MIC5212-SJYM-TR [MICROCHIP]
DUAL OUTPUT, FIXED POSITIVE LDO REGULATOR, PDSO8;
| 型号： | MIC5212-SJYM-TR |
| 厂家： | 
MICROCHIP |
| 描述： | DUAL OUTPUT, FIXED POSITIVE LDO REGULATOR, PDSO8 光电二极管 输出元件 调节器 |
| 文件： | 总18页 (文件大小：1755K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
MIC5212
Dual 500 mA LDO Regulator
Features
General Description
• Fused-Lead Frame SOIC-8
• Up to 500 mA per Regulator Output
• Low Quiescent Current
The MIC5212 is a dual linear voltage regulator with
very low dropout voltage (typically 10 mV at light loads
and 350 mV at 500 mA), very low ground current
(225 μA at 10 mA output), and better than 1% initial
accuracy.
• Low Dropout Voltage
• Tight Load and Line Regulation
• Low Temperature Coefficient
• Current and Thermal Limiting
• Reversed Input Polarity Protection
Both regulator outputs can supply up to 500 mA at the
same time as long as each regulator’s maximum
junction temperature is not exceeded.
Key features include current limiting, overtemperature
shutdown, and protection against reversed battery.
Applications
The MIC5212 is available in a fixed 3.3V/2.5V output
voltage configuration. Other voltages are available;
contact Microchip for details.
• Hard Disk Drives
• CD R/W
• Barcode Scanners
Package Type
• SMPS Post Regulator and DC/DC Modules
• High-Efficiency Linear Power Supplies
MIC5212
SOIC-8
Top View
2017 Microchip Technology Inc.
DS20005774A-page 1
MIC5212
Typical Application Circuit
MIC5212
3.3V/2.5V Dual LDO
MIC5212-SJYM
INA OUTA
INB
VO1 = 3.3V
VO2 = 2.5V
IN = 5V
4.7µF
OUTB
GND
4.7µF 4.7µF
Functional Diagram
DS20005774A-page 2
2017 Microchip Technology Inc.
MIC5212
1.0
ELECTRICAL CHARACTERISTICS
Absolute Maximum Ratings †
Supply Input Voltage, (VIN A or B) .............................................................................................................. –20V to +20V
Power Dissipation ................................................................................................................................. Internally Limited
Operating Ratings ††
Supply Input Voltage, (VIN ) ....................................................................................................................... +2.5V to +16V
† Notice: Exceeding the absolute maximum rating may damage the device.
†† Notice: The device is not guaranteed to function outside its operating rating.
DC CHARACTERISTICS
Electrical Characteristics: Unless otherwise indicated, Regulator A and B VIN = VOUT + 1V; IL = 100 μA;
CL = 4.7 μF; TJ = +25°C, bold values indicate –40°C ≤ TJ ≤ +125°C.
Parameters
Symbol
Min.
Typ.
Max.
Units
Conditions
–1
—
—
1
%
%
Variation from specified
VOUT
Output Voltage Accuracy
VO
–2
2
Output Voltage
Temperature Coefficient
∆VO/∆T
∆VO/VO
—
40
—
ppm/°C
Note 1
—
—
—
—
—
—
—
—
—
—
—
—
—
—
0.009
—
0.05
0.1
0.7
1
%/V
%/V
%
Line Regulation
Load Regulation
VIN = VOUT + 1V to 16V
0.05
—
IL = 0.1 mA to 500 mA,
Note 2
∆VO/VO
%
175
—
275
350
500
600
2.5
3.0
20
mV
mV
mV
mV
mA
mA
mA
mA
dB
IL = 150 mA
IL = 150 mA
IL = 150 mA
IL = 150 mA
Dropout Voltage, Note 3
(per regulator)
VIN – VO
350
—
1.5
—
Ground Pin Current,
Note 4
(per regulator)
IGND
12
—
25
Ripple Rejection
Current Limit
PSRR
ILIMIT
75
—
f = 120 Hz, IL = 150 mA
VOUT = 0V
750
1000
mA
VOUT = 2.5V, IOUT = 50 mA,
COUT = 2.2 μF
Spectral Noise Density
—
—
500
—
nV/√Hz
Note 1: Output voltage temperature coefficient is defined as the worst case voltage change divided by the total
temperature range.
2: Regulation is measured at constant junction temperature using low duty cycle pulse testing. Parts are
tested for load regulation in the load range from 0.1 mA to 500 mA. Changes in output voltage due to
heating effects are covered by the thermal regulation specification.
3: Dropout voltage is defined as the input to output differential at which the output voltage drops 2% below its
nominal value measured at 1V differential.
4: Ground pin current is the regulator quiescent current plus pass transistor base current. The total current
drawn from the supply is the sum of the load current plus the ground pin current.
2017 Microchip Technology Inc.
DS20005774A-page 3
MIC5212
TEMPERATURE SPECIFICATIONS (Note 1)
Parameters
Temperature Ranges
Sym.
Min.
Typ.
Max.
Units
Conditions
Storage Temperature Range
Lead Temperature
TA
TJ
TJ
–60
—
—
+260
—
+150
—
°C
°C
°C
—
Soldering, 5 sec.
—
Junction Temperature
–40
+125
Package Thermal Resistances
JC
JA
—
—
20
63
—
—
°C/W
°C/W
Thermal Resistance, SOIC-8Ld
Note 2
Note 1: The maximum allowable power dissipation is a function of ambient temperature, the maximum allowable
junction temperature and the thermal resistance from junction to air (i.e., TA, TJ, JA). Exceeding the
maximum allowable power dissipation will cause the device operating junction temperature to exceed the
maximum +125°C rating. Sustained junction temperatures above +125°C can impact the device reliability.
2: Absolute maximum ratings indicate limits beyond which damage to the component may occur. Electrical
specifications do not apply when operating the device outside of its operating ratings. The maximum
allowable power dissipation is a function of the maximum junction temperature, TJ(max), the junc-
tion-to-ambient thermal resistance, θJA, and the ambient temperature, TA. The maximum allowable power
dissipation at any ambient temperature is calculated using: PD(max) = (TJ(max) – TA) ÷ θJA. Exceeding the
maximum allowable power dissipation will result in excessive die temperature, and the regulator will go
into thermal shutdown. The θJA of the 8-lead SOIC (M) is 63°C/W mounted on a PC board.
DS20005774A-page 4
2017 Microchip Technology Inc.
MIC5212
2.0
TYPICAL PERFORMANCE CURVES
Note: The graphs and tables provided following this note are a statistical summary based on a limited number of
samples and are provided for informational purposes only. The performance characteristics listed herein
are not tested or guaranteed. In some graphs or tables, the data presented may be outside the specified
operating range (e.g., outside specified power supply range) and therefore outside the warranted range.
90
80
70
60
50
40
30
20 C
90
80
70
60
50
40
30
20
10
0
OUT = 10μF Tantulum
VIN = 4.3V
COUT = 10μF Tantulum
VIN = 4.3V
10 VOUT = 3.3V
VOUT = 3.3V
IN = VOUT + 1V
0 V
V
IN = VOUT + 1V
10
1k
100
100k 1M
10k
100k
FREQUENCY (Hz)
10
100
1k
10k
1M
FREQUENCY (Hz)
FIGURE 2-1:
Load.
MIC5212-3.3 PSRR 150 mA
FIGURE 2-4:
Load.
MIC5212-2.5 PSRR 500 mA
90
80
70
60
50
40
30
20
10
0
14
500mA
12
10
8
6
300mA
4
COUT = 10μF Tantulum
VIN = 4.3V
OUT = 3.3V
VIN = VOUT + 1V
2
V
150mA
100μA
0
-40 -20
0
20 40 60 80 100 120
100k
FREQUENCY (Hz)
10
100
1k
10k
1M
TEMPERATURE (°C)
FIGURE 2-2:
Load.
MIC5212-3.3 PSRR 500 mA
FIGURE 2-5:
Temperature.
Ground Current vs.
90
80
70
60
50
40
30
800
700
600
500
400
300
200
100
0
OUT = 10μF Tantulum
VIN = 4.3V
20 C
10 VOUT = 3.3V
IN = VOUT + 1V
0 V
-40 -20
0
20 40 60 80 100 120
10
10k
100
1k
100k 1M
TEMPERATURE (°C)
FREQUENCY (Hz)
FIGURE 2-3:
Load.
MIC5212-2.5 PSRR 150 mA
FIGURE 2-6:
Temperature.
Short Circuit Current vs.
2017 Microchip Technology Inc.
DS20005774A-page 5
MIC5212
.
3.320
3.315
3.310
3.305
3.300
3.295
3.290
3.285
3.280
14
12
10
8
6
4
2
3.275
0
-40 -20
0
20 40 60 80 100 120
0
100 200 300 400 500
OUTPUT CURRENT (mA)
TEMPERATURE (°C)
FIGURE 2-7:
Output Voltage vs.
FIGURE 2-10:
Ground Current vs. Load
Temperature.
Current.
500
450
400
350
300
250
200
150
100
50
500mA
300mA
150mA
500mA
10mA
0
-40 -20
0
20 40 60 80 100 120
TEMPERATURE (°C)
TIME (1ms/div.)
FIGURE 2-11:
Output 1 Load Transient
FIGURE 2-8:
Dropout Voltage vs.
Response.
Temperature.
350
300
250
200
150
100
50
500mA
0
10mA
OUTPUT CURRENT (mA)
TIME (1ms/div.)
FIGURE 2-12:
Response.
Output 2 Load Transient
FIGURE 2-9:
Current.
Dropout Voltage vs. Load
DS20005774A-page 6
2017 Microchip Technology Inc.
MIC5212
7V
4.3V
TIME (1ms/div.)
FIGURE 2-13:
Line Transient Response.
6V
3.5V
TIME (1ms/div.)
FIGURE 2-14:
Line Transient Response.
3.3V, 500mA
2.5V, 200mA
TIME (40μs/div.)
FIGURE 2-15:
Turn-On Response.
2017 Microchip Technology Inc.
DS20005774A-page 7
MIC5212
3.0
PIN DESCRIPTIONS
The descriptions of the pins are listed in Table 3-1.
TABLE 3-1:
Pin Number
PIN FUNCTION TABLE
Pin Name
Description
1
OUTA
INA
Regulator A Output.
2
Regulator A Input.
Regulator B Input.
Regulator B Output.
Ground.
3
4
INB
OUTB
GND
5, 6, 7, 8
DS20005774A-page 8
2017 Microchip Technology Inc.
MIC5212
4.4
Dual-Supply Operation
4.0
4.1
DEVICE OVERVIEW
Input Capacitor
When used in dual supply systems where the regulator
load is returned to a negative supply, the output voltage
must be diode clamped to ground.
A 1 μF capacitor should be placed from IN to GND if
there is more than 10 inches of wire between the input
and the AC filter capacitor or if a battery is used as the
input.
4.4.1
POWER SO-8 THERMAL
CHARACTERISTICS
One of the secrets of the MIC5212’s performance is its
power SO-8 package featuring half the thermal
resistance of a standard SO-8 package. Lower thermal
resistance means more output current or higher input
voltage for a given package size.
4.2
Output Capacitor
An output capacitor is required between OUT and GND
to prevent oscillation. 1.0 μF minimum is
recommended. Larger values improve the regulator’s
transient response. The output capacitor value may be
increased without limit.
Lower thermal resistance is achieved by joining the
four ground leads with the die attach paddle to create a
single-unit electrical and thermal conductor. This
concept has been used by MOSFET manufacturers for
years, proving very reliable and cost effective for the
user.
The output capacitor should have an ESR (Effective
Series Resistance) of about 5Ω or less and a resonant
frequency above 1 MHz. Ultra-low-ESR capacitors
may cause
a
low-amplitude oscillation and/or
Thermal resistance consists of two main elements, θJC
underdamped transient response. Most tantalum or
aluminum electrolytic capacitors are adequate; film
types will work, but are more expensive. Since many
aluminum electrolytic capacitors have electrolytes that
freeze at about –30°C, solid tantalum capacitors are
recommended for operation below –25°C.
(junction-to-case thermal resistance) and θCA
(case-to-ambient thermal resistance). See Figure 4-1.
θJC is the resistance from the die to the leads of the
package. θCA is the resistance from the leads to the
ambient air and it includes θCS (case-to-sink thermal
resistance) and θSA (sink-to-ambient thermal
resistance).
At lower values of output current, less output
capacitance is required for output stability. The
capacitor can be reduced to 0.47 μF for current below
10 mA or 0.33 μF for currents below 1 mA.
4.3
No-Load Stability
SO-8
The MIC5212 will remain stable and in regulation with
no load (other than the internal voltage divider) unlike
many other voltage regulators. This is especially
important in CMOS RAM keep-alive applications.
θJA
ground plane
heat sink area
θJC
θCA
AMBIENT
printed circuit board
FIGURE 4-1:
Thermal Resistance.
Using the power SO-8 reduces the θJC dramatically
and allows the user to reduce θCA. The total thermal
resistance,
θJA
(junction-to-ambient
thermal
resistance) is the limiting factor in calculating the
maximum power dissipation capability of the device.
Typically, the power SO-8 has a θJC of 20°C/W, this is
significantly lower than the standard SO-8 which is
typically 75°C/W. θCA is reduced because pins 5
through 8 can now be soldered directly to a ground
plane which significantly reduces the case-to-sink
thermal resistance and sink to ambient thermal
resistance.
These low dropout linear regulators are rated to a
maximum junction temperature of 125°C. It is important
not to exceed this maximum junction temperature
2017 Microchip Technology Inc.
DS20005774A-page 9
MIC5212
during operation of the device. To prevent this
maximum junction temperature from being exceeded,
the appropriate ground plane heat sink must be used.
With a common 5V input, a 3.3V, 300 mA output on
LDO 1 and a 2.5V, 150 mA output on LDO 2, power
dissipation is as follows:
EQUATION 4-4:
900
800
700
600
500
400
300
200
100
0
5V – 3.3V 300mA + 5V 5mA
+ 5V – 2.5V 150mA + 5V 1.8mA
PD
PD
=
=
0.919W
From Figure 4-2, the minimum amount of copper
required to operate this application at a ∆T of 75°C is
500 mm2.
4.4.2
QUICK METHOD
0
0.25 0.50 0.75 1.00 1.25 1.50
POWER DISSIPATION (W)
Determine the power dissipation requirements for the
design along with the maximum ambient temperature
at which the device will be operated. Refer to
Figure 4-3, which shows safe operating curves for
three different ambient temperatures: 25°C, 50°C and
85°C. From these curves, the minimum amount of
copper can be determined by knowing the maximum
power dissipation required. If the maximum ambient
temperature is 50°C and the power dissipation is as
above, 920 mW, the curve in Figure 4-3 shows that the
required area of copper is 500 mm2.
FIGURE 4-2:
Power Dissipation (∆T ).
Copper Area vs. Power-SO
JA
Figure 4-2 shows copper area versus power
dissipation with each trace corresponding to a different
temperature rise above ambient.
From these curves, the minimum area of copper
necessary for the part to operate safely can be
determined. The maximum allowable temperature rise
must be calculated to determine operation along which
curve.
The θJA of this package is ideally 63°C/W, but it will
vary depending upon the availability of copper ground
plane to which it is attached.
EQUATION 4-1:
T = TJmax – TAmax
900
T
= 125°C
85°C
800
700
600
500
400
300
200
100
0
J
Where:
50°C 25°C
TJ(max)
TA(max)
= 125°C
= Maximum ambient operating
temperature
For example, the maximum ambient temperature is
50°C, the ∆T is determined as shown in Equation 4-2.
0
0.25 0.50 0.75 1.00 1.25 1.50
POWER DISSIPATION (W)
EQUATION 4-2:
∆T
∆T
=
=
125°C – 50°C
75°C
FIGURE 4-3:
Power Dissipation (T ).
Copper Area vs. Power-SO
A
Using Figure 4-2, the minimum amount of required
copper can be determined based on the required
power dissipation.
Power dissipation in a linear regulator is calculated as
shown in Equation 4-3.
EQUATION 4-3:
PD = VIN1 – VOUT1 IOUT1 + VIN1 IGND1
+ VIN2 – VOUT2 IOUT2 + VIIN2 IGND2
DS20005774A-page 10
2017 Microchip Technology Inc.
MIC5212
5.0
5.1
PACKAGING INFORMATION
Package Marking Information
8-lead SOIC*
Example
XXXX
-XXXX
5212
-SJYM
YYWW
1784
Legend: XX...X Product code or customer-specific information
Y
Year code (last digit of calendar year)
YY
WW
NNN
Year code (last 2 digits of calendar year)
Week code (week of January 1 is week ‘01’)
Alphanumeric traceability code
e
3
Pb-free JEDEC® designator for Matte Tin (Sn)
This package is Pb-free. The Pb-free JEDEC designator (
can be found on the outer packaging for this package.
*
e
3
)
●, ▲, ▼ Pin one index is identified by a dot, delta up, or delta down (triangle
mark).
Note: In the event the full Microchip part number cannot be marked on one line, it will
be carried over to the next line, thus limiting the number of available
characters for customer-specific information. Package may or may not include
the corporate logo.
Underbar (_) and/or Overbar (⎯) symbol may not be to scale.
2017 Microchip Technology Inc.
DS20005774A-page 11
MIC5212
8-Lead SOICN Package Outline & Recommended Land Pattern
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging.
DS20005774A-page 12
2017 Microchip Technology Inc.
MIC5212
APPENDIX A: REVISION HISTORY
Revision A (June 2017)
• Converted Micrel document MIC5212 to Micro-
chip data sheet template DS20005774A.
• Minor grammatical text changes throughout.
2017 Microchip Technology Inc.
DS20005774A-page 13
MIC5212
NOTES:
DS20005774A-page 14
2017 Microchip Technology Inc.
MIC5212
PRODUCT IDENTIFICATION SYSTEM
To order or obtain information, e.g., on pricing or delivery, contact your local Microchip representative or sales office.
Examples:
-X
-XX
PART NO.
Device
X
X
XX
a) MIC5212-SJYM:
Dual 500 mA LDO Regulator,
3.3V/2.5V Output Voltage,
1% Accuracy, –40°C to +125°C
Temperature Range, 8-Lead
SOIC, 95/Tube
Fixed
Output
Voltage
Media
Type
Accuracy Temperature Package
Range
Device:
MIC5212:
Dual 500 mA LDO Regulator
3.3V/2.5V
b) MIC5212-SJYM-TR: Dual 500 mA LDO Regulator,
3.3V/2.5V Output Voltage,
Fixed Output
Voltage:
S
=
1% Accuracy, –40°C to +125°C
Temperature Range, 8-Lead
SOIC, 2,500/Reel
Accuracy
J
=
=
1.0%
Temperature
Range:
Y
–40C to +125C (RoHS Compliant)
Note 1:
Tape and Reel identifier only appears in the
catalog part number description. This identifier is
used for ordering purposes and is not printed on
the device package. Check with your Microchip
Sales Office for package availability with the
Tape and Reel option.
Package:
M
=
=
8-Lead SOIC
2,500/Reel
Media Type:
TR
<blank>= 95/Tube
2017 Microchip Technology Inc.
DS20005774A-page 15
MIC5212
NOTES:
DS20005774A-page 16
2017 Microchip Technology Inc.
Note the following details of the code protection feature on Microchip devices:
•
Microchip products meet the specification contained in their particular Microchip Data Sheet.
•
Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the
intended manner and under normal conditions.
•
There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our
knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data
Sheets. Most likely, the person doing so is engaged in theft of intellectual property.
•
•
Microchip is willing to work with the customer who is concerned about the integrity of their code.
Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not
mean that we are guaranteeing the product as “unbreakable.”
Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our
products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts
allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act.
Information contained in this publication regarding device
applications and the like is provided only for your convenience
and may be superseded by updates. It is your responsibility to
ensure that your application meets with your specifications.
MICROCHIP MAKES NO REPRESENTATIONS OR
WARRANTIES OF ANY KIND WHETHER EXPRESS OR
IMPLIED, WRITTEN OR ORAL, STATUTORY OR
OTHERWISE, RELATED TO THE INFORMATION,
INCLUDING BUT NOT LIMITED TO ITS CONDITION,
QUALITY, PERFORMANCE, MERCHANTABILITY OR
FITNESS FOR PURPOSE. Microchip disclaims all liability
arising from this information and its use. Use of Microchip
devices in life support and/or safety applications is entirely at
the buyer’s risk, and the buyer agrees to defend, indemnify and
hold harmless Microchip from any and all damages, claims,
suits, or expenses resulting from such use. No licenses are
conveyed, implicitly or otherwise, under any Microchip
intellectual property rights unless otherwise stated.
Trademarks
The Microchip name and logo, the Microchip logo, AnyRate, AVR,
AVR logo, AVR Freaks, BeaconThings, BitCloud, CryptoMemory,
CryptoRF, dsPIC, FlashFlex, flexPWR, Heldo, JukeBlox, KEELOQ,
KEELOQ logo, Kleer, LANCheck, LINK MD, maXStylus,
maXTouch, MediaLB, megaAVR, MOST, MOST logo, MPLAB,
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Logo, SuperFlash, tinyAVR, UNI/O, and XMEGA are registered
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and other countries.
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mTouch, Precision Edge, and Quiet-Wire are registered
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Adjacent Key Suppression, AKS, Analog-for-the-Digital Age, Any
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QUALITYꢀMANAGEMENTꢀꢀSYSTEMꢀ
CERTIFIEDꢀBYꢀDNVꢀ
© 2017, Microchip Technology Incorporated, All Rights Reserved.
ISBN: 978-1-5224-1786-6
== ISO/TSꢀ16949ꢀ==ꢀ
2017 Microchip Technology Inc.
DS20005774A-page 17
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Tel: 91-80-3090-4444
Fax: 91-80-3090-4123
Finland - Espoo
Tel: 358-9-4520-820
Australia - Sydney
Tel: 61-2-9868-6733
Fax: 61-2-9868-6755
Web Address:
www.microchip.com
France - Paris
Tel: 33-1-69-53-63-20
Fax: 33-1-69-30-90-79
India - New Delhi
Tel: 91-11-4160-8631
Fax: 91-11-4160-8632
Atlanta
Duluth, GA
Tel: 678-957-9614
Fax: 678-957-1455
China - Beijing
Tel: 86-10-8569-7000
Fax: 86-10-8528-2104
France - Saint Cloud
Tel: 33-1-30-60-70-00
India - Pune
Tel: 91-20-3019-1500
China - Chengdu
Tel: 86-28-8665-5511
Fax: 86-28-8665-7889
Germany - Garching
Tel: 49-8931-9700
Germany - Haan
Austin, TX
Tel: 512-257-3370
Japan - Osaka
Tel: 81-6-6152-7160
Fax: 81-6-6152-9310
Boston
Tel: 49-2129-3766400
China - Chongqing
Tel: 86-23-8980-9588
Fax: 86-23-8980-9500
Westborough, MA
Tel: 774-760-0087
Fax: 774-760-0088
Japan - Tokyo
Tel: 81-3-6880- 3770
Fax: 81-3-6880-3771
Germany - Heilbronn
Tel: 49-7131-67-3636
China - Dongguan
Tel: 86-769-8702-9880
Germany - Karlsruhe
Tel: 49-721-625370
Chicago
Itasca, IL
Tel: 630-285-0071
Fax: 630-285-0075
Korea - Daegu
Tel: 82-53-744-4301
Fax: 82-53-744-4302
China - Guangzhou
Tel: 86-20-8755-8029
Germany - Munich
Tel: 49-89-627-144-0
Fax: 49-89-627-144-44
China - Hangzhou
Tel: 86-571-8792-8115
Fax: 86-571-8792-8116
Korea - Seoul
Dallas
Addison, TX
Tel: 972-818-7423
Fax: 972-818-2924
Tel: 82-2-554-7200
Fax: 82-2-558-5932 or
82-2-558-5934
Germany - Rosenheim
Tel: 49-8031-354-560
China - Hong Kong SAR
Tel: 852-2943-5100
Fax: 852-2401-3431
Israel - Ra’anana
Tel: 972-9-744-7705
Malaysia - Kuala Lumpur
Tel: 60-3-6201-9857
Fax: 60-3-6201-9859
Detroit
Novi, MI
Tel: 248-848-4000
Italy - Milan
Tel: 39-0331-742611
Fax: 39-0331-466781
China - Nanjing
Tel: 86-25-8473-2460
Fax: 86-25-8473-2470
Malaysia - Penang
Tel: 60-4-227-8870
Fax: 60-4-227-4068
Houston, TX
Tel: 281-894-5983
Italy - Padova
Tel: 39-049-7625286
China - Qingdao
Tel: 86-532-8502-7355
Fax: 86-532-8502-7205
Indianapolis
Noblesville, IN
Tel: 317-773-8323
Fax: 317-773-5453
Tel: 317-536-2380
Philippines - Manila
Tel: 63-2-634-9065
Fax: 63-2-634-9069
Netherlands - Drunen
Tel: 31-416-690399
Fax: 31-416-690340
China - Shanghai
Tel: 86-21-3326-8000
Fax: 86-21-3326-8021
Singapore
Tel: 65-6334-8870
Fax: 65-6334-8850
Norway - Trondheim
Tel: 47-7289-7561
Los Angeles
China - Shenyang
Tel: 86-24-2334-2829
Fax: 86-24-2334-2393
Mission Viejo, CA
Tel: 949-462-9523
Fax: 949-462-9608
Tel: 951-273-7800
Poland - Warsaw
Tel: 48-22-3325737
Taiwan - Hsin Chu
Tel: 886-3-5778-366
Fax: 886-3-5770-955
Romania - Bucharest
Tel: 40-21-407-87-50
China - Shenzhen
Tel: 86-755-8864-2200
Fax: 86-755-8203-1760
Taiwan - Kaohsiung
Tel: 886-7-213-7830
Raleigh, NC
Tel: 919-844-7510
Spain - Madrid
Tel: 34-91-708-08-90
Fax: 34-91-708-08-91
China - Wuhan
Tel: 86-27-5980-5300
Fax: 86-27-5980-5118
Taiwan - Taipei
Tel: 886-2-2508-8600
Fax: 886-2-2508-0102
New York, NY
Tel: 631-435-6000
Sweden - Gothenberg
Tel: 46-31-704-60-40
San Jose, CA
Tel: 408-735-9110
Tel: 408-436-4270
China - Xian
Tel: 86-29-8833-7252
Fax: 86-29-8833-7256
Thailand - Bangkok
Tel: 66-2-694-1351
Fax: 66-2-694-1350
Sweden - Stockholm
Tel: 46-8-5090-4654
Canada - Toronto
Tel: 905-695-1980
Fax: 905-695-2078
UK - Wokingham
Tel: 44-118-921-5800
Fax: 44-118-921-5820
DS00000A-page 18
2017 Microchip Technology Inc.
11/07/16
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