TC10723.0VCT713_技术文档

TC1072/TC1073

50mA and 100mA CMOS LDOs with Shutdown, ERROR Output and V_REFBypass

Features:

General Description

• 50 µA Ground Current for Longer Battery Life

• Very Low Dropout Voltage

The TC1072 and TC1073 are high accuracy (typically

±0.5%) CMOS upgrades for older (bipolar) low dropout

regulators. Designed specifically for battery-operated

systems, the devices’ CMOS construction eliminates

wasted ground current, significantly extending battery

life. Total supply current is typically 50 µA at full load

(20 to 60 times lower than in bipolar regulators).

• Choice of 50 mA (TC1072) and 100 mA (TC1073)

Output

• High Output Voltage Accuracy

• Standard or Custom Output Voltages

• Power-Saving Shutdown Mode

The devices’ key features include ultra low noise

operation (plus optional Bypass input); very low

dropout voltage (typically 85 mV, TC1072 and 180 mV,

TC1073 at full load) and fast response to step changes

in load. An error output (ERROR) is asserted when the

devices are out-of-regulation (due to a low input

voltage or excessive output current). ERROR can be

used as a low battery warning or as a processor

RESET signal (with the addition of an external RC

network). Supply current is reduced to 0.5 µA (max)

and both V_OUTand ERROR are disabled when the

shutdown input is low. The devices incorporate both

overtemperature and overcurrent protection.

• ERROR Output Can Be Used as a Low Battery

Detector or Processor Reset Generator

• Bypass Input for Ultra Quiet Operation

• Overcurrent and Overtemperature Protection

• Space-Saving 6-Pin SOT-23 Package

• Pin Compatible Upgrades for Bipolar Regulators

• Standard Output Voltage Options:

- 1.8V, 2.5V, 2.6V, 2.7V, 2.8V, 2.85V, 3.0V,

3.3V, 3.6V, 4.0V, 5.0V

• Other output voltages are available. Please

contact Microchip Technology Inc. for details.

The TC1072 and TC1073 are stable with an output

capacitor of only 1 µF and have a maximum output

current of 50 mA, and 100 mA, respectively. For higher

output current versions, please see the TC1185,

TC1186, TC1187 (I_OUT= 150 mA) and TC1107,

TC1108 and TC1173 (I_OUT= 300 mA) data sheets.

Applications:

• Battery Operated Systems

• Portable Computers

• Medical Instruments

• Instrumentation

• Cellular/GSM/PHS Phones

• Linear Post-Regulators for SMPS

• Pagers

Package Type

6-Pin SOT-23

V_OUTBypass ERROR

Typical Application Circuit

5

6

4

R

P

1

2

6

5

V

OUT

IN

OUT

+

TC1072

TC1073

1 µF

GND

Bypass

C

3

1

BYPASS

470 pF

2

V_IN

GND SHDN

3

4

ERROR

SHDN

ERROR

Shutdown Control

(from Power Control Logic)

DS21354D-page 1

TC1072/TC1073

† Note: Stresses above those listed under "Absolute

Maximum Ratings" may cause permanent damage to

the device. These are stress ratings only and functional

operation of the device at these or any other conditions

above those indicated in the operation sections of the

specifications is not implied. Exposure to Absolute

Maximum Rating conditions for extended periods may

affect device reliability.

1.0

ELECTRICAL

CHARACTERISTICS

Absolute Maximum Ratings†

Input Voltage .........................................................6.5V

Output Voltage...........................(-0.3V) to (V_IN+ 0.3V)

Power Dissipation................Internally Limited (Note 6)

Maximum Voltage on Any Pin ........V_IN+0.3V to -0.3V

Operating Temperature Range...... -40°C < T_J< 125°C

Storage Temperature..........................-65°C to +150°C

TC1072/TC1073 ELECTRICAL SPECIFICATIONS

Electrical Characteristics: Unless otherwise noted, V_IN= V_OUT+ 1V, I_L= 0.1 mA, C_L= 3.3 μF, SHDN > V_IH, T_A= +25°C.

Boldface type specifications apply for junction temperatures of -40°C to +125°C.

Symbol

V_IN

I_OUTMAX

Parameter

Min

2.7

Typ

Max

6.0

Units

Test Conditions

Note 9

Input Operating Voltage

Maximum Output Current

—

V

50

100

—

mA

TC1072

TC1073

V_OUT

Output Voltage

V_R

–

V_R±0.5% V_R+ 2.5%

V

Note 1

2.5%

TCV_OUT

V_OUTTemperature Coefficient

—

20

40

—

ppm/°C Note 2

ΔV_OUT/ΔV_INLine Regulation

ΔV_OUT/V_OUTLoad Regulation

—

0.05

0.5

0.35

2.0

%

(V_R+ 1V) ≤ V_IN≤ 6V

I_L= 0.1 mA to I_OUTMAX

(Note 3)

V_IN-V_OUT

Dropout Voltage

—

2

65

85

180

—

120

250

mV

I_L= 0.1 mA

I_L= 20 mA

I_L= 50 mA

I_L= 100 mA (Note 4),

TC1073

I_IN

Supply Current

—

50

0.05

64

80

0.5

—

µA

SHDN = V_IH, I_L= 0 (Note 8)

SHDN = 0V

I_INSD

PSRR

I_OUTSC

ΔV_OUT/ΔP_D

T_SD

Shutdown Supply Current

Power Supply Rejection Ratio

Output Short Circuit Current

Thermal Regulation

dB

F_RE≤ 1 kHz

300

0.04

160

10

450

—

mA

V/W

°C

V_OUT= 0V

Notes 5, 6

Thermal Shutdown Die Temperature

Thermal Shutdown Hysteresis

Output Noise

—

ΔT_SD

eN

—

°C

260

—

nV/√Hz I_L= I_OUTMAX

470 pF from Bypass to GND

Note 1:

2:

V is the regulator output voltage setting. For example: V = 2.5V, 2.7V, 2.85V, 3.0V, 3.3V, 3.6V, 4.0V, 5.0V.

R R

6

TC V

= (V_OUTMAX– V_OUTMIN) x 10

OUT

V

x ΔT

OUT

3: Regulation is measured at a constant junction temperature using low duty cycle pulse testing. Load regulation is tested over a load range

from 0.1 mA to the maximum specified output current. Changes in output voltage due to heating effects are covered by the thermal

regulation specification.

4: Dropout voltage is defined as the input to output differential at which the output voltage drops 2% below its nominal value.

5: Thermal Regulation is defined as the change in output voltage at a time T after a change in power dissipation is applied, excluding load or

line regulation effects. Specifications are for a current pulse equal to I_LMAXat V = 6V for T = 10 ms.

IN

6: The maximum allowable power dissipation is a function of ambient temperature, the maximum allowable junction temperature and the

thermal resistance from junction-to-air (i.e., T , T , θ ). Exceeding the maximum allowable power dissipation causes the device to initiate

A

J

JA

thermal shutdown. Please see Section 5.0 “Thermal Considerations” for more details.

7: Hysteresis voltage is referenced by V .

R

8: Apply for Junction Temperatures of -40°C to +85°C.

9:

The minimum V has to justify the conditions = V ≥ V + V

and V ≥ 2.7V for I = 0.1 mA to I

.

OUTMAX

IN

R

DROPOUT

IN

L

DS21354D-page 2

TC1072/TC1073

TC1072/TC1073 ELECTRICAL SPECIFICATIONS (CONTINUED)

Electrical Characteristics: Unless otherwise noted, V_IN= V_OUT+ 1V, I_L= 0.1 mA, C_L= 3.3 μF, SHDN > V_IH, T_A= +25°C.

Boldface type specifications apply for junction temperatures of -40°C to +125°C.

Symbol

Parameter

Min

Typ

Max

Units

Test Conditions

SHDN Input

V_IH

V_IL

SHDN Input High Threshold

SHDN Input Low Threshold

45

—

%V_IN

V_IN= 2.5V to 6.5V

15

V_IN= 2.5V to 6.5V

ERROR Open Drain Output

V_INMINMinimum V_INOperating Voltage

V_OL

1.0

—

400

—

V

Output Logic Low Voltage

ERROR Threshold Voltage

ERROR Positive Hysteresis

V_OUTto ERROR Delay

mV

V

1 mA Flows to ERROR

See Figure 4-2

Note 7

V_TH

0.95 x V_R

50

V_HYS

t_DELAY

—

mV

ms

2.5

—

Vout falling from V_Rto

V_R-10%

Note 1:

2:

V is the regulator output voltage setting. For example: V = 2.5V, 2.7V, 2.85V, 3.0V, 3.3V, 3.6V, 4.0V, 5.0V.

R R

6

TC V

= (V_OUTMAX– V_OUTMIN) x 10

OUT

V

x ΔT

OUT

3: Regulation is measured at a constant junction temperature using low duty cycle pulse testing. Load regulation is tested over a load range

from 0.1 mA to the maximum specified output current. Changes in output voltage due to heating effects are covered by the thermal

regulation specification.

4: Dropout voltage is defined as the input to output differential at which the output voltage drops 2% below its nominal value.

5: Thermal Regulation is defined as the change in output voltage at a time T after a change in power dissipation is applied, excluding load or

line regulation effects. Specifications are for a current pulse equal to I_LMAXat V = 6V for T = 10 ms.

IN

6: The maximum allowable power dissipation is a function of ambient temperature, the maximum allowable junction temperature and the

thermal resistance from junction-to-air (i.e., T , T , θ ). Exceeding the maximum allowable power dissipation causes the device to initiate

A

J

JA

thermal shutdown. Please see Section 5.0 “Thermal Considerations” for more details.

7: Hysteresis voltage is referenced by V .

R

8: Apply for Junction Temperatures of -40°C to +85°C.

9:

The minimum V has to justify the conditions = V ≥ V + V

and V ≥ 2.7V for I = 0.1 mA to I

.

OUTMAX

IN

R

DROPOUT

IN

L

DS21354D-page 3

TC1072/TC1073

2.0

TYPICAL CHARACTERISTICS CURVES

Note:

The graphs and tables provided following this note are a statistical summary based on a limited number of

samples and are provided for informational purposes only. The performance characteristics listed herein

are not tested or guaranteed. In some graphs or tables, the data presented may be outside the specified

operating range (e.g., outside specified power supply range) and therefore outside the warranted range.

Note: Unless otherwise specified, all parts are measured at temperature = +25°C.

Dropout Voltage vs. Temperature (V

= 10mA

= 3.3V)

OUT

Dropout Voltage vs. Temperature (V

= 3.3V)

OUT

0.020

0.018

0.016

0.014

0.012

0.010

0.008

0.006

0.004

0.002

0.000

0.100

0.090

0.080

0.070

0.060

0.050

0.040

0.030

0.020

0.010

0.000

I

LOAD

I

= 50mA

LOAD

C

= 1μF

IN

OUT

C

= 1μF

IN

OUT

= 1μF

-40

-20

0

20

50

70

125

-40

-20

0

20

50

70

125

TEMPERATURE (°C)

Dropout Voltage vs. Temperature (V

OUT

= 3.3V)

Dropout Voltage vs. Temperature (V

= 3.3V)

0.200

0.180

0.160

0.140

0.120

0.100

0.080

0.060

0.040

0.020

0.000

OUT

0.300

0.250

0.200

0.150

0.100

0.050

0.000

I

= 100mA

LOAD

I

= 150mA

LOAD

C

= 1μF

C

= 1μF

IN

OUT

IN

OUT

= 1μF

-40

-20

0

20

50

70

125

-40

-20

0

20

50

70

125

TEMPERATURE (°C)

Ground Current vs. V (V

IN OUT

= 3.3V)

Ground Current vs. V (V

IN OUT

= 3.3V)

90

80

70

60

50

40

30

20

10

0

I

= 100mA

LOAD

I

= 10mA

LOAD

80

70

60

50

40

30

20

10

0

C

= 1μF

IN

C

= 1μF

OUT

IN

= 1μF

OUT

0 0.5 1 1.5

2

2.5

3

3.5 4 4.5

(V)

5 5.5 6 6.5 7 7.5

0

0.5 1 1.5

2

2.5

3

3.5 4 4.5

(V)

5 5.5 6 6.5 7 7.5

V

IN

V

IN

DS21354D-page 4

TC1072/TC1073

Note: Unless otherwise specified, all parts are measured at temperature = +25°C.

V

vs.

V

(V = 3.3V)

OUT

IN OUT

Ground Current vs. V (V

IN OUT

= 3.3V)

3.5

3

80

70

60

50

40

30

20

10

0

I

= 0

LOAD

I

= 150mA

LOAD

2.5

2

1.5

1

C

OUT

= 1μF

0.5

0

IN

C

= 1μF

IN

OUT

C

= 1μF

0 0.5 1 1.5

2

2.5

3

3.5 4 4.5 5 5.5 6 6.5 7 7.5

0

0.5 1 1.5

2

2.5

3

3.5

(V)

4

4.5

5

5.5

6

6.5

7

V

(V)

(V

IN

V

IN

V

vs.

= 3.3V)

Output Voltage vs. Temperature (V

= 3.3V)

OUT

IN OUT

OUT

3.5

3.0

2.5

2.0

1.5

1.0

0.5

0.0

3.320

3.315

3.310

3.305

3.300

3.295

3.290

3.285

3.280

3.275

I

= 100mA

I

= 10mA

LOAD

C

V

= 1μF

IN

OUT

IN

= 1μF

C

= 1μF

IN

OUT

= 4.3V

= 1μF

0

0.5

1

1.5

2

2.5

3

3.5

(V)

4

4.5

5

5.5

6

6.5

7

-40

-20

-10

0

20

40

85

125

V

TEMPERATURE (°C)

IN

Output Voltage vs. Temperature (V

= 3.3V)

OUT

3.290

3.288

3.286

3.284

3.282

3.280

3.278

3.276

3.274

I

= 150mA

LOAD

C

V

= 1μF

IN

OUT

IN

= 1μF

= 4.3V

-40

-20

-10

0

20

40

85

125

TEMPERATURE (°C)

DS21354D-page 5

TC1072/TC1073

Note: Unless otherwise specified, all parts are measured at temperature = +25°C.

Output Voltage vs. Temperature (V

= 10mA

= 5V)

Output Voltage vs. Temperature (V

= 150mA

= 5V)

OUT

4.994

4.992

4.990

4.988

4.986

4.984

4.982

4.980

4.978

4.976

4.974

5.025

5.020

5.015

5.010

5.005

5.000

4.995

4.990

4.985

I

LOAD

V

C

= 6V

V

C

= 6V

IN

= 1μF

OUT

-40

-20

-10

0

20

40

85

125

-40

-20

-10

0

20

40

85

125

TEMPERATURE (°C)

Temperature vs. Quiescent Current (V

OUT

= 5V)

Temperature vs. Quiescent Current (V

OUT

= 5V)

80

70

60

50

40

30

20

10

0

I

= 150mA

LOAD

I

= 10mA

70

60

50

40

30

20

10

0

LOAD

V

C

= 6V

IN

= 1μF

IN

OUT

V

= 6V

IN

= 1μF

C

= 1μF

C

= 1μF

OUT

-40

-20

-10

0

20

40

85

125

-40

-20

-10

0

20

40

85

125

TEMPERATURE (°C)

Output Noise vs. Frequency

Stability Region vs. Load Current

= 1μF

Power Supply Rejection Ratio

= 10mA

1000

-30

10.0

1.0

C

I

OUT

to 10μF

OUT

R

C

= 50Ω

LOAD

= 1μF

IN

-35

-40

-45

V

= 4V

IN

OUT

IN

OUT

DC

AC

OUT

= 100mV

= 3V

p-p

= 1μF

= 0

100

10

1

BYP

C

= 0

= 1μF

-50

-55

Stable Region

-60

-65

-70

-75

-80

0.1

0.0

0.1

0.01

0.1K

1K

10K

1000K

100K

0.01K

0.01K 0.1K

10

1K

10K 100K 1000K

0

20 30 40 50 60 70 80 90 100

LOAD CURRENT (mA)

FREQUENCY (Hz)

DS21354D-page 6

TC1072/TC1073

Note: Unless otherwise specified, all parts are measured at temperature = +25°C.

Measure Rise Time of 3.3V LDO with Bypass Capacitor

Measure Rise Time of 3.3V LDO without Bypass Capacitor

Conditions: C = 1μF, C

IN OUT

= 1μF, C

BYP

= 470pF, I = 100mA

LOAD

Conditions: C = 1μF, C

IN OUT

= 1μF, C

BYP

= 0pF, I = 100mA

LOAD

V

= 4.3V, Temp = 25°C, Rise Time = 448μS

IN

V

= 4.3V, Temp = 25°C, Rise Time = 184μS

IN

V

SHDN

V

SHDN

V

OUT

V

OUT

Measure Fall Time of 3.3V LDO with Bypass Capacitor

Measure Fall Time of 3.3V LDO without Bypass Capacitor

Conditions: C = 1μF, C

IN OUT

= 1μF, C

BYP

= 470pF, I = 50mA

LOAD

Conditions: C = 1μF, C

IN OUT

= 1μF, C

BYP

= 0pF, I = 100mA

LOAD

V

= 4.3V, Temp = 25°C, Fall Time = 100μS

IN

V

= 4.3V, Temp = 25°C, Fall Time = 52μS

IN

V

SHDN

V

SHDN

V

OUT

V

OUT

DS21354D-page 7

TC1072/TC1073

Note: Unless otherwise specified, all parts are measured at temperature = +25°C.

Measure Rise Time of 5.0V LDO with Bypass Capacitor

Measure Rise Time of 5.0V LDO without Bypass Capacitor

Conditions: C = 1μF, C

IN OUT

= 1μF, C

BYP

= 470pF, I = 100mA

LOAD

Conditions: C = 1μF, C

IN OUT

= 1μF, C

BYP

= 0pF, I = 100mA

LOAD

V

= 6V, Temp = 25°C, Rise Time = 390μS

IN

V

= 6V, Temp = 25°C, Rise Time = 192μS

IN

V

SHDN

V

SHDN

V

OUT

V

OUT

Measure Fall Time of 5.0V LDO with Bypass Capacitor

Measure Fall Time of 5.0V LDO without Bypass Capacitor

Conditions: C = 1μF, C

IN OUT

= 1μF, C

BYP

= 470pF, I = 50mA

LOAD

Conditions: C = 1μF, C

IN OUT

= 1μF, C

BYP

= 0pF, I = 100mA

LOAD

V

= 6V, Temp = 25°C, Fall Time = 167μS

IN

V

= 6V, Temp = 25°C, Fall Time = 88μS

IN

V

SHDN

V

SHDN

V

OUT

V

OUT

DS21354D-page 8

TC1072/TC1073

Note: Unless otherwise specified, all parts are measured at temperature = +25°C.

Load Regulation of 3.3V LDO

Conditions: C = 1μF, C

= 2.2μF, C = 470pF,

BYP

Conditions: C = 1μF, C

= 2.2μF, C = 470pF,

BYP

IN

OUT

+ 0.25V, Temp = 25°C

OUT

IN

OUT

+ 0.25V, Temp = 25°C

OUT

V

= V

V

= V

IN

I

= 100mA switched in at 10kHz, V

is AC coupled

OUT

I

= 50mA switched in at 10kHz, V is AC coupled

OUT

LOAD

I

LOAD

V

OUT

Line Regulation of 3.3V LDO

Load Regulation of 3.3V LDO

Conditions: V = 4V, + 1V Squarewave @ 2.5kHz

IN

Conditions: C = 1μF, C

IN OUT

= 2.2μF, C = 470pF,

BYP

V

= V + 0.25V, Temp = 25°C

IN

OUT

I

= 150mA switched in at 10kHz, V

is AC coupled

OUT

LOAD

V

IN

I

LOAD

V

OUT

V

OUT

C

I

= 0μF, C

LOAD

= 1μF, C

IN

= 470pF,

IN

OUT

BYP

are AC coupled

OUT

= 100mA, V & V

DS21354D-page 9

TC1072/TC1073

Note: Unless otherwise specified, all parts are measured at temperature = +25°C.

Line Regulation of 5.0V LDO

Thermal Shutdown Response of 5.0V LDO

Conditions: V = 6V, + 1V Squarewave @ 2.5kHz

IN

Conditions: V = 6V, C = 0μF, C

IN IN

= 1μF

OUT

V

IN

V

OUT

V

OUT

C

I

= 0μF, C

LOAD

= 1μF, C

IN OUT

= 470pF,

are AC coupled

IN

OUT BYP

= 100mA, V & V

I_LOADwas increased until temperature of die reached about 160°C, at

which time integrated thermal protection circuitry shuts the regulator

off when die temperature exceeds approximately 160°C. The regulator

remains off until die temperature drops to approximately 150°C.

DS21354D-page 10

TC1072/TC1073

3.0

PIN DESCRIPTIONS

The descriptions of the pins are listed in Table 3-1.

TABLE 3-1:

PIN FUNCTION TABLE

Symbol

Pin No.

(6-Pin SOT-23)

Description

1

2

3

4

5

6

V_IN

Unregulated supply input.

GND

Ground terminal.

SHDN

ERROR

Bypass

V_OUT

Shutdown control input.

Out-of-Regulation Flag. (Open drain output).

Reference bypass input.

Regulated voltage output.

3.1

Input Voltage Supply (V_IN)

3.4

Out-Of-Regulation Flag (ERROR)

Connect unregulated input supply to the V_INpin. If

there is a large distance between the input supply and

the LDO regulator, some input capacitance is

necessary for proper operation. A 1 µF capacitor

connected from V_INto ground is recommended for

most applications.

ERROR goes low when V_OUTis out-of-tolerance by

approximately – 5%.

3.5

Reference Bypass Input (Bypass)

Connecting a 470 pF to this input further reduces

output noise.

3.2

Ground (GND)

3.6

Regulated Voltage Output (V_OUT)

Connect the unregulated input supply ground return to

GND. Also connect the negative side of the 1 µF typical

input decoupling capacitor close to GND and the

negative side of the output capacitor C_OUTto GND.

Connect the output load to V_OUTof the LDO. Also

connect the positive side of the LDO output capacitor

as close as possible to the V_OUTpin.

3.3

Shutdown Control Input (SHDN)

The regulator is fully enabled when a logic-high is

applied to SHDN. The regulator enters shutdown when

a logic-low is applied to SHDN. During shutdown,

output voltage falls to zero, ERROR is open-circuited

and supply current is reduced to 0.5 µA (maximum).

DS21354D-page 11

TC1072/TC1073

4.0

DETAILED DESCRIPTION

The TC1072 and TC1073 are precision fixed output

voltage regulators. (If an adjustable version is desired,

please see the TC1070/TC1071/TC1187 data sheet.)

Unlike bipolar regulators, the TC1072 and TC1073’s

supply current does not increase with load current. In

addition, V_OUTremains stable and within regulation

over the entire 0 mA to I_OUTMAXload current range, (an

important consideration in RTC and CMOS RAM

battery back-up applications).

V

OUT

HYSTERESIS (V )

H

V

TH

t

DELAY

ERROR

V

IH

V

OL

Figure 4-1 shows a typical application circuit. The

regulator is enabled any time the shutdown input

(SHDN) is at or above V_IH, and shutdown (disabled)

when SHDN is at or below V_IL. SHDN may be

controlled by a CMOS logic gate, or I/O port of a

microcontroller. If the SHDN input is not required, it

should be connected directly to the input supply. While

in shutdown, supply current decreases to 0.05 µA

(typical), V_OUTfalls to zero volts, and ERROR is open-

circuited.

FIGURE 4-2:

Error Output Operation.

4.2

Output Capacitor

A 1 µF (minimum) capacitor from V_OUTto ground is

recommended. The output capacitor should have an

effective series resistance greater than 0.1Ω and less

than 5.0Ω, and a resonant frequency above 1 MHz. A

1 µF capacitor should be connected from V_INto GND if

there is more than 10 inches of wire between the

regulator and the AC filter capacitor, or if a battery is

used as the power source. Aluminum electrolytic or

tantalum capacitor types can be used. (Since many

V

OUT

IN

OUT

+

1 μF

+

TC1072

TC1073

1 μF

C1

Battery

aluminum

approximately

electrolytic

-30°C,

capacitors

freeze

at

are

GND

Bypass

solid tantalums

C3, 470 pF

recommended for applications operating below -25°C.)

When operating from sources other than batteries,

supply-noise rejection and transient response can be

improved by increasing the value of the input and

output capacitors and employing passive filtering

techniques.

V+

SHDN

ERROR

R1

1M

Shutdown Control

(to CMOS Logic or Tie

to V if unused)

IN

C2 Required Only

if ERROR is used as a

Processor RESET Signal

(See Text)

BATTLOW

or RESET

0.2 μF

C2

4.3

Bypass Input

A 470 pF capacitor connected from the Bypass input to

ground reduces noise present on the internal

reference, which in turn significantly reduces output

noise. If output noise is not a concern, this input may be

left unconnected. Larger capacitor values may be

used, but results in a longer time period to rated output

voltage when power is initially applied.

FIGURE 4-1:

Typical Application Circuit.

4.1

ERROR Open-Drain Output

ERROR is driven low whenever V_OUTfalls out of

regulation by more than –5% (typical). This condition

may be caused by low input voltage, output current

limiting, or thermal limiting. The ERROR output voltage

value (e.g. ERROR = V_OLat 4.75V (typical) for a 5.0V

regulator and 2.85V (typical) for a 3.0V regulator).

ERROR output operation is shown in Figure 4-2.

Note that ERROR is active tDELAY (typically, 2.5 µs)

after V_OUTfalls to V_TH, and inactive when V_OUTrises

above V_THby V_HYS

.

As shown in Figure 4-1, ERROR can be used as a

battery low flag, or as a processor RESET signal (with

the addition of timing capacitor C₂). R₁x C₂should be

chosen to maintain ERROR below V_IHof the processor

RESET input for at least 200 ms to allow time for the

system to stabilize. Pull-up resistor R₁can be tied to

V_OUT, V_INor any other voltage less than (V_IN+ 0.3V).

DS21354D-page 12

TC1072/TC1073

Equation 5-1 can be used in conjunction with

Equation 5-2 to ensure regulator thermal operation is

within limits. For example:

5.0

5.1

THERMAL CONSIDERATIONS

Thermal Shutdown

Given:

Integrated thermal protection circuitry shuts the

regulator off when die temperature exceeds 160°C.

The regulator remains off until the die temperature

drops to approximately 150°C.

V_INMAX

V_OUTMIN

I_LOADMAX

T_JMAX

= 3.0V ±5%

= 2.7V – 2.5%

= 40 mA

= 125°C

5.2

Power Dissipation

T_AMAX

= 55°C

The amount of power the regulator dissipates is

primarily a function of input and output voltage, and

output current. The following equation is used to

calculate worst-case actual power dissipation:

Find: 1. Actual power dissipation

2. Maximum allowable dissipation

Actual power dissipation:

P_D≈ (V_INMAX– V_OUTMIN)I_LOADMAX

= [(3.0 x 1.05) – (2.7 x 0.975)] x 40 x 10^–3

= 20.7 mW

EQUATION 5-1:

P_D≈ (V_INMAX– V_OUTMIN)I_LOADMAX

Maximum allowable power dissipation:

Where:

P_D= Worst-case actual power dissipation

P_DMAX= (T_JMAX– T_AMAX

)

= Maximum voltage on V_IN

V_INMAX

θ_JA

= (125 – 55)

220

V_OUTMIN= Minimum regulator output voltage

I_LOADMAX= Maximum output (load) current

= 318 mW

The

maximum

allowable

power

dissipation

In this example, the TC1072 dissipates a maximum of

20.7 mW; below the allowable limit of 318 mW. In a

similar manner, Equation 5-1 and Equation 5-2 can be

used to calculate maximum current and/or input

voltage limits.

(Equation 5-2) is a function of the maximum ambient

temperature (T_AMAX), the maximum allowable die tem-

perature (T_JMAX) and the thermal resistance from junc-

tion-to-air (θ_JA). The 6-Pin SOT-23 package has a θ_JA

of approximately 220°C/Watt.

5.3

Layout Considerations

EQUATION 5-2:

The primary path of heat conduction out of the package

is via the package leads. Therefore, layouts having a

ground plane, wide traces at the pads, and wide power

supply bus lines combine to lower θ_JAand therefore

increase the maximum allowable power dissipation

limit.

P_DMAX= (T_JMAX– T_AMAX

)

θ_JA

where all terms are previously defined.

DS21354D-page 13

TC1072/TC1073

6.0

6.1

PACKAGING INFORMATION

Package Marking Information

1

2

&

= part number code + threshold voltage

(two-digit code)

TC1072

Code

TC1073

Code

(V)

1.8

2.5

2.6

2.7

2.8

EY

E1

ET

E2

EZ

E8

E3

E4

E9

E0

E6

FY

F1

FT

F2

FZ

F8

F3

F4

F9

F0

F6

2.85

3.0

3.3

3.6

4.0

5.0

3

4

represents year and quarter code

represents production lot ID code

6.2

Taping Form

User Direction of Feed

Device

Marking

W, Width of

Carrier Tape

PIN 1

P,Pitch

Standard Reel Component

Orientation

Reverse Reel Component

Orientation

Carrier Tape, Number of Components per Reel and Reel Size

Package

Carrier Width (W)

Pitch (P)

Part Per Full Reel

Reel Size

6-Pin SOT-23

8 mm

4 mm

3000

7 in

DS21354D-page 14

TC1072/TC1073

6-Lead Plastic Small Outline Transistor (CH) [SOT-23]

Note: For the most current package drawings, please see the Microchip Packaging Specification located at

http://www.microchip.com/packaging

b

4

N

E

E1

PIN 1 ID BY

LASER MARK

1

2

3

e

e1

D

c

A

φ

A2

L

A1

L1

Units

MILLIMETERS

Dimension Limits

MIN

NOM

MAX

Number of Pins

Pitch

N

e

6

0.95 BSC

Outside Lead Pitch

Overall Height

e1

A

1.90 BSC

0.90

0.89

0.00

2.20

1.30

2.70

0.10

0.35

0°

–

1.45

1.30

0.15

3.20

1.80

3.10

0.60

0.80

30°

Molded Package Thickness

Standoff

A2

A1

E

Overall Width

Molded Package Width

Overall Length

Foot Length

E1

D

L

Footprint

L1

φ

Foot Angle

Lead Thickness

Lead Width

c

0.08

0.20

0.26

0.51

b

Notes:

1. Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed 0.127 mm per side.

2. Dimensioning and tolerancing per ASME Y14.5M.

BSC: Basic Dimension. Theoretically exact value shown without tolerances.

Microchip Technology Drawing C04-028B

DS21354D-page 15

TC1072/TC1073

NOTES:

DS21354D-page 16

TC1072/TC1073

APPENDIX A: REVISION HISTORY

Revision D (February 2007)

• Page 1: Ground current changed to 50 µA.

• Package type changed from SOT-23A to SOT-23.

• Added voltage options.

• T_DELAYadded to Table 1-1.

• Section 3.0 “Pin Descriptions”: Added pin

descriptions.

• Section 4.1 “ERROR Open-Drain Output”:

Defined t_DELAY

.

• Changed Figure 4-2.

• Updated Packaging Information.

Revision C (January 2006)

• Undocumented changes.

Revision B (May 2002)

• Undocumented changes.

Revision A (March 2002)

• Original Release of this Document.

DS21354D-page 17

TC1072/TC1073

NOTES:

DS21354D-page 18

TC1072/TC1073

PRODUCT IDENTIFICATION SYSTEM

To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office.

PART NO.

Device

—

X.X

X

XXXXX

Examples:

Threshold Temperature Package

Voltage

a)

b)

c)

d)

e)

f)

g)

h)

i)

TC1072-1.8VCH713: 1.8V

Range

TC1072-2.5VCH713 2.5V

TC1072-2.6VCH713 2.6V

TC1072-2.7VCH713 2.7V

TC1072-2.8VCH713 2.8V

TC1072-2.85VCH713 2.85V

TC1072-3.0VCH713 3.0V

TC1072-3.3VCH713 3.3V

TC1072-3.6VCH713 3.6V

TC1072-4.0VCH713 4.0V

TC1072-5.0VCH713 5.0V

Device

TC1072: CMOS LDO with Shutdown, ERROR Output & V

REF

Bypass

TC1073: CMOS LDO with Shutdown, ERROR Output & V

Bypass

j)

k)

Threshold voltage

(typical)

1.8

2.5

2.6

2.7

2.8

2.85

3.0

3.3

3.6

4.0

5.0

=

1.8V

2.5V

2.6V

2.7V

2.8V

2.85V

3.0V

3.3V

3.6V

4.0V

5.0V

a)

b)

c)

d)

e)

f)

g)

h)

i)

TC1073-1.8VCH713: 1.8V

TC1073-2.5VCH713 2.5V

TC1073-2.6VCH713 2.6V

TC1073-2.7VCH713 2.7V

TC1073-2.8VCH713 2.8V

TC1073-2.85VCH713 2.85V

TC1073-3.0VCH713 3.0V

TC1073-3.3VCH713 3.3V

TC1073-3.6VCH713 3.6V

TC1073-4.0VCH713 4.0V

TC1073-5.0VCH713 5.0V

j)

k)

Temperature Range

Package

V

= -40° C to +125° C

CH713 = Plastic small outline transistor (CH) SOT-23,

6 lead, (tape and reel).

DS21354D-page 19

TC1072/TC1073

NOTES:

DS21354D-page 20

Note the following details of the code protection feature on Microchip devices:

•

Microchip products meet the specification contained in their particular Microchip Data Sheet.

•

Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the

intended manner and under normal conditions.

•

There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our

knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data

Sheets. Most likely, the person doing so is engaged in theft of intellectual property.

•

Microchip is willing to work with the customer who is concerned about the integrity of their code.

Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not

mean that we are guaranteeing the product as “unbreakable.”

Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our

products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts

allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act.

Information contained in this publication regarding device

applications and the like is provided only for your convenience

and may be superseded by updates. It is your responsibility to

ensure that your application meets with your specifications.

MICROCHIP MAKES NO REPRESENTATIONS OR

WARRANTIES OF ANY KIND WHETHER EXPRESS OR

IMPLIED, WRITTEN OR ORAL, STATUTORY OR

OTHERWISE, RELATED TO THE INFORMATION,

INCLUDING BUT NOT LIMITED TO ITS CONDITION,

QUALITY, PERFORMANCE, MERCHANTABILITY OR

FITNESS FOR PURPOSE. Microchip disclaims all liability

arising from this information and its use. Use of Microchip

devices in life support and/or safety applications is entirely at

the buyer’s risk, and the buyer agrees to defend, indemnify and

hold harmless Microchip from any and all damages, claims,

suits, or expenses resulting from such use. No licenses are

conveyed, implicitly or otherwise, under any Microchip

intellectual property rights.

Trademarks

The Microchip name and logo, the Microchip logo, Accuron,

dsPIC, KEELOQ, KEELOQ logo, microID, MPLAB, PIC,

PICmicro, PICSTART, PRO MATE, PowerSmart, rfPIC, and

SmartShunt are registered trademarks of Microchip

Technology Incorporated in the U.S.A. and other countries.

AmpLab, FilterLab, Linear Active Thermistor, Migratable

Memory, MXDEV, MXLAB, PS logo, SEEVAL, SmartSensor

and The Embedded Control Solutions Company are

registered trademarks of Microchip Technology Incorporated

in the U.S.A.

Analog-for-the-Digital Age, Application Maestro, CodeGuard,

dsPICDEM, dsPICDEM.net, dsPICworks, ECAN,

ECONOMONITOR, FanSense, FlexROM, fuzzyLAB,

In-Circuit Serial Programming, ICSP, ICEPIC, Mindi, MiWi,

MPASM, MPLAB Certified logo, MPLIB, MPLINK, PICkit,

PICDEM, PICDEM.net, PICLAB, PICtail, PowerCal,

PowerInfo, PowerMate, PowerTool, REAL ICE, rfLAB,

rfPICDEM, Select Mode, Smart Serial, SmartTel, Total

Endurance, UNI/O, WiperLock and ZENA are trademarks of

Microchip Technology Incorporated in the U.S.A. and other

countries.

SQTP is a service mark of Microchip Technology Incorporated

in the U.S.A.

All other trademarks mentioned herein are property of their

respective companies.

Printed on recycled paper.

Microchip received ISO/TS-16949:2002 certification for its worldwide

headquarters, design and wafer fabrication facilities in Chandler and

Tempe, Arizona, Gresham, Oregon and Mountain View, California. The

Company’s quality system processes and procedures are for its PIC^®

MCUs and dsPIC^®DSCs, KEELOQ^®code hopping devices, Serial

EEPROMs, microperipherals, nonvolatile memory and analog

products. In addition, Microchip’s quality system for the design and

manufacture of development systems is ISO 9001:2000 certified.

DS21354D-page 21

WORLDWIDE SALES AND SERVICE

AMERICAS

ASIA/PACIFIC

EUROPE

Corporate Office

Asia Pacific Office

Suites 3707-14, 37th Floor

Tower 6, The Gateway

Habour City, Kowloon

Hong Kong

Tel: 852-2401-1200

Fax: 852-2401-3431

India - Bangalore

Tel: 91-80-4182-8400

Fax: 91-80-4182-8422

Austria - Wels

Tel: 43-7242-2244-39

Fax: 43-7242-2244-393

2355 West Chandler Blvd.

Chandler, AZ 85224-6199

Tel: 480-792-7200

Fax: 480-792-7277

Technical Support:

http://support.microchip.com

Web Address:

www.microchip.com

Denmark - Copenhagen

Tel: 45-4450-2828

Fax: 45-4485-2829

India - New Delhi

Tel: 91-11-4160-8631

Fax: 91-11-4160-8632

France - Paris

Tel: 33-1-69-53-63-20

Fax: 33-1-69-30-90-79

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Tel: 91-20-2566-1512

Fax: 91-20-2566-1513

Australia - Sydney

Tel: 61-2-9868-6733

Fax: 61-2-9868-6755

Atlanta

Duluth, GA

Tel: 678-957-9614

Fax: 678-957-1455

Germany - Munich

Tel: 49-89-627-144-0

Fax: 49-89-627-144-44

Japan - Yokohama

Tel: 81-45-471- 6166

Fax: 81-45-471-6122

China - Beijing

Tel: 86-10-8528-2100

Fax: 86-10-8528-2104

Italy - Milan

Tel: 39-0331-742611

Fax: 39-0331-466781

Korea - Gumi

Tel: 82-54-473-4301

Fax: 82-54-473-4302

Boston

China - Chengdu

Tel: 86-28-8665-5511

Fax: 86-28-8665-7889

Westborough, MA

Tel: 774-760-0087

Fax: 774-760-0088

Netherlands - Drunen

Tel: 31-416-690399

Fax: 31-416-690340

Korea - Seoul

China - Fuzhou

Tel: 86-591-8750-3506

Fax: 86-591-8750-3521

Tel: 82-2-554-7200

Fax: 82-2-558-5932 or

82-2-558-5934

Chicago

Itasca, IL

Tel: 630-285-0071

Fax: 630-285-0075

Spain - Madrid

Tel: 34-91-708-08-90

Fax: 34-91-708-08-91

China - Hong Kong SAR

Tel: 852-2401-1200

Fax: 852-2401-3431

Malaysia - Penang

Tel: 60-4-646-8870

Fax: 60-4-646-5086

Dallas

Addison, TX

Tel: 972-818-7423

Fax: 972-818-2924

UK - Wokingham

Tel: 44-118-921-5869

Fax: 44-118-921-5820

China - Qingdao

Tel: 86-532-8502-7355

Fax: 86-532-8502-7205

Philippines - Manila

Tel: 63-2-634-9065

Fax: 63-2-634-9069

Detroit

Farmington Hills, MI

Tel: 248-538-2250

Fax: 248-538-2260

China - Shanghai

Tel: 86-21-5407-5533

Fax: 86-21-5407-5066

Singapore

Tel: 65-6334-8870

Fax: 65-6334-8850

Kokomo

Kokomo, IN

Tel: 765-864-8360

Fax: 765-864-8387

China - Shenyang

Tel: 86-24-2334-2829

Fax: 86-24-2334-2393

Taiwan - Hsin Chu

Tel: 886-3-572-9526

Fax: 886-3-572-6459

China - Shenzhen

Tel: 86-755-8203-2660

Fax: 86-755-8203-1760

Taiwan - Kaohsiung

Tel: 886-7-536-4818

Fax: 886-7-536-4803

Los Angeles

Mission Viejo, CA

Tel: 949-462-9523

Fax: 949-462-9608

China - Shunde

Tel: 86-757-2839-5507

Fax: 86-757-2839-5571

Taiwan - Taipei

Tel: 886-2-2500-6610

Fax: 886-2-2508-0102

Santa Clara

Santa Clara, CA

Tel: 408-961-6444

Fax: 408-961-6445

China - Wuhan

Tel: 86-27-5980-5300

Fax: 86-27-5980-5118

Thailand - Bangkok

Tel: 66-2-694-1351

Fax: 66-2-694-1350

Toronto

Mississauga, Ontario,

Canada

Tel: 905-673-0699

Fax: 905-673-6509

China - Xian

Tel: 86-29-8833-7250

Fax: 86-29-8833-7256

12/08/06

DS21354D-page 22


型号：	TC10723.0VCT713
厂家：	MICROCHIP
描述：	50mA and 100mA CMOS LDOs with Shutdown, ERROR Output and VREF Bypass 50毫安和百毫安CMOS LDO，具有关断，错误输出和VREF旁路
文件：	总22页 (文件大小：712K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

TC10723.0VCT713 [MICROCHIP]

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