TC1264-1.8VEB_技术文档

TC1264

800 mA Fixed-Output CMOS LDO with Shutdown

Features

Description

• Very Low Dropout Voltage

The TC1264 is a fixed output, high accuracy (typically

±0.5%) CMOS low dropout regulator. Designed

specifically for battery-operated systems, the TC1264’s

CMOS construction eliminates wasted ground current,

significantly extending battery life. Total supply current

is typically 80 µA at full load (20 to 60 times lower than

in bipolar regulators).

• 800 mA Output Current

• High Output Voltage Accuracy

• Standard or Custom Output Voltages

• Overcurrent and Overtemperature Protection

Applications

TC1264 key features include ultra low noise operation,

very low dropout voltage (typically 450 mV at full load),

and fast response to step changes in load.

• Battery Operated Systems

• Portable Computers

• Medical Instruments

• Instrumentation

The TC1264 incorporates both over temperature and

over current protection. The TC1264 is stable with an

output capacitor of only 1μF and has a maximum

output current of 800 mA. It is available in 3-Pin

SOT-223, 3-Pin TO-220 and 3-Pin DDPAK packages.

• Cellular/GSM/PHS Phones

• Linear Post-Regulators for SMPS

• Pagers

Package Type

Typical Application

3-Pin DDPAK

3-Pin TO-220

FRONT VIEW

TAB IS GND

V_OUT

V_IN

+

C₁

1 µF

TC1264

GND

1

2

3

1

2

3

3-Pin SOT-223

FRONT VIEW

V_OUT

3

2 GND

1 V_IN

TC1264

DS21375C-page 1

TC1264

† Notice: Stresses above those listed under "Maximum

Ratings" may cause permanent damage to the device. This is

a stress rating only and functional operation of the device at

those or any other conditions above those indicated in the

operation listings of this specification is not implied. Exposure

to maximum rating conditions for extended periods may affect

device reliability.

1.0

ELECTRICAL

CHARACTERISTICS

Absolute Maximum Ratings †

Input Voltage .........................................................6.5V

Output Voltage.................. (V_SS– 0.3V) to (V_IN+ 0.3V)

Power Dissipation................Internally Limited (Note 8)

Maximum Voltage on Any Pin ........V_IN+0.3V to -0.3V

Operating Temperature Range...... -40°C < T_J< 125°C

Storage Temperature..........................-65°C to +150°C

DC CHARACTERISTICS

Electrical Specifications: Unless otherwise indicated, V_IN= V_R+ 1.5V, (Note 1), I_L= 100 µA, C_L= 3.3 µF, SHDN > V_IH

T_A= +25°C. Boldface type specifications apply for junction temperatures of -40°C to +125°C.

,

Parameters

Sym

Min

Typ

Max

Units

Conditions

Input Operating Voltage

Maximum Output Current

Output Voltage

V_IN

2.7

—

6.0

V

mA

V

Note 2

I_OUTMAX

V_OUT

800

—

V_R– 2.5% V_R± 0.5% V_R+ 2.5%

V_R– 2% V_R± 0.5% V_R+ 3%

V_R≥ 2.5V

V_R= 1.8V

V_R– 7%

—

V_R+ 3%

I_L= 0.1 mA to 800 mA

(Note 3)

V

_OUTTemperature Coefficient

ΔV_OUT/ΔT

ΔV_OUT/ΔV_IN

ΔV_OUT/V_OUT

V_IN–V_OUT

—

40

0.007

0.002

20

—

0.35

0

ppm/°C Note 4

Line Regulation

%

(V_R+ 1V) ≤ V_IN≤ 6V

Load Regulation (Note 5)

Dropout Voltage (Note 6)

-0.01

—

%/mA I_L= 0.1 mA to I_OUTMAX

30

mV

V_R≥ 2.5V, I_L= 100 µA

V_R≥ 2.5V, I_L= 100 mA

V_R≥ 2.5V, I_L= 300 mA

V_R≥ 2.5V, I_L= 500 mA

V_R≥ 2.5V, I_L= 800 mA

V_R= 1.8V, I_L= 500 mA

I_L= 800 mA

—

50

160

480

800

1300

1200

1400

130

—

150

260

450

1000

1200

80

—

Supply Current

I_DD

—

µA

db

SHDN = V_IH, I_L= 0

F ≤ 1 kHz

Power Supply Rejection Ratio

Output Short Circuit Current

PSRR

I_OUTSC

—

64

—

1200

—

mA

V_OUT= 0V

Note 1: V_Ris the regulator output voltage setting.

2: The minimum V_INhas to justify the conditions: V_IN≥ V_R+ V_DROPOUTand V_IN≥ 2.7V for I_L= 0.1 mA to I_OUTMAX

3: This accuracy represents the worst-case over the entire output current and temperature range.

.

(V_OUTMAX– V_OUTMIN) – 10⁶

4:

TCV_OUT= -------------------------------------------------------------------------

V_OUT× ΔT

5: Regulation is measured at a constant junction temperature using low duty cycle pulse testing. Load regulation is tested

over a load range from 0.1 mA to the maximum specified output current. Changes in output voltage due to heating

effects are covered by the thermal regulation specification.

6: Dropout voltage is defined as the input-to-output differential at which the output voltage drops 2% below its nominal

value measured at a 1.5V differential.

7: Thermal regulation is defined as the change in output voltage at a time T after a change in power dissipation is applied,

excluding load or line regulation effects. Specifications are for a current pulse equal to I_LMAXat V_IN= 6V for T = 10 ms.

8: The maximum allowable power dissipation is a function of ambient temperature, the maximum allowable junction tem-

perature and the thermal resistance from junction-to-air (i.e., T_A, T_J, θ_JA). Exceeding the maximum allowable power dis-

sipation causes the device to initiate thermal shutdown. Please see Section 5.0 “Thermal Considerations” for more

details..

DS21375C-page 2

TC1264

DC CHARACTERISTICS (CONTINUED)

Electrical Specifications: Unless otherwise indicated, V_IN= V_R+ 1.5V, (Note 1), I_L= 100 µA, C_L= 3.3 µF, SHDN > V_IH

T_A= +25°C. Boldface type specifications apply for junction temperatures of -40°C to +125°C.

,

Parameters

Thermal Regulation

Output Noise

Sym

Min

Typ

Max

Units

Conditions

ΔV_OUT/ΔP_D

—

0.04

260

—

V/W

Note 7

eN

nV/√Hz I_L= I_OUTMAX, F = 10 kHZ

Note 1: V_Ris the regulator output voltage setting.

2: The minimum V_INhas to justify the conditions: V_IN≥ V_R+ V_DROPOUTand V_IN≥ 2.7V for I_L= 0.1 mA to I_OUTMAX

3: This accuracy represents the worst-case over the entire output current and temperature range.

.

(V_OUTMAX– V_OUTMIN) – 10⁶

4:

TCV_OUT= -------------------------------------------------------------------------

V_OUT× ΔT

5: Regulation is measured at a constant junction temperature using low duty cycle pulse testing. Load regulation is tested

over a load range from 0.1 mA to the maximum specified output current. Changes in output voltage due to heating

effects are covered by the thermal regulation specification.

6: Dropout voltage is defined as the input-to-output differential at which the output voltage drops 2% below its nominal

value measured at a 1.5V differential.

7: Thermal regulation is defined as the change in output voltage at a time T after a change in power dissipation is applied,

excluding load or line regulation effects. Specifications are for a current pulse equal to I_LMAXat V_IN= 6V for T = 10 ms.

8: The maximum allowable power dissipation is a function of ambient temperature, the maximum allowable junction tem-

perature and the thermal resistance from junction-to-air (i.e., T_A, T_J, θ_JA). Exceeding the maximum allowable power dis-

sipation causes the device to initiate thermal shutdown. Please see Section 5.0 “Thermal Considerations” for more

details..

TEMPERATURE CHARACTERISTICS

Electrical Specifications: Unless otherwise indicated, V_IN= V_R+ 1.5V, I_L= 100 µA, C_L= 3.3 µF, SHDN > V_IH, T_A= +25°C.

Parameters

Temperature Ranges

Sym

Min

Typ

Max

Units

Conditions

Specified Temperature Range

Operating Temperature Range

Storage Temperature Range

T_A

T_J

T_A

-40

-65

—

+125

+150

°C

(Note 1)

Thermal Package Resistances

Thermal Resistance, 3L-SOT-223

Thermal Resistance, 3L-DDPAK

Thermal Resistance, 3L-TO-220

θ_JA

—

59

71

—

°C/W

Note 1: Operation in this range must not cause T_Jto exceed Maximum Junction Temperature (+125°C).

DS21375C-page 3

TC1264

2.0

TYPICAL PERFORMANCE CURVES

Note:

The graphs and tables provided following this note are a statistical summary based on a limited number of

samples and are provided for informational purposes only. The performance characteristics listed herein

are not tested or guaranteed. In some graphs or tables, the data presented may be outside the specified

operating range (e.g., outside specified power supply range) and therefore outside the warranted range.

150

135

0.020

0.018

0.016

120

105

90

0.014

0.012

0.010

0.008

0.006

0.004

V

= 3V

OUT

75

60

45

30

0.002

0.000

15

0

-40°C 0°C

25°C 70°C 85°C 125°C

TEMPERATURE (°C)

-40°C 0°C

25°C 70°C 85°C 125°C

TEMPERATURE (°C)

FIGURE 2-1:

Line Regulation vs.

FIGURE 2-4:

I

vs. Temperature.

DD

Temperature.

0.600

0.550

0.500

0.450

0.400

10.0

1.0

125°C

85°C

R

C

= 50

:

LOAD

OUT

= 1

μF

70°C

25°C

0.350

0.300

0.250

0.200

0.150

0.100

0.050

0.000

0°C

0.1

0.0

-40°C

400 500 600 700 800

(mA)

0

100

200 300

I

0.01

10

0.01

1

100

1000

LOAD

FREQUENCY (kHz)

FIGURE 2-5:

3.0V Dropout Voltage vs.

FIGURE 2-2:

Output Noise vs. Frequency.

I

.

LOAD

0.0100

0.0090

0.0080

0.0070

0.0060

0.0050

0.0040

0.0030

3.030

3.020

3.010

3.000

2.990

2.980

I

= 0.1 mA

LOAD

I

= 300 mA

= 500 mA

LOAD

I

LOAD

V

= 3V

1 mA to 800 mA

OUT

2.970

2.960

2.950

2.940

2.930

2.920

I

= 800 mA

LOAD

0.0020

0.0010

0.0100

-40°C

-40°C 0°C

25°C 70°C 85°C 125°C

TEMPERATURE (°C)

0°C

25°C 70°C

85°C 125°C

TEMPERATURE (°C)

FIGURE 2-3:

Load Regulation vs.

FIGURE 2-6:

3.0V V

vs.Temperature.

OUT

Temperature.

DS21375C-page 4

TC1264

3.0

PIN DESCRIPTIONS

The descriptions of the pins are listed in Table 3-1.

TABLE 3-1:

PIN FUNCTION TABLE

Symbol

Pin No.

3-Pin SOT-223

3-Pin TO-220

3-Pin DDPAK

Description

1

2

3

V_IN

Unregulated supply input

GND

V_OUT

Ground terminal

Regulated voltage output.

3.1

Unregulated Supply (V_IN)

3.3

Regulated Output Voltage (V_OUT

)

Unregulated supply input.

Regulated voltage output.

3.2

Ground (GND)

Ground terminal.

DS21375C-page 5

TC1264

4.1

Output Capacitor

4.0

DETAILED DESCRIPTION

A 1 µF (min) capacitor from V_OUTto ground is required.

The output capacitor should have an effective series

resistance greater than 0.1Ω and less than 5Ω. A 1 µF

capacitor should be connected from V_INto GND if there

is more than 10 inches of wire between the regulator

and the AC filter capacitor, or if a battery is used as the

power source. Aluminum electrolytic or tantalum

capacitor types can be used. (Since many aluminum

electrolytic capacitors freeze at approximately -30°C,

solid tantalums are recommended for applications

operating below -25°C.) When operating from sources

other than batteries, supply-noise rejection and

transient response can be improved by increasing the

value of the input and output capacitors and employing

passive filtering techniques.

The TC1264 is a precision, fixed output LDO. Unlike

bipolar regulators, the TC1264’s supply current does

not increase with load current. In addition, V_OUT

remains stable and within regulation over the entire

0mA to I_LOADMAXload current range (an important

consideration in RTC and CMOS RAM battery back-up

applications).

Figure 4-1 shows a typical application circuit.

FIGURE 4-1:

TYPICAL APPLICATION

CIRCUIT

V_OUT

V_IN

+

C₁

1 µF

TC1264

GND

SHDN

DS21375C-page 6

TC1264

TABLE 5-2:

THERMAL RESISTANCE

5.0

5.1

THERMAL CONSIDERATIONS

Thermal Shutdown

GUIDELINES FOR TC1264 IN

3-PIN DDPAK/TO-220

PACKAGE

Integrated thermal protection circuitry shuts the

regulator off when die temperature exceeds 160°C.

The regulator remains off until the die temperature

drops to approximately 150°C.

Copper

Area

(Topside)*

Copper

Area

(Backside)

Thermal

Resistance

Board

Area

(θ

)

JA

2500 sq mm 2500 sq mm 2500 sq mm

1000 sq mm 2500 sq mm 2500 sq mm

125 sq mm 2500 sq mm 2500 sq mm

* Tab of device attached to topside copper

25°C/W

27°C/W

35°C/W

5.2

Power Dissipation

The amount of power the regulator dissipates is

primarily a function of input and output voltage, and

output current. The following equation is used to

calculate worst-case actual power dissipation:

Equation 5-1 can be used in conjunction with

Equation 5-2 to ensure regulator thermal operation is

within limits. For example:

EQUATION 5-1:

P_D= (V_INMAX– V_OUTMIN)I_LOADMAX

Given:

Where:

V_INMAX= 3.3V ± 10%

V_OUTMIN= 2.7V ± 0.5%

I_LOADMAX= 275 mA

T_JMAX= 125°C

P_D= Worst-case actual power dissipation

V_INMAX

V_OUTMIN= Minimum regulator output voltage

_LOADMAX= Maximum output (load) current

= Maximum voltage on V_IN

I

T_AMAX= 95°C

θ_JA= 59°C/W (SOT-223)

The

maximum

allowable

power

dissipation

(Equation 5-2) is a function of the maximum ambient

temperature (T_AMAX), the maximum allowable die tem-

perature (T_JMAX) and the thermal resistance from junc-

tion-to-air (θ_JA).

Find:

1. Actual power dissipation.

2. Maximum allowable dissipation

Actual power dissipation:

EQUATION 5-2:

P_D≈ (V_INMAX– V_OUTMIN)I_LOADMAX

P_D= (3.3 × 1.1) – (2.7 × .995)275 × 10^–3

P_D= 260 mW

P_DMAX= (T_JMAX– T_AMAX

)

θ_JA

Where all terms are previously defined.

Maximum allowable power dissipation:

Table 5-1 and Table 5-2 show various values of θ_JAfor

the TC1264 packages.

T_JMAX– T_AMAX

P_DMAX= --------------------------------------

θ_JA

(125 – 95)

TABLE 5-1:

THERMAL RESISTANCE

GUIDELINES FOR TC1264 IN

SOT-223 PACKAGE

P_DMAX= -------------------------

59

P_DMAX= 508 mW

In this example, the TC1264 dissipates a maximum of

260 mW; below the allowable limit of 508 mW. In a

similar manner, Equation 5-1 and Equation 5-2 can be

used to calculate maximum current and/or input

voltage limits. For example, the maximum allowable

V_IN, is found by substituting the maximum allowable

power dissipation of 508mW into Equation 5-1, from

which V_INMAX= 4.6V.

Copper

Area

(Topside)*

Copper

Area

(Backside)

Thermal

Resistance

Board

Area

(θ

)

JA

2500 sq mm 2500 sq mm 2500 sq mm

1000 sq mm 2500 sq mm 2500 sq mm

225 sq mm 2500 sq mm 2500 sq mm

100 sq mm 2500 sq mm 2500 sq mm

1000 sq mm 1000 sq mm 1000 sq mm

45°C/W

53°C/W

59°C/W

52°C/W

55°C/W

1000 sq mm

0 sq mm

1000 sq mm

* Tab of device attached to topside copper

DS21375C-page 7

TC1264

6.0

6.1

PACKAGING INFORMATION

Package Marking Information

3-Lead DDPAK

Example

TC1264

1.8VEB^^

0643256

XXXXXXXXX

YYWWNNN

e

3

3-Lead SOT-223

Example

1264-25

VDB0643

256

XXXXXXX

XXXYYWW

NNN

3-Lead TO-220

Example

TC1264

3.0VAB^^

0643256

XXXXXXXXX

YYWWNNN

e3

Legend: XX...X Customer-specific information

Y

YY

WW

NNN

Year code (last digit of calendar year)

Year code (last 2 digits of calendar year)

Week code (week of January 1 is week ‘01’)

Alphanumeric traceability code

e

3

Pb-free JEDEC designator for Matte Tin (Sn)

*

This package is Pb-free. The Pb-free JEDEC designator (

can be found on the outer packaging for this package.

)

e3

Note: In the event the full Microchip part number cannot be marked on one line, it will

be carried over to the next line, thus limiting the number of available

characters for customer-specific information.

DS21375C-page 8

TC1264

3-Lead Plastic (EB) (DDPAK)

Note: For the most current package drawings, please see the Microchip Packaging Specification located at

http://www.microchip.com/packaging

E

L3

E1

D2

D

D1

1

b

e

BOTTOM VIEW

TOP VIEW

α

b1

(5X)

c2

A

φ

A1

c

L

Units

Dimension Limits

INCHES

*

MILLIMETERS

MIN

NOM

MAX

MIN

NOM

3

MAX

Number of Pins

Pitch

3

e

A

1.00 BSC

2.54 BSC

4.50

Overall Height

Standoff

.170

.000

.385

.177

.005

.398

.183

4.32

0.00

9.78

4.65

§

A1

E

.010

.410

0.13

0.25

Overall Width

10.11

6.50 REF

8.89

10.41

Exposed Pad Width

Molded Package Length

Overall Length

E1

.256 REF

D

D1

D2

c

.330

.549

.350

.577

.370

.605

8.38

9.40

13.94

14.66

7.70 REF

0.51

15.37

Exposed Pad Length

Lead Thickness

Pad Thickness

.303 REF

.014

.045

.026

.049

.068

.045

--

.020

--

.026

.055

.037

.051

.110

.067

0.36

1.14

0.66

1.24

1.73

1.14

--

0.66

1.40

0.94

1.30

2.79

1.70

c2

b

--

Lower Lead Width

Upper Lead Width

Foot Length

.032

.050

--

0.81

b1

L

1.27

--

Pad Length

L3

φ

--

Foot Angle

--

8°

7°

--

8°

7°

α

Mold Draft Angle

3°

--

3°

--

*

Controlling Parameter

§

Significant Characteristic

Notes:

Dimensions D and E do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010" (0.254mm) per side.

BSC: Basic Dimension. Theoretically, exact value shown without tolerances.

See ASME Y14.5M

REF: Reference Dimension, usually without tolerance, for information purposes only.

See ASME Y14.5M

Revised 07-19-05

JEDEC equivalent: TO-252

Drawing No. C04-011

DS21375C-page 9

TC1264

3-Lead Plastic Small Outline Transistor (DB) (SOT-223)

Note: For the most current package drawings, please see the Microchip Packaging Specification located at

http://www.microchip.com/packaging

D

b2

E1

E

1

e

e1

α

A2

A

c

φ

β

L

b

A1

Units

e

INCHES

NOM

MILLIMETERS

NOM

*

Dimension Limits

MIN

MAX

MIN

MAX

Pitch

.091 BSC

.181 BSC

2.30 BSC

4.60 BSC

Outside lead pitch (basic)

Overall Height

e1

A

–

.071

.004

.065

.287

.146

.264

.014

.033

.124

–

1.80

Standoff

A1

A2

E

.001

.061

.264

.130

.248

.009

.026

.114

.035

0°

0.02

0.10

1.65

7.30

3.70

6.70

0.35

0.85

3.15

–

Molded Package Height

Overall Width

.063

.276

.138

.256

.012

.030

.118

–

1.55

6.70

3.30

6.30

0.23

0.65

2.90

0.90

–

1.60

7.00

3.50

6.50

0.30

0.76

3.00

–

Molded Package Width

Overall Length

E1

D

c

Lead Thickness

Lead Width

b

Tab Lead Width

Foot Length

b2

L

φ

Lead Angle

–

10°

0.37

–

10°

α

β

Mold Draft Angle, Top

Mold Draft Angle, Bottom

10°

–

16°

10°

16°

10°

–

16°

10°

–

16°

*

Controlling Parameter

Notes:

Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .005" (0.127mm) per side.

BSC: Basic Dimension. Theoretically exact value shown without tolerances.

See ASME Y14.5M

JEDEC Equivalent TO-261 AA

Drawing No. C04-032

Revised 09-13-05

DS21375C-page 10

TC1264

3-Lead Plastic Transistor Outline (AB) (TO-220)

Note: For the most current package drawings, please see the Microchip Packaging Specification located at

http://www.microchip.com/packaging

A

E

φP

A1

E3

E/2

E1

Q

H1

D3

D4

D2

α

D

5X

D1

L1

BOTTOM: VARIANT A

BOTTOM: VARIANT B

L

b2

PIN 1

PIN n

b

c

e

A2

e1

Units

INCHES*

NOM

3

MILLIMETERS

NOM

Dimension Limits

MIN

MAX

MIN

MAX

n

e

Number of Pins

Pitch

3

.100 BSC

2.54 BSC

Overall Pin Pitch

Overall Height

Tab Thickness

Base to Lead

Overall Width

e1

A

A1

A2

E

.200 BSC

5.08 BSC

.140

-

.190

3.56

0.51

2.03

9.65

6.86

6.38

2.54

14.22

8.38

12.19

6.17

7.70

5.84

3.53

12.70

2.10

0

-

4.83

.020

.080

.380

.270

.251

.100

.560

.330

.480

.243

.303

.230

.139

.500

-

.055

.120

.420

.350

.261

.120

.650

.361

.507

.253

.313

.270

.156

.580

.250

8°

-

1.40

3.05

10.67

8.89

6.63

3.05

16.51

9.17

12.88

6.43

7.95

6.86

3.96

14.73

6.35

8°

-

Exposed Tab Width

E1

-

– (SEE BOTTOM VARIANT B)

Hole Center to Tab Edge

Overall Length

E3

.256

6.50

Q

-

D

-

Molded Package Length

Exposed Tab Length

– (SEE BOTTOM VARIANT B)

Tab Length

D1

D2

D3

D4

H1

-

.248

6.30

.308

7.82

-

Mounting Hole Diameter

Lead Length

φP

L

-

Lead Shoulder

L1

-

Foot Angle

α

0

c

Lead Thickness

.012

.015

.045

-

.024

.040

.070

0.30

0.38

1.14

-

0.61

1.02

1.78

Lead Width

b

.027

.057

0.69

1.45

Shoulder Width

b2

*Controlling Parameter

Notes:

Dimensions D1 and E do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010" (0.254mm) per side.

BSC: Basic Dimension. Theoretically exact value shown without tolerances.

See ASME Y14.5M

Drawing No. C04-158

DS21375C-page 11

TC1264

NOTES:

DS21375C-page 12

TC1264

APPENDIX A: REVISION HISTORY

Revision C (October 2006)

• Section 1.0 “Electrical Characteristics”:

Changed dropout voltage voltage typical value for

I_L= 500 mA from 700 to 1000 and maximum

value from 1000 to 1200 for. Changed typical

value for I_L= 800 mA from 890 to 1200

• Section 6.0 “PackAging Information”: Added

package marking information and package outline

drawings

• Added disclaimer to package outline drawings.

Revision B (May 2002)

• Not Documented

Revision A (March 2002)

• Original Release of this Document.

DS21375C-page 13

TC1264

NOTES:

DS21375C-page 14

TC1264

PRODUCT IDENTIFICATION SYSTEM

To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office.

Examples:

PART NO.

Device

X.XX

XX

a)

b)

c)

d)

TC1264-1.8VAB

1.8V LDO, TO-220-3 pkg.

2.5V LDO, TO-220-3 pkg.

3.0V LDO, TO-220-3 pkg.

3.3V LDO, TO-220-3 pkg.

Voltage

Option

Package

Tape and

Reel

TC1264-2.5VAB

TC1264-3.0VAB

TC1264-3.3VAB

a)

b)

TC1264-1.8VEBTR 1.8V LDO, DDPAK-3 pkg.,

Tape and Reel

TC1264-2.5VEBTR 2.5V LDO, DDPAK-3 pkg.,

Tape and Reel

TC1264-3.0VEBTR 3.0V LDO, DDPAK-3 pkg.,

Tape and Reel

TC1264-3.3VEBTR 3.3V LDO, DDPAK-3 pkg.,

Tape and Reel

Device

TC1264 Fixed Output CMOS LDO

Voltage Option:*

1.8V

2.5V

3.0V

3.3V

=

1.8V

2.5V

3.0V

3.3V

c)

d)

* Other output voltages are available. Please contact your local

Microchip sales office for details.

a)

b)

TC1264-1.8VDB

1.8V LDO, SOT-223 pkg.

TC1264-1.8VDBTR 1.8V LDO, SOT-223 pkg.,

Tape and Reel

Package

AB

=

Plastic (TO-220), 3-Lead

c)

d)

TC1264-2.5VDB

2.5V LDO, SOT-223 pkg.

DB

Plastic (SOT-223), 3-lead

Plastic (SOT-223), 3-lead,

Tape and Reel

TC1264-2.5VDBTR 2.5V LDO, SOT-223 pkg.,

Tape and Reel

DBTR

EB

EBTR

=

Plastic Transistor Outline (DDPAK), 3-Lead

Plastic Transistor Outline (DDPAK), 3-Lead,

Tape and Reel

e)

f)

TC1264-3.0VDB

3.0V LDO, SOT-223 pkg.

TC1264-3.0VDBTR 3.0V LDO, SOT-223 pkg.,

Tape and Reel

g)

h)

TC1264-3.3VDB

TC1264-3.3VDBTR 3.3V LDO, SOT-223 pkg.,

Tape and Reel

3.3V LDO, SOT-223 pkg.

DS21375C-page 15

TC1264

NOTES:

DS21375C-page 16

Note the following details of the code protection feature on Microchip devices:

•

Microchip products meet the specification contained in their particular Microchip Data Sheet.

•

Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the

intended manner and under normal conditions.

•

There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our

knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data

Sheets. Most likely, the person doing so is engaged in theft of intellectual property.

•

Microchip is willing to work with the customer who is concerned about the integrity of their code.

Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not

mean that we are guaranteeing the product as “unbreakable.”

Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our

products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts

allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act.

Information contained in this publication regarding device

applications and the like is provided only for your convenience

and may be superseded by updates. It is your responsibility to

ensure that your application meets with your specifications.

MICROCHIP MAKES NO REPRESENTATIONS OR

WARRANTIES OF ANY KIND WHETHER EXPRESS OR

IMPLIED, WRITTEN OR ORAL, STATUTORY OR

OTHERWISE, RELATED TO THE INFORMATION,

INCLUDING BUT NOT LIMITED TO ITS CONDITION,

QUALITY, PERFORMANCE, MERCHANTABILITY OR

FITNESS FOR PURPOSE. Microchip disclaims all liability

arising from this information and its use. Use of Microchip

devices in life support and/or safety applications is entirely at

the buyer’s risk, and the buyer agrees to defend, indemnify and

hold harmless Microchip from any and all damages, claims,

suits, or expenses resulting from such use. No licenses are

conveyed, implicitly or otherwise, under any Microchip

intellectual property rights.

Trademarks

The Microchip name and logo, the Microchip logo, Accuron,

dsPIC, KEELOQ, microID, MPLAB, PIC, PICmicro, PICSTART,

PRO MATE, PowerSmart, rfPIC, and SmartShunt are

registered trademarks of Microchip Technology Incorporated

in the U.S.A. and other countries.

AmpLab, FilterLab, Migratable Memory, MXDEV, MXLAB,

SEEVAL, SmartSensor and The Embedded Control Solutions

Company are registered trademarks of Microchip Technology

Incorporated in the U.S.A.

Analog-for-the-Digital Age, Application Maestro, CodeGuard,

dsPICDEM, dsPICDEM.net, dsPICworks, ECAN,

ECONOMONITOR, FanSense, FlexROM, fuzzyLAB,

In-Circuit Serial Programming, ICSP, ICEPIC, Linear Active

Thermistor, Mindi, MiWi, MPASM, MPLIB, MPLINK, PICkit,

PICDEM, PICDEM.net, PICLAB, PICtail, PowerCal,

PowerInfo, PowerMate, PowerTool, REAL ICE, rfLAB,

rfPICDEM, Select Mode, Smart Serial, SmartTel, Total

Endurance, UNI/O, WiperLock and ZENA are trademarks of

Microchip Technology Incorporated in the U.S.A. and other

countries.

SQTP is a service mark of Microchip Technology Incorporated

in the U.S.A.

All other trademarks mentioned herein are property of their

respective companies.

Printed on recycled paper.

Microchip received ISO/TS-16949:2002 certification for its worldwide

headquarters, design and wafer fabrication facilities in Chandler and

Tempe, Arizona, Gresham, Oregon and Mountain View, California. The

Company’s quality system processes and procedures are for its PIC^®

8-bit MCUs, KEELOQ^®code hopping devices, Serial EEPROMs,

microperipherals, nonvolatile memory and analog products. In addition,

Microchip’s quality system for the design and manufacture of

development systems is ISO 9001:2000 certified.

DS21375C-page 17

WORLDWIDE SALES AND SERVICE

AMERICAS

ASIA/PACIFIC

EUROPE

Corporate Office

Asia Pacific Office

Suites 3707-14, 37th Floor

Tower 6, The Gateway

Habour City, Kowloon

Hong Kong

Tel: 852-2401-1200

Fax: 852-2401-3431

India - Bangalore

Tel: 91-80-4182-8400

Fax: 91-80-4182-8422

Austria - Wels

Tel: 43-7242-2244-39

Fax: 43-7242-2244-393

2355 West Chandler Blvd.

Chandler, AZ 85224-6199

Tel: 480-792-7200

Fax: 480-792-7277

Technical Support:

http://support.microchip.com

Web Address:

www.microchip.com

Denmark - Copenhagen

Tel: 45-4450-2828

Fax: 45-4485-2829

India - New Delhi

Tel: 91-11-4160-8631

Fax: 91-11-4160-8632

France - Paris

Tel: 33-1-69-53-63-20

Fax: 33-1-69-30-90-79

India - Pune

Tel: 91-20-2566-1512

Fax: 91-20-2566-1513

Australia - Sydney

Tel: 61-2-9868-6733

Fax: 61-2-9868-6755

Atlanta

Germany - Munich

Tel: 49-89-627-144-0

Fax: 49-89-627-144-44

Japan - Yokohama

Tel: 81-45-471- 6166

Fax: 81-45-471-6122

Alpharetta, GA

Tel: 770-640-0034

Fax: 770-640-0307

China - Beijing

Tel: 86-10-8528-2100

Fax: 86-10-8528-2104

Italy - Milan

Tel: 39-0331-742611

Fax: 39-0331-466781

Korea - Gumi

Tel: 82-54-473-4301

Fax: 82-54-473-4302

Boston

China - Chengdu

Tel: 86-28-8665-5511

Fax: 86-28-8665-7889

Westborough, MA

Tel: 774-760-0087

Fax: 774-760-0088

Netherlands - Drunen

Tel: 31-416-690399

Fax: 31-416-690340

Korea - Seoul

China - Fuzhou

Tel: 86-591-8750-3506

Fax: 86-591-8750-3521

Tel: 82-2-554-7200

Fax: 82-2-558-5932 or

82-2-558-5934

Chicago

Itasca, IL

Tel: 630-285-0071

Fax: 630-285-0075

Spain - Madrid

Tel: 34-91-708-08-90

Fax: 34-91-708-08-91

China - Hong Kong SAR

Tel: 852-2401-1200

Fax: 852-2401-3431

Malaysia - Penang

Tel: 60-4-646-8870

Fax: 60-4-646-5086

Dallas

Addison, TX

Tel: 972-818-7423

Fax: 972-818-2924

UK - Wokingham

Tel: 44-118-921-5869

Fax: 44-118-921-5820

China - Qingdao

Tel: 86-532-8502-7355

Fax: 86-532-8502-7205

Philippines - Manila

Tel: 63-2-634-9065

Fax: 63-2-634-9069

Detroit

Farmington Hills, MI

Tel: 248-538-2250

Fax: 248-538-2260

China - Shanghai

Tel: 86-21-5407-5533

Fax: 86-21-5407-5066

Singapore

Tel: 65-6334-8870

Fax: 65-6334-8850

Kokomo

Kokomo, IN

Tel: 765-864-8360

Fax: 765-864-8387

China - Shenyang

Tel: 86-24-2334-2829

Fax: 86-24-2334-2393

Taiwan - Hsin Chu

Tel: 886-3-572-9526

Fax: 886-3-572-6459

China - Shenzhen

Tel: 86-755-8203-2660

Fax: 86-755-8203-1760

Taiwan - Kaohsiung

Tel: 886-7-536-4818

Fax: 886-7-536-4803

Los Angeles

Mission Viejo, CA

Tel: 949-462-9523

Fax: 949-462-9608

China - Shunde

Tel: 86-757-2839-5507

Fax: 86-757-2839-5571

Taiwan - Taipei

Tel: 886-2-2500-6610

Fax: 886-2-2508-0102

Santa Clara

Santa Clara, CA

Tel: 408-961-6444

Fax: 408-961-6445

China - Wuhan

Tel: 86-27-5980-5300

Fax: 86-27-5980-5118

Thailand - Bangkok

Tel: 66-2-694-1351

Fax: 66-2-694-1350

Toronto

Mississauga, Ontario,

Canada

Tel: 905-673-0699

Fax: 905-673-6509

China - Xian

Tel: 86-29-8833-7250

Fax: 86-29-8833-7256

10/19/06

DS21375C-page 18


型号：	TC1264-1.8VEB
厂家：	MICROCHIP
描述：	800 mA Fixed-Output CMOS LDO with Shutdown 800毫安固定输出CMOS LDO ，带有关断
文件：	总18页 (文件大小：825K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

TC1264-1.8VEB [MICROCHIP]

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TC1264-2.5VEBRT

TC1264-2.5VEBTR

TC1264-3.0VAB

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