PIC24FJ128GA008-I/PT [MICROCHIP]
16-BIT, FLASH, 32 MHz, MICROCONTROLLER, PQFP80, 12 X 12 MM, 1 MM HEIGHT, PLASTIC, TQFP-80;型号: | PIC24FJ128GA008-I/PT |
厂家: | MICROCHIP |
描述: | 16-BIT, FLASH, 32 MHz, MICROCONTROLLER, PQFP80, 12 X 12 MM, 1 MM HEIGHT, PLASTIC, TQFP-80 |
文件: | 总10页 (文件大小:344K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
PIC24FJ128GA010
PIC24FJ128GA010 Family Rev. A4 Silicon Errata
The PIC24FJ128GA010 family Rev. A4 parts you have
received conform functionally to the Device Data Sheet
(DS39747C), except for the anomalies described below.
Any Data Sheet Clarification issues related to the
PIC24FJ128GA010 Family will be reported in a separate
Data Sheet errata. Please check the Microchip web site
for any existing issues.
2. Module: JTAG
The current JTAG programming implementation is
not compatible with third party programmers using
SVF (Serial Vector Format) description language.
JTAG boundary scan is supported by third party
JTAG solutions and is not affected.
Work around
The following silicon errata apply only
to PIC24FJ128GA010 devices with these Device/
Revision IDs:
Program
devices
with
In-Circuit
Serial
Programming™. JTAG programming can be
accomplished using custom JTAG software. The
current implementation may not be supported in
future PIC24F revisions. JTAG boundary scan is
supported.
Part Number
Device ID
Revision ID
PIC24FJ128GA010
PIC24FJ96GA010
PIC24FJ64GA010
PIC24FJ128GA008
PIC24FJ96GA008
PIC24FJ64GA008
PIC24FJ128GA006
PIC24FJ96GA006
PIC24FJ64GA006
040Dh
040Ch
040Bh
040Ah
0409h
0408h
0407h
0406h
0405h
04h
04h
04h
04h
04h
04h
04h
04h
04h
Date Codes that pertain to this issue:
All engineering and production devices.
3
Module: PMP
In Master mode (MODE<1:0> = 11 or 10), back-
to-back operations may cause the PMRD signal to
not be generated. This limitation occurs when the
peripheral is configured for zero wait states
(WAITM<3:0> = 0000).
The Device IDs (DEVID and DEVREV) are located at
the last two implemented addresses in program
memory. They are shown in hexadecimal in the
format “DEVID DEVREV”.
Work around
The PMRD signal will be generated correctly if a
minimum of one instruction cycle delay is inserted
between the back-to-back operations. A NOP
instruction, or any other instruction, is adequate.
Selecting a delay other than zero will also permit
the PMRD signal to be generated.
1. Module: Core
With Doze mode enabled, DOZEN (CLKDIV<11>)
set, and the CPU Peripheral Clock Ratio Select
bits (CLKDIV<14:12>) configured to any value
except 0b000, writes to SFR locations can not be
performed.
Date Codes that pertain to this issue:
All engineering and production devices.
Work around
4. Module: Interrupts
Disable Doze mode, or select 1:1 CPU peripheral
clock ratio before modifying stated SFR locations,
or avoid writing stated locations while Doze mode
is enabled and CPU peripheral clock ratio other
than 1:1 is selected. Configure the device prior to
entering Doze mode and use the mode only to
monitor applications activity.
The device may not exit Doze mode if certain trap
conditions occur. Address error, stack error and
math error traps are affected. Oscillator failure and
all interrupt sources are not affected and can
cause the device to correctly exit Doze mode.
Work around
Date Codes that pertain to this issue:
None.
All engineering and production devices.
Date Codes that pertain to this issue:
All engineering and production devices.
© 2007 Microchip Technology Inc.
DS80330A-page 1
PIC24FJ128GA010
5. Module: Output Compare
8. Module: UART
The output compare module may output a single
glitch for one TCY after the module is enabled
(OCM<2:0> = 000). This issue occurs when the
output state of the associated Data Latch register
(LATx) is in the opposite state of the Output Com-
pare mode when the peripheral is enabled. It can
also occur when switching between two Output
Compare modes with opposite output states.
UART1 and UART2 hardware flow control options
are not available for the 64-pin variants of the
PIC24FJ128GA010 product family. As a result, the
UxCTS and UxRTS pins not available and the
UEN<1:0> control bits are read as ‘0’ (unimple-
mented). UART2 hardware flow control is not
available for the 80-pin PIC24FJ128GA010
variants. Therefore associated pins and bits are
not available for these devices.
Work around
Work around
If the output glitch must be avoided, verify that the
associated data latch value of the OCx pin matches
the initial state of the desired Output Compare
mode. For example, if Output Compare 5 is config-
ured for mode, OCM<2:0> = 001, ensure that the
LATD<4> bit is clear prior to writing the OCM bits.
The port latch output value will match the initial out-
put state of the OC5 pin and avoid the glitch when
the peripheral is enabled.
None.
Date Codes that pertain to this issue:
All engineering and production devices.
9. Module: UART
When the UART is in High-Speed mode
(BRGH = 1), the auto-baud sequence can calculate
the baud rate as if it were in Low-Speed mode.
Date Codes that pertain to this issue:
All engineering and production devices.
Work around
The calculated baud rate can be modified by the
following equation:
6. Module: UART
The timing for transmitting a Sync Break has
changed for this revision of silicon. The Sync
Break is transmitted as soon as the UTXBRK bit is
set. A dummy write to UxTXREG is still required
and must be performed before the Sync Break has
finished transmitting. Otherwise, the UxTX may be
held in the active state until the write has occurred.
New BRG Value = (Auto-Baud BRG + 1) * 4 – 1
The user should verify baud rate error does not
exceed application limits.
Date Codes that pertain to this issue:
All engineering and production devices.
Work around
10. Module: UART
Set the UTXBRK bit when a Sync Break is
required and perform a dummy UxTXREG imme-
diately following. This sequence will avoid holding
the UxTX pin in the active state.
With the auto-baud feature selected, the Sync
Break character (0x55) may be loaded into the
FIFO as data.
Work around
Date Codes that pertain to this issue:
To prevent the Sync Break character from being
loaded into the FIFO, load the UxBRG register with
either 0x0000 or 0xFFFF prior to enabling the
auto-baud feature (ABAUD = 1).
All engineering and production devices.
7. Module: UART
When the UART is in High-Speed mode, BRGH
(UxMODE<3>) is set, some optimal UxBRG
values can cause reception to fail.
Date Codes that pertain to this issue:
All engineering and production devices.
Work around
Test UxBRG values in the application to find a
UxBRG value that works consistently for more
high-speed applications. User should verify that
the UxBRG baud rate error does not exceed the
application limits.
Date Codes that pertain to this issue:
All engineering and production devices.
DS80330A-page 2
© 2007 Microchip Technology Inc.
PIC24FJ128GA010
11. Module: A/D
14. Module: SPI
Gain error may be as high as 5 LSbs for external
references (VREF+ and VREF-) and 6 LSbs for
internal reference (AVDD and AVSS).
Master mode receptions using the SPI1 and SPI2
modules may not function correctly for bit rates
above 8 Mbps if the master has the SMP bit
(SPIxCON1<9>) cleared (master samples data at
the middle of the serial clock period).
Work around
Determine gain error from a known reference
voltage and compensate the A/D result in
software.
In this case, the data transmitted by the slave is
received, shifted right by one bit, by the master.
For example, if the data transmitted by the slave
was 0xAAAA, the data received by the master
would be 0x5555 (0xAAAA shifted right by one bit).
Date Codes that pertain to this issue:
All engineering and production devices.
Work around
12. Module: A/D
Users may set up the SPI module so that the bit
rate is 8 Mbps or lower.
With the External Interrupt 0 (INT0) selected to start
an A/D conversion (SSRC<2:0> = 001), the device
may not wake-up from Sleep or Idle mode if more
than one conversion is selected per interrupt
(SMPI<3:0> <> 0000). Interrupts are generated
correctly if the device is not in a Sleep or Idle mode.
Alternatively, the bit rate can be configured higher
than 8 Mbps, but the SMP bit (SPIxCON1<9>) of
the SPI master must be set (master samples data
at the end of the serial clock period).
Date Codes that pertain to this issue:
Work around
All engineering and production devices.
Configure the A/D to generate an interrupt after
every conversion (SMPI<3:0> = 0000). Use
another wake-up source, such as the WDT or
another interrupt source, to exit the Sleep or Idle
mode. Alternatively, perform A/D conversions in
Run mode.
15. Module: SPI
A frame synchronization pulse may not be output
in SPI Master mode if the pulse is selected to
coincide with the first bit clock (SPIFE = 1). SCKx
and SDOx waveforms are not affected.
Date Codes that pertain to this issue:
Work around
All engineering and production devices.
Select the frame sychronization pulses to proceed
the first bit clock (SPIFE = 0). The frame pulses
will output correctly as described in the product
data sheet.
13. Module: SPI
The Enhanced SPI modes, selected by setting the
Enhanced
Buffer
Enable
bit,
SPIBEN
Date Codes that pertain to this issue:
(SPIxCON2<0>), are not available.
All engineering and production devices.
Work around
Use Standard SPI mode by clearing the SPI
Enhanced Buffer Enable bit, SPIBEN.
Date Codes that pertain to this issue:
All engineering and production devices.
© 2007 Microchip Technology Inc.
DS80330A-page 3
PIC24FJ128GA010
16. Module: SPI
19. Module: Core
In SPI Slave mode (MSTEN = 0), with the slave
select option enabled (SSEN = 1), the peripheral
may accept transfers regardless of the SSx pin
state. The received data in SSPxBUF will be
accurate but not intended for the device.
If a clock failure occurs when the device is in Idle
mode, the oscillator failure trap does not vector to
the Trap Service Routine. Instead, the device will
simply wake-up from Idle mode and continue code
execution if the Fail-Safe Clock Monitor (FSCM) is
enabled.
Work around
Work around
If the Slave select option is required (e.g., device
one of multiple SPI slave nodes on an SPI
network), two potential work arounds exist:
Whenever the device wakes up from Idle (assum-
ing the FSCM is enabled), the user software
should check the status of the OSCFAIL bit
(INTCON1<1>) to determine whether a clock fail-
ure occurred and then perform an appropriate
clock switch operation.
1. Configure the port associated with SSx to an
input and periodically read the PORT register. If
the pin is read ‘0’, disable the SPI peripheral
(SPIEN = 0). Enable the peripheral (SPIEN = 1)
if the pin is read as a logic ‘1’.
Date Codes that pertain to this issue:
2. Read the pin associated with SSx after a trans-
fer is complete, indicated by the SPIxF bit
being set. If the port pin is read as a digital ‘1’,
read SSPxBUF and discard the contents.
All engineering and production devices.
20. Module: Core
On a Brown-out Reset, both the BOR and POR
bits may be set. This may cause the Brown-out
Reset condition to be indistinguishable from the
Power-on Reset.
Date Codes that pertain to this issue:
All engineering and production devices.
17. Module: Oscillator
Work around
The Two-Speed Start-up feature may not be
available on exit from Sleep mode with the IESO
(Internal/External Switchover mode) enabled.
Upon wake-up, the device will wait for the clock
source used prior to entering Sleep mode to
become ready.
None.
Date Codes that pertain to this issue:
All engineering and production devices.
21. Module: Ports
Work around
RC15 may output a digital ‘0’ after a Reset until the
Configuration Word settings are processed. The
duration of time for this effect is TRST which is
nominally 20 µs.
None.
Date Codes that pertain to this issue:
All engineering and production devices.
After the Configuration Word is processed, RC15
is put into its reset state as a digital input.
18. Module: Core
Work around
The CLKDIV register Reset value is incorrect. The
register will reset with unimplemented bits equal to
‘1’ for all Resets.
Connect components not adversely affected by a
digital 0 signal to RC15.
Date Codes that pertain to this issue:
Work around
All engineering and production devices.
Mask out unimplemented bits to maintain software
compatibility with future device revisions.
Date Codes that pertain to this issue:
All engineering and production devices.
DS80330A-page 4
© 2007 Microchip Technology Inc.
PIC24FJ128GA010
22. Module: I2C™
25. Module: UART
During I2C Slave mode transactions, the Data/
Address bit, D/A, may not update during the data
frame. This affects both 7 and 10-Bit Addressing
modes.
The auto-baud may miscalculate for certain baud
rates and clock speed combinations, resulting in a
BRG value that is 1 greater or less than the
expected value. When UxBRG is less than 50, this
can result in transmission and reception failures
due to introducing error greater than 1%.
I2C slave receptions are not affected by this issue.
Work around
Work around
Use the Read/Write bit, R/W, and the Transmit
Buffer Full Status Bit, TBF, to determine whether
address or data information is being received.
Test auto-baud calculations at various clock speed
and baud rate combinations that would be used in
applications. If an inaccurate UxBRG value is
generated, manually correct the baud rate in user
code.
For more information, see Figure 24-30 and
Figure 24-31 in “Section 24. Inter-Integrated
Circuit™ (I2C™)” (DS39702A).
Date Codes that pertain to this issue:
Date Codes that pertain to this issue:
All engineering and production devices.
All engineering and production devices.
26. Module: UART
23. Module: I2C
When the UART is in 4x mode (BRGH = 1) and
using two Stop bits (STSEL = 1), it may sample the
first Stop bit instead of the second one.
When the I2C module is operating in Slave mode,
after the ACKSTAT bit is set when receiving a
NACK from the master, it may be cleared by the
reception of a Start or Stop bit.
This issue does not affect the other UART
configurations.
Work around
Work around
Store the value of the ACKSTAT bit immediately
after receiving a NACK from the master.
Use the 16x baud rate option (BRGH = 0) and
adjust the baud rate accordingly.
Date Codes that pertain to this issue:
Date Codes that pertain to this issue:
All engineering and production devices.
All engineering and production devices.
24. Module: UART
27. Module: SPI
When an auto-baud is detected, the receive inter-
rupt may occur twice. The first interrupt occurs at
the beginning of the Start bit and the second after
reception of the Sync field character.
In SPI Master mode, the Disable SCK Pin bit,
DISSCK, may not disable the SPI clock. As a
result, the PIC® microcontroller must provide the
SPI clock in Master mode.
Work around
Work around
If a receive interrupt occurs, check the URXDA bit
(UxSTA<0>) to ensure that valid data is available.
On the first interrupt, no data will be present. The
second interrupt will have the Sync field character
(55h) in the receive FIFO.
None.
Date Codes that pertain to this issue:
All engineering and production devices.
Date Codes that pertain to this issue:
All engineering and production devices.
© 2007 Microchip Technology Inc.
DS80330A-page 5
PIC24FJ128GA010
28. Module: Output Compare
30. Module: RTCC
In PWM mode, the output compare module may
miss a compare event when the current duty cycle
register (OCxRS) value is 0x0000 (0% duty cycle)
and the OCxRS register is updated with a value of
0x0001. The compare event is only missed the first
time a value of 0x0001 is written to OCxRS and the
PWM output remains low for one PWM period.
Subsequent PWM high and low times occur as
expected.
When performing writes to the ALCFGRPT regis-
ter, some bits may become corrupted. The error
occurs because of desynchronization between the
CPU clock domain and the RTCC clock domain.
The error causes data from the instruction follow-
ing the ALCFGRPT instruction to overwrite the
data in ALCFGRPT.
Work around
Always follow writes to the ALCFGRPT register
with an additional write of the same data to a
dummy location. These writes can be performed to
RAM locations, W registers or unimplemented
SFR space.
Work around
If the current OCxRS register value is 0x0000,
avoid writing a value of 0x0001 to OCxRS.
Instead, write a value of 0x0002. In this case, how-
ever, the duty cycle will be slightly different from
the desired value.
The optimal way to perform the work around:
1. Read ALCFGRPT into a RAM location.
Date Codes that pertain to this issue:
2. Modify the ALCFGRPT data, as required, in
RAM.
All engineering and production devices.
3. Move the RAM value into ALCFGRPT and a
dummy location in back-to-back instructions.
29. Module: RTCC
The RTCC alarm repeat will generate an incorrect
number of pin toggles. If the repeat count (x) is
even, it will toggle the alarm pin ‘x’ times. If the
repeat count is odd, one less than x toggles will be
observed (x – 1).
Date Codes that pertain to this issue:
All engineering and production devices.
31. Module: CRC
If a CRC FIFO overflow occurs, the VWORD indi-
cator will reset to ‘1’ instead of ‘0’. Further writes to
the FIFO will cause the VWORD indicator to reset
to ‘0’ after seven writes are performed.
Work around
None at this time.
Date Codes that pertain to this issue:
Work around
All engineering and production devices.
Poll the CRCFUL bit (CRCCON<7>) to ensure that
no writes are performed on the FIFO when it is full.
Date Codes that pertain to this issue:
All engineering and production devices.
DS80330A-page 6
© 2007 Microchip Technology Inc.
PIC24FJ128GA010
32. Module: I/O Pins
The I/O pin output, VOL, meets the specifications in
Table 1 below:
TABLE 1:
DC CHARACTERISTICS: I/O PIN OUTPUT SPECIFICATIONS
Standard Operating Conditions: 2.0V to 3.6V (unless otherwise stated)
DC CHARACTERISTICS
Operating temperature
-40°C ≤ TA ≤ +85°C for Industrial
Param
No.
Sym
Characteristic
Min
Typ(1) Max
Units
Conditions
VOL
Output Low Voltage
DO10
All I/O Pins
—
—
—
—
—
—
—
—
.55
.4
V
V
V
V
IOL = 8.5 mA, VDD = 3.6V
IOL = 7.8 mA, VDD = 3.6V
IOL = 6.0 mA, VDD = 2.0V
IOL = 5.0 mA, VDD = 2.0V
.55
.4
Note 1: Data in “Typ” column is at 3.3V, 25°C unless otherwise stated. Parameters are for design guidance only
and are not tested.
Work around
None.
© 2007 Microchip Technology Inc.
DS80330A-page 7
PIC24FJ128GA010
REVISION HISTORY
Rev A Document (9/2007)
Initial release of this document. Includes silicon issues
1 (Core), 2 (JTAG), 3 (PMP), 4 (Interrupts), 5 (Output
Compare), 6-10 (UART), 11-12 (A/D), 13-16 (SPI),
17 (Oscillator), 18-20 (Core), 21 (Ports), 22-23 (I2C™),
24-26 (UART), 27 (SPI), 28 (Output Compare), 29-30
(RTCC), 31 (CRC) and 32 (I/O Pins).
DS80330A-page 8
© 2007 Microchip Technology Inc.
Note the following details of the code protection feature on Microchip devices:
•
Microchip products meet the specification contained in their particular Microchip Data Sheet.
•
Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the
intended manner and under normal conditions.
•
There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our
knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data
Sheets. Most likely, the person doing so is engaged in theft of intellectual property.
•
•
Microchip is willing to work with the customer who is concerned about the integrity of their code.
Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not
mean that we are guaranteeing the product as “unbreakable.”
Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our
products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts
allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act.
Information contained in this publication regarding device
applications and the like is provided only for your convenience
and may be superseded by updates. It is your responsibility to
ensure that your application meets with your specifications.
MICROCHIP MAKES NO REPRESENTATIONS OR
WARRANTIES OF ANY KIND WHETHER EXPRESS OR
IMPLIED, WRITTEN OR ORAL, STATUTORY OR
OTHERWISE, RELATED TO THE INFORMATION,
INCLUDING BUT NOT LIMITED TO ITS CONDITION,
QUALITY, PERFORMANCE, MERCHANTABILITY OR
FITNESS FOR PURPOSE. Microchip disclaims all liability
arising from this information and its use. Use of Microchip
devices in life support and/or safety applications is entirely at
the buyer’s risk, and the buyer agrees to defend, indemnify and
hold harmless Microchip from any and all damages, claims,
suits, or expenses resulting from such use. No licenses are
conveyed, implicitly or otherwise, under any Microchip
intellectual property rights.
Trademarks
The Microchip name and logo, the Microchip logo, Accuron,
dsPIC, KEELOQ, KEELOQ logo, microID, MPLAB, PIC,
PICmicro, PICSTART, PRO MATE, rfPIC and SmartShunt are
registered trademarks of Microchip Technology Incorporated
in the U.S.A. and other countries.
AmpLab, FilterLab, Linear Active Thermistor, Migratable
Memory, MXDEV, MXLAB, SEEVAL, SmartSensor and The
Embedded Control Solutions Company are registered
trademarks of Microchip Technology Incorporated in the
U.S.A.
Analog-for-the-Digital Age, Application Maestro, CodeGuard,
dsPICDEM, dsPICDEM.net, dsPICworks, dsSPEAK, ECAN,
ECONOMONITOR, FanSense, FlexROM, fuzzyLAB,
In-Circuit Serial Programming, ICSP, ICEPIC, Mindi, MiWi,
MPASM, MPLAB Certified logo, MPLIB, MPLINK, PICkit,
PICDEM, PICDEM.net, PICLAB, PICtail, PowerCal,
PowerInfo, PowerMate, PowerTool, REAL ICE, rfLAB, Select
Mode, Smart Serial, SmartTel, Total Endurance, UNI/O,
WiperLock and ZENA are trademarks of Microchip
Technology Incorporated in the U.S.A. and other countries.
SQTP is a service mark of Microchip Technology Incorporated
in the U.S.A.
All other trademarks mentioned herein are property of their
respective companies.
© 2007, Microchip Technology Incorporated, Printed in the
U.S.A., All Rights Reserved.
Printed on recycled paper.
Microchip received ISO/TS-16949:2002 certification for its worldwide
headquarters, design and wafer fabrication facilities in Chandler and
Tempe, Arizona; Gresham, Oregon and design centers in California
and India. The Company’s quality system processes and procedures
are for its PIC® MCUs and dsPIC® DSCs, KEELOQ® code hopping
devices, Serial EEPROMs, microperipherals, nonvolatile memory and
analog products. In addition, Microchip’s quality system for the design
and manufacture of development systems is ISO 9001:2000 certified.
© 2007 Microchip Technology Inc.
DS80330A-page 9
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Tel: 63-2-634-9065
Fax: 63-2-634-9069
Kokomo
Kokomo, IN
Tel: 765-864-8360
Fax: 765-864-8387
China - Shanghai
Tel: 86-21-5407-5533
Fax: 86-21-5407-5066
Singapore
Tel: 65-6334-8870
Fax: 65-6334-8850
China - Shenyang
Tel: 86-24-2334-2829
Fax: 86-24-2334-2393
Taiwan - Hsin Chu
Tel: 886-3-572-9526
Fax: 886-3-572-6459
Los Angeles
Mission Viejo, CA
Tel: 949-462-9523
Fax: 949-462-9608
China - Shenzhen
Tel: 86-755-8203-2660
Fax: 86-755-8203-1760
Taiwan - Kaohsiung
Tel: 886-7-536-4818
Fax: 886-7-536-4803
Santa Clara
Santa Clara, CA
Tel: 408-961-6444
Fax: 408-961-6445
China - Shunde
Tel: 86-757-2839-5507
Fax: 86-757-2839-5571
Taiwan - Taipei
Tel: 886-2-2500-6610
Fax: 886-2-2508-0102
Toronto
Mississauga, Ontario,
Canada
Tel: 905-673-0699
Fax: 905-673-6509
China - Wuhan
Tel: 86-27-5980-5300
Fax: 86-27-5980-5118
Thailand - Bangkok
Tel: 66-2-694-1351
Fax: 66-2-694-1350
China - Xian
Tel: 86-29-8833-7252
Fax: 86-29-8833-7256
09/10/07
DS80330A-page 10
© 2007 Microchip Technology Inc.
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