MIC5201-3.0YM-TR [MICROCHIP]
3V FIXED POSITIVE LDO REGULATOR, 0.4V DROPOUT, PDSO8;
| 型号： | MIC5201-3.0YM-TR |
| 厂家： | 
MICROCHIP |
| 描述： | 3V FIXED POSITIVE LDO REGULATOR, 0.4V DROPOUT, PDSO8 光电二极管 输出元件 调节器 |
| 文件： | 总24页 (文件大小：1048K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
MIC5201
200 mA Low Dropout Regulator
Features
General Description
• High Output Voltage Accuracy
• Variety of Output Voltages
The MIC5201 is an efficient linear voltage regulator
with very low dropout voltage (typically 17 mV at light
loads and 200 mV at 100 mA), and very low ground
current (1 mA at 100 mA output), offering better than
1% initial accuracy with a logic compatible on-off
switching input.
• Guaranteed 200 mA Output
• Low Quiescent Current
• Low Dropout Voltage
• Extremely Tight Load and Line Regulation
• Very Low Temperature Coefficient
• Current and Thermal Limiting
• Reversed-Battery Protection
Designed especially for hand-held battery powered
devices, the MIC5201 can be switched by a CMOS or
TTL compatible enable signal. This enable control may
be connected directly to VIN if unneeded. When
disabled, power consumption drops nearly to zero. The
ground current of the MIC5201 increases only slightly
in dropout, further prolonging battery life. Key MIC5201
features include current limiting, overtemperature
shutdown, and protection against reversed battery.
• Load-Dump Protection (Fixed Voltage Versions)
• Zero Off-Mode Current
• Logic-Controlled Electronic Enable
• Available in SOIC-8 and SOT-223 Packages
The MIC5201 is available in several fixed voltages and
accuracy configurations. It features the same pinout as
the LT1121 with better performance. Other options are
available; contact Microchip for details.
Applications
• Cellular Telephones
• Laptop, Notebook, and Palmtop Computers
• Battery Powered Equipment
• PCMCIA VCC and VPP Regulation/Switching
• Barcode Scanners
• SMPS Post-Regulator and DC/DC Modules
• High-Efficiency Linear Power Supplies
Package Types
MIC5201 (FIXED)
MIC5201 (ADJ.)
8-Lead SOIC (M)
8-Lead SOIC (M)
1
2
3
4
8
7
6
5
OUT
ADJ
GND
NC
IN
1
2
3
4
8
7
6
5
OUT
NC
IN
NC
NC
EN
NC
NC
EN
GND
NC
MIC5201 (FIXED)
SOT-223 (S)
GND
TAB
1
2
3
IN
GND OUT
2017 Microchip Technology Inc.
DS20005718A-page 1
MIC5201
Typical Application Circuit
MIC5201
ENABLE
SHUTDOWN
MIC5201-3.3
VOUT
3.3V
IN
EN
OUT
GND
1μF
Functional Diagrams
FIXED REGULATOR
(SOT-223 VERSION ONLY)
OUT
IN
VOUT
COUT
VIN
Bandgap
Ref.
Current-Limit
Thermal Shutdown
MIC5201-x.xYS
GND
FIXED REGULATOR
OUT
IN
VOUT
COUT
VIN
Bandgap
Ref.
EN
Current-Limit
Thermal Shutdown
MIC5201-x.xYM
GND
ADJUSTABLE REGULATOR
OUT
IN
VOUT
COUT
VIN
R1
R2
ADJ
Bandgap
Ref.
EN
Current-Limit
Thermal Shutdown
MIC5201YM [adj.]
GND
DS20005718A-page 2
2017 Microchip Technology Inc.
MIC5201
1.0
ELECTRICAL CHARACTERISTICS
Absolute Maximum Ratings †
Supply Input Voltage (VIN) Fixed................................................................................................................. –20V to +60V
Supply Input Voltage (VIN) Adjustable......................................................................................................... –20V to +20V
Enable Input Voltage (VEN) Fixed ............................................................................................................... –20V to +60V
Enable Input Voltage (VEN) Adjustable ....................................................................................................... –20V to +20V
Power Dissipation (Note 1) ....................................................................................................................Internally Limited
Operating Ratings ‡
Supply Input Voltage (VIN) Fixed................................................................................................................ +2.5V to +26V
Supply Input Voltage (VIN) Adjustable........................................................................................................ +2.5V to +16V
Enable Input Voltage (VEN) .................................................................................................................................0V to VIN
† Notice: Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to the device.
This is a stress rating only and functional operation of the device at those or any other conditions above those indicated
in the operational sections of this specification is not intended. Exposure to maximum rating conditions for extended
periods may affect device reliability.
‡ Notice: The device is not guaranteed to function outside its operating ratings.
Note 1: The maximum allowable power dissipation is a function of the maximum junction temperature, TJ(max), the
junction-to-ambient thermal resistance, θJA, and the ambient temperature, TA. The maximum allowable
power dissipation at any ambient temperature is calculated using: P(max) = (TJ(max) – TA) ÷ θJA. Exceeding
the maximum allowable power dissipation will result in excessive die temperature, and the regulator will go
into thermal shutdown.
2017 Microchip Technology Inc.
DS20005718A-page 3
MIC5201
TABLE 1-1:
ELECTRICAL CHARACTERISTICS (Note 1)
Electrical Characteristics: VIN = VOUT + 1V; IL = 100 μA; CL = 3.3 μF; VEN ≥ 2.0V; TJ = +25°C, bold values indicate
–40°C ≤ TJ ≤ +85°C; unless noted.
Parameter
Symbol
Min.
Typ.
Max.
Units
Conditions
–1
—
—
1
Output Voltage Accuracy
VO
%
Variation from specified VOUT
–2
2
Output Voltage
Temperature Coefficient
∆VO/∆T
—
40
150
ppm/°C Note 2
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
0.004
—
0.20
0.40
0.20
0.40
0.16
0.30
—
Line Regulation, Fixed
∆VO/∆VO
%
%
%
VIN = VOUT + 1V to 26V
0.004
—
Line Regulation,
Adjustable
∆VO/∆VO
∆VO/∆VO
VIN = VOUT + 1V to 16V
0.04
—
Load Regulation
IL = 0.1 mA to 200 mA, Note 3
17
IL = 100 µA
IL = 20 mA
130
180
225
270
0.01
130
270
500
1000
3000
75
—
Dropout Voltage, Note 4
Quiescent Current
Ground Pin Current
Ripple Rejection
VIN – VO
—
mV
µA
µA
IL = 50 mA
—
IL = 100 mA
IL = 200 mA
VENABLE ≤ 0.7V (shutdown)
IL = 100 µA
IL = 20 mA
400
—
IGND
—
400
—
IGND
IL = 50 mA
2000
—
IL = 100 mA
IL = 200 mA
—
PSRR
—
dB
µA
Ground Pin Current at
Dropout
VIN = 0.5V less than specified VOUT,
IGDNDO
—
270
330
IL = 100 µA, Note 5
VOUT = 0V
Note 6
Current Limit
ILIMIT
∆VO/∆PD
en
—
—
—
280
0.05
100
500
—
mA
%/W
µV
Thermal Regulation
Output Noise
—
—
Enable Input
Input Voltage Level
Input Voltage Level
Enable Input Current
Enable Input Current
VIL
VIH
IIL
—
2.0
—
—
—
0.7
—
1
V
V
Logic-low (off)
Logic-high (on)
VIL ≤ 0.7V
0.01
15
µA
µA
IIH
—
50
VIH ≤ 2.0V
DS20005718A-page 4
2017 Microchip Technology Inc.
MIC5201
TABLE 1-1:
ELECTRICAL CHARACTERISTICS (Note 1) (CONTINUED)
Electrical Characteristics: VIN = VOUT + 1V; IL = 100 μA; CL = 3.3 μF; VEN ≥ 2.0V; TJ = +25°C, bold values indicate
–40°C ≤ TJ ≤ +85°C; unless noted.
Parameter
Symbol
Min.
Typ.
Max.
Units
Conditions
Reference (MIC5201 Adjustable Version Only)
1.223
1.242
—
1.255
Reference Voltage
VREF
V
—
—
1.217
1.267
Reference Voltage
Temperature Coefficient
∆VREF/∆T
—
20
—
ppm/°C
Note 1: Specification for packaged product only. Devices are ESD sensitive. Handling precautions recommended.
2: Output voltage temperature coefficient is defined as the worst-case voltage change divided by the total
temperature range.
3: Regulation is measured at constant junction temperature using low duty cycle pulse testing. Parts are
tested for load regulation in the load range from 0.1 mA to 200 mA. Changes in output voltage due to heat-
ing effects are covered by the thermal regulation specification.
4: Dropout Voltage is defined as the input to output differential at which the output voltage drops 2% below its
nominal value measured at 1V differential.
5: Ground pin current is the regulator quiescent current plus pass transistor base current. The total current
drawn from the supply is the sum of the load current plus the ground pin current.
6: Thermal regulation is defined as the change in output voltage at a time “t” after a change in power dissipa-
tion is applied, excluding load or line regulation effects. Specifications are for a 200 mA load pulse at VIN
26V for fixed and VIN = 16V for adjustable at t = 10 ms.
=
2017 Microchip Technology Inc.
DS20005718A-page 5
MIC5201
TEMPERATURE SPECIFICATIONS (Note 1)
Parameters
Temperature Ranges
Sym.
Min.
Typ.
Max.
Units
Conditions
Storage Temperature Range
Lead Temperature
TJ
—
–40
—
—
—
+125
+260
°C
°C
—
Soldering, 5 sec.
Package Thermal Resistance
θJC
θJA
—
—
15
62
—
—
See Thermal
°C/W Considerations Layout
for more information.
Thermal Resistance SOT-223
Thermal Resistance 8-Ld SOIC
See Thermal
°C/W Considerations Layout
for more information.
θJA
—
160
—
Note 1: The maximum allowable power dissipation is a function of ambient temperature, the maximum allowable
junction temperature and the thermal resistance from junction to air (i.e., TA, TJ, JA). Exceeding the
maximum allowable power dissipation will cause the device operating junction temperature to exceed the
maximum +125°C rating. Sustained junction temperatures above +125°C can impact the device reliability.
DS20005718A-page 6
2017 Microchip Technology Inc.
MIC5201
2.0
TYPICAL PERFORMANCE CURVES
Note: The graphs and tables provided following this note are a statistical summary based on a limited number of
samples and are provided for informational purposes only. The performance characteristics listed herein
are not tested or guaranteed. In some graphs or tables, the data presented may be outside the specified
operating range (e.g., outside specified power supply range) and therefore outside the warranted range.
FIGURE 2-4:
Current.
Ground Current vs. Output
FIGURE 2-1:
Current.
Dropout Voltage vs. Output
FIGURE 2-5:
Voltage.
Ground Current vs. Supply
FIGURE 2-2:
Temperature.
Dropout Voltage vs.
FIGURE 2-6:
Current.
Output Voltage vs. Output
FIGURE 2-3:
Dropout Characteristics.
2017 Microchip Technology Inc.
DS20005718A-page 7
MIC5201
FIGURE 2-10:
Temperature (3.3V Version).
Output Voltage vs.
FIGURE 2-7:
Temperature.
Ground Current vs.
FIGURE 2-11:
Temperature.
Output Current vs.
FIGURE 2-8:
Temperature.
Ground Current vs.
FIGURE 2-12:
Temperature.
Minimum Input Voltage vs.
FIGURE 2-9:
Version).
Thermal Regulation (3.3V
DS20005718A-page 8
2017 Microchip Technology Inc.
MIC5201
FIGURE 2-16:
Voltage (3.3V Version).
Supply Current vs. Supply
FIGURE 2-13:
Input Voltage.
Short-Circuit Current vs.
FIGURE 2-17:
Line Transient.
FIGURE 2-14:
Load Transient.
FIGURE 2-18:
Line Transient.
FIGURE 2-15:
Load Transient.
2017 Microchip Technology Inc.
DS20005718A-page 9
MIC5201
FIGURE 2-22:
Output Impedance.
FIGURE 2-19:
Supply Current vs. Supply
Voltage (3.3V Version).
FIGURE 2-23:
Enable Current Threshold
FIGURE 2-20:
Enable Transient (3.3V
vs. Temperature.
Version).
FIGURE 2-24:
Enable Voltage Threshold
FIGURE 2-21:
Enable Transient (3.3V
vs. Temperature.
Version).
DS20005718A-page 10
2017 Microchip Technology Inc.
MIC5201
FIGURE 2-25:
FIGURE 2-26:
FIGURE 2-27:
Ripple vs. Frequency.
Ripple vs. Frequency.
Ripple vs. Frequency.
2017 Microchip Technology Inc.
DS20005718A-page 11
MIC5201
3.0
PIN DESCRIPTIONS
The descriptions of the pins are listed in Table 3-1.
TABLE 3-1:
PIN FUNCTION TABLE
Pin Number
Pin Number Pin Number
SOT-223
SOIC-8
(Fixed)
Pin Name
Description
SOIC-8 (Adj.)
3
1
2
1
—
OUT
ADJ
NC
Regulated output.
—
—
Feedback input. Adjustable version only.
4, 6, 7
2, 4, 6, 7
Not internally connected. Connect to ground plane for
lowest thermal resistance.
2
3
5
3
5
GND
EN
Ground.
—
Enable (input): TTL-compatible input. High = enable.
Low or open = off/disable.
1
8
8
VIN
Unregulated supply input.
DS20005718A-page 12
2017 Microchip Technology Inc.
MIC5201
4.3
Noise Reduction Capacitors
4.0
APPLICATIONS INFORMATION
On adjustable devices, a capacitor from ADJ to GND
will decrease high-frequency noise on the output. See
Figure 4-3.
Figure 4-1 shows a basic fixed-voltage application with
the unused enable input connected to VIN.
MIC5201-x.xYM
MIC5201-x.xYS
MIC5201YM
VIN
VOUT
1μF
VIN
VOUT
IN
OUT
IN
OUT
ADJ
EN
R1
R2
EN
GND
3.3μF
GND
CADJ
FIGURE 4-1:
Fixed Application.
FIGURE 4-3:
Decreasing Output Noise.
Adjustable regulators require two resistors to set the
output voltage. See Figure 4-2.
4.4
Minimum Load
The MIC5201 will remain stable and in regulation with
no load unlike many other voltage regulators. This is
especially important in CMOS RAM keep-alive
applications.
MIC5201YM
VIN
VOUT
IN
OUT
ADJ
R1
R2
EN
GND
3.3μF
4.5
Dual-Supply Systems
R1
R2
VOUT = 1.242V x
(1+
)
When used in dual supply systems where the regulator
load is returned to a negative supply, the output voltage
must be diode clamped to ground.
FIGURE 4-2:
Adjustable Application.
Resistor values are not critical because ADJ (adjust)
has a high impedance, but for best results use resistors
of 470 kΩ or less.
4.6
Thermal Considerations Layout
The MIC5201-x.xYM (8-pin surface mount package)
has the following thermal characteristics when
mounted on a single layer copper-clad printed circuit
board.
4.1
Output Capacitors
A 1 μF capacitor is recommended between the
MIC5201 output and ground to prevent oscillations due
to instability. Larger values serve to improve the
regulator’s transient response. Most types of tantalum
or aluminum electrolytics will be adequate; film types
will work, but are costly and therefore not
recommended. Many aluminum electrolytics have
electrolytes that freeze at about –30°C, so solid
tantalums are recommended for operation below
–25°C. The important parameters of the capacitor are
an effective series resistance of about 5Ω or less and a
resonant frequency above 500 kHz. The value of this
capacitor may be increased without limit.
TABLE 4-1:
THERMAL
CHARACTERISTICS
PCB Dielectric
FR4
Ceramic
θJA
160ºC/W
120ºC/W
Multilayer boards having a ground plane, wide traces
near the pads, and large supply bus lines provide better
thermal conductivity.
The “worst case” value of 160°C/W assumes no ground
plane, minimum trace widths, and a FR4 material
board.
At lower values of output current, less output
capacitance is required for output stability. The
capacitor can be reduced to 0.47 μF for current below
10 mA or 0.33 μF for currents below 1 mA.
4.7
Nominal Power Dissipation and
Die Temperature
4.2
Input Capacitors
The MIC5201-x.xYM at a +25°C ambient temperature
will operate reliably at up to 625 mW power dissipation
when mounted in the “worst case” manner described
above. At an ambient temperature of +55°C, the device
may safely dissipate 440 mW. These power levels are
equivalent to a die temperature of +125°C, the
recommended maximum temperature for non-military
grade silicon integrated circuits.
A 1 μF capacitor should be placed from the MIC5201
input to ground if there is more than 10 inches of wire
between the input and the AC filter capacitor or if a
battery is used as the input.
2017 Microchip Technology Inc.
DS20005718A-page 13
MIC5201
For MIC5201-x.xYS (SOT-223 package) heat sink
characteristics, please refer to Application Hint 17, P.C.
Board Heat Sinking.
50 mm
245 mm
150 mm
30 mm
50 mm
FIGURE 4-4:
Minimum Recommended
SOIC-8 PCB Pads Size.
DS20005718A-page 14
2017 Microchip Technology Inc.
MIC5201
5.0
5.1
PACKAGING INFORMATION
Package Marking Information
8-Pin SOIC*
Example
XXXX
XXXX
5201
33YM
8943C
WNNNC
3-Pin TO-223*
Example
XXXX
XXXXNNNP
5021
48YS235P
Legend: XX...X Product code or customer-specific information
Y
Year code (last digit of calendar year)
YY
WW
NNN
Year code (last 2 digits of calendar year)
Week code (week of January 1 is week ‘01’)
Alphanumeric traceability code
Pb-free JEDEC® designator for Matte Tin (Sn)
This package is Pb-free. The Pb-free JEDEC designator (
can be found on the outer packaging for this package.
e
3
*
)
e
3
●, ▲, ▼ Pin one index is identified by a dot, delta up, or delta down (triangle
mark).
Note: In the event the full Microchip part number cannot be marked on one line, it will
be carried over to the next line, thus limiting the number of available
characters for customer-specific information. Package may or may not include
the corporate logo.
Underbar (_) and/or Overbar (⎯) symbol may not be to scale.
2017 Microchip Technology Inc.
DS20005718A-page 15
MIC5201
8-Lead SOIC Package Outline and Recommended Land Pattern
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging.
DS20005718A-page 16
2017 Microchip Technology Inc.
MIC5201
3-Lead TO-223 Package Outline and Recommended Land Pattern
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging.
2017 Microchip Technology Inc.
DS20005718A-page 17
MIC5201
NOTES:
DS20005718A-page 18
2017 Microchip Technology Inc.
MIC5201
APPENDIX A: REVISION HISTORY
Revision A (February 2017)
• Converted Micrel document MIC5201 to Micro-
chip data sheet DS20005718A.
• Minor text changes throughout.
• Removed all reference to discontinued leaded
parts.
• Added θJA value for SOT-223 package in Tem-
perature Specifications section.
2017 Microchip Technology Inc.
DS20005718A-page 19
MIC5201
NOTES:
DS20005718A-page 20
2017 Microchip Technology Inc.
MIC5201
PRODUCT IDENTIFICATION SYSTEM
To order or obtain information, e.g., on pricing or delivery, contact your local Microchip representative or sales office.
Examples:
–
PART NO.
Device
–
X
X
XX
X.X
a) MIC5201YM:
200 mA Low Dropout Regulator
Adjustable Voltage, 8-Lead
SOIC, –40°C to +125°C
Junction Temperature Range,
95/Tube
Media Type
Junction Package
Voltage
Temperature Range
Device:
MIC5201:
200 mA Low Dropout Regulator
b) MIC5201-3.0YM-TR:
c) MIC5201-3.3YM:
d) MIC5201-5.0YM-TR:
e) MIC5201-3.0YS:
f) MIC5201-3.3YS-TR:
g) MIC5201-4.8YS:
h) MIC5201-5.0YS-TR:
200 mA Low Dropout Regulator
3.0V Voltage, 8-Lead SOIC,
–40°C to +125°C Junction
Temperature Range,
Voltage:
(blank) = Adjustable (M package only)
3.0
3.3
4.8
5.0
=
=
=
=
3.0V
3.3V
4.8V (S package only)
5.0V
2,500/Reel
200 mA Low Dropout Regulator
3.3V Voltage, 8-Lead SOIC,
–40°C to +125°C Junction
Temperature Range,
Junction
Temperature
Range:
Y
=
–40°C to +125°C
95/Tube
200 mA Low Dropout Regulator
5.0V Voltage, 8-Lead SOIC,
–40°C to +125°C Junction
Temperature Range,
Package:
M
S
=
=
8-Lead SOIC
3-Lead SOT-223
2,500/Reel
Media Type:
TR
=
2,500/Reel
(blank)= 95/Tube for M Package
(blank)= 78/Tube for S Package
200 mA Low Dropout Regulator
3.0V Voltage, 3-Lead SOT-223,
–40°C to +125°C Junction
Temperature Range,
78/Tube
200 mA Low Dropout Regulator
3.3V Voltage, 3-Lead SOT-223,
–40°C to +125°C Junction
Temperature Range,
2,500/Reel
200 mA Low Dropout Regulator
4.8V Voltage, 3-Lead SOT-223,
–40°C to +125°C Junction
Temperature Range,
78/Tube
200 mA Low Dropout Regulator
5.0V Voltage, 3-Lead SOT-223,
–40°C to +125°C Junction
Temperature Range,
2,500/Reel
Note 1:
Tape and Reel identifier only appears in the
catalog part number description. This identifier is
used for ordering purposes and is not printed on
the device package. Check with your Microchip
Sales Office for package availability with the
Tape and Reel option.
2017 Microchip Technology Inc.
DS20005718A-page 21
MIC5201
NOTES:
DS20005718A-page 22
2017 Microchip Technology Inc.
Note the following details of the code protection feature on Microchip devices:
•
Microchip products meet the specification contained in their particular Microchip Data Sheet.
•
Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the
intended manner and under normal conditions.
•
There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our
knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data
Sheets. Most likely, the person doing so is engaged in theft of intellectual property.
•
•
Microchip is willing to work with the customer who is concerned about the integrity of their code.
Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not
mean that we are guaranteeing the product as “unbreakable.”
Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our
products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts
allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act.
Information contained in this publication regarding device
applications and the like is provided only for your convenience
and may be superseded by updates. It is your responsibility to
ensure that your application meets with your specifications.
MICROCHIP MAKES NO REPRESENTATIONS OR
WARRANTIES OF ANY KIND WHETHER EXPRESS OR
IMPLIED, WRITTEN OR ORAL, STATUTORY OR
OTHERWISE, RELATED TO THE INFORMATION,
INCLUDING BUT NOT LIMITED TO ITS CONDITION,
QUALITY, PERFORMANCE, MERCHANTABILITY OR
FITNESS FOR PURPOSE. Microchip disclaims all liability
arising from this information and its use. Use of Microchip
devices in life support and/or safety applications is entirely at
the buyer’s risk, and the buyer agrees to defend, indemnify and
hold harmless Microchip from any and all damages, claims,
suits, or expenses resulting from such use. No licenses are
conveyed, implicitly or otherwise, under any Microchip
intellectual property rights unless otherwise stated.
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The Microchip name and logo, the Microchip logo, AnyRate, AVR,
AVR logo, AVR Freaks, BeaconThings, BitCloud, CryptoMemory,
CryptoRF, dsPIC, FlashFlex, flexPWR, Heldo, JukeBlox, KEELOQ,
KEELOQ logo, Kleer, LANCheck, LINK MD, maXStylus,
maXTouch, MediaLB, megaAVR, MOST, MOST logo, MPLAB,
OptoLyzer, PIC, picoPower, PICSTART, PIC32 logo, Prochip
Designer, QTouch, RightTouch, SAM-BA, SpyNIC, SST, SST
Logo, SuperFlash, tinyAVR, UNI/O, and XMEGA are registered
trademarks of Microchip Technology Incorporated in the U.S.A.
and other countries.
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trademarks of Microchip Technology Incorporated in the U.S.A.
Adjacent Key Suppression, AKS, Analog-for-the-Digital Age, Any
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CryptoController, dsPICDEM, dsPICDEM.net, Dynamic Average
Matching, DAM, ECAN, EtherGREEN, In-Circuit Serial
Programming, ICSP, Inter-Chip Connectivity, JitterBlocker,
KleerNet, KleerNet logo, Mindi, MiWi, motorBench, MPASM, MPF,
MPLAB Certified logo, MPLIB, MPLINK, MultiTRAK, NetDetach,
Omniscient Code Generation, PICDEM, PICDEM.net, PICkit,
PICtail, PureSilicon, QMatrix, RightTouch logo, REAL ICE, Ripple
Blocker, SAM-ICE, Serial Quad I/O, SMART-I.S., SQI,
SuperSwitcher, SuperSwitcher II, Total Endurance, TSHARC,
USBCheck, VariSense, ViewSpan, WiperLock, Wireless DNA, and
ZENA are trademarks of Microchip Technology Incorporated in the
U.S.A. and other countries.
SQTP is a service mark of Microchip Technology Incorporated in
the U.S.A.
Microchip received ISO/TS-16949:2009 certification for its worldwide
headquarters, design and wafer fabrication facilities in Chandler and
Tempe, Arizona; Gresham, Oregon and design centers in California
and India. The Company’s quality system processes and procedures
are for its PIC® MCUs and dsPIC® DSCs, KEELOQ® code hopping
devices, Serial EEPROMs, microperipherals, nonvolatile memory and
analog products. In addition, Microchip’s quality system for the design
and manufacture of development systems is ISO 9001:2000 certified.
Silicon Storage Technology is a registered trademark of Microchip
Technology Inc. in other countries.
GestIC is a registered trademark of Microchip Technology
Germany II GmbH & Co. KG, a subsidiary of Microchip Technology
Inc., in other countries.
All other trademarks mentioned herein are property of their
respective companies.
QUALITYꢀMANAGEMENTꢀꢀSYSTEMꢀ
CERTIFIEDꢀBYꢀDNVꢀ
© 2017, Microchip Technology Incorporated, All Rights Reserved.
ISBN: 978-1-5224-1407-0
== ISO/TSꢀ16949ꢀ==ꢀ
2017 Microchip Technology Inc.
DS20005718A-page 23
Worldwide Sales and Service
AMERICAS
ASIA/PACIFIC
ASIA/PACIFIC
EUROPE
Corporate Office
2355 West Chandler Blvd.
Chandler, AZ 85224-6199
Tel: 480-792-7200
Fax: 480-792-7277
Technical Support:
http://www.microchip.com/
support
Asia Pacific Office
China - Xiamen
Tel: 86-592-2388138
Fax: 86-592-2388130
Austria - Wels
Tel: 43-7242-2244-39
Fax: 43-7242-2244-393
Suites 3707-14, 37th Floor
Tower 6, The Gateway
Harbour City, Kowloon
China - Zhuhai
Tel: 86-756-3210040
Fax: 86-756-3210049
Denmark - Copenhagen
Tel: 45-4450-2828
Fax: 45-4485-2829
Hong Kong
Tel: 852-2943-5100
Fax: 852-2401-3431
India - Bangalore
Tel: 91-80-3090-4444
Fax: 91-80-3090-4123
Finland - Espoo
Tel: 358-9-4520-820
Australia - Sydney
Tel: 61-2-9868-6733
Fax: 61-2-9868-6755
Web Address:
www.microchip.com
France - Paris
Tel: 33-1-69-53-63-20
Fax: 33-1-69-30-90-79
India - New Delhi
Tel: 91-11-4160-8631
Fax: 91-11-4160-8632
Atlanta
Duluth, GA
Tel: 678-957-9614
Fax: 678-957-1455
China - Beijing
Tel: 86-10-8569-7000
Fax: 86-10-8528-2104
France - Saint Cloud
Tel: 33-1-30-60-70-00
India - Pune
Tel: 91-20-3019-1500
China - Chengdu
Tel: 86-28-8665-5511
Fax: 86-28-8665-7889
Germany - Garching
Tel: 49-8931-9700
Germany - Haan
Austin, TX
Tel: 512-257-3370
Japan - Osaka
Tel: 81-6-6152-7160
Fax: 81-6-6152-9310
Boston
Tel: 49-2129-3766400
China - Chongqing
Tel: 86-23-8980-9588
Fax: 86-23-8980-9500
Westborough, MA
Tel: 774-760-0087
Fax: 774-760-0088
Japan - Tokyo
Tel: 81-3-6880- 3770
Fax: 81-3-6880-3771
Germany - Heilbronn
Tel: 49-7131-67-3636
China - Dongguan
Tel: 86-769-8702-9880
Germany - Karlsruhe
Tel: 49-721-625370
Chicago
Itasca, IL
Tel: 630-285-0071
Fax: 630-285-0075
Korea - Daegu
Tel: 82-53-744-4301
Fax: 82-53-744-4302
China - Guangzhou
Tel: 86-20-8755-8029
Germany - Munich
Tel: 49-89-627-144-0
Fax: 49-89-627-144-44
China - Hangzhou
Tel: 86-571-8792-8115
Fax: 86-571-8792-8116
Korea - Seoul
Dallas
Addison, TX
Tel: 972-818-7423
Fax: 972-818-2924
Tel: 82-2-554-7200
Fax: 82-2-558-5932 or
82-2-558-5934
Germany - Rosenheim
Tel: 49-8031-354-560
China - Hong Kong SAR
Tel: 852-2943-5100
Fax: 852-2401-3431
Israel - Ra’anana
Tel: 972-9-744-7705
Malaysia - Kuala Lumpur
Tel: 60-3-6201-9857
Fax: 60-3-6201-9859
Detroit
Novi, MI
Tel: 248-848-4000
Italy - Milan
Tel: 39-0331-742611
Fax: 39-0331-466781
China - Nanjing
Tel: 86-25-8473-2460
Fax: 86-25-8473-2470
Malaysia - Penang
Tel: 60-4-227-8870
Fax: 60-4-227-4068
Houston, TX
Tel: 281-894-5983
Italy - Padova
Tel: 39-049-7625286
China - Qingdao
Tel: 86-532-8502-7355
Fax: 86-532-8502-7205
Indianapolis
Noblesville, IN
Tel: 317-773-8323
Fax: 317-773-5453
Tel: 317-536-2380
Philippines - Manila
Tel: 63-2-634-9065
Fax: 63-2-634-9069
Netherlands - Drunen
Tel: 31-416-690399
Fax: 31-416-690340
China - Shanghai
Tel: 86-21-3326-8000
Fax: 86-21-3326-8021
Singapore
Tel: 65-6334-8870
Fax: 65-6334-8850
Norway - Trondheim
Tel: 47-7289-7561
Los Angeles
China - Shenyang
Tel: 86-24-2334-2829
Fax: 86-24-2334-2393
Mission Viejo, CA
Tel: 949-462-9523
Fax: 949-462-9608
Tel: 951-273-7800
Poland - Warsaw
Tel: 48-22-3325737
Taiwan - Hsin Chu
Tel: 886-3-5778-366
Fax: 886-3-5770-955
Romania - Bucharest
Tel: 40-21-407-87-50
China - Shenzhen
Tel: 86-755-8864-2200
Fax: 86-755-8203-1760
Taiwan - Kaohsiung
Tel: 886-7-213-7830
Raleigh, NC
Tel: 919-844-7510
Spain - Madrid
Tel: 34-91-708-08-90
Fax: 34-91-708-08-91
China - Wuhan
Tel: 86-27-5980-5300
Fax: 86-27-5980-5118
Taiwan - Taipei
Tel: 886-2-2508-8600
Fax: 886-2-2508-0102
New York, NY
Tel: 631-435-6000
Sweden - Gothenberg
Tel: 46-31-704-60-40
San Jose, CA
Tel: 408-735-9110
Tel: 408-436-4270
China - Xian
Tel: 86-29-8833-7252
Fax: 86-29-8833-7256
Thailand - Bangkok
Tel: 66-2-694-1351
Fax: 66-2-694-1350
Sweden - Stockholm
Tel: 46-8-5090-4654
Canada - Toronto
Tel: 905-695-1980
Fax: 905-695-2078
UK - Wokingham
Tel: 44-118-921-5800
Fax: 44-118-921-5820
DS20005718A-page 24
2017 Microchip Technology Inc.
11/07/16
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