TC1263-2.5VOA [MICROCHIP]
500 mA, Fixed-Output, CMOS LDO with Shutdown; 500毫安，固定输出， CMOS LDO ，带有关断
| 型号： | TC1263-2.5VOA |
| 厂家： | 
MICROCHIP |
| 描述： | 500 mA, Fixed-Output, CMOS LDO with Shutdown |
| 文件： | 总18页 (文件大小：272K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
TC1263
500 mA, Fixed-Output, CMOS LDO with Shutdown
Features
Description
• Very Low Dropout Voltage
The TC1263 is a fixed-output, high-accuracy (typically
±0.5%) CMOS low dropout regulator. Designed
specifically for battery-operated systems, the TC1263’s
CMOS construction eliminates wasted ground current,
significantly extending battery life. Total supply current
is typically 80 µA at full load (20 to 60 times lower than
in bipolar regulators).
• 500 mA Output Current
• High-Output Voltage Accuracy
• Standard or Custom Output Voltages
• Overcurrent and Overtemperature Protection
• SHDN Input for Active Power Management
• ERROR Output Can Be Used as a Low Battery
Detector (SOIC only)
TC1263 key features include ultra low noise operation,
very low dropout voltage (typically 350 mV at full load)
and fast response to step changes in load.
Applications
The TC1263 incorporates both overtemperature and
overcurrent protection. The TC1263 is stable with an
output capacitor of only 1 µF and has a maximum
output current of 500 mA. It is available in 8-Pin SOIC,
5-Pin TO-220 and 5-Pin DDPAK packages.
• Battery-Operated Systems
• Portable Computers
• Medical Instruments
• Instrumentation
• Cellular/GSM/PHS Phones
• Linear Post-Regulators for SMPS
• Pagers
Package Type
5-Pin TO-220
TC1263
5-Pin DDPAK
Front View
Tab is GND
Tab is GND
Typical Application
TC1263
V
V
OUT
V
V
IN
OUT
IN
+
C
1
1 µF
TC1263
1
2 3 4 5
3
2
5
4
1
GND
SHDN
SHDN
8-Pin SOIC
VOUT
GND
NC
VIN
NC
1
2
3
4
8
7
6
5
TC1263
SHDN
BYPASS
ERROR
© 2005 Microchip Technology Inc.
DS21374C-page 1
TC1263
† Notice: Stresses above those listed under "Maximum
Ratings" may cause permanent damage to the device. This is
a stress rating only and functional operation of the device at
those or any other conditions above those indicated in the
operation listings of this specification is not implied. Exposure
to maximum rating conditions for extended periods may affect
device reliability.
1.0
ELECTRICAL
CHARACTERISTICS
Absolute Maximum Ratings †
Input Voltage .........................................................6.5V
Output Voltage................ (GND – 0.3V) to (VIN + 0.3V)
Power Dissipation................Internally Limited (Note 7)
Voltage (max.) on Any Pin: (GND – 0.3V) to (VIN + 0.3V)
Operating Temperature Range....-40°C < TJ < +125°C
Storage Temperature..........................-65°C to +150°C
DC CHARACTERISTICS
Electrical Specifications: Unless otherwise indicated, V = V + 1.0V, (Note 1), I = 100 µA, C = 3.3 µF,
IN
R
L
L
SHDN > V , T = +25°C. Boldface type specifications apply for junction temperatures of -40°C to +125°C.
IH
A
Parameters
Sym
Min
Typ
Max
Units
Conditions
Input Operating Voltage
Maximum Output Current
Output Voltage
V
2.7
500
– 2.5%
—
—
6.0
—
V
mA
V
Note 2
Note 1
IN
I
—
OUTMAX
V
V
V
± 0.5%
40
V
+ 2.5%
—
OUT
R
R
R
V
Temperature Coefficient
ΔV
/ΔT
ppm/°C Note 3
(V + 1V) ≤ V ≤ 6V
OUT
OUT
Line Regulation
ΔV
ΔV
/ΔV
—
0.05
0.35
%
OUT
IN
R
IN
Load Regulation (Note 4)
Dropout Voltage (Note 5)
/V
–0.01
—
0.002
20
+0.01
30
%/mA I = 0.1 mA to I
L OUTMAX
OUT OUT
V
-V
mV
I = 100 µA
L
IN OUT
—
60
130
390
650
130
1
I = 100 mA
L
—
200
350
80
I = 300 mA
L
—
I = 500 mA
L
Supply Current
I
—
µA
µA
SHDN = V , I = 0
DD
IH
L
Shutdown Supply Current
Power Supply Rejection Ratio
Output Short Circuit Current
Thermal Regulation
I
—
0.05
64
SHDN = 0V
F ≤ 1 kHz
= 0V
SHDN
PSRR
—
—
db
I
—
1200
0.04
260
1400
—
mA
V/W
V
OUT
OUTSC
ΔV
/ΔP
—
Note 6
OUT
D
Output Noise
eN
—
—
nV/√Hz I = I
, F = 10 kHZ
OUTMAX
L
Note 1:
V is the regulator output voltage setting.
R
2: The minimum V has to justify the conditions: V ≥ V + V
and V ≥ 2.7V for I = 0.1 mA to I
.
OUTMAX
IN
IN
R
DROPOUT
IN
L
(VOUTMAX – VOUTMIN) – 106
-------------------------------------------------------------------------
VOUT × ΔT
3:
TCVOUT
=
4: Regulation is measured at a constant junction temperature using low duty-cycle pulse testing. Load regulation is tested
over a load range from 0.1 mA to the maximum specified output current. Changes in output voltage due to heating
effects are covered by the thermal regulation specification.
5: Dropout voltage is defined as the input-to-output differential at which the output voltage drops 2% below its nominal
value measured at a 1.0V differential.
6: Thermal regulation is defined as the change in output voltage at a time T after a change in power dissipation is applied,
excluding load or line regulation effects. Specifications are for a current pulse equal to I
at V = 6V for T = 10 ms.
IN
LMAX
7: The maximum allowable power dissipation is a function of ambient temperature, the maximum allowable junction
temperature and the thermal resistance from junction-to-air (i.e., T , T , θ ). Exceeding the maximum allowable power
A
J
JA
dissipation causes the device to initiate thermal shutdown. Please see Section 5.0 “Thermal Considerations” for
more details.
DS21374C-page 2
© 2005 Microchip Technology Inc.
TC1263
DC CHARACTERISTICS (CONTINUED)
Electrical Specifications: Unless otherwise indicated, V = V + 1.0V, (Note 1), I = 100 µA, C = 3.3 µF,
IN
R
L
L
SHDN > V , T = +25°C. Boldface type specifications apply for junction temperatures of -40°C to +125°C.
IH
A
Parameters
SHDN Input
Sym
Min
Typ
Max
Units
Conditions
SHDN Input High Threshold
SHDN Input Low Threshold
ERROR Output (SOIC Only)
Minimum Operating Voltage
Output Logic Low Voltage
ERROR Threshold Voltage
ERROR Positive Hysteresis
V
45
—
—
—
%V
%V
IH
IN
IN
V
—
15
IL
V
1.0
—
—
—
—
—
—
400
—
V
MIN
V
mV
1 mA Flows to ERROR
OL
TH
V
0.95 x V
50
V
R
V
—
mV
HYS
Note 1:
V is the regulator output voltage setting.
R
2: The minimum V has to justify the conditions: V ≥ V + V
and V ≥ 2.7V for I = 0.1 mA to I
.
OUTMAX
IN
IN
R
DROPOUT
IN
L
(VOUTMAX – VOUTMIN) – 106
-------------------------------------------------------------------------
VOUT × ΔT
3:
TCVOUT
=
4: Regulation is measured at a constant junction temperature using low duty-cycle pulse testing. Load regulation is tested
over a load range from 0.1 mA to the maximum specified output current. Changes in output voltage due to heating
effects are covered by the thermal regulation specification.
5: Dropout voltage is defined as the input-to-output differential at which the output voltage drops 2% below its nominal
value measured at a 1.0V differential.
6: Thermal regulation is defined as the change in output voltage at a time T after a change in power dissipation is applied,
excluding load or line regulation effects. Specifications are for a current pulse equal to I
at V = 6V for T = 10 ms.
IN
LMAX
7: The maximum allowable power dissipation is a function of ambient temperature, the maximum allowable junction
temperature and the thermal resistance from junction-to-air (i.e., T , T , θ ). Exceeding the maximum allowable power
A
J
JA
dissipation causes the device to initiate thermal shutdown. Please see Section 5.0 “Thermal Considerations” for
more details.
TEMPERATURE CHARACTERISTICS
Electrical Specifications: Unless otherwise indicated, V = V + 1.0V, I = 100 µA, C = 3.3 µF,
IN
R
L
L
SHDN > V , T = +25°C.
IH
A
Parameters
Sym
Min
Typ
Max
Units
Conditions
Temperature Ranges
Specified Temperature Range
Operating Temperature Range
Storage Temperature Range
Thermal Package Resistances
Thermal Resistance, 5L-DDPAK
Thermal Resistance, 5L-TO-220
Thermal Resistance, 8L-SOIC
T
-40
-40
-65
—
—
—
+125
+125
+150
°C
°C
°C
Note 1
A
T
J
T
A
θ
θ
θ
—
—
—
57
71
—
—
—
°C/W
°C/W
°C/W
JA
JA
JA
163
Note 1: Operation in this range must not cause T to exceed Maximum Junction Temperature (+125°C).
J
© 2005 Microchip Technology Inc.
DS21374C-page 3
TC1263
2.0
TYPICAL PERFORMANCE CURVES
Note:
The graphs and tables provided following this note are a statistical summary based on a limited number of
samples and are provided for informational purposes only. The performance characteristics listed herein
are not tested or guaranteed. In some graphs or tables, the data presented may be outside the specified
operating range (e.g., outside specified power supply range) and therefore outside the warranted range.
Note: Unless otherwise indicated, VIN = VR + 1.0V, IL = 100 µA, CL = 3.3 µF, SHDN > VIH, TA = +25°C.
0
.
020
150
135
0
.
018
0
.
016
014
012
120
105
90
0
0
.
.
2.5V
0
0
.
010
008
75
5
V
.
60
0
.006
45
0
.
004
30
0
.
002
15
0
0
.
000
-
40
°
C
0
°C
25°
C
70°
C
85°C
125
°
C
-
40
°C
0
°C
25°C
70°C
85°C 125°C
TEM
PERA
TUR
E
(°C)
TE
M
PERA
TUR
E
(°C)
FIGURE 2-1:
Line Regulation vs.
FIGURE 2-4:
IDD vs. Temperature.
Temperature.
0.50
10.0
R
C
= 50Ω
1μF
LOAD
125°C
=
OUT
85
C
°C
0
0
.
40
30
70
°
1
.0
25°C
.
0°C
0
0
0
.20
0
.
1
-
40°C
.
10
.
00
0
.0
0
100
200
300
400
500
0
.
01
10
0
.
01
1
100
1000
I
(mA)
LOAD
FREQUENCY (kHz)
FIGURE 2-5:
ILOAD
2.5V Dropout Voltage vs.
FIGURE 2-2:
Output Noise vs. Frequency.
.
0.0100
0
.
50
125°C
0.0090
0.0080
0.0070
0.0060
0.0050
0.0040
0.0030
0
0
.
.
40
85°C
30
70°C
1mA to 500mA
1mA to 500mA
25°C
2.5V
0
0
0
.20
0°C
5V
.
10
0.0020
0.0010
0.0100
-
40
°
C
.
00
0
500
200
300
100
400
-40°C
0°C
25°C 70°C
85°C 125°C
I
(mA)
LOAD
TEMPERATURE (°C)
FIGURE 2-3:
Temperature.
Load Regulation vs.
FIGURE 2-6:
ILOAD
5.0V Dropout Voltage vs.
.
DS21374C-page 4
© 2005 Microchip Technology Inc.
TC1263
Note: Unless otherwise indicated, VIN = VR + 1.0V, IL = 100 µA, CL = 3.3 µF, SHDN > VIH, TA = +25°C.
5.20
2.70
5
5
.
10
00
I
= 0.1mA
I
=
0
.1mA
L
L
2
2
.
50
30
.
4
4
4
.90
.
.
.
80
70
.
I
= 300mA
I
= 300mA
L
L
2
10
4
4
4
4
.
60
50
40
30
I
=
500mA
I
= 500mA
L
L
.
.
.
1
1
1
.90
.
70
50
4
4
.
20
10
.
.
4
.
00
40
-
40
°
C
0
°C
25
°
C
70
°C
85°C 125°C
-
°
C
0
°
C
25
°
C
70
°
C
85°C
125°C
TEM
PERA
TURE (°C)
TEM
PERA
T
URE (°C)
FIGURE 2-7:
2.5V VOUT vs. Temperature.
FIGURE 2-8:
5.0V VOUT vs. Temperature.
© 2005 Microchip Technology Inc.
DS21374C-page 5
TC1263
3.0
PIN DESCRIPTIONS
The descriptions of the pins are listed in Table 3-1.
TABLE 3-1:
PIN FUNCTION TABLE
Pin No.
Pin No.
(8-Pin SOIC)
(5-Pin DDPAK)
(5-Pin TO-220)
Symbol
Description
1
2
3
4
5
6
7
8
5
3
VOUT
GND
NC
Regulated voltage output
Ground terminal
No connect
—
1
BYPASS Reference bypass input
ERROR Out-of-Regulation Flag (open-drain output).
—
2
SHDN
NC
Shutdown control input
No connect
—
4
VIN
Unregulated supply input
3.1
Regulated Output Voltage (V
)
3.4
Out-of-Regulation Flag (ERROR)
OUT
VOUT is a regulated voltage output.
Out-of-Regulation Flag (open-drain output). ERROR
goes low when VOUT is out-of-tolerance by
approximately – 5%.
3.2
Ground (GND)
Ground terminal.
3.5
Shutdown Control (SHDN)
Shutdown control input. The regulator is fully enabled
when a logic-high is applied to SHDN. The regulator
enters shutdown when a logic-low is applied to this
input. During shutdown, output voltage falls to zero and
supply current is reduced to 0.05 µA (typical).
3.3
Reference Bypass (BYPASS)
Reference bypass input. Connect a 470 pF to the
BYPASS input to further reduce output noise.
3.6
Unregulated Supply (V )
IN
VIN is an unregulated supply input.
DS21374C-page 6
© 2005 Microchip Technology Inc.
TC1263
4.2
ERROR Output
4.0
DETAILED DESCRIPTION
ERROR is driven low whenever VOUT falls out of
regulation by more than – 5% (typ.). This condition may
be caused by low input voltage, output current limiting
or thermal limiting. The ERROR threshold is 5% below
rated VOUT, regardless of the programmed output
voltage value (e.g., ERROR = VOL at 4.75V (typ.) for a
5.0V regulator and 2.85V (typ.) for a 3.0V regulator).
ERROR output operation is shown in Figure 4-2.
The TC1263 is a precision, fixed-output LDO. Unlike
bipolar regulators, the TC1263’s supply current does
not increase with load current. In addition, VOUT
remains stable and within regulation over the entire
0 mA to ILOADMAX load current range (an important
consideration in RTC and CMOS RAM battery back-up
applications).
Figure 4-1 shows a typical application circuit.
Note that ERROR is active when VOUT is at or below
VTH, and inactive when VOUT is above VTH + VHYS
.
VIN
VOUT
VOUT
As shown in Figure 4-1, ERROR can be used as a
battery-low flag or as a processor RESET signal (with
the addition of timing capacitor C3). R1 x C3 should be
chosen to maintain ERROR below VIH of the processor
RESET input for at least 200 ms to allow time for the
system to stabilize. Pull-up resistor R1 can be tied to
VOUT, VIN or any other voltage less than (VIN + 0.3V).
+
+
1 µF
C2
1 µF
C1
+
TC1263
Battery
GND
V+
SHDN
ERROR
R1
1 M
Shutdown Control
(to CMOS Logic or Tie
BATTLOW
or RESET
C3 Required Only
if ERROR is used as a
Processor RESET Signal
(See Text)
to V , if unused)
IN
VOUT
+
0.2 µF
C3
Hysteresis (VHYS
)
VTH
FIGURE 4-1:
Typical Application Circuit.
ERROR
VOH
4.1
Output Capacitor
VOL
A 1 µF (min.) capacitor from VOUT to ground is
required. The output capacitor should have an Effective
Series Eesistance (ESR) greater than 0.1Ω and less
than 5Ω. A 1 µF capacitor should be connected from
VIN to GND if there is either more than 10 inches of wire
between the regulator and the AC filter capacitor or a
battery is used as the power source. Aluminum
electrolytic or tantalum capacitor types can be used.
Since many aluminum electrolytic capacitors freeze at
FIGURE 4-2:
ERROR Output Operation.
approximately
-30°C,
solid
tantalums
are
recommended for applications operating below -25°C.
When operating from sources other than batteries,
supply-noise rejection and transient response can be
improved by increasing the value of the input and
output capacitors, and by employing passive filtering
techniques.
© 2005 Microchip Technology Inc.
DS21374C-page 7
TC1263
TABLE 5-2:
THERMAL RESISTANCE
GUIDELINES FOR TC1263 IN
5-PIN DDPAK/TO-220
PACKAGE
5.0
5.1
THERMAL CONSIDERATIONS
Thermal Shutdown
Integrated thermal protection circuitry shuts the
regulator off when the die temperature exceeds 160°C.
The regulator remains off until the die temperature
drops to approximately 150°C.
Copper
Area
(Topside)* (Backside)
Copper
Area
Thermal
Resistance
Board
Area
(θ
)
JA
2500 sq mm 2500 sq mm 2500 sq mm
1000 sq mm 2500 sq mm 2500 sq mm
125 sq mm 2500 sq mm 2500 sq mm
* Tab of device attached to top-side copper
25°C/W
27°C/W
35°C/W
5.2
Power Dissipation
The amount of power the regulator dissipates is
primarily a function of input and output voltage and out-
put current. The following equation is used to calculate
worst-case actual power dissipation:
Equation 5-1 can be used in conjunction with
Equation 5-2 to ensure regulator thermal operation is
within limits. For example:
EQUATION 5-1:
Given:
PD = (VINMAX – VOUTMIN)ILOADMAX
VINMAX
VOUTMIN
ILOADMAX
TJMAX
=
=
=
=
=
=
3.3V ± 10%
2.7V ± 0.5%
275 mA
Where:
PD = Worst-case actual power dissipation
VINMAX = Maximum voltage on VIN
125°C
VOUTMIN = Minimum regulator output voltage
ILOADMAX = Maximum output (load) current
TAMAX
95°C
θJA
60° C/W (SOIC)
The
maximum
allowable
power
dissipation
Find:
(Equation 5-2) is a function of the maximum ambient
temperature (TAMAX), the maximum allowable die
temperature (TJMAX) and the thermal resistance from
junction-to-air (θJA).
1. Actual power dissipation
2. Maximum allowable dissipation
Actual power dissipation:
PD ≈ (VINMAX – VOUTMIN)ILOADMAX
PD = (3.3 × 1.1) – (2.7 × .995)275 × 10–3
EQUATION 5-2:
TJMAX – TAMAX
--------------------------------------
=
PD = 260 mW
PDMAX
θJA
Where:
PD = Worst-case actual power dissipation
= Maximum voltage on VIN
VOUTMIN = Minimum regulator output voltage
ILOADMAX = Maximum output (load) current
Maximum allowable power dissipation:
VINMAX
TJMAX – TAMAX
--------------------------------------
PDMAX
=
θJA
(125 – 95)
-------------------------
PDMAX
=
60
Table 5-1 and Table 5-2 show various values of θJA for
the TC1263 package types.
PDMAX = 500 mW
In this example, the TC1263 dissipates a maximum of
260 mW below the allowable limit of 500 mW. In a
similar manner, Equation 5-1 and Equation 5-2 can be
used to calculate maximum current and/or input
voltage limits. For example, the maximum allowable
VIN is found by substituting the maximum allowable
power dissipation of 500 mW into Equation 5-1, from
which VINMAX = 4.6V.
TABLE 5-1:
THERMAL RESISTANCE
GUIDELINES FOR TC1263 IN
8-PIN SOIC PACKAGE
Copper
Area
(Topside)* (Backside)
Copper
Area
Thermal
Resistance
Board
Area
(θ
)
JA
2500 sq mm 2500 sq mm 2500 sq mm
1000 sq mm 2500 sq mm 2500 sq mm
225 sq mm 2500 sq mm 2500 sq mm
100 sq mm 2500 sq mm 2500 sq mm
60°C/W
60°C/W
68°C/W
74°C/W
* Pin 2 is ground. Device is mounted on top-side.
DS21374C-page 8
© 2005 Microchip Technology Inc.
TC1263
6.0
6.1
PACKAGING INFORMATION
Package Marking Information
5-Lead DDPAK
Example:
XXXXXXXXX
XXXXXXXXX
YYWWNNN
TC1263
3.3VET
0430256
5-Lead TO-220
Example:
XXXXXXXXX
XXXXXXXXX
TC1263-
3.3VATX
YYWWNNN
0430256
8-Lead SOIC (150 mil)
Example:
XXXXXXXX
XXXXYYWW
1263-3.3
VOA0430
NNN
256
Legend: XX...X Customer-specific information
Y
YY
Year code (last digit of calendar year)
Year code (last 2 digits of calendar year)
WW
NNN
Week code (week of January 1 is week ‘01’)
Alphanumeric traceability code
e
3
Pb-free JEDEC designator for Matte Tin (Sn)
This package is Pb-free. The Pb-free JEDEC designator (
can be found on the outer packaging for this package.
*
)
3
e
Note: In the event the full Microchip part number cannot be marked on one line, it will
be carried over to the next line, thus limiting the number of available
characters for customer-specific information.
© 2005 Microchip Technology Inc.
DS21374C-page 9
TC1263
5-Lead Plastic (ET) (DDPAK)
E
L3
E1
D2
D
D1
1
BOTTOM VIEW
e
b
TOP VIEW
θ1
(5X)
c2
A
θ
A1
c
L
Units
INCHES*
NOM
5
MILLIMETERS
Dimension Limits
MIN
MAX
MIN
NOM
5
MAX
Number of Pins
Pitch
e
.067 BSC
.177
.005
.398
.256 REF
.350
.577
.303 REF
.020
--
1.70 BSC
4.50
0.13
10.11
6.50 REF
8.89
14.66
7.75 REF
0.51
--
Overall Height
Standoff §
A
A1
E
.170
.183
4.32
4.65
.000
.010
.410
0.00
9.78
0.25
Overall Width
Exposed Pad Width
Molded Package Length
Overall Length
Exposed Pad Length
Lead Thickness
Pad Thickness
Lead Width
.385
10.41
E1
D
.330
.370
8.38
9.40
D1
D2
c
.549
.605
13.94
15.37
.014
.045
.026
.068
.045
--
.026
.055
.037
.110
.067
8°
0.36
1.14
0.66
1.73
1.14
--
0.66
1.40
0.94
2.79
1.70
8°
c2
b
.032
.089
--
0.81
2.26
--
Foot Length
L
Pad Length
L3
Foot Angle
θ
--
--
Mold Draft Angle
θ1
3°
--
7°
3°
--
7°
*Controlling Parameter
§ Significant Characteristic
Notes:
Dimensions D and E do not include mold flash or protrusions. Mold flash or protrusions shall not
exceed .010" (0.254mm) per side.
JEDEC equivalent: TO-252
Drawing No. C04-012
DS21374C-page 10
© 2005 Microchip Technology Inc.
TC1263
5-Lead Plastic Transistor Outline (AT) (TO-220)
L
H1
Q
b
e3
e1
E
e
EJECTOR PIN
ØP
(5X)
a
C1
A
J1
F
D
Units
INCHES*
MIN
.060
MILLIMETERS
MIN MAX
1.52 1.83
Dimension Limits
MAX
.072
e
Lead Pitch
Overall Lead Centers
Space Between Leads
Overall Height
e1
e3
A
.263
.030
.160
.385
.560
.234
.045
.103
.146
.540
.090
.014
.025
.273
.040
.190
.415
.590
.258
.055
.113
.156
.560
.115
.022
.040
6.68
0.76
4.06
9.78
14.22
5.94
1.14
2.62
3.71
13.72
2.29
0.36
0.64
6.93
1.02
4.83
Overall Width
E
10.54
14.99
6.55
Overall Length
D
Flag Length
H1
F
Flag Thickness
1.40
Q
Through Hole Center
Through Hole Diameter
Lead Length
2.87
P
L
3.96
14.22
2.92
Base to Bottom of Lead
Lead Thickness
Lead Width
J1
C1
b
0.56
1.02
a
Mold Draft Angle
3°
7°
3°
7°
*Controlling Parameter
Notes:
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or
protrusions shall not exceed .010" (0.254mm) per side.
JEDEC equivalent: TO-220
Drawing No. C04-036
© 2005 Microchip Technology Inc.
DS21374C-page 11
TC1263
8-Lead Plastic Small Outline (SN) – Narrow, 150 mil Body (SOIC)
E
E1
p
D
2
B
n
1
h
α
45°
c
A2
A
φ
β
L
A1
Units
INCHES*
MILLIMETERS
Dimension Limits
MIN
NOM
8
MAX
MIN
NOM
8
MAX
n
p
Number of Pins
Pitch
.050
1.27
Overall Height
A
.053
.061
.056
.007
.237
.154
.193
.015
.025
4
.069
1.35
1.32
1.55
1.42
0.18
6.02
3.91
4.90
0.38
0.62
4
1.75
Molded Package Thickness
Standoff
A2
A1
E
.052
.004
.228
.146
.189
.010
.019
0
.061
.010
.244
.157
.197
.020
.030
8
1.55
0.25
6.20
3.99
5.00
0.51
0.76
8
§
0.10
5.79
3.71
4.80
0.25
0.48
0
Overall Width
Molded Package Width
Overall Length
E1
D
Chamfer Distance
Foot Length
h
L
φ
Foot Angle
c
Lead Thickness
Lead Width
.008
.013
0
.009
.017
12
.010
.020
15
0.20
0.33
0
0.23
0.42
12
0.25
0.51
15
B
α
β
Mold Draft Angle Top
Mold Draft Angle Bottom
0
12
15
0
12
15
* Controlling Parameter
§ Significant Characteristic
Notes:
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed
.010” (0.254mm) per side.
JEDEC Equivalent: MS-012
Drawing No. C04-057
DS21374C-page 12
© 2005 Microchip Technology Inc.
TC1263
APPENDIX A: REVISION HISTORY
Revision C (January 2005)
The following is the list of modifications:
1. Changes to DC Characteristics table
2. Added Appendix A: Revision History.
Revision B (May 2002)
No information for this revision.
Revision A (March 2002)
Original data sheet release.
© 2005 Microchip Technology Inc.
DS21374C-page 13
TC1263
NOTES:
DS21374C-page 14
© 2005 Microchip Technology Inc.
TC1263
PRODUCT IDENTIFICATION SYSTEM
To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office.
Examples:
PART NO.
Device
X.X
X
XX
XX
a)
b)
c)
d)
e)
TC1263-2.5VAT
2.5V LDO, TO-220-5 pkg.
2.8V LDO, TO-220-5 pkg.
3.0V LDO, TO-220-5 pkg.
3.3V LDO, TO-220-5 pkg.
5.0V LDO, TO-220-5 pkg.
Voltage
Option
Temperature Package
Range
Tape and
Reel
TC1263-2.8VAT
TC1263-3.0VAT
TC1263-3.3VAT
TC1263-5.0VAT
Device
TC1263 Fixed Output CMOS LDO with Shutdown
a)
b)
TC1263-2.5VETTR 1.8V LDO, DDPAK-5 pkg.,
Tape and Reel
TC1263-2.8VETTR 2.5V LDO, DDPAK-5 pkg.,
Tape and Reel
TC1263-3.0VETTR 3.0V LDO, DDPAK-5 pkg.,
Tape and Reel
TC1263-3.3VETTR 3.3V LDO, DDPAK-5 pkg.,
Tape and Reel
Voltage Option:*
2.5
2.8
3.0
3.3
5.0
=
=
=
=
=
2.5V
2.8V
3.0V
3.3V
5.0V
c)
d)
* Other output voltages are available. Please contact your
local Microchip sales office for details.
a)
b)
TC1263-2.5VOA
1.8V LDO, SOIC-8 pkg.
TC1263-2.5VOATR 1.8V LDO, SOIC-8 pkg.,
Tape and Reel
Temperature Range:
Package
V
= -40°C to +125°C
c)
d)
TC1263-2.8VOA
2.5V LDO, SOIC-8 pkg.
TC1263-2.8VOATR 2.5V LDO, SOIC-8 pkg.,
Tape and Reel
AT
ET
ETTR
=
=
=
Plastic (TO-220), 5-Lead
e)
f)
TC1263-3.0VOA
3.0V LDO, SOIC-8 pkg.
Plastic Transistor Outline (DDPAK), 5-Lead
Plastic Transistor Outline (DDPAK), 5-Lead,
Tape and Reel
TC1263-3.0VOATR 3.0V LDO, SOIC-8 pkg.,
Tape and Reel
OA
OATR
=
=
Plastic SOIC, (150 mil Body), 8-lead
Plastic SOIC, (150 mil Body), 8-lead,
Tape and Reel
g)
h)
TC1263-3.3VOA
3.3V LDO, SOIC-8 pkg.
TC1263-3.3VOATR 3.3V LDO, SOIC-8 pkg.,
Tape and Reel
i)
TC1263-5.0VOA
5.0V LDO, SOIC-8 pkg.
© 2005 Microchip Technology Inc.
DS21374C-page 15
TC1263
NOTES:
DS21374C-page 16
© 2005 Microchip Technology Inc.
Note the following details of the code protection feature on Microchip devices:
•
Microchip products meet the specification contained in their particular Microchip Data Sheet.
•
Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the
intended manner and under normal conditions.
•
There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our
knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data
Sheets. Most likely, the person doing so is engaged in theft of intellectual property.
•
•
Microchip is willing to work with the customer who is concerned about the integrity of their code.
Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not
mean that we are guaranteeing the product as “unbreakable.”
Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our
products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts
allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act.
Information contained in this publication regarding device
applications and the like is provided only for your convenience
and may be superseded by updates. It is your responsibility to
ensure that your application meets with your specifications.
MICROCHIP MAKES NO REPRESENTATIONS OR WAR-
RANTIES OF ANY KIND WHETHER EXPRESS OR IMPLIED,
WRITTEN OR ORAL, STATUTORY OR OTHERWISE,
RELATED TO THE INFORMATION, INCLUDING BUT NOT
LIMITED TO ITS CONDITION, QUALITY, PERFORMANCE,
MERCHANTABILITY OR FITNESS FOR PURPOSE.
Microchip disclaims all liability arising from this information and
its use. Use of Microchip’s products as critical components in
life support systems is not authorized except with express
written approval by Microchip. No licenses are conveyed,
implicitly or otherwise, under any Microchip intellectual property
rights.
Trademarks
The Microchip name and logo, the Microchip logo, Accuron,
dsPIC, KEELOQ, microID, MPLAB, PIC, PICmicro, PICSTART,
PRO MATE, PowerSmart, rfPIC, and SmartShunt are
registered trademarks of Microchip Technology Incorporated
in the U.S.A. and other countries.
AmpLab, FilterLab, Migratable Memory, MXDEV, MXLAB,
PICMASTER, SEEVAL, SmartSensor and The Embedded
Control Solutions Company are registered trademarks of
Microchip Technology Incorporated in the U.S.A.
Analog-for-the-Digital Age, Application Maestro, dsPICDEM,
dsPICDEM.net, dsPICworks, ECAN, ECONOMONITOR,
FanSense, FlexROM, fuzzyLAB, In-Circuit Serial
Programming, ICSP, ICEPIC, MPASM, MPLIB, MPLINK,
MPSIM, PICkit, PICDEM, PICDEM.net, PICLAB, PICtail,
PowerCal, PowerInfo, PowerMate, PowerTool, rfLAB,
rfPICDEM, Select Mode, Smart Serial, SmartTel and Total
Endurance are trademarks of Microchip Technology
Incorporated in the U.S.A. and other countries.
SQTP is a service mark of Microchip Technology Incorporated
in the U.S.A.
All other trademarks mentioned herein are property of their
respective companies.
© 2005, Microchip Technology Incorporated, Printed in the
U.S.A., All Rights Reserved.
Printed on recycled paper.
Microchip received ISO/TS-16949:2002 quality system certification for
its worldwide headquarters, design and wafer fabrication facilities in
Chandler and Tempe, Arizona and Mountain View, California in
October 2003. The Company’s quality system processes and
procedures are for its PICmicro® 8-bit MCUs, KEELOQ® code hopping
devices, Serial EEPROMs, microperipherals, nonvolatile memory and
analog products. In addition, Microchip’s quality system for the design
and manufacture of development systems is ISO 9001:2000 certified.
© 2005 Microchip Technology Inc.
DS21374C-page 17
WORLDWIDE SALES AND SERVICE
AMERICAS
ASIA/PACIFIC
ASIA/PACIFIC
EUROPE
Corporate Office
Australia - Sydney
Tel: 61-2-9868-6733
Fax: 61-2-9868-6755
India - Bangalore
Tel: 91-80-2229-0061
Fax: 91-80-2229-0062
Austria - Weis
Tel: 43-7242-2244-399
Fax: 43-7242-2244-393
2355 West Chandler Blvd.
Chandler, AZ 85224-6199
Tel: 480-792-7200
Fax: 480-792-7277
Technical Support:
http://support.microchip.com
Web Address:
www.microchip.com
China - Beijing
Tel: 86-10-8528-2100
Fax: 86-10-8528-2104
Denmark - Ballerup
Tel: 45-4450-2828
Fax: 45-4485-2829
India - New Delhi
Tel: 91-11-5160-8631
Fax: 91-11-5160-8632
China - Chengdu
Tel: 86-28-8676-6200
Fax: 86-28-8676-6599
France - Massy
Tel: 33-1-69-53-63-20
Fax: 33-1-69-30-90-79
Japan - Kanagawa
Tel: 81-45-471- 6166
Fax: 81-45-471-6122
Atlanta
China - Fuzhou
Tel: 86-591-8750-3506
Fax: 86-591-8750-3521
Germany - Ismaning
Tel: 49-89-627-144-0
Fax: 49-89-627-144-44
Korea - Seoul
Alpharetta, GA
Tel: 770-640-0034
Fax: 770-640-0307
Tel: 82-2-554-7200
Fax: 82-2-558-5932 or
82-2-558-5934
Italy - Milan
Tel: 39-0331-742611
Fax: 39-0331-466781
China - Hong Kong SAR
Tel: 852-2401-1200
Fax: 852-2401-3431
Boston
Singapore
Tel: 65-6334-8870
Fax: 65-6334-8850
Westford, MA
Tel: 978-692-3848
Fax: 978-692-3821
Netherlands - Drunen
Tel: 31-416-690399
Fax: 31-416-690340
China - Shanghai
Tel: 86-21-5407-5533
Fax: 86-21-5407-5066
China - Shenyang
Tel: 86-24-2334-2829
Fax: 86-24-2334-2393
Taiwan - Kaohsiung
Tel: 886-7-536-4818
Fax: 886-7-536-4803
Chicago
Itasca, IL
Tel: 630-285-0071
Fax: 630-285-0075
England - Berkshire
Tel: 44-118-921-5869
Fax: 44-118-921-5820
Taiwan - Taipei
Tel: 886-2-2500-6610
Fax: 886-2-2508-0102
Dallas
Addison, TX
China - Shenzhen
Tel: 86-755-8203-2660
Fax: 86-755-8203-1760
Tel: 972-818-7423
Fax: 972-818-2924
Taiwan - Hsinchu
Tel: 886-3-572-9526
Fax: 886-3-572-6459
China - Shunde
Detroit
Tel: 86-757-2839-5507
Fax: 86-757-2839-5571
Farmington Hills, MI
Tel: 248-538-2250
Fax: 248-538-2260
China - Qingdao
Tel: 86-532-502-7355
Fax: 86-532-502-7205
Kokomo
Kokomo, IN
Tel: 765-864-8360
Fax: 765-864-8387
Los Angeles
Mission Viejo, CA
Tel: 949-462-9523
Fax: 949-462-9608
San Jose
Mountain View, CA
Tel: 650-215-1444
Fax: 650-961-0286
Toronto
Mississauga, Ontario,
Canada
Tel: 905-673-0699
Fax: 905-673-6509
10/20/04
DS21374C-page 18
© 2005 Microchip Technology Inc.
相关型号：
TC1263-2.8VOA713
2.8 V FIXED POSITIVE LDO REGULATOR, 0.65 V DROPOUT, PDSO8, 0.150 INCH, PLASTIC, MS-012, SOIC-8
MICROCHIP
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