MIC5319-3.0YD5-TX [MICROCHIP]
Fixed Positive LDO Regulator;
| 型号： | MIC5319-3.0YD5-TX |
| 厂家： | 
MICROCHIP |
| 描述： | Fixed Positive LDO Regulator 输出元件 调节器 |
| 文件： | 总22页 (文件大小：1053K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
MIC5319
500 mA, µCap Ultra-Low Dropout Regulator with High PSRR
Features
General Description
• Ultra-Low Dropout Voltage: 200 mV @ 500 mA
• Input Voltage Range: 2.5V to 5.5V
• Output Voltage:
The MIC5319 is a high performance, 500 mA LDO
regulator, with high PSRR and very low noise, with low
ground current.
Ideal for battery-operated applications, the MIC5319
features 1% accuracy, very low dropout voltage
(typically 200 mV @ 500 mA), and low ground current
at light load (typically 90 µA). Equipped with a
logic-compatible enable pin, the MIC5319 can be set
into a zero-off-mode current state, typically drawing
only 0.5 µA current when disabled.
- Adjustable: VREF = 1.25V
- Fixed: 1.3V, 1.8V, 1.85V, 2.5V, 2.6V, 2.7V,
2.8V, 2.85V, 2.9V, 3.0V, 3.3V
• Stable with Low ESR Ceramic Output Capacitor
• Low Output Noise: 40 µVRMS (10 Hz to 100 kHz
Bandwidth)
• Low Ground Current: 90 µA Typical
• High PSRR, up to 70 dB @ 1 kHz
• Fast Turn-On Time: 40 µs Typical
• High Output Accuracy:
The MIC5319 is a µCap design operating with very
small ceramic output capacitors for stability, thereby
reducing required board space and component cost.
The MIC5319 is available in fixed-output voltages and
adjustable output versions in the compact 2 mm x
2 mm TDFN lead-less package or the thin SOT23-5
package.
- ±1.0% Initial Accuracy
- ±2.0% Over Temperature
• Thermal-Shutdown Protection
• Current-Limit Protection
• Logic-Controlled Enable Input Pin
• Available Packages:
- 2 mm x 2 mm TDFN, 500 mA Continuous
- SOT23-5, 500 mA Peak
Applications
• Cellular Phones
• PDAs
• Fiber Optic Modules
• Portable Electronics
• Notebook PCs
• Audio Codec Power Supplies
Package Types
MIC5319-X.XYML (FIXED)
MIC5319-X.XYD5
SOT23-5 (D5)
(Top View)
MIC5319YML (ADJ.)
6-Lead TDFN (ML)
(Top View)
6-Lead TDFN (ML)
(Top View)
EN GND VIN
6
5
4
BYP
EN
GND
VIN
1
2
3
6
5
4
BYP
NC
3
2
1
EN
GND
VIN
1
2
3
EP
EP
ADJ
KWxx
VOUT
VOUT
4
5
BYP
VOUT
2017 Microchip Technology Inc.
DS20005876A-page 1
MIC5319
Typical Application Circuit
MIC5319
TDFN-6 or SOT23-5
MIC5319-2.8
VIN VOUT
EN BYP
GND
2.8V@500mA
VOUT
VIN
1μF
0.1μF
2.2μF
Functional Block Diagrams
MIC5319
(Fixed Output Voltage)
VIN
EN
VOUT
QUICK-
START
VREF
ERROR
AMP
BYP
THERMAL
SHUTDOWN
CURRENT
LIMIT
MIC5319
GND
MIC5319
(Adjustable Output Voltage)
VOUT
VIN
EN
QUICK-
START
VREF
ERROR
AMP
BYP
ADJ
THERMAL
SHUTDOWN
CURRENT
LIMIT
MIC5319
GND
DS20005876A-page 2
2017 Microchip Technology Inc.
MIC5319
1.0
ELECTRICAL CHARACTERISTICS
Absolute Maximum Ratings †
Supply Input Voltage (VIN) ................................................................................................................................ 0V to +6V
Enable Input Voltage (VEN)............................................................................................................................... 0V to +6V
Power Dissipation (PD) (Note 1) ............................................................................................................Internally Limited
ESD Rating (Note 2) ........................................................................................................................................ 3 kV, HBM
Operating Ratings ‡
Supply Input Voltage (VIN) ........................................................................................................................ +2.5V to +5.5V
Enable Input Voltage (VEN).................................................................................................................................0V to VIN
† Notice: Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to the device.
This is a stress rating only and functional operation of the device at those or any other conditions above those indicated
in the operational sections of this specification is not intended. Exposure to maximum rating conditions for extended
periods may affect device reliability.
‡ Notice: The device is not guaranteed to function outside its operating ratings.
Note 1: The maximum allowable power dissipation of any TA (ambient temperature) is PD(MAX) = (TJ(MAX) – TA)/θJA
.
Exceeding the maximum allowable power dissipation will result in excessive die temperature, and the reg-
ulator may go into thermal shutdown.
2: Devices are ESD sensitive. Handling precautions recommended.
2017 Microchip Technology Inc.
DS20005876A-page 3
MIC5319
TABLE 1-1:
ELECTRICAL CHARACTERISTICS
Electrical Characteristics: VIN = VOUT + 1.0V; COUT = 2.2 µF; IOUT = 100 µA; TA = +25°C, bold values are available
for the –40°C to +125°C junction temperature range, unless otherwise noted. (Note 1)
Parameter
Symbol
Min.
Typ.
Max.
Units Conditions
Variation from nominal VOUT
–1.0
—
1.0
Output Voltage Accuracy
∆VOUT
%
Variation from nominal VOUT
IOUT = 100 µA to 500 mA
,
–2.0
—
2.0
1.2375 1.25
1.2625
Feedback Voltage (Adj.
Option)
VADJ
V
—
1.225
1.25
1.275
∆VOUT/(
Line Regulation
VOUT
x
—
0.04
0.3
%/V
VIN = VOUT +1V to +5.5V
∆VIN)
∆VOUT
VOUT
/
Load Regulation (Note 2)
—
0.1
0.5
%
IL = 100 µA to 500 mA
IOUT = 50 mA
—
—
—
20
200
90
40
Dropout Voltage (Note 3,
Note 4)
VDO
mV
400
150
IOUT = 500 mA
Ground Pin Current (Note 5)
IGND
µA
µA
IOUT = 0 mA to 500 mA
Ground Pin Current in
Shutdown Mode
ISHDN
—
—
0.5
70
—
—
VEN ≤ 0.2V
f = up to 1 kHz; COUT = 2.2 µF
ceramic; CBYP = 0.1 µF
dB
Power Supply Ripple
Rejection
PSRR
f = 10 kHz; COUT = 2.2 µF ceramic;
CBYP = 0.1 µF
—
600
—
60
700
40
—
—
—
dB
mA
Current Limit
ILIMIT
eN
VOUT = 0V
COUT = 2.2 µF; CBYP = 0.1 µF;
10 Hz to 100 kHz
Output Voltage Noise
Turn-On Time
µVRMS
µs
tON
—
—
40
—
100
0.2
—
1
COUT = 2.2 µF; CBYP = 0.1 µF
Logic Low (Regulator Shutdown)
Logic High (Regulator Enabled)
VIL = ≤ 0.2V (Regulator Shutdown)
Enable Input Voltage
Enable Input Current
VENABLE
IENABLE
V
1.2
—
—
0.01
0.01
µA
—
1
VIH = ≥ 1.0V (Regulator Shutdown)
Note 1: Specification for packaged product only.
2: Regulation is measured at constant junction temperature using low duty cycle pulse testing.
3: Dropout voltage is defined as the input-to-output differential at which the output voltage drops 2% below its
nominal VOUT. For outputs below 2.5V, dropout voltage spec does not apply, as the part is limited by mini-
mum VIN spec of 2.5V. There may be some typical dropout degradation at VOUT < 3V.
4: For Adjustable option, VOUT = 3V for dropout specification.
5: Ground pin current is the regulator quiescent current. The total current drawn from the supply is the sum of
the load current plus the ground pin current.
DS20005876A-page 4
2017 Microchip Technology Inc.
MIC5319
TEMPERATURE SPECIFICATIONS (Note 1)
Parameters
Temperature Ranges
Sym.
Min.
Typ.
Max.
Units
Conditions
Junction Operating Temperature
Range
TJ
–40
—
+125
°C
—
—
Storage Temperature Range
Lead Temperature
TS
—
–65
—
—
—
+150
+260
°C
°C
Soldering, 5s
Package Thermal Resistances
Thermal Resistance TDFN-6
Thermal Resistance Thin SOT23-5
JA
JA
—
—
93
—
—
°C/W
°C/W
—
—
235
Note 1: The maximum allowable power dissipation is a function of ambient temperature, the maximum allowable
junction temperature and the thermal resistance from junction to air (i.e., TA, TJ, JA). Exceeding the
maximum allowable power dissipation will cause the device operating junction temperature to exceed the
maximum +125°C rating. Sustained junction temperatures above +125°C can impact the device reliability.
2017 Microchip Technology Inc.
DS20005876A-page 5
MIC5319
2.0
TYPICAL PERFORMANCE CURVES
Note: The graphs and tables provided following this note are a statistical summary based on a limited number of
samples and are provided for informational purposes only. The performance characteristics listed herein
are not tested or guaranteed. In some graphs or tables, the data presented may be outside the specified
operating range (e.g., outside specified power supply range) and therefore outside the warranted range.
FIGURE 2-1:
PSRR (Bypass Pin
FIGURE 2-4:
Ground Current vs.
Capacitor = 0.1 µF).
Temperature.
FIGURE 2-2:
PSRR (Bypass Pin
FIGURE 2-5:
Ground Current vs.
Capacitor = 0.01 µF).
Temperature.
FIGURE 2-3:
Ground Current vs. Output
FIGURE 2-6:
Ground Current vs.
Current.
Temperature.
DS20005876A-page 6
2017 Microchip Technology Inc.
MIC5319
FIGURE 2-7:
Ground Current vs.
FIGURE 2-10:
Ground Current vs. Input
Temperature.
Voltage.
FIGURE 2-11:
Dropout Characteristics.
FIGURE 2-8:
Ground Current vs. Input
Voltage.
FIGURE 2-12:
Dropout Voltage vs.
FIGURE 2-9:
Ground Current vs. Input
Temperature.
Voltage.
2017 Microchip Technology Inc.
DS20005876A-page 7
MIC5319
FIGURE 2-13:
Temperature.
Dropout Voltage vs.
Dropout Voltage vs.
Dropout Voltage vs. Load
FIGURE 2-16:
Input Voltage.
Short-Circuit Current vs.
FIGURE 2-17:
Temperature.
Output Voltage vs.
FIGURE 2-14:
Temperature.
FIGURE 2-18:
Temperature.
Enable Threshold vs.
FIGURE 2-15:
Current.
DS20005876A-page 8
2017 Microchip Technology Inc.
MIC5319
FIGURE 2-19:
Output Noise Spectral
FIGURE 2-22:
Enable Pin Delay (3.0V
Density.
Fixed Output Version).
FIGURE 2-20:
Line Transient Response
FIGURE 2-23:
Shutdown Delay (3.0V Fixed
(3.0V Fixed Output Version).
Output Version).
FIGURE 2-21:
Load Transient Response
(3.0V Fixed Output Version).
2017 Microchip Technology Inc.
DS20005876A-page 9
MIC5319
3.0
PIN DESCRIPTIONS
The descriptions of the pins are listed in Table 3-1.
TABLE 3-1:
PIN FUNCTION TABLE
Pin Number
TDFN-6, Fixed
Pin Number
TDFN-6, Adj.
Pin Number
SOT23-5
Pin Name
Description
1
1
3
EN
Enable Input: Active-High. High = Regulator ON,
Low = Regulator OFF. Do not leave floating.
2
3
2
3
4
5
2
1
GND
VIN
Ground.
Input Voltage.
Output Voltage.
4
5
VOUT
ADJ
—
—
Adjustable Input: Connect to the external resistor
voltage divider network to set the desired output
voltage.
5
6
—
6
—
4
NC
BYP
ePAD
Not connected for the TDFN fixed output voltage
versions.
Reference Bypass: Connect external 0.1 µF to
GND for reduced output noise. May be left open.
EP
EP
—
Exposed Pad connected to ground internally.
Must be connected to the ground plane of the
application board for optimal heat dissipation.
DS20005876A-page 10
2017 Microchip Technology Inc.
MIC5319
A unique, quick-start circuit allows the MIC5319 to
drive a large capacitor on the bypass pin without
significantly slowing turn-on time.
4.0
4.1
APPLICATION INFORMATION
Enable/Shutdown
The MIC5319 features an active-high enable pin that
allows the regulator to be disabled. Forcing the enable
pin low disables the regulator and sends it into a “zero”
off-mode current state. In this state, the current
consumed by the regulator is typically only 0.5 µA.
Forcing the enable pin high enables the output voltage.
The active-high enable pin uses CMOS technology and
the enable pin cannot be left floating, as this may cause
an undetermined state on the output.
4.5
No-Load Stability
Unlike many other voltage regulators, the MIC5319 will
remain stable and in regulation with no load. This is
especially important in CMOS RAM keep-alive
applications.
4.6
Adjustable Regulator Application
Adjustable regulators use a two-resistor divider to
multiply the reference voltage and to produce the
desired output voltage.
4.2
Input Capacitor
The MIC5319 is a high-performance, high bandwidth
device. Therefore, it requires a well-bypassed input
supply for optimal performance. A minimum 1 µF
capacitor is required from the input-to-ground to
provide stability. Low-ESR ceramic capacitors provide
optimal performance at a minimum of space. Additional
high-frequency capacitors, such as small-valued NPO
dielectric-type capacitors, help filter out high-frequency
noise and are good design practice in any RF-based
circuit.
The MIC5319 output voltage can be adjusted from
1.25V to 5.5V by using two external resistors
(Figure 4-1). The resistors set the output voltage based
on the following equation:
EQUATION 4-1:
R1
R2
------
VOUT = VREF 1 +
Where:
VREF = 1.25V
4.3
Output Capacitor
The MIC5319 requires an output capacitor of 2.2 µF or
greater to maintain stability. The design is optimized for
use with low-ESR ceramic chip capacitors. High ESR
capacitors may cause high-frequency oscillation. The
output capacitor can be increased, but performance
has been optimized for a 2.2 µF ceramic output
capacitor and does not improve significantly with larger
capacitance.
MIC5319YML
VOUT
VIN
VIN VOUT
EN
R1
R2
1μF
2.2μF
BYP ADJ
GND
X7R/X5R dielectric-type ceramic capacitors are
recommended because of their temperature
performance. X7R-type capacitors change capacitance
by 15% over their operating temperature range and are
the most stable type of ceramic capacitors. Z5U and
Y5V dielectric capacitors change value by as much as
50% and 60%, respectively, over their operating
temperature ranges. To use a ceramic chip capacitor
with Y5V dielectric, the value must be much higher than
an X7R ceramic capacitor to ensure the same
minimum capacitance over the equivalent operating
temperature range.
FIGURE 4-1:
Application.
Adjustable Voltage Typical
4.7
Thermal Considerations
The MIC5319 is designed to provide 500 mA of
continuous current in a very small TDFN package.
Maximum ambient operating temperature can be
calculated based on the output current and the voltage
drop across the part. Given an input voltage of 3.3V,
output voltage of 2.8V, and output current of 500 mA,
the actual power dissipation of the regulator circuit can
be determined using the equation:
4.4
Bypass Capacitor
A
capacitor can be placed from the bypass
pin-to-ground to reduce output voltage noise. The
capacitor bypasses the internal reference. A 0.1 µF
capacitor is recommended for applications that require
low-noise outputs. The bypass capacitor can be
increased, further reducing noise and improving
PSRR. Turn-on time increases slightly with respect to
bypass capacitance.
2017 Microchip Technology Inc.
DS20005876A-page 11
MIC5319
Therefore, a 2.8V application at 500 mA of output
current can accept an ambient operating temperature
of 101.75°C in a 2 mm x 2 mm TDFN package. For a
full discussion of heat sinking and thermal effects on
voltage regulators, refer to the “Regulator Thermals”
section of Microchip’s Designing with Low-Dropout
Voltage Regulators handbook.
EQUATION 4-2:
PD = VIN – VOUT IOUT + VIN IGND
Because this device is CMOS and the ground current
is typically <100 µA over the load range, the power
dissipation contributed by the ground current is <1%
and can be ignored for this calculation:
EQUATION 4-3:
PD = 3.3V – 2.8V 500mA = 0.25W
To determine the maximum ambient operating
temperature
of
the
package,
use
the
junction-to-ambient thermal resistance of the device
and the following basic equation:
EQUATION 4-4:
T
JMAX – TA
-------------------------------
=
PDMAX
JA
Where:
TJ(MAX) = 125°C
θJA = 93°C/W (for the TDFN package)
Substituting 0.25W for PD(MAX) and solving for the
ambient operating temperature will give the maximum
operating conditions for the regulator circuit. The
maximum power dissipation must not be exceeded for
proper operation.
EQUATION 4-5:
125C – TA
---------------------------
0.25W =
93C/W
TA = 101.75C
DS20005876A-page 12
2017 Microchip Technology Inc.
MIC5319
5.0
5.1
PACKAGING INFORMATION
Package Marking Information
5-Pin TSOT23*
Example
Part Number
MIC5319YML-TR
Marking
XXXX
Z31J
689
9AA
950
MIC5319-5.0YML-TR
MIC5319-5.0YD5-TR
MIC5319-3.3YML-TR
MIC5319-3.3YD5-TR
MIC5319-3.0YML-TR
MIC5319-3.0YD5-TR
MIC5319-2.9YML-TR
NNN
N950
933
N933
930
N930
N929
6-Pin TDFN*
Example
MIC5319-2.8YML-TR
MIC5319-2.8YD5-TR
MIC5319-2.85YML-TR
MIC5319-2.7YML-TR
MIC5319-2.7YD5-TR
MIC5319-2.6YML-TR
MIC5319-2.6YD5-TX
MIC5319-2.6YD5-TR
MIC5319-2.5YML-TR
MIC5319-2.5YD5-TX
928
N928
92J
XXX
NNN
933
689
927
N927
926
N926
N926
925
N925
MIC5319-2.5YD5-TR
MIC5319-1.8YML-TR
MIC5319-1.8YD5-TX
MIC5319-1.8YD5-TR
MIC5319-1.85YML-TR
MIC5319-1.85YD5-TX
MIC5319-1.85YD5-TR
MIC5319-1.3HYML-TR
MIC5319-1.3HYD5-TR
N925
918
N918
N918
91J
N91J
N91J
13H
N13H
Legend: XX...X Product code or customer-specific information
Y
YY
WW
NNN
Year code (last digit of calendar year)
Year code (last 2 digits of calendar year)
Week code (week of January 1 is week ‘01’)
Alphanumeric traceability code
e
3
Pb-free JEDEC® designator for Matte Tin (Sn)
*
This package is Pb-free. The Pb-free JEDEC designator (
can be found on the outer packaging for this package.
e
3
)
●, ▲, ▼ Pin one index is identified by a dot, delta up, or delta down (triangle
mark).
Note: In the event the full Microchip part number cannot be marked on one line, it will
be carried over to the next line, thus limiting the number of available
characters for customer-specific information. Package may or may not include
the corporate logo.
Underbar (_) and/or Overbar (⎯) symbol may not be to scale.
2017 Microchip Technology Inc.
DS20005876A-page 13
MIC5319
5-Lead TSOT Package Outline and Recommended Land Pattern
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging.
DS20005876A-page 14
2017 Microchip Technology Inc.
MIC5319
6-Lead TDFN 2 mm x 2 mm Package Outline and Recommended Land Pattern
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging.
2017 Microchip Technology Inc.
DS20005876A-page 15
MIC5319
NOTES:
DS20005876A-page 16
2017 Microchip Technology Inc.
MIC5319
APPENDIX A: REVISION HISTORY
Revision A (October 2017)
• Converted Micrel document MIC5319 to Micro-
chip data sheet DS20005876A.
• Minor text changes throughout.
2017 Microchip Technology Inc.
DS20005876A-page 17
MIC5319
NOTES:
DS20005876A-page 18
2017 Microchip Technology Inc.
MIC5319
PRODUCT IDENTIFICATION SYSTEM
To order or obtain information, e.g., on pricing or delivery, contact your local Microchip representative or sales office.
Examples:
PART NO.
Device
–X.X
X
XX
–XX
a) MIC5319-1.3HYML-TR: 500 mA µCap Ultra-Low
Dropout High PSRR LDO
Output
Voltage
Junction Temp. Package Media Type
Range
Regulator, 1.375V Output
Voltage, –40°C to +125°C,
6-Lead TDFN, 5,000/Reel
Device:
MIC5319:
500 mA µCap Ultra-Low Dropout High
PSRR LDO Regulator
b) MIC5319YD5-TX:
500 mA µCap Ultra-Low
Dropout High PSRR LDO
Regulator, Adjustable
Output Voltage, –40°C to
+125°C, 5-Lead TSOT23,
3,000/Reel w/ Reversed
Pin 1
Voltage:
<blank>= Adjustable
1.3H = 1.375V
1.8
1.85 =
=
1.8V
1.85V
2.5
2.6
2.7
2.8
=
=
=
=
2.5V
2.6V
2.7V
2.8V
c) MIC5319-2.7YML-TR:
d) MIC5319-3.0YD5-TR:
500 mA µCap Ultra-Low
Dropout High PSRR LDO
Regulator, 2.7V Output
Voltage, –40°C to +125°C,
6-Lead TDFN, 5,000/Reel
2.85 =
2.85V (TDFN Only)
2.9V (TDFN Only)
3.0V
3.3V
5.0V
2.9
3.0
3.3
5.0
=
=
=
=
500 mA µCap Ultra-Low
Dropout High PSRR LDO
Regulator, 3.0V Output
Voltage, –40°C to +125°C,
5-Lead TSOT23, 3,000/
Reel
Junction
Temperature
Range:
Y
=
–40°C to +125°C RoHS-Compliant
Package:
D5
ML
=
=
5-Lead TSOT23
6-Lead 2 mm x 2 mm x 0.9 mm TDFN
e) MIC5319-2.85YML-TR:
f) MIC5319-5.0YD5-TX:
500 mA µCap Ultra-Low
Dropout High PSRR LDO
Regulator, 2.85V Output
Voltage, –40°C to +125°C,
6-Lead TDFN, 5,000/Reel
Media Type:
TX
TR
TR
=
=
=
3,000/Reel (with reversed Pin 1; D5 only)
3,000/Reel (D5)
5,000/Reel (ML)
500 mA µCap Ultra-Low
Dropout High PSRR LDO
Regulator, 5.0V Output
Voltage, –40°C to +125°C,
5-Lead TSOT23, 3,000/
Reel w/ Reversed Pin 1
Note 1:
Tape and Reel identifier only appears in the
catalog part number description. This identifier is
used for ordering purposes and is not printed on
the device package. Check with your Microchip
Sales Office for package availability with the
Tape and Reel option.
2017 Microchip Technology Inc.
DS20005876A-page 19
MIC5319
NOTES:
DS20005876A-page 20
2017 Microchip Technology Inc.
Note the following details of the code protection feature on Microchip devices:
•
Microchip products meet the specification contained in their particular Microchip Data Sheet.
•
Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the
intended manner and under normal conditions.
•
There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our
knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data
Sheets. Most likely, the person doing so is engaged in theft of intellectual property.
•
•
Microchip is willing to work with the customer who is concerned about the integrity of their code.
Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not
mean that we are guaranteeing the product as “unbreakable.”
Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our
products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts
allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act.
Information contained in this publication regarding device
applications and the like is provided only for your convenience
and may be superseded by updates. It is your responsibility to
ensure that your application meets with your specifications.
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WARRANTIES OF ANY KIND WHETHER EXPRESS OR
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suits, or expenses resulting from such use. No licenses are
conveyed, implicitly or otherwise, under any Microchip
intellectual property rights unless otherwise stated.
Trademarks
The Microchip name and logo, the Microchip logo, AnyRate, AVR,
AVR logo, AVR Freaks, BeaconThings, BitCloud, CryptoMemory,
CryptoRF, dsPIC, FlashFlex, flexPWR, Heldo, JukeBlox, KEELOQ,
KEELOQ logo, Kleer, LANCheck, LINK MD, maXStylus,
maXTouch, MediaLB, megaAVR, MOST, MOST logo, MPLAB,
OptoLyzer, PIC, picoPower, PICSTART, PIC32 logo, Prochip
Designer, QTouch, RightTouch, SAM-BA, SpyNIC, SST, SST
Logo, SuperFlash, tinyAVR, UNI/O, and XMEGA are registered
trademarks of Microchip Technology Incorporated in the U.S.A.
and other countries.
ClockWorks, The Embedded Control Solutions Company,
EtherSynch, Hyper Speed Control, HyperLight Load, IntelliMOS,
mTouch, Precision Edge, and Quiet-Wire are registered
trademarks of Microchip Technology Incorporated in the U.S.A.
Adjacent Key Suppression, AKS, Analog-for-the-Digital Age, Any
Capacitor, AnyIn, AnyOut, BodyCom, chipKIT, chipKIT logo,
CodeGuard, CryptoAuthentication, CryptoCompanion,
CryptoController, dsPICDEM, dsPICDEM.net, Dynamic Average
Matching, DAM, ECAN, EtherGREEN, In-Circuit Serial
Programming, ICSP, Inter-Chip Connectivity, JitterBlocker,
KleerNet, KleerNet logo, Mindi, MiWi, motorBench, MPASM, MPF,
MPLAB Certified logo, MPLIB, MPLINK, MultiTRAK, NetDetach,
Omniscient Code Generation, PICDEM, PICDEM.net, PICkit,
PICtail, PureSilicon, QMatrix, RightTouch logo, REAL ICE, Ripple
Blocker, SAM-ICE, Serial Quad I/O, SMART-I.S., SQI,
SuperSwitcher, SuperSwitcher II, Total Endurance, TSHARC,
USBCheck, VariSense, ViewSpan, WiperLock, Wireless DNA, and
ZENAare trademarks of Microchip Technology Incorporated in the
U.S.A. and other countries.
SQTP is a service mark of Microchip Technology Incorporated in
the U.S.A.
Microchip received ISO/TS-16949:2009 certification for its worldwide
headquarters, design and wafer fabrication facilities in Chandler and
Tempe, Arizona; Gresham, Oregon and design centers in California
and India. The Company’s quality system processes and procedures
are for its PIC® MCUs and dsPIC® DSCs, KEELOQ® code hopping
devices, Serial EEPROMs, microperipherals, nonvolatile memory and
analog products. In addition, Microchip’s quality system for the design
and manufacture of development systems is ISO 9001:2000 certified.
Silicon Storage Technology is a registered trademark of Microchip
Technology Inc. in other countries.
GestIC is a registered trademark of Microchip Technology
Germany II GmbH & Co. KG, a subsidiary of Microchip Technology
Inc., in other countries.
All other trademarks mentioned herein are property of their
respective companies.
QUALITYꢀMANAGEMENTꢀꢀSYSTEMꢀ
CERTIFIEDꢀBYꢀDNVꢀ
© 2017, Microchip Technology Incorporated, All Rights Reserved.
ISBN: 978-1-5224-2270-9
== ISO/TSꢀ16949ꢀ==ꢀ
2017 Microchip Technology Inc.
DS20005876A-page 21
Worldwide Sales and Service
AMERICAS
ASIA/PACIFIC
ASIA/PACIFIC
EUROPE
Corporate Office
2355 West Chandler Blvd.
Chandler, AZ 85224-6199
Tel: 480-792-7200
Fax: 480-792-7277
Technical Support:
http://www.microchip.com/
support
Asia Pacific Office
China - Xiamen
Tel: 86-592-2388138
Fax: 86-592-2388130
Austria - Wels
Tel: 43-7242-2244-39
Fax: 43-7242-2244-393
Suites 3707-14, 37th Floor
Tower 6, The Gateway
Harbour City, Kowloon
China - Zhuhai
Tel: 86-756-3210040
Fax: 86-756-3210049
Denmark - Copenhagen
Tel: 45-4450-2828
Fax: 45-4485-2829
Hong Kong
Tel: 852-2943-5100
Fax: 852-2401-3431
India - Bangalore
Tel: 91-80-3090-4444
Fax: 91-80-3090-4123
Finland - Espoo
Tel: 358-9-4520-820
Australia - Sydney
Tel: 61-2-9868-6733
Fax: 61-2-9868-6755
Web Address:
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Tel: 33-1-69-53-63-20
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India - New Delhi
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Atlanta
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Tel: 678-957-9614
Fax: 678-957-1455
China - Beijing
Tel: 86-10-8569-7000
Fax: 86-10-8528-2104
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Tel: 33-1-30-60-70-00
India - Pune
Tel: 91-20-3019-1500
China - Chengdu
Tel: 86-28-8665-5511
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Germany - Haan
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Tel: 81-6-6152-7160
Fax: 81-6-6152-9310
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Fax: 774-760-0088
Japan - Tokyo
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Germany - Heilbronn
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China - Dongguan
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Germany - Karlsruhe
Tel: 49-721-625370
Chicago
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China - Guangzhou
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Germany - Munich
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China - Hangzhou
Tel: 86-571-8792-8115
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Korea - Seoul
Dallas
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Tel: 972-818-7423
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Tel: 82-2-554-7200
Fax: 82-2-558-5932 or
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Germany - Rosenheim
Tel: 49-8031-354-560
China - Hong Kong SAR
Tel: 852-2943-5100
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Israel - Ra’anana
Tel: 972-9-744-7705
Malaysia - Kuala Lumpur
Tel: 60-3-6201-9857
Fax: 60-3-6201-9859
Detroit
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Tel: 248-848-4000
Italy - Milan
Tel: 39-0331-742611
Fax: 39-0331-466781
China - Nanjing
Tel: 86-25-8473-2460
Fax: 86-25-8473-2470
Malaysia - Penang
Tel: 60-4-227-8870
Fax: 60-4-227-4068
Houston, TX
Tel: 281-894-5983
Italy - Padova
Tel: 39-049-7625286
China - Qingdao
Tel: 86-532-8502-7355
Fax: 86-532-8502-7205
Indianapolis
Noblesville, IN
Tel: 317-773-8323
Fax: 317-773-5453
Tel: 317-536-2380
Philippines - Manila
Tel: 63-2-634-9065
Fax: 63-2-634-9069
Netherlands - Drunen
Tel: 31-416-690399
Fax: 31-416-690340
China - Shanghai
Tel: 86-21-3326-8000
Fax: 86-21-3326-8021
Singapore
Tel: 65-6334-8870
Fax: 65-6334-8850
Norway - Trondheim
Tel: 47-7289-7561
Los Angeles
China - Shenyang
Tel: 86-24-2334-2829
Fax: 86-24-2334-2393
Mission Viejo, CA
Tel: 949-462-9523
Fax: 949-462-9608
Tel: 951-273-7800
Poland - Warsaw
Tel: 48-22-3325737
Taiwan - Hsin Chu
Tel: 886-3-5778-366
Fax: 886-3-5770-955
Romania - Bucharest
Tel: 40-21-407-87-50
China - Shenzhen
Tel: 86-755-8864-2200
Fax: 86-755-8203-1760
Taiwan - Kaohsiung
Tel: 886-7-213-7830
Raleigh, NC
Tel: 919-844-7510
Spain - Madrid
Tel: 34-91-708-08-90
Fax: 34-91-708-08-91
China - Wuhan
Tel: 86-27-5980-5300
Fax: 86-27-5980-5118
Taiwan - Taipei
Tel: 886-2-2508-8600
Fax: 886-2-2508-0102
New York, NY
Tel: 631-435-6000
Sweden - Gothenberg
Tel: 46-31-704-60-40
San Jose, CA
Tel: 408-735-9110
Tel: 408-436-4270
China - Xian
Tel: 86-29-8833-7252
Fax: 86-29-8833-7256
Thailand - Bangkok
Tel: 66-2-694-1351
Fax: 66-2-694-1350
Sweden - Stockholm
Tel: 46-8-5090-4654
Canada - Toronto
Tel: 905-695-1980
Fax: 905-695-2078
UK - Wokingham
Tel: 44-118-921-5800
Fax: 44-118-921-5820
DS20005876A-page 22
2017 Microchip Technology Inc.
11/07/16
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