MIC4129YML-TR [MICROCHIP]
6A BUF OR INV BASED PRPHL DRVR, PDSO8;
| 型号： | MIC4129YML-TR |
| 厂家： | 
MICROCHIP |
| 描述： | 6A BUF OR INV BASED PRPHL DRVR, PDSO8 驱动 CD 光电二极管 接口集成电路 |
| 文件： | 总10页 (文件大小：435K) |
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MIC4120/4129
6A-Peak Low-Side MꢀSfꢁt Driver
Bipolar/CMꢀS/DMꢀS Process
General Descripꢂion
feaꢂures
• CMOS Construction
• Latch-Up Protected: Will Withstand >200mA
Reverse Output Current
MIC4120 and MIC4129 MOSFET drivers are resilient,
efficient, and easy to use. The MIC4129 is an inverting
driver, while the MIC4120 is a non-inverting driver. The
MIC4120 and MIC4129 are improved versions of the
MIC4420 and MIC4429.
• Logic Input Withstands Negative Swing of Up to 5V
• Matched Rise and Fall Times ................................25ns
• High Peak Output Current ............................... 6A Peak
• Wide Operating Range...............................4.5V to 20V
• High Capacitive Load Drive............................10,000pF
• Low Delay Time.............................................. 55ns Typ
• Logic High Input for Any Voltage From 2.4V to VS
• Low Equivalent Input Capacitance (typ)..................6pF
• Low Supply Current...............450µA With Logic 1 Input
• Low Output Impedance ......................................... 2.5Ω
• Output Voltage Swing Within 25mV of Ground or VS
• Exposed backside pad packaging reduces heat
The drivers are capable of 6A (peak) output and can drive
the largest MOSFETs with an improved safe operating
margin. The MIC4120/4129 accept any logic input from
2.4V to VS without external speed-up capacitors or resis-
tor networks. Proprietary circuits allow the input to swing
negative by as much as 5V without damaging the part. Ad-
ditional circuits protect against damage from electrostatic
discharge.
MIC4120/4129 drivers can replace three or more discrete
components, reducing PCB area requirements, simplifying
product design, and reducing assembly cost.
- ePAD SOIC-8L (θ = 58°C/W)
- 3mm x 3mm MLF™-8L (θ = 60°C/W)
JA
JA
Applicaꢂions
• Switch Mode Power Supplies
• Motor Controls
• Pulse Transformer Driver
• Class-D Switching Amplifiers
Modern BiCMOS/DMOS construction guarantees freedom
from latch-up. The rail-to-rail swing capability insures ad-
equate gate voltage to the MOSFET during power up/down
sequencing.
funcꢂional Diagram
VS
MIC4129
INVERTING
0.4mA
0.1mA
OUT
IN
2kΩ
MIC4120
NONINVERTING
GND
MLF is a registered trademark of Amkor Technology, Inc
.
Micrel, Inc. • 2180 Fortune Drive • San Jose, CA 95131 • USA • tel + 1 (408) 944-0800 • fax + 1 (408) 474-1000 • http://www.micrel.com
July 2010
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MIC4120/4129
Micrel, Inc.
Ordering Information
Part Number
MIC4120YME
MIC4120YML
MIC4129YME
MIC4129YML
Package
Configuration
Non-Inverting
Non-Inverting
Inverting
Lead Finish
Pb-Free
Pb-Free
Pb-Free
Pb-Free
EPAD 8-Pin SOIC
8-Pin MLF
EPAD 8-Pin SOIC
8-Pin MLF
Inverting
Pin Configurations
V S
IN
V S
1
2
3
4
8
7
6
5
OUT
OUT
GND
NC
GND
EPAD SOIC-8 (ME)
MLF-8 (ML)
Pin Descripꢂion
Pin Number
Pin Name
Pin Function
Control Input
2
IN
4, 5
1, 8
6, 7
3
GND
VS
Ground: Duplicate pins must be externally connected together
Supply Input: Duplicate pins must be externally connected together
Output: Duplicate pins must be externally connected together
Not connected
OUT
NC
EP
GND
Ground: Backside
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MIC4120/4129
Micrel, Inc.
Absolute Maximum Ratings (Notes 1, 2 and 3)
ꢀperaꢂing Raꢂings
Supply Voltage ...........................................................24V
Supply Voltage .............................................. 4.5V to 20V
Junction Temperature............................–40°C to +125°C
Package Thermal Resistance
Input Voltage ...............................V + 0.3V to GND – 5V
S
Input Current (V > V ) ..........................................50mA
IN
S
Storage Temperature.............................–65°C to +150°C
Lead Temperature (10 sec.) ................................... 300°C
ESD Rating, ꢄoꢂe 4
3x3 MLF™ (q ) ...............................................60°C/W
JA
EPAD SOIC-8 (q ) ..........................................58°C/W
JA
Electrical Characteristics: (TA = 25°C with 4.5V ≤ VS ≤ 20V unless otherwise specified. Note 3.) Input Voltage slew rate
>1V/µs
Symbol
INPUT
VIH
Parameter
Conditions
Min
Typ
Max
Units
Logic 1 Input Voltage
Logic 0 Input Voltage
Input Voltage Range
Input Current
2.4
1.9
1.5
V
V
VIL
0.8
VS + 0.3
10
VIN
–5
V
IIN
0 V ≤ VIN ≤ VS
–10
µA
OUTPUT
VOH
High Output Voltage
Low Output Voltage
See Figure 1
VS–0.025
V
V
Ω
VOL
See Figure 1
0.025
5
RO
Output Resistance,
Output Low
IOUT = 10 mA, VS = 20 V
1.4
1.5
6
RO
Output Resistance,
Output High
IOUT = 10 mA, VS = 20 V
VS = 20 V (See Figure 6)
5
Ω
IPK
IR
Peak Output Current
A
Latch-Up Protection
200
mA
Withstand Reverse Current
SꢃItChIꢄG tIMꢁ
tR
Rise Time
Test Figure 1, CL = 2200 pF
Test Figure 1, CL = 2200 pF
Test Figure 1
12
13
45
50
30
35
ns
ns
tF
Fall Time
30
35
ns
ns
tD1
tD2
Delay Time
Delay Time
75
100
ns
ns
Test Figure 1
75
ns
100
ns
POWER SUPPLY
IS
Power Supply Current
VIN = 3 V
VIN = 0 V
0.45
60
3
400
mA
µA
VS
Operating Input Voltage
4.5
20
V
Notes:
1. Functional operation above the absolute maximum stress ratings is not implied.
2. Static-sensitive device. Store only in conductive containers. Handling personnel and equipment should be grounded to prevent
damage from static discharge.
3. Specification for packaged product only.
4. Devices are ESD sensitive. Handling precautions recommended. Human body model: 1.5kΩ in series with 100pF.
July 2010
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MIC4120/4129
Micrel, Inc.
tesꢂ Circuiꢂs
VS = 20V
VS = 20V
0.1µF
1.0µF
0.1µF
0.1µF
1.0µF
0.1µF
IN
OUT
2200pF
IN
OUT
2200pF
MIC4129
MIC4120
5V
90%
5V
90%
2.5V
2.5V
INPUT
INPUT
10%
0V
10%
0V
tPW
tPW
tD1
tF
tR
tD2
tD1
tF
tD2
tR
VS
VS
90%
90%
OUTPUT
OUTPUT
10%
0V
10%
0V
Figure 1. Inverting Driver Switching Time
Figure 2. Non-inverting Driver Switching Time
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Micrel, Inc.
Typical Characteristics
Delay Time
vs . Input Voltage
R is e Time
Fall Time
60
50
40
30
20
10
0
60
60
50
40
30
20
10
0
10000pF
50
40
td2
td1
10000pF
4700pF
30
4700pF
20
2200pF
2200pF
10
10
0
5
10
15
20
5
10
15
20
5
15
20
INPUT VOLTAGE (V)
INPUT VOLTAGE (V)
INPUT VOLTAGE (V)
Output R es is tance
vs . S upply Voltage
3.0
2.5
2.0
1.5
1.0
0.5
0
Output High
Output Low
5
10
15
20
SUPPLY VOLTAGE (V)
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MIC4120/4129
Micrel, Inc.
Grounding
Applications Information
The high current capability of the MIC4120/4129 demands
careful PC board layout for best performance. Since the
MIC4129 is an inverting driver, any ground lead impedance
will appear as negative feedback which can degrade switch-
ing speed. Feedback is especially noticeable with slow-rise
time inputs.
Supply Bypassing
Charging and discharging large capacitive loads quickly
requires large currents. For example, charging a 2500pF
load to 18V in 25ns requires a 1.8 A current from the device
power supply.
Figure 3 shows the feedback effect in detail.As the MIC4129
input begins to go positive, the output goes negative and
several amperes of current flow in the ground lead. As little
as 0.05Ω of PC trace resistance can produce hundreds of
millivolts at the MIC4129 ground pins. If the driving logic is
referenced to power ground, the effective logic input level is
reduced and oscillation may result.
The MIC4120/4129 has double bonding on the supply pins,
the ground pins and output pins This reduces parasitic lead
inductance. Low inductance enables large currents to be
switched rapidly. It also reduces internal ringing that can
cause voltage breakdown when the driver is operated at or
near the maximum rated voltage.
Internal ringing can also cause output oscillation due to
feedback. This feedback is added to the input signal since it
is referenced to the same ground.
To insure optimum performance, separate ground traces
shouldbeprovidedforthelogicandpowerconnections. Con-
necting the logic ground directly to the MIC4129 GND pins
will ensure full logic drive to the input and ensure fast output
switching. Both of the MIC4129 GND pins should, however,
still be connected to power ground.
To guarantee low supply impedance over a wide frequency
range, a parallel capacitor combination is recommended
for supply bypassing. Low inductance ceramic capacitors
should be used.A1µF low ESR film capacitor in parallel with
two 0.1 µF low ESR ceramic capacitors provide adequate
bypassing. Connect one ceramic capacitor directly between
pins 1 and 4. Connect the second ceramic capacitor directly
between pins 8 and 5.
The E-Pad and MLF packages have an exposed pad under
thepackage. It'simportantforgoodthermalperformancethat
this pad is connected to a ground plane.
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MIC4120/4129
Micrel, Inc.
can easily be exceeded. Therefore, some attention should
be given to power dissipation when driving low impedance
loads and/or operating at high frequency.
Inpuꢂ Sꢂage
The input voltage level of the 4129 changes the quiescent
supplycurrent.TheNchannelMOSFETinputstagetransistor
drives a 450µAcurrent source load. With a logic “1” input, the
maximum quiescent supply current is 450µA. Logic “0” input
level signals reduce quiescent current to 55µA maximum.
Thesupplycurrentvsfrequencyandsupplycurrentvscapaci-
tive load characteristic curves aid in determining power dissi-
pation calculations. Table 1 lists the maximum safe operating
frequency for several power supply voltages when driving a
2500pF load. More accurate power dissipation figures can
be obtained by summing the three dissipation sources.
The MIC4120/4129 input is designed to provide hysteresis.
This provides clean transitions, reduces noise sensitivity,
and minimizes output stage current spiking when changing
states. Input voltage threshold level is approximately 1.5V,
making the device TTL compatible over the 4.5V to 20V
operating supply voltage range. Input current is less than
10µA over this range.
Given the power dissipation in the device, and the thermal
resistance of the package, junction operating temperature
for any ambient is easy to calculate. For example, the ther-
mal resistance of the 8-pin EPAD MSOP package, from the
data sheet, is 60°C/W. In a 25°C ambient, then, using a
maximum junction temperature of 150°C, this package will
dissipate 2W.
TheMIC4129canbedirectlydrivenbytheMIC9130,MIC3808,
MIC38HC42andsimilarswitchmodepowersupply.Byoffload-
ing the power-driving duties to the MIC4120/4129, the power
supply controller can operate at lower dissipation. This can
improve performance and reliability.
Accuratepowerdissipationnumberscanbeobtainedbytotal-
ing the three sources of power dissipation in the device:
+
Theinputcanbegreaterthanthe VS supply,however,current
• Load Power Dissipation (P )
• Quiescent power dissipation (P )
• Transition power dissipation (P )
L
will flow into the input lead. The propagation delay for T
will increase to as much as 400ns at room temperature. The
input currents can be as high as 30mA p-p (6.4mA
the input, 6 V greater than the supply voltage. No damage
will occur to MIC4120/4129 however, and it will not latch.
D2
Q
T
) with
RMS
Calculation of load power dissipation differs depending upon
whether the load is capacitive, resistive or inductive.
Resisꢂive Load Power Dissipaꢂion
Theinputappearsasa7pFcapacitance,anddoesnotchange
even if the input is driven from anAC source. Care should be
taken so that the input does not go more than 5 volts below
the negative rail.
Dissipation caused by a resistive load can be calculated
as:
2
P = I R D
L
O
Power Dissipaꢂion
where:
CMOS circuits usually permit the user to ignore power dis-
sipation. Logic families such as 4000 and 74C have outputs
whichcanonlysupplyafewmilliamperesofcurrent,andeven
shorting outputs-to-ground will not force enough current to
destroy the device. The MIC4120/4129, on the other hand,
cansourceorsinkseveralamperesanddrivelargecapacitive
loads at high frequency. The package power dissipation limit
I = the current drawn by the load
R = the output resistance of the driver when the output
O
is high, at the power supply voltage used. (See data
sheet)
D = fraction of time the load is conducting (duty cycle)
+18 V
WIMA
MK22
1 µF
Table 1: MIC4129 Maximum
5.0V
18 V
1
T EK C UR R EN T
PROBE 6302
ꢀperaꢂing frequency
8
6, 7
MIC4121
V
Max Frequency
1Mhz
S
0 V
5
0 V
0.1µF
0.1µF
4
20V
15V
10V
2,500 pF
POLYCARBONATE
1.5MHz
LOGIC
GROUND
6 AMPS
3.5MHz
POWER
GROUND
Conditions:
T = 25°C, 3. C = 2500pF
A L
PC TRACE RESISTANCE = 0.05 Ω
Figure 3. Switching Time Degradation Due to
ꢄegaꢂive feedback
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MIC4120/4129
Micrel, Inc.
Capaciꢂive Load Power Dissipaꢂion
transiꢂion Power Dissipaꢂion
Dissipation caused by a capacitive load is simply the energy
placed in, or removed from, the load capacitance by the
driver. The energy stored in a capacitor is described by the
equation:
Transition power is dissipated in the driver each time its out-
put changes state, because during the transition, for a very
brief interval, both the N- and P-channel MOSFETs in the
output totem-pole are ON simultaneously, and a current is
+
conducted through them from V to ground. The transition
S
2
E = 1/2 C V
power dissipation is approximately:
Asthisenergyislostinthedrivereachtimetheloadischarged
or discharged, for power dissipation calculations the 1/2 is
removed. This equation also shows that it is good practice
not to place more voltage on the capacitor than is necessary,
as dissipation increases as the square of the voltage applied
to the capacitor. For a driver with a capacitive load:
P = 2 f V (A•s)
T
S
where (A•s) is a time-current factor derived from the typical
characteristic curves.
Total power (P ) then, as previously described is:
D
P = P + P +P
2
D
L
Q
T
P = f C (V )
L
S
Definitions
where:
C = Load Capacitance in Farads.
L
f = Operating Frequency
C = Load Capacitance
D = Duty Cycle expressed as the fraction of time the
input to the driver is high.
V =Driver Supply Voltage
S
Inducꢂive Load Power Dissipaꢂion
f = Operating Frequency of the driver in Hertz.
For inductive loads the situation is more complicated. For
the part of the cycle in which the driver is actively forcing
current into the inductor, the situation is the same as it is in
the resistive case:
I = Power supply current drawn by a driver when both
H
inputs are high and neither output is loaded.
I = Power supply current drawn by a driver when both
L
inputs are low and neither output is loaded.
2
P
= I R D
L1
O
I = Output current from a driver in Amps.
D
However, in this instance the R required may be either
O
P = Total power dissipated in a driver in Watts.
the on resistance of the driver when its output is in the high
state, or its on resistance when the driver is in the low state,
depending on how the inductor is connected, and this is still
only half the story. For the part of the cycle when the induc-
tor is forcing current through the driver, dissipation is best
described as
D
P = Power dissipated in the driver due to the driver’s
L
load in Watts.
P = Power dissipated in a quiescent driver in Watts.
Q
P = Power dissipated in a driver when the output
T
P
= I V (1-D)
D
changes states (“shoot-through current”) in Watts.
NOTE: The “shoot-through” current from a dual
transition (once up, once down) for both drivers
is shown by the "Typical Characteristic Curve":
Crossover Area vs. Supply Voltage and is in am-
pere-seconds. This figure must be multiplied by
the number of repetitions per second (frequency)
to find Watts.
L2
where V is the forward drop of the clamp diode in the driver
D
(generally around 0.7V). The two parts of the load dissipation
must be summed in to produce P
L
P = P + P
L2
L
L1
Quiescenꢂ Power Dissipaꢂion
Quiescent power dissipation (P , as described in the input
Q
R = Output resistance of a driver in Ohms.
O
section) depends on whether the input is high or low. A low
input will result in a maximum current drain (per driver) of
≤0.2mA; a logic high will result in a current drain of ≤2.0mA.
Quiescent power can therefore be found from:
V = Power supply voltage to the IC in Volts.
S
P = V [D I + (1-D) I ]
Q
S
H
L
where:
I = quiescent current with input high
H
I = quiescent current with input low
L
D = fraction of time input is high (duty cycle)
V = power supply voltage
S
M9999-072010
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July 2010
MIC4120/4129
Micrel, Inc.
+18 V
WIMA
MK22
1 µF
5.0V
18 V
1
T EK C UR R EN T
PROBE 6302
8
2
6, 7
MIC4129
0 V
5
0 V
0.1µF
0.1µF
4
10,000 pF
POLYCARBONATE
figure 4. Peak ꢀuꢂpuꢂ Currenꢂ tesꢂ Circuiꢂ
July 2010
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MIC4120/4129
Micrel, Inc.
Package Information
8-Pin 3x3 MLF (ML)
8-Pin Exposed Pad SOIC (ME)
MICREL INC. 2180 FORTUNE DRIVE SAN JOSE, CA 95131 USA
tel + 1 (408) 944-0800 fax + 1 (408) 474-1000 web http://www.micrel.com
This information furnished by Micrel in this data sheet is believed to be accurate and reliable. However no responsibility is assumed by Micrel for its use.
Micrel reserves the right to change circuitry and specifications at any time without notification to the customer.
Micrel Products are not designed or authorized for use as components in life support appliances, devices or systems where malfunction of a product can
reasonably be expected to result in personal injury. Life support devices or systems are devices or systems that (a) are intended for surgical implant into
the body or (b) support or sustain life, and whose failure to perform can be reasonably expected to result in a significant injury to the user. A Purchaser's
use or sale of Micrel Products for use in life support appliances, devices or systems is a Purchaser's own risk and Purchaser agrees to fully indemnify
Micrel for any damages resulting from such use or sale.
© 2004 Micrel Incorporated
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