MIC5255-3.0YM5-TX [MICROCHIP]

Fixed Positive LDO Regulator;
MIC5255-3.0YM5-TX
型号: MIC5255-3.0YM5-TX
厂家: MICROCHIP    MICROCHIP
描述:

Fixed Positive LDO Regulator

光电二极管 输出元件 调节器
文件: 总22页 (文件大小:1507K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
MIC5255  
150 mA Low Noise µCap CMOS LDO  
Features  
General Description  
• Input Voltage Range: 2.7V to 6.0V  
• Thin SOT Package: 1 mm Height SOT-23-5  
• Ultra-Low Output Noise: 30 µVRMS  
• Stability with Ceramic Output Capacitors  
• Ultra-Low Dropout: 135 mV @ 150 mA  
• High output accuracy:  
The MIC5255 is an efficient, precise CMOS voltage  
regulator optimized for ultra-low-noise applications. It  
offers 1% initial accuracy, extremely-low dropout  
voltage (135 mV at 150 mA) and low ground current  
(typically 117 µA at full load). The MIC5255 provides a  
very low noise output, ideal for RF applications where  
a clean voltage source is required. A noise bypass pin  
is also available for further reduction of output noise.  
- 1.0% Initial Accuracy  
- 2.0% Over Temperature  
Designed specically for handheld and battery  
powered devices, the MIC5255 provides  
TTL-logic-compatible enable pin. When disabled,  
power consumption drops nearly to zero.  
a
• Low Quiescent Current: 90 µA  
• Tight Load and Line Regulation  
• TTL-Logic-Controlled Enable Input  
• “Zero” Off-Mode Current  
The MIC5255 also works with low-ESR ceramic  
capacitors, reducing the amount of board space  
necessary for power applications, critical in handheld  
wireless devices.  
• Thermal Shutdown and Current-Limit Protection  
Applications  
• Cellular Telephones and Pagers  
Key features include current limit, thermal shutdown,  
faster transient response, and an active clamp to speed  
up device turn-off. Available in the 6-pin 2 mm × 2 mm  
VDFN package, the SOT-23-5 package and the Thin  
SOT-23-5, which offers the same footprint as the  
standard SOT-23-5, but is only 1 mm tall. The MIC5255  
offers a range of output voltages.  
• Cellular Accessories  
• Battery-Powered Equipment  
• Laptop. Notebook, and Palmtop Computers  
• Consumer/Personal Electronics  
Package Types  
MIC5255-x.xYM5  
5-Pin SOT-23 (M5)  
(Top View)  
MIC5255-x.xYD5  
5-Pin TSOT23 (D5)  
(Top View)  
MIC5255-x.xYML  
6-Pin VDFN (ML)  
(Top View)  
EN GND IN  
EN GND IN  
3
2
1
3
2
1
6
5
4
BYP  
NC  
EN  
GND  
IN  
1
2
3
Wxx  
KWxx  
NWxx  
4
5
4
5
OUT  
BYP  
BYP  
OUT  
OUT  
2016 Microchip Technology Inc.  
DS20005661A-page 1  
MIC5255  
Typical Application Schematic  
MIC5255-X.X  
5-PIN SOT-23  
MIC5255-X.X  
6-PIN 2X2 VDFN  
VIN  
VOUT  
COUT  
MIC5255-x.xYML  
MIC5255-x.x_M5  
VIN  
VOUT  
ENABLE  
SHUTDOWN  
CIN = 1.0μF  
1
2
3
5
6
5
4
1
2
3
EN  
CBYP  
Ceramic  
(optional)  
COUT = 1.0μF  
Ceramic  
4
Enable  
Shutdown  
EN  
EN (pin 3) may be  
connected directly  
to IN (pin 1).  
ULTRA-LOW-NOISE REGULATOR  
APPLICATION  
C
BYP = 0.01μF  
Block Diagram  
IN  
Startup/  
Shutdown  
Control  
Q
uickstart/  
Noise  
Reference  
Voltage  
Cancellation  
EN  
BYP  
FAULT  
Thermal  
Sensor  
Error  
Amplifier  
Current  
OUT  
Amplifier  
Under-  
voltage  
Lockout  
ACTIVE SHUTDOWN  
GND  
DS20005661A-page 2  
2016 Microchip Technology Inc.  
MIC5255  
1.0  
ELECTRICAL CHARACTERISTICS  
Absolute Maximum Ratings †  
Supply Voltage (VIN) ......................................................................................................................................... 0V to +7V  
Enable Voltage (VEN) ........................................................................................................................................ 0V to +7V  
Power Dissipation (PD, Note 1)..............................................................................................................Internally Limited  
ESD Rating (Note 2) ..................................................................................................................................................2 kV  
Operating Ratings ‡  
Supply Voltage (VIN) .................................................................................................................................... +2.7V to +6V  
Enable Voltage (VEN) ..........................................................................................................................................0V to VIN  
† Notice: Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to the device.  
This is a stress rating only and functional operation of the device at those or any other conditions above those indicated  
in the operational sections of this specification is not intended. Exposure to maximum rating conditions for extended  
periods may affect device reliability.  
‡ Notice: The device is not guaranteed to function outside its operating ratings.  
Note 1: The maximum allowable power dissipation of any TA (ambient temperature) is PD(max) = (TJ(max) – TA) / θJA  
.
Exceeding the maximum allowable power dissipation will result in excessive die temperature, and the reg-  
ulator will go into thermal shutdown. The θJA of the MIC5255-x.xYM5 (all versions) is 235°C/W on a PC  
board. See the Thermal Considerations section for further details.  
2: Devices are ESD sensitive. Handling precautions recommended. Human body model, 1.5 kin series with  
100 pF.  
2016 Microchip Technology Inc.  
DS20005661A-page 3  
MIC5255  
TABLE 1-1:  
ELECTRICAL CHARACTERISTICS  
Electrical Characteristics: VIN = VOUT + 1V, VEN = VIN; IOUT = 100 µA; TJ = 25°C, bold values indicate –40°C TJ  
+125°C; unless noted. (Note 1).  
Parameters  
Sym.  
Min.  
Typ.  
Max.  
Units  
Conditions  
–1  
–2  
1
2
Output Voltage Accuracy  
VO  
%
I
OUT = 100 µA  
Line Regulation  
Load Regulation  
VLNR  
VLDR  
0.02  
0.05  
%/V  
%
VIN = VOUT + 1V to 6V  
IOUT = 0.1 mA to 150 mA;  
Note 2  
1.5  
2.5  
0.1  
90  
5
IOUT = 100 µA  
IOUT = 100 mA  
150  
200  
250  
5
VIN  
VOUT  
Dropout Voltage, Note 3  
mV  
135  
IOUT = 150 mA  
Quiescent Current  
IQ  
0.2  
90  
µA  
µA  
VEN 0.4V (shutdown)  
150  
IOUT = 0 mA  
Ground Pin Current, Note 4  
IGND  
117  
IOUT = 150 mA  
f = 10 Hz, COUT = 1.0 µF,  
CBYP = 0.01 µF  
60  
Ripple Rejection  
PSRR  
dB  
60  
50  
f = 100 Hz, VIN = VOUT +1V  
f = 10 kHz, VIN = VOUT +1V  
VOUT = 0V  
Current Limit  
ILIM  
en  
160  
425  
mA  
COUT = 1.0 µF, CBYP = 0.01 µF,  
f = 10 Hz to 100 kHz  
Output Voltage Noise  
Enable Input  
30  
µVRMS  
V
IN = 2.7V to 5.5V,  
Enable Input Logic-Low Voltage  
VIL  
VIH  
0.4  
V
V
regulator shutdown  
VIN = 2.7V to 5.5V,  
Enable Input Logic-High Voltage  
Enable Input Current  
1.6  
regulator enabled  
0.01  
0.01  
500  
µA  
µA  
VIL 0.4V, regulator shutdown  
IEN  
V
IH 1.6V, regulator enabled  
Shutdown Resistance Discharge  
Thermal Protection  
Thermal Shutdown Temperature  
Thermal Shutdown Hysteresis  
150  
10  
°C  
°C  
Note 1: Specification for packaged product only.  
2: Regulation is measured at constant junction temperature using low duty cycle pulse testing. Parts are  
tested for load regulation in the load range from 1.0 mA to 150 mA. Changes in output voltage due to  
heating effects are covered by the thermal regulation specication.  
3: Dropout voltage is defined as the input to output differential at which the output voltage drops 2% below its  
nominal value measured at 1V differential. For outputs below 2.7V, dropout voltage is the input-to-output  
voltage differential with the minimum input voltage 2.7V. Minimum input operating voltage is 2.7V.  
4: Ground pin current is the regulator quiescent current. The total current drawn from the supply is the sum of  
the load current plus the ground pin current.  
DS20005661A-page 4  
2016 Microchip Technology Inc.  
MIC5255  
TEMPERATURE SPECIFICATIONS  
Parameters  
Temperature Ranges  
Sym.  
Min.  
Typ.  
Max.  
Units  
Conditions  
Junction Operating Temperature  
Range  
TJ  
–40  
+125  
°C  
Note 1  
Storage Temperature  
TS  
–60  
+150  
+260  
°C  
°C  
Lead Temperature  
Soldering, 5s  
Package Thermal Resistances  
Thermal Resistance, SOT-23-5  
Thermal Resistance, 2x2 VDFN-6  
JA  
JA  
235  
90  
°C/W  
°C/W  
Note 1: The maximum allowable power dissipation is a function of ambient temperature, the maximum allowable  
junction temperature and the thermal resistance from junction to air (i.e., TA, TJ, JA). Exceeding the  
maximum allowable power dissipation will cause the device operating junction temperature to exceed the  
maximum +125°C rating. Sustained junction temperatures above +125°C can impact the device reliability.  
2016 Microchip Technology Inc.  
DS20005661A-page 5  
MIC5255  
2.0  
TYPICAL PERFORMANCE CURVES  
Note: The graphs and tables provided following this note are a statistical summary based on a limited number of  
samples and are provided for informational purposes only. The performance characteristics listed herein  
are not tested or guaranteed. In some graphs or tables, the data presented may be outside the specified  
operating range (e.g., outside specified power supply range) and therefore outside the warranted range.  
70  
70  
60  
ILOAD = 100μA  
60  
50  
50  
40  
30  
20  
10  
0
100μA*  
50mA*  
100mA*  
40  
30  
20  
10  
0
ILOAD = 150mA  
150mA*  
*ILOAD  
COUT = 1μF Ceramic  
COUT = 1μF  
CBYP = 0  
0
200 400 600 800 1000  
VOLTAGE DROP (mV)  
FREQUENCY (Hz)  
FIGURE 2-1:  
Ratio.  
Power Supply Rejection  
FIGURE 2-4:  
PSRR vs. Voltage Drop.  
70  
60  
50  
40  
30  
20  
80  
70  
60  
50  
40  
30  
20  
10  
0
ILOAD = 100μA  
ILOAD = 150mA  
100μA*  
50mA*  
100mA*  
150mA*  
* ILOAD  
10 COUT = 4.7μF Ceramic  
COUT = 1μF  
CBYP = 0.01μF  
0
0
200 400 600 800 1000  
VOLTAGE DROP (mV)  
FREQUENCY (Hz)  
FIGURE 2-5:  
PSRR vs. Voltage Drop.  
FIGURE 2-2:  
Power Supply Rejection  
Ratio.  
70  
130  
125  
120  
115  
110  
105  
100  
60  
50  
40  
30  
20  
10  
0
0μF*  
0.01μF*  
0.1μF*  
1.0μF*  
* CBYP  
ILOAD = 50mA  
VIN = VOUT + 0.5V  
COUT = 1μF Ceramic  
VIN = VOUT + 1V  
0.1  
1
10  
100  
1000  
OUTPUT CURRENT (mA)  
FREQUENCY (Hz)  
FIGURE 2-6:  
Ground Pin Current.  
FIGURE 2-3:  
Power Supply Rejection  
Ratio.  
DS20005661A-page 6  
2016 Microchip Technology Inc.  
MIC5255  
115  
113  
111  
109  
107  
105  
103  
101  
99  
140  
120  
100  
80  
60  
40  
20  
97  
ILOAD = 100μA  
ILOAD = 150mA  
95  
0
-40 -20  
0
20 40 60 80 100120140  
0 0.5 1 1.5 2 2.5 3 3.5 4 4.5 5  
INPUT VOLTAGE (V)  
TEMPERATURE (°C)  
FIGURE 2-7:  
Ground Pin Current.  
FIGURE 2-10:  
Ground Pin Current.  
3.5  
3.0  
2.5  
2.0  
1.5  
1.0  
0.5  
0
125  
120  
115  
110  
105  
100  
95  
ILOAD = 100μA  
ILOAD = 150mA  
ILOAD = 150mA  
0 0.5 1 1.5 2 2.5 3 3.5 4 4.5 5  
INPUT VOLTAGE (V)  
-40 -20  
0 20 40 60 80 100120140  
TEMPERATURE (°C)  
FIGURE 2-11:  
Dropout Characteristics.  
FIGURE 2-8:  
Ground Pin Current.  
0.14  
0.12  
0.10  
0.08  
0.06  
0.04  
0.02  
0
140  
120  
100  
80  
60  
40  
20  
ILOAD = 100μA  
ILOAD = 100μA  
0
-40 -20  
0 20 40 60 80 100120140  
TEMPERATURE (°C)  
0 0.5 1 1.5 2 2.5 3 3.5 4 4.5 5  
INPUT VOLTAGE (V)  
FIGURE 2-12:  
Dropout Voltage.  
FIGURE 2-9:  
Ground Pin Current.  
2016 Microchip Technology Inc.  
DS20005661A-page 7  
MIC5255  
500  
500  
450  
400  
350  
300  
250  
200  
150  
100  
50  
VIN = VOUT + 1V  
490  
480  
470  
460  
450  
440  
430  
420  
410  
400  
CIN = 1μF Ceramic  
COUT = 1μF Ceramic  
ILOAD = 100μA  
Rise Time  
Prop Delay  
0
-40 -20  
0 20 40 60 80 100120140  
TEMPERATURE (°C)  
100  
1000 10000 1000001000000  
BYPASS CAPACITANCE (pF)  
FIGURE 2-13:  
Short Circuit Current.  
FIGURE 2-16:  
Turn-On Time vs. Bypass  
Capacitance.  
3.05  
3.04  
3.03  
3.02  
3.01  
3.00  
2.99  
2.98  
2.97  
2.96  
2.95  
5V  
4V  
CIN = 1μF Ceramic  
OUT = 1μF Ceramic  
C
C
BYP = 0.01μF  
OUT = 100μA  
I
ILOAD = 100μA  
-40 -20  
0 20 40 60 80 100120140  
TEMPERATURE (°C)  
TIME (400μs/div)  
FIGURE 2-14:  
Output Voltage vs.  
FIGURE 2-17:  
Line Transient Response.  
Temperature.  
1.3  
1.25  
1.2  
1.15  
1.1  
1.05  
1
CIN = 1μF Ceramic  
C
OUT = 1μF Ceramic  
C
BYP = 0.01μF  
IN = 4V  
V
150mA  
0.95  
0.9  
100μA  
0.85  
0.8  
ILOAD = 100μA  
-40 -20  
0 20 40 60 80 100120140  
TEMPERATURE (°C)  
TIME (4μs/div)  
FIGURE 2-15:  
Enable Threshold vs.  
FIGURE 2-18:  
Load Transient Response.  
Temperature.  
DS20005661A-page 8  
2016 Microchip Technology Inc.  
MIC5255  
CIN = 1μF Ceramic  
OUT = 1μF Ceramic  
C
C
BYP = 0.01μF  
OUT = 100μA  
I
TIME (10μs/div)  
FIGURE 2-19:  
Enable Pin Delay.  
CIN = 1μF Ceramic  
OUT = 1μF Ceramic  
BYP = 0.01μF  
IN = 4V  
C
C
V
TIME (400μs/div)  
FIGURE 2-20:  
Shutdown Delay.  
2016 Microchip Technology Inc.  
DS20005661A-page 9  
MIC5255  
3.0  
PIN DESCRIPTIONS  
The descriptions of the pins are listed in Table 3-1.  
TABLE 3-1:  
PIN FUNCTION TABLE  
Pin Number  
SOT23-5  
TSOT23-5  
Pin Number  
VDFN-6  
Pin Name  
Description  
1
2
3
3
2
1
IN  
GND  
EN  
Supply Input.  
Ground.  
Enable/Shutdown (Input): CMOS-compatible input. Logic-high =  
enable; logic-low = shutdown. Do not leave open.  
4
6
BYP  
Reference Bypass: Connect external 0.01 µF CBYP 1.0 µF  
capacitor to GND to reduce output noise. May be left open.  
5
4
5
OUT  
NC  
Regulator Output.  
No internal connection.  
EP  
GND  
Ground: Internally connected to the exposed pad. Connect  
externally to GND pin.  
DS20005661A-page 10  
2016 Microchip Technology Inc.  
MIC5255  
MIC5255 to drive a large capacitor on the bypass pin  
without signicantly slowing turn-on time. Refer to the  
Typical Performance Curves section for performance  
with different bypass capacitors.  
4.0  
4.1  
APPLICATION INFORMATION  
Enable Shutdown  
The MIC5255 comes with an active-high enable pin  
that allows the regulator to be disabled. Forcing the  
enable pin low disables the regulator and sends it into  
a “zero” off-mode current state. In this state, current  
consumed by the regulator goes nearly to zero. Forcing  
the enable pin high enables the output voltage. This  
part is CMOS and the enable pin cannot be left oating;  
a oating enable pin may cause an indeterminate state  
on the output.  
4.5  
Active Shutdown  
The MIC5255 also features an active shutdown clamp,  
which is an N-Channel MOSFET that turns on when the  
device is disabled. This allows the output capacitor and  
load to discharge, de-energizing the load.  
4.6  
No-Load Stability  
The MIC5255 will remain stable and in regulation with  
no load unlike many other voltage regulators. This is  
especially important in CMOS RAM keep-alive  
applications.  
4.2  
Input Capacitor  
The MIC5255 is a high performance, high bandwidth  
device. Therefore, it requires a well-bypassed input  
supply for optimal performance. A 1 µF capacitor is  
required from the input to ground to provide stability.  
Low-ESR ceramic capacitors provide optimal  
performance at a minimum of space. Additional high  
frequency capacitors, such as small valued NPO  
dielectric type capacitors, help lter out high frequency  
noise and are good practice in any RF-based circuit.  
4.7  
Thermal Considerations  
The MIC5255 is designed to provide 150 mA of  
continuous current in a very small package. Maximum  
power dissipation can be calculated based on the  
output current and the voltage drop across the part. To  
determine the maximum power dissipation of the  
package, use the junction-to-ambient thermal  
resistance of the device and the following basic  
equation:  
4.3  
Output Capacitor  
The MIC5255 requires an output capacitor for stability.  
The design requires 1 µF or greater on the output to  
maintain stability. The design is optimized for use with  
low-ESR ceramic chip capacitors. High ESR capacitors  
may cause high frequency oscillation. The maximum  
recommended ESR is 300 m. The output capacitor  
can be increased, but performance has been optimized  
for a 1 µF ceramic output capacitor and does not  
improve signicantly with larger capacitance.  
EQUATION 4-1:  
T
JMAXTA  
-------------------------------  
PDMAX  
=
JA  
X7R/X5R dielectric-type ceramic capacitors are  
recommended because of their temperature  
performance. X7R-type capacitors change capacitance  
by 15% over their operating temperature range and are  
the most stable type of ceramic capacitors. Z5U and  
Y5V dielectric capacitors change value by as much as  
50% and 60%, respectively, over their operating  
temperature ranges. To use a ceramic chip capacitor  
with Y5V dielectric, the value must be much higher than  
an X7R ceramic capacitor to ensure the same  
minimum capacitance over the equivalent operating  
temperature range.  
TJ(MAX) is the maximum junction temperature of the  
die, 125°C, and TA is the ambient operating  
temperature. θJA is layout dependent; Table 4-1 shows  
examples of junction-to-ambient thermal resistance for  
the MIC5255.  
TABLE 4-1:  
SOT23-5 THERMAL  
RESISTANCE  
θJA  
θJA 1”  
Square  
Copper  
Clad  
Recommended  
Minimum  
Package  
θJC  
Footprint  
4.4  
Bypass Capacitor  
SOT23-5  
(M5 or D5)  
235°C/W  
185°C/W 145°C/W  
A capacitor can be placed from the noise bypass pin to  
ground to reduce output voltage noise. The capacitor  
bypasses the internal reference. A 0.01 µF capacitor is  
recommended for applications that require low-noise  
outputs. The bypass capacitor can be increased,  
further reducing noise and improving PSRR. Turn-on  
time increases slightly with respect to bypass  
capacitance. A unique quick-start circuit allows the  
The actual power dissipation of the regulator circuit can  
be determined using the equation:  
2016 Microchip Technology Inc.  
DS20005661A-page 11  
MIC5255  
EQUATION 4-2:  
EQUATION 4-6:  
PD = VIN VOUTIOUT + VIN IGND  
769mW = VIN 150mA  
Substituting PD(MAX) for PD and solving for the  
operating conditions that are critical to the application  
will give the maximum operating conditions for the  
regulator circuit. For example, when operating the  
MIC5255-3.0YM5 at +50°C with a minimum footprint  
layout, the maximum input voltage for a set output  
current can be determined as follows:  
EQUATION 4-7:  
VINMAX= 5.12V  
EQUATION 4-3:  
Therefore, a 3.0V application at 150 mA of output  
current can accept a maximum input voltage of 5.12V  
in a SOT23-5 package.  
o
o
125 C – 50 C  
----------------------------------  
PDMAX  
=
= 319mW  
235oC/W  
The junction-to-ambient thermal resistance for the  
minimum footprint is 235°C/W, from Table 4-1. The  
maximum power dissipation must not be exceeded for  
proper operation. Using the output voltage of 3.0V and  
an output current of 150 mA, the maximum input  
voltage can be determined for the series of equations  
between Equation 4-4 and Equation 4-7. Because this  
device is CMOS and the ground current is typically  
100 µA over the load range, the power dissipation  
contributed by the ground current is <1% and can be  
ignored for this calculation:  
EQUATION 4-4:  
319mW = VIN – 3.0V  150mA  
EQUATION 4-5:  
319mW = VIN 150mA – 450mW  
DS20005661A-page 12  
2016 Microchip Technology Inc.  
MIC5255  
5.0  
5.1  
PACKAGING INFORMATION  
Package Marking Information  
5-Pin TSOT-23*  
Example  
XXXX  
NW29  
5-Pin SOT-23*  
Example  
XXXX  
KW25  
6-Pin VDFN*  
Example  
XXX  
YWW  
W2J  
523  
Legend: XX...X Product code or customer-specific information  
Y
Year code (last digit of calendar year)  
YY  
WW  
NNN  
Year code (last 2 digits of calendar year)  
Week code (week of January 1 is week ‘01’)  
Alphanumeric traceability code  
Pb-free JEDEC® designator for Matte Tin (Sn)  
This package is Pb-free. The Pb-free JEDEC designator (  
can be found on the outer packaging for this package.  
e
3
*
)
e
3
, , Pin one index is identified by a dot, delta up, or delta down (triangle  
mark).  
Note: In the event the full Microchip part number cannot be marked on one line, it will  
be carried over to the next line, thus limiting the number of available  
characters for customer-specific information. Package may or may not include  
the corporate logo.  
Underbar (_) and/or Overbar () symbol may not be to scale.  
2016 Microchip Technology Inc.  
DS20005661A-page 13  
MIC5255  
5-Pin SOT-23 Package Outline and Recommended Land Pattern  
Note: For the most current package drawings, please see the Microchip Packaging Specification located at  
http://www.microchip.com/packaging.  
DS20005661A-page 14  
2016 Microchip Technology Inc.  
MIC5255  
5-Pin TSOT-23 Package Outline and Recommended Land Pattern  
Note: For the most current package drawings, please see the Microchip Packaging Specification located at  
http://www.microchip.com/packaging.  
2016 Microchip Technology Inc.  
DS20005661A-page 15  
MIC5255  
6-Pin 2 mm x 2 mm VDFN Package Outline and Recommended Land Pattern  
Note: For the most current package drawings, please see the Microchip Packaging Specification located at  
http://www.microchip.com/packaging.  
DS20005661A-page 16  
2016 Microchip Technology Inc.  
MIC5255  
APPENDIX A: REVISION HISTORY  
Revision A (November 2016)  
• Converted Micrel document MIC5255 to Micro-  
chip data sheet DS20005661A.  
• Minor text changes throughout.  
• Leaded parts (B-designated) removed from data  
sheet.  
• Voltage options updated in the Product Identifica-  
tion System section.  
• DFN package naming updated to Microchip-stan-  
dard VDFN package.  
• Typical ground current updated on Page 1.  
• Equation values on Page 12 updated.  
2016 Microchip Technology Inc.  
DS20005661A-page 17  
MIC5255  
NOTES:  
DS20005661A-page 18  
2016 Microchip Technology Inc.  
MIC5255  
PRODUCT IDENTIFICATION SYSTEM  
To order or obtain information, e.g., on pricing or delivery, contact your local Microchip representative or sales office.  
Examples:  
PART NO.  
Device  
X.X  
X
XX  
X.X  
a) MIC5255-2.5YM5-TR: 150 mA Low Noise µCap CMOS  
LDO, 2.5V Output Voltage,  
Voltage  
Media Type  
Temperature Package  
–40°C to +125°C Temp. Range,  
5-Pin SOT-23, 3,000/Reel  
Device:  
MIC5255:  
150 mA Low Noise µCap CMOS LDO  
b) MIC5255-2.5YD5-TX: 150 mA Low Noise µCap CMOS  
LDO, 2.5V Output Voltage,  
–40°C to +125°C Temp. Range,  
Voltage:  
(Note 1, Note 2,  
Note 3)  
2.5  
2.8  
3.0  
3.2  
3.3  
=
=
=
=
=
2.5V  
2.8V  
3.0V  
3.2V  
3.3V  
5-Pin TSOT-23, 3,000/Reel with  
Reverse Pin 1 Orientation  
c) MIC5255-2.8YML-TR: 150 mA Low Noise µCap CMOS  
LDO, 2.8V Output Voltage,  
–40°C to +125°C Temp. Range,  
6-Pin VDFN, 5,000/Reel  
Temperature:  
Package:  
Y
=
–40°C to +125°C  
d) MIC5255-3.0YD5-TX: 150 mA Low Noise µCap CMOS  
LDO, 3.0V Output Voltage,  
M5  
D5  
ML  
=
=
=
5-Pin SOT-23  
5-Pin TSOT-23  
6-Pin 2 mm x 2 mm VDFN  
–40°C to +125°C Temp. Range,  
5-Pin TSOT-23, 3,000/Reel with  
Reverse Pin 1 Orientation  
e) MIC5255-3.2YM5-TR: 150 mA Low Noise µCap CMOS  
LDO, 3.2V Output Voltage,  
Media Type:  
(Note 4)  
TR  
TX  
=
=
3,000/Reel (5,000/Reel if ML package option)  
3,000/Reel with Reverse Pin 1 Orientation  
–40°C to +125°C Temp. Range,  
5-Pin SOT-23, 3,000/Reel  
Note 1:  
2:  
Other voltage options available. Contact Microchip for details.  
The 5-Pin TSOT package (D5) is not available in the 3.2V  
option.  
f) MIC5255-3.3YML-TR: 150 mA Low Noise µCap CMOS  
LDO, 3.3V Output Voltage,  
–40°C to +125°C Temp. Range,  
3:  
4:  
The 6-Pin VDFN package (ML) is not available in 2.5V and 3.2V  
options.  
6-Pin VDFN, 5,000/Reel  
The TX media type is not available with the ML package option.  
Note 1:  
Tape and Reel identifier only appears in the  
catalog part number description. This identifier is  
used for ordering purposes and is not printed on  
the device package. Check with your Microchip  
Sales Office for package availability with the  
Tape and Reel option.  
2016 Microchip Technology Inc.  
DS20005661A-page 19  
MIC5255  
NOTES:  
DS20005661A-page 20  
2016 Microchip Technology Inc.  
Note the following details of the code protection feature on Microchip devices:  
Microchip products meet the specification contained in their particular Microchip Data Sheet.  
Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the  
intended manner and under normal conditions.  
There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our  
knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data  
Sheets. Most likely, the person doing so is engaged in theft of intellectual property.  
Microchip is willing to work with the customer who is concerned about the integrity of their code.  
Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not  
mean that we are guaranteeing the product as “unbreakable.”  
Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our  
products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts  
allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act.  
Information contained in this publication regarding device  
applications and the like is provided only for your convenience  
and may be superseded by updates. It is your responsibility to  
ensure that your application meets with your specifications.  
MICROCHIP MAKES NO REPRESENTATIONS OR  
WARRANTIES OF ANY KIND WHETHER EXPRESS OR  
IMPLIED, WRITTEN OR ORAL, STATUTORY OR  
OTHERWISE, RELATED TO THE INFORMATION,  
INCLUDING BUT NOT LIMITED TO ITS CONDITION,  
QUALITY, PERFORMANCE, MERCHANTABILITY OR  
FITNESS FOR PURPOSE. Microchip disclaims all liability  
arising from this information and its use. Use of Microchip  
devices in life support and/or safety applications is entirely at  
the buyer’s risk, and the buyer agrees to defend, indemnify and  
hold harmless Microchip from any and all damages, claims,  
suits, or expenses resulting from such use. No licenses are  
conveyed, implicitly or otherwise, under any Microchip  
intellectual property rights unless otherwise stated.  
Trademarks  
The Microchip name and logo, the Microchip logo, AnyRate,  
dsPIC, FlashFlex, flexPWR, Heldo, JukeBlox, KeeLoq,  
KeeLoq logo, Kleer, LANCheck, LINK MD, MediaLB, MOST,  
MOST logo, MPLAB, OptoLyzer, PIC, PICSTART, PIC32 logo,  
RightTouch, SpyNIC, SST, SST Logo, SuperFlash and UNI/O  
are registered trademarks of Microchip Technology  
Incorporated in the U.S.A. and other countries.  
ClockWorks, The Embedded Control Solutions Company,  
ETHERSYNCH, Hyper Speed Control, HyperLight Load,  
IntelliMOS, mTouch, Precision Edge, and QUIET-WIRE are  
registered trademarks of Microchip Technology Incorporated  
in the U.S.A.  
Analog-for-the-Digital Age, Any Capacitor, AnyIn, AnyOut,  
BodyCom, chipKIT, chipKIT logo, CodeGuard, dsPICDEM,  
dsPICDEM.net, Dynamic Average Matching, DAM, ECAN,  
EtherGREEN, In-Circuit Serial Programming, ICSP, Inter-Chip  
Connectivity, JitterBlocker, KleerNet, KleerNet logo, MiWi,  
motorBench, MPASM, MPF, MPLAB Certified logo, MPLIB,  
MPLINK, MultiTRAK, NetDetach, Omniscient Code  
Generation, PICDEM, PICDEM.net, PICkit, PICtail,  
PureSilicon, RightTouch logo, REAL ICE, Ripple Blocker,  
Serial Quad I/O, SQI, SuperSwitcher, SuperSwitcher II, Total  
Endurance, TSHARC, USBCheck, VariSense, ViewSpan,  
WiperLock, Wireless DNA, and ZENA are trademarks of  
Microchip Technology Incorporated in the U.S.A. and other  
countries.  
SQTP is a service mark of Microchip Technology Incorporated  
in the U.S.A.  
Microchip received ISO/TS-16949:2009 certification for its worldwide  
headquarters, design and wafer fabrication facilities in Chandler and  
Tempe, Arizona; Gresham, Oregon and design centers in California  
and India. The Company’s quality system processes and procedures  
are for its PIC® MCUs and dsPIC® DSCs, KEELOQ® code hopping  
devices, Serial EEPROMs, microperipherals, nonvolatile memory and  
analog products. In addition, Microchip’s quality system for the design  
and manufacture of development systems is ISO 9001:2000 certified.  
Silicon Storage Technology is a registered trademark of  
Microchip Technology Inc. in other countries.  
GestIC is a registered trademarks of Microchip Technology  
Germany II GmbH & Co. KG, a subsidiary of Microchip  
Technology Inc., in other countries.  
All other trademarks mentioned herein are property of their  
respective companies.  
QUALITYMANAGEMENTꢀꢀSYSTEMꢀ  
CERTIFIEDBYDNVꢀ  
© 2016, Microchip Technology Incorporated, Printed in the  
U.S.A., All Rights Reserved.  
ISBN: 978-1-5224-1071-3  
== ISO/TS16949==ꢀ  
2016 Microchip Technology Inc.  
DS20005661A-page 21  
Worldwide Sales and Service  
AMERICAS  
ASIA/PACIFIC  
ASIA/PACIFIC  
EUROPE  
Corporate Office  
2355 West Chandler Blvd.  
Chandler, AZ 85224-6199  
Tel: 480-792-7200  
Fax: 480-792-7277  
Technical Support:  
http://www.microchip.com/  
support  
Asia Pacific Office  
China - Xiamen  
Tel: 86-592-2388138  
Fax: 86-592-2388130  
Austria - Wels  
Tel: 43-7242-2244-39  
Fax: 43-7242-2244-393  
Suites 3707-14, 37th Floor  
Tower 6, The Gateway  
Harbour City, Kowloon  
China - Zhuhai  
Tel: 86-756-3210040  
Fax: 86-756-3210049  
Denmark - Copenhagen  
Tel: 45-4450-2828  
Fax: 45-4485-2829  
Hong Kong  
Tel: 852-2943-5100  
Fax: 852-2401-3431  
India - Bangalore  
Tel: 91-80-3090-4444  
Fax: 91-80-3090-4123  
Finland - Espoo  
Tel: 358-9-4520-820  
Australia - Sydney  
Tel: 61-2-9868-6733  
Fax: 61-2-9868-6755  
Web Address:  
www.microchip.com  
France - Paris  
Tel: 33-1-69-53-63-20  
Fax: 33-1-69-30-90-79  
India - New Delhi  
Tel: 91-11-4160-8631  
Fax: 91-11-4160-8632  
Atlanta  
Duluth, GA  
Tel: 678-957-9614  
Fax: 678-957-1455  
China - Beijing  
Tel: 86-10-8569-7000  
Fax: 86-10-8528-2104  
France - Saint Cloud  
Tel: 33-1-30-60-70-00  
India - Pune  
Tel: 91-20-3019-1500  
China - Chengdu  
Tel: 86-28-8665-5511  
Fax: 86-28-8665-7889  
Germany - Garching  
Tel: 49-8931-9700  
Germany - Haan  
Austin, TX  
Tel: 512-257-3370  
Japan - Osaka  
Tel: 81-6-6152-7160  
Fax: 81-6-6152-9310  
Boston  
Tel: 49-2129-3766400  
China - Chongqing  
Tel: 86-23-8980-9588  
Fax: 86-23-8980-9500  
Westborough, MA  
Tel: 774-760-0087  
Fax: 774-760-0088  
Japan - Tokyo  
Tel: 81-3-6880- 3770  
Fax: 81-3-6880-3771  
Germany - Heilbronn  
Tel: 49-7131-67-3636  
China - Dongguan  
Tel: 86-769-8702-9880  
Germany - Karlsruhe  
Tel: 49-721-625370  
Chicago  
Itasca, IL  
Tel: 630-285-0071  
Fax: 630-285-0075  
Korea - Daegu  
Tel: 82-53-744-4301  
Fax: 82-53-744-4302  
China - Guangzhou  
Tel: 86-20-8755-8029  
Germany - Munich  
Tel: 49-89-627-144-0  
Fax: 49-89-627-144-44  
China - Hangzhou  
Tel: 86-571-8792-8115  
Fax: 86-571-8792-8116  
Korea - Seoul  
Dallas  
Addison, TX  
Tel: 972-818-7423  
Fax: 972-818-2924  
Tel: 82-2-554-7200  
Fax: 82-2-558-5932 or  
82-2-558-5934  
Germany - Rosenheim  
Tel: 49-8031-354-560  
China - Hong Kong SAR  
Tel: 852-2943-5100  
Fax: 852-2401-3431  
Israel - Ra’anana  
Tel: 972-9-744-7705  
Malaysia - Kuala Lumpur  
Tel: 60-3-6201-9857  
Fax: 60-3-6201-9859  
Detroit  
Novi, MI  
Tel: 248-848-4000  
Italy - Milan  
Tel: 39-0331-742611  
Fax: 39-0331-466781  
China - Nanjing  
Tel: 86-25-8473-2460  
Fax: 86-25-8473-2470  
Malaysia - Penang  
Tel: 60-4-227-8870  
Fax: 60-4-227-4068  
Houston, TX  
Tel: 281-894-5983  
Italy - Padova  
Tel: 39-049-7625286  
China - Qingdao  
Tel: 86-532-8502-7355  
Fax: 86-532-8502-7205  
Indianapolis  
Noblesville, IN  
Tel: 317-773-8323  
Fax: 317-773-5453  
Tel: 317-536-2380  
Philippines - Manila  
Tel: 63-2-634-9065  
Fax: 63-2-634-9069  
Netherlands - Drunen  
Tel: 31-416-690399  
Fax: 31-416-690340  
China - Shanghai  
Tel: 86-21-3326-8000  
Fax: 86-21-3326-8021  
Singapore  
Tel: 65-6334-8870  
Fax: 65-6334-8850  
Norway - Trondheim  
Tel: 47-7289-7561  
Los Angeles  
China - Shenyang  
Tel: 86-24-2334-2829  
Fax: 86-24-2334-2393  
Mission Viejo, CA  
Tel: 949-462-9523  
Fax: 949-462-9608  
Tel: 951-273-7800  
Poland - Warsaw  
Tel: 48-22-3325737  
Taiwan - Hsin Chu  
Tel: 886-3-5778-366  
Fax: 886-3-5770-955  
Romania - Bucharest  
Tel: 40-21-407-87-50  
China - Shenzhen  
Tel: 86-755-8864-2200  
Fax: 86-755-8203-1760  
Taiwan - Kaohsiung  
Tel: 886-7-213-7830  
Raleigh, NC  
Tel: 919-844-7510  
Spain - Madrid  
Tel: 34-91-708-08-90  
Fax: 34-91-708-08-91  
China - Wuhan  
Tel: 86-27-5980-5300  
Fax: 86-27-5980-5118  
Taiwan - Taipei  
Tel: 886-2-2508-8600  
Fax: 886-2-2508-0102  
New York, NY  
Tel: 631-435-6000  
Sweden - Gothenberg  
Tel: 46-31-704-60-40  
San Jose, CA  
Tel: 408-735-9110  
Tel: 408-436-4270  
China - Xian  
Tel: 86-29-8833-7252  
Fax: 86-29-8833-7256  
Thailand - Bangkok  
Tel: 66-2-694-1351  
Fax: 66-2-694-1350  
Sweden - Stockholm  
Tel: 46-8-5090-4654  
Canada - Toronto  
Tel: 905-695-1980  
Fax: 905-695-2078  
UK - Wokingham  
Tel: 44-118-921-5800  
Fax: 44-118-921-5820  
DS20005661A-page 22  
2016 Microchip Technology Inc.  
11/07/16  

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