MIC2810-44MYML-TR [MICROCHIP]
2-CHANNEL POWER SUPPLY SUPPORT CKT, QCC16;
| 型号： | MIC2810-44MYML-TR |
| 厂家： | 
MICROCHIP |
| 描述： | 2-CHANNEL POWER SUPPLY SUPPORT CKT, QCC16 |
| 文件： | 总26页 (文件大小：1022K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
MIC2810
Digital Power Management IC 2 MHz, 600 mA DC/DC with Dual
300 mA/300 mA Low V LDOs
IN
Features
General Description
• 2.7V to 5.5V Input Voltage Range
• 2 MHz DC/DC Converter and Two LDOs
• Integrated Power-on Reset (POR)
• Adjustable POR Delay Time
• LOWQ Mode
The MIC2810 is
a
high performance power
management IC, featuring three output voltages with
independent enable control: a 2 MHz DC/DC converter
and two 300 mA LDOs. The MIC2810 features a
LOWQ mode, reducing the total current draw while in
this mode to less than 30 µA. In LOWQ mode, the
- 30 µA Total IQ When in LOWQ Mode
• DC/DC Converter
output noise of the DC/DC converter is 53 µVRMS
,
significantly lower than other converters that use a
PFM light load mode that can interfere with sensitive
RF circuitry.
- Up to 600 mA of Output Current in PWM
Mode
The DC/DC converter uses small values of L and C to
reduce board space but still retains high efficiency over
a wide load range, while supporting load currents up to
600 mA.
- LOWQ Mode: No Ripple Light Load Mode
- 53 µVRMS Output Noise in LOWQ Mode
- 2 MHz PWM Mode Operation
- >90% Efficiency
The LDOs operate with very small ceramic output
capacitors for stability, therefore, reducing required
board space and component cost. It is available in
various output voltage options in the 16-pin 3 mm x
3 mm QFN leadless package.
• LDO1
- 1.65V to 5.5V Input Voltage Range
- 300 mA Output Current
- Output Voltage Down to 0.8V
• LDO2
Package Type
- 2.7V to 5.5V Input Voltage Range
- 300 mA Output Current
MIC2810
16-PIN 3 mm X 3 mm QFN
- Output Voltage Down to 0.8V
• Thermal Shutdown Protection
• Current-Limit Protection
• Simple, Leakage-Free Interfacing to Host MPU in
Applications with Backup Power
• Tiny 16-Pin 3 mm x 3 mm QFN Package
Pin 1 LOWQ
Pin 2 BIAS
Pin 3 SGND
POR
LDO1
VIN1
LDO
Pin 12
Pin 11
Pin 10
Pin 9
Applications
• Embedded MPU and MCU Power
• Portable and Wearable Applications
• Low-Power RF Systems
• Backup Power Systems
Pin 4 PGND
2017 Microchip Technology Inc.
DS20005910A-page 1
MIC2810
Typical Application Circuit (simplified)
Functional Diagram
VIN
SW
BIAS
EN
LDO
DC/DC
/LOWQ
VIN1
LDO1
LDO2
LDO1
LDO2
EN1
VIN2
EN2
POR
LOGIC
REFERENCE AND
QUICK START
POR
PGND
SGND
CSET
DS20005910A-page 2
2017 Microchip Technology Inc.
MIC2810
1.0
ELECTRICAL CHARACTERISTICS
Absolute Maximum Ratings †
Supply Voltage (VIN, VIN1, VIN2)..................................................................................................................... 0V to +6.0V
Enable Input Voltage (VEN, VEN1, VEN2)..............................................................................................................0V to VIN
Power Dissipation (Note 1) ....................................................................................................................Internally Limited
ESD Rating (Note 2) ..................................................................................................................................................2 kV
Operating Ratings ‡
Supply Voltage (VIN, VIN2)......................................................................................................................... +2.7V to +5.5V
Supply Voltage (VIN1)..............................................................................................................................+1.65V to +5.5V
Enable Input Voltage (VEN, VEN1, VEN2)........................................................................................................... 0V to +VIN
† Notice: Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to the device.
This is a stress rating only and functional operation of the device at those or any other conditions above those indicated
in the operational sections of this specification is not intended. Exposure to maximum rating conditions for extended
periods may affect device reliability.
‡ Notice: The device is not guaranteed to function outside its operating ratings.
1: The maximum allowable power dissipation of any TA (ambient temperature) is PD(max) = (TJ(max) – TA) / θJA
.
Exceeding the maximum allowable power dissipation will result in excessive die temperature, and the
regulator will go into thermal shutdown.
2: Devices are ESD sensitive. Handling precautions recommended. Human body model, 1.5 kΩ in series with
100 pF.
2017 Microchip Technology Inc.
DS20005910A-page 3
MIC2810
TABLE 1-1:
ELECTRICAL CHARACTERISTICS (Note 1)
Electrical Characteristics: VIN = EN1 = EN2 = LOWQ = VOUT (Note 2) + 1V; COUTDC/DC = 2.2 µF, CLDO1 = CLDO2
=
2.2 µF; IOUTDC/DC = 100 mA; IOUTLDO1 = IOUTLDO2 = 100 µA; TJ = 25°C, bold values indicate –40°C ≤ TJ ≤ +125°C;
unless noted.
Parameter
Symbol
Min.
Typ.
Max.
Units
Conditions
UVLO Threshold
UVLO Hysteresis
UVLOTH
2.45
—
2.55
100
800
55
2.65
—
V
Rising input voltage during turn-on
—
UVLOHYS
mV
—
1100
85
VFB = GND (not switching)
Ground Pin Current
IGND
—
µA
µA
LDO1 or LDO2 (EN = GND; EN1 or
EN2 = GND)
—
—
95
Ground Pin Current in
Shutdown
IGND_SHDN
—
0.2
5
EN = EN1 = EN2 = 0V
—
—
30
—
60
All channels on, IDC/DC = ILDO1
ILDO2 = 0 mA (LOWQ = GND)
=
80
Ground Pin Current
(LOWQ mode)
IGND_LOWQ
µA
LDO1 or LDO2 (EN = GND; EN1 or
EN2 = GND);
—
20
70
IOUT = 0 mA (LOWQ = GND)
Overtemperature
Shutdown
TSD
—
—
160
23
—
—
°C
°C
—
—
Overtemperature
Shutdown Hysteresis
TSDHYS
Enable Inputs (EN; EN1; EN2; LOWQ)
VIH
—
1.0
—
—
—
0.2
—
1
V
V
Logic Low
Logic High
VIL ≤ 0.2V
Enable Input Voltage
VIL
0.1
0.1
µA
µA
Enable Input Current
IENLK
—
1
VIH ≥ 1.0V
Turn-on Time
Turn-on Time
(LDO1 and LDO2)
tTURN-ON
tTURN-ON
—
—
240
83
500
350
µs
µs
—
(LOWQ = VIN; ILOAD = 300 mA);
(LOWQ = GND; ILOAD = 10 mA)
Turn-on Time (DC/DC)
POR Output
Low Threshold, % of nominal
(VDC/DC or VLDO1 or VLDO2) (Flag
ON)
POR Threshold Voltage,
Falling
VTHLOW_POR
90
—
91
96
—
%
%
High Threshold, % of nominal
POR Threshold Voltage,
Rising
VTHIGH_POR
99
(VDC/DC and VLDO1 and VLDO2
(Flag OFF)
)
POR Output Logic Low Voltage; IL =
250 µA
VOL
VOLPOR
—
—
10
100
1
mV
µA
IPOR
ILEAKPOR
0.01
Flag Leakage Current, Flag OFF
SET INPUT
SET Pin Current Source
ISET
0.75
—
1.25
1.25
1.75
—
µA
V
VSET = 0V
SET Pin Threshold
Voltage
VTHSET
POR = High
Note 1: Specification for packaged product only.
2: VOUT denotes the highest of the three output voltages of DC/DC, LDO1 and LDO2.
DS20005910A-page 4
2017 Microchip Technology Inc.
MIC2810
TABLE 1-2:
ELECTRICAL CHARACTERISTICS - DC/DC CONVERTER
Electrical Characteristics: VIN = VOUTDC/DC + 1V; EN1 = VIN; EN2 = GND; IOUTDC/DC = 100 mA; L = 2.2 µH;
COUTDC/DC = 2.2 µF; TJ = 25°C, bold values indicate –40°C to + 125°C; unless noted.
Parameter
Symbol
Min.
Typ.
Max.
Units
Conditions
LOWQ = High (Full Power Mode)
–2
—
—
2
Output Voltage Accuracy
VOUT
%
Nominal VOUT tolerance
–3
3
VOUT > 2.4V; VIN = VOUT + 300 mV
to 5.5V, ILOAD= 100 mA
VOUT < 2.4V; VIN = 2.7V to 5.5V,
ILOAD= 100 mA
Output Voltage Line
Regulation
(∆VOUT/VOUT
)
—
0.2
—
%/V
/∆VIN
Output Voltage Load
Regulation
∆VOUT/VOUT
—
100
—
0.1
—
—
—
—
%
%
Ω
20 mA < ILOAD < 600 mA
Maximum Duty Cycle
DCMAX
VFB ≤ 0.4V
ISW = 150 mA, VFB = 0.7VFB_NOM
PMOS
0.5
PWM Switch
ON-Resistance
—
ISW = –150 mA, VFB = 1.1VFB_NOM
NMOS
—
1.8
0.6
2
—
Ω
MHz
A
Oscillator Frequency
fosc
—
2.2
1.6
—
Current Limit in PWM
Mode
0.75
1
VFB = 0.9 * VNOM
LOWQ = Low (Light Load Mode)
–2
—
—
2
Variation from nominal VOUT
Output Voltage Accuracy
VOUT
%
Variation from nominal VOUT
–40°C to +125°C
;
–3
3
—
—
—
—
80
—
0.02
—
0.3
0.6
1.5
—
V
IN = VOUT + 1V to 5.5V;
(∆VOUT/VOUT
)
Line Regulation
%/V
/∆VIN
IOUT = 100 µA
Load Regulation
Ripple Rejection
Current Limit
∆VOUT/VOUT
PSRR
0.4
45
%
dB
mA
IOUT = 100 µA to 50 mA
f = up to 1 kHz
ILIM_LOWQ
VN
120
53
190
—
VOUT = 0V
Output Voltage Noise
µVRMS 10 Hz to 100 kHz
2017 Microchip Technology Inc.
DS20005910A-page 5
MIC2810
TABLE 1-3:
ELECTRICAL CHARACTERISTICS - LDO1/LDO2
Electrical Characteristics: VIN1 = VIN2 = VOUTLDO1 + 1.0V or VIN1 = VIN2 = VOUTLDO2 + 1.0V; EN = GND; EN1 =
EN2 = VIN1 = VIN2; CLDO1 = CLDO2 = 2.2 µF; IOUTLDO1 = 100 µA; TJ = 25°C, bold values indicate
–40°C ≤ TJ ≤ +125°C; unless noted.
Parameter
Symbol
Min.
Typ.
Max.
Units
Conditions
LOWQ = High (Full Power Mode)
–2
—
—
2
Variation from nominal VOUT
Output Voltage Accuracy
Line Regulation
VOUT
%
Variation from nominal VOUT
–40°C to +125°C
;
–3
3
—
—
—
—
—
—
—
—
—
400
—
0.02
—
0.3
0.6
—
—
%/V
V
IN = VOUT +1V to 5.5V
0.20
0.25
0.40
70
IOUT = 100 µA to 150 mA
Load Regulation
Dropout Voltage
∆VOUT/VOUT
—
%
I
I
OUT = 100 µA to 200 mA
OUT = 100 µA to 300 mA
1.5
—
IOUT = 150 mA
IOUT = 200 mA
VDO
94
—
mV
142
35
300
—
IOUT = 300 mA
f = up to 1 kHz
VOUT = 0V
Ripple Rejection
Current Limit
PSRR
ILIM
dB
600
91
850
—
mA
Output Voltage Noise
VN
µVRMS 10 Hz to 100 kHz
LOWQ = Low (Light Load Mode)
–3
—
—
3
Variation from nominal VOUT
Output Voltage Accuracy
VOUT
%
Variation from nominal VOUT
–40°C to +125°C
;
–4
4
—
—
—
—
—
50
—
0.02
—
0.3
0.6
1.0
35
Line Regulation
Load Regulation
Dropout Voltage
—
∆VOUT/VOUT
VDO
%/V
%
VIN = VOUT +1V to 5.5V
0.2
22
IOUT = 100 µA to 10 mA
IOUT = 10 mA
mV
—
50
Current Limit
ILIM
85
125
—
mA
dB
VIN = 2.7V; VOUT = 0V
f = up to 1 kHz
Ripple Rejection
PSRR
35
DS20005910A-page 6
2017 Microchip Technology Inc.
MIC2810
TABLE 1-4:
TEMPERATURE SPECIFICATIONS (Note 1)
Parameters
Sym.
Min.
Typ.
Max.
Units
Conditions
Temperature Ranges
Storage Temperature Range
Lead Temperature
TS
—
TJ
–65
—
—
—
—
+150
+260
+125
°C
°C
°C
—
Soldering, 10 sec.
—
Junction Temperature
Package Thermal Resistance
16-Ld QFN
–40
θJA
—
56
—
°C/W
—
Note 1: The maximum allowable power dissipation is a function of ambient temperature, the maximum allowable
junction temperature and the thermal resistance from junction to air (i.e., TA, TJ, JA). Exceeding the
maximum allowable power dissipation will cause the device operating junction temperature to exceed the
maximum +125°C rating. Sustained junction temperatures above +125°C can impact the device reliability.
2017 Microchip Technology Inc.
DS20005910A-page 7
MIC2810
2.0
TYPICAL PERFORMANCE CURVES
Note: The graphs and tables provided following this note are a statistical summary based on a limited number of
samples and are provided for informational purposes only. The performance characteristics listed herein
are not tested or guaranteed. In some graphs or tables, the data presented may be outside the specified
operating range (e.g., outside specified power supply range) and therefore outside the warranted range.
For this page only, DC/DC Normal Mode (LOWQ = VIN)
FIGURE 2-1:
1.2V
Efficiency.
FIGURE 2-4:
Load Regulation.
OUT
FIGURE 2-2:
Switching Frequency vs.
FIGURE 2-5:
Line Regulation.
Input Voltage.
FIGURE 2-6:
Current Limit vs. Input
FIGURE 2-3:
Switching Frequency vs.
Voltage.
Temperature.
DS20005910A-page 8
2017 Microchip Technology Inc.
MIC2810
For this page only, DC/DC LOWQ Mode (LOWQ = GND)
FIGURE 2-7:
Power Supply Rejection
FIGURE 2-10:
Current Limit vs. Input
Ratio.
Voltage.
FIGURE 2-8:
Load Regulation.
FIGURE 2-11:
Output Noise Spectral
Density.
FIGURE 2-9:
Line Regulation.
2017 Microchip Technology Inc.
DS20005910A-page 9
MIC2810
FIGURE 2-15:
Ratio LDO2 (LOWQ Mode).
Power Supply Rejection
FIGURE 2-12:
Ratio LDO1 (LOWQ Mode).
Power Supply Rejection
FIGURE 2-16:
Ratio LDO2 (Normal Mode).
Power Supply Rejection
FIGURE 2-13:
Ratio LDO1 (Normal Mode).
Power Supply Rejection
FIGURE 2-17:
LDO2 Load Regulation.
FIGURE 2-14:
LDO1 Line Regulation.
DS20005910A-page 10
2017 Microchip Technology Inc.
MIC2810
FIGURE 2-18:
Output Current.
LDO2 Ground Current vs.
LDO2 Ground Current vs.
LDO2 Dropout Voltage vs.
FIGURE 2-21:
Temperature.
LDO2 Dropout Voltage vs.
FIGURE 2-19:
Temperature.
FIGURE 2-22:
Density.
LDO2 Output Noise Spectral
FIGURE 2-20:
FIGURE 2-23:
LDO2 (LOWQ Mode) Load
Output Current.
Transient.
2017 Microchip Technology Inc.
DS20005910A-page 11
MIC2810
FIGURE 2-24:
Transient.
LDO2 (Normal Mode) Load
DC/DC (LOWQ Mode) Load
DC/DC (LOWQ Mode)
FIGURE 2-27:
DC/DC PWM Waveforms.
FIGURE 2-28:
DC/DC Load Transient.
FIGURE 2-25:
Transient.
FIGURE 2-29:
DC/DC Start-Up
FIGURE 2-26:
Waveforms.
Start-Up Waveform.
DS20005910A-page 12
2017 Microchip Technology Inc.
MIC2810
FIGURE 2-30:
POR Behavior; EN1 = EN2
FIGURE 2-33:
C
Pin Voltage for Correct
SET
= High, Low-to-High Transition on EN.
Sequencing.
FIGURE 2-31:
POR Behavior; EN = EN2 =
FIGURE 2-34:
POR Behavior for Correct
High, Low-to-High Transition on EN1.
Sequencing.
FIGURE 2-32:
POR Behavior; EN = EN1 =
High, Low-to-High Transition on EN2.
2017 Microchip Technology Inc.
DS20005910A-page 13
MIC2810
3.0
PIN DESCRIPTIONS
The descriptions of the pins are listed in Table 3-1.
TABLE 3-1:
PIN FUNCTION TABLE
Pin Number Pin Name
Description
LOWQ Mode. Active Low Input. Logic High = Full Power Mode; Logic Low = LOWQ
Mode; Do not leave floating.
1
2
LOWQ
BIAS
Internal circuit bias supply. It must be decoupled to signal ground with a 0.1 µF
capacitor and should not be loaded.
3
4
5
SGND
PGND
SW
Signal ground.
Power ground.
Switch (Output): Internal power MOSFET output switches.
Supply Input – DC/DC and other circuitry shared with LDO1 and LDO2. Must be
connected to Pin 7.
6
VIN
7
8
VIN2
LDO2
LDO
Supply Input – LDO2. Must be connected to Pin 6.
Output of LDO regulator 2.
9
LDO Output: Connect to VOUT of the DC/DC for LOWQ mode operation.
Supply Input – LDO1.
10
11
VIN1
LDO1
Output of LDO regulator 1.
Power-on Reset Output: Open-drain output. Active low indicates an output
undervoltage condition on either one of the three regulated outputs.
12
13
14
15
16
POR
CSET
EN1
EN
Delay Set Input: Connect external capacitor to GND to set the internal delay for the
POR output. When left open, there is a minimum delay. This pin cannot be grounded.
Enable Input (LDO1). Active High Input. Logic high = On; Logic low = Off; do not leave
floating.
Enable Input (DC/DC). Active High Input. Logic High = On; Logic Low = Off; Do not
leave floating.
Enable Input (LDO2). Active High Input. Logic high = On; Logic low = Off; do not leave
floating.
EN2
3.1
LOWQ
3.2
BIAS
The LOWQ pin provides a logic level control between
the internal PWM switching regulator mode, and the
low noise linear regulator mode. With LOWQ pulled low
(≤ 0.2V), quiescent current of the device is greatly
reduced by switching to a low noise linear regulator
mode that has a typical supply current of 38 µA. In
linear (LDO) mode, the output can deliver 60 mA of
current to the output. By placing LOWQ high (≥ 1V), the
device transitions into a constant frequency PWM
step-down regulator mode. This allows the device the
ability to efficiently deliver up to 600 mA of output
current at the same output voltage.
The BIAS pin supplies the power to the internal control
and reference circuitry. The bias is powered from VIN
through an internal 6ꢀ resistor. A small 0.1 µF
capacitor is required for bypassing.
3.3
SGND
Signal ground (SGND) is the ground path for the
biasing and control circuitry. The current loop for the
signal ground should be as small as possible.
3.4
PGND
LOWQ mode also limits the output load of both LDO1
and LDO2 to less than 50 mA.
Power ground (PGND) is the ground path for the high
current PWM mode. The current loop for the power
ground should be as small as possible.
DS20005910A-page 14
2017 Microchip Technology Inc.
MIC2810
If any of the outputs are subsequently pulled out of
regulation (e.g., due to a momentary overload), the
POR signal goes low and it remains low as long as the
affected output is out of regulation. If the affected
output returns within regulation, POR is asserted high
after the delay time programmed with the capacitor at
the CSET pin.
3.5
SW
The switch (SW) pin connects directly to the inductor
and provides the switching current necessary to
operate in PWM mode. Due to the high speed
switching on this pin, the switch node should be routed
away from sensitive nodes.
The ESD protection of the POR pin is free from
clamping diodes to the input supply rails. Therefore, the
POR signal can be asserted to host I/Os under backup
power domains or pulled up to backup power sources
without the risk of parasitic leakage, even if the main
power to the MIC2810 is removed.
3.6
VIN/VIN1/VIN2
Three input voltage pins provide power to the switch
mode regulator, LDO1, and LDO2. VIN provides power
to the control circuitry of the DC/DC converter and
voltage reference circuitry shared by all the regulators
in the MIC2810. LDO1’s input voltage (VIN1) can go
down to 1.65V, but LDO2 and the DC/DC converter
input voltages are limited to 2.7V minimum.
3.11 CSET
The CSET pin is a current source output that charges
a capacitor that sets the delay time for the power-on
reset output from low to high. The delay for POR high
to low (detecting an undervoltage on any of the outputs)
is always minimal. The current source of 1.25µA
charges a capacitor up from 0V. When the capacitor
reaches 1.25V, the output of the POR is allowed to go
high. The delay time in microseconds is equal to the
CSET in picofarads.
For the switch mode regulator, VIN provides power to
the MOSFET along with current limiting sense circuitry.
Due to the high switching speeds, a 4.7 µF capacitor is
recommended close to VIN and the power ground
(PGND) pin for bypassing. Please refer to the PCB
layout section for an example of an appropriate circuit
layout.
3.7
LDO2
EQUATION 3-1:
Regulated output voltage of LDO2. Power is provided
by VIN2 The minimum recommended output
capacitance is 2.2 µF.
.
PORDelays = C
pF
SET
3.8
LDO
3.12 EN/EN1/EN2
The LDO pin is the output of the linear regulator and
should be connected to the output of the step-down
PWM regulator. In LOWQ mode (LOWQ < 0.2V), the
LDO provides the output voltage of the DC/DC
regulator.
All enable inputs are active high, requiring 1.0V for
guaranteed operation. EN provides logic control for the
DC/DC regulator. EN2 provides logic control for LDO2,
and EN1 provides logic control for LDO1. The enable
inputs are CMOS logic and cannot be left floating.
3.9
LDO1
The enable pins provide logic level control of the
specified outputs. When all enable pins are in the off
state, supply current of the device is greatly reduced
(typically <1 µA). When the DC/DC regulator is in the
off state, the output drive is placed in a "tri-stated"
condition, where both the high side P-channel
MOSFET and the low-side N-channel are in an “off” or
non-conducting state. Do not drive any of the enable
pins above the supply voltage.
Regulated output voltage of LDO1. Input power is
provided by VIN1. The minimum recommended output
capacitance is 2.2 µF.
3.10 Power-on Reset (POR)
The power-on reset output is an open-drain N-Channel
device, requiring a pull-up resistor to either the input
voltage or output voltage for proper voltage levels. The
POR output has a delay time that is programmable with
a capacitor from the CSET pin to ground. The delay
time can be programmed to be as long as 1 second. In
steady-state conditions, the POR output is high if at
least one channel (DC/DC, LDO1, and LDO2) is
enabled and has reached regulation. This is equivalent
to performing a logic OR operation on the status of the
output voltages.
2017 Microchip Technology Inc.
DS20005910A-page 15
MIC2810
recommended due to their lower ESR and ESL. Please
refer to the PCB layout section for an example of an
appropriate circuit layout.
4.0
APPLICATION INFORMATION
The MIC2810 is a power management IC with a single
integrated step-down regulator and two low dropout
regulators. LDO1 and LDO2 are 300 mA low dropout
regulators supplied from the input voltage pins. The
step-down regulator is a 600 mA PWM power supply.
All three regulators utilize a LOWQ light load mode to
maximize battery efficiency under light load conditions.
This is achieved with a LOWQ control pin that, when
pulled low, shuts down all the biasing and drive current
for the PWM regulator, along with reducing the current
limit of the two independent LDOs. When the LOWQ
pin is pulled low, the MIC2810 draws only 30 µA of
operating current. This mode allows the output to be
regulated through the LDO output, which is capable of
providing 60 mA of output current. This method has the
advantage of producing a clean, low current, ultra-low
noise output in LOWQ mode. During LOWQ mode, the
SW node becomes high impedance, blocking current
flow. Other methods of reducing quiescent current,
such as pulse frequency modulation (PFM) or bursting
techniques create large amplitude and low frequency
ripple voltages that can be detrimental to system
operation.
4.3
Inductor Selection
The MIC2810 is designed for use with a 2.2 µH
inductor. Proper selection should ensure the inductor
can handle the maximum average and peak currents
required by the load. Maximum current ratings of the
inductor are generally given in two methods;
permissible DC current and saturation current.
Permissible DC current can be rated either for a 40°C
temperature rise or a 10% to 20% loss in inductance.
Ensure that the inductor selected can handle the
maximum operating current. When saturation current is
specified, make sure that there is enough margin that
the peak current will not saturate the inductor. Peak
inductor current can be calculated as follows:
EQUATION 4-1:
V
OUT
----------------
V
1 –
OUT
V
IN
-----------------------------------------------
I
= I
+
PK
OUT
2 f L
When more than 60 mA is required, the LOWQ pin can
be forced high, causing the MIC2810 to enter PWM
mode. In this case, the LDO output makes a "hand-off"
to the PWM regulator with virtually no variation in
output voltage. The LDO output then turns off allowing
up to 600 mA of current to be efficiently supplied
through the PWM output to the load.
Where:
PK = Peak inductor current.
IOUT = Output/load current.
VIN = Input voltage.
VOUT = Output voltage.
f = Switching frequency of the PWM regulator.
L = Inductor value.
I
4.1
Output Capacitor
LDO1 and LDO2 outputs require a 2.2 µF ceramic
output capacitor for stability. The DC/DC switch mode
regulator also requires a 2.2 µF ceramic output
capacitor to be stable. All output capacitor values can
be increased to improve transient response, but
performance has been optimized for a 2.2 µF ceramic
on the LDOs and the DC/DC regulator. X7R/X5R
dielectric-type ceramic capacitors are recommended
4.4
POR Delay Time
The POR signal also goes low for the duration of the
delay time given by Equation 3-1 when only one of the
enable inputs (EN, EN1, EN2) transitions from low to
high, with the others being already high and the
corresponding output being in regulation. This is shown
in Figure 2-30, Figure 2-31, and Figure 2-32. At the
low-to-high transition of either enable input, the CSET
pin capacitor is discharged to ground, and the POR
delay time is restarted.
because
of
their
temperature
performance.
X5R/X7R-type capacitors change capacitance by 15%
over their operating temperature range and are the
most stable type of ceramic capacitors. Z5U and Y5V
dielectric capacitors change value by as much as 50%
to 60% respectively over their operating temperature
ranges.
At start-up, in order to prevent a momentary HIGH
glitch of the POR signal between subsequent enable
commands, it is recommended to set the POR delay
time longer than the maximum delay expected between
the enable command signals plus the turn-on time
4.2
Input Capacitor
tTURN-ON
.
A minimum 1 µF ceramic, 4.7 µF recommended,
should be placed as close as possible to the VIN pin for
optimal bypassing. X5R or X7R dielectrics are
recommended for the input capacitor. Y5V dielectrics
lose most of their capacitance over temperature and
are therefore, not recommended. A minimum 1 µF is
recommended close to the VIN and PGND pins for high
frequency filtering. Smaller case size capacitors are
For a given delay between the enable signals, an
example of correct POR delay time design is shown in
Figure 2-33 and Figure 2-34. In Figure 2-33, it can be
seen that the CSET voltage is reset to ground by
subsequent low-to-high enable signals transitions
before it reaches the VTHCSET voltage (1.25V typ.),
thus extending the duration of the POR LOW assertion
(Figure 2-34).
DS20005910A-page 16
2017 Microchip Technology Inc.
MIC2810
5.0
5.1
PACKAGING INFORMATION
Package Marking Information
Example
16-Pin QFN*
Part Number
Code
MIC2810-1JGMYML-TR
MIC2810-1J6JYML-TR
MIC2810-1J6SYML-TR
MIC2810-44MYML-TR
MIC2810-4GKYML-TR
MIC2810-4GMYML-TR
MIC2810-4GPYML-TR
MIC2810-4GSYML-TR
MIC2810-4LSYML-TR
MIC2810-4MSYML-TR
MIC2810-CGJYML-TR
MIC2810-FGSYML-TR
D1JGM
D1J6J
Y
Y
XXXXX
NNN
YD4GP
D1J6S
231
YD44M
YD4GK
YD4GM
YD4GP
YD4GS
YD4LS
YD4MS
YDCGJ
YDFGS
Refer to the Product Identification System
section for information on the output voltage
for each device.
Legend: XX...X Product code or customer-specific information
Y
YY
WW
NNN
Year code (last digit of calendar year)
Year code (last 2 digits of calendar year)
Week code (week of January 1 is week ‘01’)
Alphanumeric traceability code
Pb-free JEDEC® designator for Matte Tin (Sn)
e
3
*
This package is Pb-free. The Pb-free JEDEC designator (
can be found on the outer packaging for this package.
)
e3
●, ▲, ▼ Pin one index is identified by a dot, delta up, or delta down (triangle
mark).
Note: In the event the full Microchip part number cannot be marked on one line, it will
be carried over to the next line, thus limiting the number of available
characters for customer-specific information. Package may or may not include
the corporate logo.
Underbar (_) and/or Overbar (⎯) symbol may not be to scale.
2017 Microchip Technology Inc.
DS20005910A-page 17
MIC2810
16-Lead QFN 3 mm x 3 mm Package Outline and Recommended Land Pattern
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging.
DS20005910A-page 18
2017 Microchip Technology Inc.
MIC2810
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging.
2017 Microchip Technology Inc.
DS20005910A-page 19
MIC2810
NOTES:
DS20005910A-page 20
2017 Microchip Technology Inc.
MIC2810
APPENDIX A: REVISION HISTORY
Revision A (November 2017)
• Converted Micrel document MIC2810 to Micro-
chip data sheet DS20005910A.
• Minor text changes throughout.
2017 Microchip Technology Inc.
DS20005910A-page 21
MIC2810
NOTES:
DS20005910A-page 22
2017 Microchip Technology Inc.
MIC2810
PRODUCT IDENTIFICATION SYSTEM
To order or obtain information, e.g., on pricing or delivery, contact your local Microchip representative or sales office.
Examples:
(1)
–
PART NO.
Device
–
X
X
XX
X
X
a) MIC2810-44MYML-TR:
Digital Power Management
IC 2 MHz, 600 mA DC/DC
with Dual 300 mA/300 mA
Low VIN LDOs,
Tape and Reel Option
Output Temperature Package
Voltages
1.2V/1.2V/2.8V Output Voltage,
–40°C to +125°C, 16LD QFN
Package, 5,000/Reel
Device:
MIC2810:
Digital Power Management IC 2 MHz,
600 mA DC/DC with Dual 300 mA/300 mA
Low VIN LDOs
b) MIC2810-4GMYML-TR:
c) MIC2810-4GSYML-TR:
Digital Power Management
IC 2 MHz, 600 mA DC/DC
with Dual 300 mA/300 mA
Low VIN LDOs, 1.2V/1.8V/2.8V
Output Voltage, –40°C to +125°C
16LD QFN Package, 5,000/Reel
Digital Power Management
IC 2 MHz, 600 mA DC/DC
with Dual 300 mA/300 mA
Low VIN LDOs, 1.2V/1.8V/3.3V
Output Voltage, –40°C to +125°C
16LD QFN Package, 5,000/Reel
Output Voltages: 1JGM=
(DC/DC, LDO1,
LDO2)
1.25V/1.8V/2.8V
1J6J =
1J6S=
44M =
4GK =
4GM=
4GP =
4GS =
4LS =
4MS =
CGJ =
FGS =
1.25V/1.4V/2.5V
1.25V/1.4V/3.3V
1.2V/1.2V/2.8V
1.2V/1.8V/2.6V
1.2V/1.8V/2.8V
1.2V/1.8V/3.0V
1.2V/1.8V/3.3V
1.2V/2.7V/3.3V
1.2V/2.8V/3.3V
1.2V/1.8V/2.5V
1.5V/1.8V/3.3V
d) MIC2810-4MSYML-TR:
e) MIC2810-FGSYML-TR:
Digital Power Management
IC 2 MHz, 600 mA DC/DC
with Dual 300 mA/300 mA
Low VIN LDOs, 1.2V/2.8V/3.3V
Output Voltage, –40°C to +125°C
16LD QFN Package, 5,000/Reel
Temperature:
Y
=
Pb-Free with Industrial Temperature Grade
(–40°C to +125°C)
Digital Power Management
IC 2 MHz, 600 mA DC/DC
with Dual 300 mA/300 mA
Low VIN LDOs, 1.5V/1.8V/3.3V
Output Voltage, –40°C to +125°C
16LD QFN Package, 5,000/Reel
Package:
ML
TR
=
=
16-lead, 3 mm x 3 mm QFN, 0.85 mm thickness
5,000/Reel
Tape and Reel:
Note 1:
Tape and Reel identifier only appears in the
catalog part number description. This identifier is
used for ordering purposes and is not printed on
the device package. Check with your Microchip
Sales Office for package availability with the
Tape and Reel option.
2017 Microchip Technology Inc.
DS20005910A-page 23
MIC2810
NOTES:
DS20005910A-page 24
2017 Microchip Technology Inc.
Note the following details of the code protection feature on Microchip devices:
•
Microchip products meet the specification contained in their particular Microchip Data Sheet.
•
Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the
intended manner and under normal conditions.
•
There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our
knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data
Sheets. Most likely, the person doing so is engaged in theft of intellectual property.
•
•
Microchip is willing to work with the customer who is concerned about the integrity of their code.
Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not
mean that we are guaranteeing the product as “unbreakable.”
Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our
products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts
allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act.
Information contained in this publication regarding device
applications and the like is provided only for your convenience
and may be superseded by updates. It is your responsibility to
ensure that your application meets with your specifications.
MICROCHIP MAKES NO REPRESENTATIONS OR
WARRANTIES OF ANY KIND WHETHER EXPRESS OR
IMPLIED, WRITTEN OR ORAL, STATUTORY OR
OTHERWISE, RELATED TO THE INFORMATION,
INCLUDING BUT NOT LIMITED TO ITS CONDITION,
QUALITY, PERFORMANCE, MERCHANTABILITY OR
FITNESS FOR PURPOSE. Microchip disclaims all liability
arising from this information and its use. Use of Microchip
devices in life support and/or safety applications is entirely at
the buyer’s risk, and the buyer agrees to defend, indemnify and
hold harmless Microchip from any and all damages, claims,
suits, or expenses resulting from such use. No licenses are
conveyed, implicitly or otherwise, under any Microchip
intellectual property rights unless otherwise stated.
Trademarks
The Microchip name and logo, the Microchip logo, AnyRate, AVR,
AVR logo, AVR Freaks, BeaconThings, BitCloud, CryptoMemory,
CryptoRF, dsPIC, FlashFlex, flexPWR, Heldo, JukeBlox, KEELOQ,
KEELOQ logo, Kleer, LANCheck, LINK MD, maXStylus,
maXTouch, MediaLB, megaAVR, MOST, MOST logo, MPLAB,
OptoLyzer, PIC, picoPower, PICSTART, PIC32 logo, Prochip
Designer, QTouch, RightTouch, SAM-BA, SpyNIC, SST, SST
Logo, SuperFlash, tinyAVR, UNI/O, and XMEGA are registered
trademarks of Microchip Technology Incorporated in the U.S.A.
and other countries.
ClockWorks, The Embedded Control Solutions Company,
EtherSynch, Hyper Speed Control, HyperLight Load, IntelliMOS,
mTouch, Precision Edge, and Quiet-Wire are registered
trademarks of Microchip Technology Incorporated in the U.S.A.
Adjacent Key Suppression, AKS, Analog-for-the-Digital Age, Any
Capacitor, AnyIn, AnyOut, BodyCom, chipKIT, chipKIT logo,
CodeGuard, CryptoAuthentication, CryptoCompanion,
CryptoController, dsPICDEM, dsPICDEM.net, Dynamic Average
Matching, DAM, ECAN, EtherGREEN, In-Circuit Serial
Programming, ICSP, Inter-Chip Connectivity, JitterBlocker,
KleerNet, KleerNet logo, Mindi, MiWi, motorBench, MPASM, MPF,
MPLAB Certified logo, MPLIB, MPLINK, MultiTRAK, NetDetach,
Omniscient Code Generation, PICDEM, PICDEM.net, PICkit,
PICtail, PureSilicon, QMatrix, RightTouch logo, REAL ICE, Ripple
Blocker, SAM-ICE, Serial Quad I/O, SMART-I.S., SQI,
SuperSwitcher, SuperSwitcher II, Total Endurance, TSHARC,
USBCheck, VariSense, ViewSpan, WiperLock, Wireless DNA, and
ZENAare trademarks of Microchip Technology Incorporated in the
U.S.A. and other countries.
SQTP is a service mark of Microchip Technology Incorporated in
the U.S.A.
Microchip received ISO/TS-16949:2009 certification for its worldwide
headquarters, design and wafer fabrication facilities in Chandler and
Tempe, Arizona; Gresham, Oregon and design centers in California
and India. The Company’s quality system processes and procedures
are for its PIC® MCUs and dsPIC® DSCs, KEELOQ® code hopping
devices, Serial EEPROMs, microperipherals, nonvolatile memory and
analog products. In addition, Microchip’s quality system for the design
and manufacture of development systems is ISO 9001:2000 certified.
Silicon Storage Technology is a registered trademark of Microchip
Technology Inc. in other countries.
GestIC is a registered trademark of Microchip Technology
Germany II GmbH & Co. KG, a subsidiary of Microchip Technology
Inc., in other countries.
All other trademarks mentioned herein are property of their
respective companies.
QUALITYꢀMANAGEMENTꢀꢀSYSTEMꢀ
CERTIFIEDꢀBYꢀDNVꢀ
© 2017, Microchip Technology Incorporated, All Rights Reserved.
ISBN: 978-1-5224-2428-4
== ISO/TSꢀ16949ꢀ==ꢀ
2017 Microchip Technology Inc.
DS20005910A-page 25
Worldwide Sales and Service
AMERICAS
ASIA/PACIFIC
ASIA/PACIFIC
EUROPE
Corporate Office
2355 West Chandler Blvd.
Chandler, AZ 85224-6199
Tel: 480-792-7200
Fax: 480-792-7277
Technical Support:
http://www.microchip.com/
support
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Tel: 61-2-9868-6733
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Tel: 91-80-3090-4444
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Tel: 86-10-8569-7000
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Tel: 45-4450-2828
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Tel: 358-9-4520-820
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DS20005910A-page 26
2017 Microchip Technology Inc.
10/25/17
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