MP111-240E/MB 概述
Micropower Voltage Detector 微功耗电压检测器
MP111-240E/MB 数据手册
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PDF下载MCP111/112
Micropower Voltage Detector
Features
Package Types
• Ultra-low supply current: 1.75 µA (max.)
• Precision monitoring options of:
3-Pin SOT23-3/SC-70
3-Pin SOT-89
VDD
- 1.90V, 2.32V, 2.63V, 2.90V, 2.93V, 3.08V,
4.38V and 4.63V
VOUT
1
2
• Resets microcontroller in a power-loss event
• Active-low VOUT pin:
VDD
3
MCP111/112
- MCP111 active-low, open-drain
- MCP112 active-low, push-pull
VSS
1
2
3
VOUT V
DD VSS
• Available in SOT23-3, TO-92, SC-70 and
SOT-89-3 packages
3-Pin TO-92
• Temperature Range:
- Extended: -40°C to +125°C
(except MCP1XX-195)
- Industrial: -40°C to +85°C (MCP1XX-195 only)
VOUT
VSS
VDD
• Pb-free devices
Applications
Block Diagram
• Critical Microcontroller and Microprocessor
Power-Monitoring Applications
VDD
• Computers
• Intelligent Instruments
• Portable Battery-Powered Equipment
Comparator
VOUT
+
–
Output
Driver
Description
The MCP111/112 are voltage-detecting devices
designed to keep a microcontroller in reset until the
system voltage has stabilized at the appropriate level
for reliable system operation. These devices also
operate as protection from brown-out conditions when
the system supply voltage drops below the specified
threshold voltage level. Eight different trip voltages are
available.
Band Gap
Reference
VSS
TABLE 1:
DEVICE FEATURES
Output
Reset Delay Package Pin Out
(typ) (Pin # 1, 2, 3)
Device
Comment
Type
Pull-up Resistor
MCP111 Open-drain
MCP112 Push-pull
MCP102 Push-pull
External
No
No
No
V
, V , V
OUT SS
DD
V
, V , V
OUT SS
DD
No
120 ms
120 ms
120 ms
120 ms
RST, V , V
See MCP102/103/121/131 Data Sheet
(DS21906)
DD
SS
MCP103 Push-pull
MCP121 Open-drain
No
VSS, RST, V
See MCP102/103/121/131 Data Sheet
(DS21906)
DD
External
RST, V , V
See MCP102/103/121/131 Data Sheet
(DS21906)
DD
SS
MCP131 Open-Drain Internal (~95 kΩ)
RST, V , V
See MCP102/103/121/131 Data Sheet
DD
SS
(DS21906)
© 2005 Microchip Technology Inc.
DS21889D-page 1
MCP111/112
† Notice: Stresses above those listed under “Maximum
Ratings” may cause permanent damage to the device. This is
a stress rating only and functional operation of the device at
those or any other conditions above those indicated in the
operational listings of this specification is not implied.
Exposure to maximum rating conditions for extended periods
may affect device reliability.
1.0
ELECTRICAL
CHARACTERISTICS
Absolute Maximum Ratings†
V
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7.0V
DD
Input current (V ) . . . . . . . . . . . . . . . . . . . . . . . . . . . .10 mA
DD
Output current (RST) . . . . . . . . . . . . . . . . . . . . . . . . . .10 mA
Rated Rise Time of V
. . . . . . . . . . . . . . . . . . . . . . 100V/µs
DD
All inputs and outputs (except RST) w.r.t. V
SS
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .-0.6V to (V + 1.0V)
DD
RST output w.r.t. V
. . . . . . . . . . . . . . . . . . . -0.6V to 13.5V
SS
Storage temperature . . . . . . . . . . . . . . . . . . .65°C to + 150°C
Ambient temp. with power applied . . . . . . . -40°C to + 125°C
Maximum Junction temp. with power applied . . . . . . . .150°C
ESD protection on all pins. . . . . . . . . . . . . . . . . . . . . . . . . ≥ 2 kV
DC CHARACTERISTICS
Electrical Specifications: Unless otherwise indicated, all limits are specified for V = 1V to 5.5V, R = 100 kΩ (only MCP111),
DD
PU
T = -40°C to +125°C.
A
Parameters
Operating Voltage Range
Sym
Min
Typ
Max
Units
Conditions
V
V
1.0
—
5.5
V
V
µA
V
V
V
V
V
V
V
V
V
V
V
V
V
V
V
V
DD
DD
DD
Specified V Value to V
low
1.0
—
I
= 10 µA, V
< 0.2V
RST
DD
OUT
RST
Operating Current
I
—
< 1
1.75
1.929
1.948
2.355
2.378
2.670
2.696
2.944
2.973
2.974
3.003
3.126
3.157
4.446
4.490
4.700
4.746
—
V
Trip Point
MCP1XX-195
V
1.872
1.853
2.285
2.262
2.591
2.564
2.857
2.828
2.886
2.857
3.034
3.003
4.314
4.271
4.561
4.514
—
1.900
1.900
2.320
2.320
2.630
2.630
2.900
2.900
2.930
2.930
3.080
3.080
4.380
4.380
4.630
4.630
±100
T = +25°C (Note 1)
A
DD
TRIP
T = -40°C to +85°C (Note 2)
A
MCP1XX-240
MCP1XX-270
MCP1XX-290
MCP1XX-300
MCP1XX-315
MCP1XX-450
MCP1XX-475
T = +25°C (Note 1)
A
Note 2
T = +25°C (Note 1)
A
Note 2
T = +25°C (Note 1)
A
Note 2
T = +25°C (Note 1)
A
Note 2
T = +25°C (Note 1)
A
Note 2
T = +25°C (Note 1)
A
Note 2
T = +25°C (Note 1)
A
Note 2
V
Trip Point Tempco
T
ppm/°
C
DD
TPCO
Note 1: Trip point is ±1.5% from typical value.
2: Trip point is ±2.5% from typical value.
®
3: This specification allows this device to be used in PICmicro microcontroller applications that require the In-Circuit
Serial Programming™ (ICSP™) feature (see device-specific programming specifications for voltage requirements).
This specification DOES NOT allow a continuous high voltage to be present on the open-drain output pin (V
). The
OUT
total time that the V
pin can be above the maximum device operational voltage (5.5V) is 100 sec. Current into the
OUT
V
pin should be limited to 2 mA. It is recommended that the device operational temperature be maintained between
OUT
0°C to 70°C (+25°C preferred). For additional information, please refer to Figure 2-28.
4: This parameter is established by characterization and is not 100% tested.
DS21889D-page 2
© 2005 Microchip Technology Inc.
MCP111/112
DC CHARACTERISTICS (CONTINUED)
Electrical Specifications: Unless otherwise indicated, all limits are specified for V = 1V to 5.5V, R = 100 kΩ (only MCP111),
DD
PU
T = -40°C to +125°C.
A
Parameters
Sym
Min
Typ
Max
Units
Conditions
T = +25°C
Threshold Hysteresis
(min. = 1%, max = 6%)
MCP1XX-195
MCP1XX-240
MCP1XX-270
MCP1XX-290
MCP1XX-300
MCP1XX-315
MCP1XX-450
MCP1XX-475
V
0.019
0.023
0.026
0.029
0.029
0.031
0.044
0.046
—
—
—
—
—
—
—
—
—
—
—
0.114
0.139
0.158
0.174
0.176
0.185
0.263
0.278
0.4
V
V
V
V
V
V
V
V
V
V
HYS
A
V
V
Low-level Output Voltage
V
I
I
= 500 µA, V = V
OL DD TRIP(MIN)
OUT
OL
High-level Output Voltage
V
V
– 0.6
—
= 1 mA, For only MCP112
OH
OUT
OH
DD
(push-pull output)
(3)
Open-drain High Voltage on Output
V
—
—
13.5
V
MCP111 only,
ODH
V
= 3.0V, Time voltage >
DD
5.5V applied ≤ 100s,
current into pin limited to
2 mA, +25°C operation
recommended
Note 3, Note 4
Open-drain Output Leakage Current
I
—
0.1
—
µA
OD
(MCP111 only)
Note 1: Trip point is ±1.5% from typical value.
2: Trip point is ±2.5% from typical value.
®
3: This specification allows this device to be used in PICmicro microcontroller applications that require the In-Circuit
Serial Programming™ (ICSP™) feature (see device-specific programming specifications for voltage requirements).
This specification DOES NOT allow a continuous high voltage to be present on the open-drain output pin (V
). The
OUT
total time that the V
pin can be above the maximum device operational voltage (5.5V) is 100 sec. Current into the
OUT
V
pin should be limited to 2 mA. It is recommended that the device operational temperature be maintained between
OUT
0°C to 70°C (+25°C preferred). For additional information, please refer to Figure 2-28.
4: This parameter is established by characterization and is not 100% tested.
© 2005 Microchip Technology Inc.
DS21889D-page 3
MCP111/112
VTRIP
1V
VDD
tRPU
tRPD
VOH
1V
VOL
VOUT
tRT
FIGURE 1-1:
Timing Diagram.
AC CHARACTERISTICS
Electrical Specifications: Unless otherwise indicated, all limits are specified for VDD = 1V to 5.5V, RPU = 100 kΩ
(only MCP111), TA = -40°C to +125°C.
Parameters
Sym
Min
Typ
Max
Units
Conditions
Figure 1-1 and C = 50 pF
(Note 1)
V
V
Detect to V
Inactive
t
—
90
—
µs
L
DD
OUT
RPU
t
V
ramped from V
+
TRIP(MAX)
Detect to V
Active
—
—
130
5
—
—
µs
µs
RPD
DD
DD
OUT
250 mV down to V
–
TRIP(MIN)
250 mV, per Figure 1-1,
C = 50 pF (Note 1)
L
V
Rise Time After V
Active
t
For V
10% to 90% of final
OUT
OUT
OUT
RT
value per Figure 1-1, C = 50 pF
L
(Note 1)
Note 1: These parameters are for design guidance only and are not 100% tested.
TEMPERATURE CHARACTERISTICS
Electrical Specifications: Unless otherwise noted, all limits are specified for VDD = 1V to 5.5V, RPU = 100 kΩ
(only MCP111), TA = -40°C to +125°C.
Parameters
Sym
Min
Typ
Max
Units
Conditions
Temperature Ranges
Specified Temperature Range
Specified Temperature Range
Maximum Junction Temperature
Storage Temperature Range
Package Thermal Resistances
Thermal Resistance, 3L-SOT23
Thermal Resistance, 3L-SC-70
Thermal Resistance, 3L-TO-92
Thermal Resistance, 3L-SOT-89
TA
TA
TJ
TA
-40
-40
—
—
—
—
—
+85
°C
°C
°C
°C
MCP1XX-195
+125
+150
+150
Except MCP1XX-195
-65
θJA
θJA
θJA
θJA
—
—
—
—
336
340
—
—
—
—
°C/W
°C/W
°C/W
°C/W
131.9
110
DS21889D-page 4
© 2005 Microchip Technology Inc.
MCP111/112
2.0
TYPICAL PERFORMANCE CURVES
Note:
The graphs and tables provided following this note are a statistical summary based on a limited number of
samples and are provided for informational purposes only. The performance characteristics listed herein
are not tested or guaranteed. In some graphs or tables, the data presented may be outside the specified
operating range (e.g., outside specified power supply range) and therefore outside the warranted range.
Note: Unless otherwise indicated, all limits are specified for VDD = 1V to 5.5V, RPU = 100 kΩ (only MCP111;
see Figure 4-1), TA = -40°C to +125°C.
1.6
1.4
1.2
1
1.6
1.4
1.2
1
MCP111-195
MCP111-195
5.5V
5.0V
+125°C
4.0V
+85°C
0.8
0.6
0.4
0.2
0
0.8
0.6
0.4
0.2
0
2.8V
-40°C
2.1V
1.7V
+25°C
1.0V
1.0
2.0
3.0
4.0
5.0
6.0
VDD (V)
Temperature (°C)
FIGURE 2-1:
IDD vs. Temperature
FIGURE 2-4:
IDD vs. VDD (MCP111-195).
(MCP111-195).
1.6
1.2
5.5V
5.0V
MCP112-300
MCP112-300
1.4
1.2
1
1
0.8
0.6
0.4
0.2
0
4.0V
2.8V
1.7V
+125°C
0.8
0.6
0.4
0.2
0
+85°C
2.1V
-40°C
1.0V
+25°C
1.0
2.0
3.0
4.0
DD (V)
5.0
6.0
V
Temperature (°C)
FIGURE 2-5:
IDD vs. VDD (MCP112-300).
FIGURE 2-2:
IDD vs. Temperature
(MCP112-300).
1.6
1
MCP112-475
MCP112-475
0.9
5.5V
2.1V
1.4
1.2
1
0.8
4.0V
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0
5.0V
2.8V
0.8
0.6
0.4
0.2
0
+125°C
+85°C
1.7V
1.0V
-40°C
+25°C
1.0
2.0
3.0
4.0
5.0
6.0
VDD (V)
Temperature (°C)
FIGURE 2-6:
IDD vs. VDD (MCP112-475).
FIGURE 2-3:
IDD vs. Temperature
(MCP112-475).
© 2005 Microchip Technology Inc.
DS21889D-page 5
MCP111/112
Note: Unless otherwise indicated, all limits are specified for VDD = 1V to 5.5V, RPU = 100 kΩ (only MCP111;
see Figure 4-1), TA = -40°C to +125°C.
0.120
MCP111-195
1.950
1.945
1.940
1.935
1.930
1.925
1.920
1.915
1.910
1.905
1.900
1.895
0.050
0.045
0.040
0.035
0.030
0.025
0.020
0.015
0.010
0.005
0.000
VDD = 1.7V
VTRIP, V increasing
0.100
0.080
0.060
0.040
0.020
0.000
VHYS, Hysteresis
+125°C
MCP111-195
max temp is
+85°C
+85°C
-40°C
VTRIP, V decreasing
+25°C
-60
-10
40
90
140
0.00
0.25
0.50
0.75
1.00
Temperature (°C)
I
OL (mA)
FIGURE 2-7:
VTRIP and VHYST vs.
FIGURE 2-10:
VOL vs. IOL
Temperature (MCP111-195).
(MCP111-195 @ VDD = 1.7V).
0.080
MCP112-300
0.070
3.040
0.100
0.098
0.096
0.094
0.092
0.090
0.088
0.086
0.084
0.082
VTRIP, V increasing
VDD = 2.7V
3.020
0.060
0.050
0.040
0.030
0.020
0.010
0.000
3.000
2.980
2.960
2.940
2.920
2.900
VHYS, Hysteresis
+125°C
+85°C
MCP112-300
-40°C
0.75
+25°C
VTRIP, V decreasing
0.00
0.25
0.50
1.00
-60
-10
40
90
140
IOL (mA)
Temperature (°C)
FIGURE 2-8:
VTRIP and VHYST vs.
FIGURE 2-11:
VOL vs. IOL
Temperature (MCP112-300).
(MCP112-300 @ VDD = 2.7V).
0.050
4.800
0.180
0.170
0.160
0.150
0.140
0.130
0.120
0.110
0.100
MCP112-475
VTRIP, V increasing
4.780
4.760
4.740
4.720
4.700
4.680
4.660
4.640
4.620
4.600
4.580
VDD = 4.4V
0.040
VHYS, Hysteresis
MCP112-475
+125°C
0.030
+85°C
0.020
-40°C
0.75
0.010
+25°C
VTRIP, V decreasing
0.000
-60
-20
20
60
100
140
0.00
0.25
0.50
1.00
IOL (mA)
Temperature (°C)
FIGURE 2-9:
VTRIP and VHYST vs.
FIGURE 2-12:
VOL vs. IOL
Temperature (MCP112-475).
(MCP112-475 @ VDD = 4.4V).
DS21889D-page 6
© 2005 Microchip Technology Inc.
MCP111/112
Note: Unless otherwise indicated, all limits are specified for VDD = 1V to 5.5V, RPU = 100 kΩ (only MCP111;
see Figure 4-1), TA = -40°C to +125°C.
0.120
3.150
3.100
3.050
3.000
2.950
2.900
MCP111-195
VDD = 1.7 V
IOL = 1.00 mA
MCP112-300
VDD = 3.1V
0.100
0.080
0.060
0.040
0.020
0.000
IOL = 0.75 mA
IOL = 0.50 mA
-40 °C
+85 °C
+25 °C
IOL = 0.25 mA
IOL = 0.00 mA
80
+125 °C
-40
0
40
120
0.00
0.25
0.50
0.75
1.00
IOL (mA)
Temperature (°C)
FIGURE 2-13:
VOL vs. Temperature
FIGURE 2-16:
VOH vs. IOH
(MCP111-195 @ VDD = 1.7V).
(MCP112-300 @ VDD = 3.1V).
0.080
4.820
4.800
4.780
4.760
4.740
4.720
4.700
4.680
MCP112-475
DD = 4.8V
MCP112-300
VDD = 2.7V
IOL = 1.00 mA
0.070
V
0.060
0.050
0.040
0.030
0.020
0.010
0.000
IOL = 0.75 mA
IOL = 0.50 mA
+25 °C
-40 °C
IOL = 0.25 mA
IOL = 0.00 mA
+85 °C
+125 °C
-40
0
40
80
120
0.00
0.25
0.50
IOL (mA)
0.75
1.00
Temperature (°C)
FIGURE 2-14:
VOL vs. Temperature
FIGURE 2-17:
VOH vs. IOH
(MCP112-300 @ VDD = 2.7V).
(MCP112-475 @ VDD = 4.8V).
0.050
600
IOL = 1.00 mA
MCP112-475
VDD = 4.4V
0.040
500
400
300
200
100
0
MCP111-195
IOL = 0.75 mA
IOL = 0.50 mA
MCP112-300
MCP112-475
0.030
0.020
0.010
0.000
IOL = 0.25 mA
IOL = 0.00 mA
0.001
0.01
0.1
1
10
-40
0
40
80
120
Temperature (°C)
VTRIP(min) - VDD
FIGURE 2-15:
VOL vs. Temperature
FIGURE 2-18:
Typical Transient Response
(MCP112-475 @ VDD = 4.4V).
(25 °C).
© 2005 Microchip Technology Inc.
DS21889D-page 7
MCP111/112
Note: Unless otherwise indicated, all limits are specified for VDD = 1V to 5.5V, RPU = 100 kΩ (only MCP111;
see Figure 4-1), TA = -40°C to +125°C.
400
350
300
250
200
150
100
50
350
300
250
200
150
100
50
MCP111-195
MCP111-195
VDD decreasing from:
5V - 1.7V
VDD increasing from:
0V - 2.1V
VDD decreasing from:
TRIP(max) + 0.25V to VTRIP(min) - 0.25V
V
VDD increasing from:
0V - 2.8V
VDD increasing
from: 0V - 4.0V
VDD decreasing from:
5V - 0V
VDD increasing
from: 0V - 5.5V
0
0
-40
-15
10
35
60
85
110
-40
-15
10
35
60
85
110
Temperature (°C)
Temperature (°C)
FIGURE 2-19:
tRPD vs. Temperature
FIGURE 2-22:
tRPU vs. Temperature
(MCP111-195).
(MCP111-195).
140
120
100
80
160
MCP112-300
MCP112-300
VDD decreasing from:
VDD increasing from:
0V - 3.1V
140
120
100
80
VTRIP(max) + 0.25V to VTRIP(min) - 0.25V
VDD increasing from:
0V - 3.3V
VDD decreasing from:
5V - 2.7V
VDD increasing from:
0V - 4.0V
60
60
40
40
VDD decreasing from:
5V - 0V
20
20
VDD increasing from:
0V - 5.5V
0
0
-40
-15
10
35
60
85
110
-40
-15
10
35
60
85
110
Temperature (°C)
Temperature (°C)
FIGURE 2-20:
tRPD vs. Temperature
FIGURE 2-23:
tRPU vs. Temperature
(MCP112-300).
(MCP112-300).
250
250
200
150
100
50
MCP112-475
MCP112-475
VDD decreasing from:
5V - 4.4V
VDD increasing from:
0V - 4.9V
200
150
100
50
VDD increasing from:
0V - 5.0V
VDD decreasing from:
VTRIP(max) + 0.25V to VTRIP(min) - 0.25V
VDD increasing from:
0V - 5.5V
VDD decreasing from:
5V - 0V
0
0
-40
-15
10
35
60
85
110
-40
-15
10
35
60
85
110
Temperature (°C)
Temperature (°C)
FIGURE 2-21:
tRPD vs. Temperature
FIGURE 2-24:
tRPU vs. Temperature
(MCP112-475).
(MCP112-475).
DS21889D-page 8
© 2005 Microchip Technology Inc.
MCP111/112
Note: Unless otherwise indicated, all limits are specified for VDD = 1V to 5.5V, RPU = 100 kΩ (only MCP111;
see Figure 4-1), TA = -40°C to +125°C.
0.1500
0.1400
0.1300
0.1200
0.1100
0.1000
0.0900
0.0800
60
55
MCP112-475
MCP111-195
VDD increasing from:
50
VDD increasing from:
0V - 2.1V
45
0V - 5.0V
VDD increasing from:
0V - 4.9V
VDD increasing from:
0V - 5.5V
VDD increasing
from: 0V - 4.0V
40
35
30
VDD increasing from:
0V - 5.5V
VDD increasing from:
VDD increasing from:
0V - 4.8V
25
20
0V - 2.8V
-40
-15
10
35
60
85
110
-40
-15
10
35
60
85
110
Temperature (°C)
Temperature (°C)
FIGURE 2-25:
tRT vs. Temperature
FIGURE 2-27:
tRT vs. Temperature
(MCP111-195).
(MCP112-475).
0.4
1.E-02
10m
VDD increasing from:
0V - 3.1V
VDD increasing from:
1.E-03
1m
0.35
1.E-04
100µ
0V - 3.3V
0.3
0.25
0.2
1.E-05
10µ
1.E-06
1µ
125°C
25°C
1.E-07
100n
1.E-08
10n
VDD increasing from:
0V - 5.5V
1.E-09
0.15
0.1
1n
1.E-10
100p
VDD increasing from:
1.E-11
0V - 4.0V
10p
- 40°C
1.E-12
1p
0.05
0
MCP112-300
35
1.E-13
100f
0
1
2
3
4
5
6
7
8
9
10 11 12 13 14
-40
-15
10
60
85
110
Pull-Up Voltage (V)
Temperature (°C)
FIGURE 2-26:
tRT vs. Temperature
FIGURE 2-28:
Open-Drain Leakage
(MCP112-300).
Current vs. Voltage Applied to VOUT Pin
(MCP111-195).
© 2005 Microchip Technology Inc.
DS21889D-page 9
MCP111/112
3.0
PIN DESCRIPTION
The descriptions of the pins are listed in Table 3-1.
TABLE 3-1:
PIN FUNCTION TABLE
Pin No.
Symbol
Function
SOT-23-3
SC-70
SOT-89-3
T0-92
1
1
1
VOUT
Output State
VDD Falling:
H = VDD > VTRIP
L = VDD < VTRIP
VDD Rising:
H = VDD > VTRIP + VHYS
L = VDD < VTRIP + VHYS
2
3
2
3
4
3
2
VSS
VDD
VDD
Ground reference
Positive power supply
Positive power supply
—
—
DS21889D-page 10
© 2005 Microchip Technology Inc.
MCP111/112
4.1
VTRIP Operation
4.0
APPLICATION INFORMATION
The voltage trip point (VTRIP) is determined on the falling
edge of VDD. The actual voltage trip point (VTRIPAC) will
be between the minimum trip point (VTRIPMIN) and the
maximum trip point (VTRIPMAX). There is a hysteresis on
this trip point to remove any “jitter” that would occur on
the VOUT pin when the device VDD is at the trip point.
For many of today’s microcontroller applications, care
must be taken to prevent low-power conditions that can
cause many different system problems. The most
common causes are brown-out conditions, where the
system supply drops below the operating level momen-
tarily. The second most common cause is when a slowly
decaying power supply causes the microcontroller to
begin executing instructions without sufficient voltage to
sustain SRAM, thus producing indeterminate results.
Figure 4-1 shows a typical application circuit.
Figure 4-2 shows the state of the VOUT pin as
determined by the VDD voltage. The VTRIP specification
is for falling VDD voltages. When the VDD voltage is
rising, the VOUT pin will not be driven high until VDD is at
VTRIP + VHYS.
VDD
3
VDD
VDD
PICmicro®
Microcontroller
0.1
µF
RPU
MCP11X
(1)
1
VOUT
MCLR
(Reset Input)
VSS
2
GND
Note 1: RPU may be required with the MCP111
due to the open-drain output. Resistor
RPU is not required with the MCP112.
FIGURE 4-1:
Typical Application Circuit.
VDD
VTRIPAC + VHYSAC
VTRIPMAX
VTRIPMIN
VTRIPAC
VTRIPAC
1V
VOUT
< 1 V is outside the
device specifications
FIGURE 4-2:
VOUT Operation as Determined by the VTRIP and VHYS.
© 2005 Microchip Technology Inc.
DS21889D-page 11
MCP111/112
4.2
Negative Going VDD Transients
4.3
Effect of Temperature on Time-out
Period (t
)
RPU
The minimum pulse width (time) required to cause a
reset may be an important criteria in the implementa-
tion of a Power-on Reset (POR) circuit. This time is
referred to as transient duration, defined as the amount
of time needed for these supervisory devices to
respond to a drop in VDD. The transient duration time is
dependant on the magnitude of VTRIP – VDD. Generally
speaking, the transient duration decreases with
The time-out period (tRPU) determines how long the
device remains in the reset condition. This is affected
by both VDD and temperature. The graph shown in
Figures 2-22, 2-23 and 2-24 show the typical response
for different VDD values and temperatures.
®
4.4
Using in PICmicro
increases in VTRIP – VDD
.
Microcontroller ICSP™
Applications (MCP111 only)
Figure 4-3 shows a typical transient duration vs. reset
comparator overdrive for which the MCP111/112 will
not generate a reset pulse. It shows that the farther
below the trip point the transient pulse goes, the
duration of the pulse required to cause a reset gets
shorter. Figure 2-18 shows the transient response
characteristics for the MCP111/112.
Figure 4-4 shows the typical application circuit for using
the MCP111 for voltage supervisory function when the
PICmicro microcontroller will be programmed via the
In-Circuit
Serial
Programming™
(ICSP)
feature. Additional information is available in TB087,
“Using Voltage Supervisors with PICmicro® Microcon-
troller Systems which Implement In-Circuit Serial
Programming™”, DS91087.
A 0.1 µF bypass capacitor, mounted as close as
possible to the VDD pin, provides additional transient
immunity (refer to Figure 4-1).
Note:
It is recommended that the current into the
RST pin be current limited by a 1 kΩ
resistor.
5V
V
V
TRIP(MAX)
TRIP(MIN)
VDD/VPP
V
- V
DD
TRIP(MIN)
0.1 µF
VDD
RPU
VDD
t
PICmicro®
TRANS
MCU
MCP111
0V
Time (µs)
MCLR
(reset input)
(Active-Low)
FIGURE 4-3:
Transient Duration Waveform.
Example of Typical
RST
VSS
1 kΩ
VSS
FIGURE 4-4:
Typical Application Circuit
for PICmicro® Microcontroller with the ICSP™
feature.
DS21889D-page 12
© 2005 Microchip Technology Inc.
MCP111/112
5.0
5.1
PACKAGING INFORMATION
Package Marking Information
3-Lead TO-92
Example:
XXXXXX
XXXXXX
XXXXXX
YWWNNN
MCP111
290E
TO^
e3
547256
3-Pin SOT-23
Example:
Part Number
SOT-23
Part Number
SOT-23
MCP111T-195I/TT
MCP111T-240ETT
MPNN MCP112T-195I/TT
MQNN MCP112T-240ETT
MRNN
MSNN
XXNN
MCP111T-270E/TT MGNN MCP112T-270E/TT MANN
MCP111T-290E/TT NHNN MCP112T-290E/TT MBNN
MCP111T-300E/TT
MCP111T-315E/TT MKNN MCP112T-315E/TT MDNN
MCP111T-450E/TT MLNN MCP112T-450E/TT MENN
MJNN MCP112T-300E/TT MCNN
MCP111T-475E/TT MMNN MCP112T-475E/TT MFNN
3-Pin SOT-89
Example:
Part Number
SOT-89
Part Number
SOT-89
MCP111T-195I/MB
MCP111T-240EMB
MCP111T-270E/MB
MCP111T-290E/MB
MCP111T-300E/MB
MCP111T-315E/MB
MCP111T-450E/MB
MCP111T-475E/MB
MP
MQ
MG
NH
MJ
MCP112T-195I/MB
MCP112T-240EMB
MCP112T-270E/MB
MCP112T-290E/MB
MCP112T-300E/MB
MCP112T-315E/MB
MCP112T-450E/MB
MCP112T-475E/MB
MR
MS
MA
MB
MC
MD
ME
MF
XXYYWW
NNN
MK
ML
MM
Legend: XX...X Customer-specific information
Y
Year code (last digit of calendar year)
WW
NNN
Week code (week of January 1 is week ‘01’)
Alphanumeric traceability code
e
3
Pb-free JEDEC designator for Matte Tin (Sn)
*
This package is Pb-free. The Pb-free JEDEC designator (
can be found on the outer packaging for this package.
)
e3
Note: In the event the full Microchip part number cannot be marked on one line, it will
be carried over to the next line, thus limiting the number of available
characters for customer-specific information.
© 2005 Microchip Technology Inc.
DS21889D-page 13
MCP111/112
Package Marking Information (Continued)
3-Pin SC-70
Example:
SC-70
Part Number
Part Number
SC-70
MCP111T-195I/LB
MCP111T-240E/LB
MCP111T-270E/LB
MCP111T-290E/LB
MCP111T-300E/LB
MCP111T-315E/LB
MCP111T-450E/LB
EPN
EQN
EGN
EHN
EJN
EKN
ELN
MCP112T-195I/LB
ERN
XXN
MCP112T-240E/LB ESN
MCP112T-270E/LB EAN
MCP112T-290E/LB EBN
MCP112T-300E/LB ECN
MCP112T-315E/LB EDN
MCP112T-450E/LB EEN
Top Side
MCP111T-475E/LB EMN MCP112T-475E/LB EFN
OR
Example:
Part Number
SC-70
Part Number
SC-70
MCP111T-195I/LB
EPNN MCP112T-195I/LB
ERNN
MCP111T-240E/LB EQNN MCP112T-240E/LB ESNN
MCP111T-270E/LB EGNN MCP112T-270E/LB EANN
MCP111T-290E/LB EHNN MCP112T-290E/LB EBNN
MCP111T-300E/LB EJNN MCP112T-300E/LB ECNN
MCP111T-315E/LB EKNN MCP112T-315E/LB EDNN
MCP111T-450E/LB ELNN MCP112T-450E/LB EENN
MCP111T-475E/LB EMNN MCP112T-475E/LB EFNN
XXNN
Top Side
DS21889D-page 14
© 2005 Microchip Technology Inc.
MCP111/112
3-Lead Plastic Small Outline Transistor (MB) (SOT89)
H
E
B1
3
B
D1
D
p1
2
1
p
R
B1
L
E1
A
C
Units
INCHES
MILLIMETERS*
Dimension Limits
MIN
MAX
MIN
1.50 BSC
MAX
p
Pitch
.059 BSC
.118 BSC
.055
p1
Outside lead pitch (basic)
Overall Height
3.00 BSC
1.40
A
H
E
.063
1.60
Overall Width
.155
.167
.102
.090
.181
.072
3.94
4.25
2.60
2.29
4.60
1.83
Molded Package Width at Base
Molded Package Width at Top
Overall Length
.090
2.29
E1
D
D1
R
.084
2.13
.173
4.40
Tab Length
.064
1.62
Tab Corner Radii
Foot Length
.010
0.254
0.89
L
c
.035
.047
.017
.022
.019
1.20
0.44
0.56
0.48
Lead Thickness
.014
0.35
Lead 2 Width
B
.017
0.43
Leads 1 & 3 Width
B1
.014
0.36
*Controlling Parameter
Notes:
Dimensions D and E1 do not include mold or flash protrusions. Mold flash or protrusions
shall not exceed .005" (0.127mm) per side.
JEDEC Equivalent: TO-243
Drawing No. C04-29
Revised 07-24-03
© 2005 Microchip Technology Inc.
DS21889D-page 15
MCP111/112
3-Lead Plastic Small Outline Transistor (TT) (SOT-23)
E
E1
2
B
p1
D
n
p
1
α
c
A
A2
A1
φ
β
L
Units
INCHES*
NOM
MILLIMETERS
Dimension Limits
MIN
MAX
MIN
NOM
3
MAX
n
p
Number of Pins
3
Pitch
.038
.076
.040
.037
.002
.093
.051
.115
.018
5
0.96
1.92
p1
Outside lead pitch (basic)
Overall Height
A
A2
A1
E
.035
.044
0.89
0.88
1.01
0.95
0.06
2.37
1.30
2.92
0.45
5
1.12
1.02
0.10
2.64
1.40
3.04
0.55
10
Molded Package Thickness
.035
.000
.083
.047
.110
.014
0
.040
.004
.104
.055
.120
.022
10
Standoff
§
0.01
2.10
1.20
2.80
0.35
0
Overall Width
Molded Package Width
Overall Length
E1
D
Foot Length
L
φ
Foot Angle
c
Lead Thickness
Lead Width
.004
.015
0
.006
.017
5
.007
.020
10
0.09
0.37
0
0.14
0.44
5
0.18
0.51
10
B
α
β
Mold Draft Angle Top
Mold Draft Angle Bottom
0
5
10
0
5
10
* Controlling Parameter
§ Significant Characteristic
Notes:
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed
.010” (0.254mm) per side.
JEDEC Equivalent: TO-236
Drawing No. C04-104
DS21889D-page 16
© 2005 Microchip Technology Inc.
MCP111/112
3-Lead Plastic Small Outline Transistor (LB) (SC-70)
E
E1
B
2
1
p1
D
3
p
a
A2
A
c
A1
b
L
Units
Dimension Limits
INCHES
3
MILLIMETERS*
MIN MAX
MIN
MAX
Number of Pins
Pitch
3
p
.026 BSC.
.051 BSC.
.031
.031
.000
.071
.045
.071
.004
.003
.006
8°
0.65 BSC.
1.30 BSC.
0.80
p1
Outside lead pitch (basic)
Overall Height
A
A2
A1
E
.043
1.10
Molded Package Thickness
Standoff
.039
.0004
.094
.053
.089
.016
.010
.016
12°
0.80
1.00
.010
2.40
1.35
2.25
0.41
0.25
0.40
12°
0.00
Overall Width
1.80
Molded Package Width
Overall Length
E1
D
1.15
1.80
Foot Length
L
c
0.10
Lead Thickness
0.08
Lead Width
B
a
0.15
Mold Draft Angle Top
Mold Draft Angle Bottom
8°
b
8°
12°
8°
12°
*Controlling Parameter
Notes:
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions
shall not exceed .005" (0.127mm) per side.
JEITA (EIAJ) Equivalent: SC70
Drawing No. C04-104
© 2005 Microchip Technology Inc.
DS21889D-page 17
MCP111/112
3-Lead Plastic Transistor Outline (TO) (TO-92)
E1
D
n
1
L
1
2
3
α
B
p
c
A
R
β
Units
INCHES*
NOM
MILLIMETERS
Dimension Limits
MIN
MAX
MIN
NOM
3
MAX
n
p
Number of Pins
3
Pitch
.050
.143
.186
.183
.090
.555
.017
.019
5
1.27
Bottom to Package Flat
Overall Width
A
E1
D
R
L
.130
.155
3.30
4.45
3.62
4.71
4.64
2.29
14.10
0.43
0.48
5
3.94
.175
.170
.085
.500
.014
.016
4
.195
.195
.095
.610
.020
.022
6
4.95
4.95
2.41
15.49
0.51
0.56
6
Overall Length
4.32
2.16
12.70
0.36
0.41
4
Molded Package Radius
Tip to Seating Plane
Lead Thickness
Lead Width
c
B
α
Mold Draft Angle Top
Mold Draft Angle Bottom
β
2
3
4
2
3
4
*Controlling Parameter
Notes:
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed
.010” (0.254mm) per side.
JEDEC Equivalent: TO-92
Drawing No. C04-101
DS21889D-page 18
© 2005 Microchip Technology Inc.
MCP111/112
5.2
Product Tape and Reel Specifications
EMBOSSED CARRIER DIMENSIONS (8, 12, 16 AND 24 MM TAPE ONLY)
FIGURE 5-1:
Top
Cover
Tape
A
0
W
B
K
0
0
P
TABLE 1:
CARRIER TAPE/CAVITY DIMENSIONS
Carrier
Cavity
Dimensions
Output
Quantity
Units
Reel
Diameter in
mm
Dimensions
Case
Package
Outline
Type
W
P
A0
B0
mm
K0
mm
mm
mm
mm
TT
LB
SOT-23B
SC-70
3L
3L
8
8
4
4
3.15
2.4
2.77
2.4
1.22
1.19
3000
3000
180
180
FIGURE 5-2:
3-LEAD SOT-23/SC70 DEVICE TAPE AND REEL SPECIFICATIONS
User Direction of Feed
Device
Marking
W
PIN 1
P
Standard Reel Component Orientation
© 2005 Microchip Technology Inc.
DS21889D-page 19
MCP111/112
FIGURE 5-3:
TO-92 DEVICES
User Direction of Feed
P
Device
Marking
MARK
FACE
MARK
FACE
MARK
FACE
Seal
Tape
Back
Tape
W
Note:
Bent leads are for Tape and Reel only.
FIGURE 5-4:
SOT-89 DEVICES
User Direction of Feed
W, Width
of Carrier
Tape
Pin 1
Pin 1
P, Pitch
Reverse Reel Component Orientation
Standard Reel Component Orientation
DS21889D-page 20
© 2005 Microchip Technology Inc.
MCP111/112
APPENDIX A: REVISION HISTORY
Revision D (June 2005)
1. Added
SOT-89-3
package
information
throughout.
Revision C (March 2005)
The following is the list of modifications:
1. Added Section 4.4 “Using in PICmicro®
Microcontroller ICSP™ Applications
(MCP111 only)” on using the MCP111 in
PICmicro microcontroller ICSP applications.
2. Added VODH specifications in Section 1.0
“Electrical
Characteristics” (for
ICSP
applications).
3. Added Figure 2-28.
4. Added devices features table to page 1.
5. Updated SC-70 package markings and added
Pb-free marking information to Section 5.0
“Packaging information”.
6. Added Appendix A: “Revision History”.
Revision B (August 2004)
1. Corrected package marking information in
Section 5.0 “Packaging information”
Revision A (May 2004)
• Original Release of this Document.
© 2005 Microchip Technology Inc.
DS21889D-page 21
MCP111/112
NOTES:
DS21889D-page 22
© 2005 Microchip Technology Inc.
MCP111/112
PRODUCT IDENTIFICATION SYSTEM
To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office.
Examples:
PART NO.
Device
X
XXX
X
XX
a)
MCP111T-195I/TT: Tape and Reel,
Temperature Package
Range
Tape/Reel
Option
Monitoring
Options
1.95V option, open-drain,
-40°C to +85°C,
SOT-23B package.
b)
MCP111T-315E/LB: Tape and Reel,
3.15V option, open-drain,
-40°C to +125°C,
SC-70-3 package.
Device:
MCP111: MicroPower Voltage Detector, open-drain
MCP111T: MicroPower Voltage Detector, open-drain
(Tape and Reel)
c)
d)
MCP111-300E/TO: 3.00V option, open-drain,
-40°C to +125°C,
TO-92-3 package.
MCP111-315E/MB: 3.15V option, open-drain,
-40°C to +125°C,
MCP112: MicroPower Voltage Detector, push-pull
MCP112T: MicroPower Voltage Detector, push-pull
(Tape and Reel)
Monitoring Options:
195 = 1.90V
240 = 2.32V
270 = 2.63V
290 = 2.90V
300 = 2.93V
315 = 3.08V
450 = 4.38V
475 = 4.63V
SOT-89-3 package.
a)
b)
MCP112T-290E/TT: Tape and Reel,
2.90V option, push-pull, -
40°C to +125°C,
SOT-23B-3 package.
MCP112T-475E/LB: Tape and Reel,
4.75V option, push-pull,
-40°C to +125°C,
SC-70-3 package.
MCP112-450E/TO: 4.5V option, push-pull,
-40°C to +125°C,
TO-92-3 package.
MCP112-315E/MB: 3.15V option, push-pull,
-40°C to +125°C,
Temperature Range:
Package:
I
E
=
=
-40°C to +85°C (MCP11X-195 only)
-40°C to +125°C (Except MCP11X-195 only)
c)
d)
LB
MB
TO
TT
=
=
=
=
SC-70, 3-lead
SOT-89, 3-lead
TO-92, 3-lead
SOT-23B, 3-lead
SOT-89-3 package.
© 2005 Microchip Technology Inc.
DS21889D-page 23
MCP111/112
NOTES:
DS21889D-page 24
© 2005 Microchip Technology Inc.
Note the following details of the code protection feature on Microchip devices:
•
Microchip products meet the specification contained in their particular Microchip Data Sheet.
•
Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the
intended manner and under normal conditions.
•
There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our
knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data
Sheets. Most likely, the person doing so is engaged in theft of intellectual property.
•
•
Microchip is willing to work with the customer who is concerned about the integrity of their code.
Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not
mean that we are guaranteeing the product as “unbreakable.”
Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our
products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts
allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act.
Information contained in this publication regarding device
applications and the like is provided only for your convenience
and may be superseded by updates. It is your responsibility to
ensure that your application meets with your specifications.
MICROCHIP MAKES NO REPRESENTATIONS OR WAR-
RANTIES OF ANY KIND WHETHER EXPRESS OR IMPLIED,
WRITTEN OR ORAL, STATUTORY OR OTHERWISE,
RELATED TO THE INFORMATION, INCLUDING BUT NOT
LIMITED TO ITS CONDITION, QUALITY, PERFORMANCE,
MERCHANTABILITY OR FITNESS FOR PURPOSE.
Microchip disclaims all liability arising from this information and
its use. Use of Microchip’s products as critical components in
life support systems is not authorized except with express
written approval by Microchip. No licenses are conveyed,
implicitly or otherwise, under any Microchip intellectual property
rights.
Trademarks
The Microchip name and logo, the Microchip logo, Accuron,
dsPIC, KEELOQ, microID, MPLAB, PIC, PICmicro,
PICSTART, PRO MATE, PowerSmart, rfPIC, and
SmartShunt are registered trademarks of Microchip
Technology Incorporated in the U.S.A. and other countries.
AmpLab, FilterLab, Migratable Memory, MXDEV, MXLAB,
PICMASTER, SEEVAL, SmartSensor and The Embedded
Control Solutions Company are registered trademarks of
Microchip Technology Incorporated in the U.S.A.
Analog-for-the-Digital Age, Application Maestro, dsPICDEM,
dsPICDEM.net, dsPICworks, ECAN, ECONOMONITOR,
FanSense, FlexROM, fuzzyLAB, In-Circuit Serial
Programming, ICSP, ICEPIC, Linear Active Thermistor,
MPASM, MPLIB, MPLINK, MPSIM, PICkit, PICDEM,
PICDEM.net, PICLAB, PICtail, PowerCal, PowerInfo,
PowerMate, PowerTool, rfLAB, rfPICDEM, Select Mode,
Smart Serial, SmartTel, Total Endurance and WiperLock are
trademarks of Microchip Technology Incorporated in the
U.S.A. and other countries.
SQTP is a service mark of Microchip Technology Incorporated
in the U.S.A.
All other trademarks mentioned herein are property of their
respective companies.
© 2005, Microchip Technology Incorporated, Printed in the
U.S.A., All Rights Reserved.
Printed on recycled paper.
Microchip received ISO/TS-16949:2002 quality system certification for
its worldwide headquarters, design and wafer fabrication facilities in
Chandler and Tempe, Arizona and Mountain View, California in
October 2003. The Company’s quality system processes and
procedures are for its PICmicro® 8-bit MCUs, KEELOQ® code hopping
devices, Serial EEPROMs, microperipherals, nonvolatile memory and
analog products. In addition, Microchip’s quality system for the design
and manufacture of development systems is ISO 9001:2000 certified.
© 2005 Microchip Technology Inc.
DS21889D-page 25
WORLDWIDE SALES AND SERVICE
AMERICAS
ASIA/PACIFIC
ASIA/PACIFIC
EUROPE
Corporate Office
Australia - Sydney
Tel: 61-2-9868-6733
Fax: 61-2-9868-6755
India - Bangalore
Tel: 91-80-2229-0061
Fax: 91-80-2229-0062
Austria - Weis
Tel: 43-7242-2244-399
Fax: 43-7242-2244-393
2355 West Chandler Blvd.
Chandler, AZ 85224-6199
Tel: 480-792-7200
Fax: 480-792-7277
Technical Support:
http://support.microchip.com
Web Address:
www.microchip.com
China - Beijing
Tel: 86-10-8528-2100
Fax: 86-10-8528-2104
Denmark - Ballerup
Tel: 45-4450-2828
Fax: 45-4485-2829
India - New Delhi
Tel: 91-11-5160-8631
Fax: 91-11-5160-8632
China - Chengdu
Tel: 86-28-8676-6200
Fax: 86-28-8676-6599
France - Massy
Tel: 33-1-69-53-63-20
Fax: 33-1-69-30-90-79
Japan - Kanagawa
Tel: 81-45-471- 6166
Fax: 81-45-471-6122
Atlanta
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Tel: 86-591-8750-3506
Fax: 86-591-8750-3521
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Tel: 49-89-627-144-0
Fax: 49-89-627-144-44
Korea - Seoul
Alpharetta, GA
Tel: 770-640-0034
Fax: 770-640-0307
Tel: 82-2-554-7200
Fax: 82-2-558-5932 or
82-2-558-5934
Italy - Milan
Tel: 39-0331-742611
Fax: 39-0331-466781
China - Hong Kong SAR
Tel: 852-2401-1200
Fax: 852-2401-3431
Boston
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Fax:011-604-646-5086
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Tel: 774-760-0087
Fax: 774-760-0088
Netherlands - Drunen
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Tel: 86-21-5407-5533
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Fax: 011-632-634-9069
Chicago
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Tel: 630-285-0071
Fax: 630-285-0075
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Tel: 44-118-921-5869
Fax: 44-118-921-5820
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Fax: 65-6334-8850
Dallas
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Tel: 972-818-7423
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Taiwan - Kaohsiung
Tel: 886-7-536-4818
Fax: 886-7-536-4803
China - Shunde
Detroit
Tel: 86-757-2839-5507
Fax: 86-757-2839-5571
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Tel: 248-538-2250
Fax: 248-538-2260
Taiwan - Taipei
Tel: 886-2-2500-6610
Fax: 886-2-2508-0102
China - Qingdao
Tel: 86-532-502-7355
Fax: 86-532-502-7205
Kokomo
Kokomo, IN
Tel: 765-864-8360
Fax: 765-864-8387
Taiwan - Hsinchu
Tel: 886-3-572-9526
Fax: 886-3-572-6459
Los Angeles
Mission Viejo, CA
Tel: 949-462-9523
Fax: 949-462-9608
San Jose
Mountain View, CA
Tel: 650-215-1444
Fax: 650-961-0286
Toronto
Mississauga, Ontario,
Canada
Tel: 905-673-0699
Fax: 905-673-6509
04/20/05
DS21889D-page 26
© 2005 Microchip Technology Inc.
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