MIC5209YU [MICROCHIP]
ADJUSTABLE POSITIVE LDO REGULATOR, 0.6V DROPOUT, PSSO5;
| 型号： | MIC5209YU |
| 厂家： | 
MICROCHIP |
| 描述： | ADJUSTABLE POSITIVE LDO REGULATOR, 0.6V DROPOUT, PSSO5 输出元件 调节器 |
| 文件： | 总30页 (文件大小：1510K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
MIC5209
500 mA Low-Noise LDO Regulator
Features
General Description
• Output Voltage Range: 1.8V – 15V
• Meets Intel® Slot 1 and Slot 2 Requirements
The MIC5209 is an efficient linear voltage regulator
with very low dropout voltage, typically 10 mV at light
loads and less than 500 mV at full load, with better than
1% output voltage accuracy.
• Guaranteed 500 mA Output Over the Full
Operating Temperature Range
Designed especially for hand-held, battery-powered
devices, the MIC5209 features low ground current to
help prolong battery life. An enable/shutdown pin on
the SOIC-8 and DDPAK versions can further improve
battery life with near-zero shutdown current.
• Low 500 mV Maximum Dropout Voltage at Full
Load
• Extremely Tight Load and Line Regulation
• Thermally Efficient Surface-Mount Package
• Low Temperature Coefficient
Key features include reversed-battery protection,
• Current and Thermal Limiting
current
limiting,
overtemperature
shutdown,
• Reversed-Battery Protection
ultra-low-noise capability (SOIC-8 and DDPAK
versions), and is available in thermally efficient
packaging. The MIC5209 is available in adjustable or
fixed output voltages.
• No-Load Stability
• 1% Output Accuracy
• Ultra-Low-Noise Capability in SOIC-8 and DDPAK
• Ultra-Small 3 mm × 3 mm DFN Package
Applications
• Pentium II Slot 1 and Slot 2 Support Circuits
• Laptop, Notebook, and Palmtop Computers
• Cellular Telephones
• Consumer and Personal Electronics
• SMPS Post-Regulator and DC/DC Modules
• High-Efficiency Linear Power Supplies
Typical Application Circuits
ULTRA-LOW NOISE
5V REGULATOR
3.3V NOMINAL INPUT SLOT 1
POWER SUPPLY
MIC5209-5.0YM
MIC5209-2.5YS
ENABLE
SHUTDOWN
1
8
VIN
6.0V
VOUT
5.0V
7
6
5
2
3
4
1
2
3
VIN
3.0V
VOUT
22μF
TANTALUM
2.5V 1ꢀ
470pF
(OPTIONAL)
0.1μF
22μF
TANTALUM
2017 Microchip Technology Inc.
DS20005720A-page 1
MIC5209
Package Types
MIC5209-X.XYS
SOT-223 (S)
MIC5209YML
8-PIN 3X3 DFN (ML)
FIXED VOLTAGES (TOP VIEW)
ADJUSTABLE VOLTAGES (TOP VIEW)
PART
IDENTIFICATION
TAB
GND
OUT
OUT
EP
1
2
3
MIC5209-X.XYU
DDPAK (U)
MIC5209-X.XYM
SOIC-8 (M)
FIXED VOLTAGES (TOP VIEW)
FIXED VOLTAGES (TOP VIEW)
5 BYP
EN
IN
GND
GND
GND
GND
1
2
3
4
8
7
6
5
4 OUT
3 GND
2 IN
OUT
BYP
1 EN
MIC5209YU
DDPAK (U)
ADJUSTABLE VOLTAGES (TOP VIEW)
MIC5209YM
SOIC-8 (M)
ADJUSTABLE VOLTAGES (TOP VIEW)
4 OUT
GND
GND
GND
GND
D
DS20005720A-page 2
2017 Microchip Technology Inc.
MIC5209
Functional Diagrams
LOW-NOISE
FIXED REGULATOR
(SOT-223 VERSION ONLY)
IN
OUT
VIN
VOUT
COUT
~2.0V – 2.1V
–40ºC
EN
BANDGAP
REFERENCE
CURRENT-LIMIT
THERMAL SHUTDOWN
MIC5209-x.xYS
GND
ULTRA-LOW-NOISE
FIXED REGULATOR
IN
OUT
VIN
VOUT
COUT
BYP
CBYP
(OPTIONAL)
BANDGAP
REFERENCE
EN
CURRENT-LIMIT
THERMAL SHUTDOWN
MIC5209-x.xYM/U
GND
ULTRA-LOW-NOISE
ADJUSTABLE REGULATOR
OUT
IN
VIN
VOUT
COUT
R1
ADJ
CBYP
(OPTIONAL)
R2
BANDGAP
REFERENCE
EN
CURRENT-LIMIT
THERMAL SHUTDOWN
MIC5209YM/U (ADJUSTABLE)
GND
2017 Microchip Technology Inc.
DS20005720A-page 3
MIC5209
1.0
ELECTRICAL CHARACTERISTICS
Absolute Maximum Ratings †
Supply Voltage (VIN).................................................................................................................................... –20V to +20V
Power Dissipation (PD) (Note 1).............................................................................................................Internally Limited
ESD Rating (SOT-223)..................................................................................................................... 2 kV HBM/300V MM
ESD Rating (DFN, SOIC-8).............................................................................................................. 5 kV HBM/100V MM
Operating Ratings ‡
Supply Voltage (VIN)...................................................................................................................................+2.5V to +16V
Adjustable Output Voltage Range (VOUT) ..................................................................................................+1.8V to +15V
† Notice: Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to the device.
This is a stress rating only and functional operation of the device at those or any other conditions above those indicated
in the operational sections of this specification is not intended. Exposure to maximum rating conditions for extended
periods may affect device reliability.
‡ Notice: The device is not guaranteed to function outside its operating ratings.
Note 1: The maximum allowable power dissipation at any TA (ambient temperature) is PD(max) = (TJ(max) – TA) x θJA
.
Exceeding the maximum allowable power dissipation will cause excessive die temperature, and the regula-
tor will go into thermal shutdown. See Table 4-1 and the Thermal Considerations sub-section in Applications
Information for details.
DS20005720A-page 4
2017 Microchip Technology Inc.
MIC5209
TABLE 1-1:
ELECTRICAL CHARACTERISTICS (Note 1)
Electrical Characteristics: VIN = VOUT + 1V; IL = 100 μA; TJ = +25°C, bold values indicate –40°C ≤ TJ ≤ +125°C
except 0°C ≤ TJ ≤ +125°C for 1.8V ≤ VOUT ≤ 2.5V, unless noted.
Parameter
Symbol
Min.
Typ.
Max.
Units
Conditions
–1
—
—
1
Output Voltage Accuracy
VOUT
%
Variation from nominal VOUT
–2
2
Output Voltage
Temperature Coefficient
∆VOUT
∆T
/
/
—
40
—
ppm/°C Note 2
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
0.009
—
0.05
0.10
0.5
0.7
60
∆VOUT
VOUT
Line Regulation
Load Regulation
%
%
VIN = VOUT + 1V to 16V
0.05
—
∆VOUT
VOUT
/
IL = 100 µA to 500 mA, Note 3
IL = 100 µA
10
—
80
115
—
175
250
300
400
500
600
130
170
650
900
2.5
3.0
20
IL = 50 mA
VIN
–
Dropout Voltage, (Note 4)
mV
VOUT
165
—
IL = 150 mA
350
—
IL = 500 mA
80
VEN ≥ 3.0V, IOUT = 100 µA
VEN ≥ 3.0V, IOUT = 50 mA
VEN ≥ 3.0V, IOUT = 150 mA
VEN ≥ 3.0V, IOUT = 500 mA
—
µA
350
—
Ground Pin Current
(Note 5, Note 6)
IGND
1.8
—
mA
8
—
25
0.05
0.10
75
3
VEN ≤ 0.4V (shutdown)
VEN ≤ 0.18V (shutdown)
f = 120 Hz
Ground Pin Quiescent
Current, (Note 6)
IGND
PSRR
ILIMIT
µA
dB
8
Ripple Rejection
—
700
—
900
1000
Current Limit
mA
VOUT = 0V
Note 7
∆VOUT
∆PD
/
Thermal Regulation
—
—
—
0.05
500
300
—
—
—
%/W
VOUT = 2.5V, IOUT = 50 mA
COUT = 2.2 µF, CBYP = 0
Output Noise, (Note 8)
en
nV √Hz
IOUT = 50 mA, COUT = 2.2 µF
CBYP = 470 pF
2017 Microchip Technology Inc.
DS20005720A-page 5
MIC5209
TABLE 1-1:
ELECTRICAL CHARACTERISTICS (Note 1) (CONTINUED)
Electrical Characteristics: VIN = VOUT + 1V; IL = 100 μA; TJ = +25°C, bold values indicate –40°C ≤ TJ ≤ +125°C
except 0°C ≤ TJ ≤ +125°C for 1.8V ≤ VOUT ≤ 2.5V, unless noted.
Parameter
Enable Input
Symbol
Min.
Typ.
Max.
Units
Conditions
—
—
2.0
—
—
—
—
—
—
—
—
0.4
0.18
—
V
V
VEN = Logic-low (Regulator shutdown)
Enable Input Logic-Low
Voltage
VENL
—
V
EN = Logic-high (Regulator enabled)
0.01
0.01
5
–1
VENL ≤ 0.4V
Enable Input Current
—
IENL
µA
–2
V
ENL ≤ 0.18V
ENH ≥ 2.0V
20
V
—
25
IENH
µA
—
30
VENH ≥ 16V
—
50
Note 1: Specification for packaged product only.
2: Output voltage temperature coefficient is defined as the worst-case voltage change divided by the total
temperature range.
3: Regulation is measured at constant junction temperature using low duty cycle pulse testing. Parts are
tested for load regulation in the load range from 100 µA to 500 mA. Changes in output voltage due to heat-
ing effects are covered by the thermal regulation specification.
4: Dropout Voltage is defined as the input to output differential at which the output voltage drops 2% below its
nominal value measured at 1V differential.
5: Ground pin current is the regulator quiescent current plus pass transistor base current. The total current
drawn from the supply is the sum of the load current plus the ground pin current.
6: VEN is the voltage externally applied to devices with the EN (enable) input pin. SOIC-8 (M) and DDPAK (U)
packages only.
7: Thermal regulation is the change in output voltage at a time “t” after a change in power dissipation is
applied, excluding load or line regulation effects. Specifications are for a 500 mA load pulse at VIN = 16V
for t = 10 ms.
8: CBYP is an optional, external bypass capacitor connected to devices with a BYP (bypass) or ADJ (adjust)
pin. SOIC-8 (M) and DDPAK (U) packages only.
DS20005720A-page 6
2017 Microchip Technology Inc.
MIC5209
TEMPERATURE SPECIFICATIONS (Note 1)
Parameters
Temperature Ranges
Sym.
Min.
Typ.
Max.
Units
Conditions
Storage Temperature Range
Lead Temperature
TS
—
TJ
TJ
–65
—
—
—
—
—
+150
+260
+125
+125
°C
°C
°C
°C
—
Soldering, 5 sec.
2.5V ≤ VOUT ≤ 15V
1.8V ≤ VOUT < 2.5V
Junction Temperature
–40
0
Junction Temperature
Package Thermal Resistance
θJA
θJC
θJA
θJC
θJA
θJC
θJA
θJC
—
—
—
—
—
—
—
—
62
15
50
25
31.4
3
—
—
—
—
—
—
—
—
°C/W EIA/JEDEC
JES51-751-7,
Thermal Resistance SOT-223
Thermal Resistance SOIC-8
Thermal Resistance DDPAK
°C/W
4 Layer Board
°C/W See Thermal
Considerations for more
information.
°C/W
°C/W EIA/JEDEC
JES51-751-7,
°C/W
4 Layer Board
64
12
°C/W EIA/JEDEC
JES51-751-7,
Thermal Resistance 3 mm x 3 mm
DFN
°C/W
4 Layer Board
Note 1: The maximum allowable power dissipation is a function of ambient temperature, the maximum allowable
junction temperature and the thermal resistance from junction to air (i.e., TA, TJ, JA). Exceeding the
maximum allowable power dissipation will cause the device operating junction temperature to exceed the
maximum +125°C rating. Sustained junction temperatures above +125°C can impact the device reliability.
2017 Microchip Technology Inc.
DS20005720A-page 7
MIC5209
2.0
TYPICAL PERFORMANCE CURVES
Note: The graphs and tables provided following this note are a statistical summary based on a limited number of
samples and are provided for informational purposes only. The performance characteristics listed herein
are not tested or guaranteed. In some graphs or tables, the data presented may be outside the specified
operating range (e.g., outside specified power supply range) and therefore outside the warranted range.
FIGURE 2-4:
Ratio.
Power Supply Rejection
FIGURE 2-1:
Ratio.
Power Supply Rejection
Power Supply Rejection
Power Supply Rejection
FIGURE 2-5:
Ratio.
Power Supply Rejection
FIGURE 2-2:
Ratio.
FIGURE 2-6:
Ratio.
Power Supply Rejection
FIGURE 2-3:
Ratio.
DS20005720A-page 8
2017 Microchip Technology Inc.
MIC5209
FIGURE 2-10:
Noise Performance.
FIGURE 2-7:
Power Supply Ripple
Rejection vs. Voltage Drop.
FIGURE 2-8:
Power Supply Ripple
FIGURE 2-11:
Noise Performance.
Rejection vs. Voltage Drop.
FIGURE 2-9:
Noise Performance.
FIGURE 2-12:
Dropout Voltage vs. Output
Current.
2017 Microchip Technology Inc.
DS20005720A-page 9
MIC5209
FIGURE 2-13:
Current.
Ground Current vs. Output
Ground Current vs. Supply
Ground Current vs. Supply
FIGURE 2-14:
Voltage.
FIGURE 2-15:
Voltage.
DS20005720A-page 10
2017 Microchip Technology Inc.
MIC5209
3.0
PIN DESCRIPTIONS
The descriptions of the pins are listed in Table 3-1.
TABLE 3-1:
PIN FUNCTION TABLE
Pin Number Pin Number Pin Number Pin Number
Pin Name
Description
8-Pin DFN
SOT-223
SOIC-8
DDPAK
1, 2
7
1
2
2
IN
Supply Input.
2, TAB
5, 6, 7, 8
3, TAB
GND
Ground: SOT-223 Pin 2 and TAB are
internally connected. SOIC-8 Pins 5
through 8 are internally connected.
3, 4
3
3
4
OUT
Regulator Output: Pins 3 and 4 must
be tied together.
5
8
—
—
—
1
—
1
NC
EN
Not Connected.
Enable (Input): CMOS-compatible
control input. Logic-High = Enable;
Logic-Low = Shutdown.
—
—
4 (Fixed)
5 (Fixed)
BYP
Reference Bypass: Connect external
470 pF capacitor to GND to reduce
output noise. Can be left open. For
1.8V or 2.5V operation, see Application
Information.
6
—
—
4 (Adjustable) 5 (Adjustable)
ADJ
Adjust (Input): Feedback input.
Connect to resistive voltage-divider
network.
EP
—
—
ePad
Exposed Thermal Pad: Connect to
GND for best thermal performance.
2017 Microchip Technology Inc.
DS20005720A-page 11
MIC5209
CBYP reduces the phase margin, the output capacitor
should be increased to at least 2.2 µF to maintain
stability.
4.0
4.1
APPLICATIONS INFORMATION
Enable/Shutdown
The start-up speed of the MIC5209 is inversely
proportional to the size of the reference bypass
capacitor. Applications requiring a slow ramp-up of
Enable is not available on devices in the SOT-223 (S)
package.
output voltage should consider larger values of CBYP
Likewise, if rapid turn-on is necessary, consider
omitting CBYP
.
Forcing EN (enable/shutdown) high (> 2V) enables the
regulator. EN is compatible with CMOS logic. If the
enable/shutdown feature is not required, connect EN to
IN (supply input).
.
If output noise is not a major concern, omit CBYP and
leave BYP open.
4.2
Input Capacitor
4.6
Thermal Considerations
A 1 µF capacitor should be placed from IN to GND if
there is more than 10 inches of wire between the input
and the AC filter capacitor or if a battery is used as the
input.
The SOT-223 has a ground tab that allows it to
dissipate more power than the SOIC-8 (refer to the
Slot-1 Power Supply sub-section for details). At +25°C
ambient, it will operate reliably at 1.6W dissipation with
“worst-case” mounting (no ground plane, minimum
trace widths, and FR4 printed circuit board).
4.3
Output Capacitor
An output capacitor is required between OUT and GND
to prevent oscillation. The minimum size of the output
capacitor is dependent upon whether a reference
bypass capacitor is used. 1 µF minimum is
recommended when CBYP is not used (see Figure 4-1).
2.2 µF minimum is recommended when CBYP is 470 pF
(see Figure 4-2). Larger values improve the regulator’s
transient response.
Thermal resistance values for the SOIC-8 represent
typical mounting on a 1”-square, copper-clad, FR4
circuit board. For greater power dissipation, SOIC-8
versions of the MIC5209 feature a fused internal lead
frame and die bonding arrangement that reduces
thermal resistance when compared to standard SOIC-8
packages.
The output capacitor should have an ESR (equivalent
series resistance) of about 1Ω and a resonant
frequency above 1 MHz. Ultra-low-ESR and ceramic
capacitors can cause a low amplitude oscillation on the
output and/or underdamped transient response. Most
tantalum or aluminum electrolytic capacitors are
adequate; film types will work, but are more expensive.
Since many aluminum electrolytics have electrolytes
that freeze at about –30°C, solid tantalums are
recommended for operation below –25°C.
TABLE 4-1:
MIC5209 THERMAL
RESISTANCE
Package
θJA
θJC
SOT-223 (S)
SOIC-8 (M)
DDPAK (U)
62°C/W
50°C/W
31.4°C/W
64°C/W
15°C/W
25°C/W
3°C/W
3x3 DFN (ML)
12°C/W
Multilayer boards with a ground plane, wide traces near
the pads, and large supply-bus lines will have better
thermal conductivity and will also allow additional
power dissipation.
At lower values of output current, less output
capacitance is needed for output stability. The
capacitor can be reduced to 0.47 µF for current below
10 mA or 0.33 µF for currents below 1 mA.
For additional heat sink characteristics, refer to
Application Hint 17. For a full discussion of heat sinking
and thermal effects on voltage regulators, refer to the
“Regulator Thermals” section of the Designing with
Low-Dropout Voltage Regulators handbook.
4.4
No-Load Stability
The MIC5209 will remain stable and in regulation with
no load (other than the internal voltage divider) unlike
many other voltage regulators. This is especially
important in CMOSRAM keep-alive applications.
4.7
Low-Voltage Operation
The MIC5209-1.8 and MIC5209-2.5 require special
consideration when used in voltage-sensitive systems.
They may momentarily overshoot their nominal output
voltages unless appropriate output and bypass
capacitor values are chosen.
4.5
Reference Bypass Capacitor
Reference bypass (BYP) is available only on devices in
SOIC-8 and DDPAK packages.
BYP is connected to the internal voltage reference. A
470 pF capacitor (CBYP) connected from BYP to GND
quiets this reference, providing a significant reduction
in output noise (ultra-low-noise performance). Because
During regulator power up, the pass transistor is fully
saturated for a short time, while the error amplifier and
voltage reference are being powered up more slowly
from the output (see Functional Diagrams). Selecting
DS20005720A-page 12
2017 Microchip Technology Inc.
MIC5209
larger output and bypass capacitors allows additional
time for the error amplifier and reference to turn on and
prevent overshoot.
4.9
Adjustable Regulator Applications
The MIC5209YM, MIC5209YU, and MIC5209YML can
be adjusted to a specific output voltage by using two
external resistors (Figure 4-3). The resistors set the
output voltage based on the equation:
To ensure that no overshoot is present when starting up
into a light load (100 µA), use a 4.7 µF output
capacitance and 470 pF bypass capacitance. This
slows the turn-on enough to allow the regulator to react
and keep the output voltage from exceeding its nominal
EQUATION 4-1:
value. At heavier loads, use
a 10 µF output
capacitance and 470 pF bypass capacitance. Lower
values of output and bypass capacitance can be used,
depending on the sensitivity of the system.
R2
R1
VOUT = 1.242V 1 + ------
Applications that can withstand some overshoot on the
output of the regulator can reduce the output capacitor
and/or reduce or eliminate the bypass capacitor.
Applications that are not sensitive to overshoot due to
power-on reset delays can use normal output and
bypass capacitor configurations.
This equation is correct due to the configuration of the
bandgap reference. The bandgap voltage is relative to
the output, as seen in the Functional Diagrams.
Traditional regulators normally have the reference
voltage relative to ground; therefore, their equations
are different from the equation for the MIC5209Y.
Please note the junction temperature range of the
regulator with an output less than 2.5V (fixed and
adjustable) is 0°C to +125°C.
Although ADJ is a high-impedance input and, for best
performance, R2 should not exceed 470 kΩ.
4.8
Fixed Regulator Applications
MIC5209YM
Figure 4-1 shows a basic MIC5209-x.xYM (SOIC-8)
fixed-voltage regulator circuit. See Figure 5 for a similar
configuration using the more thermally-efficient
MIC5209-x.xYS (SOT-223). A 1 µF minimum output
capacitor is required for basic fixed-voltage
applications.
3
4
2
1
VIN
VOUT
IN
OUT
ADJ
R1
EN
1μF
GND
5 - 8
R2
MIC5209-x.xYM
3
4
2
1
VIN
VOUT
IN
OUT
FIGURE 4-3:
Low-Noise
Adjustable-Voltage Application.
EN
BYP
Figure 4-4 includes the optional 470 pF bypass
capacitor from ADJ to GND to reduce output noise.
1μF
GND
5 - 8
MIC5209YM
3
4
2
1
VIN
VOUT
IN
OUT
ADJ
FIGURE 4-1:
Low-Noise Fixed-Voltage
Application.
R1
R2
EN
2.2μF
Figure 4-2 includes the optional 470 pF noise bypass
capacitor between BYP and GND to reduce output
noise. Note that the minimum value of COUT must be
increased when the bypass capacitor is used.
GND
5 - 8
470pF
MIC5209-x.xYM
FIGURE 4-4:
Application.
Ultra-Low-Noise Adjustable
3
4
2
1
VIN
VOUT
IN
OUT
EN
BYP
2.2μF
4.10 Slot-1 Power Supply
GND
5 - 8
Intel’s Pentium II processors have a requirement for a
2.5V ±5% power supply for a clock synthesizer and its
associated loads. The current requirement for the 2.5V
supply is dependent upon the clock synthesizer used,
470pF
FIGURE 4-2:
Ultra-Low-Noise
Fixed-Voltage Application.
2017 Microchip Technology Inc.
DS20005720A-page 13
MIC5209
the number of clock outputs, and the type of level
shifter (from core logic levels to 2.5V levels). Intel
estimates a “worst-case” load of 320 mA.
So:
EQUATION 4-3:
The MIC5209 was designed to provide the 2.5V power
requirement for Slot-1 applications. Its guaranteed
performance of 2.5V ±3% at 500 mA allows adequate
margin for all systems, and the dropout voltage of
500 mV means that it operates from a “worst-case”
3.3V supply where the voltage can be as low as 3.0V.
3.6V – 2.375V 320mA + 3.6V 4mA
Resulting in:
MIC5209-x.xYS
1
3
VIN
VOUT
IN
OUT
EQUATION 4-4:
CIN
0.1μF
COUT
22μF
GND
2, TAB
PD = 407mW
Using the maximum junction temperature of +125°C
and a θJC of 15°C/W for the SOT-223, 25°C/W for the
SOIC-8, or 3°C/W for the DDPAK package, the
FIGURE 4-5:
Slot-1 Power Supply.
A
Slot-1 power supply (Figure 4-5) is easy to
implement. Only two capacitors are necessary, and
their values are not critical. CIN bypasses the internal
circuitry and should be at least 0.1 µF. COUT provides
output filtering, improves transient response, and
compensates the internal regulator control loop. Its
value should be at least 22 µF. CIN and COUT can be
increased as much as desired.
following worst-case heat-sink thermal resistance (θSA
)
requirements are:
EQUATION 4-5:
T
JMAX – TA
JA = -------------------------------
PD
4.10.1
SLOT-1 POWER SUPPLY POWER
DISSIPATION
Where: θSA = θJA - θJC
Powered from a 3.3V supply, the Slot-1 power supply
illustrated in Figure 4-5 has a nominal efficiency of
75%. At the maximum anticipated Slot-1 load
(320 mA), the nominal power dissipation is only
256 mW.
Table 4-2 and Figure 4-6 show that the Slot-1 power
supply application can be implemented with a minimum
footprint layout.
TABLE 4-2:
MAXIMUM ALLOWABLE
THERMAL RESISTANCE
The SOT-223 package has sufficient thermal
characteristics for wide design margins when mounted
on a single-layer copper-clad printed circuit board. The
power dissipation of the MIC5209 is calculated using
the voltage drop across the device output current plus
supply voltage ground current.
TA
+40°C
+50°C
+60°C
+70°C
θJA Limit 209°C/W 184°C/W 160°C/W 135°C/W
θSA
SOT-223
194°C/W 169°C/W 145°C/W 120°C/W
184°C/W 159°C/W 135°C/W 110°C/W
206°C/W 181°C/W 157°C/W 132°C/W
Considering “worst-case” tolerances, the power
dissipation could be as high as:
θSA
SOIC-8
EQUATION 4-2:
θSA
DDPAK
Figure 4-6 shows the necessary copper pad area to
obtain specific heatsink thermal resistance (θSA
VINMAX – VOUTMAX IOUT + VINMAX IGND
)
values. The θSA values highlighted in Table 4-2 require
much less than 500 mm2 of copper and, per Figure 4-6,
can be easily accomplished with the minimum footprint.
DS20005720A-page 14
2017 Microchip Technology Inc.
MIC5209
70
60
50
40
30
20
10
0
0
2000
4000
6000
COPPER HEAT SINK AREA (mm2)
FIGURE 4-6:
PCB Heatsink Thermal
Resistance.
2017 Microchip Technology Inc.
DS20005720A-page 15
MIC5209
5.0
5.1
PACKAGING INFORMATION
Package Marking Information
5-Pin SOT-223*
Example
5209
XXXX
25YS722P
XXXXYWWP
SOIC-8 (Fixed)*
Example
XXXX
-X.XXX
WNNN
5209
-3.3YM
9651
SOIC-8 (Adj.)*
Example
XXX
XXXXXX
WNNN
MIC
5209YM
1312
5-Pin DDPAK (Fixed)*
Example
XXXX
-X.XXX
5209
-3.3YU
5492P
WNNNP
5-Pin DDPAK (Adj)*
Example
XXX
XXXXXX
WNNNP
MIC
5209YU
1975P
8-Pin DFN*
Example
X
XXXX
NNN
Y
5209
916
DS20005720A-page 16
2017 Microchip Technology Inc.
MIC5209
Legend: XX...X Product code or customer-specific information
Y
Year code (last digit of calendar year)
YY
WW
NNN
Year code (last 2 digits of calendar year)
Week code (week of January 1 is week ‘01’)
Alphanumeric traceability code
Pb-free JEDEC® designator for Matte Tin (Sn)
This package is Pb-free. The Pb-free JEDEC designator (
can be found on the outer packaging for this package.
e
3
*
)
e
3
●, ▲, ▼ Pin one index is identified by a dot, delta up, or delta down (triangle
mark).
Note: In the event the full Microchip part number cannot be marked on one line, it will
be carried over to the next line, thus limiting the number of available
characters for customer-specific information. Package may or may not include
the corporate logo.
Underbar (_) and/or Overbar (⎯) symbol may not be to scale.
2017 Microchip Technology Inc.
DS20005720A-page 17
MIC5209
3-Lead SOT-223 Package Outline and Recommended Land Pattern
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging.
DS20005720A-page 18
2017 Microchip Technology Inc.
MIC5209
5-Lead DDPAK Package Outline and Recommended Land Pattern
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,ꢃ!- ,ꢉꢍꢄꢈꢂꢏꢄ#ꢌꢆꢍꢄꢐꢆꢁꢂꢗꢊꢌꢐꢋꢌ ꢄꢈꢉꢑꢑꢘꢂꢌ'ꢉꢈ ꢂ.ꢉꢑ&ꢌꢂꢍꢊꢐ/ꢆꢂ/ꢄ ꢊꢐ& ꢂ ꢐꢑꢌꢋꢉꢆꢈꢌꢍꢁ
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2017 Microchip Technology Inc.
DS20005720A-page 19
MIC5209
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
DS20005720A-page 20
2017 Microchip Technology Inc.
MIC5209
8-Lead 3 mm x 3 mm DFN Package Outline and Recommended Land Pattern
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging.
2017 Microchip Technology Inc.
DS20005720A-page 21
MIC5209
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging.
DS20005720A-page 22
2017 Microchip Technology Inc.
MIC5209
8-Lead SOIC Package Outline and Recommended Land Pattern
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging.
2017 Microchip Technology Inc.
DS20005720A-page 23
MIC5209
NOTES:
DS20005720A-page 24
2017 Microchip Technology Inc.
MIC5209
APPENDIX A: REVISION HISTORY
Revision A (February 2017)
• Converted Micrel document MIC5209 to Micro-
chip data sheet DS20005720A.
• Minor text changes throughout.
• Updated TO-263-5 packaging spec to DDPAK.
• Updated Thermal Resistance values to be current
with Microchip packaging.
2017 Microchip Technology Inc.
DS20005720A-page 25
MIC5209
NOTES:
DS20005720A-page 26
2017 Microchip Technology Inc.
MIC5209
PRODUCT IDENTIFICATION SYSTEM
To order or obtain information, e.g., on pricing or delivery, contact your local Microchip representative or sales office.
Examples:
–
PART NO.
Device
–
X
X
XX
X.X
a) MIC5209-1.8YM-TR:
b) MIC5209-1.8YM:
c) MIC5209-2.5YU-TR:
d) MIC5209-2.5YU:
e) MIC5209-3.0YS-TR:
f) MIC5209-3.0YS:
500 mA Low-Noise LDO
Regulator, 1.8V Voltage,
–40°C to +125°C Temp. Range,
8-Lead SOIC, 2,500/Reel
Media Type
Temperature Package
Voltage
Device:
MIC5209:
500 mA Low Noise LDO Regulator
500 mA Low-Noise LDO
Regulator, 1.8V Voltage,
–40°C to +125°C Temp. Range,
8-Lead SOIC, 95/Tube
Voltage:
(blank) = Adjustable
1.8
2.5
3.0
3.3
3.6
4.2
5.0
=
=
=
=
=
=
=
1.8V
2.5V
3.0V
3.3V
3.6V
4.2V
5.0V
500 mA Low-Noise LDO
Regulator, 2.5V Voltage,
–40°C to +125°C Temp. Range,
5-Lead DDPAK, 750/Reel
500 mA Low-Noise LDO
Regulator, 2.5V Voltage,
–40°C to +125°C Temp. Range,
5-Lead DDPAK, 50/Tube
Temperature:
Package:
Y
=
–40°C to +125°C
500 mA Low-Noise LDO
Regulator, 3.0V Voltage,
–40°C to +125°C Temp. Range,
3-Lead SOT-223, 2,500/Reel
M
ML
S
=
=
=
=
8-Lead SOIC
8-Lead DFN
3-Lead SOT-223
5-Lead DDPAK
U
500 mA Low-Noise LDO
Media Type:
TR
TR
TR
T5
=
=
=
=
2,500/Reel (SOIC, SOT-223)
750/Reel (DDPAK)
5,000/Reel (DFN)
Regulator, 3.0V Voltage,
–40°C to +125°C Temp. Range,
3-Lead SOT-223, 78/Tube
500/Reel (DFN)
(blank)= 50/Tube (DDPAK)
(blank)= 78/Tube (SOT-223)
(blank)= 95/Tube (SOIC)
g) MIC5209YML-TR:
h) MIC5209YML-T5:
500 mA Low-Noise LDO
Regulator, Adj. Voltage,
–40°C to +125°C Temp. Range,
8-Lead DFN, 5,000/Reel
500 mA Low-Noise LDO
Regulator, Adj. Voltage,
–40°C to +125°C Temp. Range,
8-Lead DFN, 500/Reel
Note 1:
Tape and Reel identifier only appears in the
catalog part number description. This identifier is
used for ordering purposes and is not printed on
the device package. Check with your Microchip
Sales Office for package availability with the
Tape and Reel option.
2017 Microchip Technology Inc.
DS20005720A-page 27
MIC5209
NOTES:
DS20005720A-page 28
2017 Microchip Technology Inc.
Note the following details of the code protection feature on Microchip devices:
•
Microchip products meet the specification contained in their particular Microchip Data Sheet.
•
Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the
intended manner and under normal conditions.
•
There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our
knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data
Sheets. Most likely, the person doing so is engaged in theft of intellectual property.
•
•
Microchip is willing to work with the customer who is concerned about the integrity of their code.
Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not
mean that we are guaranteeing the product as “unbreakable.”
Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our
products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts
allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act.
Information contained in this publication regarding device
applications and the like is provided only for your convenience
and may be superseded by updates. It is your responsibility to
ensure that your application meets with your specifications.
MICROCHIP MAKES NO REPRESENTATIONS OR
WARRANTIES OF ANY KIND WHETHER EXPRESS OR
IMPLIED, WRITTEN OR ORAL, STATUTORY OR
OTHERWISE, RELATED TO THE INFORMATION,
INCLUDING BUT NOT LIMITED TO ITS CONDITION,
QUALITY, PERFORMANCE, MERCHANTABILITY OR
FITNESS FOR PURPOSE. Microchip disclaims all liability
arising from this information and its use. Use of Microchip
devices in life support and/or safety applications is entirely at
the buyer’s risk, and the buyer agrees to defend, indemnify and
hold harmless Microchip from any and all damages, claims,
suits, or expenses resulting from such use. No licenses are
conveyed, implicitly or otherwise, under any Microchip
intellectual property rights unless otherwise stated.
Trademarks
The Microchip name and logo, the Microchip logo, AnyRate, AVR,
AVR logo, AVR Freaks, BeaconThings, BitCloud, CryptoMemory,
CryptoRF, dsPIC, FlashFlex, flexPWR, Heldo, JukeBlox, KEELOQ,
KEELOQ logo, Kleer, LANCheck, LINK MD, maXStylus,
maXTouch, MediaLB, megaAVR, MOST, MOST logo, MPLAB,
OptoLyzer, PIC, picoPower, PICSTART, PIC32 logo, Prochip
Designer, QTouch, RightTouch, SAM-BA, SpyNIC, SST, SST
Logo, SuperFlash, tinyAVR, UNI/O, and XMEGA are registered
trademarks of Microchip Technology Incorporated in the U.S.A.
and other countries.
ClockWorks, The Embedded Control Solutions Company,
EtherSynch, Hyper Speed Control, HyperLight Load, IntelliMOS,
mTouch, Precision Edge, and Quiet-Wire are registered
trademarks of Microchip Technology Incorporated in the U.S.A.
Adjacent Key Suppression, AKS, Analog-for-the-Digital Age, Any
Capacitor, AnyIn, AnyOut, BodyCom, chipKIT, chipKIT logo,
CodeGuard, CryptoAuthentication, CryptoCompanion,
CryptoController, dsPICDEM, dsPICDEM.net, Dynamic Average
Matching, DAM, ECAN, EtherGREEN, In-Circuit Serial
Programming, ICSP, Inter-Chip Connectivity, JitterBlocker,
KleerNet, KleerNet logo, Mindi, MiWi, motorBench, MPASM, MPF,
MPLAB Certified logo, MPLIB, MPLINK, MultiTRAK, NetDetach,
Omniscient Code Generation, PICDEM, PICDEM.net, PICkit,
PICtail, PureSilicon, QMatrix, RightTouch logo, REAL ICE, Ripple
Blocker, SAM-ICE, Serial Quad I/O, SMART-I.S., SQI,
SuperSwitcher, SuperSwitcher II, Total Endurance, TSHARC,
USBCheck, VariSense, ViewSpan, WiperLock, Wireless DNA, and
ZENA are trademarks of Microchip Technology Incorporated in the
U.S.A. and other countries.
SQTP is a service mark of Microchip Technology Incorporated in
the U.S.A.
Microchip received ISO/TS-16949:2009 certification for its worldwide
headquarters, design and wafer fabrication facilities in Chandler and
Tempe, Arizona; Gresham, Oregon and design centers in California
and India. The Company’s quality system processes and procedures
are for its PIC® MCUs and dsPIC® DSCs, KEELOQ® code hopping
devices, Serial EEPROMs, microperipherals, nonvolatile memory and
analog products. In addition, Microchip’s quality system for the design
and manufacture of development systems is ISO 9001:2000 certified.
Silicon Storage Technology is a registered trademark of Microchip
Technology Inc. in other countries.
GestIC is a registered trademark of Microchip Technology
Germany II GmbH & Co. KG, a subsidiary of Microchip Technology
Inc., in other countries.
All other trademarks mentioned herein are property of their
respective companies.
QUALITYꢀMANAGEMENTꢀꢀSYSTEMꢀ
CERTIFIEDꢀBYꢀDNVꢀ
© 2017, Microchip Technology Incorporated, All Rights Reserved.
ISBN: 978-1-5224-1417-9
== ISO/TSꢀ16949ꢀ==ꢀ
2017 Microchip Technology Inc.
DS20005720A-page 29
Worldwide Sales and Service
AMERICAS
ASIA/PACIFIC
ASIA/PACIFIC
EUROPE
Corporate Office
2355 West Chandler Blvd.
Chandler, AZ 85224-6199
Tel: 480-792-7200
Fax: 480-792-7277
Technical Support:
http://www.microchip.com/
support
Asia Pacific Office
China - Xiamen
Tel: 86-592-2388138
Fax: 86-592-2388130
Austria - Wels
Tel: 43-7242-2244-39
Fax: 43-7242-2244-393
Suites 3707-14, 37th Floor
Tower 6, The Gateway
Harbour City, Kowloon
China - Zhuhai
Tel: 86-756-3210040
Fax: 86-756-3210049
Denmark - Copenhagen
Tel: 45-4450-2828
Fax: 45-4485-2829
Hong Kong
Tel: 852-2943-5100
Fax: 852-2401-3431
India - Bangalore
Tel: 91-80-3090-4444
Fax: 91-80-3090-4123
Finland - Espoo
Tel: 358-9-4520-820
Australia - Sydney
Tel: 61-2-9868-6733
Fax: 61-2-9868-6755
Web Address:
www.microchip.com
France - Paris
Tel: 33-1-69-53-63-20
Fax: 33-1-69-30-90-79
India - New Delhi
Tel: 91-11-4160-8631
Fax: 91-11-4160-8632
Atlanta
Duluth, GA
Tel: 678-957-9614
Fax: 678-957-1455
China - Beijing
Tel: 86-10-8569-7000
Fax: 86-10-8528-2104
France - Saint Cloud
Tel: 33-1-30-60-70-00
India - Pune
Tel: 91-20-3019-1500
China - Chengdu
Tel: 86-28-8665-5511
Fax: 86-28-8665-7889
Germany - Garching
Tel: 49-8931-9700
Germany - Haan
Austin, TX
Tel: 512-257-3370
Japan - Osaka
Tel: 81-6-6152-7160
Fax: 81-6-6152-9310
Boston
Tel: 49-2129-3766400
China - Chongqing
Tel: 86-23-8980-9588
Fax: 86-23-8980-9500
Westborough, MA
Tel: 774-760-0087
Fax: 774-760-0088
Japan - Tokyo
Tel: 81-3-6880- 3770
Fax: 81-3-6880-3771
Germany - Heilbronn
Tel: 49-7131-67-3636
China - Dongguan
Tel: 86-769-8702-9880
Germany - Karlsruhe
Tel: 49-721-625370
Chicago
Itasca, IL
Tel: 630-285-0071
Fax: 630-285-0075
Korea - Daegu
Tel: 82-53-744-4301
Fax: 82-53-744-4302
China - Guangzhou
Tel: 86-20-8755-8029
Germany - Munich
Tel: 49-89-627-144-0
Fax: 49-89-627-144-44
China - Hangzhou
Tel: 86-571-8792-8115
Fax: 86-571-8792-8116
Korea - Seoul
Dallas
Addison, TX
Tel: 972-818-7423
Fax: 972-818-2924
Tel: 82-2-554-7200
Fax: 82-2-558-5932 or
82-2-558-5934
Germany - Rosenheim
Tel: 49-8031-354-560
China - Hong Kong SAR
Tel: 852-2943-5100
Fax: 852-2401-3431
Israel - Ra’anana
Tel: 972-9-744-7705
Malaysia - Kuala Lumpur
Tel: 60-3-6201-9857
Fax: 60-3-6201-9859
Detroit
Novi, MI
Tel: 248-848-4000
Italy - Milan
Tel: 39-0331-742611
Fax: 39-0331-466781
China - Nanjing
Tel: 86-25-8473-2460
Fax: 86-25-8473-2470
Malaysia - Penang
Tel: 60-4-227-8870
Fax: 60-4-227-4068
Houston, TX
Tel: 281-894-5983
Italy - Padova
Tel: 39-049-7625286
China - Qingdao
Tel: 86-532-8502-7355
Fax: 86-532-8502-7205
Indianapolis
Noblesville, IN
Tel: 317-773-8323
Fax: 317-773-5453
Tel: 317-536-2380
Philippines - Manila
Tel: 63-2-634-9065
Fax: 63-2-634-9069
Netherlands - Drunen
Tel: 31-416-690399
Fax: 31-416-690340
China - Shanghai
Tel: 86-21-3326-8000
Fax: 86-21-3326-8021
Singapore
Tel: 65-6334-8870
Fax: 65-6334-8850
Norway - Trondheim
Tel: 47-7289-7561
Los Angeles
China - Shenyang
Tel: 86-24-2334-2829
Fax: 86-24-2334-2393
Mission Viejo, CA
Tel: 949-462-9523
Fax: 949-462-9608
Tel: 951-273-7800
Poland - Warsaw
Tel: 48-22-3325737
Taiwan - Hsin Chu
Tel: 886-3-5778-366
Fax: 886-3-5770-955
Romania - Bucharest
Tel: 40-21-407-87-50
China - Shenzhen
Tel: 86-755-8864-2200
Fax: 86-755-8203-1760
Taiwan - Kaohsiung
Tel: 886-7-213-7830
Raleigh, NC
Tel: 919-844-7510
Spain - Madrid
Tel: 34-91-708-08-90
Fax: 34-91-708-08-91
China - Wuhan
Tel: 86-27-5980-5300
Fax: 86-27-5980-5118
Taiwan - Taipei
Tel: 886-2-2508-8600
Fax: 886-2-2508-0102
New York, NY
Tel: 631-435-6000
Sweden - Gothenberg
Tel: 46-31-704-60-40
San Jose, CA
Tel: 408-735-9110
Tel: 408-436-4270
China - Xian
Tel: 86-29-8833-7252
Fax: 86-29-8833-7256
Thailand - Bangkok
Tel: 66-2-694-1351
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UK - Wokingham
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DS20005720A-page 30
2017 Microchip Technology Inc.
11/07/16
相关型号：
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MIC5210-2.8BMM
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