MX573EBH125M000-TR [MICROCHIP]
CMOS Output Clock Oscillator, 125MHz Nom;
| 型号： | MX573EBH125M000-TR |
| 厂家： | 
MICROCHIP |
| 描述： | CMOS Output Clock Oscillator, 125MHz Nom 机械 振荡器 |
| 文件： | 总28页 (文件大小：1337K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
MX55/57
Low Jitter Crystal Oscillator
Features
General Description
• Output Frequency 2.5 MHz to 850 MHz
The MX55/MX57 product line is an ultra-low jitter family
of industry standard crystal oscillators (XO) designed to
maximize performance in networking, storage, server,
and telecommunications equipment.
• Phase Noise as Low as 150 fs at
F0 = 156.25 MHz, Integration Bandwidth
12 kHz - 20 MHz, LVPECL Output
• Ultra Low Spurs (-113 dBc Typical)
The MX55 employs a space-saving 3.2 mm x 5 mm
package, while the MX57 is in a 5 mm x 7 mm package.
These devices meet ±50 ppm total stability across
–40°C to +85°C operating temperature range, using
proven high reliability assembly methods that improve
long term reliability and minimize aging drift compared
to traditional XO assembly processes.
• ±50 ppm Overvoltage and Temperature
• Supports CMOS, LVPECL, LVDS, and HCSL
Outputs
• Supply Voltage (VIN) +2.375V to +3.63V
• Output Enable Option; Can Be Ordered on Pin 1
or Pin 2
With programmable output format and OE options,
these XOs can be configured to be footprint compatible
with any standard 6-pin XO available today. Standard
options and frequencies are also available.
• Industry-Standard and Space-Saving
5.0 mm x 3.2 mm 6-pin package (MX55) and
5.0 mm x 7.0 mm (MX57)
• –40°C to +85°C Operating Temperature Range
• Pb-Free and RoHS Compliant
Please visit http://clockworks.microchip.com/timing to
select a combination of options to customize your
product, print a specific data sheet, and order samples.
• Short Production Lead Time
Applications
• 10/40/100G Ethernet
Block Diagram
• Optical Communications
• PCIe Gen 1/2/3/4
VDD Pin 6
• Fibre Channel/SAS
GND Pin 3
• CPRI/OBSAI, XAUI and Backplane SERDES
VDD Noise Filter
OE Pin 1 or Pin 2
Q Pin 4
Q Pin 5
Fixed
Freq. XO
Phase Locked
Loop
2018 Microchip Technology Inc.
DS20005972A-page 1
MX55/57
Package Types
MX55 Pinout Enable
Pin 1 Option
MX57 Pinout Enable
Pin 2 Option
OE
1
6
VDD
DNC 1
6
VDD
DNC 2
GND 3
5
4
Q
Q
OE
2
5
4
Q
Q
GND 3
DS20005972A-page 2
2018 Microchip Technology Inc.
MX55/57
1.0
ELECTRICAL CHARACTERISTICS
Absolute Maximum Ratings †
Input Voltage, (VIN) ............................................................................................................................–0.3V to VDD +0.3V
Supply Voltage......................................................................................................................................... –0.3V to + 4.0V
ESD Protection (HBM)...............................................................................................................................................2 kV
ESD Protection (MM) ................................................................................................................................................200V
ESD Protection (CDM)............................................................................................................................................1.5 kV
† Notice: Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to the device.
This is a stress rating only and functional operation of the device at those or any other conditions above those indicated
in the operational sections of this specification is not intended. Exposure to maximum rating conditions for extended
periods may affect device reliability.
TABLE 1-1:
ELECTRICAL CHARACTERISTICS
Electrical Characteristics: VDD = 2.375V to 3.63V, TA = –40°C to +85°C.
Parameters
Sym.
Min.
Typ.
Max.
Units
Conditions
Supply Voltage
(Note 1)
VDD
2.375
—
3.63
V
—
—
—
—
—
—
85
105
80
95
120
90
Output enabled LVCMOS (no load).
LVPECL
Supply Current
IDD
mA
LVDS
85
95
HCSL
68
—
Output disabled (Tri-state)
Frequency
Stability
Inclusive of initial accuracy, temperature
drift, aging, shock and vibration.
Δf
—
—
—
—
±50
20
ppm
ms
From 90% VDD to valid clock output,
T = +25°C
Start-up Time
tSU
VIH
VIL
2
—
—
VDD+0.3
0.8
Input logic-high
Input logic-low
Input Logic
Levels
V
–0.3
Enable Active
High Option
(Note 2)
—
—
—
—
50
50
—
—
kΩ
Pull-up resistor on Pin 1 or 2
Enable Active
Low Option
(Note 3)
kΩ
Pull-down resistor on Pin 1 or 2
LVCMOS
Frequency
f0
ϕj
2.5
—
—
131
77
250
—
MHz
—
12 kHz to 5 MHz @ 25 MHz
1.875 MHz to 5 MHz @ 25 MHz
Integrated Phase
Noise (Random)
fsRMS
—
—
Output High
Voltage
VOH
VDD–0.8
—
—
—
—
V
V
RL = 50Ω termination from Q to VDD–2
Output Low
Voltage
VOL
Tr/Tf
SYM
0.6
Output Rise/Fall
Time
100
45
—
—
500
55
ps
%
—
—
Duty Cycle
LVPECL
Frequency
f0
ϕj
2.5
—
—
130
96
850
—
MHz
—
12 kHz to 20 MHz @ 200 MHz
1.875 MHz to 20 MHz @ 200 MHz
Integrated Phase
Noise (Random)
fsRMS
—
—
2018 Microchip Technology Inc.
DS20005972A-page 3
MX55/57
TABLE 1-1:
ELECTRICAL CHARACTERISTICS (CONTINUED)
Electrical Characteristics: VDD = 2.375V to 3.63V, TA = –40°C to +85°C.
Parameters
Sym.
Min.
Typ.
Max.
Units
Conditions
Output High
Voltage
VOH
VDD
1.01
–
V
VDD–1.35
V
DD–0.8
RL = 50Ω termination at Q and Q, both to
VDD–2
Output Low
Voltage
VOL
VDD–
mV
VDD–2.0
0.65
V
DD–1.6
0.95
1.78
Output
Differential
Voltage
VOD
Tr/Tf
SYM
0.77
mV
ps
%
—
Output Rise/Fall
Time
85
45
—
—
350
55
—
—
Duty Cycle
LVDS
Frequency
f0
ϕj
2.5
—
—
140
94
850
—
MHz
fsRMS
V
—
12 kHz to 20 MHz @ 200 MHz
1.875 MHz to 20 MHz @ 200 MHz
Integrated Phase
Noise (Random)
—
—
Output High
Voltage
VOH
1.248
0.898
1.375
1.025
1.602
1.252
RL = 100Ω termination from Q to Q
Output Low
Voltage
VOL
VOD
V
mV
V
Output
Differential
Voltage
247
350
1.2
454
—
—
Common Mode
Output Voltage
VCM
Tr/Tf
SYM
1.125
1.375
Output Rise/Fall
Time
100
45
—
—
400
55
ps
%
—
—
Duty Cycle
HCSL
Frequency
f0
ϕj
2.5
—
—
166
97
850
—
MHz
fsRMS
V
—
12 kHz to 20 MHz @ 100 MHz
1.875 MHz to 20 MHz @ 100 MHz
Integrated Phase
Noise (Random)
—
—
Output High
Voltage
VOH
660
700
0
850
27
RL = 50Ω termination at Q and Q to GND
Output Low
Voltage
VOL
VOD
–150
mV
mV
Output
Differential
Voltage
—
—
200
250
250
300
20% to 80%
—
Common Mode
Output Voltage
VCM
Tr/Tf
SYM
48
—
52
mV
Differential
Output Rise/Fall
Time
150
48
300
—
450
52
ps
%
—
—
Duty Cycle
Note 1: VDD Pin should be filtered with a 0.1 µF capacitor.
2: Output is enabled if pad floated (not connected) or pulled high; output tri-stated if pulled low.
3: Output is enabled if pad floated (not connected) or pulled low; output tri-stated if pulled high.
DS20005972A-page 4
2018 Microchip Technology Inc.
MX55/57
TEMPERATURE SPECIFICATIONS (Note 1)
Parameters
Temperature Ranges
Sym.
Min.
Typ.
Max.
Units
Conditions
Operating Temperature Range
Junction Operating Temperature
Storage Temperature Range
Soldering Temperature
TA
TJ
TS
—
–40
—
—
—
—
—
85
°C
°C
°C
°C
Ordering Option I
125
150
260
—
–65
—
—
10 sec. max.
Package Thermal Resistance
—
—
53
58
5 mm x 7 mm
Thermal Resistance from Junction to
Ambient
JA
°C/W
5 mm x 3.2 mm
Note 1: The maximum allowable power dissipation is a function of ambient temperature, the maximum allowable
junction temperature and the thermal resistance from junction to air (i.e., TA, TJ, JA). Exceeding the
maximum allowable power dissipation will cause the device operating junction temperature to exceed the
maximum +125°C rating. Sustained junction temperatures above +125°C can impact the device reliability.
2018 Microchip Technology Inc.
DS20005972A-page 5
MX55/57
2.0
PIN DESCRIPTIONS
The descriptions of the pins are listed in Table 2-1 and Table 2-2.
TABLE 2-1:
PIN FUNCTION TABLE (ENABLE PIN 1 OPTION)
Pin Number
Pin Name
Pin Type
Description
1
OE
I
Output Enable.
Active-High and Active-Low Options.
Do not connect, Leave Floating.
Power Supply Ground.
2
3
4
5
6
DNC
GND
Q
NC
Power
O
Clock Output + or Output for CMOS.
Clock Output – or Do Not Connect for CMOS.
Power Supply.
Q
O
VDD
Power
TABLE 2-2:
PIN FUNCTION TABLE (ENABLE PIN 2 OPTION)
Pin Number
Pin Name
Pin Type
Description
Do not connect, Leave Floating.
1
DNC
NC
Output Enable.
Active-High and Active-Low Options.
2
OE
I
3
4
5
6
GND
Q
Power
O
Power Supply Ground.
Clock Output + or Output for CMOS.
Clock Output – or Do Not Connect for CMOS.
Power Supply.
Q
O
VDD
Power
DS20005972A-page 6
2018 Microchip Technology Inc.
MX55/57
3.0
PERFORMANCE CHARACTERISTICS
Note: The graphs and tables provided following this note are a statistical summary based on a limited number of
samples and are provided for informational purposes only. The performance characteristics listed herein
are not tested or guaranteed. In some graphs or tables, the data presented may be outside the specified
operating range (e.g., outside specified power supply range) and therefore outside the warranted range.
FIGURE 3-1:
LVPECL Output 156.25 MHz 12 kHz - 20 MHz 153 fs.
FIGURE 3-2:
LVCMOS Output 25 MHz 12 kHz - 5 MHz 131 fs.
2018 Microchip Technology Inc.
DS20005972A-page 7
MX55/57
FIGURE 3-3:
LVPECL Output 200 MHz 1.875 MHz - 20 MHz 96 fs.
FIGURE 3-4:
LVPECL Output 200 MHz 12 kHz - 20 MHz 130 fs.
DS20005972A-page 8
2018 Microchip Technology Inc.
MX55/57
FIGURE 3-5:
LVDS Output 200 MHz 1.875 MHz - 20 MHz 94 fs.
FIGURE 3-6:
LVDS Output 200 MHz 12 kHz - 20 MHz 140 fs.
2018 Microchip Technology Inc.
DS20005972A-page 9
MX55/57
FIGURE 3-7:
HCSL Output 100 MHz 1.875 MHz - 20 MHz 97 fs.
FIGURE 3-8:
HCSL Output 100 MHz 12 kHz - 20 MHz 166 fs.
DS20005972A-page 10
2018 Microchip Technology Inc.
MX55/57
4.0
OUTPUT WAVEFORM
Output Voltage Swing
Refer to Table 4-1
FIGURE 4-1:
Output Waveform: LVPECL, LVDS, HCSL, LVCMOS.
TABLE 4-1:
OUTPUT VOLTAGE SWING
Output Logic Protocol
Output Swing (mV Peak-Peak, Typical)
LVCMOS
LVPECL
LVDS
VOH, VOL
770 mV
350 mV
700 mV
HCSL
2018 Microchip Technology Inc.
DS20005972A-page 11
MX55/57
5.0
SOLDER REFLOW PROFILE
FIGURE 5-1:
Solder Reflow Profile.
TABLE 5-1:
SOLDER REFLOW
Refer to JSTD-020C
Ramp-Up Rate (200°C to Peak Temp.)
Preheat Time 150°C to 200°C
Time Maintained above 217°C
Peak Temperature
3°C/sec. max.
60 to 180 sec.
60 to 150 sec.
255°C to 260°C
20 to 40 sec.
Time within 5°C of Actual Peak
Ramp-Down Rate
6°C/sec. max.
8 minutes max.
Time 25°C to Peak Temperature
DS20005972A-page 12
2018 Microchip Technology Inc.
MX55/57
6.0
ENVIRONMENTAL SPECIFICATIONS
TABLE 6-1:
ENVIRONMENTAL SPECIFICATIONS
Parameter
Specification
Thermal Shock
MIL-STD-883, Method 1011, Condition A
MIL-STD-883, Method1004
Moisture Resistance
Mechanical Shock
Mechanical Vibration
Resistance to Soldering Heat
Hazardous Substance
Solderability
MIL-STD-883, Method 2022, Condition C
MIL-STD-883, Method 2007, Condition B
J-STD-020C, Table 5-2 Pb-free Devices (Except 2 Cycles Max)
Pb-Free/RoHS/Green Compliant
JESD22-B102-D Method 2 (Preconditioning E)
MIL-STD-883, Method 2004, Test Condition D
MIL-STD-883, Method 1014, Condition C
Terminal Strength
Gross Leak
Fine Leak
MIL-STD-883, Method 1014, Condition A2, R1 = 2x10–8 ATM CC/S
Solvent Resistance
MIL-STD-202, Method 215
2018 Microchip Technology Inc.
DS20005972A-page 13
MX55/57
7.0
7.1
PACKAGING INFORMATION
Package Marking Information
6-Pin LGA*
5 mm x 7 mm
Example
MX575AB
1958
F100M000
XXXXXXX
WNNN
XXXXXXXX
6-Pin LGA*
3.2 mm x 5 mm
Example
MX555A
1817
XXXXXX
WNNN
BF1000
XXXXXX
Legend: XX...X Product code, customer-specific information, or frequency in MHz
without printed decimal point
Y
Year code (last digit of calendar year)
YY
WW
NNN
Year code (last 2 digits of calendar year)
Week code (week of January 1 is week ‘01’)
Alphanumeric traceability code
e
3
Pb-free JEDEC® designator for Matte Tin (Sn)
This package is Pb-free. The Pb-free JEDEC designator (
can be found on the outer packaging for this package.
*
e
3
)
●, ▲, ▼ Pin one index is identified by a dot, delta up, or delta down (triangle
mark).
Note: In the event the full Microchip part number cannot be marked on one line, it will
be carried over to the next line, thus limiting the number of available
characters for customer-specific information. Package may or may not include
the corporate logo.
Underbar (_) and/or Overbar (‾) symbol may not be to scale.
DS20005972A-page 14
2018 Microchip Technology Inc.
MX55/57
6-Lead Low 5.0 mm x 3.2 mm LGA Package Outline and Recommended Land Pattern
6-Lead Low Profile Land Grid Array (ANA) - 5.0x3.2 mm Body [LLGA]
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
D
A
B
E
N
(DATUM A)
(DATUM B)
NOTE 1
2X
0.10 C
2X
1
2
0.10 C
TOP VIEW
0.10 C
A2
A
C
A1
SEATING
PLANE
0.08 C
SIDE VIEW
1
2
L1
E1
L
N
6X b
0.10
0.05
C A B
C
e
BOTTOM VIEW
Microchip Technology Drawing C04-1068A Sheet 1 of 2
2018 Microchip Technology Inc.
DS20005972A-page 15
MX55/57
6-Lead Low Profile Land Grid Array (ANA) - 5.0x3.2 mm Body [LLGA]
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
Units
Dimension Limits
MILLIMETERS
NOM
MIN
MAX
Number of Terminals
Pitch
Overall Height
Substrate Thickness
Mold Cap Height
Overall Length
Overall Width
Terminal Pitch
Terminal Width
Terminal Length
Terminal Pullback
N
6
e
1.27 BSC
1.33
0.23
A
A1
A2
D
E
E1
b
1.26
0.19
1.07
1.40
0.27
1.13
1.10
5.00 BSC
3.20 BSC
2.10 BSC
0.90
0.90
0.10
0.85
0.85
0.05
0.95
0.95
0.15
L
L1
Notes:
1. Pin 1 visual index feature may vary, but must be located within the hatched area.
2. Dimensioning and tolerancing per ASME Y14.5M
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
REF: Reference Dimension, usually without tolerance, for information purposes only.
Microchip Technology Drawing C04-1068A Sheet 2 of 2
DS20005972A-page 16
2018 Microchip Technology Inc.
MX55/57
6-Lead Low Profile Land Grid Array (ANA) - 5.0x3.2 mm Body [LLGA]
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
X
G1
6
Y
G2
C
1
2
E
SILK SCREEN
RECOMMENDED LAND PATTERN
Units
Dimension Limits
MILLIMETERS
MIN
NOM
1.27 BSC
2.35
MAX
Contact Pitch
E
C
X
Y
Contact Pad Spacing
Contact Pad Width (X6)
Contact Pad Length (X6)
Spacing Between Pads (X4)
Spacing Between Pads (X3)
0.75
1.25
G1
G2
0.52
1.10
Notes:
1. Dimensioning and tolerancing per ASME Y14.5M
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
2. For best soldering results, thermal vias, if used, should be filled or tented to avoid solder loss during
reflow process
Microchip Technology Drawing C04-3068A
2018 Microchip Technology Inc.
DS20005972A-page 17
MX55/57
6-Lead Low 7 mm x 5 mm LGA Package Outline and Recommended Land Pattern
6-Lead Low Profile Land Grid Array [APA] - 7x5 mm Body (LLGA)
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
D
A
B
E
N
(DATUM A)
(DATUM B)
NOTE 1
2X
0.10 C
2X
1
2
TOP VIEW
0.10 C
A1
C
A2
A
SEATING
PLANE
SIDE VIEW
0.07 C
1
2
E1
L
N
L1
6X b
0.10
0.05
C A B
C
e
BOTTOM VIEW
Microchip Technology Drawing C04-1071A Sheet 1 of 2
DS20005972A-page 18
2018 Microchip Technology Inc.
MX55/57
ꢀꢁ/HDGꢂ/RZꢂ3URILOHꢂ/DQGꢂ*ULGꢂ$UUD\ꢂ>$3$@ꢂꢁꢂꢃ[ꢄꢂPPꢂ%RG\ꢂꢅ//*$ꢆ
1RWHꢇ )RUꢀWKHꢀPRVWꢀFXUUHQWꢀSDFNDJHꢀGUDZLQJVꢈꢀSOHDVHꢀVHHꢀWKHꢀ0LFURFKLSꢀ3DFNDJLQJꢀ6SHFLILFDWLRQꢀORFDWHGꢀDW
KWWSꢇꢋꢋZZZꢉPLFURFKLSꢉFRPꢋSDFNDJLQJ
8QLWV
'LPHQVLRQꢀ/LPLWV
0,//,0(7(56
120
0,1
0$;
1XPEHUꢀRIꢀ7HUPLQDOV
3LWFK
1
ꢍ
H
ꢆꢉꢊꢂꢀ%6&
ꢄꢉꢌꢌ
ꢁꢉꢆꢌ
2YHUDOOꢀ+HLJKW
6XEVWUDWHꢀ7KLFNQHVV
0ROGꢀ&DSꢀ7KLFNQHVV
2YHUDOOꢀ/HQJWK
3LWFK
2YHUDOOꢀ:LGWK
7HUPLQDOꢀ:LGWK
7HUPLQDOꢀ/HQJWK
3XOOEDFN
$
$ꢄ
$ꢆ
'
(ꢄ
(
E
/
/ꢄ
ꢄꢉꢆꢍ
ꢁꢉꢄꢎ
ꢄꢉꢁꢅ
ꢄꢉꢂꢁ
ꢁꢉꢆꢅ
ꢄꢉꢄꢌ
ꢄꢉꢄꢁ
ꢅꢉꢁꢁꢀ%6&
ꢌꢉꢅꢁꢀ%6&
ꢊꢉꢁꢁꢀ%6&
ꢄꢉꢂꢁ
ꢄꢉꢄꢁ
ꢁꢉꢄꢁ
ꢄꢉꢌꢊ
ꢄꢉꢁꢊ
ꢁꢉꢁꢊ
ꢄꢉꢂꢊ
ꢄꢉꢄꢊ
ꢁꢉꢄꢊ
Notes:
ꢄꢉ 3LQꢀꢄꢀYLVXDOꢀLQGH[ꢀIHDWXUHꢀPD\ꢀYDU\ꢈꢀEXWꢀPXVWꢀEHꢀORFDWHGꢀZLWKLQꢀWKHꢀKDWFKHGꢀDUHDꢉ
ꢆꢉ 'LPHQVLRQLQJꢀDQGꢀWROHUDQFLQJꢀSHUꢀ$60(ꢀ<ꢄꢂꢉꢊ0
%6&ꢇꢀ%DVLFꢀ'LPHQVLRQꢉꢀ7KHRUHWLFDOO\ꢀH[DFWꢀYDOXHꢀVKRZQꢀZLWKRXWꢀWROHUDQFHVꢉ
5()ꢇꢀ5HIHUHQFHꢀ'LPHQVLRQꢈꢀXVXDOO\ꢀZLWKRXWꢀWROHUDQFHꢈꢀIRUꢀLQIRUPDWLRQꢀSXUSRVHVꢀRQO\ꢉ
0LFURFKLSꢀ7HFKQRORJ\ꢀ'UDZLQJꢀꢀ&ꢁꢂꢃꢄꢁꢅꢄ$ꢀ6KHHWꢀꢆꢀRIꢀꢆ
2018 Microchip Technology Inc.
DS20005972A-page 19
MX55/57
6-Lead Low Profile Land Grid Array [APA] - 7x5 mm Body (LLGA)
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
X
6
G1
Y
C
G2
1
2
E
SILK SCREEN
RECOMMENDED LAND PATTERN
Units
Dimension Limits
MILLIMETERS
MIN
NOM
2.54 BSC
3.93
MAX
Contact Pitch
E
C
Contact Pad Spacing
Contact Pad Width (X6)
Contact Pad Length (X6)
Contact to Contact (X4)
Contact to Contact (X3)
X
Y
G1
G2
1.60
1.53
0.94
2.40
Notes:
1. Dimensioning and tolerancing per ASME Y14.5M
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
Microchip Technology Drawing C04-3071A
DS20005972A-page 20
2018 Microchip Technology Inc.
MX55/57
NOTES:
2018 Microchip Technology Inc.
DS20005972A-page 21
MX55/57
DS20005972A-page 22
2018 Microchip Technology Inc.
MX55/57
APPENDIX A: REVISION HISTORY
Revision A (March 2018)
• Initial creation of MX55/57 Microchip data sheet
DS20005972A.
2018 Microchip Technology Inc.
DS20005972A-page 23
MX55/57
NOTES:
DS20005972A-page 24
2018 Microchip Technology Inc.
MX55/57
PRODUCT IDENTIFICATION SYSTEM
To order or obtain information, e.g., on pricing or delivery, contact your local Microchip representative or sales office.
Examples:
X
XX
X
PART NO.
Device
XXXMXXX
XX
a) MX555ABF
100M000TA
Low Jitter Crystal Oscillator in 6-Pin
5 mm × 3.2 mm, Pin 1 PECL Active
Low, 100 MHz, Tube
Crystal
Frequency
Enable Pin
Option
Output Logic
Type
Output
Frequency
Shipping
b) MX575ABF
100M000RA
Low Jitter Crystal Oscillator in 6-Pin
5 mm × 7 mm, Pin 1 PECL Active
Low, 100 MHz, Reel
Device:
MX55:
MX57:
Low Jitter Crystal Oscillator in
6-Pin 5 mm × 3.2 mm
Low Jitter Crystal Oscillator in
6-Pin 7 mm × 5 mm
c) MX555ANU
100M000TA
Low Jitter Crystal Oscillator in 6-Pin
5 mm × 3.2 mm, Pin 2 PECL Active
Low, 250 MHz, Tube
d) MX575ANN
100M000RA
Low Jitter Crystal Oscillator in 6-Pin
5 mm × 7 mm, Pin 2 CMOS Active
Low, 150 MHz, Reel
Crystal Frequency:
Enable Pin Option:
5A (Example Only) = Option selected by ClockWorks
Configurator for Manufacturing
B
N
=
=
Pin 1
Pin 2
Output Logic Type:
(For Enable Pin 1)
A
B
C
D
F
G
H
J
=
=
=
=
=
=
=
=
PECL (Active High)
LVDS (Active High)
CMOS (Active High)
HCSL (Active High)
PECL (Active Low)
LVDS (Active Low)
CMOS (Active Low)
HCSL (Active Low)
Note 1:
Tape and Reel identifier only appears in the
catalog part number description. This
identifier is used for ordering purposes and
is not printed on the device package. Check
with your Microchip Sales Office for package
availability with the Tape and Reel option.
Output Logic Type:
(For Enable Pin 2)
R
S
T
U
L
M
N
P
=
=
=
=
=
=
=
=
PECL (Active High)
LVDS (Active High)
CMOS (Active High)
HCSL (Active High)
PECL (Active Low)
LVDS (Active Low)
CMOS (Active Low)
HCSL (Active Low)
Output Frequency:
Shipping
xxxMxxx
=
2.5 MHz to 850 MHz
TA =
Tube
RA = Tape & Reel
Please visit http://clockworks.microchip.com/timing to select a combination of
options to customize your product, print a specific data sheet and order samples.
2018 Microchip Technology Inc.
DS20005972A-page 25
MX55/57
NOTES:
DS20005972A-page 26
2018 Microchip Technology Inc.
Note the following details of the code protection feature on Microchip devices:
•
Microchip products meet the specification contained in their particular Microchip Data Sheet.
•
Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the
intended manner and under normal conditions.
•
There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our
knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data
Sheets. Most likely, the person doing so is engaged in theft of intellectual property.
•
•
Microchip is willing to work with the customer who is concerned about the integrity of their code.
Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not
mean that we are guaranteeing the product as “unbreakable.”
Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our
products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts
allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act.
Information contained in this publication regarding device
applications and the like is provided only for your convenience
and may be superseded by updates. It is your responsibility to
ensure that your application meets with your specifications.
MICROCHIP MAKES NO REPRESENTATIONS OR
WARRANTIES OF ANY KIND WHETHER EXPRESS OR
IMPLIED, WRITTEN OR ORAL, STATUTORY OR
OTHERWISE, RELATED TO THE INFORMATION,
INCLUDING BUT NOT LIMITED TO ITS CONDITION,
QUALITY, PERFORMANCE, MERCHANTABILITY OR
FITNESS FOR PURPOSE. Microchip disclaims all liability
arising from this information and its use. Use of Microchip
devices in life support and/or safety applications is entirely at
the buyer’s risk, and the buyer agrees to defend, indemnify and
hold harmless Microchip from any and all damages, claims,
suits, or expenses resulting from such use. No licenses are
conveyed, implicitly or otherwise, under any Microchip
intellectual property rights unless otherwise stated.
Trademarks
The Microchip name and logo, the Microchip logo, AnyRate, AVR,
AVR logo, AVR Freaks, BeaconThings, BitCloud, CryptoMemory,
CryptoRF, dsPIC, FlashFlex, flexPWR, Heldo, JukeBlox, KEELOQ,
KEELOQ logo, Kleer, LANCheck, LINK MD, maXStylus,
maXTouch, MediaLB, megaAVR, MOST, MOST logo, MPLAB,
OptoLyzer, PIC, picoPower, PICSTART, PIC32 logo, Prochip
Designer, QTouch, RightTouch, SAM-BA, SpyNIC, SST, SST
Logo, SuperFlash, tinyAVR, UNI/O, and XMEGA are registered
trademarks of Microchip Technology Incorporated in the U.S.A.
and other countries.
ClockWorks, The Embedded Control Solutions Company,
EtherSynch, Hyper Speed Control, HyperLight Load, IntelliMOS,
mTouch, Precision Edge, and Quiet-Wire are registered
trademarks of Microchip Technology Incorporated in the U.S.A.
Adjacent Key Suppression, AKS, Analog-for-the-Digital Age, Any
Capacitor, AnyIn, AnyOut, BodyCom, chipKIT, chipKIT logo,
CodeGuard, CryptoAuthentication, CryptoCompanion,
CryptoController, dsPICDEM, dsPICDEM.net, Dynamic Average
Matching, DAM, ECAN, EtherGREEN, In-Circuit Serial
Programming, ICSP, Inter-Chip Connectivity, JitterBlocker,
KleerNet, KleerNet logo, Mindi, MiWi, motorBench, MPASM, MPF,
MPLAB Certified logo, MPLIB, MPLINK, MultiTRAK, NetDetach,
Omniscient Code Generation, PICDEM, PICDEM.net, PICkit,
PICtail, PureSilicon, QMatrix, RightTouch logo, REAL ICE, Ripple
Blocker, SAM-ICE, Serial Quad I/O, SMART-I.S., SQI,
SuperSwitcher, SuperSwitcher II, Total Endurance, TSHARC,
USBCheck, VariSense, ViewSpan, WiperLock, Wireless DNA, and
ZENAare trademarks of Microchip Technology Incorporated in the
U.S.A. and other countries.
SQTP is a service mark of Microchip Technology Incorporated in
the U.S.A.
Microchip received ISO/TS-16949:2009 certification for its worldwide
headquarters, design and wafer fabrication facilities in Chandler and
Tempe, Arizona; Gresham, Oregon and design centers in California
and India. The Company’s quality system processes and procedures
are for its PIC® MCUs and dsPIC® DSCs, KEELOQ® code hopping
devices, Serial EEPROMs, microperipherals, nonvolatile memory and
analog products. In addition, Microchip’s quality system for the design
and manufacture of development systems is ISO 9001:2000 certified.
Silicon Storage Technology is a registered trademark of Microchip
Technology Inc. in other countries.
GestIC is a registered trademark of Microchip Technology
Germany II GmbH & Co. KG, a subsidiary of Microchip Technology
Inc., in other countries.
All other trademarks mentioned herein are property of their
respective companies.
QUALITYꢀMANAGEMENTꢀꢀSYSTEMꢀ
CERTIFIEDꢀBYꢀDNVꢀ
© 2018, Microchip Technology Incorporated, All Rights Reserved.
ISBN: 978-1-5224-2830-5
== ISO/TSꢀ16949ꢀ==ꢀ
2018 Microchip Technology Inc.
DS20005893A-page 27
Worldwide Sales and Service
AMERICAS
ASIA/PACIFIC
ASIA/PACIFIC
EUROPE
Corporate Office
2355 West Chandler Blvd.
Chandler, AZ 85224-6199
Tel: 480-792-7200
Fax: 480-792-7277
Technical Support:
http://www.microchip.com/
support
Australia - Sydney
Tel: 61-2-9868-6733
India - Bangalore
Tel: 91-80-3090-4444
Austria - Wels
Tel: 43-7242-2244-39
Fax: 43-7242-2244-393
China - Beijing
Tel: 86-10-8569-7000
India - New Delhi
Tel: 91-11-4160-8631
Denmark - Copenhagen
Tel: 45-4450-2828
Fax: 45-4485-2829
China - Chengdu
Tel: 86-28-8665-5511
India - Pune
Tel: 91-20-4121-0141
Finland - Espoo
Tel: 358-9-4520-820
China - Chongqing
Tel: 86-23-8980-9588
Japan - Osaka
Tel: 81-6-6152-7160
Web Address:
www.microchip.com
France - Paris
Tel: 33-1-69-53-63-20
Fax: 33-1-69-30-90-79
China - Dongguan
Tel: 86-769-8702-9880
Japan - Tokyo
Tel: 81-3-6880- 3770
Atlanta
Duluth, GA
Tel: 678-957-9614
Fax: 678-957-1455
China - Guangzhou
Tel: 86-20-8755-8029
Korea - Daegu
Tel: 82-53-744-4301
Germany - Garching
Tel: 49-8931-9700
China - Hangzhou
Tel: 86-571-8792-8115
Korea - Seoul
Tel: 82-2-554-7200
Germany - Haan
Tel: 49-2129-3766400
Austin, TX
Tel: 512-257-3370
China - Hong Kong SAR
Tel: 852-2943-5100
Malaysia - Kuala Lumpur
Tel: 60-3-7651-7906
Germany - Heilbronn
Tel: 49-7131-67-3636
Boston
Westborough, MA
Tel: 774-760-0087
Fax: 774-760-0088
China - Nanjing
Tel: 86-25-8473-2460
Malaysia - Penang
Tel: 60-4-227-8870
Germany - Karlsruhe
Tel: 49-721-625370
China - Qingdao
Philippines - Manila
Germany - Munich
Tel: 49-89-627-144-0
Fax: 49-89-627-144-44
Tel: 86-532-8502-7355
Tel: 63-2-634-9065
Chicago
Itasca, IL
Tel: 630-285-0071
Fax: 630-285-0075
China - Shanghai
Tel: 86-21-3326-8000
Singapore
Tel: 65-6334-8870
Germany - Rosenheim
Tel: 49-8031-354-560
China - Shenyang
Tel: 86-24-2334-2829
Taiwan - Hsin Chu
Tel: 886-3-577-8366
Dallas
Addison, TX
Tel: 972-818-7423
Fax: 972-818-2924
Israel - Ra’anana
Tel: 972-9-744-7705
China - Shenzhen
Tel: 86-755-8864-2200
Taiwan - Kaohsiung
Tel: 886-7-213-7830
Italy - Milan
Tel: 39-0331-742611
Fax: 39-0331-466781
China - Suzhou
Tel: 86-186-6233-1526
Taiwan - Taipei
Tel: 886-2-2508-8600
Detroit
Novi, MI
Tel: 248-848-4000
China - Wuhan
Tel: 86-27-5980-5300
Thailand - Bangkok
Tel: 66-2-694-1351
Italy - Padova
Tel: 39-049-7625286
Houston, TX
Tel: 281-894-5983
China - Xian
Tel: 86-29-8833-7252
Vietnam - Ho Chi Minh
Tel: 84-28-5448-2100
Netherlands - Drunen
Tel: 31-416-690399
Fax: 31-416-690340
Indianapolis
Noblesville, IN
Tel: 317-773-8323
Fax: 317-773-5453
Tel: 317-536-2380
China - Xiamen
Tel: 86-592-2388138
Norway - Trondheim
Tel: 47-7289-7561
China - Zhuhai
Tel: 86-756-3210040
Poland - Warsaw
Tel: 48-22-3325737
Los Angeles
Mission Viejo, CA
Tel: 949-462-9523
Fax: 949-462-9608
Tel: 951-273-7800
Romania - Bucharest
Tel: 40-21-407-87-50
Spain - Madrid
Tel: 34-91-708-08-90
Fax: 34-91-708-08-91
Raleigh, NC
Tel: 919-844-7510
Sweden - Gothenberg
Tel: 46-31-704-60-40
New York, NY
Tel: 631-435-6000
Sweden - Stockholm
Tel: 46-8-5090-4654
San Jose, CA
Tel: 408-735-9110
Tel: 408-436-4270
UK - Wokingham
Tel: 44-118-921-5800
Fax: 44-118-921-5820
Canada - Toronto
Tel: 905-695-1980
Fax: 905-695-2078
DS20005972A-page 28
2018 Microchip Technology Inc.
10/25/17
相关型号：
MX574AJCWI
ADC, Successive Approximation, 12-Bit, 1 Func, 1 Channel, Parallel, Word Access, BICMOS, PDSO28, SO-28
ROCHESTER
MX574AJCWI+T
ADC, Successive Approximation, 12-Bit, 1 Func, 1 Channel, Parallel, Word Access, BICMOS, PDSO28, ROHS COMPLIANT, SOIC-28
MAXIM
MX574AJCWI-T
ADC, Successive Approximation, 12-Bit, 1 Func, 1 Channel, Parallel, Word Access, BICMOS, PDSO28, SO-28
MAXIM
MX574AJEPI
ADC, Successive Approximation, 12-Bit, 1 Func, 1 Channel, Parallel, Word Access, BICMOS, PDIP28, PLASTIC, DIP-28
ROCHESTER
MX574AJEPI+
ADC, Successive Approximation, 12-Bit, 1 Func, 1 Channel, Parallel, Word Access, BICMOS, PDIP28, ROHS COMPLIANT, PLASTIC, DIP-28
MAXIM
©2020 ICPDF网 联系我们和版权申明