MIC23356-HAYFT [MICROCHIP]
Switching Regulator;
| 型号： | MIC23356-HAYFT |
| 厂家： | 
MICROCHIP |
| 描述： | Switching Regulator 开关 |
| 文件： | 总36页 (文件大小：1027K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
MIC23356
3A, Step-Down Converter
with HyperLight Load™ and I2C Interface
Features
General Description
• Input Voltage Range: 2.4V to 5.5V
• 3A Continuous Output Current
• Multiple Faults Indication through I2C
• I2C Programmable:
The MIC23356 is a high-efficiency, low-voltage input,
3A synchronous step-down regulator. The Con-
stant-ON-Time (COT) control architecture with
HyperLight Load™ provides very high efficiency at light
loads, while still having ultra-fast transient response.
The I2C interface allows programming the output volt-
age between 0.6V and 1.28V, with 5 mV resolution or
between 0.6V and 3.84V, with 10 mV and 20 mV reso-
lution. Three different default voltage options (0.6V,
0.9V and 1.0V) are provided so that the application can
be started with a safe voltage level and then moved to
high performance modes under I2C control.
- Output Voltage: 0.6V - 1.28V, 5 mV
Resolution or 0.6V - 3.84V, 10/20 mV
Resolution
- Slew Rate: 0.2 ms/V - 3.2 ms/V
- ON Time (Switching Frequency)
- High-Side Current Limit: 3.5A - 5A
- Enable Delay: 0.2 ms - 3 ms
- Output Discharge when Disabled
(EN = GND)
An open-drain Power Good output facilitates output
voltage monitoring and sequencing. If set in shutdown
(EN = GND), the MIC23356 typically draws 1.5 µA,
while the output is discharged through 10pull-down
(if the output discharge feature is enabled).
• High Efficiency (up to 95%)
• Ultra-Fast Transient Response
• ±1.5% Output Voltage Accuracy Over
Line/Load/Temperature Range
The MIC23356 pinout is compatible with the
MIC23350, so that applications can be easily
converted.
• Safe Start-Up with Pre-Biased Output
• Typical 1.5 µA Shutdown Supply Current
• Low Dropout (100% Duty Cycle) Operation
• I2C Speed up to 3.4 MHz
The 2.4V to 5.5V input voltage range, low shutdown
and quiescent currents make the MIC23356 ideal for
single-cell Li-Ion battery-powered applications. The
100% duty cycle capability provides low dropout
operation, extending operating range in portable
systems.
• Latch-Off Thermal Shutdown Protection
• Latch-Off Current Limit Protection
• Power Good (PG) Open-Drain Output
The MIC23356 is available in a thermally efficient,
16-Lead 2.5 mm x 2.5 mm x 0.55 mm thin FTQFN
package, with an operating junction temperature range
from -40°C to +125°C.
Applications
• Solid State Drives (SSD)
• FPGAs, DSP and Low-Voltage ASIC Power
2019 Microchip Technology Inc.
DS20006130A-page 1
MIC23356
Typical Application
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Package Types
MIC23356 Top View
16-pin FTQFN
2.5 mm x 2.5 mm
13
16 15 14
SW
PGND
PGND
PVIN
1
AGND
VOUT
PG
12
11
2
3
4
EP
17
10
9
EN
5
6
7
8
* Includes Exposed Thermal Pad (EP); see Table 3-1.
Ordering Information
Default Status at Power-Up
TON<1:0> - Soft-Start Overtemp
Output Voltage
Range/Step
Output
Voltage Current Limit
(typical)
High-Side
Output
Pull-Down
when Disabled
Part Number
ns
Speed
Latch-Off
MIC23356YFT
0.6 V
3.5 A
[00] - 260 ns 200 µs/V
[10] - 130 ns 800 µs/V
Immediate
Latch-Off
NO
0.600V-1.280V/
5 mV
MIC23356-HAYFT
1.0 V
5 A
Latch-Off
after 4 OT
cycles
YES
0.600V-1.280V/
5 mV
MIC23356-FAYFT
MIC23356-SAYFT
0.9 V
1.0 V
5 A
5 A
[10] - 130 ns 800 µs/V
[10] - 130 ns 800 µs/V
Latch-Off
after 4 OT
cycles
YES
YES
0.600V-1.280V/
5 mV
Latch-Off
after 4 OT
cycles
0.600V-1.280V/
10 mV
1.280V-3.840V/
20 mV
2019 Microchip Technology Inc.
DS20006130A-page 2
MIC23356
Functional Block Diagram
MIC23356
1.0μF
TON
ADJUST
10Ω
PVIN
VIN
2.4V to 5.5V
MINIMUM
TOFF
10μF
UVLO
OT
HSD
2.225V/
2.072V
Control
Logic
EN
L1
0.47μH
VOUT
SW
0.6V-3.84V
/3A
165°C/143°C
PD
ZC
47μF
PVIN
RIPPLE
INJECTION
LSD
PGND
VOUT
COMP
EA
10Ω
I2C
SDA
VREF
CONTROL
8-Bit
DAC
PD
AND
REGISTERS
SCL
VIN
100k
AGND
PG
VREF -9%
PG
DELAY
2019 Microchip Technology Inc.
DS20006130A-page 3
MIC23356
1.0
ELECTRICAL CHARACTERISTICS
Absolute Maximum Ratings †
SVIN, PVIN to AGND...................................................................................................................................... -0.3V to +6V
VSW to AGND ................................................................................................................................................ -0.3V to +6V
VEN to AGND................................................................................................................................................ -0.3V to PVIN
VPG to AGND................................................................................................................................................ -0.3V to PVIN
VSDA, VSCL to AGND ................................................................................................................................... -0.3V to PVIN
PVIN to SVIN.............................................................................................................................................. -0.3V to +0.3V
AGND to PGND ........................................................................................................................................... -0.3V to +0.3V
Junction Temperature .......................................................................................................................................... +150°C
Storage Temperature (TS)...................................................................................................................... -65°C to +150°C
Lead Temperature (soldering, 10s)...................................................................................................................... +260°C
ESD Rating (Note 1)
HBM....................................................................................................................................................................... 2000V
CDM....................................................................................................................................................................... 1500V
MM........................................................................................................................................................................... 200V
† Notice: Stresses above those listed under “Maximum Ratings” may cause permanent damage to the device. This is
a stress rating only and functional operation of the device at those or any other conditions above those indicated in the
operational sections of this specification is not intended. Exposure to maximum rating conditions for extended periods
may affect device reliability.
Note 1: Devices are ESD sensitive. Handling precautions recommended. Human body model, 1.5 k in series with
100 pF.
Operating Ratings(1)
Supply Voltage (PVIN).................................................................................................................................. 2.4V to 5.5V
Enable Voltage (VEN) ...................................................................................................................................... 0V to PVIN
Power Good (PG) Pull-Up Voltage (VPU_PG) .................................................................................................. 0V to 5.5V
Output Current ............................................................................................................................................................. 3A
Junction Temperature (TJ) ..................................................................................................................... -40°C to +125°C
Note 1: The device is not ensured to function outside the operating range.
2019 Microchip Technology Inc.
DS20006130A-page 4
MIC23356
ELECTRICAL CHARACTERISTICS (Note 1, 2)
Electrical Specifications: unless otherwise specified, PVIN = 5V; VOUT = 1.0V, COUT = 47 µF, TA = +25°C.
Boldface values indicate -40°C TJ +125°C.
Parameter
VIN Supply
Symbol
Min.
Typ.
Max.
Units
Conditions
Input Range
PVIN
2.4
—
5.5
V
V
Undervoltage Lockout
Threshold
UVLO
2.15
2.225
2.35
SVIN rising
Undervoltage Lockout
Hysteresis
UVLO_H
—
153
—
V
SVIN falling
Operating Supply Current
Shutdown Current
IIN0
—
—
60
100
µA
µA
VOUT =1.2V, non switching
ISHDN
1.5
10
VEN = 0V, PVIN = SVIN = 5.5V,
VSW = VSDA = VSCL = 0V,
-40°C TJ +105°C
20
VEN = 0V, PVIN = SVIN = 5.5V,
VSW = VSDA = VSCL = 0V,
-40°C TJ +125°C
Output Voltage
Output Accuracy
VOUT_ACC
-1.5
1.5
%
VOUT from 0.6V to 1.28V
(includes line and load regula-
tion)
Output Voltage Step
(options YFT, HAYFT, FAYFT)
VOUT_STEP
VOUT_STEP
5
mV
mV
VOUT from 0.6V to 1.28V
Output Voltage Step
(option SAYFT)
10
20
VOUT from 0.6V to 1.28V
VOUT from 1.28V to 3.84V
Line Regulation
0.06
%
%
VOUT = 1.0V, VIN = 2.5 to 5.5V,
IOUT = 300 mA
Load Regulation
Enable Control
EN Logic Level High
0.1
VOUT = 1.0V, IOUT = 0A to 3A
VEN_H
VEN_L
1.2
—
—
—
V
V
VEN Rising, Regulator
Enabled
EN Logic Level Low
0.4
VEN Falling, Regulator Shut-
down
EN Low Input Current
EN High Input Current
Enable Delay (2 Bits)
Enable Lockout Delay
IEN_L
IEN_H
—
0.01
0.01
500
500
nA
nA
VEN = 0V
VEN = 5.5V
0.15
0.25
0.4
ms
EN_DELAY<1:0> = 00;
Default
0.85
1.70
2.55
1
2
3
1.20
2.35
3.50
ms
ms
ms
EN_DELAY<1:0> = 01
EN_DELAY<1:0> = 10
EN_DELAY<1:0> = 11
Internal DAC Slew Rate (4 Bits)
Note 1: Specification for packaged product only.
2: Characterized in open loop.
3: Tested in open loop. The closed-loop current limit is affected by inductance value, input voltage and temperature.
2019 Microchip Technology Inc.
DS20006130A-page 5
MIC23356
ELECTRICAL CHARACTERISTICS (Note 1, 2)
Electrical Specifications: unless otherwise specified, PVIN = 5V; VOUT = 1.0V, COUT = 47 µF, TA = +25°C.
Boldface values indicate -40°C TJ +125°C.
Parameter
Symbol
Min.
Typ.
Max.
Units
Conditions
Slew Rate Time (Time to 1V)
TRISE
100
250
400
600
200
400
600
800
300
550
µs/V SLEW_RATE<3:0> = 0000
µs/V SLEW_RATE<3:0> = 0001
µs/V SLEW_RATE<3:0> = 0010
800
1000
µs/V SLEW_RATE<3:0>= 0011;
Default
750
1000
1200
1400
1600
1800
2000
2200
2400
2600
2800
3000
3200
1250
1450
1700
1900
2150
2350
2600
2800
3020
3250
3480
3710
µs/V SLEW_RATE<3:0> = 0100
µs/V SLEW_RATE<3:0> = 0101
µs/V SLEW_RATE<3:0> = 0110
µs/V SLEW_RATE<3:0> = 0111
µs/V SLEW_RATE<3:0> = 1000
µs/V SLEW_RATE<3:0> = 1001
µs/V SLEW_RATE<3:0> = 1010
µs/V SLEW_RATE<3:0> = 1011
µs/V SLEW_RATE<3:0> = 1100
µs/V SLEW_RATE<3:0> = 1101
µs/V SLEW_RATE<3:0> = 1110
µs/V SLEW_RATE<3:0> = 1111
950
1100
1300
1450
1650
1800
2000
2180
2350
2520
2690
Note 1: Specification for packaged product only.
2: Characterized in open loop.
3: Tested in open loop. The closed-loop current limit is affected by inductance value, input voltage and temperature.
2019 Microchip Technology Inc.
DS20006130A-page 6
MIC23356
ELECTRICAL CHARACTERISTICS (Note 1, 2)
Electrical Specifications: unless otherwise specified, PVIN = 5V; VOUT = 1.0V, COUT = 47 µF, TA = +25°C.
Boldface values indicate -40°C TJ +125°C.
Parameter
Symbol
Min.
Typ.
Max.
Units
Conditions
TON Control/Switching Frequency (2 Bits)
Switching ON Time
Switching Frequency
TON
—
—
—
—
—
260
180
130
105
1.6
—
—
—
—
—
ns
V
OUT = 1V, TON<1:0> = 00
VOUT = 1V, TON<1:0> = 01
VOUT = 1V, TON<1:0> = 10
V
OUT = 1V, TON<1:0> = 11
FREQ
MHz VOUT = 1V, TON<1:0> = 10,
IOUT = 3A,
L=XEL4030-471ME
—
—
2.2
—
—
MHz VOUT = 3.3V, TON<1:0> = 10,
IOUT = 3A,
L=XEL4030-471ME
Maximum Duty Cycle
DCMAX
100
%
Short Circuit Protection
High-Side MOSFET Forward
Current Limit (Note 3)
ILIM_HS
ILIM_LS
2.1
4.0
—
3.5
5.0
3.0
4.2
-3
4.9
6.5
—
A
A
ILIM = 0
ILIM = 1
ILIM = 0
ILIM = 1
Low-Side MOSFET Forward
Current Limit (Note 3)
—
—
Low-Side MOSFET Negative
Current Limit
ILIM_NEG
IZC_TH
HICCUP
—
-2
-4
A
A
N-Channel Zero-Crossing
Threshold
—
—
—
0.9
8
—
—
—
Current Limit Pulses before
Hiccup
Cycles
ms
Hiccup Period before Restart
Internal MOSFETs
1
High-Side ON-Resistance
Low-Side ON-Resistance
Output Discharge Resistance
RDS-ON-HS
RDS-ON-LS
RDS-ON-DSC
—
—
—
30
16
10
60
40
50
mΩ ISW = 1A
mΩ ISW = -1A
Ω
VEN = 0V, VSW = 5.5V, from
VOUT to PGND
SW Leakage Current
ILEAK_SW
—
1
10
µA
PVIN = 5.5V, VSW = 0V, VEN
= 0V, flowing out of SW pin
Power Good (PG)
Power Good Threshold
Power Good Hysteresis
Power Good Blanking time
PG Output Leakage Current
PG_TH
PG_HYS
87
—
—
—
91
4
95
—
%VOUT VOUT Rising (Good)
%VOUT VOUT Falling
µs
PG_BLANK
PG_LEAK
65
30
—
300
nA
V
OUT = VOUT(NOM)
,
VPG = 5.5V
Power Good Sink Low Voltage
I2C Interface (SCL, SDA)
Low Level Input Voltage
High Level Input Voltage
PG_SINKV
—
—
200
mV
VOUT = 0V, IPG = 10 mA
VIL
0
0.4
5.5
V
V
SVIN = 5.5V
SVIN = 5.5V
VIH
1.2
Note 1: Specification for packaged product only.
2: Characterized in open loop.
3: Tested in open loop. The closed-loop current limit is affected by inductance value, input voltage and temperature.
2019 Microchip Technology Inc.
DS20006130A-page 7
MIC23356
ELECTRICAL CHARACTERISTICS (Note 1, 2)
Electrical Specifications: unless otherwise specified, PVIN = 5V; VOUT = 1.0V, COUT = 47 µF, TA = +25°C.
Boldface values indicate -40°C TJ +125°C.
Parameter
Symbol
Min.
-1
Typ.
Max.
1
Units
Conditions
High Level Input Leakage
Current
II2C_H
0.01
µA
Low Level Input Leakage
Current
II2C_L
-1
0.01
1
µA
SDA Logic 0 Output Voltage
SCL, DATA Pin Capacitance
SDA Pull Down Resistance
I2C Interface Timing
VOL
0.4
V
pF
Ω
ISDA = 3 mA
I2C_CAP
SDA_PD
0.7
80
Maximum SCL Clock
Frequency
SCL_CLOCK
100
400
3.4
kHz Standard mode
kHz Fast mode
MHz High-Speed mode
Thermal Shutdown
Thermal Shutdown
TSHDN
TSHDN_HYST
TTHWRN
—
—
—
—
165
22
—
—
—
—
°C
°C
°C
—
TJ rising
TJ falling
TJ rising
Thermal-Shutdown Hysteresis
Thermal Warning Threshold
118
4
Thermal Latch OFF Soft-Start
Cycles
TH_LATCH
Note 1: Specification for packaged product only.
2: Characterized in open loop.
3: Tested in open loop. The closed-loop current limit is affected by inductance value, input voltage and temperature.
TEMPERATURE SPECIFICATIONS
Electrical Specifications: unless otherwise specified, PVIN = 5V; VOUT = 1.0V, COUT = 47 µF, TA = +25°C.
Boldface values indicate -40°C TJ +125°C.
Parameters
Temperature Ranges
Sym.
Min.
Typ.
Max.
Units
Conditions
Junction Temperature
TJ
TA
-40
-65
—
—
+125
+150
°C
°C
Storage Temperature Range
Package Thermal Resistances
Thermal Resistance,
JA
—
45
—
°C/W
16LD 2.5 mm x 2.5 mm Thin FTQFN
2019 Microchip Technology Inc.
DS20006130A-page 8
MIC23356
2.0
TYPICAL CHARACTERISTIC CURVES
Note: The graphs and tables provided following this note are a statistical summary based on a limited number of
samples and are provided for informational purposes only. The performance characteristics listed herein
are not tested or guaranteed. In some graphs or tables, the data presented may be outside the specified
operating range (e.g., outside specified power supply range) and therefore outside the warranted range.
Note: Unless otherwise indicated, PVIN = 5V, L = 0.47 µH (XEL4030-471ME), COUT = 47 µF, TA = +25°C.
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FIGURE 2-1:
Operating Supply Current
FIGURE 2-4:
No-Load Operating Supply
vs. Input Voltage, Switching.
Current vs. Temperature, Switching.
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FIGURE 2-2:
High-Side Current Limits vs.
FIGURE 2-5:
R
vs. Temperature.
DS(on)
Temperature (V
= 1.0V), Closed-Loop.
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FIGURE 2-6:
Efficiency vs. Load Current
FIGURE 2-3:
Temperature (V
High-Side Current Limits vs.
= 3.3V), Closed-Loop.
(V
= 0.6V).
OUT
OUT
2019 Microchip Technology Inc.
DS20006130A-page 9
MIC23356
Note: Unless otherwise indicated, PVIN = 5V, L = 0.47 µH (XEL4030-471ME), COUT = 47 µF, TA = +25°C.
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FIGURE 2-10:
DCM/FPWM I
Threshold
OUT
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FIGURE 2-8:
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FIGURE 2-11:
Line Regulation: Output
(V
= 1.28V).
Voltage Variation vs. Input Voltage.
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FIGURE 2-9:
(V = 3.3V).
Efficiency vs. Load Current
FIGURE 2-12:
Voltage Variation vs. I
Load Regulation: V
OUT
.
OUT
OUT
2019 Microchip Technology Inc.
DS20006130A-page 10
MIC23356
Note: Unless otherwise indicated, PVIN = 5V, L = 0.47 µH (XEL4030-471ME), COUT = 47 µF, TA = +25°C.
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FIGURE 2-16:
Switching Frequency vs.
I
V
(V = 0.6V).
OUT
OUT
IN
OUT
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Switching Frequency vs.
FIGURE 2-17:
V (V = 1.0V).
IN
Switching Frequency vs.
I
OUT
OUT
OUT
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FIGURE 2-15:
(V = 3.3V).
Switching Frequency vs.
FIGURE 2-18:
V (V = 3.3V).
IN
Switching Frequency vs.
I
OUT
OUT
OUT
2019 Microchip Technology Inc.
DS20006130A-page 11
MIC23356
Note: Unless otherwise indicated, PVIN = 5V, L = 0.47 µH (XEL4030-471ME), COUT = 47 µF, TON<1:0>=10, ILIM = 1,
TA = +25°C.
V
IN
5V/div
EN
2V/div
V
OUT
500 mV/div
V
OUT
500 mV/div
PG
5V/div
PG
5V/div
IL
2A/div
IL
2A/div
4 ms/div
80 µs/div
FIGURE 2-19:
V
Turn-On (EN = PV ).
FIGURE 2-22:
EN Turn-Off, R
= 0.3.
LOAD
IN
IN
V
IN
5V/div
EN
2V/div
V
OUT
500 mV/div
V
OUT
PG
5V/div
500 mV/div
PG
5V/div
IL
2A/div
IL
2A/div
400 µs/div
2 ms/div
FIGURE 2-20:
V
Turn-Off (EN = PV
,
IN)
FIGURE 2-23:
EN Turn-On into Pre-biased
= 0.8V).
IN
R
= 0.3.
output (V
LOAD
pre-bias
V
IN
5V/div
EN
2V/div
V
V
OUT
OUT
500 mV/div
500 mV/div
PG
5V/div
PG
5V/div
IL
2A/div
IL
2A/div
2 ms/div
2 ms/div
FIGURE 2-21:
EN Turn-On, R
= 0.3.
FIGURE 2-24:
Power-Up into Short Circuit.
LOAD
2019 Microchip Technology Inc.
DS20006130A-page 12
MIC23356
Note: Unless otherwise indicated, PVIN = 5V, L = 0.47 µH (XEL4030-471ME), COUT = 47 µF, TON<1:0>=10, ILIM = 1,
TA = +25°C.
V
OUT
VIN
2V/div
5V/div
VOUT
20 mV/div, AC coupled
IL
5A/div
SW, 5V/div
I
OUT
5A/div
IL
1A/div
PG
5V/div
1 µs/div
1 ms/div
FIGURE 2-25:
Output Current Limit
FIGURE 2-28:
Switching Waveforms -
Threshold.
I
= 3A.
OUT
Step from 0.5A to 3A
PG
5V/div
V
OUT
1V/div
I
OUT
5A/div
IL
5A/div
V
OUT
I
100 mV/div
OUT
5A/div
AC coupled
PG
5V/div
IL
5A/div
1 ms/div
80 µs/div
FIGURE 2-26:
Hiccup Mode Short Circuit
FIGURE 2-29:
Load Transient Response.
Current Limit Response.
Step from 4.5V to 5.5V
V
IN
5V/div
V
IN
2V/div
V
OUT
50 mV/div
AC coupled
V
OUT
10 mV/div
AC coupled
SW
5V/div
PG
5V/div
IL
2A/div
400 µs/div
1 µs/div
FIGURE 2-30:
Line Transient Response.
FIGURE 2-27:
Switching Waveforms -
I
= 50mA, HLL.
OUT
2019 Microchip Technology Inc.
DS20006130A-page 13
MIC23356
3.0
PIN DESCRIPTIONS
The descriptions of the pins are listed in Table 3-1.
TABLE 3-1:
MIC23356
PIN FUNCTION TABLE
Symbol
Description
1, 16
SW
Switch Node
2, 3, 13, 14, 15
PGND
Power Ground. PGND is the ground path for the MIC23356 buck converter
power stage.
4, 5
6
PVIN
SVIN
Power Supply Voltage
Analog Voltage Input. The power to the internal reference and control
sections of the MIC23356. A 1.0 µF ceramic capacitor from SVIN to ground
must be used. Internally connected to PVIN through a 10 resistor.
7
8
9
SCL
SDA
EN
I2C Clock (Input). I2C Serial bus clock input.
I2C Data (Input/Output). I2C Serial bus data bidirectional pin.
Enable (Input). Logic high enables operation of the regulator. The EN pin
should not be left open.
10
11
PG
Power Good (Output). This is an open-drain output that indicates when the
rising output voltage is higher than the 91% threshold (typical value).
VOUT
Output Voltage Sense (Input). This pin is used to remote sense the output
voltage. Connect VOUT as close to the output capacitor as possible to
sense output voltage. Also provides the path to discharge the output
through an internal 10 resistor when disabled.
12
17
AGND
EP
Analog Ground. Internal signal ground for all low-power circuits.
Exposed Thermal Pad, internally connected to PGND.
3.1
Switch Node Pin (SW)
3.5
I2C Clock Input Pin (SCL)
High current output which connects to the internal
MOSFETs. Connect inductor to this pin. This is a
high-frequency, high-power connection; therefore,
traces should be kept as short and as wide as practical.
The SCL pin is the serial interfaces Serial Clock pin.
This pin is connected to the Host Controller SCL pin.
The MIC23356 is a slave device, so its SCL pin is only
an input.
I2C Data Input/Output Pin (SDA)
3.2
Power Ground Pin (PGND)
3.6
PGND is the ground path for the MIC23356 buck
converter power stage. The PGND pin connects to the
sources of low-side N-Channel MOSFET, the negative
terminals of input capacitors, and the negative
terminals of output capacitors. The loop for the power
ground should be as small as possible and separate
from the analog ground (AGND) loop.
The SDA pin is the serial interface Serial Data pin. This
pin is connected to the Host Controller SDA pin. The
SDA pin has an open-drain N-Channel driver.
3.7
Enable Pin (EN)
Logic high enables operation of the regulator. Logic low
will shut down the device. In the off state, supply
current of the device is greatly reduced (typically
1.5 µA). The EN pin should not be left open.
3.3
Input Voltage Pin (PVIN)
Input supply to the source of the internal high-side
P-channel MOSFET. The PVIN operating voltage range
is from 2.4V to 5.5V. An input capacitor between PVIN
and the power ground PGND pin is required and placed
as close as possible to the IC.
3.8
Power Good Pin (PG)
This is an open-drain output that indicates when the
rising output voltage is higher than the 91% threshold.
There is a 4% hysteresis, therefore PG will return low
when the falling output voltage falls below 87% of the
target regulation voltage.
3.4
Analog Voltage Input Pin (SVIN)
The power to the internal reference and control
sections of the MIC23356. A 1.0 µF ceramic capacitor
from SVIN to ground must be used. Internally
connected to PVIN through a 10 resistor.
2019 Microchip Technology Inc.
DS20006130A-page 14
MIC23356
3.9
Output Voltage Sense Pin (VOUT)
This pin is used to remote sense the output voltage.
Connect to VOUT as close to the output capacitor as
possible to sense the output voltage. It also provides
the path to discharge the output through an internal
10 resistor when the device is disabled.
3.10 Analog Ground Pin (AGND
)
Internal signal ground for all low-power circuits.
Connect to ground plane. For best load regulation, the
connection path from AGND to the output capacitor
ground terminal should be free from parasitic voltage
drops.
3.11 Exposed Pad (EP)
Electrically connected to PGND pins. Connect with ther-
mal vias to the ground plane to ensure adequate
heat-sinking. See Section 8.0 “Packaging Informa-
tion”.
2019 Microchip Technology Inc.
DS20006130A-page 15
MIC23356
the 0 ms delay setting is chosen, there is an internal
delay of 250 µs before the part will start to switch in
order to bias up internal circuitry.
4.0
4.1
FUNCTIONAL DESCRIPTION
Device Overview
I2C Programming
The MIC23356 is a high-efficiency 3A continuous cur-
rent, synchronous buck regulator with HyperLight
Load™ mode. The Constant-ON-Time control architec-
ture with automatic HyperLight Load™ provides very
high efficiency at light loads and ultra-fast transient
response.
4.4
The MIC23356 behaves as an I2C slave, accessible at
0x5B (7 bit addressing).
The I²C interface remains active and the MIC23356 can
be programmed whether the enable pin is high or low,
as long the input voltage is above the UVLO threshold.
This feature is useful in applications where a house-
keeping MCU preconfigures the MIC23356 before
enabling power delivery. The registers do not get reset
when the enable pin is low. The output voltage can be
programmed to a new value with I2C, regardless of the
EN pin status. If the EN pin is high, the output voltage
will move to the newly programmed value on-the-fly,
with the programmed slew rate.
The MIC23356 output voltage is programmed through
the I2C interface in the range of 0.6V to 1.28V with
5 mV resolution (options YFT, HAYFT and FAYFT), or
between 0.6V and 3.84V (option SAYFT). The latter
option has a 10 mV resolution from 0.6V up to 1.28V
and 20 mV resolution from 1.28V to and 3.84V.
The 2.4V to 5.5V input voltage operating range makes
the device ideal for single cell Li-ion battery-powered
applications. Automatic HyperLight Load™ mode
provides very high efficiency at light loads.
4.5
Power Good (PG)
This device focuses on high output voltage accuracy.
Total output error is less than 1.5% over line, load and
temperature.
The Power Good output is generally used for power
sequencing where the Power Good output is tied to the
enable output of another regulator. This technique
avoids all the regulators powering up at the same time,
causing large inrush current.
The MIC23356 buck regulator uses an adaptive
Constant-ON Time control method. The adaptive
on-time control scheme is employed to obtain a nearly
constant switching frequency in Continuous
Conduction mode. Overcurrent protection is
implemented by sensing the current on both the
low-side and high-side internal power MOSFETs. The
device includes an internal soft-start function which
reduces the power supply input surge current at
start-up by controlling the output voltage rise time.
The Power Good output is an open-drain output.
During start-up, when the output voltage is rising, the
Power Good output goes high by means of an external
pull-up resistor when the output voltage reaches 91%
of its set value. The Power Good threshold has 4%
hysteresis so the Power Good output stays high until
the output voltage falls below 87% of the set value. A
built-in 65 µs blanking time is incorporated to prevent
nuisance tripping.
4.2
HyperLight Load™ Mode (HLL)
The pull-up resistor from the PG pin can be connected
to VIN, VOUT or an external source that is less than or
equal to VIN. The PG pin can be connected to another
regulator’s enable pin for sequencing of the outputs.
The PG output is deasserted as soon as the enable pin
is pulled low or an input undervoltage condition or any
other Fault is detected.
HLL is a power-saving switching mode. In HLL, the
switching frequency is not constant over the operation
current range. At light loads, the fixed ON-Time opera-
tion coupled with low-side MOSFET diode emulation
causes the switching frequency to decrease. This
reduces switching and drive losses and increases effi-
ciency. The HLL Switching mode can be disabled for
reduced output ripple and low noise by setting the
FPWM bit in the CTRL2 register.
4.6
Output Soft Discharge option
To ensure a known output condition when the device is
turned off then back on again, the output is actively
discharged to ground by means of an internal 10-ohm
resistor. The active discharge resistor can be enabled
or disabled through I2C in the CTRL2 register.
4.3
Enable (EN pin)
When the EN pin is pulled LOW, the IC is in a shutdown
state with all internal circuits disabled and with the
Power Good output (PG) low. During shutdown, the
part consumes typically 1.5 µA. When the EN pin is
pulled HIGH, the start-up sequence is initiated. There
is a programmable enable delay that is used to delay
the start of the output ramp. The enable delay timer can
be programmed to one of four time intervals of 0.25 ms,
1 ms, 2 ms or 3 ms in the CTRL1 register. Note that if
4.7
Output Voltage Setting
The MIC23356 output voltage has an 8-bit control DAC
that can be programmed from 0.6V to 1.28V in 5 mV
increments, for part options -YFT, -HAYFT, -FAYFT.
Option -SAYFT can be programmed from 0.6V up to
2019 Microchip Technology Inc.
DS20006130A-page 16
MIC23356
1.28V with 10 mV resolution and from 1.28V up to
3.84V with 20 mV resolution. This can be programmed
in the MIC23356 Output Voltage Control register.
4.11 Switching Frequency
The switching frequency of the MIC23356 is indirectly
set, by programming the TON value. The equation
below provides an estimation for the resulting switching
frequency:
The output voltage sensing pin VOUT should be
connected exactly to the desired point-of-load
regulation, avoiding parasitic resistive drops.
EQUATION 4-2:
4.8
Converter Stability. Output
Capacitor
V
1
TON
OUT
-------------- ---------
fSW
=
VIN
The MIC23356 utilizes an internal compensation
network and it is designed to provide stable operation
with output capacitors from 47 µF to 1000 µF. This
greatly simplifies the design where supplementary out-
put capacitance can be added without having to worry
about stability.
The above equation is only valid in Continuous
Conduction mode and for a loss-less converter. In
practice, losses will cause an increase of the switching
frequency with respect to the ideal case. As the load
current increases, losses will increase too and so will
the switching frequency.
4.9
Soft-Start
Excess bulk capacitance on the output can cause
excessive input inrush current. The MIC23356 internal
soft-start feature forces the output voltage to rise
gradually, keeping the inrush current at reasonable
levels. This is particularly important in battery-powered
applications. The ramp rate can be set in the CTRL2
register by means of the SLEW_RATE [3:0] bits.
The ON-Time calculation is adaptive, in that the TON
value is modulated based on the input voltage and on
the target output voltage to stabilize the switching
frequency against their variations. Losses are not
accounted for.
The table below highlights the resulting ON time (TON),
for typical output voltages:
When the enable pin goes high, the output voltage
starts to rise. Once the soft-start period has finished,
the Power Good comparator is enabled and if the out-
put voltage is above 91% of the nominal regulation volt-
age, then the Power Good output goes high.
TON
VIN (V) VOUT (V) [00]
[01]
110
180
340
490
610
270
[10]
100
130
200
260
310
170
[11]
80
5
0.6
1
140
260
520
740
930
380
105
150
190
220
130
The output voltage soft-start time is determined by the
soft-start equation below. The soft-start time tSS can be
calculated using Equation 4-1.
1.8
2.5
3.3
1
EQUATION 4-1:
3.3
tSS = V
tRAMP
OUT
4.12 Undervoltage Protection (UVLO)
tSS = 1.0V 800s V
tSS = 800s = 0.8ms
Undervoltage protection ensures that the IC has
enough voltage to bias the internal circuitry properly
and provide sufficient gate drive for the power
MOSFETs. When the input voltage starts to rise, both
power MOSFETs are off and the Power Good output is
pulled low. The IC starts at approximately 2.225V typi-
cal and has a nominal 153 mV of hysteresis to prevent
chattering between the UVLO high and low states.
Where:
VOUT
=
=
1.0V
800 µs/V
tRAMP
4.10 100% Duty Cycle Operation
The MIC23356 can deliver 100% duty cycle. To
achieve 100% duty cycle, the high-side switch is
latched on when the duty cycle reaches around 92%
and stays latched until the output voltage falls 4%
below its regulated value. This feature is especially
useful in battery operated applications. It is recom-
mended that this feature is enabled together with the
highest TON setting, corresponding to the lowest
switching frequency (TON<1:0>=00 in register
CTRL1). The high-side latch circuitry can be disabled
by setting the DIS_100PCT bit in register CTRL2 to ‘1’.
4.13 Overtemperature Fault
The MIC23356 monitors the die junction temperature to
keep the IC operating properly. If the IC junction
temperature exceeds 118°C, the warning flag
"OT_WARN" is set, but does not affect the operation
mode. It automatically resets if the junction
temperature drops below the temperature threshold. If
the IC junction temperature exceeds 165°C, both
power MOSFETs are immediately turned off. The IC is
allowed to start when the die temperature falls below
143°C.
2019 Microchip Technology Inc.
DS20006130A-page 17
MIC23356
During the Fault condition, several changes will occur
in the status register. The OT bit will go high indicating
the junction temperature reached 165°C, while the
OT_WARN automatically resets. If the controller is
enabled to restart after the first thermal shutdown event
(OT_LATCH bit in register CTRL2 is set), the SSD bit
will go low and the hiccup bit will go high. Finally, the
PG bit in register FAULT (address 0x03) will go low and
the PG pin will be pulled low until the output voltage has
restarted and is once again in regulation. The I2C
interface remains active and all registers values are
maintained. When the die temperature decreases
below the lower thermal shutdown threshold and the
MIC23356 resumes switching with the output voltage
going back in regulation, the global Power Good output
is pulled high, but the over temperature Fault bit OT is
still set to “1”. To clear the Fault, either recycle input
power or write a logic “0” to the overtemperature bit OT
in the FAULT register.
until the current falls to 80% of the high-side current
threshold value, then the high-side can be turned on
again. If the overload condition lasts for more than
seven cycles, the MIC23356 enters hiccup current
limiting and both MOSFETs are turned off. There is a
1 ms cool-off period before the MOSFETs are allowed
to be turned on. If the regulator has another hiccup
event before it reaches the Power Good threshold on
restart, it will again turn off both MOSFETs and wait for
1 ms. If this happens more than three times in a row
then the part will enter the latch-off state which will
permanently turn off both MOSFETs until the part is
reset by toggling the EN pin, recycling power or via I2C
command.
During a hiccup event, the HICCUP bit in the STATUS
register will go high and the SSD bit will go low until the
output has recovered. The Power Good FAULT status
register bit PG will also go low and the PG pin will be
pulled low.
During recovery from a thermal shutdown event, if the
regulator hits another thermal shutdown event or a
current limit event is causing hiccup before Power
Good can be achieved, the controller will again reset. If
this happens four times in a row the part will be in a
latch-off state, and the MOSFETs are permanently
latched off. The LATCH_OFF bit in the STATUS
register will be set to “1” which will latch off the
MIC23356. The device can be restarted by toggling the
enable input, by recycling the input power, or by
software enable control (EN_CON). This latch-off
feature eliminates the thermal stress on the MIC23356
during a Fault event. The OT_LATCH bit in register
CTRL 2 can be set to “0” which will cause this latch-off
to happen after the first overtemperature event instead
of waiting for four consecutive overtemperatures. This
is a more conservative approach to protect the part and
is available to the user.
In latch-off, the LATCH_OFF status bit is set to 1.
The High-Side Current Limit can be programmed by
setting the ILIM bit in the CTRL1 register. For maximum
efficiency and current limit precision, it is recom-
mended that the highest current limit is programmed
together with a higher TON setting (corresponding to a
lower frequency).
4.14 Safe Start-up into a Pre-Biased
Output
The MIC23356 is designed for safe start-up into a
pre-biased output in forced PWM. This feature
prevents high negative inductor current flow in a
pre-bias condition which can damage the IC. This is
achieved by not allowing forced PWM until the control
loop commands eight switching cycles. After eight
cycles, the low-side negative current limit is switched
from 0A to -3A. The cycle counter is reset to zero if the
enable pin is pulled low or an input undervoltage
condition or any other Fault is detected.
4.15 Current Limiting
The MIC23356 regulator uses both high-side and
low-side current sense for current limiting. When the
high-side current sense threshold is reached, the
high-side MOSFET is turned off and the low-side
MOSFET is turned on. The low-side MOSFET stays on
2019 Microchip Technology Inc.
DS20006130A-page 18
MIC23356
higher inductance values are used with higher input
voltages. Larger peak-to-peak ripple currents will
increase the power dissipation in the inductor and
MOSFETs. Larger output ripple currents will also
require more output capacitance to smooth out the
larger ripple current. Smaller peak-to-peak ripple
5.0
5.1
APPLICATION INFORMATION
Power-up State
When power is first applied to the MIC23356 and the
enable pin is high, all I2C registers are loaded with their
default values and the device starts delivering power to
the output based on those default values. After the
soft-start ramp has finished, these registers can be
reconfigured. These new settings are saved even if the
enable pin is pulled low. When the enable is pulled high
again, the MIC23356 is configured to the new register
settings, not the original default settings. To set the I2C
registers to their original settings, the input power has
to be recycled.
currents require
a larger inductance value and
therefore, a larger and more expensive inductor. A
good compromise between size, loss and cost is to set
the inductor ripple current to be equal to about 30% of
the maximum output current. The inductance value is
calculated by Equation 5-1. Switching frequency can
be estimated from curves given in Section 2.0
“Typical Characteristic Curves”.
EQUATION 5-1:
When power is first applied to the MIC23356 and the
enable pin is low, all I2C registers can be configured.
When the enable pin is pulled high, the regulator will
power-up with the new I2C registers settings. Again,
these register settings will not be lost when the enable
pin is pulled low. If power is recycled, the register
settings are lost and they will have to be
reprogrammed.
V
V
– V
OUT
INMAX
INMAX SW
OUT
OUTMAX
L = ---------------------------------------------------------------------------------------------
V
f r I
Where:
fSW
r
=
Switching Frequency
=
Ratio of AC Inductor Ripple Current to DC
Output Current (typical 30%)
VIN(MAX)
=
Maximum Power Stage Input Voltage
5.2
Output Voltage Sensing
The peak-to-peak inductor current ripple is:
To achieve accurate output voltage regulation, the
VOUT pin (internal feedback divider top terminal) should
be Kelvin-connected as close as possible to the
point-of-regulation top terminal. Since both the internal
reference and the internal feedback divider’s bottom
terminal refer to AGND, it is important to minimize
voltage drops between the AGND and the
point-of-regulation return terminal (typically the ground
terminal of the output capacitor which is closest to the
load).
EQUATION 5-2:
V
V
– V
OUT
INMAX
f
OUT
L
I
= -------------------------------------------------------------------------------
LPP
V
INMAX SW
The peak inductor current is equal to the average
output current plus one-half of the peak-to-peak
inductor current ripple.
5.3
Digital Voltage Control (DVC)
EQUATION 5-3:
When the buck is programmed to a lower voltage, the
regulator is placed into forced PWM mode and the
Power Good monitor is blanked during the transition
time.
I
= I
+ 0.5 I
LPK
OUTMAX
LPP
The RMS inductor current is used to calculate the I2R
losses in the inductor.
5.4
Inductor Selection and Slope
Compensation
EQUATION 5-4:
2
When selecting an inductor, it is important to consider
the following factors:
ILPP
2
ILRMS
=
IOUTMAX + --------------------
12
• Inductance
• Rated Current value
• Size requirements
• DC Resistance (DCR)
• Core losses
Maximizing the efficiency requires the proper selection
of core material while minimizing the winding
resistance. The high-frequency operation of the
MIC23356 requires the use of low-loss high-frequency
magnetic materials for all but the most cost sensitive
applications. Lower cost iron powder cores may be
used, but the increase in core loss will reduce the
efficiency of the power supply. This is especially
Values for inductance, peak and RMS currents are
required to select the output inductor. The input and
output voltages and the inductance value determine
the peak-to-peak inductor ripple current. Generally,
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MIC23356
noticeable at low output power. The winding resistance
decreases efficiency at the higher output current levels.
The winding resistance must be minimized, although
this usually comes at the expense of a larger inductor.
The power dissipated in the inductor is equal to the sum
of the core and copper losses. Core loss information is
usually available from the magnetic’s vendor. Copper
loss in the inductor is calculated by Equation 5-5.
The total output ripple is a combination of the ESR and
output capacitance. The total ripple is calculated in
Equation 5-8.
EQUATION 5-8:
2
I
2
LPP
------------------------------------------
V
=
+
I
ESR
C
OUTPP
LPP
C
f 8
OUT SW
OUT
Where:
EQUATION 5-5:
COUT
fSW
=
=
Output Capacitance Value
Switching Frequency
2
P
= I
R
INDUCTORCU
LRMS
WINDING
The output capacitor RMS current is calculated in
Equation 5-9.
The resistance of the copper wire, RWINDING, increases
with the temperature. The value of the winding
resistance used should be at the operating
temperature.
EQUATION 5-9:
I
LPP
I
= ---------------------
12
EQUATION 5-6:
C
OUTRMS
P
= R
1 + 0.0042 T – T
20C
WINDINGHT
WINDING20C
H
The power dissipated in the output capacitor is:
Where:
EQUATION 5-10:
TH
=
=
=
Temperature of Wire Under Full Load
Ambient Temperature
T20C
2
P
= I
ESR
COUT
RWINDING(20C)
Room Temperature Winding
Resistance (usually specified by the
manufacturer)
DISSCOUT
COUTRMS
5.6
Input Capacitor Selection
5.5
Output Capacitor Selection
The input capacitor for the power stage input VIN
should be selected for ripple current rating and voltage
rating. Due to the pulsed waveform of the buck stage
input current, ceramic input capacitors with good
high-frequency characteristics are mandatory and
should be placed as close to the device as possible.
Additional polarized capacitors can be used in parallel
to the ceramic input capacitors. Tantalum input
capacitors may fail when subjected to high inrush
currents, caused by turning on the input supply. A
tantalum input capacitor voltage rating should be at
least two times the maximum input voltage to maximize
reliability. Aluminum electrolytic, OS–CON, and
multilayer polymer film capacitors can handle the
higher inrush currents without voltage derating. The
input voltage ripple will primarily depend on the input
capacitor ESR. The peak input current is equal to the
peak inductor current, so:
The MIC23356 utilizes an internal compensation
network and is design to provide stable operation with
output capacitors from 47 μF to 1000 μF. This greatly
simplifies the design where supplementary output
capacitance can be added without having to worry
about stability.
The type of output capacitor is usually determined by its
equivalent series resistance (ESR). Voltage and RMS
current capability are two other important factors for
selecting the output capacitor. Recommended
capacitor types are ceramic, OS–CON, and POSCAP.
The output capacitor ESR is usually the main cause of
the output ripple. The output capacitor ESR also affects
the control loop from a stability point of view. The
maximum value of ESR is calculated using
Equation 5-7.
EQUATION 5-7:
EQUATION 5-11:
V
OUTPP
---------------------------------
ESR
V
= I
ESRCIN
LPK
C
I
IN
OUT
LPP
Where:
The input capacitor must be rated for the input current
ripple. The RMS value of input capacitor current is
determined at the maximum output current. Assuming
the peak-to-peak inductor current ripple is low:
∆VOUT(PP)
∆IL(PP)
=
=
Peak-to-Peak Output Voltage Ripple
Peak-to-Peak Inductor Current Ripple
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MIC23356
EQUATION 5-12:
I
I
CINRMS OUTMAX
D 1 – D
Where:
D = VOUT/VIN
The power dissipated in the input capacitor is:
EQUATION 5-13:
2
P
= I
ESRCIN
DISSCIN
CINRMS
5.7
I2C Bus Pull-Ups Selection
The optimal pull-up resistors must be strong enough
such that the RC constant of the bus is not too large
(causing the line not to rise to a logical high before
being pulled low), but weak enough for the IC to drive
the line low.
2
TABLE 5-1:
I C BUS CONSTRAINTS
Standard Fast
High-Speed
Mode
Mode
Mode
Bit Rate
(kbits/s)
0 to 100
0 to
400
0 to
1700
0 to
3400
Max Cap
Load (pF)
400
1000
N/A
400
300
50
400
100
Rise time
(ns)
160
80
Spike
10
Filtered (ns)
EQUATION 5-14:
V
CC – VOLmax
Rpmin = ----------------------------------------------
IOL
Where:
VCC
=
=
=
Pull-up reference voltage (i.e. VIN)
VOL(max)
IOL
0.4V
3 mA
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MIC23356
2
6.0
I C INTERFACE DESCRIPTION
The I2C bus is for 2-way, 2-line communication
between different ICs or modules. The two lines are: a
serial data line (SDA) and a serial clock line (SCL).
Both lines must be connected to a positive supply via a
pull-up resistor. Data transfer may be initiated only
when the bus is not busy. MIC23356 is a slave-only
device (i.e., it cannot generate a SCL signal and does
not have SCL clock stretching capability). Every data
transfer to and from the MIC23356 must be initiated by
a master device which drives the SCL line.
SDA
SCL
Change of data
allowed
Data line stable;
data valid
FIGURE 6-1:
Bit Transfer.
6.1
Bit Transfer
One data bit is transferred during each clock pulse. The
data on the SDA line must remain stable during the
HIGH period of the clock pulse as changes in the data
line at this time will be interpreted as control signals.
6.2
START and STOP Conditions
Both data and clock lines remain HIGH when the bus is
not busy. A HIGH-to-LOW transition of the data line
while the clock is high is defined as the START (S) or
repeated START (Sr) condition. A LOW-to-HIGH
transition of the data line while the clock is high is
defined as the STOP condition (P). START and STOP
conditions are always generated by the master. The
bus is considered to be busy after the START condition.
The bus is considered to be free again a certain time
after the STOP condition. The bus stays busy if a
repeated START (Sr) is generated instead of a STOP
condition.
SDA
SDA
SCL
S
SCL
P
STOP condition
START condition
FIGURE 6-2:
START and STOP Conditions.
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MIC23356
A ‘zero’ in the Least Significant position of the first byte
means that the master will write information to a
selected slave. A ‘1’ in this position means that the
master will read information from the slave. When an
address is sent, each device in a system compares the
first seven bits after the START condition with its
address. If they match, the device considers itself
addressed by the master as a slave-receiver or
slave-transmitter, depending on the R/W bit.
6.3
Device Address
The MIC23356 device uses a fixed 7-bit address, which
is set in hardware. This address is “0x5B”.
6.4
Acknowledge
The number of data bytes transferred between the
START and the STOP conditions, from transmitter to
receiver, is not limited. Each byte of eight bits is fol-
lowed by one Acknowledge bit. The Acknowledge bit is
a high level put on the bus by the transmitter, whereas
the master generates an extra acknowledge-related
clock pulse. The device that acknowledges has to pull
down the SDA line during the acknowledge clock pulse,
so that the SDA line is stable low during the high period
of the acknowledge-related clock pulse; setup and hold
times must be taken into account.
Command byte is a data byte which selects a register
on the device. The Least Significant six bits of the
command byte determine the address of the register
that needs to be written.
The data to port is the 8-bit data that needs to be written
to the selected register. This is followed by the
acknowledge from the slave and then the STOP
condition.
A slave receiver which is addressed must generate an
acknowledge after the reception of each byte.
The Write command is as follows and it is illustrated in
the timing diagram below:
Also, a master receiver must generate an acknowledge
after the reception of each byte that has been clocked
out of the slave transmitter, except on the last received
byte. A master receiver must signal an end of data to
the transmitter by not generating an acknowledge on
the last byte that has been clocked out of the slave
transmitter. In this event, the transmitter must leave the
data line high to enable the master to generate a STOP
condition.
1. Send START sequence
2. Send 7-bit slave address
3. Send the R/W bit - 0 to indicate a write operation
4. Wait for acknowledge from the slave
5. Send the command byte – address that needs to
be written
6. Wait for acknowledge from the slave
7. Receive the 8-bit data from the master and write
it to the slave register indicated in step 5 starting
from MSB
6.5
Bus Transactions
8. Acknowledge from the slave
9. Send STOP sequence
6.5.1
SINGLE WRITE
The first seven bits of the first byte make up the slave
address. The eighth bit is the LSB (Least Significant
bit). It determines the direction of the message (R/W).
1
2
3
4
5
6
7
8
9
SCL
Data to port
DATA 1
Slave address
Command byte
S
0
A
0
0
A
A
P
SDA
ACK from
Slave
START condition
R/W
ACK from
Slave
ACK from
Slave
DATA 1 VALID
Data out from port
FIGURE 6-3:
Single Write Timing Diagram.
Note:
Writing to a non-existing register location
will have no effect.
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MIC23356
7. Send START sequence again (Repeated
START condition)
6.5.2
SINGLE READ
This reads a single byte from a device, from a
designated register. The register is specified through
the command byte.
8. Send the 7-bit slave address
9. Send R/W bit - 1 to indicate a read operation
10. Wait for acknowledge from the slave
The Read command is as follows and it is illustrated in
the timing diagram of Figure 6-4 below.
11. Receive the 8-bit data from the slave starting
from MSB
1. Send START sequence
12. Acknowledge from the master. On the received
byte, the master receiver issues a NACK in
place of ACK to signal the end of the data
transfer.
2. Send 7-bit slave address
3. Send the R/W bit - 0 to indicate a write operation
4. Wait for acknowledge from the slave
5. Send the register address that needs to be read
6. Wait for acknowledge from the slave
13. Send STOP sequence
Slave address
Command byte
(cont.)
* * *
SDA
S
0
A
A
ACK from
Slave
START
condition
R/W
ACK from Slave
Slave address
Data from register
DATA (first byte)
(cont.)
* * *
Sr
1
A
A
P
(repeated)
START condition
STOP
condition
R/W
ACK from Slave
At this moment master-transmitter becomes master-receiver
and slave-receiver becomes slave-transmitter
FIGURE 6-4:
Note:
Single Read Timing Diagram.
Attempts to read from a non-existing
register location will return all zeros.
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MIC23356
2
7.0
REGISTER MAP AND I C
PROGRAMMABILITY
The MIC23356 internal registers are summarized in
Table 7-1, below.
TABLE 7-1:
Address
0x00
MIC23356 REGISTER MAP
Register Name
Control Register (CTRL1)
TON<1:0>
Reserved
Output Control Register (CTRL2)
OT_LATCH PULL_DN
ILIM
EN_DELAY<1:0>
EN_INT
EN_CON
0x01
DIS_100PCT FPWM
SLEW_RATE<3:0>
0x02
0x03
Output Voltage Register (VOUT)
VO<7:0>
Status and Fault Register (FAULT)
OT_WARN
EN_STAT BOOT_ERR
SSD
HICCUP
OT
LATCH_OFF
PG
Register 7-1:
CTRL1 – CONTROL REGISTER (ADDRESS 0x00)
R/W-V
R/W-V
Reserved
R/W-V
ILIM
R/W-0
R/W-0
R/W-0
R/W-0
EN_CON
bit 0
TON
EN_DELAY
EN_INT
bit 7
Legend:
R = Readable bit
-n = Value at POR
W = Writable bit
‘1’ = Bit is set
U = Unimplemented bit, read as ‘0’
‘0’ = Bit is cleared x = Bit is unknown
RC = Read-then-clear bit
V = Factory-programmed POR value
bit 7-6
TON<7:6>: On Time
00 = Low Frequency
01 = Medium Frequency
10 = High Frequency
11 = Very High Frequency
bit 5
bit 4
Reserved
ILIM High-Side Peak Current Limit
0 = 3.5A
1 = 5A
bit 3-2
EN_DELAY<3:2>: Enable Delay
00 = 250 µs
01 = 1 ms
10 = 2 ms
11 = 3 ms
bit 1
bit 0
EN_INT: Enable Bit Register Control
0 = Register Controlled
1 = Enable Controlled
EN_CON: Enable Control
0 = Off
1 = On
2019 Microchip Technology Inc.
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MIC23356
Register 7-2:
CTRL2 – OUTPUT CONTROL REGISTER (ADDRESS 0x01)
R/W-0
DIS_100PCT
bit 7
R/W-0
FPWM
R/W-V
R/W-V
R/W-V
R/W-V
R/W-V
R/W-V
bit 0
OT_LATCH
PULLDN
SLEW_RATE
Legend:
R = Readable bit
-n = Value at POR
W = Writable bit
‘1’ = Bit is set
U = Unimplemented bit, read as ‘0’
‘0’ = Bit is cleared x = Bit is unknown
RC = Read-then-clear bit
V = Factory-programmed POR value
bit 7
bit 6
bit 5
bit 4
bit 3-0
DIS_100PCT: Disable 100% Duty Cycle
0 = 100% DC
1 = Disable 100% DC
FPWM: Force PWM
0 = HLL
1 = FPWM
OT_LATCH: Over Temperature Latch
0 = Latch Off Immediately
1 = Latch Off after 4 OT Cycles
PULLDN: Enable/Disable Regulator pull-down when power down
0 = No Pull Down
1 = Pull Down
SLEW_RATE<3:0>: Step Slew-Rate Time in µs/V
0000 = 200
0001 = 400
0010 = 600
0011 = 800
0100 = 1000
0101 = 1200
0110 = 1400
0111 = 1600
1000 = 1800
1001 = 2000
1010 = 2200
1011 = 2400
1100 = 2600
1101 = 2800
1110 = 3000
1111 = 3200
2019 Microchip Technology Inc.
DS20006130A-page 26
MIC23356
Register 7-3:
OUTPUT VOLTAGE CONTROL REGISTER (ADDRESS 0x02)
R/W-V
R/W-V
R/W-V
R/W-V
R/W-V
R/W-V
R/W-V
R/W-V
bit 0
VO
bit 7
Legend:
R = Readable bit
-n = Value at POR
W = Writable bit
‘1’ = Bit is set
U = Unimplemented bit, read as ‘0’
‘0’ = Bit is cleared x = Bit is unknown
RC = Read-then-clear bit
V = Factory-programmed POR value
bit 7-0
VO<7:0>: Output Voltage Control: Options YFT, HAYFT, FAYFT
For codes 0x00 to 0x76: 0.6V.
0x80 = 0.645
0x81 = 0.65V
0x82 = 0.655V
0x83 = 0.66V
0x84 = 0.665V
0x85 = 0.67V
0x86 = 0.675V
0x87 = 0.68V
0x88 = 0.685V
0x89 = 0.69V
0x8A = 0.695V
0x8B = 0.7V
0xA0 = 0.805V
0xA1 = 0.81V
0xA2 = 0.815V
0xA3 = 0.82V
0xA4 = 0.825V
0xA5 = 0.83V
0xA6 = 0.835V
0xA7 = 0.84V
0xA8 = 0.845V
0xA9 = 0.85V
0xAA = 0.855V
0xAB = 0.86V
0xAC = 0.865V
0xAD = 0.87V
0xAE = 0.875V
0xAF = 0.88V
0xB0 = 0.885V
0xB1 = 0.89V
0xB2 = 0.895V
0xB3 = 0.9V
0xC0 = 0.965
0xC1 = 0.97V
0xC2 = 0.975V
0xC3 = 0.98V
0xC4 = 0.985V
0xC5 = 0.99V
0xC6 = 0.995V
0xC7 = 1V
0xE0 = 1.125V
0xE1 = 1.13V
0xE2 = 1.135V
0xE3 = 1.14V
0xE4 = 1.145V
0xE5 = 1.15V
0xE6 = 1.155V
0xE7 = 1.16V
0xE8 = 1.165V
0xE9 = 1.17V
0xEA = 1.175V
0xEB = 1.18V
0xEC = 1.185V
0xED = 1.19V
0xEE = 1.195V
0xEF = 1.2V
0xC8 = 1.005V
0xC9 = 1.01V
0xCA = 1.015V
0xCB = 1.02V
0xCC = 1.025V
0xCD = 1.03V
0xCE = 1.035V
0xCF = 1.04V
0xD0 = 1.045V
0xD1 = 1.05V
0xD2 = 1.055V
0xD3 = 1.06V
0xD4 = 1.065V
0xD5 = 1.07V
0xD6 = 1.075V
0xD7 = 1.08V
0xD8 = 1.085V
0xD9 = 1.09V
0xDA = 1.095V
0xDB = 1.1V
0x8C = 0.705V
0x8D = 0.71V
0x8E = 0.715V
0x8F = 0.72V
0x90 = 0.725V
0x91 = 0.73V
0x92 = 0.735V
0x93 = 0.74V
0x94 = 0.745V
0x95 = 0.75V
0x96 = 0.755V
0x97 = 0.76V
0x98 = 0.765V
0x99 = 0.77V
0x9A = 0.775V
0x9B = 0.78V
0x9C = 0.785V
0x9D = 0.79V
0x9E = 0.795V
0x9F = 0.8V
0xF0 = 1.205V
0xF1 = 1.21V
0xF2 = 1.215V
0xF3 = 1.22V
0xF4 = 1.225V
0xF5 = 1.23V
0xF6 = 1.235V
0xF7 = 1.24V
0xF8 = 1.245V
0xF9 = 1.25V
0xFA = 1.255V
0xFB = 1.26V
0xFC = 1.265V
0xFD = 1.27V
0xFE = 1.275V
0xFF = 1.28V
0xB4 = 0.905V
0xB5 = 0.91V
0xB6 = 0.915V
0xB7 = 0.92V
0xB8 = 0.925V
0xB9 = 0.93V
0xBA = 0.935V
0xBB = 0.94V
0xBC = 0.945V
0xBD = 0.95V
0xBE = 0.955V
0xBF = 0.96V
0x77 = 0.6V
0x78 = 0.605V
0x79 = 0.61V
0x7A = 0.615V
0x7B = 0.62V
0x7C = 0.625V
0x7D = 0.63V
0x7E = 0.635V
0x7F = 0.64V
0xDC = 1.105V
0xDD = 1.11V
0xDE = 1.115V
0xDF = 1.12V
2019 Microchip Technology Inc.
DS20006130A-page 27
MIC23356
Register 7-3:
OUTPUT VOLTAGE CONTROL REGISTER (ADDRESS 0x02) (Continued)
bit 7-0
VO<7:0>: Output Voltage Control: Option SAYFT
For codes 0x00 to 0x3B: 0.6V
0x40 = 0.65V 0x60 = 0.97V 0x80 = 1.3V
0xA0 = 1.94V 0xC0 = 2.58V 0xE0 = 3.22V
0xE1 = 3.24V
0x42 = 0.67V 0x62 = 0.99V 0x82 = 1.34V 0xA2 = 1.98V 0xC2 = 2.62V 0xE2 = 3.26V
0x43 = 0.68V 0x63 = 1V 0x83 = 1.36V 0xA3 = 2V 0xC3 = 2.64V 0xE3 = 3.28V
0x44 = 0.69V 0x64 = 1.01V 0x84 = 1.38V 0xA4 = 2.02V 0xC4 = 2.66V 0xE4 = 3.3V
0x45 = 0.7V 0x65 = 1.02V 0x85 = 1.4V 0xA5 = 2.04V 0xC5 = 2.68V 0xE5 = 3.32V
0x46 = 0.71V 0x66 = 1.03V 0x86 = 1.42V 0xA6 = 2.06V 0xC6 = 2.7V 0xE6 = 3.34V
0x47 = 0.72V 0x67 = 1.04V 0x87 = 1.44V 0xA7 = 2.08V 0xC7 = 2.72V 0xE7 = 3.36V
0x48 = 0.73V 0x68 = 1.05V 0x88 = 1.46V 0xA8 = 2.1V 0xC8 = 2.74V 0xE8 = 3.38V
0x41 = 0.66V 0x61 = 0.98V 0x81 = 1.32V 0xA1 = 1.96V 0xC1 = 2.6V
0x49 = 0.74V 0x69 = 1.06V 0x89 = 1.48V 0xA9 = 2.12V 0xC9 = 2.76V 0xE9 = 3.4V
0x4A = 0.75V 0x6A = 1.07V 0x8A = 1.5V 0xAA = 2.14V 0xCA = 2.78V 0xEA = 3.42V
0x4B = 0.76V 0x6B = 1.08V 0x8B = 1.52V 0xAB = 2.16V 0xCB = 2.8V 0xEB = 3.44V
0x4C = 0.77V 0x6C = 1.09V 0x8C = 1.54V 0xAC = 2.18V 0xCC = 2.82V 0xEC = 3.46V
0x4D = 0.78V 0x6D = 1.1V 0x8D = 1.56V 0xAD = 2.2V 0xCD = 2.84V 0xED = 3.48V
0x4E = 0.79V 0x6E = 1.11V 0x8E = 1.58V 0xAE = 2.22V 0xCE = 2.86V 0xEE = 3.5V
0x4F = 0.8V
0x50 = 0.81V 0x70 = 1.13V 0x90 = 1.62V 0xB0 = 2.26V 0xD0 = 2.9V
0x51 = 0.82V 0x71 = 1.14V 0x91 = 1.64V 0xB1 = 2.28V 0xD1 = 2.92V 0xF1 = 3.56V
0x52 = 0.83V 0x72 = 1.15V 0x92 = 1.66V 0xB2 = 2.3V 0xD2 = 2.94V 0xF2 = 3.58V
0x53 = 0.84V 0x73 = 1.16V 0x93 = 1.68V 0xB3 = 2.32V 0xD3 = 2.96V 0xF3 = 3.6V
0x54 = 0.85V 0x74 = 1.17V 0x94 = 1.7V 0xB4 = 2.34V 0xD4 = 2.98V 0xF4 = 3.62V
0x55 = 0.86V 0x75 = 1.18V 0x95 = 1.72V 0xB5 = 2.36V 0xD5 = 3V 0xF5 = 3.64V
0x56 = 0.87V 0x76 = 1.19V 0x96 = 1.74V 0xB6 = 2.38V 0xD6 = 3.02V 0xF6 = 3.66V
0x57 = 0.88V 0x77 = 1.2V 0x97 = 1.76V 0xB7 = 2.4V 0xD7 = 3.04V 0xF7 = 3.68V
0x58 = 0.89V 0x78 = 1.21V 0x98 = 1.78V 0xB8 = 2.42V 0xD8 = 3.06V 0xF8 = 3.7V
0x59 = 0.9V 0x79 = 1.22V 0x99 = 1.8V 0xB9 = 2.44V 0xD9 = 3.08V 0xF9 = 3.72V
0x6F = 1.12V 0x8F = 1.6V 0xAF = 2.24V 0xCF = 2.88V 0xEF = 3.52V
0xF0 = 3.54V
0x5A = 0.91V 0x7A = 1.23V 0x9A = 1.82V 0xBA = 2.46V 0xDA = 3.1V 0xFA = 3.74V
0x5B = 0.92V 0x7B = 1.24V 0x9B = 1.84V 0xBB = 2.48V 0xDB = 3.12V 0xFB = 3.76V
0x3B = 0.6V
0x3C = 0.61V 0x5C = 0.93V 0x7C = 1.25V 0x9C = 1.86V 0xBC = 2.5V 0xDC = 3.14V 0xFC = 3.78V
0x3D = 0.62V 0x5D = 0.94V 0x7D = 1.26V 0x9D = 1.88V 0xBD = 2.52V 0xDD = 3.16V 0xFD = 3.8V
0x3E = 0.63V 0x5E = 0.95V 0x7E = 1.27V 0x9E = 1.9V 0xBE = 2.54V 0xDE = 3.18V 0xFE = 3.82V
0x3F = 0.64V 0x5F = 0.96V 0x7F = 1.28V 0x9F = 1.92V 0xBF = 2.56V 0xDF = 3.2V 0xFF = 3.84V
2019 Microchip Technology Inc.
DS20006130A-page 28
MIC23356
Register 7-4:
STATUS AND FAULT REGISTER (ADDRESS 0x03)
R-0
OT_WARN
bit 7
R-0
R-0
R-0
R-0
R-0
OT
R-0
R-0
PG
EN_STAT
BOOT_ERR
SSD
HICCUP
LATCH_OFF
bit 0
Legend:
R = Readable bit
W = Writable bit
‘1’ = Bit is set
U = Unimplemented bit, read as ‘0’
‘0’ = Bit is cleared x = Bit is unknown
-n = Value at POR
RC = Read-then-clear bit
bit 7
bit 6
bit 5
bit 4
bit 3
bit 2
bit 1
bit 0
OT_WARN: Over Temperature Warning
0 = No Fault
1 = Fault
EN_STAT: Buck ON/OFF Control
0 = OFF
1 = ON
BOOT_ERR: Boot-Up Error
0 = No Fault
1 = Fault
SSD: Soft-Start Done
0 = Ramp not Done
1 = Ramp Done
HICCUP: Current Limit Hiccup
0 = Not in Hiccup
1 = In Hiccup
OT: Over Temperature
0 = No Fault
1 = Fault
LATCH_OFF: Overcurrent or Overtemperature Fault Latch Off
0 = No Fault
1 = Fault (device is latched off)
PG: Power Good.
0 = Power Not Good
1 = Power Good
2019 Microchip Technology Inc.
DS20006130A-page 29
MIC23356
8.0
8.1
PACKAGING INFORMATION
Package Marking Information
16-Lead FTQFN 2.5 mm x 2.5 mm
Example
23356
7256
WNNN
Part Number
Marking
Marking Code
MIC23356YFT
XXXX
XXXX
XXXX
XXXX
23356
356FA
356HA
356SA
MIC23356-FAYFT
MIC23356-HAYFT
MIC23356-SAYFT
Legend: XX...X Customer-specific information
Y
YY
WW
NNN
Year code (last digit of calendar year)
Year code (last 2 digits of calendar year)
Week code (week of January 1 is week ‘01’)
Alphanumeric traceability code
e
3
Pb-free JEDEC designator for Matte Tin (Sn)
*
This package is Pb-free. The Pb-free JEDEC designator (
can be found on the outer packaging for this package.
)
e3
Note: In the event the full Microchip part number cannot be marked on one line, it will
be carried over to the next line, thus limiting the number of available
characters for customer-specific information.
2019 Microchip Technology Inc.
DS20006130A-page 30
MIC23356
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging.
2019 Microchip Technology Inc.
DS20006130A-page 31
MIC23356
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging.
2019 Microchip Technology Inc.
DS20006130A-page 32
MIC23356
APPENDIX A: REVISION HISTORY
Revision A (March 2019)
• Original release of this document
2019 Microchip Technology Inc.
DS20006130A-page 33
MIC23356
PRODUCT IDENTIFICATION SYSTEM
To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office.
XX
X
PART NO.
Device
XX
Examples:
Package
Temperature
Range
Tape and Reel
Option
a)
MIC23356YFT:
Step-Down Converter with
HyperLight Load™,
-40C to+125C
Junction Temperature Range,
16-Lead FTQFN
MIC23356YFT-TR: Step-Down Converter with
Device:
MIC23356
Step-Down Converter with HyperLight Load™
b)
HyperLight Load™,
-40C to +125C
Junction Temperature Range,
16-Lead FTQFN,
Junction
Temperature
Range:
Y
=
-40C to +125C
Tape and Reel
Note 1:
Tape and Reel identifier only appears in the
catalog part number description. This identifier is
used for ordering purposes and is not printed on
the device package. Check with your Microchip
Sales Office for package availability with the
Tape and Reel option.
Package:
FT
TR
=
=
16-Lead FTQFN 2.5 x 2.5 mm
Tape and Reel
Tape and Reel
Option:
2019 Microchip Technology Inc.
DS20006130A-page 34
Note the following details of the code protection feature on Microchip devices:
•
Microchip products meet the specification contained in their particular Microchip Data Sheet.
•
Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the
intended manner and under normal conditions.
•
There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our
knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data
Sheets. Most likely, the person doing so is engaged in theft of intellectual property.
•
•
Microchip is willing to work with the customer who is concerned about the integrity of their code.
Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not
mean that we are guaranteeing the product as “unbreakable.”
Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our
products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts
allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act.
Information contained in this publication regarding device
applications and the like is provided only for your convenience
and may be superseded by updates. It is your responsibility to
ensure that your application meets with your specifications.
MICROCHIP MAKES NO REPRESENTATIONS OR
WARRANTIES OF ANY KIND WHETHER EXPRESS OR
IMPLIED, WRITTEN OR ORAL, STATUTORY OR
OTHERWISE, RELATED TO THE INFORMATION,
INCLUDING BUT NOT LIMITED TO ITS CONDITION,
QUALITY, PERFORMANCE, MERCHANTABILITY OR
FITNESS FOR PURPOSE. Microchip disclaims all liability
arising from this information and its use. Use of Microchip
devices in life support and/or safety applications is entirely at
the buyer’s risk, and the buyer agrees to defend, indemnify and
hold harmless Microchip from any and all damages, claims,
suits, or expenses resulting from such use. No licenses are
conveyed, implicitly or otherwise, under any Microchip
intellectual property rights unless otherwise stated.
Trademarks
The Microchip name and logo, the Microchip logo, AnyRate, AVR,
AVR logo, AVR Freaks, BitCloud, chipKIT, chipKIT logo,
CryptoMemory, CryptoRF, dsPIC, FlashFlex, flexPWR, Heldo,
JukeBlox, KeeLoq, Kleer, LANCheck, LINK MD, maXStylus,
maXTouch, MediaLB, megaAVR, MOST, MOST logo, MPLAB,
OptoLyzer, PIC, picoPower, PICSTART, PIC32 logo, Prochip
Designer, QTouch, SAM-BA, SpyNIC, SST, SST Logo,
SuperFlash, tinyAVR, UNI/O, and XMEGA are registered
trademarks of Microchip Technology Incorporated in the U.S.A.
and other countries.
ClockWorks, The Embedded Control Solutions Company,
EtherSynch, Hyper Speed Control, HyperLight Load, IntelliMOS,
mTouch, Precision Edge, and Quiet-Wire are registered
trademarks of Microchip Technology Incorporated in the U.S.A.
Adjacent Key Suppression, AKS, Analog-for-the-Digital Age, Any
Capacitor, AnyIn, AnyOut, BodyCom, CodeGuard,
CryptoAuthentication, CryptoAutomotive, CryptoCompanion,
CryptoController, dsPICDEM, dsPICDEM.net, Dynamic Average
Matching, DAM, ECAN, EtherGREEN, In-Circuit Serial
Programming, ICSP, INICnet, Inter-Chip Connectivity,
JitterBlocker, KleerNet, KleerNet logo, memBrain, Mindi, MiWi,
motorBench, MPASM, MPF, MPLAB Certified logo, MPLIB,
MPLINK, MultiTRAK, NetDetach, Omniscient Code Generation,
PICDEM, PICDEM.net, PICkit, PICtail, PowerSmart, PureSilicon,
QMatrix, REAL ICE, Ripple Blocker, SAM-ICE, Serial Quad I/O,
SMART-I.S., SQI, SuperSwitcher, SuperSwitcher II, Total
Endurance, TSHARC, USBCheck, VariSense, ViewSpan,
WiperLock, Wireless DNA, and ZENA are trademarks of
Microchip Technology Incorporated in the U.S.A. and other
countries.
SQTP is a service mark of Microchip Technology Incorporated in
the U.S.A.
Microchip received ISO/TS-16949:2009 certification for its worldwide
headquarters, design and wafer fabrication facilities in Chandler and
Tempe, Arizona; Gresham, Oregon and design centers in California
and India. The Company’s quality system processes and procedures
are for its PIC® MCUs and dsPIC® DSCs, KEELOQ® code hopping
devices, Serial EEPROMs, microperipherals, nonvolatile memory and
analog products. In addition, Microchip’s quality system for the design
and manufacture of development systems is ISO 9001:2000 certified.
Silicon Storage Technology is a registered trademark of Microchip
Technology Inc. in other countries.
GestIC is a registered trademark of Microchip Technology
Germany II GmbH & Co. KG, a subsidiary of Microchip
Technology Inc., in other countries.
All other trademarks mentioned herein are property of their
respective companies.
QUALITYꢀMANAGEMENTꢀꢀSYSTEMꢀ
CERTIFIEDꢀBYꢀDNVꢀ
© 2019, Microchip Technology Incorporated, All Rights Reserved.
ISBN: 978-1-5224-4275-2
== ISO/TSꢀ16949ꢀ==ꢀ
2019 Microchip Technology Inc.
DS20006130A-page 35
Worldwide Sales and Service
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2019 Microchip Technology Inc.
DS20006130A-page 36
08/15/18
相关型号：
MIC2341R-2YTQ
Power Supply Support Circuit, Adjustable, 2 Channel, PQFP48, LEAD FREE, TQFP-48
MICROCHIP
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