PIC18LF26J50T-I/SS [MICROCHIP]

8-BIT, FLASH, 48 MHz, MICROCONTROLLER, PDSO28, 5.30 MM, LEAD FREE, PLASTIC, SSOP-28;
PIC18LF26J50T-I/SS
型号: PIC18LF26J50T-I/SS
厂家: MICROCHIP    MICROCHIP
描述:

8-BIT, FLASH, 48 MHz, MICROCONTROLLER, PDSO28, 5.30 MM, LEAD FREE, PLASTIC, SSOP-28

文件: 总12页 (文件大小:211K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
PIC18F46J50 FAMILY  
PIC18F46J50 Family  
Silicon Errata and Data Sheet Clarification  
The PIC18F46J50 family devices that you have received  
For example, to identify the silicon revision level using  
MPLAB IDE in conjunction with MPLAB ICD 2 or  
PICkit™ 3:  
conform functionally to the current Device Data Sheet  
(DS39931C), except for the anomalies described in this  
document.  
1. Using the appropriate interface, connect the  
device to the MPLAB ICD 2 programmer/  
debugger or PICkit™ 3.  
The silicon issues discussed in the following pages are  
for silicon revisions with the Device and Revision IDs  
listed in Table 1. The silicon issues are summarized in  
Table 2.  
2. From the main menu in MPLAB IDE, select  
Configure>Select Device, and then select the  
target part number in the dialog box.  
The errata described in this document will be addressed  
in future revisions of the PIC18F46J50 family silicon.  
3. Select  
the  
MPLAB  
hardware  
tool  
(Debugger>Select Tool).  
Note:  
This document summarizes all silicon  
errata issues from all revisions of silicon,  
previous as well as current. Only the  
issues indicated in the last column of  
Table 2 apply to the current silicon revision  
(Rev. A4).  
4. Perform a “Connect” operation to the device  
(Debugger>Connect). Depending on the devel-  
opment tool used, the part number and Device  
Revision ID value appear in the Output window.  
Note:  
If you are unable to extract the silicon  
revision level, please contact your local  
Microchip sales office for assistance.  
Data Sheet clarifications and corrections start on page 8,  
following the discussion of silicon issues.  
The silicon revision level can be identified using the  
current version of MPLAB® IDE and Microchip’s  
programmers, debuggers, and emulation tools, which  
are available at the Microchip corporate web site  
(www.microchip.com).  
The DEVREV values for the various PIC18F46J50 family  
silicon revisions are shown in Table 1.  
TABLE 1:  
SILICON DEVREV VALUES  
Revision ID for Silicon Revision(2)  
Part Number  
Device ID(1)  
A2  
A4  
PIC18F24J50  
PIC18F25J50  
PIC18F26J50  
PIC18F44J50  
PIC18F45J50  
PIC18F46J50  
PIC18LF24J50  
PIC18LF25J50  
PIC18LF26J50  
PIC18LF44J50  
PIC18LF45J50  
PIC18LF46J50  
4C0Xh  
4C2Xh  
4C4Xh  
4C6Xh  
4C8Xh  
4CAXh  
4CCXh  
4CEXh  
4D0Xh  
4D2Xh  
4D4Xh  
4D6Xh  
2h  
4h  
Note 1: The Device IDs (DEVID and DEVREV) are located at the last two implemented addresses of configuration  
memory space. They are shown in hexadecimal in the format “DEVID DEVREV”.  
2: Refer to the “PIC18F2XJXX/4XJXX Family Flash Microcontroller Programming Specification” (DS39687)  
for detailed information on Device and Revision IDs for your specific device.  
2010 Microchip Technology Inc.  
DS80436C-page 1  
PIC18F46J50 FAMILY  
TABLE 2:  
SILICON ISSUE SUMMARY  
Affected  
Revisions(1)  
Item  
Feature  
Module  
Issue Summary  
Number  
A2  
A4  
MSSP  
MSSP  
I2C™  
Modes  
I2C Slave  
1.  
2.  
Must keep LATB<5:4> bits clear.  
X
Module may not receive the correct data if there  
is a delay in reading SSPxBUF after SSPxIF  
interrupt.  
X
X
X
EUSART  
A/D  
Enable/Dis-  
able  
3.  
4.  
If interrupts are enabled, a 2 TCY delay needed  
after re-enabling the module.  
X
X
FOSC/2  
Clock  
FOSC/2 A/D Conversion mode may not meet  
linearity error limits.  
X
X
X
PMP  
PSP  
5.  
6.  
Incorrect data capture in Slave modes.  
Low-Power  
modes  
Deep Sleep  
Wake-up events that occur during Deep Sleep  
entry may not generate an event.  
X
X
DC  
Supply Volt-  
age  
7.  
8.  
9.  
Minimum operating voltage (VDD) parameter for  
“F” devices is 2.25V.  
X
X
X
Characteristics  
A/D  
Band Gap  
Reference  
At high VDD voltages, performing an A/D  
conversion on Channel 15 could have issues.  
CTMU  
Constant  
Current  
Low voltages turn off constant current source.  
Note 1: Only those issues indicated in the last column apply to the current silicon revision.  
DS80436C-page 2  
2010 Microchip Technology Inc.  
PIC18F46J50 FAMILY  
2. Module: Master Synchronous Serial Port  
(MSSP)  
Silicon Errata Issues  
Note:  
This document summarizes all silicon  
In extremely rare cases, when configured for I2C™  
slave reception, the MSSP module may not receive  
the correct data. This occurs only if the Serial  
Receive/Transmit Buffer Register (SSPxBUF) is not  
read within a window after the SSPxIF interrupt  
has occurred.  
errata issues from all revisions of silicon,  
previous as well as current. Only the  
issues indicated by the shaded column in  
the following tables apply to the current  
silicon revision (Rev. A4).  
1. Module: Master Synchronous Serial Port  
(MSSP1)  
Work around  
The issue can be resolved in either of these ways:  
• Prior to the I2C slave reception, enable the  
clock stretching feature.  
If the LATB<5> or LATB<4> bit is set, the  
MSSP1 module will not work correctly in the  
I2C™ modes. If both LATB<5> and LATB<4>  
are clear, the module will work normally.  
This is done by setting the SEN bit  
(SSPxCON2<0>).  
Work around  
• Each time the SSPxIF is set, read the  
SSPxBUF before the first rising clock edge of  
the next byte being received.  
Clear the bits, LATB<5:4>, prior to enabling the  
MSSP1 module in an I2C mode. Keep these bits  
clear while using the module.  
For operation in I2C modes, the TRISB<5:4>  
bits should be set.  
Affected Silicon Revisions  
A2 A4  
X
X
Affected Silicon Revisions  
A2 A4  
X
2010 Microchip Technology Inc.  
DS80436C-page 3  
PIC18F46J50 FAMILY  
Work around  
3. Module: Enhanced Universal  
Synchronous Asynchronous  
Receiver Transmitter (EUSART)  
Add a 2 TCY delay after any instruction that re-  
enables the EUSART module (sets SPEN = 1).  
Refer to Example 1.  
In rare situations, when interrupts are enabled,  
unexpected results may occur if:  
• The EUSART is disabled (the SPEN bit,  
RCSTAx<7> = 0)  
• The EUSART is re-enabled (RCSTAx<7> = 1)  
• A two-cycle instruction is executed immediately  
after setting SPEN = 1  
EXAMPLE 1:  
RE-ENABLING A EUSART MODULE  
;Initial conditions: SPEN = 0 (module disabled)  
;To re-enable the module:  
;Re-Initialize TXSTAx, BAUDCONx, SPBRGx, SPBRGHx registers (if needed)  
;Re-Initialize RCSTAx register (if needed), but do not set SPEN = 1 yet  
;Now enable the module, but add a 2-Tcy delay before executing any two-cycle  
;instructions  
bsf  
nop  
nop  
RCSTA1, SPEN ;or RCSTA2 if EUSART2  
;1 Tcy delay  
;1 Tcy delay (two total)  
;CPU may now execute 2 cycle instructions  
Affected Silicon Revisions  
A2 A4  
X
X
DS80436C-page 4  
2010 Microchip Technology Inc.  
PIC18F46J50 FAMILY  
4. Module: 10-Bit Analog-to-Digital  
Converter (ADC)  
5. Module: Parallel Master Port (PMP)  
When configured for Parallel Slave Port  
(PMMODEH<1:0> = 0xand PMPEN = 1), the data  
bus (PMD<7:0>) may not work correctly and  
incorrect data could be captured into the PMDIN1L  
register.  
When the A/D conversion clock select bits are set  
for FOSC/2 (ADCON1<2:0> = 000), the Integral  
Linearity Error (EIL) parameter (A03) and Differen-  
tial Linearity Error (EDL) parameter (A04) may  
exceed data sheet specifications.  
Work around  
Work around  
None.  
Select one of the alternate AD clock sources  
shown in Table 3. The EIL and EDL parameters  
are met for the other clocking options.  
Affected Silicon Revisions  
A2 A4  
X
TABLE 3:  
ADCON1<2:0>  
ADCS<2:0>  
ALTERNATE ADC SETTINGS  
Clock Setting  
110  
101  
100  
011  
010  
001  
FOSC/64  
FOSC/16  
FOSC/4  
FRC  
FOSC/32  
FOSC/8  
Affected Silicon Revisions  
A2 A4  
X
X
2010 Microchip Technology Inc.  
DS80436C-page 5  
PIC18F46J50 FAMILY  
instruction before the SLEEPinstruction eliminates  
the 2 TCY window where wake-up events could be  
missed.  
6. Module: Low-Power Modes (Deep Sleep)  
Entering Deep Sleep mode takes approximately  
2 TCY, following the SLEEP instruction. Wake-up  
events that occur during this Deep Sleep entry  
period may not generate a wake-up event.  
Before using this work around, users should check  
their device’s revision ID bits to verify that they  
have the A4 silicon. This can be done at run time  
by a table read from address, 3FFFFEh.  
Work around  
If using the RTCC alarm for Deep Sleep wake-up,  
code should only enter Deep Sleep mode when  
the RTCC Value registers read synchronization bit  
(RTCCFG<4>) is clear.  
On revision A2 silicon devices, the instruction can-  
not be inserted between setting the DSEN bit and  
executing the SLEEPinstruction or the device will  
enter conventional Sleep mode, not Deep Sleep.  
This will prevent missing an RTCC alarm that  
could occur during the period after the SLEEP  
instruction, but before the Deep Sleep mode has  
not been fully entered.  
Even on A4 silicon devices, if the firmware imme-  
diately executes SLEEP after setting DSEN, the  
device will enter Deep Sleep mode without  
benefitting from this work around.  
The revision A4 silicon allows insertion of a single  
instruction between setting the Deep Sleep Enable  
bit (DSEN, DSCONH<7>) and issuing the SLEEP  
instruction (see Example 2). The insertion of a NOP  
EXAMPLE 2:  
DEEP-SLEEP WAKE-UP WORK AROUND  
EnterDeepSleep:  
bsf  
DSCONH, DSEN  
; Enter Deep Sleep mode on SLEEP instruction  
nop  
; Not compatible with A2 silicon  
sleep  
(…)  
; Enter Deep Sleep mode  
; Add code here to handle wake up events that may  
; have been asserted prior to Deep Sleep entry  
; re-attempt Deep Sleep entry if desired  
goto  
EnterDeepSleep  
Affected Silicon Revisions  
A2 A4  
X
DS80436C-page 6  
2010 Microchip Technology Inc.  
PIC18F46J50 FAMILY  
7. Module: DC Characteristics (Supply  
Voltage)  
9. Module: Charge Time Measurement Unit  
(CTMU)  
The minimum operating voltage (VDD) parameter  
(D001) for “F” devices is 2.25V. For “LF” devices  
(such as the PIC18LF46J50), the minimum rated  
VDD operating voltage is 2.0V.  
On an “F” device, the CTMU current source will stop  
sourcing current if the applied VDD voltage falls  
below the LVDSTAT (WDTCON<6>) threshold  
(2.45V nominal). When VDD is above the LVDSTAT  
threshold, the CTMU will function normally. This  
issue does not apply to “LF” devices. The current  
source will continue to function normally at all rated  
voltages for these devices.  
Work around  
None.  
Affected Silicon Revisions  
Work around  
A2 A4  
None  
X
Affected Silicon Revisions  
8. Module: Analog-to-Digital Converter  
(Band Gap Reference)  
A2 A4  
X
At high VDD voltages (ex: >2.5V), performing an  
ADC conversion on Channel 15 (the VBG absolute  
reference) can temporarily disturb the reference  
voltage supplied to the HLVD module and compar-  
ator module (only when configured to use the  
VIRV). At lower VDD voltages, the disturbance will  
be less or non-existent.  
Work around  
If precise HLVD or comparator VIRV thresholds are  
required at high VDD voltages, avoid performing  
ADC conversions on Channel 15 while simultane-  
ously using the HLVD or comparator VIRV. If an  
ADC conversion is performed on Channel 15, a  
settling time of approximately 100 s is needed  
before the reference voltage fully returns to the  
original value.  
Affected Silicon Revisions  
A2 A4  
X
X
2010 Microchip Technology Inc.  
DS80436C-page 7  
PIC18F46J50 FAMILY  
3. Module: DC Characteristics (Input  
Leakage)  
Data Sheet Clarifications  
The following typographic corrections and clarifications  
are to be noted for the latest version of the Device Data  
Sheet (DS39931C):  
In Table 29-7 USB Module Specifications,  
electrical parameter D314 indicates the D+ and  
D- pin leakage is +/-0.2 A maximum. The  
updated specification is +/-0.5 A maximum,  
over the -40°C to +85°C temperature range.  
Note:  
Corrections are shown in bold. Where  
possible, the original bold text formatting  
has been removed for clarity.  
The input leakage specification for all other I/O  
pins remains unchanged at the +/-0.2 A maxi-  
mum level, as indicated by electrical parameters  
D060, D061 and D063 (IIL), in Section 29.3 “DC  
Characteristics”.  
1. Module: Special Features (CONFIG2L)  
The “T1DIG” feature mentioned in the Device  
Data Sheet (DS39931C) is not implemented in  
this device family. The feature, associated with  
bit 3 of the CONFIG2L Configuration register, is  
discussed in Section 26.1 “Configuration  
Bits” and Section 2.5.1 “Oscillator Control  
Register”.  
For application firmware to switch to the Timer1  
clock source, it must first enable the crystal  
driver by setting the T1OSCEN bit (T1CON<3>).  
The microcontroller will ignore attempts to clock  
switch to the Timer1 clock source when the  
crystal driver is disabled.  
2. Module: DC Characteristics  
(Power-Down Current)  
Section 29.2 “DC Characteristics: Power-  
Down and Supply Current” lists the maximum  
Power-Down (IPD) Sleep mode current for  
PIC18FXXJ50 devices, operating at VDD = 2.15V  
and -40°C, and 25°C at 5 A.  
The correct maximum is 6 A.  
DS80436C-page 8  
2010 Microchip Technology Inc.  
PIC18F46J50 FAMILY  
APPENDIX A: DOCUMENT  
REVISION HISTORY  
Rev A Document (2/2009)  
First release of this document. Silicon issues  
1 (T1DIG), 2-3 (MSSP), 4 (EUSART), 5 (ADC),  
6 (PMP), 7 (Deep Sleep), 8 (Supply Voltage).  
Rev B Document (5/2009)  
Added silicon issues 9 (Band Gap Reference) and  
10 (Charge Time Measurement Unit – CTMU).  
Rev C Document (1/2010)  
Converted existing document for the A2 silicon revision  
to the new, combined format. (There were no other  
silicon errata or data sheet clarification documents for  
the device family.)  
Removed silicon issue 1 (Special Features, T1DIG)  
and modified decremented issue 1, formerly  
2 (MSSP1) and 6 (Low-Power Modes – Deep Sleep).  
Added data sheet clarifications 1 (Special Features –  
CONFIG2L), 2 (DC Characteristics – Power-Down  
Current) and 3 (DC Characteristics – Input Leakage).  
2010 Microchip Technology Inc.  
DS80436C-page 9  
PIC18F46J50 FAMILY  
NOTES:  
DS80436C-page 10  
2010 Microchip Technology Inc.  
Note the following details of the code protection feature on Microchip devices:  
Microchip products meet the specification contained in their particular Microchip Data Sheet.  
Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the  
intended manner and under normal conditions.  
There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our  
knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data  
Sheets. Most likely, the person doing so is engaged in theft of intellectual property.  
Microchip is willing to work with the customer who is concerned about the integrity of their code.  
Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not  
mean that we are guaranteeing the product as “unbreakable.”  
Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our  
products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts  
allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act.  
Information contained in this publication regarding device  
applications and the like is provided only for your convenience  
and may be superseded by updates. It is your responsibility to  
ensure that your application meets with your specifications.  
MICROCHIP MAKES NO REPRESENTATIONS OR  
WARRANTIES OF ANY KIND WHETHER EXPRESS OR  
IMPLIED, WRITTEN OR ORAL, STATUTORY OR  
OTHERWISE, RELATED TO THE INFORMATION,  
INCLUDING BUT NOT LIMITED TO ITS CONDITION,  
QUALITY, PERFORMANCE, MERCHANTABILITY OR  
FITNESS FOR PURPOSE. Microchip disclaims all liability  
arising from this information and its use. Use of Microchip  
devices in life support and/or safety applications is entirely at  
the buyer’s risk, and the buyer agrees to defend, indemnify and  
hold harmless Microchip from any and all damages, claims,  
suits, or expenses resulting from such use. No licenses are  
conveyed, implicitly or otherwise, under any Microchip  
intellectual property rights.  
Trademarks  
The Microchip name and logo, the Microchip logo, dsPIC,  
KEELOQ, KEELOQ logo, MPLAB, PIC, PICmicro, PICSTART,  
rfPIC and UNI/O are registered trademarks of Microchip  
Technology Incorporated in the U.S.A. and other countries.  
FilterLab, Hampshire, HI-TECH C, Linear Active Thermistor,  
MXDEV, MXLAB, SEEVAL and The Embedded Control  
Solutions Company are registered trademarks of Microchip  
Technology Incorporated in the U.S.A.  
Analog-for-the-Digital Age, Application Maestro, CodeGuard,  
dsPICDEM, dsPICDEM.net, dsPICworks, dsSPEAK, ECAN,  
ECONOMONITOR, FanSense, HI-TIDE, In-Circuit Serial  
Programming, ICSP, Mindi, MiWi, MPASM, MPLAB Certified  
logo, MPLIB, MPLINK, mTouch, Octopus, Omniscient Code  
Generation, PICC, PICC-18, PICDEM, PICDEM.net, PICkit,  
32  
PICtail, PIC logo, REAL ICE, rfLAB, Select Mode, Total  
Endurance, TSHARC, UniWinDriver, WiperLock and ZENA  
are trademarks of Microchip Technology Incorporated in the  
U.S.A. and other countries.  
SQTP is a service mark of Microchip Technology Incorporated  
in the U.S.A.  
All other trademarks mentioned herein are property of their  
respective companies.  
© 2010, Microchip Technology Incorporated, Printed in the  
U.S.A., All Rights Reserved.  
Printed on recycled paper.  
Microchip received ISO/TS-16949:2002 certification for its worldwide  
headquarters, design and wafer fabrication facilities in Chandler and  
Tempe, Arizona; Gresham, Oregon and design centers in California  
and India. The Company’s quality system processes and procedures  
are for its PIC® MCUs and dsPIC® DSCs, KEELOQ® code hopping  
devices, Serial EEPROMs, microperipherals, nonvolatile memory and  
analog products. In addition, Microchip’s quality system for the design  
and manufacture of development systems is ISO 9001:2000 certified.  
2010 Microchip Technology Inc.  
DS80436C-page 11  
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01/05/10  
DS80436C-page 12  
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