TC1265-2.5VOART [MICROCHIP]
Fixed Positive LDO Regulator, 2.5V, 0.8V Dropout, CMOS, PDSO8, SOIC-8;
| 型号： | TC1265-2.5VOART |
| 厂家： | 
MICROCHIP |
| 描述： | Fixed Positive LDO Regulator, 2.5V, 0.8V Dropout, CMOS, PDSO8, SOIC-8 光电二极管 |
| 文件： | 总8页 (文件大小：60K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
TC1265
800mA Fixed Output CMOS LDO with Shutdown
FEATURES
GENERAL DESCRIPTION
■ Very Low Dropout Voltage
■ Guaranteed 800mA Output
■ High Output Voltage Accuracy
■ Standard or Custom Output Voltages
■ Over-Current and Over-Temperature Protection
■ SHDN Input for Active Power Management
■ ERROR Output to Detect Low Battery (SOIC Only)
The TC1265 is a fixed output, high accuracy (typically
±0.5%) CMOS low dropout regulator. Designed specifically
for battery-operated systems, the TC1265’s CMOS con-
struction eliminates wasted ground current, significantly
extending battery life. Total supply current is typically 80µA
at full load (20 to 60 times lower than in bipolar regulators!).
TC1265 key features include ultra low noise, very low
dropout voltage (typically 450mV at full load), and fast
responsetostepchangesinload. TheTC1265incorporates
both over-temperature and over-current protection. The
TC1265 is stable with an output capacitor of only 1µF and
has a maximum output current of 800mA. It is available in 8-
Pin SOIC, 5-Pin TO-220, and 5-Pin DDPAK packages.
APPLICATIONS
■ Battery-Operated Systems
■ Portable Computers
■ Medical Instruments
■ Instrumentation
■ Cellular / GSM / PHS Phones
■ Linear Post-Regulator for SMPS
■ Pagers
ORDERING INFORMATION
Junction
Temperature
Range
Part
Number
Package
TYPICAL APPLICATION
TC1265-xxVOA
TC1265-xxVAT
TC1265-xxVET
8-Pin SOIC(Narrow) – 40°C to +125°C
5-Pin TO-220
5-Pin DDPAK
– 40°C to +125°C
– 40°C to +125°C
VIN
VIN
VOUT
VOUT
C1
1µF
TC1265
GND
SHDN
SHDN
Available Output Voltages:
1.8, 2.5, 3.0, 3.3
xx indicates ouput voltages
Other output voltages are available. Please contact TelCom
Semiconductor for details.
PIN CONFIGURATION
5-Pin DDPAK
FRONT VIEW
TAB IS GND
TC1265
3
5
4
1
2
5-Pin TO-220
TAB IS GND
8-Pin SOIC
TC1265
3
1
2
3
4
8
VOUT
GND
VIN
5
1
2
4
NC
7
6
5
TC1265
NC
SHDN
BYPASS
ERROR
TC1265-4 3/28/00 TelCom Semiconductor reserves the right to make changes in the circuitry and specifications of its devices.
800mA Fixed Output
CMOS LDO with Shutdown
TC1265
Storage Temperature ............................ – 65°C to +150°C
Maximum Voltage on Any Pin ........... VIN + 0.3V to – 0.3V
Lead Temperature (Soldering, 10 Sec.)................ +260°C
ABSOLUTE MAXIMUM RATINGS*
Input Voltage ..............................................................6.5V
Output Voltage ........................... (VSS – 0.3) to (VIN + 0.3)
Power Dissipation ....................Internally Limited (Note 7)
Operating Temperature.................... – 40°C < TJ < 125°C
*Absolute Maximum Ratings indicate device operation limits beyond dam-
age may occur. Device operation beyond the limits listed in Electrical
Characteristics is not recommended.
ELECTRICAL CHARACTERISTICS: VIN = VR + 1.5V (Note 1), IL = 100µA, CL = 3.3µF, SHDN > VIH, TA = 25°C, unless
otherwise specified. BOLDFACE type specifications apply for junction temperatures of – 40°C to +125°C.
Symbol
Parameter
Test Conditions
Min
Typ
Max
Units
VIN
Input Operating Voltage
Maximum Output Current
Output Voltage
2.7
—
—
6.0
V
mA
V
(Note 2)
IOUT
(SOIC-8 TBD)
800
—
MAX
VOUT
VR > 2.5V
VR = 1.8V
VR – 2.5% VR ± 0.5% VR + 2.5%
VR – 2% VR ± 0.5% VR + 3%
∆VOUT/∆T
VOUT Temperature Coefficient
Line Regulation
(Note 3)
—
—
40
—
0.35
0
ppm/°C
%
∆VOUT/∆VIN
∆VOUT/VOUT
(VR + 1V) < VIN < 6V
0.007
0.002
Load Regulation
IL = 0.1mA to IOUT
MAX (Note 4)
-0.01
%/mA
mV
VIN – VOUT
Dropout Voltage (Note 5)
VR > 2.5V, IL= 100µA
IL= 100mA
—
—
—
—
—
—
—
20
50
30
160
480
800
1300
1000
1400
IL= 300mA
IL= 500mA
150
260
450
700
890
IL= 800mA (SOIC TBD)
VR = 1.8V, IL = 500mA
IL = 800mA (SOIC TBD)
IDD
Supply Current
SHDN = VIH, IL = 0
SHDN = 0V
F ≤ 1KHz
—
—
—
—
—
—
80
0.05
64
130
1
µA
µA
ISHDN
PSRR
Shutdown Supply Current
Power Supply Rejection Ratio
Output Short Circuit Current
Thermal Regulation
—
dB
IOUT
VOUT = 0V
1200
0.04
260
1400
—
mA
SC
∆VOUT/∆PD
(Note 6)
V/W
nV/√Hz
eN
Output Noise
IL = IOUT
—
MAX, F = 10kHz
SHDN Input
VIH
VIL
SHDN Input High Threshold
SHDN Input Low Threshold
45
—
—
—
%VIN
%VIN
—
15
ERROR Output (SOIC Only)
VMIN
VOL
Minimum Operating Voltage
1.0
—
—
—
—
—
—
400
—
V
mV
V
Output Logic Low Voltage
ERROR Threshold Voltage
ERROR Positive Hysteresis
1mA Flows to ERROR
(Note 8)
VTH
0.95 x VR
50
VHYS
—
mV
NOTES: 1. VR is the regulator output voltage setting.
2. The minimum VIN has to justify the conditions: VIN> VR + VDROPOUT and VIN > 2.7V for IL = 0.1mA to IOUTMAX
3. TC VOUT = (VOUT
.
MIN) x 10 6
V
OUT
–
MAX
∆T
VOUT
x
4. Regulation is measured at a constant junction temperature using low duty cycle pulse testing. Load regulation is tested over a load
range from 0.1mA to the maximum specified output current. Changes in output voltage due to heating effects are covered by the
thermal regulation specification.
5. Dropout voltage is defined as the input to output differential at which the output voltage drops 2% below its nominal value measured at a 1.5V differential.
6. Thermal Regulation is defined as the change in output voltage at a time T after a change in power dissipation is applied, excluding load
or line regulation effects. Specifications are for a current pulse equal to ILMAX at VIN = 6V for T = 10msec.
7. The maximum allowable power dissipation is a function of ambient temperature, the maximum allowable junction temperature, and the
thermal resistance from junction-to-air (i.e. TA, TJ, θJA). Exceeding the maximum allowable power dissipation causes the device to
initiate thermal shutdown. Please see Thermal Considerations section of this data sheet for more details.
8. Hysteresis voltage is referenced to VR.
2
TC1265-4 3/28/00
800mA Fixed Output
CMOS LDO with Shutdown
TC1265
DETAILED DESCRIPTION
of timing capacitor C3). R1 x C3 should be chosen to
maintain ERROR below VIH of the processor RESET input
for at least 200 msec to allow time for the system to stabilize.
Pull-up resistor R1 can be tied to VOUT, VIN or any other
voltage less than (VIN + 0.3V.)
The TC1265 is a precision, fixed output LDO. Unlike
bipolar regulators, the TC1265 supply current does not
increase with load current. In addition, VOUT remains stable
and within regulation at very low load currents (an important
consideration in RTC and CMOS RAM battery backup
applications). Figure 1 shows a typical application circuit.
VOUT
V
V
V
Hysteresis (VH)
OUT
IN
OUT
VTH
1µF
C1
1µF
C2
TC1265
ERROR
VIH
BATTERY
GND
VOL
+
V
SHDN
ERROR
R1
1M
Shutdown Control
(to CMOS Logic or Tie
Figure 2: ERROR Output Operation
C3 Required Only
if ERROR is used as a
Processor RESET Signal
(See Text)
BATTLOW
or RESET
to V if unused)
IN
0.2µF
C3
Thermal Considerations
Thermal Shutdown
Integrated thermal protection circuitry shuts the regula-
tor off when die temperature exceeds 160°C. The regulator
remains off until the die temperature drops to approximately
150°C.
Figure 1: Typical Application Circuit
Output Capacitor
A 1µF (min) capacitor from VOUT to ground is required.
The output capacitor should have an effective series resis-
tance of 5Ω or less. A 1µF capacitor should be connected
from VIN to GND if there is more than 10 inches of wire
between the regulator and the AC filter capacitor, or if a
battery is used as the power source. Aluminum electrolytic
or tantalum capacitor types can be used. (Since many
aluminum electrolytic capacitors freeze at approximately –
30°C, solid tantalums are recommended for applications
operating below –25°C.) When operating from sources
other than batteries, supply-noise rejection and transient
response can be improved by increasing the value of the
input and output capacitors and employing passive filtering
techniques.
Power Dissipation
The amount of power the regulator dissipates is prima-
rilyafunctionofinputandoutputvoltage,andoutputcurrent.
Thefollowingequationisusedtocalculateworstcaseactual
power dissipation:
PD ≈ (VINMAX – VOUT )ILOAD
MIN
MAX
Where:
PD = worst case actual power dissipation
VIN
= maximum voltage on VIN
MAX
VOUT
= minimum regulator output voltage
= maximum output (load) current
MIN
ILOAD
MAX
ERROR Output
Equation 1.
ERROR is driven low whenever VOUT falls out of regu-
lation by more than – 5% (typical). This condition may be
caused by low input voltage, output current limiting, or
thermal limiting.
The ERROR threshold is 5% below rated VOUT regard-
less of the programmed output voltage value (e.g., ERROR
= VOL at 4.75V (typ) for a 5.0V regulator and 2.85V (typ) for
a 3.0V regulator). ERROR output operation is shown in
Figure 2. Note that ERROR is active when VOUT is at or
below VTH, and inactive when VOUT is above VTH + VH.
As shown in Figure 1, ERROR can be used as a battery
low flag, or as a processor RESET signal (with the addition
The maximum allowablepower dissipation (Equation 2)
is a function of the maximum ambient temperature (TAMAX),
the maximum allowable die temperature (125°C) and the
thermal resistance from junction-to-air (JA).
(TJMAX – TA
)
MAX
PD
=
MAX
JA
Where all terms are previously defined.
Equation 2.
3
TC1265-4 3/28/00
800mA Fixed Output
CMOS LDO with Shutdown
TC1265
Table 1 shows various values of for the TC1265
JA
mounted on a 1/16 inch, 2-layer PCB with 1 oz. copper foil.
Equation 1 can be used in conjunction with Equation 2
to ensure regulator thermal operation is within limits. For
example:
Table 1. Thermal Resistance Guidelines for TC1265 in
8-Pin SOIC Package
GIVEN: VIN
= 3.3V ± 10%
= 2.7V ± 0.5%
MAX
Copper
Area
(Topside)*
Copper
Area
(Backside)
Thermal
Resistance
VOUT
MIN
Board
Area
ILOADMAX = 275mA
(
)
TJ
TA
= 125°C
= 95°C
JA
MAX
MAX
2500 sq mm 2500 sq mm 2500 sq mm
1000 sq mm 2500 sq mm 2500 sq mm
60°C/W
60°C/W
68°C/W
74°C/W
JA
= 60°C/W(SOIC)
FIND: 1. Actual power dissipation
2. Maximum allowable dissipation
225 sq mm
100 sq mm
2500 sq mm 2500 sq mm
2500 sq mm 2500 sq mm
NOTES: *Pin 2 is ground. Device is mounted on topside.
Actual power dissipation:
PD ≈ (VINMAX – VOUT )ILOAD
MIN
MAX
= [(3.3 x 1.1) – (2.7 x .995)]275 x 10-3
Table 2. Thermal Resistance Guidelines for TC1265 in
5-Pin DDPAK/TO-220 Package
= 260mW
Maximum allowable power dissipation:
Copper
Area
(Topside)*
Copper
Area
(Backside)
Thermal
Resistance
(TJMAX – TA
)
Board
Area
MAX
PD
=
=
=
MAX
JA
(
)
JA
2500 sq mm 2500 sq mm 2500 sq mm
1000 sq mm 2500 sq mm 2500 sq mm
125 sq mm
25°C/W
27°C/W
35°C/W
(125 – 95)
60
2500 sq mm 2500 sq mm
500mW
NOTES: *Tab of device attached to topside copper
In this example, the TC1265 dissipates a maximum of
only 260mW; far below the allowable limit of 500 mW. In a
similar manner, Equation 1 and Equation 2 can be used to
calculate maximum current and/or input voltage limits. For
example, the maximum allowable VIN is found by substitut-
ing the maximum allowable power dissipation of 500 mW
into Equation 1, from which VINMAX = 4.6V.
4
TC1265-4 3/28/00
800mA Fixed Output
CMOS LDO with Shutdown
TC1265
TYPICAL CHARACTERISTICS
Line Regulation vs. Temperature
0.020
Load Regulation vs. Temperature
Output Noise vs. Frequency
0.0100
0.0090
0.0080
0.0070
0.0060
0.0050
0.0040
0.0030
10.0
1.0
R
C
= 50µΩ
= 1µF
LOAD
OUT
0.018
0.016
0.014
0.012
0.010
0.008
0.006
0.004
1mA to 800mA
V
= 3V
OUT
0.1
0.0
0.0020
0.0010
0.0100
0.002
0.000
0.01
10
0.01
1
100
1000
–40°C 0°C
25°C 70°C 85°C 125°C
TEMPERATURE (°C)
–40°C
0°C
25°C 70°C
85°C 125°C
TEMPERATURE (°C)
FREQUENCY (KHz)
I
vs. Temperature
3.0V V
Temperature
= 0.1mA
3.0V Dropout Voltage vs. I
DD
OUT VS.
LOAD
3.030
3.020
3.010
3.000
2.990
2.980
150
0.600
0.550
0.500
0.450
0.400
125°C
85°C
70°C
I
LOAD
135
120
105
90
25°C
I
= 300mA
= 500mA
LOAD
0.350
0.300
0.250
0.200
0.150
0.100
0.050
0.000
V
= 3V
OUT
I
LOAD
75
2.970
2.960
2.950
2.940
2.930
2.920
0°C
60
–40°C
45
I
= 800mA
LOAD
30
15
0
400 500 600 700 800
(mA)
0
100
–40°C 0°C
25°C 70°C 85°C 125°C
TEMPERATURE (°C)
200 300
I
–40°C 0°C
25°C 70°C 85°C 125°C
TEMPERATURE (°C)
LOAD
I
vs. Temperature
Power Supply Rejection Ratio
= 3V
SHDN
–30dB
–35dB
0.090
0.080
V
R
V
OUT
= 50Ω
LOAD
= 50mV
IN
AC
p-p
–40dB
–45dB
0.070
0.060
0.050
0.040
0.030
0.020
0.010
0.000
–50dB
–55dB
C
= 1µF
OUT
–60dB
–65dB
–70dB
–75dB
–80dB
1K
FREQUENCY (Hz)
100K
–40°C 0°C
25°C 70°C
85°C 125°C
10
1M
100
10K
TEMPERATURE (°C)
5
TC1265-4 3/28/00
800mA Fixed Output
CMOS LDO with Shutdown
TC1265
TAPING FORM
Component Taping Orientation for 8-Pin SOIC (Narrow) Devices
User Direction of Feed
User Direction of Feed
PIN 1
W
PIN 1
P
Standard Reel Component Orientation
for TR Suffix Device
Standard Reel Component Orientation
for RT Suffix Device
Carrier Tape, Number of Components Per Reel and Reel Size
Package
Carrier Width (W)
Pitch (P)
Part Per Full Reel
Reel Size
8-Pin SOIC (N)
12 mm
8 mm
2500
13 in
Component Taping Orientation for 5-Pin DDPAK Devices
PIN 1
User Direction of Feed
User Direction of Feed
M a r k i n g
D e v i c e
Device
Marking
W
PIN 1
P
Reverse Reel Component Orientation
for RT Suffix Device
(Mark Upside Down)
Standard Reel Component Orientation
for TR Suffix Device
(Mark Right Side Up)
Carrier Tape, Number of Components Per Reel and Reel Size
Package
Carrier Width (W)
Pitch (P)
Part Per Full Reel
750
Reel Size
5-Pin DDPAK
24 mm
16 mm
13 in
6
TC1265-4 3/28/00
800mA Fixed Output
CMOS LDO with Shutdown
TC1265
PACKAGE DIMENSIONS
8-Pin SOIC
PIN 1 indicated by dot and / or beveled edge
.157 (3.99)
.150 (3.81)
.244 (6.20)
.228 (5.79)
.050 (1.27) TYP.
.197 (5.00)
.189 (4.80)
.069 (1.75)
.053 (1.35)
.010 (0.25)
.007 (0.18)
8°MAX.
.020 (0.51)
.013 (0.33)
.010 (0.25)
.004 (0.10)
.050 (1.27)
.016 (0.40)
5-Pin DDPAK
.410 (10.41)
.385 (9.78)
.183 (4.65)
.170 (4.32)
.067 (1.70)
.045 (1.14)
.055 (1.40)
.045 (1.14)
3° - 7°
(5x)
.370 (9.40)
.330 (8.38)
.010 (0.25)
.000 (0.00)
.605 (15.37)
.549 (13.95)
.026 (0.66)
.014 (0.36)
.110 (2.79)
.068 (1.72)
.037 (0.94)
.026 (0.66)
PIN 1
.067 (1.70) TYP.
8° MAX.
Dimensions: inches (mm)
7
TC1265-4 3/28/00
800mA Fixed Output
CMOS LDO with Shutdown
TC1265
PACKAGE DIMENSIONS (CONT.)
5-Pin TO-220
.185 (4.70)
.165 (4.19)
.415 (10.54)
.390 (9.91)
.117 (2.97)
.103 (2.62)
.055 (1.40)
.045 (1.14)
.156 (3.96)
.140 (3.56)
DIA.
.293 (7.44)
.204 (5.18)
3° - 7.5°
5 PLCS.
.613 (15.57)
.569 (14.45)
.037 (0.95)
.025 (0.64)
.590 (14.99)
.482 (12.24)
.025 (0.64)
.012 (0.30)
.072 (1.83)
.062 (1.57)
PIN 1
.115 (2.92)
.087 (2.21)
.273 (6.93)
.263 (6.68)
Dimensions: inches (mm)
Sales Offices
TelCom Semiconductor, Inc.
1300 Terra Bella Avenue
P.O. Box 7267
Mountain View, CA 94039-7267
TEL: 650-968-9241
TelCom Semiconductor, GmbH
TelCom Semiconductor H.K. Ltd.
10 Sam Chuk Street, Ground Floor
San Po Kong, Kowloon
Hong Kong
TEL: (011) 852-2350-7380
FAX: (011) 852-2354-9957
Lochhamer Strasse 13
D-82152 Martinsried
Germany
TEL: (011) 49 89 895 6500
FAX: (011) 49 89 895 6502 2
FAX: 650-967-1590
E-Mail: liter@telcom-semi.com
8
TC1265-4 3/28/00
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