TC1072-3.3VCH_技术文档

TC1072/TC1073

50mA and 100mA CMOS LDOs with Shutdown, ERROR Output and V_REFBypass

Features:

Device Selection Table

Junction

Temp. Range

• Zero Ground Current for Longer Battery Life

• Very Low Dropout Voltage

Part Number

Package

TC1072-xxVCH 6-Pin SOT-23A -40°C to +125°C

TC1073-xxVCH 6-Pin SOT-23A -40°C to +125°C

• Choice of 50 mA (TC1072) and 100 mA (TC1073)

Output

• High Output Voltage Accuracy

• Standard or Custom Output Voltages

• Power-Saving Shutdown Mode

Note:

xx indicates output voltages.

Available Output Voltages: 2.5, 2.7, 2.8, 2.85, 3.0, 3.3,

3.6, 4.0, 5.0.

• ERROR Output Can Be Used as a Low Battery

Detector or Processor Reset Generator

Other output voltages are available. Please contact

Microchip Technology Inc. for details.

• Bypass Input for Ultra Quiet Operation

• Over Current and Over Temperature Protection

• Space-Saving 6-Pin SOT-23A Package

• Pin Compatible Upgrades for Bipolar Regulators

Package Type

6-Pin SOT-23A

V

Bypass

5

OUT

ERROR

4

Applications:

6

• Battery Operated Systems

• Portable Computers

• Medical Instruments

• Instrumentation

TC1072

TC1073

1

2

3

• Cellular/GSM/PHS Phones

• Linear Post-Regulators for SMPS

• Pagers

V

GND SHDN

IN

NOTE: 6-Pin SOT-23A is equivalent to the EIAJ (SC-74A)

DS21354C-page 1

TC1072/TC1073

General Description

Typical Application

The TC1072 and TC1073 are high accuracy (typically

±0.5%) CMOS upgrades for older (bipolar) low dropout

regulators. Designed specifically for battery-operated

systems, the devices’ CMOS construction eliminates

wasted ground current, significantly extending battery

life. Total supply current is typically 50 μA at full load (20

to 60 times lower than in bipolar regulators).

R

P

1

6

5

V

OUT

IN

OUT

+

TC1072

TC1073

1 μF

2

3

GND

Bypass

The devices’ key features include ultra low noise

operation (plus optional Bypass input); very low

dropout voltage (typically 85 mV, TC1072 and 180 mV,

TC1073 at full load) and fast response to step changes

in load. An error output (ERROR) is asserted when the

devices are out-of-regulation (due to a low input

voltage or excessive output current). ERROR can be

used as a low battery warning or as a processor

RESET signal (with the addition of an external RC

network). Supply current is reduced to 0.5 μA (max)

C

BYPASS

470 pF

4

ERROR

SHDN

ERROR

and both V

and ERROR are disabled when the

OUT

Shutdown Control

(from Power Control Logic)

shutdown input is low. The devices incorporate both

over-temperature and over-current protection.

The TC1072 and TC1073 are stable with an output

capacitor of only 1 μF and have a maximum output

current of 50 mA, and 100 mA, respectively. For higher

output current versions, please see the TC1185,

TC1186, TC1187 (I_OUT= 150 mA) and TC1107,

TC1108 and TC1173 (I_OUT= 300 mA) data sheets.

DS21354C-page 2

TC1072/TC1073

*Stresses above those listed under "Absolute Maxi-

mum Ratings" may cause permanent damage to the

device. These are stress ratings only and functional

operation of the device at these or any other conditions

above those indicated in the operation sections of the

specifications is not implied. Exposure to Absolute

Maximum Rating conditions for extended periods may

affect device reliability.

1.0

ELECTRICAL

CHARACTERISTICS

Absolute Maximum Ratings*

Input Voltage .........................................................6.5V

Output Voltage .......................... (-0.3V) to (V_IN+ 0.3V)

Power Dissipation ...............Internally Limited (Note 6)

Maximum Voltage on Any Pin ........V_IN+0.3V to -0.3V

Operating Temperature Range ..... -40°C < T_J< 125°C

Storage Temperature .........................-65°C to +150°C

TABLE 1-1:

TC1072/TC1073 ELECTRICAL SPECIFICATIONS

Electrical Characteristics: V = V

+ 1V, I = 0.1 mA, C = 3.3 μF, SHDN > V , T = 25°C, unless otherwise noted. Boldface

IN

OUT

L

IH

A

type specifications apply for junction temperatures of -40°C to +125°C.

Symbol

Parameter

Min

2.7

Typ

Max

6.0

Units

Test Conditions

Note 9

V

Input Operating Voltage

Maximum Output Current

—

V

IN

I

50

100

—

mA

TC1072

TC1073

OUTMAX

V

Output Voltage

V

–

V

±0.5%

V + 2.5%

R

V

Note 1

OUT

R

2.5%

TCV

V

Temperature Coefficient

—

20

40

—

ppm/°C Note 2

OUT

ΔV

/ΔV

Line Regulation

Load Regulation

—

0.05

0.5

0.35

2.0

%

(V + 1V) ≤ V ≤ 6V

R IN

OUT

IN

ΔV

/V

I = 0.1 mA to I

OUT OUT

L

OUTMAX

(Note 3)

V

-V

Dropout Voltage

—

2

65

85

180

—

120

250

mV

I = 0.1 mA

L

IN OUT

I = 20 mA

L

I = 50 mA

L

I = 100 mA (Note 4),

L

TC1073

I

Supply Current

—

50

0.05

64

80

0.5

—

μA

SHDN = V , I = 0 (Note 8)

IN

IH

L

I

Shutdown Supply Current

Power Supply Rejection Ratio

Output Short Circuit Current

Thermal Regulation

SHDN = 0V

F ≤ 1 kHz

RE

INSD

PSRR

dB

I

300

0.04

160

10

450

—

mA

V/W

°C

V

= 0V

OUT

OUTSC

ΔV

/ΔP

Notes 5, 6

OUT

D

T

Thermal Shutdown Die Temperature

Thermal Shutdown Hysteresis

Output Noise

—

SD

ΔT

—

°C

SD

eN

260

—

nV/√Hz I = I

L OUTMAX

470 pF from Bypass to GND

SHDN Input

V

SHDN Input High Threshold

45

—

%V

V

= 2.5V to 6.5V

IH

IN

Note 1: V_Ris the regulator output voltage setting. For example: V_R= 2.5V, 2.7V, 2.85V, 3.0V, 3.3V, 3.6V, 4.0V, 5.0V.

TC V_OUT= (V_OUTMAX– V_OUTMIN) x 10⁶

2:

V_OUTx ΔT

3: Regulation is measured at a constant junction temperature using low duty cycle pulse testing. Load regulation is tested over a load range

from 0.1 mA to the maximum specified output current. Changes in output voltage due to heating effects are covered by the thermal

regulation specification.

4: Dropout voltage is defined as the input to output differential at which the output voltage drops 2% below its nominal value.

5: Thermal Regulation is defined as the change in output voltage at a time T after a change in power dissipation is applied, excluding load or

line regulation effects. Specifications are for a current pulse equal to I_LMAXat V_IN= 6V for T = 10 msec.

6: The maximum allowable power dissipation is a function of ambient temperature, the maximum allowable junction temperature and the

thermal resistance from junction-to-air (i.e., T_A, T_J, θ_JA). Exceeding the maximum allowable power dissipation causes the device to initiate

thermal shutdown. Please see Section 4.0 “Thermal Considerations” for more details.

7: Hysteresis voltage is referenced by V_R.

8: Apply for Junction Temperatures of -40°C to +85°C.

9:

The minimum V_INhas to justify the conditions = V_IN≥ V_R+ V_DROPOUTand V_IN≥ 2.7V for I_L= 0.1 mA to I_OUTMAX.

DS21354C-page 3

TC1072/TC1073

TABLE 1-1:

TC1072/TC1073 ELECTRICAL SPECIFICATIONS (CONTINUED)

Electrical Characteristics: V = V

+ 1V, I = 0.1 mA, C = 3.3 μF, SHDN > V , T = 25°C, unless otherwise noted. Boldface

IN

OUT

L

IH

A

type specifications apply for junction temperatures of -40°C to +125°C.

Symbol

Parameter

Min

Typ

Max

Units

Test Conditions

V

SHDN Input Low Threshold

—

15

%V

V = 2.5V to 6.5V

IN

IL

IN

ERROR Open Drain Output

V

Minimum V Operating Voltage

1.0

—

400

—

V

INMIN

IN

Output Logic Low Voltage

ERROR Threshold Voltage

ERROR Positive Hysteresis

mV

1 mA Flows to ERROR

See Figure 3-2

Note 7

OL

0.95 x V

V

TH

R

50

—

mV

HYS

Note 1: V_Ris the regulator output voltage setting. For example: V_R= 2.5V, 2.7V, 2.85V, 3.0V, 3.3V, 3.6V, 4.0V, 5.0V.

TC V_OUT= (V_OUTMAX– V_OUTMIN) x 10⁶

2:

V_OUTx ΔT

3: Regulation is measured at a constant junction temperature using low duty cycle pulse testing. Load regulation is tested over a load range

from 0.1 mA to the maximum specified output current. Changes in output voltage due to heating effects are covered by the thermal

regulation specification.

4: Dropout voltage is defined as the input to output differential at which the output voltage drops 2% below its nominal value.

5: Thermal Regulation is defined as the change in output voltage at a time T after a change in power dissipation is applied, excluding load or

line regulation effects. Specifications are for a current pulse equal to I_LMAXat V_IN= 6V for T = 10 msec.

6: The maximum allowable power dissipation is a function of ambient temperature, the maximum allowable junction temperature and the

thermal resistance from junction-to-air (i.e., T_A, T_J, θ_JA). Exceeding the maximum allowable power dissipation causes the device to initiate

thermal shutdown. Please see Section 4.0 “Thermal Considerations” for more details.

7: Hysteresis voltage is referenced by V_R.

8: Apply for Junction Temperatures of -40°C to +85°C.

9:

The minimum V_INhas to justify the conditions = V_IN≥ V_R+ V_DROPOUTand V_IN≥ 2.7V for I_L= 0.1 mA to I_OUTMAX

.

DS21354C-page 4

TC1072/TC1073

2.0

PIN DESCRIPTIONS

The descriptions of the pins are listed in Table 2-1.

TABLE 2-1:

PIN FUNCTION TABLE

Symbol

Pin No.

(6-Pin SOT-23A)

Description

1

2

3

V_IN

Unregulated supply input.

Ground terminal.

GND

SHDN

Shutdown control input. The regulator is fully enabled when a logic high is applied

to this input. The regulator enters shutdown when a logic low is applied to this

input. During shutdown, output voltage falls to zero and supply current is reduced

to 0.05 μA (typical).

4

5

6

ERROR

Bypass

V_OUT

Out-of-Regulation Flag. (Open drain output). This output goes low when V_OUTis

out-of-tolerance by approximately – 5%.

Reference bypass input. Connecting a 470 pF to this input further reduces output

noise.

Regulated voltage output.

DS21354C-page 5

TC1072/TC1073

3.0

DETAILED DESCRIPTION

The TC1072 and TC1073 are precision fixed output

voltage regulators. (If an adjustable version is desired,

please see the TC1070/TC1071/TC1187 data sheet.)

Unlike bipolar regulators, the TC1072 and TC1073’s

supply current does not increase with load current. In

addition, V_OUTremains stable and within regulation

over the entire 0 mA to I_OUTMAXload current range, (an

important consideration in RTC and CMOS RAM

battery back-up applications).

V

OUT

HYSTERESIS (V

)

H

V

TH

ERROR

V

IH

V

OL

Figure 3-1 shows a typical application circuit. The

regulator is enabled any time the shutdown input

(SHDN) is at or above V_IH, and shutdown (disabled)

when SHDN is at or below V_IL. SHDN may be

controlled by a CMOS logic gate, or I/O port of a

microcontroller. If the SHDN input is not required, it

should be connected directly to the input supply. While

in shutdown, supply current decreases to 0.05 μA

(typical), V_OUTfalls to zero volts, and ERROR is open-

circuited.

FIGURE 3-2:

Error Output Operation

3.2

Output Capacitor

A 1 μF (min) capacitor from V_OUTto ground is

recommended. The output capacitor should have an

effective series resistance greater than 0.1Ω and less

than 5.0Ω, and a resonant frequency above 1 MHz. A

1 μF capacitor should be connected from V_INto GND

if there is more than 10 inches of wire between the

regulator and the AC filter capacitor, or if a battery is

used as the power source. Aluminum electrolytic or

tantalum capacitor types can be used. (Since many

aluminum electrolytic capacitors freeze at approxi-

mately -30°C, solid tantalums are recommended for

applications operating below -25°C.) When operating

from sources other than batteries, supply-noise

rejection and transient response can be improved by

increasing the value of the input and output capacitors

and employing passive filtering techniques.

V

OUT

IN

OUT

+

1 μF

+

TC1072

TC1073

1 μF

C1

Battery

GND

Bypass

C3, 470 pF

V+

SHDN

ERROR

R1

1M

Shutdown Control

(to CMOS Logic or Tie

to V if unused)

IN

C2 Required Only

if ERROR is used as a

Processor RESET Signal

(See Text)

BATTLOW

or RESET

3.3

Bypass Input

0.2 μF

C2

A 470 pF capacitor connected from the Bypass input to

ground reduces noise present on the internal

reference, which in turn significantly reduces output

noise. If output noise is not a concern, this input may be

left unconnected. Larger capacitor values may be

used, but results in a longer time period to rated output

voltage when power is initially applied.

FIGURE 3-1:

Typical Application Circuit

3.1

ERROR Open Drain Output

ERROR is driven low whenever V_OUTfalls out of

regulation by more than – 5% (typical). This condition

may be caused by low input voltage, output current

limiting, or thermal limiting. The ERROR output voltage

value (e.g. ERROR = V_OLat 4.75V (typ.) for a 5.0V

regulator and 2.85V (typ.) for a 3.0V regulator).

ERROR output operation is shown in Figure 3-2.

Note that ERROR is active when V_OUTfalls to V_TH, and

inactive when V_OUTrises above V_THby V_HYS

.

As shown in Figure 3-1, ERROR can be used as a

battery low flag, or as a processor RESET signal (with

the addition of timing capacitor C2). R1 x C2 should be

chosen to maintain ERROR below V_IHof the processor

RESET input for at least 200 msec to allow time for the

system to stabilize. Pull-up resistor R1 can be tied to

V_OUT, V_INor any other voltage less than (V_IN+ 0.3V).

DS21354C-page 6

TC1072/TC1073

Equation 4-1 can be used in conjunction with Equation

4-2 to ensure regulator thermal operation is within

limits. For example:

4.0

4.1

THERMAL CONSIDERATIONS

Thermal Shutdown

Given:

Integrated thermal protection circuitry shuts the

regulator off when die temperature exceeds 160°C.

The regulator remains off until the die temperature

drops to approximately 150°C.

V_INMAX

= 3.0V ±5%

V_OUTMIN= 2.7V – 2.5%

I_LOADMAX= 40 mA

T_JMAX

T_AMAX

= 125°C

= 55°C

4.2

Power Dissipation

The amount of power the regulator dissipates is

primarily a function of input and output voltage, and

output current. The following equation is used to

calculate worst-case actual power dissipation:

Find: 1. Actual power dissipation

2. Maximum allowable dissipation

Actual power dissipation:

P_D≈ (V_INMAX– V_OUTMIN)I_LOADMAX

= [(3.0 x 1.05) – (2.7 x .975)]40 x 10^–3

= 20.7 mW

EQUATION 4-1:

P_D≈ (V_INMAX– V_OUTMIN)I_LOADMAX

Maximum allowable power dissipation:

Where:

P_D= Worst-case actual power dissipation

P_DMAX= (T_JMAX– T_AMAX

)

= Maximum voltage on V_IN

V_INMAX

θ_JA

V_OUTMIN= Minimum regulator output voltage

I_LOADMAX= Maximum output (load) current

= (125 – 55)

220

= 318 mW

The maximum allowable power dissipation (Equation

4-2) is a function of the maximum ambient temperature

(T_AMAX), the maximum allowable die temperature

(T_JMAX) and the thermal resistance from junction-to-air

(θ_JA). The 6-Pin SOT-23A package has a θ_JAof

approximately 220°C/Watt.

In this example, the TC1072 dissipates a maximum of

20.7 mW; below the allowable limit of 318 mW. In a

similar manner, Equation 4-1 and Equation 4-2 can be

used to calculate maximum current and/or input

voltage limits.

4.3

Layout Considerations

EQUATION 4-2:

The primary path of heat conduction out of the package

is via the package leads. Therefore, layouts having a

ground plane, wide traces at the pads, and wide power

supply bus lines combine to lower θ_JAand therefore

increase the maximum allowable power dissipation

limit.

P_DMAX= (T_JMAX– T_AMAX

)

θ_JA

Where all terms are previously defined.

DS21354C-page 7

TC1072/TC1073

5.0

TYPICAL CHARACTERISTICS

(Unless Otherwise Specified, All Parts Are Measured At Temperature = 25°C)

Note:

The graphs and tables provided following this note are a statistical summary based on a limited number of

samples and are provided for informational purposes only. The performance characteristics listed herein

are not tested or guaranteed. In some graphs or tables, the data presented may be outside the specified

operating range (e.g., outside specified power supply range) and therefore outside the warranted range.

Dropout Voltage vs. Temperature (V

= 10mA

= 3.3V)

Dropout Voltage vs. Temperature (V

= 3.3V)

OUT

0.100

0.090

0.080

0.070

0.060

0.050

0.040

0.030

0.020

0.010

0.000

0.020

0.018

0.016

0.014

0.012

0.010

0.008

0.006

0.004

0.002

0.000

I

= 50mA

LOAD

C

= 1μF

IN

OUT

C

= 1μF

IN

OUT

= 1μF

-40

-20

0

20

50

70

125

-40

-20

0

20

50

70

125

TEMPERATURE (°C)

Dropout Voltage vs. Temperature (V

= 3.3V)

OUT

0.200

0.180

0.160

0.140

0.120

0.100

0.080

0.060

0.040

0.020

0.000

Dropout Voltage vs. Temperature (V

= 3.3V)

OUT

0.300

0.250

0.200

0.150

0.100

0.050

0.000

I

= 100mA

LOAD

I

= 150mA

LOAD

C

= 1μF

C

= 1μF

IN

OUT

IN

OUT

= 1μF

-40

-20

0

20

50

70

125

-40

-20

0

20

50

70

125

TEMPERATURE (°C)

Ground Current vs. V (V

= 3.3V)

Ground Current vs. V (V

IN OUT

= 3.3V)

IN OUT

90

80

70

60

50

40

30

20

10

0

90

80

70

60

50

40

30

20

10

0

I

= 100mA

I

= 10mA

LOAD

C

= 1μF

IN

OUT

C

OUT

= 1μF

IN

C

= 1μF

0 0.5 1 1.5

2

2.5 3 3.5 4 4.5 5 5.5 6 6.5 7 7.5

(V)

0

0.5 1 1.5

2

2.5

3

3.5 4 4.5

(V)

5

5.5 6 6.5 7 7.5

V

IN

V

IN

DS21354C-page 8

TC1072/TC1073

5.0

TYPICAL CHARACTERISTICS (CONTINUED)

(Unless Otherwise Specified, All Parts Are Measured At Temperature = 25°C)

Ground Current vs. V (V

IN OUT

= 3.3V)

V

vs.

V

(V = 3.3V)

OUT

IN OUT

3.5

3

80

70

60

50

40

30

20

10

0

I

= 0

I

= 150mA

LOAD

2.5

2

1.5

1

C

OUT

= 1μF

0.5

0

IN

C

= 1μF

IN

OUT

C

= 1μF

0 0.5 1 1.5

2

2.5

3

3.5 4 4.5

5

5.5 6 6.5 7 7.5

0

0.5 1 1.5

2

2.5

3

3.5

(V)

4

4.5

5

5.5

6

6.5

7

V

(V)

V

IN

Output Voltage vs. Temperature (V

= 3.3V)

V

vs.

V

(V

= 3.3V)

OUT

IN OUT

3.320

3.315

3.310

3.305

3.300

3.295

3.290

3.285

3.280

3.275

3.5

3.0

2.5

2.0

1.5

1.0

0.5

0.0

I

= 10mA

I

= 100mA

LOAD

C

= 1μF

IN

C

= 1μF

OUT

C

= 1μF

IN

OUT

V

= 4.3V

IN

= 1μF

0

0.5

1

1.5

2

2.5

3

3.5

(V)

4

4.5

5

5.5

6

6.5

7

-40

-20

-10

0

20

40

85

125

V

IN

TEMPERATURE (°C)

Output Voltage vs. Temperature (V

= 3.3V)

OUT

3.290

3.288

3.286

3.284

3.282

3.280

3.278

3.276

3.274

I

= 150mA

LOAD

C

V

= 1μF

IN

OUT

IN

= 1μF

= 4.3V

-40

-20

-10

0

20

40

85

125

TEMPERATURE (°C)

DS21354C-page 9

TC1072/TC1073

5.0

TYPICAL CHARACTERISTICS (CONTINUED)

(Unless Otherwise Specified, All Parts Are Measured At Temperature = 25°C)

Output Voltage vs. Temperature (V

= 10mA

= 5V)

Output Voltage vs. Temperature (V

= 150mA

= 5V)

OUT

4.994

4.992

4.990

4.988

4.986

4.984

4.982

4.980

4.978

4.976

4.974

5.025

5.020

5.015

5.010

5.005

5.000

4.995

4.990

4.985

I

LOAD

V

C

= 6V

V

C

= 6V

IN

= 1μF

OUT

-40

-20

-10

0

20

40

85

125

-40

-20

-10

0

20

40

85

125

TEMPERATURE (°C)

Temperature vs. Quiescent Current (V

OUT

= 5V)

Temperature vs. Quiescent Current (V

= 150mA

= 5V)

OUT

70

60

50

40

30

20

10

0

80

I

= 10mA

I

LOAD

70

60

50

40

30

20

10

0

V

C

= 6V

IN

= 1μF

V

= 6V

IN

= 1μF

OUT

C

= 1μF

C

= 1μF

OUT

-40

-20

-10

0

20

40

85

125

TEMPERATURE (°C)

-40

-20

-10

0

20

40

85

125

TEMPERATURE (°C)

Output Noise vs. Frequency

Stability Region vs. Load Current

= 1μF

Power Supply Rejection Ratio

= 10mA

1000

-30

-35

10.0

1.0

C

I

OUT

to 10μF

OUT

R

C

= 50Ω

LOAD

= 1μF

IN

V

= 4V

IN

OUT

IN

OUT

DC

AC

OUT

= 100mV

= 3V

-40

-45

p-p

= 1μF

= 0

100

10

1

BYP

C

= 0

= 1μF

-50

-55

Stable Region

-60

-65

-70

-75

-80

0.1

0.0

0.1

0.01

0.1K

1K

10K

1000K

100K

0.01K

0.01K 0.1K

10

1K

10K 100K 1000K

0

20 30 40 50 60 70 80 90 100

LOAD CURRENT (mA)

FREQUENCY (Hz)

DS21354C-page 10

TC1072/TC1073

5.0

TYPICAL CHARACTERISTICS (CONTINUED)

Measure Rise Time of 3.3V LDO with Bypass Capacitor

Measure Rise Time of 3.3V LDO without Bypass Capacitor

Conditions: C = 1μF, C

IN OUT

= 1μF, C

BYP

= 470pF, I = 100mA

LOAD

Conditions: C = 1μF, C

IN OUT

= 1μF, C

BYP

= 0pF, I = 100mA

LOAD

V

= 4.3V, Temp = 25°C, Rise Time = 448μS

IN

V

= 4.3V, Temp = 25°C, Rise Time = 184μS

IN

V

SHDN

V

SHDN

V

OUT

V

OUT

Measure Fall Time of 3.3V LDO with Bypass Capacitor

Measure Fall Time of 3.3V LDO without Bypass Capacitor

Conditions: C = 1μF, C

IN OUT

= 1μF, C

BYP

= 470pF, I = 50mA

LOAD

V

= 4.3V, Temp = 25°C, Fall Time = 100μS

IN

Conditions: C = 1μF, C

IN OUT

= 1μF, C

BYP

= 0pF, I = 100mA

LOAD

V

= 4.3V, Temp = 25°C, Fall Time = 52μS

IN

V

SHDN

V

SHDN

V

OUT

V

OUT

DS21354C-page 11

TC1072/TC1073

5.0

TYPICAL CHARACTERISTICS (CONTINUED)

Measure Rise Time of 5.0V LDO with Bypass Capacitor

Measure Rise Time of 5.0V LDO without Bypass Capacitor

Conditions: C = 1μF, C

IN OUT

= 1μF, C

= 470pF, I

= 100mA

LOAD

Conditions: C = 1μF, C

IN OUT

= 1μF, C

= 0pF, I

= 100mA

LOAD

BYP

= 6V, Temp = 25°C, Rise Time = 390μS

BYP

= 6V, Temp = 25°C, Rise Time = 192μS

V

IN

V

SHDN

V

SHDN

V

OUT

V

OUT

Measure Fall Time of 5.0V LDO with Bypass Capacitor

Measure Fall Time of 5.0V LDO without Bypass Capacitor

Conditions: C = 1μF, C

IN

= 1μF, C

= 470pF, I

= 6V, Temp = 25°C, Fall Time = 167μS

= 50mA

LOAD

OUT

BYP

Conditions: C = 1μF, C

IN OUT

= 1μF, C

BYP

= 0pF, I

= 100mA

LOAD

= 6V, Temp = 25°C, Fall Time = 88μS

V

IN

V

IN

V

SHDN

V

SHDN

V

OUT

V

OUT

DS21354C-page 12

TC1072/TC1073

5.0

TYPICAL CHARACTERISTICS (CONTINUED)

Load Regulation of 3.3V LDO

Conditions: C = 1μF, C

= 2.2μF, C = 470pF,

BYP

Conditions: C = 1μF, C

IN OUT

= 2.2μF, C

= 470pF,

BYP

IN

OUT

+ 0.25V, Temp = 25°C

V

= V

V

= V + 0.25V, Temp = 25°C

IN

OUT

IN

OUT

I

= 100mA switched in at 10kHz, V is AC coupled

OUT

I

= 50mA switched in at 10kHz, V is AC coupled

OUT

LOAD

I

LOAD

V

OUT

V

OUT

Line Regulation of 3.3V LDO

Load Regulation of 3.3V LDO

Conditions: V = 4V, + 1V Squarewave @ 2.5kHz

IN

Conditions: C = 1μF, C

IN OUT

= 2.2μF, C = 470pF,

BYP

V

= V + 0.25V, Temp = 25°C

IN

OUT

I

= 150mA switched in at 10kHz, V is AC coupled

OUT

LOAD

V

IN

I

LOAD

V

OUT

V

OUT

C

I

= 0μF, C

OUT

LOAD

= 1μF, C

IN

= 470pF,

IN

BYP

are AC coupled

OUT

= 100mA, V & V

DS21354C-page 13

TC1072/TC1073

5.0

TYPICAL CHARACTERISTICS (CONTINUED)

Line Regulation of 5.0V LDO

Thermal Shutdown Response of 5.0V LDO

Conditions: V = 6V, + 1V Squarewave @ 2.5kHz

IN

Conditions: V = 6V, C = 0μF, C

IN IN

= 1μF

OUT

V

IN

V

OUT

C

I

= 0μF, C

LOAD

= 1μF, C

IN OUT

= 470pF,

are AC coupled

IN

OUT BYP

= 100mA, V & V

I_LOADwas increased until temperature of die reached about 160°C, at

which time integrated thermal protection circuitry shuts the regulator

off when die temperature exceeds approximately 160°C. The regulator

remains off until die temperature drops to approximately 150°C.

DS21354C-page 14

TC1072/TC1073

6.0

6.1

PACKAGING INFORMATION

Package Marking Information

“1” & “2” = part number code + temperature range and

voltage

TC1072

Code

TC1073

Code

(V)

2.5

2.7

2.8

2.85

3.0

3.3

3.6

4.0

5.0

E1

E2

EZ

E8

E3

E5

E9

E0

E7

F1

F2

FZ

F8

F3

F5

F9

F0

F7

“3” represents year and quarter code

“4” represents lot ID number

6.2

Taping Form

Component Taping Orientation for 6-Pin SOT-23A (EIAJ SC-74) Devices

User Direction of Feed

DDDDDDeDeeDeevevveviveivicivcicivicieciecieicieeceee

MMMMMMMaaMaMaararrakrkarkarkrikikrinrikninikkiningingiginigngngggg

W

Pin 1

P

Standard Reel Component Orientation

For 713 Suffix Device

(Mark Right Side Up)

Carrier Tape, Number of Components Per Reel and Reel Size

Package

Carrier Width (W)

Pitch (P)

Part Per Full Reel

Reel Size

6-Pin SOT-23A

8 mm

4 mm

3000

7 in

DS21354C-page 15

TC1072/TC1073

6.3

Package Dimensions

SOT-23A-6

.075 (1.90)

Ref.

.069 (1.75)

.059 (1.50)

.122 (3.10)

.098 (2.50)

.020 (0.50)

.014 (0.35)

.037 (0.95)

Ref.

.118 (3.00)

.110 (2.80)

.057 (1.45)

.035 (0.90)

.008 (0.20)

.004 (0.09)

10° Max.

.006 (0.15)

.000 (0.00)

.024 (0.60)

.004 (0.10)

Dimensions: inches (mm)

DS21354C-page 16

TC1072/TC1073

SALES AND SUPPORT

Data Sheets

Products supported by a preliminary Data Sheet may have an errata sheet describing minor operational differences and recom-

mended workarounds. To determine if an errata sheet exists for a particular device, please contact one of the following:

1. Your local Microchip sales office

2. The Microchip Corporate Literature Center U.S. FAX: (480) 792-7277

3. The Microchip Worldwide Site (www.microchip.com)

Please specify which device, revision of silicon and Data Sheet (include Literature #) you are using.

New Customer Notification System

Register on our web site (www.microchip.com/cn) to receive the most current information on our products.

DS21354C-page 17

TC1072/TC1073

NOTES:

DS21354C-page 18

Note the following details of the code protection feature on Microchip devices:

•

Microchip products meet the specification contained in their particular Microchip Data Sheet.

•

Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the

intended manner and under normal conditions.

•

There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our

knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data

Sheets. Most likely, the person doing so is engaged in theft of intellectual property.

•

Microchip is willing to work with the customer who is concerned about the integrity of their code.

Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not

mean that we are guaranteeing the product as “unbreakable.”

Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our

products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts

allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act.

Information contained in this publication regarding device

applications and the like is provided only for your convenience

and may be superseded by updates. It is your responsibility to

ensure that your application meets with your specifications.

MICROCHIP MAKES NO REPRESENTATIONS OR WAR-

RANTIES OF ANY KIND WHETHER EXPRESS OR IMPLIED,

WRITTEN OR ORAL, STATUTORY OR OTHERWISE,

RELATED TO THE INFORMATION, INCLUDING BUT NOT

LIMITED TO ITS CONDITION, QUALITY, PERFORMANCE,

MERCHANTABILITY OR FITNESS FOR PURPOSE.

Microchip disclaims all liability arising from this information and

its use. Use of Microchip’s products as critical components in

life support systems is not authorized except with express

written approval by Microchip. No licenses are conveyed,

implicitly or otherwise, under any Microchip intellectual property

rights.

Trademarks

The Microchip name and logo, the Microchip logo, Accuron,

dsPIC, KEELOQ, microID, MPLAB, PIC, PICmicro, PICSTART,

PRO MATE, PowerSmart, rfPIC, and SmartShunt are

registered trademarks of Microchip Technology Incorporated

in the U.S.A. and other countries.

AmpLab, FilterLab, Migratable Memory, MXDEV, MXLAB,

PICMASTER, SEEVAL, SmartSensor and The Embedded

Control Solutions Company are registered trademarks of

Microchip Technology Incorporated in the U.S.A.

Analog-for-the-Digital Age, Application Maestro, dsPICDEM,

dsPICDEM.net, dsPICworks, ECAN, ECONOMONITOR,

FanSense, FlexROM, fuzzyLAB, In-Circuit Serial

Programming, ICSP, ICEPIC, Linear Active Thermistor,

MPASM, MPLIB, MPLINK, MPSIM, PICkit, PICDEM,

PICDEM.net, PICLAB, PICtail, PowerCal, PowerInfo,

PowerMate, PowerTool, Real ICE, rfLAB, rfPICDEM, Select

Mode, Smart Serial, SmartTel, Total Endurance, UNI/O,

WiperLock and Zena are trademarks of Microchip Technology

Incorporated in the U.S.A. and other countries.

SQTP is a service mark of Microchip Technology Incorporated

in the U.S.A.

All other trademarks mentioned herein are property of their

respective companies.

Printed on recycled paper.

Microchip received ISO/TS-16949:2002 quality system certification for

its worldwide headquarters, design and wafer fabrication facilities in

Chandler and Tempe, Arizona and Mountain View, California in

October 2003. The Company’s quality system processes and

procedures are for its PICmicro^®8-bit MCUs, KEELOQ^®code hopping

devices, Serial EEPROMs, microperipherals, nonvolatile memory and

analog products. In addition, Microchip’s quality system for the design

and manufacture of development systems is ISO 9001:2000 certified.

DS21354C-page 19

WORLDWIDE SALES AND SERVICE

AMERICAS

ASIA/PACIFIC

EUROPE

Corporate Office

Australia - Sydney

Tel: 61-2-9868-6733

Fax: 61-2-9868-6755

India - Bangalore

Tel: 91-80-2229-0061

Fax: 91-80-2229-0062

Austria - Wels

Tel: 43-7242-2244-399

Fax: 43-7242-2244-393

2355 West Chandler Blvd.

Chandler, AZ 85224-6199

Tel: 480-792-7200

Fax: 480-792-7277

Technical Support:

http://support.microchip.com

Web Address:

www.microchip.com

China - Beijing

Tel: 86-10-8528-2100

Fax: 86-10-8528-2104

Denmark - Copenhagen

Tel: 45-4450-2828

Fax: 45-4485-2829

India - New Delhi

Tel: 91-11-5160-8631

Fax: 91-11-5160-8632

China - Chengdu

Tel: 86-28-8676-6200

Fax: 86-28-8676-6599

France - Paris

Tel: 33-1-69-53-63-20

Fax: 33-1-69-30-90-79

India - Pune

Tel: 91-20-2566-1512

Fax: 91-20-2566-1513

Atlanta

China - Fuzhou

Tel: 86-591-8750-3506

Fax: 86-591-8750-3521

Germany - Munich

Tel: 49-89-627-144-0

Fax: 49-89-627-144-44

Japan - Yokohama

Tel: 81-45-471- 6166

Fax: 81-45-471-6122

Alpharetta, GA

Tel: 770-640-0034

Fax: 770-640-0307

Italy - Milan

Tel: 39-0331-742611

Fax: 39-0331-466781

China - Hong Kong SAR

Tel: 852-2401-1200

Fax: 852-2401-3431

Korea - Gumi

Tel: 82-54-473-4301

Fax: 82-54-473-4302

Boston

Westborough, MA

Tel: 774-760-0087

Fax: 774-760-0088

Netherlands - Drunen

Tel: 31-416-690399

Fax: 31-416-690340

China - Qingdao

Tel: 86-532-8502-7355

Fax: 86-532-8502-7205

Korea - Seoul

Tel: 82-2-554-7200

Fax: 82-2-558-5932 or

82-2-558-5934

Chicago

Itasca, IL

Tel: 630-285-0071

Fax: 630-285-0075

Spain - Madrid

Tel: 34-91-708-08-90

Fax: 34-91-708-08-91

China - Shanghai

Tel: 86-21-5407-5533

Fax: 86-21-5407-5066

Malaysia - Penang

Tel: 60-4-646-8870

Fax: 60-4-646-5086

Dallas

Addison, TX

Tel: 972-818-7423

Fax: 972-818-2924

UK - Wokingham

Tel: 44-118-921-5869

Fax: 44-118-921-5820

China - Shenyang

Tel: 86-24-2334-2829

Fax: 86-24-2334-2393

Philippines - Manila

Tel: 63-2-634-9065

Fax: 63-2-634-9069

Detroit

China - Shenzhen

Farmington Hills, MI

Tel: 248-538-2250

Fax: 248-538-2260

Tel: 86-755-8203-2660

Fax: 86-755-8203-1760

Singapore

Tel: 65-6334-8870

Fax: 65-6334-8850

China - Shunde

Tel: 86-757-2839-5507

Fax: 86-757-2839-5571

Kokomo

Kokomo, IN

Tel: 765-864-8360

Fax: 765-864-8387

Taiwan - Hsin Chu

Tel: 886-3-572-9526

Fax: 886-3-572-6459

China - Wuhan

Tel: 86-27-5980-5300

Fax: 86-27-5980-5118

Taiwan - Kaohsiung

Tel: 886-7-536-4818

Fax: 886-7-536-4803

Los Angeles

Mission Viejo, CA

Tel: 949-462-9523

Fax: 949-462-9608

China - Xian

Tel: 86-29-8833-7250

Fax: 86-29-8833-7256

Taiwan - Taipei

Tel: 886-2-2500-6610

Fax: 886-2-2508-0102

San Jose

Mountain View, CA

Tel: 650-215-1444

Fax: 650-961-0286

Thailand - Bangkok

Tel: 66-2-694-1351

Fax: 66-2-694-1350

Toronto

Mississauga, Ontario,

Canada

Tel: 905-673-0699

Fax: 905-673-6509

10/31/05

DS21354C-page 20


型号：	TC1072-3.3VCH
厂家：	MICROCHIP
描述：	3.3 V FIXED POSITIVE LDO REGULATOR, 0.12 V DROPOUT, PDSO6, SOT-23A, 6 PIN 光电二极管输出元件调节器
文件：	总20页 (文件大小：416K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

TC1072-3.3VCH [MICROCHIP]

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