MIC39100-1.8BS [MICROCHIP]
Fixed Positive LDO Regulator, 1.8V, 0.63V Dropout, BIPolar, PDSO4, SOT-223, 4 PIN;
| 型号： | MIC39100-1.8BS |
| 厂家： | 
MICROCHIP |
| 描述： | Fixed Positive LDO Regulator, 1.8V, 0.63V Dropout, BIPolar, PDSO4, SOT-223, 4 PIN 光电二极管 输出元件 调节器 |
| 文件： | 总24页 (文件大小：1898K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
MIC39100/1/2
1A, Low Voltage, Low Dropout Regulator
with Reversed-Battery Protection
Features
General Description
• Fixed and Adjustable Output Voltages to 1.24V
• 410 mV Typical Dropout at 1A Load
The MIC39100, MIC39101, and MIC39102 are 1A low
dropout linear voltage regulators that provide low
voltage, high current output from an extremely small
package. The MIC39100/1/2 offers extremely low
dropout (typically 410 mV at 1A) and low ground
current (typically 11 mA at 1A).
- Best Recommended for 3.0V to 2.5V Conver-
sion
- Best Recommended for 2.5V to 1.8V Conver-
sion
The MIC39100 is a fixed output regulator offered in the
SOT-223 package. The MIC39101 and MIC39102 are
fixed and adjustable regulators, respectively, in a
thermally enhanced 8-lead SOIC package.
• 1A Minimum Guaranteed Output Current
• 1% Initial Accuracy
• Low Ground Current
• Current-Limiting and Thermal-Shutdown
Protection
The MIC39100/1/2 is ideal for PC add-in cards that
need to convert from standard 5V to 3.3V, 3.3V to 2.5V,
or 2.5V to 1.8V. A guaranteed maximum dropout
voltage of 630 mV over all operating conditions allows
the MIC39100/1/2 to provide 2.5V from a supply as low
as 3.13V and 1.8V from a supply as low as 2.43V.
• Reversed-Battery and Reversed-Leakage
Protection
• Fast Transient Response
• Low Profile SOT-223 Package
• Power SO-8 Package
The MIC39100/1/2 is fully protected with overcurrent
limiting, thermal-shutdown, and reverse-battery
protection. Fixed voltages of 5.0V, 3.3V, 2.5V, and 1.8V
are available on MIC39100/1 with adjustable output
voltages to 1.24V on MIC39102.
Applications
• LDO Linear Regulator for PC Add-In Cards
• High-Efficiency Linear Power Supplies
• SMPS Post Regulator
• Multimedia and PC Processor Supplies
• Battery Chargers
• Low Voltage Microcontrollers and Digital Logic
Package Types
MIC39102 (ADJ.)
SOIC-8 (M)
MIC39101-XX (FIXED)
MIC39100-XX (FIXED)
SOT-223 (S)
SOIC-8 (M)
(Top View)
(Top View)
(Top View)
GND
TAB
EN 1
IN 2
8 GND
7 GND
6 GND
5 GND
EN 1
IN 2
8 GND
7 GND
6 GND
5 GND
OUT 3
ADJ 4
OUT 3
FLG 4
2
3
1
IN GND OUT
2017 Microchip Technology Inc.
DS20005834A-page 1
MIC39100/1/2
Typical Application Circuits
2.5V/1A Regulator
MIC39100
IN
VIN
3.3V
OUT
2.5V
10μF
TANTALUM
GND
2.5V/1A Regulator with Error Flag
100k
ERROR FLAG
OUTPUT
MIC39101
VIN
3.3V
IN
OUT
2.5V
R1
ENABLE
SHUTDOWN
EN
FLG
10μF
TANTALUM
GND
1.5V/1A Adjustable Regulator
MIC39102
VIN
2.5V
IN
OUT
1.5V
R1
R2
ENABLE
SHUTDOWN
EN
ADJ
10μF
TANTALUM
GND
DS20005834A-page 2
2017 Microchip Technology Inc.
MIC39100/1/2
Functional Block Diagrams
MIC39100 Fixed Regulator
IN
OUT
O.V. ILIMIT
18V
1.240V
REFERENCE
THERMAL
SHUTDOWN
MIC39100
GND
MIC39101 Fixed Regulator
with Flag and Enable
OUT
IN
O.V. ILIMIT
18V
1.180V
1.240V
REFERENCE
FLG
EN
THERMAL
SHUTDOWN
GND
MIC39101
MIC39102 Adjustable Regulator
OUT
IN
O.V. ILIMIT
18V
1.240V
REFERENCE
ADJ
EN
THERMAL
SHUTDOWN
GND
MIC39102
2017 Microchip Technology Inc.
DS20005834A-page 3
MIC39100/1/2
1.0
ELECTRICAL CHARACTERISTICS
Absolute Maximum Ratings †
Supply Voltage (VIN).................................................................................................................................... –20V to +20V
Enable Voltage (VEN) ................................................................................................................................................+20V
ESD Rating ............................................................................................................................................................ Note 1
Maximum Power Dissipation (PD(MAX)).................................................................................................................. Note 2
Operating Ratings ‡
Supply Voltage (VIN).................................................................................................................................+2.25V to +16V
Enable Voltage (VEN) ................................................................................................................................................+16V
† Notice: Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to the device.
This is a stress rating only and functional operation of the device at those or any other conditions above those indicated
in the operational sections of this specification is not intended. Exposure to maximum rating conditions for extended
periods may affect device reliability.
‡ Notice: The device is not guaranteed to function outside its operating ratings.
Note 1: Devices are ESD sensitive. Handling precautions are recommended. Human body model, 1.5 kΩ in series
with 100 pF.
2: PD(MAX) = (TJ(MAX) – TA) ÷ θJA, where θJA depends upon the printed circuit layout (see Application Informa-
tion).
TABLE 1-1:
ELECTRICAL CHARACTERISTICS
Electrical Characteristics: VIN = VOUT + 1V; VEN = 2.25V; TJ = +25°C, bold values indicate –40°C ≤ TJ ≤ +125°C,
unless noted. Note 1
Parameter
Symbol
Min.
Typ.
Max.
Units Conditions
–1
—
1
IOUT = 10 mA
Output Voltage
VOUT
%
10 mA ≤ IOUT ≤ 1A,
VOUT +1V ≤ VIN ≤ 8V
–2
—
—
—
—
0.06
0.2
40
2
0.5
1
IOUT = 10 mA,
VOUT + 1V ≤ VIN ≤ 16V
Line Regulation
Load Regulation
—
—
%
%
VIN = VOUT + 1V,
10 mA ≤ IOUT ≤ 1A
Output Voltage Temperature
Coefficient
∆VOUT
∆T
/
100
ppm/°C Note 2
IOUT = 100 mA, ∆VOUT = –1%
200
250
—
—
140
—
—
275
300
I
OUT = 500 mA, ∆VOUT = –1%
Dropout Voltage, Note 3
Ground Current, Note 4
VDO
mV
500
550
630
—
IOUT = 750 mA, ∆VOUT = –1%
—
410
I
OUT = 1A, ∆VOUT = –1%
—
—
—
—
—
400
4
µA
mA
A
IOUT = 100 mA, VIN = VOUT + 1V
—
I
I
OUT = 500 mA, VIN = VOUT + 1V
OUT = 750 mA, VIN = VOUT + 1V
IGND
6.5
11
—
20
IOUT = 1A, VIN = VOUT + 1V
VOUT = 0V, VIN = VOUT + 1V
Current Limit
IOUT(LIM)
1.8
2.5
Enable Input
—
—
—
0.8
Logic LOW (Off)
Logic HIGH (On)
Enable Input Voltage
VEN
V
2.25
—
DS20005834A-page 4
2017 Microchip Technology Inc.
MIC39100/1/2
TABLE 1-1:
ELECTRICAL CHARACTERISTICS (CONTINUED)
Electrical Characteristics: VIN = VOUT + 1V; VEN = 2.25V; TJ = +25°C, bold values indicate –40°C ≤ TJ ≤ +125°C,
unless noted. Note 1
Parameter
Symbol
Min.
Typ.
Max.
Units Conditions
1
15
—
—
—
30
75
2
VEN = 2.25V
µA
—
—
—
Enable Input Current
IEN
VEN = 0.8V
4
Flag Output
1
2
IFLG(LEAK)
Output Leakage Voltage
—
—
0.01
210
µA
VOH = 16V
300
400
—
Output Low Voltage
VFLG(DO)
mV
VIN = 2.250V, IOL = 250 µA, Note 5
Low Threshold
High Threshold
Hysteresis
93
—
—
—
—
1
% of VOUT
% of VOUT
—
VFLG
99.2
—
%
MIC39102 Only
1.228
1.215
1.203
1.252
1.265
1.277
80
1.240
—
IOUT = 10 mA
Note 6
Reference Voltage
—
—
V
Adjust Pin Bias Current
—
40
nA
—
120
Reference Voltage
Temperature Coefficient
—
—
—
—
20
—
—
ppm/°C
nA/°C
—
—
Adjust Pin Bias Current
Temperature Coefficient
0.1
Note 1: Specification for packaged product only.
2: Output voltage temperature coefficient is ∆VOUT(WORST CASE) ÷ (TJ(MAX) – TJ(MIN)), where TJ(MAX)
=
+125°C and TJ(MIN) = –40°C.
3: VDO = VIN – VOUT when VOUT decreases to 99% of its nominal output voltage with VIN = VOUT + 1V. For
output voltages below 2.25V, dropout voltage is the input-to-output voltage differential with the minimum
input voltage being 2.25V. Minimum input operating voltage is 2.25V.
4: IGND is the quiescent current (IIN = IGND + IOUT).
5: For a 2.5V device, VIN = 2.250V (device is in dropout).
6: VREF ≤ VOUT ≤ (VIN – 1V), 2.25V ≤ VIN ≤ 16V, 10 mA ≤ IL ≤ 1A, TJ = TMAX
.
2017 Microchip Technology Inc.
DS20005834A-page 5
MIC39100/1/2
TEMPERATURE SPECIFICATIONS (Note 1)
Parameters
Temperature Ranges
Sym.
Min.
Typ.
Max.
Units
Conditions
Junction Operating Temperature
Range
TJ
–40
—
+125
°C
—
—
Storage Temperature Range
Lead Temperature
TS
—
–65
—
—
—
+150
+260
°C
°C
Soldering, 5s
Package Thermal Resistances
Thermal Resistance SOT-223
Thermal Resistance SOIC-8
JC
JC
—
—
15
20
—
—
°C/W
°C/W
—
—
Note 1: The maximum allowable power dissipation is a function of ambient temperature, the maximum allowable
junction temperature and the thermal resistance from junction to air (i.e., TA, TJ, JA). Exceeding the
maximum allowable power dissipation will cause the device operating junction temperature to exceed the
maximum +125°C rating. Sustained junction temperatures above +125°C can impact the device reliability.
DS20005834A-page 6
2017 Microchip Technology Inc.
MIC39100/1/2
2.0
TYPICAL PERFORMANCE CURVES
Note: The graphs and tables provided following this note are a statistical summary based on a limited number of
samples and are provided for informational purposes only. The performance characteristics listed herein
are not tested or guaranteed. In some graphs or tables, the data presented may be outside the specified
operating range (e.g., outside specified power supply range) and therefore outside the warranted range.
80
60
40
20
0
80
60
40
V
= 5V
VIONUT = 3.3V
V
= 3.3V
VIONUT = 2.5V
20
0
IOUT = 1A
CIONU=T 0μF
IOUT = 1A
CIONU=T 0μF
C
= 10μF
C
= 47μF
10
100
1K
10K 100K 1M
1E+1 1E+2 1E+3 1E+4 1E+5 1E+6
10 100 1K 10K 100K 1M
FREQUENCY (Hz)
FREQUENCY (Hz)
FIGURE 2-1:
Power Supply Rejection
FIGURE 2-4:
Power Supply Rejection
Ratio.
Ratio.
80
500
450
400
V
= 5V
VIONUT = 3.3V
2.5V
3.3V
60
40
20
0
350
300
250
200
150
100
50
1.8V
TA = 25°C
IOUT = 1A
CIONU=T 0μF
C
= 47μF
0
1E+2 1E+3 1E+4 1E+5 1E+6
1E+1 1E+2 1E+3 1E+4 1E+5 1E+6
10 100 1K 10K 100K 1M
0
250
500 750 1000 1250
FREQUENCY (Hz)
OUTPUT CURRENT (mA)
FIGURE 2-2:
Ratio.
Power Supply Rejection
FIGURE 2-5:
Current.
Dropout Voltage vs. Output
80
600
V
= 3.3V
ILOAD = 1A
VIONUT = 2.5V
550
500
60
40
20
0
1.8V
3.3V
450
400
2.5V
IOUT = 1A
CIONU=T 0μF
350
300
C
= 10μF
1E+1 1E+2 1E+3 1E+4 1E+5 1E+6
10 100 1K 10K 100K 1M
1E+2 1E+3 1E+4 1E+5
–40 –20
0
20 40 60 80 100 120
TEMPERATURE (°C)
FREQUENCY (Hz)
FIGURE 2-3:
Power Supply Rejection
FIGURE 2-6:
Dropout Voltage vs.
Ratio.
Temperature.
2017 Microchip Technology Inc.
DS20005834A-page 7
MIC39100/1/2
2.8
2.0
1.8
1.6
2.6
2.4
ILOAD = 100mA
ILOAD = 100mA
1.4
1.2
1.0
0.8
2.2
2.0
1.8
1.6
1.4
ILOAD = 750mA
ILOAD = 10mA
0.6
0.4
0.2
0
ILOAD = 1A
1E+2 1E+3 1E+4
2.3 2.6 2.9
0
2
4
6
8
2
3.2
3.5
SUPPLY VOLTAGE (V)
SUPPLY VOLTAGE (V)
FIGURE 2-7:
Dropout Characteristics
FIGURE 2-10:
Ground Current vs. Supply
(2.5V).
Voltage (2.5V).
35
30
3.6
3.4
ILOAD = 100mA
25
3.2
3.0
2.8
2.6
ILOAD = 1A
20
15
ILOAD = 750mA
ILOAD = 1A
10
5
1E+2 1E+3 1E+4
2.4
0
2.8
3.2
3.6
4.0
4.4
0
2
4
6
8
SUPPLY VOLTAGE (V)
SUPPLY VOLTAGE (V)
FIGURE 2-11:
Voltage (2.5V).
Ground Current vs. Supply
FIGURE 2-8:
(3.3V).
Dropout Characteristics
1.4
1.2
1.0
14
12
10
8
1.8V
ILOAD = 100mA
2.5V
3.3V
0.8
0.6
0.4
0.2
0
6
ILOAD = 10mA
4
2
0
0
2
4
6
8
0
200
400 600
800 1000
SUPPLY VOLTAGE (V)
OUTPUT CURRENT (mA)
FIGURE 2-12:
Ground Current vs. Supply
FIGURE 2-9:
Ground Current vs. Output
Voltage (3.3V).
Current.
DS20005834A-page 8
2017 Microchip Technology Inc.
MIC39100/1/2
50
20
15
ILOAD = 1A
40
30
1.8V
3.3V
2.5V
ILOAD = 1A
10
5
20
10
0
0
–40 –20
0
20 40 60 80 100 120
0
2
4
6
8
TEMPERATURE (°C)
SUPPLY VOLTAGE (V)
FIGURE 2-13:
Ground Current vs. Supply
FIGURE 2-16:
Ground Current vs.
Voltage (3.3V).
Temperature.
3.40
3.35
1.0
0.8
ILOAD = 10mA
0.6
0.4
3.3V
2.5V
3.30
3.25
3.20
0.2
0
1.8V
TYPICAL 3.3V DEVICE
–40 –20
0
20 40 60 80 100 120
–40 –20
0
20 40 60 80 100 120
TEMPERATURE (°C)
TEMPERATURE (°C)
FIGURE 2-17:
Output Voltage vs.
FIGURE 2-14:
Ground Current vs.
Temperature.
Temperature.
2.5
2.0
1.5
1.0
5.0
4.5
2.5V
3.3V
3.3V
4.0
3.5
3.0
2.5
2.0
1.8V
2.5V
1.8V
1.5
1.0
0.5
0.5
0
ILOAD = 500mA
0
–40 –20
0
20 40 60 80 100 120
–40 –20
0
20 40 60 80 100 120
TEMPERATURE (°C)
TEMPERATURE (°C)
FIGURE 2-18:
Temperature.
Short-Circuit vs.
FIGURE 2-15:
Temperature.
Ground Current vs.
2017 Microchip Technology Inc.
DS20005834A-page 9
MIC39100/1/2
6
VOUT = 2.5V
COUT = 10μF
V
IN = 5V
5
OUTPUT
VOLTAGE
(200mV/div)
FLAG HIGH (OK)
4
3
2
1A
FLAG LOW (FAULT)
1
0
LOAD
CURRENT
(500mA/div)
100mA
10 100 1K 10K 100K 1M 10M
RESISTANCE ()
TIME (250μs/div)
FIGURE 2-19:
Error Flag Voltage vs.
FIGURE 2-22:
Load Transient Response.
Pull-Up Resistor Value.
12
VOUT = 2.5V
COUT = 47μF
V
= V
+ 1V
VEINN = 2O.4UTV
10
8
OUTPUT
VOLTAGE
(200mV/div)
6
4
2
1A
LOAD
CURRENT
(500mA/div)
10mA
0
–40 –20
0 20 40 60 80 100 120 140
TEMPERATURE (°C)
TIME (500μs/div)
FIGURE 2-23:
Load Transient Response.
FIGURE 2-20:
Enable Current vs.
Temperature.
250
200
150
100
VOUT = 2.5V
COUT = 10μF
FLAG-LOW
VOLTAGE
OUTPUT
VOLTAGE
(50mV/div)
VIN = 2.25V
R
PULL-UP = 22k
50
0
INPUT
VOLTAGE
(2V/div)
–40 –20
0 20 40 60 80 100 120 140
TEMPERATURE (°C)
TIME (25μs/div)
FIGURE 2-21:
Flag-Low Voltage vs.
FIGURE 2-24:
Line Transient Response.
Temperature.
DS20005834A-page 10
2017 Microchip Technology Inc.
MIC39100/1/2
3.0
PIN DESCRIPTIONS
The descriptions of the pins are listed in Table 3-1.
TABLE 3-1:
PIN FUNCTION TABLE
Pin Number
MIC39100
Pin Number
MIC39101
Pin Number
MIC39102
Pin Name
Description
—
1
1
EN
Enable (Input): CMOS-compatible control input.
Logic HIGH = enable; logic LOW or OPEN =
shutdown.
1
3
2
3
4
2
3
IN
Supply (Input).
OUT
FLG
Regulator Output.
—
—
Flag (Output): Open-collector error flag output.
Active LOW = output undervoltage.
—
—
4
ADJ
Adjustable Input: Feedback input. Connect to
resistive voltage-divider network.
2, TAB
5, 6, 7, 8
5, 6, 7, 8
GND
Ground.
2017 Microchip Technology Inc.
DS20005834A-page 11
MIC39100/1/2
The value of the output capacitor can be increased
without limit. Higher capacitance values help to
improve transient response and ripple rejection and
reduce output noise.
4.0
APPLICATION INFORMATION
The MIC39100/1/2 is a high performance, low dropout
voltage regulator suitable for moderate to high current
voltage regulator applications. Its 630 mV dropout
voltage at full load and over temperature makes it
especially valuable in battery-powered systems and as
high efficiency noise filters in post-regulator
applications. Unlike older NPN-pass transistor designs,
where the minimum dropout voltage is limited by the
base-to-emitter voltage drop and collector-to-emitter
saturation voltage, dropout performance of the PNP
output of these devices is limited only by the low VCE
saturation voltage.
4.2
Input Capacitor
An input capacitor of 1 µF or greater is recommended
when the device is more than four inches away from
the bulk ac supply capacitance or when the supply is a
battery. Small, surface mount, ceramic chip capacitors
can be used for bypassing. Larger values will help to
improve ripple rejection by bypassing the input to the
regulator, further improving the integrity of the output
voltage.
A trade-off for the low dropout voltage is a varying base
drive requirement that reduces the drive requirement to
only 2% of the load current.
4.3
Error Flag
The MIC39100/1/2 regulator is fully protected from
damage due to fault conditions. Linear current limiting
is provided. Output current during overload conditions
is constant. Thermal shutdown disables the device
when the die temperature exceeds the maximum safe
operating temperature. Transient protection allows
device (and load) survival even when the input voltage
spikes above and below nominal. The output structure
of these regulators allows voltages in excess of the
desired output voltage to be applied without reverse
current flow.
The MIC39101 features an error flag (FLG) that
monitors the output voltage and signals an error
condition when this voltage drops 5% below its
expected value. The error flag is an open-collector
output that pulls low under fault conditions and may
sink up to 10 mA. Low output voltage signifies a
number of possible problems, including an overcurrent
fault (the device is in current-limit) or low input voltage.
The flag output is inoperative during overtemperature
conditions. A pull-up resistor from FLG to either VIN or
VOUT is required for proper operation. For information
regarding the minimum and maximum values of pull-up
resistance, refer to Figure 2-19.
MIC39100-x.x.
VIN
VOUT
COUT
IN
OUT
4.4
Enable Input
The MIC39101 and MIC39102 feature an active-HIGH
enable input (EN) that allows on/off control of the
regulator. Current drain reduces to zero when the
device is shutdown, with only microamperes (µA) of
CIN
GND
leakage
current.
The
EN
input
has
FIGURE 4-1:
Capacitor Requirements.
TTL/CMOS-comparable thresholds for simple logic
interfacing. EN can be directly tied to VIN and pulled-up
to the maximum supply voltage.
4.1
Output Capacitor
The MIC39100/1/2 requires an output capacitor to
maintain stability and improve transient response.
Proper capacitor selection is important to ensure
proper operation. The MIC39100/1/2 output capacitor
selection is dependent upon the equivalent series
resistance (ESR) of the output capacitor to maintain
stability. When the output capacitor is 10 µF or greater,
the output capacitor should have an ESR less than 2ꢀ.
This will improve transient response as well as promote
stability. Ultra-low ESR capacitors (<100 mꢀ), such as
ceramic-chip capacitors, may promote instability.
These very low ESR levels may cause an oscillation
and/or underdamped transient response. A low-ESR
solid tantalum capacitor works extremely well and
provides good transient response and stability over
temperature. Aluminum electrolytics can also be used,
as long as the ESR of the capacitor is <2ꢀ.
4.5
Transient Response and 3.3V to
2.5V or 2.5V to 1.8V Conversion
The MIC39100/1/2 has excellent transient response to
variations in input voltage and load current. The device
has been designed to respond quickly to load current
variations and input voltage variations. Large output
capacitors are not required to obtain this performance.
A standard 10 µF output capacitor, preferably tantalum,
is all that is required. Larger values help to improve
performance even further.
By virtue of its low dropout voltage, this device does not
saturate into dropout as readily as similar NPN-based
designs. When converting from 3.3V to 2.5V or 2.5V to
1.8V, the NPN-based regulators are already operating
in dropout, with typical dropout requirements of 1.2V or
DS20005834A-page 12
2017 Microchip Technology Inc.
MIC39100/1/2
greater. To convert down to 2.5V or 1.8V without
operating in dropout, NPN-based regulators require an
input voltage of 3.7V at the very least.
EQUATION 4-2:
R1
R2
The MIC39100 regulator will provide excellent
performance with an input as low as 3.0V or 2.5V
respectively. This gives the PNP-based regulators a
distinct advantage over older, NPN-based linear
regulators.
VOUT = 1.240V 1 + ------
4.8
Power SOIC-8 Thermal
Characteristics
4.6
Minimum Load Current
The MIC39100/1/2 regulator is specified between finite
loads. If the output current is too small, leakage
currents dominate and the output voltage rises. A
10 mA minimum load current is necessary for proper
regulation.
One of the secrets of the MIC39101/2’s performance is
its power SO-8 package. Lower thermal resistance
means more output current or higher input voltage for a
given package size.
Lower thermal resistance is achieved by joining the
four ground leads with the die attach paddle to create a
single-piece electrical and thermal conductor. This
concept has been used by MOSFET manufacturers for
years, proving very reliable and cost effective for the
user.
4.7
Adjustable Regulator Design
The MIC39102 allows programming the output voltage
anywhere between 1.24V and the 16V maximum
operating rating of the family. Two resistors are used.
Resistors can be quite large, up to 1 Mꢀ, because of
the very high input impedance and low bias current of
the sense comparator: The resistor values are
calculated by Equation 4-1:
Thermal resistance consists of two main elements, θJC
(junction-to-case thermal resistance) and θCA
(case-to-ambient thermal resistance, see Figure 4-3).
θJC is the resistance from the die to the leads of the
package. θCA is the resistance from the leads to the
ambient air and it includes θCS (case-to-sink thermal
resistance) and θSA (sink-to-ambient thermal
resistance).
EQUATION 4-1:
VOUT
R1 = R2 ------------- – 1
1.240
Where:
VOUT Desired output voltage.
Applications with widely varying load currents may
scale the resistors to draw the minimum load current
required for proper operation (Figure 4-2).
TJA
GROUND PLANE
HEAT SINK AREA
TJC
TCA
AMBIENT
MIC39102
VOUT
COUT
VIN
IN
OUT
R1
R2
PRINTED CIRCUIT BOARD
ENABLE
SHUTDOWN
EN
ADJ
GND
FIGURE 4-3:
Thermal Resistance.
Using the power SOIC-8 reduces the θJC dramatically
and allows the user to reduce θCA. The total thermal
resistance,
θJA
,
(junction-to-ambient
thermal
FIGURE 4-2:
Resistors.
Adjustable Regulator with
resistance) is the limiting factor in calculating the
maximum power dissipation capability of the device.
Typically, the power SOIC-8 has a θJC of 20°C/W,
which is significantly lower than the standard SOIC-8
(typically 75°C/W). θCA is reduced due to the capability
of soldering Pins 5 through 8 directly to a ground plane.
2017 Microchip Technology Inc.
DS20005834A-page 13
MIC39100/1/2
This significantly reduces the case-to-sink thermal
resistance as well as the sink-to-ambient thermal
resistance.
Using Figure 4-4, the minimum amount of required
copper can be determined based on the required
power dissipation. Power dissipation in a linear
regulator is calculated as in Equation 4-4:
Low dropout linear regulators from Microchip are rated
to a maximum junction temperature of +125°C. It is
important not to exceed this maximum junction
temperature during operation of the device. To prevent
this maximum junction temperature from being
exceeded, the appropriate ground plane heat sink must
be used.
EQUATION 4-4:
PD = VIN – VOUTIOUT + VIN IGND
Figure 4-4 shows copper area versus power
dissipation with each trace corresponding to a different
temperature rise above ambient.
Using a 2.5V output device and a 3.3V input at an
output current of 1A, the power dissipation is calculated
as in Equation 4-5:
900
800
¨TJA
=
EQUATION 4-5:
700
600
500
400
300
200
100
0
PD = 3.3V – 2.5V1A + 3.3V 11 mA
= 800 mW + 36 mW = 836 mW
From Figure 4-4, the minimum amount of copper
required to operate this application at a ∆T of 75°C is
160 mm2.
0
0.25 0.50 0.75 1.00 1.25 1.50
POWER DISSIPATION (W)
FIGURE 4-4:
SOIC Power Dissipation (∆T ).
Copper Area vs. Power
4.9
Quick Method
JA
Determine the power dissipation requirements for the
design along with the maximum ambient temperature
at which the device will be operated. Refer to
Figure 4-5, which shows safe operating curves for
three different ambient temperatures: 25°C, 50°C, and
85°C. From these curves, the minimum amount of
copper can be determined by knowing the maximum
power dissipation required. If the maximum ambient
temperature is 50°C and the power dissipation is as
above, 836 mW, the curve in Figure 4-5 shows that the
required area of copper is 160 mm2.
From these curves, the minimum area of copper
necessary for the part to operate safely can be
determined. The maximum allowable temperature rise
must be calculated to determine operation along which
curve.
For example, the maximum ambient temperature is
50°C, the ∆T is determined as in Equation 4-3:
EQUATION 4-3:
The θJA of this package is ideally 63°C/W, but it will
vary depending upon the availability of copper ground
plane to which it is attached.
T = 125C – 50C = 75C
Where:
∆T
TJ(MAX) – TA(MAX)
TJ(MAX) +125°C
TA(MAX) Max. ambient operating temperature
DS20005834A-page 14
2017 Microchip Technology Inc.
MIC39100/1/2
900
800
700
600
500
TJ = 125°C
TA
=
400
300
200
100
0
0
0.25 0.50 0.75 1.00 1.25 1.50
POWER DISSIPATION (W)
FIGURE 4-5:
Copper Area vs. Power
SOIC Power Dissipation (T ).
A
2017 Microchip Technology Inc.
DS20005834A-page 15
MIC39100/1/2
5.0
5.1
PACKAGING INFORMATION
Package Marking Information
3-Pin SOT-223*
(MIC39100)
Example
XXXXX
X.XWNNNP
39100
2.58103P
8-Pin SOIC*
(MIC39101)
Example
XXXXX
-X.XXX
39101
-3.3Y
WNNN
6987
8-Pin SOIC*
(MIC39102)
Example
XXX
XXXXXXX
MIC
39102YM
3112
WNNN
Legend: XX...X Product code or customer-specific information
Y
Year code (last digit of calendar year)
YY
WW
NNN
Year code (last 2 digits of calendar year)
Week code (week of January 1 is week ‘01’)
Alphanumeric traceability code
e
3
Pb-free JEDEC® designator for Matte Tin (Sn)
This package is Pb-free. The Pb-free JEDEC designator (
can be found on the outer packaging for this package.
*
e
3
)
●, ▲, ▼ Pin one index is identified by a dot, delta up, or delta down (triangle
mark).
Note: In the event the full Microchip part number cannot be marked on one line, it will
be carried over to the next line, thus limiting the number of available
characters for customer-specific information. Package may or may not include
the corporate logo.
Underbar (_) and/or Overbar (⎯) symbol may not be to scale.
DS20005834A-page 16
2017 Microchip Technology Inc.
MIC39100/1/2
3-Lead SOT-223 Package Outline and Recommended Land Pattern
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging.
2017 Microchip Technology Inc.
DS20005834A-page 17
MIC39100/1/2
8-Lead SOIC Package Outline and Recommended Land Pattern
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging.
DS20005834A-page 18
2017 Microchip Technology Inc.
MIC39100/1/2
APPENDIX A: REVISION HISTORY
Revision A (August 2017)
• Converted Micrel document MIC39100/1/2 to
Microchip data sheet DS20005834A.
• Minor text changes throughout.
2017 Microchip Technology Inc.
DS20005834A-page 19
MIC39100/1/2
DS20005834A-page 20
2017 Microchip Technology Inc.
MIC39100/1/2
PRODUCT IDENTIFICATION SYSTEM
To order or obtain information, e.g., on pricing or delivery, contact your local Microchip representative or sales office.
Examples:
PART NO.
Device
–X.
X
X
XX
–XX
a) MIC39100-1.8WS:
1A, Low Voltage, Low Dropout
Regulator, 1.8V,
–40°C to +125°C, 3-Lead
SOT-223, 78/Tube
Voltage
Temperature Package Media Type
Device:
Voltage:
MIC39100/1/2: 1A, Low Voltage, Low Dropout Regulator
b) MIC39100-3.3WS-TR: 1A, Low Voltage, Low Dropout
Regulator, 3.3V,
–40°C to +125°C, 3-Lead
1.8
2.5
3.3
5.0
=
=
=
=
1.8V
2.5V
3.3V
5.0V
SOT-223, 2,500/Reel
c) MIC39101-2.5YM:
1A, Low Voltage, Low Dropout
Regulator, 2.5V,
<blank>= Adjustable (MIC39102 Only)
–40°C to +125°C, 8-Lead
SOIC, 95/Tube
Temperature:
Y
W
=
=
–40°C to +125°C
–40°C to +125°C (with high-melting solder
exemption)
d) MIC39101-5.0YM-TR: 1A, Low Voltage, Low Dropout
Regulator, 5.0V,
–40°C to +125°C, 8-Lead
SOIC, 2,500/Reel
Package:
M
S
=
=
8-Lead SOIC
3-Lead SOT-223 (MIC39100 Only)
e) MIC39102YM:
1A, Low Voltage, Low Dropout
Regulator, Adjustable Voltage,
–40°C to +125°C, 8-Lead
SOIC, 95/Tube
Media Type:
<blank>= 78/Tube (MIC39100)
<blank>= 95/Tube (MIC39101/2)
TR
f) MIC39102YM-TR:
1A, Low Voltage, Low Dropout
Regulator, Adjustable Voltage,
–40°C to +125°C, 8-Lead
SOIC, 2,500/Reel
=
2,500/Reel
Note 1:
Tape and Reel identifier only appears in the
catalog part number description. This identifier is
used for ordering purposes and is not printed on
the device package. Check with your Microchip
Sales Office for package availability with the
Tape and Reel option.
2017 Microchip Technology Inc.
DS20005834A-page 21
MIC39100/1/2
NOTES:
DS20005834A-page 22
2017 Microchip Technology Inc.
Note the following details of the code protection feature on Microchip devices:
•
Microchip products meet the specification contained in their particular Microchip Data Sheet.
•
Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the
intended manner and under normal conditions.
•
There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our
knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data
Sheets. Most likely, the person doing so is engaged in theft of intellectual property.
•
•
Microchip is willing to work with the customer who is concerned about the integrity of their code.
Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not
mean that we are guaranteeing the product as “unbreakable.”
Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our
products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts
allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act.
Information contained in this publication regarding device
applications and the like is provided only for your convenience
and may be superseded by updates. It is your responsibility to
ensure that your application meets with your specifications.
MICROCHIP MAKES NO REPRESENTATIONS OR
WARRANTIES OF ANY KIND WHETHER EXPRESS OR
IMPLIED, WRITTEN OR ORAL, STATUTORY OR
OTHERWISE, RELATED TO THE INFORMATION,
INCLUDING BUT NOT LIMITED TO ITS CONDITION,
QUALITY, PERFORMANCE, MERCHANTABILITY OR
FITNESS FOR PURPOSE. Microchip disclaims all liability
arising from this information and its use. Use of Microchip
devices in life support and/or safety applications is entirely at
the buyer’s risk, and the buyer agrees to defend, indemnify and
hold harmless Microchip from any and all damages, claims,
suits, or expenses resulting from such use. No licenses are
conveyed, implicitly or otherwise, under any Microchip
intellectual property rights unless otherwise stated.
Trademarks
The Microchip name and logo, the Microchip logo, AnyRate, AVR,
AVR logo, AVR Freaks, BeaconThings, BitCloud, CryptoMemory,
CryptoRF, dsPIC, FlashFlex, flexPWR, Heldo, JukeBlox, KEELOQ,
KEELOQ logo, Kleer, LANCheck, LINK MD, maXStylus,
maXTouch, MediaLB, megaAVR, MOST, MOST logo, MPLAB,
OptoLyzer, PIC, picoPower, PICSTART, PIC32 logo, Prochip
Designer, QTouch, RightTouch, SAM-BA, SpyNIC, SST, SST
Logo, SuperFlash, tinyAVR, UNI/O, and XMEGA are registered
trademarks of Microchip Technology Incorporated in the U.S.A.
and other countries.
ClockWorks, The Embedded Control Solutions Company,
EtherSynch, Hyper Speed Control, HyperLight Load, IntelliMOS,
mTouch, Precision Edge, and Quiet-Wire are registered
trademarks of Microchip Technology Incorporated in the U.S.A.
Adjacent Key Suppression, AKS, Analog-for-the-Digital Age, Any
Capacitor, AnyIn, AnyOut, BodyCom, chipKIT, chipKIT logo,
CodeGuard, CryptoAuthentication, CryptoCompanion,
CryptoController, dsPICDEM, dsPICDEM.net, Dynamic Average
Matching, DAM, ECAN, EtherGREEN, In-Circuit Serial
Programming, ICSP, Inter-Chip Connectivity, JitterBlocker,
KleerNet, KleerNet logo, Mindi, MiWi, motorBench, MPASM, MPF,
MPLAB Certified logo, MPLIB, MPLINK, MultiTRAK, NetDetach,
Omniscient Code Generation, PICDEM, PICDEM.net, PICkit,
PICtail, PureSilicon, QMatrix, RightTouch logo, REAL ICE, Ripple
Blocker, SAM-ICE, Serial Quad I/O, SMART-I.S., SQI,
SuperSwitcher, SuperSwitcher II, Total Endurance, TSHARC,
USBCheck, VariSense, ViewSpan, WiperLock, Wireless DNA, and
ZENA are trademarks of Microchip Technology Incorporated in the
U.S.A. and other countries.
SQTP is a service mark of Microchip Technology Incorporated in
the U.S.A.
Microchip received ISO/TS-16949:2009 certification for its worldwide
headquarters, design and wafer fabrication facilities in Chandler and
Tempe, Arizona; Gresham, Oregon and design centers in California
and India. The Company’s quality system processes and procedures
are for its PIC® MCUs and dsPIC® DSCs, KEELOQ® code hopping
devices, Serial EEPROMs, microperipherals, nonvolatile memory and
analog products. In addition, Microchip’s quality system for the design
and manufacture of development systems is ISO 9001:2000 certified.
Silicon Storage Technology is a registered trademark of Microchip
Technology Inc. in other countries.
GestIC is a registered trademark of Microchip Technology
Germany II GmbH & Co. KG, a subsidiary of Microchip Technology
Inc., in other countries.
All other trademarks mentioned herein are property of their
respective companies.
QUALITYꢀMANAGEMENTꢀꢀSYSTEMꢀ
CERTIFIEDꢀBYꢀDNVꢀ
© 2017, Microchip Technology Incorporated, All Rights Reserved.
ISBN: 978-1-5224-2098-9
== ISO/TSꢀ16949ꢀ==ꢀ
2017 Microchip Technology Inc.
DS20005834A-page 23
Worldwide Sales and Service
AMERICAS
ASIA/PACIFIC
ASIA/PACIFIC
EUROPE
Corporate Office
2355 West Chandler Blvd.
Chandler, AZ 85224-6199
Tel: 480-792-7200
Fax: 480-792-7277
Technical Support:
http://www.microchip.com/
support
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China - Xiamen
Tel: 86-592-2388138
Fax: 86-592-2388130
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Tel: 43-7242-2244-39
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Tower 6, The Gateway
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Tel: 86-756-3210040
Fax: 86-756-3210049
Denmark - Copenhagen
Tel: 45-4450-2828
Fax: 45-4485-2829
Hong Kong
Tel: 852-2943-5100
Fax: 852-2401-3431
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Tel: 91-80-3090-4444
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DS20005834A-page 24
2017 Microchip Technology Inc.
11/07/16
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