MIC2582-JBMTR [MICROCHIP]

Power Supply Management Circuit, Adjustable, 1 Channel, PDSO8, SOIC-8;
MIC2582-JBMTR
型号: MIC2582-JBMTR
厂家: MICROCHIP    MICROCHIP
描述:

Power Supply Management Circuit, Adjustable, 1 Channel, PDSO8, SOIC-8

光电二极管
文件: 总25页 (文件大小:826K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
MIC2582/MIC2583  
Single Channel Hot Swap Controllers  
General Description  
Features  
The MIC2582 and MIC2583 are single channel positive  
voltage hot swap controllers designed to allow the safe  
insertion of boards into live system backplanes. The  
MIC2582 and MIC2583 are available in 8-pin SOIC and  
16-pin QSOP packages, respectively. Using a few external  
components and by controlling the gate drive of an  
external N-Channel MOSFET device, the MIC2582/83  
provide inrush current limiting and output voltage slew rate  
control in harsh, critical power supply environments.  
Additionally, a circuit breaker function will latch the output  
MOSFET off if the current limit threshold is exceeded for a  
determined period. The MIC2583R option includes an  
auto-restart function upon detecting an over current  
condition.  
MIC2582:  
Pin-for-pin functional equivalent to the LTC1422  
2.3V to 13.2V supply voltage operation  
Surge voltage protection up to 20V  
Current regulation limits inrush current regardless of load  
capacitance  
Programmable inrush current limiting  
Electronic circuit breaker  
Optional dual-level overcurrent threshold detects  
excessive load faults  
Fast response to short circuit conditions (<1µs)  
Programmable output under-voltage detection  
Under-voltage Lockout (UVLO) protection  
Auto-restart function (MIC2583R)  
Power-On Reset and Power-Good status outputs  
(Power-Good for the MIC2583 and MIC2583R only)  
Datasheets and support documentation can be found on  
Micrel’s web site at www.micrel.com.  
/FAULT status output (MIC2583 and MIC2583R)  
Applications  
RAID systems  
Base stations  
PC board hot swap insertion and removal  
+12V backplanes  
Network switches  
___________________________________________________________________________________________________________  
Typical Applications  
Figure 1. MIC2583/83R Typical Application Circuit  
Micrel Inc. • 2180 Fortune Drive • San Jose, CA 95131 • USA • tel +1 (408) 944-0800 • fax + 1 (408) 474-1000 • http://www.micrel.com  
M9999-043009-C  
April 2009  
Micrel, Inc.  
MIC2582/MIC2583  
Ordering Information  
Part Number  
Standard  
Fast Circuit Breaker Threshold  
Circuit Breaker  
Package  
Pb-Free  
MIC2582-JBM  
MIC2582-xYM  
x = J, 100mV  
x = J1, Off  
Latched off  
8-Pin SOIC  
x = M, Off  
MIC2583-xBQS  
MIC2583-xYQS  
x = J, 100mV  
x = K*, 150mV  
x = L*, 200mV  
x = M*, Off  
Latched off  
Auto-retry  
16-pin QSOP  
16-pin QSOP  
MIC2583R-xBQS  
MIC2583R-xYQS  
x = J, 100mV  
x = K*, 150mV  
x = L*, 200mV  
x = M*, Off  
Note:  
* Contact factory for availability.  
Pin Configuration  
8-Pin SOIC (M)  
16-Pin QSOP (QS)  
M9999-043009-C  
April 2009  
2
Micrel, Inc.  
MIC2582/MIC2583  
Pin Description  
Pin Number  
8-Pin SOIC  
Pin Number  
16-Pin QSOP  
Pin Name  
Pin Name  
1
1
/POR  
Power-On Reset Output: Open drain N-channel device, Active Low. This pin  
remains asserted during start-up until a time period (tPOR) after the FB pin  
voltage rises above the power-good threshold (VFB). The timing capacitor CPOR  
determines tPOR. When the output voltage monitored at the FB pin falls below  
VFB, /POR is asserted for a minimum of one timing cycle (tPOR). The /POR pin  
requires a pull-up resistor (10kminimum) to VCC.  
2
3
4
ON  
ON Input: Active High. The ON pin, an input to a Schmitt-triggered comparator  
used to enable/disable the controller, is compared to a 1.24V reference with  
50mV of hysteresis. When a logic high is applied to the ON pin (VON > 1.24V), a  
start-up sequence begins when the GATE pin starts ramping up towards its final  
operating voltage. When the ON pin receives a logic low signal (VON < 1.19V),  
the GATE pin is grounded and /FAULT remains high if VCC is above the UVLO  
threshold. ON must be low for 20µs in order to initiate a start-up sequence.  
Additionally, toggling the ON pin LOW to HIGH resets the circuit breaker.  
3
CPOR  
Power-On Reset Timer: A capacitor connected between this pin and ground sets  
the supply contact start-up delay (tSTART) and the power-on reset interval (tPOR).  
When VCC rises above the UVLO threshold, the capacitor connected to CPOR  
begins to charge. When the voltage at CPOR crosses 0.3V, the start-up  
threshold (VSTART), a start cycle is initiated if ON is asserted while capacitor CPOR  
is immediately discharged to ground. When the voltage at FB rises above VFB,  
capacitor CPOR begins to charge again. When the voltage at CPOR rises above  
the power-on reset delay threshold (VTH), the timer resets by pulling CPOR to  
ground, and /POR is de-asserted. If CPOR is left open, then tSTART defaults to  
20µs.  
4
5
7, 8  
12  
GND  
FB  
Ground Connection: Tie to analog ground.  
Power-Good Threshold Input (Under-voltage Detect): This input is internally  
compared to a 1.24V reference with 30mV of hysteresis. An external resistive  
divider may be used to set the voltage at this pin. If this input momentarily goes  
below 1.24V, then /POR is activated for one timing cycle, tPOR, indicating an  
output under-voltage condition. The /POR signal de-asserts one timing cycle  
after the FB pin exceeds the power-good threshold by 30mV. A 5µs filter on this  
pin prevents glitches from inadvertently activating this signal.  
6
7
14  
15  
GATE  
Gate Drive Output: Connects to the gate of an external N-channel MOSFET. An  
internal clamp ensures that no more than 9V is applied between the GATE pin  
and the source of the external MOSFET. The GATE pin is immediately brought  
low when either the circuit breaker trips or an under-voltage lockout condition  
occurs.  
SENSE  
Circuit Breaker Sense Input: A resistor between this pin and VCC sets the  
current limit threshold. Whenever the voltage across the sense resistor exceeds  
the slow trip current limit threshold (VTRIPSLOW), the GATE voltage is adjusted to  
ensure a constant load current. If VTRIPSLOW (50mV) is exceeded for longer than  
time period tOCSLOW, then the circuit breaker is tripped and the GATE pin is  
immediately pulled low. If the voltage across the sense resistor exceeds the fast  
trip circuit breaker threshold, VTRIPFAST, at any point due to fast, high amplitude  
power supply faults, then the GATE pin is immediately brought low without delay.  
To disable the circuit breaker, the SENSE and VCC pins can be tied together.  
The default VTRIPFAST for either device is 100mV. Other fast trip thresholds are  
available: 150mV, 200mV, or OFF (VTRIPFAST disabled). Please contact factory for  
availability of other options.  
8
16  
VCC  
Positive Supply Input: 2.3V to 13.2V. The GATE pin is held low by an internal  
under-voltage lockout circuit until VCC exceeds a threshold of 2.2V. If VCC  
exceeds 13.2V, an internal shunt regulator protects the chip from transient  
voltages up to 20V at the VCC and SENSE pins.  
M9999-043009-C  
April 2009  
3
Micrel, Inc.  
MIC2582/MIC2583  
Pin Number  
8-Pin SOIC  
Pin Number  
16-Pin QSOP  
Pin Name  
Pin Name  
n/a  
n/a  
n/a  
2
PWRGD  
Power-Good Output: Open drain N-channel device, Active High. When the  
voltage at the FB pin is lower than 1.24V, PWRGD output is held low. When the  
voltage at the FB pin exceeds 1.24V, then PWRGD is asserted immediately. The  
PWRGD pin requires a pull-up resistor (10kminimum) to VCC.  
5
CFILTER  
/FAULT  
Current Limit Response Timer: A capacitor connected to this pin defines the  
period of time (tOCSLOW) in which an over current event must last to signal a fault  
condition and trip the circuit breaker. If no capacitor is connected, then tOCSLOW  
defaults to 5µs.  
11  
Circuit Breaker Fault Status Output: Open drain N-channel device, Active Low.  
The /FAULT pin is asserted when the circuit breaker trips due to an over current  
condition or when an under-voltage lockout condition exists. The/FAULT pin  
requires a pull-up resistor (10kminimum) to VCC.  
n/a  
n/a  
13  
DIS  
NC  
Discharge Output: When the MIC2583/83R is turned off, a 500internal resistor  
at this output allows the discharging of any load capacitance to ground.  
6, 9, 10  
No internal connection.  
M9999-043009-C  
April 2009  
4
Micrel, Inc.  
MIC2582/MIC2583  
Absolute Maximum Ratings(1)  
Operating Ratings(2)  
Supply Voltage (VCC)....................................... –0.3V to 20V  
/POR, /FAULT, PWRGD pins.......................... –0.3V to 15V  
SENSE pin ............................................ –0.3V to VCC+0.3V  
Supply Voltage (VCC).................................. +2.3V to +13.2V  
Ambient Temperature (TA) ..........................40°C to +85°C  
Junction Thermal Resistance  
ON pin  
............................................ –0.3V to VCC+0.3V  
SOIC (θJA)........................................................163°C/W  
QSOP (θJA) ......................................................112°C/W  
GATE pin ..................................................... –0.3V to 20V  
FB Input pins..................................................... –0.3V to 6V  
Junction Temperature ..............................................+125°C  
Lead Temperature  
Standard Package (-JBM and –xBQS)  
(IR Reflow, Peak Temperature) ..240°C + 0°C/-5°C  
Pb-Free Package (-xYM or –xYQS)  
(IR Reflow, Peak Temperature) ..260°C + 0°C/-5°C  
EDS Rating  
Human body model..................................................2kV  
Machine model ......................................................100V  
Electrical Characteristics(3)  
VCC = 5.0V, TA = 25°C unless noted. Bold values indicate –40°C TA +85°C.  
Symbol Parameter  
Condition  
Min  
2.3  
Typ  
Max  
13.2  
2.5  
Units  
V
VCC  
ICC  
Supply Voltage  
Supply Current  
VON = 2V  
1.5  
50  
mA  
VTRIP  
Circuit Breaker Trip Voltage  
(Current Limit Threshold)  
VTRIP = VCC VSENSE VTRIPSLOW  
42  
59  
VTRIPFAST  
(MIC2582-Jxx)  
100  
mV  
VTRIPFAST  
(MIC2583/83R) X = J  
85  
130  
175  
100  
150  
200  
110  
170  
225  
mV  
mV  
mV  
X = K  
X = L  
VGS  
External Gate Drive  
VGATE VCC  
VCC > 3V  
7
8
9
V
V
CC = 2.3V  
Start Cycle, VGATE = 0V, VCC = 13.2V  
CC = 2.3V  
3.5  
30  
26  
4.8  
17  
6.5  
8  
8  
V
IGATE  
GATE Pin Pull-Up Current  
GATE Pink Sink Current  
µA  
µA  
µA  
µA  
µA  
V
17  
IGATEOFF  
VGATE > 1V  
VCC = 13.2V, Note 4  
VCC = 2.3V, Note 4  
Turn Off  
100  
50  
/FAULT = 0  
(MIC2583/83R only)  
110  
ITIMER  
Current Limit/Overcurrent Timer  
(CFILTER) Current  
(MIC2583/83R)  
VCC VSENSE > VTRIPSLOW (timer on)  
CC VSENSE > VTRIPSLOW (timer off)  
8.5  
6.5  
4.5  
µA  
µA  
V
4.5  
6.5  
8.5  
ICPOR  
Power-On-Reset Timer Current  
Timer on  
Timer off  
3.5  
2.5  
1.3  
1.5  
µA  
0.5  
mA  
VTH  
VUV  
POR Delay and Overcurrent  
Timer (CFILTER) Threshold  
V
CPOR rising  
VCFILTER rising (MIC2583/83R only)  
1.19  
2.1  
1.245  
2.2  
1.30  
2.3  
V
V
Undervoltage Lockout Threshold  
VCC rising  
CC falling  
V
1.90  
2.05  
150  
1.24  
1.19  
50  
2.20  
V
VUVHYS  
VON  
Undervoltage Lockout Hysteresis  
ON Pin Threshold Voltage  
mV  
V
2.3V VCC 13.2V  
ON rising  
ON falling  
1.19  
1.14  
1.29  
1.24  
V
VONHYS  
ON Pin Hysteresis  
mV  
M9999-043009-C  
April 2009  
5
Micrel, Inc.  
MIC2582/MIC2583  
Symbol Parameter  
Condition  
Min  
Typ  
Max  
Units  
mV  
µA  
V
ON Pin Threshold Line Regulation 2.3V VCC 13.2V  
2
ΔVON  
ION  
ON Pin Input Current  
VON = VCC  
0.5  
0.36  
1.30  
0.36  
16  
VSTART  
VAUTO  
Start-Up Delay Timer Threshold  
VCPOR rising  
0.26  
0.19  
0.26  
10  
0.31  
1.24  
0.31  
13  
Auto-Restart Threshold Voltage  
(MIC2583R only)  
Upper threshold  
Lower threshold  
Charge current  
Discharge current  
2.3V = VCC = 13.2V  
V
V
IAUTO  
Auto-Restart Current  
(MIC2583R only)  
µA  
µA  
V
1.4  
2
VFB  
Power-Good Threshold Voltage  
FB rising  
FB falling  
1.19  
1.15  
1.24  
1.20  
40  
1.29  
1.25  
V
VFBHYS  
IFBLKG  
VOL  
FB Hysteresis  
mV  
µA  
V
FB Pin Leakage Current  
2.3V = VCC = 13.2V, VFB = 1.3V  
IOUT = 1mA  
1.5  
0.4  
/POR, /FAULT, PWRGD  
Output Voltage  
(/FAULT, PWRGD MIC2583/83R only)  
RDIS  
Output Discharge Resistance  
(MIC2583/83R only)  
500  
1000  
AC Parameters(4)  
tOCFAST  
Fast Overcurrent SENSE to GATE  
Low Trip Time  
V
CC = 5V, VCC VSENSE = 100mV  
1
5
µs  
µs  
CGATE = 10nF, Figure 2  
tOCSLOW  
Slow Overcurrent SENSE to GATE  
Low Trip Time  
V
C
CC = 5V, VCC VSENSE = 50mV  
FILTER = 0, Figure 2  
tONDLY  
tFBDLY  
ON Delay Filter  
FB Delay Filter  
20  
20  
µs  
µs  
Notes:  
1. Exceeding the absolute maximum rating may damage the device.  
2. The device is not guaranteed to function outside its operating rating.  
3. Specification for packaged product only.  
4. Not a tested parameter, guaranteed by design.  
Timing Diagrams  
Figure 2. Current-Limit Response  
Figure 3. Power-On Reset Response  
Figure 4. Power-On Start-Up Delay Timing  
M9999-043009-C  
April 2009  
6
Micrel, Inc.  
MIC2582/MIC2583  
Test Circuit  
Figure 5. Applications Test Circuit  
(not all pins shown for simplicity)  
M9999-043009-C  
April 2009  
7
Micrel, Inc.  
MIC2582/MIC2583  
Typical Characteristics  
M9999-043009-C  
April 2009  
8
Micrel, Inc.  
MIC2582/MIC2583  
M9999-043009-C  
April 2009  
9
Micrel, Inc.  
MIC2582/MIC2583  
Functional Characteristics (See Figure 5, Applications Test Circuit)  
M9999-043009-C  
April 2009  
10  
Micrel, Inc.  
MIC2582/MIC2583  
Functional Characteristics (See Figure 5, Applications Test Circuit)  
M9999-043009-C  
April 2009  
11  
Micrel, Inc.  
MIC2582/MIC2583  
Functional Diagram  
M9999-043009-C  
April 2009  
12  
Micrel, Inc.  
MIC2582/MIC2583  
Functional Description  
delays using several standard value capacitors. As the  
GATE voltage continues ramping toward its final value  
(VCC + VGS) at a defined slew rate (See Load  
Capacitance/Gate Capacitance Dominated Startup  
sections), a second CPOR timing cycle begins if:  
1)/FAULT is high and 2)CFILTER is low (i.e., not an  
overvoltage, undervoltage lockout, or overcurrent state).  
This second timing cycle (tPOR) begins when the voltage  
at the FB pin exceeds its threshold (VFB). This condition  
indicates that the output voltage is valid. See Figure 3 in  
the Timing Diagrams. When the power supply is already  
present (i.e., not a “hot swapping” condition) and the  
MIC2582/83 device is enabled by applying a logic high  
signal at the ON pin, the GATE output begins ramping  
immediately as the first CPOR timing cycle is bypassed.  
Active current regulation is employed to limit the inrush  
current transient response during start-up by regulating  
the load current at the programmed current limit value  
(See Current Limiting and Dual-Level Circuit Breaker  
section). The following equation is used to determine the  
nominal current limit value:  
Hot Swap Insertion  
When circuit boards are inserted into live system  
backplanes and supply voltages, high inrush currents  
can result due to the charging of bulk capacitance that  
resides across the supply pins of the circuit board. This  
inrush current, although transient in nature, may be high  
enough to cause permanent damage to on board  
components or may cause the system’s supply voltages  
to go out of regulation during the transient period which  
may result in system failures. The MIC2582 and  
MIC2583 act as a controller for external N-Channel  
MOSFET devices in which the gate drive is controlled to  
provide inrush current limiting and output voltage slew  
rate control during hot plug insertions.  
Power Supply  
VCC is the supply input to the MIC2582/83 controller  
with a voltage range of 2.3V to 13.2V. The VCC input  
can withstand transient spikes up to 20V. In order to  
ensure stability of the supply voltage, a minimum 0.47µF  
capacitor from VCC to ground is recommended.  
Alternatively, a low pass filter, shown in the typical  
application circuit (see Figure 1), can be used to  
eliminate high frequency oscillations as well as help  
suppress transient spikes.  
VTRIPSLOW  
50mV  
(2)  
ILIM  
=
=
RSENSE  
RSENSE  
where VTRIPSLOW is the current limit slow trip threshold  
found in the electrical table and RSENSE is the selected  
value that will set the desired current limit. There are two  
basic start-up modes for the MIC2582/83: 1) Start-up  
dominated by load capacitance and 2) start-up  
dominated by total gate capacitance. The magnitude of  
the inrush current delivered to the load will determine the  
dominant mode. If the inrush current is greater than the  
programmed current limit (ILIM), then load capacitance is  
dominant. Otherwise, gate capacitance is dominant. The  
expected inrush current may be calculated using the  
following equation:  
Also, due to the existence of an undetermined amount of  
parasitic inductance in the absence of bulk capacitance  
along the supply path, placing a Zener diode at the VCC  
of the controller to ground in order to provide external  
supply transient protection is strongly recommended for  
relatively high current applications (3A). See Figure 1.  
Start-Up Cycle  
Supply Contact Delay  
During a hot insert of a PC board into a backplane or  
when the supply (VCC) is powered up, as the voltage at  
the ON pin rises above its threshold (1.24V typical), the  
MIC2582/83 first checks that both supply voltages are  
above their respective UVLO thresholds. If so, the  
device is enabled and an internal 2.5µA current source  
begins charging capacitor CPOR to 0.3V to initiate a start-  
up sequence. Once the start-up delay (tSTART) elapses,  
the CPOR pin is pulled immediately to ground and a  
17µA current source begins charging the GATE output  
CLOAD  
CGATE  
CLOAD  
CGATE  
(3)  
INRUSH IGATE  
x
= 17μA x  
where IGATE is the GATE pin pull-up current, CLOAD is the  
load capacitance, and CGATE is the total GATE  
capacitance (CISS of the external MOSFET and any  
external capacitor connected from the MIC2582/83  
GATE pin to ground).  
Load Capacitance Dominated Start-Up  
to drive the external MOSFET that switches VIN to VOUT  
.
In this case, the load capacitance (CLOAD) is large  
enough to cause the inrush current to exceed the  
programmed current limit but is less than the fast-trip  
threshold (or the fast-trip threshold is disabled, ‘M’  
option). During start-up under this condition, the load  
current is regulated at the programmed current limit  
value (ILIM) and held constant until the output voltage  
rises to its final value. The output slew rate and  
equivalent GATE voltage slew rate is computed by the  
The programmed contact start-up delay is calculated  
using the following equation:  
VSTART  
(1)  
tSTART = CPOR  
0.12xCPOR  
(
μF  
)
ICPOR  
Where the start-up delay timer threshold (VSTART) is 0.3V,  
and the Power-On Reset timer current (ICPOR) is 2.5µA.  
See Table 2 for some typical supply contact start-up  
M9999-043009-C  
April 2009  
13  
Micrel, Inc.  
MIC2582/MIC2583  
following equation:  
Current Limiting and Dual-Level Circuit Breaker  
Many applications will require that the inrush and steady  
state supply current be limited at a specific value in order  
to protect critical components within the system.  
Connecting a sense resistor between the VCC and  
SENSE pins sets the nominal current limit value of the  
MIC2582/83 and the current limit is calculated using  
Equation 2.  
ILIM  
Output Voltage Slew Rate, dVOUT/dt =  
(4)  
CLOAD  
where ILIM is the programmed current limit value.  
Consequently, the value of CFILTER must be selected to  
ensure that the overcurrent response time, tOCSLOW  
exceeds the time needed for the output to reach its final  
value. For example, given a MOSFET with an input  
capacitance CISS = CGATE = 4700pF, CLOAD is 2200µF,  
and ILIM is set to 6A with a 12V input, then the load  
capacitance dominates as determined by the calculated  
,
The MIC2582/83 also features a dual-level circuit  
breaker triggered via 50mV and 100mV current-limit  
thresholds sensed across the VCC and SENSE pins.  
The first level of the circuit breaker functions as follows.  
For the MIC2583/83R, once the voltage sensed across  
these two pins exceeds 50mV, the overcurrent timer, its  
duration set by capacitor CFILTER, starts to ramp the  
voltage at CFILTER using a 6.5µA constant current source.  
If the voltage at CFILTER reaches the overcurrent timer  
threshold (VTH) of 1.24V, then CFILTER immediately  
returns to ground as the circuit breaker trips and the  
GATE output is immediately shut down. The default  
overcurrent time period for the MIC2582/83 is 5µs. For  
the second level, if the voltage sensed across VCC and  
SENSE exceeds 100mV at any time, the circuit breaker  
trips and the GATE shuts down immediately, bypassing  
the overcurrent time period. The MIC2582-MYM option  
is equipped with only a single circuit breaker threshold  
(50mV). To disable current limit and circuit breaker  
operation, tie the SENSE and VCC pins together and the  
CFILTER (MIC2583/83R) pin to ground.  
INRUSH > ILIM. Therefore, the output voltage slew rate  
determined from Equation 4 is:  
6A  
V
Output Voltage Slew Rate, dVOUT/dt =  
= 2.73  
2200μF  
ms  
and the resulting tOCSLOW needed to achieve a 12V  
output is approximately 4.5ms. (See Power-On Reset  
and Overcurrent Timer Delays section to calculate  
tOCSLOW).  
GATE Capacitance Dominated Start-Up  
In this case, the value of the load capacitance relative to  
the GATE capacitance is small enough such that the  
load current during start-up never exceeds the current  
limit threshold as determined by Equation 3. The  
minimum value of CGATE that will ensure that the current  
limit is never exceeded is given by the equation below:  
Output Undervoltage Detection  
IGATE  
(5)  
CGATE (min) =  
× CLOAD  
The MIC2582/83 employ output undervoltage detection  
by monitoring the output voltage through a resistive  
divider connected at the FB pin. During turn on, while the  
voltage at the FB pin is below the threshold (VFB), the  
/POR pin is asserted low.  
ILIM  
where CGATE is the summation of the MOSFET input  
capacitance (CISS) and the value of the external  
capacitor connected to the GATE pin of the MIC2582/83  
to ground. Once CGATE is determined, use the following  
equation to determine the output slew rate for gate  
capacitance dominated start-up.  
Once the FB pin voltage crosses VFB, a 2.5µA current  
source charges capacitor CPOR. Once the CPOR pin  
voltage reaches 1.24V, the time period tPOR elapses as  
the CPOR pin is pulled to ground and the /POR pin goes  
HIGH. If the voltage at FB drops below VFB for more than  
10µs, the /POR pin resets for at least one timing cycle  
defined by tPOR (See Applications Information for an  
example).  
IGATE  
dVOUT/dt =  
(6)  
CGATE  
Table 1 depicts the output slew rate for various values of  
CGATE  
.
IGATE = 17µA  
Power-On Reset and Overcurrent Timer Delays  
CGATE  
0.001µF  
0.01µF  
0.1µF  
dVOUT/dt  
17V/ms  
The Power-On Reset delay, tPOR, is the time period for  
the /POR pin to go HIGH once the voltage at the FB pin  
exceeds the power-good threshold (VFB). A capacitor  
connected to CPOR sets the interval and is determined  
by using Equation 1 with VTH substituted for VSTART. The  
resulting equation becomes:  
1.7V/ms  
0.17V/ms  
0.017V/ms  
1µF  
VTH  
Table 1. Output Slew Rate Selection for GATE  
Capacitance Dominated Start-Up  
(7)  
tPOR = CPOR  
×
0.5× CPOR  
(
μF  
)
ICPOR  
where the Power-On Reset threshold (VTH) and timer  
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MIC2582/MIC2583  
current (ICPOR  
respectively.  
)
are typically 1.24V and 2.5µA,  
CPOR  
0.01µF  
0.02µF  
0.033µF  
0.05µF  
0.1µF  
tSTART  
1.2ms  
2.4ms  
4ms  
tPOR  
5ms  
For the MIC2583/83R, a capacitor connected to  
CFILTER is used to set the timer which activates the  
circuit breaker during overcurrent conditions. When the  
voltage across the sense resistor exceeds the slow trip  
current limit threshold of 50mV, the overcurrent timer  
begins to charge for a time period (tOCSLOW), determined  
by CFILTER. When no capacitor is connected to CFILTER  
and for the MIC2582, tOCSLOW defaults to 5µs. If tOCSLOW  
elapses, then the circuit breaker is activated and the  
GATE output is immediately pulled to ground. For the  
MIC2583/83R, the following equation is used to  
10ms  
16.5ms  
25ms  
50ms  
165ms  
235ms  
500ms  
6ms  
12ms  
40ms  
56ms  
120ms  
0.33µF  
0.47µF  
1µF  
determine the overcurrent timer period, tOCSLOW  
.
Table 2. Selected Power-On Reset and Start-Up Delays  
VTH  
(8)  
0.19 × CFILTER (μF)  
tOCSLOW = CFILTER  
×
ITIMER  
CFILTER  
680pF  
tOCSLOW  
130µs  
420µs  
900µs  
1.5ms  
6ms  
where VTH, the CFILTER timer threshold, is 1.24V and  
ITIMER, the overcurrent timer current, is 6.5µA. Tables 2  
and 3 provide a quick reference for several timer  
calculations using select standard value capacitors.  
2200pF  
4700pF  
8200pF  
0.033µF  
0.1µF  
19ms  
42ms  
90ms  
0.22µF  
0.47µF  
Table 3. Selected Overcurrent Timer Delays  
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MIC2582/MIC2583  
(9.1)  
Application Information  
VOUT(Good)  
R5 = R6 ⎢  
1⎥  
VFB(MAX)  
Design Consideration for Output Undervoltage  
Detection  
where VFB(MAX) = 1.29V, VOUT(Good) = 11V, and R6 is  
12.4k. Substituting these values into Equation 9.1 now  
yields R5 = 93.33k. A standard 93.1k±% is selected.  
For output undervoltage detection, the first consideration  
is to establish the output voltage level that indicates  
“power is good.” For this example, the output value for  
which a 12V supply will signal “good” is 11V. Next,  
consider the tolerances of the input supply and FB  
threshold (VFB). For this example, the 12V supply varies  
±5%, thus the resulting output voltage may be as low as  
11.4V and as high as 12.6V. Additionally, the FB  
threshold has ±50mV tolerance and may be as low as  
1.19V and as high as 1.29V. Thus, to determine the  
values of the resistive divider network (R5 and R6) at the  
FB pin, shown in the typical application circuit on page 1,  
use the following iterative design procedure.  
Now, consider the 11.4V minimum output voltage, the  
lower tolerance for R6 and higher tolerance for R5,  
12.28kand 94.03k, respectively. With only 11.4V  
available, the voltage sensed at the FB pin exceeds  
VFB(MAX), thus the /POR and PWRGD (MIC2583/83R)  
signals will transition from LOW to HIGH, indicating  
“power is good” given the worse case tolerances of this  
example. Lastly, in giving consideration to the leakage  
current associated with the FB input, it is recommended  
to either: 1) provide ample design margin (20mV to  
30mV) to allow for loss in the potential (V) at the FB  
pin, or 2) allow >>100µA to flow in the FB resistor  
network.  
1) Choose R6 to allow 100µA or more in the FB  
resistive divider branch.  
VFB(MAX)  
1.29V  
R6 =  
=
= 12.9k  
PCB Connection Sense  
100μA  
100μA  
There are several configuration options for the  
MIC2582/83’s ON pin to detect if the PCB has been fully  
seated in the backplane before initiating a start-up cycle.  
In the typical applications circuit, the MIC2582/83 is  
mounted on the PCB with a resistive divider network  
connected to the ON pin. R2 is connected to a short pin  
on the PCB edge connector. Until the connectors mate,  
the ON pin is held low which keeps the GATE output  
charge pump off. Once the connectors mate, the resistor  
network is pulled up to the input supply,  
R6 is chosen as 12.4k±1%.  
2) Next, determine R5 using the output “good”  
voltage of 11V and the following equation:  
(
R5 + R6  
)
VOUT(Good) = VFB  
(9)  
R6  
Using some basic algebra and simplifying Equation 9 to  
isolate R5, yields:  
Figure 6. PCB Connection Sense with ON/OFF Control  
M9999-043009-C  
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Micrel, Inc.  
MIC2582/MIC2583  
5V Switch with 3.3V Supply Generation  
12V in this example, and the ON pin voltage exceeds its  
threshold (VON) of 1.24V and the MIC2582/83 initiates a  
start-up cycle. In Figure 6, the connection sense consisting  
of a discrete logic-level MOSFET and a few resistors allows  
for interrupt control from the processor or other signal  
controller to shut off the output of the MIC2582/83. R4 pulls  
the GATE of Q2 to VIN and the ON pin is held low until the  
connectors are fully mated.  
The MIC2582/83 can be configured to switch a primary  
supply while generating a secondary regulated voltage rail.  
The circuit in Figure 8 enables the MIC2582 to switch a 5V  
supply while also providing a 3.3V low dropout regulated  
supply with only a few added external components. Upon  
enabling the MIC2582, the GATE output voltage increases  
and thus the 3.3V supply also begins to ramp. As the 3.3V  
output supply crosses 3.3V, the FB pin threshold is also  
exceeded which triggers the power-on reset comparator.  
The /POR pin goes HIGH, turning on transistor Q3 which  
lowers the voltage on the gate of MOSFET Q2. The result is  
a regulated 3.3V supply with the gate feedback loop of Q2  
compensated by capacitor C3 and resistors R4 and R5. For  
MOSFET Q2, special consideration must be given to the  
power dissipation capability of the selected MOSFET as  
1.5V to 2V will drop across the device during normal  
operation in this application. Therefore, the device is  
susceptible to overheating dependent upon the current  
requirements for the regulated output. In this example, the  
power dissipated by Q2 is approximately = 1W. However, a  
substantial amount of power will be generated with higher  
current requirements and/or conditions. As a general  
guideline, expect the ambient temperature within the power  
supply box to exceed the maximum operating ambient  
temperature of the system environment by approximately  
20ºC. Given the MOSFET’s Rθ(JA) and the expected power  
dissipated by the MOSFET, an approximation for the  
junction temperature at which the device will operate is  
obtained as follows:  
Once the connectors fully mate, a logic LOW at the  
/ON_OFF signal turns Q2 off and allows the ON pin to pull  
up above its threshold and initiate a start-up cycle. Applying  
a logic HIGH at the /ON_OFF signal will turn Q2 on and  
short the ON pin of the MIC2582/83 to ground which turns  
off the GATE output charge pump.  
Higher UVLO Setting  
Once a PCB is inserted into a backplane (power supply), the  
internal UVLO circuit of the MIC2582/83 holds the GATE  
output charge pump off until VCC exceeds 2.2V. If VCC falls  
below 2.1V, the UVLO circuit pulls the GATE output to  
ground and clears the overvoltage and/or current limit faults.  
A typical 12V application, for example, should implement a  
higher UVLO than the internal 2.1V threshold of MIC2582 to  
avoid delivering power to downstream modules/loads while  
the input is below tolerance. For a higher UVLO threshold,  
the circuit in Figure 7 can be used to delay the output  
MOSFET from switching on until the desired input voltage is  
achieved. The circuit allows the charge pump to remain off  
R1  
R2  
until V exceeds 1+  
× 1.24V. The GATE drive output  
IN  
TJ = (PD x Rθ(JA)) + TA  
(10)  
R1  
R2  
will be shut down when V falls below 1+  
× 1.19V. In  
IN  
where TA = TA (MAX OPERATING) + 20ºC. As a precaution, the  
implementation of additional copper heat sinking is highly  
recommended for the area under/around the MOSFET.  
the example circuit (Figure 7), the rising UVLO threshold is  
set at approximately 9.5V and the falling UVLO threshold is  
established as 9.1V. The circuit consists of an external  
resistor divider at the ON pin that keeps the GATE output  
charge pump off until the voltage at the ON pin exceeds its  
threshold (VON) and after the start-up timer elapses.  
Figure 7. Higher UVLO Setting  
M9999-043009-C  
April 2009  
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Micrel, Inc.  
MIC2582/MIC2583  
For additional information on MOSFET thermal  
considerations, please see MOSFET Selection text and  
subsequent sections.  
42mV  
40.8mV  
(11)  
RSENSE(MAX )  
=
=
(
1.03  
)
(
ILOAD(CONT )  
)
ILOAD(CONT )  
Once the value of RSENSE has been chosen in this  
manner, it is good practice to check the maximum  
Auto-Restart - MIC2583R  
I
LOAD(CONT) which the circuit may let through in the case of  
The MIC2583R provides an auto-restart function. Upon  
an overcurrent fault condition such as a short circuit, the  
MIC2583R initially shuts off the GATE output. The  
MIC2583R attempts to restart with a 12µA charge  
current at a preset 10% duty cycle until the fault  
condition is removed. The interval between auto-retry  
tolerance buildup in the opposite direction. Here, the  
worst-case maximum current is found using a 59mV trip  
voltage and a sense resistor that is 3% low in value. The  
resulting equation is:  
59mV  
60.8mV  
ILOAD(CONT,MAX )  
=
=
(12)  
attempts is set by capacitor CFILTER  
.
(0.97)  
(
RSENSE(NOM)  
)
RSENSE(NOM)  
Sense Resistor Selection  
As an example, if an output must carry a continuous 2A  
without nuisance trips occurring, Equation 11  
40.8mV  
The MIC2582 and MIC2583 use a low-value sense  
resistor to measure the current flowing through the  
MOSFET switch (and therefore the load). This sense  
yields: RSENSE(MAX )  
=
= 20.4mΩ. The next  
2A  
resistor is nominally set at 50mV/ILOAD(CONT)  
.
To  
lowest standard value is 20m. At the other set of  
tolerance extremes for the output in question,  
60.8mV  
accommodate worst-case tolerances for both the sense  
resistor (allow ±3% over time and temperature for a  
resistor with ±1% initial tolerance) and still supply the  
maximum required steady-state load current, a slightly  
more detailed calculation must be used.  
ILOAD(CONT,MAX )  
=
= 3.04A, approximately 3A.  
20.0mΩ  
Knowing this final data, we can determine the necessary  
wattage of the sense resistor using P = I2R, where I will  
be ILOAD(CONT, MAX), and R will be (0.97)(RSENSE(NOM)).  
These numbers yield the following: PMAX = (3A)2  
(19.4m) = 0.175W.  
The current limit threshold voltage (i.e., the “trip point”)  
for the MIC2582/83 may be as low as 42mV, which  
would equate to  
a
sense resistor value of  
42mV/ILOAD(CONT). Carrying the numbers through for the  
case where the value of the sense resistor is 3% high  
yields:  
In this example, a ¼W sense resistor is sufficient.  
Figure 8. 5V Switch/3.3V LDO Application  
M9999-043009-C  
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Micrel, Inc.  
MIC2582/MIC2583  
MOSFET (again, assuming 12V operation).  
MOSFET Selection  
Selecting the proper external MOSFET for use with the  
MIC2582/83 involves three straightforward tasks:  
At the same time, if the output of the external MOSFET  
(its source) is suddenly subjected to a short, the gate-  
source voltage will go to (19.5V – 0V) = 19.5V. This  
means that the external MOSFET must be chosen to  
have a gate-source breakdown voltage of 20V or more,  
which is an available standard maximum value.  
However, if operation is at or above 13V, the 20V gate-  
source maximum will likely be exceeded. As a result, an  
external Zener diode clamp should be used to prevent  
breakdown of the external MOSFET when operating at  
voltages above 8V. A Zener diode with 10V rating is  
recommended as shown in Figure 9. At the present time,  
most power MOSFETs with a 20V gate-source voltage  
rating have a 30V drain-source breakdown rating or  
higher.  
Choice of a MOSFET which meets minimum voltage  
requirements.  
Selection of a device to handle the maximum  
continuous current (steady-state thermal issues).  
Verify the selected part’s ability to withstand any peak  
currents (transient thermal issues).  
MOSFET Voltage Requirements  
The first voltage requirement for the MOSFET is easily  
stated: the drain-source breakdown voltage of the  
MOSFET must be greater than VIN(MAX). For instance, a  
12V input may reasonably be expected to see high-  
frequency transients as high as 18V. Therefore, the  
drain-source breakdown voltage of the MOSFET must  
be at least 19V. For ample safety margin and standard  
availability, the closest value will be 20V.  
As a general tip, choose surface-mount devices with a  
drain-source rating of 30V as a starting point.  
Finally, the external gate drive of the MIC2582/83  
requires a low-voltage logic level MOSFET when  
operating at voltages lower than 3V. There are 2.5V  
logic level MOSFETs available. Please see Table 4  
MOSFET and Sense Resistor Vendors” for  
suggested manufacturers.  
The second breakdown voltage criterion that must be  
met is a bit subtler than simple drain-source breakdown  
voltage, but is not hard to meet. In MIC2582/83  
applications, the gate of the external MOSFET is driven  
up to approximately 19.5V by the internal output  
Figure 9. Zener Clamped MOSFET Gate  
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Micrel, Inc.  
MIC2582/MIC2583  
MOSFET Steady-State Thermal Issues  
processor’s cooling fan.  
The selection of a MOSFET to meet the maximum  
continuous current is a fairly straightforward exercise.  
First, arm yourself with the following data:  
3. The best test of a surface-mount MOSFET for  
an application (assuming the above tips show  
it to be a likely fit) is an empirical one. Check  
the MOSFETs temperature in the actual layout  
of the expected final circuit, at full operating  
current. The use of a thermocouple on the  
drain leads, or infrared pyrometer on the  
package, will then give a reasonable idea of  
the device’s junction temperature.  
• The value of ILOAD(CONT, MAX.) for the output in  
question (see Sense Resistor Selection).  
• The manufacturer’s data sheet for the  
candidate MOSFET.  
• The maximum ambient temperature in which  
the device will be required to operate.  
MOSFET Transient Thermal Issues  
• Any knowledge you can get about the heat  
sinking available to the device (e.g., can heat  
be dissipated into the ground plane or power  
plane, if using a surface-mount part? Is any  
airflow available?).  
Having chosen a MOSFET that will withstand the  
imposed voltage stresses, and the worse case  
continuous I2R power dissipation which it will see, it  
remains only to verify the MOSFETs ability to handle  
short-term  
overload  
power  
dissipation  
without  
The data sheet will almost always give a value of on  
resistance given for the MOSFET at a gate-source  
voltage of 4.5V, and another value at a gate-source  
voltage of 10V. As a first approximation, add the two  
values together and divide by two to get the on-  
resistance of the part with 8V of enhancement.  
overheating. A MOSFET can handle a much higher  
pulsed power without damage than its continuous  
dissipation ratings would imply. The reason for this is  
that, like everything else, thermal devices (silicon die,  
lead frames, etc.) have thermal inertia.  
In terms related directly to the specification and use of  
power MOSFETs, this is known as “transient thermal  
impedance,” or Zθ(JA). Almost all power MOSFET data  
sheets give a Transient Thermal Impedance Curve. For  
example, take the following case: VIN = 12V, tOCSLOW has  
been set to 100msec, ILOAD(CONT. MAX) is 2.5A, the slow-  
trip threshold is 50mV nominal, and the fast-trip  
threshold is 100mV. If the output is accidentally  
connected to a 3load, the output current from the  
Call this value RON. Since a heavily enhanced MOSFET  
acts as an ohmic (resistive) device, almost all that’s  
required to determine steady-state power dissipation is  
to calculate I2R.  
The one addendum to this is that MOSFETs have a  
slight increase in RON with increasing die temperature. A  
good approximation for this value is 0.5% increase in  
RON per ºC rise in junction temperature above the point  
at which RON was initially specified by the manufacturer.  
For instance, if the selected MOSFET has a calculated  
RON of 10mat a TJ = 25ºC, and the actual junction  
temperature ends up at 110ºC, a good first cut at the  
operating value for RON would be:  
MOSFET will be regulated to 2.5A for 100ms (tOCSLOW  
)
before the part trips. During that time, the dissipation in  
the MOSFET is given by:  
P = E x I; EMOSFET = [12V-(2.5A)(3)] = 4.5V  
PMOSFET = (4.5V x 2.5A) = 11.25W for 100msec.  
RON 10mΩ  
[
1+  
(
110 25)(0.005  
)
]
14.3mΩ  
(13)  
At first glance, it would appear that a really hefty  
MOSFET is required to withstand this sort of fault  
condition. This is where the transient thermal impedance  
curves become very useful. Figure 10 shows the curve  
for the Vishay (Siliconix) Si4410DY, a commonly used  
SOIC-8 power MOSFET.  
The final step is to make sure that the heat sinking  
available to the MOSFET is capable of dissipating at  
least as much power (rated in ºC/W) as that with which  
the MOSFETs performance was specified by the  
manufacturer. Here are a few practical tips:  
Taking the simplest case first, we’ll assume that once a  
fault event such as the one in question occurs, it will be  
a long time– 10 minutes or more– before the fault is  
isolated and the channel is reset. In such a case, we can  
approximate this as a “single pulse” event, that is to say,  
there’s no significant duty cycle. Then, reading up from  
the X-axis at the point where “Square Wave Pulse  
Duration” is equal to 0.1sec (=100msec), we see that the  
Zθ(JA) of this MOSFET to a highly infrequent event of this  
1. The heat from a surface-mount device such as  
an SOIC-8 MOSFET flows almost entirely out  
of the drain leads. If the drain leads can be  
soldered down to one square inch or more, the  
copper will act as the heat sink for the part.  
This copper must be on the same layer of the  
board as the MOSFET drain.  
2. Airflow works. Even a few LFM (linear feet per  
minute) of air will cool a MOSFET down  
substantially.  
duration is only 8% of its continuous Rθ(JA)  
.
This particular part is specified as having an Rθ(JA) of  
50°C/W for intervals of 10 seconds or less.  
If you can, position the MOSFET(s) near the  
inlet of a power supply’s fan, or the outlet of a  
M9999-043009-C  
April 2009  
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Micrel, Inc.  
Thus:  
MIC2582/MIC2583  
x (2.5A)2 x (50ºC/W)  
TJ (55ºC + (0.122W)(50ºC/W)  
61.1ºC  
Assume TA = 55°C maximum, 1 square inch of copper at  
the drain leads, no airflow.  
Recalling from our previous approximation hint, the part  
has an RON of (0.0335/2) = 17mat 25°C.  
Assume it has been carrying just about 2.5A for some  
time.  
Iterate the calculation once to see if this value is within a  
few percent of the expected final value. For this iteration  
we will start with TJ equal to the already calculated value  
of 61.1°C:  
When performing this calculation, be sure to use the  
highest anticipated ambient temperature (TA(MAX)) in  
which the MOSFET will be operating as the starting  
temperature, and find the operating junction temperature  
increase (TJ) from that point. Then, as shown next, the  
final junction temperature is found by adding TA(MAX) and  
TJ. Since this is not a closed-form equation, getting a  
close approximation may take one or two iterations, and  
the calculation tends to converge quickly.  
TJ TA + [17m+ (61.1ºC-25ºC)(0.005)(17m)]  
x (2.5A)2 x (50ºC/W)  
TJ (55ºC + (0.125W)(50ºC/W) 61.27ºC  
So our original approximation of 61.1ºC was very close  
to the correct value. We will use TJ = 61ºC.  
Finally, add the temperature increase due to the  
maximum power dissipation calculated from a “single  
event”, (11.25W)(50ºC/W)(0.08) = 45ºC to the steady-  
Then the starting (steady-state) TJ is:  
TJ TA(MAX) + TJ  
state TJ to get TJ(TRANSIENT  
= 106ºC. This is an  
MAX.)  
acceptable maximum junction temperature for this part.  
TA(MAX) + [RON + TA(MAX) – TA)(0.005/ºC)(RON)]  
x I2 x Rθ(JA)  
TJ 55ºC + [17m+ (55ºC-25ºC)(0.005)(17m)]  
Figure 10. Transient Thermal Impedance  
M9999-043009-C  
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Micrel, Inc.  
MIC2582/MIC2583  
PCB Layout Considerations  
widths (W) need to be wide enough to allow the current  
to flow while the rise in temperature for a given copper  
plate (e.g., 1oz. or 2oz.) is kept to a maximum of  
10ºC~25ºC. Also, these traces should be as short as  
possible in order to minimize the IR drops between the  
input and the load.  
Because of the low values of the sense resistors used  
with the MIC2582/83 controllers, special attention to the  
layout must be used in order for the device’s circuit  
breaker function to operate properly. Specifically, the  
use of a 4-wire Kelvin connection to accurately measure  
the voltage across RSENSE is highly recommended. Kelvin  
sensing is simply a means of making sure that any  
voltage drops in the power traces connecting to the  
resistors does not get picked up by the traces  
themselves. Additionally, these Kelvin connections  
should be isolated from all other signal traces to avoid  
introducing noise onto these sensitive nodes. Figure 11  
illustrates a recommended, single layer layout for the  
Finally, the use of plated-through vias will be needed to  
make circuit connections to power and ground planes  
when utilizing multi-layer PC boards.  
MOSFET and Sense Resistor Vendors  
Device types and manufacturer contact information for  
power MOSFETs and sense resistors are provided in  
Table 4. Some of the recommended MOSFETs include a  
metal heat sink on the bottom side of the package. The  
recommended trace for the MOSFET Gate of Figure 11  
must be redirected when using MOSFETs packaged in  
this style. Contact the device manufacturer for package  
information.  
R
SENSE, Power MOSFET, timer(s), and feedback network  
connections. The feedback network resistor values are  
selected for 12V application. Many hot swap  
a
applications will require load currents of several  
amperes. Therefore, the power (VCC and Return) trace  
.
Figure 11. Recommended PCB Layout for Sense Resistor,  
Power MOSFET, and Feedback Network  
M9999-043009-C  
April 2009  
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Micrel, Inc.  
MIC2582/MIC2583  
MOSFET Vendor  
Key MOSFET Type(s)  
Applications(1)  
OUT 10A  
IOUT = 10-15A, VCC < 3V (203) 452-5664  
OUT 5A, VCC 5V  
IOUT 15A  
OUT 10A  
IOUT = 10-15A  
OUT 5A, VCC 3V  
Contact Information  
www.siliconix.com  
Vishay (Siliconix)  
Si4420DY (SOIC-8) package  
Si4442DY (SOIC-8) package  
Si4876DY (SOIC-8) package  
Si7892DY (PowerPAK™ SOIC-8)  
I
I
International Rectifier  
IRF7413 (SOIC-8 package)  
IRF7457 (SOIC-8 package)  
IRF7601 (SOIC-8 package)  
I
www.irf.com  
(310) 322-3331  
I
Fairchild Semiconductor  
FDS6680A (SOIC-8 package)  
IOUT 10A  
www.fairchildsemi.com  
(207) 775-8100  
Philips  
Hitachi  
PH3230 (SOT669-LFPAK)  
HAT2099H (LFPAK)  
IOUT 20A  
IOUT 20A  
www.philips.com  
www.halsp.hitachi.com  
(408) 433-1990  
Note:  
1. These devices are not limited to these conditions in many cases, but these conditions are provided as a helpful reference for customer applications.  
Resistor Vendors  
Sense Resistors  
Contact Information  
Vishay (Dale)  
“WSL” Series  
www.vishay.com/docswsl_30100.pdf  
(203) 452-5664  
IRC  
“OARS” Series  
”LR” Series  
(second source to “WSL”)  
www.irctt.com/pdf_files/OARS.pdf  
www.irctt.com/pdf_files/LRC.pdf  
(828) 264-8861  
Table 4. MOSFET and Sense Resistor Vendors  
M9999-043009-C  
April 2009  
23  
Micrel, Inc.  
MIC2582/MIC2583  
Package Information  
8-Pin SOIC (M)  
M9999-043009-C  
April 2009  
24  
Micrel, Inc.  
MIC2582/MIC2583  
16-Pin QSOP (QS)  
MICREL, INC. 2180 FORTUNE DRIVE SAN JOSE, CA 95131 USA  
TEL +1 (408) 944-0800 FAX +1 (408) 474-1000 WEB http://www.micrel.com  
The information furnished by Micrel in this data sheet is believed to be accurate and reliable. However, no responsibility is assumed by Micrel for its  
use. Micrel reserves the right to change circuitry and specifications at any time without notification to the customer.  
Micrel Products are not designed or authorized for use as components in life support appliances, devices or systems where malfunction of a product  
can reasonably be expected to result in personal injury. Life support devices or systems are devices or systems that (a) are intended for surgical implant  
into the body or (b) support or sustain life, and whose failure to perform can be reasonably expected to result in a significant injury to the user. A  
Purchaser’s use or sale of Micrel Products for use in life support appliances, devices or systems is a Purchaser’s own risk and Purchaser agrees to fully  
indemnify Micrel for any damages resulting from such use or sale.  
© 2006 Micrel, Incorporated.  
M9999-043009-C  
April 2009  
25  

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