PIC24HJ256GP610ATI/PF

PIC24HJXXXGPX06A/X08A/X10A

16-bit Microcontrollers (up to 256 KB Flash and

16 KB SRAM) with Advanced Analog

Operating Conditions

Communication Interfaces

• Two UART modules (10 Mbps)

- With support for LIN 2.0 protocols and IrDA^®

• 3.0V to 3.6V, -40ºC to +150ºC, DC to 20 MIPS

• 3.0V to 3.6V, -40ºC to +125ºC, DC to 40 MIPS

• Two 4-wire SPI modules (15 Mbps)

• Up to two I²C™ modules (up to 1 Mbaud) with

SMBus support

Core: 16-bit PIC24H CPU

• Code-efficient (C and Assembly) architecture

• Up to two Enhanced CAN (ECAN) modules

(1 Mbaud) with 2.0B support

• Single-cycle mixed-sign MUL plus hardware divide

• Data Converter Interface (DCI) module with I²S

codec support

Clock Management

• ±2% internal oscillator

• Programmable PLLs and oscillator clock sources

• Fail-Safe Clock Monitor (FSCM)

• Independent Watchdog Timer (WDT)

• Fast wake-up and start-up

Input/Output

• Sink/Source up to 10 mA (pin specific) for stan-

dard VOH/VOL, up to 16 mA (pin specific) for non-

standard VOH1

• 5V-tolerant pins

Power Management

• Selectable open drain, pull-ups, and pull-downs

• Up to 5 mA overvoltage clamp current

• External interrupts on all I/O pins

• Low-power management modes (Sleep, Idle,

Doze)

• Integrated Power-on Reset and Brown-out Reset

• 1.35 mA/MHz dynamic current (typical)

• 55 μA IPD current (typical)

Qualification and Class B Support

• AEC-Q100 REVG (Grade 1 -40ºC to +125ºC)

• AEC-Q100 REVG (Grade 0 -40ºC to +150ºC)

• Class B Safety Library, IEC 60730

Advanced Analog Features

• Two ADC modules:

- Configurable as 10-bit, 1.1 Msps with four

S&H or 12-bit, 500 ksps with one S&H

Debugger Development Support

• In-circuit and in-application programming

• Two program and two complex data breakpoints

• IEEE 1149.2-compatible (JTAG) boundary scan

• Trace and run-time watch

- 18 analog inputs on 64-pin devices and up to

32 analog inputs on 100-pin devices

• Flexible and independent ADC trigger sources

Timers/Output Compare/Input Capture

• Up to nine 16-bit timers/counters. Can pair up to

make four 32-bit timers.

• Eight Output Compare modules configurable as

timers/counters

• Eight Input Capture modules

Packages

Type

QFN

TQFP

Pin Count

Contact Lead/Pitch

I/O Pins

64

0.50

64

0.50

100

0.50

100

0.40

53

85

Dimensions

9x9x0.9

10x10x1

12x12x1

14x14x1

Note: All dimensions are in millimeters (mm) unless specified.

 2009-2012 Microchip Technology Inc.

DS70592D-page 1

PIC24HJXXXGPX06A/X08A/X10A

PIC24H PRODUCT FAMILIES

The PIC24H Family of devices is ideal for a wide vari-

ety of 16-bit MCU embedded applications. The device

names, pin counts, memory sizes and peripheral avail-

ability of each device are listed below, followed by their

pinout diagrams.

PIC24H Family Controllers

Program

Device

Pins

Flash

Memory (KB)

PIC24HJ64GP206A

64

8

9

8

0

1 ADC,

18 ch

2

1

2

0

1

0

1

0

2

53

85

53

85

53

85

53

85

53

85

53

85

PT, MR

PF, PT

PT, MR

PF, PT

PT, MR

PF, PT

PT, MR

PF, PT

PT, MR

PF, PT

PT, MR

PF, PT

PIC24HJ64GP210A 100

PIC24HJ64GP506A 64

64

1 ADC,

32 ch

64

8

1 ADC,

18 ch

PIC24HJ64GP510A 100

PIC24HJ128GP206A 64

PIC24HJ128GP210A 100

PIC24HJ128GP506A 64

PIC24HJ128GP510A 100

PIC24HJ128GP306A 64

PIC24HJ128GP310A 100

PIC24HJ256GP206A 64

PIC24HJ256GP210A 100

PIC24HJ256GP610A 100

64

8

1 ADC,

32 ch

128

256

8

1 ADC,

18 ch

8

1 ADC,

32 ch

8

1 ADC,

18 ch

8

1 ADC,

32 ch

16

1 ADC,

18 ch

1 ADC,

32 ch

1 ADC,

18 ch

1 ADC,

32 ch

2 ADC,

32 ch

Note 1: RAM size is inclusive of 2 Kbytes DMA RAM.

2: Maximum I/O pin count includes pins shared by the peripheral functions.

DS70592D-page 2

 2009-2012 Microchip Technology Inc.

PIC24HJXXXGPX06A/X08A/X10A

Pin Diagrams

64-Pin QFN⁽¹⁾

= Pins are up to 5V tolerant

6463 62 6160 59 5857 56 55 54 53 52 5150 49

1

2

3

4

5

6

7

8

9

10

11

12

13

14

15

16

RG15

48

47

46

45

44

43

42

41

40

39

38

37

36

35

34

33

PGEC2/SOSCO/T1CK/CN0/RC14

PGED2/SOSCI/T4CK/CN1/RC13

OC1/RD0

AN16/T2CK/T7CK/RC1

AN17/T3CK/T6CK/RC2

SCK2/CN8/RG6

SDI2/CN9/RG7

IC4/INT4/RD11

IC3/INT3/RD10

IC2/U1CTS/INT2/RD9

IC1/INT1/RD8

SDO2/CN10/RG8

MCLR

PIC24HJ64GP206A⁽²⁾

PIC24HJ128GP206A

PIC24HJ256GP206A

SS2/CN11/RG9

VSS

OSC2/CLKO/RC15

OSC1/CLKIN/RC12

VDD

AN5/IC8/CN7/RB5

AN4/IC7/CN6/RB4

AN3/CN5/RB3

SCL1/RG2

SDA1/RG3

AN2/SS1/CN4/RB2

PGEC3/AN1/VREF-/CN3/RB1

PGED3/AN0/VREF+/CN2/RB0

U1RTS/SCK1/INT0/RF6

U1RX/SDI1/RF2

U1TX/SDO1/RF3

17 18 19 20 21 22 23 2425 26 2728 29 30 31 32

Note 1: The metal plane at the bottom of the device is not connected to any pins and should be connected to VSS externally.

2: The PIC24HJ64GP206A device does not have the SCL2 and SDA2 pins.

3: Refer to Section 2.3 “CPU Logic Filter Capacitor Connection (VCAP)” for proper connection to this pin.

 2009-2012 Microchip Technology Inc.

DS70592D-page 3

PIC24HJXXXGPX06A/X08A/X10A

Pin Diagrams (Continued)

64-Pin QFN⁽¹⁾

= Pins are up to 5V tolerant

6463 62 6160 59 58 57 56 55 54 53 52 5150 49

RG15

AN16/T2CK/T7CK/RC1

AN17/T3CK/T6CK/RC2

SCK2/CN8/RG6

SDI2/CN9/RG7

PGEC2/SOSCO/T1CK/CN0/RC14

PGED2/SOSCI/T4CK/CN1/RC13

OC1/RD0

1

2

3

4

5

6

7

8

9

10

11

12

13

14

15

16

48

47

46

45

44

43

42

41

40

39

38

37

36

35

34

33

IC4/INT4/RD11

IC3/INT3/RD10

IC2/U1CTS/INT2/RD9

IC1/INT1/RD8

SDO2/CN10/RG8

MCLR

SS2/CN11/RG9

VSS

PIC24HJ128GP306A

VSS

OSC2/CLKO/RC15

OSC1/CLKIN/RC12

VDD

AN5/IC8/CN7/RB5

AN4/IC7/CN6/RB4

AN3/CN5/RB3

SCL1/RG2

SDA1/RG3

AN2/SS1/CN4/RB2

PGEC3/AN1/VREF-/CN3/RB1

PGED3/AN0/VREF+/CN2/RB0

U1RTS/SCK1/INT0/RF6

U1RX/SDI1/RF2

U1TX/SDO1/RF3

17 18 19 20 21 22 23 2425 26 2728 29 30 31 32

Note 1: The metal plane at the bottom of the device is not connected to any pins and should be connected to VSS externally.

2: Refer to Section 2.3 “CPU Logic Filter Capacitor Connection (VCAP)” for proper connection to this pin.

DS70592D-page 4

 2009-2012 Microchip Technology Inc.

PIC24HJXXXGPX06A/X08A/X10A

Pin Diagrams (Continued)

64-Pin QFN⁽¹⁾

= Pins are up to 5V tolerant

64 6362 61 6059 58 57 56 55 54 53 52 51 5049

PGEC2/SOSCO/T1CK/CN0/RC14

PGED2/SOSCI/T4CK/CN1/RC13

OC1/RD0

RG15

1

2

3

4

5

6

7

8

9

10

11

12

13

14

15

16

48

47

46

45

44

43

42

41

40

39

38

37

36

35

34

33

AN16/T2CK/T7CK/RC1

AN17/T3CK/T6CK/RC2

SCK2/CN8/RG6

SDI2/CN9/RG7

IC4/INT4/RD11

IC3/INT3/RD10

IC2/U1CTS/INT2/RD9

IC1/INT1/RD8

SDO2/CN10/RG8

MCLR

SS2/CN11/RG9

VSS

PIC24HJ64GP506A

PIC24HJ128GP506A

VSS

OSC2/CLKO/RC15

OSC1/CLKIN/RC12

VDD

AN5/IC8/CN7/RB5

AN4/IC7/CN6/RB4

AN3/CN5/RB3

SCL1/RG2

SDA1/RG3

AN2/SS1/CN4/RB2

PGEC3/AN1/VREF-/CN3/RB1

PGED3/AN0/VREF+/CN2/RB0

U1RTS/SCK1/INT0/RF6

U1RX/SDI1/RF2

U1TX/SDO1/RF3

17 18 19 20 21 2223 24 2526 27 2829 30 31 32

Note 1: The metal plane at the bottom of the device is not connected to any pins and should be connected to VSS externally.

2: Refer to Section 2.3 “CPU Logic Filter Capacitor Connection (VCAP)” for proper connection to this pin.

 2009-2012 Microchip Technology Inc.

DS70592D-page 5

PIC24HJXXXGPX06A/X08A/X10A

Pin Diagrams (Continued)

64-Pin TQFP

= Pins are up to 5V tolerant

RG15

AN16/T2CK/T7CK/RC1

AN17/T3CK/T6CK/RC2

SCK2/CN8/RG6

SDI2/CN9/RG7

SDO2/CN10/RG8

MCLR

1

48

47

46

45

44

43

42

41

40

39

38

37

36

35

34

33

PGEC2/SOSCO/T1CK/CN0/RC14

PGED2/SOSCI/T4CK/CN1/RC13

OC1/RD0

2

3

4

IC4/INT4/RD11

5

IC3/INT3/RD10

IC2/U1CTS/INT2/RD9

IC1/INT1/RD8

6

7

SS2/CN11/RG9

VSS

8

VSS

PIC24HJ64GP206A

PIC24HJ128GP206A

PIC24HJ256GP206A

9

OSC2/CLKO/RC15

OSC1/CLKIN/RC12

VDD

10

11

12

13

14

15

16

AN5/IC8/CN7/RB5

AN4/IC7/CN6/RB4

AN3/CN5/RB3

AN2/SS1/CN4/RB2

SCL1/RG2

SDA1/RG3

U1RTS/SCK1/INT0/RF6

U1RX/SDI1/RF2

U1TX/SDO1/RF3

PGEC3/AN1/VREF-/CN3/RB1

PGED3/AN0/VREF+/CN2/RB0

Note 1: This pin is not present on the PIC24HJ64GP206A device.

2: Refer to Section 2.3 “CPU Logic Filter Capacitor Connection (VCAP)” for proper connection to this pin.

DS70592D-page 6

 2009-2012 Microchip Technology Inc.

PIC24HJXXXGPX06A/X08A/X10A

Pin Diagrams (Continued)

64-Pin TQFP

= Pins are up to 5V tolerant

RG15

1

48

47

46

45

44

43

42

41

40

39

38

37

36

35

34

33

PGEC2/SOSCO/T1CK/CN0/RC14

PGED2/SOSCI/T4CK/CN1/RC13

OC1/RD0

AN16/T2CK/T7CK/RC1

AN17/T3CK/T6CK/RC2

SCK2/CN8/RG6

SDI2/CN9/RG7

SDO2/CN10/RG8

MCLR

2

3

4

IC4/INT4/RD11

5

IC3/INT3/RD10

IC2/U1CTS/INT2/RD9

IC1/INT1/RD8

6

7

PIC24HJ128GP306A

SS2/CN11/RG9

VSS

8

VSS

9

OSC2/CLKO/RC15

OSC1/CLKIN/RC12

VDD

10

11

12

13

14

15

16

AN5/IC8/CN7/RB5

AN4/IC7/CN6/RB4

AN3/CN5/RB3

AN2/SS1/CN4/RB2

SCL1/RG2

SDA1/RG3

U1RTS/SCK1/INT0/RF6

U1RX/SDI1/RF2

U1TX/SDO1/RF3

PGEC3/AN1/VREF-/CN3/RB1

PGED3/AN0/VREF+/CN2/RB0

Note 1: Refer to Section 2.3 “CPU Logic Filter Capacitor Connection (VCAP)” for proper connection to this pin.

 2009-2012 Microchip Technology Inc.

DS70592D-page 7

PIC24HJXXXGPX06A/X08A/X10A

Pin Diagrams (Continued)

64-Pin TQFP

= Pins are up to 5V tolerant

48

47

46

45

44

43

42

41

40

39

38

37

36

35

34

33

PGEC2/SOSCO/T1CK/CN0/RC14

PGED2/SOSCI/T4CK/CN1/RC13

OC1/RD0

RG15

AN16/T2CK/T7CK/RC1

AN17/T3CK/T6CK/RC2

SCK2/CN8/RG6

SDI2/CN9/RG7

SDO2/CN10/RG8

MCLR

1

2

3

4

IC4/INT4/RD11

5

IC3/INT3/RD10

IC2/U1CTS/INT2/RD9

IC1/INT1/RD8

6

7

SS2/CN11/RG9

VSS

8

VSS

PIC24HJ64GP506A

PIC24HJ128GP506A

9

OSC2/CLKO/RC15

OSC1/CLKIN/RC12

VDD

10

11

12

13

14

15

16

AN5/IC8/CN7/RB5

AN4/IC7/CN6/RB4

AN3/CN5/RB3

AN2/SS1/CN4/RB2

SCL1/RG2

SDA1/RG3

U1RTS/SCK1/INT0/RF6

U1RX/SDI1/RF2

U1TX/SDO1/RF3

PGEC3/AN1/VREF-/CN3/RB1

PGED3/AN0/VREF+/CN2/RB0

Note 1: Refer to Section 2.3 “CPU Logic Filter Capacitor Connection (VCAP)” for proper connection to this pin.

DS70592D-page 8

 2009-2012 Microchip Technology Inc.

PIC24HJXXXGPX06A/X08A/X10A

Pin Diagrams (Continued)

= Pins are up to 5V tolerant

100-Pin TQFP

V

SS

75

74

73

72

71

70

69

68

67

66

65

64

63

62

61

60

59

58

57

56

55

54

53

52

51

RG15

1

PGEC2/SOSCO/T1CK/CN0/RC14

PGED2/SOSCI/CN1/RC13

OC1/RD0

VDD

2

AN29/RE5

AN30/RE6

3

4

IC4/RD11

AN31/RE7

5

IC3/RD10

AN16/T2CK/T7CK/RC1

AN17/T3CK/T6CK/RC2

AN18/T4CK/T9CK/RC3

AN19/T5CK/T8CK/RC4

SCK2/CN8/RG6

SDI2/CN9/RG7

6

IC2/RD9

7

IC1/RD8

8

INT4/RA15

9

INT3/RA14

10

11

12

13

14

15

16

17

18

19

20

21

22

23

24

25

VSS

OSC2/CLKO/RC15

OSC1/CLKIN/RC12

SDO2/CN10/RG8

MCLR

PIC24HJ64GP210A

PIC24HJ128GP210A

PIC24HJ128GP310A

PIC24HJ256GP210A

SS2/CN11/RG9

VDD

VSS

TDO/RA5

VDD

TDI/RA4

TMS/RA0

AN20/INT1/RA12

AN21/INT2/RA13

AN5/CN7/RB5

SDA2/RA3

SCL2/RA2

SCL1/RG2

SDA1/RG3

SCK1/INT0/RF6

SDI1/RF7

AN4/CN6/RB4

AN3/CN5/RB3

AN2/SS1/CN4/RB2

SDO1/RF8

U1RX/RF2

U1TX/RF3

PGEC3/AN1/CN3/RB1

PGED3/AN0/CN2/RB0

Note 1: Refer to Section 2.3 “CPU Logic Filter Capacitor Connection (VCAP)” for proper connection to this pin.

 2009-2012 Microchip Technology Inc.

DS70592D-page 9

PIC24HJXXXGPX06A/X08A/X10A

Pin Diagrams (Continued)

100-Pin TQFP

= Pins are up to 5V tolerant

75

VSS

1

RG15

74

73

72

71

70

69

68

67

66

65

64

63

62

61

60

59

58

57

56

55

54

53

52

51

PGEC2/SOSCO/T1CK/CN0/RC14

PGED2/SOSCI/CN1/RC13

OC1/RD0

V

DD

2

3

AN29/RE5

AN30/RE6

4

IC4/RD11

AN31/RE7

5

IC3/RD10

AN16/T2CK/T7CK/RC1

AN17/T3CK/T6CK/RC2

AN18/T4CK/T9CK/RC3

AN19/T5CK/T8CK/RC4

6

IC2/RD9

7

IC1/RD8

8

INT4/RA15

9

INT3/RA14

10

11

12

13

14

15

16

17

18

19

20

21

22

23

24

25

SCK2/CN8/RG6

SDI2/CN9/RG7

SDO2/CN10/RG8

MCLR

VSS

OSC2/CLKO/RC15

OSC1/CLKIN/RC12

PIC24HJ64GP510A

PIC24HJ128GP510A

SS2/CN11/RG9

VDD

V

SS

TDO/RA5

VDD

TDI/RA4

TMS/RA0

AN20/INT1/RA12

AN21/INT2/RA13

AN5/CN7/RB5

SDA2/RA3

SCL2/RA2

SCL1/RG2

SDA1/RG3

SCK1/INT0/RF6

SDI1/RF7

AN4/CN6/RB4

AN3/CN5/RB3

AN2/SS1/CN4/RB2

PGEC3/AN1/CN3/RB1

PGED3/AN0/CN2/RB0

SDO1/RF8

U1RX/RF2

U1TX/RF3

Note 1: Refer to Section 2.3 “CPU Logic Filter Capacitor Connection (VCAP)” for proper connection to this pin.

DS70592D-page 10

 2009-2012 Microchip Technology Inc.

PIC24HJXXXGPX06A/X08A/X10A

Pin Diagrams (Continued)

100-Pin TQFP

= Pins are up to 5V tolerant

75

74

73

72

71

70

69

68

67

66

65

64

63

62

61

60

59

58

57

56

55

54

53

52

51

VSS

1

RG15

PGEC2/SOSCO/T1CK/CN0/RC14

PGED2/SOSCI/CN1/RC13

OC1/RD0

VDD

2

AN29/RE5

AN30/RE6

3

4

IC4/RD11

AN31/RE7

5

IC3/RD10

AN16/T2CK/T7CK/RC1

AN17/T3CK/T6CK/RC2

AN18/T4CK/T9CK/RC3

AN19/T5CK/T8CK/RC4

SCK2/CN8/RG6

6

IC2/RD9

7

IC1/RD8

8

INT4/RA15

9

INT3/RA14

10

11

12

VSS

SDI2/CN9/RG7

SDO2/CN10/RG8

MCLR

OSC2/CLKO/RC15

OSC1/CLKIN/RC12

PIC24HJ256GP610A

13

14

15

16

17

18

19

20

21

22

23

24

25

SS2/CN11/RG9

VDD

VSS

TDO/RA5

VDD

TDI/RA4

TMS/RA0

AN20/INT1/RA12

AN21/INT2/RA13

AN5/CN7/RB5

SDA2/RA3

SCL2/RA2

SCL1/RG2

SDA1/RG3

SCK1/INT0/RF6

SDI1/RF7

AN4/CN6/RB4

AN3/CN5/RB3

AN2/SS1/CN4/RB2

SDO1/RF8

U1RX/RF2

U1TX/RF3

PGEC3/AN1/CN3/RB1

PGED3/AN0/CN2/RB0

Note 1: Refer to Section 2.3 “CPU Logic Filter Capacitor Connection (VCAP)” for proper connection to this pin.

 2009-2012 Microchip Technology Inc.

DS70592D-page 11

PIC24HJXXXGPX06A/X08A/X10A

Table of Contents

PIC24H Product Families....................................................................................................................................................................... 2

1.0 Device Overview ........................................................................................................................................................................ 15

2.0 Guidelines for Getting Started with 16-Bit Microcontrollers........................................................................................................ 19

3.0 CPU............................................................................................................................................................................................ 23

4.0 Memory Organization................................................................................................................................................................. 29

5.0 Flash Program Memory.............................................................................................................................................................. 59

6.0 Reset ......................................................................................................................................................................................... 65

7.0 Interrupt Controller ..................................................................................................................................................................... 69

8.0 Direct Memory Access (DMA) .................................................................................................................................................. 113

9.0 Oscillator Configuration ............................................................................................................................................................ 123

10.0 Power-Saving Features............................................................................................................................................................ 133

11.0 I/O Ports ................................................................................................................................................................................... 141

12.0 Timer1 ...................................................................................................................................................................................... 145

13.0 Timer2/3, Timer4/5, Timer6/7 and Timer8/9 ............................................................................................................................ 147

14.0 Input Capture............................................................................................................................................................................ 153

15.0 Output Compare....................................................................................................................................................................... 155

16.0 Serial Peripheral Interface (SPI)............................................................................................................................................... 159

2

17.0 Inter-Integrated Circuit™ (I C™).............................................................................................................................................. 165

18.0 Universal Asynchronous Receiver Transmitter (UART) ........................................................................................................... 173

19.0 Enhanced CAN (ECAN™) Module........................................................................................................................................... 179

20.0 10-bit/12-bit Analog-to-Digital Converter (ADC)....................................................................................................................... 207

21.0 Special Features ...................................................................................................................................................................... 221

22.0 Instruction Set Summary.......................................................................................................................................................... 229

23.0 Development Support............................................................................................................................................................... 237

24.0 Electrical Characteristics .......................................................................................................................................................... 241

25.0 High Temperature Electrical Characteristics............................................................................................................................ 287

26.0 DC and AC Device Characteristics Graphs.............................................................................................................................. 297

27.0 Packaging Information.............................................................................................................................................................. 301

Appendix A: Migrating from PIC24HJXXXGPX06/X08/X10 Devices to PIC24HJXXXGPX06A/X08A/X10A Devices....................... 311

Appendix B: Revision History............................................................................................................................................................. 312

Index ................................................................................................................................................................................................. 317

The Microchip Web Site..................................................................................................................................................................... 321

Customer Change Notification Service .............................................................................................................................................. 321

Customer Support.............................................................................................................................................................................. 321

Reader Response .............................................................................................................................................................................. 322

Product Identification System............................................................................................................................................................. 323

DS70592D-page 12

 2009-2012 Microchip Technology Inc.

PIC24HJXXXGPX06A/X08A/X10A

TO OUR VALUED CUSTOMERS

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Errata

An errata sheet, describing minor operational differences from the data sheet and recommended workarounds, may exist for current

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To determine if an errata sheet exists for a particular device, please check with one of the following:

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 2009-2012 Microchip Technology Inc.

DS70592D-page 13

PIC24HJXXXGPX06A/X08A/X10A

Referenced Sources

This device data sheet is based on the following

individual chapters of the “dsPIC33F/PIC24H Family

Reference Manual”. These documents should be

considered as the general reference for the operation

of a particular module or device feature.

Note:

To access the documents listed below,

browse to the documentation section of

the PIC24HJ256GP610A product page

on

the

Microchip

web

site

(www.microchip.com) or by selecting a

family reference manual section from

the following list.

In addition to parameters, features, and

other documentation, the resulting page

provides links to the related family

reference manual sections.

• Section 1. “Introduction” (DS70197)

• Section 2. “CPU” (DS70204)

• Section 3. “Data Memory” (DS70202)

• Section 4. “Program Memory” (DS70203)

• Section 5. “Flash Programming” (DS70191)

• Section 6. “Interrupts” (DS70184)

• Section 7. “Oscillator” (DS70186)

• Section 8. “Reset” (DS70192)

• Section 9. “Watchdog Timer and Power-Saving Modes” (DS70196)

• Section 10. “I/O Ports” (DS70193)

• Section 11. “Timers” (DS70205)

• Section 12. “Input Capture” (DS70198)

• Section 13. “Output Compare” (DS70209)

• Section 16. “Analog-to-Digital Converter (ADC)” (DS70183)

• Section 17. “UART” (DS70188)

• Section 18. “Serial Peripheral Interface (SPI)” (DS70206)

• Section 19. “Inter-Integrated Circuit™ (I2C™)” (DS70195)

• Section 20. “Data Converter Interface (DCI)” (DS70288)

• Section 21. “Enhanced Controller Area Network (ECAN™)” (DS70185)

• Section 22. “Direct Memory Access (DMA)” (DS70182)

• Section 23. “CodeGuard™ Security” (DS70199)

• Section 24. “Programming and Diagnostics” (DS70207)

• Section 25. “Device Configuration” (DS70194)

DS70592D-page 14

 2009-2012 Microchip Technology Inc.

PIC24HJXXXGPX06A/X08A/X10A

This makes these families suitable for a wide variety of

1.0

DEVICE OVERVIEW

high-performance digital signal control applications.

The devices are pin compatible with the dsPIC33F fam-

ily of devices, and also share a very high degree of

compatibility with the dsPIC30F family devices. This

allows easy migration between device families as may

be necessitated by the specific functionality, computa-

tional resource and system cost requirements of the

application.

Note:

This data sheet summarizes the features

of the PIC24HJXXXGPX06A/X08A/X10A

family of devices. However, it is not

intended to be a comprehensive refer-

ence source. To complement the informa-

tion in this data sheet, refer to the latest

family reference sections of the

“dsPIC33F/PIC24H Family Reference

Manual”, which is available from the

Microchip web site (www.microchip.com).

The PIC24HJXXXGPX06A/X08A/X10A device family

employs a powerful 16-bit architecture, ideal for

applications that rely on high-speed, repetitive

computations, as well as control.

This document contains device specific information for

the following devices:

The 17 x 17 multiplier, hardware support for division

operations, multi-bit data shifter, a large array of 16-bit

working registers and a wide variety of data addressing

• PIC24HJ64GP206A

• PIC24HJ64GP210A

• PIC24HJ64GP506A

• PIC24HJ64GP510A

• PIC24HJ128GP206A

• PIC24HJ128GP210A

• PIC24HJ128GP506A

• PIC24HJ128GP510A

• PIC24HJ128GP306A

• PIC24HJ128GP310A

• PIC24HJ256GP206A

• PIC24HJ256GP210A

• PIC24HJ256GP610A

modes,

together

provide

the

PIC24HJXXXGPX06A/X08A/X10A Central Processing

Unit (CPU) with extensive mathematical processing

capability. Flexible and deterministic interrupt handling,

coupled with a powerful array of peripherals, renders

the PIC24HJXXXGPX06A/X08A/X10A devices suit-

able for control applications. Further, Direct Memory

Access (DMA) enables overhead-free transfer of data

between several peripherals and a dedicated DMA

RAM. Reliable, field programmable Flash program

memory ensures scalability of applications that use

PIC24HJXXXGPX06A/X08A/X10A devices.

Figure 1-1 shows a general block diagram of the

various core and peripheral modules in the

PIC24HJXXXGPX06A/X08A/X10A family of devices,

while Table 1-1 lists the functions of the various pins

shown in the pinout diagrams.

The PIC24HJXXXGPX06A/X08A/X10A device family

includes devices with different pin counts (64 and 100

pins), different program memory sizes (64 Kbytes, 128

Kbytes and 256 Kbytes) and different RAM sizes (8

Kbytes and 16 Kbytes).

 2009-2012 Microchip Technology Inc.

DS70592D-page 15

PIC24HJXXXGPX06A/X08A/X10A

FIGURE 1-1:

PIC24HJXXXGPX06A/X08A/X10A GENERAL BLOCK DIAGRAM

PSV and Table

Data Access

Control Block

Data Bus

Interrupt

Controller

PORTA

PORTB

16

8

DMA

RAM

Data Latch

X RAM

23

PCH PCL

Program Counter

PCU

23

Address

Latch

Loop

Control

Logic

Stack

Control

Logic

DMA

16

Controller

23

16

PORTC

PORTD

PORTE

PORTF

PORTG

Address Generator Units

Address Latch

Program Memory

Data Latch

EA MUX

ROM Latch

24

16

Instruction

Decode and

Control

Instruction Reg

16

Control Signals

to Various Blocks

17 x 17 Multiplier

Divide Support

16 x 16

W Register Array

Power-up

Timer

Timing

Generation

OSC2/CLKO

OSC1/CLKI

16

Oscillator

Start-up Timer

FRC/LPRC

Oscillators

Power-on

Reset

16-bit ALU

Precision

Band Gap

Reference

Watchdog

Timer

16

Brown-out

Reset

Voltage

Regulator

VCAP

VDD, VSS

MCLR

Timers

1-9

ADC1,2

ECAN1,2

UART1,2

OC/

IC1-8

CN1-23

SPI1,2

I2C1,2

PWM1-8

Note:

Not all pins or features are implemented on all device pinout configurations. See Pin Diagrams for the specific pins and

features present on each device.

DS70592D-page 16

 2009-2012 Microchip Technology Inc.

PIC24HJXXXGPX06A/X08A/X10A

TABLE 1-1:

Pin Name

PINOUT I/O DESCRIPTIONS

Buffer

Description

Type

AN0-AN31

AVDD

I

Analog Analog input channels.

P

Positive supply for analog modules. This pin must be connected at all times.

Ground reference for analog modules.

AVSS

CLKI

I

ST/CMOS External clock source input. Always associated with OSC1 pin function.

CLKO

O

—

Oscillator crystal output. Connects to crystal or resonator in Crystal Oscillator

mode. Optionally functions as CLKO in RC and EC modes. Always associated

with OSC2 pin function.

CN0-CN23

I

ST

Input change notification inputs.

Can be software programmed for internal weak pull-ups on all inputs.

C1RX

C1TX

C2RX

C2TX

I

O

I

ST

—

ST

—

ECAN1 bus receive pin.

ECAN1 bus transmit pin.

ECAN2 bus receive pin.

ECAN2 bus transmit pin.

O

PGED1

PGEC1

PGED2

PGEC2

PGED3

PGEC3

I/O

ST

Data I/O pin for programming/debugging communication channel 1.

Clock input pin for programming/debugging communication channel 1.

Data I/O pin for programming/debugging communication channel 2.

Clock input pin for programming/debugging communication channel 2.

Data I/O pin for programming/debugging communication channel 3.

Clock input pin for programming/debugging communication channel 3.

I

I/O

I

I/O

I

IC1-IC8

I

ST

Capture inputs 1 through 8.

INT0

INT1

INT2

INT3

INT4

I

ST

External interrupt 0.

External interrupt 1.

External interrupt 2.

External interrupt 3.

External interrupt 4.

MCLR

I/P

ST

Master Clear (Reset) input. This pin is an active-low Reset to the device.

OCFA

OCFB

OC1-OC8

I

O

ST

—

Compare Fault A input (for Compare Channels 1, 2, 3 and 4).

Compare Fault B input (for Compare Channels 5, 6, 7 and 8).

Compare outputs 1 through 8.

OSC1

I

ST/CMOS Oscillator crystal input. ST buffer when configured in RC mode; CMOS

otherwise.

OSC2

I/O

—

Oscillator crystal output. Connects to crystal or resonator in Crystal Oscillator

mode. Optionally functions as CLKO in RC and EC modes.

RA0-RA7

RA9-RA10

RA12-RA15

I/O

ST

PORTA is a bidirectional I/O port.

RB0-RB15

I/O

ST

PORTB is a bidirectional I/O port.

PORTC is a bidirectional I/O port.

RC1-RC4

RC12-RC15

I/O

ST

RD0-RD15

RE0-RE7

I/O

ST

PORTD is a bidirectional I/O port.

PORTE is a bidirectional I/O port.

PORTF is a bidirectional I/O port.

RF0-RF8

RF12-RF13

RG0-RG3

RG6-RG9

RG12-RG15

I/O

ST

PORTG is a bidirectional I/O port.

Legend: CMOS = CMOS compatible input or output

Analog = Analog input

O = Output

P = Power

I = Input

ST = Schmitt Trigger input with CMOS levels

 2009-2012 Microchip Technology Inc.

DS70592D-page 17

PIC24HJXXXGPX06A/X08A/X10A

TABLE 1-1:

Pin Name

PINOUT I/O DESCRIPTIONS (CONTINUED)

Buffer

Type

Description

Type

SCK1

SDI1

SDO1

SS1

SCK2

SDI2

SDO2

SS2

I/O

I

O

I/O

I

ST

—

ST

—

Synchronous serial clock input/output for SPI1.

SPI1 data in.

SPI1 data out.

SPI1 slave synchronization or frame pulse I/O.

Synchronous serial clock input/output for SPI2.

SPI2 data in.

O

I/O

SPI2 data out.

SPI2 slave synchronization or frame pulse I/O.

ST

SCL1

SDA1

SCL2

SDA2

I/O

ST

Synchronous serial clock input/output for I2C1.

Synchronous serial data input/output for I2C1.

Synchronous serial clock input/output for I2C2.

Synchronous serial data input/output for I2C2.

SOSCI

I

ST/CMOS 32.768 kHz low-power oscillator crystal input; CMOS otherwise.

SOSCO

O

—

32.768 kHz low-power oscillator crystal output.

TMS

TCK

TDI

I

ST

—

JTAG Test mode select pin.

JTAG test clock input pin.

JTAG test data input pin.

JTAG test data output pin.

TDO

O

T1CK

T2CK

T3CK

T4CK

T5CK

T6CK

T7CK

T8CK

T9CK

I

ST

Timer1 external clock input.

Timer2 external clock input.

Timer3 external clock input.

Timer4 external clock input.

Timer5 external clock input.

Timer6 external clock input.

Timer7 external clock input.

Timer8 external clock input.

Timer9 external clock input.

I

O

I

O

I

O

I

O

ST

—

ST

—

ST

—

ST

—

UART1 clear to send.

UART1 ready to send.

UART1 receive.

U1CTS

U1RTS

U1RX

UART1 transmit.

U1TX

UART2 clear to send.

UART2 ready to send.

UART2 receive.

U2CTS

U2RTS

U2RX

UART2 transmit.

U2TX

VDD

P

I

—

Positive supply for peripheral logic and I/O pins.

CPU logic filter capacitor connection.

VCAP

VSS

Ground reference for logic and I/O pins.

VREF+

VREF-

Analog Analog voltage reference (high) input.

Analog Analog voltage reference (low) input.

I

Legend: CMOS = CMOS compatible input or output

Analog = Analog input

O = Output

P = Power

I = Input

ST = Schmitt Trigger input with CMOS levels

DS70592D-page 18

 2009-2012 Microchip Technology Inc.

PIC24HJXXXGPX06A/X08A/X10A

2.2

Decoupling Capacitors

2.0

GUIDELINES FOR GETTING

STARTED WITH 16-BIT

MICROCONTROLLERS

The use of decoupling capacitors on every pair of

power supply pins, such as VDD, VSS, AVDD and

AVSS is required.

Note 1: This data sheet summarizes the features

of the PIC24HJXXXGPX06A/X08A/X10A

family of devices. It is not intended to be

a comprehensive reference source. To

complement the information in this data

sheet, refer to the “dsPIC33F/PIC24H

Family Reference Manual”. Please see

Consider the following criteria when using decoupling

capacitors:

• Value and type of capacitor: Recommendation

of 0.1 µF (100 nF), 10-20V. This capacitor should

be a low-ESR and have resonance frequency in

the range of 20 MHz and higher. It is

recommended that ceramic capacitors be used.

the

Microchip

web

site

(www.microchip.com) for the latest

dsPIC33F/PIC24H Family Reference

Manual sections.

• Placement on the printed circuit board: The

decoupling capacitors should be placed as close

to the pins as possible. It is recommended to

place the capacitors on the same side of the

board as the device. If space is constricted, the

capacitor can be placed on another layer on the

PCB using a via; however, ensure that the trace

length from the pin to the capacitor is within

one-quarter inch (6 mm) in length.

2: Some registers and associated bits

described in this section may not be

available on all devices. Refer to

Section 4.0 “Memory Organization” in

this data sheet for device-specific register

and bit information.

• Handling high frequency noise: If the board is

experiencing high frequency noise, upward of

tens of MHz, add a second ceramic-type capacitor

in parallel to the above described decoupling

capacitor. The value of the second capacitor can

be in the range of 0.01 µF to 0.001 µF. Place this

second capacitor next to the primary decoupling

capacitor. In high-speed circuit designs, consider

implementing a decade pair of capacitances as

close to the power and ground pins as possible.

For example, 0.1 µF in parallel with 0.001 µF.

2.1

Basic Connection Requirements

Getting

started

with

the

PIC24HJXXXGPX06A/X08A/X10A family of 16-bit

Microcontrollers (MCUs) requires attention to a minimal

set of device pin connections before proceeding with

development. The following is a list of pin names, which

must always be connected:

• All VDD and VSS pins

(see Section 2.2 “Decoupling Capacitors”)

• Maximizing performance: On the board layout

from the power supply circuit, run the power and

return traces to the decoupling capacitors first,

and then to the device pins. This ensures that the

decoupling capacitors are first in the power chain.

Equally important is to keep the trace length

between the capacitor and the power pins to a

minimum thereby reducing PCB track inductance.

• All AVDD and AVSS pins (regardless if ADC module

is not used)

(see Section 2.2 “Decoupling Capacitors”)

• VCAP

(see Section 2.3 “CPU Logic Filter Capacitor

Connection (VCAP)”)

• MCLR pin

(see Section 2.4 “Master Clear (MCLR) Pin”)

• PGECx/PGEDx pins used for In-Circuit Serial

Programming™ (ICSP™) and debugging purposes

(see Section 2.5 “ICSP Pins”)

• OSC1 and OSC2 pins when external oscillator

source is used

(see Section 2.6 “External Oscillator Pins”)

Additionally, the following pins may be required:

• VREF+/VREF- pins used when external voltage

reference for ADC module is implemented

Note:

The AVDD and AVSS pins must be

connected independent of the ADC

voltage reference source.

 2009-2012 Microchip Technology Inc.

DS70592D-page 19

PIC24HJXXXGPX06A/X08A/X10A

The placement of this capacitor should be close to the

VCAP. It is recommended that the trace length not

exceed one-quarter inch (6 mm). Refer to Section 21.2

“On-Chip Voltage Regulator” for details.

FIGURE 2-1:

RECOMMENDED

MINIMUM CONNECTION

0.1 µF

Ceramic

10 µF

VDD

Tantalum

MCLR

2.4

Master Clear (MCLR) Pin

R

The MCLR pin provides for two specific device

functions:

R1

• Device Reset

C

• Device programming and debugging

PIC24H

During device programming and debugging, the

resistance and capacitance that can be added to the

pin must be considered. Device programmers and

debuggers drive the MCLR pin. Consequently,

specific voltage levels (VIH and VIL) and fast signal

transitions must not be adversely affected. Therefore,

specific values of R and C will need to be adjusted

based on the application and PCB requirements.

VDD

VSS

VDD

VSS

0.1 µF

Ceramic

0.1 µF

Ceramic

0.1 µF

Ceramic

0.1 µF

Ceramic

(1)

L1

For example, as shown in Figure 2-2, it is

recommended that the capacitor C, be isolated from

the MCLR pin during programming and debugging

operations.

Note 1: As an option, instead of a hard-wired connection, an

inductor (L1) can be substituted between VDD and

AVDD to improve ADC noise rejection. The inductor

impedance should be less than 1 and the inductor

capacity greater than 10 mA.

Place the components shown in Figure 2-2 within

one-quarter inch (6 mm) from the MCLR pin.

Where:

FCNV

f =

-------------

2

(i.e., ADC conversion rate/2)

FIGURE 2-2:

EXAMPLE OF MCLR PIN

CONNECTIONS

1

-----------------------

2 LC

VDD

²

1



L = ---------------------





(1)

2f C

R

(2)

R1

MCLR

2.2.1

TANK CAPACITORS

PIC24H

JP

C

On boards with power traces running longer than six

inches in length, it is suggested to use a tank capacitor

for integrated circuits including MCUs to supply a local

power source. The value of the tank capacitor should

be determined based on the trace resistance that con-

nects the power supply source to the device, and the

maximum current drawn by the device in the applica-

tion. In other words, select the tank capacitor so that it

meets the acceptable voltage sag at the device. Typical

values range from 4.7 µF to 47 µF.

Note 1: R  10 k is recommended. A suggested

starting value is 10 k. Ensure that the MCLR

pin VIH and VIL specifications are met.

2: R1  470 will limit any current flowing into

MCLR from the external capacitor C, in the

event of MCLR pin breakdown, due to

Electrostatic Discharge (ESD) or Electrical

Overstress (EOS). Ensure that the MCLR pin

VIH and VIL specifications are met.

2.3

CPU Logic Filter Capacitor

Connection (VCAP)

A low-ESR (< 5 Ohms) capacitor is required on the

VCAP pin, which is used to stabilize the voltage

regulator output voltage. The VCAP pin must not be

connected to VDD, and must have a capacitor between

4.7 µF and 10 µF, 16V connected to ground. The type

can be ceramic or tantalum. Refer to Section 24.0

“Electrical

Characteristics”

for

additional

information.

DS70592D-page 20

 2009-2012 Microchip Technology Inc.

PIC24HJXXXGPX06A/X08A/X10A

2.5

ICSP Pins

2.6

External Oscillator Pins

The PGECx and PGEDx pins are used for In-Circuit

Serial Programming™ (ICSP™) and debugging pur-

poses. It is recommended to keep the trace length

between the ICSP connector and the ICSP pins on the

device as short as possible. If the ICSP connector is

expected to experience an ESD event, a series resistor

is recommended, with the value in the range of a few

tens of Ohms, not to exceed 100 Ohms.

Many MCUs have options for at least two oscillators: a

high-frequency primary oscillator and a low-frequency

secondary oscillator (refer to Section 9.0 “Oscillator

Configuration” for details).

The oscillator circuit should be placed on the same

side of the board as the device. Also, place the

oscillator circuit close to the respective oscillator pins,

not exceeding one-half inch (12 mm) distance

between them. The load capacitors should be placed

next to the oscillator itself, on the same side of the

board. Use a grounded copper pour around the

oscillator circuit to isolate them from surrounding

circuits. The grounded copper pour should be routed

directly to the MCU ground. Do not run any signal

traces or power traces inside the ground pour. Also, if

using a two-sided board, avoid any traces on the

other side of the board where the crystal is placed. A

suggested layout is shown in Figure 2-3.

Pull-up resistors, series diodes, and capacitors on the

PGECx and PGEDx pins are not recommended as they

will interfere with the programmer/debugger communi-

cations to the device. If such discrete components are

an application requirement, they should be removed

from the circuit during programming and debugging.

Alternatively, refer to the AC/DC characteristics and

timing

requirements

information

in

the

“dsPIC33F/PIC24H Flash Programming Specification”

(DS70152) for information on capacitive loading limits

and pin input voltage high (VIH) and input low (VIL)

requirements.

FIGURE 2-3:

SUGGESTED PLACEMENT

OF THE OSCILLATOR

CIRCUIT

Ensure that the “Communication Channel Select” (i.e.,

PGECx/PGEDx pins) programmed into the device

matches the physical connections for the ICSP to

MPLAB^®ICD 3 or MPLAB REAL ICE™.

Main Oscillator

Guard Ring

For more information on ICD 3 and REAL ICE

connection requirements, refer to the following

documents that are available on the Microchip web

site.

• “Using MPLAB^®ICD 3 In-Circuit Debugger”

(poster) DS51765

• “MPLAB^®ICD 3 Design Advisory” DS51764

13

14

15

16

17

18

Guard Trace

Secondary

Oscillator

• “MPLAB^®REAL ICE™ In-Circuit Emulator User’s

Guide” DS51616

• “Using MPLAB^®REAL ICE™” (poster) DS51749

19

20

 2009-2012 Microchip Technology Inc.

DS70592D-page 21

PIC24HJXXXGPX06A/X08A/X10A

2.7

Oscillator Value Conditions on

Device Start-up

If the PLL of the target device is enabled and

configured for the device start-up oscillator, the

maximum oscillator source frequency must be limited

to  8 MHz for start-up with PLL enabled to comply with

device PLL start-up conditions. This means that if the

external oscillator frequency is outside this range, the

application must start-up in the FRC mode first. The

default PLL settings after a POR with an oscillator

frequency outside this range will violate the device

operating speed.

Once the device powers up, the application firmware

can initialize the PLL SFRs, CLKDIV and PLLDBF to a

suitable value, and then perform a clock switch to the

Oscillator + PLL clock source. Note that clock switching

must be enabled in the device Configuration word.

2.8

Configuration of Analog and

Digital Pins During ICSP

Operations

If MPLAB ICD 3 or REAL ICE is selected as a debug-

ger, it automatically initializes all of the A/D input pins

(ANx) as “digital” pins, by setting all bits in the

AD1PCFGL register.

The bits in this register that correspond to the A/D pins

that are initialized by MPLAB ICD 3 or REAL ICE, must

not be cleared by the user application firmware;

otherwise, communication errors will result between

the debugger and the device.

If your application needs to use certain A/D pins as

analog input pins during the debug session, the user

application must clear the corresponding bits in the

AD1PCFGL register during initialization of the ADC

module.

When MPLAB ICD 3 or REAL ICE is used as a

programmer, the user application firmware must

correctly configure the AD1PCFGL register. Automatic

initialization of this register is only done during

debugger operation. Failure to correctly configure the

register(s) will result in all A/D pins being recognized as

analog input pins, resulting in the port value being read

as a logic ‘0’, which may affect user application

functionality.

2.9

Unused I/Os

Unused I/O pins should be configured as outputs and

driven to a logic-low state.

Alternatively, connect a 1k to 10k resistor between VSS

and the unused pins.

DS70592D-page 22

 2009-2012 Microchip Technology Inc.

PIC24HJXXXGPX06A/X08A/X10A

3.1

Data Addressing Overview

3.0

CPU

The data space can be linearly addressed as 32K words

or 64 Kbytes using an Address Generation Unit (AGU).

The upper 32 Kbytes of the data space memory map can

optionally be mapped into program space at any 16K pro-

gram word boundary defined by the 8-bit Program Space

Visibility Page (PSVPAG) register. The program to data

space mapping feature lets any instruction access pro-

gram space as if it were data space.

Note 1: This data sheet summarizes the features

of the PIC24HJXXXGPX06A/X08A/X10A

family of devices. However, it is not

intended to be

a

comprehensive

reference source. To complement the

information in this data sheet, refer to

Section 2. “CPU” (DS70204) of the

“dsPIC33F/PIC24H Family Reference

Manual”, which is available from the

Microchip web site (www.microchip.com).

The data space also includes 2 Kbytes of DMA RAM,

which is primarily used for DMA data transfers, but may

be used as general purpose RAM.

2: Some registers and associated bits

described in this section may not be

available on all devices. Refer to

Section 4.0 “Memory Organization” in

this data sheet for device-specific register

and bit information.

3.2

Special MCU Features

The PIC24HJXXXGPX06A/X08A/X10A features

a

17-bit by 17-bit, single-cycle multiplier. The multiplier

can perform signed, unsigned and mixed-sign

multiplication. Using a 17-bit by 17-bit multiplier for

16-bit by 16-bit multiplication makes mixed-sign

multiplication possible.

The PIC24HJXXXGPX06A/X08A/X10A CPU module

has a 16-bit (data) modified Harvard architecture with an

enhanced instruction set and addressing modes. The

CPU has a 24-bit instruction word with a variable length

opcode field. The Program Counter (PC) is 23 bits wide

and addresses up to 4M x 24 bits of user program

memory space. The actual amount of program memory

implemented varies by device. A single-cycle instruction

prefetch mechanism is used to help maintain throughput

and provides predictable execution. All instructions

execute in a single cycle, with the exception of

instructions that change the program flow, the double

word move (MOV.D) instruction and the table instructions.

Overhead-free, single-cycle program loop constructs are

supported using the REPEAT instruction, which is

interruptible at any point.

The PIC24HJXXXGPX06A/X08A/X10A supports 16/16

and 32/16 integer divide operations. All divide

instructions are iterative operations. They must be

executed within a REPEAT loop, resulting in a total

execution time of 19 instruction cycles. The divide

operation can be interrupted during any of those

19 cycles without loss of data.

A multi-bit data shifter is used to perform up to a 16-bit,

left or right shift in a single cycle.

The PIC24HJXXXGPX06A/X08A/X10A devices have

sixteen, 16-bit working registers in the programmer’s

model. Each of the working registers can serve as a data,

address or address offset register. The 16th working

register (W15) operates as a software Stack Pointer (SP)

for interrupts and calls.

The PIC24HJXXXGPX06A/X08A/X10A instruction set

includes many addressing modes and is designed for

optimum C compiler efficiency. For most instructions,

the PIC24HJXXXGPX06A/X08A/X10A is capable of

executing a data (or program data) memory read, a

working register (data) read, a data memory write and

a program (instruction) memory read per instruction

cycle. As a result, three parameter instructions can be

supported, allowing A + B = C operations to be

executed in a single cycle.

A block diagram of the CPU is shown in Figure 3-1,

and

the

programmer’s

model

for

the

PIC24HJXXXGPX06A/X08A/X10A is shown in

Figure 3-2.

 2009-2012 Microchip Technology Inc.

DS70592D-page 23

PIC24HJXXXGPX06A/X08A/X10A

FIGURE 3-1:

PIC24HJXXXGPX06A/X08A/X10A CPU CORE BLOCK DIAGRAM

PSV and Table

Data Access

Control Block

X Data Bus

Interrupt

Controller

16

8

Data Latch

X RAM

DMA

RAM

23

16

PCH PCL

Program Counter

PCU

23

Address

Latch

Stack

Control

Logic

Loop

Control

Logic

23

16

DMA

Controller

Address Generator Units

Address Latch

Program Memory

Data Latch

EA MUX

ROM Latch

24

16

Instruction

Decode and

Control

Instruction Reg

16

17 x 17

Multiplier

Control Signals

to Various Blocks

16 x 16

W Register Array

Divide Support

16

16-bit ALU

16

To Peripheral Modules

DS70592D-page 24

 2009-2012 Microchip Technology Inc.

PIC24HJXXXGPX06A/X08A/X10A

FIGURE 3-2:

PIC24HJXXXGPX06A/X08A/X10A PROGRAMMER’S MODEL

D15

D0

W0/WREG

W1

PUSH.SShadow

DOShadow

W2

W3

Legend

W4

W5

W6

W7

Working Registers

W8

W9

W10

W11

W12

W13

W14/Frame Pointer

W15/Stack Pointer

SPLIM

Stack Pointer Limit Register

Program Counter

PC22

PC0

0

7

TBLPAG

Data Table Page Address

7

0

PSVPAG

Program Space Visibility Page Address

15

0

RCOUNT

REPEATLoop Counter

15

Core Configuration Register

CORCON

—

DC

N

Z

C

IPL2 IPL1 IPL0 RA

SRL

OV

STATUS Register

SRH

 2009-2012 Microchip Technology Inc.

DS70592D-page 25

PIC24HJXXXGPX06A/X08A/X10A

3.3

CPU Control Registers

REGISTER 3-1:

SR: CPU STATUS REGISTER

U-0

—

U-0

—

U-0

—

U-0

—

U-0

—

U-0

—

U-0

—

R/W-0

DC

bit 15

bit 8

R/W-0⁽¹⁾

R/W-0⁽²⁾

IPL<2:0>⁽²⁾

R/W-0⁽²⁾

R-0

RA

R/W-0

N

R/W-0

OV

R/W-0

Z

R/W-0

C

bit 7

bit 0

Legend:

C = Clear only bit

S = Set only bit

‘1’ = Bit is set

R = Readable bit

W = Writable bit

‘0’ = Bit is cleared

U = Unimplemented bit, read as ‘0’

-n = Value at POR

x = Bit is unknown

bit 15-9

bit 8

Unimplemented: Read as ‘0’

DC: MCU ALU Half Carry/Borrow bit

1= A carry-out from the 4th low-order bit (for byte sized data) or 8th low-order bit (for word sized data)

of the result occurred

0= No carry-out from the 4th low-order bit (for byte sized data) or 8th low-order bit (for word sized

data) of the result occurred

bit 7-5

IPL<2:0>: CPU Interrupt Priority Level Status bits⁽²⁾

111= CPU Interrupt Priority Level is 7 (15), user interrupts disabled

110= CPU Interrupt Priority Level is 6 (14)

101= CPU Interrupt Priority Level is 5 (13)

100= CPU Interrupt Priority Level is 4 (12)

011= CPU Interrupt Priority Level is 3 (11)

010= CPU Interrupt Priority Level is 2 (10)

001= CPU Interrupt Priority Level is 1 (9)

000= CPU Interrupt Priority Level is 0 (8)

bit 4

bit 3

bit 2

RA: REPEATLoop Active bit

1= REPEATloop in progress

0= REPEATloop not in progress

N: MCU ALU Negative bit

1= Result was negative

0= Result was non-negative (zero or positive)

OV: MCU ALU Overflow bit

This bit is used for signed arithmetic (2’s complement). It indicates an overflow of the magnitude which

causes the sign bit to change state.

1= Overflow occurred for signed arithmetic (in this arithmetic operation)

0= No overflow occurred

bit 1

bit 0

Z: MCU ALU Zero bit

1= An operation which affects the Z bit has set it at some time in the past

0= The most recent operation which affects the Z bit has cleared it (i.e., a non-zero result)

C: MCU ALU Carry/Borrow bit

1= A carry-out from the Most Significant bit (MSb) of the result occurred

0= No carry-out from the Most Significant bit of the result occurred

Note 1: The IPL<2:0> bits are concatenated with the IPL<3> bit (CORCON<3>) to form the CPU Interrupt Priority

Level. The value in parentheses indicates the IPL if IPL<3> = 1. User interrupts are disabled when

IPL<3> = 1.

2: The IPL<2:0> Status bits are read only when NSTDIS = 1(INTCON1<15>).

DS70592D-page 26

 2009-2012 Microchip Technology Inc.

PIC24HJXXXGPX06A/X08A/X10A

REGISTER 3-2:

CORCON: CORE CONTROL REGISTER

U-0

—

U-0

—

U-0

—

U-0

—

U-0

—

U-0

—

U-0

—

U-0

—

bit 15

bit 8

bit 0

U-0

—

U-0

—

U-0

—

U-0

—

R/C-0

IPL3⁽¹⁾

R/W-0

PSV

U-0

—

U-0

—

bit 7

Legend:

C = Clear only bit

W = Writable bit

‘x = Bit is unknown

R = Readable bit

0’ = Bit is cleared

-n = Value at POR

‘1’ = Bit is set

U = Unimplemented bit, read as ‘0’

bit 15-4

bit 3

Unimplemented: Read as ‘0’

IPL3: CPU Interrupt Priority Level Status bit 3⁽¹⁾

1= CPU interrupt priority level is greater than 7

0= CPU interrupt priority level is 7 or less

bit 2

PSV: Program Space Visibility in Data Space Enable bit

1= Program space visible in data space

0= Program space not visible in data space

bit 1-0

Unimplemented: Read as ‘0’

Note 1: The IPL3 bit is concatenated with the IPL<2:0> bits (SR<7:5>) to form the CPU interrupt priority level.

 2009-2012 Microchip Technology Inc.

DS70592D-page 27

PIC24HJXXXGPX06A/X08A/X10A

3.4.2

DIVIDER

3.4

Arithmetic Logic Unit (ALU)

The divide block supports 32-bit/16-bit and 16-bit/16-bit

signed and unsigned integer divide operations with the

following data sizes:

The PIC24HJXXXGPX06A/X08A/X10A ALU is 16 bits

wide and is capable of addition, subtraction, bit shifts

and logic operations. Unless otherwise mentioned,

arithmetic operations are 2’s complement in nature.

Depending on the operation, the ALU may affect the

values of the Carry (C), Zero (Z), Negative (N),

Overflow (OV) and Digit Carry (DC) Status bits in the

SR register. The C and DC Status bits operate as

Borrow and Digit Borrow bits, respectively, for

subtraction operations.

• 32-bit signed/16-bit signed divide

• 32-bit unsigned/16-bit unsigned divide

• 16-bit signed/16-bit signed divide

• 16-bit unsigned/16-bit unsigned divide

The quotient for all divide instructions ends up in W0

and the remainder in W1. Sixteen-bit signed and

unsigned DIV instructions can specify any W register

for both the 16-bit divisor (Wn) and any W register

(aligned) pair (W(m + 1):Wm) for the 32-bit dividend.

The divide algorithm takes one cycle per bit of divisor,

so both 32-bit/16-bit and 16-bit/16-bit instructions take

the same number of cycles to execute.

The ALU can perform 8-bit or 16-bit operations,

depending on the mode of the instruction that is used.

Data for the ALU operation can come from the W reg-

ister array, or data memory, depending on the address-

ing mode of the instruction. Likewise, output data from

the ALU can be written to the W register array or a data

memory location.

3.4.3

MULTI-BIT DATA SHIFTER

Refer to the “16-bit MCU and DSC Programmer’s

Reference Manual” (DS70157) for information on the

SR bits affected by each instruction.

The multi-bit data shifter is capable of performing up to

16-bit arithmetic or logic right shifts, or up to 16-bit left

shifts in a single cycle. The source can be either a

working register or a memory location.

The

PIC24HJXXXGPX06A/X08A/X10A

CPU

incorporates hardware support for both multiplication

and division. This includes a dedicated hardware

multiplier and support hardware for 16-bit divisor

division.

The shifter requires a signed binary value to determine

both the magnitude (number of bits) and direction of the

shift operation. A positive value shifts the operand right.

A negative value shifts the operand left. A value of ‘0’

does not modify the operand.

3.4.1

MULTIPLIER

Using the high-speed 17-bit x 17-bit multiplier, the ALU

supports unsigned, signed or mixed-sign operation in

several multiplication modes:

• 16-bit x 16-bit signed

• 16-bit x 16-bit unsigned

• 16-bit signed x 5-bit (literal) unsigned

• 16-bit unsigned x 16-bit unsigned

• 16-bit unsigned x 5-bit (literal) unsigned

• 16-bit unsigned x 16-bit signed

• 8-bit unsigned x 8-bit unsigned

DS70592D-page 28

 2009-2012 Microchip Technology Inc.

PIC24HJXXXGPX06A/X08A/X10A

4.1

Program Address Space

4.0

MEMORY ORGANIZATION

The program address memory space of the

PIC24HJXXXGPX06A/X08A/X10A devices is 4M

instructions. The space is addressable by a 24-bit value

derived from either the 23-bit Program Counter (PC)

during program execution, or from table operation or

data space remapping as described in Section 4.4

“Interfacing Program and Data Memory Spaces”.

Note:

This data sheet summarizes the features

of the PIC24HJXXXGPX06A/X08A/X10A

family of devices. However, it is not

intended to be a comprehensive refer-

ence source. To complement the informa-

tion in this data sheet, refer to Section 3.

“Data Memory” (DS70202) of the

“dsPIC33F/PIC24H Family Reference

Manual”, which is available from the

Microchip web site (www.microchip.com).

User access to the program memory space is restricted

to the lower half of the address range (0x000000 to

0x7FFFFF). The exception is the use of TBLRD/TBLWT

operations, which use TBLPAG<7> to permit access to

the Configuration bits and Device ID sections of the

configuration memory space.

The PIC24HJXXXGPX06A/X08A/X10A architecture

features separate program and data memory spaces

and buses. This architecture also allows the direct

access of program memory from the data space during

code execution.

Memory maps for the PIC24HJXXXGPX06A/X08A/

X10A family of devices are shown in Figure 4-1.

FIGURE 4-1:

PROGRAM MEMORY MAP FOR PIC24HJXXXGPX06A/X08A/X10A FAMILY DEVICES

PIC24HJ64XXXXXA

PIC24HJ128XXXXXA

PIC24HJ256XXXXXA

0x000000

0x000002

0x000004

GOTOInstruction

Reset Address

GOTOInstruction

Reset Address

GOTOInstruction

Reset Address

Interrupt Vector Table

Reserved

Interrupt Vector Table

Reserved

Interrupt Vector Table

Reserved

0x0000FE

0x000100

0x000104

0x0001FE

0x000200

Alternate Vector Table

User Program

Flash Memory

(22K instructions)

User Program

Flash Memory

(44K instructions)

User Program

Flash Memory

(88K instructions)

0x00ABFE

0x00AC00

0x0157FE

0x015800

Unimplemented

(Read ‘0’s)

0x02ABFE

0x02AC00

(Read ‘0’s)

Unimplemented

(Read ‘0’s)

0x7FFFFE

0x800000

Reserved

0xF7FFFE

0xF80000

Device Configuration

Registers

Device Configuration

Registers

Device Configuration

Registers

0xF80017

0xF80010

Reserved

DEVID (2)

Reserved

DEVID (2)

Reserved

DEVID (2)

0xFEFFFE

0xFF0000

0xFFFFFE

 2009-2012 Microchip Technology Inc.

DS70592D-page 29

PIC24HJXXXGPX06A/X08A/X10A

4.1.1

PROGRAM MEMORY

ORGANIZATION

4.1.2

INTERRUPT AND TRAP VECTORS

All PIC24HJXXXGPX06A/X08A/X10A devices reserve

the addresses between 0x00000 and 0x000200 for

hard-coded program execution vectors. A hardware

Reset vector is provided to redirect code execution

from the default value of the PC on device Reset to the

actual start of code. A GOTOinstruction is programmed

by the user at 0x000000, with the actual address for the

start of code at 0x000002.

The program memory space is organized in word-

addressable blocks. Although it is treated as 24 bits

wide, it is more appropriate to think of each address of

the program memory as a lower and upper word, with

the upper byte of the upper word being unimplemented.

The lower word always has an even address, while the

upper word has an odd address (Figure 4-2).

PIC24HJXXXGPX06A/X08A/X10A devices also have

two interrupt vector tables, located from 0x000004 to

0x0000FF and 0x000100 to 0x0001FF. These vector

tables allow each of the many device interrupt sources

to be handled by separate Interrupt Service Routines

(ISRs). A more detailed discussion of the interrupt vec-

tor tables is provided in Section 7.1 “Interrupt Vector

Table”.

Program memory addresses are always word-aligned

on the lower word, and addresses are incremented or

decremented by two during code execution. This

arrangement also provides compatibility with data

memory space addressing and makes it possible to

access data in the program memory space.

FIGURE 4-2:

PROGRAM MEMORY ORGANIZATION

least significant word

PC Address

most significant word

23

msw

Address

(lsw Address)

16

8

0

0x000001

0x000003

0x000005

0x000007

0x000000

0x000002

0x000004

0x000006

00000000

Program Memory

‘Phantom’ Byte

(read as ‘0’)

Instruction Width

DS70592D-page 30

 2009-2012 Microchip Technology Inc.

PIC24HJXXXGPX06A/X08A/X10A

All word accesses must be aligned to an even address.

4.2

Data Address Space

Misaligned word data fetches are not supported, so

care must be taken when mixing byte and word opera-

tions, or translating from 8-bit MCU code. If a mis-

aligned read or write is attempted, an address error

trap is generated. If the error occurred on a read, the

instruction underway is completed; if it occurred on a

write, the instruction will be executed but the write does

not occur. In either case, a trap is then executed, allow-

ing the system and/or user to examine the machine

state prior to execution of the address Fault.

The PIC24HJXXXGPX06A/X08A/X10A CPU has a

separate 16-bit wide data memory space. The data

space is accessed using separate Address Generation

Units (AGUs) for read and write operations. Data mem-

ory maps of devices with different RAM sizes are

shown in Figure 4-3 and Figure 4-4.

All Effective Addresses (EAs) in the data memory space

are 16 bits wide and point to bytes within the data space.

This arrangement gives a data space address range of

64 Kbytes or 32K words. The lower half of the data

memory space (that is, when EA<15> = 0) is used for

implemented memory addresses, while the upper half

(EA<15> = 1) is reserved for the Program Space

Visibility area (see Section 4.4.3 “Reading Data from

Program Memory Using Program Space Visibility”).

All byte loads into any W register are loaded into the

Least Significant Byte. The Most Significant Byte

(MSB) is not modified.

A sign-extend instruction (SE) is provided to allow

users to translate 8-bit signed data to 16-bit signed

values. Alternatively, for 16-bit unsigned data, users

can clear the Most Significant Byte of any W register by

executing a zero-extend (ZE) instruction on the

appropriate address.

PIC24HJXXXGPX06A/X08A/X10A devices implement

up to 16 Kbytes of data memory. Should an EA point to

a location outside of this area, an all-zero word or byte

will be returned.

4.2.3

SFR SPACE

4.2.1

DATA SPACE WIDTH

The first 2 Kbytes of the Near Data Space, from 0x0000

to 0x07FF, is primarily occupied by Special Function

Registers (SFRs). These are used by the

PIC24HJXXXGPX06A/X08A/X10A core and peripheral

modules for controlling the operation of the device.

The data memory space is organized in byte address-

able, 16-bit wide blocks. Data is aligned in data

memory and registers as 16-bit words, but all data

space EAs resolve to bytes. The Least Significant

Bytes of each word have even addresses, while the

Most Significant Bytes have odd addresses.

SFRs are distributed among the modules that they

control, and are generally grouped together by module.

Much of the SFR space contains unused addresses;

these are read as ‘0’. A complete listing of implemented

SFRs, including their addresses, is shown in Table 4-1

through Table 4-33.

4.2.2

DATA MEMORY ORGANIZATION

AND ALIGNMENT

To maintain backward compatibility with PIC^®MCU

devices and improve data space memory usage

efficiency, the PIC24HJXXXGPX06A/X08A/X10A

instruction set supports both word and byte operations.

As a consequence of byte accessibility, all effective

address calculations are internally scaled to step

through word-aligned memory. For example, the core

recognizes that Post-Modified Register Indirect

Addressing mode [Ws++] will result in a value of Ws +

1 for byte operations and Ws + 2 for word operations.

Note:

The actual set of peripheral features and

interrupts varies by the device. Please

refer to the corresponding device tables

and pinout diagrams for device-specific

information.

4.2.4

NEAR DATA SPACE

The 8-Kbyte area between 0x0000 and 0x1FFF is

referred to as the Near Data Space. Locations in this

space are directly addressable via a 13-bit absolute

address field within all memory direct instructions.

Additionally, the whole data space is addressable using

MOV instructions, which support Memory Direct

Addressing mode with a 16-bit address field, or by

using Indirect Addressing mode using a working

register as an Address Pointer.

Data byte reads will read the complete word that

contains the byte, using the Least Significant bit (LSb)

of any EA to determine which byte to select. The

selected byte is placed onto the Least Significant Byte

(LSB) of the data path. That is, data memory and reg-

isters are organized as two parallel byte-wide entities

with shared (word) address decode but separate write

lines. Data byte writes only write to the corresponding

side of the array or register which matches the byte

address.

 2009-2012 Microchip Technology Inc.

DS70592D-page 31

PIC24HJXXXGPX06A/X08A/X10A

FIGURE 4-3:

DATA MEMORY MAP FOR PIC24HJXXXGPX06A/X08A/X10A DEVICES WITH 8 KB

RAM

MSB

Address

LSB

Address

16 bits

MSB

LSB

0x0000

0x0001

2 Kbyte

SFR Space

0x07FE

0x0800

0x07FF

0x0801

8 Kbyte

Near

Data

Space

X Data RAM (X)

8 Kbyte

SRAM Space

0x1FFF

0x2001

0x1FFE

0x2000

DMA RAM

0x27FF

0x2801

0x27FE

0x2800

0x8001

0x8000

X Data

Optionally

Mapped

Unimplemented (X)

into Program

Memory

0xFFFF

0xFFFE

DS70592D-page 32

 2009-2012 Microchip Technology Inc.

PIC24HJXXXGPX06A/X08A/X10A

FIGURE 4-4:

DATA MEMORY MAP FOR PIC24HJXXXGPX06A/X08A/X10A DEVICES WITH 16 KB RAM

LSB

Address

MSB

Address

16 bits

MSB

LSB

0x0000

0x0001

2 Kbyte

SFR Space

8 Kbyte

Near

Data

0x07FE

0x0800

0x07FF

0x0801

Space

0x1FFF

0x1FFE

X Data RAM (X)

16 Kbyte

SRAM Space

0x3FFF

0x4001

0x3FFE

0x4000

DMA RAM

0x47FF

0x4801

0x47FE

0x4800

0x8001

0x8000

X Data

Unimplemented (X)

Optionally

Mapped

into Program

Memory

0xFFFF

0xFFFE

transferred from various peripherals using DMA. The

DMA RAM can be accessed by the DMA controller

without having to steal cycles from the CPU.

4.2.5

Every

DMA RAM

PIC24HJXXXGPX06A/X08A/X10A

device

contains 2 Kbytes of dual ported DMA RAM located at

the end of data space. Memory locations in the DMA

RAM space are accessible simultaneously by the CPU

and the DMA controller module. DMA RAM is utilized by

the DMA controller to store data to be transferred to

various peripherals using DMA, as well as data

When the CPU and the DMA controller attempt to

concurrently write to the same DMA RAM location, the

hardware ensures that the CPU is given precedence in

accessing the DMA RAM location. Therefore, the DMA

RAM provides a reliable means of transferring DMA

data without ever having to stall the CPU.

Note:

DMA RAM can be used for general

purpose data storage if the DMA function

is not required in an application.

 2009-2012 Microchip Technology Inc.

DS70592D-page 33

PIC24HJXXXGPX06A/X08A/X10A

4.2.6

SOFTWARE STACK

4.2.7

DATA RAM PROTECTION FEATURE

The PIC24H product family supports Data RAM protec-

tion features that enable segments of RAM to be

protected when used in conjunction with Boot and

Secure Code Segment Security. BSRAM (Secure RAM

segment for BS) is accessible only from the Boot Seg-

ment Flash code, when enabled. SSRAM (Secure

RAM segment for RAM) is accessible only from the

Secure Segment Flash code, when enabled. See

Table 4-1 for an overview of the BSRAM and SSRAM

SFRs.

In addition to its use as a working register, the W15

register in the PIC24HJXXXGPX06A/X08A/X10A

devices is also used as a software Stack Pointer. The

Stack Pointer always points to the first available free

word and grows from lower to higher addresses. It pre-

decrements for stack pops and post-increments for

stack pushes, as shown in Figure 4-5. For a PC push

during any CALLinstruction, the MSB of the PC is zero-

extended before the push, ensuring that the MSB is

always clear.

Note:

A PC push during exception processing

concatenates the SRL register to the MSB

of the PC prior to the push.

4.3

Instruction Addressing Modes

The addressing modes in Table 4-34 form the basis of

the addressing modes optimized to support the specific

features of individual instructions. The addressing

modes provided in the MAC class of instructions are

somewhat different from those in the other instruction

types.

The Stack Pointer Limit register (SPLIM) associated

with the Stack Pointer sets an upper address boundary

for the stack. SPLIM is uninitialized at Reset. As is the

case for the Stack Pointer, SPLIM<0> is forced to ‘0’

because all stack operations must be word-aligned.

Whenever an EA is generated using W15 as a source

or destination pointer, the resulting address is

compared with the value in SPLIM. If the contents of

the Stack Pointer (W15) and the SPLIM register are

equal and a push operation is performed, a stack error

trap will not occur. The stack error trap will occur on a

subsequent push operation. Thus, for example, if it is

desirable to cause a stack error trap when the stack

grows beyond address 0x2000 in RAM, initialize the

SPLIM with the value 0x1FFE.

4.3.1

FILE REGISTER INSTRUCTIONS

Most file register instructions use a 13-bit address field

(f) to directly address data present in the first 8192

bytes of data memory (Near Data Space). Most file

register instructions employ a working register, W0,

which is denoted as WREG in these instructions. The

destination is typically either the same file register or

WREG (with the exception of the MUL instruction),

which writes the result to a register or register pair. The

MOV instruction allows additional flexibility and can

access the entire data space.

Similarly, a Stack Pointer underflow (stack error) trap is

generated when the Stack Pointer address is found to

be less than 0x0800. This prevents the stack from

interfering with the Special Function Register (SFR)

space.

4.3.2

MCU INSTRUCTIONS

The 3-operand MCU instructions are of the form:

Operand 3 = Operand 1 <function> Operand 2

where:

A write to the SPLIM register should not be immediately

followed by an indirect read operation using W15.

Operand 1 is always a working register (i.e., the

addressing mode can only be Register Direct) which is

referred to as Wb.

FIGURE 4-5:

CALL STACK FRAME

0x0000

15

0

Operand 2 can be a W register, fetched from data

memory, or a 5-bit literal. The result location can be

either a W register or a data memory location. The fol-

lowing addressing modes are supported by MCU

instructions:

PC<15:0>

000000000

W15 (before CALL)

• Register Direct

PC<22:16>

• Register Indirect

W15 (after CALL)

• Register Indirect Post-Modified

• Register Indirect Pre-Modified

• 5-bit or 10-bit Literal

POP : [--W15]

PUSH: [W15++]

Note:

Not all instructions support all the

addressing modes given above.

Individual instructions may support

different subsets of these addressing

modes.

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TABLE 4-34: FUNDAMENTAL ADDRESSING MODES SUPPORTED

Addressing Mode

File Register Direct

Description

The address of the file register is specified explicitly.

The contents of a register are accessed directly.

The contents of Wn forms the EA.

Register Direct

Register Indirect

Register Indirect Post-Modified

The contents of Wn forms the EA. Wn is post-modified (incremented or

decremented) by a constant value.

Register Indirect Pre-Modified

Wn is pre-modified (incremented or decremented) by a signed constant value

to form the EA.

Register Indirect with Register Offset The sum of Wn and Wb forms the EA.

Register Indirect with Literal Offset The sum of Wn and a literal forms the EA.

4.3.3

MOVE INSTRUCTIONS

4.4

Interfacing Program and Data

Memory Spaces

Move instructions provide a greater degree of address-

ing flexibility than other instructions. In addition to the

Addressing modes supported by most MCU instruc-

tions, move instructions also support Register Indirect

with Register Offset Addressing mode, also referred to

as Register Indexed mode.

The PIC24HJXXXGPX06A/X08A/X10A architecture

uses a 24-bit wide program space and a 16-bit wide

data space. The architecture is also a modified Harvard

scheme, meaning that data can also be present in the

program space. To use this data successfully, it must

be accessed in a way that preserves the alignment of

information in both spaces.

Note:

For the MOV instructions, the Addressing

mode specified in the instruction can differ

for the source and destination EA.

However, the 4-bit Wb (Register Offset)

field is shared between both source and

destination (but typically only used by

one).

Aside

from

normal

execution,

the

PIC24HJXXXGPX06A/X08A/X10A architecture pro-

vides two methods by which program space can be

accessed during operation:

• Using table instructions to access individual bytes

or words anywhere in the program space

In summary, the following Addressing modes are

supported by move instructions:

• Remapping a portion of the program space into

the data space (Program Space Visibility)

• Register Direct

• Register Indirect

Table instructions allow an application to read or write

to small areas of the program memory. This capability

makes the method ideal for accessing data tables that

need to be updated from time to time. It also allows

access to all bytes of the program word. The remap-

ping method allows an application to access a large

block of data on a read-only basis, which is ideal for

look ups from a large table of static data. It can only

access the least significant word of the program word.

• Register Indirect Post-modified

• Register Indirect Pre-modified

• Register Indirect with Register Offset (Indexed)

• Register Indirect with Literal Offset

• 8-bit Literal

• 16-bit Literal

Note:

Not all instructions support all the

Addressing modes given above.

4.4.1

ADDRESSING PROGRAM SPACE

Individual instructions may support

different subsets of these Addressing

modes.

Since the address ranges for the data and program

spaces are 16 and 24 bits, respectively, a method is

needed to create a 23-bit or 24-bit program address

from 16-bit data registers. The solution depends on the

interface method to be used.

4.3.4

OTHER INSTRUCTIONS

Besides the various addressing modes outlined above,

some instructions use literal constants of various sizes.

For example, BRA (branch) instructions use 16-bit

signed literals to specify the branch destination directly,

whereas the DISI instruction uses a 14-bit unsigned

literal field. In some instructions, the source of an oper-

and or result is implied by the opcode itself. Certain

operations, such as NOP, do not have any operands.

For table operations, the 8-bit Table Page register

(TBLPAG) is used to define a 32K word region within

the program space. This is concatenated with a 16-bit

EA to arrive at a full 24-bit program space address. In

this format, the Most Significant bit of TBLPAG is used

to determine if the operation occurs in the user memory

(TBLPAG<7> = 0) or the configuration memory

(TBLPAG<7> = 1).

DS70592D-page 54

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For remapping operations, the 8-bit Program Space

Table 4-35 and Figure 4-6 show how the program EA is

created for table operations and remapping accesses

from the data EA. Here, P<23:0> refers to a program

space word, whereas D<15:0> refers to a data space

word.

Visibility register (PSVPAG) is used to define a

16K word page in the program space. When the Most

Significant bit of the EA is ‘1’, PSVPAG is concatenated

with the lower 15 bits of the EA to form a 23-bit program

space address. Unlike table operations, this limits

remapping operations strictly to the user memory area.

TABLE 4-35: PROGRAM SPACE ADDRESS CONSTRUCTION

Program Space Address

Access

Space

Access Type

<23>

<22:16>

<15>

<14:1>

<0>

Instruction Access

(Code Execution)

User

0

PC<22:1>

0

0xxx xxxx xxxx xxxx xxxx xxx0

TBLRD/TBLWT

(Byte/Word Read/Write)

TBLPAG<7:0>

0xxx xxxx

Data EA<15:0>

xxxx xxxx xxxx xxxx

Data EA<15:0>

Configuration

TBLPAG<7:0>

1xxx xxxx

xxxx xxxx xxxx xxxx

Program Space Visibility User

(Block Remap/Read)

0

PSVPAG<7:0>

xxxx xxxx

Data EA<14:0>⁽¹⁾

xxx xxxx xxxx xxxx

Note 1: Data EA<15> is always ‘1’ in this case, but is not used in calculating the program space address. Bit 15 of

the address is PSVPAG<0>.

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PIC24HJXXXGPX06A/X08A/X10A

FIGURE 4-6:

DATA ACCESS FROM PROGRAM SPACE ADDRESS GENERATION

Program Counter⁽¹⁾

Program Counter

23 bits

0

1/0

EA

Table Operations⁽²⁾

1/0

TBLPAG

8 bits

16 bits

24 bits

Select

1

0

EA

Program Space Visibility⁽¹⁾

(Remapping)

0

PSVPAG

8 bits

15 bits

23 bits

Byte Select

User/Configuration

Space Select

Note 1: The LSb of program space addresses is always fixed as ‘0’ in order to maintain word

alignment of data in the program and data spaces.

2: Table operations are not required to be word-aligned. Table read operations are permitted

in the configuration memory space.

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2. TBLRDH (Table Read High): In Word mode, it

maps the entire upper word of a program address

(P<23:16>) to a data address. Note that

D<15:8>, the ‘phantom byte’, will always be ‘0’.

4.4.2

DATA ACCESS FROM PROGRAM

MEMORY USING TABLE

INSTRUCTIONS

The TBLRDL and TBLWTL instructions offer a direct

method of reading or writing the lower word of any

address within the program space without going

through data space. The TBLRDHand TBLWTHinstruc-

tions are the only method to read or write the upper

8 bits of a program space word as data.

In Byte mode, it maps the upper or lower byte of

the program word to D<7:0> of the data

address, as above. Note that the data will

always be ‘0’ when the upper ‘phantom’ byte is

selected (Byte Select = 1).

In a similar fashion, two table instructions, TBLWTH

and TBLWTL, are used to write individual bytes or

words to a program space address. The details of

their operation are explained in Section 5.0 “Flash

Program Memory”.

The PC is incremented by two for each successive

24-bit program word. This allows program memory

addresses to directly map to data space addresses.

Program memory can thus be regarded as two 16-bit,

word wide address spaces, residing side by side, each

with the same address range. TBLRDL and TBLWTL

access the space which contains the least significant

data word and TBLRDHand TBLWTHaccess the space

which contains the upper data byte.

For all table operations, the area of program memory

space to be accessed is determined by the Table Page

register (TBLPAG). TBLPAG covers the entire program

memory space of the device, including user and config-

uration spaces. When TBLPAG<7> = 0, the table page

is located in the user memory space. When

TBLPAG<7> = 1, the page is located in configuration

space.

Two table instructions are provided to move byte or

word sized (16-bit) data to and from program space.

Both function as either byte or word operations.

1. TBLRDL (Table Read Low): In Word mode, it

maps the lower word of the program space

location (P<15:0>) to a data address (D<15:0>).

In Byte mode, either the upper or lower byte of

the lower program word is mapped to the lower

byte of a data address. The upper byte is

selected when Byte Select is ‘1’; the lower byte

is selected when it is ‘0’.

FIGURE 4-7:

ACCESSING PROGRAM MEMORY WITH TABLE INSTRUCTIONS

Program Space

TBLPAG

02

23

15

0

0x000000

23

16

8

0

00000000

0x020000

0x030000

00000000

‘Phantom’ Byte

TBLRDH.B(Wn<0> = 0)

TBLRDL.B(Wn<0> = 1)

TBLRDL.B(Wn<0> = 0)

TBLRDL.W

The address for the table operation is determined by the data EA

within the page defined by the TBLPAG register.

Only read operations are shown; write operations are also valid in

the user memory area.

0x800000

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24-bit program word are used to contain the data. The

upper 8 bits of any program space location used as

data should be programmed with ‘1111 1111’ or

‘0000 0000’ to force a NOP. This prevents possible

issues should the area of code ever be accidentally

executed.

4.4.3

READING DATA FROM PROGRAM

MEMORY USING PROGRAM SPACE

VISIBILITY

The upper 32 Kbytes of data space may optionally be

mapped into any 16K word page of the program space.

This option provides transparent access of stored con-

stant data from the data space without the need to use

special instructions (i.e., TBLRDL/H).

Note:

PSV access is temporarily disabled during

table reads/writes.

Program space access through the data space occurs

if the Most Significant bit of the data space EA is ‘1’ and

program space visibility is enabled by setting the PSV

bit in the Core Control register (CORCON<2>). The

location of the program memory space to be mapped

into the data space is determined by the Program

Space Visibility Page register (PSVPAG). This 8-bit

register defines any one of 256 possible pages of

16K words in program space. In effect, PSVPAG func-

tions as the upper 8 bits of the program memory

address, with the 15 bits of the EA functioning as the

lower bits. Note that by incrementing the PC by 2 for

each program memory word, the lower 15 bits of data

space addresses directly map to the lower 15 bits in the

corresponding program space addresses.

For operations that use PSV and are executed outside

a REPEAT loop, the MOV and MOV.D instructions

require one instruction cycle in addition to the specified

execution time. All other instructions require two

instruction cycles in addition to the specified execution

time.

For operations that use PSV, which are executed inside

a REPEAT loop, there will be some instances that

require two instruction cycles in addition to the

specified execution time of the instruction:

• Execution in the first iteration

• Execution in the last iteration

• Execution prior to exiting the loop due to an

interrupt

Data reads to this area add an additional cycle to the

instruction being executed, since two program memory

fetches are required.

• Execution upon re-entering the loop after an

interrupt is serviced

Any other iteration of the REPEAT loop will allow the

instruction accessing data, using PSV, to execute in a

single cycle.

Although each data space address, 0x8000 and higher,

maps directly into a corresponding program memory

address (see Figure 4-8), only the lower 16 bits of the

FIGURE 4-8:

PROGRAM SPACE VISIBILITY OPERATION

When CORCON<2> = 1and EA<15> = 1:

Program Space

Data Space

PSVPAG

02

23

15

0

0x000000

0x0000

Data EA<14:0>

0x010000

0x018000

The data in the page

designated by

PSVPAG is mapped

into the upper half of

the data memory

space...

0x8000

PSV Area

...while the lower 15 bits

of the EA specify an

exact address within

the PSV area. This

corresponds exactly to

the same lower 15 bits

of the actual program

space address.

0xFFFF

0x800000

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lines for power (VDD), ground (VSS) and Master Clear

5.0

FLASH PROGRAM MEMORY

(MCLR). This allows customers to manufacture boards

with unprogrammed devices and then program the dig-

ital signal controller just before shipping the product.

This also allows the most recent firmware or a custom

firmware to be programmed.

Note 1: This data sheet summarizes the features

of the PIC24HJXXXGPX06A/X08A/X10A

family of devices. However, it is not

intended to be a comprehensive refer-

ence source. To complement the infor-

mation in this data sheet, refer to Section

5. “Flash Programming” (DS70191) of

the “dsPIC33F/PIC24H Family Reference

Manual”, which is available from the

Microchip web site (www.microchip.com).

RTSP is accomplished using TBLRD (table read) and

TBLWT (table write) instructions. With RTSP, the user

can write program memory data either in blocks or

‘rows’ of 64 instructions (192 bytes) at a time, or single

instructions and erase program memory in blocks or

‘pages’ of 512 instructions (1536 bytes) at a time.

2: Some registers and associated bits

described in this section may not be

available on all devices. Refer to

Section 4.0 “Memory Organization” in

this data sheet for device-specific register

and bit information.

5.1

Table Instructions and Flash

Programming

Regardless of the method used, all programming of

Flash memory is done with the table read and table

write instructions. These allow direct read and write

access to the program memory space from the data

memory while the device is in normal operating mode.

The 24-bit target address in the program memory is

formed using bits<7:0> of the TBLPAG register and the

Effective Address (EA) from a W register specified in

the table instruction, as shown in Figure 5-1.

The PIC24HJXXXGPX06A/X08A/X10A devices con-

tain internal Flash program memory for storing and

executing application code. The memory is readable,

writable and erasable during normal operation over the

entire VDD range.

Flash memory can be programmed in two ways:

The TBLRDLand the TBLWTLinstructions are used to

read or write to bits<15:0> of program memory.

TBLRDLand TBLWTLcan access program memory in

both Word and Byte modes.

1. In-Circuit Serial Programming™ (ICSP™)

programming capability

2. Run-Time Self-Programming (RTSP)

ICSP

programming

capability

allows

a

The TBLRDHand TBLWTHinstructions are used to read

or write to bits<23:16> of program memory. TBLRDH

and TBLWTHcan also access program memory in Word

or Byte mode.

PIC24HJXXXGPX06A/X08A/X10A device to be seri-

ally programmed while in the end application circuit.

This is simply done with two lines for programming

clock and programming data (one of the alternate pro-

gramming pin pairs: PGECx/PGEDx, and three other

FIGURE 5-1:

ADDRESSING FOR TABLE REGISTERS

24 bits

Program Counter

Using

Program Counter

0

Working Reg EA

Using

Table Instruction

1/0

TBLPAG Reg

8 bits

16 bits

User/Configuration

Space Select

Byte

Select

24-bit EA

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DS70592D-page 59

PIC24HJXXXGPX06A/X08A/X10A

For example, if the device is operating at +125°C, the

FRC accuracy will be ±5%. If the TUN<5:0> bits (see

Register 9-4) are set to ‘b111111, the minimum row

write time is equal to Equation 5-2.

5.2

RTSP Operation

The PIC24HJXXXGPX06A/X08A/X10A Flash program

memory array is organized into rows of 64 instructions

or 192 bytes. RTSP allows the user to erase a page of

memory, which consists of eight rows (512 instructions)

at a time, and to program one row or one word at a

time. Table 24-12 displays typical erase and program-

ming times. The 8-row erase pages and single row

write rows are edge-aligned, from the beginning of pro-

gram memory, on boundaries of 1536 bytes and 192

bytes, respectively.

EQUATION 5-2:

MINIMUM ROW WRITE

TIME

11064 Cycles

T_RW= ---------------------------------------------------------------------------------------------- = 1 . 4 3 5 ms

7.37 MHz  1 + 0.05  1 – 0.00375

The program memory implements holding buffers that

can contain 64 instructions of programming data. Prior

to the actual programming operation, the write data

must be loaded into the buffers in sequential order. The

instruction words loaded must always be from a group

of 64 boundary.

The maximum row write time is equal to Equation 5-3.

EQUATION 5-3:

MAXIMUM ROW WRITE

TIME

11064 Cycles

T_RW= --------------------------------------------------------------------------------------------- = 1.586ms

7.37 MHz  1 – 0.05  1 – 0.00375

The basic sequence for RTSP programming is to set up

a Table Pointer, then do a series of TBLWTinstructions

to load the buffers. Programming is performed by set-

ting the control bits in the NVMCON register. A total of

64 TBLWTL and TBLWTH instructions are required to

load the instructions.

Setting the WR bit (NVMCON<15>) starts the

operation, and the WR bit is automatically cleared

when the operation is finished.

All of the table write operations are single-word writes

(two instruction cycles) because only the buffers are

5.4

Control Registers

written.

A

programming cycle is required for

The two SFRs that are used to read and write the

program Flash memory are:

programming each row.

• NVMCON

5.3

Programming Operations

• NVMKEY

A complete programming sequence is necessary for

programming or erasing the internal Flash in RTSP

mode. The processor stalls (waits) until the

programming operation is finished.

The NVMCON register (Register 5-1) controls which

blocks are to be erased, which memory type is to be

programmed and the start of the programming cycle.

NVMKEY is a write-only register that is used for write

protection. To start a programming or erase sequence,

the user must consecutively write 0x55 and 0xAA to the

NVMKEY register. Refer to Section 5.3 “Programming

Operations” for further details.

The programming time depends on the FRC accuracy

(see Table 24-19) and the value of the FRC Oscillator

Tuning register (see Register 9-4). Use the following

formula to calculate the minimum and maximum values

for the Row Write Time, Page Erase Time and Word

Write Cycle Time parameters (see Table 24-12).

EQUATION 5-1:

PROGRAMMING TIME

T

-------------------------------------------------------------------------------------------------------------------------

7.37 MHz  FRC Accuracy%  FRC Tuning%

DS70592D-page 60

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REGISTER 5-1:

NVMCON: FLASH MEMORY CONTROL REGISTER

R/SO-0⁽¹⁾

WR

R/W-0⁽¹⁾

WREN

R/W-0⁽¹⁾

WRERR

U-0

—

U-0

—

U-0

—

U-0

—

U-0

—

bit 15

bit 8

U-0

—

R/W-0⁽¹⁾

ERASE

U-0

—

U-0

—

R/W-0⁽¹⁾

NVMOP<3:0>⁽²⁾

bit 7

bit 0

Legend:

SO = Settable only bit

W = Writable bit

‘1’ = Bit is set

R = Readable bit

-n = Value at POR

U = Unimplemented bit, read as ‘0’

‘0’ = Bit is cleared x = Bit is unknown

bit 15

WR: Write Control bit

1= Initiates a Flash memory program or erase operation. The operation is self-timed and the bit is

cleared by hardware once operation is complete

0= Program or erase operation is complete and inactive

bit 14

bit 13

WREN: Write Enable bit

1= Enable Flash program/erase operations

0= Inhibit Flash program/erase operations

WRERR: Write Sequence Error Flag bit

1= An improper program or erase sequence attempt or termination has occurred (bit is set

automatically on any set attempt of the WR bit)

0= The program or erase operation completed normally

bit 12-7

bit 6

Unimplemented: Read as ‘0’

ERASE: Erase/Program Enable bit

1= Perform the erase operation specified by NVMOP<3:0> on the next WR command

0= Perform the program operation specified by NVMOP<3:0> on the next WR command

bit 5-4

bit 3-0

Unimplemented: Read as ‘0’

NVMOP<3:0>: NVM Operation Select bits⁽²⁾

1111= Memory bulk erase operation (ERASE = 1) or no operation (ERASE = 0)

1110= Reserved

1101= Erase General Segment and FGS Configuration Register

(ERASE = 1) or no operation (ERASE = 0)

1100= Erase Secure Segment and FSS Configuration Register

(ERASE = 1) or no operation (ERASE = 0)

1011= Reserved

•

0100= Reserved

0011= Memory word program operation (ERASE = 0) or no operation (ERASE = 1)

0010= Memory page erase operation (ERASE = 1) or no operation (ERASE = 0)

0001= Memory row program operation (ERASE = 0) or no operation (ERASE = 1)

0000= Program or erase a single Configuration register byte

Note 1: These bits can only be reset on a POR.

2: All other combinations of NVMOP<3:0> are unimplemented.

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DS70592D-page 61

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4. Write the first 64 instructions from data RAM into

the program memory buffers (see Example 5-2).

5.4.1

PROGRAMMING ALGORITHM FOR

FLASH PROGRAM MEMORY

5. Write the program block to Flash memory:

The user can program one row of program Flash

memory at a time. To do this, it is necessary to erase

the 8-row erase page that contains the desired row.

The general process is:

a) Set the NVMOP bits to ‘0001’ to configure

for row programming. Clear the ERASE bit

and set the WREN bit.

b) Write 0x55 to NVMKEY.

c) Write 0xAA to NVMKEY.

1. Read eight rows of program memory

(512 instructions) and store in data RAM.

d) Set the WR bit. The programming cycle

begins and the CPU stalls for the duration of

the write cycle. When the write to Flash mem-

ory is done, the WR bit is cleared

automatically.

2. Update the program data in RAM with the

desired new data.

3. Erase the page (see Example 5-1):

a) Set the NVMOP bits (NVMCON<3:0>) to

‘0010’ to configure for block erase. Set the

ERASE (NVMCON<6>) and WREN

(NVMCON<14>) bits.

6. Repeat steps 4 and 5, using the next available

64 instructions from the block in data RAM by

incrementing the value in TBLPAG, until all

512 instructions are written back to Flash memory.

b) Write the starting address of the page to be

erased into the TBLPAG and W registers.

For protection against accidental operations, the write

initiate sequence for NVMKEY must be used to allow

any erase or program operation to proceed. After the

programming command has been executed, the user

must wait for the programming time until programming

is complete. The two instructions following the start of

the programming sequence should be NOPs, as shown

in Example 5-3.

c) Perform a dummy table write operation

(TBLWTL) to any address within the page

that needs to be erased.

d) Write 0x55 to NVMKEY.

e) Write 0xAA to NVMKEY.

f) Set the WR bit (NVMCON<15>). The erase

cycle begins and the CPU stalls for the dura-

tion of the erase cycle. When the erase is

done, the WR bit is cleared automatically.

EXAMPLE 5-1:

ERASING A PROGRAM MEMORY PAGE

; Set up NVMCON for block erase operation

MOV

#0x4042, W0

W0, NVMCON

;

; Initialize NVMCON

; Init pointer to row to be ERASED

MOV

#tblpage(PROG_ADDR), W0

W0, TBLPAG

#tbloffset(PROG_ADDR), W0

;

; Initialize PM Page Boundary SFR

; Initialize in-page EA<15:0> pointer

; Set base address of erase block

; Block all interrupts with priority <7

; for next 5 instructions

TBLWTL W0, [W0]

DISI

#5

MOV

BSET

NOP

#0x55, W0

W0, NVMKEY

#0xAA, W1

W1, NVMKEY

NVMCON, #WR

; Write the 55 key

;

; Write the AA key

; Start the erase sequence

; Insert two NOPs after the erase

; command is asserted

Note:

A program memory page erase operation

is set up by performing a dummy table

write (TBLWTL) operation to any address

within the page. This methodology is dif-

ferent from the page erase operation on

dsPIC30F/33F devices in which the erase

page was selected using a dedicated pair

of registers (NVMADRU and NVMADR).

DS70592D-page 62

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EXAMPLE 5-2:

LOADING THE WRITE BUFFERS

; Set up NVMCON for row programming operations

MOV

#0x4001, W0

W0, NVMCON

;

; Initialize NVMCON

; Set up a pointer to the first program memory location to be written

; program memory selected, and writes enabled

MOV

#0x0000, W0

W0, TBLPAG

#0x6000, W0

;

; Initialize PM Page Boundary SFR

; An example program memory address

; Perform the TBLWT instructions to write the latches

; 0th_program_word

MOV

#LOW_WORD_0, W2

#HIGH_BYTE_0, W3

;

TBLWTL W2, [W0]

TBLWTH W3, [W0++]

; Write PM low word into program latch

; Write PM high byte into program latch

; 1st_program_word

MOV

#LOW_WORD_1, W2

#HIGH_BYTE_1, W3

;

TBLWTL W2, [W0]

TBLWTH W3, [W0++]

; Write PM low word into program latch

; Write PM high byte into program latch

;

2nd_program_word

MOV

#LOW_WORD_2, W2

#HIGH_BYTE_2, W3

;

TBLWTL W2, [W0]

TBLWTH W3, [W0++]

; Write PM low word into program latch

; Write PM high byte into program latch

•

; 63rd_program_word

MOV

#LOW_WORD_31, W2

#HIGH_BYTE_31, W3

;

TBLWTL W2, [W0]

TBLWTH W3, [W0++]

; Write PM low word into program latch

; Write PM high byte into program latch

EXAMPLE 5-3:

INITIATING A PROGRAMMING SEQUENCE

DISI

#5

; Block all interrupts with priority <7

; for next 5 instructions

MOV

BSET

NOP

#0x55, W0

W0, NVMKEY

#0xAA, W1

W1, NVMKEY

NVMCON, #WR

; Write the 55 key

;

; Write the AA key

; Start the erase sequence

; Insert two NOPs after the

; erase command is asserted

 2009-2012 Microchip Technology Inc.

DS70592D-page 63

PIC24HJXXXGPX06A/X08A/X10A

NOTES:

DS70592D-page 64

 2009-2012 Microchip Technology Inc.

PIC24HJXXXGPX06A/X08A/X10A

A simplified block diagram of the Reset module is

shown in Figure 6-1.

6.0

RESET

Note 1: This data sheet summarizes the features

of the PIC24HJXXXGPX06A/X08A/X10A

family of devices. However, it is not

Any active source of Reset will make the SYSRST sig-

nal active. Many registers associated with the CPU and

peripherals are forced to a known Reset state. Most

registers are unaffected by a Reset; their status is

unknown on POR and unchanged by all other Resets.

intended to be

a

comprehensive

reference source. To complement the

information in this data sheet, refer to

Section 8. “Reset” (DS70192) of the

“dsPIC33F/PIC24H Family Reference

Manual”, which is available from the

Microchip web site (www.microchip.com).

Note:

Refer to the specific peripheral or CPU

section of this data sheet for register

Reset states.

All types of device Reset will set a corresponding status

bit in the RCON register to indicate the type of Reset

(see Register 6-1). A POR will clear all bits, except for

the POR bit (RCON<0>), that are set. The user can set

or clear any bit at any time during code execution. The

RCON bits only serve as status bits. Setting a particular

Reset status bit in software does not cause a device

Reset to occur.

2: Some registers and associated bits

described in this section may not be

available on all devices. Refer to

Section 4.0 “Memory Organization” in

this data sheet for device-specific register

and bit information.

The Reset module combines all Reset sources and

controls the device Master Reset Signal, SYSRST. The

following is a list of device Reset sources:

The RCON register also has other bits associated with

the Watchdog Timer and device power-saving states.

The function of these bits is discussed in other sections

of this manual.

• POR: Power-on Reset

• BOR: Brown-out Reset

Note:

The status bits in the RCON register

should be cleared after they are read so

that the next RCON register value after a

device Reset will be meaningful.

• MCLR: Master Clear Pin Reset

• SWR: RESETInstruction

• WDT: Watchdog Timer Reset

• TRAPR: Trap Conflict Reset

• IOPUWR: Illegal Opcode and Uninitialized W

Register Reset

FIGURE 6-1:

RESET SYSTEM BLOCK DIAGRAM

RESETInstruction

Glitch Filter

MCLR

WDT

Module

Sleep or Idle

BOR

Internal

Regulator

SYSRST

VDD

POR

VDD Rise

Detect

Trap Conflict

Illegal Opcode

Uninitialized W Register

 2009-2012 Microchip Technology Inc.

DS70592D-page 65

PIC24HJXXXGPX06A/X08A/X10A

REGISTER 6-1:

RCON: RESET CONTROL REGISTER⁽¹⁾

R/W-0

TRAPR

bit 15

R/W-0

U-0

—

U-0

—

U-0

—

U-0

—

U-0

—

R/W-0

VREGS⁽³⁾

IOPUWR

bit 8

R/W-0

EXTR

R/W-0

SWR

R/W-0

SWDTEN⁽²⁾

R/W-0

WDTO

R/W-0

IDLE

R/W-1

BOR

R/W-1

POR

SLEEP

bit 7

bit 0

Legend:

R = Readable bit

W = Writable bit

‘1’ = Bit is set

U = Unimplemented bit, read as ‘0’

‘0’ = Bit is cleared x = Bit is unknown

-n = Value at POR

bit 15

bit 14

TRAPR: Trap Reset Flag bit

1= A Trap Conflict Reset has occurred

0= A Trap Conflict Reset has not occurred

IOPUWR: Illegal Opcode or Uninitialized W Access Reset Flag bit

1= An illegal opcode detection, an illegal address mode or uninitialized W register used as an

Address Pointer caused a Reset

0= An illegal opcode or uninitialized W Reset has not occurred

bit 13-9

bit 8

Unimplemented: Read as ‘0’

VREGS: Voltage Regulator Standby During Sleep bit⁽³⁾

1= Voltage Regulator is active during Sleep mode

0= Voltage Regulator goes into standby mode during Sleep

bit 7

bit 6

bit 5

bit 4

bit 3

bit 2

bit 1

bit 0

EXTR: External Reset (MCLR) Pin bit

1= A Master Clear (pin) Reset has occurred

0= A Master Clear (pin) Reset has not occurred

SWR: Software Reset (Instruction) Flag bit

1= A RESETinstruction has been executed

0= A RESETinstruction has not been executed

SWDTEN: Software Enable/Disable of WDT bit⁽²⁾

1= WDT is enabled

0= WDT is disabled

WDTO: Watchdog Timer Time-out Flag bit

1= WDT time-out has occurred

0= WDT time-out has not occurred

SLEEP: Wake-up from Sleep Flag bit

1= Device has been in Sleep mode

0= Device has not been in Sleep mode

IDLE: Wake-up from Idle Flag bit

1= Device was in Idle mode

0= Device was not in Idle mode

BOR: Brown-out Reset Flag bit

1= A Brown-out Reset has occurred

0= A Brown-out Reset has not occurred

POR: Power-on Reset Flag bit

1= A Power-on Reset has occurred

0= A Power-on Reset has not occurred

Note 1: All of the Reset status bits may be set or cleared in software. Setting one of these bits in software does not

cause a device Reset.

2: If the FWDTEN Configuration bit is ‘1’ (unprogrammed), the WDT is always enabled, regardless of the

SWDTEN bit setting.

3: For PIC24HJ256GPX06A/X08A/X10A devices, this bit is unimplemented and reads back programmed

value.

DS70592D-page 66

 2009-2012 Microchip Technology Inc.

PIC24HJXXXGPX06A/X08A/X10A

TABLE 6-1:

RESET FLAG BIT OPERATION

Flag Bit Setting Event

Trap conflict event

Clearing Event

TRAPR (RCON<15>)

IOPUWR (RCON<14>)

POR, BOR

Illegal opcode or uninitialized

W register access

EXTR (RCON<7>)

SWR (RCON<6>)

WDTO (RCON<4>)

SLEEP (RCON<3>)

IDLE (RCON<2>)

BOR (RCON<1>)

POR (RCON<0>)

MCLR Reset

POR

RESETinstruction

WDT time-out

POR, BOR

PWRSAVinstruction, POR, BOR

PWRSAV #SLEEPinstruction

PWRSAV #IDLEinstruction

BOR, POR

POR, BOR

—

POR

Note: All Reset flag bits may be set or cleared by the user software.

6.1

Clock Source Selection at Reset

6.2

Device Reset Times

If clock switching is enabled, the system clock source at

device Reset is chosen, as shown in Table 6-2. If clock

switching is disabled, the system clock source is always

selected according to the oscillator Configuration bits.

Refer to Section 9.0 “Oscillator Configuration” for

further details.

The Reset times for various types of device Reset are

summarized in Table 6-3. The system Reset signal is

released after the POR and PWRT delay times expire.

The time at which the device actually begins to execute

code also depends on the system oscillator delays,

which include the Oscillator Start-up Timer (OST) and

the PLL lock time. The OST and PLL lock times occur

in parallel with the applicable reset delay times.

TABLE 6-2:

OSCILLATOR SELECTION vs.

TYPE OF RESET (CLOCK

SWITCHING ENABLED)

The FSCM delay determines the time at which the

FSCM begins to monitor the system clock source after

the reset signal is released.

Reset Type

Clock Source Determinant

POR

BOR

Oscillator Configuration bits

(FNOSC<2:0>)

MCLR

WDTR

SWR

COSC Control bits

(OSCCON<14:12>)

 2009-2012 Microchip Technology Inc.

DS70592D-page 67

PIC24HJXXXGPX06A/X08A/X10A

TABLE 6-3:

Reset Type

POR

RESET DELAY TIMES FOR VARIOUS DEVICE RESETS

System Clock

Delay

FSCM

Delay

Clock Source

SYSRST Delay

See Notes

1, 2, 3

EC, FRC, LPRC

ECPLL, FRCPLL

XT, HS, SOSC

XTPLL, HSPLL

Any Clock

TPOR + TSTARTUP + TRST

—

TFSCM

—

TPOR + TSTARTUP + TRST

TLOCK

1, 2, 3, 5, 6

TPOR + TSTARTUP + TRST

TOST

1, 2, 3, 4, 6

TPOR + TSTARTUP + TRST

TOST + TLOCK

1, 2, 3, 4, 5, 6

MCLR

TRST

—

3

WDT

Any Clock

—

Software

Any clock

—

Illegal Opcode

Uninitialized W

Trap Conflict

Any Clock

—

Any Clock

—

Any Clock

—

Note 1: TPOR = Power-on Reset delay (10 s nominal).

2: TSTARTUP = Conditional POR delay of 20 s nominal (if on-chip regulator is enabled) or 64 ms nominal

Power-up Timer delay (if regulator is disabled). TSTARTUP is also applied to all returns from powered-down

states, including waking from Sleep mode, only if the regulator is enabled.

3: TRST = Internal state Reset time (20 s nominal).

4: TOST = Oscillator Start-up Timer. A 10-bit counter counts 1024 oscillator periods before releasing the

oscillator clock to the system.

5: TLOCK = PLL lock time (20 s nominal).

6: TFSCM = Fail-Safe Clock Monitor delay (100 s nominal).

6.2.1

POR AND LONG OSCILLATOR

START-UP TIMES

6.2.2.1

FSCM Delay for Crystal and PLL

Clock Sources

The oscillator start-up circuitry and its associated delay

timers are not linked to the device Reset delays that

occur at power-up. Some crystal circuits (especially

low-frequency crystals) have a relatively long start-up

time. Therefore, one or more of the following conditions

is possible after the Reset signal is released:

When the system clock source is provided by a crystal

oscillator and/or the PLL, a small delay, TFSCM, is auto-

matically inserted after the POR and PWRT delay

times. The FSCM does not begin to monitor the system

clock source until this delay expires. The FSCM delay

time is nominally 500 s and provides additional time

for the oscillator and/or PLL to stabilize. In most cases,

the FSCM delay prevents an oscillator failure trap at a

device Reset when the PWRT is disabled.

• The oscillator circuit has not begun to oscillate

• The Oscillator Start-up Timer has not expired (if a

crystal oscillator is used)

• The PLL has not achieved a lock (if PLL is used)

6.3

Special Function Register Reset

States

The device will not begin to execute code until a valid

clock source has been released to the system. There-

fore, the oscillator and PLL start-up delays must be

considered when the Reset delay time must be known.

Most of the Special Function Registers (SFRs) associ-

ated with the CPU and peripherals are reset to a

particular value at a device Reset. The SFRs are

grouped by their peripheral or CPU function and their

Reset values are specified in each section of this

manual.

6.2.2

FAIL-SAFE CLOCK MONITOR

(FSCM) AND DEVICE RESETS

If the FSCM is enabled, it begins to monitor the system

clock source when the Reset signal is released. If a

valid clock source is not available at this time, the

device automatically switches to the FRC oscillator and

the user can switch to the desired crystal oscillator in

the Trap Service Routine.

The Reset value for each SFR does not depend on the

type of Reset, with the exception of two registers. The

Reset value for the Reset Control register, RCON,

depends on the type of device Reset. The Reset value

for the Oscillator Control register, OSCCON, depends

on the type of Reset and the programmed values of the

oscillator Configuration bits in the FOSC Configuration

register.

DS70592D-page 68

 2009-2012 Microchip Technology Inc.

PIC24HJXXXGPX06A/X08A/X10A

7.1.1

ALTERNATE VECTOR TABLE

7.0

INTERRUPT CONTROLLER

The Alternate Interrupt Vector Table (AIVT) is located

after the IVT, as shown in Figure 7-1. Access to the

AIVT is provided by the ALTIVT control bit

(INTCON2<15>). If the ALTIVT bit is set, all interrupt

and exception processes use the alternate vectors

instead of the default vectors. The alternate vectors are

organized in the same manner as the default vectors.

Note 1: This data sheet summarizes the features

of the PIC24HJXXXGPX06A/X08A/X10A

family of devices. However, it is not

intended to be

a

comprehensive

reference source. To complement the

information in this data sheet, refer to

Section 6. “Interrupts” (DS70184) of

The AIVT supports debugging by providing a means to

switch between an application and a support environ-

ment without requiring the interrupt vectors to be

reprogrammed. This feature also enables switching

between applications for evaluation of different soft-

ware algorithms at run time. If the AIVT is not needed,

the AIVT should be programmed with the same

addresses used in the IVT.

the

Reference Manual”, which is available

from the Microchip web site

(www.microchip.com).

“dsPIC33F/PIC24H

Family

2: Some registers and associated bits

described in this section may not be

available on all devices. Refer to

Section 4.0 “Memory Organization” in

this data sheet for device-specific register

and bit information.

7.2

Reset Sequence

A device Reset is not a true exception because the

interrupt controller is not involved in the Reset process.

The PIC24HJXXXGPX06A/X08A/X10A device clears

its registers in response to a Reset which forces the PC

to zero. The digital signal controller then begins pro-

gram execution at location 0x000000. The user pro-

grams a GOTOinstruction at the Reset address which

redirects program execution to the appropriate start-up

routine.

The PIC24HJXXXGPX06A/X08A/X10A interrupt con-

troller reduces the numerous peripheral interrupt

request signals to a single interrupt request signal to

the PIC24HJXXXGPX06A/X08A/X10A CPU. It has the

following features:

• Up to 8 processor exceptions and software traps

• 7 user-selectable priority levels

• Interrupt Vector Table (IVT) with up to 118 vectors

• A unique vector for each interrupt or exception

source

Note: Any unimplemented or unused vector

locations in the IVT and AIVT should be

programmed with the address of a default

interrupt handler routine that contains a

RESETinstruction.

• Fixed priority within a specified user priority level

• Alternate Interrupt Vector Table (AIVT) for debug

support

• Fixed interrupt entry and return latencies

7.1

Interrupt Vector Table

The Interrupt Vector Table (IVT) is shown in Figure 7-1.

The IVT resides in program memory, starting at location

000004h. The IVT contains 126 vectors consisting of

8 nonmaskable trap vectors plus up to 118 sources of

interrupt. In general, each interrupt source has its own

vector. Each interrupt vector contains a 24-bit wide

address. The value programmed into each interrupt

vector location is the starting address of the associated

Interrupt Service Routine (ISR).

Interrupt vectors are prioritized in terms of their natural

priority; this priority is linked to their position in the

vector table. All other things being equal, lower

addresses have a higher natural priority. For example,

the interrupt associated with vector 0 will take priority

over interrupts at any other vector address.

PIC24HJXXXGPX06A/X08A/X10A devices implement

up to 61 unique interrupts and 5 nonmaskable traps.

These are summarized in Table 7-1 and Table 7-2.

 2009-2012 Microchip Technology Inc.

DS70592D-page 69

PIC24HJXXXGPX06A/X08A/X10A

FIGURE 7-1:

PIC24HJXXXGPX06A/X08A/X10A INTERRUPT VECTOR TABLE

Reset – GOTOInstruction

Reset – GOTOAddress

Reserved

0x000000

0x000002

0x000004

Oscillator Fail Trap Vector

Address Error Trap Vector

Stack Error Trap Vector

Math Error Trap Vector

DMA Error Trap Vector

Reserved

Interrupt Vector 0

Interrupt Vector 1

~

0x000014

~

Interrupt Vector 52

Interrupt Vector 53

Interrupt Vector 54

~

0x00007C

0x00007E

0x000080

(1)

Interrupt Vector Table (IVT)

~

Interrupt Vector 116

Interrupt Vector 117

Reserved

0x0000FC

0x0000FE

0x000100

0x000102

Reserved

Oscillator Fail Trap Vector

Address Error Trap Vector

Stack Error Trap Vector

Math Error Trap Vector

DMA Error Trap Vector

Reserved

Interrupt Vector 0

Interrupt Vector 1

~

0x000114

~

(1)

Alternate Interrupt Vector Table (AIVT)

Interrupt Vector 52

Interrupt Vector 53

Interrupt Vector 54

~

0x00017C

0x00017E

0x000180

~

Interrupt Vector 116

Interrupt Vector 117

Start of Code

0x0001FE

0x000200

Note 1: See Table 7-1 for the list of implemented interrupt vectors.

DS70592D-page 70

 2009-2012 Microchip Technology Inc.

PIC24HJXXXGPX06A/X08A/X10A

TABLE 7-1:

INTERRUPT VECTORS

Interrupt

Request(IRQ)

Number

Vector

Number

IVT Address

AIVT Address

Interrupt Source

8

0

0x000014

0x000016

0x000018

0x00001A

0x00001C

0x00001E

0x000020

0x000022

0x000024

0x000026

0x000028

0x00002A

0x00002C

0x00002E

0x000030

0x000032

0x000034

0x000036

0x000038

0x00003A

0x00003C

0x00003E

0x000040

0x000042

0x000044

0x000046

0x000048

0x00004A

0x00004C

0x00004E

0x000050

0x000052

0x000054

0x000056

0x000058

0x00005A

0x00005C

0x00005E

0x000060

0x000062

0x000064

0x000066

0x000068

0x00006A

0x00006C

0x00006E

0x000114

0x000116

0x000118

0x00011A

0x00011C

0x00011E

0x000120

0x000122

0x000124

0x000126

0x000128

0x00012A

0x00012C

0x00012E

0x000130

0x000132

0x000134

0x000136

0x000138

0x00013A

0x00013C

0x00013E

0x000140

0x000142

0x000144

0x000146

0x000148

0x00014A

0x00014C

0x00014E

0x000150

0x000152

0x000154

0x000156

0x000158

0x00015A

0x00015C

0x00015E

0x000160

0x000162

0x000164

0x000166

0x000168

0x00016A

0x00016C

0x00016E

INT0 – External Interrupt 0

IC1 – Input Capture 1

OC1 – Output Compare 1

T1 – Timer1

9

1

10

11

12

13

14

15

16

17

18

19

20

21

22

23

24

25

26

27

28

29

30

31

32

33

34

35

36

37

38

39

40

41

42

43

44

45

46

47

48

49

50

51

52

53

2

3

4

DMA0 – DMA Channel 0

IC2 – Input Capture 2

OC2 – Output Compare 2

T2 – Timer2

5

6

7

8

T3 – Timer3

9

SPI1E – SPI1 Error

10

11

12

13

14

15

16

17

18

19

20

21

22

23

24

25

26

27

28

29

30

31

32

33

34

35

36

37

38

39

40

41

42

43

44

45

SPI1 – SPI1 Transfer Done

U1RX – UART1 Receiver

U1TX – UART1 Transmitter

ADC1 – Analog-to-Digital Converter 1

DMA1 – DMA Channel 1

Reserved

SI2C1 – I2C1 Slave Events

MI2C1 – I2C1 Master Events

Reserved

CN - Change Notification Interrupt

INT1 – External Interrupt 1

ADC2 – Analog-to-Digital Converter 2

IC7 – Input Capture 7

IC8 – Input Capture 8

DMA2 – DMA Channel 2

OC3 – Output Compare 3

OC4 – Output Compare 4

T4 – Timer4

T5 – Timer5

INT2 – External Interrupt 2

U2RX – UART2 Receiver

U2TX – UART2 Transmitter

SPI2E – SPI2 Error

SPI1 – SPI1 Transfer Done

C1RX – ECAN1 Receive Data Ready

C1 – ECAN1 Event

DMA3 – DMA Channel 3

IC3 – Input Capture 3

IC4 – Input Capture 4

IC5 – Input Capture 5

IC6 – Input Capture 6

OC5 – Output Compare 5

OC6 – Output Compare 6

OC7 – Output Compare 7

OC8 – Output Compare 8

Reserved

 2009-2012 Microchip Technology Inc.

DS70592D-page 71

PIC24HJXXXGPX06A/X08A/X10A

TABLE 7-1:

INTERRUPT VECTORS (CONTINUED)

Interrupt

Vector

Number

Request(IRQ)

Number

IVT Address

AIVT Address

Interrupt Source

54

55

46

47

0x000070

0x000072

0x000074

0x000076

0x000078

0x00007A

0x00007C

0x00007E

0x000080

0x000082

0x000084

0x000170

0x000172

0x000174

0x000176

0x000178

0x00017A

0x00017C

0x00017E

0x000180

0x000182

0x000184

DMA4 – DMA Channel 4

T6 – Timer6

56

48

T7 – Timer7

57

49

SI2C2 – I2C2 Slave Events

MI2C2 – I2C2 Master Events

T8 – Timer8

58

50

59

51

60

52

T9 – Timer9

61

53

INT3 – External Interrupt 3

INT4 – External Interrupt 4

C2RX – ECAN2 Receive Data Ready

C2 – ECAN2 Event

62

54

63

55

64

56

65-68

69

57-60

61

0x000086-0x00008C 0x000186-0x00018C Reserved

0x00008E 0x00018E DMA5 – DMA Channel 5

0x000090-0x000094 0x000190-0x000194 Reserved

70-72

73

62-64

65

0x000096

0x000098

0x00009A

0x00009C

0x00009E

0x0000A0

0x0000A2

0x000196

0x000198

0x00019A

0x00019C

0x00019E

0x0001A0

0x0001A2

U1E – UART1 Error

74

66

U2E – UART2 Error

75

67

Reserved

76

68

DMA6 – DMA Channel 6

DMA7 – DMA Channel 7

C1TX – ECAN1 Transmit Data Request

C2TX – ECAN2 Transmit Data Request

77

69

78

70

79

71

80-125

72-117

0x0000A4-0x0000FE 0x0001A4-0x0001FE Reserved

TABLE 7-2:

TRAP VECTORS

Vector Number

IVT Address

AIVT Address

Trap Source

Reserved

0

1

2

3

4

5

6

7

0x000004

0x000006

0x000008

0x00000A

0x00000C

0x00000E

0x000010

0x000012

0x000104

0x000106

0x000108

0x00010A

0x00010C

0x00010E

0x000110

0x000112

Oscillator Failure

Address Error

Stack Error

Math Error

DMA Error Trap

Reserved

DS70592D-page 72

 2009-2012 Microchip Technology Inc.

PIC24HJXXXGPX06A/X08A/X10A

The IPC registers are used to set the interrupt priority

level for each source of interrupt. Each user interrupt

source can be assigned to one of eight priority levels.

7.3

Interrupt Control and Status

Registers

PIC24HJXXXGPX06A/X08A/X10A devices implement

a total of 30 registers for the interrupt controller:

The INTTREG register contains the associated inter-

rupt vector number and the new CPU interrupt priority

level, which are latched into vector number (VEC-

NUM<6:0>) and Interrupt level (ILR<3:0>) bit fields in

the INTTREG register. The new interrupt priority level

is the priority of the pending interrupt.

• INTCON1

• INTCON2

• IFS0 through IFS4

• IEC0 through IEC4

• IPC0 through IPC17

• INTTREG

The interrupt sources are assigned to the IFSx, IECx

and IPCx registers in the same sequence that they are

listed in Table 7-1. For example, the INT0 (External

Interrupt 0) is shown as having vector number 8 and a

natural order priority of 0. Thus, the INT0IF bit is found

in IFS0<0>, the INT0IE bit in IEC0<0>, and the INT0IP

bits in the first position of IPC0 (IPC0<2:0>).

Global interrupt control functions are controlled from

INTCON1 and INTCON2. INTCON1 contains the Inter-

rupt Nesting Disable (NSTDIS) bit as well as the control

and status flags for the processor trap sources. The

INTCON2 register controls the external interrupt

request signal behavior and the use of the Alternate

Interrupt Vector Table.

Although they are not specifically part of the interrupt

control hardware, two of the CPU Control registers con-

tain bits that control interrupt functionality. The CPU

STATUS register, SR, contains the IPL<2:0> bits

(SR<7:5>). These bits indicate the current CPU inter-

rupt priority level. The user can change the current

CPU priority level by writing to the IPL bits.

The IFS registers maintain all of the interrupt request

flags. Each source of interrupt has a Status bit, which is

set by the respective peripherals or external signal and

is cleared via software.

The IEC registers maintain all of the interrupt enable

bits. These control bits are used to individually enable

interrupts from the peripherals or external signals.

The CORCON register contains the IPL3 bit which,

together with IPL<2:0>, also indicates the current CPU

priority level. IPL3 is a read-only bit so that trap events

cannot be masked by the user software.

All Interrupt registers are described in Register 7-1

through Register 7-32.

 2009-2012 Microchip Technology Inc.

DS70592D-page 73

PIC24HJXXXGPX06A/X08A/X10A

REGISTER 7-1:

SR: CPU STATUS REGISTER⁽¹⁾

U-0

—

U-0

—

U-0

—

U-0

—

U-0

—

U-0

—

U-0

—

R/W-0

DC

bit 15

bit 8

R/W-0⁽³⁾

IPL2⁽²⁾

bit 7

R/W-0⁽³⁾

IPL1⁽²⁾

R/W-0⁽³⁾

IPL0⁽²⁾

R-0

RA

R/W-0

N

R/W-0

OV

R/W-0

Z

R/W-0

C

bit 0

Legend:

C = Clear only bit

S = Set only bit

‘1’ = Bit is set

R = Readable bit

W = Writable bit

‘0’ = Bit is cleared

U = Unimplemented bit, read as ‘0’

-n = Value at POR

x = Bit is unknown

bit 7-5

IPL<2:0>: CPU Interrupt Priority Level Status bits⁽²⁾

111= CPU Interrupt Priority Level is 7 (15), user interrupts disabled

110= CPU Interrupt Priority Level is 6 (14)

101= CPU Interrupt Priority Level is 5 (13)

100= CPU Interrupt Priority Level is 4 (12)

011= CPU Interrupt Priority Level is 3 (11)

010= CPU Interrupt Priority Level is 2 (10)

001= CPU Interrupt Priority Level is 1 (9)

000= CPU Interrupt Priority Level is 0 (8)

Note 1: For complete register details, see Register 3-1.

2: The IPL<2:0> bits are concatenated with the IPL<3> bit (CORCON<3>) to form the CPU Interrupt Priority

Level. The value in parentheses indicates the IPL if IPL<3> = 1. User interrupts are disabled when

IPL<3> = 1.

3: The IPL<2:0> Status bits are read-only when NSTDIS (INTCON1<15>) = 1.

REGISTER 7-2:

CORCON: CORE CONTROL REGISTER⁽¹⁾

U-0

—

U-0

—

U-0

—

U-0

—

U-0

—

U-0

—

U-0

—

U-0

—

bit 15

bit 8

bit 0

U-0

—

U-0

—

U-0

—

U-0

—

R/C-0

IPL3⁽²⁾

R/W-0

PSV

U-0

—

U-0

—

bit 7

Legend:

C = Clear only bit

W = Writable bit

‘x = Bit is unknown

R = Readable bit

0’ = Bit is cleared

-n = Value at POR

‘1’ = Bit is set

U = Unimplemented bit, read as ‘0’

bit 3

IPL3: CPU Interrupt Priority Level Status bit 3⁽²⁾

1= CPU interrupt priority level is greater than 7

0= CPU interrupt priority level is 7 or less

Note 1: For complete register details, see Register 3-2.

2: The IPL3 bit is concatenated with the IPL<2:0> bits (SR<7:5>) to form the CPU Interrupt Priority Level.

DS70592D-page 74

 2009-2012 Microchip Technology Inc.

PIC24HJXXXGPX06A/X08A/X10A

REGISTER 7-3:

INTCON1: INTERRUPT CONTROL REGISTER 1

R/W-0

NSTDIS

bit 15

U-0

—

U-0

—

U-0

—

U-0

—

U-0

—

U-0

—

U-0

—

bit 8

bit 0

U-0

—

R/W-0

U-0

—

DIV0ERR

DMACERR MATHERR ADDRERR

STKERR

OSCFAIL

bit 7

Legend:

R = Readable bit

W = Writable bit

‘1’ = Bit is set

U = Unimplemented bit, read as ‘0’

‘0’ = Bit is cleared x = Bit is unknown

-n = Value at POR

bit 15

NSTDIS: Interrupt Nesting Disable bit

1= Interrupt nesting is disabled

0= Interrupt nesting is enabled

bit 14-7

bit 6

Unimplemented: Read as ‘0’

DIV0ERR: Arithmetic Error Status bit

1= Math error trap was caused by a divide by zero

0= Math error trap was not caused by a divide by zero

bit 5

bit 4

bit 3

bit 2

bit 1

bit 0

DMACERR: DMA Controller Error Status bit

1= DMA controller error trap has occurred

0= DMA controller error trap has not occurred

MATHERR: Arithmetic Error Status bit

1= Math error trap has occurred

0= Math error trap has not occurred

ADDRERR: Address Error Trap Status bit

1= Address error trap has occurred

0= Address error trap has not occurred

STKERR: Stack Error Trap Status bit

1= Stack error trap has occurred

0= Stack error trap has not occurred

OSCFAIL: Oscillator Failure Trap Status bit

1= Oscillator failure trap has occurred

0= Oscillator failure trap has not occurred

Unimplemented: Read as ‘0’

 2009-2012 Microchip Technology Inc.

DS70592D-page 75

PIC24HJXXXGPX06A/X08A/X10A

REGISTER 7-4:

INTCON2: INTERRUPT CONTROL REGISTER 2

R/W-0

ALTIVT

bit 15

R-0

U-0

—

U-0

—

U-0

—

U-0

—

U-0

—

U-0

—

DISI

bit 8

U-0

—

U-0

—

U-0

—

R/W-0

INT4EP

INT3EP

INT2EP

INT1EP

INT0EP

bit 7

bit 0

Legend:

R = Readable bit

-n = Value at POR

W = Writable bit

‘1’ = Bit is set

U = Unimplemented bit, read as ‘0’

‘0’ = Bit is cleared x = Bit is unknown

bit 15

bit 14

ALTIVT: Enable Alternate Interrupt Vector Table bit

1= Use alternate vector table

0= Use standard (default) vector table

DISI: DISIInstruction Status bit

1= DISIinstruction is active

0= DISIinstruction is not active

bit 13-5

bit 4

Unimplemented: Read as ‘0’

INT4EP: External Interrupt 4 Edge Detect Polarity Select bit

1= Interrupt on negative edge

0= Interrupt on positive edge

bit 3

bit 2

bit 1

bit 0

INT3EP: External Interrupt 3 Edge Detect Polarity Select bit

1= Interrupt on negative edge

0= Interrupt on positive edge

INT2EP: External Interrupt 2 Edge Detect Polarity Select bit

1= Interrupt on negative edge

0= Interrupt on positive edge

INT1EP: External Interrupt 1 Edge Detect Polarity Select bit

1= Interrupt on negative edge

0= Interrupt on positive edge

INT0EP: External Interrupt 0 Edge Detect Polarity Select bit

1= Interrupt on negative edge

0= Interrupt on positive edge

DS70592D-page 76

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PIC24HJXXXGPX06A/X08A/X10A

REGISTER 7-5:

IFS0: INTERRUPT FLAG STATUS REGISTER 0

U-0

—

R/W-0

AD1IF

R/W-0

SPI1IF

R/W-0

T3IF

DMA1IF

U1TXIF

U1RXIF

SPI1EIF

bit 15

bit 8

R/W-0

T2IF

R/W-0

OC2IF

R/W-0

IC2IF

R/W-0

T1IF

R/W-0

OC1IF

R/W-0

IC1IF

R/W-0

INT0IF

DMA01IF

bit 7

bit 0

Legend:

R = Readable bit

-n = Value at POR

W = Writable bit

‘1’ = Bit is set

U = Unimplemented bit, read as ‘0’

‘0’ = Bit is cleared x = Bit is unknown

bit 15

bit 14

Unimplemented: Read as ‘0’

DMA1IF: DMA Channel 1 Data Transfer Complete Interrupt Flag Status bit

1= Interrupt request has occurred

0= Interrupt request has not occurred

bit 13

bit 12

bit 11

bit 10

bit 9

AD1IF: ADC1 Conversion Complete Interrupt Flag Status bit

1= Interrupt request has occurred

0= Interrupt request has not occurred

U1TXIF: UART1 Transmitter Interrupt Flag Status bit

1= Interrupt request has occurred

0= Interrupt request has not occurred

U1RXIF: UART1 Receiver Interrupt Flag Status bit

1= Interrupt request has occurred

0= Interrupt request has not occurred

SPI1IF: SPI1 Event Interrupt Flag Status bit

1= Interrupt request has occurred

0= Interrupt request has not occurred

SPI1EIF: SPI1 Fault Interrupt Flag Status bit

1= Interrupt request has occurred

0= Interrupt request has not occurred

bit 8

T3IF: Timer3 Interrupt Flag Status bit

1= Interrupt request has occurred

0= Interrupt request has not occurred

bit 7

T2IF: Timer2 Interrupt Flag Status bit

1= Interrupt request has occurred

0= Interrupt request has not occurred

bit 6

OC2IF: Output Compare Channel 2 Interrupt Flag Status bit

1= Interrupt request has occurred

0= Interrupt request has not occurred

bit 5

IC2IF: Input Capture Channel 2 Interrupt Flag Status bit

1= Interrupt request has occurred

0= Interrupt request has not occurred

bit 4

DMA01IF: DMA Channel 0 Data Transfer Complete Interrupt Flag Status bit

1= Interrupt request has occurred

0= Interrupt request has not occurred

bit 3

T1IF: Timer1 Interrupt Flag Status bit

1= Interrupt request has occurred

0= Interrupt request has not occurred

 2009-2012 Microchip Technology Inc.

DS70592D-page 77

PIC24HJXXXGPX06A/X08A/X10A

REGISTER 7-5:

IFS0: INTERRUPT FLAG STATUS REGISTER 0 (CONTINUED)

bit 2

bit 1

bit 0

OC1IF: Output Compare Channel 1 Interrupt Flag Status bit

1= Interrupt request has occurred

0= Interrupt request has not occurred

IC1IF: Input Capture Channel 1 Interrupt Flag Status bit

1= Interrupt request has occurred

0= Interrupt request has not occurred

INT0IF: External Interrupt 0 Flag Status bit

1= Interrupt request has occurred

0= Interrupt request has not occurred

DS70592D-page 78

 2009-2012 Microchip Technology Inc.

PIC24HJXXXGPX06A/X08A/X10A

REGISTER 7-6:

IFS1: INTERRUPT FLAG STATUS REGISTER 1

R/W-0

U2TXIF

bit 15

R/W-0

INT2IF

R/W-0

T5IF

R/W-0

T4IF

R/W-0

OC4IF

R/W-0

OC3IF

R/W-0

U2RXIF

DMA21IF

bit 8

R/W-0

IC8IF

R/W-0

IC7IF

R/W-0

AD2IF

R/W-0

INT1IF

R/W-0

CNIF

U-0

—

R/W-0

MI2C1IF

SI2C1IF

bit 7

bit 0

Legend:

R = Readable bit

-n = Value at POR

W = Writable bit

‘1’ = Bit is set

U = Unimplemented bit, read as ‘0’

‘0’ = Bit is cleared x = Bit is unknown

bit 15

bit 14

bit 13

bit 12

bit 11

bit 10

bit 9

U2TXIF: UART2 Transmitter Interrupt Flag Status bit

1= Interrupt request has occurred

0= Interrupt request has not occurred

U2RXIF: UART2 Receiver Interrupt Flag Status bit

1= Interrupt request has occurred

0= Interrupt request has not occurred

INT2IF: External Interrupt 2 Flag Status bit

1= Interrupt request has occurred

0= Interrupt request has not occurred

T5IF: Timer5 Interrupt Flag Status bit

1= Interrupt request has occurred

0= Interrupt request has not occurred

T4IF: Timer4 Interrupt Flag Status bit

1= Interrupt request has occurred

0= Interrupt request has not occurred

OC4IF: Output Compare Channel 4 Interrupt Flag Status bit

1= Interrupt request has occurred

0= Interrupt request has not occurred

OC3IF: Output Compare Channel 3 Interrupt Flag Status bit

1= Interrupt request has occurred

0= Interrupt request has not occurred

bit 8

DMA21IF: DMA Channel 2 Data Transfer Complete Interrupt Flag Status bit

1= Interrupt request has occurred

0= Interrupt request has not occurred

bit 7

IC8IF: Input Capture Channel 8 Interrupt Flag Status bit

1= Interrupt request has occurred

0= Interrupt request has not occurred

bit 6

IC7IF: Input Capture Channel 7 Interrupt Flag Status bit

1= Interrupt request has occurred

0= Interrupt request has not occurred

bit 5

AD2IF: ADC2 Conversion Complete Interrupt Flag Status bit

1= Interrupt request has occurred

0= Interrupt request has not occurred

bit 4

INT1IF: External Interrupt 1 Flag Status bit

1= Interrupt request has occurred

0= Interrupt request has not occurred

 2009-2012 Microchip Technology Inc.

DS70592D-page 79

PIC24HJXXXGPX06A/X08A/X10A

REGISTER 7-6:

IFS1: INTERRUPT FLAG STATUS REGISTER 1 (CONTINUED)

bit 3

CNIF: Input Change Notification Interrupt Flag Status bit

1= Interrupt request has occurred

0= Interrupt request has not occurred

bit 2

bit 1

Unimplemented: Read as ‘0’

MI2C1IF: I2C1 Master Events Interrupt Flag Status bit

1= Interrupt request has occurred

0= Interrupt request has not occurred

bit 0

SI2C1IF: I2C1 Slave Events Interrupt Flag Status bit

1= Interrupt request has occurred

0= Interrupt request has not occurred

DS70592D-page 80

 2009-2012 Microchip Technology Inc.

PIC24HJXXXGPX06A/X08A/X10A

REGISTER 7-7:

IFS2: INTERRUPT FLAG STATUS REGISTER 2

R/W-0

T6IF

R/W-0

U-0

—

R/W-0

OC8IF

R/W-0

OC7IF

R/W-0

OC6IF

R/W-0

OC5IF

R/W-0

IC6IF

DMA4IF

bit 15

bit 8

R/W-0

IC5IF

R/W-0

IC4IF

R/W-0

IC3IF

R/W-0

C1IF

R/W-0

SPI2IF

R/W-0

DMA3IF

C1RXIF

SPI2EIF

bit 7

bit 0

Legend:

R = Readable bit

-n = Value at POR

W = Writable bit

‘1’ = Bit is set

U = Unimplemented bit, read as ‘0’

‘0’ = Bit is cleared x = Bit is unknown

bit 15

bit 14

T6IF: Timer6 Interrupt Flag Status bit

1= Interrupt request has occurred

0= Interrupt request has not occurred

DMA4IF: DMA Channel 4 Data Transfer Complete Interrupt Flag Status bit

1= Interrupt request has occurred

0= Interrupt request has not occurred

bit 13

bit 12

Unimplemented: Read as ‘0’

OC8IF: Output Compare Channel 8 Interrupt Flag Status bit

1= Interrupt request has occurred

0= Interrupt request has not occurred

bit 11

bit 10

bit 9

bit 8

bit 7

bit 6

bit 5

bit 4

bit 3

OC7IF: Output Compare Channel 7 Interrupt Flag Status bit

1= Interrupt request has occurred

0= Interrupt request has not occurred

OC6IF: Output Compare Channel 6 Interrupt Flag Status bit

1= Interrupt request has occurred

0= Interrupt request has not occurred

OC5IF: Output Compare Channel 5 Interrupt Flag Status bit

1= Interrupt request has occurred

0= Interrupt request has not occurred

IC6IF: Input Capture Channel 6 Interrupt Flag Status bit

1= Interrupt request has occurred

0= Interrupt request has not occurred

IC5IF: Input Capture Channel 5 Interrupt Flag Status bit

1= Interrupt request has occurred

0= Interrupt request has not occurred

IC4IF: Input Capture Channel 4 Interrupt Flag Status bit

1= Interrupt request has occurred

0= Interrupt request has not occurred

IC3IF: Input Capture Channel 3 Interrupt Flag Status bit

1= Interrupt request has occurred

0= Interrupt request has not occurred

DMA3IF: DMA Channel 3 Data Transfer Complete Interrupt Flag Status bit

1= Interrupt request has occurred

0= Interrupt request has not occurred

C1IF: ECAN1 Event Interrupt Flag Status bit

1= Interrupt request has occurred

0= Interrupt request has not occurred

 2009-2012 Microchip Technology Inc.

DS70592D-page 81

PIC24HJXXXGPX06A/X08A/X10A

REGISTER 7-7:

IFS2: INTERRUPT FLAG STATUS REGISTER 2 (CONTINUED)

bit 2

bit 1

bit 0

C1RXIF: ECAN1 Receive Data Ready Interrupt Flag Status bit

1= Interrupt request has occurred

0= Interrupt request has not occurred

SPI2IF: SPI2 Event Interrupt Flag Status bit

1= Interrupt request has occurred

0= Interrupt request has not occurred

SPI2EIF: SPI2 Error Interrupt Flag Status bit

1= Interrupt request has occurred

0= Interrupt request has not occurred

DS70592D-page 82

 2009-2012 Microchip Technology Inc.

PIC24HJXXXGPX06A/X08A/X10A

REGISTER 7-8:

IFS3: INTERRUPT FLAG STATUS REGISTER 3

U-0

—

U-0

—

R/W-0

U-0

—

U-0

—

U-0

—

U-0

—

R/W-0

C2IF

DMA5IF

bit 15

bit 8

R/W-0

C2RXIF

bit 7

R/W-0

INT4IF

R/W-0

INT3IF

R/W-0

T9IF

R/W-0

T8IF

R/W-0

T7IF

MI2C2IF

SI2C2IF

bit 0

Legend:

R = Readable bit

-n = Value at POR

W = Writable bit

‘1’ = Bit is set

U = Unimplemented bit, read as ‘0’

‘0’ = Bit is cleared x = Bit is unknown

bit 15-14

bit 13

Unimplemented: Read as ‘0’

DMA5IF: DMA Channel 5 Data Transfer Complete Interrupt Flag Status bit

1= Interrupt request has occurred

0= Interrupt request has not occurred

bit 12-9

bit 8

Unimplemented: Read as ‘0’

C2IF: ECAN2 Event Interrupt Flag Status bit

1= Interrupt request has occurred

0= Interrupt request has not occurred

bit 7

bit 6

bit 5

bit 4

bit 3

bit 2

bit 1

bit 0

C2RXIF: ECAN2 Receive Data Ready Interrupt Flag Status bit

1= Interrupt request has occurred

0= Interrupt request has not occurred

INT4IF: External Interrupt 4 Flag Status bit

1= Interrupt request has occurred

0= Interrupt request has not occurred

INT3IF: External Interrupt 3 Flag Status bit

1= Interrupt request has occurred

0= Interrupt request has not occurred

T9IF: Timer9 Interrupt Flag Status bit

1= Interrupt request has occurred

0= Interrupt request has not occurred

T8IF: Timer8 Interrupt Flag Status bit

1= Interrupt request has occurred

0= Interrupt request has not occurred

MI2C2IF: I2C2 Master Events Interrupt Flag Status bit

1= Interrupt request has occurred

0= Interrupt request has not occurred

SI2C2IF: I2C2 Slave Events Interrupt Flag Status bit

1= Interrupt request has occurred

0= Interrupt request has not occurred

T7IF: Timer7 Interrupt Flag Status bit

1= Interrupt request has occurred

0= Interrupt request has not occurred

 2009-2012 Microchip Technology Inc.

DS70592D-page 83

PIC24HJXXXGPX06A/X08A/X10A

REGISTER 7-9:

IFS4: INTERRUPT FLAG STATUS REGISTER 4

U-0

—

U-0

—

U-0

—

U-0

—

U-0

—

U-0

—

U-0

—

U-0

—

bit 15

bit 8

bit 0

R/W-0

C2TXIF

bit 7

R/W-0

U-0

—

R/W-0

U2EIF

R/W-0

U1EIF

U-0

—

C1TXIF

DMA7IF

DMA6IF

Legend:

R = Readable bit

-n = Value at POR

W = Writable bit

‘1’ = Bit is set

U = Unimplemented bit, read as ‘0’

‘0’ = Bit is cleared x = Bit is unknown

bit 15-8

bit 7

Unimplemented: Read as ‘0’

C2TXIF: ECAN2 Transmit Data Request Interrupt Flag Status bit

1= Interrupt request has occurred

0= Interrupt request has not occurred

bit 6

bit 5

bit 4

C1TXIF: ECAN1 Transmit Data Request Interrupt Flag Status bit

1= Interrupt request has occurred

0= Interrupt request has not occurred

DMA7IF: DMA Channel 7 Data Transfer Complete Interrupt Flag Status bit

1= Interrupt request has occurred

0= Interrupt request has not occurred

DMA6IF: DMA Channel 6 Data Transfer Complete Interrupt Flag Status bit

1= Interrupt request has occurred

0= Interrupt request has not occurred

bit 3

bit 2

Unimplemented: Read as ‘0’

U2EIF: UART2 Error Interrupt Flag Status bit

1= Interrupt request has occurred

0= Interrupt request has not occurred

bit 1

bit 0

U1EIF: UART1 Error Interrupt Flag Status bit

1= Interrupt request has occurred

0= Interrupt request has not occurred

Unimplemented: Read as ‘0’

DS70592D-page 84

 2009-2012 Microchip Technology Inc.

PIC24HJXXXGPX06A/X08A/X10A

REGISTER 7-10: IEC0: INTERRUPT ENABLE CONTROL REGISTER 0

U-0

—

R/W-0

AD1IE

R/W-0

T3IE

DMA1IE

U1TXIE

U1RXIE

SPI1IE

SPI1EIE

bit 15

bit 8

R/W-0

T2IE

R/W-0

OC2IE

R/W-0

IC2IE

R/W-0

T1IE

R/W-0

OC1IE

R/W-0

IC1IE

R/W-0

DMA0IE

INT0IE

bit 7

bit 0

Legend:

R = Readable bit

-n = Value at POR

W = Writable bit

‘1’ = Bit is set

U = Unimplemented bit, read as ‘0’

‘0’ = Bit is cleared x = Bit is unknown

bit 15

bit 14

Unimplemented: Read as ‘0’

DMA1IE: DMA Channel 1 Data Transfer Complete Interrupt Enable bit

1= Interrupt request enabled

0= Interrupt request not enabled

bit 13

bit 12

bit 11

bit 10

bit 9

AD1IE: ADC1 Conversion Complete Interrupt Enable bit

1= Interrupt request enabled

0= Interrupt request not enabled

U1TXIE: UART1 Transmitter Interrupt Enable bit

1= Interrupt request enabled

0= Interrupt request not enabled

U1RXIE: UART1 Receiver Interrupt Enable bit

1= Interrupt request enabled

0= Interrupt request not enabled

SPI1IE: SPI1 Event Interrupt Enable bit

1= Interrupt request enabled

0= Interrupt request not enabled

SPI1EIE: SPI1 Error Interrupt Enable bit

1= Interrupt request enabled

0= Interrupt request not enabled

bit 8

T3IE: Timer3 Interrupt Enable bit

1= Interrupt request enabled

0= Interrupt request not enabled

bit 7

T2IE: Timer2 Interrupt Enable bit

1= Interrupt request enabled

0= Interrupt request not enabled

bit 6

OC2IE: Output Compare Channel 2 Interrupt Enable bit

1= Interrupt request enabled

0= Interrupt request not enabled

bit 5

IC2IE: Input Capture Channel 2 Interrupt Enable bit

1= Interrupt request enabled

0= Interrupt request not enabled

bit 4

DMA0IE: DMA Channel 0 Data Transfer Complete Interrupt Enable bit

1= Interrupt request enabled

0= Interrupt request not enabled

bit 3

T1IE: Timer1 Interrupt Enable bit

1= Interrupt request enabled

0= Interrupt request not enabled

 2009-2012 Microchip Technology Inc.

DS70592D-page 85

PIC24HJXXXGPX06A/X08A/X10A

REGISTER 7-10: IEC0: INTERRUPT ENABLE CONTROL REGISTER 0 (CONTINUED)

bit 2

bit 1

bit 0

OC1IE: Output Compare Channel 1 Interrupt Enable bit

1= Interrupt request enabled

0= Interrupt request not enabled

IC1IE: Input Capture Channel 1 Interrupt Enable bit

1= Interrupt request enabled

0= Interrupt request not enabled

INT0IE: External Interrupt 0 Enable bit

1= Interrupt request enabled

0= Interrupt request not enabled

DS70592D-page 86

 2009-2012 Microchip Technology Inc.

PIC24HJXXXGPX06A/X08A/X10A

REGISTER 7-11: IEC1: INTERRUPT ENABLE CONTROL REGISTER 1

R/W-0

T5IE

R/W-0

T4IE

R/W-0

OC4IE

R/W-0

OC3IE

R/W-0

U2TXIE

U2RXIE

INT2IE

DMA2IE

bit 15

bit 8

R/W-0

IC8IE

R/W-0

IC7IE

R/W-0

AD2IE

R/W-0

CNIE

U-0

—

R/W-0

INT1IE

MI2C1IE

SI2C1IE

bit 7

bit 0

Legend:

R = Readable bit

-n = Value at POR

W = Writable bit

‘1’ = Bit is set

U = Unimplemented bit, read as ‘0’

‘0’ = Bit is cleared x = Bit is unknown

bit 15

bit 14

bit 13

bit 12

bit 11

bit 10

bit 9

U2TXIE: UART2 Transmitter Interrupt Enable bit

1= Interrupt request enabled

0= Interrupt request not enabled

U2RXIE: UART2 Receiver Interrupt Enable bit

1= Interrupt request enabled

0= Interrupt request not enabled

INT2IE: External Interrupt 2 Enable bit

1= Interrupt request enabled

0= Interrupt request not enabled

T5IE: Timer5 Interrupt Enable bit

1= Interrupt request enabled

0= Interrupt request not enabled

T4IE: Timer4 Interrupt Enable bit

1= Interrupt request enabled

0= Interrupt request not enabled

OC4IE: Output Compare Channel 4 Interrupt Enable bit

1= Interrupt request enabled

0= Interrupt request not enabled

OC3IE: Output Compare Channel 3 Interrupt Enable bit

1= Interrupt request enabled

0= Interrupt request not enabled

bit 8

DMA2IE: DMA Channel 2 Data Transfer Complete Interrupt Enable bit

1= Interrupt request enabled

0= Interrupt request not enabled

bit 7

IC8IE: Input Capture Channel 8 Interrupt Enable bit

1= Interrupt request enabled

0= Interrupt request not enabled

bit 6

IC7IE: Input Capture Channel 7 Interrupt Enable bit

1= Interrupt request enabled

0= Interrupt request not enabled

bit 5

AD2IE: ADC2 Conversion Complete Interrupt Enable bit

1= Interrupt request enabled

0= Interrupt request not enabled

bit 4

INT1IE: External Interrupt 1 Enable bit

1= Interrupt request enabled

0= Interrupt request not enabled

 2009-2012 Microchip Technology Inc.

DS70592D-page 87

PIC24HJXXXGPX06A/X08A/X10A

REGISTER 7-11: IEC1: INTERRUPT ENABLE CONTROL REGISTER 1 (CONTINUED)

bit 3

CNIE: Input Change Notification Interrupt Enable bit

1= Interrupt request enabled

0= Interrupt request not enabled

bit 2

bit 1

Unimplemented: Read as ‘0’

MI2C1IE: I2C1 Master Events Interrupt Enable bit

1= Interrupt request enabled

0= Interrupt request not enabled

bit 0

SI2C1IE: I2C1 Slave Events Interrupt Enable bit

1= Interrupt request enabled

0= Interrupt request not enabled

DS70592D-page 88

 2009-2012 Microchip Technology Inc.

PIC24HJXXXGPX06A/X08A/X10A

REGISTER 7-12: IEC2: INTERRUPT ENABLE CONTROL REGISTER 2

R/W-0

T6IE

R/W-0

U-0

—

R/W-0

OC8IE

R/W-0

OC7IE

R/W-0

OC6IE

R/W-0

OC5IE

R/W-0

IC6IE

DMA4IE

bit 15

bit 8

R/W-0

IC5IE

R/W-0

IC4IE

R/W-0

IC3IE

R/W-0

C1IE

R/W-0

DMA3IE

C1RXIE

SPI2IE

SPI2EIE

bit 7

bit 0

Legend:

R = Readable bit

-n = Value at POR

W = Writable bit

‘1’ = Bit is set

U = Unimplemented bit, read as ‘0’

‘0’ = Bit is cleared x = Bit is unknown

bit 15

bit 14

T6IE: Timer6 Interrupt Enable bit

1= Interrupt request enabled

0= Interrupt request not enabled

DMA4IE: DMA Channel 4 Data Transfer Complete Interrupt Enable bit

1= Interrupt request enabled

0= Interrupt request not enabled

bit 13

bit 12

Unimplemented: Read as ‘0’

OC8IE: Output Compare Channel 8 Interrupt Enable bit

1= Interrupt request enabled

0= Interrupt request not enabled

bit 11

bit 10

bit 9

bit 8

bit 7

bit 6

bit 5

bit 4

bit 3

OC7IE: Output Compare Channel 7 Interrupt Enable bit

1= Interrupt request enabled

0= Interrupt request not enabled

OC6IE: Output Compare Channel 6 Interrupt Enable bit

1= Interrupt request enabled

0= Interrupt request not enabled

OC5IE: Output Compare Channel 5 Interrupt Enable bit

1= Interrupt request enabled

0= Interrupt request not enabled

IC6IE: Input Capture Channel 6 Interrupt Enable bit

1= Interrupt request enabled

0= Interrupt request not enabled

IC5IE: Input Capture Channel 5 Interrupt Enable bit

1= Interrupt request enabled

0= Interrupt request not enabled

IC4IE: Input Capture Channel 4 Interrupt Enable bit

1= Interrupt request enabled

0= Interrupt request not enabled

IC3IE: Input Capture Channel 3 Interrupt Enable bit

1= Interrupt request enabled

0= Interrupt request not enabled

DMA3IE: DMA Channel 3 Data Transfer Complete Interrupt Enable bit

1= Interrupt request enabled

0= Interrupt request not enabled

C1IE: ECAN1 Event Interrupt Enable bit

1= Interrupt request enabled

0= Interrupt request not enabled

 2009-2012 Microchip Technology Inc.

DS70592D-page 89

PIC24HJXXXGPX06A/X08A/X10A

REGISTER 7-12: IEC2: INTERRUPT ENABLE CONTROL REGISTER 2 (CONTINUED)

bit 2

bit 1

bit 0

C1RXIE: ECAN1 Receive Data Ready Interrupt Enable bit

1= Interrupt request enabled

0= Interrupt request not enabled

SPI2IE: SPI2 Event Interrupt Enable bit

1= Interrupt request enabled

0= Interrupt request not enabled

SPI2EIE: SPI2 Error Interrupt Enable bit

1= Interrupt request enabled

0= Interrupt request not enabled

DS70592D-page 90

 2009-2012 Microchip Technology Inc.

PIC24HJXXXGPX06A/X08A/X10A

REGISTER 7-13: IEC3: INTERRUPT ENABLE CONTROL REGISTER 3

U-0

—

U-0

—

R/W-0

U-0

—

U-0

—

U-0

—

U-0

—

R/W-0

C2IE

DMA5IE

bit 15

bit 8

R/W-0

T9IE

R/W-0

T8IE

R/W-0

T7IE

C2RXIE

INT4IE

INT3IE

MI2C2IE

SI2C2IE

bit 7

bit 0

Legend:

R = Readable bit

-n = Value at POR

W = Writable bit

‘1’ = Bit is set

U = Unimplemented bit, read as ‘0’

‘0’ = Bit is cleared x = Bit is unknown

bit 15-14

bit 13

Unimplemented: Read as ‘0’

DMA5IE: DMA Channel 5 Data Transfer Complete Interrupt Enable bit

1= Interrupt request enabled

0= Interrupt request not enabled

bit 12-9

bit 8

Unimplemented: Read as ‘0’

C2IE: ECAN2 Event Interrupt Enable bit

1= Interrupt request enabled

0= Interrupt request not enabled

bit 7

bit 6

bit 5

bit 4

bit 3

bit 2

bit 1

bit 0

C2RXIE: ECAN2 Receive Data Ready Interrupt Enable bit

1= Interrupt request enabled

0= Interrupt request not enabled

INT4IE: External Interrupt 4 Enable bit

1= Interrupt request enabled

0= Interrupt request not enabled

INT3IE: External Interrupt 3 Enable bit

1= Interrupt request enabled

0= Interrupt request not enabled

T9IE: Timer9 Interrupt Enable bit

1= Interrupt request enabled

0= Interrupt request not enabled

T8IE: Timer8 Interrupt Enable bit

1= Interrupt request enabled

0= Interrupt request not enabled

MI2C2IE: I2C2 Master Events Interrupt Enable bit

1= Interrupt request enabled

0= Interrupt request not enabled

SI2C2IE: I2C2 Slave Events Interrupt Enable bit

1= Interrupt request enabled

0= Interrupt request not enabled

T7IE: Timer7 Interrupt Enable bit

1= Interrupt request enabled

0= Interrupt request not enabled

 2009-2012 Microchip Technology Inc.

DS70592D-page 91

PIC24HJXXXGPX06A/X08A/X10A

REGISTER 7-14: IEC4: INTERRUPT ENABLE CONTROL REGISTER 4

U-0

—

U-0

—

U-0

—

U-0

—

U-0

—

U-0

—

U-0

—

U-0

—

bit 15

bit 8

bit 0

R/W-0

U-0

—

R/W-0

U2EIE

R/W-0

U1EIE

U-0

—

C2TXIE

C1TXIE

DMA7IE

DMA6IE

bit 7

Legend:

R = Readable bit

-n = Value at POR

W = Writable bit

‘1’ = Bit is set

U = Unimplemented bit, read as ‘0’

‘0’ = Bit is cleared x = Bit is unknown

bit 15-8

bit 7

Unimplemented: Read as ‘0’

C2TXIE: ECAN2 Transmit Data Request Interrupt Enable bit

1= Interrupt request enabled

0= Interrupt request not enabled

bit 6

bit 5

bit 4

C1TXIE: ECAN1 Transmit Data Request Interrupt Enable bit

1= Interrupt request enabled

0= Interrupt request not enabled

DMA7IE: DMA Channel 7 Data Transfer Complete Enable Status bit

1= Interrupt request enabled

0= Interrupt request not enabled

DMA6IE: DMA Channel 6 Data Transfer Complete Enable Status bit

1= Interrupt request enabled

0= Interrupt request not enabled

bit 3

bit 2

Unimplemented: Read as ‘0’

U2EIE: UART2 Error Interrupt Enable bit

1= Interrupt request enabled

0= Interrupt request not enabled

bit 1

bit 0

U1EIE: UART1 Error Interrupt Enable bit

1= Interrupt request enabled

0= Interrupt request not enabled

Unimplemented: Read as ‘0’

DS70592D-page 92

 2009-2012 Microchip Technology Inc.

PIC24HJXXXGPX06A/X08A/X10A

REGISTER 7-15: IPC0: INTERRUPT PRIORITY CONTROL REGISTER 0

U-0

—

R/W-1

R/W-0

U-0

—

R/W-1

R/W-0

bit 8

R/W-0

T1IP<2:0>

OC1IP<2:0>

bit 15

U-0

—

R/W-1

R/W-0

U-0

—

R/W-1

R/W-0

IC1IP<2:0>

INT0IP<2:0>

bit 7

bit 0

Legend:

R = Readable bit

-n = Value at POR

W = Writable bit

‘1’ = Bit is set

U = Unimplemented bit, read as ‘0’

‘0’ = Bit is cleared x = Bit is unknown

bit 15

Unimplemented: Read as ‘0’

T1IP<2:0>: Timer1 Interrupt Priority bits

bit 14-12

111= Interrupt is priority 7 (highest priority interrupt)

•

001= Interrupt is priority 1

000= Interrupt source is disabled

bit 11

Unimplemented: Read as ‘0’

bit 10-8

OC1IP<2:0>: Output Compare Channel 1 Interrupt Priority bits

111= Interrupt is priority 7 (highest priority interrupt)

•

001= Interrupt is priority 1

000= Interrupt source is disabled

bit 7

Unimplemented: Read as ‘0’

bit 6-4

IC1IP<2:0>: Input Capture Channel 1 Interrupt Priority bits

111= Interrupt is priority 7 (highest priority interrupt)

•

001= Interrupt is priority 1

000= Interrupt source is disabled

bit 3

Unimplemented: Read as ‘0’

bit 2-0

INT0IP<2:0>: External Interrupt 0 Priority bits

111= Interrupt is priority 7 (highest priority interrupt)

•

001= Interrupt is priority 1

000= Interrupt source is disabled

 2009-2012 Microchip Technology Inc.

DS70592D-page 93

PIC24HJXXXGPX06A/X08A/X10A

REGISTER 7-16: IPC1: INTERRUPT PRIORITY CONTROL REGISTER 1

U-0

—

R/W-1

R/W-0

U-0

—

R/W-1

R/W-0

bit 8

R/W-0

T2IP<2:0>

OC2IP<2:0>

bit 15

U-0

—

R/W-1

R/W-0

U-0

—

R/W-1

R/W-0

IC2IP<2:0>

DMA0IP<2:0>

bit 7

bit 0

Legend:

R = Readable bit

-n = Value at POR

W = Writable bit

‘1’ = Bit is set

U = Unimplemented bit, read as ‘0’

‘0’ = Bit is cleared x = Bit is unknown

bit 15

Unimplemented: Read as ‘0’

T2IP<2:0>: Timer2 Interrupt Priority bits

bit 14-12

111= Interrupt is priority 7 (highest priority interrupt)

•

001= Interrupt is priority 1

000= Interrupt source is disabled

bit 11

Unimplemented: Read as ‘0’

bit 10-8

OC2IP<2:0>: Output Compare Channel 2 Interrupt Priority bits

111= Interrupt is priority 7 (highest priority interrupt)

•

001= Interrupt is priority 1

000= Interrupt source is disabled

bit 7

Unimplemented: Read as ‘0’

bit 6-4

IC2IP<2:0>: Input Capture Channel 2 Interrupt Priority bits

111= Interrupt is priority 7 (highest priority interrupt)

•

001= Interrupt is priority 1

000= Interrupt source is disabled

bit 3

Unimplemented: Read as ‘0’

bit 2-0

DMA0IP<2:0>: DMA Channel 0 Data Transfer Complete Interrupt Priority bits

111= Interrupt is priority 7 (highest priority interrupt)

•

001= Interrupt is priority 1

000= Interrupt source is disabled

DS70592D-page 94

 2009-2012 Microchip Technology Inc.

PIC24HJXXXGPX06A/X08A/X10A

REGISTER 7-17: IPC2: INTERRUPT PRIORITY CONTROL REGISTER 2

U-0

—

R/W-1

R/W-0

U-0

—

R/W-1

R/W-0

bit 8

R/W-0

U1RXIP<2:0>

SPI1IP<2:0>

bit 15

U-0

—

R/W-1

R/W-0

U-0

—

R/W-1

R/W-0

SPI1EIP<2:0>

T3IP<2:0>

bit 7

bit 0

Legend:

R = Readable bit

-n = Value at POR

W = Writable bit

‘1’ = Bit is set

U = Unimplemented bit, read as ‘0’

‘0’ = Bit is cleared x = Bit is unknown

bit 15

Unimplemented: Read as ‘0’

bit 14-12

U1RXIP<2:0>: UART1 Receiver Interrupt Priority bits

111= Interrupt is priority 7 (highest priority interrupt)

•

001= Interrupt is priority 1

000= Interrupt source is disabled

bit 11

Unimplemented: Read as ‘0’

bit 10-8

SPI1IP<2:0>: SPI1 Event Interrupt Priority bits

111= Interrupt is priority 7 (highest priority interrupt)

•

001= Interrupt is priority 1

000= Interrupt source is disabled

bit 7

Unimplemented: Read as ‘0’

bit 6-4

SPI1EIP<2:0>: SPI1 Error Interrupt Priority bits

111= Interrupt is priority 7 (highest priority interrupt)

•

001= Interrupt is priority 1

000= Interrupt source is disabled

bit 3

Unimplemented: Read as ‘0’

bit 2-0

T3IP<2:0>: Timer3 Interrupt Priority bits

111= Interrupt is priority 7 (highest priority interrupt)

•

001= Interrupt is priority 1

000= Interrupt source is disabled

 2009-2012 Microchip Technology Inc.

DS70592D-page 95

PIC24HJXXXGPX06A/X08A/X10A

REGISTER 7-18: IPC3: INTERRUPT PRIORITY CONTROL REGISTER 3

U-0

—

U-0

—

U-0

—

U-0

—

U-0

—

R/W-1

R/W-0

bit 8

R/W-0

DMA1IP<2:0>

bit 15

U-0

—

R/W-1

R/W-0

U-0

—

R/W-1

R/W-0

AD1IP<2:0>

U1TXIP<2:0>

bit 7

bit 0

Legend:

R = Readable bit

-n = Value at POR

W = Writable bit

‘1’ = Bit is set

U = Unimplemented bit, read as ‘0’

‘0’ = Bit is cleared x = Bit is unknown

bit 15-11

bit 10-8

Unimplemented: Read as ‘0’

DMA1IP<2:0>: DMA Channel 1 Data Transfer Complete Interrupt Priority bits

111= Interrupt is priority 7 (highest priority interrupt)

•

001= Interrupt is priority 1

000= Interrupt source is disabled

bit 7

Unimplemented: Read as ‘0’

bit 6-4

AD1IP<2:0>: ADC1 Conversion Complete Interrupt Priority bits

111= Interrupt is priority 7 (highest priority interrupt)

•

001= Interrupt is priority 1

000= Interrupt source is disabled

bit 3

Unimplemented: Read as ‘0’

bit 2-0

U1TXIP<2:0>: UART1 Transmitter Interrupt Priority bits

111= Interrupt is priority 7 (highest priority interrupt)

•

001= Interrupt is priority 1

000= Interrupt source is disabled

DS70592D-page 96

 2009-2012 Microchip Technology Inc.

PIC24HJXXXGPX06A/X08A/X10A

REGISTER 7-19: IPC4: INTERRUPT PRIORITY CONTROL REGISTER 4

U-0

—

R/W-1

R/W-0

U-0

—

U-0

—

U-0

—

U-0

—

CNIP<2:0>

bit 15

bit 8

U-0

—

R/W-1

R/W-0

U-0

—

R/W-1

R/W-0

MI2C1IP<2:0>

SI2C1IP<2:0>

bit 7

bit 0

Legend:

R = Readable bit

-n = Value at POR

W = Writable bit

‘1’ = Bit is set

U = Unimplemented bit, read as ‘0’

‘0’ = Bit is cleared x = Bit is unknown

bit 15

Unimplemented: Read as ‘0’

bit 14-12

CNIP<2:0>: Change Notification Interrupt Priority bits

111= Interrupt is priority 7 (highest priority interrupt)

•

001= Interrupt is priority 1

000= Interrupt source is disabled

bit 11-7

bit 6-4

Unimplemented: Read as ‘0’

MI2C1IP<2:0>: I2C1 Master Events Interrupt Priority bits

111= Interrupt is priority 7 (highest priority interrupt)

•

001= Interrupt is priority 1

000= Interrupt source is disabled

bit 3

Unimplemented: Read as ‘0’

bit 2-0

SI2C1IP<2:0>: I2C1 Slave Events Interrupt Priority bits

111= Interrupt is priority 7 (highest priority interrupt)

•

001= Interrupt is priority 1

000= Interrupt source is disabled

 2009-2012 Microchip Technology Inc.

DS70592D-page 97

PIC24HJXXXGPX06A/X08A/X10A

REGISTER 7-20: IPC5: INTERRUPT PRIORITY CONTROL REGISTER 5

U-0

—

R/W-1

R/W-0

U-0

—

R/W-1

R/W-0

bit 8

R/W-0

IC8IP<2:0>

IC7IP<2:0>

bit 15

U-0

—

R/W-1

R/W-0

U-0

—

R/W-1

R/W-0

AD2IP<2:0>

INT1IP<2:0>

bit 7

bit 0

Legend:

R = Readable bit

-n = Value at POR

W = Writable bit

‘1’ = Bit is set

U = Unimplemented bit, read as ‘0’

‘0’ = Bit is cleared x = Bit is unknown

bit 15

Unimplemented: Read as ‘0’

bit 14-12

IC8IP<2:0>: Input Capture Channel 8 Interrupt Priority bits

111= Interrupt is priority 7 (highest priority interrupt)

•

001= Interrupt is priority 1

000= Interrupt source is disabled

bit 11

Unimplemented: Read as ‘0’

bit 10-8

IC7IP<2:0>: Input Capture Channel 7 Interrupt Priority bits

111= Interrupt is priority 7 (highest priority interrupt)

•

001= Interrupt is priority 1

000= Interrupt source is disabled

bit 7

Unimplemented: Read as ‘0’

bit 6-4

AD2IP<2:0>: ADC2 Conversion Complete Interrupt Priority bits

111= Interrupt is priority 7 (highest priority interrupt)

•

001= Interrupt is priority 1

000= Interrupt source is disabled

bit 3

Unimplemented: Read as ‘0’

bit 2-0

INT1IP<2:0>: External Interrupt 1 Priority bits

111= Interrupt is priority 7 (highest priority interrupt)

•

001= Interrupt is priority 1

000= Interrupt source is disabled

DS70592D-page 98

 2009-2012 Microchip Technology Inc.

PIC24HJXXXGPX06A/X08A/X10A

REGISTER 7-21: IPC6: INTERRUPT PRIORITY CONTROL REGISTER 6

U-0

—

R/W-1

R/W-0

U-0

—

R/W-1

R/W-0

bit 8

R/W-0

T4IP<2:0>

OC4IP<2:0>

bit 15

U-0

—

R/W-1

R/W-0

U-0

—

R/W-1

R/W-0

OC3IP<2:0>

DMA2IP<2:0>

bit 7

bit 0

Legend:

R = Readable bit

-n = Value at POR

W = Writable bit

‘1’ = Bit is set

U = Unimplemented bit, read as ‘0’

‘0’ = Bit is cleared x = Bit is unknown

bit 15

Unimplemented: Read as ‘0’

T4IP<2:0>: Timer4 Interrupt Priority bits

bit 14-12

111= Interrupt is priority 7 (highest priority interrupt)

•

001= Interrupt is priority 1

000= Interrupt source is disabled

bit 11

Unimplemented: Read as ‘0’

bit 10-8

OC4IP<2:0>: Output Compare Channel 4 Interrupt Priority bits

111= Interrupt is priority 7 (highest priority interrupt)

•

001= Interrupt is priority 1

000= Interrupt source is disabled

bit 7

Unimplemented: Read as ‘0’

bit 6-4

OC3IP<2:0>: Output Compare Channel 3 Interrupt Priority bits

111= Interrupt is priority 7 (highest priority interrupt)

•

001= Interrupt is priority 1

000= Interrupt source is disabled

bit 3

Unimplemented: Read as ‘0’

bit 2-0

DMA2IP<2:0>: DMA Channel 2 Data Transfer Complete Interrupt Priority bits

111= Interrupt is priority 7 (highest priority interrupt)

•

001= Interrupt is priority 1

000= Interrupt source is disabled

 2009-2012 Microchip Technology Inc.

DS70592D-page 99

PIC24HJXXXGPX06A/X08A/X10A

REGISTER 7-22: IPC7: INTERRUPT PRIORITY CONTROL REGISTER 7

U-0

—

R/W-1

R/W-0

U-0

—

R/W-1

R/W-0

bit 8

R/W-0

U2TXIP<2:0>

U2RXIP<2:0>

bit 15

U-0

—

R/W-1

R/W-0

U-0

—

R/W-1

R/W-0

INT2IP<2:0>

T5IP<2:0>

bit 7

bit 0

Legend:

R = Readable bit

-n = Value at POR

W = Writable bit

‘1’ = Bit is set

U = Unimplemented bit, read as ‘0’

‘0’ = Bit is cleared x = Bit is unknown

bit 15

Unimplemented: Read as ‘0’

bit 14-12

U2TXIP<2:0>: UART2 Transmitter Interrupt Priority bits

111= Interrupt is priority 7 (highest priority interrupt)

•

001= Interrupt is priority 1

000= Interrupt source is disabled

bit 11

Unimplemented: Read as ‘0’

bit 10-8

U2RXIP<2:0>: UART2 Receiver Interrupt Priority bits

111= Interrupt is priority 7 (highest priority interrupt)

•

001= Interrupt is priority 1

000= Interrupt source is disabled

bit 7

Unimplemented: Read as ‘0’

bit 6-4

INT2IP<2:0>: External Interrupt 2 Priority bits

111= Interrupt is priority 7 (highest priority interrupt)

•

001= Interrupt is priority 1

000= Interrupt source is disabled

bit 3

Unimplemented: Read as ‘0’

bit 2-0

T5IP<2:0>: Timer5 Interrupt Priority bits

111= Interrupt is priority 7 (highest priority interrupt)

•

001= Interrupt is priority 1

000= Interrupt source is disabled

DS70592D-page 100

 2009-2012 Microchip Technology Inc.

PIC24HJXXXGPX06A/X08A/X10A

REGISTER 7-23: IPC8: INTERRUPT PRIORITY CONTROL REGISTER 8

U-0

—

R/W-1

R/W-0

U-0

—

R/W-1

R/W-0

bit 8

R/W-0

C1IP<2:0>

C1RXIP<2:0>

bit 15

U-0

—

R/W-1

R/W-0

U-0

—

R/W-1

R/W-0

SPI2IP<2:0>

SPI2EIP<2:0>

bit 7

bit 0

Legend:

R = Readable bit

-n = Value at POR

W = Writable bit

‘1’ = Bit is set

U = Unimplemented bit, read as ‘0’

‘0’ = Bit is cleared x = Bit is unknown

bit 15

Unimplemented: Read as ‘0’

bit 14-12

C1IP<2:0>: ECAN1 Event Interrupt Priority bits

111= Interrupt is priority 7 (highest priority interrupt)

•

001= Interrupt is priority 1

000= Interrupt source is disabled

bit 11

Unimplemented: Read as ‘0’

bit 10-8

C1RXIP<2:0>: ECAN1 Receive Data Ready Interrupt Priority bits

111= Interrupt is priority 7 (highest priority interrupt)

•

001= Interrupt is priority 1

000= Interrupt source is disabled

bit 7

Unimplemented: Read as ‘0’

bit 6-4

SPI2IP<2:0>: SPI2 Event Interrupt Priority bits

111= Interrupt is priority 7 (highest priority interrupt)

•

001= Interrupt is priority 1

000= Interrupt source is disabled

bit 3

Unimplemented: Read as ‘0’

bit 2-0

SPI2EIP<2:0>: SPI2 Error Interrupt Priority bits

111= Interrupt is priority 7 (highest priority interrupt)

•

001= Interrupt is priority 1

000= Interrupt source is disabled

 2009-2012 Microchip Technology Inc.

DS70592D-page 101

PIC24HJXXXGPX06A/X08A/X10A

REGISTER 7-24: IPC9: INTERRUPT PRIORITY CONTROL REGISTER 9

U-0

—

R/W-1

R/W-0

U-0

—

R/W-1

R/W-0

bit 8

R/W-0

IC5IP<2:0>

IC4IP<2:0>

bit 15

U-0

—

R/W-1

R/W-0

U-0

—

R/W-1

R/W-0

IC3IP<2:0>

DMA3IP<2:0>

bit 7

bit 0

Legend:

R = Readable bit

-n = Value at POR

W = Writable bit

‘1’ = Bit is set

U = Unimplemented bit, read as ‘0’

‘0’ = Bit is cleared x = Bit is unknown

bit 15

Unimplemented: Read as ‘0’

bit 14-12

IC5IP<2:0>: Input Capture Channel 5 Interrupt Priority bits

111= Interrupt is priority 7 (highest priority interrupt)

•

001= Interrupt is priority 1

000= Interrupt source is disabled

bit 11

Unimplemented: Read as ‘0’

bit 10-8

IC4IP<2:0>: Input Capture Channel 4 Interrupt Priority bits

111= Interrupt is priority 7 (highest priority interrupt)

•

001= Interrupt is priority 1

000= Interrupt source is disabled

bit 7

Unimplemented: Read as ‘0’

bit 6-4

IC3IP<2:0>: Input Capture Channel 3 Interrupt Priority bits

111= Interrupt is priority 7 (highest priority interrupt)

•

001= Interrupt is priority 1

000= Interrupt source is disabled

bit 3

Unimplemented: Read as ‘0’

bit 2-0

DMA3IP<2:0>: DMA Channel 3 Data Transfer Complete Interrupt Priority bits

111= Interrupt is priority 7 (highest priority interrupt)

•

001= Interrupt is priority 1

000= Interrupt source is disabled

DS70592D-page 102

 2009-2012 Microchip Technology Inc.

PIC24HJXXXGPX06A/X08A/X10A

REGISTER 7-25: IPC10: INTERRUPT PRIORITY CONTROL REGISTER 10

U-0

—

R/W-1

R/W-0

U-0

—

R/W-1

R/W-0

bit 8

R/W-0

OC7IP<2:0>

OC6IP<2:0>

bit 15

U-0

—

R/W-1

R/W-0

U-0

—

R/W-1

R/W-0

OC5IP<2:0>

IC6IP<2:0>

bit 7

bit 0

Legend:

R = Readable bit

-n = Value at POR

W = Writable bit

‘1’ = Bit is set

U = Unimplemented bit, read as ‘0’

‘0’ = Bit is cleared x = Bit is unknown

bit 15

Unimplemented: Read as ‘0’

bit 14-12

OC7IP<2:0>: Output Compare Channel 7 Interrupt Priority bits

111= Interrupt is priority 7 (highest priority interrupt)

•

001= Interrupt is priority 1

000= Interrupt source is disabled

bit 11

Unimplemented: Read as ‘0’

bit 10-8

OC6IP<2:0>: Output Compare Channel 6 Interrupt Priority bits

111= Interrupt is priority 7 (highest priority interrupt)

•

001= Interrupt is priority 1

000= Interrupt source is disabled

bit 7

Unimplemented: Read as ‘0’

bit 6-4

OC5IP<2:0>: Output Compare Channel 5 Interrupt Priority bits

111= Interrupt is priority 7 (highest priority interrupt)

•

001= Interrupt is priority 1

000= Interrupt source is disabled

bit 3

Unimplemented: Read as ‘0’

bit 2-0

IC6IP<2:0>: Input Capture Channel 6 Interrupt Priority bits

111= Interrupt is priority 7 (highest priority interrupt)

•

001= Interrupt is priority 1

000= Interrupt source is disabled

 2009-2012 Microchip Technology Inc.

DS70592D-page 103

PIC24HJXXXGPX06A/X08A/X10A

REGISTER 7-26: IPC11: INTERRUPT PRIORITY CONTROL REGISTER 11

U-0

—

R/W-1

R/W-0

U-0

—

R/W-1

R/W-0

bit 8

R/W-0

T6IP<2:0>

DMA4IP<2:0>

bit 15

U-0

—

U-0

—

U-0

—

U-0

—

U-0

—

R/W-1

R/W-0

OC8IP<2:0>

bit 7

bit 0

Legend:

R = Readable bit

-n = Value at POR

W = Writable bit

‘1’ = Bit is set

U = Unimplemented bit, read as ‘0’

‘0’ = Bit is cleared x = Bit is unknown

bit 15

Unimplemented: Read as ‘0’

T6IP<2:0>: Timer6 Interrupt Priority bits

bit 14-12

111= Interrupt is priority 7 (highest priority interrupt)

•

001= Interrupt is priority 1

000= Interrupt source is disabled

bit 11

Unimplemented: Read as ‘0’

bit 10-8

DMA4IP<2:0>: DMA Channel 4 Data Transfer Complete Interrupt Priority bits

111= Interrupt is priority 7 (highest priority interrupt)

•

001= Interrupt is priority 1

000= Interrupt source is disabled

bit 7-3

bit 2-0

Unimplemented: Read as ‘0’

OC8IP<2:0>: Output Compare Channel 8 Interrupt Priority bits

111= Interrupt is priority 7 (highest priority interrupt)

•

001= Interrupt is priority 1

000= Interrupt source is disabled

DS70592D-page 104

 2009-2012 Microchip Technology Inc.

PIC24HJXXXGPX06A/X08A/X10A

REGISTER 7-27: IPC12: INTERRUPT PRIORITY CONTROL REGISTER 12

U-0

—

R/W-1

R/W-0

U-0

—

R/W-1

R/W-0

bit 8

R/W-0

T8IP<2:0>

MI2C2IP<2:0>

bit 15

U-0

—

R/W-1

R/W-0

U-0

—

R/W-1

R/W-0

SI2C2IP<2:0>

T7IP<2:0>

bit 7

bit 0

Legend:

R = Readable bit

-n = Value at POR

W = Writable bit

‘1’ = Bit is set

U = Unimplemented bit, read as ‘0’

‘0’ = Bit is cleared x = Bit is unknown

bit 15

Unimplemented: Read as ‘0’

T8IP<2:0>: Timer8 Interrupt Priority bits

bit 14-12

111= Interrupt is priority 7 (highest priority interrupt)

•

001= Interrupt is priority 1

000= Interrupt source is disabled

bit 11

Unimplemented: Read as ‘0’

bit 10-8

MI2C2IP<2:0>: I2C2 Master Events Interrupt Priority bits

111= Interrupt is priority 7 (highest priority interrupt)

•

001= Interrupt is priority 1

000= Interrupt source is disabled

bit 7

Unimplemented: Read as ‘0’

bit 6-4

SI2C2IP<2:0>: I2C2 Slave Events Interrupt Priority bits

111= Interrupt is priority 7 (highest priority interrupt)

•

001= Interrupt is priority 1

000= Interrupt source is disabled

bit 3

Unimplemented: Read as ‘0’

bit 2-0

T7IP<2:0>: Timer7 Interrupt Priority bits

111= Interrupt is priority 7 (highest priority interrupt)

•

001= Interrupt is priority 1

000= Interrupt source is disabled

 2009-2012 Microchip Technology Inc.

DS70592D-page 105

PIC24HJXXXGPX06A/X08A/X10A

REGISTER 7-28: IPC13: INTERRUPT PRIORITY CONTROL REGISTER 13

U-0

—

R/W-1

R/W-0

U-0

—

R/W-1

R/W-0

bit 8

R/W-0

C2RXIP<2:0>

INT4IP<2:0>

bit 15

U-0

—

R/W-1

R/W-0

U-0

—

R/W-1

R/W-0

INT3IP<2:0>

T9IP<2:0>

bit 7

bit 0

Legend:

R = Readable bit

-n = Value at POR

W = Writable bit

‘1’ = Bit is set

U = Unimplemented bit, read as ‘0’

‘0’ = Bit is cleared x = Bit is unknown

bit 15

Unimplemented: Read as ‘0’

bit 14-12

C2RXIP<2:0>: ECAN2 Receive Data Ready Interrupt Priority bits

111= Interrupt is priority 7 (highest priority interrupt)

•

001= Interrupt is priority 1

000= Interrupt source is disabled

bit 11

Unimplemented: Read as ‘0’

bit 10-8

INT4IP<2:0>: External Interrupt 4 Priority bits

111= Interrupt is priority 7 (highest priority interrupt)

•

001= Interrupt is priority 1

000= Interrupt source is disabled

bit 7

Unimplemented: Read as ‘0’

bit 6-4

INT3IP<2:0>: External Interrupt 3 Priority bits

111= Interrupt is priority 7 (highest priority interrupt)

•

001= Interrupt is priority 1

000= Interrupt source is disabled

bit 3

Unimplemented: Read as ‘0’

bit 2-0

T9IP<2:0>: Timer9 Interrupt Priority bits

111= Interrupt is priority 7 (highest priority interrupt)

•

001= Interrupt is priority 1

000= Interrupt source is disabled

DS70592D-page 106

 2009-2012 Microchip Technology Inc.

PIC24HJXXXGPX06A/X08A/X10A

REGISTER 7-29: IPC14: INTERRUPT PRIORITY CONTROL REGISTER 14

U-0

—

U-0

—

U-0

—

U-0

—

U-0

—

U-0

—

U-0

—

U-0

—

bit 15

bit 8

U-0

—

U-0

—

U-0

—

U-0

—

U-0

—

R/W-1

R/W-0

C2IP<2:0>

bit 7

bit 0

Legend:

R = Readable bit

-n = Value at POR

W = Writable bit

‘1’ = Bit is set

U = Unimplemented bit, read as ‘0’

‘0’ = Bit is cleared x = Bit is unknown

bit 15-3

bit 2-0

Unimplemented: Read as ‘0’

C2IP<2:0>: ECAN2 Event Interrupt Priority bits

111= Interrupt is priority 7 (highest priority interrupt)

•

001= Interrupt is priority 1

000= Interrupt source is disabled

REGISTER 7-30: IPC15: INTERRUPT PRIORITY CONTROL REGISTER 15

U-0

—

U-0

—

U-0

—

U-0

—

U-0

—

U-0

—

U-0

—

U-0

—

bit 15

bit 8

bit 0

U-0

—

R/W-1

R/W-0

U-0

—

U-0

—

U-0

—

U-0

—

DMA5IP<2:0>

bit 7

Legend:

R = Readable bit

-n = Value at POR

W = Writable bit

‘1’ = Bit is set

U = Unimplemented bit, read as ‘0’

‘0’ = Bit is cleared x = Bit is unknown

bit 15-7

bit 6-4

Unimplemented: Read as ‘0’

DMA5IP<2:0>: DMA Channel 5 Data Transfer Complete Interrupt Priority bits

111= Interrupt is priority 7 (highest priority interrupt)

•

001= Interrupt is priority 1

000= Interrupt source is disabled

bit 3-0

Unimplemented: Read as ‘0’

 2009-2012 Microchip Technology Inc.

DS70592D-page 107

PIC24HJXXXGPX06A/X08A/X10A

REGISTER 7-31: IPC16: INTERRUPT PRIORITY CONTROL REGISTER 16

U-0

—

U-0

—

U-0

—

U-0

—

U-0

—

R/W-1

R/W-0

bit 8

U2EIP<2:0>

bit 15

U-0

—

R/W-1

R/W-0

U-0

—

U-0

—

U-0

—

U-0

—

U1EIP<2:0>

bit 7

bit 0

Legend:

R = Readable bit

-n = Value at POR

W = Writable bit

‘1’ = Bit is set

U = Unimplemented bit, read as ‘0’

‘0’ = Bit is cleared x = Bit is unknown

bit 15-11

bit 10-8

Unimplemented: Read as ‘0’

U2EIP<2:0>: UART2 Error Interrupt Priority bits

111= Interrupt is priority 7 (highest priority interrupt)

•

001= Interrupt is priority 1

000= Interrupt source is disabled

bit 7

Unimplemented: Read as ‘0’

bit 6-4

U1EIP<2:0>: UART1 Error Interrupt Priority bits

111= Interrupt is priority 7 (highest priority interrupt)

•

001= Interrupt is priority 1

000= Interrupt source is disabled

bit 3-0

Unimplemented: Read as ‘0’

DS70592D-page 108

 2009-2012 Microchip Technology Inc.

PIC24HJXXXGPX06A/X08A/X10A

REGISTER 7-32: IPC17: INTERRUPT PRIORITY CONTROL REGISTER 17

U-0

—

R/W-1

R/W-0

U-0

—

R/W-1

R/W-0

bit 8

R/W-0

C2TXIP<2:0>

C1TXIP<2:0>

bit 15

U-0

—

R/W-1

R/W-0

U-0

—

R/W-1

R/W-0

DMA7IP<2:0>

DMA6IP<2:0>

bit 7

bit 0

Legend:

R = Readable bit

-n = Value at POR

W = Writable bit

‘1’ = Bit is set

U = Unimplemented bit, read as ‘0’

‘0’ = Bit is cleared x = Bit is unknown

bit 15

Unimplemented: Read as ‘0’

bit 14-12

C2TXIP<2:0>: ECAN2 Transmit Data Request Interrupt Priority bits

111= Interrupt is priority 7 (highest priority interrupt)

•

001= Interrupt is priority 1

000= Interrupt source is disabled

bit 11

Unimplemented: Read as ‘0’

bit 10-8

C1TXIP<2:0>: ECAN1 Transmit Data Request Interrupt Priority bits

111= Interrupt is priority 7 (highest priority interrupt)

•

001= Interrupt is priority 1

000= Interrupt source is disabled

bit 7

Unimplemented: Read as ‘0’

bit 6-4

DMA7IP<2:0>: DMA Channel 7 Data Transfer Complete Interrupt Priority bits

111= Interrupt is priority 7 (highest priority interrupt)

•

001= Interrupt is priority 1

000= Interrupt source is disabled

bit 3

Unimplemented: Read as ‘0’

bit 2-0

DMA6IP<2:0>: DMA Channel 6 Data Transfer Complete Interrupt Priority bits

111= Interrupt is priority 7 (highest priority interrupt)

•

001= Interrupt is priority 1

000= Interrupt source is disabled

 2009-2012 Microchip Technology Inc.

DS70592D-page 109

PIC24HJXXXGPX06A/X08A/X10A

REGISTER 7-33: INTTREG: INTERRUPT CONTROL AND STATUS REGISTER

U-0

—

U-0

—

U-0

—

U-0

—

R-0

ILR<3:0>

bit 15

bit 8

bit 0

U-0

—

U-0

R-0

VECNUM<6:0>

bit 7

Legend:

R = Readable bit

-n = Value at POR

W = Writable bit

‘1’ = Bit is set

U = Unimplemented bit, read as ‘0’

‘0’ = Bit is cleared x = Bit is unknown

bit 15-12

bit 11-8

Unimplemented: Read as ‘0’

ILR<3:0>: New CPU Interrupt Priority Level bits

1111= CPU Interrupt Priority Level is 15

•

0001 = CPU Interrupt Priority Level is 1

0000= CPU Interrupt Priority Level is 0

bit 7

Unimplemented: Read as ‘0’

bit 6-0

VECNUM<6:0>: Vector Number of Pending Interrupt bits

1111111= Interrupt Vector pending is number 135

•

0000001= Interrupt Vector pending is number 9

0000000= Interrupt Vector pending is number 8

DS70592D-page 110

 2009-2012 Microchip Technology Inc.

PIC24HJXXXGPX06A/X08A/X10A

7.4.3

TRAP SERVICE ROUTINE

7.4

Interrupt Setup Procedures

A Trap Service Routine (TSR) is coded like an ISR,

except that the appropriate trap status flag in the

INTCON1 register must be cleared to avoid re-entry

into the TSR.

7.4.1

INITIALIZATION

To configure an interrupt source:

1. Set the NSTDIS bit (INTCON1<15>) if nested

interrupts are not desired.

7.4.4

INTERRUPT DISABLE

2. Select the user-assigned priority level for the

interrupt source by writing the control bits in the

appropriate IPCx register. The priority level will

depend on the specific application and type of

interrupt source. If multiple priority levels are not

desired, the IPCx register control bits for all

enabled interrupt sources may be programmed

to the same non-zero value.

All user interrupts can be disabled using the following

procedure:

1. Push the current SR value onto the software

stack using the PUSHinstruction.

2. Force the CPU to priority level 7 by inclusive

ORing the value 0x0E with SRL.

To enable user interrupts, the POPinstruction may be

used to restore the previous SR value.

Note: At a device Reset, the IPCx registers are

initialized, such that all user interrupt

sources are assigned to priority level 4.

Note that only user interrupts with a priority level of 7 or

less can be disabled. Trap sources (level 8-level 15)

cannot be disabled.

3. Clear the interrupt flag status bit associated with

the peripheral in the associated IFSx register.

The DISIinstruction provides a convenient way to dis-

able interrupts of priority levels 1-6 for a fixed period of

time. Level 7 interrupt sources are not disabled by the

DISI instruction.

4. Enable the interrupt source by setting the inter-

rupt enable control bit associated with the

source in the appropriate IECx register.

7.4.2

INTERRUPT SERVICE ROUTINE

The method that is used to declare an ISR and initialize

the IVT with the correct vector address will depend on

the programming language (i.e., C or assembler) and

the language development toolsuite that is used to

develop the application. In general, the user must clear

the interrupt flag in the appropriate IFSx register for the

source of interrupt that the ISR handles. Otherwise, the

ISR will be re-entered immediately after exiting the

routine. If the ISR is coded in assembly language, it

must be terminated using a RETFIE instruction to

unstack the saved PC value, SRL value and old CPU

priority level.

 2009-2012 Microchip Technology Inc.

DS70592D-page 111

PIC24HJXXXGPX06A/X08A/X10A

NOTES:

DS70592D-page 112

 2009-2012 Microchip Technology Inc.

PIC24HJXXXGPX06A/X08A/X10A

TABLE 8-1:

PERIPHERALS WITH DMA

SUPPORT

8.0

DIRECT MEMORY ACCESS

(DMA)

Peripheral

IRQ Number

Note 1: This data sheet summarizes the features

of the PIC24HJXXXGPX06A/X08A/X10A

family of devices. However, it is not

intended to be a comprehensive refer-

ence source. To complement the infor-

mation in this data sheet, refer to Section

22. “Direct Memory Access (DMA)”

(DS70182) of the “dsPIC33F/PIC24H

Family Reference Manual”, which is

available from the Microchip web site

(www.microchip.com).

INT0

0

1

Input Capture 1

Input Capture 2

Output Compare 1

Output Compare 2

Timer2

5

2

6

7

Timer3

8

SPI1

10

33

11

12

30

31

13

21

34

70

55

71

SPI2

2: Some registers and associated bits

described in this section may not be

available on all devices. Refer to

Section 4.0 “Memory Organization” in

this data sheet for device-specific register

and bit information.

UART1 Reception

UART1 Transmission

UART2 Reception

UART2 Transmission

ADC1

ADC2

Direct Memory Access (DMA) is a very efficient

mechanism of copying data between peripheral SFRs

(e.g., UART Receive register, Input Capture 1 buffer),

and buffers or variables stored in RAM, with minimal

CPU intervention. The DMA controller can

automatically copy entire blocks of data without

requiring the user software to read or write the

peripheral Special Function Registers (SFRs) every

time a peripheral interrupt occurs. The DMA controller

uses a dedicated bus for data transfers and, therefore,

does not steal cycles from the code execution flow of

the CPU. To exploit the DMA capability, the

corresponding user buffers or variables must be

located in DMA RAM.

ECAN1 Reception

ECAN1 Transmission

ECAN2 Reception

ECAN2 Transmission

The DMA controller features eight identical data

transfer channels.

Each channel has its own set of control and status

registers. Each DMA channel can be configured to

copy data either from buffers stored in dual port DMA

RAM to peripheral SFRs, or from peripheral SFRs to

buffers in DMA RAM.

The DMA controller supports the following features:

• Word or byte sized data transfers

The PIC24HJXXXGPX06A/X08A/X10A peripherals

that can utilize DMA are listed in Table 8-1 along with

their associated Interrupt Request (IRQ) numbers.

• Transfers from peripheral to DMA RAM or DMA

RAM to peripheral

• Indirect Addressing of DMA RAM locations with or

without automatic post-increment

• Peripheral Indirect Addressing – In some

peripherals, the DMA RAM read/write addresses

may be partially derived from the peripheral

• One-Shot Block Transfers – Terminating DMA

transfer after one block transfer

• Continuous Block Transfers – Reloading DMA RAM

buffer start address after every block transfer is

complete

• Ping-Pong Mode – Switching between two DMA

RAM start addresses between successive block

transfers, thereby filling two buffers alternately

• Automatic or manual initiation of block transfers

• Each channel can select from 19 possible sources

of data sources or destinations

For each DMA channel, a DMA interrupt request is

generated when a block transfer is complete. Alterna-

tively, an interrupt can be generated when half of the

block has been filled.

 2009-2012 Microchip Technology Inc.

DS70592D-page 113

PIC24HJXXXGPX06A/X08A/X10A

FIGURE 8-1:

TOP LEVEL SYSTEM ARCHITECTURE USING A DEDICATED TRANSACTION BUS

Peripheral Indirect Address

DMA Controller

DMA

Ready

Peripheral 3

DMA

Channels

DMA RAM

SRAM

PORT 1 PORT 2

CPU

DMA

SRAM X-Bus

DMA DS Bus

CPU Peripheral DS Bus

CPU

DMA

CPU

DMA

Non-DMA

Ready

Peripheral

DMA

Ready

Peripheral 2

DMA

Ready

Peripheral 1

CPU

Note: CPU and DMA address buses are not shown for clarity.

8.1

DMAC Registers

Each DMAC Channel x (x = 0, 1, 2, 3, 4, 5, 6 or 7)

contains the following registers:

• A 16-bit DMA Channel Control register

(DMAxCON)

• A 16-bit DMA Channel IRQ Select register

(DMAxREQ)

• A 16-bit DMA RAM Primary Start Address Offset

register (DMAxSTA)

• A 16-bit DMA RAM Secondary Start Address

Offset register (DMAxSTB)

• A 16-bit DMA Peripheral Address register

(DMAxPAD)

• A 10-bit DMA Transfer Count register (DMAxCNT)

An additional pair of status registers, DMACS0 and

DMACS1 are common to all DMAC channels.

DS70592D-page 114

 2009-2012 Microchip Technology Inc.

PIC24HJXXXGPX06A/X08A/X10A

REGISTER 8-1:

DMAxCON: DMA CHANNEL x CONTROL REGISTER

R/W-0

CHEN

R/W-0

SIZE

R/W-0

DIR

R/W-0

HALF

R/W-0

U-0

—

U-0

—

U-0

—

NULLW

bit 15

bit 8

U-0

—

U-0

—

R/W-0

U-0

—

U-0

—

R/W-0

AMODE<1:0>

MODE<1:0>

bit 7

bit 0

Legend:

R = Readable bit

-n = Value at POR

W = Writable bit

‘1’ = Bit is set

U = Unimplemented bit, read as ‘0’

‘0’ = Bit is cleared x = Bit is unknown

bit 15

bit 14

bit 13

bit 12

bit 11

CHEN: Channel Enable bit

1= Channel enabled

0= Channel disabled

SIZE: Data Transfer Size bit

1= Byte

0= Word

DIR: Transfer Direction bit (source/destination bus select)

1= Read from DMA RAM address, write to peripheral address

0= Read from peripheral address, write to DMA RAM address

HALF: Early Block Transfer Complete Interrupt Select bit

1= Initiate block transfer complete interrupt when half of the data has been moved

0= Initiate block transfer complete interrupt when all of the data has been moved

NULLW: Null Data Peripheral Write Mode Select bit

1= Null data write to peripheral in addition to DMA RAM write (DIR bit must also be clear)

0= Normal operation

bit 10-6

bit 5-4

Unimplemented: Read as ‘0’

AMODE<1:0>: DMA Channel Operating Mode Select bits

11= Reserved

10= Peripheral Indirect Addressing mode

01= Register Indirect without Post-Increment mode

00= Register Indirect with Post-Increment mode

bit 3-2

bit 1-0

Unimplemented: Read as ‘0’

MODE<1:0>: DMA Channel Operating Mode Select bits

11= One-Shot, Ping-Pong modes enabled (one block transfer from/to each DMA RAM buffer)

10= Continuous, Ping-Pong modes enabled

01= One-Shot, Ping-Pong modes disabled

00= Continuous, Ping-Pong modes disabled

 2009-2012 Microchip Technology Inc.

DS70592D-page 115

PIC24HJXXXGPX06A/X08A/X10A

REGISTER 8-2:

DMAxREQ: DMA CHANNEL x IRQ SELECT REGISTER

R/W-0

FORCE⁽¹⁾

bit 15

U-0

—

U-0

—

U-0

—

U-0

—

U-0

—

U-0

—

U-0

—

bit 8

U-0

—

R/W-0

IRQSEL6⁽²⁾IRQSEL5⁽²⁾IRQSEL4⁽²⁾IRQSEL3⁽²⁾IRQSEL2⁽²⁾

IRQSEL1⁽²⁾IRQSEL0⁽²⁾

bit 7

bit 0

Legend:

R = Readable bit

-n = Value at POR

W = Writable bit

‘1’ = Bit is set

U = Unimplemented bit, read as ‘0’

‘0’ = Bit is cleared x = Bit is unknown

bit 15

FORCE: Force DMA Transfer bit⁽¹⁾

1= Force a single DMA transfer (Manual mode)

0= Automatic DMA transfer initiation by DMA request

bit 14-7

bit 6-0

Unimplemented: Read as ‘0’

IRQSEL<6:0>: DMA Peripheral IRQ Number Select bits⁽²⁾

0000000-1111111= DMAIRQ0-DMAIRQ127 selected to be Channel DMAREQ

Note 1: The FORCE bit cannot be cleared by the user. The FORCE bit is cleared by hardware when the forced

DMA transfer is complete.

2: Please see Table 8-1 for a complete listing of IRQ numbers for all interrupt sources.

DS70592D-page 116

 2009-2012 Microchip Technology Inc.

PIC24HJXXXGPX06A/X08A/X10A

REGISTER 8-3:

DMAxSTA: DMA CHANNEL x RAM START ADDRESS OFFSET REGISTER A

R/W-0

bit 8

R/W-0

STA<15:8>

bit 15

R/W-0

bit 7

R/W-0

STA<7:0>

R/W-0

bit 0

Legend:

R = Readable bit

-n = Value at POR

W = Writable bit

‘1’ = Bit is set

U = Unimplemented bit, read as ‘0’

‘0’ = Bit is cleared x = Bit is unknown

bit 15-0

STA<15:0>: Primary DMA RAM Start Address bits (source or destination)

REGISTER 8-4:

DMAxSTB: DMA CHANNEL x RAM START ADDRESS OFFSET REGISTER B

R/W-0

STB<15:8>

bit 15

R/W-0

bit 7

bit 8

R/W-0

bit 0

R/W-0

STB<7:0>

R/W-0

Legend:

R = Readable bit

-n = Value at POR

W = Writable bit

‘1’ = Bit is set

U = Unimplemented bit, read as ‘0’

‘0’ = Bit is cleared x = Bit is unknown

bit 15-0

STB<15:0>: Secondary DMA RAM Start Address bits (source or destination)

 2009-2012 Microchip Technology Inc.

DS70592D-page 117

PIC24HJXXXGPX06A/X08A/X10A

REGISTER 8-5:

DMAxPAD: DMA CHANNEL x PERIPHERAL ADDRESS REGISTER⁽¹⁾

R/W-0

bit 8

R/W-0

PAD<15:8>

bit 15

R/W-0

bit 7

R/W-0

PAD<7:0>

R/W-0

bit 0

Legend:

R = Readable bit

-n = Value at POR

W = Writable bit

‘1’ = Bit is set

U = Unimplemented bit, read as ‘0’

‘0’ = Bit is cleared x = Bit is unknown

bit 15-0

PAD<15:0>: Peripheral Address Register bits

Note 1: If the channel is enabled (i.e., active), writes to this register may result in unpredictable behavior of the

DMA channel and should be avoided.

REGISTER 8-6:

DMAxCNT: DMA CHANNEL x TRANSFER COUNT REGISTER⁽¹⁾

U-0

—

U-0

—

U-0

—

U-0

—

U-0

—

U-0

—

R/W-0

CNT<9:8>⁽²⁾

bit 15

bit 8

R/W-0

bit 0

R/W-0

bit 7

R/W-0

CNT<7:0>⁽²⁾

Legend:

R = Readable bit

-n = Value at POR

W = Writable bit

‘1’ = Bit is set

U = Unimplemented bit, read as ‘0’

‘0’ = Bit is cleared x = Bit is unknown

bit 15-10

bit 9-0

Unimplemented: Read as ‘0’

CNT<9:0>: DMA Transfer Count Register bits⁽²⁾

Note 1: If the channel is enabled (i.e., active), writes to this register may result in unpredictable behavior of the

DMA channel and should be avoided.

2: Number of DMA transfers = CNT<9:0> + 1.

DS70592D-page 118

 2009-2012 Microchip Technology Inc.

PIC24HJXXXGPX06A/X08A/X10A

REGISTER 8-7:

DMACS0: DMA CONTROLLER STATUS REGISTER 0

R/C-0

PWCOL7

bit 15

R/C-0

PWCOL6

PWCOL5

PWCOL4

PWCOL3

PWCOL2

PWCOL1

PWCOL0

bit 8

R/C-0

XWCOL7

bit 7

R/C-0

XWCOL6

XWCOL5

XWCOL4

XWCOL3

XWCOL2

XWCOL1

XWCOL0

bit 0

Legend:

C = Clear only bit

W = Writable bit

‘1’ = Bit is set

R = Readable bit

U = Unimplemented bit, read as ‘0’

‘0’ = Bit is cleared x = Bit is unknown

-n = Value at POR

bit 15

bit 14

bit 13

bit 12

bit 11

bit 10

bit 9

PWCOL7: Channel 7 Peripheral Write Collision Flag bit

1= Write collision detected

0= No write collision detected

PWCOL6: Channel 6 Peripheral Write Collision Flag bit

1= Write collision detected

0= No write collision detected

PWCOL5: Channel 5 Peripheral Write Collision Flag bit

1= Write collision detected

0= No write collision detected

PWCOL4: Channel 4 Peripheral Write Collision Flag bit

1= Write collision detected

0= No write collision detected

PWCOL3: Channel 3 Peripheral Write Collision Flag bit

1= Write collision detected

0= No write collision detected

PWCOL2: Channel 2 Peripheral Write Collision Flag bit

1= Write collision detected

0= No write collision detected

PWCOL1: Channel 1 Peripheral Write Collision Flag bit

1= Write collision detected

0= No write collision detected

bit 8

PWCOL0: Channel 0 Peripheral Write Collision Flag bit

1= Write collision detected

0= No write collision detected

bit 7

XWCOL7: Channel 7 DMA RAM Write Collision Flag bit

1= Write collision detected

0= No write collision detected

bit 6

XWCOL6: Channel 6 DMA RAM Write Collision Flag bit

1= Write collision detected

0= No write collision detected

bit 5

XWCOL5: Channel 5 DMA RAM Write Collision Flag bit

1= Write collision detected

0= No write collision detected

bit 4

XWCOL4: Channel 4 DMA RAM Write Collision Flag bit

1= Write collision detected

0= No write collision detected

 2009-2012 Microchip Technology Inc.

DS70592D-page 119

PIC24HJXXXGPX06A/X08A/X10A

REGISTER 8-7:

DMACS0: DMA CONTROLLER STATUS REGISTER 0 (CONTINUED)

bit 3

bit 2

bit 1

bit 0

XWCOL3: Channel 3 DMA RAM Write Collision Flag bit

1= Write collision detected

0= No write collision detected

XWCOL2: Channel 2 DMA RAM Write Collision Flag bit

1= Write collision detected

0= No write collision detected

XWCOL1: Channel 1 DMA RAM Write Collision Flag bit

1= Write collision detected

0= No write collision detected

XWCOL0: Channel 0 DMA RAM Write Collision Flag bit

1= Write collision detected

0= No write collision detected

DS70592D-page 120

 2009-2012 Microchip Technology Inc.

PIC24HJXXXGPX06A/X08A/X10A

REGISTER 8-8:

DMACS1: DMA CONTROLLER STATUS REGISTER 1

U-0

—

U-0

—

U-0

—

U-0

—

R-1

LSTCH<3:0>

bit 15

bit 8

R-0

PPST7

bit 7

R-0

PPST6

PPST5

PPST4

PPST3

PPST2

PPST1

PPST0

bit 0

Legend:

R = Readable bit

-n = Value at POR

W = Writable bit

‘1’ = Bit is set

U = Unimplemented bit, read as ‘0’

‘0’ = Bit is cleared x = Bit is unknown

bit 15-12

bit 11-8

Unimplemented: Read as ‘0’

LSTCH<3:0>: Last DMA Channel Active bits

1111= No DMA transfer has occurred since system Reset

1110-1000= Reserved

0111= Last data transfer was by DMA Channel 7

0110= Last data transfer was by DMA Channel 6

0101= Last data transfer was by DMA Channel 5

0100= Last data transfer was by DMA Channel 4

0011= Last data transfer was by DMA Channel 3

0010= Last data transfer was by DMA Channel 2

0001= Last data transfer was by DMA Channel 1

0000= Last data transfer was by DMA Channel 0

bit 7

bit 6

bit 5

bit 4

bit 3

bit 2

bit 1

bit 0

PPST7: Channel 7 Ping-Pong Mode Status Flag bit

1= DMA7STB register selected

0= DMA7STA register selected

PPST6: Channel 6 Ping-Pong Mode Status Flag bit

1= DMA6STB register selected

0= DMA6STA register selected

PPST5: Channel 5 Ping-Pong Mode Status Flag bit

1= DMA5STB register selected

0= DMA5STA register selected

PPST4: Channel 4 Ping-Pong Mode Status Flag bit

1= DMA4STB register selected

0= DMA4STA register selected

PPST3: Channel 3 Ping-Pong Mode Status Flag bit

1= DMA3STB register selected

0= DMA3STA register selected

PPST2: Channel 2 Ping-Pong Mode Status Flag bit

1= DMA2STB register selected

0= DMA2STA register selected

PPST1: Channel 1 Ping-Pong Mode Status Flag bit

1= DMA1STB register selected

0= DMA1STA register selected

PPST0: Channel 0 Ping-Pong Mode Status Flag bit

1= DMA0STB register selected

0= DMA0STA register selected

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DS70592D-page 121

PIC24HJXXXGPX06A/X08A/X10A

REGISTER 8-9:

DSADR: MOST RECENT DMA RAM ADDRESS

R-0

DSADR<15:8>

bit 15

R-0

bit 8

bit 0

R-0

DSADR<7:0>

bit 7

Legend:

R = Readable bit

-n = Value at POR

W = Writable bit

‘1’ = Bit is set

U = Unimplemented bit, read as ‘0’

‘0’ = Bit is cleared x = Bit is unknown

bit 15-0

DSADR<15:0>: Most Recent DMA RAM Address Accessed by DMA Controller bits

DS70592D-page 122

 2009-2012 Microchip Technology Inc.

PIC24HJXXXGPX06A/X08A/X10A

The

PIC24HJXXXGPX06A/X08A/X10A

oscillator

9.0

OSCILLATOR

CONFIGURATION

system provides:

• Various external and internal oscillator options as

clock sources

Note 1: This data sheet summarizes the features

of the PIC24HJXXXGPX06A/X08A/X10A

family of devices. However, it is not

• An on-chip PLL to scale the internal operating

frequency to the required system clock frequency

intended to be

a

comprehensive

• The internal FRC oscillator can also be used with

the PLL, thereby allowing full-speed operation

without any external clock generation hardware

reference source. To complement the

information in this data sheet, refer to

Section 7. “Oscillator” (DS70186) of

the “dsPIC33F/dsPIC33F/PIC24H Family

Reference Manual”, which is available

• Clock switching between various clock sources

• Programmable clock postscaler for system power

savings

from

the

Microchip

web

site

(www.microchip.com).

• A Fail-Safe Clock Monitor (FSCM) that detects

clock failure and takes fail-safe measures

2: Some registers and associated bits

described in this section may not be

available on all devices. Refer to

Section 4.0 “Memory Organization” in

this data sheet for device-specific register

and bit information.

• An Oscillator Control register (OSCCON)

• Nonvolatile Configuration bits for main oscillator

selection.

A simplified diagram of the oscillator system is shown

in Figure 9-1.

FIGURE 9-1:

PIC24HJXXXGPX06A/X08A/X10A OSCILLATOR SYSTEM DIAGRAM

Primary Oscillator

OSC1

OSC2

DOZE<2:0>

XT, HS, EC

S2

R⁽²⁾

XTPLL, HSPLL,

ECPLL, FRCPLL

S3

S1

FCY

PLL⁽¹⁾

S1/S3

POSCMD<1:0>

(3)

FP

FRC

Oscillator

÷ 2

FRCDIVN

S7

FOSC

FRCDIV<2:0>

TUN<5:0>

FRCDIV16

FRC

S6

S0

÷ 16

LPRC

SOSC

LPRC

Oscillator

S5

Secondary Oscillator

SOSCO

SOSCI

S4

LPOSCEN

Clock Switch

Reset

Clock Fail

S7

NOSC<2:0> FNOSC<2:0>

WDT, PWRT,

FSCM

Timer 1

Note 1: See Figure 9-2 for PLL details.

2: If the Oscillator is used with XT or HS modes, an extended parallel resistor with the value of 1 M must be connected.

3: The term, FP refers to the clock source for all the peripherals, while FCY refers to the clock source for the CPU. Through-

out this document FP and FCY are used interchangeably, except in the case of Doze mode. FP and FCY will be different

when Doze mode is used in any ratio other than 1:1, which is the default.

 2009-2012 Microchip Technology Inc.

DS70592D-page 123

PIC24HJXXXGPX06A/X08A/X10A

(FOSC<1:0>), select the oscillator source that is used at

a Power-on Reset. The FRC primary oscillator is the

default (unprogrammed) selection.

9.1

CPU Clocking System

There are seven system clock options provided by the

PIC24HJXXXGPX06A/X08A/X10A:

The Configuration bits allow users to choose between

twelve different clock modes, shown in Table 9-1.

• FRC Oscillator

• FRC Oscillator with PLL

• Primary (XT, HS or EC) Oscillator

• Primary Oscillator with PLL

• Secondary (LP) Oscillator

• LPRC Oscillator

The output of the oscillator (or the output of the PLL if

a PLL mode has been selected) FOSC is divided by 2 to

generate the device instruction clock (FCY) and the

peripheral clock time base (FP). FCY defines the

operating speed of the device, and speeds up to 40

MHz are supported by the PIC24HJXXXGPX06A/

X08A/X10A architecture.

• FRC Oscillator with postscaler

9.1.1

SYSTEM CLOCK SOURCES

Instruction execution speed or device operating

frequency, FCY, is calculated, as shown in

Equation 9-1:

The FRC (Fast RC) internal oscillator runs at a nominal

frequency of 7.37 MHz. The user software can tune the

FRC frequency. User software can optionally specify a

factor (ranging from 1:2 to 1:256) by which the FRC

clock frequency is divided. This factor is selected using

the FRCDIV<2:0> (CLKDIV<10:8>) bits.

EQUATION 9-1:

DEVICE OPERATING

FREQUENCY

FOSC

2

FCY =

-------------

The primary oscillator can use one of the following as

its clock source:

• XT (Crystal): Crystals and ceramic resonators in

the range of 3 MHz to 10 MHz. The crystal is con-

nected to the OSC1 and OSC2 pins.

9.1.3

PLL CONFIGURATION

The primary oscillator and internal FRC oscillator can

optionally use an on-chip PLL to obtain higher speeds

of operation. The PLL provides a significant amount of

flexibility in selecting the device operating speed. A

block diagram of the PLL is shown in Figure 9-2.

• HS (High-Speed Crystal): Crystals in the range of

10 MHz to 40 MHz. The crystal is connected to

the OSC1 and OSC2 pins.

• EC (External Clock): External clock signal is

directly applied to the OSC1 pin.

The output of the primary oscillator or FRC, denoted as

‘FIN’, is divided down by a prescale factor (N1) of 2, 3,

... or 33 before being provided to the PLL’s Voltage

Controlled Oscillator (VCO). The input to the VCO must

be selected to be in the range of 0.8 MHz to 8 MHz.

Since the minimum prescale factor is 2, this implies that

FIN must be chosen to be in the range of 1.6 MHz to 16

MHz. The prescale factor ‘N1’ is selected using the

PLLPRE<4:0> bits (CLKDIV<4:0>).

The secondary (LP) oscillator is designed for low power

and uses a 32.768 kHz crystal or ceramic resonator.

The LP oscillator uses the SOSCI and SOSCO pins.

The LPRC (Low-Power RC) internal oscIllator runs at a

nominal frequency of 32.768 kHz. It is also used as a

reference clock by the Watchdog Timer (WDT) and

Fail-Safe Clock Monitor (FSCM).

The clock signals generated by the FRC and primary

oscillators can be optionally applied to an on-chip

Phase-Locked Loop (PLL) to provide a wide range of

output frequencies for device operation. PLL

configuration is described in Section 9.1.3 “PLL

Configuration”.

The PLL Feedback Divisor, selected using the

PLLDIV<8:0> bits (PLLFBD<8:0>), provides a factor ‘M’,

by which the input to the VCO is multiplied. This factor

must be selected such that the resulting VCO output

frequency is in the range of 100 MHz to 200 MHz.

The VCO output is further divided by a postscale factor

‘N2’. This factor is selected using the PLLPOST<1:0>

bits (CLKDIV<7:6>). ‘N2’ can be either 2, 4 or 8, and

must be selected such that the PLL output frequency

(FOSC) is in the range of 12.5 MHz to 80 MHz, which

generates device operating speeds of 6.25-40 MIPS.

The FRC frequency depends on the FRC accuracy

(see Table 24-19) and the value of the FRC Oscillator

Tuning register (see Register 9-4).

9.1.2

SYSTEM CLOCK SELECTION

The oscillator source that is used at a device Power-on

Reset event is selected using Configuration bit settings.

The oscillator Configuration bit settings are located in the

Configuration registers in the program memory. (Refer to

Section 21.1 “Configuration Bits” for further details.)

The Initial Oscillator Selection Configuration bits,

FNOSC<2:0> (FOSCSEL<2:0>), and the Primary Oscil-

lator Mode Select Configuration bits, POSCMD<1:0>

For a primary oscillator or FRC oscillator, output ‘FIN’,

the PLL output ‘FOSC’ is given by:

EQUATION 9-2:

FOSC CALCULATION

M

N1  N2







FOSC = F^IN ------------------



DS70592D-page 124

 2009-2012 Microchip Technology Inc.

PIC24HJXXXGPX06A/X08A/X10A

For example, suppose a 10 MHz crystal is being used,

with “XT with PLL” being the selected oscillator mode.

If PLLPRE<4:0> = 0, then N1 = 2. This yields a VCO

input of 10/2 = 5 MHz, which is within the acceptable

range of 0.8-8 MHz. If PLLDIV<8:0> = 0x1E, then

M = 32. This yields a VCO output of 5 x 32 = 160 MHz,

which is within the 100-200 MHz ranged needed.

EQUATION 9-3:

XT WITH PLL MODE

EXAMPLE

1 10000000  32

FOSC





FCY =

= -- --------------------------------- = 40 MIPS

-------------





2

2  2

2

If PLLPOST<1:0> = 0, then N2 = 2. This provides a

Fosc of 160/2 = 80 MHz. The resultant device operating

speed is 80/2 = 40 MIPS.

FIGURE 9-2:

PIC24HJXXXGPX06A/X08A/X10A PLL BLOCK DIAGRAM

FVCO

0.8-8.0 MHz

100-200 MHz

Here⁽¹⁾

12.5-80 MHz

Here⁽¹⁾

Source (Crystal, External Clock

or Internal RC)

FOSC

PLLPRE

VCO

PLLPOST

X

PLLDIV

N1

Divide by

2-33

N2

Divide by

2, 4, 8

M

Divide by

2-513

Note 1: This frequency range must be satisfied at all times.

TABLE 9-1:

CONFIGURATION BIT VALUES FOR CLOCK SELECTION

Oscillator Mode

Oscillator Source

POSCMD<1:0>

FNOSC<2:0>

See Note

1, 2

Fast RC Oscillator with Divide-by-N

(FRCDIVN)

Internal

xx

111

Internal

xx

110

1

Fast RC Oscillator with Divide-by-16

(FRCDIV16)

Low-Power RC Oscillator (LPRC)

Internal

Secondary

Primary

xx

10

101

100

011

1

Secondary (Timer1) Oscillator (Sosc)

Primary Oscillator (HS) with PLL

(HSPLL)

—

Primary Oscillator (XT) with PLL

(XTPLL)

Primary

01

00

011

—

1

Primary Oscillator (EC) with PLL

(ECPLL)

Primary Oscillator (HS)

Primary

Internal

10

01

00

xx

010

001

000

—

1

Primary Oscillator (XT)

Primary Oscillator (EC)

Fast RC Oscillator with PLL (FRCPLL)

Fast RC Oscillator (FRC)

1

Note 1: OSC2 pin function is determined by the OSCIOFNC Configuration bit.

2: This is the default oscillator mode for an unprogrammed (erased) device.

 2009-2012 Microchip Technology Inc.

DS70592D-page 125

PIC24HJXXXGPX06A/X08A/X10A

REGISTER 9-1:

OSCCON: OSCILLATOR CONTROL REGISTER^(1,3)

U-0

—

R-0

U-0

—

R/W-y

NOSC<2:0>⁽²⁾

R/W-y

bit 8

COSC<2:0>

bit 15

R/W-0

CLKLOCK

bit 7

U-0

—

R-0

U-0

—

R/C-0

CF

U-0

—

R/W-0

LOCK

LPOSCEN

OSWEN

bit 0

Legend:

y = Value set from Configuration bits on POR

C = Clear only bit

U = Unimplemented bit, read as ‘0’

‘0’ = Bit is cleared x = Bit is unknown

R = Readable bit

-n = Value at POR

W = Writable bit

‘1’ = Bit is set

bit 15

Unimplemented: Read as ‘0’

bit 14-12

COSC<2:0>: Current Oscillator Selection bits (read-only)

111= Fast RC oscillator (FRC) with Divide-by-N

110= Fast RC oscillator (FRC) with Divide-by-16

101= Low-Power RC oscillator (LPRC)

100= Secondary oscillator (Sosc)

011= Primary oscillator (XT, HS, EC) with PLL

010= Primary oscillator (XT, HS, EC)

001= Fast RC Oscillator (FRC) with Divide-by-N and PLL (FRCDIVN + PLL)

000= Fast RC oscillator (FRC)

bit 11

Unimplemented: Read as ‘0’

NOSC<2:0>: New Oscillator Selection bits⁽²⁾

bit 10-8

111= Fast RC oscillator (FRC) with Divide-by-N

110= Fast RC oscillator (FRC) with Divide-by-16

101= Low-Power RC oscillator (LPRC)

100= Secondary oscillator (Sosc)

011= Primary oscillator (XT, HS, EC) with PLL

010= Primary oscillator (XT, HS, EC)

001= Fast RC Oscillator (FRC) with Divide-by-N and PLL (FRCDIVN + PLL)

000= Fast RC oscillator (FRC)

bit 7

CLKLOCK: Clock Lock Enable bit

1= If (FCKSM0 = 1), the clock and PLL configurations are locked

If (FCKSM0 = 0), the clock and PLL configurations may be modified

0= Clock and PLL selections are not locked, configurations may be modified

bit 6

bit 5

Unimplemented: Read as ‘0’

LOCK: PLL Lock Status bit (read-only)

1= Indicates that PLL is in lock, or PLL start-up timer is satisfied

0= Indicates that PLL is out of lock, start-up timer is in progress or PLL is disabled

bit 4

bit 3

Unimplemented: Read as ‘0’

CF: Clock Fail Detect bit (read/clear by application)

1= FSCM has detected clock failure

0= FSCM has not detected clock failure

bit 2

Unimplemented: Read as ‘0’

Note 1: Writes to this register require an unlock sequence. Refer to Section 7. “Oscillator” (DS70186) in the

“dsPIC33F/PIC24H Family Reference Manual” for details.

2: Direct clock switches between any primary oscillator mode with PLL and FRCPLL mode are not permitted.

This applies to clock switches in either direction. In these instances, the application must switch to FRC

mode as a transition clock source between the two PLL modes.

3: This register is reset only on a Power-on Reset (POR).

DS70592D-page 126

 2009-2012 Microchip Technology Inc.

PIC24HJXXXGPX06A/X08A/X10A

REGISTER 9-1:

OSCCON: OSCILLATOR CONTROL REGISTER^(1,3)(CONTINUED)

bit 1

LPOSCEN: Secondary (LP) Oscillator Enable bit

1= Enable secondary oscillator

0= Disable secondary oscillator

bit 0

OSWEN: Oscillator Switch Enable bit

1= Request oscillator switch to selection specified by NOSC<2:0> bits

0= Oscillator switch is complete

Note 1: Writes to this register require an unlock sequence. Refer to Section 7. “Oscillator” (DS70186) in the

“dsPIC33F/PIC24H Family Reference Manual” for details.

2: Direct clock switches between any primary oscillator mode with PLL and FRCPLL mode are not permitted.

This applies to clock switches in either direction. In these instances, the application must switch to FRC

mode as a transition clock source between the two PLL modes.

3: This register is reset only on a Power-on Reset (POR).

 2009-2012 Microchip Technology Inc.

DS70592D-page 127

PIC24HJXXXGPX06A/X08A/X10A

REGISTER 9-2:

CLKDIV: CLOCK DIVISOR REGISTER⁽²⁾

R/W-0

ROI

R/W-0

R/W-1

R/W-0

DOZEN⁽¹⁾

R/W-0

bit 8

R/W-0

bit 0

DOZE<2:0>

FRCDIV<2:0>

bit 15

R/W-0

R/W-1

U-0

—

R/W-0

PLLPOST<1:0>

PLLPRE<4:0>

bit 7

Legend:

y = Value set from Configuration bits on POR

R = Readable bit

-n = Value at POR

W = Writable bit

‘1’ = Bit is set

U = Unimplemented bit, read as ‘0’

‘0’ = Bit is cleared x = Bit is unknown

bit 15

ROI: Recover on Interrupt bit

1= Interrupts will clear the DOZEN bit and the processor clock/peripheral clock ratio is set to 1:1

0= Interrupts have no effect on the DOZEN bit

bit 14-12

DOZE<2:0>: Processor Clock Reduction Select bits

111= FCY/128

110= FCY/64

101= FCY/32

100= FCY/16

011= FCY/8 (default)

010= FCY/4

001= FCY/2

000= FCY/1

bit 11

DOZEN: DOZE Mode Enable bit⁽¹⁾

1= DOZE<2:0> field specifies the ratio between the peripheral clocks and the processor clocks

0= Processor clock/peripheral clock ratio forced to 1:1

bit 10-8

FRCDIV<2:0>: Internal Fast RC Oscillator Postscaler bits

111= FRC divide by 256

110= FRC divide by 64

101= FRC divide by 32

100= FRC divide by 16

011= FRC divide by 8

010= FRC divide by 4

001= FRC divide by 2

000= FRC divide by 1 (default)

bit 7-6

PLLPOST<1:0>: PLL VCO Output Divider Select bits (also denoted as ‘N2’, PLL postscaler)

11= Output/8

10= Reserved

01= Output/4 (default)

00= Output/2

bit 5

Unimplemented: Read as ‘0’

bit 4-0

PLLPRE<4:0>: PLL Phase Detector Input Divider bits (also denoted as ‘N1’, PLL prescaler)

11111= Input/33

•

00001= Input/3

00000= Input/2 (default)

Note 1: This bit is cleared when the ROI bit is set and an interrupt occurs.

2: This register is reset only on a Power-on Reset (POR).

DS70592D-page 128

 2009-2012 Microchip Technology Inc.

PIC24HJXXXGPX06A/X08A/X10A

REGISTER 9-3:

PLLFBD: PLL FEEDBACK DIVISOR REGISTER⁽¹⁾

U-0

—

U-0

—

U-0

—

U-0

—

U-0

—

U-0

—

U-0

—

R/W-0

PLLDIV<8>

bit 8

bit 15

R/W-0

bit 7

R/W-0

R/W-1

R/W-0

bit 0

PLLDIV<7:0>

Legend:

R = Readable bit

-n = Value at POR

W = Writable bit

‘1’ = Bit is set

U = Unimplemented bit, read as ‘0’

‘0’ = Bit is cleared x = Bit is unknown

bit 15-9

bit 8-0

Unimplemented: Read as ‘0’

PLLDIV<8:0>: PLL Feedback Divisor bits (also denoted as ‘M’, PLL multiplier)

111111111= 513

•

000110000= 50 (default)

•

000000010= 4

000000001= 3

000000000= 2

Note 1: This register is reset only on a Power-on Reset (POR).

 2009-2012 Microchip Technology Inc.

DS70592D-page 129

PIC24HJXXXGPX06A/X08A/X10A

REGISTER 9-4:

OSCTUN: FRC OSCILLATOR TUNING REGISTER⁽²⁾

U-0

—

U-0

—

U-0

—

U-0

—

U-0

—

U-0

—

U-0

—

U-0

—

bit 15

bit 8

U-0

—

U-0

—

R/W-0

TUN<5:0>⁽¹⁾

bit 7

bit 0

Legend:

R = Readable bit

-n = Value at POR

W = Writable bit

‘1’ = Bit is set

U = Unimplemented bit, read as ‘0’

‘0’ = Bit is cleared x = Bit is unknown

bit 15-6

bit 5-0

Unimplemented: Read as ‘0’

TUN<5:0>: FRC Oscillator Tuning bits⁽¹⁾

111111= Center frequency – 0.375% (7.345 MHz)

•

100001= Center frequency – 11.625% (6.52 MHz)

100000= Center frequency – 12% (6.49 MHz)

011111= Center frequency + 11.625% (8.23 MHz)

011110= Center frequency + 11.25% (8.20 MHz)

•

000001= Center frequency + 0.375% (7.40 MHz)

000000= Center frequency (7.37 MHz nominal)

Note 1: OSCTUN functionality has been provided to help customers compensate for temperature effects on the

FRC frequency over a wide range of temperatures. The tuning step size is an approximation and is neither

characterized nor tested.

2: This register is reset only on a Power-on Reset (POR).

DS70592D-page 130

 2009-2012 Microchip Technology Inc.

PIC24HJXXXGPX06A/X08A/X10A

2. If a valid clock switch has been initiated, the

9.2

Clock Switching Operation

LOCK

(OSCCON<5>)

and

the

CF

Applications are free to switch between any of the four

clock sources (Primary, LP, FRC and LPRC) under

software control at any time. To limit the possible side

effects that could result from this flexibility,

PIC24HJXXXGPX06A/X08A/X10A devices have a

safeguard lock built into the switch process.

(OSCCON<3>) status bits are cleared.

3. The new oscillator is turned on by the hardware

if it is not currently running. If a crystal oscillator

must be turned on, the hardware waits until the

Oscillator Start-up Timer (OST) expires. If the

new source is using the PLL, the hardware waits

until a PLL lock is detected (LOCK = 1).

Note:

Primary Oscillator mode has three different

submodes (XT, HS and EC) which are

determined by the POSCMD<1:0> Config-

uration bits. While an application can

switch to and from Primary Oscillator

mode in software, it cannot switch

between the different primary submodes

without reprogramming the device.

4. The hardware waits for 10 clock cycles from the

new clock source and then performs the clock

switch.

5. The hardware clears the OSWEN bit to indicate a

successful clock transition. In addition, the NOSC

bit values are transferred to the COSC status bits.

6. The old clock source is turned off at this time,

with the exception of LPRC (if WDT or FSCM

are enabled) or LP (if LPOSCEN remains set).

9.2.1

ENABLING CLOCK SWITCHING

To enable clock switching, the FCKSM1 Configuration

bit in the Configuration register must be programmed to

‘0’. (Refer to Section 21.1 “Configuration Bits” for

further details.) If the FCKSM1 Configuration bit is

unprogrammed (‘1’), the clock switching function and

Fail-Safe Clock Monitor function are disabled. This is

the default setting.

Note 1: The processor continues to execute code

throughout the clock switching sequence.

Timing sensitive code should not be

executed during this time.

2: Direct clock switches between any pri-

mary oscillator mode with PLL and

FRCPLL mode are not permitted. This

applies to clock switches in either direc-

tion. In these instances, the application

must switch to FRC mode as a transition

clock source between the two PLL modes.

3: Refer to Section 7. “Oscillator”

(DS70186) in the “dsPIC33F/PIC24H

Family Reference Manual” for details.

The NOSC control bits (OSCCON<10:8>) do not

control the clock selection when clock switching is

disabled. However, the COSC bits (OSCCON<14:12>)

reflect the clock source selected by the FNOSC

Configuration bits.

The OSWEN control bit (OSCCON<0>) has no effect

when clock switching is disabled. It is held at ‘0’ at all

times.

9.2.2

OSCILLATOR SWITCHING SEQUENCE

9.3

Fail-Safe Clock Monitor (FSCM)

At a minimum, performing a clock switch requires this

basic sequence:

The Fail-Safe Clock Monitor (FSCM) allows the device

to continue to operate even in the event of an oscillator

failure. The FSCM function is enabled by programming.

If the FSCM function is enabled, the LPRC internal

oscillator runs at all times (except during Sleep mode)

and is not subject to control by the Watchdog Timer.

1. If

desired,

read

the

COSC

bits

(OSCCON<14:12>) to determine the current

oscillator source.

2. Perform the unlock sequence to allow a write to

the OSCCON register high byte.

If an oscillator failure occurs, the FSCM generates a

clock failure trap event and switches the system clock

over to the FRC oscillator. Then the application

program can either attempt to restart the oscillator or

execute a controlled shutdown. The trap can be treated

as a warm Reset by simply loading the Reset address

into the oscillator fail trap vector.

3. Write the appropriate value to the NOSC control

bits (OSCCON<10:8>) for the new oscillator

source.

4. Perform the unlock sequence to allow a write to

the OSCCON register low byte.

5. Set the OSWEN bit to initiate the oscillator

switch.

If the PLL multiplier is used to scale the system clock,

the internal FRC is also multiplied by the same factor

on clock failure. Essentially, the device switches to

FRC with PLL on a clock failure.

Once the basic sequence is completed, the system

clock hardware responds automatically as follows:

1. The clock switching hardware compares the

COSC status bits with the new value of the

NOSC control bits. If they are the same, the

clock switch is a redundant operation. In this

case, the OSWEN bit is cleared automatically

and the clock switch is aborted.

 2009-2012 Microchip Technology Inc.

DS70592D-page 131

PIC24HJXXXGPX06A/X08A/X10A

NOTES:

DS70592D-page 132

 2009-2012 Microchip Technology Inc.

PIC24HJXXXGPX06A/X08A/X10A

10.2 Instruction-Based Power-Saving

Modes

10.0 POWER-SAVING FEATURES

Note 1: This data sheet summarizes the features

of the PIC24HJXXXGPX06A/X08A/X10A

family of devices. However, it is not

PIC24HJXXXGPX06A/X08A/X10A devices have two

special power-saving modes that are entered through

the execution of a special PWRSAV instruction. Sleep

mode stops clock operation and halts all code execu-

tion. Idle mode halts the CPU and code execution, but

allows peripheral modules to continue operation. The

assembly syntax of the PWRSAVinstruction is shown in

Example 10-1.

intended to be

a

comprehensive

reference source. To complement the

information in this data sheet, refer to

Section 9. “Watchdog Timer and

Power-Saving Modes” (DS70196) of

the

Reference Manual”, which is available

from the Microchip web site

(www.microchip.com).

“dsPIC33F/PIC24H

Family

Note: SLEEP_MODE and IDLE_MODE are

constants defined in the assembler

include file for the selected device.

2: Some registers and associated bits

described in this section may not be

available on all devices. Refer to

Section 4.0 “Memory Organization” in

this data sheet for device-specific register

and bit information.

Sleep and Idle modes can be exited as a result of an

enabled interrupt, WDT time-out or a device Reset. When

the device exits these modes, it is said to “wake-up”.

10.2.1

SLEEP MODE

Sleep mode has these features:

The

PIC24HJXXXGPX06A/X08A/X10A

devices

• The system clock source is shut down. If an

on-chip oscillator is used, it is turned off.

provide the ability to manage power consumption by

selectively managing clocking to the CPU and the

peripherals. In general, a lower clock frequency and a

reduction in the number of circuits being clocked

• The device current consumption is reduced to a

minimum, provided that no I/O pin is sourcing

current

constitutes

PIC24HJXXXGPX06A/X08A/X10A

lower

consumed

devices

power.

can

• The Fail-Safe Clock Monitor does not operate

during Sleep mode since the system clock source

is disabled

manage power consumption in four different ways:

• Clock frequency

• The LPRC clock continues to run in Sleep mode if

the WDT is enabled

• Instruction-based Sleep and Idle modes

• Software-controlled Doze mode

• Selective peripheral control in software

• The WDT, if enabled, is automatically cleared

prior to entering Sleep mode

Combinations of these methods can be used to selec-

tively tailor an application’s power consumption while

still maintaining critical application features, such as

timing-sensitive communications.

• Some device features or peripherals may continue

to operate in Sleep mode. This includes items such

as the input change notification on the I/O ports, or

peripherals that use an external clock input. Any

peripheral that requires the system clock source for

its operation is disabled in Sleep mode.

10.1 Clock Frequency and Clock

Switching

The device will wake-up from Sleep mode on any of

these events:

PIC24HJXXXGPX06A/X08A/X10A devices allow a

wide range of clock frequencies to be selected under

application control. If the system clock configuration is

not locked, users can choose low-power or high-preci-

sion oscillators by simply changing the NOSC bits

(OSCCON<10:8>). The process of changing a system

clock during operation, as well as limitations to the pro-

cess, are discussed in more detail in Section 9.0

“Oscillator Configuration”.

• Any interrupt source that is individually enabled

• Any form of device Reset

• A WDT time-out

On wake-up from Sleep, the processor restarts with the

same clock source that was active when Sleep mode

was entered.

EXAMPLE 10-1:

PWRSAV INSTRUCTION SYNTAX

PWRSAV #SLEEP_MODE

PWRSAV #IDLE_MODE

; Put the device into SLEEP mode

; Put the device into IDLE mode

 2009-2012 Microchip Technology Inc.

DS70592D-page 133

PIC24HJXXXGPX06A/X08A/X10A

Doze mode is enabled by setting the DOZEN bit

(CLKDIV<11>). The ratio between peripheral and core

clock speed is determined by the DOZE<2:0> bits

(CLKDIV<14:12>). There are eight possible

configurations, from 1:1 to 1:128, with 1:1 being the

default setting.

10.2.2

IDLE MODE

Idle mode has these features:

• The CPU stops executing instructions.

• The WDT is automatically cleared.

• The system clock source remains active. By

default, all peripheral modules continue to operate

normally from the system clock source, but can

also be selectively disabled (see Section 10.4

“Peripheral Module Disable”).

It is also possible to use Doze mode to selectively

reduce power consumption in event-driven applica-

tions. This allows clock-sensitive functions, such as

synchronous communications, to continue without

interruption while the CPU idles, waiting for something

to invoke an interrupt routine. Enabling the automatic

return to full-speed CPU operation on interrupts is

enabled by setting the ROI bit (CLKDIV<15>). By

default, interrupt events have no effect on Doze mode

operation.

• If the WDT or FSCM is enabled, the LPRC also

remains active.

The device will wake from Idle mode on any of these

events:

• Any interrupt that is individually enabled.

• Any device Reset.

For example, suppose the device is operating at

20 MIPS and the CAN module has been configured for

500 kbps based on this device operating speed. If the

device is now placed in Doze mode with a clock

frequency ratio of 1:4, the CAN module continues to

communicate at the required bit rate of 500 kbps, but

the CPU now starts executing instructions at a

frequency of 5 MIPS.

• A WDT time-out.

On wake-up from Idle, the clock is reapplied to the CPU

and instruction execution will begin (2-4 clock cycles

later), starting with the instruction following the PWRSAV

instruction, or the first instruction in the ISR.

10.2.3

INTERRUPTS COINCIDENT WITH

POWER SAVE INSTRUCTIONS

10.4 Peripheral Module Disable

Any interrupt that coincides with the execution of a

PWRSAV instruction is held off until entry into Sleep or

Idle mode has completed. The device then wakes up

from Sleep or Idle mode.

The Peripheral Module Disable (PMD) registers

provide a method to disable a peripheral module by

stopping all clock sources supplied to that module.

When a peripheral is disabled via the appropriate PMD

control bit, the peripheral is in a minimum power

consumption state. The control and status registers

associated with the peripheral are also disabled, so

writes to those registers will have no effect and read

values will be invalid.

10.3 Doze Mode

Generally, changing clock speed and invoking one of the

power-saving modes are the preferred strategies for

reducing power consumption. There may be cir-

cumstances, however, where this is not practical. For

example, it may be necessary for an application to main-

tain uninterrupted synchronous communication, even

while it is doing nothing else. Reducing system clock

speed may introduce communication errors, while using

a power-saving mode may stop communications

completely.

A peripheral module is only enabled if both the associ-

ated bit in the PMD register is cleared and the peripheral

is supported by the specific dsPIC^®DSC variant. If the

peripheral is present in the device, it is enabled in the

PMD register by default.

Note:

If a PMD bit is set, the corresponding

module is disabled after a delay of 1

instruction cycle. Similarly, if a PMD bit is

cleared, the corresponding module is

enabled after a delay of 1 instruction cycle

(assuming the module control registers

are already configured to enable module

operation).

Doze mode is a simple and effective alternative method

to reduce power consumption while the device is still

executing code. In this mode, the system clock contin-

ues to operate from the same source and at the same

speed. Peripheral modules continue to be clocked at

the same speed, while the CPU clock speed is

reduced. Synchronization between the two clock

domains is maintained, allowing the peripherals to

access the SFRs while the CPU executes code at a

slower rate.

DS70592D-page 134

 2009-2012 Microchip Technology Inc.

PIC24HJXXXGPX06A/X08A/X10A

REGISTER 10-1: PMD1: PERIPHERAL MODULE DISABLE CONTROL REGISTER 1

R/W-0

T5MD

R/W-0

T4MD

R/W-0

T3MD

R/W-0

T2MD

R/W-0

T1MD

U-0

—

U-0

—

U-0

—

bit 15

bit 8

R/W-0

U2MD

R/W-0

U1MD

R/W-0

C2MD

R/W-0

C1MD

R/W-0

AD1MD⁽¹⁾

I2C1MD

SPI2MD

SPI1MD

bit 7

bit 0

Legend:

R = Readable bit

-n = Value at POR

W = Writable bit

‘1’ = Bit is set

U = Unimplemented bit, read as ‘0’

‘0’ = Bit is cleared x = Bit is unknown

bit 15

bit 14

bit 13

bit 12

bit 11

T5MD: Timer5 Module Disable bit

1= Timer5 module is disabled

0= Timer5 module is enabled

T4MD: Timer4 Module Disable bit

1= Timer4 module is disabled

0= Timer4 module is enabled

T3MD: Timer3 Module Disable bit

1= Timer3 module is disabled

0= Timer3 module is enabled

T2MD: Timer2 Module Disable bit

1= Timer2 module is disabled

0= Timer2 module is enabled

T1MD: Timer1 Module Disable bit

1= Timer1 module is disabled

0= Timer1 module is enabled

bit 10-8

bit 7

Unimplemented: Read as ‘0’

I2C1MD: I²C1 Module Disable bit

1= I²C1 module is disabled

0= I²C1 module is enabled

bit 6

bit 5

bit 4

bit 3

bit 2

U2MD: UART2 Module Disable bit

1= UART2 module is disabled

0= UART2 module is enabled

U1MD: UART1 Module Disable bit

1= UART1 module is disabled

0= UART1 module is enabled

SPI2MD: SPI2 Module Disable bit

1= SPI2 module is disabled

0= SPI2 module is enabled

SPI1MD: SPI1 Module Disable bit

1= SPI1 module is disabled

0= SPI1 module is enabled

C2MD: ECAN2 Module Disable bit

1= ECAN2 module is disabled

0= ECAN2 module is enabled

Note 1: PCFGx bits have no effect if ADC module is disabled by setting this bit. In this case all port pins

multiplexed with ANx will be in Digital mode.

 2009-2012 Microchip Technology Inc.

DS70592D-page 135

PIC24HJXXXGPX06A/X08A/X10A

REGISTER 10-1: PMD1: PERIPHERAL MODULE DISABLE CONTROL REGISTER 1 (CONTINUED)

bit 1

C1MD: ECAN1 Module Disable bit

1= ECAN1 module is disabled

0= ECAN1 module is enabled

bit 0

AD1MD: ADC1 Module Disable bit⁽¹⁾

1= ADC1 module is disabled

0= ADC1 module is enabled

Note 1: PCFGx bits have no effect if ADC module is disabled by setting this bit. In this case all port pins

multiplexed with ANx will be in Digital mode.

DS70592D-page 136

 2009-2012 Microchip Technology Inc.

PIC24HJXXXGPX06A/X08A/X10A

REGISTER 10-2: PMD2: PERIPHERAL MODULE DISABLE CONTROL REGISTER 2

R/W-0

IC8MD

IC7MD

IC6MD

IC5MD

IC4MD

IC3MD

IC2MD

IC1MD

bit 15

bit 8

R/W-0

OC8MD

OC7MD

OC6MD

OC5MD

OC4MD

OC3MD

OC2MD

OC1MD

bit 7

bit 0

Legend:

R = Readable bit

W = Writable bit

‘1’ = Bit is set

U = Unimplemented bit, read as ‘0’

‘0’ = Bit is cleared x = Bit is unknown

-n = Value at POR

bit 15

bit 14

bit 13

bit 12

bit 11

bit 10

bit 9

IC8MD: Input Capture 8 Module Disable bit

1= Input Capture 8 module is disabled

0= Input Capture 8 module is enabled

IC7MD: Input Capture 7 Module Disable bit

1= Input Capture 7 module is disabled

0= Input Capture 7 module is enabled

IC6MD: Input Capture 6 Module Disable bit

1= Input Capture 6 module is disabled

0= Input Capture 6 module is enabled

IC5MD: Input Capture 5 Module Disable bit

1= Input Capture 5 module is disabled

0= Input Capture 5 module is enabled

IC4MD: Input Capture 4 Module Disable bit

1= Input Capture 4 module is disabled

0= Input Capture 4 module is enabled

IC3MD: Input Capture 3 Module Disable bit

1= Input Capture 3 module is disabled

0= Input Capture 3 module is enabled

IC2MD: Input Capture 2 Module Disable bit

1= Input Capture 2 module is disabled

0= Input Capture 2 module is enabled

bit 8

IC1MD: Input Capture 1 Module Disable bit

1= Input Capture 1 module is disabled

0= Input Capture 1 module is enabled

bit 7

OC8MD: Output Compare 8 Module Disable bit

1= Output Compare 8 module is disabled

0= Output Compare 8 module is enabled

bit 6

OC7MD: Output Compare 4 Module Disable bit

1= Output Compare 7 module is disabled

0= Output Compare 7 module is enabled

bit 5

OC6MD: Output Compare 6 Module Disable bit

1= Output Compare 6 module is disabled

0= Output Compare 6 module is enabled

bit 4

OC5MD: Output Compare 5 Module Disable bit

1= Output Compare 5 module is disabled

0= Output Compare 5 module is enabled

 2009-2012 Microchip Technology Inc.

DS70592D-page 137

PIC24HJXXXGPX06A/X08A/X10A

REGISTER 10-2: PMD2: PERIPHERAL MODULE DISABLE CONTROL REGISTER 2 (CONTINUED)

bit 3

bit 2

bit 1

bit 0

OC4MD: Output Compare 4 Module Disable bit

1= Output Compare 4 module is disabled

0= Output Compare 4 module is enabled

OC3MD: Output Compare 3 Module Disable bit

1= Output Compare 3 module is disabled

0= Output Compare 3 module is enabled

OC2MD: Output Compare 2 Module Disable bit

1= Output Compare 2 module is disabled

0= Output Compare 2 module is enabled

OC1MD: Output Compare 1 Module Disable bit

1= Output Compare 1 module is disabled

0= Output Compare 1 module is enabled

DS70592D-page 138

 2009-2012 Microchip Technology Inc.

PIC24HJXXXGPX06A/X08A/X10A

REGISTER 10-3: PMD3: PERIPHERAL MODULE DISABLE CONTROL REGISTER 3

R/W-0

T9MD

R/W-0

T8MD

R/W-0

T7MD

R/W-0

T6MD

U-0

—

U-0

—

U-0

—

U-0

—

bit 15

bit 8

U-0

—

U-0

—

U-0

—

U-0

—

U-0

—

U-0

—

R/W-0

AD2MD⁽¹⁾

I2C2MD

bit 7

bit 0

Legend:

R = Readable bit

-n = Value at POR

W = Writable bit

‘1’ = Bit is set

U = Unimplemented bit, read as ‘0’

‘0’ = Bit is cleared x = Bit is unknown

bit 15

bit 14

bit 13

bit 12

T9MD: Timer9 Module Disable bit

1= Timer9 module is disabled

0= Timer9 module is enabled

T8MD: Timer8 Module Disable bit

1= Timer8 module is disabled

0= Timer8 module is enabled

T7MD: Timer7 Module Disable bit

1= Timer7 module is disabled

0= Timer7 module is enabled

T6MD: Timer6 Module Disable bit

1= Timer6 module is disabled

0= Timer6 module is enabled

bit 11-2

bit 1

Unimplemented: Read as ‘0’

I2C2MD: I2C2 Module Disable bit

1= I2C2 module is disabled

0= I2C2 module is enabled

bit 0

AD2MD: AD2 Module Disable bit⁽¹⁾

1= AD2 module is disabled

0= AD2 module is enabled

Note 1: The PCFGx bits will have no effect if the ADC module is disabled by setting this bit. In this case, all port

pins multiplexed with ANx will be in Digital mode.

 2009-2012 Microchip Technology Inc.

DS70592D-page 139

PIC24HJXXXGPX06A/X08A/X10A

NOTES:

DS70592D-page 140

 2009-2012 Microchip Technology Inc.

PIC24HJXXXGPX06A/X08A/X10A

which a port’s digital output can drive the input of a

peripheral that shares the same pin. Figure 11-1 shows

11.0 I/O PORTS

how ports are shared with other peripherals and the

associated I/O pin to which they are connected.

Note 1: This data sheet summarizes the features

of the PIC24HJXXXGPX06A/X08A/X10A

family of devices. However, it is not

When a peripheral is enabled and actively driving an

associated pin, the use of the pin as a general purpose

output pin is disabled. The I/O pin may be read, but the

output driver for the parallel port bit will be disabled. If

a peripheral is enabled, but the peripheral is not

actively driving a pin, that pin may be driven by a port.

intended to be

a

comprehensive

reference source. To complement the

information in this data sheet, refer to

Section 10. “I/O Ports” (DS70193) of

the

Reference Manual”, which is available

from the Microchip web site

(www.microchip.com).

“dsPIC33F/PIC24H

Family

All port pins have three registers directly associated

with their operation as digital I/O. The data direction

register (TRISx) determines whether the pin is an input

or an output. If the data direction bit is a ‘1’, the pin is

then an input. All port pins are defined as inputs after a

Reset. Reads from the latch (LATx), read the latch.

Writes to the latch, write the latch. Reads from the port

(PORTx), read the port pins, while writes to the port

pins, write the latch.

2: Some registers and associated bits

described in this section may not be

available on all devices. Refer to

Section 4.0 “Memory Organization” in

this data sheet for device-specific register

and bit information.

Any bit and its associated data and control registers

that are not valid for a particular device will be

disabled. That means the corresponding LATx and

TRISx registers and the port pins will read as zeros.

All of the device pins (except VDD, VSS, MCLR and

OSC1/CLKIN) are shared between the peripherals and

the parallel I/O ports. All I/O input ports feature Schmitt

Trigger inputs for improved noise immunity.

When a pin is shared with another peripheral or func-

tion that is defined as an input only, it is nonetheless

regarded as a dedicated port because there is no other

competing source of outputs. An example is the INT4

pin.

11.1 Parallel I/O (PIO) Ports

A parallel I/O port that shares a pin with a peripheral is,

in general, subservient to the peripheral. The periph-

eral’s output buffer data and control signals are

provided to a pair of multiplexers. The multiplexers

select whether the peripheral or the associated port

has ownership of the output data and control signals of

the I/O pin. The logic also prevents “loop through”, in

Note:

The voltage on a digital input pin can be

between -0.3V to 5.6V.

FIGURE 11-1:

BLOCK DIAGRAM OF A TYPICAL SHARED PORT STRUCTURE

Output Multiplexers

Peripheral Module

Peripheral Input Data

Peripheral Module Enable

I/O

Peripheral Output Enable

Peripheral Output Data

1

Output Enable

0

PIO Module

1

0

Output Data

Read TRIS

Data Bus

WR TRIS

D

Q

I/O Pin

CK

TRIS Latch

D

Q

WR LAT +

WR PORT

CK

Data Latch

Read LAT

Read Port

Input Data

 2009-2012 Microchip Technology Inc.

DS70592D-page 141

PIC24HJXXXGPX06A/X08A/X10A

11.2 Open-Drain Configuration

11.4 I/O Port Write/Read Timing

In addition to the PORT, LAT and TRIS registers for

data control, some port pins can also be individually

configured for either digital or open-drain output. This is

controlled by the Open-Drain Control register, ODCx,

associated with each port. Setting any of the bits con-

figures the corresponding pin to act as an open-drain

output.

One instruction cycle is required between a port

direction change or port write operation and a read

operation of the same port. Typically, this instruction

would be a NOP.

11.5 Input Change Notification

The input change notification function of the I/O ports

allows the PIC24HJXXXGPX06A/X08A/X10A devices

to generate interrupt requests to the processor in

response to a change-of-state on selected input pins.

This feature is capable of detecting input

change-of-states even in Sleep mode, when the clocks

are disabled. Depending on the device pin count, there

are up to 24 external signals (CN0 through CN23) that

can be selected (enabled) for generating an interrupt

request on a change-of-state.

The open-drain feature allows the generation of

outputs higher than VDD (e.g., 5V) on any desired 5V

tolerant pins by using external pull-up resistors. The

maximum open-drain voltage allowed is the same as

the maximum VIH specification.

See the “Pin Diagrams” section for the available pins

and their functionality.

11.3 Configuring Analog Port Pins

There are four control registers associated with the CN

module. The CNEN1 and CNEN2 registers contain the

CN interrupt enable (CNxIE) control bits for each of the

CN input pins. Setting any of these bits enables a CN

interrupt for the corresponding pins.

The use of the ADxPCFGH, ADxPCFGL and TRIS

registers control the operation of the Analog-to-Digital

port pins. The port pins that are desired as analog

inputs must have their corresponding TRIS bit set

(input). If the TRIS bit is cleared (output), the digital out-

put level (VOH or VOL) is converted.

Each CN pin also has a weak pull-up connected to it.

The pull-ups act as a current source that is connected

to the pin and eliminate the need for external resistors

when push button or keypad devices are connected.

The pull-ups are enabled separately using the CNPU1

and CNPU2 registers, which contain the weak pull-up

enable (CNxPUE) bits for each of the CN pins. Setting

any of the control bits enables the weak pull-ups for the

corresponding pins.

Clearing any bit in the ADxPCFGH or ADxPCFGL reg-

ister configures the corresponding bit to be an analog

pin. This is also the Reset state of any I/O pin that has

an analog (ANx) function associated with it.

Note:

In devices with two ADC modules, if the

corresponding PCFG bit in either

AD1PCFGH(L) and AD2PCFGH(L) is

cleared, the pin is configured as an analog

input.

Note:

Pull-ups on change notification pins

should always be disabled whenever the

port pin is configured as a digital output.

When reading the PORT register, all pins configured as

analog input channels will read as cleared (a low level).

Pins configured as digital inputs will not convert an

analog input. Analog levels on any pin that is defined as

a digital input (including the ANx pins) can cause the

input buffer to consume current that exceeds the

device specifications.

Note:

The voltage on an analog input pin can be

between -0.3V to (VDD + 0.3 V).

EXAMPLE 11-1:

PORT WRITE/READ EXAMPLE

MOV

NOP

btss

0xFF00, W0

W0, TRISBB

; Configure PORTB<15:8> as inputs

; and PORTB<7:0> as outputs

; Delay 1 cycle

PORTB, #13

; Next Instruction

DS70592D-page 142

 2009-2012 Microchip Technology Inc.

PIC24HJXXXGPX06A/X08A/X10A

4. Each CN pin has a configurable internal weak

pull-up resistor. The pull-ups act as a current

11.6 I/O Helpful Tips

1. In some cases, certain pins as defined in TABLE

24-9: “DC Characteristics: I/O Pin Input Speci-

fications” under “Injection Current”, have internal

protection diodes to VDD and VSS. The term

“Injection Current” is also referred to as “Clamp

Current”. On designated pins, with sufficient exter-

nal current limiting precautions by the user, I/O pin

input voltages are allowed to be greater or less

than the data sheet absolute maximum ratings

with nominal VDD with respect to the VSS and VDD

supplies. Note that when the user application for-

ward biases either of the high or low side internal

input clamp diodes, that the resulting current being

injected into the device that is clamped internally

by the VDD and VSS power rails, may affect the

ADC accuracy by four to six counts.

source connected to the pin, and eliminates the

need for external resistors in certain applica-

tions. The internal pull-up is to ~(VDD-0.8) not

VDD. This is still above the minimum VIH of

CMOS and TTL devices.

5. When driving LEDs directly, the I/O pin can source

or sink more current than what is specified in the

VOH/IOH and VOL/IOL DC characteristic specifica-

tion. The respective IOH and IOL current rating only

applies to maintaining the corresponding output at

or above the VOH and at or below the VOL levels.

However, for LEDs unlike digital inputs of an exter-

nally connected device, they are not governed by

the same minimum VIH/VIL levels. An I/O pin out-

put can safely sink or source any current less than

that listed in the absolute maximum rating section

of the data sheet. For example:

2. I/O pins that are shared with any analog input pin,

(i.e., ANx), are always analog pins by default after

any reset. Consequently, any pin(s) configured as

an analog input pin, automatically disables the dig-

ital input pin buffer. As such, any attempt to read a

digital input pin will always return a ‘0’ regardless

of the digital logic level on the pin if the analog pin

is configured. To use a pin as a digital I/O pin on a

shared ANx pin, the user application needs to con-

figure the analog pin configuration registers in the

ADC module, (i.e., ADxPCFGL, AD1PCFGH), by

setting the appropriate bit that corresponds to that

I/O port pin to a ‘1’. On devices with more than one

ADC, both analog pin configurations for both ADC

modules must be configured as a digital I/O pin for

that pin to function as a digital I/O pin.

VOH = 2.4v @ IOH = -8 mA and VDD = 3.3V

The maximum output current sourced by any 8 mA

I/O pin = 12 mA.

LED source current < 12 mA is technically

permitted. Refer to the VOH/IOH graphs in

Section 24.0 “Electrical Characteristics” for

additional information.

11.7 I/O Resources

Many useful resources related to I/O are provided on

the main product page of the Microchip web site for the

devices listed in this data sheet. This product page,

which can be accessed using this link, contains the

latest updates and additional information.

Note:

Although it is not possible to use a digital

input pin when its analog function is

enabled, it is possible to use the digital I/O

output function, TRISx = 0x0, while the

analog function is also enabled. However,

this is not recommended, particularly if the

analog input is connected to an external

analog voltage source, which would cre-

ate signal contention between the analog

signal and the output pin driver.

Note:

In the event you are not able to access the

product page using the link above, enter

this URL in your browser:

http://www.microchip.com/wwwproducts/

Devices.aspx?dDocName=en546061

11.7.1

KEY RESOURCES

• Section 10. “I/O Ports” (DS70193)

• Code Samples

3. Most I/O pins have multiple functions. Referring to

the device pin diagrams in the data sheet, the pri-

orities of the functions allocated to any pins are

indicated by reading the pin name from

• Application Notes

• Software Libraries

• Webinars

• All related dsPIC33F/PIC24H Family Reference

Manuals Sections

left-to-right. The left most function name takes pre-

cedence over any function to its right in the naming

convention. Forexample:AN16/T2CK/T7CK/RC1.

This indicates that AN16 is the highest priority in

this example and will supersede all other functions

to its right in the list. Those other functions to its

right, even if enabled, would not work as long as

any other function to its left was enabled. This rule

applies to all of the functions listed for a given pin.

• Development Tools

 2009-2012 Microchip Technology Inc.

DS70592D-page 143

PIC24HJXXXGPX06A/X08A/X10A

NOTES:

DS70592D-page 144

 2009-2012 Microchip Technology Inc.

PIC24HJXXXGPX06A/X08A/X10A

Timer1 also supports these features:

• Timer gate operation

12.0 TIMER1

Note 1: This data sheet summarizes the features

of the PIC24HJXXXGPX06A/X08A/X10A

family of devices. However, it is not

intended to be a comprehensive refer-

ence source. To complement the infor-

mation in this data sheet, refer to Section

11. “Timers” (DS70205) of the

“dsPIC33F/PIC24H Family Reference

Manual”, which is available from the

Microchip web site (www.microchip.com).

• Selectable prescaler settings

• Timer operation during CPU Idle and Sleep

modes

• Interrupt on 16-bit Period register match or falling

edge of external gate signal

Figure 12-1 presents a block diagram of the 16-bit

timer module.

To configure Timer1 for operation:

1. Set the TON bit (= 1) in the T1CON register.

2: Some registers and associated bits

described in this section may not be

available on all devices. Refer to

Section 4.0 “Memory Organization” in

this data sheet for device-specific register

and bit information.

2. Select the timer prescaler ratio using the

TCKPS<1:0> bits in the T1CON register.

3. Set the Clock and Gating modes using the TCS

and TGATE bits in the T1CON register.

4. Set or clear the TSYNC bit in T1CON to select

synchronous or asynchronous operation.

The Timer1 module is a 16-bit timer, which can serve

as the time counter for the real-time clock, or operate

as a free-running interval timer/counter. Timer1 can

operate in three modes:

5. Load the timer period value into the PR1

register.

6. If interrupts are required, set the interrupt enable

bit, T1IE. Use the priority bits, T1IP<2:0>, to set

the interrupt priority.

• 16-bit Timer

• 16-bit Synchronous Counter

• 16-bit Asynchronous Counter

FIGURE 12-1:

16-BIT TIMER1 MODULE BLOCK DIAGRAM

TCKPS<1:0>

TON

2

SOSCO/

1x

01

00

T1CK

Prescaler

1, 8, 64, 256

Gate

Sync

SOSCEN

SOSCI

TCY

TGATE

TCS

TGATE

1

0

Q

D

Set T1IF

CK

0

Reset

Equal

TMR1

1

Sync

Comparator

PR1

TSYNC

 2009-2012 Microchip Technology Inc.

DS70592D-page 145

PIC24HJXXXGPX06A/X08A/X10A

REGISTER 12-1: T1CON: TIMER1 CONTROL REGISTER

R/W-0

TON

U-0

—

R/W-0

TSIDL

U-0

—

U-0

—

U-0

—

U-0

—

U-0

—

bit 15

bit 8

bit 0

U-0

—

R/W-0

U-0

—

R/W-0

TCS

U-0

—

TGATE

TCKPS<1:0>

TSYNC

bit 7

Legend:

R = Readable bit

-n = Value at POR

W = Writable bit

‘1’ = Bit is set

U = Unimplemented bit, read as ‘0’

‘0’ = Bit is cleared x = Bit is unknown

bit 15

TON: Timer1 On bit

1= Starts 16-bit Timer1

0= Stops 16-bit Timer1

bit 14

bit 13

Unimplemented: Read as ‘0’

TSIDL: Stop in Idle Mode bit

1= Discontinue module operation when device enters Idle mode

0= Continue module operation in Idle mode

bit 12-7

bit 6

Unimplemented: Read as ‘0’

TGATE: Timer1 Gated Time Accumulation Enable bit

When TCS = 1:

This bit is ignored.

When TCS = 0:

1= Gated time accumulation enabled

0= Gated time accumulation disabled

bit 5-4

TCKPS<1:0>: Timer1 Input Clock Prescale Select bits

11= 1:256

10= 1:64

01= 1:8

00= 1:1

bit 3

bit 2

Unimplemented: Read as ‘0’

TSYNC: Timer1 External Clock Input Synchronization Select bit

When TCS = 1:

1= Synchronize external clock input

0= Do not synchronize external clock input

When TCS = 0:

This bit is ignored.

bit 1

bit 0

TCS: Timer1 Clock Source Select bit

1= External clock from pin T1CK (on the rising edge)

0= Internal clock (FCY)

Unimplemented: Read as ‘0’

DS70592D-page 146

 2009-2012 Microchip Technology Inc.

PIC24HJXXXGPX06A/X08A/X10A

For 32-bit timer/counter operation, Timer2, Timer4,

13.0 TIMER2/3, TIMER4/5, TIMER6/7

Timer6 or Timer8 is the least significant word; Timer3,

Timer5, Timer7 or Timer9 is the most significant word

of the 32-bit timers.

AND TIMER8/9

Note 1: This data sheet summarizes the features

of the PIC24HJXXXGPX06A/X08A/X10A

family of devices. However, it is not

intended to be a comprehensive refer-

ence source. To complement the infor-

mation in this data sheet, refer to Section

11. “Timers” (DS70205) of the

“dsPIC33F/PIC24H Family Reference

Manual”, which is available from the

Microchip web site (www.microchip.com).

Note:

For 32-bit operation, T3CON, T5CON,

T7CON and T9CON control bits are

ignored. Only T2CON, T4CON, T6CON

and T8CON control bits are used for setup

and control. Timer2, Timer4, Timer6 and

Timer8 clock and gate inputs are utilized

for the 32-bit timer modules, but an inter-

rupt is generated with the Timer3, Timer5,

Ttimer7 and Timer9 interrupt flags.

2: Some registers and associated bits

described in this section may not be

available on all devices. Refer to

Section 4.0 “Memory Organization” in

this data sheet for device-specific register

and bit information.

To configure Timer2/3, Timer4/5, Timer6/7 or Timer8/9

for 32-bit operation:

1. Set the corresponding T32 control bit.

2. Select the prescaler ratio for Timer2, Timer4,

Timer6 or Timer8 using the TCKPS<1:0> bits.

3. Set the Clock and Gating modes using the

corresponding TCS and TGATE bits.

The Timer2/3, Timer4/5, Timer6/7 and Timer8/9

modules are 32-bit timers, which can also be config-

ured as four independent 16-bit timers with selectable

operating modes.

4. Load the timer period value. PR3, PR5, PR7 or

PR9 contains the most significant word of the

value, while PR2, PR4, PR6 or PR8 contains the

least significant word.

As a 32-bit timer, Timer2/3, Timer4/5, Timer6/7 and

Timer8/9 operate in three modes:

5. If interrupts are required, set the interrupt enable

bit, T3IE, T5IE, T7IE or T9IE. Use the priority

bits, T3IP<2:0>, T5IP<2:0>, T7IP<2:0> or

T9IP<2:0>, to set the interrupt priority. While

Timer2, Timer4, Timer6 or Timer8 control the

timer, the interrupt appears as a Timer3, Timer5,

Timer7 or Timer9 interrupt.

• Two Independent 16-bit Timers (e.g., Timer2 and

Timer3) with all 16-bit operating modes (except

Asynchronous Counter mode)

• Single 32-bit Timer

• Single 32-bit Synchronous Counter

They also support these features:

6. Set the corresponding TON bit.

• Timer Gate Operation

The timer value at any point is stored in the register

pair, TMR3:TMR2, TMR5:TMR4, TMR7:TMR6 or

TMR9:TMR8. TMR3, TMR5, TMR7 or TMR9 always

contains the most significant word of the count, while

TMR2, TMR4, TMR6 or TMR8 contains the least

significant word.

• Selectable Prescaler Settings

• Timer Operation during Idle and Sleep modes

• Interrupt on a 32-bit Period Register Match

• Time Base for Input Capture and Output Compare

Modules (Timer2 and Timer3 only)

• ADC1 Event Trigger (Timer2/3 only)

• ADC2 Event Trigger (Timer4/5 only)

To configure any of the timers for individual 16-bit

operation:

1. Clear the T32 bit corresponding to that timer.

Individually, all eight of the 16-bit timers can function as

synchronous timers or counters. They also offer the

features listed above, except for the event trigger; this

is implemented only with Timer2/3. The operating

modes and enabled features are determined by setting

the appropriate bit(s) in the T2CON, T3CON, T4CON,

T5CON, T6CON, T7CON, T8CON and T9CON regis-

ters. T2CON, T4CON, T6CON and T8CON are shown

in generic form in Register 13-1. T3CON, T5CON,

T7CON and T9CON are shown in Register 13-2.

2. Select the timer prescaler ratio using the

TCKPS<1:0> bits.

3. Set the Clock and Gating modes using the TCS

and TGATE bits.

4. Load the timer period value into the PRx

register.

5. If interrupts are required, set the interrupt enable

bit, TxIE. Use the priority bits, TxIP<2:0>, to set

the interrupt priority.

6. Set the TON bit.

 2009-2012 Microchip Technology Inc.

DS70592D-page 147

PIC24HJXXXGPX06A/X08A/X10A

A block diagram for a 32-bit timer pair (Timer4/5)

example is shown in Figure 13-1 and a timer (Timer4)

operating in 16-bit mode example is shown in

Figure 13-2.

Note:

Only Timer2 and Timer3 can trigger a

DMA data transfer.

FIGURE 13-1:

TIMER2/3 (32-BIT) BLOCK DIAGRAM⁽¹⁾

TCKPS<1:0>

2

TON

1x

01

00

T2CK

Gate

Sync

Prescaler

1, 8, 64, 256

TCY

TGATE

TCS

TGATE

1

0

Q

D

Set T3IF

CK

PR2

PR3

(2)

ADC Event Trigger

Equal

Reset

Comparator

MSb

LSb

TMR3

TMR2

Sync

16

Read TMR2

Write TMR2

16

TMR3HLD

16

Data Bus<15:0>

Note 1: The 32-bit timer control bit, T32, must be set for 32-bit timer/counter operation. All control bits are respective

to the T2CON register.

2: The ADC event trigger is available only on Timer2/3.

DS70592D-page 148

 2009-2012 Microchip Technology Inc.

PIC24HJXXXGPX06A/X08A/X10A

FIGURE 13-2:

TIMER2 (16-BIT) BLOCK DIAGRAM

TCKPS<1:0>

TON

2

T2CK

1x

01

00

Prescaler

1, 8, 64, 256

Gate

Sync

TGATE

TCS

TGATE

TCY

1

0

Q

D

Set T2IF

Q

CK

Reset

Equal

TMR2

Sync

Comparator

PR2

 2009-2012 Microchip Technology Inc.

DS70592D-page 149

PIC24HJXXXGPX06A/X08A/X10A

REGISTER 13-1: TxCON (T2CON, T4CON, T6CON OR T8CON) CONTROL REGISTER

R/W-0

TON

U-0

—

R/W-0

TSIDL

U-0

—

U-0

—

U-0

—

U-0

—

U-0

—

bit 15

bit 8

bit 0

U-0

—

R/W-0

T32

U-0

—

R/W-0

TCS⁽¹⁾

U-0

—

TGATE

TCKPS<1:0>

bit 7

Legend:

R = Readable bit

-n = Value at POR

W = Writable bit

‘1’ = Bit is set

U = Unimplemented bit, read as ‘0’

‘0’ = Bit is cleared x = Bit is unknown

bit 15

TON: Timerx On bit

When T32 = 1:

1= Starts 32-bit Timerx/y

0= Stops 32-bit Timerx/y

When T32 = 0:

1= Starts 16-bit Timerx

0= Stops 16-bit Timerx

bit 14

bit 13

Unimplemented: Read as ‘0’

TSIDL: Stop in Idle Mode bit

1= Discontinue module operation when device enters Idle mode

0= Continue module operation in Idle mode

bit 12-7

bit 6

Unimplemented: Read as ‘0’

TGATE: Timerx Gated Time Accumulation Enable bit

When TCS = 1:

This bit is ignored.

When TCS = 0:

1= Gated time accumulation enabled

0= Gated time accumulation disabled

bit 5-4

bit 3

TCKPS<1:0>: Timerx Input Clock Prescale Select bits

11= 1:256

10= 1:64

01= 1:8

00= 1:1

T32: 32-bit Timer Mode Select bit

1= Timerx and Timery form a single 32-bit timer

0= Timerx and Timery act as two 16-bit timers

bit 2

bit 1

Unimplemented: Read as ‘0’

TCS: Timerx Clock Source Select bit⁽¹⁾

1= External clock from pin TxCK (on the rising edge)

0= Internal clock (FCY)

bit 0

Unimplemented: Read as ‘0’

Note 1: The TxCK pin is not available on all timers. Refer to the “Pin Diagrams” section for the available pins.

DS70592D-page 150

 2009-2012 Microchip Technology Inc.

PIC24HJXXXGPX06A/X08A/X10A

REGISTER 13-2: TyCON (T3CON, T5CON, T7CON OR T9CON) CONTROL REGISTER

R/W-0

TON⁽¹⁾

U-0

—

R/W-0

TSIDL⁽²⁾

U-0

—

U-0

—

U-0

—

U-0

—

U-0

—

bit 15

bit 8

bit 0

U-0

—

R/W-0

TGATE⁽¹⁾

R/W-0

TCKPS<1:0>⁽¹⁾

R/W-0

U-0

—

U-0

—

R/W-0

TCS^(1,3)

U-0

—

bit 7

Legend:

R = Readable bit

W = Writable bit

‘1’ = Bit is set

U = Unimplemented bit, read as ‘0’

‘0’ = Bit is cleared x = Bit is unknown

-n = Value at POR

bit 15

TON: Timery On bit⁽¹⁾

1= Starts 16-bit Timery

0= Stops 16-bit Timery

bit 14

bit 13

Unimplemented: Read as ‘0’

TSIDL: Stop in Idle Mode bit⁽²⁾

1= Discontinue module operation when device enters Idle mode

0= Continue module operation in Idle mode

bit 12-7

bit 6

Unimplemented: Read as ‘0’

TGATE: Timery Gated Time Accumulation Enable bit⁽¹⁾

When TCS = 1:

This bit is ignored.

When TCS = 0:

1= Gated time accumulation enabled

0= Gated time accumulation disabled

bit 5-4

TCKPS<1:0>: Timer3 Input Clock Prescale Select bits⁽¹⁾

11= 1:256

10= 1:64

01= 1:8

00= 1:1

bit 3-2

bit 1

Unimplemented: Read as ‘0’

TCS: Timery Clock Source Select bit^(1,3)

1= External clock from pin TyCK (on the rising edge)

0= Internal clock (FCY)

bit 0

Unimplemented: Read as ‘0’

Note 1: When 32-bit operation is enabled (T2CON<3> = 1), these bits have no effect on Timery operation; all timer

functions are set through T2CON.

2: When 32-bit timer operation is enabled (T32 = 1) in the Timer Control register (TxCON<3>), the TSIDL bit

must be cleared to operate the 32-bit timer in Idle mode.

3: The TyCK pin is not available on all timers. Refer to the “Pin Diagrams” section for the available pins.

 2009-2012 Microchip Technology Inc.

DS70592D-page 151

PIC24HJXXXGPX06A/X08A/X10A

NOTES:

DS70592D-page 152

 2009-2012 Microchip Technology Inc.

PIC24HJXXXGPX06A/X08A/X10A

• Capture timer value on every edge (rising and

falling)

14.0 INPUT CAPTURE

Note 1: This data sheet summarizes the features

of the PIC24HJXXXGPX06A/X08A/X10A

family of devices. However, it is not

intended to be a comprehensive refer-

ence source. To complement the infor-

mation in this data sheet, refer to the

“dsPIC33F/PIC24H Family Reference

Manual”, Section 12. “Input Capture”

(DS70198), which is available from the

Microchip web site (www.microchip.com).

• Prescaler Capture Event modes:

- Capture timer value on every 4th rising

edge of input at ICx pin

- Capture timer value on every 16th rising

edge of input at ICx pin

Each input capture channel can select between one of

two 16-bit timers (Timer2 or Timer3) for the time base.

The selected timer can use either an internal or

external clock.

Other operational features include:

2: Some registers and associated bits

described in this section may not be

available on all devices. Refer to

Section 4.0 “Memory Organization” in

this data sheet for device-specific register

and bit information.

• Device wake-up from capture pin during CPU

Sleep and Idle modes

• Interrupt on input capture event

• 4-word FIFO buffer for capture values

- Interrupt optionally generated after 1, 2, 3 or

4 buffer locations are filled

The input capture module is useful in applications

requiring frequency (period) and pulse measurement.

• Input capture can also be used to provide

additional sources of external interrupts.

The

PIC24HJXXXGPX06A/X08A/X10A

devices

support up to eight input capture channels.

Note:

Only IC1 and IC2 can trigger a DMA data

transfer. If DMA data transfers are

required, the FIFO buffer size must be set

to 1 (ICI<1:0> = 00).

The input capture module captures the 16-bit value of

the selected Time Base register when an event occurs

at the ICx pin. The events that cause a capture event

are listed below in three categories:

• Simple Capture Event modes:

- Capture timer value on every falling edge of

input at ICx pin

- Capture timer value on every rising edge of

input at ICx pin

FIGURE 14-1:

INPUT CAPTURE BLOCK DIAGRAM

From 16-bit Timers

TMRy TMRz

16

ICTMR

(ICxCON<7>)

1

0

Edge Detection Logic

and

Clock Synchronizer

FIFO

R/W

Logic

Prescaler

Counter

(1, 4, 16)

ICx Pin

ICM<2:0> (ICxCON<2:0>)

3

Mode Select

ICOV, ICBNE (ICxCON<4:3>)

ICxBUF

ICxI<1:0>

Interrupt

Logic

ICxCON

Set Flag ICxIF

System Bus

(in IFSn Register)

Note: An ‘x’ in a signal, register or bit name denotes the number of the capture channel.

 2009-2012 Microchip Technology Inc.

DS70592D-page 153

PIC24HJXXXGPX06A/X08A/X10A

14.1 Input Capture Registers

REGISTER 14-1: ICxCON: INPUT CAPTURE x CONTROL REGISTER

U-0

—

U-0

—

R/W-0

U-0

—

U-0

—

U-0

—

U-0

—

U-0

—

ICSIDL

bit 15

bit 8

R/W-0

bit 0

R/W-0

ICTMR⁽¹⁾

R/W-0

R-0, HC

ICOV

R-0, HC

ICBNE

R/W-0

ICI<1:0>

ICM<2:0>

bit 7

Legend:

R = Readable bit

-n = Value at POR

W = Writable bit

‘1’ = Bit is set

U = Unimplemented bit, read as ‘0’

‘0’ = Bit is cleared x = Bit is unknown

bit 15-14

bit 13

Unimplemented: Read as ‘0’

ICSIDL: Input Capture Module Stop in Idle Control bit

1= Input capture module will halt in CPU Idle mode

0= Input capture module will continue to operate in CPU Idle mode

bit 12-8

bit 7

Unimplemented: Read as ‘0’

ICTMR: Input Capture Timer Select bits⁽¹⁾

1= TMR2 contents are captured on capture event

0= TMR3 contents are captured on capture event

bit 6-5

ICI<1:0>: Select Number of Captures per Interrupt bits

11= Interrupt on every fourth capture event

10= Interrupt on every third capture event

01= Interrupt on every second capture event

00= Interrupt on every capture event

bit 4

ICOV: Input Capture Overflow Status Flag bit (read-only)

1= Input capture overflow occurred

0= No input capture overflow occurred

bit 3

ICBNE: Input Capture Buffer Empty Status bit (read-only)

1= Input capture buffer is not empty, at least one more capture value can be read

0= Input capture buffer is empty

bit 2-0

ICM<2:0>: Input Capture Mode Select bits

111= Input capture functions as interrupt pin only when device is in Sleep or Idle mode

(Rising edge detect only, all other control bits are not applicable.)

110= Unused (module disabled)

101= Capture mode, every 16th rising edge

100= Capture mode, every 4th rising edge

011= Capture mode, every rising edge

010= Capture mode, every falling edge

001= Capture mode, every edge (rising and falling)

(ICI<1:0> bits do not control interrupt generation for this mode.)

000= Input capture module turned off

DS70592D-page 154

 2009-2012 Microchip Technology Inc.

PIC24HJXXXGPX06A/X08A/X10A

The state of the output pin changes when the timer

15.0 OUTPUT COMPARE

value matches the Compare register value. The output

compare module generates either a single output

pulse, or a sequence of output pulses, by changing the

state of the output pin on the compare match events.

The output compare module can also generate

interrupts on compare match events.

Note 1: This data sheet summarizes the features

of the PIC24HJXXXGPX06A/X08A/X10A

families of devices. It is not intended to be

a comprehensive reference source. To

complement the information in this data

sheet, refer to the “dsPIC33F/PIC24H

Family Reference Manual”, Section 13.

“Output Compare” (DS70209), which is

available on the Microchip web site

(www.microchip.com).

The output compare module has multiple operating

modes:

• Active-Low One-Shot mode

• Active-High One-Shot mode

• Toggle mode

2: Some registers and associated bits

described in this section may not be

available on all devices. Refer to

Section 4.0 “Memory Organization” in

this data sheet for device-specific register

and bit information.

• Delayed One-Shot mode

• Continuous Pulse mode

• PWM mode without Fault Protection

• PWM mode with Fault Protection

The output compare module can select either Timer2 or

Timer3 for its time base. The module compares the

value of the timer with the value of one or two Compare

registers depending on the operating mode selected.

FIGURE 15-1:

OUTPUT COMPARE MODULE BLOCK DIAGRAM

Set Flag bit

OCxIF

OCxRS

OCxR

Output

Logic

S

R

Q

OCx

3

Output

Enable

Logic

Output

Enable

OCM<2:0>

Mode Select

Comparator

OCFA

0

1

0

OCTSEL

1

16

TMR2

Rollover

TMR3

Rollover

TMR3

TMR2

 2009-2012 Microchip Technology Inc.

DS70592D-page 155

PIC24HJXXXGPX06A/X08A/X10A

application must disable the associated timer when

writing to the Output Compare Control registers to

avoid malfunctions.

15.1 Output Compare Modes

Configure the Output Compare modes by setting the

appropriate Output Compare Mode (OCM<2:0>) bits in

the Output Compare Control (OCxCON<2:0>) register.

Table 15-1 lists the different bit settings for the Output

Compare modes. Figure 15-2 illustrates the output

compare operation for various modes. The user

Note:

See Section 13. “Output Compare”

(DS70209) in the “dsPIC33F/PIC24H

Family Reference Manual” for OCxR and

OCxRS register restrictions.

TABLE 15-1: OUTPUT COMPARE MODES

OCM<2:0>

Mode

Module Disabled

OCx Pin Initial State

OCx Interrupt Generation

000

001

010

011

100

101

110

Controlled by GPIO register

—

Active-Low One-Shot

Active-High One-Shot

Toggle

0

1

OCx rising edge

OCx falling edge

Current output is maintained OCx rising and falling edge

Delayed One-Shot

Continuous Pulse

PWM without Fault Protection

0

OCx falling edge

No interrupt

‘0’, if OCxR is zero

‘1’, if OCxR is non-zero

111

PWM with Fault Protection

‘0’, if OCxR is zero

OCFA falling edge for OC1 to OC4

‘1’, if OCxR is non-zero

FIGURE 15-2:

OUTPUT COMPARE OPERATION

Output Compare

Mode Enabled

Timer is Reset on

Period Match

OCxRS

OCxR

TMRy

Active-Low One-Shot

(OCM = 001)

Active-High One-Shot

(OCM = 010)

Toggle

(OCM = 011)

Delayed One-Shot

(OCM = 100)

Continuous Pulse

(OCM = 101)

PWM

(OCM = 110or 111)

DS70592D-page 156

 2009-2012 Microchip Technology Inc.

PIC24HJXXXGPX06A/X08A/X10A

REGISTER 15-1: OCxCON: OUTPUT COMPARE x CONTROL REGISTER (x = 1, 2)

U-0

—

U-0

—

R/W-0

U-0

—

U-0

—

U-0

—

U-0

—

U-0

—

OCSIDL

bit 15

bit 8

U-0

—

U-0

—

U-0

—

R-0, HC

OCFLT

R/W-0

OCTSEL

OCM<2:0>

bit 7

bit 0

Legend:

HC = Hardware Clearable bit

W = Writable bit

R = Readable bit

-n = Value at POR

U = Unimplemented bit, read as ‘0’

‘0’ = Bit is cleared x = Bit is unknown

‘1’ = Bit is set

bit 15-14

bit 13

Unimplemented: Read as ‘0’

OCSIDL: Stop Output Compare in Idle Mode Control bit

1= Output Compare x halts in CPU Idle mode

0= Output Compare x continues to operate in CPU Idle mode

bit 12-5

bit 4

Unimplemented: Read as ‘0’

OCFLT: PWM Fault Condition Status bit

1= PWM Fault condition has occurred (cleared in hardware only)

0= No PWM Fault condition has occurred (this bit is only used when OCM<2:0> = 111)

bit 3

OCTSEL: Output Compare Timer Select bit

1= Timer3 is the clock source for Compare x

0= Timer2 is the clock source for Compare x

bit 2-0

OCM<2:0>: Output Compare Mode Select bits

111= PWM mode on OCx, Fault pin enabled

110= PWM mode on OCx, Fault pin disabled

101= Initialize OCx pin low, generate continuous output pulses on OCx pin

100= Initialize OCx pin low, generate single output pulse on OCx pin

011= Compare event toggles OCx pin

010= Initialize OCx pin high, compare event forces OCx pin low

001= Initialize OCx pin low, compare event forces OCx pin high

000= Output compare channel is disabled

 2009-2012 Microchip Technology Inc.

DS70592D-page 157

PIC24HJXXXGPX06A/X08A/X10A

NOTES:

DS70592D-page 158

 2009-2012 Microchip Technology Inc.

PIC24HJXXXGPX06A/X08A/X10A

The Serial Peripheral Interface (SPI) module is a syn-

16.0 SERIAL PERIPHERAL

chronous serial interface useful for communicating with

other peripheral or microcontroller devices. These

peripheral devices may be serial EEPROMs, shift regis-

ters, display drivers, Analog-to-Digital converters, etc.

The SPI module is compatible with SPI and SIOP from

Motorola^®.

INTERFACE (SPI)

Note 1: This data sheet summarizes the features

of the PIC24HJXXXGPX06A/X08A/X10A

family of devices. However, it is not

intended to be a comprehensive refer-

ence source. To complement the infor-

mation in this data sheet, refer to the

“dsPIC33F/PIC24H Family Reference

Manual“, Section 18. “Serial Peripheral

Interface (SPI)” (DS70206), which is

available from the Microchip web site

(www.microchip.com).

Note: In this section, the SPI modules are

referred to together as SPIx, or sepa-

rately as SPI1 and SPI2. Special Function

Registers will follow a similar notation.

For example, SPIxCON refers to the con-

trol register for the SPI1 or SPI2 module.

Each SPI module consists of a 16-bit shift register,

SPIxSR (where x = 1 or 2), used for shifting data in and

out, and a buffer register, SPIxBUF. A control register,

SPIxCON, configures the module. Additionally, a status

register, SPIxSTAT, indicates various status conditions.

2: Some registers and associated bits

described in this section may not be

available on all devices. Refer to

Section 4.0 “Memory Organization” in

this data sheet for device-specific register

and bit information.

The serial interface consists of 4 pins: SDIx (serial data

input), SDOx (serial data output), SCKx (shift clock

input or output), and SSx (active-low slave select).

In Master mode operation, SCK is a clock output but in

Slave mode, it is a clock input.

FIGURE 16-1:

SPI MODULE BLOCK DIAGRAM

SCKx

1:1 to 1:8

Secondary

Prescaler

1:1/4/16/64

Primary

Prescaler

FCY

SSx

Sync

Control

Select

Edge

Control

Clock

SPIxCON1<1:0>

SPIxCON1<4:2>

Shift Control

SDOx

SDIx

Enable

Master Clock

bit 0

SPIxSR

Transfer

SPIxRXB SPIxTXB

SPIxBUF

Write SPIxBUF

Read SPIxBUF

16

Internal Data Bus

 2009-2012 Microchip Technology Inc.

DS70592D-page 159

PIC24HJXXXGPX06A/X08A/X10A

16.1 SPI Helpful Tips

16.2 SPI Resources

1. In Frame mode, if there is a possibility that the

master may not be initialized before the slave:

Many useful resources related to SPI are provided on

the main product page of the Microchip web site for the

devices listed in this data sheet. This product page,

which can be accessed using this link, contains the

latest updates and additional information.

a) If FRMPOL (SPIxCON2<13>) = 1, use a

pull-down resistor on SSx.

b) If FRMPOL = 0, use a pull-up resistor on

SSx.

Note:

In the event you are not able to access the

product page using the link above, enter

this URL in your browser:

http://www.microchip.com/wwwproducts/

Devices.aspx?dDocName=en546061

Note:

This insures that the first frame

transmission after initialization is not

shifted or corrupted.

2. In non-framed 3-wire mode, (i.e., not using SSx

from a master):

16.2.1

KEY RESOURCES

a) If CKP (SPIxCON1<6>) = 1, always place a

• Section 18. “Serial Peripheral Interface (SPI)”

(DS70206)

pull-up resistor on SSx.

b) If CKP = 0, always place a pull-down

• Code Samples

• Application Notes

• Software Libraries

• Webinars

resistor on SSx.

Note:

This will insure that during power-up and

initialization the master/slave will not lose

sync due to an errant SCK transition that

would cause the slave to accumulate data

shift errors for both transmit and receive

appearing as corrupted data.

• All related dsPIC33F/PIC24H Family Reference

Manuals Sections

• Development Tools

3. FRMEN (SPIxCON2<15>) = 1 and SSEN

(SPIxCON1<7>) = 1 are exclusive and invalid.

In Frame mode, SCKx is continuous and the

Frame sync pulse is active on the SSx pin,

which indicates the start of a data frame.

Note:

Not all third-party devices support Frame

mode timing. Refer to the SPI electrical

characteristics for details.

4. In Master mode only, set the SMP bit

(SPIxCON1<9>) to a ‘1’ for the fastest SPI data

rate possible. The SMP bit can only be set at the

same time or after the MSTEN bit

(SPIxCON1<5>) is set.

5. To avoid invalid slave read data to the master,

the user’s master software must guarantee

enough time for slave software to fill its write buf-

fer before the user application initiates a master

write/read cycle. It is always advisable to pre-

load the SPIxBUF transmit register in advance

of the next master transaction cycle. SPIxBUF is

transferred to the SPI shift register and is empty

once the data transmission begins.

DS70592D-page 160

 2009-2012 Microchip Technology Inc.

PIC24HJXXXGPX06A/X08A/X10A

16.3

SPI Control Registers

REGISTER 16-1: SPIxSTAT: SPIx STATUS AND CONTROL REGISTER

R/W-0

SPIEN

U-0

—

R/W-0

U-0

—

U-0

—

U-0

—

U-0

—

U-0

—

SPISIDL

bit 15

bit 8

U-0

—

R/C-0

U-0

—

U-0

—

U-0

—

U-0

—

R-0

SPIROV

SPITBF

SPIRBF

bit 0

bit 7

Legend:

C = Clearable bit

W = Writable bit

‘1’ = Bit is set

R = Readable bit

-n = Value at POR

U = Unimplemented bit, read as ‘0’

‘0’ = Bit is cleared x = Bit is unknown

bit 15

SPIEN: SPIx Enable bit

1= Enables module and configures SCKx, SDOx, SDIx and SSx as serial port pins

0= Disables module

bit 14

bit 13

Unimplemented: Read as ‘0’

SPISIDL: Stop in Idle Mode bit

1= Discontinue module operation when device enters Idle mode

0= Continue module operation in Idle mode

bit 12-7

bit 6

Unimplemented: Read as ‘0’

SPIROV: Receive Overflow Flag bit

1= A new byte/word is completely received and discarded. The user software has not read the

previous data in the SPIxBUF register

0= No overflow has occurred

bit 5-2

bit 1

Unimplemented: Read as ‘0’

SPITBF: SPIx Transmit Buffer Full Status bit

1= Transmit not yet started, SPIxTXB is full

0= Transmit started, SPIxTXB is empty

Automatically set in hardware when CPU writes SPIxBUF location, loading SPIxTXB.

Automatically cleared in hardware when SPIx module transfers data from SPIxTXB to SPIxSR.

bit 0

SPIRBF: SPIx Receive Buffer Full Status bit

1= Receive complete, SPIxRXB is full

0= Receive is not complete, SPIxRXB is empty

Automatically set in hardware when SPIx transfers data from SPIxSR to SPIxRXB.

Automatically cleared in hardware when core reads SPIxBUF location, reading SPIxRXB.

 2009-2012 Microchip Technology Inc.

DS70592D-page 161

PIC24HJXXXGPX06A/X08A/X10A

REGISTER 16-2: SPIXCON1: SPIx CONTROL REGISTER 1

U-0

—

U-0

—

U-0

—

R/W-0

SMP

R/W-0

CKE⁽¹⁾

DISSCK

DISSDO

MODE16

bit 15

bit 8

R/W-0

SSEN⁽³⁾

R/W-0

CKP

R/W-0

SPRE<2:0>⁽²⁾

R/W-0

MSTEN

PPRE<1:0>⁽²⁾

bit 7

bit 0

Legend:

R = Readable bit

-n = Value at POR

W = Writable bit

‘1’ = Bit is set

U = Unimplemented bit, read as ‘0’

‘0’ = Bit is cleared x = Bit is unknown

bit 15-13

bit 12

Unimplemented: Read as ‘0’

DISSCK: Disable SCKx pin bit (SPI Master modes only)

1= Internal SPI clock is disabled, pin functions as I/O

0= Internal SPI clock is enabled

bit 11

bit 10

bit 9

DISSDO: Disable SDOx pin bit

1= SDOx pin is not used by module; pin functions as I/O

0= SDOx pin is controlled by the module

MODE16: Word/Byte Communication Select bit

1= Communication is word-wide (16 bits)

0= Communication is byte-wide (8 bits)

SMP: SPIx Data Input Sample Phase bit

Master mode:

1= Input data sampled at end of data output time

0= Input data sampled at middle of data output time

Slave mode:

SMP must be cleared when SPIx is used in Slave mode.

bit 8

bit 7

bit 6

bit 5

CKE: SPIx Clock Edge Select bit⁽¹⁾

1= Serial output data changes on transition from active clock state to Idle clock state (see bit 6)

0= Serial output data changes on transition from Idle clock state to active clock state (see bit 6)

SSEN: Slave Select Enable bit (Slave mode)⁽³⁾

1= SSx pin used for Slave mode

0= SSx pin not used by module. Pin controlled by port function

CKP: Clock Polarity Select bit

1= Idle state for clock is a high level; active state is a low level

0= Idle state for clock is a low level; active state is a high level

MSTEN: Master Mode Enable bit

1= Master mode

0= Slave mode

Note 1: The CKE bit is not used in the Framed SPI modes. The user should program this bit to ‘0’ for the Framed

SPI modes (FRMEN = 1).

2: Do not set both Primary and Secondary prescalers to a value of 1:1.

3: This bit must be cleared when FRMEN = 1.

DS70592D-page 162

 2009-2012 Microchip Technology Inc.

PIC24HJXXXGPX06A/X08A/X10A

REGISTER 16-2: SPIXCON1: SPIx CONTROL REGISTER 1 (CONTINUED)

bit 4-2

SPRE<2:0>: Secondary Prescale bits (Master mode)⁽²⁾

111= Secondary prescale 1:1

110= Secondary prescale 2:1

•

000= Secondary prescale 8:1

bit 1-0

PPRE<1:0>: Primary Prescale bits (Master mode)⁽²⁾

11= Primary prescale 1:1

10= Primary prescale 4:1

01= Primary prescale 16:1

00= Primary prescale 64:1

Note 1: The CKE bit is not used in the Framed SPI modes. The user should program this bit to ‘0’ for the Framed

SPI modes (FRMEN = 1).

2: Do not set both Primary and Secondary prescalers to a value of 1:1.

3: This bit must be cleared when FRMEN = 1.

 2009-2012 Microchip Technology Inc.

DS70592D-page 163

PIC24HJXXXGPX06A/X08A/X10A

REGISTER 16-3: SPIxCON2: SPIx CONTROL REGISTER 2

R/W-0

U-0

—

U-0

—

U-0

—

U-0

—

U-0

—

FRMEN

SPIFSD

FRMPOL

bit 15

bit 8

bit 0

U-0

—

U-0

—

U-0

—

U-0

—

U-0

—

U-0

—

R/W-0

U-0

—

FRMDLY

bit 7

Legend:

R = Readable bit

-n = Value at POR

W = Writable bit

‘1’ = Bit is set

U = Unimplemented bit, read as ‘0’

‘0’ = Bit is cleared x = Bit is unknown

bit 15

bit 14

bit 13

FRMEN: Framed SPIx Support bit

1= Framed SPIx support enabled (SSx pin used as frame sync pulse input/output)

0= Framed SPIx support disabled

SPIFSD: Frame Sync Pulse Direction Control bit

1= Frame sync pulse input (slave)

0= Frame sync pulse output (master)

FRMPOL: Frame Sync Pulse Polarity bit

1= Frame sync pulse is active-high

0= Frame sync pulse is active-low

bit 12-2

bit 1

Unimplemented: Read as ‘0’

FRMDLY: Frame Sync Pulse Edge Select bit

1= Frame sync pulse coincides with first bit clock

0= Frame sync pulse precedes first bit clock

bit 0

Unimplemented: Read as ‘0’

This bit must not be set to ‘1’ by the user application

DS70592D-page 164

 2009-2012 Microchip Technology Inc.

PIC24HJXXXGPX06A/X08A/X10A

17.1 Operating Modes

17.0 INTER-INTEGRATED

2

CIRCUIT™ (I C™)

The hardware fully implements all the master and slave

functions of the I²C Standard and Fast mode

specifications, as well as 7 and 10-bit addressing.

Note 1: This data sheet summarizes the features

of the PIC24HJXXXGPX06A/X08A/X10A

family of devices. However, it is not

The I²C module can operate either as a slave or a

master on an I²C bus.

intended to be

a

comprehensive

The following types of I²C operation are supported:

reference source. To complement the

information in this data sheet, refer to

Section 19. “Inter-Integrated Circuit™

(I²C™)” (DS70195) of the “dsPIC33F/

PIC24H Family Reference Manual”,

which is available from the Microchip web

site (www.microchip.com).

• I²C slave operation with 7-bit addressing

• I²C slave operation with 10-bit addressing

• I²C master operation with 7-bit or 10-bit addressing

For details about the communication sequence in each

of these modes, please refer to the “dsPIC33F/PIC24H

Family Reference Manual”.

2: Some registers and associated bits

described in this section may not be

available on all devices. Refer to

Section 4.0 “Memory Organization” in

this data sheet for device-specific register

and bit information.

The Inter-Integrated Circuit (I²C) module provides

complete hardware support for both Slave and Multi-

Master modes of the I²C serial communication

standard, with a 16-bit interface.

The PIC24HJXXXGPX06A/X08A/X10A devices have

up to two I²C interface modules, denoted as I2C1 and

I2C2. Each I²C module has a 2-pin interface: the SCLx

pin is clock and the SDAx pin is data.

Each I²C module ‘x’ (x = 1 or 2) offers the following key

features:

• I²C interface supporting both master and slave

operation

• I²C Slave mode supports 7-bit and 10-bit

addressing

• I²C Master mode supports 7-bit and 10-bit

addressing

• I²C Port allows bidirectional transfers between

master and slaves

• Serial clock synchronization for I²C port can be

used as a handshake mechanism to suspend and

resume serial transfer (SCLREL control)

• I²C supports multi-master operation; detects bus

collision and will arbitrate accordingly

 2009-2012 Microchip Technology Inc.

DS70592D-page 165

PIC24HJXXXGPX06A/X08A/X10A

FIGURE 17-1:

I²C™ BLOCK DIAGRAM (X = 1 OR 2)

Internal

Data Bus

I2CxRCV

Read

Shift

Clock

SCLx

SDAx

I2CxRSR

LSB

Address Match

Match Detect

Write

Read

I2CxMSK

Write

Read

I2CxADD

Start and Stop

Bit Detect

Write

Start and Stop

Bit Generation

I2CxSTAT

I2CxCON

Read

Write

Collision

Detect

Acknowledge

Generation

Read

Clock

Stretching

Write

Read

I2CxTRN

LSB

Shift Clock

Reload

Control

Write

Read

BRG Down Counter

TCY/2

I2CxBRG

DS70592D-page 166

 2009-2012 Microchip Technology Inc.

PIC24HJXXXGPX06A/X08A/X10A

2

17.2

C Resources

17.3 I C Registers

Many useful resources related to I²C are provided on

the main product page of the Microchip web site for the

devices listed in this data sheet. This product page,

which can be accessed using this link, contains the

latest updates and additional information.

I2CxCON and I2CxSTAT are control and status

registers, respectively. The I2CxCON register is

readable and writable. The lower six bits of I2CxSTAT

are read-only. The remaining bits of the I2CSTAT are

read/write.

I2CxRSR is the shift register used for shifting data,

whereas I2CxRCV is the buffer register to which data

bytes are written, or from which data bytes are read.

I2CxRCV is the receive buffer. I2CxTRN is the transmit

register to which bytes are written during a transmit

operation.

Note:

In the event you are not able to access the

product page using the link above, enter

this URL in your browser:

http://www.microchip.com/wwwproducts/

Devices.aspx?dDocName=en546061

17.2.1

KEY RESOURCES

The I2CxADD register holds the slave address. A

status bit, ADD10, indicates 10-bit Address mode. The

I2CxBRG acts as the Baud Rate Generator (BRG)

reload value.

• Section 11. “Inter-Integrated Circuit™ (I²C™)”

(DS70195)

• Code Samples

• Application Notes

• Software Libraries

• Webinars

In receive operations, I2CxRSR and I2CxRCV together

form a double-buffered receiver. When I2CxRSR

receives a complete byte, it is transferred to I2CxRCV

and an interrupt pulse is generated.

• All related dsPIC33F/PIC24H Family Reference

Manuals Sections

• Development Tools

 2009-2012 Microchip Technology Inc.

DS70592D-page 167

PIC24HJXXXGPX06A/X08A/X10A

REGISTER 17-1: I2CxCON: I2Cx CONTROL REGISTER

R/W-0

I2CEN

U-0

—

R/W-0

R/W-1 HC

SCLREL

R/W-0

A10M

R/W-0

SMEN

I2CSIDL

IPMIEN

DISSLW

bit 15

bit 8

R/W-0

GCEN

R/W-0

R/W-0 HC

ACKEN

R/W-0 HC

RCEN

R/W-0 HC

PEN

R/W-0 HC

RSEN

R/W-0 HC

SEN

STREN

ACKDT

bit 7

bit 0

Legend:

U = Unimplemented bit, read as ‘0’

R = Readable bit

-n = Value at POR

W = Writable bit

‘1’ = Bit is set

HS = Set in hardware

‘0’ = Bit is cleared

HC = Cleared in hardware

x = Bit is unknown

bit 15

I2CEN: I2Cx Enable bit

1= Enables the I2Cx module and configures the SDAx and SCLx pins as serial port pins

0= Disables the I2Cx module. All I²C pins are controlled by port functions.

bit 14

bit 13

Unimplemented: Read as ‘0’

I2CSIDL: Stop in Idle Mode bit

1= Discontinue module operation when device enters an Idle mode

0= Continue module operation in Idle mode

bit 12

SCLREL: SCLx Release Control bit (when operating as I²C slave)

1= Release SCLx clock

0= Hold SCLx clock low (clock stretch)

If STREN = 1:

Bit is R/W (i.e., software may write ‘0’ to initiate stretch and write ‘1’ to release clock). Hardware clear

at beginning of slave transmission. Hardware clear at end of slave reception.

If STREN = 0:

Bit is R/S (i.e., software may only write ‘1’ to release clock). Hardware clear at beginning of slave

transmission.

bit 11

bit 10

bit 9

IPMIEN: Intelligent Peripheral Management Interface (IPMI) Enable bit

1= IPMI mode is enabled; all addresses Acknowledged

0= IPMI mode disabled

A10M: 10-bit Slave Address bit

1= I2CxADD is a 10-bit slave address

0= I2CxADD is a 7-bit slave address

DISSLW: Disable Slew Rate Control bit

1= Slew rate control disabled

0= Slew rate control enabled

bit 8

SMEN: SMBus Input Levels bit

1= Enable I/O pin thresholds compliant with SMBus specification

0= Disable SMBus input thresholds

bit 7

GCEN: General Call Enable bit (when operating as I²C slave)

1= Enable interrupt when a general call address is received in the I2CxRSR

(module is enabled for reception)

0= General call address disabled

bit 6

STREN: SCLx Clock Stretch Enable bit (when operating as I²C slave)

Used in conjunction with SCLREL bit.

1= Enable software or receive clock stretching

0= Disable software or receive clock stretching

DS70592D-page 168

 2009-2012 Microchip Technology Inc.

PIC24HJXXXGPX06A/X08A/X10A

REGISTER 17-1: I2CxCON: I2Cx CONTROL REGISTER (CONTINUED)

bit 5

ACKDT: Acknowledge Data bit (when operating as I²C master, applicable during master receive)

Value that will be transmitted when the software initiates an Acknowledge sequence.

1= Send NACK during Acknowledge

0= Send ACK during Acknowledge

bit 4

ACKEN: Acknowledge Sequence Enable bit

(when operating as I²C master, applicable during master receive)

1= Initiate Acknowledge sequence on SDAx and SCLx pins and transmit ACKDT data bit.

Hardware clear at end of master Acknowledge sequence.

0= Acknowledge sequence not in progress

bit 3

bit 2

bit 1

RCEN: Receive Enable bit (when operating as I²C master)

1= Enables Receive mode for I²C. Hardware clear at end of eighth bit of master receive data byte.

0= Receive sequence not in progress

PEN: Stop Condition Enable bit (when operating as I²C master)

1= Initiate Stop condition on SDAx and SCLx pins. Hardware clear at end of master Stop sequence.

0= Stop condition not in progress

RSEN: Repeated Start Condition Enable bit (when operating as I²C master)

1= Initiate Repeated Start condition on SDAx and SCLx pins. Hardware clear at end of

master Repeated Start sequence.

0= Repeated Start condition not in progress

bit 0

SEN: Start Condition Enable bit (when operating as I²C master)

1= Initiate Start condition on SDAx and SCLx pins. Hardware clear at end of master Start sequence.

0= Start condition not in progress

 2009-2012 Microchip Technology Inc.

DS70592D-page 169

PIC24HJXXXGPX06A/X08A/X10A

REGISTER 17-2: I2CxSTAT: I2Cx STATUS REGISTER

R-0 HSC

TRSTAT

U-0

—

U-0

—

U-0

—

R/C-0 HS

BCL

R-0 HSC

GCSTAT

R-0 HSC

ADD10

ACKSTAT

bit 15

bit 8

R/C-0 HS

IWCOL

R/C-0 HS

I2COV

R-0 HSC

D_A

R/C-0 HSC R/C-0 HSC

R-0 HSC

R_W

R-0 HSC

RBF

R-0 HSC

TBF

P

S

bit 7

bit 0

Legend:

U = Unimplemented bit, read as ‘0’

C = Clear only bit

R = Readable bit

W = Writable bit

‘1’ = Bit is set

HS = Set in hardware

‘0’ = Bit is cleared

HSC = Hardware set/cleared

x = Bit is unknown

-n = Value at POR

bit 15

bit 14

ACKSTAT: Acknowledge Status bit

(when operating as I²C master, applicable to master transmit operation)

1= NACK received from slave

0= ACK received from slave

Hardware set or clear at end of slave Acknowledge.

TRSTAT: Transmit Status bit (when operating as I²C master, applicable to master transmit operation)

1= Master transmit is in progress (8 bits + ACK)

0= Master transmit is not in progress

Hardware set at beginning of master transmission. Hardware clear at end of slave Acknowledge.

bit 13-11

bit 10

Unimplemented: Read as ‘0’

BCL: Master Bus Collision Detect bit

1= A bus collision has been detected during a master operation

0= No collision

Hardware set at detection of bus collision.

bit 9

bit 8

bit 7

bit 6

bit 5

bit 4

GCSTAT: General Call Status bit

1= General call address was received

0= General call address was not received

Hardware set when address matches general call address. Hardware clear at Stop detection.

ADD10: 10-Bit Address Status bit

1= 10-bit address was matched

0= 10-bit address was not matched

Hardware set at match of 2nd byte of matched 10-bit address. Hardware clear at Stop detection.

IWCOL: Write Collision Detect bit

1= An attempt to write the I2CxTRN register failed because the I²C module is busy

0= No collision

Hardware set at occurrence of write to I2CxTRN while busy (cleared by software).

I2COV: Receive Overflow Flag bit

1= A byte was received while the I2CxRCV register is still holding the previous byte

0= No overflow

Hardware set at attempt to transfer I2CxRSR to I2CxRCV (cleared by software).

D_A: Data/Address bit (when operating as I²C slave)

1= Indicates that the last byte received was data

0= Indicates that the last byte received was device address

Hardware clear at device address match. Hardware set by reception of slave byte.

P: Stop bit

1= Indicates that a Stop bit has been detected last

0= Stop bit was not detected last

Hardware set or clear when Start, Repeated Start or Stop detected.

DS70592D-page 170

 2009-2012 Microchip Technology Inc.

PIC24HJXXXGPX06A/X08A/X10A

REGISTER 17-2: I2CxSTAT: I2Cx STATUS REGISTER (CONTINUED)

bit 3

bit 2

bit 1

S: Start bit

1= Indicates that a Start (or Repeated Start) bit has been detected last

0= Start bit was not detected last

Hardware set or clear when Start, Repeated Start or Stop detected.

R_W: Read/Write Information bit (when operating as I²C slave)

1= Read – indicates data transfer is output from slave

0= Write – indicates data transfer is input to slave

Hardware set or clear after reception of I²C device address byte.

RBF: Receive Buffer Full Status bit

1= Receive complete, I2CxRCV is full

0= Receive not complete, I2CxRCV is empty

Hardware set when I2CxRCV is written with received byte. Hardware clear when software

reads I2CxRCV.

bit 0

TBF: Transmit Buffer Full Status bit

1= Transmit in progress, I2CxTRN is full

0= Transmit complete, I2CxTRN is empty

Hardware set when software writes I2CxTRN. Hardware clear at completion of data transmission.

 2009-2012 Microchip Technology Inc.

DS70592D-page 171

PIC24HJXXXGPX06A/X08A/X10A

REGISTER 17-3: I2CxMSK: I2Cx SLAVE MODE ADDRESS MASK REGISTER

U-0

—

U-0

—

U-0

—

U-0

—

U-0

—

U-0

—

R/W-0

AMSK9

AMSK8

bit 15

bit 8

R/W-0

AMSK7

AMSK6

AMSK5

AMSK4

AMSK3

AMSK2

AMSK1

AMSK0

bit 7

bit 0

Legend:

R = Readable bit

-n = Value at POR

W = Writable bit

‘1’ = Bit is set

U = Unimplemented bit, read as ‘0’

‘0’ = Bit is cleared x = Bit is unknown

bit 15-10

bit 9-0

Unimplemented: Read as ‘0’

AMSKx: Mask for Address Bit x Select bit

1= Enable masking for bit x of incoming message address; bit match not required in this position

0= Disable masking for bit x; bit match required in this position

DS70592D-page 172

 2009-2012 Microchip Technology Inc.

PIC24HJXXXGPX06A/X08A/X10A

• Full-Duplex, 8 or 9-bit Data Transmission through

the UxTX and UxRX pins

18.0 UNIVERSAL ASYNCHRONOUS

RECEIVER TRANSMITTER

(UART)

• Even, Odd or No Parity Options (for 8-bit data)

• One or Two Stop bits

• Hardware Flow Control Option with UxCTS and

UxRTS pins

Note 1: This data sheet summarizes the features

of the PIC24HJXXXGPX06A/X08A/X10A

family of devices. However, it is not

intended to be a comprehensive refer-

ence source. To complement the infor-

mation in this data sheet, refer to Section

17. “UART” (DS70188) of the

“dsPIC33F/PIC24H Family Reference

Manual”, which is available from the

Microchip web site (www.microchip.com).

• Fully Integrated Baud Rate Generator with 16-bit

Prescaler

• Baud rates ranging from 10 Mbps to 38 bps at 40

MIPS

• 4-deep First-In-First-Out (FIFO) Transmit Data

Buffer

• 4-Deep FIFO Receive Data Buffer

• Parity, Framing and Buffer Overrun Error Detection

2: Some registers and associated bits

described in this section may not be

available on all devices. Refer to

Section 4.0 “Memory Organization” in

this data sheet for device-specific register

and bit information.

• Support for 9-bit mode with Address Detect

(9th bit = 1)

• Transmit and Receive Interrupts

• A Separate Interrupt for all UART Error Conditions

• Loopback mode for Diagnostic Support

• Support for Sync and Break Characters

• Supports Automatic Baud Rate Detection

• IrDA^®Encoder and Decoder Logic

The Universal Asynchronous Receiver Transmitter

(UART) module is one of the serial I/O modules avail-

able in the PIC24HJXXXGPX06A/X08A/X10A device

family. The UART is a full-duplex asynchronous system

that can communicate with peripheral devices, such as

personal computers, LIN, RS-232 and RS-485 inter-

faces. The module also supports a hardware flow con-

trol option with the UxCTS and UxRTS pins and also

includes an IrDA^®encoder and decoder.

• 16x Baud Clock Output for IrDA^®Support

A simplified block diagram of the UART is shown in

Figure 18-1. The UART module consists of the key

important hardware elements:

• Baud Rate Generator

• Asynchronous Transmitter

• Asynchronous Receiver

The primary features of the UART module are:

FIGURE 18-1:

UART SIMPLIFIED BLOCK DIAGRAM

Baud Rate Generator

IrDA^®

/BCLK

UxRTS

Hardware Flow Control

UART Receiver

UxCTS

UxRX

UxTX

UART Transmitter

Note 1: Both UART1 and UART2 can trigger a DMA data transfer. If U1TX, U1RX, U2TX or U2RX is selected as

a DMA IRQ source, a DMA transfer occurs when the U1TXIF, U1RXIF, U2TXIF or U2RXIF bit gets set as

a result of a UART1 or UART2 transmission or reception.

2: If DMA transfers are required, the UART TX/RX FIFO buffer must be set to a size of 1 byte/word

(i.e., UTXISEL<1:0> = 00and URXISEL<1:0> = 00).

 2009-2012 Microchip Technology Inc.

DS70592D-page 173

PIC24HJXXXGPX06A/X08A/X10A

18.1 UART Helpful Tips

18.2 UART Resources

1. In multi-node direct-connect UART networks,

Many useful resources related to UART are provided

on the main product page of the Microchip web site for

the devices listed in this data sheet. This product page,

which can be accessed using this link, contains the

latest updates and additional information.

UART

receive

inputs

react

to

the

complementary logic level defined by the

URXINV bit (UxMODE<4>), which defines the

idle state, the default of which is logic high, (i.e.,

URXINV = 0). Because remote devices do not

initialize at the same time, it is likely that one of

the devices, because the RX line is floating, will

trigger a start bit detection and will cause the

first byte received after the device has been ini-

tialized to be invalid. To avoid this situation, the

user should use a pull-up or pull-down resistor

on the RX pin depending on the value of the

URXINV bit.

Note:

In the event you are not able to access the

product page using the link above, enter

this URL in your browser:

http://www.microchip.com/wwwproducts/

Devices.aspx?dDocName=en546061

18.2.1

KEY RESOURCES

• Section 17. “UART” (DS70188)

• Code Samples

a) If URXINV = 0, use a pull-up resistor on the

RX pin.

• Application Notes

• Software Libraries

• Webinars

b) If URXINV = 1, use a pull-down resistor on

the RX pin.

2. The first character received on a wake-up from

Sleep mode caused by activity on the UxRX pin

of the UART module will be invalid. In Sleep

mode, peripheral clocks are disabled. By the

time the oscillator system has restarted and

stabilized from Sleep mode, the baud rate bit

sampling clock relative to the incoming UxRX bit

timing is no longer synchronized, resulting in the

first character being invalid. This is to be

expected.

• All related dsPIC33F/PIC24H Family Reference

Manuals Sections

• Development Tools

DS70592D-page 174

 2009-2012 Microchip Technology Inc.

PIC24HJXXXGPX06A/X08A/X10A

18.3 UART Control Registers

REGISTER 18-1: UxMODE: UARTx MODE REGISTER

R/W-0

UARTEN⁽¹⁾

U-0

—

R/W-0

USIDL

R/W-0

IREN⁽²⁾

R/W-0

U-0

—

R/W-0

RTSMD

UEN<1:0>

bit 15

bit 8

R/W-0 HC

WAKE

R/W-0

R/W-0 HC

ABAUD

R/W-0

BRGH

R/W-0

LPBACK

URXINV

PDSEL<1:0>

STSEL

bit 7

bit 0

Legend:

HC = Hardware cleared

W = Writable bit

R = Readable bit

-n = Value at POR

U = Unimplemented bit, read as ‘0’

‘0’ = Bit is cleared x = Bit is unknown

‘1’ = Bit is set

bit 15

UARTEN: UARTx Enable bit⁽¹⁾

1= UARTx is enabled; all UARTx pins are controlled by UARTx as defined by UEN<1:0>

0= UARTx is disabled; all UARTx pins are controlled by port latches; UARTx power consumption

minimal

bit 14

bit 13

Unimplemented: Read as ‘0’

USIDL: Stop in Idle Mode bit

1= Discontinue module operation when device enters Idle mode

0= Continue module operation in Idle mode

bit 12

bit 11

IREN: IrDA^®Encoder and Decoder Enable bit⁽²⁾

1= IrDA^®encoder and decoder enabled

0= IrDA^®encoder and decoder disabled

RTSMD: Mode Selection for UxRTS Pin bit

1= UxRTS pin in Simplex mode

0= UxRTS pin in Flow Control mode

bit 10

Unimplemented: Read as ‘0’

UEN<1:0>: UARTx Enable bits

bit 9-8

11= UxTX, UxRX and BCLK pins are enabled and used; UxCTS pin controlled by port latches

10= UxTX, UxRX, UxCTS and UxRTS pins are enabled and used

01= UxTX, UxRX and UxRTS pins are enabled and used; UxCTS pin controlled by port latches

00= UxTX and UxRX pins are enabled and used; UxCTS and UxRTS/BCLK pins controlled by

port latches

bit 7

WAKE: Wake-up on Start bit Detect During Sleep Mode Enable bit

1= UARTx will continue to sample the UxRX pin; interrupt generated on falling edge; bit cleared

in hardware on following rising edge

0= No wake-up enabled

bit 6

bit 5

LPBACK: UARTx Loopback Mode Select bit

1= Enable Loopback mode

0= Loopback mode is disabled

ABAUD: Auto-Baud Enable bit

1= Enable baud rate measurement on the next character – requires reception of a Sync field (0x55)

before any data; cleared in hardware upon completion

0= Baud rate measurement disabled or completed

Note 1: Refer to Section 17. “UART” (DS70188) in the “dsPIC33F/PIC24H Family Reference Manual” for

information on enabling the UART module for receive or transmit operation.

2: This feature is only available for the 16x BRG mode (BRGH = 0).

 2009-2012 Microchip Technology Inc.

DS70592D-page 175

PIC24HJXXXGPX06A/X08A/X10A

REGISTER 18-1: UxMODE: UARTx MODE REGISTER (CONTINUED)

bit 4

URXINV: Receive Polarity Inversion bit

1= UxRX Idle state is ‘0’

0= UxRX Idle state is ‘1’

bit 3

BRGH: High Baud Rate Enable bit

1= BRG generates 4 clocks per bit period (4x baud clock, High-Speed mode)

0= BRG generates 16 clocks per bit period (16x baud clock, Standard mode)

bit 2-1

PDSEL<1:0>: Parity and Data Selection bits

11= 9-bit data, no parity

10= 8-bit data, odd parity

01= 8-bit data, even parity

00= 8-bit data, no parity

bit 0

STSEL: Stop Bit Selection bit

1= Two Stop bits

0= One Stop bit

Note 1: Refer to Section 17. “UART” (DS70188) in the “dsPIC33F/PIC24H Family Reference Manual” for

information on enabling the UART module for receive or transmit operation.

2: This feature is only available for the 16x BRG mode (BRGH = 0).

DS70592D-page 176

 2009-2012 Microchip Technology Inc.

PIC24HJXXXGPX06A/X08A/X10A

REGISTER 18-2: UxSTA: UARTx STATUS AND CONTROL REGISTER

R/W-0

U-0

—

R/W-0 HC

UTXBRK

R/W-0

UTXEN⁽¹⁾

R-0

R-1

UTXISEL1

UTXINV

UTXISEL0

UTXBF

TRMT

bit 15

bit 8

R/W-0

R-1

R-0

R/C-0

R-0

URXISEL<1:0>

ADDEN

RIDLE

PERR

FERR

OERR

URXDA

bit 7

bit 0

Legend:

HC = Hardware cleared

W = Writable bit

C = Clear only bit

U = Unimplemented bit, read as ‘0’

‘0’ = Bit is cleared x = Bit is unknown

R = Readable bit

-n = Value at POR

‘1’ = Bit is set

bit 15,13

UTXISEL<1:0>: Transmission Interrupt Mode Selection bits

11= Reserved; do not use

10= Interrupt when a character is transferred to the Transmit Shift Register, and as a result, the

transmit buffer becomes empty

01= Interrupt when the last character is shifted out of the Transmit Shift Register; all transmit

operations are completed

00= Interrupt when a character is transferred to the Transmit Shift Register (this implies there is

at least one character open in the transmit buffer)

bit 14

UTXINV: Transmit Polarity Inversion bit

If IREN = 0:

1= UxTX Idle state is ‘0’

0= UxTX Idle state is ‘1’

If IREN = 1:

1= IrDA^®encoded UxTX Idle state is ‘1’

0= IrDA^®encoded UxTX Idle state is ‘0’

bit 12

bit 11

Unimplemented: Read as ‘0’

UTXBRK: Transmit Break bit

1= Send Sync Break on next transmission – Start bit, followed by twelve ‘0’ bits, followed by Stop bit;

cleared by hardware upon completion

0= Sync Break transmission disabled or completed

bit 10

UTXEN: Transmit Enable bit⁽¹⁾

1= Transmit enabled, UxTX pin controlled by UARTx

0= Transmit disabled, any pending transmission is aborted and buffer is reset. UxTX pin controlled

by port.

bit 9

UTXBF: Transmit Buffer Full Status bit (read-only)

1= Transmit buffer is full

0= Transmit buffer is not full, at least one more character can be written

bit 8

TRMT: Transmit Shift Register Empty bit (read-only)

1= Transmit Shift Register is empty and transmit buffer is empty (the last transmission has completed)

0= Transmit Shift Register is not empty, a transmission is in progress or queued

bit 7-6

URXISEL<1:0>: Receive Interrupt Mode Selection bits

11= Interrupt is set on UxRSR transfer making the receive buffer full (i.e., has 4 data characters)

10= Interrupt is set on UxRSR transfer making the receive buffer 3/4 full (i.e., has 3 data characters)

0x= Interrupt is set when any character is received and transferred from the UxRSR to the receive

buffer. Receive buffer has one or more characters.

Note 1: Refer to Section 17. “UART” (DS70188) in the “dsPIC33F/PIC24H Family Reference Manual” for

information on enabling the UART module for transmit operation.

 2009-2012 Microchip Technology Inc.

DS70592D-page 177

PIC24HJXXXGPX06A/X08A/X10A

REGISTER 18-2: UxSTA: UARTx STATUS AND CONTROL REGISTER (CONTINUED)

bit 5

bit 4

bit 3

bit 2

ADDEN: Address Character Detect bit (bit 8 of received data = 1)

1= Address Detect mode enabled. If 9-bit mode is not selected, this does not take effect

0= Address Detect mode disabled

RIDLE: Receiver Idle bit (read-only)

1= Receiver is Idle

0= Receiver is active

PERR: Parity Error Status bit (read-only)

1= Parity error has been detected for the current character (character at the top of the receive FIFO)

0= Parity error has not been detected

FERR: Framing Error Status bit (read-only)

1= Framing error has been detected for the current character (character at the top of the receive

FIFO)

0= Framing error has not been detected

bit 1

bit 0

OERR: Receive Buffer Overrun Error Status bit (read/clear only)

1= Receive buffer has overflowed

0= Receive buffer has not overflowed. Clearing a previously set OERR bit (1 0transition) will reset

the receiver buffer and the UxRSR to the empty state

URXDA: Receive Buffer Data Available bit (read-only)

1= Receive buffer has data, at least one more character can be read

0= Receive buffer is empty

Note 1: Refer to Section 17. “UART” (DS70188) in the “dsPIC33F/PIC24H Family Reference Manual” for

information on enabling the UART module for transmit operation.

DS70592D-page 178

 2009-2012 Microchip Technology Inc.

PIC24HJXXXGPX06A/X08A/X10A

• Signaling via interrupt capabilities for all CAN

receiver and transmitter error states

19.0 ENHANCED CAN (ECAN™)

MODULE

• Programmable clock source

• Programmable link to input capture module (IC2

for both CAN1 and CAN2) for time-stamping and

network synchronization

Note 1: This data sheet summarizes the features

of the PIC24HJXXXGPX06A/X08A/X10A

family of devices. However, it is not

intended to be a comprehensive refer-

ence source. To complement the infor-

mation in this data sheet, refer to the

“dsPIC33F/PIC24H Family Reference

Manual”, Section 21. “Enhanced Con-

troller Area Network (ECAN™)”

(DS70185), which is available from the

Microchip web site (www.microchip.com).

• Low-power Sleep and Idle mode

The CAN bus module consists of a protocol engine and

message buffering/control. The CAN protocol engine

handles all functions for receiving and transmitting

messages on the CAN bus. Messages are transmitted

by first loading the appropriate data registers. Status

and errors can be checked by reading the appropriate

registers. Any message detected on the CAN bus is

checked for errors and then matched against filters to

see if it should be received and stored in one of the

receive registers.

2: Some registers and associated bits

described in this section may not be

available on all devices. Refer to

Section 4.0 “Memory Organization” in

this data sheet for device-specific register

and bit information.

19.2 Frame Types

The CAN module transmits various types of frames

which include data messages, remote transmission

requests and as other frames that are automatically

generated for control purposes. The following frame

types are supported:

19.1 Overview

The Enhanced Controller Area Network (ECAN™)

module is a serial interface, useful for communicating

with other CAN modules or microcontroller devices.

This interface/protocol was designed to allow commu-

• Standard Data Frame:

A standard data frame is generated by a node when

the node wishes to transmit data. It includes an 11-bit

standard identifier (SID) but not an 18-bit extended

identifier (EID).

nications

within

noisy

environments.

The

PIC24HJXXXGPX06A/X08A/X10A devices contain up

to two ECAN modules.

The CAN module is a communication controller imple-

menting the CAN 2.0 A/B protocol, as defined in the

BOSCH specification. The module will support CAN 1.2,

CAN 2.0A, CAN 2.0B Passive and CAN 2.0B Active

versions of the protocol. The module implementation is

a full CAN system. The CAN specification is not covered

within this data sheet. The reader may refer to the

BOSCH CAN specification for further details.

• Extended Data Frame:

An extended data frame is similar to a standard data

frame but includes an extended identifier as well.

• Remote Frame:

It is possible for a destination node to request the

data from the source. For this purpose, the

destination node sends a remote frame with an iden-

tifier that matches the identifier of the required data

frame. The appropriate data source node will then

send a data frame as a response to this remote

request.

The module features are as follows:

• Implementation of the CAN protocol, CAN 1.2,

CAN 2.0A and CAN 2.0B

• Standard and extended data frames

• 0-8 bytes data length

• Error Frame:

• Programmable bit rate up to 1 Mbit/sec

An error frame is generated by any node that detects

a bus error. An error frame consists of two fields: an

error flag field and an error delimiter field.

• Automatic response to remote transmission

requests

• Up to 8 transmit buffers with application specified

prioritization and abort capability (each buffer may

contain up to 8 bytes of data)

• Overload Frame:

An overload frame can be generated by a node as a

result of two conditions. First, the node detects a

dominant bit during interframe space which is an ille-

gal condition. Second, due to internal conditions, the

node is not yet able to start reception of the next

message. A node may generate a maximum of 2

sequential overload frames to delay the start of the

next message.

• Up to 32 receive buffers (each buffer may contain

up to 8 bytes of data)

• Up to 16 full (standard/extended identifier)

acceptance filters

• 3 full acceptance filter masks

• DeviceNet™ addressing support

• Programmable wake-up functionality with

integrated low-pass filter

• Interframe Space:

Interframe space separates a proceeding frame (of

whatever type) from a following data or remote

frame.

• Programmable Loopback mode supports self-test

operation

 2009-2012 Microchip Technology Inc.

DS70592D-page 179

PIC24HJXXXGPX06A/X08A/X10A

FIGURE 19-1:

ECAN™ MODULE BLOCK DIAGRAM

RXF15 Filter

RXF14 Filter

RXF13 Filter

RXF12 Filter

RXF11 Filter

RXF10 Filter

RXF9 Filter

RXF8 Filter

RXF7 Filter

RXF6 Filter

RXF5 Filter

RXF4 Filter

RXF3 Filter

RXF2 Filter

RXF1 Filter

RXF0 Filter

DMA Controller

TRB7 TX/RX Buffer Control Register

TRB6 TX/RX Buffer Control Register

TRB5 TX/RX Buffer Control Register

TRB4 TX/RX Buffer Control Register

TRB3 TX/RX Buffer Control Register

TRB2 TX/RX Buffer Control Register

TRB1 TX/RX Buffer Control Register

TRB0 TX/RX Buffer Control Register

RXM2 Mask

RXM1 Mask

RXM0 Mask

Transmit Byte

Sequencer

Message Assembly

Buffer

Control

Configuration

Logic

CPU

Bus

CAN Protocol

Engine

Interrupts

(1)

CiTX

CiRX

Note 1: i = 1 or 2 refers to a particular ECAN™ module (ECAN1 or ECAN2).

DS70592D-page 180

 2009-2012 Microchip Technology Inc.

PIC24HJXXXGPX06A/X08A/X10A

The module can be programmed to apply a low-pass

19.3 Modes of Operation

filter function to the CiRX input line while the module or

the CPU is in Sleep mode. The WAKFIL bit

(CiCFG2<14>) enables or disables the filter.

The CAN module can operate in one of several operation

modes selected by the user. These modes include:

• Initialization Mode

• Disable Mode

• Normal Operation Mode

• Listen Only Mode

• Listen All Messages Mode

• Loopback Mode

Note:

Typically, if the CAN module is allowed to

transmit in a particular mode of operation

and

a

transmission is requested

immediately after the CAN module has

been placed in that mode of operation, the

module waits for 11 consecutive recessive

bits on the bus before starting

transmission. If the user application

switches to Disable mode within this 11-bit

period, the transmission is then aborted

and the corresponding TXABT bit is set

and the TXREQ bit is cleared.

Modes are requested by setting the REQOP<2:0> bits

(CiCTRL1<10:8>). Entry into a mode is Acknowledged

by

monitoring

the

OPMODE<2:0>

bits

(CiCTRL1<7:5>). The module will not change the mode

and the OPMODE bits until a change in mode is

acceptable, generally during bus Idle time, which is

defined as at least 11 consecutive recessive bits.

19.3.3

NORMAL OPERATION MODE

19.3.1

INITIALIZATION MODE

Normal Operation mode is selected when

REQOP<2:0> = 000. In this mode, the module is

activated and the I/O pins will assume the CAN bus

functions. The module will transmit and receive CAN

bus messages via the CiTX and CiRX pins.

In the Initialization mode, the module will not transmit or

receive. The error counters are cleared and the inter-

rupt flags remain unchanged. The programmer will

have access to Configuration registers that are access

restricted in other modes. The module will protect the

user from accidentally violating the CAN protocol

through programming errors. All registers which control

the configuration of the module cannot be modified

while the module is on-line. The CAN module will not

be allowed to enter the Configuration mode while a

transmission is taking place. The Configuration mode

serves as a lock to protect the following registers.

19.3.4

LISTEN ONLY MODE

If the Listen Only mode is activated, the module on the

CAN bus is passive. The transmitter buffers revert to

the port I/O function. The receive pins remain inputs.

For the receiver, no error flags or Acknowledge signals

are sent. The error counters are deactivated in this

state. The Listen Only mode can be used for detecting

the baud rate on the CAN bus. To use this, it is neces-

sary that there are at least two further nodes that

communicate with each other.

• All Module Control Registers

• Baud Rate and Interrupt Configuration Registers

• Bus Timing Registers

• Identifier Acceptance Filter Registers

• Identifier Acceptance Mask Registers

19.3.5

LISTEN ALL MESSAGES MODE

The module can be set to ignore all errors and receive

any message. The Listen All Messages mode is acti-

vated by setting REQOP<2:0> = ‘111’. In this mode,

the data which is in the message assembly buffer, until

the time an error occurred, is copied in the receive buf-

fer and can be read via the CPU interface.

19.3.2

DISABLE MODE

In Disable mode, the module will not transmit or

receive. The module has the ability to set the WAKIF bit

due to bus activity, however, any pending interrupts will

remain and the error counters will retain their value.

19.3.6

LOOPBACK MODE

If the REQOP<2:0> bits (CiCTRL1<10:8>) = 001, the

module will enter the Module Disable mode. If the module

is active, the module will wait for 11 recessive bits on the

CAN bus, detect that condition as an Idle bus, then

accept the module disable command. When the

OPMODE<2:0> bits (CiCTRL1<7:5>) = 001, that indi-

cates whether the module successfully went into Module

Disable mode. The I/O pins will revert to normal I/O

function when the module is in the Module Disable mode.

If the Loopback mode is activated, the module will con-

nect the internal transmit signal to the internal receive

signal at the module boundary. The transmit and

receive pins revert to their port I/O function.

 2009-2012 Microchip Technology Inc.

DS70592D-page 181

PIC24HJXXXGPX06A/X08A/X10A

REGISTER 19-1: CiCTRL1: ECAN™ MODULE CONTROL REGISTER 1

U-0

—

U-0

—

R/W-0

CSIDL

R/W-0

ABAT

r-0

—

R/W-1

R/W-0

bit 8

REQOP<2:0>

bit 15

R-1

R-0

U-0

—

R/W-0

U-0

—

U-0

—

R/W-0

WIN

OPMODE<2:0>

CANCAP

bit 7

Legend:

bit 0

r = Bit is Reserved

W = Writable bit

‘1’ = Bit is set

R = Readable bit

-n = Value at POR

U = Unimplemented bit, read as ‘0’

‘0’ = Bit is cleared x = Bit is unknown

bit 15-14

bit 13

Unimplemented: Read as ‘0’

CSIDL: Stop in Idle Mode bit

1= Discontinue module operation when device enters Idle mode

0= Continue module operation in Idle mode

bit 12

ABAT: Abort All Pending Transmissions bit

1= Signal all transmit buffers to abort transmission

0= Module will clear this bit when all transmissions are aborted

bit 11

Reserved: Do not use

bit 10-8

REQOP<2:0>: Request Operation Mode bits

111= Set Listen All Messages mode

110= Reserved – do not use

101= Reserved – do not use

100= Set Configuration mode

011= Set Listen Only Mode

010= Set Loopback mode

001= Set Disable mode

000= Set Normal Operation mode

bit 7-5

OPMODE<2:0>: Operation Mode bits

111= Module is in Listen All Messages mode

110= Reserved

101= Reserved

100= Module is in Configuration mode

011= Module is in Listen Only mode

010= Module is in Loopback mode

001= Module is in Disable mode

000= Module is in Normal Operation mode

bit 4

bit 3

Unimplemented: Read as ‘0’

CANCAP: CAN Message Receive Timer Capture Event Enable bit

1= Enable input capture based on CAN message receive

0= Disable CAN capture

bit 2-1

bit 0

Unimplemented: Read as ‘0’

WIN: SFR Map Window Select bit

1= Use filter window

0= Use buffer window

DS70592D-page 182

 2009-2012 Microchip Technology Inc.

PIC24HJXXXGPX06A/X08A/X10A

REGISTER 19-2: CiCTRL2: ECAN™ MODULE CONTROL REGISTER 2

U-0

—

U-0

—

U-0

—

U-0

—

U-0

—

U-0

—

U-0

—

U-0

—

bit 15

bit 8

bit 0

U-0

—

U-0

—

U-0

—

R-0

DNCNT<4:0>

bit 7

Legend:

R = Readable bit

-n = Value at POR

W = Writable bit

‘1’ = Bit is set

U = Unimplemented bit, read as ‘0’

‘0’ = Bit is cleared x = Bit is unknown

bit 15-5

bit 4-0

Unimplemented: Read as ‘0’

DNCNT<4:0>: DeviceNet™ Filter Bit Number bits

10010-11111= Invalid selection

10001= Compare up to data byte 3, bit 6 with EID<17>

•

00001= Compare up to data byte 1, bit 7 with EID<0>

00000= Do not compare data bytes

 2009-2012 Microchip Technology Inc.

DS70592D-page 183

PIC24HJXXXGPX06A/X08A/X10A

REGISTER 19-3: CiVEC: ECAN™ MODULE INTERRUPT CODE REGISTER

U-0

—

U-0

—

U-0

—

R-0

FILHIT<4:0>

bit 15

bit 8

bit 0

U-0

—

R-1

R-0

ICODE<6:0>

bit 7

Legend:

R = Readable bit

-n = Value at POR

W = Writable bit

‘1’ = Bit is set

U = Unimplemented bit, read as ‘0’

‘0’ = Bit is cleared x = Bit is unknown

bit 15-13

bit 12-8

Unimplemented: Read as ‘0’

FILHIT<4:0>: Filter Hit Number bits

10000-11111= Reserved

01111= Filter 15

•

00001= Filter 1

00000= Filter 0

bit 7

Unimplemented: Read as ‘0’

bit 6-0

ICODE<6:0>: Interrupt Flag Code bits

1000101-1111111= Reserved

1000100= FIFO almost full interrupt

1000011= Receiver overflow interrupt

1000010= Wake-up interrupt

1000001= Error interrupt

1000000= No interrupt

0010000-0111111= Reserved

0001111= RB15 buffer Interrupt

•

0001001= RB9 buffer interrupt

0001000= RB8 buffer interrupt

0000111= TRB7 buffer interrupt

0000110= TRB6 buffer interrupt

0000101= TRB5 buffer interrupt

0000100= TRB4 buffer interrupt

0000011= TRB3 buffer interrupt

0000010= TRB2 buffer interrupt

0000001= TRB1 buffer interrupt

0000000= TRB0 Buffer interrupt

DS70592D-page 184

 2009-2012 Microchip Technology Inc.

PIC24HJXXXGPX06A/X08A/X10A

REGISTER 19-4: CiFCTRL: ECAN™ MODULE FIFO CONTROL REGISTER

R/W-0

U-0

—

U-0

—

U-0

—

U-0

—

U-0

—

DMABS<2:0>

bit 15

bit 8

U-0

—

U-0

—

U-0

—

R/W-0

FSA<4:0>

bit 7

bit 0

Legend:

R = Readable bit

-n = Value at POR

W = Writable bit

‘1’ = Bit is set

U = Unimplemented bit, read as ‘0’

‘0’ = Bit is cleared x = Bit is unknown

bit 15-13

DMABS<2:0>: DMA Buffer Size bits

111= Reserved; do not use

110= 32 buffers in DMA RAM

101= 24 buffers in DMA RAM

100= 16 buffers in DMA RAM

011= 12 buffers in DMA RAM

010= 8 buffers in DMA RAM

001= 6 buffers in DMA RAM

000= 4 buffers in DMA RAM

bit 12-5

bit 4-0

Unimplemented: Read as ‘0’

FSA<4:0>: FIFO Area Starts with Buffer bits

11111= RB31 buffer

11110= RB30 buffer

•

00001= TRB1 buffer

00000= TRB0 buffer

 2009-2012 Microchip Technology Inc.

DS70592D-page 185

PIC24HJXXXGPX06A/X08A/X10A

REGISTER 19-5: CiFIFO: ECAN™ MODULE FIFO STATUS REGISTER

U-0

—

U-0

—

R-0

FBP<5:0>

R-0

bit 15

bit 8

bit 0

U-0

—

U-0

—

R-0

FNRB<5:0>

bit 7

Legend:

R = Readable bit

-n = Value at POR

W = Writable bit

‘1’ = Bit is set

U = Unimplemented bit, read as ‘0’

‘0’ = Bit is cleared x = Bit is unknown

bit 15-14

bit 13-8

Unimplemented: Read as ‘0’

FBP<5:0>: FIFO Write Buffer Pointer bits

011111= RB31 buffer

011110= RB30 buffer

•

000001= TRB1 buffer

000000= TRB0 buffer

bit 7-6

bit 5-0

Unimplemented: Read as ‘0’

FNRB<5:0>: FIFO Next Read Buffer Pointer bits

011111= RB31 buffer

011110= RB30 buffer

•

000001= TRB1 buffer

000000= TRB0 buffer

DS70592D-page 186

 2009-2012 Microchip Technology Inc.

PIC24HJXXXGPX06A/X08A/X10A

REGISTER 19-6: CiINTF: ECAN™ MODULE INTERRUPT FLAG REGISTER

U-0

R-0

—

TXBO

TXBP

RXBP

TXWAR

RXWAR

EWARN

bit 15

bit 8

R/C-0

IVRIF

R/C-0

U-0

—

R/C-0

RBIF

R/C-0

TBIF

WAKIF

ERRIF

FIFOIF

RBOVIF

bit 7

bit 0

Legend:

C = Clear only bit

W = Writable bit

‘1’ = Bit is set

R = Readable bit

-n = Value at POR

U = Unimplemented bit, read as ‘0’

‘0’ = Bit is cleared x = Bit is unknown

bit 15-14

bit 13

Unimplemented: Read as ‘0’

TXBO: Transmitter in Error State Bus Off bit

1= Transmitter is in Bus Off state

0= Transmitter is not in Bus Off state

bit 12

bit 11

bit 10

bit 9

TXBP: Transmitter in Error State Bus Passive bit

1= Transmitter is in Bus Passive state

0= Transmitter is not in Bus Passive state

RXBP: Receiver in Error State Bus Passive bit

1= Receiver is in Bus Passive state

0= Receiver is not in Bus Passive state

TXWAR: Transmitter in Error State Warning bit

1= Transmitter is in Error Warning state

0= Transmitter is not in Error Warning state

RXWAR: Receiver in Error State Warning bit

1= Receiver is in Error Warning state

0= Receiver is not in Error Warning state

bit 8

EWARN: Transmitter or Receiver in Error State Warning bit

1= Transmitter or receiver is in Error Warning state

0= Transmitter or receiver is not in Error Warning state

bit 7

IVRIF: Invalid Message Received Interrupt Flag bit

1= Interrupt request has occurred

0= Interrupt request has not occurred

bit 6

WAKIF: Bus Wake-up Activity Interrupt Flag bit

1= Interrupt request has occurred

0= Interrupt request has not occurred

bit 5

ERRIF: Error Interrupt Flag bit (multiple sources in CiINTF<13:8> register)

1= Interrupt request has occurred

0= Interrupt request has not occurred

bit 4

bit 3

Unimplemented: Read as ‘0’

FIFOIF: FIFO Almost Full Interrupt Flag bit

1= Interrupt request has occurred

0= Interrupt request has not occurred

bit 2

bit 1

bit 0

RBOVIF: RX Buffer Overflow Interrupt Flag bit

1= Interrupt request has occurred

0= Interrupt request has not occurred

RBIF: RX Buffer Interrupt Flag bit

1= Interrupt request has occurred

0= Interrupt request has not occurred

TBIF: TX Buffer Interrupt Flag bit

1= Interrupt request has occurred

0= Interrupt request has not occurred

 2009-2012 Microchip Technology Inc.

DS70592D-page 187

PIC24HJXXXGPX06A/X08A/X10A

REGISTER 19-7: CiINTE: ECAN™ MODULE INTERRUPT ENABLE REGISTER

U-0

—

U-0

—

U-0

—

U-0

—

U-0

—

U-0

—

U-0

—

U-0

—

bit 15

bit 8

R/W-0

IVRIE

R/W-0

ERRIE

U-0

—

R/W-0

RBIE

R/W-0

TBIE

WAKIE

FIFOIE

RBOVIE

bit 7

bit 0

Legend:

R = Readable bit

-n = Value at POR

W = Writable bit

‘1’ = Bit is set

U = Unimplemented bit, read as ‘0’

‘0’ = Bit is cleared x = Bit is unknown

bit 15-8

bit 7

Unimplemented: Read as ‘0’

IVRIE: Invalid Message Interrupt Enable bit

1= Interrupt request enabled

0= Interrupt request not enabled

bit 6

bit 5

WAKIE: Bus Wake-up Activity Interrupt Enable bit

1= Interrupt request enabled

0= Interrupt request not enabled

ERRIE: Error Interrupt Enable bit

1= Interrupt request enabled

0= Interrupt request not enabled

bit 4

bit 3

Unimplemented: Read as ‘0’

FIFOIE: FIFO Almost Full Interrupt Enable bit

1= Interrupt request enabled

0= Interrupt request not enabled

bit 2

bit 1

bit 0

RBOVIE: RX Buffer Overflow Interrupt Enable bit

1= Interrupt request enabled

0= Interrupt request not enabled

RBIE: RX Buffer Interrupt Enable bit

1= Interrupt request enabled

0= Interrupt request not enabled

TBIE: TX Buffer Interrupt Enable bit

1= Interrupt request enabled

0= Interrupt request not enabled

DS70592D-page 188

 2009-2012 Microchip Technology Inc.

PIC24HJXXXGPX06A/X08A/X10A

REGISTER 19-8: CiEC: ECAN™ MODULE TRANSMIT/RECEIVE ERROR COUNT REGISTER

R-0

bit 15

R-0

TERRCNT<7:0>

bit 8

bit 0

R-0

RERRCNT<7:0>

bit 7

Legend:

R = Readable bit

-n = Value at POR

W = Writable bit

‘1’ = Bit is set

U = Unimplemented bit, read as ‘0’

‘0’ = Bit is cleared x = Bit is unknown

bit 15-8

bit 7-0

TERRCNT<7:0>: Transmit Error Count bits

RERRCNT<7:0>: Receive Error Count bits

 2009-2012 Microchip Technology Inc.

DS70592D-page 189

PIC24HJXXXGPX06A/X08A/X10A

REGISTER 19-9: CiCFG1: ECAN™ MODULE BAUD RATE CONFIGURATION REGISTER 1

U-0

—

U-0

—

U-0

—

U-0

—

U-0

—

U-0

—

U-0

—

U-0

—

bit 15

bit 8

R/W-0

SJW<1:0>

BRP<5:0>

bit 7

bit 0

Legend:

R = Readable bit

-n = Value at POR

W = Writable bit

‘1’ = Bit is set

U = Unimplemented bit, read as ‘0’

‘0’ = Bit is cleared x = Bit is unknown

bit 15-8

bit 7-6

Unimplemented: Read as ‘0’

SJW<1:0>: Synchronization Jump Width bits

11= Length is 4 x TQ

10= Length is 3 x TQ

01= Length is 2 x TQ

00= Length is 1 x TQ

bit 5-0

BRP<5:0>: Baud Rate Prescaler bits

11 1111= TQ = 2 x 64 x 1/FCAN

•

00 0010= TQ = 2 x 3 x 1/FCAN

00 0001= TQ = 2 x 2 x 1/FCAN

00 0000= TQ = 2 x 1 x 1/FCAN

DS70592D-page 190

 2009-2012 Microchip Technology Inc.

PIC24HJXXXGPX06A/X08A/X10A

REGISTER 19-10: CiCFG2: ECAN™ MODULE BAUD RATE CONFIGURATION REGISTER 2

U-0

—

R/W-x

U-0

—

U-0

—

U-0

—

R/W-x

bit 8

R/W-x

WAKFIL

SEG2PH<2:0>

bit 15

R/W-x

SAM

R/W-x

SEG2PHTS

SEG1PH<2:0>

PRSEG<2:0>

bit 7

bit 0

Legend:

R = Readable bit

-n = Value at POR

W = Writable bit

‘1’ = Bit is set

U = Unimplemented bit, read as ‘0’

‘0’ = Bit is cleared x = Bit is unknown

bit 15

bit 14

Unimplemented: Read as ‘0’

WAKFIL: Select CAN bus Line Filter for Wake-up bit

1= Use CAN bus line filter for wake-up

0= CAN bus line filter is not used for wake-up

bit 13-11

bit 10-8

Unimplemented: Read as ‘0’

SEG2PH<2:0>: Phase Buffer Segment 2 bits

111= Length is 8 x TQ

000= Length is 1 x TQ

bit 7

SEG2PHTS: Phase Segment 2 Time Select bit

1= Freely programmable

0= Maximum of SEG1PH bits or Information Processing Time (IPT), whichever is greater

bit 6

SAM: Sample of the CAN bus Line bit

1= Bus line is sampled three times at the sample point

0= Bus line is sampled once at the sample point

bit 5-3

bit 2-0

SEG1PH<2:0>: Phase Buffer Segment 1 bits

111= Length is 8 x TQ

000= Length is 1 x TQ

PRSEG<2:0>: Propagation Time Segment bits

111= Length is 8 x TQ

000= Length is 1 x TQ

 2009-2012 Microchip Technology Inc.

DS70592D-page 191

PIC24HJXXXGPX06A/X08A/X10A

REGISTER 19-11: CiFEN1: ECAN™ MODULE ACCEPTANCE FILTER ENABLE REGISTER

R/W-1

FLTEN15

FLTEN14

FLTEN13

FLTEN12

FLTEN11

FLTEN10

FLTEN9

FLTEN8

bit 15

bit 8

R/W-1

FLTEN7

FLTEN6

FLTEN5

FLTEN4

FLTEN3

FLTEN2

FLTEN1

FLTEN0

bit 7

bit 0

Legend:

R = Readable bit

W = Writable bit

‘1’ = Bit is set

U = Unimplemented bit, read as ‘0’

‘0’ = Bit is cleared x = Bit is unknown

-n = Value at POR

bit 15-0

FLTENn: Enable Filter n (0-15) to Accept Messages bits

1= Enable Filter n

0= Disable Filter n

DS70592D-page 192

 2009-2012 Microchip Technology Inc.

PIC24HJXXXGPX06A/X08A/X10A

REGISTER 19-12: CiBUFPNT1: ECAN™ MODULE FILTER 0-3 BUFFER POINTER REGISTER

R/W-0

bit 15

R/W-0

bit 8

R/W-0

F3BP<3:0>

F2BP<3:0>

R/W-0

F1BP<3:0>

R/W-0

F0BP<3:0>

R/W-0

bit 7

bit 0

Legend:

R = Readable bit

-n = Value at POR

W = Writable bit

‘1’ = Bit is set

U = Unimplemented bit, read as ‘0’

‘0’ = Bit is cleared x = Bit is unknown

bit 15-12

bit 11-8

bit 7-4

F3BP<3:0>: RX Buffer Written when Filter 3 Hits bits

1111= Filter hits received in RX FIFO buffer

1110= Filter hits received in RX Buffer 14

•

0001= Filter hits received in RX Buffer 1

0000= Filter hits received in RX Buffer 0

F2BP<3:0>: RX Buffer Written when Filter 2 Hits bits

1111= Filter hits received in RX FIFO buffer

1110= Filter hits received in RX Buffer 14

•

0001= Filter hits received in RX Buffer 1

0000= Filter hits received in RX Buffer 0

F1BP<3:0>: RX Buffer Written when Filter 1 Hits bits

1111= Filter hits received in RX FIFO buffer

1110= Filter hits received in RX Buffer 14

•

0001= Filter hits received in RX Buffer 1

0000= Filter hits received in RX Buffer 0

bit 3-0

F0BP<3:0>: RX Buffer Written when Filter 0 Hits bits

1111= Filter hits received in RX FIFO buffer

1110= Filter hits received in RX Buffer 14

•

0001= Filter hits received in RX Buffer 1

0000= Filter hits received in RX Buffer 0

 2009-2012 Microchip Technology Inc.

DS70592D-page 193

PIC24HJXXXGPX06A/X08A/X10A

REGISTER 19-13: CiBUFPNT2: ECAN™ MODULE FILTER 4-7 BUFFER POINTER REGISTER

R/W-0

bit 15

R/W-0

bit 8

R/W-0

F7BP<3:0>

F6BP<3:0>

R/W-0

F5BP<3:0>

R/W-0

F4BP<3:0>

R/W-0

bit 7

bit 0

Legend:

R = Readable bit

-n = Value at POR

W = Writable bit

‘1’ = Bit is set

U = Unimplemented bit, read as ‘0’

‘0’ = Bit is cleared x = Bit is unknown

bit 15-12

bit 11-8

bit 7-4

F7BP<3:0>: RX Buffer Written when Filter 7 Hits bits

1111= Filter hits received in RX FIFO buffer

1110= Filter hits received in RX Buffer 14

•

0001= Filter hits received in RX Buffer 1

0000= Filter hits received in RX Buffer 0

F6BP<3:0>: RX Buffer Written when Filter 6 Hits bits

1111= Filter hits received in RX FIFO buffer

1110= Filter hits received in RX Buffer 14

•

0001= Filter hits received in RX Buffer 1

0000= Filter hits received in RX Buffer 0

F5BP<3:0>: RX Buffer Written when Filter 5 Hits bits

1111= Filter hits received in RX FIFO buffer

1110= Filter hits received in RX Buffer 14

•

0001= Filter hits received in RX Buffer 1

0000= Filter hits received in RX Buffer 0

bit 3-0

F4BP<3:0>: RX Buffer Written when Filter 4 Hits bits

1111= Filter hits received in RX FIFO buffer

1110= Filter hits received in RX Buffer 14

•

0001= Filter hits received in RX Buffer 1

0000= Filter hits received in RX Buffer 0

DS70592D-page 194

 2009-2012 Microchip Technology Inc.

PIC24HJXXXGPX06A/X08A/X10A

REGISTER 19-14: CiBUFPNT3: ECAN™ MODULE FILTER 8-11 BUFFER POINTER REGISTER

R/W-0

bit 15

R/W-0

bit 8

R/W-0

F11BP<3:0>

F10BP<3:0>

R/W-0

F9BP<3:0>

R/W-0

F8BP<3:0>

R/W-0

bit 7

bit 0

Legend:

R = Readable bit

-n = Value at POR

W = Writable bit

‘1’ = Bit is set

U = Unimplemented bit, read as ‘0’

‘0’ = Bit is cleared x = Bit is unknown

bit 15-12

bit 11-8

bit 7-4

F11BP<3:0>: RX Buffer Written when Filter 11 Hits bits

1111= Filter hits received in RX FIFO buffer

1110= Filter hits received in RX Buffer 14

•

0001= Filter hits received in RX Buffer 1

0000= Filter hits received in RX Buffer 0

F10BP<3:0>: RX Buffer Written when Filter 10 Hits bits

1111= Filter hits received in RX FIFO buffer

1110= Filter hits received in RX Buffer 14

•

0001= Filter hits received in RX Buffer 1

0000= Filter hits received in RX Buffer 0

F9BP<3:0>: RX Buffer Written when Filter 9 Hits bits

1111= Filter hits received in RX FIFO buffer

1110= Filter hits received in RX Buffer 14

•

0001= Filter hits received in RX Buffer 1

0000= Filter hits received in RX Buffer 0

bit 3-0

F8BP<3:0>: RX Buffer Written when Filter 8 Hits bits

1111= Filter hits received in RX FIFO buffer

1110= Filter hits received in RX Buffer 14

•

0001= Filter hits received in RX Buffer 1

0000= Filter hits received in RX Buffer 0

 2009-2012 Microchip Technology Inc.

DS70592D-page 195

PIC24HJXXXGPX06A/X08A/X10A

REGISTER 19-15: CiBUFPNT4: ECAN™ MODULE FILTER 12-15 BUFFER POINTER REGISTER

R/W-0

bit 15

R/W-0

bit 8

R/W-0

F15BP<3:0>

F14BP<3:0>

R/W-0

F13BP<3:0>

R/W-0

F12BP<3:0>

R/W-0

bit 7

bit 0

Legend:

R = Readable bit

-n = Value at POR

W = Writable bit

‘1’ = Bit is set

U = Unimplemented bit, read as ‘0’

‘0’ = Bit is cleared x = Bit is unknown

bit 15-12

bit 11-8

bit 7-4

F15BP<3:0>: RX Buffer Written when Filter 15 Hits bits

1111= Filter hits received in RX FIFO buffer

1110= Filter hits received in RX Buffer 14

•

0001= Filter hits received in RX Buffer 1

0000= Filter hits received in RX Buffer 0

F14BP<3:0>: RX Buffer Written when Filter 14 Hits bits

1111= Filter hits received in RX FIFO buffer

1110= Filter hits received in RX Buffer 14

•

0001= Filter hits received in RX Buffer 1

0000= Filter hits received in RX Buffer 0

F13BP<3:0>: RX Buffer Written when Filter 13 Hits bits

1111= Filter hits received in RX FIFO buffer

1110= Filter hits received in RX Buffer 14

•

0001= Filter hits received in RX Buffer 1

0000= Filter hits received in RX Buffer 0

bit 3-0

F12BP<3:0>: RX Buffer Written when Filter 12 Hits bits

1111= Filter hits received in RX FIFO buffer

1110= Filter hits received in RX Buffer 14

•

0001= Filter hits received in RX Buffer 1

0000= Filter hits received in RX Buffer 0

DS70592D-page 196

 2009-2012 Microchip Technology Inc.

PIC24HJXXXGPX06A/X08A/X10A

REGISTER 19-16: CiRXFnSID: ECAN™ MODULE ACCEPTANCE FILTER n STANDARD IDENTIFIER

(n = 0, 1, ..., 15)

R/W-x

bit 15

R/W-x

SID<10:3>

bit 8

R/W-x

U-0

—

R/W-x

EXIDE

U-0

—

R/W-x R/W-x

EID<17:16>

SID<2:0>

bit 7

bit 0

Legend:

R = Readable bit

W = Writable bit

‘1’ = Bit is set

U = Unimplemented bit, read as ‘0’

‘0’ = Bit is cleared x = Bit is unknown

-n = Value at POR

bit 15-5

SID<10:0>: Standard Identifier bits

1= Message address bit SIDx must be ‘1’ to match filter

0= Message address bit SIDx must be ‘0’ to match filter

bit 4

bit 3

Unimplemented: Read as ‘0’

EXIDE: Extended Identifier Enable bit

If MIDE = 1:

1= Match only messages with extended identifier addresses

0= Match only messages with standard identifier addresses

If MIDE = 0:

Ignore EXIDE bit.

bit 2

Unimplemented: Read as ‘0’

bit 1-0

EID<17:16>: Extended Identifier bits

1= Message address bit EIDx must be ‘1’ to match filter

0= Message address bit EIDx must be ‘0’ to match filter

REGISTER 19-17: CiRXFnEID: ECAN™ MODULE ACCEPTANCE FILTER n EXTENDED IDENTIFIER

(n = 0, 1, ..., 15)

R/W-x

EID<15:8>

bit 15

R/W-x

bit 7

bit 8

R/W-x

bit 0

R/W-x

R/W-x R/W-x

EID<7:0>

R/W-x

Legend:

R = Readable bit

-n = Value at POR

W = Writable bit

‘1’ = Bit is set

U = Unimplemented bit, read as ‘0’

‘0’ = Bit is cleared x = Bit is unknown

bit 15-0

EID<15:0>: Extended Identifier bits

1= Message address bit EIDx must be ‘1’ to match filter

0= Message address bit EIDx must be ‘0’ to match filter

 2009-2012 Microchip Technology Inc.

DS70592D-page 197

PIC24HJXXXGPX06A/X08A/X10A

REGISTER 19-18: CiFMSKSEL1: ECAN™ MODULE FILTER 7-0 MASK SELECTION REGISTER

R/W-0

F7MSK<1:0>

F6MSK<1:0>

F5MSK<1:0>

F4MSK<1:0>

bit 15

bit 8

R/W-0 R/W-0

F3MSK<1:0>

R/W-0

F2MSK<1:0>

F1MSK<1:0>

F0MSK<1:0>

bit 7

bit 0

Legend:

R = Readable bit

-n = Value at POR

W = Writable bit

‘1’ = Bit is set

U = Unimplemented bit, read as ‘0’

‘0’ = Bit is cleared x = Bit is unknown

bit 15-14

bit 13-12

bit 11-10

bit 9-8

F7MSK<1:0>: Mask Source for Filter 7 bit

11= Reserved; do not use

10= Acceptance Mask 2 registers contain mask

01= Acceptance Mask 1 registers contain mask

00= Acceptance Mask 0 registers contain mask

F6MSK<1:0>: Mask Source for Filter 6 bit

11= Reserved; do not use

10= Acceptance Mask 2 registers contain mask

01= Acceptance Mask 1 registers contain mask

00= Acceptance Mask 0 registers contain mask

F5MSK<1:0>: Mask Source for Filter 5 bit

11= Reserved; do not use

10= Acceptance Mask 2 registers contain mask

01= Acceptance Mask 1 registers contain mask

00= Acceptance Mask 0 registers contain mask

F4MSK<1:0>: Mask Source for Filter 4 bit

11= Reserved; do not use

10= Acceptance Mask 2 registers contain mask

01= Acceptance Mask 1 registers contain mask

00= Acceptance Mask 0 registers contain mask

bit 7-6

F3MSK<1:0>: Mask Source for Filter 3 bit

11= Reserved; do not use

10= Acceptance Mask 2 registers contain mask

01= Acceptance Mask 1 registers contain mask

00= Acceptance Mask 0 registers contain mask

bit 5-4

F2MSK<1:0>: Mask Source for Filter 2 bit

11= Reserved; do not use

10= Acceptance Mask 2 registers contain mask

01= Acceptance Mask 1 registers contain mask

00= Acceptance Mask 0 registers contain mask

bit 3-2

F1MSK<1:0>: Mask Source for Filter 1 bit

11= Reserved; do not use

10= Acceptance Mask 2 registers contain mask

01= Acceptance Mask 1 registers contain mask

00= Acceptance Mask 0 registers contain mask

bit 1-0

F0MSK<1:0>: Mask Source for Filter 0 bit

11= Reserved; do not use

10= Acceptance Mask 2 registers contain mask

01= Acceptance Mask 1 registers contain mask

00= Acceptance Mask 0 registers contain mask

DS70592D-page 198

 2009-2012 Microchip Technology Inc.

PIC24HJXXXGPX06A/X08A/X10A

REGISTER 19-19: CiFMSKSEL2: ECAN™ FILTER 15-8 MASK SELECTION REGISTER

R/W-0

F15MSK<1:0>

F14MSK<1:0>

F13MSK<1:0>

F12MSK<1:0>

bit 15

bit 8

R/W-0

F11MSK<1:0>

F10MSK<1:0>

F9MSK<1:0>

F8MSK<1:0>

bit 7

bit 0

Legend:

R = Readable bit

-n = Value at POR

W = Writable bit

‘1’ = Bit is set

U = Unimplemented bit, read as ‘0’

‘0’ = Bit is cleared x = Bit is unknown

bit 15-14

bit 13-12

bit 11-10

bit 9-8

F15MSK<1:0>: Mask Source for Filter 15 bit

11= Reserved; do not use

10= Acceptance Mask 2 registers contain mask

01= Acceptance Mask 1 registers contain mask

00= Acceptance Mask 0 registers contain mask

F14MSK<1:0>: Mask Source for Filter 14 bit

11= Reserved; do not use

10= Acceptance Mask 2 registers contain mask

01= Acceptance Mask 1 registers contain mask

00= Acceptance Mask 0 registers contain mask

F13MSK<1:0>: Mask Source for Filter 13 bit

11= Reserved; do not use

10= Acceptance Mask 2 registers contain mask

01= Acceptance Mask 1 registers contain mask

00= Acceptance Mask 0 registers contain mask

F12MSK<1:0>: Mask Source for Filter 12 bit

11= Reserved; do not use

10= Acceptance Mask 2 registers contain mask

01= Acceptance Mask 1 registers contain mask

00= Acceptance Mask 0 registers contain mask

bit 7-6

F11MSK<1:0>: Mask Source for Filter 11 bit

11= Reserved; do not use

10= Acceptance Mask 2 registers contain mask

01= Acceptance Mask 1 registers contain mask

00= Acceptance Mask 0 registers contain mask

bit 5-4

F10MSK<1:0>: Mask Source for Filter 10 bit

11= Reserved; do not use

10= Acceptance Mask 2 registers contain mask

01= Acceptance Mask 1 registers contain mask

00= Acceptance Mask 0 registers contain mask

bit 3-2

F9MSK<1:0>: Mask Source for Filter 9 bit

11= Reserved; do not use

10= Acceptance Mask 2 registers contain mask

01= Acceptance Mask 1 registers contain mask

00= Acceptance Mask 0 registers contain mask

bit 1-0

F8MSK<1:0>: Mask Source for Filter 8 bit

11= Reserved; do not use

10= Acceptance Mask 2 registers contain mask

01= Acceptance Mask 1 registers contain mask

00= Acceptance Mask 0 registers contain mask

 2009-2012 Microchip Technology Inc.

DS70592D-page 199

PIC24HJXXXGPX06A/X08A/X10A

REGISTER 19-20: CiRXMnSID: ECAN™ MODULE ACCEPTANCE FILTER MASK n STANDARD

IDENTIFIER

R/W-x

bit 15

R/W-x

SID<10:3>

bit 8

R/W-x

U-0

—

R/W-x

MIDE

U-0

—

R/W-x R/W-x

EID<17:16>

SID<2:0>

bit 7

bit 0

Legend:

R = Readable bit

W = Writable bit

‘1’ = Bit is set

U = Unimplemented bit, read as ‘0’

‘0’ = Bit is cleared x = Bit is unknown

-n = Value at POR

bit 15-5

SID<10:0>: Standard Identifier bits

1= Include bit SIDx in filter comparison

0= Bit SIDx is don’t care in filter comparison

bit 4

bit 3

Unimplemented: Read as ‘0’

MIDE: Identifier Receive Mode bit

1= Match only message types (standard or extended address) that correspond to EXIDE bit in filter

0= Match either standard or extended address message if filters match

(i.e., if (Filter SID) = (Message SID) or if (Filter SID/EID) = (Message SID/EID))

bit 2

Unimplemented: Read as ‘0’

bit 1-0

EID<17:16>: Extended Identifier bits

1= Include bit EIDx in filter comparison

0= Bit EIDx is don’t care in filter comparison

REGISTER 19-21: CiRXMnEID: ECAN™ TECHNOLOGY ACCEPTANCE FILTER MASK n EXTENDED

IDENTIFIER

R/W-x

bit 15

R/W-x

bit 8

R/W-x

EID<15:8>

R/W-x

EID<7:0>

R/W-x

bit 7

bit 0

Legend:

R = Readable bit

-n = Value at POR

W = Writable bit

‘1’ = Bit is set

U = Unimplemented bit, read as ‘0’

‘0’ = Bit is cleared x = Bit is unknown

bit 15-0

EID<15:0>: Extended Identifier bits

1= Include bit EIDx in filter comparison

0= Bit EIDx is don’t care in filter comparison

DS70592D-page 200

 2009-2012 Microchip Technology Inc.

PIC24HJXXXGPX06A/X08A/X10A

REGISTER 19-22: CiRXFUL1: ECAN™ MODULE RECEIVE BUFFER FULL REGISTER 1

R/C-0

RXFUL15

RXFUL14

RXFUL13

RXFUL12

RXFUL11

RXFUL10

RXFUL9

RXFUL8

bit 15

bit 8

R/C-0

RXFUL7

RXFUL6

RXFUL5

RXFUL4

RXFUL3

RXFUL2

RXFUL1

RXFUL0

bit 7

bit 0

Legend:

C = Clear only bit

W = Writable bit

‘1’ = Bit is set

R = Readable bit

U = Unimplemented bit, read as ‘0’

‘0’ = Bit is cleared x = Bit is unknown

-n = Value at POR

bit 15-0

RXFUL15:RXFUL0: Receive Buffer n Full bits

1= Buffer is full (set by module)

0= Buffer is empty (clear by application software)

REGISTER 19-23: CiRXFUL2: ECAN™ MODULE RECEIVE BUFFER FULL REGISTER 2

R/C-0

RXFUL31

RXFUL30

RXFUL29

RXFUL28

RXFUL27

RXFUL26

RXFUL25

RXFUL24

bit 15

bit 8

R/C-0

RXFUL23

RXFUL22

RXFUL21

RXFUL20

RXFUL19

RXFUL18

RXFUL17

RXFUL16

bit 7

bit 0

Legend:

C = Clear only bit

W = Writable bit

‘1’ = Bit is set

R = Readable bit

U = Unimplemented bit, read as ‘0’

‘0’ = Bit is cleared x = Bit is unknown

-n = Value at POR

bit 15-0

RXFUL31:RXFUL16: Receive Buffer n Full bits

1= Buffer is full (set by module)

0= Buffer is empty (clear by application software)

 2009-2012 Microchip Technology Inc.

DS70592D-page 201

PIC24HJXXXGPX06A/X08A/X10A

REGISTER 19-24: CiRXOVF1: ECAN™ MODULE RECEIVE BUFFER OVERFLOW REGISTER 1

R/C-0

RXOVF15

RXOVF14

RXOVF13

RXOVF12

RXOVF11

RXOVF10

RXOVF9

RXOVF8

bit 15

bit 8

R/C-0

RXOVF7

RXOVF6

RXOVF5

RXOVF4

RXOVF3

RXOVF2

RXOVF1

RXOVF0

bit 7

bit 0

Legend:

C = Clear only bit

W = Writable bit

‘1’ = Bit is set

R = Readable bit

U = Unimplemented bit, read as ‘0’

‘0’ = Bit is cleared x = Bit is unknown

-n = Value at POR

bit 15-0

RXOVF15:RXOVF0: Receive Buffer n Overflow bits

1= Module pointed a write to a full buffer (set by module)

0= Overflow is cleared (clear by application software)

REGISTER 19-25: CiRXOVF2: ECAN™ MODULE RECEIVE BUFFER OVERFLOW REGISTER 2

R/C-0

RXOVF24

bit 8

RXOVF31

RXOVF30

RXOVF29

RXOVF28

RXOVF27

RXOVF26

RXOVF25

bit 15

R/C-0

RXOVF23

RXOVF22

RXOVF21

RXOVF20

RXOVF19

RXOVF18

RXOVF17

RXOVF16

bit 7

bit 0

Legend:

C = Clear only bit

W = Writable bit

‘1’ = Bit is set

R = Readable bit

U = Unimplemented bit, read as ‘0’

‘0’ = Bit is cleared x = Bit is unknown

-n = Value at POR

bit 15-0

RXOVF31:RXOVF16: Receive Buffer n Overflow bits

1= Module pointed a write to a full buffer (set by module)

0= Overflow is cleared (clear by application software)

DS70592D-page 202

 2009-2012 Microchip Technology Inc.

PIC24HJXXXGPX06A/X08A/X10A

REGISTER 19-26: CiTRmnCON: ECAN™ MODULE TX/RX BUFFER m CONTROL REGISTER

(m = 0,2,4,6; n = 1,3,5,7)

R/W-0

R-0

R/W-0

TXENn

TXABTn

TXLARBn

TXERRn

TXREQn

RTRENn

TXnPRI<1:0>

bit 15

bit 8

R/W-0

R-0

R/W-0

TXENm

TXABTm⁽¹⁾TXLARBm⁽¹⁾TXERRm⁽¹⁾TXREQm

RTRENm

TXmPRI<1:0>

bit 7

bit 0

Legend:

R = Readable bit

-n = Value at POR

W = Writable bit

‘1’ = Bit is set

U = Unimplemented bit, read as ‘0’

‘0’ = Bit is cleared x = Bit is unknown

bit 15-8

bit 7

See Definition for Bits 7-0, Controls Buffer n

TXENm: TX/RX Buffer Selection bit

1= Buffer TRBn is a transmit buffer

0= Buffer TRBn is a receive buffer

bit 6

bit 5

bit 4

bit 3

bit 2

bit 1-0

TXABTm: Message Aborted bit⁽¹⁾

1= Message was aborted

0= Message completed transmission successfully

TXLARBm: Message Lost Arbitration bit⁽¹⁾

1= Message lost arbitration while being sent

0= Message did not lose arbitration while being sent

TXERRm: Error Detected During Transmission bit⁽¹⁾

1= A bus error occurred while the message was being sent

0= A bus error did not occur while the message was being sent

TXREQm: Message Send Request bit

Setting this bit to ‘1’ requests sending a message. The bit will automatically clear when the message

is successfully sent. Clearing the bit to ‘0’ while set will request a message abort.

RTRENm: Auto-Remote Transmit Enable bit

1= When a remote transmit is received, TXREQ will be set

0= When a remote transmit is received, TXREQ will be unaffected

TXmPRI<1:0>: Message Transmission Priority bits

11= Highest message priority

10= High intermediate message priority

01= Low intermediate message priority

00= Lowest message priority

Note 1: This bit is cleared when TXREQ is set.

 2009-2012 Microchip Technology Inc.

DS70592D-page 203

PIC24HJXXXGPX06A/X08A/X10A

Note:

The buffers, SID, EID, DLC, Data Field and Receive Status registers are stored in DMA RAM. These are

not Special Function Registers.

REGISTER 19-27: CiTRBnSID: ECAN™ MODULE BUFFER n STANDARD IDENTIFIER

(n = 0, 1, ..., 31)

U-0

—

U-0

—

U-0

—

R/W-x

bit 8

SID<10:6>

bit 15

R/W-x

SRR

R/W-x

IDE

SID<5:0>

bit 7

bit 0

Legend:

R = Readable bit

-n = Value at POR

W = Writable bit

‘1’ = Bit is set

U = Unimplemented bit, read as ‘0’

‘0’ = Bit is cleared x = Bit is unknown

bit 15-13

bit 12-2

bit 1

Unimplemented: Read as ‘0’

SID<10:0>: Standard Identifier bits

SRR: Substitute Remote Request bit

1= Message will request remote transmission

0= Normal message

bit 0

IDE: Extended Identifier bit

1= Message will transmit extended identifier

0= Message will transmit standard identifier

REGISTER 19-28: CiTRBnEID: ECAN™ MODULE BUFFER n EXTENDED IDENTIFIER

(n = 0, 1, ..., 31)

U-0

—

U-0

—

U-0

—

U-0

—

R/W-x

bit 8

EID<17:14>

bit 15

R/W-x

bit 7

R/W-x

bit 0

EID<13:6>

Legend:

R = Readable bit

-n = Value at POR

W = Writable bit

‘1’ = Bit is set

U = Unimplemented bit, read as ‘0’

‘0’ = Bit is cleared x = Bit is unknown

bit 15-12

bit 11-0

Unimplemented: Read as ‘0’

EID<17:6>: Extended Identifier bits

DS70592D-page 204

 2009-2012 Microchip Technology Inc.

PIC24HJXXXGPX06A/X08A/X10A

REGISTER 19-29: CiTRBnDLC: ECAN™ MODULE BUFFER n DATA LENGTH CONTROL

(n = 0, 1, ..., 31)

R/W-x

RTR

R/W-x

RB1

EID<5:0>

bit 15

bit 8

U-0

—

U-0

—

U-0

—

R/W-x

RB0

R/W-x

DLC<3:0>

bit 7

bit 0

Legend:

R = Readable bit

-n = Value at POR

W = Writable bit

‘1’ = Bit is set

U = Unimplemented bit, read as ‘0’

‘0’ = Bit is cleared x = Bit is unknown

bit 15-10

bit 9

EID<5:0>: Extended Identifier bits

RTR: Remote Transmission Request bit

1= Message will request remote transmission

0= Normal message

bit 8

RB1: Reserved Bit 1

User must set this bit to ‘0’ per CAN protocol.

Unimplemented: Read as ‘0’

bit 7-5

bit 4

RB0: Reserved Bit 0

User must set this bit to ‘0’ per CAN protocol.

DLC<3:0>: Data Length Code bits

bit 3-0

REGISTER 19-30: CiTRBnDm: ECAN™ MODULE BUFFER n DATA FIELD BYTE m

(n = 0, 1, ..., 31; m = 0, 1, ..., 7)⁽¹⁾

R/W-x

TRBnDm<7:0>

bit 7

bit 0

Legend:

R = Readable bit

-n = Value at POR

W = Writable bit

‘1’ = Bit is set

U = Unimplemented bit, read as ‘0’

‘0’ = Bit is cleared x = Bit is unknown

bit 7-0

TRnDm<7:0>: Data Field Buffer ‘n’ Byte ‘m’ bits

Note 1: The Most Significant Byte contains byte (m + 1) of the buffer.

 2009-2012 Microchip Technology Inc.

DS70592D-page 205

PIC24HJXXXGPX06A/X08A/X10A

REGISTER 19-31: CiTRBnSTAT: ECAN™ MODULE RECEIVE BUFFER n STATUS

(n = 0, 1, ..., 31)

U-0

—

U-0

—

U-0

—

R/W-x

bit 8

FILHIT<4:0>

bit 15

U-0

—

U-0

—

U-0

—

U-0

—

U-0

—

U-0

—

U-0

—

U-0

—

bit 7

bit 0

Legend:

R = Readable bit

-n = Value at POR

W = Writable bit

‘1’ = Bit is set

U = Unimplemented bit, read as ‘0’

‘0’ = Bit is cleared x = Bit is unknown

bit 15-13

bit 12-8

Unimplemented: Read as ‘0’

FILHIT<4:0>: Filter Hit Code bits (only written by module for receive buffers, unused for transmit buffers)

Encodes number of filter that resulted in writing this buffer.

Unimplemented: Read as ‘0’

bit 7-0

DS70592D-page 206

 2009-2012 Microchip Technology Inc.

PIC24HJXXXGPX06A/X08A/X10A

Depending on the particular device pinout, the Ana-

log-to-Digital Converter can have up to 32 analog input

20.0 10-BIT/12-BIT

ANALOG-TO-DIGITAL

CONVERTER (ADC)

pins, designated AN0 through AN31. In addition, there

are two analog input pins for external voltage reference

connections. These voltage reference inputs may be

shared with other analog input pins. The actual number

of analog input pins and external voltage reference

input configuration will depend on the specific device.

Note 1: This data sheet summarizes the features

of the PIC24HJXXXGPX06A/X08A/X10A

family of devices. However, it is not

intended to be a comprehensive refer-

ence source. To complement the infor-

mation in this data sheet, refer to the

“dsPIC33F/PIC24H Family Reference

Manual”, Section 16. “Analog-to-Digital

Converter (ADC)” (DS70183), which is

available from the Microchip web site

(www.microchip.com).

A block diagram of the Analog-to-Digital Converter is

shown in Figure 20-1.

20.2 Analog-to-Digital Initialization

The following configuration steps should be performed.

1. Configure the ADC module:

a) Select port pins as analog inputs

(ADxPCFGH<15:0> or ADxPCFGL<15:0>)

2: Some registers and associated bits

described in this section may not be

available on all devices. Refer to

Section 4.0 “Memory Organization” in

this data sheet for device-specific register

and bit information.

b) Select voltage reference source to match

expected range on analog inputs

(ADxCON2<15:13>)

c) Select the analog conversion clock to

match desired data rate with processor

clock (ADxCON3<7:0>)

The PIC24HJXXXGPX06A/X08A/X10A devices have

up to 32 Analog-to-Digital input channels. These

devices also have up to 2 Analog-to-Digital converter

modules (ADCx, where ‘x’ = 1 or 2), each with its own

set of Special Function Registers.

d) Determine how many S/H channels will

be

used

(ADxCON2<9:8>

and

ADxPCFGH<15:0> or ADxPCFGL<15:0>)

e) Select the appropriate sample/conversion

sequence

ADxCON3<12:8>)

(ADxCON1<7:5>

and

The AD12B bit (ADxCON1<10>) allows each of the

ADC modules to be configured by the user as either a

10-bit, 4-sample/hold ADC (default configuration) or a

12-bit, 1-sample/hold ADC.

f) Select how conversion results are

presented in the buffer (ADxCON1<9:8>)

g) Turn on the ADC module (ADxCON1<15>)

2. Configure ADC interrupt (if required):

a) Clear the ADxIF bit

Note:

The ADC module needs to be disabled

before modifying the AD12B bit.

b) Select ADC interrupt priority

20.1 Key Features

The 10-bit ADC configuration has the following key

features:

20.3 ADC and DMA

If more than one conversion result needs to be buffered

before triggering an interrupt, DMA data transfers can

be used. Both ADC1 and ADC2 can trigger a DMA data

transfer. If ADC1 or ADC2 is selected as the DMA IRQ

source, a DMA transfer occurs when the AD1IF or

AD2IF bit gets set as a result of an ADC1 or ADC2

sample conversion sequence.

• Successive Approximation (SAR) conversion

• Conversion speeds of up to 1.1 Msps

• Up to 32 analog input pins

• External voltage reference input pins

• Simultaneous sampling of up to four analog input

pins

• Automatic Channel Scan mode

The SMPI<3:0> bits (ADxCON2<5:2>) are used to

select how often the DMA RAM buffer pointer is

incremented.

• Selectable conversion trigger source

• Selectable Buffer Fill modes

The ADDMABM bit (ADxCON1<12>) determines how

the conversion results are filled in the DMA RAM buffer

area being used for ADC. If this bit is set, DMA buffers

are written in the order of conversion. The module will

provide an address to the DMA channel that is the

same as the address used for the non-DMA

stand-alone buffer. If the ADDMABM bit is cleared, the

DMA buffers are written in Scatter/Gather mode. The

module will provide a scatter/gather address to the

DMA channel, based on the index of the analog input

and the size of the DMA buffer.

• Two result alignment options (signed/unsigned)

• Operation during CPU Sleep and Idle modes

The 12-bit ADC configuration supports all the above

features, except:

• In the 12-bit configuration, conversion speeds of

up to 500 ksps are supported

• There is only 1 sample/hold amplifier in the 12-bit

configuration, so simultaneous sampling of

multiple channels is not supported.

 2009-2012 Microchip Technology Inc.

DS70592D-page 207

PIC24HJXXXGPX06A/X08A/X10A

FIGURE 20-1:

ADCx MODULE BLOCK DIAGRAM

AN0

ANy⁽³⁾

S/H0

CHANNEL

SCAN

+

CH0SB<4:0>

-

CH0SA<4:0>

CH0

CSCNA

AN1

VREFL

CH0NB

CH0NA

AN0

AN3

_AVDDVREF-⁽¹⁾

VREF+⁽¹⁾

AVSS

S/H1

+

-

CH123SA CH123SB

AN6

CH1⁽²⁾

VCFG<2:0>

AN9

VREFL

VREFH

VREFL

CH123NB

CH123NA

ADC1BUF0

SAR ADC

AN1

AN4

S/H2

+

-

CH123SA

CH123SB

CH2⁽²⁾

AN7

AN10

VREFL

CH123NA

CH123NB

AN2

AN5

S/H3

+

-

CH123SA CH123SB

AN8

CH3⁽²⁾

AN11

VREFL

CH123NA

CH123NB

Alternate

Input Selection

Note 1: VREF+, VREF- inputs can be multiplexed with other analog inputs.

2: Channels 1, 2 and 3 are not applicable for the 12-bit mode of operation.

3: For 64-pin devices, y = 17; for 100-pin devices, y =31; for ADC2, y = 15.

DS70592D-page 208

 2009-2012 Microchip Technology Inc.

PIC24HJXXXGPX06A/X08A/X10A

FIGURE 20-2:

ANALOG-TO-DIGITAL CONVERSION CLOCK PERIOD BLOCK DIAGRAM

ADxCON3<15>

ADC Internal

RC Clock

(2)

1

0

TAD

ADxCON3<5:0>

6

ADC Conversion

Clock Multiplier

TCY

(1)

TOSC

X2

1, 2, 3, 4, 5,..., 64

Note 1: Refer to Figure 9-2 for the derivation of FOSC when the PLL is enabled. If the PLL is not used, FOSC is equal to the clock source

frequency. TOSC = 1/FOSC.

2: See the ADC electrical specifications for exact RC clock value.

 2009-2012 Microchip Technology Inc.

DS70592D-page 209

PIC24HJXXXGPX06A/X08A/X10A

20.4 ADC Helpful Tips

20.5 ADC Resources

1. The SMPI<3:0> (AD1CON2<5:2>) control bits:

Many useful resources related to ADC are provided on

the main product page of the Microchip web site for the

devices listed in this data sheet. This product page,

which can be accessed using this link, contains the

latest updates and additional information.

a) Determine when the ADC interrupt flag is

set and an interrupt is generated if enabled.

b) When the CSCNA bit (AD1CON2<10>) is

set to ‘1’, determines when the ADC analog

scan channel list defined in the AD1CSSL/

AD1CSSH registers starts over from the

beginning.

Note:

In the event you are not able to access the

product page using the link above, enter

this URL in your browser:

c) On devices without a DMA peripheral,

determines when ADC result buffer pointer

to ADC1BUF0-ADC1BUFF, gets reset back

to the beginning at ADC1BUF0.

http://www.microchip.com/wwwproducts/

Devices.aspx?dDocName=en546061

20.5.1

KEY RESOURCES

2. On devices without a DMA module, the ADC has

16 result buffers. ADC conversion results are

stored sequentially in ADC1BUF0-ADC1BUFF

regardless of which analog inputs are being

used subject to the SMPI<3:0> bits

(AD1CON2<5:2>) and the condition described

in 1c above. There is no relationship between

the ANx input being measured and which ADC

buffer (ADC1BUF0-ADC1BUFF) that the

conversion results will be placed in.

• Section 16. “Analog-to-Digital Converter

(ADC)” (DS70183)

• Code Samples

• Application Notes

• Software Libraries

• Webinars

• All related dsPIC33F/PIC24H Family Reference

Manuals Sections

• Development Tools

3. On devices with a DMA module, the ADC mod-

ule has only

1 ADC result buffer, (i.e.,

ADC1BUF0), per ADC peripheral and the ADC

conversion result must be read either by the

CPU or DMA controller before the next ADC

conversion is complete to avoid overwriting the

previous value.

4. The DONE bit (AD1CON1<0>) is only cleared at

the start of each conversion and is set at the

completion of the conversion, but remains set

indefinitely even through the next sample phase

until the next conversion begins. If application

code is monitoring the DONE bit in any kind of

software loop, the user must consider this

behavior because the CPU code execution is

faster than the ADC. As a result, in manual sam-

ple mode, particularly where the users code is

setting the SAMP bit (AD1CON1<1>), the

DONE bit should also be cleared by the user

application just before setting the SAMP bit.

5. On devices with two ADC modules, the

ADCxPCFG registers for both ADC modules

must be set to a logic ‘1’ to configure a target

I/O pin as a digital I/O pin. Failure to do so

means that any alternate digital input function

will always see only a logic ‘0’ as the digital

input buffer is held in Disable mode.

DS70592D-page 210

 2009-2012 Microchip Technology Inc.

PIC24HJXXXGPX06A/X08A/X10A

20.6

ADC Control Registers

REGISTER 20-1: ADxCON1: ADCx CONTROL REGISTER 1(where x = 1 or 2)

R/W-0

ADON

U-0

—

R/W-0

U-0

—

R/W-0

ADSIDL

ADDMABM

AD12B

FORM<1:0>

bit 15

bit 8

R/W-0

U-0

—

R/W-0

ASAM

R/W-0

HC,HS

R/C-0

HC, HS

SSRC<2:0>

SIMSAM

SAMP

DONE

bit 7

Legend:

bit 0

HC = Cleared by hardware

W = Writable bit

HS = Set by hardware

U = Unimplemented bit, read as ‘0’

‘0’ = Bit is cleared x = Bit is unknown

R = Readable bit

-n = Value at POR

‘1’ = Bit is set

bit 15

ADON: ADC Operating Mode bit

1= ADC module is operating

0= ADC module is off

bit 14

bit 13

Unimplemented: Read as ‘0’

ADSIDL: Stop in Idle Mode bit

1= Discontinue module operation when device enters Idle mode

0= Continue module operation in Idle mode

bit 12

ADDMABM: DMA Buffer Build Mode bit

1= DMA buffers are written in the order of conversion. The module will provide an address to the DMA

channel that is the same as the address used for the non-DMA stand-alone buffer

0= DMA buffers are written in Scatter/Gather mode. The module will provide a scatter/gather address

to the DMA channel, based on the index of the analog input and the size of the DMA buffer

bit 11

bit 10

Unimplemented: Read as ‘0’

AD12B: 10-Bit or 12-Bit Operation Mode bit

1= 12-bit, 1-channel ADC operation

0= 10-bit, 4-channel ADC operation

bit 9-8

FORM<1:0>: Data Output Format bits

For 10-bit operation:

11= Reserved

10= Reserved

01= Signed integer (DOUT = ssss sssd dddd dddd, where s= .NOT.d<9>)

00= Integer (DOUT = 0000 00dd dddd dddd)

For 12-bit operation:

11= Reserved

10= Reserved

01= Signed Integer (DOUT = ssss sddd dddd dddd, where s= .NOT.d<11>)

00= Integer (DOUT = 0000 dddd dddd dddd)

bit 7-5

SSRC<2:0>: Sample Clock Source Select bits

111= Internal counter ends sampling and starts conversion (auto-convert)

110= Reserved

101= Reserved

100= GP timer (Timer5 for ADC1, Timer3 for ADC2) compare ends sampling and starts conversion

011= Reserved

010= GP timer (Timer3 for ADC1, Timer5 for ADC2) compare ends sampling and starts conversion

001= Active transition on INT0 pin ends sampling and starts conversion

000= Clearing sample bit ends sampling and starts conversion

 2009-2012 Microchip Technology Inc.

DS70592D-page 211

PIC24HJXXXGPX06A/X08A/X10A

REGISTER 20-1: ADxCON1: ADCx CONTROL REGISTER 1(where x = 1 or 2) (CONTINUED)

bit 4

bit 3

Unimplemented: Read as ‘0’

SIMSAM: Simultaneous Sample Select bit (only applicable when CHPS<1:0> = 01or 1x)

When AD12B = 1, SIMSAM is: U-0, Unimplemented, Read as ‘0’

1= Samples CH0, CH1, CH2, CH3 simultaneously (when CHPS<1:0> = 1x); or

Samples CH0 and CH1 simultaneously (when CHPS<1:0> = 01)

0= Samples multiple channels individually in sequence

bit 2

bit 1

ASAM: ADC Sample Auto-Start bit

1= Sampling begins immediately after last conversion. SAMP bit is auto-set

0= Sampling begins when SAMP bit is set

SAMP: ADC Sample Enable bit

1= ADC sample/hold amplifiers are sampling

0= ADC sample/hold amplifiers are holding

If ASAM = 0, software may write ‘1’ to begin sampling. Automatically set by hardware if ASAM = 1.

If SSRC = 000, software may write ‘0’ to end sampling and start conversion. If SSRC 000,

automatically cleared by hardware to end sampling and start conversion.

bit 0

DONE: ADC Conversion Status bit

1= ADC conversion cycle is completed.

0= ADC conversion not started or in progress

Automatically set by hardware when analog-to-digital conversion is complete. Software may write ‘0’

to clear DONE status (software not allowed to write ‘1’). Clearing this bit will NOT affect any operation

in progress. Automatically cleared by hardware at start of a new conversion.

DS70592D-page 212

 2009-2012 Microchip Technology Inc.

PIC24HJXXXGPX06A/X08A/X10A

REGISTER 20-2: ADxCON2: ADCx CONTROL REGISTER 2 (where x = 1 or 2)

R/W-0

U-0

—

U-0

—

R/W-0

VCFG<2:0>

CSCNA

CHPS<1:0>

bit 15

bit 8

R-0

U-0

—

R/W-0

BUFM

R/W-0

ALTS

BUFS

SMPI<3:0>

bit 7

bit 0

Legend:

R = Readable bit

-n = Value at POR

W = Writable bit

‘1’ = Bit is set

U = Unimplemented bit, read as ‘0’

‘0’ = Bit is cleared x = Bit is unknown

bit 15-13

VCFG<2:0>: Converter Voltage Reference Configuration bits

VREF+

VREF-

000

AVDD

AVSS

001 External VREF+

010 AVDD

011 External VREF+

1xx AVDD

External VREF-

AVSS

bit 12-11

bit 10

Unimplemented: Read as ‘0’

CSCNA: Scan Input Selections for CH0+ during Sample A bit

1= Scan inputs

0= Do not scan inputs

bit 9-8

bit 7

CHPS<1:0>: Selects Channels Utilized bits

When AD12B = 1, CHPS<1:0> is: U-0, Unimplemented, Read as ‘0’

1x= Converts CH0, CH1, CH2 and CH3

01= Converts CH0 and CH1

00= Converts CH0

BUFS: Buffer Fill Status bit (only valid when BUFM = 1)

1= ADC is currently filling second half of buffer, user should access data in first half

0= ADC is currently filling first half of buffer, user should access data in second half

bit 6

Unimplemented: Read as ‘0’

bit 5-2

SMPI<3:0>: Selects Increment Rate for DMA Addresses bits or number of sample/conversion

operations per interrupt

1111= Increments the DMA address or generates interrupt after completion of every 16th sample/

conversion operation

1110= Increments the DMA address or generates interrupt after completion of every 15th sample/

conversion operation

•

0001= Increments the DMA address or generates interrupt after completion of every 2nd sample/con-

version operation

0000= Increments the DMA address or generates interrupt after completion of every sample/conver-

sion operation

bit 1

bit 0

BUFM: Buffer Fill Mode Select bit

1= Starts filling first half of buffer on first interrupt and second half of buffer on next interrupt

0= Always starts filling buffer from the beginning

ALTS: Alternate Input Sample Mode Select bit

1= Uses channel input selects for Sample A on first sample and Sample B on next sample

0= Always uses channel input selects for Sample A

 2009-2012 Microchip Technology Inc.

DS70592D-page 213

PIC24HJXXXGPX06A/X08A/X10A

REGISTER 20-3: ADxCON3: ADCx CONTROL REGISTER 3

R/W-0

ADRC

U-0

—

U-0

—

R/W-0

SAMC<4:0>⁽¹⁾

R/W-0

bit 8

R/W-0

bit 15

R/W-0

ADCS<7:0>⁽²⁾

bit 7

bit 0

Legend:

R = Readable bit

-n = Value at POR

W = Writable bit

‘1’ = Bit is set

U = Unimplemented bit, read as ‘0’

‘0’ = Bit is cleared x = Bit is unknown

bit 15

ADRC: ADC Conversion Clock Source bit

1= ADC internal RC clock

0= Clock derived from system clock

bit 14-13

bit 12-8

Unimplemented: Read as ‘0’

SAMC<4:0>: Auto Sample Time bits⁽¹⁾

11111= 31 TAD

•

00001= 1 TAD

00000= 0 TAD

bit 7-0

ADCS<7:0>: Analog-to-Digital Conversion Clock Select bits⁽²⁾

11111111= Reserved

•

01000000= Reserved

00111111= TCY ·(ADCS<7:0> + 1) = 64 ·TCY = TAD

•

00000010= TCY ·(ADCS<7:0> + 1) = 3 ·TCY = TAD

00000001= TCY ·(ADCS<7:0> + 1) = 2 ·TCY = TAD

00000000= TCY ·(ADCS<7:0> + 1) = 1 ·TCY = TAD

Note 1: This bit only used if ADxCON1<7:5> (SSRC<2:0>) = 111.

2: This bit is not used if ADxCON3<15> (ADRC) = 1.

DS70592D-page 214

 2009-2012 Microchip Technology Inc.

PIC24HJXXXGPX06A/X08A/X10A

REGISTER 20-4: ADxCON4: ADCx CONTROL REGISTER 4

U-0

—

U-0

—

U-0

—

U-0

—

U-0

—

U-0

—

U-0

—

U-0

—

bit 15

bit 8

U-0

—

U-0

—

U-0

—

U-0

—

U-0

—

R/W-0

DMABL<2:0>

bit 7

bit 0

Legend:

R = Readable bit

-n = Value at POR

W = Writable bit

‘1’ = Bit is set

U = Unimplemented bit, read as ‘0’

‘0’ = Bit is cleared x = Bit is unknown

bit 15-3

bit 2-0

Unimplemented: Read as ‘0’

DMABL<2:0>: Selects Number of DMA Buffer Locations per Analog Input bits

111= Allocates 128 words of buffer to each analog input

110= Allocates 64 words of buffer to each analog input

101= Allocates 32 words of buffer to each analog input

100= Allocates 16 words of buffer to each analog input

011= Allocates 8 words of buffer to each analog input

010= Allocates 4 words of buffer to each analog input

001= Allocates 2 words of buffer to each analog input

000= Allocates 1 word of buffer to each analog input

 2009-2012 Microchip Technology Inc.

DS70592D-page 215

PIC24HJXXXGPX06A/X08A/X10A

REGISTER 20-5: ADxCHS123: ADCx INPUT CHANNEL 1, 2, 3 SELECT REGISTER

U-0

—

U-0

—

U-0

—

U-0

—

U-0

—

R/W-0

CH123NB<1:0>

CH123SB

bit 15

bit 8

U-0

—

U-0

—

U-0

—

U-0

—

U-0

—

R/W-0

CH123NA<1:0>

CH123SA

bit 7

bit 0

Legend:

R = Readable bit

-n = Value at POR

W = Writable bit

‘1’ = Bit is set

U = Unimplemented bit, read as ‘0’

‘0’ = Bit is cleared x = Bit is unknown

bit 15-11

bit 10-9

Unimplemented: Read as ‘0’

CH123NB<1:0>: Channel 1, 2, 3 Negative Input Select for Sample B bits

When AD12B = 1, CHxNB is: U-0, Unimplemented, Read as ‘0’

11= CH1 negative input is AN9, CH2 negative input is AN10, CH3 negative input is AN11

10= CH1 negative input is AN6, CH2 negative input is AN7, CH3 negative input is AN8

0x= CH1, CH2, CH3 negative input is VREF-

bit 8

CH123SB: Channel 1, 2, 3 Positive Input Select for Sample B bit

When AD12B = 1, CHxSB is: U-0, Unimplemented, Read as ‘0’

1= CH1 positive input is AN3, CH2 positive input is AN4, CH3 positive input is AN5

0= CH1 positive input is AN0, CH2 positive input is AN1, CH3 positive input is AN2

bit 7-3

bit 2-1

Unimplemented: Read as ‘0’

CH123NA<1:0>: Channel 1, 2, 3 Negative Input Select for Sample A bits

When AD12B = 1, CHxNA is: U-0, Unimplemented, Read as ‘0’

11= CH1 negative input is AN9, CH2 negative input is AN10, CH3 negative input is AN11

10= CH1 negative input is AN6, CH2 negative input is AN7, CH3 negative input is AN8

0x= CH1, CH2, CH3 negative input is VREF-

bit 0

CH123SA: Channel 1, 2, 3 Positive Input Select for Sample A bit

When AD12B = 1, CHxSA is: U-0, Unimplemented, Read as ‘0’

1= CH1 positive input is AN3, CH2 positive input is AN4, CH3 positive input is AN5

0= CH1 positive input is AN0, CH2 positive input is AN1, CH3 positive input is AN2

DS70592D-page 216

 2009-2012 Microchip Technology Inc.

PIC24HJXXXGPX06A/X08A/X10A

REGISTER 20-6: ADxCHS0: ADCx INPUT CHANNEL 0 SELECT REGISTER

R/W-0

U-0

—

U-0

—

R/W-0

CH0SB<4:0>⁽¹⁾

R/W-0

bit 8

R/W-0

CH0NB

bit 15

R/W-0

U-0

—

U-0

—

R/W-0

CH0SA<4:0>⁽¹⁾

R/W-0

CH0NA

bit 7

bit 0

Legend:

R = Readable bit

-n = Value at POR

W = Writable bit

‘1’ = Bit is set

U = Unimplemented bit, read as ‘0’

‘0’ = Bit is cleared x = Bit is unknown

bit 15

CH0NB: Channel 0 Negative Input Select for Sample B bit

1= Channel 0 negative input is AN1

0= Channel 0 negative input is VREF-

bit 14-13

bit 12-8

Unimplemented: Read as ‘0’

CH0SB<4:0>: Channel 0 Positive Input Select for Sample B bits⁽¹⁾

11111= Channel 0 positive input is AN31

11110= Channel 0 positive input is AN30

•

00010= Channel 0 positive input is AN2

00001= Channel 0 positive input is AN1

00000= Channel 0 positive input is AN0

bit 7

CH0NA: Channel 0 Negative Input Select for Sample A bit

1= Channel 0 negative input is AN1

0= Channel 0 negative input is VREF-

bit 6-5

bit 4-0

Unimplemented: Read as ‘0’

CH0SA<4:0>: Channel 0 Positive Input Select for Sample A bits⁽¹⁾

11111= Channel 0 positive input is AN31

11110= Channel 0 positive input is AN30

•

00010= Channel 0 positive input is AN2

00001= Channel 0 positive input is AN1

00000= Channel 0 positive input is AN0

Note 1: ADC2 can only select AN0 through AN15 as positive inputs.

 2009-2012 Microchip Technology Inc.

DS70592D-page 217

PIC24HJXXXGPX06A/X08A/X10A

REGISTER 20-7: ADxCSSH: ADCx INPUT SCAN SELECT REGISTER HIGH^(1,2)

R/W-0

CSS31

CSS30

CSS29

CSS28

CSS27

CSS26

CSS25

CSS24

bit 15

bit 8

R/W-0

CSS23

CSS22

CSS21

CSS20

CSS19

CSS18

CSS17

CSS16

bit 7

bit 0

Legend:

R = Readable bit

-n = Value at POR

W = Writable bit

‘1’ = Bit is set

U = Unimplemented bit, read as ‘0’

‘0’ = Bit is cleared x = Bit is unknown

bit 15-0

CSS<31:16>: ADC Input Scan Selection bits

1= Select ANx for input scan

0= Skip ANx for input scan

Note 1: On devices without 32 analog inputs, all ADxCSSH bits may be selected by user. However, inputs selected

for scan without a corresponding input on device will convert VREFL.

2: CSSx = ANx, where x = 16 through 31.

REGISTER 20-8: ADxCSSL: ADCx INPUT SCAN SELECT REGISTER LOW^(1,2)

R/W-0

CSS11

R/W-0

CSS9

R/W-0

CSS8

CSS15

CSS14

CSS13

CSS12

CSS10

bit 15

bit 8

R/W-0

CSS7

R/W-0

CSS6

R/W-0

CSS5

R/W-0

CSS4

R/W-0

CSS3

R/W-0

CSS2

R/W-0

CSS1

R/W-0

CSS0

bit 7

bit 0

Legend:

R = Readable bit

-n = Value at POR

W = Writable bit

‘1’ = Bit is set

U = Unimplemented bit, read as ‘0’

‘0’ = Bit is cleared x = Bit is unknown

bit 15-0

CSS<15:0>: ADC Input Scan Selection bits

1= Select ANx for input scan

0= Skip ANx for input scan

Note 1: On devices without 16 analog inputs, all ADxCSSL bits may be selected by user. However, inputs selected

for scan without a corresponding input on device will convert VREF-.

2: CSSx = ANx, where x = 0 through 15.

DS70592D-page 218

 2009-2012 Microchip Technology Inc.

PIC24HJXXXGPX06A/X08A/X10A

REGISTER 20-9: AD1PCFGH: ADC1 PORT CONFIGURATION REGISTER HIGH^(1,2,3,4)

R/W-0

PCFG31

PCFG30

PCFG29

PCFG28

PCFG27

PCFG26

PCFG25

PCFG24

bit 15

bit 8

R/W-0

PCFG23

PCFG22

PCFG21

PCFG20

PCFG19

PCFG18

PCFG17

PCFG16

bit 7

bit 0

Legend:

R = Readable bit

-n = Value at POR

W = Writable bit

‘1’ = Bit is set

U = Unimplemented bit, read as ‘0’

‘0’ = Bit is cleared x = Bit is unknown

bit 15-0

PCFG<31:16>: ADC Port Configuration Control bits

1= Port pin in Digital mode, port read input enabled, ADC input multiplexer connected to AVSS

0= Port pin in Analog mode, port read input disabled, ADC samples pin voltage

Note 1: On devices without 32 analog inputs, all PCFG bits are R/W by user. However, PCFG bits are ignored on

ports without a corresponding input on device.

2: ADC2 only supports analog inputs AN0-AN15; therefore, no ADC2 high port Configuration register exists.

3: PCFGx = ANx, where x = 16 through 31.

4: PCFGx bits will have no effect if ADC module is disabled by setting ADxMD bit in the PMDx register. In

this case all port pins multiplexed with ANx will be in Digital mode.

 2009-2012 Microchip Technology Inc.

DS70592D-page 219

PIC24HJXXXGPX06A/X08A/X10A

REGISTER 20-10: ADxPCFGL: ADCx PORT CONFIGURATION REGISTER LOW^(1,2,3,4)

R/W-0

PCFG15

PCFG14

PCFG13

PCFG12

PCFG11

PCFG10

PCFG9

PCFG8

bit 15

bit 8

R/W-0

PCFG7

PCFG6

PCFG5

PCFG4

PCFG3

PCFG2

PCFG1

PCFG0

bit 7

bit 0

Legend:

R = Readable bit

-n = Value at POR

W = Writable bit

‘1’ = Bit is set

U = Unimplemented bit, read as ‘0’

‘0’ = Bit is cleared x = Bit is unknown

bit 15-0

PCFG<15:0>: ADC Port Configuration Control bits

1= Port pin in Digital mode, port read input enabled, ADC input multiplexer connected to AVSS

0= Port pin in Analog mode, port read input disabled, ADC samples pin voltage

Note 1: On devices without 16 analog inputs, all PCFG bits are R/W by user. However, PCFG bits are ignored on

ports without a corresponding input on device.

2: On devices with 2 analog-to-digital modules, both AD1PCFGL and AD2PCFGL will affect the configuration

of port pins multiplexed with AN0-AN15.

3: PCFGx = ANx, where x = 0 through 15.

4: PCFGx bits will have no effect if ADC module is disabled by setting ADxMD bit in the PMDx register. In this

case all port pins multiplexed with ANx will be in Digital mode.

DS70592D-page 220

 2009-2012 Microchip Technology Inc.

PIC24HJXXXGPX06A/X08A/X10A

21.1 Configuration Bits

21.0 SPECIAL FEATURES

PIC24HJXXXGPX06A/X08A/X10A devices provide

nonvolatile memory implementation for device

configuration bits. Refer to Section 25. “Device Con-

figuration” (DS70194) of the “dsPIC33F/PIC24H

Family Reference Manual”, for more information on this

implementation.

Note 1: This data sheet summarizes the features

of the PIC24HJXXXGPX06A/X08A/X10A

families of devices. However, it is not

intended to be a comprehensive refer-

ence source. To complement the infor-

mation in this data sheet, refer to Section

23.

“CodeGuard™

Security”

The Configuration bits can be programmed (read as

‘0’), or left unprogrammed (read as ‘1’), to select vari-

ous device configurations. These bits are mapped

starting at program memory location 0xF80000.

(DS70199), Section 24. “Programming

and Diagnostics” (DS70207), and Sec-

tion 25. “Device Configuration”

(DS70194) in the “dsPIC33F/PIC24H

Family Reference Manual”, which is

available from the Microchip web site

(www.microchip.com).

The device Configuration register map is shown in

Table 21-1.

The individual Configuration bit descriptions for the

Configuration registers are shown in Table 21-2.

2: Some registers and associated bits

described in this section may not be

available on all devices. Refer to

Section 4.0 “Memory Organization” in

this data sheet for device-specific register

and bit information.

Note that address 0xF80000 is beyond the user program

memory space. In fact, it belongs to the configuration

memory space (0x800000-0xFFFFFF), which can only

be accessed using table reads and table writes.

PIC24HJXXXGPX06A/X08A/X10A devices include

several features intended to maximize application flex-

ibility and reliability, and minimize cost through elimina-

tion of external components. These are:

• Flexible Configuration

• Watchdog Timer (WDT)

• Code Protection and CodeGuard™ Security

• JTAG Boundary Scan Interface

• In-Circuit Serial Programming™ (ICSP™)

programming capability

• In-Circuit Emulation

TABLE 21-1: DEVICE CONFIGURATION REGISTER MAP

Address

Name

Bit 7

RBS<1:0>

RSS<1:0>

Bit 6

Bit 5

Bit 4

Bit 3

Bit 2

Bit 1

Bit 0

—

BSS<2:0>

SSS<2:0>

BWRP

SWRP

GWRP

0xF80000 FBS

0xF80002 FSS

0xF80004 FGS

0xF80006 FOSCSEL

0xF80008 FOSC

0xF8000A FWDT

0xF8000C FPOR

0xF8000E FICD

0xF80010 FUID0

0xF80012 FUID1

0xF80014 FUID2

0xF80016 FUID3

—

GSS<1:0>

FNOSC<2:0>

IESO

Reserved⁽²⁾

FCKSM<1:0>

OSCIOFNC POSCMD<1:0>

WDTPOST<3:0>

FWDTEN

WINDIS PLLKEN⁽³⁾WDTPRE

Reserved⁽⁴⁾

—

FPWRT<2:0>

Reserved⁽¹⁾

JTAGEN

—

ICS<1:0>

User Unit ID Byte 0

User Unit ID Byte 1

User Unit ID Byte 2

User Unit ID Byte 3

Legend: — = unimplemented bits, read as ‘0’.

Note 1: These bits are reserved for use by development tools and must be programmed as ‘1’.

2: When read, this bit returns the current programmed value.

3: This bit is unimplemented on PIC24HJ64GPX06A/X08A/X10A and PIC24HJ128GPX06A/X08A/X10A

devices and reads as ‘0’.

4: These bits are reserved and always read as ‘1’.

 2009-2012 Microchip Technology Inc.

DS70592D-page 221

PIC24HJXXXGPX06A/X08A/X10A

TABLE 21-2: CONFIGURATION BITS DESCRIPTION

RTSP

Bit Field

Register

Description

Effect

BWRP

FBS

Immediate Boot Segment Program Flash Write Protection

1= Boot segment may be written

0= Boot segment is write-protected

BSS<2:0>

FBS

Immediate Boot Segment Program Flash Code Protection Size

X11= No Boot program Flash segment

Boot space is 1K IW less VS

110= Standard security; boot program Flash segment starts at End of

VS, ends at 0x0007FE

010= High security; boot program Flash segment starts at End of VS,

ends at 0x0007FE

Boot space is 4K IW less VS

101= Standard security; boot program Flash segment starts at End of

VS, ends at 0x001FFE

001= High security; boot program Flash segment starts at End of VS,

ends at 0x001FFE

Boot space is 8K IW less VS

100= Standard security; boot program Flash segment starts at End of

VS, ends at 0x003FFE

000= High security; boot program Flash segment starts at End of VS,

ends at 0x003FFE

RBS<1:0>

SWRP

FBS

FSS

Immediate Boot Segment RAM Code Protection

11= No Boot RAM defined

10= Boot RAM is 128 Bytes

01= Boot RAM is 256 Bytes

00 = Boot RAM is 1024 Bytes

Immediate Secure Segment Program Flash Write Protection

1= Secure segment may be written

0= Secure segment is write-protected

DS70592D-page 222

 2009-2012 Microchip Technology Inc.

PIC24HJXXXGPX06A/X08A/X10A

TABLE 21-2: CONFIGURATION BITS DESCRIPTION (CONTINUED)

RTSP

Effect

Bit Field

Register

Description

SSS<2:0>

FSS

Immediate Secure Segment Program Flash Code Protection Size

(FOR 128K and 256K DEVICES)

X11= No Secure program Flash segment

Secure space is 8K IW less BS

110= Standard security; secure program Flash segment starts at End of

BS, ends at 0x003FFE

010= High security; secure program Flash segment starts at End of BS,

ends at 0x003FFE

Secure space is 16K IW less BS

101= Standard security; secure program Flash segment starts at End of

BS, ends at 0x007FFE

001= High security; secure program Flash segment starts at End of BS,

ends at 0x007FFE

Secure space is 32K IW less BS

100= Standard security; secure program Flash segment starts at End of

BS, ends at 0x00FFFE

000= High security; secure program Flash segment starts at End of BS,

ends at 0x00FFFE

(FOR 64K DEVICES)

X11= No Secure program Flash segment

Secure space is 4K IW less BS

110= Standard security; secure program Flash segment starts at End of

BS, ends at 0x001FFE

010= High security; secure program Flash segment starts at End of BS,

ends at 0x001FFE

Secure space is 8K IW less BS

101= Standard security; secure program Flash segment starts at End of

BS, ends at 0x003FFE

001= High security; secure program Flash segment starts at End of BS,

ends at 0x003FFE

Secure space is 16K IW less BS

100= Standard security; secure program Flash segment starts at End of

BS, ends at 0x007FFE

000= High security; secure program Flash segment starts at End of BS,

ends at 0x007FFE

RSS<1:0>

GSS<1:0>

FSS

FGS

Immediate Secure Segment RAM Code Protection

11= No Secure RAM defined

10= Secure RAM is 256 Bytes less BS RAM

01= Secure RAM is 2048 Bytes less BS RAM

00= Secure RAM is 4096 Bytes less BS RAM

Immediate General Segment Code-Protect bit

11= User program memory is not code-protected

10= Standard Security; general program Flash segment starts at End of

SS, ends at EOM

0x= High Security; general program Flash segment starts at End of ESS,

ends at EOM

GWRP

FGS

Immediate General Segment Write-Protect bit

1= User program memory is not write-protected

0= User program memory is write-protected

 2009-2012 Microchip Technology Inc.

DS70592D-page 223

PIC24HJXXXGPX06A/X08A/X10A

TABLE 21-2: CONFIGURATION BITS DESCRIPTION (CONTINUED)

RTSP

Bit Field

Register

Description

Effect

FOSCSEL Immediate Internal External Start-up Option bit

1= Start-up device with FRC, then automatically switch to the

IESO

user-selected oscillator source when ready

0= Start-up device with user-selected oscillator source

FNOSC<2:0> FOSCSEL

If clock

Initial Oscillator Source Selection bits

switch is 111= Internal Fast RC (FRC) oscillator with postscaler

enabled, 110= Reserved

RTSP

101= LPRC oscillator

effect is on 100= Secondary (LP) oscillator

any device 011= Primary (XT, HS, EC) oscillator with PLL

Reset;

010= Primary (XT, HS, EC) oscillator

otherwise, 001= Internal Fast RC (FRC) oscillator with PLL

Immediate 000= FRC oscillator

FCKSM<1:0>

FOSC

Immediate Clock Switching Mode bits

1x= Clock switching is disabled, Fail-Safe Clock Monitor is disabled

01= Clock switching is enabled, Fail-Safe Clock Monitor is disabled

00= Clock switching is enabled, Fail-Safe Clock Monitor is enabled

OSCIOFNC

FOSC

Immediate OSC2 Pin Function bit (except in XT and HS modes)

1= OSC2 is clock output

0= OSC2 is general purpose digital I/O pin

POSCMD<1:0>

Immediate Primary Oscillator Mode Select bits

11= Primary oscillator disabled

10= HS Crystal Oscillator mode

01= XT Crystal Oscillator mode

00= EC (External Clock) mode

FWDTEN

FWDT

Immediate Watchdog Timer Enable bit

1= Watchdog Timer always enabled (LPRC oscillator cannot be disabled.

Clearing the SWDTEN bit in the RCON register will have no effect.)

0 = Watchdog Timer enabled/disabled by user software (LPRC can be

disabled by clearing the SWDTEN bit in the RCON register)

WINDIS

PLLKEN

FWDT

Immediate Watchdog Timer Window Enable bit

1= Watchdog Timer in Non-Window mode

0= Watchdog Timer in Window mode

Immediate PLL Lock Enable bit

1= Clock switch to PLL source will wait until the PLL lock signal is valid.

0= Clock switch will not wait for the PLL lock signal.

WDTPRE

WDTPOST

Immediate Watchdog Timer Prescaler bit

1= 1:128

0= 1:32

Immediate Watchdog Timer Postscaler bits

1111= 1:32,768

1110= 1:16,384

•

0001= 1:2

0000= 1:1

DS70592D-page 224

 2009-2012 Microchip Technology Inc.

PIC24HJXXXGPX06A/X08A/X10A

TABLE 21-2: CONFIGURATION BITS DESCRIPTION (CONTINUED)

RTSP

Effect

Bit Field

Register

Description

FPWRT<2:0>

FPOR

Immediate Power-on Reset Timer Value Select bits

111= PWRT = 128 ms

110= PWRT = 64 ms

101= PWRT = 32 ms

100= PWRT = 16 ms

011= PWRT = 8 ms

010= PWRT = 4 ms

001= PWRT = 2 ms

000= PWRT = Disabled

JTAGEN

ICS<1:0>

FICD

Immediate JTAG Enable bits

1= JTAG enabled

0= JTAG disabled

Immediate ICD Communication Channel Select bits

11= Communicate on PGEC1 and PGED1

10= Communicate on PGEC2 and PGED2

01= Communicate on PGEC3 and PGED3

00= Reserved

 2009-2012 Microchip Technology Inc.

DS70592D-page 225

PIC24HJXXXGPX06A/X08A/X10A

21.2 On-Chip Voltage Regulator

21.3 Brown-out Reset (BOR)

All of the PIC24HJXXXGPX06A/X08A/X10A devices

power their core digital logic at a nominal 2.5V. This

may create an issue for designs that are required to

operate at a higher typical voltage, such as 3.3V. To

simplify system design, all devices in the

PIC24HJXXXGPX06A/X08A/X10A family incorporate

an on-chip regulator that allows the device to run its

core logic from VDD.

The BOR (Brown-out Reset) module is based on an

internal voltage reference circuit that monitors the reg-

ulated voltage VCAP. The main purpose of the BOR

module is to generate a device Reset when a

brown-out condition occurs. Brown-out conditions are

generally caused by glitches on the AC mains (i.e.,

missing portions of the AC cycle waveform due to bad

power transmission lines or voltage sags due to exces-

sive current draw when a large inductive load is turned

on).

The regulator provides power to the core from the other

VDD pins. The regulator requires that a low-ESR (less

than 5 ohms) capacitor (such as tantalum or ceramic)

be connected to the VCAP pin (Figure 21-1). This helps

to maintain the stability of the regulator. The

recommended value for the filter capacitor is provided

in Table 24-13 of Section 24.1 “DC Characteristics”.

A BOR will generate a Reset pulse which will reset the

device. The BOR will select the clock source, based on

the device Configuration bit values (FNOSC<2:0> and

POSCMD<1:0>). Furthermore, if an oscillator mode is

selected, the BOR will activate the Oscillator Start-up

Timer (OST). The system clock is held until OST

expires. If the PLL is used, the clock will be held until

the LOCK bit (OSCCON<5>) is ‘1’.

Note:

It is important for the low-ESR capacitor to

be placed as close as possible to the VCAP

pin.

Concurrently, the PWRT time-out (TPWRT) will be

applied before the internal Reset is released. If

TPWRT = 0 and a crystal oscillator is being used, a

nominal delay of TFSCM = 100 is applied. The total

delay in this case is TFSCM.

On a POR, it takes approximately 20 s for the on-chip

voltage regulator to generate an output voltage. During

this time, designated as TSTARTUP, code execution is

disabled. TSTARTUP is applied every time the device

resumes operation after any power-down.

The BOR Status bit (RCON<1>) will be set to indicate

that a BOR has occurred. The BOR circuit continues to

operate while in Sleep or Idle modes and will reset the

device should VDD fall below the BOR threshold

voltage.

FIGURE 21-1:

ON-CHIP VOLTAGE

REGULATOR

CONNECTIONS^(1,2,3)

3.3V

PIC24H

VDD

VCAP

VSS

CEFC

10 µF

Note 1: These are typical operating voltages. Refer to

Table 24-13 located in Section 24.1 “DC

Characteristics” for the full operating ranges

of VDD and VCAP.

2: It is important for the low-ESR capacitor to

be placed as close as possible to the VCAP

pin.

3: Typical VCAP pin voltage = 2.5V when VDD 

VDDMIN.

DS70592D-page 226

 2009-2012 Microchip Technology Inc.

PIC24HJXXXGPX06A/X08A/X10A

If the WDT is enabled, it will continue to run during

21.4 Watchdog Timer (WDT)

Sleep or Idle modes. When the WDT time-out occurs,

the device will wake the device and code execution will

continue from where the PWRSAVinstruction was exe-

cuted. The corresponding SLEEP or IDLE bits

(RCON<3,2>) will need to be cleared in software after

the device wakes up.

For PIC24HJXXXGPX06A/X08A/X10A devices, the

WDT is driven by the LPRC oscillator. When the WDT

is enabled, the clock source is also enabled.

The nominal WDT clock source from LPRC is 32 kHz.

This feeds a prescaler than can be configured for either

5-bit (divide-by-32) or 7-bit (divide-by-128) operation.

The prescaler is set by the WDTPRE Configuration bit.

With a 32 kHz input, the prescaler yields a nominal

WDT time-out period (TWDT) of 1 ms in 5-bit mode, or

4 ms in 7-bit mode.

The WDT flag bit, WDTO (RCON<4>), is not automatically

cleared following a WDT time-out. To detect subsequent

WDT events, the flag must be cleared in software.

Note:

The CLRWDT and PWRSAV instructions

clear the prescaler and postscaler counts

when executed.

A variable postscaler divides down the WDT prescaler

output and allows for a wide range of time-out periods.

The postscaler is controlled by the WDTPOST<3:0>

Configuration bits (FWDT<3:0>) which allow the selec-

tion of a total of 16 settings, from 1:1 to 1:32,768. Using

the prescaler and postscaler, time-out periods ranging

from 1 ms to 131 seconds can be achieved.

The WDT is enabled or disabled by the FWDTEN

Configuration bit in the FWDT Configuration register.

When the FWDTEN Configuration bit is set, the WDT is

always enabled.

The WDT can be optionally controlled in software when

the FWDTEN Configuration bit has been programmed

to ‘0’. The WDT is enabled in software by setting the

SWDTEN control bit (RCON<5>). The SWDTEN con-

trol bit is cleared on any device Reset. The software

WDT option allows the user to enable the WDT for crit-

ical code segments and disable the WDT during

non-critical segments for maximum power savings.

The WDT, prescaler and postscaler are reset:

• On any device Reset

• On the completion of a clock switch, whether

invoked by software (i.e., setting the OSWEN bit

after changing the NOSC bits) or by hardware

(i.e., Fail-Safe Clock Monitor)

• When a PWRSAVinstruction is executed

(i.e., Sleep or Idle mode is entered)

Note:

If the WINDIS bit (FWDT<6>) is cleared,

the CLRWDTinstruction should be executed

by the application software only during the

last 1/4 of the WDT period. This CLRWDT

window can be determined by using a timer.

If a CLRWDTinstruction is executed before

this window, a WDT Reset occurs.

• When the device exits Sleep or Idle mode to

resume normal operation

• By a CLRWDTinstruction during normal execution

FIGURE 21-2:

WDT BLOCK DIAGRAM

All Device Resets

Transition to New Clock Source

Exit Sleep or Idle Mode

PWRSAVInstruction

CLRWDTInstruction

Watchdog Timer

Sleep/Idle

WDTPRE

Prescaler

WDTPOST<3:0>

SWDTEN

FWDTEN

WDT

Wake-up

1

0

RS

Postscaler

WDT

Reset

(divide by N1)

(divide by N2)

LPRC Clock

WDT Window Select

WINDIS

CLRWDTInstruction

 2009-2012 Microchip Technology Inc.

DS70592D-page 227

PIC24HJXXXGPX06A/X08A/X10A

21.5 JTAG Interface

21.7 In-Circuit Serial Programming

Programming Capability

PIC24HJXXXGPX06A/X08A/X10A devices implement

a JTAG interface, which supports boundary scan

device testing, as well as in-circuit programming.

Detailed information on the interface will be provided in

future revisions of the document.

PIC24HJXXXGPX06A/X08A/X10A family digital signal

controllers can be serially programmed while in the end

application circuit. This is simply done with two lines for

clock and data and three other lines for power, ground

and the programming sequence. This allows custom-

ers to manufacture boards with unprogrammed

devices and then program the digital signal controller

just before shipping the product. This also allows the

most recent firmware or a custom firmware, to be pro-

grammed. Please refer to the “dsPIC33F/PIC24H

Note:

For further information, refer to the

dsPIC33F/PIC24H Family Reference

Manual“, Section 24. “Programming

and Diagnostics” (DS70207), which is

available from the Microchip web site

(www.microchip.com).

Flash

Programming

Specification”

(DS70152)

document for details about ICSP programming

capability.

21.6 Code Protection and

CodeGuard™ Security

Any one out of three pairs of programming clock/data

pins may be used:

The PIC24H product families offer advanced imple-

mentation of CodeGuard™ Security. CodeGuard

Security enables multiple parties to securely share

resources (memory, interrupts and peripherals) on a

single chip. This feature helps protect individual

Intellectual Property in collaborative system designs.

• PGEC1 and PGED1

• PGEC2 and PGED2

• PGEC3 and PGED3

21.8 In-Circuit Debugger

When coupled with software encryption libraries,

CodeGuard Security can be used to securely update

Flash even when multiple IP are resident on the single

chip. The code protection features vary depending on

the actual PIC24H implemented. The following

sections provide an overview these features.

When MPLAB^®ICD 3 is selected as a debugger, the

in-circuit debugging functionality is enabled. This func-

tion allows simple debugging functions when used with

MPLAB IDE. Debugging functionality is controlled

through the PGECx (Emulation/Debug Clock) and

PGEDx (Emulation/Debug Data) pin functions.

The code protection features are controlled by the

Configuration registers: FBS, FSS and FGS.

Any one out of three pairs of debugging clock/data pins

may be used:

Note:

For further information, refer to the

“dsPIC33F/PIC24H Family Reference

Manual”, Section 23. “CodeGuard™

Security” (DS70239), which is available

• PGEC1 and PGED1

• PGEC2 and PGED2

• PGEC3 and PGED3

from

the

Microchip

web

site

To use the in-circuit debugger function of the device,

the design must implement ICSP programming capa-

bility connections to MCLR, VDD, VSS and the PGEDx/

PGECx pin pair. In addition, when the feature is

enabled, some of the resources are not available for

general use. These resources include the first 80 bytes

of data RAM and two I/O pins.

(www.microchip.com).

DS70592D-page 228

 2009-2012 Microchip Technology Inc.

PIC24HJXXXGPX06A/X08A/X10A

Most bit-oriented instructions (including simple

rotate/shift instructions) have two operands:

22.0 INSTRUCTION SET SUMMARY

Note:

This data sheet summarizes the features

of the PIC24HJXXXGPX06A/X08A/X10A

families of devices. However, it is not

• The W register (with or without an address

modifier) or file register (specified by the value of

‘Ws’ or ‘f’)

intended to be

a

comprehensive

• The bit in the W register or file register

(specified by a literal value or indirectly by the

contents of register ‘Wb’)

reference source. To complement the

information in this data sheet, refer to the

related section in the “dsPIC33F/PIC24H

Family Reference Manual”, which is

available from the Microchip web site

(www.microchip.com).

The literal instructions that involve data movement may

use some of the following operands:

• A literal value to be loaded into a W register or file

register (specified by the value of ‘k’)

The PIC24H instruction set is identical to that of the

PIC24F, and is a subset of the dsPIC30F/33F

instruction set.

• The W register or file register where the literal

value is to be loaded (specified by ‘Wb’ or ‘f’)

However, literal instructions that involve arithmetic or

logical operations use some of the following operands:

Most instructions are a single program memory word

(24 bits). Only three instructions require two program

memory locations.

• The first source operand which is a register ‘Wb’

without any address modifier

Each single-word instruction is a 24-bit word, divided

into an 8-bit opcode, which specifies the instruction

type and one or more operands, which further specify

the operation of the instruction.

• The second source operand which is a literal

value

• The destination of the result (only if not the same

as the first source operand) which is typically a

register ‘Wd’ with or without an address modifier

The instruction set is highly orthogonal and is grouped

into five basic categories:

The control instructions may use some of the following

operands:

• Word or byte-oriented operations

• Bit-oriented operations

• Literal operations

• A program memory address

• The mode of the table read and table write

instructions

• DSP operations

• Control operations

All instructions are a single word, except for certain

double word instructions, which were made double

word instructions so that all the required information is

available in these 48 bits. In the second word, the

8 MSbs are ‘0’s. If this second word is executed as an

instruction (by itself), it will execute as a NOP.

Table 22-1 shows the general symbols used in

describing the instructions.

The PIC24H instruction set summary in Table 22-2 lists

all the instructions, along with the status flags affected

by each instruction.

Most word or byte-oriented W register instructions

(including barrel shift instructions) have three

operands:

Most single-word instructions are executed in a single

instruction cycle, unless a conditional test is true, or the

program counter is changed as a result of the instruc-

tion. In these cases, the execution takes two instruction

cycles with the additional instruction cycle(s) executed

as a NOP. Notable exceptions are the BRA (uncondi-

tional/computed branch), indirect CALL/GOTO, all table

reads and writes and RETURN/RETFIE instructions,

which are single-word instructions but take two or three

cycles. Certain instructions that involve skipping over the

subsequent instruction require either two or three cycles

if the skip is performed, depending on whether the

instruction being skipped is a single-word or double word

instruction. Moreover, double word moves require two

cycles. The double word instructions execute in two

instruction cycles.

• The first source operand which is typically a

register ‘Wb’ without any address modifier

• The second source operand which is typically a

register ‘Ws’ with or without an address modifier

• The destination of the result which is typically a

register ‘Wd’ with or without an address modifier

However, word or byte-oriented file register instructions

have two operands:

• The file register specified by the value ‘f’

• The destination, which could either be the file

register ‘f’ or the W0 register, which is denoted as

‘WREG’

Note:

For more details on the instruction set,

refer to the “16-bit MCU and DSC

Programmer’s

Reference

Manual”

(DS70157).

 2009-2012 Microchip Technology Inc.

DS70592D-page 229

PIC24HJXXXGPX06A/X08A/X10A

TABLE 22-1: SYMBOLS USED IN OPCODE DESCRIPTIONS

Field

Description

#text

(text)

[text]

{ }

Means literal defined by “text”

Means “content of text”

Means “the location addressed by text”

Optional field or operation

Register bit field

<n:m>

.b

Byte mode selection

.d

Double Word mode selection

Shadow register select

.S

.w

Word mode selection (default)

bit4

4-bit bit selection field (used in word addressed instructions) {0...15}

MCU Status bits: Carry, Digit Carry, Negative, Overflow, Sticky Zero

Absolute address, label or expression (resolved by the linker)

File register address {0x0000...0x1FFF}

1-bit unsigned literal {0,1}

C, DC, N, OV, Z

Expr

f

lit1

lit4

4-bit unsigned literal {0...15}

lit5

5-bit unsigned literal {0...31}

lit8

8-bit unsigned literal {0...255}

lit10

lit14

lit16

lit23

None

PC

10-bit unsigned literal {0...255} for Byte mode, {0:1023} for Word mode

14-bit unsigned literal {0...16384}

16-bit unsigned literal {0...65535}

23-bit unsigned literal {0...8388608}; LSB must be ‘0’

Field does not require an entry, may be blank

Program Counter

Slit10

Slit16

Slit6

Wb

10-bit signed literal {-512...511}

16-bit signed literal {-32768...32767}

6-bit signed literal {-16...16}

Base W register {W0..W15}

Wd

Destination W register { Wd, [Wd], [Wd++], [Wd--], [++Wd], [--Wd] }

Wdo

Destination W register 

{ Wnd, [Wnd], [Wnd++], [Wnd--], [++Wnd], [--Wnd], [Wnd+Wb] }

Wm,Wn

Dividend, Divisor working register pair (direct addressing)

Wm*Wm

Multiplicand and Multiplier working register pair for Square instructions 

{W4 * W4,W5 * W5,W6 * W6,W7 * W7}

Wm*Wn

Multiplicand and Multiplier working register pair for DSP instructions 

{W4 * W5,W4 * W6,W4 * W7,W5 * W6,W5 * W7,W6 * W7}

Wn

One of 16 working registers {W0..W15}

Wnd

Wns

WREG

Ws

One of 16 destination working registers {W0...W15}

One of 16 source working registers {W0...W15}

W0 (working register used in file register instructions)

Source W register { Ws, [Ws], [Ws++], [Ws--], [++Ws], [--Ws] }

Wso

Source W register 

{ Wns, [Wns], [Wns++], [Wns--], [++Wns], [--Wns], [Wns+Wb] }

DS70592D-page 230

 2009-2012 Microchip Technology Inc.

PIC24HJXXXGPX06A/X08A/X10A

TABLE 22-2: INSTRUCTION SET OVERVIEW

Base

Instr

#

Assembly

Mnemonic

# of

Status Flags

Affected

Assembly Syntax

Description

Words Cycles

ADD

f

f = f + WREG

1

C,DC,N,OV,Z

N,Z

1

ADD

ADDC

AND

ASR

ADD

f,WREG

WREG = f + WREG

1

ADD

#lit10,Wn

Wb,Ws,Wd

Wb,#lit5,Wd

f

Wd = lit10 + Wd

1

ADD

Wd = Wb + Ws

1

ADD

Wd = Wb + lit5

1

2

3

4

ADDC

AND

f = f + WREG + (C)

f,WREG

WREG = f + WREG + (C)

Wd = lit10 + Wd + (C)

Wd = Wb + Ws + (C)

Wd = Wb + lit5 + (C)

f = f .AND. WREG

1

#lit10,Wn

Wb,Ws,Wd

Wb,#lit5,Wd

f

1

AND

f,WREG

WREG = f .AND. WREG

Wd = lit10 .AND. Wd

Wd = Wb .AND. Ws

Wd = Wb .AND. lit5

1

N,Z

AND

#lit10,Wn

Wb,Ws,Wd

Wb,#lit5,Wd

f

1

N,Z

AND

1

N,Z

AND

1

N,Z

ASR

f = Arithmetic Right Shift f

WREG = Arithmetic Right Shift f

Wd = Arithmetic Right Shift Ws

Wnd = Arithmetic Right Shift Wb by Wns

Wnd = Arithmetic Right Shift Wb by lit5

Bit Clear f

1

C,N,OV,Z

N,Z

ASR

f,WREG

1

ASR

Ws,Wd

1

ASR

Wb,Wns,Wnd

Wb,#lit5,Wnd

f,#bit4

Ws,#bit4

C,Expr

1

ASR

1

N,Z

5

6

BCLR

BRA

BCLR

BRA

1

None

Bit Clear Ws

1

None

Branch if Carry

1 (2)

2

None

BRA

GE,Expr

GEU,Expr

GT,Expr

GTU,Expr

LE,Expr

LEU,Expr

LT,Expr

LTU,Expr

N,Expr

Branch if greater than or equal

Branch if unsigned greater than or equal

Branch if greater than

Branch if unsigned greater than

Branch if less than or equal

Branch if unsigned less than or equal

Branch if less than

None

BRA

None

BRA

None

BRA

None

BRA

None

BRA

None

BRA

None

BRA

Branch if unsigned less than

Branch if Negative

None

BRA

None

BRA

NC,Expr

NN,Expr

NZ,Expr

Expr

Branch if Not Carry

None

BRA

Branch if Not Negative

Branch if Not Zero

None

BRA

None

BRA

Branch Unconditionally

Branch if Zero

None

BRA

Z,Expr

1 (2)

2

None

BRA

Wn

Computed Branch

None

7

BSET

BSW

BSET

BSW.C

BSW.Z

BTG

f,#bit4

Ws,#bit4

Ws,Wb

Bit Set f

1

None

Bit Set Ws

1

None

8

Write C bit to Ws<Wb>

Write Z bit to Ws<Wb>

Bit Toggle f

1

None

Ws,Wb

1

None

9

BTG

f,#bit4

Ws,#bit4

f,#bit4

1

None

BTG

Bit Toggle Ws

1

None

10

BTSC

Bit Test f, Skip if Clear

1

None

(2 or 3)

BTSC

BTSS

Ws,#bit4

f,#bit4

Ws,#bit4

Bit Test Ws, Skip if Clear

Bit Test f, Skip if Set

1

None

(2 or 3)

11

BTSS

1

(2 or 3)

Bit Test Ws, Skip if Set

1

(2 or 3)

 2009-2012 Microchip Technology Inc.

DS70592D-page 231

PIC24HJXXXGPX06A/X08A/X10A

TABLE 22-2: INSTRUCTION SET OVERVIEW (CONTINUED)

Base

Instr

#

Assembly

Mnemonic

# of

Status Flags

Affected

Assembly Syntax

Description

Words Cycles

12

BTST

f,#bit4

Ws,#bit4

Ws,Wb

Bit Test f

1

2

1

2

1

Z

BTST.C

BTST.Z

BTST.C

BTST.Z

BTSTS

Bit Test Ws to C

Bit Test Ws to Z

C

Z

Bit Test Ws<Wb> to C

Bit Test Ws<Wb> to Z

Bit Test then Set f

Bit Test Ws to C, then Set

Bit Test Ws to Z, then Set

Call subroutine

C

Ws,Wb

Z

13

BTSTS

f,#bit4

BTSTS.C Ws,#bit4

BTSTS.Z Ws,#bit4

C

Z

14

15

CALL

CLR

CALL

CLR

lit23

Wn

None

WDTO,Sleep

N,Z

Call indirect subroutine

f = 0x0000

f

CLR

WREG

Ws

WREG = 0x0000

Ws = 0x0000

CLR

16

17

CLRWDT

COM

CLRWDT

COM

Clear Watchdog Timer

f = f

f

COM

f,WREG

WREG = f

N,Z

COM

CP

Ws,Wd

Wd = Ws

1

N,Z

18

CP

f

Compare f with WREG

C,DC,N,OV,Z

CP

Wb,#lit5

Compare Wb with lit5

CP

Wb,Ws

Compare Wb with Ws (Wb – Ws)

Compare f with 0x0000

19

20

CP0

CPB

CP0

CPB

f

Ws

Compare Ws with 0x0000

Compare f with WREG, with Borrow

Compare Wb with lit5, with Borrow

f

Wb,#lit5

Wb,Ws

Compare Wb with Ws, with Borrow

(Wb – Ws – C)

21

22

23

24

CPSEQ

CPSGT

CPSLT

CPSNE

CPSEQ

CPSGT

CPSLT

CPSNE

Wb, Wn

Compare Wb with Wn, skip if =

Compare Wb with Wn, skip if >

Compare Wb with Wn, skip if <

Compare Wb with Wn, skip if 

1

None

(2 or 3)

1

(2 or 3)

1

(2 or 3)

1

(2 or 3)

25

26

DAW

DEC

DAW

Wn

Wn = decimal adjust Wn

f = f – 1

1

2

1

C

DEC

f

C,DC,N,OV,Z

None

DEC

f,WREG

Ws,Wd

f

WREG = f – 1

1

DEC

Wd = Ws – 1

1

27

DEC2

DISI

DIV.S

DIV.SD

DIV.U

DIV.UD

EXCH

FBCL

FF1L

FF1R

GOTO

f = f – 2

1

f,WREG

Ws,Wd

#lit14

Wm,Wn

Wns,Wnd

Ws,Wnd

Expr

WREG = f – 2

1

Wd = Ws – 2

1

28

29

DISI

DIV

Disable Interrupts for k instruction cycles

Signed 16/16-bit Integer Divide

Signed 32/16-bit Integer Divide

Unsigned 16/16-bit Integer Divide

Unsigned 32/16-bit Integer Divide

Swap Wns with Wnd

1

18

1

N,Z,C,OV

None

30

31

32

33

34

EXCH

FBCL

FF1L

FF1R

GOTO

Find Bit Change from Left (MSb) Side

Find First One from Left (MSb) Side

Find First One from Right (LSb) Side

Go to address

1

C

1

C

1

C

2

None

Wn

Go to indirect

2

None

DS70592D-page 232

 2009-2012 Microchip Technology Inc.

PIC24HJXXXGPX06A/X08A/X10A

TABLE 22-2: INSTRUCTION SET OVERVIEW (CONTINUED)

Base

Instr

#

Assembly

Mnemonic

# of

Status Flags

Affected

Assembly Syntax

Description

Words Cycles

35

INC

f

f = f + 1

1

2

1

C,DC,N,OV,Z

N,Z

INC

f,WREG

Ws,Wd

WREG = f + 1

Wd = Ws + 1

f = f + 2

INC

36

37

INC2

IOR

INC2

IOR

f

f,WREG

Ws,Wd

WREG = f + 2

Wd = Ws + 2

f

f = f .IOR. WREG

IOR

f,WREG

#lit10,Wn

Wb,Ws,Wd

Wb,#lit5,Wd

#lit14

f

WREG = f .IOR. WREG

Wd = lit10 .IOR. Wd

N,Z

IOR

N,Z

IOR

Wd = Wb .IOR. Ws

N,Z

IOR

Wd = Wb .IOR. lit5

N,Z

38

39

LNK

LSR

LNK

Link Frame Pointer

None

LSR

f = Logical Right Shift f

C,N,OV,Z

N,Z

LSR

f,WREG

Ws,Wd

WREG = Logical Right Shift f

Wd = Logical Right Shift Ws

Wnd = Logical Right Shift Wb by Wns

Wnd = Logical Right Shift Wb by lit5

Move f to Wn

LSR

Wb,Wns,Wnd

Wb,#lit5,Wnd

f,Wn

LSR

N,Z

40

MOV

None

MOV

f

Move f to f

None

MOV

f,WREG

#lit16,Wn

#lit8,Wn

Wn,f

Move f to WREG

N,Z

MOV

Move 16-bit literal to Wn

Move 8-bit literal to Wn

None

MOV.b

MOV

None

Move Wn to f

None

MOV

Wso,Wdo

WREG,f

Wns,Wd

Ws,Wnd

Wb,Ws,Wnd

Move Ws to Wd

None

MOV

Move WREG to f

None

MOV.D

MUL.SS

MUL.SU

MUL.US

MUL.UU

Move Double from W(ns):W(ns + 1) to Wd

Move Double from Ws to W(nd + 1):W(nd)

{Wnd + 1, Wnd} = signed(Wb) * signed(Ws)

{Wnd + 1, Wnd} = signed(Wb) * unsigned(Ws)

{Wnd + 1, Wnd} = unsigned(Wb) * signed(Ws)

None

41

MUL

None

{Wnd + 1, Wnd} = unsigned(Wb) *

unsigned(Ws)

None

MUL.SU

MUL.UU

Wb,#lit5,Wnd

{Wnd + 1, Wnd} = signed(Wb) * unsigned(lit5)

1

None

{Wnd + 1, Wnd} = unsigned(Wb) *

unsigned(lit5)

MUL

f

W3:W2 = f * WREG

1

None

42

NEG

f

f = f + 1

1

2

C,DC,N,OV,Z

None

NEG

f,WREG

Ws,Wd

WREG = f + 1

NEG

Wd = Ws + 1

43

44

NOP

POP

NOP

No Operation

NOPR

POP

No Operation

None

f

Pop f from Top-of-Stack (TOS)

Pop from Top-of-Stack (TOS) to Wdo

None

POP

Wdo

Wnd

None

POP.D

Pop from Top-of-Stack (TOS) to

W(nd):W(nd + 1)

None

POP.S

PUSH

Pop Shadow Registers

1

2

1

All

None

45

46

PUSH

f

Push f to Top-of-Stack (TOS)

Push Wso to Top-of-Stack (TOS)

Push W(ns):W(ns + 1) to Top-of-Stack (TOS)

Push Shadow Registers

PUSH

Wso

Wns

None

PUSH.D

PUSH.S

PWRSAV

None

PWRSAV

#lit1

Go into Sleep or Idle mode

WDTO,Sleep

 2009-2012 Microchip Technology Inc.

DS70592D-page 233

PIC24HJXXXGPX06A/X08A/X10A

TABLE 22-2: INSTRUCTION SET OVERVIEW (CONTINUED)

Base

Instr

#

Assembly

Mnemonic

# of

Status Flags

Affected

Assembly Syntax

Description

Words Cycles

47

RCALL

REPEAT

RESET

RETFIE

RETLW

RETURN

RLC

Expr

Wn

Relative Call

1

2

None

Computed Call

48

REPEAT

#lit14

Wn

Repeat Next Instruction lit14 + 1 times

Repeat Next Instruction (Wn) + 1 times

Software device Reset

1

None

1

None

49

50

51

52

53

RESET

RETFIE

RETLW

RETURN

RLC

1

None

Return from interrupt

3 (2)

1

None

#lit10,Wn

Return with literal in Wn

Return from Subroutine

f = Rotate Left through Carry f

WREG = Rotate Left through Carry f

Wd = Rotate Left through Carry Ws

f = Rotate Left (No Carry) f

WREG = Rotate Left (No Carry) f

Wd = Rotate Left (No Carry) Ws

f = Rotate Right through Carry f

WREG = Rotate Right through Carry f

Wd = Rotate Right through Carry Ws

f = Rotate Right (No Carry) f

WREG = Rotate Right (No Carry) f

Wd = Rotate Right (No Carry) Ws

Wnd = sign-extended Ws

f = 0xFFFF

None

f

C,N,Z

RLC

f,WREG

Ws,Wd

f

1

C,N,Z

RLC

1

C,N,Z

54

55

56

RLNC

RRC

RLNC

RRC

1

N,Z

f,WREG

Ws,Wd

f

1

N,Z

1

N,Z

1

C,N,Z

RRC

f,WREG

Ws,Wd

f

1

C,N,Z

RRC

1

C,N,Z

RRNC

SE

1

N,Z

f,WREG

Ws,Wd

Ws,Wnd

f

1

N,Z

1

N,Z

57

58

SE

1

C,N,Z

SETM

SL

1

None

WREG

WREG = 0xFFFF

1

None

Ws

Ws = 0xFFFF

1

None

59

60

61

SL

f

f = Left Shift f

1

C,N,OV,Z

N,Z

SL

f,WREG

Ws,Wd

Wb,Wns,Wnd

Wb,#lit5,Wnd

f

WREG = Left Shift f

1

SL

Wd = Left Shift Ws

1

SL

Wnd = Left Shift Wb by Wns

Wnd = Left Shift Wb by lit5

f = f – WREG

1

SL

1

N,Z

SUB

SUBB

SUB

1

C,DC,N,OV,Z

SUB

f,WREG

#lit10,Wn

Wb,Ws,Wd

Wb,#lit5,Wd

WREG = f – WREG

1

SUB

Wn = Wn – lit10

1

SUB

Wd = Wb – Ws

1

SUB

Wd = Wb – lit5

1

SUBB

f

f = f – WREG – (C)

1

C,DC,N,OV,Z

f,WREG

#lit10,Wn

WREG = f – WREG – (C)

Wn = Wn – lit10 – (C)

SUBB

SUBR

SUBBR

Wb,Ws,Wd

Wb,#lit5,Wd

f

Wd = Wb – Ws – (C)

Wd = Wb – lit5 – (C)

f = WREG – f

1

C,DC,N,OV,Z

62

63

SUBR

f,WREG

Wb,Ws,Wd

Wb,#lit5,Wd

f

WREG = WREG – f

Wd = Ws – Wb

Wd = lit5 – Wb

SUBBR

f = WREG – f – (C)

SUBBR

SWAP.b

SWAP

f,WREG

Wb,Ws,Wd

Wb,#lit5,Wd

Wn

WREG = WREG – f – (C)

Wd = Ws – Wb – (C)

1

2

C,DC,N,OV,Z

None

Wd = lit5 – Wb – (C)

64

65

SWAP

Wn = nibble swap Wn

Wn = byte swap Wn

Wn

None

TBLRDH

Ws,Wd

Read Prog<23:16> to Wd<7:0>

None

DS70592D-page 234

 2009-2012 Microchip Technology Inc.

PIC24HJXXXGPX06A/X08A/X10A

TABLE 22-2: INSTRUCTION SET OVERVIEW (CONTINUED)

Base

Instr

#

Assembly

Mnemonic

# of

Status Flags

Affected

Assembly Syntax

Description

Words Cycles

66

TBLRDL

TBLWTH

TBLWTL

ULNK

TBLRDL

TBLWTH

TBLWTL

ULNK

XOR

Ws,Wd

Read Prog<15:0> to Wd

1

2

1

None

N,Z

67

68

69

70

Write Ws<7:0> to Prog<23:16>

Write Ws to Prog<15:0>

Unlink Frame Pointer

f = f .XOR. WREG

XOR

f

XOR

f,WREG

WREG = f .XOR. WREG

Wd = lit10 .XOR. Wd

Wd = Wb .XOR. Ws

N,Z

XOR

#lit10,Wn

Wb,Ws,Wd

Wb,#lit5,Wd

Ws,Wnd

N,Z

XOR

N,Z

XOR

Wd = Wb .XOR. lit5

N,Z

71

ZE

Wnd = Zero-extend Ws

C,Z,N

 2009-2012 Microchip Technology Inc.

DS70592D-page 235

PIC24HJXXXGPX06A/X08A/X10A

NOTES:

DS70592D-page 236

 2009-2012 Microchip Technology Inc.

PIC24HJXXXGPX06A/X08A/X10A

23.1 MPLAB Integrated Development

Environment Software

23.0 DEVELOPMENT SUPPORT

The PIC^®microcontrollers and dsPIC^®digital signal

controllers are supported with a full range of software

and hardware development tools:

The MPLAB IDE software brings an ease of software

development previously unseen in the 8/16/32-bit

microcontroller market. The MPLAB IDE is a Windows^®

operating system-based application that contains:

• Integrated Development Environment

- MPLAB^®IDE Software

• A single graphical interface to all debugging tools

- Simulator

• Compilers/Assemblers/Linkers

- MPLAB C Compiler for Various Device

Families

- Programmer (sold separately)

- HI-TECH C^®for Various Device Families

- MPASM^TMAssembler

- MPLINK^TMObject Linker/

MPLIB^TMObject Librarian

- In-Circuit Emulator (sold separately)

- In-Circuit Debugger (sold separately)

• A full-featured editor with color-coded context

• A multiple project manager

- MPLAB Assembler/Linker/Librarian for

Various Device Families

• Customizable data windows with direct edit of

contents

• Simulators

• High-level source code debugging

• Mouse over variable inspection

- MPLAB SIM Software Simulator

• Emulators

• Drag and drop variables from source to watch

windows

- MPLAB REAL ICE™ In-Circuit Emulator

• In-Circuit Debuggers

• Extensive on-line help

• Integration of select third party tools, such as

IAR C Compilers

- MPLAB ICD 3

- PICkit™ 3 Debug Express

• Device Programmers

- PICkit™ 2 Programmer

- MPLAB PM3 Device Programmer

The MPLAB IDE allows you to:

• Edit your source files (either C or assembly)

• One-touch compile or assemble, and download to

emulator and simulator tools (automatically

updates all project information)

• Low-Cost Demonstration/Development Boards,

Evaluation Kits, and Starter Kits

• Debug using:

- Source files (C or assembly)

- Mixed C and assembly

- Machine code

MPLAB IDE supports multiple debugging tools in a

single development paradigm, from the cost-effective

simulators, through low-cost in-circuit debuggers, to

full-featured emulators. This eliminates the learning

curve when upgrading to tools with increased flexibility

and power.

 2009-2012 Microchip Technology Inc.

DS70592D-page 237

PIC24HJXXXGPX06A/X08A/X10A

23.2 MPLAB C Compilers for Various

Device Families

23.5 MPLINK Object Linker/

MPLIB Object Librarian

The MPLAB C Compiler code development systems

are complete ANSI C compilers for Microchip’s PIC18,

PIC24 and PIC32 families of microcontrollers and the

dsPIC30 and dsPIC33 families of digital signal control-

lers. These compilers provide powerful integration

capabilities, superior code optimization and ease of

use.

The MPLINK Object Linker combines relocatable

objects created by the MPASM Assembler and the

MPLAB C18 C Compiler. It can link relocatable objects

from precompiled libraries, using directives from a

linker script.

The MPLIB Object Librarian manages the creation and

modification of library files of precompiled code. When

a routine from a library is called from a source file, only

the modules that contain that routine will be linked in

with the application. This allows large libraries to be

used efficiently in many different applications.

For easy source level debugging, the compilers provide

symbol information that is optimized to the MPLAB IDE

debugger.

23.3 HI-TECH C for Various Device

Families

The object linker/library features include:

• Efficient linking of single libraries instead of many

smaller files

The HI-TECH C Compiler code development systems

are complete ANSI C compilers for Microchip’s PIC

family of microcontrollers and the dsPIC family of digital

signal controllers. These compilers provide powerful

integration capabilities, omniscient code generation

and ease of use.

• Enhanced code maintainability by grouping

related modules together

• Flexible creation of libraries with easy module

listing, replacement, deletion and extraction

23.6 MPLAB Assembler, Linker and

Librarian for Various Device

Families

For easy source level debugging, the compilers provide

symbol information that is optimized to the MPLAB IDE

debugger.

The compilers include a macro assembler, linker, pre-

processor, and one-step driver, and can run on multiple

platforms.

MPLAB Assembler produces relocatable machine

code from symbolic assembly language for PIC24,

PIC32 and dsPIC devices. MPLAB C Compiler uses

the assembler to produce its object file. The assembler

generates relocatable object files that can then be

archived or linked with other relocatable object files and

archives to create an executable file. Notable features

of the assembler include:

23.4 MPASM Assembler

The MPASM Assembler is a full-featured, universal

macro assembler for PIC10/12/16/18 MCUs.

The MPASM Assembler generates relocatable object

files for the MPLINK Object Linker, Intel^®standard HEX

files, MAP files to detail memory usage and symbol

reference, absolute LST files that contain source lines

and generated machine code and COFF files for

debugging.

• Support for the entire device instruction set

• Support for fixed-point and floating-point data

• Command line interface

• Rich directive set

• Flexible macro language

The MPASM Assembler features include:

• Integration into MPLAB IDE projects

• MPLAB IDE compatibility

• User-defined macros to streamline

assembly code

• Conditional assembly for multi-purpose

source files

• Directives that allow complete control over the

assembly process

DS70592D-page 238

 2009-2012 Microchip Technology Inc.

PIC24HJXXXGPX06A/X08A/X10A

23.7 MPLAB SIM Software Simulator

23.9 MPLAB ICD 3 In-Circuit Debugger

System

The MPLAB SIM Software Simulator allows code

development in a PC-hosted environment by simulat-

ing the PIC MCUs and dsPIC^®DSCs on an instruction

level. On any given instruction, the data areas can be

examined or modified and stimuli can be applied from

a comprehensive stimulus controller. Registers can be

logged to files for further run-time analysis. The trace

buffer and logic analyzer display extend the power of

the simulator to record and track program execution,

actions on I/O, most peripherals and internal registers.

MPLAB ICD 3 In-Circuit Debugger System is Micro-

chip's most cost effective high-speed hardware

debugger/programmer for Microchip Flash Digital Sig-

nal Controller (DSC) and microcontroller (MCU)

devices. It debugs and programs PIC^®Flash microcon-

trollers and dsPIC^®DSCs with the powerful, yet easy-

to-use graphical user interface of MPLAB Integrated

Development Environment (IDE).

The MPLAB ICD 3 In-Circuit Debugger probe is con-

nected to the design engineer's PC using a high-speed

USB 2.0 interface and is connected to the target with a

connector compatible with the MPLAB ICD 2 or MPLAB

REAL ICE systems (RJ-11). MPLAB ICD 3 supports all

MPLAB ICD 2 headers.

The MPLAB SIM Software Simulator fully supports

symbolic debugging using the MPLAB C Compilers,

and the MPASM and MPLAB Assemblers. The soft-

ware simulator offers the flexibility to develop and

debug code outside of the hardware laboratory envi-

ronment, making it an excellent, economical software

development tool.

23.10 PICkit 3 In-Circuit Debugger/

Programmer and

23.8 MPLAB REAL ICE In-Circuit

Emulator System

PICkit 3 Debug Express

The MPLAB PICkit 3 allows debugging and program-

ming of PIC^®and dsPIC^®Flash microcontrollers at a

most affordable price point using the powerful graphical

user interface of the MPLAB Integrated Development

Environment (IDE). The MPLAB PICkit 3 is connected

to the design engineer's PC using a full speed USB

interface and can be connected to the target via an

Microchip debug (RJ-11) connector (compatible with

MPLAB ICD 3 and MPLAB REAL ICE). The connector

uses two device I/O pins and the reset line to imple-

ment in-circuit debugging and In-Circuit Serial Pro-

gramming™.

MPLAB REAL ICE In-Circuit Emulator System is

Microchip’s next generation high-speed emulator for

Microchip Flash DSC and MCU devices. It debugs and

programs PIC^®Flash MCUs and dsPIC^®Flash DSCs

with the easy-to-use, powerful graphical user interface of

the MPLAB Integrated Development Environment (IDE),

included with each kit.

The emulator is connected to the design engineer’s PC

using a high-speed USB 2.0 interface and is connected

to the target with either a connector compatible with in-

circuit debugger systems (RJ11) or with the new high-

speed, noise tolerant, Low-Voltage Differential Signal

(LVDS) interconnection (CAT5).

The PICkit 3 Debug Express include the PICkit 3, demo

board and microcontroller, hookup cables and CDROM

with user’s guide, lessons, tutorial, compiler and

MPLAB IDE software.

The emulator is field upgradable through future firmware

downloads in MPLAB IDE. In upcoming releases of

MPLAB IDE, new devices will be supported, and new

features will be added. MPLAB REAL ICE offers

significant advantages over competitive emulators

including low-cost, full-speed emulation, run-time

variable watches, trace analysis, complex breakpoints, a

ruggedized probe interface and long (up to three meters)

interconnection cables.

 2009-2012 Microchip Technology Inc.

DS70592D-page 239

PIC24HJXXXGPX06A/X08A/X10A

23.11 PICkit 2 Development

Programmer/Debugger and

PICkit 2 Debug Express

23.13 Demonstration/Development

Boards, Evaluation Kits, and

Starter Kits

The PICkit™ 2 Development Programmer/Debugger is

a low-cost development tool with an easy to use inter-

face for programming and debugging Microchip’s Flash

families of microcontrollers. The full featured

Windows^®programming interface supports baseline

A wide variety of demonstration, development and

evaluation boards for various PIC MCUs and dsPIC

DSCs allows quick application development on fully func-

tional systems. Most boards include prototyping areas for

adding custom circuitry and provide application firmware

and source code for examination and modification.

(PIC10F,

PIC12F5xx,

PIC16F5xx),

midrange

(PIC12F6xx, PIC16F), PIC18F, PIC24, dsPIC30,

dsPIC33, and PIC32 families of 8-bit, 16-bit, and 32-bit

microcontrollers, and many Microchip Serial EEPROM

products. With Microchip’s powerful MPLAB Integrated

The boards support a variety of features, including LEDs,

temperature sensors, switches, speakers, RS-232

interfaces, LCD displays, potentiometers and additional

EEPROM memory.

Development Environment (IDE) the PICkit™

2

enables in-circuit debugging on most PIC^®microcon-

trollers. In-Circuit-Debugging runs, halts and single

steps the program while the PIC microcontroller is

embedded in the application. When halted at a break-

point, the file registers can be examined and modified.

The demonstration and development boards can be

used in teaching environments, for prototyping custom

circuits and for learning about various microcontroller

applications.

In addition to the PICDEM™ and dsPICDEM™ demon-

stration/development board series of circuits, Microchip

has a line of evaluation kits and demonstration software

The PICkit 2 Debug Express include the PICkit 2, demo

board and microcontroller, hookup cables and CDROM

with user’s guide, lessons, tutorial, compiler and

MPLAB IDE software.

®

for analog filter design, KEELOQ security ICs, CAN,

IrDA^®, PowerSmart battery management, SEEVAL^®

evaluation system, Sigma-Delta ADC, flow rate

sensing, plus many more.

23.12 MPLAB PM3 Device Programmer

Also available are starter kits that contain everything

needed to experience the specified device. This usually

includes a single application and debug capability, all

on one board.

The MPLAB PM3 Device Programmer is a universal,

CE compliant device programmer with programmable

voltage verification at VDDMIN and VDDMAX for

maximum reliability. It features a large LCD display

(128 x 64) for menus and error messages and a modu-

lar, detachable socket assembly to support various

package types. The ICSP™ cable assembly is included

as a standard item. In Stand-Alone mode, the MPLAB

PM3 Device Programmer can read, verify and program

PIC devices without a PC connection. It can also set

code protection in this mode. The MPLAB PM3

connects to the host PC via an RS-232 or USB cable.

The MPLAB PM3 has high-speed communications and

optimized algorithms for quick programming of large

memory devices and incorporates an MMC card for file

storage and data applications.

Check the Microchip web page (www.microchip.com)

for the complete list of demonstration, development

and evaluation kits.

DS70592D-page 240

 2009-2012 Microchip Technology Inc.

PIC24HJXXXGPX06A/X08A/X10A

24.0 ELECTRICAL CHARACTERISTICS

This section provides an overview of PIC24HJXXXGPX06A/X08A/X10A electrical characteristics. Additional

information is provided in future revisions of this document as it becomes available.

Absolute maximum ratings for the PIC24HJXXXGPX06A/X08A/X10A family are listed below. Exposure to these maxi-

mum rating conditions for extended periods can affect device reliability. Functional operation of the device at these or

any other conditions above the parameters indicated in the operation listings of this specification is not implied.

Absolute Maximum Ratings

(See Note 1 )

Ambient temperature under bias.............................................................................................................-40°C to +125°C

Storage temperature .............................................................................................................................. -65°C to +160°C

Voltage on VDD with respect to VSS ......................................................................................................... -0.3V to +4.0V

Voltage on any pin that is not 5V tolerant with respect to VSS⁽⁴⁾.................................................... -0.3V to (VDD + 0.3V)

Voltage on any 5V tolerant pin with respect to VSS when VDD  3.0V⁽⁴⁾.................................................. -0.3V to +5.6V

Voltage on any 5V tolerant pin with respect to VSS when VDD < 3.0V⁽⁴⁾..................................................... -0.3V to 3.6V

Maximum current out of VSS pin ...........................................................................................................................300 mA

Maximum current into VDD pin⁽²⁾...........................................................................................................................250 mA

Maximum current sourced/sunk by any 2x I/O pin⁽³⁾................................................................................................8 mA

Maximum current sourced/sunk by any 4x I/O pin⁽³⁾..............................................................................................15 mA

Maximum current sourced/sunk by any 8x I/O pin⁽³⁾..............................................................................................25 mA

Maximum current sunk by all ports .......................................................................................................................200 mA

Maximum current sourced by all ports⁽²⁾...............................................................................................................200 mA

Note 1: Stresses above those listed under “Absolute Maximum Ratings” can cause permanent damage to the

device. This is a stress rating only, and functional operation of the device at those or any other conditions

above those indicated in the operation listings of this specification is not implied. Exposure to maximum

rating conditions for extended periods can affect device reliability.

2: Maximum allowable current is a function of device maximum power dissipation (see Table 24-2).

3: Exceptions are CLKOUT, which is able to sink/source 25 mA, and the VREF+, VREF-, SCLx, SDAx, PGECx

and PGEDx pins, which are able to sink/source 12 mA.

4: See the “Pin Diagrams” section for 5V tolerant pins.

 2009-2012 Microchip Technology Inc.

DS70592D-page 241

PIC24HJXXXGPX06A/X08A/X10A

24.1 DC Characteristics

TABLE 24-1: OPERATING MIPS VS. VOLTAGE

Max MIPS

VDD Range

(in Volts)

Temp Range

(in °C)

Characteristic

PIC24HJXXXGPX06A/X08A/X10A

VBOR-3.6V⁽¹⁾

-40°C to +85°C

-40°C to +125°C

40

—

Note 1: Device is functional at VBORMIN < VDD < VDDMIN. Analog modules such as the ADC will have degraded

performance. Device functionality is tested but not characterized. Refer to parameter BO10 in Table 24-11

for the minimum and maximum BOR values.

TABLE 24-2: THERMAL OPERATING CONDITIONS

Rating

Industrial Temperature Devices

Symbol

Min

Typ

Max

Unit

Operating Junction Temperature Range

Operating Ambient Temperature Range

TJ

TA

-40

—

+125

+85

°C

Extended Temperature Devices

Operating Junction Temperature Range

Operating Ambient Temperature Range

TJ

TA

-40

—

+150

+125

°C

Power Dissipation:

Internal chip power dissipation:

PINT = VDD x (IDD –  IOH)

PD

PINT + PI/O

W

I/O Pin Power Dissipation:

I/O =  ({VDD – VOH} x IOH) +  (VOL x IOL)

Maximum Allowed Power Dissipation

PDMAX

(TJ – TA)/JA

TABLE 24-3: THERMAL PACKAGING CHARACTERISTICS

Characteristic

Symbol

Typ

Max

Unit

Notes

Package Thermal Resistance, 100-pin TQFP (14x14x1 mm)

Package Thermal Resistance, 100-pin TQFP (12x12x1 mm)

Package Thermal Resistance, 64-pin TQFP (10x10x1 mm)

Package Thermal Resistance, 64-pin QFN (9x9x0.9 mm)

JA

40

28

—

°C/W

1

Note 1: Junction to ambient thermal resistance, Theta-JA (JA) numbers are achieved by package simulations.

DS70592D-page 242

 2009-2012 Microchip Technology Inc.

PIC24HJXXXGPX06A/X08A/X10A

TABLE 24-4: DC TEMPERATURE AND VOLTAGE SPECIFICATIONS

Standard Operating Conditions: 3.0V to 3.6V

(unless otherwise stated)

Operating temperature -40°C  TA  +85°C for Industrial

-40°C  TA  +125°C for Extended

DC CHARACTERISTICS

Param

Symbol

No.

Characteristic

Min

Typ⁽¹⁾

Max Units

Conditions

Operating Voltage

DC10 Supply Voltage

VDD

3.0

1.8

—

3.6

—

V

Industrial and Extended

DC12

DC16

VDR

RAM Data Retention Voltage⁽²⁾

—

VPOR

VDD Start Voltage

to ensure internal

VSS

Power-on Reset signal

DC17

SVDD

VDD Rise Rate

0.03

—

V/ms 0-3.0V in 0.1s

to ensure internal

Power-on Reset signal

Note 1: Data in “Typ” column is at 3.3V, 25°C unless otherwise stated.

2: This is the limit to which VDD can be lowered without losing RAM data.

 2009-2012 Microchip Technology Inc.

DS70592D-page 243

PIC24HJXXXGPX06A/X08A/X10A

TABLE 24-5: DC CHARACTERISTICS: OPERATING CURRENT (IDD)

Standard Operating Conditions: 3.0V to 3.6V

(unless otherwise stated)

Operating temperature -40°C  TA  +85°C for Industrial

DC CHARACTERISTICS

-40°C  TA  +125°C for Extended

Parameter

Typical⁽²⁾

Max

Units

Conditions

No.⁽³⁾

Operating Current (IDD)⁽¹⁾

DC20d

DC20a

DC20b

DC20c

DC21d

DC21a

DC21b

DC21c

DC22d

DC22a

DC22b

DC22c

DC23d

DC23a

DC23b

DC23c

DC24d

DC24a

DC24b

DC24c

27

36

37

38

39

43

46

47

65

84

30

35

40

45

50

55

70

90

mA

-40°C

+25°C

+85°C

+125°C

-40°C

3.3V

10 MIPS

16 MIPS

20 MIPS

30 MIPS

40 MIPS

+25°C

+85°C

+125°C

-40°C

+25°C

+85°C

+125°C

-40°C

+25°C

+85°C

+125°C

-40°C

+25°C

+85°C

+125°C

Note 1: IDD is primarily a function of the operating voltage and frequency. Other factors, such as I/O pin loading

and switching rate, oscillator type, internal code execution pattern and temperature, also have an impact

on the current consumption. The test conditions for all IDD measurements are as follows:

• Oscillator is configured in EC mode with PLL, OSC1 is driven with external square wave from

rail-to-rail (EC clock overshoot/undershoot < 250 mV required)

• CLKO is configured as an I/O input pin in the Configuration word

• All I/O pins are configured as inputs and pulled to VSS

• MCLR = VDD, WDT and FSCM are disabled

• CPU, SRAM, program memory and data memory are operational

• No peripheral modules are operating; however, every peripheral is being clocked (defined PMDx bits

are set to zero and unimplemented PMDx bits are set to one)

• CPU executing while(1)statement

• JTAG is disabled

2: These parameters are characterized but not tested in manufacturing.

3: Data in “Typ” column is at 3.3V, +25ºC unless otherwise stated.

DS70592D-page 244

 2009-2012 Microchip Technology Inc.

PIC24HJXXXGPX06A/X08A/X10A

TABLE 24-6: DC CHARACTERISTICS: IDLE CURRENT (IIDLE)

Standard Operating Conditions: 3.0V to 3.6V

(unless otherwise stated)

Operating temperature -40°C  TA  +85°C for Industrial

-40°C  TA  +125°C for Extended

DC CHARACTERISTICS

Parameter

Typical⁽²⁾

No.⁽³⁾

Max

Units

Conditions

Idle Current (IIDLE): Core OFF Clock ON Base Current⁽¹⁾

DC40d

DC40a

DC40b

DC40c

DC41d

DC41a

DC41b

DC41c

DC42d

DC42a

DC42b

DC42c

DC43a

DC43d

DC43b

DC43c

DC44d

DC44a

DC44b

DC44c

3

25

mA

-40°C

+25°C

+85°C

+125°C

-40°C

10 MIPS

16 MIPS

20 MIPS

30 MIPS

40 MIPS

3.3V

3

4

5

+25°C

+85°C

+125°C

-40°C

6

8

9

+25°C

+85°C

+125°C

+25°C

-40°C

3.3V

10

15

16

+85°C

+125°C

-40°C

+25°C

+85°C

+125°C

Note 1: Base IIDLE current is measured as follows:

• CPU core is off, oscillator is configured in EC mode and external clock active, OSC1 is driven with

external square wave from rail-to-rail (EC clock overshoot/undershoot < 250 mV required)

• CLKO is configured as an I/O input pin in the Configuration word

• All I/O pins are configured as inputs and pulled to VSS

• MCLR = VDD, WDT and FSCM are disabled

• No peripheral modules are operating; however, every peripheral is being clocked (defined PMDx bits

are set to zero and unimplemented PMDx bits are set to one)

• JTAG is disabled

2: These parameters are characterized but not tested in manufacturing.

3: Data in “Typ” column is at 3.3V, +25ºC unless otherwise stated.

 2009-2012 Microchip Technology Inc.

DS70592D-page 245

PIC24HJXXXGPX06A/X08A/X10A

TABLE 24-7: DC CHARACTERISTICS: POWER-DOWN CURRENT (IPD)

Standard Operating Conditions: 3.0V to 3.6V

(unless otherwise stated)

Operating temperature -40°C  TA  +85°C for Industrial

DC CHARACTERISTICS

-40°C  TA  +125°C for Extended

Parameter

Typical⁽²⁾

Max

Units

Conditions

No.⁽³⁾

Power-Down Current (IPD)⁽¹⁾

DC60d

DC60a

DC60b

DC60c

DC61d

DC61a

DC61b

DC61c

50

200

600

8

200

500

1000

13

A

-40°C

+25°C

+85°C

+125°C

-40°C

3.3V

Base Power-Down Current⁽³⁾

10

12

13

15

+25°C

+85°C

+125°C

(3)

Watchdog Timer Current: IWDT

20

25

Note 1: IPD (Sleep) current is measured as follows:

• CPU core is off, oscillator is configured in EC mode and external clock active, OSC1 is driven with

external square wave from rail-to-rail (EC clock overshoot/undershoot < 250 mV required)

• CLKO is configured as an I/O input pin in the Configuration word

• All I/O pins are configured as inputs and pulled to VSS

• MCLR = VDD, WDT and FSCM are disabled, all peripheral modules except the ADC are disabled

(PMDx bits are all ‘1’s). The following ADC settings are enabled for each ADC module (ADCx) prior to

executing the PWRSAV instruction: ADON = 1, VCFG = 1, AD12B = 1and ADxMD = 0.

• VREGS bit (RCON<8>) = 0(i.e., core regulator is set to stand-by while the device is in Sleep mode)

• RTCC is disabled.

• JTAG is disabled

2: Data in the “Typ” column is at 3.3V, +25ºC unless otherwise stated.

3: The Watchdog Timer Current is the additional current consumed when the WDT module is enabled. This

current should be added to the base IPD current.

4: These currents are measured on the device containing the most memory in this family.

5: These parameters are characterized, but are not tested in manufacturing.

DS70592D-page 246

 2009-2012 Microchip Technology Inc.

PIC24HJXXXGPX06A/X08A/X10A

TABLE 24-8: DC CHARACTERISTICS: DOZE CURRENT (IDOZE)

Standard Operating Conditions: 3.0V to 3.6V

(unless otherwise stated)

Operating temperature -40°C  TA  +85°C for Industrial

-40°C  TA  +125°C for Extended

DC CHARACTERISTICS

Doze

Ratio

Parameter No.

Typical⁽²⁾

Max

Units

Conditions

Doze Current (IDOZE)⁽¹⁾

DC73a

11

42

26

25

41

25

24

42

26

25

35

30

50

30

50

30

50

30

1:2

1:64

1:128

1:2

mA

DC73f

-40°C

+25°C

+85°C

3.3V

40 MIPS

DC73g

DC70a

DC70f

1:64

1:128

1:2

3.3V

DC70g

DC71a

DC71f

1:64

1:128

1:2

DC71g

DC72a

DC72f

1:64

1:128

+125°C 3.3V

DC72g

Note 1: IDOZE is primarily a function of the operating voltage and frequency. Other factors, such as I/O pin loading

and switching rate, oscillator type, internal code execution pattern and temperature, also have an impact

on the current consumption. The test conditions for all IDOZE measurements are as follows:

• Oscillator is configured in EC mode and external clock active, OSC1 is driven with external square

wave from rail-to-rail with overshoot/undershoot < 250 mV

• CLKO is configured as an I/O input pin in the Configuration word

• All I/O pins are configured as inputs and pulled to VSS

• MCLR = VDD, WDT and FSCM are disabled

• CPU, SRAM, program memory and data memory are operational

• No peripheral modules are operating; however, every peripheral is being clocked (defined PMDx bits

are set to zero and unimplemented PMDx bits are set to one)

• CPU executing while(1)statement

• JTAG is disabled

2: Data in the “Typ” column is at 3.3V, +25ºC unless otherwise stated.

 2009-2012 Microchip Technology Inc.

DS70592D-page 247

PIC24HJXXXGPX06A/X08A/X10A

TABLE 24-9: DC CHARACTERISTICS: I/O PIN INPUT SPECIFICATIONS

Standard Operating Conditions: 3.0V to 3.6V

(unless otherwise stated)

Operating temperature -40°C  TA  +85°C for Industrial

-40°C  TA  +125°C for Extended

DC CHARACTERISTICS

Param

Symbol

No.

Characteristic

Min

Typ⁽¹⁾

Max

Units

Conditions

VIL

Input Low Voltage

I/O pins

DI10

DI15

DI16

DI18

DI19

VSS

—

0.2 VDD

0.3 VDD

0.8 V

V

MCLR

I/O Pins with OSC1 or SOSCI

I/O Pins with I²C

Input High Voltage

SMBus disabled

SMBus enabled

VIH

DI20

I/O Pins Not 5V Tolerant⁽⁴⁾

0.7 VDD

—

VDD

5.5

V

I/O Pins 5V Tolerant⁽⁴⁾

DI28

DI29

SDAx, SCLx

0.7 VDD

2.1

—

5.5

V

SMBus disabled

SMBus enabled

SDAx, SCLx

ICNPU

IIL

CNx Pull-up Current

DI30

50

250

400

A VDD = 3.3V, VPIN = VSS

Input Leakage Current^(2,3)

DI50

DI51

I/O Pins 5V Tolerant⁽⁴⁾

—

±2

±1

A VSS  VPIN  VDD,

Pin at high-impedance

I/O Pins Not 5V Tolerant⁽⁴⁾

A VSS  VPIN  VDD,

Pin at high-impedance,

-40°C  TA  +85°C

DI51a

DI51b

I/O Pins Not 5V Tolerant⁽⁴⁾

—

±2

A Shared with external reference

pins, -40°C  TA  +85°C

±3.5

A VSS  VPIN  VDD, Pin at

high-impedance,

-40°C  TA  +125°C

DI51c

I/O Pins Not 5V Tolerant⁽⁴⁾

—

±8

A Analog pins shared with

external reference pins,

-40°C  TA  +125°C

DI55

DI56

MCLR

OSC1

—

±2

A VSS VPIN VDD

A VSS VPIN VDD,

XT and HS modes

Note 1: Data in “Typ” column is at 3.3V, 25°C unless otherwise stated.

2: The leakage current on the MCLR pin is strongly dependent on the applied voltage level. The specified

levels represent normal operating conditions. Higher leakage current may be measured at different input

voltages.

3: Negative current is defined as current sourced by the pin.

4: See “Pin Diagrams” for a list of 5V tolerant pins.

5: VIL source < (VSS – 0.3). Characterized but not tested.

6: Non-5V tolerant pins VIH source > (VDD + 0.3), 5V tolerant pins VIH source > 5.5V. Characterized but not

tested.

7: Digital 5V tolerant pins cannot tolerate any “positive” input injection current from input sources > 5.5V.

8: Injection currents > | 0 | can affect the ADC results by approximately 4-6 counts.

9: Any number and/or combination of I/O pins not excluded under IICL or IICH conditions are permitted pro-

vided the mathematical “absolute instantaneous” sum of the input injection currents from all pins do not

exceed the specified limit. Characterized but not tested.

DS70592D-page 248

 2009-2012 Microchip Technology Inc.

PIC24HJXXXGPX06A/X08A/X10A

TABLE 24-9: DC CHARACTERISTICS: I/O PIN INPUT SPECIFICATIONS (CONTINUED)

Standard Operating Conditions: 3.0V to 3.6V

(unless otherwise stated)

Operating temperature -40°C  TA  +85°C for Industrial

DC CHARACTERISTICS

-40°C  TA  +125°C for Extended

Param

No.

Symbol

Characteristic

Min

Typ⁽¹⁾

Max

Units

Conditions

IICL

Input Low Injection Current

DI60a

All pins except VDD, VSS, AVDD,

AVSS, MCLR, VCAP, SOSCI,

SOSCO, and RB11

0

—

-5^(5,8)

mA

IICH

Input High Injection Current

DI60b

DI60c

All pins except VDD, VSS, AVDD,

AVSS, MCLR, VCAP, SOSCI,

SOSCO, RB11, and all 5V

tolerant pins⁽⁷⁾

0

—

+5^(6,7,8)mA

IICT

Total Input Injection Current

(sum of all I/O and control

pins)

-20⁽⁹⁾

+20⁽⁹⁾

mA Absolute instantaneous sum of

all ± input injection currents

from all I/O pins

( | IICL + | IICH | )  IICT

Note 1: Data in “Typ” column is at 3.3V, 25°C unless otherwise stated.

2: The leakage current on the MCLR pin is strongly dependent on the applied voltage level. The specified

levels represent normal operating conditions. Higher leakage current may be measured at different input

voltages.

3: Negative current is defined as current sourced by the pin.

4: See “Pin Diagrams” for a list of 5V tolerant pins.

5: VIL source < (VSS – 0.3). Characterized but not tested.

6: Non-5V tolerant pins VIH source > (VDD + 0.3), 5V tolerant pins VIH source > 5.5V. Characterized but not

tested.

7: Digital 5V tolerant pins cannot tolerate any “positive” input injection current from input sources > 5.5V.

8: Injection currents > | 0 | can affect the ADC results by approximately 4-6 counts.

9: Any number and/or combination of I/O pins not excluded under IICL or IICH conditions are permitted pro-

vided the mathematical “absolute instantaneous” sum of the input injection currents from all pins do not

exceed the specified limit. Characterized but not tested.

 2009-2012 Microchip Technology Inc.

DS70592D-page 249

PIC24HJXXXGPX06A/X08A/X10A

TABLE 24-10: DC CHARACTERISTICS: I/O PIN OUTPUT SPECIFICATIONS

Standard Operating Conditions: 3.0V to 3.6V

(unless otherwise stated)

Operating temperature -40°C  TA  +85°C for Industrial

-40°C  TA  +125°C for Extended

DC CHARACTERISTICS

Param

Symbol

No.

Characteristic

Min

Typ

Max Units

Conditions

Output Low Voltage

I/O Pins:

2x Sink Driver Pins - All pins not

defined by 4x or 8x driver pins

IOL  3 mA, VDD = 3.3V

—

0.4

V

Output Low Voltage

I/O Pins:

4x Sink Driver Pins - RA2, RA3,

RA9, RA10, RA14, RA15, RB0,

RB1, RB11, RF4, RF5, RG2, RG3

DO10 VOL

—

IOL  6 mA, VDD = 3.3V

Output Low Voltage

I/O Pins:

—

0.4

—

V

IOL  10 mA, VDD = 3.3V

IOL  -3 mA, VDD = 3.3V

8x Sink Driver Pins - OSC2, CLKO,

RC15

Output High Voltage

I/O Pins:

2x Source Driver Pins - All pins not

defined by 4x or 8x driver pins

2.4

Output High Voltage

I/O Pins:

4x Source Driver Pins - RA2, RA3,

RA9, RA10, RA14, RA15, RB0,

RB1, RB11, RF4, RF5, RG2, RG3

2.4

—

V

IOL  -6 mA, VDD = 3.3V

IOL  -10 mA, VDD = 3.3V

DO20 VOH

Output High Voltage

I/O Pins:

8x Source Driver Pins - OSC2,

CLKO, RC15

Output High Voltage

I/O Pins:

2x Source Driver Pins - All pins not

defined by 4x or 8x driver pins

IOH  -6 mA, VDD = 3.3V

See Note 1

1.5

2.0

3.0

1.5

2.0

3.0

1.5

2.0

3.0

—

IOH  -5 mA, VDD = 3.3V

See Note 1

V

IOH  -2 mA, VDD = 3.3V

See Note 1

Output High Voltage

IOH  -12 mA, VDD = 3.3V

See Note 1

4x Source Driver Pins - RA2, RA3,

RA9, RA10, RA14, RA15, RB0,

RB1, RB11, RF4, RF5, RG2, RG3

IOH  -11 mA, VDD = 3.3V

See Note 1

DO20A VOH1

IOH  -3 mA, VDD = 3.3V

See Note 1

Output High Voltage

8x Source Driver Pins - OSC2,

CLKO, RC15

IOH  -16 mA, VDD = 3.3V

See Note 1

IOH  -12 mA, VDD = 3.3V

See Note 1

IOH  -4 mA, VDD = 3.3V

See Note 1

Note 1: Parameters are characterized, but not tested.

DS70592D-page 250

 2009-2012 Microchip Technology Inc.

PIC24HJXXXGPX06A/X08A/X10A

TABLE 24-11: ELECTRICAL CHARACTERISTICS: BOR

Standard Operating Conditions: 3.0V to 3.6V

(unless otherwise stated)

Operating temperature -40°C  TA  +85°C for Industrial

-40°C  TA  +125°C for Extended

DC CHARACTERISTICS

Param.

Symbol

Characteristic⁽¹⁾

Min⁽¹⁾Typ Max⁽¹⁾Units

Conditions

BO10

VBOR

BOR Event on VDD transition high-to-low 2.40

—

2.55

V

VDD

Note 1: Parameters are for design guidance only and are not tested in manufacturing.

TABLE 24-12: DC CHARACTERISTICS: PROGRAM MEMORY

Standard Operating Conditions: 3.0V to 3.6V

(unless otherwise stated)

Operating temperature -40°C  TA  +85°C for Industrial

-40°C  TA  +125°C for Extended

DC CHARACTERISTICS

Param

Symbol

No.

Characteristic

Min Typ⁽¹⁾

Max

Units

Conditions

Program Flash Memory

Cell Endurance

D130

D131

EP

10,000

VMIN

—

E/W

V

VPR

VDD for Read

3.6

VMIN = Minimum operating

voltage

D132b VPEW

VDD for Self-Timed Write

Characteristic Retention

VMIN

20

—

10

—

3.6

—

V

VMIN = Minimum operating

voltage

D134

D135

TRETD

IDDP

Year Provided no other specifications are

violated

Supply Current during

Programming

—

mA

D136a TRW

D136b TRW

D137a TPE

D137b TPE

D138a TWW

D138b TWW

Row Write Time

1.32

1.28

20.1

19.5

42.3

41.1

1.74

1.79

26.5

27.3

55.9

57.6

ms TRW = 11064 FRC cycles,

TA = +85°C, See Note 2

Row Write Time

ms TRW = 11064 FRC cycles,

TA = +150°C, See Note 2

Page Erase Time

Word Write Cycle Time

ms TPE = 168517 FRC cycles,

TA = +85°C, See Note 2

ms TPE = 168517 FRC cycles,

TA = +150°C, See Note 2

µs TWW = 355 FRC cycles,

TA = +85°C, See Note 2

µs TWW = 355 FRC cycles,

TA = +150°C, See Note 2

Note 1: Data in “Typ” column is at 3.3V, 25°C unless otherwise stated.

2: Other conditions: FRC = 7.37 MHz, TUN<5:0> = b'011111(for Min), TUN<5:0> = b'100000(for Max).

This parameter depends on the FRC accuracy (see Table 24-19) and the value of the FRC Oscillator Tun-

ing register (see Register 9-4). For complete details on calculating the Minimum and Maximum time see

Section 5.3 “Programming Operations”.

TABLE 24-13: INTERNAL VOLTAGE REGULATOR SPECIFICATIONS

Standard Operating Conditions: 3.0V to 3.6V

(unless otherwise stated)

Operating temperature -40°C  TA  +85°C for Industrial

-40°C  TA  +125°C for Extended

Param. Symbol

Characteristics

Min

Typ

Max

Units

Comments

CEFC

External Filter Capacitor Value

4.7

10

—

F

Capacitor must be low

series resistance (< 5 Ohms)

 2009-2012 Microchip Technology Inc.

DS70592D-page 251

PIC24HJXXXGPX06A/X08A/X10A

24.2 AC Characteristics and Timing

Parameters

This section defines PIC24HJXXXGPX06A/X08A/

X10A AC characteristics and timing parameters.

TABLE 24-14: TEMPERATURE AND VOLTAGE SPECIFICATIONS – AC

Standard Operating Conditions: 3.0V to 3.6V

(unless otherwise stated)

AC CHARACTERISTICS

Operating temperature -40°C  TA  +85°C for Industrial

-40°C  TA  +125°C for Extended

Operating voltage VDD range as described in Table 24-1.

FIGURE 24-1:

LOAD CONDITIONS FOR DEVICE TIMING SPECIFICATIONS

Load Condition 1 – for all pins except OSC2

VDD/2

Load Condition 2 – for OSC2

CL

RL

VSS

CL

RL = 464

CL = 50 pF for all pins except OSC2

15 pF for OSC2 output

VSS

TABLE 24-15: CAPACITIVE LOADING REQUIREMENTS ON OUTPUT PINS

Param

Symbol

Characteristic

Min

Typ

Max Units

Conditions

No.

DO50 COSCO

OSC2/SOSCO pin

—

15

pF In XT and HS modes when

external clock is used to drive

OSC1

DO56 CIO

DO58 CB

All I/O pins and OSC2

SCLx, SDAx

—

50

pF EC mode

pF In I²C™ mode

400

DS70592D-page 252

 2009-2012 Microchip Technology Inc.

PIC24HJXXXGPX06A/X08A/X10A

FIGURE 24-2:

EXTERNAL CLOCK TIMING

Q1

Q2

Q3

Q4

Q1

Q2

Q3

Q4

OSC1

CLKO

OS20

OS30 OS30

OS31 OS31

OS25

OS41

OS40

TABLE 24-16: EXTERNAL CLOCK TIMING REQUIREMENTS

Standard Operating Conditions: 3.0V to 3.6V

(unless otherwise stated)

Operating temperature -40°C  TA  +85°C for Industrial

-40°C  TA  +125°C for Extended

AC CHARACTERISTICS

Param

Symbol

No.

Characteristic

Min

Typ⁽¹⁾

Max

Units

Conditions

OS10 FIN

External CLKI Frequency

(External clocks allowed only

in EC and ECPLL modes)

DC

—

40

MHz EC

Oscillator Crystal Frequency

3.5

10

—

10

40

33

MHz XT

MHz HS

kHz SOSC

OS20 TOSC

OS25 TCY

TOSC = 1/FOSC

Instruction Cycle Time⁽²⁾

12.5

25

—

DC

ns

—

OS30 TosL,

TosH

External Clock in (OSC1)

High or Low Time

0.375 x TOSC

0.625 x TOSC

EC

OS31 TosR,

TosF

External Clock in (OSC1)

Rise or Fall Time

—

20

ns

EC

OS40 TckR

OS41 TckF

OS42 GM

CLKO Rise Time⁽³⁾

CLKO Fall Time⁽³⁾

—

14

5.2

16

—

18

ns

—

External Oscillator

mA/V VDD = 3.3V

TA = +25ºC

Transconductance⁽⁴⁾

Note 1: Data in “Typ” column is at 3.3V, 25°C unless otherwise stated.

2: Instruction cycle period (TCY) equals two times the input oscillator time-base period. All specified values

are based on characterization data for that particular oscillator type under standard operating conditions

with the device executing code. Exceeding these specified limits may result in an unstable oscillator

operation and/or higher than expected current consumption. All devices are tested to operate at “min.”

values with an external clock applied to the OSC1/CLKI pin. When an external clock input is used, the

“max.” cycle time limit is “DC” (no clock) for all devices.

3: Measurements are taken in EC mode. The CLKO signal is measured on the OSC2 pin.

4: Data for this parameter is Preliminary. This parameter is characterized, but not tested in manufacturing.

 2009-2012 Microchip Technology Inc.

DS70592D-page 253

PIC24HJXXXGPX06A/X08A/X10A

TABLE 24-17: PLL CLOCK TIMING SPECIFICATIONS (VDD = 3.0V TO 3.6V)

Standard Operating Conditions: 3.0V to 3.6V (unless otherwise stated)

Operating temperature -40°C  TA  +85°C for Industrial

-40°C  TA  +125°C for Extended

AC CHARACTERISTICS

Param

Symbol

No.

Characteristic

Min

Typ⁽¹⁾

Max

Units

Conditions

OS50

FPLLI

PLL Voltage Controlled

Oscillator (VCO) Input

Frequency Range⁽²⁾

0.8

—

8

MHz ECPLL, HSPLL, XTPLL

modes

OS51

FSYS

On-Chip VCO System

Frequency

100

—

200

MHz

—

OS52

OS53

TLOCK

DCLK

PLL Start-up Time (Lock Time)

CLKO Stability (Jitter)

0.9

-3

1.5

0.5

3.1

3

mS

%

Measured over 100 ms

period

Note 1: Data in “Typ” column is at 3.3V, 25°C unless otherwise stated. Parameters are for design guidance only

and are not tested.

2: These parameters are characterized by similarity but are not tested in manufacturing. This specification is

based on clock cycle by clock cycle measurements. To calculate the effective jitter for individual time base

or communication clocks used by peripherals use the formula:

Peripheral Clock Jitter = DCLK / √(FOSC/Peripheral bit rate clock)

Example Only: Fosc = 80 MHz, DCLK = 3%, SPI bit rate clock, (i.e. SCK), is 5 MHz

SPI SCK Jitter = [ DCLK / √(80 MHz/5 MHz)] = [3%/ √16] = [3% / 4] = 0.75%

TABLE 24-18: AC CHARACTERISTICS: INTERNAL FRC ACCURACY

Standard Operating Conditions: 3.0V to 3.6V (unless otherwise stated)

AC CHARACTERISTICS

Operating temperature

-40°C  TA  +85°C for Industrial

-40°C  TA  +125°C for Extended

Param

No.

Characteristic

Min

Typ

Max

Units

Conditions

Internal FRC Accuracy @ 7.3728 MHz⁽¹⁾

F20a

F20b

FRC

-2

-5

—

+2

+5

%

-40°C  TA +85°C

-40°C  TA +125°C

VDD = 3.0-3.6V

Note 1: Frequency calibrated at 25°C and 3.3V. TUN bits can be used to compensate for temperature drift.

TABLE 24-19: INTERNAL LPRC ACCURACY

Standard Operating Conditions: 3.0V to 3.6V (unless otherwise stated)

AC CHARACTERISTICS

Operating temperature -40°C  TA  +85°C for Industrial

-40°C  TA  +125°C for Extended

Param

No.

Characteristic

Min

Typ

Max

Units

Conditions

LPRC @ 32.768 kHz⁽¹⁾

F21a LPRC

F21b LPRC

-30

-35

—

+30

+35

%

-40°C  TA +85°C

-40°C  TA +125°C

—

Note 1: Change of LPRC frequency as VDD changes.

DS70592D-page 254

 2009-2012 Microchip Technology Inc.

PIC24HJXXXGPX06A/X08A/X10A

FIGURE 24-3:

CLKO AND I/O TIMING CHARACTERISTICS

I/O Pin

(Input)

DI35

DI40

I/O Pin

(Output)

New Value

Old Value

DO31

DO32

Note: Refer to Figure 24-1 for load conditions.

TABLE 24-20: I/O TIMING REQUIREMENTS

Standard Operating Conditions: 3.0V to 3.6V

(unless otherwise stated)

Operating temperature -40°C  TA  +85°C for Industrial

-40°C  TA  +125°C for Extended

AC CHARACTERISTICS

Param

Symbol

No.

Characteristic

Min

Typ⁽¹⁾

Max

Units

Conditions

DO31

DO32

DI35

TIOR

TIOF

TINP

TRBP

Port Output Rise Time

—

20

2

10

—

25

—

ns

—

Port Output Fall Time

INTx Pin High or Low Time (input)

CNx High or Low Time (input)

ns

DI40

TCY

Note 1: Data in “Typ” column is at 3.3V, 25°C unless otherwise stated.

 2009-2012 Microchip Technology Inc.

DS70592D-page 255

PIC24HJXXXGPX06A/X08A/X10A

FIGURE 24-4:

RESET, WATCHDOG TIMER, OSCILLATOR START-UP TIMER AND POWER-UP

TIMER TIMING CHARACTERISTICS

VDD

SY12

MCLR

SY10

Internal

POR

SY11

SY30

PWRT

Time-out

OSC

Time-out

Internal

Reset

Watchdog

Timer

Reset

SY20

SY13

I/O Pins

SY35

FSCM

Delay

Note: Refer to Figure 24-1 for load conditions.

DS70592D-page 256

 2009-2012 Microchip Technology Inc.

PIC24HJXXXGPX06A/X08A/X10A

TABLE 24-21: RESET, WATCHDOG TIMER, OSCILLATOR START-UP TIMER, POWER-UP TIMER

TIMING REQUIREMENTS

Standard Operating Conditions: 3.0V to 3.6V

(unless otherwise stated)

Operating temperature -40°C  TA  +85°C for Industrial

AC CHARACTERISTICS

-40°C  TA  +125°C for Extended

Param

No.

Symbol

Characteristic⁽¹⁾

Min

Typ⁽²⁾

Max Units

Conditions

SY10

SY11

TMCL

MCLR Pulse Width (low)

Power-up Timer Period

2

—

s

-40°C to +85°C

TPWRT

—

2

4

ms

-40°C to +85°C

User programmable

8

16

32

64

128

SY12

SY13

TPOR

TIOZ

Power-on Reset Delay

3

10

30

s

-40°C to +85°C

—

I/O High-Impedance from

MCLR Low or Watchdog

Timer Reset

0.68

0.72

1.2

SY20

TWDT1

Watchdog Timer Time-out

Period

—

See Section 21.4 “Watchdog

Timer (WDT)” and LPRC

specification F21 (Table 24-19)

SY30

SY35

TOST

Oscillator Start-up Timer

Period

—

1024 TOSC

500

—

TOSC = OSC1 period

-40°C to +85°C

TFSCM

Fail-Safe Clock Monitor

Delay

900

s

Note 1: These parameters are characterized but not tested in manufacturing.

2: Data in “Typ” column is at 3.3V, 25°C unless otherwise stated.

 2009-2012 Microchip Technology Inc.

DS70592D-page 257

PIC24HJXXXGPX06A/X08A/X10A

FIGURE 24-5:

TIMER1, 2, 3, 4, 5, 6, 7, 8 AND 9 EXTERNAL CLOCK TIMING CHARACTERISTICS

TxCK

Tx11

Tx10

Tx15

Tx20

OS60

TMRx

Note: Refer to Figure 24-1 for load conditions.

TABLE 24-22: TIMER1 EXTERNAL CLOCK TIMING REQUIREMENTS⁽¹⁾

Standard Operating Conditions: 3.0V to 3.6V

(unless otherwise stated)

Operating temperature -40°C  TA  +85°C for Industrial

-40°C  TA  +125°C for Extended

AC CHARACTERISTICS

Param

Symbol

No.

Characteristic

Min

Typ

Max

Units

Conditions

TA10

TA11

TTXH

TTXL

TxCK High Time

TxCK Low Time

Synchronous,

no prescaler

TCY + 20

—

ns

Must also meet

parameter TA15

Synchronous, (TCY + 20)/N

with prescaler

—

ns

Asynchronous

20

—

ns

Synchronous, (TCY + 20)/N

no prescaler

Must also meet

parameter TA15

Synchronous,

with prescaler

20

—

ns

—

N = prescale

value

(1,8,64,256)

Asynchronous

TA15

TTXP

TxCK Input Period Synchronous,

no prescaler

2TCY + 40

—

Synchronous,

with prescaler

Greater of:

40 ns or

(2TCY + 40)/

N

N = prescale

value

(1, 8, 64, 256)

Asynchronous

40

—

ns

—

OS60

TA20

Ft1

SOSC1/T1CK Oscillator Input

frequency Range (oscillator

enabled by setting TCS bit

(T1CON<1>))

DC

50

kHz

TCKEXTMRL Delay from External TxCK Clock

Edge to Timer Increment

0.75TCY+40

—

1.75TCY

+40

ns

—

Note 1: Timer1 is a Type A.

DS70592D-page 258

 2009-2012 Microchip Technology Inc.

PIC24HJXXXGPX06A/X08A/X10A

TABLE 24-23: TIMER2, 4, 6 AND 8 EXTERNAL CLOCK TIMING REQUIREMENTS

Standard Operating Conditions: 3.0V to 3.6V

(unless otherwise stated)

Operating temperature -40°C  TA  +85°C for Industrial

-40°C  TA  +125°C for Extended

AC CHARACTERISTICS

Param

Symbol

No.

Characteristic⁽¹⁾

Min

Typ

Max

Units

Conditions

TB10 TtxH

TB11 TtxL

TB15 TtxP

TxCK High Synchronous

Time mode

Greater of:

20 or

(TCY + 20)/N

—

ns Must also meet

parameter TB15

N = prescale

value

(1, 8, 64, 256)

TxCK Low Synchronous

Time mode

Greater of:

20 or

(TCY + 20)/N

—

ns

Must also meet

parameter TB15

N = prescale

value

(1, 8, 64, 256)

TxCK Input Synchronous

Period mode

Greater of:

40 or

(2 TCY + 40)/N

—

ns N = prescale

value

(1, 8, 64, 256)

TB20 TCKEXTMRL Delay from External TxCK

0.75 TCY + 40

1.75 TCY + 40 ns

—

Clock Edge to Timer Incre-

ment

Note 1: These parameters are characterized, but are not tested in manufacturing.

TABLE 24-24: TIMER3, 5, 7 AND 9 EXTERNAL CLOCK TIMING REQUIREMENTS

Standard Operating Conditions: 3.0V to 3.6V

(unless otherwise stated)

Operating temperature -40°C  TA  +85°C for Industrial

AC CHARACTERISTICS

-40°C  TA  +125°C for Extended

Param

No.

Symbol

Characteristic⁽¹⁾

Min

Typ

Max

Units

Conditions

TC10 TtxH

TC11 TtxL

TC15 TtxP

TxCK High

Time

Synchronous

TCY + 20

—

ns

Must also meet

parameter TC15

TxCK Low

Time

TCY + 20

—

ns

Must also meet

parameter TC15

TxCK Input

Period

Synchronous,

with prescaler

2 TCY + 40

N = prescale

value

(1, 8, 64, 256)

TC20 TCKEXTMRL Delay from External TxCK

0.75 TCY + 40

—

1.75 TCY + 40

ns

—

Clock Edge to Timer Incre-

ment

Note 1: These parameters are characterized, but are not tested in manufacturing.

 2009-2012 Microchip Technology Inc.

DS70592D-page 259

PIC24HJXXXGPX06A/X08A/X10A

FIGURE 24-6:

INPUT CAPTURE (CAPx) TIMING CHARACTERISTICS

ICx

IC10

IC11

IC15

Note: Refer to Figure 24-1 for load conditions.

TABLE 24-25: INPUT CAPTURE TIMING REQUIREMENTS

Standard Operating Conditions: 3.0V to 3.6V

(unless otherwise stated)

Operating temperature -40°C  TA  +85°C for Industrial

-40°C  TA  +125°C for Extended

AC CHARACTERISTICS

Param

Symbol

No.

Characteristic⁽¹⁾

Min

Max

Units

Conditions

IC10

IC11

IC15

TccL

TccH

TccP

ICx Input Low Time No Prescaler

With Prescaler

0.5 TCY + 20

10

—

ns

—

ICx Input High Time No Prescaler

With Prescaler

0.5 TCY + 20

10

—

ICx Input Period

(TCY + 40)/N

N = prescale

value (1, 4, 16)

Note 1: These parameters are characterized but not tested in manufacturing.

FIGURE 24-7:

OUTPUT COMPARE MODULE (OCx) TIMING CHARACTERISTICS

OCx

(Output Compare

or PWM Mode)

OC10

OC11

Note: Refer to Figure 24-1 for load conditions.

TABLE 24-26: OUTPUT COMPARE MODULE TIMING REQUIREMENTS

Standard Operating Conditions: 3.0V to 3.6V

(unless otherwise stated)

AC CHARACTERISTICS

Operating temperature -40°C  TA  +85°C for Industrial

-40°C  TA  +125°C for Extended

Param

Symbol

No.

Characteristic⁽¹⁾

Min

Typ

Max

Units

Conditions

OC10 TccF

OC11 TccR

OCx Output Fall Time

OCx Output Rise Time

—

ns

See parameter D032

See parameter D031

Note 1: These parameters are characterized but not tested in manufacturing.

DS70592D-page 260

 2009-2012 Microchip Technology Inc.

PIC24HJXXXGPX06A/X08A/X10A

FIGURE 24-8:

OCFA

OC/PWM MODULE TIMING CHARACTERISTICS

OC20

OC15

OCx

Tri-state

Active

TABLE 24-27: SIMPLE OC/PWM MODE TIMING REQUIREMENTS

Standard Operating Conditions: 3.0V to 3.6V

(unless otherwise stated)

Operating temperature -40°C  TA  +85°C for Industrial

-40°C  TA  +125°C for Extended

AC CHARACTERISTICS

Param

Symbol

No.

Characteristic⁽¹⁾

Min

Typ

Max

Units

Conditions

OC15

TFD

Fault Input to PWM I/O

Change

—

TCY+20

ns

—

OC20

TFLT

Fault Input Pulse-Width

TCY+20

—

ns

—

Note 1: These parameters are characterized but not tested in manufacturing.

 2009-2012 Microchip Technology Inc.

DS70592D-page 261

PIC24HJXXXGPX06A/X08A/X10A

TABLE 24-28: SPIx MAXIMUM DATA/CLOCK RATE SUMMARY

Standard Operating Conditions: 3.0V to 3.6V

(unless otherwise stated)

Operating temperature -40°C  TA  +85°C for Industrial

-40°C  TA  +125°C for Extended

AC CHARACTERISTICS

Master

Transmit Only

(Half-Duplex)

Master

Slave

Maximum

Data Rate

Transmit/Receive Transmit/Receive

(Full-Duplex)

CKE

CKP

SMP

(Full-Duplex)

15 MHz

10 MHz

15 MHz

11 MHz

15 MHz

11 MHz

Table 24-29

—

0,1

1

0,1

0

0,1

1

—

Table 24-30

—

Table 24-31

—

0

1

—

Table 24-32

Table 24-33

Table 24-34

Table 24-35

1

0

1

0

1

0

FIGURE 24-9:

SPIx MASTER MODE (HALF-DUPLEX, TRANSMIT ONLY CKE = 0) TIMING

CHARACTERISTICS

SCKx

(CKP = 0)

SP10

SP21

SP20

SCKx

(CKP = 1)

SP35

SP21

LSb

Bit 14 - - - - - -1

MSb

SDOx

SP30, SP31

Note: Refer to Figure 24-1 for load conditions.

DS70592D-page 262

 2009-2012 Microchip Technology Inc.

PIC24HJXXXGPX06A/X08A/X10A

FIGURE 24-10:

SPIx MASTER MODE (HALF-DUPLEX, TRANSMIT ONLY CKE = 1) TIMING

CHARACTERISTICS

SP36

SCKx

(CKP = 0)

SP10

SP21

SP20

SP21

SCKx

(CKP = 1)

SP35

Bit 14 - - - - - -1

SP30, SP31

MSb

LSb

SDOx

Note: Refer to Figure 24-1 for load conditions.

TABLE 24-29: SPIx MASTER MODE (HALF-DUPLEX, TRANSMIT ONLY) TIMING REQUIREMENTS

Standard Operating Conditions: 3.0V to 3.6V

(unless otherwise stated)

Operating temperature -40°C  TA  +85°C for Industrial

AC CHARACTERISTICS

-40°C  TA  +125°C for Extended

Param

No.

Symbol

TscP

Characteristic⁽¹⁾

Min

Typ⁽²⁾

Max

Units

Conditions

See Note 3

SP10

SP20

Maximum SCK Frequency

SCKx Output Fall Time

—

15

—

MHz

ns

TscF

TscR

TdoF

TdoR

See parameter DO32

and Note 4

SP21

SP30

SP31

SP35

SP36

SCKx Output Rise Time

—

30

—

6

—

20

—

ns

See parameter DO31

and Note 4

SDOx Data Output Fall Time

SDOx Data Output Rise Time

See parameter DO32

and Note 4

See parameter DO31

and Note 4

TscH2doV, SDOx Data Output Valid after

TscL2doV SCKx Edge

—

TdiV2scH, SDOx Data Output Setup to

—

TdiV2scL

First SCKx Edge

Note 1: These parameters are characterized, but are not tested in manufacturing.

2: Data in “Typ” column is at 3.3V, 25°C unless otherwise stated.

3: The minimum clock period for SCKx is 66.7 ns. Therefore, the clock generated in Master mode must not

violate this specification.

4: Assumes 50 pF load on all SPIx pins.

 2009-2012 Microchip Technology Inc.

DS70592D-page 263

PIC24HJXXXGPX06A/X08A/X10A

FIGURE 24-11:

SPIx MASTER MODE (FULL-DUPLEX, CKE = 1, CKP = X, SMP = 1) TIMING

CHARACTERISTICS

SP36

SCKx

(CKP = 0)

SP10

SP21

SP20

SP21

SCKx

(CKP = 1)

SP35

Bit 14 - - - - - -1

SP30, SP31

MSb

LSb

SDOx

SDIx

SP40

MSb In

SP41

LSb In

Bit 14 - - - -1

Note: Refer to Figure 24-1 for load conditions.

TABLE 24-30: SPIx MASTER MODE (FULL-DUPLEX, CKE = 1, CKP = x, SMP = 1) TIMING

REQUIREMENTS

Standard Operating Conditions: 3.0V to 3.6V

(unless otherwise stated)

Operating temperature -40°C  TA  +85°C for Industrial

AC CHARACTERISTICS

-40°C  TA  +125°C for Extended

Param

No.

Symbol

TscP

Characteristic⁽¹⁾

Min

Typ⁽²⁾

Max

Units

Conditions

See Note 3

SP10

SP20

Maximum SCK Frequency

SCKx Output Fall Time

—

10

—

MHz

ns

TscF

TscR

TdoF

TdoR

See parameter DO32

and Note 4

SP21

SP30

SP31

SP35

SP36

SP40

SP41

SCKx Output Rise Time

—

30

—

6

—

20

—

ns

See parameter DO31

and Note 4

SDOx Data Output Fall Time

SDOx Data Output Rise Time

See parameter DO32

and Note 4

See parameter DO31

and Note 4

TscH2doV, SDOx Data Output Valid after

TscL2doV SCKx Edge

—

TdoV2sc, SDOx Data Output Setup to

TdoV2scL First SCKx Edge

—

TdiV2scH, Setup Time of SDIx Data

TdiV2scL Input to SCKx Edge

TscH2diL, Hold Time of SDIx Data Input

TscL2diL

to SCKx Edge

Note 1: These parameters are characterized, but are not tested in manufacturing.

2: Data in “Typ” column is at 3.3V, 25°C unless otherwise stated.

3: The minimum clock period for SCKx is 100 ns. The clock generated in Master mode must not violate this

specification.

4: Assumes 50 pF load on all SPIx pins.

DS70592D-page 264

 2009-2012 Microchip Technology Inc.

PIC24HJXXXGPX06A/X08A/X10A

FIGURE 24-12:

SPIx MASTER MODE (FULL-DUPLEX, CKE = 0, CKP = X, SMP = 1) TIMING

CHARACTERISTICS

SCKx

(CKP = 0)

SP10

SP21

SP20

SCKx

(CKP = 1)

SP35

SP21

LSb

Bit 14 - - - - - -1

MSb

SDOx

SDIx

SP30, SP31

LSb In

MSb In

Bit 14 - - - -1

SP40

SP41

Note: Refer to Figure 24-1 for load conditions.

TABLE 24-31: SPIx MASTER MODE (FULL-DUPLEX, CKE = 0, CKP = x, SMP = 1) TIMING

REQUIREMENTS

Standard Operating Conditions: 2.4V to 3.6V

(unless otherwise stated)

Operating temperature -40°C  TA  +85°C for Industrial

AC CHARACTERISTICS

-40°C  TA  +125°C for Extended

Param

No.

Symbol

TscP

Characteristic⁽¹⁾

Min

Typ⁽²⁾

Max

Units

Conditions

-40ºC to +125ºC and

SP10

Maximum SCK Frequency

—

10

MHz

see Note 3

SP20

SP21

SP30

SP31

SP35

SP36

SP40

SP41

TscF

TscR

TdoF

TdoR

SCKx Output Fall Time

—

30

—

6

—

20

—

ns

See parameter DO32

and Note 4

SCKx Output Rise Time

SDOx Data Output Fall Time

SDOx Data Output Rise Time

See parameter DO31

and Note 4

See parameter DO32

and Note 4

See parameter DO31

and Note 4

TscH2doV, SDOx Data Output Valid after

TscL2doV SCKx Edge

—

TdoV2scH, SDOx Data Output Setup to

TdoV2scL First SCKx Edge

—

TdiV2scH, Setup Time of SDIx Data

TdiV2scL Input to SCKx Edge

TscH2diL, Hold Time of SDIx Data Input

TscL2diL

to SCKx Edge

Note 1: These parameters are characterized, but are not tested in manufacturing.

2: Data in “Typ” column is at 3.3V, 25°C unless otherwise stated.

3: The minimum clock period for SCKx is 100 ns. The clock generated in Master mode must not violate this

specification.

4: Assumes 50 pF load on all SPIx pins.

 2009-2012 Microchip Technology Inc.

DS70592D-page 265

PIC24HJXXXGPX06A/X08A/X10A

FIGURE 24-13:

SPIx SLAVE MODE (FULL-DUPLEX, CKE = 1, CKP = 0, SMP = 0) TIMING

CHARACTERISTICS

SP60

SSx

SP52

SP50

SCKx

(CKP = 0)

SP70

SP72

SP73

SCKx

(CKP = 1)

SP35

SP72

LSb

MSb

Bit 14 - - - - - -1

SDOx

SDIx

SP30,SP31

Bit 14 - - - -1

SP51

MSb In

SP41

LSb In

SP40

Note: Refer to Figure 24-1 for load conditions.

DS70592D-page 266

 2009-2012 Microchip Technology Inc.

PIC24HJXXXGPX06A/X08A/X10A

TABLE 24-32: SPIx SLAVE MODE (FULL-DUPLEX, CKE = 1, CKP = 0, SMP = 0) TIMING

REQUIREMENTS

Standard Operating Conditions: 2.4V to 3.6V

(unless otherwise stated)

Operating temperature -40°C  TA  +85°C for Industrial

AC CHARACTERISTICS

-40°C  TA  +125°C for Extended

Param

No.

Symbol

TscP

Characteristic⁽¹⁾

Min

Typ⁽²⁾Max Units

Conditions

See Note 3

SP70

SP72

Maximum SCK Input Frequency

SCKx Input Fall Time

—

15

—

MHz

ns

TscF

TscR

TdoF

TdoR

See parameterDO32

and Note 4

SP73

SP30

SP31

SP35

SP36

SP40

SCKx Input Rise Time

—

30

—

6

—

20

—

ns

See parameterDO31

and Note 4

SDOx Data Output Fall Time

SDOx Data Output Rise Time

See parameterDO32

and Note 4

See parameter DO31

and Note 4

TscH2doV, SDOx Data Output Valid after

TscL2doV SCKx Edge

—

TdoV2scH, SDOx Data Output Setup to

TdoV2scL First SCKx Edge

—

TdiV2scH, Setup Time of SDIx Data Input

TdiV2scL

TscH2diL, Hold Time of SDIx Data Input

TscL2diL to SCKx Edge

to SCKx Edge

SP41

SP50

SP51

SP52

SP60

30

—

50

—

50

ns

—

TssL2scH, SSx  to SCKx  or SCKx Input

TssL2scL

120

TssH2doZ SSx  to SDOx Output

10

1.5 TCY + 40

—

High-Impedance⁽⁴⁾

See Note 4

TscH2ssH SSx after SCKx Edge

TscL2ssH

TssL2doV SDOx Data Output Valid after

SSx Edge

—

Note 1: These parameters are characterized, but are not tested in manufacturing.

2: Data in “Typ” column is at 3.3V, 25°C unless otherwise stated.

3: The minimum clock period for SCKx is 66.7 ns. Therefore, the SCK clock generated by the Master must

not violate this specificiation.

4: Assumes 50 pF load on all SPIx pins.

 2009-2012 Microchip Technology Inc.

DS70592D-page 267

PIC24HJXXXGPX06A/X08A/X10A

FIGURE 24-14:

SPIx SLAVE MODE (FULL-DUPLEX, CKE = 1, CKP = 1, SMP = 0) TIMING

CHARACTERISTICS

SP60

SSx

SP52

SP50

SCKx

(CKP = 0)

SP72

SP73

SP70

SP73

SCKx

(CKP = 1)

SP35

SP72

LSb

SP52

Bit 14 - - - - - -1

MSb

SDOx

SDIx

SP30,SP31

Bit 14 - - - -1

SP51

MSb In

SP41

LSb In

SP40

Note: Refer to Figure 24-1 for load conditions.

DS70592D-page 268

 2009-2012 Microchip Technology Inc.

PIC24HJXXXGPX06A/X08A/X10A

TABLE 24-33: SPIx SLAVE MODE (FULL-DUPLEX, CKE = 1, CKP = 1, SMP = 0) TIMING

REQUIREMENTS

Standard Operating Conditions: 2.4V to 3.6V

(unless otherwise stated)

Operating temperature -40°C  TA  +85°C for Industrial

AC CHARACTERISTICS

-40°C  TA  +125°C for Extended

Param

No.

Symbol

TscP

Characteristic⁽¹⁾

Min

Typ⁽²⁾Max Units

Conditions

See Note 3

SP70

SP72

Maximum SCK Input Frequency

SCKx Input Fall Time

—

11

—

MHz

ns

TscF

TscR

TdoF

TdoR

See parameterDO32

and Note 4

SP73

SP30

SP31

SP35

SP36

SP40

SP41

SCKx Input Rise Time

—

30

—

6

—

20

—

ns

See parameterDO31

and Note 4

SDOx Data Output Fall Time

SDOx Data Output Rise Time

See parameterDO32

and Note 4

See parameter DO31

and Note 4

TscH2doV, SDOx Data Output Valid after

TscL2doV SCKx Edge

—

TdoV2scH, SDOx Data Output Setup to

TdoV2scL First SCKx Edge

—

TdiV2scH, Setup Time of SDIx Data Input

TdiV2scL

TscH2diL, Hold Time of SDIx Data Input

TscL2diL to SCKx Edge

to SCKx Edge

SP50

SP51

SP52

SP60

TssL2scH, SSx  to SCKx  or SCKx Input

TssL2scL

120

—

50

—

50

ns

—

TssH2doZ SSx  to SDOx Output

10

1.5 TCY + 40

—

High-Impedance⁽⁴⁾

See Note 4

TscH2ssH SSx after SCKx Edge

TscL2ssH

TssL2doV SDOx Data Output Valid after

SSx Edge

—

Note 1: These parameters are characterized, but are not tested in manufacturing.

2: Data in “Typ” column is at 3.3V, 25°C unless otherwise stated.

3: The minimum clock period for SCKx is 91 ns. Therefore, the SCK clock generated by the Master must not

violate this specificiation.

4: Assumes 50 pF load on all SPIx pins.

 2009-2012 Microchip Technology Inc.

DS70592D-page 269

PIC24HJXXXGPX06A/X08A/X10A

FIGURE 24-15:

SPIx SLAVE MODE (FULL-DUPLEX CKE = 0, CKP = 1, SMP = 0) TIMING

CHARACTERISTICS

SSX

SP52

SP50

SCKX

(CKP = 0)

SP70

SP72

SP73

SP72

SCKX

(CKP = 1)

SP73

LSb

SP35

MSb

Bit 14 - - - - - -1

SDOX

SDIX

SP51

SP30,SP31

Bit 14 - - - -1

MSb In

LSb In

SP41

SP40

Note: Refer to Figure 24-1 for load conditions.

DS70592D-page 270

 2009-2012 Microchip Technology Inc.

PIC24HJXXXGPX06A/X08A/X10A

TABLE 24-34: SPIx SLAVE MODE (FULL-DUPLEX, CKE = 0, CKP = 1, SMP = 0) TIMING

REQUIREMENTS

Standard Operating Conditions: 2.4V to 3.6V

(unless otherwise stated)

Operating temperature -40°C  TA  +85°C for Industrial

AC CHARACTERISTICS

-40°C  TA  +125°C for Extended

Param

No.

Symbol

TscP

Characteristic⁽¹⁾

Min

Typ⁽²⁾Max Units

Conditions

See Note 3

SP70

SP72

Maximum SCK Input Frequency

SCKx Input Fall Time

—

15

—

MHz

ns

TscF

TscR

TdoF

TdoR

See parameterDO32

and Note 4

SP73

SP30

SP31

SP35

SP36

SP40

SP41

SCKx Input Rise Time

—

30

—

6

—

20

—

ns

See parameterDO31

and Note 4

SDOx Data Output Fall Time

SDOx Data Output Rise Time

See parameterDO32

and Note 4

See parameter DO31

and Note 4

TscH2doV, SDOx Data Output Valid after

TscL2doV SCKx Edge

—

TdoV2scH, SDOx Data Output Setup to

TdoV2scL First SCKx Edge

—

TdiV2scH, Setup Time of SDIx Data Input

TdiV2scL

TscH2diL, Hold Time of SDIx Data Input

TscL2diL to SCKx Edge

to SCKx Edge

SP50

SP51

SP52

TssL2scH, SSx  to SCKx  or SCKx Input

TssL2scL

120

10

—

50

—

ns

—

TssH2doZ SSx  to SDOx Output

High-Impedance⁽⁴⁾

See Note 4

TscH2ssH SSx after SCKx Edge

TscL2ssH

1.5 TCY + 40

Note 1: These parameters are characterized, but are not tested in manufacturing.

2: Data in “Typ” column is at 3.3V, 25°C unless otherwise stated.

3: The minimum clock period for SCKx is 66.7 ns. Therefore, the SCK clock generated by the Master must

not violate this specificiation.

4: Assumes 50 pF load on all SPIx pins.

 2009-2012 Microchip Technology Inc.

DS70592D-page 271

PIC24HJXXXGPX06A/X08A/X10A

FIGURE 24-16:

SPIx SLAVE MODE (FULL-DUPLEX, CKE = 0, CKP = 0, SMP = 0) TIMING

CHARACTERISTICS

SSX

SP52

SP50

SCKX

(CKP = 0)

SP70

SP72

SP73

SP72

SCKX

(CKP = 1)

SP73

LSb

SP35

MSb

Bit 14 - - - - - -1

SDOX

SDIX

SP51

SP30,SP31

Bit 14 - - - -1

MSb In

LSb In

SP41

SP40

Note: Refer to Figure 24-1 for load conditions.

DS70592D-page 272

 2009-2012 Microchip Technology Inc.

PIC24HJXXXGPX06A/X08A/X10A

TABLE 24-35: SPIx SLAVE MODE (FULL-DUPLEX, CKE = 0, CKP = 0, SMP = 0) TIMING

REQUIREMENTS

Standard Operating Conditions: 2.4V to 3.6V

(unless otherwise stated)

Operating temperature -40°C  TA  +85°C for Industrial

AC CHARACTERISTICS

-40°C  TA  +125°C for Extended

Param

No.

Symbol

TscP

Characteristic⁽¹⁾

Min

Typ⁽²⁾Max Units

Conditions

See Note 3

SP70

SP72

Maximum SCK Input Frequency

SCKx Input Fall Time

—

11

—

MHz

ns

TscF

TscR

TdoF

TdoR

See parameterDO32

and Note 4

SP73

SP30

SP31

SP35

SP36

SP40

SP41

SCKx Input Rise Time

—

30

—

6

—

20

—

ns

See parameterDO31

and Note 4

SDOx Data Output Fall Time

SDOx Data Output Rise Time

See parameterDO32

and Note 4

See parameter DO31

and Note 4

TscH2doV, SDOx Data Output Valid after

TscL2doV SCKx Edge

—

TdoV2scH, SDOx Data Output Setup to

TdoV2scL First SCKx Edge

—

TdiV2scH, Setup Time of SDIx Data Input

TdiV2scL

TscH2diL, Hold Time of SDIx Data Input

TscL2diL to SCKx Edge

to SCKx Edge

SP50

SP51

SP52

TssL2scH, SSx  to SCKx  or SCKx Input

TssL2scL

120

10

—

50

—

ns

—

TssH2doZ SSx  to SDOx Output

High-Impedance⁽⁴⁾

See Note 4

TscH2ssH SSx after SCKx Edge

TscL2ssH

1.5 TCY + 40

Note 1: These parameters are characterized, but are not tested in manufacturing.

2: Data in “Typ” column is at 3.3V, 25°C unless otherwise stated.

3: The minimum clock period for SCKx is 91 ns. Therefore, the SCK clock generated by the Master must not

violate this specificiation.

4: Assumes 50 pF load on all SPIx pins.

 2009-2012 Microchip Technology Inc.

DS70592D-page 273

PIC24HJXXXGPX06A/X08A/X10A

FIGURE 24-17:

I2Cx BUS START/STOP BITS TIMING CHARACTERISTICS (MASTER MODE)

SCLx

IM31

IM34

IM30

IM33

SDAx

Stop

Condition

Start

Condition

Note: Refer to Figure 24-1 for load conditions.

FIGURE 24-18:

I2Cx BUS DATA TIMING CHARACTERISTICS (MASTER MODE)

IM20

IM21

IM11

IM10

SCLx

IM11

IM26

IM10

IM33

IM25

SDAx

In

IM45

IM40

SDAx

Out

Note: Refer to Figure 24-1 for load conditions.

DS70592D-page 274

 2009-2012 Microchip Technology Inc.

PIC24HJXXXGPX06A/X08A/X10A

TABLE 24-36: I2Cx BUS DATA TIMING REQUIREMENTS (MASTER MODE)

Standard Operating Conditions: 3.0V to 3.6V

(unless otherwise stated)

Operating temperature -40°C  TA  +85°C for Industrial

-40°C  TA  +125°C for Extended

AC CHARACTERISTICS

Param

Symbol

No.

Characteristic

Min⁽¹⁾

Max

Units

Conditions

IM10

IM11

IM20

IM21

IM25

IM26

IM30

IM31

IM33

IM34

IM40

IM45

TLO:SCL Clock Low Time 100 kHz mode TCY/2 (BRG + 1)

400 kHz mode TCY/2 (BRG + 1)

—

s

ns

s

ns

s

pF

ns

—

1 MHz mode⁽²⁾TCY/2 (BRG + 1)

—

THI:SCL Clock High Time 100 kHz mode TCY/2 (BRG + 1)

400 kHz mode TCY/2 (BRG + 1)

—

1 MHz mode⁽²⁾TCY/2 (BRG + 1)

—

TF:SCL

TR:SCL

SDAx and SCLx 100 kHz mode

—

300

100

1000

300

—

CB is specified to be

from 10 to 400 pF

Fall Time

400 kHz mode

1 MHz mode⁽²⁾

20 + 0.1 CB

—

SDAx and SCLx 100 kHz mode

—

CB is specified to be

from 10 to 400 pF

Rise Time

400 kHz mode

1 MHz mode⁽²⁾

100 kHz mode

400 kHz mode

1 MHz mode⁽²⁾

100 kHz mode

400 kHz mode

1 MHz mode⁽²⁾

20 + 0.1 CB

—

250

100

40

0

TSU:DAT Data Input

Setup Time

—

THD:DAT Data Input

Hold Time

—

0

0.9

—

0.2

TSU:STA Start Condition 100 kHz mode TCY/2 (BRG + 1)

—

Only relevant for

Repeated Start

condition

Setup Time

400 kHz mode TCY/2 (BRG + 1)

1 MHz mode⁽²⁾TCY/2 (BRG + 1)

—

THD:STA Start Condition 100 kHz mode TCY/2 (BRG + 1)

—

After this period the

first clock pulse is

generated

Hold Time

400 kHz mode TCY/2 (BRG + 1)

1 MHz mode⁽²⁾TCY/2 (BRG + 1)

—

TSU:STO Stop Condition 100 kHz mode TCY/2 (BRG + 1)

—

Setup Time

400 kHz mode TCY/2 (BRG + 1)

1 MHz mode⁽²⁾TCY/2 (BRG + 1)

—

THD:STO Stop Condition

Hold Time

100 kHz mode TCY/2 (BRG + 1)

400 kHz mode TCY/2 (BRG + 1)

1 MHz mode⁽²⁾TCY/2 (BRG + 1)

—

TAA:SCL Output Valid

From Clock

100 kHz mode

400 kHz mode

1 MHz mode⁽²⁾

—

3500

1000

400

—

TBF:SDA Bus Free Time 100 kHz mode

400 kHz mode

4.7

1.3

0.5

—

Time the bus must be

free before a new

transmission can start

—

1 MHz mode⁽²⁾

—

IM50

IM51

CB

Bus Capacitive Loading

Pulse Gobbler Delay

400

390

—

TPGD

65

See Note 3

Note 1: BRG is the value of the I²C Baud Rate Generator. Refer to Section 19. “Inter-Integrated Circuit™

(I²C™)” (DS70195) in the “PIC24H Family Reference Manual”. Please see the Microchip web site

(www.microchip.com) for the latest PIC24H Family Reference Manual chapters.

2: Maximum pin capacitance = 10 pF for all I2Cx pins (for 1 MHz mode only).

3: Typical value for this parameter is 130 ns.

 2009-2012 Microchip Technology Inc.

DS70592D-page 275

PIC24HJXXXGPX06A/X08A/X10A

FIGURE 24-19:

I2Cx BUS START/STOP BITS TIMING CHARACTERISTICS (SLAVE MODE)

SCLx

IS34

IS31

IS30

IS33

SDAx

Stop

Condition

Start

Condition

FIGURE 24-20:

I2Cx BUS DATA TIMING CHARACTERISTICS (SLAVE MODE)

IS20

IS21

IS11

IS10

SCLx

IS30

IS26

IS31

IS33

IS25

SDAx

In

IS45

IS40

SDAx

Out

DS70592D-page 276

 2009-2012 Microchip Technology Inc.

PIC24HJXXXGPX06A/X08A/X10A

TABLE 24-37: I2Cx BUS DATA TIMING REQUIREMENTS (SLAVE MODE)

Standard Operating Conditions: 3.0V to 3.6V

(unless otherwise stated)

Operating temperature -40°C  TA  +85°C for Industrial

-40°C  TA  +125°C for Extended

AC CHARACTERISTICS

Param. Symbol

Characteristic

Min

Max

Units

Conditions

IS10

IS11

TLO:SCL Clock Low Time 100 kHz mode

4.7

—

s

Device must operate at a

minimum of 1.5 MHz

400 kHz mode

1.3

—

s

Device must operate at a

minimum of 10 MHz

1 MHz mode⁽¹⁾

0.5

4.0

—

s

—

THI:SCL Clock High Time 100 kHz mode

Device must operate at a

minimum of 1.5 MHz

400 kHz mode

1 MHz mode⁽¹⁾

0.6

—

s

Device must operate at a

minimum of 10 MHz

0.5

—

300

100

1000

300

—

s

ns

s

ns

s

pF

—

IS20

IS21

IS25

IS26

IS30

IS31

IS33

IS34

IS40

IS45

IS50

TF:SCL

TR:SCL

SDAx and SCLx 100 kHz mode

—

CB is specified to be from

10 to 400 pF

Fall Time

400 kHz mode

1 MHz mode⁽¹⁾

20 + 0.1 CB

—

SDAx and SCLx 100 kHz mode

CB is specified to be from

10 to 400 pF

Rise Time

400 kHz mode

1 MHz mode⁽¹⁾

20 + 0.1 CB

—

TSU:DAT Data Input

Setup Time

100 kHz mode

400 kHz mode

1 MHz mode⁽¹⁾

100 kHz mode

400 kHz mode

1 MHz mode⁽¹⁾

100 kHz mode

400 kHz mode

1 MHz mode⁽¹⁾

100 kHz mode

400 kHz mode

1 MHz mode⁽¹⁾

100 kHz mode

400 kHz mode

1 MHz mode⁽¹⁾

100 kHz mode

400 kHz mode

1 MHz mode⁽¹⁾

100 kHz mode

400 kHz mode

1 MHz mode⁽¹⁾

100 kHz mode

400 kHz mode

1 MHz mode⁽¹⁾

250

100

0

—

THD:DAT Data Input

Hold Time

—

0

0.9

0.3

—

0

TSU:STA Start Condition

Setup Time

4.7

0.6

0.25

4.0

0.6

0.25

4.7

0.6

4000

600

250

0

Only relevant for Repeated

Start condition

—

THD:STA Start Condition

Hold Time

—

After this period, the first

clock pulse is generated

—

TSU:STO Stop Condition

Setup Time

—

THD:STO Stop Condition

Hold Time

—

TAA:SCL Output Valid

From Clock

3500

1000

350

—

0

TBF:SDA Bus Free Time

4.7

1.3

0.5

—

Time the bus must be free

before a new transmission

can start

—

CB

Bus Capacitive Loading

400

—

Note 1: Maximum pin capacitance = 10 pF for all I2Cx pins (for 1 MHz mode only).

 2009-2012 Microchip Technology Inc.

DS70592D-page 277

PIC24HJXXXGPX06A/X08A/X10A

FIGURE 24-21:

ECAN™ MODULE I/O TIMING CHARACTERISTICS

CiTx Pin

(output)

New Value

Old Value

CA10 CA11

CiRx Pin

(input)

CA20

TABLE 24-38: ECAN™ MODULE I/O TIMING REQUIREMENTS

Standard Operating Conditions: 3.0V to 3.6V

(unless otherwise stated)

Operating temperature -40°C  TA  +85°C for Industrial

-40°C  TA  +125°C for Extended

AC CHARACTERISTICS

Param

Symbol

No.

Characteristic⁽¹⁾

Min

Typ⁽²⁾

Max

Units

Conditions

CA10

CA11

CA20

TioF

TioR

Tcwf

Port Output Fall Time

Port Output Rise Time

—

ns

See parameter D032

See parameter D031

—

Pulse-Width to Trigger

CAN Wake-up Filter

120

Note 1: These parameters are characterized but not tested in manufacturing.

2: Data in “Typ” column is at 3.3V, 25°C unless otherwise stated. Parameters are for design guidance only

and are not tested.

DS70592D-page 278

 2009-2012 Microchip Technology Inc.

PIC24HJXXXGPX06A/X08A/X10A

TABLE 24-39: ADC MODULE SPECIFICATIONS

Standard Operating Conditions: 3.0V to 3.6V

(unless otherwise stated)

Operating temperature -40°C  TA  +85°C for Industrial

-40°C  TA  +125°C for Extended

AC CHARACTERISTICS

Param Symbo

Characteristic

Module VDD Supply

Module VSS Supply

Min.

Typ

Max.

Units

Conditions

No.

l

Device Supply

AD01 AVDD

AD02 AVSS

Greater of

VDD – 0.3

or 3.0

—

Lesser of

VDD + 0.3

or 3.6

V

—

VSS – 0.3

VSS + 0.3

Reference Inputs

AD05 VREFH Reference Voltage High

AD05a

AVSS + 2.5

—

AVDD

3.6

V

3.0

VREFH = AVDD

VREFL = AVSS = 0

AD06 VREFL

AD06a

Reference Voltage Low

AVSS

0

—

AVDD – 2.5

0

V

VREFH = AVDD

VREFL = AVSS = 0

AD07 VREF

Absolute Reference

Voltage

2.5

—

3.6

10

V

VREF = VREFH - VREFL

AD08 IREF

AD08a IAD

Current Drain

A ADC off

Operating Current

—

7.0

2.7

9.0

3.2

mA 10-bit ADC mode, See Note 1

mA 12-bit ADC mode, See Note 1

Analog Input

AD12 VINH

AD13 VINL

AD17 RIN

Input Voltage Range VINH

Input Voltage Range VINL

VINL

—

VREFH

V

This voltage reflects Sample

and Hold Channels 0, 1, 2,

and 3 (CH0-CH3), positive

input

VREFL

—

AVSS + 1V

V

This voltage reflects Sample

and Hold Channels 0, 1, 2,

and 3 (CH0-CH3), negative

input

Recommended Imped-

ance of Analog Voltage

Source

—

200



10-bit ADC

12-bit ADC

Note 1: These parameters are not characterized or tested in manufacturing.

 2009-2012 Microchip Technology Inc.

DS70592D-page 279

PIC24HJXXXGPX06A/X08A/X10A

TABLE 24-40: ADC MODULE SPECIFICATIONS (12-BIT MODE)⁽¹⁾

Standard Operating Conditions: 3.0V to 3.6V

(unless otherwise stated)

Operating temperature -40°C  TA  +85°C for Industrial

-40°C  TA  +125°C for Extended

AC CHARACTERISTICS

Param

Symbol

No.

Characteristic

Min.

Typ

Max. Units

Conditions

ADC Accuracy (12-bit Mode) – Measurements with external VREF+/VREF-

AD20a Nr

AD21a INL

Resolution

12 data bits

—

bits

Integral Nonlinearity

-2

>-1

—

+2

<1

10

5

LSb VINL = AVSS = VREFL = 0V,

AVDD = VREFH = 3.6V

AD22a DNL

Differential Nonlinearity

Gain Error

—

3.4

0.9

—

LSb VINL = AVSS = VREFL = 0V,

AVDD = VREFH = 3.6V

AD23a

AD24a

AD25a

GERR

EOFF

—

LSb VINL = AVSS = VREFL = 0V,

AVDD = VREFH = 3.6V

Offset Error

—

LSb VINL = AVSS = VREFL = 0V,

AVDD = VREFH = 3.6V

Monotonicity

—

Guaranteed

ADC Accuracy (12-bit Mode) – Measurements with internal VREF+/VREF-

AD20a Nr

AD21a INL

AD22a DNL

Resolution

12 data bits

bits

Integral Nonlinearity

Differential Nonlinearity

Gain Error

-2

>-1

—

+2

<1

20

10

—

LSb VINL = AVSS = 0V, AVDD = 3.6V

AD23a

AD24a

AD25a

GERR

EOFF

—

10.5

3.8

—

Offset Error

—

Monotonicity

—

Guaranteed

Dynamic Performance (12-bit Mode)

AD30a THD

Total Harmonic Distortion

—

-75

—

dB

—

AD31a SINAD

Signal to Noise and

Distortion

68.5

69.5

AD32a SFDR

Spurious Free Dynamic

Range

80

—

dB

—

AD33a

FNYQ

Input Signal Bandwidth

Effective Number of Bits

—

250

—

kHz

bits

—

AD34a ENOB

11.09

11.3

Note 1: Injection currents > | 0 | can affect the ADC results by approximately 4-6 counts (i.e., VIH source > (VDD +

0.3) or VIL source < (VSS – 0.3)).

DS70592D-page 280

 2009-2012 Microchip Technology Inc.

PIC24HJXXXGPX06A/X08A/X10A

TABLE 24-41: ADC MODULE SPECIFICATIONS (10-BIT MODE)⁽¹⁾

Standard Operating Conditions: 3.0V to 3.6V

(unless otherwise stated)

Operating temperature -40°C  TA  +85°C for Industrial

-40°C  TA  +125°C for Extended

AC CHARACTERISTICS

Param

Symbol

No.

Characteristic

Min.

Typ

Max. Units

Conditions

ADC Accuracy (10-bit Mode) – Measurements with external VREF+/VREF-

AD20b Nr

AD21b INL

Resolution

10 data bits

—

bits

Integral Nonlinearity

-1.5

>-1

—

+1.5

<1

6

LSb VINL = AVSS = VREFL = 0V,

AVDD = VREFH = 3.6V

AD22b DNL

Differential Nonlinearity

Gain Error

—

3

LSb VINL = AVSS = VREFL = 0V,

AVDD = VREFH = 3.6V

AD23b

AD24b

AD25b

GERR

EOFF

—

LSb VINL = AVSS = VREFL = 0V,

AVDD = VREFH = 3.6V

Offset Error

—

2

5

LSb VINL = AVSS = VREFL = 0V,

AVDD = VREFH = 3.6V

Monotonicity

—

Guaranteed

ADC Accuracy (10-bit Mode) – Measurements with internal VREF+/VREF-

AD20b Nr

AD21b INL

AD22b DNL

Resolution

10 data bits

bits

Integral Nonlinearity

Differential Nonlinearity

Gain Error

-1

>-1

—

7

+1

<1

15

7

LSb VINL = AVSS = 0V, AVDD = 3.6V

AD23b

AD24b

AD25b

GERR

EOFF

—

Offset Error

—

3

Monotonicity

—

Guaranteed

Dynamic Performance (10-bit Mode)

AD30b THD

Total Harmonic Distortion

—

-64

—

dB

—

AD31b SINAD

Signal to Noise and

Distortion

57

58.5

AD32b SFDR

Spurious Free Dynamic

Range

72

—

dB

—

AD33b

FNYQ

Input Signal Bandwidth

Effective Number of Bits

—

550

—

kHz

bits

—

AD34b ENOB

9.16

9.4

Note 1: Injection currents > | 0 | can affect the ADC results by approximately 4-6 counts (i.e., VIH source > (VDD +

0.3) or VIL source < (VSS – 0.3)).

 2009-2012 Microchip Technology Inc.

DS70592D-page 281

PIC24HJXXXGPX06A/X08A/X10A

FIGURE 24-22:

ADC CONVERSION (12-BIT MODE) TIMING CHARACTERISTICS

(ASAM = 0, SSRC<2:0> = 000)

AD50

ADCLK

Instruction

Execution

Set SAMP

AD61

Clear SAMP

SAMP

AD60

TSAMP

AD55

DONE

AD1IF

1

2

3

4

5

6

7

8

9

Software sets AD1CON. SAMP to start sampling.

Sampling ends, conversion sequence starts.

Convert bit 11.

1

2

4

5

6

7

8

9

Sampling starts after discharge period. TSAMP is described in

Section 28. “Analog-to-Digital Converter (ADC) without DMA”

(DS70249) in the “dsPIC33F/PIC24H Family Reference Manual”.

Please see the Microchip web site (www.microchip.com)

Convert bit 10.

Convert bit 1.

for the latest dsPIC33F/PIC24H Family Reference Manual sections.

Convert bit 0.

Software clears AD1CON. SAMP to start conversion.

3

One TAD for end of conversion.

DS70592D-page 282

 2009-2012 Microchip Technology Inc.

PIC24HJXXXGPX06A/X08A/X10A

TABLE 24-42: ADC CONVERSION (12-BIT MODE) TIMING REQUIREMENTS

Standard Operating Conditions: 3.0V to 3.6V

(unless otherwise stated)

Operating temperature -40°C  TA  +85°C for Industrial

-40°C  TA  +125°C for Extended

AC CHARACTERISTICS

Param

Symbol

No.

Characteristic

Min.

Typ⁽²⁾Max.

Units

Conditions

Clock Parameters⁽¹⁾

AD50

AD51

TAD

tRC

ADC Clock Period

117.6

—

ns

—

ADC Internal RC Oscillator

Period

250

Conversion Rate

AD55

AD56

AD57

tCONV

FCNV

Conversion Time

Throughput Rate

Sample Time

—

14 TAD

ns

ksps

—

500

—

TSAMP

3 TAD

Timing Parameters

AD60

tPCS

2.0 TAD

—

3.0 TAD

—

Auto convert trigger not

selected

Conversion Start from Sample

Trigger⁽²⁾

AD61

AD62

AD63

tPSS

tCSS

tDPU

Sample Start from Setting

Sample (SAMP) bit⁽²⁾

2.0 TAD

—

0.5 TAD

—

3.0 TAD

—

s

—

Conversion Completion to

Sample Start (ASAM = 1)⁽²⁾

Time to Stabilize Analog Stage

from ADC Off to ADC On^(2,3)

—

20

Note 1: Because the sample caps eventually loses charge, clock rates below 10 kHz may affect linearity

performance, especially at elevated temperatures.

2: These parameters are characterized but not tested in manufacturing.

3: tDPU is the time required for the ADC module to stabilize when it is turned on (AD1CON1<ADON> = 1).

During this time, the ADC result is indeterminate.

 2009-2012 Microchip Technology Inc.

DS70592D-page 283

PIC24HJXXXGPX06A/X08A/X10A

FIGURE 24-23:

ADC CONVERSION (10-BIT MODE) TIMING CHARACTERISTICS

(CHPS<1:0> = 01, SIMSAM = 0, ASAM = 0, SSRC<2:0> = 000)

AD50

Set SAMP

AD61

ADCLK

Instruction

Execution

Clear SAMP

AD60

SAMP

TSAMP

AD55

DONE

AD1IF

1

2

3

4

5

6

7

8

5

6

7

8

– Software sets AD1CON. SAMP to start sampling.

1

2

– Sampling starts after discharge period. TSAMP is described in Section 28. “Analog-to-Digital Converter (ADC)

without DMA” (DS70249) in the “dsPIC33F/PIC24H Family Reference Manual”.

– Software clears AD1CON. SAMP to start conversion.

– Sampling ends, conversion sequence starts.

– Convert bit 9.

3

4

5

6

7

8

– Convert bit 8.

– Convert bit 0.

– One TAD for end of conversion.

FIGURE 24-24:

ADC CONVERSION (10-BIT MODE) TIMING CHARACTERISTICS (CHPS<1:0> = 01,

SIMSAM = 0, ASAM = 1, SSRC<2:0> = 111, SAMC<4:0> = 00001)

AD50

ADCLK

Instruction

Set ADON

Execution

SAMP

AD1IF

TSAMP

AD55

DONE

1

2

3

4

5

6

7

3

4

5

6

8

– Software sets AD1CON. ADON to start AD operation.

– Convert bit 0.

5

1

2

– Sampling starts after discharge period. TSAMP is described in

Section 28. “Analog-to-Digital Converter (ADC) without DMA”

(DS70249) in the “dsPIC33F/PIC24H Family Reference Manual'.

– One TAD for end of conversion.

– Begin conversion of next channel.

6

7

8

– Convert bit 9.

3

4

– Sample for time specified by SAMC<4:0>.

– Convert bit 8.

DS70592D-page 284

 2009-2012 Microchip Technology Inc.

PIC24HJXXXGPX06A/X08A/X10A

TABLE 24-43: ADC CONVERSION (10-BIT MODE) TIMING REQUIREMENTS

Standard Operating Conditions: 3.0V to 3.6V

(unless otherwise stated)

Operating temperature -40°C  TA  +85°C for Industrial

-40°C  TA  +125°C for Extended

AC CHARACTERISTICS

Param

Symbol

No.

Characteristic

Min.

Typ⁽¹⁾

Max.

Units

Conditions

Clock Parameters

AD50 TAD

AD51 tRC

ADC Clock Period

76

—

ns

—

ADC Internal RC Oscillator Period

250

Conversion Rate

AD55 tCONV

AD56 FCNV

Conversion Time

Throughput Rate

—

12 TAD

—

1.1

—

Msps

—

AD57 TSAMP Sample Time

2 TAD

Timing Parameters

AD60 tPCS

AD61 tPSS

AD62 tCSS

AD63 tDPU

Conversion Start from Sample

2.0 TAD

—

3.0 TAD

—

s

Auto-Convert Trigger

not selected

Trigger⁽²⁾

Sample Start from Setting

Sample (SAMP) bit⁽²⁾

—

0.5 TAD

—

Conversion Completion to

Sample Start (ASAM = 1)⁽²⁾

Time to Stabilize Analog Stage

from ADC Off to ADC On^(2,3)

—

20

Note 1: These parameters are characterized but not tested in manufacturing.

2: Because the sample caps eventually loses charge, clock rates below 10 kHz may affect linearity

performance, especially at elevated temperatures.

3: tDPU is the time required for the ADC module to stabilize when it is turned on (AD1CON1<ADON> = 1).

During this time, the ADC result is indeterminate.

TABLE 24-44: DMA READ/WRITE TIMING REQUIREMENTS

Standard Operating Conditions: 3.0V to 3.6V

(unless otherwise stated)

Operating temperature -40°C  TA  +85°C for Industrial

AC CHARACTERISTICS

-40°C  TA  +125°C for Extended

Param

No.

Characteristic

Min.

Typ

Max.

Units

Conditions

DM1a DMA Read/Write Cycle Time

—

2 TCY

ns This characteristic applies to

PIC24HJ256GPX06A/X08A/X10A

devices only.

DM1b DMA Read/Write Cycle Time

—

1 TCY

ns This characteristic applies to all

devices with the exception of the

PIC24HJ256GPX06A/X08A/X10A.

 2009-2012 Microchip Technology Inc.

DS70592D-page 285

PIC24HJXXXGPX06A/X08A/X10A

NOTES:

DS70592D-page 286

 2009-2012 Microchip Technology Inc.

PIC24HJXXXGPX06A/X08A/X10A

25.0 HIGH TEMPERATURE ELECTRICAL CHARACTERISTICS

This section provides an overview of PIC24HJXXXGPX06A/X08A/X10A electrical characteristics for devices operating

in an ambient temperature range of -40°C to +150°C.

The specifications between -40°C to +150°C are identical to those shown in Section 24.0 “Electrical Characteristics”

for operation between -40°C to +125°C, with the exception of the parameters listed in this section.

Parameters in this section begin with an H, which denotes High temperature. For example, parameter DC10 in

Section 24.0 “Electrical Characteristics” is the Industrial and Extended temperature equivalent of HDC10.

Absolute maximum ratings for the PIC24HJXXXGPX06A/X08A/X10A high temperature devices are listed below.

Exposure to these maximum rating conditions for extended periods can affect device reliability. Functional operation of

the device at these or any other conditions above the parameters indicated in the operation listings of this specification

is not implied.

Absolute Maximum Ratings

(See Note 1 )

Ambient temperature under bias⁽⁴⁾.........................................................................................................-40°C to +150°C

Storage temperature .............................................................................................................................. -65°C to +160°C

Voltage on VDD with respect to VSS ......................................................................................................... -0.3V to +4.0V

Voltage on any pin that is not 5V tolerant with respect to VSS⁽⁵⁾.................................................... -0.3V to (VDD + 0.3V)

Voltage on any 5V tolerant pin with respect to VSS when VDD < 3.0V⁽⁵⁾....................................... -0.3V to (VDD + 0.3V)

Voltage on any 5V tolerant pin with respect to VSS when VDD  3.0V⁽⁵⁾.................................................... -0.3V to 5.6V

Voltage on VCAP with respect to VSS ...................................................................................................... 2.25V to 2.75V

Maximum current out of VSS pin .............................................................................................................................60 mA

Maximum current into VDD pin⁽²⁾.............................................................................................................................60 mA

Maximum junction temperature............................................................................................................................. +155°C

Maximum current sourced/sunk by any 2x I/O pin⁽³⁾................................................................................................2 mA

Maximum current sourced/sunk by any 4x I/O pin⁽³⁾................................................................................................4 mA

Maximum current sourced/sunk by any 8x I/O pin⁽³⁾................................................................................................8 mA

Maximum current sunk by all ports combined ........................................................................................................10 mA

Maximum current sourced by all ports combined⁽²⁾................................................................................................10 mA

Note 1: Stresses above those listed under “Absolute Maximum Ratings” can cause permanent damage to the

device. This is a stress rating only, and functional operation of the device at those or any other conditions

above those indicated in the operation listings of this specification is not implied. Exposure to maximum

rating conditions for extended periods can affect device reliability.

2: Maximum allowable current is a function of device maximum power dissipation (see Table 25-2).

3: Unlike devices at 125°C and below, the specifications in this section also apply to the CLKOUT, VREF+,

VREF-, SCLx, SDAx, PGECx, and PGEDx pins.

4: AEC-Q100 reliability testing for devices intended to operate at 150°C is 1,000 hours. Any design in which

the total operating time from 125°C to 150°C will be greater than 1,000 hours is not warranted without prior

written approval from Microchip Technology Inc.

5: Refer to the “Pin Diagrams” section for 5V tolerant pins.

 2009-2012 Microchip Technology Inc.

DS70592D-page 287

PIC24HJXXXGPX06A/X08A/X10A

25.1 High Temperature DC Characteristics

TABLE 25-1: OPERATING MIPS VS. VOLTAGE

Max MIPS

VDD Range

(in Volts)

Temperature Range

(in °C)

Characteristic

PIC24HJXXXGPX06A/X08A/X10A

HDC5

VBOR to 3.6V⁽¹⁾

-40°C to +150°C

20

Note 1: Device is functional at VBORMIN < VDD < VDDMIN. Analog modules such as the ADC will have degraded

performance. Device functionality is tested but not characterized. Refer to parameter BO10 in Table 24-11

for the minimum and maximum BOR values.

TABLE 25-2: THERMAL OPERATING CONDITIONS

Rating

Symbol

Min

Typ

Max

Unit

High Temperature Devices

Operating Junction Temperature Range

Operating Ambient Temperature Range

TJ

TA

-40

—

+155

+150

°C

Power Dissipation:

Internal chip power dissipation:

PINT = VDD x (IDD -  IOH)

PD

PINT + PI/O

W

I/O Pin Power Dissipation:

I/O =  ({VDD - VOH} x IOH) +  (VOL x IOL)

Maximum Allowed Power Dissipation

PDMAX

(TJ - TA)/JA

TABLE 25-3: DC TEMPERATURE AND VOLTAGE SPECIFICATIONS

Standard Operating Conditions: 3.0V to 3.6V

(unless otherwise stated)

Operating temperature -40°C  TA  +150°C for High Temperature

DC CHARACTERISTICS

Parameter

Symbol

No.

Characteristic

Min

Typ

Max

Units

Conditions

Operating Voltage

HDC10

Supply Voltage

VDD

—

3.0

3.3

3.6

V

-40°C to +150°C

TABLE 25-4: DC CHARACTERISTICS: POWER-DOWN CURRENT (IPD)

Standard Operating Conditions: 3.0V to 3.6V

DC CHARACTERISTICS

(unless otherwise stated)

Operating temperature -40°C  TA  +150°C for High Temperature

Parameter

Typical

No.

Max

Units

Conditions

Power-Down Current (IPD)

HDC60e

250

2000

A

+150°C

3.3V

Base Power-Down Current^(1,3)

Note 1: Base IPD is measured with all peripherals and clocks shut down. All I/Os are configured as inputs and

pulled to VSS. WDT, etc., are all switched off, and VREGS (RCON<8>) = 1.

2: The  current is the additional current consumed when the module is enabled. This current should be

added to the base IPD current.

3: These currents are measured on the device containing the most memory in this family.

4: These parameters are characterized, but are not tested in manufacturing.

DS70592D-page 288

 2009-2012 Microchip Technology Inc.

PIC24HJXXXGPX06A/X08A/X10A

Standard Operating Conditions: 3.0V to 3.6V

(unless otherwise stated)

DC CHARACTERISTICS

Operating temperature -40°C  TA  +150°C for High Temperature

Parameter

Typical

No.

Max

Units

Conditions

Power-Down Current (IPD)

(2,4)

HDC61c

3

5

A

+150°C

3.3V

Watchdog Timer Current: IWDT

Note 1: Base IPD is measured with all peripherals and clocks shut down. All I/Os are configured as inputs and

pulled to VSS. WDT, etc., are all switched off, and VREGS (RCON<8>) = 1.

2: The  current is the additional current consumed when the module is enabled. This current should be

added to the base IPD current.

3: These currents are measured on the device containing the most memory in this family.

4: These parameters are characterized, but are not tested in manufacturing.

TABLE 25-5: DC CHARACTERISTICS: DOZE CURRENT (IDOZE)

Standard Operating Conditions: 3.0V to 3.6V

DC CHARACTERISTICS

(unless otherwise stated)

Operating temperature -40°C  TA  +150°C for High Temperature

Parameter

Typical⁽¹⁾

No.

Doze

Ratio

Max

Units

Conditions

HDC72a

HDC72f

HDC72g

39

18

45

25

1:2

1:64

1:128

mA

+150°C

3.3V

20 MIPS

Note 1: Parameters with Doze ratios of 1:2 and 1:64 are characterized, but are not tested in manufacturing.

 2009-2012 Microchip Technology Inc.

DS70592D-page 289

PIC24HJXXXGPX06A/X08A/X10A

TABLE 25-6: DC CHARACTERISTICS: I/O PIN OUTPUT SPECIFICATIONS

Standard Operating Conditions: 3.0V to 3.6V

(unless otherwise stated)

Operating temperature -40°C  TA  +85°C for High

Temperature

DC CHARACTERISTICS

Param. Symbol

Characteristic

Min. Typ. Max. Units

Conditions

Output Low Voltage

IOL  1.8 mA, VDD = 3.3V

See Note 1

I/O Pins:

2x Sink Driver Pins - All pins not

defined by 4x or 8x driver pins

—

0.4

V

Output Low Voltage

I/O Pins:

4x Sink Driver Pins - RA2, RA3, RA9,

RA10, RA14, RA15, RB0, RB1, RB11,

RF4, RF5, RG2, RG3

IOL  3.6 mA, VDD = 3.3V

See Note 1

HDO10 VOL

Output Low Voltage

I/O Pins:

IOL  6 mA, VDD = 3.3V

See Note 1

—

0.4

—

V

8x Sink Driver Pins - OSC2, CLKO,

RC15

Output High Voltage

I/O Pins:

2x Source Driver Pins - All pins not

defined by 4x or 8x driver pins

IOL  -1.8 mA, VDD = 3.3V

See Note 1

2.4

Output High Voltage

I/O Pins:

IOL  -3 mA, VDD = 3.3V

See Note 1

4x Source Driver Pins - RA2, RA3,

RA9, RA10, RA14, RA15, RB0, RB1,

RB11, RF4, RF5, RG2, RG3

2.4

—

V

HDO20 VOH

Output High Voltage

I/O Pins:

8x Source Driver Pins - OSC2, CLKO,

RC15

IOL  -6 mA, VDD = 3.3V

See Note 1

Output High Voltage

I/O Pins:

2x Source Driver Pins - All pins not

defined by 4x or 8x driver pins

IOH  -1.9 mA, VDD = 3.3V

See Note 1

1.5

2.0

—

IOH  -1.85 mA, VDD =

3.3V

V

See Note 1

IOH  -1.4 mA, VDD = 3.3V

See Note 1

3.0

1.5

2.0

3.0

1.5

2.0

3.0

—

Output High Voltage

IOH  -3.9 mA, VDD = 3.3V

See Note 1

4x Source Driver Pins - RA2, RA3,

RA9, RA10, RA14, RA15, RB0, RB1,

RB11, RF4, RF5, RG2, RG3

HDO20A VOH1

IOH  -3.7 mA, VDD = 3.3V

See Note 1

V

IOH  -2 mA, VDD = 3.3V

See Note 1

Output High Voltage

8x Source Driver Pins - OSC2, CLKO,

RC15

IOH  -7.5 mA, VDD = 3.3V

See Note 1

IOH  -6.8 mA, VDD = 3.3V

See Note 1

IOH  -3 mA, VDD = 3.3V

See Note 1

Note 1: Parameters are characterized, but not tested.

DS70592D-page 290

 2009-2012 Microchip Technology Inc.

PIC24HJXXXGPX06A/X08A/X10A

25.2 AC Characteristics and Timing

Parameters

The information contained in this section defines

PIC24HJXXXGPX06A/X08A/X10A AC characteristics

and timing parameters for high temperature devices.

However, all AC timing specifications in this section are

the same as those in Section 24.2 “AC

Characteristics and Timing Parameters”, with the

exception of the parameters listed in this section.

Parameters in this section begin with an H, which

denotes High temperature. For example, parameter

OS53 in Section 24.2 “AC Characteristics and

Timing Parameters” is the Industrial and Extended

temperature equivalent of HOS53.

TABLE 25-7: TEMPERATURE AND VOLTAGE SPECIFICATIONS – AC

Standard Operating Conditions: 3.0V to 3.6V

(unless otherwise stated)

Operating temperature -40°C  TA  +150°C for High Temperature

AC CHARACTERISTICS

Operating voltage VDD range as described in Table 25-1.

FIGURE 25-1:

LOAD CONDITIONS FOR DEVICE TIMING SPECIFICATIONS

Load Condition 1 – for all pins except OSC2

VDD/2

Load Condition 2 – for OSC2

CL

RL

VSS

CL

RL = 464

CL = 50 pF for all pins except OSC2

15 pF for OSC2 output

VSS

TABLE 25-8: PLL CLOCK TIMING SPECIFICATIONS

Standard Operating Conditions: 3.0V to 3.6V (unless otherwise stated)

Operating temperature -40°C  TA  +150°C for High Temperature

AC

CHARACTERISTICS

Param

Symbol

No.

Characteristic

Min

Typ

Max

Units

Conditions

HOS53

DCLK

CLKO Stability (Jitter)⁽¹⁾

-5

0.5

5

%

Measured over 100 ms

period

Note 1: These parameters are characterized, but are not tested in manufacturing.

 2009-2012 Microchip Technology Inc.

DS70592D-page 291

PIC24HJXXXGPX06A/X08A/X10A

TABLE 25-9: INTERNAL LPRC ACCURACY

Standard Operating Conditions: 3.0V to 3.6V (unless otherwise stated)

Operating temperature -40°C  TA  +150°C for High Temperature

AC

CHARACTERISTICS

Param

No.

Characteristic

Min

Typ

Max

Units

Conditions

LPRC @ 32.768 kHz ⁽¹⁾

HF21

LPRC

-70⁽²⁾

—

+70⁽²⁾

%

-40°C  TA  +150°C

—

Note 1: Change of LPRC frequency as VDD changes.

2: Characterized but not tested.

TABLE 25-10: SPIx MASTER MODE (CKE = 0) TIMING REQUIREMENTS

Standard Operating Conditions: 3.0V to 3.6V (unless otherwise stated)

Operating temperature -40°C  TA  +150°C for High Temperature

AC

CHARACTERISTICS

Param

Symbol

No.

Characteristic⁽¹⁾

Min

Typ

Max

Units

Conditions

HSP35

HSP40

HSP41

TscH2doV, SDOx Data Output Valid after

TscL2doV SCKx Edge

—

10

25

ns

—

TdiV2scH, Setup Time of SDIx Data Input

TdiV2scL to SCKx Edge

28

—

ns

—

TscH2diL, Hold Time of SDIx Data Input

35

—

TscL2diL

to SCKx Edge

Note 1: These parameters are characterized but not tested in manufacturing.

TABLE 25-11: SPIx MODULE MASTER MODE (CKE = 1) TIMING REQUIREMENTS

Standard Operating Conditions: 3.0V to 3.6V (unless otherwise stated)

Operating temperature -40°C  TA  +150°C for High Temperature

AC

CHARACTERISTICS

Param

Symbol

No.

Characteristic⁽¹⁾

Min

Typ

Max

Units

Conditions

HSP35 TscH2doV, SDOx Data Output Valid after

TscL2doV SCKx Edge

—

10

25

ns

—

HSP36 TdoV2sc, SDOx Data Output Setup to

TdoV2scL First SCKx Edge

35

28

35

—

ns

—

HSP40 TdiV2scH, Setup Time of SDIx Data Input

TdiV2scL to SCKx Edge

HSP41 TscH2diL, Hold Time of SDIx Data Input

TscL2diL

to SCKx Edge

Note 1: These parameters are characterized but not tested in manufacturing.

DS70592D-page 292

 2009-2012 Microchip Technology Inc.

PIC24HJXXXGPX06A/X08A/X10A

TABLE 25-12: SPIx MODULE SLAVE MODE (CKE = 0) TIMING REQUIREMENTS

Standard Operating Conditions: 3.0V to 3.6V (unless otherwise stated)

Operating temperature -40°C  TA  +150°C for High Temperature

AC

CHARACTERISTICS

Param

Symbol

No.

Characteristic⁽¹⁾

Min

Typ

Max Units

Conditions

HSP35 TscH2doV, SDOx Data Output Valid after

TscL2doV SCKx Edge

HSP40 TdiV2scH, Setup Time of SDIx Data Input

—

35

—

55

ns

—

25

15

—

TdiV2scL

to SCKx Edge

HSP41 TscH2diL,

TscL2diL

Hold Time of SDIx Data Input to

SCKx Edge

See Note 2

HSP51 TssH2doZ SSx  to SDOx Output

High-Impedance

Note 1: These parameters are characterized but not tested in manufacturing.

2: Assumes 50 pF load on all SPIx pins.

TABLE 25-13: SPIx MODULE SLAVE MODE (CKE = 1) TIMING REQUIREMENTS

Standard Operating Conditions: 3.0V to 3.6V (unless otherwise stated)

Operating temperature -40°C  TA  +150°C for High Temperature

AC

CHARACTERISTICS

Param

Symbol

No.

Characteristic⁽¹⁾

Min

Typ

Max

Units

Conditions

HSP35

HSP40

HSP41

HSP51

HSP60

TscH2doV, SDOx Data Output Valid after

TscL2doV SCKx Edge

—

35

ns

—

TdiV2scH, Setup Time of SDIx Data Input

TdiV2scL to SCKx Edge

25

15

—

55

ns

—

TscH2diL, Hold Time of SDIx Data Input

TscL2diL

to SCKx Edge

See Note 2

TssH2doZ SSx  to SDOX Output

High-Impedance

TssL2doV SDOx Data Output Valid after

SSx Edge

—

Note 1: These parameters are characterized but not tested in manufacturing.

2: Assumes 50 pF load on all SPIx pins.

 2009-2012 Microchip Technology Inc.

DS70592D-page 293

PIC24HJXXXGPX06A/X08A/X10A

TABLE 25-14: ADC MODULE SPECIFICATIONS

Standard Operating Conditions: 3.0V to 3.6V (unless otherwise stated)

Operating temperature -40°C  TA  +150°C for High Temperature

AC

CHARACTERISTICS

Param

Symbol

No.

Characteristic

Min

Typ

Max Units

Conditions

Reference Inputs

HAD08

IREF

Current Drain

—

250

—

600

50

A ADC operating, See Note 1

A ADC off, See Note 1

Note 1: These parameters are not characterized or tested in manufacturing.

2: These parameters are characterized, but are not tested in manufacturing.

TABLE 25-15: ADC MODULE SPECIFICATIONS (12-BIT MODE)⁽³⁾

Standard Operating Conditions: 3.0V to 3.6V (unless otherwise stated)

Operating temperature -40°C  TA  +150°C for High Temperature

AC

CHARACTERISTICS

Param

Symbol

No.

Characteristic

Min

Typ

Max

Units

Conditions

ADC Accuracy (12-bit Mode) – Measurements with external VREF+/VREF-⁽¹⁾

AD23a

AD24a

GERR

EOFF

Gain Error

—

5

10

LSb VINL = AVSS = VREFL = 0V,

AVDD = VREFH = 3.6V

Offset Error

—

2

5

LSb VINL = AVSS = VREFL = 0V,

AVDD = VREFH = 3.6V

ADC Accuracy (12-bit Mode) – Measurements with internal VREF+/VREF-⁽¹⁾

AD23a

AD24a

GERR

EOFF

Gain Error

2

10

5

20

10

LSb VINL = AVSS = 0V, AVDD = 3.6V

Offset Error

Dynamic Performance (12-bit Mode)⁽²⁾

HAD33a FNYQ

Input Signal Bandwidth

—

200 kHz

—

Note 1: These parameters are characterized, but are tested at 20 ksps only.

2: These parameters are characterized by similarity, but are not tested in manufacturing.

3: Injection currents > | 0 | can affect the ADC results by approximately 4-6 counts.

TABLE 25-16: ADC MODULE SPECIFICATIONS (10-BIT MODE)⁽³⁾

Standard Operating Conditions: 3.0V to 3.6V (unless otherwise stated)

Operating temperature -40°C  TA  +150°C for High Temperature

AC

CHARACTERISTICS

Param

Symbol

No.

Characteristic

Min

Typ

Max

Units

Conditions

ADC Accuracy (12-bit Mode) – Measurements with external VREF+/VREF-⁽¹⁾

AD23b

AD24b

GERR

EOFF

Gain Error

—

3

6

LSb VINL = AVSS = VREFL = 0V,

AVDD = VREFH = 3.6V

Offset Error

—

2

5

LSb VINL = AVSS = VREFL = 0V,

AVDD = VREFH = 3.6V

ADC Accuracy (12-bit Mode) – Measurements with internal VREF+/VREF-⁽¹⁾

AD23b

AD24b

GERR

EOFF

Gain Error

—

7

3

15

7

LSb VINL = AVSS = 0V, AVDD = 3.6V

Offset Error

Dynamic Performance (10-bit Mode)⁽²⁾

400 kHz

Note 1: These parameters are characterized, but are tested at 20 ksps only.

HAD33b FNYQ

Input Signal Bandwidth

—

2: These parameters are characterized by similarity, but are not tested in manufacturing.

3: Injection currents > | 0 | can affect the ADC results by approximately 4-6 counts.

DS70592D-page 294

 2009-2012 Microchip Technology Inc.

PIC24HJXXXGPX06A/X08A/X10A

TABLE 25-17: ADC CONVERSION (12-BIT MODE) TIMING REQUIREMENTS

Standard Operating Conditions: 3.0V to 3.6V (unless otherwise stated)

Operating temperature -40°C  TA  +150°C for High Temperature

AC

CHARACTERISTICS

Param

Symbol

No.

Characteristic

Min

Typ

Max

Units

Conditions

Clock Parameters

HAD50 TAD

ADC Clock Period⁽¹⁾

Throughput Rate⁽¹⁾

147

Conversion Rate

—

ns

—

HAD56 FCNV

—

400

Ksps

Note 1: These parameters are characterized but not tested in manufacturing.

TABLE 25-18: ADC CONVERSION (10-BIT MODE) TIMING REQUIREMENTS

Standard Operating Conditions: 3.0V to 3.6V (unless otherwise stated)

Operating temperature -40°C  TA  +150°C for High Temperature

AC

CHARACTERISTICS

Param

Symbol

No.

Characteristic

Min

Typ

Max

Units

Conditions

Clock Parameters

HAD50

HAD56

TAD

ADC Clock Period⁽¹⁾

Throughput Rate⁽¹⁾

104

—

ns

—

Conversion Rate

FCNV

—

800

Ksps

Note 1: These parameters are characterized but not tested in manufacturing.

 2009-2012 Microchip Technology Inc.

DS70592D-page 295

PIC24HJXXXGPX06A/X08A/X10A

NOTES:

DS70592D-page 296

 2009-2012 Microchip Technology Inc.

PIC24HJXXXGPX06A/X08A/X10A

NOTES:

DS70592D-page 300

 2009-2012 Microchip Technology Inc.

PIC24HJXXXGPX06A/X08A/X10A

27.0 PACKAGING INFORMATION

27.1 Package Marking Information

64-Lead QFN (9x9x0.9mm)

Example

XXXXXXXXXX

24HJ64GP

206A-I/MR

e

3

YYWWNNN

0610017

64-Lead TQFP (10x10x1 mm)

Example

XXXXXXXXXX

YYWWNNN

PIC24HJ

256GP706A

e

3

-I/PT

0510017

100-Lead TQFP (12x12x1 mm)

Example

XXXXXXXXXXXX

YYWWNNN

PIC24HJ256

GP710A-I/PT

0510017

e

3

100-Lead TQFP (14x14x1 mm)

Example

XXXXXXXXXXXX

YYWWNNN

PIC24HJ256

GP710A-I/PF

0510017

e

3

Legend: XX...X Customer-specific information

Y

YY

WW

NNN

Year code (last digit of calendar year)

Year code (last 2 digits of calendar year)

Week code (week of January 1 is week ‘01’)

Alphanumeric traceability code

e

3

Pb-free JEDEC designator for Matte Tin (Sn)

*

This package is Pb-free. The Pb-free JEDEC designator (

can be found on the outer packaging for this package.

)

e3

Note: In the event the full Microchip part number cannot be marked on one line, it will

be carried over to the next line, thus limiting the number of available

characters for customer-specific information.

 2009-2012 Microchip Technology Inc.

DS70592D-page 301

PIC24HJXXXGPX06A/X08A/X10A

27.2 Package Details

Note: For the most current package drawings, please see the Microchip Packaging Specification located at

http://www.microchip.com/packaging

DS70592D-page 302

 2009-2012 Microchip Technology Inc.

PIC24HJXXXGPX06A/X08A/X10A

Note: For the most current package drawings, please see the Microchip Packaging Specification located at

http://www.microchip.com/packaging

 2009-2012 Microchip Technology Inc.

DS70592D-page 303

PIC24HJXXXGPX06A/X08A/X10A

Note: For the most current package drawings, please see the Microchip Packaging Specification located at

http://www.microchip.com/packaging

DS70592D-page 304

 2009-2012 Microchip Technology Inc.

PIC24HJXXXGPX06A/X08A/X10A

64-Lead Plastic Thin Quad Flatpack (PT) – 10x10x1 mm Body, 2.00 mm Footprint [TQFP]

Note: For the most current package drawings, please see the Microchip Packaging Specification located at

http://www.microchip.com/packaging

D

D1

E

e

E1

N

b

NOTE 1

1 2 3

NOTE 2

α

A

c

φ

A2

A1

β

L

L1

Units

MILLIMETERS

Dimension Limits

MIN

NOM

64

0.50 BSC

–

1.00

–

MAX

Number of Leads

Lead Pitch

Overall Height

Molded Package Thickness

Standoff

N

e

A

A2

A1

L

–

1.20

1.05

0.15

0.75

0.95

0.05

0.45

Foot Length

0.60

Footprint

Foot Angle

L1

φ

1.00 REF

3.5°

0°

7°

Overall Width

E

D

E1

D1

c

12.00 BSC

10.00 BSC

–

Overall Length

Molded Package Width

Molded Package Length

Lead Thickness

Lead Width

0.09

0.17

11°

0.20

0.27

13°

b

α

0.22

12°

Mold Draft Angle Top

Mold Draft Angle Bottom

β

11°

13°

Notes:

1. Pin 1 visual index feature may vary, but must be located within the hatched area.

2. Chamfers at corners are optional; size may vary.

3. Dimensions D1 and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed 0.25 mm per side.

4. Dimensioning and tolerancing per ASME Y14.5M.

BSC: Basic Dimension. Theoretically exact value shown without tolerances.

REF: Reference Dimension, usually without tolerance, for information purposes only.

Microchip Technology Drawing C04-085B

 2009-2012 Microchip Technology Inc.

DS70592D-page 305

PIC24HJXXXGPX06A/X08A/X10A

Note: For the most current package drawings, please see the Microchip Packaging Specification located at

http://www.microchip.com/packaging

DS70592D-page 306

 2009-2012 Microchip Technology Inc.

PIC24HJXXXGPX06A/X08A/X10A

100-Lead Plastic Thin Quad Flatpack (PT) – 12x12x1 mm Body, 2.00 mm Footprint [TQFP]

Note: For the most current package drawings, please see the Microchip Packaging Specification located at

http://www.microchip.com/packaging

D

D1

e

E

E1

N

b

123

NOTE 2

NOTE 1

c

α

A

φ

L

A1

β

A2

L1

Units

Dimension Limits

MILLIMETERS

NOM

MIN

MAX

Number of Leads

Lead Pitch

Overall Height

N

e

A

100

0.40 BSC

–

1.20

1.05

0.15

0.75

Molded Package Thickness

Standoff

Foot Length

A2

A1

L

0.95

0.05

0.45

1.00

–

0.60

Footprint

Foot Angle

L1

φ

1.00 REF

3.5°

0°

7°

Overall Width

E

D

E1

D1

c

14.00 BSC

12.00 BSC

–

Overall Length

Molded Package Width

Molded Package Length

Lead Thickness

Lead Width

0.09

0.13

11°

0.20

0.23

13°

b

α

0.18

12°

Mold Draft Angle Top

Mold Draft Angle Bottom

β

11°

13°

Notes:

1. Pin 1 visual index feature may vary, but must be located within the hatched area.

2. Chamfers at corners are optional; size may vary.

3. Dimensions D1 and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed 0.25 mm per side.

4. Dimensioning and tolerancing per ASME Y14.5M.

BSC: Basic Dimension. Theoretically exact value shown without tolerances.

REF: Reference Dimension, usually without tolerance, for information purposes only.

Microchip Technology Drawing C04-100B

 2009-2012 Microchip Technology Inc.

DS70592D-page 307

PIC24HJXXXGPX06A/X08A/X10A

Note: For the most current package drawings, please see the Microchip Packaging Specification located at

http://www.microchip.com/packaging

DS70592D-page 308

 2009-2012 Microchip Technology Inc.

PIC24HJXXXGPX06A/X08A/X10A

100-Lead Plastic Thin Quad Flatpack (PF) – 14x14x1 mm Body, 2.00 mm Footprint [TQFP]

Note: For the most current package drawings, please see the Microchip Packaging Specification located at

http://www.microchip.com/packaging

D

D1

e

E1

E

b

N

α

NOTE 1

1 23

NOTE 2

A

φ

c

A2

A1

β

L1

L

Units

MILLIMETERS

Dimension Limits

MIN

NOM

100

0.50 BSC

–

1.00

–

MAX

Number of Leads

Lead Pitch

Overall Height

Molded Package Thickness

Standoff

Foot Length

N

e

A

A2

A1

L

–

1.20

1.05

0.15

0.75

0.95

0.05

0.45

0.60

Footprint

Foot Angle

L1

φ

1.00 REF

3.5°

0°

7°

Overall Width

Overall Length

E

D

E1

D1

c

16.00 BSC

14.00 BSC

–

Molded Package Width

Molded Package Length

Lead Thickness

Lead Width

Mold Draft Angle Top

Mold Draft Angle Bottom

0.09

0.17

11°

0.20

0.27

13°

b

α

0.22

12°

β

11°

13°

Notes:

1. Pin 1 visual index feature may vary, but must be located within the hatched area.

2. Chamfers at corners are optional; size may vary.

3. Dimensions D1 and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed 0.25 mm per side.

4. Dimensioning and tolerancing per ASME Y14.5M.

BSC: Basic Dimension. Theoretically exact value shown without tolerances.

REF: Reference Dimension, usually without tolerance, for information purposes only.

Microchip Technology Drawing C04-110B

 2009-2012 Microchip Technology Inc.

DS70592D-page 309

PIC24HJXXXGPX06A/X08A/X10A

Note: For the most current package drawings, please see the Microchip Packaging Specification located at

http://www.microchip.com/packaging

DS70592D-page 310

 2009-2012 Microchip Technology Inc.

PIC24HJXXXGPX06A/X08A/X10A

APPENDIX A: MIGRATING FROM

PIC24HJXXXGPX06/

X08/X10 DEVICES TO

PIC24HJXXXGPX06A/

X08A/X10A DEVICES

The PIC24HJXXXGPX06A/X08A/X10A devices were

designed to enhance the PIC24HJXXXGPX06/X08/

X10 families of devices.

In general, the PIC24HJXXXGPX06A/X08A/X10A

devices are backward-compatible with

PIC24HJXXXGPX06/X08/X10 devices; however,

manufacturing differences may cause

PIC24HJXXXGPX06A/X08A/X10A devices to behave

differently from PIC24HJXXXGPX06/X08/X10 devices.

Therefore, complete system test and characterization

is recommended if PIC24HJXXXGPX06A/X08A/X10A

devices are used to replace PIC24HJXXXGPX06/X08/

X10 devices.

The following enhancements were introduced:

• Extended temperature support of up to +125ºC

• Enhanced Flash module with higher endurance

and retention

• New PLL Lock Enable configuration bit

• Added Timer5 trigger for ADC1 and Timer3 trigger

for ADC2

 2009-2012 Microchip Technology Inc.

DS70592D-page 311

PIC24HJXXXGPX06A/X08A/X10A

Revision B (October 2009)

APPENDIX B: REVISION HISTORY

The revision includes the following global update:

Revision A (April 2009)

• Added Note 2 to the shaded table that appears at

the beginning of each chapter. This new note

provides information regarding the availability of

registers and their associated bits

This is the initial released version of the document.

This revision also includes minor typographical and

formatting changes throughout the data sheet text.

All other major changes are referenced by their

respective section in the following table.

TABLE B-1:

MAJOR SECTION UPDATES

Section Name

Update Description

“High-Performance, 16-bit

Microcontrollers”

Added information on high temperature operation (see “Operating

Range:”).

Section 10.0 “Power-Saving Features”

Updated the last paragraph to clarify the number of cycles that occur

prior to the start of instruction execution (see Section 10.2.2 “Idle

Mode”).

Section 11.0 “I/O Ports”

Changed the reference to digital-only pins to 5V tolerant pins in the

second paragraph of Section 11.2 “Open-Drain Configuration”.

Section 18.0 “Universal Asynchronous

Receiver Transmitter (UART)”

Updated the two baud rate range features to: 10 Mbps to 38 bps at

40 MIPS.

Section 20.0 “10-bit/12-bit Analog-to-Digital Updated the ADCx block diagram (see Figure 20-1).

Converter (ADC)”

Section 21.0 “Special Features”

Updated the second paragraph and removed the fourth paragraph in

Section 21.1 “Configuration Bits”.

Updated the Device Configuration Register Map (see Table 21-1).

Section 24.0 “Electrical Characteristics”

Updated the Absolute Maximum Ratings for high temperature and

added Note 4.

Updated Power-Down Current parameters DC60d, DC60a, DC60b,

and DC60d (see Table 24-7).

Added I2Cx Bus Data Timing Requirements (Master Mode)

parameter IM51 (see Table 24-36).

Updated the SPIx Module Slave Mode (CKE = 1) Timing

Characteristics (see Figure 24-12).

Updated the Internal LPRC Accuracy parameters (see Table 24-18

and Table 24-19).

Updated the ADC Module Specifications (12-bit Mode) parameters

AD23a and AD24a (see Table 24-40).

Updated the ADC Module Specifications (10-bit Mode) parameters

AD23b and AD24b (see Table 24-41).

Section 25.0 “High Temperature Electrical Added new chapter with high temperature specifications.

Characteristics”

“Product Identification System”

Added the “H” definition for high temperature.

DS70592D-page 312

 2009-2012 Microchip Technology Inc.

PIC24HJXXXGPX06A/X08A/X10A

Revision C (March 2011)

This revision includes typographical and formatting

changes throughout the data sheet text. In addition, all

occurrences of VDDCORE have been removed.

All other major changes are referenced by their

respective section in the following table.

TABLE B-2:

MAJOR SECTION UPDATES

Section Name

Update Description

Section 2.0 “Guidelines for Getting Started The frequency limitation for device PLL start-up conditions was

with 16-Bit Microcontrollers”

updated in Section 2.7 “Oscillator Value Conditions on Device

Start-up”.

The second paragraph in Section 2.9 “Unused I/Os” was updated.

Section 4.0 “Memory Organization”

The All Resets values for the following SFRs in the Timer Register

Map were changed (see Table 4-6):

• TMR1

• TMR2

• TMR3

• TMR4

• TMR5

• TMR6

• TMR7

• TMR8

• TMR9

Section 9.0 “Oscillator Configuration”

Added Note 3 to the OSCCON: Oscillator Control Register (see

Register 9-1).

Added Note 2 to the CLKDIV: Clock Divisor Register (see

Register 9-2).

Added Note 1 to the PLLFBD: PLL Feedback Divisor Register (see

Register 9-3).

Added Note 2 to the OSCTUN: FRC Oscillator Tuning Register (see

Register 9-4).

Section 20.0 “10-bit/12-bit Analog-to-Digital Updated the VREFL references in the ADC1 module block diagram

Converter (ADC)”

(see Figure 20-1).

Section 21.0 “Special Features”

Added a new paragraph and removed the third paragraph in

Section 21.1 “Configuration Bits”.

Added the column “RTSP Effects” to the Configuration Bits

Descriptions (see Table 21-2).

 2009-2012 Microchip Technology Inc.

DS70592D-page 313

PIC24HJXXXGPX06A/X08A/X10A

TABLE B-2:

MAJOR SECTION UPDATES (CONTINUED)

Section Name

Update Description

Section 24.0 “Electrical Characteristics”

Removed Note 4 from the DC Temperature and Voltage

Specifications (see Table 24-4).

Updated the maximum value for parameter DI19 and added

parameters DI28, DI29, DI60a, DI60b, and DI60c to the I/O Pin Input

Specifications (see Table 24-9).

Removed Note 2 from the AC Characteristics: Internal RC Accuracy

(see Table 24-18).

Updated the characteristic description for parameter DI35 in the I/O

Timing Requirements (see Table 24-20).

Updated the ADC Module Specification minimum values for

parameters AD05 and AD07, and updated the maximum value for

parameter AD06 (see Table 24-39).

Added Note 1 to the ADC Module Specifications (12-bit Mode) (see

Table 24-40).

Added Note 1 to the ADC Module Specifications (10-bit Mode) (see

Table 24-41).

Added DMA Read/Write Timing Requirements (see Table 24-44).

Section 25.0 “High Temperature Electrical

Characteristics”

Updated all ambient temperature end range values to +150ºC

throughout the chapter.

Updated the storage temperature end range to +160ºC.

Updated the maximum junction temperature from +145ºC to +155ºC.

Updated the maximum values for High Temperature Devices in the

Thermal Operating Conditions (see Table 25-2).

Added Note 3 and updated the ADC Module Specifications (12-bit

Mode), removing all parameters with the exception of HAD33a (see

Table 25-15).

Added Note 3 and updated the ADC Module Specifications (10-bit

Mode), removing all parameters with the exception of HAD33b (see

Table 25-16).

DS70592D-page 314

 2009-2012 Microchip Technology Inc.

PIC24HJXXXGPX06A/X08A/X10A

Revision D (June 2012)

This revision includes typographical and formatting

changes throughout the data sheet text.

All other major changes are referenced by their

respective section in the following table.

TABLE B-3:

MAJOR SECTION UPDATES

Section Name

Update Description

Section 2.0 “Guidelines for Getting Started Updated the Recommended Minimum Connection (see Figure 2-1).

with 16-Bit Microcontrollers”

Section 9.0 “Oscillator Configuration”

Updated the COSC<2:0> and NOSC<2:0> bit value definitions for

‘001’ (see Register 9-1).

Section 20.0 “10-bit/12-bit Analog-to-Digital Updated the Analog-to-Digital Conversion Clock Period Block

Converter (ADC)”

Diagram (see Figure 20-2).

Section 21.0 “Special Features”

Added Note 3 to the On-chip Voltage Regulator Connections (see

Figure 21-1).

Section 24.0 “Electrical Characteristics”

Updated “Absolute Maximum Ratings”.

Updated Operating MIPS vs. Voltage (see Table 24-1).

Removed parameter DC18 from the DC Temperature and Voltage

Specifications (see Table 24-4).

Updated the notes in the following tables:

• Table 24-5

• Table 24-6

• Table 24-7

• Table 24-8

Updated the I/O Pin Output Specifications (see Table 24-10).

Updated the Conditions for parameter BO10 (see Table 24-11).

Updated the Conditions for parameters D136b, D137b, and D138b

(TA = 150ºC) (see Table 24-12).

Section 25.0 “High Temperature Electrical Updated “Absolute Maximum Ratings”.

Characteristics”

Updated the I/O Pin Output Specifications (see Table 25-6).

Removed Table 25-7: DC Characteristics: Program Memory.

 2009-2012 Microchip Technology Inc.

DS70592D-page 315

PIC24HJXXXGPX06A/X08A/X10A

NOTES:

DS70592D-page 316

 2009-2012 Microchip Technology Inc.

PIC24HJXXXGPX06A/X08A/X10A

INDEX

Customer Notification Service .......................................... 321

Customer Support............................................................. 321

A

AC Characteristics .................................................... 252, 291

ADC Module.............................................................. 294

ADC Module (10-bit Mode) ....................................... 294

ADC Module (12-bit Mode) ....................................... 294

Internal RC Accuracy................................................ 254

Load Conditions................................................ 252, 291

ADC Module

ADC1 Register Map.................................................... 42

ADC2 Register Map.................................................... 42

Alternate Interrupt Vector Table (AIVT) .............................. 69

Analog-to-Digital Converter............................................... 207

DMA.......................................................................... 207

Initialization ............................................................... 207

Key Features............................................................. 207

Arithmetic Logic Unit (ALU)................................................. 28

Assembler

D

Data Address Space........................................................... 31

Alignment.................................................................... 31

Memory Map for PIC24HJXXXGPX06A/X08A/X10A

Devices with 16 KB RAM.................................... 33

Memory Map for PIC24HJXXXGPX06A/X08A/X10A

Devices with 8 KB RAM...................................... 32

Near Data Space........................................................ 31

Software Stack ........................................................... 53

Width .......................................................................... 31

DC and AC Characteristics

Graphs and Tables................................................... 297

DC Characteristics............................................................ 242

Doze Current (IDOZE)................................................ 289

High Temperature..................................................... 288

I/O Pin Input Specifications ...................................... 248

I/O Pin Output Specifications............................ 250, 290

Idle Current (IDOZE) .................................................. 247

Idle Current (IIDLE).................................................... 245

Operating Current (IDD) ............................................ 244

Operating MIPS vs. Voltage ..................................... 288

Power-Down Current (IPD)........................................ 246

Power-down Current (IPD) ........................................ 288

Program Memory...................................................... 251

Temperature and Voltage......................................... 288

Temperature and Voltage Specifications.................. 243

Thermal Operating Conditions.................................. 288

Development Support....................................................... 237

DMA Module

MPASM Assembler................................................... 238

Automatic Clock Stretch.................................................... 166

B

Block Diagrams

16-bit Timer1 Module................................................ 145

ADC1 Module............................................................ 208

Connections for On-Chip Voltage Regulator............. 226

ECAN Module ........................................................... 180

Input Capture ............................................................ 153

Output Compare ....................................................... 155

PIC24H ....................................................................... 16

PIC24H CPU Core...................................................... 24

PIC24H Oscillator System Diagram.......................... 123

PIC24H PLL.............................................................. 125

Reset System.............................................................. 65

Shared Port Structure ............................................... 141

SPI ............................................................................ 159

Timer2 (16-bit) .......................................................... 149

Timer2/3 (32-bit) ....................................................... 148

UART ........................................................................ 173

Watchdog Timer (WDT)............................................ 227

DMA Register Map ..................................................... 43

DMAC Registers............................................................... 114

DMAxCNT ................................................................ 114

DMAxCON................................................................ 114

DMAxPAD ................................................................ 114

DMAxREQ................................................................ 114

DMAxSTA................................................................. 114

DMAxSTB................................................................. 114

C

E

C Compilers

ECAN Module

MPLAB C18 .............................................................. 238

Clock Switching................................................................. 131

Enabling.................................................................... 131

Sequence.................................................................. 131

Code Examples

Erasing a Program Memory Page............................... 62

Initiating a Programming Sequence............................ 63

Loading Write Buffers ................................................. 63

Port Write/Read ........................................................ 142

PWRSAV Instruction Syntax..................................... 133

Code Protection ........................................................ 221, 228

Configuration Bits.............................................................. 221

Description (Table).................................................... 222

Configuration Register Map .............................................. 221

Configuring Analog Port Pins............................................ 142

CPU

CiFMSKSEL2 register .............................................. 199

ECAN1 Register Map (C1CTRL1.WIN = 0 or 1)......... 44

ECAN1 Register Map (C1CTRL1.WIN = 0)................ 45

ECAN1 Register Map (C1CTRL1.WIN = 1)................ 45

ECAN2 Register Map (C2CTRL1.WIN = 0 or 1)......... 47

ECAN2 Register Map (C2CTRL1.WIN = 0)................ 47

ECAN2 Register Map (C2CTRL1.WIN = 1)................ 48

Frame Types ............................................................ 179

Modes of Operation.................................................. 181

Overview................................................................... 179

ECAN Registers

Filter 15-8 Mask Selection Register

(CiFMSKSEL2)................................................. 199

Electrical Characteristics .................................................. 241

AC..................................................................... 252, 291

Enhanced CAN Module .................................................... 179

Equations

Device Operating Frequency.................................... 124

FOSC Calculation..................................................... 124

XT with PLL Mode Example ..................................... 125

Errata.................................................................................. 13

Control Register.......................................................... 26

CPU Clocking System....................................................... 124

PLL Configuration ..................................................... 124

Selection ................................................................... 124

Sources..................................................................... 124

Customer Change Notification Service ............................. 321

 2009-2012 Microchip Technology Inc.

DS70592D-page 317

PIC24HJXXXGPX06A/X08A/X10A

F

M

Flash Program Memory.......................................................59

Control Registers ........................................................60

Operations ..................................................................60

Programming Algorithm ..............................................62

RTSP Operation..........................................................60

Table Instructions........................................................59

Flexible Configuration .......................................................221

FSCM

Memory Organization ......................................................... 29

Microchip Internet Web Site.............................................. 321

Modes of Operation

Disable...................................................................... 181

Initialization............................................................... 181

Listen All Messages.................................................. 181

Listen Only................................................................ 181

Loopback .................................................................. 181

Normal Operation ..................................................... 181

MPLAB ASM30 Assembler, Linker, Librarian................... 238

MPLAB Integrated Development

Environment Software .............................................. 237

MPLAB PM3 Device Programmer .................................... 240

MPLAB REAL ICE In-Circuit Emulator System ................ 239

MPLINK Object Linker/MPLIB Object Librarian................ 238

Multi-Bit Data Shifter........................................................... 28

Delay for Crystal and PLL Clock Sources...................68

Device Resets.............................................................68

H

High Temperature Electrical Characteristics.....................287

I

I/O Ports............................................................................141

Parallel I/O (PIO).......................................................141

Write/Read Timing ....................................................142

N

2

I C

NVM Module

Operating Modes ......................................................165

Registers...................................................................167

I C Module

Register Map .............................................................. 52

2

O

I2C1 Register Map ......................................................40

I2C2 Register Map ......................................................40

In-Circuit Debugger...........................................................228

In-Circuit Emulation...........................................................221

In-Circuit Serial Programming (ICSP) ....................... 221, 228

Input Capture

Registers...................................................................154

Input Change Notification Module.....................................142

Instruction Addressing Modes.............................................53

File Register Instructions ............................................53

Fundamental Modes Supported..................................54

MCU Instructions ........................................................53

Move and Accumulator Instructions............................54

Other Instructions........................................................54

Instruction Set

Open-Drain Configuration................................................. 142

Output Compare ............................................................... 155

P

Packaging......................................................................... 301

Details....................................................................... 304

Marking..................................................................... 301

Peripheral Module Disable (PMD) .................................... 134

Pinout I/O Descriptions (table)............................................ 17

PMD Module

Register Map .............................................................. 52

POR and Long Oscillator Start-up Times ........................... 68

PORTA

Register Map .............................................................. 50

PORTB

Register Map .............................................................. 50

PORTC

Register Map .............................................................. 50

PORTD

Register Map .............................................................. 50

PORTE

Overview ...................................................................231

Summary...................................................................229

Instruction-Based Power-Saving Modes...........................133

Idle ............................................................................134

Sleep.........................................................................133

Internal RC Oscillator

Register Map .............................................................. 51

PORTF

Register Map .............................................................. 51

PORTG

Register Map .............................................................. 51

Power-Saving Features .................................................... 133

Clock Frequency and Switching ............................... 133

Program Address Space..................................................... 29

Construction ............................................................... 55

Data Access from Program Memory Using

Program Space Visibility..................................... 58

Data Access from Program Memory

Use with WDT...........................................................227

Internet Address................................................................321

Interrupt Control and Status Registers................................73

IECx ............................................................................73

IFSx.............................................................................73

INTCON1 ....................................................................73

INTCON2 ....................................................................73

INTTREG ....................................................................73

IPCx ............................................................................73

Interrupt Setup Procedures...............................................111

Initialization ...............................................................111

Interrupt Disable........................................................111

Interrupt Service Routine ..........................................111

Trap Service Routine ................................................111

Interrupt Vector Table (IVT) ................................................69

Interrupts Coincident with Power Save Instructions..........134

Using Table Instructions..................................... 57

Data Access from, Address Generation ..................... 56

Memory Map............................................................... 29

Table Read Instructions

TBLRDH ............................................................. 57

TBLRDL.............................................................. 57

Visibility Operation...................................................... 58

Program Memory

J

JTAG Boundary Scan Interface ........................................221

Interrupt Vector........................................................... 30

Organization ............................................................... 30

Reset Vector............................................................... 30

DS70592D-page 318

 2009-2012 Microchip Technology Inc.

PIC24HJXXXGPX06A/X08A/X10A

ICxCON (Input Capture x Control)............................ 154

IEC0 (Interrupt Enable Control 0)............................... 85

R

Reader Response............................................................. 322

Registers

IEC1 (Interrupt Enable Control 1)............................... 87

IEC2 (Interrupt Enable Control 2)............................... 89

IEC3 (Interrupt Enable Control 3)............................... 91

IEC4 (Interrupt Enable Control 4)............................... 92

IFS0 (Interrupt Flag Status 0)..................................... 77

IFS1 (Interrupt Flag Status 1)..................................... 79

IFS2 (Interrupt Flag Status 2)..................................... 81

IFS3 (Interrupt Flag Status 3)..................................... 83

IFS4 (Interrupt Flag Status 4)..................................... 84

INTCON1 (Interrupt Control 1) ................................... 75

INTCON2 (Interrupt Control 2) ................................... 76

IPC0 (Interrupt Priority Control 0)............................... 93

IPC1 (Interrupt Priority Control 1)............................... 94

IPC10 (Interrupt Priority Control 10)......................... 103

IPC11 (Interrupt Priority Control 11)......................... 104

IPC12 (Interrupt Priority Control 12)......................... 105

IPC13 (Interrupt Priority Control 13)......................... 106

IPC14 (Interrupt Priority Control 14)......................... 107

IPC15 (Interrupt Priority Control 15)......................... 107

IPC16 (Interrupt Priority Control 16)................. 108, 110

IPC17 (Interrupt Priority Control 17)......................... 109

IPC2 (Interrupt Priority Control 2)............................... 95

IPC3 (Interrupt Priority Control 3)............................... 96

IPC4 (Interrupt Priority Control 4)............................... 97

IPC5 (Interrupt Priority Control 5)............................... 98

IPC6 (Interrupt Priority Control 6)............................... 99

IPC7 (Interrupt Priority Control 7)............................. 100

IPC8 (Interrupt Priority Control 8)............................. 101

IPC9 (Interrupt Priority Control 9)............................. 102

NVMCON (Flash Memory Control)............................. 61

OCxCON (Output Compare x Control)..................... 157

OSCCON (Oscillator Control)................................... 126

OSCTUN (FRC Oscillator Tuning)............................ 130

PLLFBD (PLL Feedback Divisor) ............................. 129

PMD1 (Peripheral Module Disable Control

ADxCHS0 (ADCx Input Channel 0 Select................. 217

ADxCHS123 (ADCx Input

Channel 1, 2, 3 Select) ..................................... 216

ADxCON1 (ADCx Control 1)..................................... 211

ADxCON2 (ADCx Control 2)..................................... 213

ADxCON3 (ADCx Control 3)..................................... 214

ADxCON4 (ADCx Control 4)..................................... 215

ADxCSSH (ADCx Input Scan Select High)............... 218

ADxCSSL (ADCx Input Scan Select Low) ................ 218

ADxPCFGH (ADCx Port Configuration High) ........... 219

ADxPCFGL (ADCx Port Configuration Low)............. 220

CiBUFPNT1 (ECAN Filter 0-3 Buffer Pointer)........... 193

CiBUFPNT2 (ECAN Filter 4-7 Buffer Pointer)........... 194

CiBUFPNT3 (ECAN Filter 8-11 Buffer Pointer)......... 195

CiBUFPNT4 (ECAN Filter 12-15 Buffer Pointer)....... 196

CiCFG1 (ECAN Baud Rate Configuration 1) ............ 190

CiCFG2 (ECAN Baud Rate Configuration 2) ............ 191

CiCTRL1 (ECAN Control 1) ...................................... 182

CiCTRL2 (ECAN Control 2) ...................................... 183

CiEC (ECAN Transmit/Receive Error Count)............ 189

CiFCTRL (ECAN FIFO Control)................................ 185

CiFEN1 (ECAN Acceptance Filter Enable)............... 192

CiFIFO (ECAN FIFO Status)..................................... 186

CiFMSKSEL1 (ECAN Filter 7-0 Mask

Selection).................................................. 198, 199

CiINTE (ECAN Interrupt Enable) .............................. 188

CiINTF (ECAN Interrupt Flag)................................... 187

CiRXFnEID (ECAN Acceptance Filter n

Extended Identifier)........................................... 197

CiRXFnSID (ECAN Acceptance Filter n

Standard Identifier) ........................................... 197

CiRXFUL1 (ECAN Receive Buffer Full 1)................. 201

CiRXFUL2 (ECAN Receive Buffer Full 2)................. 201

CiRXMnEID (ECAN Acceptance Filter Mask n

Extended Identifier)........................................... 200

CiRXMnSID (ECAN Acceptance Filter Mask n

Register 1)........................................................ 135

PMD1 (Peripheral Module Disable Control

Register 1)........................................................ 135

PMD2 (Peripheral Module Disable Control

Register 2)........................................................ 137

PMD3 (Peripheral Module Disable Control

Standard Identifier) ........................................... 200

CiRXOVF1 (ECAN Receive Buffer Overflow 1)........ 202

CiRXOVF2 (ECAN Receive Buffer Overflow 2)........ 202

CiTRBnDLC (ECAN Buffer n Data

Register 3)........................................................ 139

RCON (Reset Control)................................................ 66

SPIxCON1 (SPIx Control 1) ..................................... 162

SPIxCON2 (SPIx Control 2) ..................................... 164

SPIxSTAT (SPIx Status and Control)....................... 161

SR (CPU Status) .................................................. 26, 74

T1CON (Timer1 Control) .......................................... 146

TxCON (T2CON, T4CON, T6CON or

T8CON Control)................................................ 150

TyCON (T3CON, T5CON, T7CON or

T9CON Control)................................................ 151

UxMODE (UARTx Mode) ......................................... 175

UxSTA (UARTx Status and Control) ........................ 177

Length Control)................................................. 205

CiTRBnEID (ECAN Buffer n Extended Identifier) ..... 204

CiTRBnSID (ECAN Buffer n Standard Identifier)...... 204

CiTRBnSTAT (ECAN Receive Buffer n Status)........ 206

CiTRmnCON (ECAN TX/RX Buffer m Control)......... 203

CiVEC (ECAN Interrupt Code).................................. 184

CLKDIV (Clock Divisor)............................................. 128

CORCON (Core Control) ...................................... 27, 74

DMACS0 (DMA Controller Status 0)......................... 119

DMACS1 (DMA Controller Status 1)......................... 121

DMAxCNT (DMA Channel x Transfer Count) ........... 118

DMAxCON (DMA Channel x Control)....................... 115

DMAxPAD (DMA Channel x Peripheral Address)..... 118

DMAxREQ (DMA Channel x IRQ Select) ................. 116

DMAxSTA (DMA Channel x RAM Start

Reset

Clock Source Selection .............................................. 67

Special Function Register Reset States..................... 68

Times.......................................................................... 67

Reset Sequence ................................................................. 69

Resets ................................................................................ 65

Address A) ........................................................ 117

DMAxSTB (DMA Channel x RAM Start

Address B) ........................................................ 117

DSADR (Most Recent DMA RAM Address).............. 122

I2CxCON (I2Cx Control) ........................................... 168

I2CxMSK (I2Cx Slave Mode Address Mask) ............ 172

I2CxSTAT (I2Cx Status) ........................................... 170

 2009-2012 Microchip Technology Inc.

DS70592D-page 319

PIC24HJXXXGPX06A/X08A/X10A

Timing Specifications

S

10-bit Analog-to-Digital Conversion

Serial Peripheral Interface (SPI) .......................................159

Software Simulator (MPLAB SIM).....................................239

Software Stack Pointer, Frame Pointer

CALL Stack Frame......................................................53

Special Features ...............................................................221

SPI Module

SPI1 Register Map......................................................41

SPI2 Register Map......................................................41

Symbols Used in Opcode Descriptions.............................230

System Control

Requirements ................................................... 285

CAN I/O Requirements............................................. 278

I2Cx Bus Data Requirements (Master Mode)........... 275

I2Cx Bus Data Requirements (Slave Mode)............. 277

Output Compare Requirements................................ 260

PLL Clock ......................................................... 254, 291

Reset, Watchdog Timer, Oscillator Start-up Timer,

Power-up Timer and Brown-out

Reset Requirements......................................... 257

Simple OC/PWM Mode Requirements ..................... 261

Timer1 External Clock Requirements....................... 258

Timer2 External Clock Requirements....................... 259

Timer3 External Clock Requirements....................... 259

Register Map...............................................................52

T

Temperature and Voltage Specifications

AC ..................................................................... 252, 291

Timer1...............................................................................145

Timer2/3, Timer4/5, Timer6/7 and Timer8/9 .....................147

Timing Characteristics

CLKO and I/O ...........................................................255

Timing Diagrams

U

UART Module

UART1 Register Map.................................................. 40

UART2 Register Map.................................................. 41

V

10-bit Analog-to-Digital Conversion (CHPS<1:0> = 01,

SIMSAM = 0, ASAM = 1, SSRC<2:0> = 111,

SAMC<4:0> = 00001).......................................284

10-bit Analog-to-Digtial Conversion (CHPS<1:0> = 01,

SIMSAM = 0, ASAM = 0,

Voltage Regulator (On-Chip) ............................................ 226

W

Watchdog Timer (WDT)............................................ 221, 227

Programming Considerations ................................... 227

WWW Address ................................................................. 321

WWW, On-Line Support ..................................................... 13

SSRC<2:0> = 000) ...........................................284

12-bit Analog-to-Digital Conversion

(ASAM = 0, SSRC<2:0> = 000)........................282

ECAN I/O ..................................................................278

External Clock...........................................................253

I2Cx Bus Data (Master Mode) ..................................274

I2Cx Bus Data (Slave Mode) ....................................276

I2Cx Bus Start/Stop Bits (Master Mode)...................274

I2Cx Bus Start/Stop Bits (Slave Mode).....................276

Input Capture (CAPx)................................................260

OC/PWM...................................................................261

Output Compare (OCx).............................................260

Reset, Watchdog Timer, Oscillator Start-up Timer

and Power-up Timer .........................................256

Timer1, 2 and 3 External Clock.................................258

Timing Requirements

ADC Conversion (10-bit mode).................................295

ADC Conversion (12-bit Mode).................................295

CLKO and I/O ...........................................................255

External Clock...........................................................253

Input Capture ............................................................260

SPIx Master Mode (CKE = 0)....................................292

SPIx Module Master Mode (CKE = 1).......................292

SPIx Module Slave Mode (CKE = 0).........................293

SPIx Module Slave Mode (CKE = 1).........................293

DS70592D-page 320

 2009-2012 Microchip Technology Inc.

PIC24HJXXXGPX06A/X08A/X10A

THE MICROCHIP WEB SITE

CUSTOMER SUPPORT

Microchip provides online support via our WWW site at

www.microchip.com. This web site is used as a means

to make files and information easily available to

customers. Accessible by using your favorite Internet

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Customers

should

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distributor,

representative or field application engineer (FAE) for

support. Local sales offices are also available to help

customers. A listing of sales offices and locations is

included in the back of this document.

• General Technical Support – Frequently Asked

Questions (FAQs), technical support requests,

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Technical support is available through the web site

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CUSTOMER CHANGE NOTIFICATION

SERVICE

Microchip’s customer notification service helps keep

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will receive e-mail notification whenever there are

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To register, access the Microchip web site at

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“Customer Change Notification” and follow the

registration instructions.

 2009-2012 Microchip Technology Inc.

DS70592D-page 321

PIC24HJXXXGPX06A/X08A/X10A

READER RESPONSE

It is our intention to provide you with the best documentation possible to ensure successful use of your Microchip

product. If you wish to provide your comments on organization, clarity, subject matter, and ways in which our

documentation can better serve you, please FAX your comments to the Technical Publications Manager at

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Please list the following information, and use this outline to provide us with your comments about this document.

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Telephone: (_______) _________ - _________

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Y

N

Device: PIC24HJXXXGPX06A/X08A/X10A

Questions:

1. What are the best features of this document?

2. How does this document meet your hardware and software development needs?

3. Do you find the organization of this document easy to follow? If not, why?

4. What additions to the document do you think would enhance the structure and subject?

5. What deletions from the document could be made without affecting the overall usefulness?

6. Is there any incorrect or misleading information (what and where)?

7. How would you improve this document?

DS70592D-page 322

 2009-2012 Microchip Technology Inc.

PIC24HJXXXGPX06A/X08A/X10A

PRODUCT IDENTIFICATION SYSTEM

To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office.

Examples:

PIC 24 HJ 256 GP6 10 A T I/PT - XXX

a)

b)

PIC24HJ256GP210AI/PT:

General-purpose PIC24H, 256 KB program

memory, 100-pin, Industrial temp.,

TQFP package.

Microchip Trademark

Architecture

PIC24HJ64GP506AI/PT-ES:

Flash Memory Family

General-purpose PIC24H, 64 KB program

memory, 64-pin, Industrial temp.,

TQFP package, Engineering Sample.

Program Memory Size (KB)

Product Group

Pin Count

Revision Level

Tape and Reel Flag (if applicable)

Temperature Range

Package

Pattern

Architecture:

24

=

16-bit Microcontroller

Flash Memory Family: HJ

Flash program memory, 3.3V, High-speed

Product Group:

GP2

=

General purpose family

GP3

GP5

GP6

Pin Count:

06

10

=

64-pin

100-pin

Temperature Range:

I

E

H

=

-40C to+85C(Industrial)

-40C to+125C(Extended)

-40C to+150C(High)

Package:

Pattern:

PT

PF

MR

=

10x10 or 12x12 mm TQFP (Thin Quad Flatpack)

14x14 mm TQFP (Thin Quad Flatpack)

9x9x0.9 mm QFN (Thin Quad Flatpack)

Three-digit QTP, SQTP, Code or Special Requirements

(blank otherwise)

ES

=

Engineering Sample

 2009-2012 Microchip Technology Inc.

DS70592D-page 323

PIC24HJXXXGPX06A/X08A/X10A

NOTES:

DS70592D-page 324

 2009-2012 Microchip Technology Inc.

Note the following details of the code protection feature on Microchip devices:

•

Microchip products meet the specification contained in their particular Microchip Data Sheet.

•

Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the

intended manner and under normal conditions.

•

There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our

knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data

Sheets. Most likely, the person doing so is engaged in theft of intellectual property.

•

Microchip is willing to work with the customer who is concerned about the integrity of their code.

Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not

mean that we are guaranteeing the product as “unbreakable.”

Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our

products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts

allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act.

Information contained in this publication regarding device

applications and the like is provided only for your convenience

and may be superseded by updates. It is your responsibility to

ensure that your application meets with your specifications.

MICROCHIP MAKES NO REPRESENTATIONS OR

WARRANTIES OF ANY KIND WHETHER EXPRESS OR

IMPLIED, WRITTEN OR ORAL, STATUTORY OR

OTHERWISE, RELATED TO THE INFORMATION,

INCLUDING BUT NOT LIMITED TO ITS CONDITION,

QUALITY, PERFORMANCE, MERCHANTABILITY OR

FITNESS FOR PURPOSE. Microchip disclaims all liability

arising from this information and its use. Use of Microchip

devices in life support and/or safety applications is entirely at

the buyer’s risk, and the buyer agrees to defend, indemnify and

hold harmless Microchip from any and all damages, claims,

suits, or expenses resulting from such use. No licenses are

conveyed, implicitly or otherwise, under any Microchip

intellectual property rights.

Trademarks

The Microchip name and logo, the Microchip logo, dsPIC,

KEELOQ, KEELOQ logo, MPLAB, PIC, PICmicro, PICSTART,

32

PIC logo, rfPIC and UNI/O are registered trademarks of

Microchip Technology Incorporated in the U.S.A. and other

countries.

FilterLab, Hampshire, HI-TECH C, Linear Active Thermistor,

MXDEV, MXLAB, SEEVAL and The Embedded Control

Solutions Company are registered trademarks of Microchip

Technology Incorporated in the U.S.A.

Analog-for-the-Digital Age, Application Maestro, chipKIT,

chipKIT logo, CodeGuard, dsPICDEM, dsPICDEM.net,

dsPICworks, dsSPEAK, ECAN, ECONOMONITOR,

FanSense, HI-TIDE, In-Circuit Serial Programming, ICSP,

Mindi, MiWi, MPASM, MPLAB Certified logo, MPLIB,

MPLINK, mTouch, Omniscient Code Generation, PICC,

PICC-18, PICDEM, PICDEM.net, PICkit, PICtail, REAL ICE,

rfLAB, Select Mode, Total Endurance, TSHARC,

UniWinDriver, WiperLock and ZENA are trademarks of

Microchip Technology Incorporated in the U.S.A. and other

countries.

SQTP is a service mark of Microchip Technology Incorporated

in the U.S.A.

All other trademarks mentioned herein are property of their

respective companies.

Printed on recycled paper.

ISBN: 978-1-62076-345-2

QUALITY MANAGEMENT SYSTEM

CERTIFIED BY DNV

Microchip received ISO/TS-16949:2009 certification for its worldwide

headquarters, design and wafer fabrication facilities in Chandler and

Tempe, Arizona; Gresham, Oregon and design centers in California

and India. The Company’s quality system processes and procedures

are for its PIC^®MCUs and dsPIC^®DSCs, KEELOQ^®code hopping

devices, Serial EEPROMs, microperipherals, nonvolatile memory and

analog products. In addition, Microchip’s quality system for the design

and manufacture of development systems is ISO 9001:2000 certified.

== ISO/TS 16949 ==

 2009-2012 Microchip Technology Inc.

DS70592D-page 325

Worldwide Sales and Service

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Technical Support:

http://www.microchip.com/

support

Asia Pacific Office

Suites 3707-14, 37th Floor

Tower 6, The Gateway

Harbour City, Kowloon

Hong Kong

Tel: 852-2401-1200

Fax: 852-2401-3431

India - Bangalore

Tel: 91-80-3090-4444

Fax: 91-80-3090-4123

Austria - Wels

Tel: 43-7242-2244-39

Fax: 43-7242-2244-393

Denmark - Copenhagen

Tel: 45-4450-2828

Fax: 45-4485-2829

India - New Delhi

Tel: 91-11-4160-8631

Fax: 91-11-4160-8632

France - Paris

Tel: 33-1-69-53-63-20

Fax: 33-1-69-30-90-79

India - Pune

Tel: 91-20-2566-1512

Fax: 91-20-2566-1513

Australia - Sydney

Tel: 61-2-9868-6733

Fax: 61-2-9868-6755

Web Address:

www.microchip.com

Germany - Munich

Tel: 49-89-627-144-0

Fax: 49-89-627-144-44

Japan - Osaka

Tel: 81-66-152-7160

Fax: 81-66-152-9310

Atlanta

Duluth, GA

Tel: 678-957-9614

Fax: 678-957-1455

China - Beijing

Tel: 86-10-8569-7000

Fax: 86-10-8528-2104

Italy - Milan

Tel: 39-0331-742611

Fax: 39-0331-466781

Japan - Yokohama

Tel: 81-45-471- 6166

Fax: 81-45-471-6122

China - Chengdu

Tel: 86-28-8665-5511

Fax: 86-28-8665-7889

Boston

Westborough, MA

Tel: 774-760-0087

Fax: 774-760-0088

Netherlands - Drunen

Tel: 31-416-690399

Fax: 31-416-690340

Korea - Daegu

Tel: 82-53-744-4301

Fax: 82-53-744-4302

China - Chongqing

Tel: 86-23-8980-9588

Fax: 86-23-8980-9500

Chicago

Itasca, IL

Tel: 630-285-0071

Fax: 630-285-0075

Spain - Madrid

Tel: 34-91-708-08-90

Fax: 34-91-708-08-91

Korea - Seoul

China - Hangzhou

Tel: 86-571-2819-3187

Fax: 86-571-2819-3189

Tel: 82-2-554-7200

Fax: 82-2-558-5932 or

82-2-558-5934

UK - Wokingham

Tel: 44-118-921-5869

Fax: 44-118-921-5820

Cleveland

Independence, OH

Tel: 216-447-0464

Fax: 216-447-0643

China - Hong Kong SAR

Tel: 852-2401-1200

Fax: 852-2401-3431

Malaysia - Kuala Lumpur

Tel: 60-3-6201-9857

Fax: 60-3-6201-9859

Dallas

Addison, TX

Tel: 972-818-7423

Fax: 972-818-2924

China - Nanjing

Tel: 86-25-8473-2460

Fax: 86-25-8473-2470

Malaysia - Penang

Tel: 60-4-227-8870

Fax: 60-4-227-4068

China - Qingdao

Tel: 86-532-8502-7355

Fax: 86-532-8502-7205

Philippines - Manila

Tel: 63-2-634-9065

Fax: 63-2-634-9069

Detroit

Farmington Hills, MI

Tel: 248-538-2250

Fax: 248-538-2260

China - Shanghai

Tel: 86-21-5407-5533

Fax: 86-21-5407-5066

Singapore

Tel: 65-6334-8870

Fax: 65-6334-8850

Indianapolis

Noblesville, IN

Tel: 317-773-8323

Fax: 317-773-5453

China - Shenyang

Tel: 86-24-2334-2829

Fax: 86-24-2334-2393

Taiwan - Hsin Chu

Tel: 886-3-5778-366

Fax: 886-3-5770-955

Los Angeles

China - Shenzhen

Tel: 86-755-8203-2660

Fax: 86-755-8203-1760

Taiwan - Kaohsiung

Tel: 886-7-536-4818

Fax: 886-7-330-9305

Mission Viejo, CA

Tel: 949-462-9523

Fax: 949-462-9608

China - Wuhan

Tel: 86-27-5980-5300

Fax: 86-27-5980-5118

Taiwan - Taipei

Tel: 886-2-2500-6610

Fax: 886-2-2508-0102

Santa Clara

Santa Clara, CA

Tel: 408-961-6444

Fax: 408-961-6445

China - Xian

Tel: 86-29-8833-7252

Fax: 86-29-8833-7256

Thailand - Bangkok

Tel: 66-2-694-1351

Fax: 66-2-694-1350

Toronto

Mississauga, Ontario,

Canada

China - Xiamen

Tel: 905-673-0699

Fax: 905-673-6509

Tel: 86-592-2388138

Fax: 86-592-2388130

China - Zhuhai

Tel: 86-756-3210040

Fax: 86-756-3210049

11/29/11

DS70592D-page 326

 2009-2012 Microchip Technology Inc.


型号：	PIC24HJ256GP610ATI/PF
厂家：	MICROCHIP
描述：	16-BIT, FLASH, 40 MHz, MICROCONTROLLER, PQFP100, 14 X 14 MM, 1 MM HEIGHT, LEAD FREE, PLASTIC, TQFP-100 时钟微控制器外围集成电路
文件：	总326页 (文件大小：4874K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

PIC24HJ256GP610ATI/PF [MICROCHIP]

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