TC1108-3.3VDBTR [MICROCHIP]
300mA CMOS LDO; 300毫安CMOS LDO
| 型号： | TC1108-3.3VDBTR |
| 厂家： | 
MICROCHIP |
| 描述： | 300mA CMOS LDO |
| 文件： | 总12页 (文件大小：197K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
TC1108
300mA CMOS LDO
Features
General Description
• Extremely Low Supply Current (50A, Typ.)
• Very Low Dropout Voltage
The TC1108 is a fixed output, high accuracy (typically
±0.5%) CMOS low dropout regulator. Total supply
current is typically 50A at full load (20 to 60 times
lower than in bipolar regulators).
• 300mA Output Current
• High Output Voltage Accuracy
TC1108 key features include ultra low noise operation,
very low dropout voltage (typically 240mV at full load),
and fast response to step changes in load.
• Standard or Custom Output Voltages
• Over Current and Over Temperature Protection
The TC1108 incorporates both over temperature and
over current protection. The TC1108 is stable with an
output capacitor of only 1F and has a maximum
output current of 300mA. It is available in a SOT-223
package.
Applications
• Battery Operated Systems
• Portable Computers
• Medical Instruments
• Instrumentation
Typical Application
• Cellular/GSM/PHS Phones
• Linear Post-Regulators for SMPS
• Pagers
1
2
3
V
V
V
V
OUT
IN
IN
OUT
+
C1
1μF
Device Selection Table
TC1108
Junction
Temp. Range
Part Number
Package
GND
TC1108-xxVDB 3-Pin SOT-223 -40°C to +125°C
NOTE: xx indicates output voltages
Available Output Voltages: 2.5, 2.8, 3.0, 3.3, 5.0.
Other output voltages are available. Please contact Microchip
Technology Inc. for details.
Package Type
SOT-223
TC1108VDB
1
2
3
V
GND V
IN
OUT
2002-2012 Microchip Technology Inc.
DS21357C-page 1
TC1108
Stresses above those listed under "Absolute Maximum
Ratings" may cause permanent damage to the device. These
are stress ratings only and functional operation of the device
at these or any other conditions above those indicated in the
operation sections of the specifications is not implied.
Exposure to Absolute Maximum Rating conditions for
extended periods may affect device reliability.
1.0
ELECTRICAL
CHARACTERISTICS
Absolute Maximum Ratings*
Input Voltage .........................................................6.5V
Output Voltage..................(VSS – 0.3V) to (VIN + 0.3V)
Power Dissipation................Internally Limited (Note 6)
Maximum Voltage on Any Pin ........VIN +0.3V to -0.3V
Operating Temperature Range......-40°C < TJ < 125°C
Storage Temperature..........................-65°C to +150°C
TC1108 ELECTRICAL SPECIFICATIONS
Electrical Characteristics: V = V
+ 1V, I = 100A, C = 3.3F, T = 25°C, unless otherwise noted. Boldface type
L L A
IN
OUT
specifications apply for junction temperatures of -40°C to +125°C.
Symbol
Parameter
Min
Typ
Max
Units
Test Conditions
V
Input Operating Voltage
Maximum Output Current
Output Voltage
2.7
—
—
6.0
V
mA
V
Note 7
Note 1
IN
I
300
—
OUTMAX
V
—
– 2.5%
V
±0.5%
—
—
+ 2.5%
OUT
R
V
V
R
R
V
V
V
/T
/V
/V
V
Temperature Coefficient
—
—
—
40
0.05
0.5
—
0.35
2.0
ppm/°C Note 2
OUT
OUT
Line Regulation
Load Regulation
Dropout Voltage
%
%
(V + 1V) V 6V
OUT
IN
R
IN
I = 0.1mA to IOUTMAX (Note 3)
OUT OUT
L
V
-V
—
—
—
20
80
240
30
160
480
mV
I = 0.1mA
L
IN OUT
I = 100mA
L
I = 300mA (Note 4)
L
I
Supply Current
—
—
—
—
—
50
60
90
—
A
dB
DD
PSRR
Power Supply Rejection Ratio
Output Short Circuit Current
Thermal Regulation
Output Noise
F
1kHz
RE
I
550
0.04
260
650
—
mA
V/W
V
= 0V
OUTSC
OUT
V
/P
Note 5
OUT
D
eN
—
nV/Hz F = 10kHz, C
= 1F,
OUT
R
= 50
LOAD
Note 1: VR is the regulator output voltage setting.
TC VOUT = (VOUTMAX – VOUTMIN) x 106
2:
VOUT x T
3: Regulation is measured at a constant junction temperature using low duty cycle pulse testing. Load regulation is tested over a load range
from 0.1mA to the maximum specified output current. Changes in output voltage due to heating effects are covered by the thermal
regulation specification.
4: Dropout voltage is defined as the input to output differential at which the output voltage drops 2% below its nominal value measured at a
1V differential.
5: Thermal Regulation is defined as the change in output voltage at a time T after a change in power dissipation is applied, excluding load or
line regulation effects. Specifications are for a current pulse equal to ILMAX at VIN = 6V for T = 10 msec.
6: The maximum allowable power dissipation is a function of ambient temperature, the maximum allowable junction temperature and the
thermal resistance from junction-to-air (i.e., TA, TJ, JA). Exceeding the maximum allowable power dissipation causes the device to initiate
thermal shutdown. Please see Section 4.0 Thermal Considerations for more details.
7: The minimum VIN has to justify the conditions: VIN VR + VDROPOUT and VIN 2.7V for IL = 0.1mA to IOUTMAX
.
DS21357C-page 2
2002-2012 Microchip Technology Inc.
TC1108
2.0
PIN DESCRIPTIONS
The descriptions of the pins are listed in Table 2-1.
TABLE 2-1:
PIN FUNCTION TABLE
Pin No.
(3-Pin SOT-223)
Symbol
Description
1
2
3
V
Unregulated supply input.
Ground terminal.
IN
GND
V
Regulated voltage output.
OUT
3.1
Output Capacitor
3.0
DETAILED DESCRIPTION
A 1F (min) capacitor from VOUT to ground is required.
The output capacitor should have an effective series
resistance greater than 0.1 and less than 5.0. A 1F
capacitor should be connected from VIN to GND if there
is more than 10 inches of wire between the regulator
and the AC filter capacitor, or if a battery is used as the
power source. Aluminum electrolytic or tantalum
capacitor types can be used. (Since many aluminum
electrolytic capacitors freeze at approximately -30°C,
solid tantalums are recommended for applications
operating below -25°C.) When operating from sources
other than batteries, supply-noise rejection and
transient response can be improved by increasing the
value of the input and output capacitors and employing
passive filtering techniques.
The TC1108 is a precision, fixed output LDO. Unlike
bipolar regulators, the TC1108’s supply current does
not increase with load current. In addition, VOUT
remains stable and within regulation over the entire
0mA to IOUTMAX operating load current range, (an
important consideration in RTC and CMOS RAM
battery back-up applications).
Figure 3-1 shows a typical application circuit.
FIGURE 3-1:
TYPICAL APPLICATION
CIRCUIT
3
1
V
V
V
OUT
IN
OUT
+
+
C1
C2
+
1μF
TC1108
1μF
Battery
2
GND
–
2002-2012 Microchip Technology Inc.
DS21357C-page 3
TC1108
Equation 4-1 can be used in conjunction with Equation
4-2 to ensure regulator thermal operation is within
limits. For example:
4.0
4.1
THERMAL CONSIDERATIONS
Thermal Shutdown
Given:
Integrated thermal protection circuitry shuts the
regulator off when die temperature exceeds 150°C.
The regulator remains off until the die temperature
drops to approximately 140°C.
VINMAX
= 3.3V + 10%
VOUTMIN = 2.7V – 0.5%
ILOADMAX = 275mA
TJMAX
TAMAX
JA
= 125°C
= 95°C
4.2
Power Dissipation
The amount of power the regulator dissipates is
primarily a function of input and output voltage, and
output current. The following equation is used to
calculate worst case actual power dissipation:
= 59°C/W
Find: 1. Actual power dissipation
2. Maximum allowable dissipation
Actual power dissipation:
EQUATION 4-1:
PD (VINMAX – VOUTMIN)ILOADMAX
= [(3.3 x 1.1) – (2.7 x .995)]275 x 10–3
= 260mW
PD (VINMAX – VOUTMIN)ILOADMAX
Where:
= Worst case actual power dissipation
= Maximum voltage on VIN
PD
VINMAX
Maximum allowable power dissipation:
VOUTMIN = Minimum regulator output voltage
ILOADMAX = Maximum output (load) current
PDMAX = (TJMAX – TAMAX)
JA
= (125 – 95)
59
= 508mW
The maximum allowable power dissipation (Equation
4-2) is a function of the maximum ambient temperature
(TAMAX), the maximum allowable die temperature
(TJMAX) and the thermal resistance from junction-to-air
(JA).
In this example, the TC1108 dissipates a maximum of
260mW; below the allowable limit of 508mW. In a
similar manner, Equation 4-1 and Equation 4-2 can be
used to calculate maximum current and/or input
voltage limits. For example, the maximum allowable
VIN, is found by sustituting the maximum allowable
power dissipation of 508mW into Equation 4-1, from
which VINMAX = 4.6V.
EQUATION 4-2:
PDMAX = (TJMAX – TAMAX
)
JA
Where all terms are previously defined.
Table 4-1 shows various values of JA for the TC1108
versus board copper area.
TABLE 4-1:
THERMAL RESISTANCE
GUIDELINES FOR TC1108
Copper
Area
(Topside)* (Backside)
Copper
Area
Thermal
Resistance
(
Board
Area
)
JA
2500 sq mm 2500 sq mm 2500 sq mm
1000 sq mm 2500 sq mm 2500 sq mm
225 sq mm 2500 sq mm 2500 sq mm
100 sq mm 2500 sq mm 2500 sq mm
1000 sq mm 1000 sq mm 1000 sq mm
45°C/W
45°C/W
53°C/W
59°C/W
52°C/W
55°C/W
1000 sq mm
0 sq mm
1000 sq mm
NOTE: *Tab of device attached to topside copper
DS21357C-page 4
2002-2012 Microchip Technology Inc.
TC1108
5.0
TYPICAL CHARACTERISTICS
Note: The graphs and tables provided following this note are a statistical summary based on a limited number of
samples and are provided for informational purposes only. The performance characteristics listed herein are
not tested or guaranteed. In some graphs or tables, the data presented may be outside the specified
operating range (e.g., outside specified power supply range) and therefore outside the warranted range.
Load Regulation
Line Regulation
Output Noise
2.00
1.80
0.012
0.010
10.0
1.0
R
C
= 50Ω
= 1μF
LOAD
OUT
1.60
1.40
1.20
1 to 300mA
0.008
0.006
1.00
0.80
0.60
0.40
0.004
0.002
0.000
0.1
0.0
1 to 100mA
1 to 50mA
-0.002
0.20
0.00
-0.004
0.01
10
-40° -20° 0° 20° 40° 60° 80° 100° 120°
-40° -20°
0.01
1
100
1000
0° 20° 40° 60° 80° 100° 120°
FREQUENCY (kHz)
TEMPERATURE ( C)
°
TEMPERATURE (°C)
Supply Current
V
vs. Temperature
OUT
100.0
90.0
80.0
0.40
0.35
3.075
3.025
125C
85C
V
= 4V
LOAD
LOAD
IN
I
= 100μA
= 3.3μF
C
0.30
0.25
0.20
0.15
0.10
0.05
0.00
70C
25C
70.0
60.0
50.0
40.0
0C
2.975
-40C
2.925
-40° -20°
0
-40° -20°
0° 20° 40° 60° 80° 100° 120°
TEMPERATURE (°C)
50
0° 20° 40° 60° 80° 100° 120°
TEMPERATURE (°C)
100
150 200 250 300
LOAD CURRENT (mA)
2002-2012 Microchip Technology Inc.
DS21357C-page 5
TC1108
6.0
6.1
PACKAGING INFORMATION
Package Marking Information
“1” = part number code
“2” = represents temperature + date code + lot identity
+ subcontractor identity
TC1108 (V)
Code
TC1108-2.5VDB
TC1108-2.8VDB
TC1108-3.0VDB
TC1108-3.3VDB
TC1108-5.0VDB
110825
110828
110830
110833
110850
6.2
Taping Form
Component Taping Orientation for 3-Pin SOT-223 Devices
User Direction of Feed
Device
Marking
W
PIN 1
P
Standard Reel Component Orientation
for TR Suffix Device
(Mark Right Side Up)
Carrier Tape, Number of Components Per Reel and Reel Size
Package
Carrier Width (W)
Pitch (P)
Part Per Full Reel
Reel Size
3-Pin SOT-223
12 mm
8 mm
4000
13 in
DS21357C-page 6
2002-2012 Microchip Technology Inc.
TC1108
6.3
Package Dimensions
Note: For the most current package drawings, please see the Microchip Packaging Specification located
at http://www.microchip.com/packaging
3-Pin SOT-223
.264 (6.70)
.248 (6.30)
.122 (3.10)
.114 (2.90)
.287 (7.30) .146 (3.70)
.264 (6.70) .130 (3.30)
.041 (1.04)
.033 (0.84)
PIN 1
.091 (2.30) TYP.
.031 (0.80)
.024 (0.60)
.071
(1.80)
MAX.
.013 (0.33)
.009 (0.24)
10°
MAX.
.036 (0.91) MIN.
Dimensions: inches (mm)
.004 (0.10)
.001 (0.02)
.181 (4.60) TYP.
2002-2012 Microchip Technology Inc.
DS21357C-page 7
TC1108
REVISION HISTORY
Revision C (November 2012)
Added a note to the package outline drawing.
DS21357C-page 8
2002-2012 Microchip Technology Inc.
TC1108
SALES AND SUPPORT
Data Sheets
Products supported by a preliminary Data Sheet may have an errata sheet describing minor operational differences and recom-
mended workarounds. To determine if an errata sheet exists for a particular device, please contact one of the following:
1. Your local Microchip sales office
2. The Microchip Worldwide Site (www.microchip.com)
Please specify which device, revision of silicon and Data Sheet (include Literature #) you are using.
New Customer Notification System
Register on our web site (www.microchip.com/cn) to receive the most current information on our products.
2002-2012 Microchip Technology Inc.
DS21357C-page9
TC1108
NOTES:
DS21357C-page10
2002-2012 Microchip Technology Inc.
Note the following details of the code protection feature on Microchip devices:
•
Microchip products meet the specification contained in their particular Microchip Data Sheet.
•
Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the
intended manner and under normal conditions.
•
There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our
knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data
Sheets. Most likely, the person doing so is engaged in theft of intellectual property.
•
•
Microchip is willing to work with the customer who is concerned about the integrity of their code.
Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not
mean that we are guaranteeing the product as “unbreakable.”
Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our
products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts
allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act.
Information contained in this publication regarding device
applications and the like is provided only for your convenience
and may be superseded by updates. It is your responsibility to
ensure that your application meets with your specifications.
MICROCHIP MAKES NO REPRESENTATIONS OR
WARRANTIES OF ANY KIND WHETHER EXPRESS OR
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OTHERWISE, RELATED TO THE INFORMATION,
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conveyed, implicitly or otherwise, under any Microchip
intellectual property rights.
Trademarks
The Microchip name and logo, the Microchip logo, dsPIC,
FlashFlex, KEELOQ, KEELOQ logo, MPLAB, PIC, PICmicro,
PICSTART, PIC logo, rfPIC, SST, SST Logo, SuperFlash
and UNI/O are registered trademarks of Microchip Technology
Incorporated in the U.S.A. and other countries.
32
FilterLab, Hampshire, HI-TECH C, Linear Active Thermistor,
MTP, SEEVAL and The Embedded Control Solutions
Company are registered trademarks of Microchip Technology
Incorporated in the U.S.A.
Silicon Storage Technology is a registered trademark of
Microchip Technology Inc. in other countries.
Analog-for-the-Digital Age, Application Maestro, BodyCom,
chipKIT, chipKIT logo, CodeGuard, dsPICDEM,
dsPICDEM.net, dsPICworks, dsSPEAK, ECAN,
ECONOMONITOR, FanSense, HI-TIDE, In-Circuit Serial
Programming, ICSP, Mindi, MiWi, MPASM, MPF, MPLAB
Certified logo, MPLIB, MPLINK, mTouch, Omniscient Code
Generation, PICC, PICC-18, PICDEM, PICDEM.net, PICkit,
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SQTP is a service mark of Microchip Technology Incorporated
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GestIC and ULPP are registered trademarks of Microchip
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Microchip Technology Inc., in other countries.
All other trademarks mentioned herein are property of their
respective companies.
© 2002-2012, Microchip Technology Incorporated, Printed in
the U.S.A., All Rights Reserved.
Printed on recycled paper.
ISBN: 9781620767351
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2002-2012 Microchip Technology Inc.
DS21357C-page 11
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DS21357C-page 12
2002-2012 Microchip Technology Inc.
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