TC1108 [MICROCHIP]
300mA CMOS LDO; 300毫安CMOS LDO
| 型号： | TC1108 |
| 厂家： | 
MICROCHIP |
| 描述： | 300mA CMOS LDO |
| 文件： | 总12页 (文件大小：432K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
TC1108
300mA CMOS LDO
Features
General Description
• Extremely Low Supply Current (50µA, Typ.)
• Very Low Dropout Voltage
The TC1108 is a fixed output, high accuracy (typically
±0.5%) CMOS low dropout regulator. Total supply
current is typically 50µA at full load (20 to 60 times
lower than in bipolar regulators).
• 300mA Output Current
• High Output Voltage Accuracy
TC1108 key features include ultra low noise operation,
very low dropout voltage (typically 240mV at full load),
and fast response to step changes in load.
• Standard or Custom Output Voltages
• Over Current and Over Temperature Protection
The TC1108 incorporates both over temperature and
over current protection. The TC1108 is stable with an
output capacitor of only 1µF and has a maximum
output current of 300mA. It is available in a SOT-223
package.
Applications
• Battery Operated Systems
• Portable Computers
• Medical Instruments
• Instrumentation
Typical Application
• Cellular/GSM/PHS Phones
• Linear Post-Regulators for SMPS
• Pagers
1
2
3
V
V
V
V
OUT
IN
IN
OUT
+
C1
1µF
Device Selection Table
TC1108
Junction
Temp. Range
Part Number
Package
GND
TC1108-xxVDB 3-Pin SOT-223 -40°C to +125°C
NOTE: xx indicates output voltages
Available Output Voltages: 2.5, 2.8, 3.0, 3.3, 5.0.
Other output voltages are available. Please contact Microchip
Technology Inc. for details.
Package Type
SOT-223
TC1108VDB
1
2
3
V
GND V
IN
OUT
2002 Microchip Technology Inc.
DS21357B-page 1
TC1108
Stresses above those listed under "Absolute Maximum
Ratings" may cause permanent damage to the device. These
are stress ratings only and functional operation of the device
at these or any other conditions above those indicated in the
operation sections of the specifications is not implied.
Exposure to Absolute Maximum Rating conditions for
extended periods may affect device reliability.
1.0
ELECTRICAL
CHARACTERISTICS
Absolute Maximum Ratings*
Input Voltage .........................................................6.5V
Output Voltage.................. (V – 0.3V) to (V + 0.3V)
SS
IN
Power Dissipation................Internally Limited (Note 6)
Maximum Voltage on Any Pin ........V +0.3V to -0.3V
IN
Operating Temperature Range...... -40°C < T < 125°C
J
Storage Temperature..........................-65°C to +150°C
TC1108 ELECTRICAL SPECIFICATIONS
Electrical Characteristics: VIN = VOUT + 1V, IL = 100µA, CL = 3.3µF, TA = 25°C, unless otherwise noted. Boldface type
specifications apply for junction temperatures of -40°C to +125°C.
Symbol
VIN
IOUTMAX
VOUT
Parameter
Min
Typ
Max
Units
Test Conditions
Input Operating Voltage
Maximum Output Current
Output Voltage
2.7
—
—
6.0
V
mA
V
Note 7
Note 1
300
—
—
R – 2.5%
VR ±0.5%
—
—
V
V
R + 2.5%
∆VOUT/∆T
VOUT Temperature Coefficient
Line Regulation
—
—
—
40
0.05
0.5
—
ppm/°C Note 2
∆VOUT/∆VIN
0.35
2.0
%
%
(VR + 1V) ≤ VIN ≤ 6V
∆VOUT/VOUT Load Regulation
IL = 0.1mA to IOUTMAX (Note 3)
VIN-VOUT
Dropout Voltage
—
—
—
20
80
240
30
160
480
mV
I
I
I
L = 0.1mA
L = 100mA
L = 300mA (Note 4)
IDD
Supply Current
—
—
—
—
—
50
60
90
—
µA
dB
PSRR
IOUTSC
∆VOUT/∆PD
eN
Power Supply Rejection Ratio
Output Short Circuit Current
Thermal Regulation
Output Noise
FRE ≤ 1kHz
VOUT = 0V
Note 5
550
0.04
260
650
—
mA
V/W
—
nV/√Hz F = 10kHz, COUT = 1µF,
LOAD = 50Ω
R
Note 1: VR is the regulator output voltage setting.
TC VOUT = (VOUTMAX – VOUTMIN) x 106
2:
VOUT x ∆T
3: Regulation is measured at a constant junction temperature using low duty cycle pulse testing. Load regulation is tested over a load range
from 0.1mA to the maximum specified output current. Changes in output voltage due to heating effects are covered by the thermal
regulation specification.
4: Dropout voltage is defined as the input to output differential at which the output voltage drops 2% below its nominal value measured at a
1V differential.
5: Thermal Regulation is defined as the change in output voltage at a time T after a change in power dissipation is applied, excluding load or
line regulation effects. Specifications are for a current pulse equal to ILMAX at VIN = 6V for T = 10 msec.
6: The maximum allowable power dissipation is a function of ambient temperature, the maximum allowable junction temperature and the
thermal resistance from junction-to-air (i.e., TA, TJ, θJA). Exceeding the maximum allowable power dissipation causes the device to initiate
thermal shutdown. Please see Section 4.0 Thermal Considerations for more details.
7: The minimum VIN has to justify the conditions: VIN ≥ VR + VDROPOUT and VIN ≥ 2.7V for IL = 0.1mA to IOUTMAX
.
DS21357B-page 2
2002 Microchip Technology Inc.
TC1108
2.0
PIN DESCRIPTIONS
The descriptions of the pins are listed in Table 2-1.
TABLE 2-1:
PIN FUNCTION TABLE
Pin No.
(3-Pin SOT-223)
Symbol
Description
1
2
3
VIN
Unregulated supply input.
GND
VOUT
Ground terminal.
Regulated voltage output.
3.1
Output Capacitor
3.0
DETAILED DESCRIPTION
A 1µF (min) capacitor from V
to ground is required.
The output capacitor should have an effective series
The TC1108 is a precision, fixed output LDO. Unlike
bipolar regulators, the TC1108’s supply current does
OUT
resistance greater than 0.1Ω and less than 5.0Ω. A 1µF
not increase with load current. In addition, V
OUT
capacitor should be connected from V to GND if there
remains stable and within regulation over the entire
0mA to I operating load current range, (an
IN
is more than 10 inches of wire between the regulator
and the AC filter capacitor, or if a battery is used as the
power source. Aluminum electrolytic or tantalum
capacitor types can be used. (Since many aluminum
electrolytic capacitors freeze at approximately -30°C,
solid tantalums are recommended for applications
operating below -25°C.) When operating from sources
other than batteries, supply-noise rejection and
transient response can be improved by increasing the
value of the input and output capacitors and employing
passive filtering techniques.
OUTMAX
important consideration in RTC and CMOS RAM
battery back-up applications).
Figure 3-1 shows a typical application circuit.
FIGURE 3-1:
TYPICAL APPLICATION
CIRCUIT
3
1
V
V
V
OUT
IN
OUT
+
+
C1
C2
+
1µF
TC1108
GND
1µF
Battery
2
–
2002 Microchip Technology Inc.
DS21357B-page 3
TC1108
Equation 4-1 can be used in conjunction with Equation
4-2 to ensure regulator thermal operation is within
limits. For example:
4.0
4.1
THERMAL CONSIDERATIONS
Thermal Shutdown
Given:
Integrated thermal protection circuitry shuts the
regulator off when die temperature exceeds 150°C.
The regulator remains off until the die temperature
drops to approximately 140°C.
V
= 3.3V + 10%
= 2.7V – 0.5%
= 275mA
INMAX
V
OUTMIN
I
LOADMAX
T
JMAX
= 125°C
4.2
Power Dissipation
T
= 95°C
AMAX
JA
The amount of power the regulator dissipates is
primarily a function of input and output voltage, and
output current. The following equation is used to
calculate worst case actual power dissipation:
θ
= 59°C/W
Find: 1. Actual power dissipation
2. Maximum allowable dissipation
Actual power dissipation:
EQUATION 4-1:
P
≈ (VINMAX – VOUTMIN)I
LOADMAX
D
P
≈ (VINMAX – VOUTMIN)I
LOADMAX
–3
D
= [(3.3 x 1.1) – (2.7 x .995)]275 x 10
= 260mW
Where:
= Worst case actual power dissipation
P
D
Maximum allowable power dissipation:
= Maximum voltage on V
V
IN
INMAX
V
= Minimum regulator output voltage
= Maximum output (load) current
P
DMAX = (TJMAX – T
)
OUTMIN
AMAX
I
θ
LOADMAX
JA
= (125 – 95)
59
= 508mW
The maximum allowable power dissipation (Equation
4-2) is a function of the maximum ambient temperature
(TAMAX), the maximum allowable die temperature
(TJMAX) and the thermal resistance from junction-to-air
In this example, the TC1108 dissipates a maximum of
260mW; below the allowable limit of 508mW. In a
similar manner, Equation 4-1 and Equation 4-2 can be
used to calculate maximum current and/or input
voltage limits. For example, the maximum allowable
(θ ).
JA
EQUATION 4-2:
P
= (TJMAX – T
)
V , is found by sustituting the maximum allowable
IN
DMAX
AMAX
power dissipation of 508mW into Equation 4-1, from
which VINMAX = 4.6V.
θ
JA
Where all terms are previously defined.
Table 4-1 shows various values of θ for the TC1108
JA
versus board copper area.
TABLE 4-1:
THERMAL RESISTANCE
GUIDELINES FOR TC1108
Copper
Area
(Topside)*
Copper
Area
(Backside)
Thermal
Resistance
(θ
Board
Area
)
JA
2500 sq mm 2500 sq mm 2500 sq mm
1000 sq mm 2500 sq mm 2500 sq mm
225 sq mm 2500 sq mm 2500 sq mm
100 sq mm 2500 sq mm 2500 sq mm
1000 sq mm 1000 sq mm 1000 sq mm
45°C/W
45°C/W
53°C/W
59°C/W
52°C/W
55°C/W
1000 sq mm
0 sq mm
1000 sq mm
NOTE: *Tab of device attached to topside copper
DS21357B-page 4
2002 Microchip Technology Inc.
TC1108
5.0
TYPICAL CHARACTERISTICS
Note: The graphs and tables provided following this note are a statistical summary based on a limited number of
samples and are provided for informational purposes only. The performance characteristics listed herein are
not tested or guaranteed. In some graphs or tables, the data presented may be outside the specified
operating range (e.g., outside specified power supply range) and therefore outside the warranted range.
Load Regulation
Line Regulation
Output Noise
2.00
1.80
0.012
0.010
10.0
1.0
R
C
= 50Ω
= 1µF
LOAD
OUT
1.60
1.40
1.20
1 to 300mA
0.008
0.006
1.00
0.80
0.60
0.40
0.004
0.002
0.000
0.1
0.0
1 to 100mA
1 to 50mA
-0.002
0.20
0.00
-0.004
0.01
10
-40° -20° 0° 20° 40° 60° 80° 100° 120°
-40° -20°
0.01
1
100
1000
0° 20° 40° 60° 80° 100° 120°
TEMPERATURE (°C)
FREQUENCY (kHz)
TEMPERATURE (°C)
Supply Current
V
vs. Temperature
OUT
100.0
90.0
80.0
0.40
0.35
3.075
3.025
125C
85C
V
= 4V
LOAD
LOAD
IN
I
= 100µA
= 3.3µF
C
0.30
0.25
0.20
0.15
0.10
0.05
0.00
70C
25C
70.0
60.0
50.0
40.0
0C
2.975
-40C
2.925
-40° -20°
0
-40° -20°
0° 20° 40° 60° 80° 100° 120°
TEMPERATURE (°C)
50
0° 20° 40° 60° 80° 100° 120°
TEMPERATURE (°C)
100
150 200 250 300
LOAD CURRENT (mA)
2002 Microchip Technology Inc.
DS21357B-page 5
TC1108
6.0
6.1
PACKAGING INFORMATION
Package Marking Information
“1” = part number code
“2” = represents temperature + date code + lot identity
+ subcontractor identity
TC1108 (V)
Code
TC1108-2.5VDB
TC1108-2.8VDB
TC1108-3.0VDB
TC1108-3.3VDB
TC1108-5.0VDB
110825
110828
110830
110833
110850
6.2
Taping Form
Component Taping Orientation for 3-Pin SOT-223 Devices
User Direction of Feed
Device
Marking
W
PIN 1
P
Standard Reel Component Orientation
for TR Suffix Device
(Mark Right Side Up)
Carrier Tape, Number of Components Per Reel and Reel Size
Package
Carrier Width (W)
Pitch (P)
Part Per Full Reel
Reel Size
3-Pin SOT-223
12 mm
8 mm
4000
13 in
DS21357B-page 6
2002 Microchip Technology Inc.
TC1108
6.3
Package Dimensions
3-Pin SOT-223
.264 (6.70)
.248 (6.30)
.122 (3.10)
.114 (2.90)
.287 (7.30) .146 (3.70)
.264 (6.70) .130 (3.30)
.041 (1.04)
.033 (0.84)
PIN 1
.091 (2.30) TYP.
.031 (0.80)
.024 (0.60)
.071
(1.80)
MAX.
.013 (0.33)
.009 (0.24)
10°
MAX.
.036 (0.91) MIN.
Dimensions: inches (mm)
.004 (0.10)
.001 (0.02)
.181 (4.60) TYP.
2002 Microchip Technology Inc.
DS21357B-page 7
TC1108
NOTES:
DS21357B-page 8
2002 Microchip Technology Inc.
TC1108
SALES AND SUPPORT
Data Sheets
Products supported by a preliminary Data Sheet may have an errata sheet describing minor operational differences and recom-
mended workarounds. To determine if an errata sheet exists for a particular device, please contact one of the following:
1. Your local Microchip sales office
2. The Microchip Corporate Literature Center U.S. FAX: (480) 792-7277
3. The Microchip Worldwide Site (www.microchip.com)
Please specify which device, revision of silicon and Data Sheet (include Literature #) you are using.
New Customer Notification System
Register on our web site (www.microchip.com/cn) to receive the most current information on our products.
2002 Microchip Technology Inc.
DS21357B-page 9
TC1108
NOTES:
DS21357B-page 10
2002 Microchip Technology Inc.
TC1108
Information contained in this publication regarding device
applications and the like is intended through suggestion only
and may be superseded by updates. It is your responsibility to
ensure that your application meets with your specifications.
No representation or warranty is given and no liability is
assumed by Microchip Technology Incorporated with respect
to the accuracy or use of such information, or infringement of
patents or other intellectual property rights arising from such
use or otherwise. Use of Microchip’s products as critical com-
ponents in life support systems is not authorized except with
express written approval by Microchip. No licenses are con-
veyed, implicitly or otherwise, under any intellectual property
rights.
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2002 Microchip Technology Inc.
DS21357B-page 11
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05/01/02
DS21357B-page 12
2002 Microchip Technology Inc.
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