MIC3490-2.5YM5 [MICROCHIP]
Fixed Positive LDO Regulator;
| 型号： | MIC3490-2.5YM5 |
| 厂家： | 
MICROCHIP |
| 描述： | Fixed Positive LDO Regulator 输出元件 调节器 |
| 文件： | 总20页 (文件大小：828K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
MIC3490
High Input Voltage, Low IQ µCap LDO Regulator
Features
General Description
• Wide Input Voltage Range: 2.3V to 36V
• Ultra-Low Ground Current: 18 µA
The MIC3490 is a 100 mA, highly accurate,
low-dropout regulator with high input voltage and
ultra-low ground current. This combination of high
voltage and low ground current makes the MIC3490
ideal for multi-cell Li-Ion battery systems.
• Low Dropout Voltage of 270 mV at 100 mA
• High Output Accuracy of ±2.0% Overtemperature
• µCap: Stable with Ceramic or Tantalum
Capacitors
As a µCap LDO design, the MIC3490 is stable with
either ceramic or tantalum output capacitors. It only
requires a 2.2 µF output capacitor for stability.
• Excellent Line and Load Regulation Specifications
• Near Zero Shutdown Current: Typical 0.1 µA
• Reverse Battery Protection
Features of the MIC3490 include enable input, thermal
shutdown, current limit, reverse battery protection and
reverse leakage protection.
• Reverse Leakage Protection
• Thermal Shutdown and Current-Limit Protection
• SOT23-5 Package
Available in five output voltage options (1.8V, 2.5V,
3.0V, 3.3V and 5.0V), the MIC3490 is offered in a 5-pin
SOT23 package with a junction temperature range of
-40°C to + 125°C.
• The MIC3490 is Pin-to-Pin Compatible with
LM3940
Applications
• Keep-Alive Supply in Notebook and Portable
Computers
Typical Application Circuit
Ultra-Low Current Adjustable Regulator
Application
• USB Power Supply
• Logic Supply for High-Voltage Batteries
• Automotive Electronics
MIC3490YM5
• Battery-Powered Systems
1
2
3
5
4
VIN
VOUT
NC
• 3 to 4-Cell Li-Ion Battery Input Range
OFF ON
EN
COUT = 2.2 µF
CIN = 1.0 µF
CERAMIC
IGND = 18 µA
2019 Microchip Technology Inc.
DS20006137A-page 1
MIC3490
Package Types
MIC3490
5-Pin SOT23
(Top View)
EN GND NC
3
2
1
L3XX
4
5
IN
OUT
Functional Block Diagrams
OUT
IN
EN
ENABLE
R1
R2
VREF
GND
DS20006137A-page 2
2019 Microchip Technology Inc.
MIC3490
1.0
ELECTRICAL CHARACTERISTICS
Absolute Maximum Ratings †
Input Supply Voltage (VIN) ........................................................................................................................... -20V to +38V
Enable Input Voltage (VEN) ......................................................................................................................... -0.3V to +38V
Power Dissipation (PDIS)........................................................................................................................Internally Limited
ESD Rating (Note 1).................................................................................................................................. ESD Sensitive
Operating Ratings ‡
Input Supply Voltage (VIN) ......................................................................................................................... +2.3V to +36V
Enable Input Voltage (VEN) ............................................................................................................................. 0V to +36V
† Notice: Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to the device.
This is a stress rating only and functional operation of the device at those or any other conditions above those indicated
in the operational sections of this specification is not intended. Exposure to maximum rating conditions for extended
periods may affect device reliability. Specifications are for packaged product only.
‡ Notice: The device is not ensured to function outside its operating ratings.
Note 1: Devices are ESD sensitive. Handling precautions are recommended.
TABLE 1-1:
ELECTRICAL CHARACTERISTICS
Electrical Characteristics: TJ = +25°C with VIN = VOUT + 1V; IOUT = 100 µA;
Bold values indicate -40°C ≤ TJ ≤ +125°C; unless otherwise specified. Specifications for packaged product only.
Parameter
Symbol
Min.
Typ.
Max.
Units Conditions
-1.0
-2.0
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
1.0
2.0
0.5
1
Output Voltage Accuracy
VOUT
%
Variation from nominal VOUT
Line Regulation
Load Regulation
ΔVOUT/ΔVIN
ΔVOUT/VOUT
0.04
0.25
50
%
%
VIN = VOUT + 1V to 36V
IOUT = 100 µA to 100 mA
IOUT = 100 µA
—
230
—
300
400
400
450
30
IOUT = 50 mA
Dropout Voltage
Ground Current
VDO
mV
270
—
IOUT = 100 mA
IOUT = 100 µA
IGND
18
µA
—
35
0.25
1
0.70
2
IOUT = 50 mA
mA
IOUT = 100 mA
Ground Current in Shutdown
Short-Circuit Current
ISHDN
ISC
0.1
190
-0.1
1
µA
mA
V
VEN ≤ 0.6V; VIN = 36V
VOUT = 0V
350
—
Output Leakage, Reverse
VOUT
Load = 500Ω; VIN = -15V
Polarity Input (Note 2)
Enable Input
Input Low Voltage
Input High Voltage
—
2.0
-1.0
—
—
—
0.6
—
Regulator off
VEN
V
Regulator on
0.01
0.1
0.5
1.7
1.0
1.0
2.5
7
VEN = 0.6V; Regulator off
VEN = 2.0V; Regulator on
VEN = 36V; Regulator on
VIN applied before EN signal
Enable Input Current
Start-up Time
IEN
µA
ms
—
tSTART
—
2019 Microchip Technology Inc.
DS20006137A-page 3
MIC3490
(1)
TEMPERATURE SPECIFICATIONS
Parameters
Sym.
Min.
Typ.
Max.
Units
Conditions
Temperature Ranges
Junction Operating Temperature Range
Storage Temperature Range
TJ
-40
-65
—
—
+125
+150
°C
°C
—
TS
—
Package Thermal Resistances
Thermal Resistance 5-Pin SOT23
JA
—
235
—
°C/W
—
Note 1: The maximum allowable power dissipation is a function of ambient temperature, the maximum allowable
junction temperature and the thermal resistance from junction to air (i.e., TA, TJ, JA). Exceeding the
maximum allowable power dissipation will cause the device operating junction temperature to exceed the
maximum +125°C rating. Sustained junction temperatures above +125°C can impact the device reliability.
2: Design guidance only, not production tested.
DS20006137A-page 4
2019 Microchip Technology Inc.
MIC3490
2.0
TYPICAL PERFORMANCE CURVES
Note: The graphs and tables provided following this note are a statistical summary based on a limited number of
samples and are provided for informational purposes only. The performance characteristics listed herein
are not tested or guaranteed. In some graphs or tables, the data presented may be outside the specified
operating range (e.g., outside specified power supply range) and therefore outside the warranted range.
FIGURE 2-1:
Ratio.
Power Supply Rejection
Dropout Voltage vs. Output
Dropout Voltage vs.
FIGURE 2-4:
Dropout Characteristics.
FIGURE 2-5:
Output Current.
Ground Pin Current vs.
FIGURE 2-2:
Current.
FIGURE 2-6:
Ground Pin Current vs.
FIGURE 2-3:
Output Current.
Temperature.
2019 Microchip Technology Inc.
DS20006137A-page 5
MIC3490
FIGURE 2-7:
Temperature.
Ground Pin Current vs.
Ground Pin Current vs.
Ground Pin Current vs.
FIGURE 2-10:
Input Voltage.
Ground Pin Current vs.
FIGURE 2-11:
Input Voltage.
Ground Pin Current vs.
FIGURE 2-8:
Temperature.
FIGURE 2-12:
Ground Pin Current vs.
FIGURE 2-9:
Input Voltage.
Temperature.
DS20006137A-page 6
2019 Microchip Technology Inc.
MIC3490
FIGURE 2-13:
Input Current vs. Supply
FIGURE 2-16:
Load Transient Response.
Voltage.
FIGURE 2-14:
Output Voltage vs.
Temperature.
FIGURE 2-15:
Short-Circuit Current vs.
Temperature.
2019 Microchip Technology Inc.
DS20006137A-page 7
MIC3490
3.0
PIN DESCRIPTIONS
The descriptions of the pins are listed in Table 3-1.
TABLE 3-1:
PIN FUNCTION TABLE
Pin Number
SOT23 (M5)
Pin
Name
Description
1
2
3
NC
GND
EN
No Connect.
Ground.
Enable (Input). Logic Low = Shutdown; Logic High = Enable.
4
5
IN
Supply Input.
OUT
Regulator Output.
DS20006137A-page 8
2019 Microchip Technology Inc.
MIC3490
To determine the maximum power dissipation of the
package, use the junction-to-ambient thermal resistance
of the device and Equation 4-1:
4.0
4.1
APPLICATION INFORMATION
Enable/Shutdown
The MIC3490 comes with an active-high enable pin
that allows the regulator to be disabled. Forcing the
enable pin low disables the regulator and sends it into
a “Zero” Off mode current state, consuming a typical
0.1 µA. Forcing the enable pin high enables the output
voltage.
EQUATION 4-1:
T
JMAX – TA
PDMAX
=
-------------------------------
JA
Where:
TJ(MAX)
=
Maximum junction temperature of
the die at +125°C
4.2
Input Capacitor
The MIC3490 has a high input voltage capability, up
to 36V. The input capacitor must be rated to sustain
voltages that may be used on the input. An input capac-
itor may be required when the device is not near the
source power supply or when supplied by a battery.
Small surface mount, ceramic capacitors can be used
for bypassing. A larger value may be required if the
source supply has high ripple.
TA =
The ambient operating temperature
Layout dependent
θJA
=
Table 4-1 shows examples of the junction-to-ambient
thermal resistance for the MIC3490:
TABLE 4-1:
5-PIN SOT23 THERMAL
RESISTANCE
4.3
Output Capacitor
θJA Recommended
Minimum Footprint
Package
SOT23-5
The MIC3490 requires an output capacitor for stability.
The design requires 2.2 µF or greater on the output to
maintain stability. The design is optimized for use with
low-ESR ceramic chip capacitors. High-ESR capacitors
may cause high-frequency oscillation. The maximum
recommended ESR is 3Ω. The output capacitor can be
increased without limit. Larger valued capacitors help to
improve transient response.
+235°C/W
The actual power dissipation of the regulator circuit can
be determined using Equation 4-2:
EQUATION 4-2:
X7R/X5R dielectric-type ceramic capacitors are recom-
mended because of their temperature performance.
X7R-type capacitors change capacitance by 15% over
their operating temperature range and are the most
stable type of ceramic capacitors. Z5U and Y5V dielec-
tric capacitors change value by as much as 50% and
60%, respectively, over their operating temperature
ranges. To use a ceramic chip capacitor with Y5V
dielectric, the value must be much higher than an X7R
ceramic capacitor to ensure the same minimum
capacitance over the equivalent operating temperature
range.
PD = VIN – VOUTIOUT + VIN IGND
Substituting PD(MAX) for PD and solving for the operating
conditions that are critical to the application will give the
maximum operating conditions for the regulator circuit.
For example, when operating the MIC3490-3.0YM5 at
+50°C with a minimum footprint layout, the maximum
input voltage for a set output current can be determined
as follows:
EQUATION 4-3:
4.4
No-Load Stability
125C – 50C
235C/W
The MIC3490 will remain stable and in regulation with
no load, unlike many other voltage regulators. This is
especially important in CMOS RAM keep-alive
applications.
PDMAX
=
----------------------------------
Where:
PD(MAX)
=
319 mW
4.5
Thermal Consideration
The MIC3490 is designed to provide 100 mA of
continuous current in a very small package. Maximum
power dissipation can be calculated based on the
output current and the voltage drop across the part.
2019 Microchip Technology Inc.
DS20006137A-page 9
MIC3490
The junction-to-ambient (θJA) thermal resistance for
the minimum footprint is +235°C/W from Table 4-1. It is
important that the maximum power dissipation not be
exceeded to ensure proper operation. Because the
MIC3490 was designed to operate with high input
voltages, careful consideration must be given so as not
to overheat the device. With very high input-to-output
voltage differentials, the output current is limited by the
total power dissipation.
Ground pin current is estimated using the typical
characteristics of the device.
EQUATION 4-6:
619 mW = VIN(102.8 mA)
Where:
Total power dissipation is calculated using the following
equation:
VIN
= 6.02V
For higher current outputs, only a lower input voltage
will work for higher ambient temperatures.
EQUATION 4-4:
Assuming a lower output current of 10 mA, the
maximum input voltage can be recalculated:
PD = VIN – VOUTIOUT + VIN IGND
EQUATION 4-7:
Due to the potential for input voltages up to 36V, ground
current must be taken into consideration.
319mW = VIN – 3V10mA + VIN 0.1mA
349mW = VIN 10.1mA
If we know the maximum load current, we can solve for
the maximum input voltage using the maximum power
dissipation calculated for a +50°C ambient, 319 mW.
Where:
EQUATION 4-5:
VIN
= 34.55V
PDMAX = VIN – VOUTIOUT + VIN IGND
The maximum input voltage for a 10 mA load current at
+50°C ambient temperature is 34.55V, utilizing virtually
the entire operating voltage range of the device.
319mW = VIN – 3V100mA + VIN 2.8mA
DS20006137A-page 10
2019 Microchip Technology Inc.
MIC3490
5.0
5.1
PACKAGING INFORMATION
Package Marking Information
5-Lead SOT23* (2.9x1.6 mm)
Example
XXXX
L350
TABLE 5-1:
MIC3490 PACKAGE MARKING CODES
Part Number
Output Voltage
Marking Code
MIC3490-1.8YM5
MIC3490-2.5YM5
MIC3490-3.0YM5
MIC3490-3.3YM5
MIC3490-5.0YM5
1.8V
2.5V
3.0V
3.3V
5.0V
L318
L325
L330
L333
L350
Legend: XX...X Product code or customer-specific information
Y
YY
WW
NNN
Year code (last digit of calendar year)
Year code (last 2 digits of calendar year)
Week code (week of January 1 is week ‘01’)
Alphanumeric traceability code
3
Pb-free JEDEC® designator for Matte Tin (Sn)
e
*
This package is Pb-free. The Pb-free JEDEC designator (
can be found on the outer packaging for this package.
e
3
)
●, ▲, ▼ Pin one index is identified by a dot, delta up, or delta down (triangle mark).
Note: In the event the full Microchip part number cannot be marked on one line, it will
be carried over to the next line, thus limiting the number of available characters
for customer-specific information. Package may or may not include the corporate
logo.
Underbar (_) and/or Overbar (⎯) symbol may not be to scale.
2019 Microchip Technology Inc.
DS20006137A-page 11
MIC3490
5.2
Package Details
The following sections give the technical details of the packages.
5-Lead Plastic Small Outline Transistor (OT) [SOT23]
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
0.20 C 2X
D
e1
A
D
N
E/2
E1/2
E1
E
(DATUM D)
(DATUM A-B)
0.15 C D
2X
NOTE 1
1
2
e
B
NX b
0.20
C A-B D
TOP VIEW
A
A2
A1
A
0.20 C
SEATING PLANE
A
SEE SHEET 2
C
SIDE VIEW
Microchip Technology Drawing C04-091-OT Rev E Sheet 1 of 2
DS20006137A-page 12
2019 Microchip Technology Inc.
MIC3490
5-Lead Plastic Small Outline Transistor (OT) [SOT23]
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
c
T
L
L1
VIEW A-A
SHEET 1
Units
Dimension Limits
MILLIMETERS
MIN
NOM
MAX
Number of Pins
Pitch
Outside lead pitch
Overall Height
Molded Package Thickness
Standoff
Overall Width
Molded Package Width
Overall Length
Foot Length
N
5
e
0.95 BSC
1.90 BSC
e1
A
A2
A1
E
E1
D
L
0.90
0.89
-
-
-
-
1.45
1.30
0.15
2.80 BSC
1.60 BSC
2.90 BSC
0.30
-
0.60
Footprint
Foot Angle
Lead Thickness
Lead Width
L1
0.60 REF
I
0°
0.08
0.20
-
-
-
10°
0.26
0.51
c
b
Notes:
1. Dimensions D and E1 do not include mold flash or protrusions. Mold flash or
protrusions shall not exceed 0.25mm per side.
2. Dimensioning and tolerancing per ASME Y14.5M
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
REF: Reference Dimension, usually without tolerance, for information purposes only.
Microchip Technology Drawing C04-091-OT Rev E Sheet 2 of 2
2019 Microchip Technology Inc.
DS20006137A-page 13
MIC3490
5-Lead Plastic Small Outline Transistor (OT) [SOT23]
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
X
SILK SCREEN
5
Y
Z
C
G
1
2
E
GX
RECOMMENDED LAND PATTERN
Units
Dimension Limits
MILLIMETERS
MIN
NOM
0.95 BSC
2.80
MAX
Contact Pitch
E
C
Contact Pad Spacing
Contact Pad Width (X5)
Contact Pad Length (X5)
Distance Between Pads
Distance Between Pads
Overall Width
X
Y
G
GX
Z
0.60
1.10
1.70
0.35
3.90
Notes:
1. Dimensioning and tolerancing per ASME Y14.5M
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
Microchip Technology Drawing No. C04-2091B [OT]
DS20006137A-page 14
2019 Microchip Technology Inc.
MIC3490
APPENDIX A: REVISION HISTORY
Revision A (February 2019)
• Original Release of this Document
2019 Microchip Technology Inc.
DS20006137A-page 15
MIC3490
NOTES:
DS20006137A-page 16
2019 Microchip Technology Inc.
MIC3490
PRODUCT IDENTIFICATION SYSTEM
To order or obtain information, e.g., on pricing or delivery, contact your local Microchip representative or sales office.
PART NO.
Device
-X.X
X
XXX
-XX
Examples:
a) MIC3490-1.8YM5-TR: High Input Voltage, Low IQ µCap
LDO Regulator, 1.8V, -40°C to
Output
Voltage
Junction
Temperature
Range
Package Media Type
+125°C, SOT23-5, 3000/Reel
b) MIC3490-2.5YM5-TR: High Input Voltage, Low IQ µCap
LDO Regulator, 2.5V, -40°C to
+125°C, SOT23-5, 3000/Reel
Device:
MIC3490:
High Input Voltage, Low IQ µCap
LDO Regulator
c) MIC3490-3.0YM5-TR: High Input Voltage, Low IQ µCap
LDO Regulator, 3.0V, -40°C to
+125°C, SOT23-5, 3000/Reel
1.8 = 1.8V
2.5 = 2.5V
3.0 = 3.0V
3.3 = 3.3V
5.0 = 5.0V
d) MIC3490-3.3YM5-TR: High Input Voltage, Low IQ µCap
LDO Regulator, 3.3V, -40°C to
+125°C, SOT23-5, 3000/Reel
Output Voltage:
e) MIC3490-5.0YM5-TR: High Input Voltage, Low IQ µCap
LDO Regulator, 5.0V, -40°C to
+125°C, SOT23-5, 3000/Reel
Junction
Y
= -40°C to +125°C
Temperature Range:
Note 1: Tape and Reel identifier only appears in the
catalog part number description. This identifier is
used for ordering purposes and is not printed on
the device package. Check with your Microchip
Sales Office for package availability with the Tape
and Reel option.
Package:
M5 = 5-Lead SOT23
Media Type:
TR = 3000/Reel (SOT23 Only)
2019 Microchip Technology Inc.
DS20006137A-page 17
MIC3490
NOTES:
DS20006137A-page 18
2019 Microchip Technology Inc.
Note the following details of the code protection feature on Microchip devices:
•
Microchip products meet the specification contained in their particular Microchip Data Sheet.
•
Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the
intended manner and under normal conditions.
•
There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our
knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data
Sheets. Most likely, the person doing so is engaged in theft of intellectual property.
•
•
Microchip is willing to work with the customer who is concerned about the integrity of their code.
Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not
mean that we are guaranteeing the product as “unbreakable.”
Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our
products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts
allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act.
Information contained in this publication regarding device
applications and the like is provided only for your convenience
and may be superseded by updates. It is your responsibility to
ensure that your application meets with your specifications.
MICROCHIP MAKES NO REPRESENTATIONS OR
WARRANTIES OF ANY KIND WHETHER EXPRESS OR
IMPLIED, WRITTEN OR ORAL, STATUTORY OR
OTHERWISE, RELATED TO THE INFORMATION,
INCLUDING BUT NOT LIMITED TO ITS CONDITION,
QUALITY, PERFORMANCE, MERCHANTABILITY OR
FITNESS FOR PURPOSE. Microchip disclaims all liability
arising from this information and its use. Use of Microchip
devices in life support and/or safety applications is entirely at
the buyer’s risk, and the buyer agrees to defend, indemnify and
hold harmless Microchip from any and all damages, claims,
suits, or expenses resulting from such use. No licenses are
conveyed, implicitly or otherwise, under any Microchip
intellectual property rights unless otherwise stated.
Trademarks
The Microchip name and logo, the Microchip logo, AnyRate, AVR,
AVR logo, AVR Freaks, BitCloud, chipKIT, chipKIT logo,
CryptoMemory, CryptoRF, dsPIC, FlashFlex, flexPWR, Heldo,
JukeBlox, KeeLoq, Kleer, LANCheck, LINK MD, maXStylus,
maXTouch, MediaLB, megaAVR, MOST, MOST logo, MPLAB,
OptoLyzer, PIC, picoPower, PICSTART, PIC32 logo, Prochip
Designer, QTouch, SAM-BA, SpyNIC, SST, SST Logo,
SuperFlash, tinyAVR, UNI/O, and XMEGA are registered
trademarks of Microchip Technology Incorporated in the U.S.A.
and other countries.
ClockWorks, The Embedded Control Solutions Company,
EtherSynch, Hyper Speed Control, HyperLight Load, IntelliMOS,
mTouch, Precision Edge, and Quiet-Wire are registered
trademarks of Microchip Technology Incorporated in the U.S.A.
Adjacent Key Suppression, AKS, Analog-for-the-Digital Age, Any
Capacitor, AnyIn, AnyOut, BodyCom, CodeGuard,
CryptoAuthentication, CryptoAutomotive, CryptoCompanion,
CryptoController, dsPICDEM, dsPICDEM.net, Dynamic Average
Matching, DAM, ECAN, EtherGREEN, In-Circuit Serial
Programming, ICSP, INICnet, Inter-Chip Connectivity,
JitterBlocker, KleerNet, KleerNet logo, memBrain, Mindi, MiWi,
motorBench, MPASM, MPF, MPLAB Certified logo, MPLIB,
MPLINK, MultiTRAK, NetDetach, Omniscient Code Generation,
PICDEM, PICDEM.net, PICkit, PICtail, PowerSmart, PureSilicon,
QMatrix, REAL ICE, Ripple Blocker, SAM-ICE, Serial Quad I/O,
SMART-I.S., SQI, SuperSwitcher, SuperSwitcher II, Total
Endurance, TSHARC, USBCheck, VariSense, ViewSpan,
WiperLock, Wireless DNA, and ZENA are trademarks of
Microchip Technology Incorporated in the U.S.A. and other
countries.
SQTP is a service mark of Microchip Technology Incorporated in
the U.S.A.
Microchip received ISO/TS-16949:2009 certification for its worldwide
headquarters, design and wafer fabrication facilities in Chandler and
Tempe, Arizona; Gresham, Oregon and design centers in California
and India. The Company’s quality system processes and procedures
are for its PIC® MCUs and dsPIC® DSCs, KEELOQ® code hopping
devices, Serial EEPROMs, microperipherals, nonvolatile memory and
analog products. In addition, Microchip’s quality system for the design
and manufacture of development systems is ISO 9001:2000 certified.
Silicon Storage Technology is a registered trademark of Microchip
Technology Inc. in other countries.
GestIC is a registered trademark of Microchip Technology
Germany II GmbH & Co. KG, a subsidiary of Microchip
Technology Inc., in other countries.
All other trademarks mentioned herein are property of their
respective companies.
QUALITY MANAGEMENT SYSTEM
CERTIFIED BY DNV
© 2019, Microchip Technology Incorporated, All Rights Reserved.
ISBN: 978-1-5224-4154-0
== ISO/TS 16949 ==
2019 Microchip Technology Inc.
DS20006137A-page 19
Worldwide Sales and Service
AMERICAS
ASIA/PACIFIC
ASIA/PACIFIC
EUROPE
Corporate Office
2355 West Chandler Blvd.
Chandler, AZ 85224-6199
Tel: 480-792-7200
Fax: 480-792-7277
Technical Support:
http://www.microchip.com/
support
Australia - Sydney
Tel: 61-2-9868-6733
India - Bangalore
Tel: 91-80-3090-4444
Austria - Wels
Tel: 43-7242-2244-39
Fax: 43-7242-2244-393
China - Beijing
Tel: 86-10-8569-7000
India - New Delhi
Tel: 91-11-4160-8631
Denmark - Copenhagen
Tel: 45-4450-2828
Fax: 45-4485-2829
China - Chengdu
Tel: 86-28-8665-5511
India - Pune
Tel: 91-20-4121-0141
Finland - Espoo
Tel: 358-9-4520-820
China - Chongqing
Tel: 86-23-8980-9588
Japan - Osaka
Tel: 81-6-6152-7160
Web Address:
www.microchip.com
France - Paris
Tel: 33-1-69-53-63-20
Fax: 33-1-69-30-90-79
China - Dongguan
Tel: 86-769-8702-9880
Japan - Tokyo
Tel: 81-3-6880- 3770
Atlanta
Duluth, GA
Tel: 678-957-9614
Fax: 678-957-1455
China - Guangzhou
Tel: 86-20-8755-8029
Korea - Daegu
Tel: 82-53-744-4301
Germany - Garching
Tel: 49-8931-9700
China - Hangzhou
Tel: 86-571-8792-8115
Korea - Seoul
Tel: 82-2-554-7200
Germany - Haan
Tel: 49-2129-3766400
Austin, TX
Tel: 512-257-3370
China - Hong Kong SAR
Tel: 852-2943-5100
Malaysia - Kuala Lumpur
Tel: 60-3-7651-7906
Germany - Heilbronn
Tel: 49-7131-67-3636
Boston
Westborough, MA
Tel: 774-760-0087
Fax: 774-760-0088
China - Nanjing
Tel: 86-25-8473-2460
Malaysia - Penang
Tel: 60-4-227-8870
Germany - Karlsruhe
Tel: 49-721-625370
China - Qingdao
Philippines - Manila
Germany - Munich
Tel: 49-89-627-144-0
Fax: 49-89-627-144-44
Tel: 86-532-8502-7355
Tel: 63-2-634-9065
Chicago
Itasca, IL
Tel: 630-285-0071
Fax: 630-285-0075
China - Shanghai
Tel: 86-21-3326-8000
Singapore
Tel: 65-6334-8870
Germany - Rosenheim
Tel: 49-8031-354-560
China - Shenyang
Tel: 86-24-2334-2829
Taiwan - Hsin Chu
Tel: 886-3-577-8366
Dallas
Addison, TX
Tel: 972-818-7423
Fax: 972-818-2924
Israel - Ra’anana
Tel: 972-9-744-7705
China - Shenzhen
Tel: 86-755-8864-2200
Taiwan - Kaohsiung
Tel: 886-7-213-7830
Italy - Milan
Tel: 39-0331-742611
Fax: 39-0331-466781
China - Suzhou
Tel: 86-186-6233-1526
Taiwan - Taipei
Tel: 886-2-2508-8600
Detroit
Novi, MI
Tel: 248-848-4000
China - Wuhan
Tel: 86-27-5980-5300
Thailand - Bangkok
Tel: 66-2-694-1351
Italy - Padova
Tel: 39-049-7625286
Houston, TX
Tel: 281-894-5983
China - Xian
Tel: 86-29-8833-7252
Vietnam - Ho Chi Minh
Tel: 84-28-5448-2100
Netherlands - Drunen
Tel: 31-416-690399
Fax: 31-416-690340
Indianapolis
Noblesville, IN
Tel: 317-773-8323
Fax: 317-773-5453
Tel: 317-536-2380
China - Xiamen
Tel: 86-592-2388138
Norway - Trondheim
Tel: 47-7288-4388
China - Zhuhai
Tel: 86-756-3210040
Poland - Warsaw
Tel: 48-22-3325737
Los Angeles
Mission Viejo, CA
Tel: 949-462-9523
Fax: 949-462-9608
Tel: 951-273-7800
Romania - Bucharest
Tel: 40-21-407-87-50
Spain - Madrid
Tel: 34-91-708-08-90
Fax: 34-91-708-08-91
Raleigh, NC
Tel: 919-844-7510
Sweden - Gothenberg
Tel: 46-31-704-60-40
New York, NY
Tel: 631-435-6000
Sweden - Stockholm
Tel: 46-8-5090-4654
San Jose, CA
Tel: 408-735-9110
Tel: 408-436-4270
UK - Wokingham
Tel: 44-118-921-5800
Fax: 44-118-921-5820
Canada - Toronto
Tel: 905-695-1980
Fax: 905-695-2078
DS20006137A-page 20
2019 Microchip Technology Inc.
08/15/18
相关型号：
©2020 ICPDF网 联系我们和版权申明