TC1232COA [MICROCHIP]
Microprocessor Monitor; 微处理器监控
| 型号： | TC1232COA |
| 厂家： | 
MICROCHIP |
| 描述： | Microprocessor Monitor |
| 文件： | 总20页 (文件大小：282K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
TC1232
Microprocessor Monitor
Features
General Description
• Precision Voltage Monitor
The TC1232 is a fully-integrated processor supervisor
that provides three important functions to safeguard
processor sanity: precision power on/off reset control,
watchdog timer and external reset override.
- Adjustable +4.5V or +4.75V
• Reset Pulse Width – 250 msec minimum
• No External Components
On power-up, the TC1232 holds the processor in the
reset state for a minimum of 250 msec after VCC is
within tolerance to ensure a stable system start-up.
• Adjustable Watchdog Timer
- 150 msec, 600 msec or 1.2 sec
• Operating Voltage 4.0V to 5.5V
Microprocessor sanity is monitored by the onboard
watchdog circuit. The microprocessor must provide a
periodic low-going signal on the ST input. Should the
processor fail to supply this signal within the selected
time-out period (150 msec, 600 msec or 1200 msec),
an out-of-control processor is indicated and the
TC1232 issues a processor reset as a result.
• Debounced Manual Reset Input for External
Override
Block Diagram
VCC
RST
RST
Tolerance
Select
The outputs of the TC1232 are immediately driven
active when the PB input is brought low by an external
push button switch or other electronic signal. When
connected to a push button switch, the TC1232
provides contact debounce.
+
–
TOL
(5% or 10%)
+
+
VREF
–
The TC1232 is packaged in a space-saving 8-Pin PDIP
or SOIC package, a 16-Pin SOIC (wide) package and
requires no external components.
Reset
Generator
PB RST
TD
Debounce
Watchdog
Timebase
Select
Watchdog
Timer
ST
Package Types
8-Pin PDIP
8-Pin SOIC
16-Pin SOIC (Wide)
NC
PB RST
NC
1
2
3
4
5
6
7
8
16 NC
V
V
8
PB RST
TD
1
2
3
4
8
7
6
5
PB RST
TD
1
2
3
4
CC
CC
VCC
15
ST
7
6
5
ST
14 NC
13 ST
12 NC
11 RST
10 NC
C1232
TC1232
TOL
RST
RST
TOL
RST
RST
TD
TC1232
GND
NC
GND
TOL
NC
GND
9
RST
Device Features
RST pin
RST pin
Minimum
Reset
Active Time
(ms)
WDI Input
Typical
Timeouts (ms)
Trip Points
Active
(Max)
MR
Input
Device
Type
Pull-up Active
Resistor Level
Type
Level
TC1232 Open-drain External Low
Push-pull
High
4.75V
or 4.5V
250
150, 600 or
1200
Yes
2002-2012 Microchip Technology Inc.
Preliminary
DS21370D-page 1
TC1232
† Stresses above those listed under "Absolute Maximum
Ratings" may cause permanent damage to the device. These
are stress ratings only and functional operation of the device
at these or any other conditions above those indicated in the
operation sections of the specifications is not implied.
Exposure to Absolute Maximum Rating conditions for
extended periods may affect device reliability.
1.0
ELECTRICAL
CHARACTERISTICS
Absolute Maximum Ratings†
Voltage on Any Pin (With Respect to GND)
...................................................... -0.3V to +5.8V
Operating Temperature Range:
C-Version ........................................0°C to +70°C
E-Version......................................-40°C to +85°C
Storage Temperature Range: ............-65°C to +150°C
DC CHARACTERISTICS
Electrical Specifications: Unless otherwise noted, TA = TMIN to TMAX; VCC = +4.0V to 5.5V.
Parameters
Supply Voltage
Sym
Min
Typ
Max
Units
Conditions
VCC
VIH
4.0
2.0
5.0
—
5.5
VCC +0.3
+0.8
+1.0
—
V
V
ST and PB RST Input High Level
ST and PB RST Input Low Level
Input Leakage ST, TOL
Output Current RST
Note 1
VIL
-0.3
-1.0
-1.0
2.0
—
V
IL
—
µA
IOH
-12
10
mA VOH = 2.4V
mA VOL = 0.4V
µA Note 2
Current RST, RST
IOL
—
Operating Current
ICC
—
50
200
VCC 5% Trip Point
VCCTP
VCCTP
4.50
4.25
4.62
4.37
4.74
4.49
V
V
TOL = GND (Note 3)
TOL = VCC (Note 3)
VCC 10% Trip Point
Capacitance Electrical Characteristics: Unless otherwise noted, TA = +25°C. (Note 4)
Input Capacitance ST, TOL
CIN
—
—
—
—
5
7
pF
pF
Output Capacitance RST, RST
COUT
Note 1: PB RST is internally pulled up to VCC with an internal impedance of typically 40 k.
2: Measured with outputs open.
3: All voltages referenced to GND.
4: Ensured by design.
DS21370D-page 2
Preliminary
2002-2012 Microchip Technology Inc.
TC1232
t
t
F
R
V
CC
+4.75V
+4.25V
+4.75V
+4.25V
V
CC
V
= 5V
CC
4.6V (5% Trip Point)
4.5V(10% Trip Point)
+4.5V (5% Trip Point)
+4.25V (10% Trip Point)
V
CC
t
t
RPU
RPD
RST
RST
RST
V
OH
Determined by
external Pull-up
resistor
V
V
Determined by
external Pull-up
resistor
OH
V
OL
OL
RST
FIGURE 1-1:
Rise Time, Fall Time and Reset Detected to Reset Active Timing Waveforms.
AC CHARACTERISTICS
Electrical Specifications: Unless otherwise noted, TA = TMIN to TMAX; VCC = +4.0V to 5.5V.
Parameters
CC Fall Time
Sym
Min
Typ
Max
Units
Conditions
V
tF
tR
10
0
—
—
—
—
—
µs
µs
ns
Note 1
VCC Rise Time
Note 1
VCC Trip Point Detected
tRPD
—
100
VCC falling
to RST High and RST Low
VCC Trip Point Detected
tRPU
250
610
1000
ms VCC rising (Note 2)
to RST High and RST Open
Note 1: Ensured by design.
2: tR = 5 µs.
2002-2012 Microchip Technology Inc.
Preliminary
DS21370D-page 3
TC1232
tTD
t
PB
ST
tST
t
PB RST
PBD
V
IH
“H”
RST (when tTD tTD (min))
V
IL
t
RST
RST
(when tTD(min) tTD tTD(max))
RST
RST
RST
(when tTD tTD(max))
The debounced PB RST input ignores input pulses less
than 1 ms and is designed to recognize pulses of
20 ms or greater.
“L”
RST (when tTD tTD(min))
RST
(when tTD(min) tTD tTD(max))
RST
(when tTD tTD(max))
FIGURE 1-2:
Push Button Reset and Watchdog Timer Reset Timing Waveforms.
AC CHARACTERISTICS (CONTINUED)
Electrical Specifications: Unless otherwise noted, TA = TMIN to TMAX; VCC = +4.0V to 5.5V.
Parameters
Sym
Min
Typ
Max
Units
Conditions
PB RST Pulse Width
tPB
20
1
—
4
—
ms Note 1
PB RST Falling Edge Low to
Reset Active
tPBD
20
ms
PB RST Rising Edge High to
Reset Inactive
tRST
250
610
1000
ms
ST Pulse Width
tST
tTD
20
—
—
ns
ST Time-out Period
62.5
250
500
150
600
1200
250
ms TD Pin = 0V
1000
2000
ms TD Pin = Open
ms TD Pin = VCC
Note 1: PB RST must be held low for a minimum of 20 ms to ensure a reset.
DS21370D-page 4
Preliminary
2002-2012 Microchip Technology Inc.
TC1232
2.0
TYPICAL PERFORMANCE CURVES
Performance Graphs are not available.
2002-2012 Microchip Technology Inc.
Preliminary
DS21370D-page 5
TC1232
3.0
PIN DESCRIPTIONS
The descriptions of the pins are listed in Table 3-1.
TABLE 3-1:
Pin No.
PIN FUNCTION TABLES
Buffer/
Pin
8-pin
16-pin
PDIP,
SOIC
SOIC
Symbol
Driver
Type
Function
Type
1
2
PB RST
I
ST
ST
Push-button Reset Input.
Input for a Manual Reset Switch. This input debounces (ignores) pulses
less than 1 ms in duration and is ensured to recognize inputs of 20 ms or
greater.
L = Manual Reset Switch is Active, Force RST/RST pins Active
H = Manual Reset Switch is Inactive. State of RST/RST pins determined by
other system conditions.
2
3
4
6
TD
I
I
Time Delay Input.
The voltage level on this input determines the watchdog timer time-out
period.
TD = 0V
TD = Open tTD = 600 ms
TD = VCC tTD = 1.2 sec
tTD = 150 ms
TOL
ST
P
Tolerance Input.
TOL = GND, Max Voltage Trip Point (VCCTP) = 4.75V (5% tolerance)
TOL = VCC, Max Voltage Trip Point (VCCTP) = 4.5V (10% tolerance)
4
5
8
9
GND
RST
—
O
The ground reference for the device.
Push Reset Output (Active-High)
Pull
Goes active (High) if one of these conditions occurs:
1. If VCC falls below the selected reset voltage threshold.
2. If PB RST pin is forced low.
3. If ST pin is not strobed within the minimum selected time-out period.
(see TD pin)
4. During power-up
6
7
11
RST
O
Open Reset Output (Active-Low)
Drain Goes active (Low) if one of these conditions occurs:
1. If VCC falls below the selected reset voltage threshold.
2. If PB RST pin is forced low.
3. If ST pin is not strobed within the minimum selected time-out period.
(see TD pin)
4. During power-up
13
15
ST
I
ST
Strobe Input
Input for Watchdog Timer. WDT period determined by state of TD pin
Falling Edge Resets Watchdog Timer counter (no time-out)
8
VCC
NC
—
—
P
The positive supply (+5V) for the device.
No internal connection.
—
1,3,5,
7,10,1
2,16
—
DS21370D-page 6
Preliminary
2002-2012 Microchip Technology Inc.
TC1232
4.0
4.1
OPERATIONAL DESCRIPTION
Power Monitor
V
= 5V
CC
+4.5V (5% Trip Point)
+4.25V (10% Trip Point)
The TC1232 provides the function of warning the
processor of a power failure. When VCC is detected as
being below the voltage levels defined by the TOL pin,
the TC1232’s comparator outputs the RST and RST
signals to a logic level that warns the system of an out-
of-tolerance power supply. The RST and RST signals
switch at a threshold value of 4.5V if TOL is tied to VCC
,
t
RPD
and at a value of 4.75 volts if TOL is grounded. The
RST and RST signals are held active for a minimum of
250 ms to ensure that the power supply voltage has
been stabilized.
RST
RST
V
V
OH
OL
Figure 4-1 shows the VCC fall time.
Figure 4-2 shows the VCC rise time.
V
SLEW RATE = 1.66 mV/µs (0.5V/300 µs)
CC
Figure 4-3 shows the time from when the voltage trip
point is detected to the reset output pin going active.
FIGURE 4-3:
Delay (Power-Down).
VCC Detect Reset Output
Figure 4-4 shows the time from when the voltage trip
point is exited to the reset output pin going inactive.
4.6V (5% Trip Point)
4.5V(10% Trip Point)
t
F
V
CC
+4.75V
+4.25V
V
CC
t
RPU
RST
RST
V
OH
FIGURE 4-1:
Power-Down Slew Rate.
V
OL
FIGURE 4-4:
Delay (Power-Up).
VCC Detect Reset Output
t
R
+4.75V
+4.25V
V
CC
FIGURE 4-2:
Power-up Slew Rate.
2002-2012 Microchip Technology Inc.
Preliminary
DS21370D-page 7
TC1232
4.2
Push Button Reset Input
+5V
The debounced manual reset input (PB RST) manually
forces the reset outputs into their active states.
Figure 4-5 shows a block diagram for using the
TC1232 with a push button switch.
V
TD
ST
CC
Once PB RST has been low for a time tPBD (the push-
button delay time), the reset outputs go active. The
reset outputs remain in their active states for a
minimum of 250 ms after PB RST rises above VIH.
Figure 4-6 shows a waveform for the push button
switch input and the reset pins output.
PB RST
I/O
TC1232
Microprocessor
RST
Reset
A mechanical push button or active logic signal can
drive the PB RST input. The debounced input ignores
input pulses less than 1 ms and recognizes pulses of
20 ms or greater. No external pull-up resistor is
required because the PB RST input has an internal
pull-up to VCC of approximately 100 µA.
GND TOL
FIGURE 4-5:
Push Button Reset and
Watchdog Timer.
t
PB
t
PB RST
PBD
V
IH
V
IL
t
RST
RST
RST
The debounced PB RST input ignores input pulses less
than 1 ms and is designed to recognize pulses of
20 ms or greater.
FIGURE 4-6:
Push Button Reset –
PB RST Input.
DS21370D-page 8
Preliminary
2002-2012 Microchip Technology Inc.
TC1232
Figure 4-8 shows the expected reset output pin wave-
forms depending on the period of the ST pin falling
edge and the state of the TD input pin.
4.3
Watchdog Timer
When the ST input is not stimulated for a preset time
period, the watchdog timer function forces RST and
RST signals to the active state. The preset time period
is determined by the TD inputs to be 150 ms with TD
connected to ground, 600 ms with TD floating or
1200 ms with TD connected to VCC (typ.). The
watchdog timer starts timing-out from the set time
period as soon as RST and RST are inactive. If a high-
to-low transition occurs on the ST input pin prior to
time-out, the watchdog timer is reset and begins to
time-out again. If the watchdog timer is allowed to time-
out, the RST and RST signals are driven to the active
state for 250 ms, minimum (Figure 4-7).
tTD
ST
tST
“H”
RST (when tTD tTD (min))
RST
(when tTD(min) tTD tTD(max))
The software routine that strobes ST is critical. The
code must be in a section of software that is executed
frequently enough so the time between toggles is less
than the watchdog time-out period. One common
technique controls the microprocessor I/O line from two
sections of the program. The software might set the I/O
line high while operating in the Foreground mode and
set it low while in the Background or Interrupt modes. If
both modes do not execute correctly, the watchdog
timer issues reset pulses.
RST
(when tTD tTD(max))
“L”
RST (when tTD tTD(min))
RST
(when tTD(min) tTD tTD(max))
RST
(when tTD tTD(max))
tTD is the maximum elapsed time between ST high-to-
low transitions (ST is activated by falling edges only),
which will keep the watchdog timer from forcing the
reset outputs active for a time of tRST. tTD is a function
of the voltage at the TD pin, as tabulated below:
FIGURE 4-8:
Strobe Input.
4.4 Supply Monitor Noise Sensitivity
The TC1232 is optimized for fast response to negative-
going changes in VDD. Systems with an inordinate
amount of electrical noise on VDD (such as systems
using relays) may require a 0.01 µF or 0.1 µF bypass
capacitor to reduce detection sensitivity. This capacitor
should be installed as close to the TC1232 as possible
to keep the capacitor lead length short.
TABLE 4-1:
WATCHDOG TIMER
PERIODS
tTD
Condition
Min
Typ
Max
TD pin = 0V
62.5 ms
250 ms
500 ms
150 ms
600 ms
1200 ms
250 ms
1000 ms
2000 ms
TD pin = Open
TD pin = VCC
Figure 4-7 shows a block diagram for using the
TC1232 with a PICmicro® MCU and the Watchdog
input.
+5V
10 k
+5V
3-Terminal
V
RESET
RST
CC
Regulator
(example:
MCP1700)
0.1
µF
®
PICmicro
TC1232
MCU
I/O
ST
TD TOL GND
FIGURE 4-7:
Watchdog Timer.
2002-2012 Microchip Technology Inc.
Preliminary
DS21370D-page 9
TC1232
5.0
5.1
PACKAGING INFORMATION
Package Marking Information
8-Lead PDIP (300 mil)
Examples:
XXXXXXXX
XXXXXNNN
TC1232
TC1232
e3
I/P256
CPA^^256
0518
OR
YYWW
0518
8-Lead SOIC (150 mil)
Examples:
XXXXXXXX
XXXXYYWW
TC1232
COA0518
TC1232E
OA^0518
e
3
OR
NNN
256
256
16-Lead SOIC (150 mil)
Examples:
e
3
TC1232COE
XXXXXXXXXX
TC1232COE^
XXXXXXXXXXXXX
XXXXXXXXXXXXX
XXXXXXXXXX
OR
YYWWNNN
0518256
0518256
Legend: XX...X Customer-specific information
Y
YY
Year code (last digit of calendar year)
Year code (last 2 digits of calendar year)
WW
NNN
Week code (week of January 1 is week ‘01’)
Alphanumeric traceability code
e
3
Pb-free JEDEC designator for Matte Tin (Sn)
This package is Pb-free. The Pb-free JEDEC designator (
can be found on the outer packaging for this package.
*
)
e
3
Note: In the event the full Microchip part number cannot be marked on one line, it will
be carried over to the next line, thus limiting the number of available
characters for customer-specific information.
DS21370D-page 10
Preliminary
2002-2012 Microchip Technology Inc.
TC1232
8-Lead Plastic Dual In-line (PA) – 300 mil (PDIP)
Note: For the most current package drawings, please see the Microchip Packaging Specification located
at http://www.microchip.com/packaging
E1
D
2
n
1
E
A2
A
L
c
A1
B1
B
p
eB
Units
INCHES*
NOM
MILLIMETERS
Dimension Limits
MIN
MAX
MIN
NOM
8
MAX
n
p
Number of Pins
Pitch
8
.100
.155
.130
2.54
Top to Seating Plane
A
.140
.170
3.56
2.92
3.94
3.30
4.32
Molded Package Thickness
Base to Seating Plane
Shoulder to Shoulder Width
Molded Package Width
Overall Length
A2
A1
E
.115
.015
.300
.240
.360
.125
.008
.045
.014
.310
5
.145
3.68
0.38
7.62
6.10
9.14
3.18
0.20
1.14
0.36
7.87
5
.313
.250
.373
.130
.012
.058
.018
.370
10
.325
.260
.385
.135
.015
.070
.022
.430
15
7.94
6.35
9.46
3.30
0.29
1.46
0.46
9.40
10
8.26
6.60
9.78
3.43
0.38
1.78
0.56
10.92
15
E1
D
Tip to Seating Plane
Lead Thickness
L
c
Upper Lead Width
B1
B
Lower Lead Width
Overall Row Spacing
Mold Draft Angle Top
Mold Draft Angle Bottom
§
eB
5
10
15
5
10
15
* Controlling Parameter
§ Significant Characteristic
Notes:
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed
.010” (0.254mm) per side.
JEDEC Equivalent: MS-001
Drawing No. C04-018
2002-2012 Microchip Technology Inc.
Preliminary
DS21370D-page 11
TC1232
8-Lead Plastic Small Outline (OA) – Narrow, 150 mil (SOIC)
Note: For the most current package drawings, please see the Microchip Packaging Specification located
at http://www.microchip.com/packaging
E
E1
p
D
2
B
n
1
h
45
c
A2
A
L
A1
Units
INCHES*
NOM
MILLIMETERS
Dimension Limits
MIN
MAX
MIN
NOM
8
MAX
n
p
Number of Pins
Pitch
8
.050
.061
.056
.007
.237
.154
.193
.015
.025
4
1.27
Overall Height
A
.053
.069
1.35
1.32
1.55
1.42
0.18
6.02
3.91
4.90
0.38
0.62
4
1.75
Molded Package Thickness
Standoff
A2
A1
E
.052
.004
.228
.146
.189
.010
.019
0
.061
.010
.244
.157
.197
.020
.030
8
1.55
0.25
6.20
3.99
5.00
0.51
0.76
8
§
0.10
5.79
3.71
4.80
0.25
0.48
0
Overall Width
Molded Package Width
Overall Length
E1
D
Chamfer Distance
Foot Length
h
L
Foot Angle
c
Lead Thickness
Lead Width
.008
.013
0
.009
.017
12
.010
.020
15
0.20
0.33
0
0.23
0.42
12
0.25
0.51
15
B
Mold Draft Angle Top
Mold Draft Angle Bottom
0
12
15
0
12
15
* Controlling Parameter
§ Significant Characteristic
Notes:
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed
.010” (0.254mm) per side.
JEDEC Equivalent: MS-012
Drawing No. C04-057
DS21370D-page 12
Preliminary
2002-2012 Microchip Technology Inc.
TC1232
16-Lead Plastic Small Outline (OE) – Wide, 300 mil (SOIC)
Note: For the most current package drawings, please see the Microchip Packaging Specification located
at http://www.microchip.com/packaging
E
p
E1
D
2
n
1
B
h
45
c
A2
A
L
A1
Units
INCHES*
NOM
MILLIMETERS
Dimension Limits
MIN
MAX
MIN
NOM
16
MAX
n
p
Number of Pins
Pitch
16
.050
.099
1.27
Overall Height
A
.093
.104
2.36
2.24
2.50
2.31
0.20
10.34
7.49
10.30
0.50
0.84
4
2.64
Molded Package Thickness
Standoff
A2
A1
E
.088
.004
.394
.291
.398
.010
.016
0
.091
.008
.407
.295
.406
.020
.033
4
.094
.012
.420
.299
.413
.029
.050
8
2.39
0.30
10.67
7.59
10.49
0.74
1.27
8
§
0.10
10.01
7.39
10.10
0.25
0.41
0
Overall Width
Molded Package Width
Overall Length
E1
D
Chamfer Distance
Foot Length
h
L
Foot Angle
c
Lead Thickness
Lead Width
.009
.014
0
.011
.017
12
.013
.020
15
0.23
0.36
0
0.28
0.42
12
0.33
0.51
15
B
Mold Draft Angle Top
Mold Draft Angle Bottom
0
12
15
0
12
15
* Controlling Parameter
§ Significant Characteristic
Notes:
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed
.010” (0.254mm) per side.
JEDEC Equivalent: MS-013
Drawing No. C04-102
2002-2012 Microchip Technology Inc.
Preliminary
DS21370D-page 13
TC1232
NOTES:
DS21370D-page 14
Preliminary
2002-2012 Microchip Technology Inc.
TC1232
APPENDIX A: REVISION HISTORY
Revision D (November 2012)
• Added a note to the package outline drawing.
Revision C (June 2005)
The following is the list of modifications:
1. Since no data is given in Section 2.0 “Typical
Performance Curves”, “Preliminary” was
added to the bottom of this document.
2. Corrected Operating Voltage in the Electrical
Specifications
3. General Data Sheet Enhancements
4. Added Revision History Appendix Section
Revision B (March 2003)
• Not logged
Revision A (March 2002)
• Original Release of this Document.
2002-2012 Microchip Technology Inc.
Preliminary
DS21370D-page 15
TC1232
NOTES:
DS21370D-page 16
lPreliminary
2002-2012 Microchip Technology Inc.
TC1232
PRODUCT IDENTIFICATION SYSTEM
To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office.
Examples:
PART NO.
Device
X
/XX
a) TC1232COA:
0°C to +70°C, 8L-SOIC
Temperature Package
Range
b) TC1232COA713: 0°C to +70°C, 8L-SOIC,
Tape and Reel
c) TC1232COE:
0°C to +70°C, 16L-SOIC
d) TC1232COE713: 0°C to +70°C, 16L-SOIC
Tape and Reel
Device:
TC1232: Microprocessor Monitor
e) TC1232CPA:
f) TC1232EOA:
0°C to +70°C, 8L-PDIP
-40°C to +85°C,
8L-SOIC
Temperature Range:
Package:
C
E
=
0°C to +70°C
= -40°C to +85°C
g) TC1232EOA713: -40°C to +85°C,
8L-SOIC,
PA
OA
=
=
Plastic DIP (300 mil Body), 8-lead
Plastic SOIC, (150 mil Body), 8-lead
Tape and Reel
OA713 = Plastic SOIC, (150 mil Body), 8-lead
Tape and Reel
OE
h) TC1232EOE:
-40°C to +85°C,
16L-SOIC
= Plastic SOIC (300 mil Body), 16-lead
OE713 = Plastic SOIC (300 mil Body), 16-lead
Tape and Reel
i) TC1232EOE713: -40°C to +85°C,
16L-SOIC,
Tape and Reel
j) TC1232EPA:
-40°C to +85°C,
8L-PDIP
2002-2012 Microchip Technology Inc.
Preliminary
DS21370D-page 17
TC1232
NOTES:
DS21370D-page 18
Preliminary
2002-2012 Microchip Technology Inc.
Note the following details of the code protection feature on Microchip devices:
•
Microchip products meet the specification contained in their particular Microchip Data Sheet.
•
Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the
intended manner and under normal conditions.
•
There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our
knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data
Sheets. Most likely, the person doing so is engaged in theft of intellectual property.
•
•
Microchip is willing to work with the customer who is concerned about the integrity of their code.
Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not
mean that we are guaranteeing the product as “unbreakable.”
Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our
products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts
allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act.
Information contained in this publication regarding device
applications and the like is provided only for your convenience
and may be superseded by updates. It is your responsibility to
ensure that your application meets with your specifications.
MICROCHIP MAKES NO REPRESENTATIONS OR
WARRANTIES OF ANY KIND WHETHER EXPRESS OR
IMPLIED, WRITTEN OR ORAL, STATUTORY OR
OTHERWISE, RELATED TO THE INFORMATION,
INCLUDING BUT NOT LIMITED TO ITS CONDITION,
QUALITY, PERFORMANCE, MERCHANTABILITY OR
FITNESS FOR PURPOSE. Microchip disclaims all liability
arising from this information and its use. Use of Microchip
devices in life support and/or safety applications is entirely at
the buyer’s risk, and the buyer agrees to defend, indemnify and
hold harmless Microchip from any and all damages, claims,
suits, or expenses resulting from such use. No licenses are
conveyed, implicitly or otherwise, under any Microchip
intellectual property rights.
Trademarks
The Microchip name and logo, the Microchip logo, dsPIC,
FlashFlex, KEELOQ, KEELOQ logo, MPLAB, PIC, PICmicro,
PICSTART, PIC logo, rfPIC, SST, SST Logo, SuperFlash
and UNI/O are registered trademarks of Microchip Technology
Incorporated in the U.S.A. and other countries.
32
FilterLab, Hampshire, HI-TECH C, Linear Active Thermistor,
MTP, SEEVAL and The Embedded Control Solutions
Company are registered trademarks of Microchip Technology
Incorporated in the U.S.A.
Silicon Storage Technology is a registered trademark of
Microchip Technology Inc. in other countries.
Analog-for-the-Digital Age, Application Maestro, BodyCom,
chipKIT, chipKIT logo, CodeGuard, dsPICDEM,
dsPICDEM.net, dsPICworks, dsSPEAK, ECAN,
ECONOMONITOR, FanSense, HI-TIDE, In-Circuit Serial
Programming, ICSP, Mindi, MiWi, MPASM, MPF, MPLAB
Certified logo, MPLIB, MPLINK, mTouch, Omniscient Code
Generation, PICC, PICC-18, PICDEM, PICDEM.net, PICkit,
PICtail, REAL ICE, rfLAB, Select Mode, SQI, Serial Quad I/O,
Total Endurance, TSHARC, UniWinDriver, WiperLock, ZENA
and Z-Scale are trademarks of Microchip Technology
Incorporated in the U.S.A. and other countries.
SQTP is a service mark of Microchip Technology Incorporated
in the U.S.A.
GestIC and ULPP are registered trademarks of Microchip
Technology Germany II GmbH & Co. & KG, a subsidiary of
Microchip Technology Inc., in other countries.
All other trademarks mentioned herein are property of their
respective companies.
© 2002-2012, Microchip Technology Incorporated, Printed in
the U.S.A., All Rights Reserved.
Printed on recycled paper.
ISBN: 9781620767467
QUALITY MANAGEMENT SYSTEM
CERTIFIED BY DNV
Microchip received ISO/TS-16949:2009 certification for its worldwide
headquarters, design and wafer fabrication facilities in Chandler and
Tempe, Arizona; Gresham, Oregon and design centers in California
and India. The Company’s quality system processes and procedures
are for its PIC® MCUs and dsPIC® DSCs, KEELOQ® code hopping
devices, Serial EEPROMs, microperipherals, nonvolatile memory and
analog products. In addition, Microchip’s quality system for the design
and manufacture of development systems is ISO 9001:2000 certified.
== ISO/TS 16949 ==
2002-2012 Microchip Technology Inc.
Preliminary
DS21370C-page 19
Worldwide Sales and Service
AMERICAS
ASIA/PACIFIC
ASIA/PACIFIC
EUROPE
Corporate Office
2355 West Chandler Blvd.
Chandler, AZ 85224-6199
Tel: 480-792-7200
Fax: 480-792-7277
Technical Support:
http://www.microchip.com/
support
Asia Pacific Office
Suites 3707-14, 37th Floor
Tower 6, The Gateway
Harbour City, Kowloon
Hong Kong
Tel: 852-2401-1200
Fax: 852-2401-3431
India - Bangalore
Tel: 91-80-3090-4444
Fax: 91-80-3090-4123
Austria - Wels
Tel: 43-7242-2244-39
Fax: 43-7242-2244-393
Denmark - Copenhagen
Tel: 45-4450-2828
Fax: 45-4485-2829
India - New Delhi
Tel: 91-11-4160-8631
Fax: 91-11-4160-8632
France - Paris
Tel: 33-1-69-53-63-20
Fax: 33-1-69-30-90-79
India - Pune
Tel: 91-20-2566-1512
Fax: 91-20-2566-1513
Australia - Sydney
Tel: 61-2-9868-6733
Fax: 61-2-9868-6755
Web Address:
www.microchip.com
Germany - Munich
Tel: 49-89-627-144-0
Fax: 49-89-627-144-44
Japan - Osaka
Tel: 81-66-152-7160
Fax: 81-66-152-9310
Atlanta
Duluth, GA
Tel: 678-957-9614
Fax: 678-957-1455
China - Beijing
Tel: 86-10-8569-7000
Fax: 86-10-8528-2104
Italy - Milan
Tel: 39-0331-742611
Fax: 39-0331-466781
Japan - Yokohama
Tel: 81-45-471- 6166
Fax: 81-45-471-6122
China - Chengdu
Tel: 86-28-8665-5511
Fax: 86-28-8665-7889
Boston
Westborough, MA
Tel: 774-760-0087
Fax: 774-760-0088
Netherlands - Drunen
Tel: 31-416-690399
Fax: 31-416-690340
Korea - Daegu
Tel: 82-53-744-4301
Fax: 82-53-744-4302
China - Chongqing
Tel: 86-23-8980-9588
Fax: 86-23-8980-9500
Chicago
Itasca, IL
Tel: 630-285-0071
Fax: 630-285-0075
Spain - Madrid
Tel: 34-91-708-08-90
Fax: 34-91-708-08-91
Korea - Seoul
China - Hangzhou
Tel: 86-571-2819-3187
Fax: 86-571-2819-3189
Tel: 82-2-554-7200
Fax: 82-2-558-5932 or
82-2-558-5934
UK - Wokingham
Tel: 44-118-921-5869
Fax: 44-118-921-5820
Cleveland
Independence, OH
Tel: 216-447-0464
Fax: 216-447-0643
China - Hong Kong SAR
Tel: 852-2401-1200
Fax: 852-2401-3431
Malaysia - Kuala Lumpur
Tel: 60-3-6201-9857
Fax: 60-3-6201-9859
Dallas
Addison, TX
Tel: 972-818-7423
Fax: 972-818-2924
China - Nanjing
Tel: 86-25-8473-2460
Fax: 86-25-8473-2470
Malaysia - Penang
Tel: 60-4-227-8870
Fax: 60-4-227-4068
China - Qingdao
Tel: 86-532-8502-7355
Fax: 86-532-8502-7205
Philippines - Manila
Tel: 63-2-634-9065
Fax: 63-2-634-9069
Detroit
Farmington Hills, MI
Tel: 248-538-2250
Fax: 248-538-2260
China - Shanghai
Tel: 86-21-5407-5533
Fax: 86-21-5407-5066
Singapore
Tel: 65-6334-8870
Fax: 65-6334-8850
Indianapolis
Noblesville, IN
Tel: 317-773-8323
Fax: 317-773-5453
China - Shenyang
Tel: 86-24-2334-2829
Fax: 86-24-2334-2393
Taiwan - Hsin Chu
Tel: 886-3-5778-366
Fax: 886-3-5770-955
Los Angeles
China - Shenzhen
Tel: 86-755-8203-2660
Fax: 86-755-8203-1760
Taiwan - Kaohsiung
Tel: 886-7-213-7828
Fax: 886-7-330-9305
Mission Viejo, CA
Tel: 949-462-9523
Fax: 949-462-9608
China - Wuhan
Tel: 86-27-5980-5300
Fax: 86-27-5980-5118
Taiwan - Taipei
Tel: 886-2-2508-8600
Fax: 886-2-2508-0102
Santa Clara
Santa Clara, CA
Tel: 408-961-6444
Fax: 408-961-6445
China - Xian
Tel: 86-29-8833-7252
Fax: 86-29-8833-7256
Thailand - Bangkok
Tel: 66-2-694-1351
Fax: 66-2-694-1350
Toronto
Mississauga, Ontario,
Canada
China - Xiamen
Tel: 905-673-0699
Fax: 905-673-6509
Tel: 86-592-2388138
Fax: 86-592-2388130
China - Zhuhai
Tel: 86-756-3210040
Fax: 86-756-3210049
10/26/12
DS21370C-page 20
Preliminary
2002-2012 Microchip Technology Inc.
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