TC1300R-2.5VUATR [MICROCHIP]
2.5 V FIXED POSITIVE LDO REGULATOR, 0.39 V DROPOUT, PDSO8, PLASTIC, MSOP-8;
| 型号： | TC1300R-2.5VUATR |
| 厂家： | 
MICROCHIP |
| 描述： | 2.5 V FIXED POSITIVE LDO REGULATOR, 0.39 V DROPOUT, PDSO8, PLASTIC, MSOP-8 光电二极管 |
| 文件： | 总18页 (文件大小：288K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
TC1300
300 mA CMOS LDO with Shutdown, Bypass and
Independent Delayed Reset Function
Features
General Description
• LDO with Integrated Microcontroller Reset
Monitor Functionality
The TC1300 combines a low dropout regulator and a
microcontroller reset monitor in an 8-Pin MSOP pack-
age. Total supply current is 80 µA (typical), 20 to 60
times lower than bipolar regulators.
• Low Input Supply Current (80 µA, typical)
• Very Low Dropout Voltage
The TC1300 has a precise output with a typical accu-
racy of ±0.5%. Other key features include low noise
operation, low dropout voltage and internal feed-
forward compensation for fast response to step
changes in load. The TC1300 has both over-tempera-
ture and over-current protection. When the shutdown
control (SHDN) is low, the regulator output voltage falls
to zero, RESET output remains valid and supply cur-
rent is reduced to 30 µA (typical). The TC1300 is rated
for 300 mA of output current and stable with a 1 µF out-
put capacitor.
• 10 µsec (typ.) Wake-Up Time from SHDN
• 300 mA Output Current
• Standard or Custom Output and Detected
Voltages
• Power-Saving Shutdown Mode
• Bypass Input for Quiet Operation
• Separate Input for Detected Voltage
• 140 msec Minimum RESET Output Duration
• Space-Saving MSOP Package
• Specified Junction Temperature Range:
-40°C to +125°C
An active-low RESET is asserted when the detected
voltage (VDET) falls below the reset voltage threshold.
The RESET output remains low for 300 msec (typical)
after VDET rises above reset threshold. The TC1300
also has a fast wake-up response time (10 µsec.,
typical) when released from shutdown.
Applications
• Battery-Operated Systems
• Portable Computers
• Medical Instruments
• Pagers
• Cellular / GSM / PHS Phones
Typical Application Circuit
Related Literature
8
7
1
VDET
VDET
RESET
RESET
• AN765, “Using Microchip’s Micropower LDOs”,
DS00765.
2
VIN
VOUT
VOUT
C2
1 µF
C1
1 µF
• AN766, “Pin-Compatible CMOS Upgrades to
Bipolar LDOs”, DS00766.
TC1300
6
5
3
4
NC
GND
• AN792, “A Method to Determine How Much
Power a SOT23 Can Dissipate in an Application”,
DS00792.
Battery
SHDN
Bypass
CBYPASS
470 pF
(Optional)
Package Type
Shutdown Control
(from Power
Control Logic)
MSOP
1
2
3
4
8
7
VDET
VIN
RESET
VOUT
TC1300VUA
6 NC
SHDN
GND
Bypass
5
2001-2012 Microchip Technology Inc.
DS21385D-page 1
TC1300
1.0
ELECTRICAL
CHARACTERISTICS
PIN DESCRIPTIONS
Pin
Description
Absolute Maximum Ratings*
RESET RESET output remains low while V
is
DET
below the reset voltage threshold and for
Input Voltage ....................................................................6.5V
300 msec after V
old.
rises above reset thesh-
DET
Output Voltage ................................. (V - 0.3) to (V + 0.3)
SS
IN
Power Dissipation ......................... Internally Limited (Note 6)
V
Regulated Voltage Output
Ground Terminal
OUT
Operating Junction Temperature, TJ ....... – 40°C < T < 150°C
Maximum Junction Temperature, Tj..............................150°C
Storage Temperature...................................– 65°C to +150°C
J
GND
Bypass
Reference Bypass Input. Connecting an
optional 470 pF to this input further reduces
output noise.
Maximum Voltage on Any Pin ............. (V -0.3) to (V +0.3)
SS
IN
*Notice: Stresses above those listed under “maximum rat-
ings” may cause permanent damage to the device. This is a
stress rating only and functional operation of the device at
those or any other conditions above those indicated in the
operational listings of this specification is not implied. Expo-
sure to maximum rating conditions for extended periods may
affect device reliability.
SHDN
Shutdown Control Input. The regulator is fully
enabled when a logic high is applied to this
input. The regulator enters shutdown when a
logic low is applied to this input. During shut-
down, regulator output voltage falls to zero,
RESET output remains valid and supply cur-
rent is reduced to 30 µA (typ.).
NC
No connect
V
Power Supply Input
IN
V
Detected Input Voltage. V
connected together.
and V can be
DET IN
DET
ELECTRICAL CHARACTERISTICS
V
= V
+ 1V, I = 0.1 mA, C = 3.3 µF, SHDN > V , T = 25°C, unless otherwise noted. BOLDFACE type specifications apply
IN
OUT L L IH A
for junction temperature (Note 8) of -40°C to +125°C.
Parameters
Sym
Min
Typ
Max
Units
Conditions
Input Operating Voltage
Maximum Output Current
Output Voltage
V
2.7
—
—
6.0
V
mA
V
Note 7
Note 1
IN
IOUT
MAX
300
—
V
—
- 2.5%
V
± 0.5%
—
—
+ 2.5%
OUT
R
V
V
R
R
V
Temperature Coefficient
V
/T
OUT
—
—
—
25
0.02
0.5
—
0.35
2.0
ppm/°C Note 2
OUT
Line Regulation
Load Regulation
V
V
/V
%
%
(V + 1V) < V < 6V
R IN
OUT
IN
/V
I = 0.1 mA to IOUTMAX, Note 3
L
OUT OUT
Note 1:
2:
V
is the regulator output voltage setting.
R
6
V
– V
10
OUTMAX
-------------------------------------------------------------------------------------
T
OUTMIN
TCV
=
OUT
V
OUT
3: Regulation is measured at a constant junction temperature using low duty cycle pulse testing. Load regulation is tested
over a load range from 0.1 mA to the maximum specified output current. Changes in output voltage due to heating
effects are covered by the thermal regulation specification.
4: Dropout voltage is defined as the input to output differential at which the output voltage drops 2% below its nominal value
measured at a 1V differential.
5: Thermal Regulation is defined as the change in output voltage at a time t after a change in power dissipation is applied,
excluding load or line regulation effects. Specifications are for a current pulse equal to I
6: The maximum allowable power dissipation is a function of ambient temperature, the maximum allowable junction tem-
at V = 6V for t = 10 msec.
L
IN
MAX
perature and the thermal resistance from junction-to-air (i.e. T , T , ). Exceeding the maximum allowable power dissi-
A
J
JA
pation causes the device to initiate thermal shutdown. Please see Section 4.0, “Thermal Considerations”, of this data
sheet for more details.
7: The minimum V has to meet two conditions: V 2.7V and V (V + V ).
IN
IN
IN
R
DROPOUT
8: The junction temperature of the device is approximated by soaking the device under test at an ambient temperature
equal to the desired junction temperature. The test time is small enough such that the rise in the junction temperature
over the ambient temperature is not significant.
DS21385D-page 2
2001-2012 Microchip Technology Inc.
TC1300
ELECTRICAL CHARACTERISTICS (CONTINUED)
V
= V
+ 1V, I = 0.1 mA, C = 3.3 µF, SHDN > V , T = 25°C, unless otherwise noted. BOLDFACE type specifications apply
OUT L L IH A
IN
for junction temperature (Note 8) of -40°C to +125°C.
Parameters
Sym
Min
Typ
Max
Units
Conditions
I = 0.1 mA
Dropout Voltage (Note 4)
V
V
—
1
30
mV
IN – OUT
L
70
210
130
390
I = 100 mA
I = 300 mA
L
L
Supply Current
I
I
—
—
—
—
—
—
80
30
160
60
µA
µA
dB
mA
SHDN = V
IH
SS1
Shutdown Supply Current
Power Supply Rejection Ratio
Output Short Circuit Current
Thermal Regulation
SHDN = 0V
SS2
PSRR
60
—
f 1 kHz, C
= 1 nF
BYPASS
I
800
0.04
900
1200
—
V
= 0V
OUT
OUT
OUT
SC
V
/P
%/W Note 5
D
Output Noise
eN
—
nV/Hz f < 1 kHz, C
= 1 µF,
OUT
R
C
= 50
LOAD
= 1 nF
BYPASS
Wake-Up Time
(from Shutdown Mode)
t
—
—
—
10
50
20
—
—
µsec
µsec
C
C
= 1 µF, V = 5V,
IN
WK
IN
= 4.7 µF, I = 30 mA,
OUT
L
See Figure 3-2
Settling Time
(from Shutdown Mode)
ts
C
C
= 1 µF, V = 5V
IN
IN
= 4.7 µF
OUT
I = 30 mA, See Figure 3-2
L
Thermal Shutdown Die
Temperature
T
150
°C
°C
SD
Thermal Shutdown Hysteresis
T
—
—
10
—
—
HYS
Thermal Resistance Junction to
Case
RthetaJA
200
°C/Watt EIA/JEDEC JESD51-751-7 4-
Layer Board
SHDN Input High Threshold
SHDN Input Low Threshold
V
45
—
—
—
%V
V
V
= 2.5V to 6.0V
= 2.5V to 6.0V
IH
IN
IN
IN
IN
V
—
15
%V
IL
Note 1:
2:
V
is the regulator output voltage setting.
R
6
V
– V
10
OUTMAX
-------------------------------------------------------------------------------------
T
OUTMIN
TCV
=
OUT
V
OUT
3: Regulation is measured at a constant junction temperature using low duty cycle pulse testing. Load regulation is tested
over a load range from 0.1 mA to the maximum specified output current. Changes in output voltage due to heating
effects are covered by the thermal regulation specification.
4: Dropout voltage is defined as the input to output differential at which the output voltage drops 2% below its nominal value
measured at a 1V differential.
5: Thermal Regulation is defined as the change in output voltage at a time t after a change in power dissipation is applied,
excluding load or line regulation effects. Specifications are for a current pulse equal to I
6: The maximum allowable power dissipation is a function of ambient temperature, the maximum allowable junction tem-
at V = 6V for t = 10 msec.
L
IN
MAX
perature and the thermal resistance from junction-to-air (i.e. T , T , ). Exceeding the maximum allowable power dissi-
A
J
JA
pation causes the device to initiate thermal shutdown. Please see Section 4.0, “Thermal Considerations”, of this data
sheet for more details.
7: The minimum V has to meet two conditions: V 2.7V and V (V + V ).
IN
IN
IN
R
DROPOUT
8: The junction temperature of the device is approximated by soaking the device under test at an ambient temperature
equal to the desired junction temperature. The test time is small enough such that the rise in the junction temperature
over the ambient temperature is not significant.
2001-2012 Microchip Technology Inc.
DS21385D-page 3
TC1300
ELECTRICAL CHARACTERISTICS (CONTINUED)
V
= V
+ 1V, I = 0.1 mA, C = 3.3 µF, SHDN > V , T = 25°C, unless otherwise noted. BOLDFACE type specifications apply
IN
OUT L L IH A
for junction temperature (Note 8) of -40°C to +125°C.
Parameters Sym
RESET Output
Min
Typ
Max
Units
Conditions
Voltage Range
V
1.0
1.2
—
—
6.0
6.0
V
V
T
= 0°C to +70°C
= – 40°C to +125°C
DET
A
T
A
Reset Threshold
V
2.59
2.63
—
2.66
TC1300R-XX, T = +25°C
TH
A
2.55
2.70
TC1300R-XX,
T = – 40°C to +125°C
A
2.36
2.40
—
2.43
TC1300Y-XX, T = +25°C
A
2.32
2.47
TC1300Y-XX,
T = – 40°C to +125°C
A
Reset Threshold Tempco
VTH / T
—
—
30
160
300
—
—
—
ppm/°C
µsec
msec
V
V
to Reset Delay
t
t
V
V
= V to (V – 100 mV)
DET TH TH
DET
RPD
RPU
Reset Active Timeout Period
RESET Output Voltage Low
140
—
560
0.3
V
= V min,
OL
DET
TH
I
= 1.2 mA
SINK
RESET Output Voltage High
V
0.8 V
—
—
V
V
> V max,
DET TH
OH
DET
I
= 500 µA
SOURCE
Note 1:
2:
V
is the regulator output voltage setting.
R
6
V
– V
10
OUTMAX
-------------------------------------------------------------------------------------
T
OUTMIN
TCV
=
OUT
V
OUT
3: Regulation is measured at a constant junction temperature using low duty cycle pulse testing. Load regulation is tested
over a load range from 0.1 mA to the maximum specified output current. Changes in output voltage due to heating
effects are covered by the thermal regulation specification.
4: Dropout voltage is defined as the input to output differential at which the output voltage drops 2% below its nominal value
measured at a 1V differential.
5: Thermal Regulation is defined as the change in output voltage at a time t after a change in power dissipation is applied,
excluding load or line regulation effects. Specifications are for a current pulse equal to I
6: The maximum allowable power dissipation is a function of ambient temperature, the maximum allowable junction tem-
at V = 6V for t = 10 msec.
L
IN
MAX
perature and the thermal resistance from junction-to-air (i.e. T , T , ). Exceeding the maximum allowable power dissi-
A
J
JA
pation causes the device to initiate thermal shutdown. Please see Section 4.0, “Thermal Considerations”, of this data
sheet for more details.
7: The minimum V has to meet two conditions: V 2.7V and V (V + V ).
IN
IN
IN
R
DROPOUT
8: The junction temperature of the device is approximated by soaking the device under test at an ambient temperature
equal to the desired junction temperature. The test time is small enough such that the rise in the junction temperature
over the ambient temperature is not significant.
DS21385D-page 4
2001-2012 Microchip Technology Inc.
TC1300
2.0
TYPICAL CHARACTERISTICS
Note: The graphs and tables provided following this note are a statistical summary based on a limited number of
samples and are provided for informational purposes only. The performance characteristics listed herein
are not tested or guaranteed. In some graphs or tables, the data presented may be outside the specified
operating range (e.g., outside specified power supply range) and therefore outside the warranted range.
Junction temperature (TJ) is approximated by soaking the device under test at an ambient temperature equal to the
desired Junction temperature. The test time is small enough such that the rise in the Junction temperature over the
Ambient temperature is not significant.
450
400
350
300
250
200
150
100
50
0.035
0.030
0.025
0.020
0.015
0.010
0.005
0.000
VOUT = 3.0V
VIN = 3.5V to 6.0V
0
-40 -25 -10
5
20 35 50 65 80 95 110 125
-40 -25 -10
5
20 35 50 65 80 95 110 125
Junction Temperature (°C)
Junction Temperature (°C)
FIGURE 2-1:
Line Regulation vs.
FIGURE 2-4:
Reset Active Time-out
Temperature.
Period vs. Temperature.
10.00
0.14
0.12
0.10
0.08
0.06
0.04
0.02
0.00
RLOAD = 50 Ohms
OUT = 1 µF
VIN = VOUT + 1V
VOUT = 5.0V
VOUT = 3.0V
C
1.00
0.10
0.01
VOUT = 2.5V
-40 -25 -10
5
20 35 50 65 80 95 110 125
1
10
100
1000
0.01
0.10
Junction Temperature (°C)
Frequency (kHz)
FIGURE 2-2:
Supply Current vs.
FIGURE 2-5:
Output Noise vs. Frequency.
Temperature.
0.30
0.25
0.20
0.15
0.10
0.05
2.500
2.499
2.498
2.497
2.496
2.495
2.494
2.493
2.492
2.491
VOUT = 2.5V
TJ = -40°C
TJ = +125°C
TJ = +25°C
VIN = VOUT + 1V
IOUT = 100 µA
OUT = 2.5V
V
0.00
0
100
200
300
400
-40 -25 -10
5
20 35 50 65 80 95 110 125
Load Current (mA)
Junction Temperature (°C)
FIGURE 2-6:
Dropout Voltage vs. Load
FIGURE 2-3:
Normalized VOUT vs.
Current (2.5V).
Temperature.
2001-2012 Microchip Technology Inc.
DS21385D-page 5
TC1300
2.0 TYPICAL CHARACTERISTICS (CON’T)
Junction temperature (TJ) is approximated by soaking the device under test at an ambient temperature equal to the
desired Junction temperature. The test time is small enough such that the rise in the Junction temperature over the
Ambient temperature is not significant.
60
45
30
15
0
0.3
0.25
0.2
VIN = 3.8V
OUT = 2.8V
VOUT = 5.0V
V
TJ = -40°C
TJ = +125°C
I
OUT = 50 mA
C
C
C
OUT = 10 μF
OUTesr = 0.25 ꢀ
BYPASS = 0 μF
0.15
0.1
TJ = +25°C
0.05
0
1k
10k
100k
1M
10
100
0
100
200
300
400
Frequency (Hz)
Load Current (mA)
FIGURE 2-7:
Power Supply Rejection
FIGURE 2-10:
Dropout Voltage vs. Load
Ratio vs. Frequency.
Current (5.0V).
2.6330
2.6325
2.6320
2.6315
2.6310
2.6305
2.6300
2.6295
2.6290
2.6285
2.6280
2.6275
-40 -25 -10
5
20 35 50 65 80 95 110 125
Junction Temperature (°C)
FIGURE 2-8:
Reset Voltage Threshold vs.
FIGURE 2-11:
Wake-Up Response Time.
Junction Temperature.
300
250
200
150
100
50
0.90
0.80
0.70
0.60
0.50
VIN = VOUT + 1V
10 mV Overdrive
100 mV Overdrive
VOUT = 3.0V
VOUT = 2.5V
VOUT = 5.0V
0.40
0.30
0.20
0
-40 -25 -10
5
20 35 50 65 80 95 110 125
-40 -25 -10
5
20 35 50 65 80 95 110 125
Junction Temperature (°C)
Junction Temperature (°C)
FIGURE 2-12:
VDET to Reset Delay vs.
FIGURE 2-9:
Load Regulation vs.
Temperature.
Temperature.
DS21385D-page 6
2001-2012 Microchip Technology Inc.
TC1300
2.0 TYPICAL CHARACTERISTICS (CON’T)
Junction temperature (TJ) is approximated by soaking the device under test at an ambient temperature equal to the
desired Junction temperature. The test time is small enough such that the rise in the Junction temperature over the
Ambient temperature is not significant.
FIGURE 2-13:
Load Transient Response
FIGURE 2-16:
Line Transient Response
1 µF Output Capacitor.
10 µF Output Capacitor.
0.30
VDET = VTH - 20 mV
0.25
0.20
0.15
0.10
0.05
0.00
ISINK = 3.2 mA
ISINK = 1.2 mA
-40 -25 -10
5
20 35 50 65 80 95 110 125
Junction Temperature (°C)
FIGURE 2-14:
Line Transient Response
FIGURE 2-17:
RESET Output Voltage Low
1 µF Output Capacitor.
vs. Junction Temperature.
3.960
3.950
3.940
3.930
3.920
3.910
ISOURCE = 500 µA
ISOURCE = 800 µA
3.900
VDET = 4.0V
3.890
-40 -25 -10
5
20 35 50 65 80 95 110 125
Junction Temperature (°C)
FIGURE 2-15:
Load Transient Response
FIGURE 2-18:
RESET Output Voltage High
10 µF Output Capacitor.
vs. Junction Temperature.
2001-2012 Microchip Technology Inc.
DS21385D-page 7
TC1300
TC1300, the selected output capacitor equivalent
series resistance (ESR) range is 0.1 ohms to 5 ohms
when using 1 µF of output capacitance, and 0.01 ohms
to 5 ohms when using 10 µF of output capacitance.
Because of the ESR requirement, tantalum and alumi-
num electrolytic capacitors are recommended. Alumi-
num electrolytic capacitors are not recommended for
operation at temperatures below -25°C. When operat-
ing from sources other than batteries, rejection and
transient responses can be improved by increasing the
value of the input and output capacitors and employing
passive filtering techniques.
3.0
DETAILED DESCRIPTION
The TC1300 is a combination of a fixed output, low
dropout
regulator
and
a
microcontroller
monitor/RESET. Unlike bipolar regulators, the TC1300
supply current does not increase with load current. In
addition, VOUT remains stable and within regulation
over the entire specified operating load range (0 mA to
300 mA) and operating input voltage range (2.7V to
6.0V).
Figure 3-1 shows a typical application circuit. The reg-
ulator is enabled any time the shutdown input (SHDN)
is above VIH. The regulator is shutdown (disabled)
when SHDN is at or below VIL. SHDN may be con-
trolled by a CMOS logic gate or an I/O port of a micro-
controller. If the SHDN input is not required, it should be
connected directly to the input supply. While in shut-
down, supply current decreases to 30 µA (typical),
VOUT falls to zero and RESET remains valid.
3.3
Bypass Input (Optional)
An optional 470 pF capacitor connected from the
Bypass input to ground reduces noise present on the
internal reference, which in turn significantly reduces
output noise and improves PSRR performance. This
input may be left unconnected. Larger capacitor values
may be used, but results in a longer time period to rated
output voltage when power is initially applied.
3.1
RESET Output
The RESET output is driven active-low within 160 µsec
of VDET falling through the reset voltage threshold.
RESET is maintained active for a minimum of
140 msec after VDET rises above the reset threshold.
The TC1300 has an active-low RESET output. The out-
put of the TC1300 is valid down to VDET = 1V and is
optimized to reject fast transient glitches on the VDET
line.
3.4
Turn On Response
The turn-on response is defined as two separate
response categories, Wake-Up Time (tWK) and Settling
Time (tS).
The TC1300 has a fast Wake-Up Time (10 µsec typi-
cal) when released from shutdown. See Figure 3-2 for
the Wake-Up Time designated as tWK. The Wake-Up
Time is defined as the time it takes for the output to rise
to 2% of the VOUT value after being released from
shutdown.
8
7
1
2
Microcontroller
RESET
VDET
VDET
RESET
VOUT
The total turn-on response is defined as the Settling
Time (tS) (see Figure 3-2). Settling Time (inclusive with
VIN
VOUT
C
C
2
1
TC1300
1 µF
1 µF
t
WK) is defined as the condition when the output is
6
5
3
4
NC
GND
within 2% of its fully enabled value (50 µsec typical)
when released from shutdown. The settling time of the
output voltage is dependent on load conditions and
output capacitance on VOUT (RC response).
Battery
SHDN
Bypass
CBYPASS
470 pF
(Optional)
Shutdown Control
(from Power
Control Logic)
VIH
VIL
tS
SHDN
VOUT
FIGURE 3-1:
Typical Application Circuit.
98%
2%
3.2 Output Capacitor
tWK
A 1 µF (min) capacitor from VOUT to ground is required.
A 1 µF capacitor should also be connected from VIN to
GND if there is more than 10 inches of wire between
the regulator and the AC filter capacitor, or if a battery
is used as the power source. As with all low dropout
regulators, a minimum output capacitance is required
to stabilize the output voltage. For the TC1300, a mini-
mum of 1 µF of output capacitance is enough to stabi-
lize the device over the entire operating load and line
range. The selected output capacitor plays an impor-
tant role is compensating the LDO regulator. For the
FIGURE 3-2:
Wake-Up Response Time.
DS21385D-page 8
2001-2012 Microchip Technology Inc.
TC1300
The worst case actual power dissipation equation can
be used in conjunction with the LDO maximum allow-
able power dissipation equation to ensure regulator
thermal operation is within limits. For example:
4.0
4.1
THERMAL CONSIDERATIONS
Thermal Shutdown
Integrated thermal protection circuitry shuts the regula-
tor off when the die temperature exceeds 150°C. The
regulator remains off until the die temperature drops to
approximately 140°C.
Given:
VINMAX
VOUTMIN
ILOADMAX
TJMAX
=
=
=
=
=
=
4.1V
3.0V -2.5%
200 mA
125°C
4.2
Power Dissipation
The amount of power the regulator dissipates is primar-
ily a function of input and output voltage, and output
current. The following equation is used to calculate
worst case actual power dissipation:
TAMAX
JA
55°C
200°C/W
Find:
EQUATION
EQUATION:
ACTUAL POWER
DISSIPATION
PD VINMAX – VOUTMINILOADMAX
PD VINMAX – VOUTMINILOADMAX
= 4.1 – 3.0 .975200 10–3
Where:
PD = worst case actual power dissipation
= 220 mW
VINMAX = maximum voltage on VIN
VOUTMIN = minimum regulator output voltage
ILOADMAX = maximum output (load) current
EQUATION:
MAXIMUM ALLOWABLE
POWER DISSIPATION
The maximum allowable power dissipation, PDMAX, is a
function of the maximum ambient temperature (TAMAX),
the maximum recommended die temperature (125°C)
and the thermal resistance from junction-to-air (JA).
The MSOP-8 package has a JA of approximately
200°C/Watt when mounted on a FR4 dielectric copper
clad PC board.
TJMAX – TAMAX
PDMAX
=
=
-------------------------------------------
JA
125 – 55
-------------------------
200
= 350 mW
In this example, the TC1300 dissipates a maximum of
only 220 mW; below the allowable limit of 350 mW. In a
similar manner, the maximum actual power dissipation
equation and the maximum allowable power dissipa-
tion equation can be used to calculate maximum cur-
rent and/or input voltage limits. For example, the
maximum allowable VIN is found by substituting the
maximum allowable power dissipation of 350 mW into
the actual power dissipation equation, from which
VINMAX = 4.97V.
EQUATION
TJMAX – TAMAX
PDMAX
=
-------------------------------------------
JA
4.3
Layout Considerations
The primary path of heat conduction out of the package
is via the package leads. Therefore, layouts having a
ground plane, wide traces at the pads and wide power
supply bus lines combine to lower JA and, therefore,
increase the maximum allowable power dissipation
limit.
2001-2012 Microchip Technology Inc.
DS21385D-page 9
TC1300
5.0
5.1
PACKAGING INFORMATION
Package Marking Information
Example:
8-Lead MSOP
XXXXXX
YWWNNN
1300RA
YWWNNN
Marking Code
(XXXXXX)
Part Number
TC1300R - 2.5VUA
TC1300Y - 2.7VUA
TC1300R - 2.8VUA
TC1300R - 2.85VUA
TC1300R - 3.0VUA
TC1300R - 3.3VUA
1300RA
1300YF
1300RB
1300RC
1300RD
1300RE
Legend: XX...X Customer-specific information
Y
YY
WW
NNN
Year code (last digit of calendar year)
Year code (last 2 digits of calendar year)
Week code (week of January 1 is week ‘01’)
Alphanumeric traceability code
e
3
Pb-free JEDEC designator for Matte Tin (Sn)
*
This package is Pb-free. The Pb-free JEDEC designator (
can be found on the outer packaging for this package.
)
e3
Note: In the event the full Microchip part number cannot be marked on one line, it will
be carried over to the next line, thus limiting the number of available
characters for customer-specific information.
DS21385D-page 10
2001-2012 Microchip Technology Inc.
TC1300
5.2
Package Dimensions
Component Taping Orientation for 8-Pin MSOP Devices
User Direction of Feed
PIN 1
W
P
Standard Reel Component Orientation
for TR Suffix Device
Carrier Tape, Number of Components Per Reel and Reel Size:
Package
Carrier Width (W)
Pitch (P)
Part Per Full Reel
Reel Size
8-Pin MSOP
12 mm
8 mm
2500
13 in.
2001-2012 Microchip Technology Inc.
DS21385D-page 11
TC1300
8-Lead Plastic Micro Small Outline Package (UA) (MSOP)
Note: For the most current package drawings, please see the Microchip Packaging Specification located
at http://www.microchip.com/packaging
E
p
E1
D
2
B
n
1
A2
A
A1
c
(F)
L
Units
Dimension Limits
INCHES
NOM
MILLIMETERS*
NOM
MIN
MAX
MIN
MAX
n
p
Number of Pins
Pitch
8
8
.026
0.65
Overall Height
A
A2
A1
E
.044
1.18
Molded Package Thickness
Standoff
.030
.034
.038
.006
.200
.122
.122
.028
.039
0.76
0.05
0.86
0.97
0.15
.5.08
3.10
3.10
0.70
1.00
§
.002
.184
.114
.114
.016
.035
Overall Width
.193
.118
.118
.022
.037
4.90
3.00
3.00
0.55
0.95
4.67
2.90
2.90
0.40
0.90
Molded Package Width
Overall Length
E1
D
Foot Length
L
Footprint (Reference)
Foot Angle
F
0
6
0
6
c
Lead Thickness
Lead Width
.004
.010
.006
.012
.008
.016
0.10
0.25
0.15
0.30
0.20
0.40
B
Mold Draft Angle Top
Mold Draft Angle Bottom
7
7
7
7
*Controlling Parameter
§ Significant Characteristic
Notes:
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not
exceed .010" (0.254mm) per side.
Drawing No. C04-111
DS21385D-page 12
2001-2012 Microchip Technology Inc.
TC1300
6.0
REVISION HISTORY
Revision D (November 2010)
Added a note to each package outline drawing.
2001-2012 Microchip Technology Inc.
DS21385D-page 13
TC1300
NOTES:
DS21385D-page 14
2001-2012 Microchip Technology Inc.
TC1300
PRODUCT IDENTIFICATION SYSTEM
To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office.
PART NO.
Device
-X.X
X
/XX
Examples:
Output
Voltages
Temperature
Range
Package
a)
TC1300R-2.5VUA: 300mA CMOS LDO w/
Shutdown, Bypass Independent Delayed
&
Reset, 2.5V output voltage, 2.63V RESET
Threshold.
b)
c)
TC1300R-2.8VUA: 300mA CMOS LDO w/Shut-
down, Bypass & Independent Delayed Reset,
2.8V output voltage, 2.63V RESET Threshold.
TC1300R-2.85VUA: 300mA CMOS LDO w/
Shutdown, Bypass & Independent Delayed
Reset, 2.85V output voltage, 2.63V RESET
Threshold.
Device:
TC1300X-X.XXXX:
300mA CMOS LDO w/Shutdown,
Bypass & Independent Delayed
Reset
TC1300X-X.XXXXTR: 300mA CMOS LDO w/Shutdown,
Bypass & Independent Delayed
Reset (Tape and Reel)
d)
e)
f)
TC1300R-3.0VUA: 300mA CMOS LDO w/Shut-
down, Bypass & Independent Delayed Reset,
3.0V output voltage, 2.63V RESET Threshold.
TC1300R-3.3VUA: 300mA CMOS LDO w/Shut-
down, Bypass & Independent Delayed Reset,
3.3V output voltage, 2.63V RESET Threshold.
TC1300R-2.85VUATR: 300mA CMOS LDO w/
Shutdown, Bypass & Independent Delayed
Reset, 2.85V output voltage, 2.63V RESET
Threshold, tape and reel.
Output Voltages:
2.5V
2.7V
2.8V
2.85V
3.0V
3.3V
=
=
=
=
=
=
2.5
2.7
2.8
2.85
3.0
3.3
RESET Threshold
Voltages:
-
2.4V = Y
-
2.63V = R
Temperature Range:
Package:
V
=
-40°C to +125°C
g)
TC1300Y-2.7VUA: 300mA CMOS LDO w/ Shut-
down, Bypass & independant Delayed Reset,
2.7V output voltage, 2.4V RESET Threshold.
UA
=
Micro Small Outline Package (MSOP), 8-lead
Sales and Support
Data Sheets
Products supported by a preliminary Data Sheet may have an errata sheet describing minor operational differences and recom-
mended workarounds. To determine if an errata sheet exists for a particular device, please contact one of the following:
1. Your local Microchip sales office
2. The Microchip Worldwide Site (www.microchip.com)
Please specify which device, revision of silicon and Data Sheet (include Literature #) you are using.
New Customer Notification System
Register on our web site (www.microchip.com/cn) to receive the most current information on our products.
2001-2012 Microchip Technology Inc.
DS21385D-page15
TC1300
NOTES:
DS21385D-page 16
2001-2012 Microchip Technology Inc.
Note the following details of the code protection feature on Microchip devices:
•
Microchip products meet the specification contained in their particular Microchip Data Sheet.
•
Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the
intended manner and under normal conditions.
•
There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our
knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data
Sheets. Most likely, the person doing so is engaged in theft of intellectual property.
•
•
Microchip is willing to work with the customer who is concerned about the integrity of their code.
Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not
mean that we are guaranteeing the product as “unbreakable.”
Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our
products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts
allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act.
Information contained in this publication regarding device
applications and the like is provided only for your convenience
and may be superseded by updates. It is your responsibility to
ensure that your application meets with your specifications.
MICROCHIP MAKES NO REPRESENTATIONS OR
WARRANTIES OF ANY KIND WHETHER EXPRESS OR
IMPLIED, WRITTEN OR ORAL, STATUTORY OR
OTHERWISE, RELATED TO THE INFORMATION,
INCLUDING BUT NOT LIMITED TO ITS CONDITION,
QUALITY, PERFORMANCE, MERCHANTABILITY OR
FITNESS FOR PURPOSE. Microchip disclaims all liability
arising from this information and its use. Use of Microchip
devices in life support and/or safety applications is entirely at
the buyer’s risk, and the buyer agrees to defend, indemnify and
hold harmless Microchip from any and all damages, claims,
suits, or expenses resulting from such use. No licenses are
conveyed, implicitly or otherwise, under any Microchip
intellectual property rights.
Trademarks
The Microchip name and logo, the Microchip logo, dsPIC,
FlashFlex, KEELOQ, KEELOQ logo, MPLAB, PIC, PICmicro,
PICSTART, PIC logo, rfPIC, SST, SST Logo, SuperFlash
and UNI/O are registered trademarks of Microchip Technology
Incorporated in the U.S.A. and other countries.
32
FilterLab, Hampshire, HI-TECH C, Linear Active Thermistor,
MTP, SEEVAL and The Embedded Control Solutions
Company are registered trademarks of Microchip Technology
Incorporated in the U.S.A.
Silicon Storage Technology is a registered trademark of
Microchip Technology Inc. in other countries.
Analog-for-the-Digital Age, Application Maestro, BodyCom,
chipKIT, chipKIT logo, CodeGuard, dsPICDEM,
dsPICDEM.net, dsPICworks, dsSPEAK, ECAN,
ECONOMONITOR, FanSense, HI-TIDE, In-Circuit Serial
Programming, ICSP, Mindi, MiWi, MPASM, MPF, MPLAB
Certified logo, MPLIB, MPLINK, mTouch, Omniscient Code
Generation, PICC, PICC-18, PICDEM, PICDEM.net, PICkit,
PICtail, REAL ICE, rfLAB, Select Mode, SQI, Serial Quad I/O,
Total Endurance, TSHARC, UniWinDriver, WiperLock, ZENA
and Z-Scale are trademarks of Microchip Technology
Incorporated in the U.S.A. and other countries.
SQTP is a service mark of Microchip Technology Incorporated
in the U.S.A.
GestIC and ULPP are registered trademarks of Microchip
Technology Germany II GmbH & Co. & KG, a subsidiary of
Microchip Technology Inc., in other countries.
All other trademarks mentioned herein are property of their
respective companies.
© 2001-2012, Microchip Technology Incorporated, Printed in
the U.S.A., All Rights Reserved.
Printed on recycled paper.
ISBN: 9781620767832
QUALITY MANAGEMENT SYSTEM
CERTIFIED BY DNV
Microchip received ISO/TS-16949:2009 certification for its worldwide
headquarters, design and wafer fabrication facilities in Chandler and
Tempe, Arizona; Gresham, Oregon and design centers in California
and India. The Company’s quality system processes and procedures
are for its PIC® MCUs and dsPIC® DSCs, KEELOQ® code hopping
devices, Serial EEPROMs, microperipherals, nonvolatile memory and
analog products. In addition, Microchip’s quality system for the design
and manufacture of development systems is ISO 9001:2000 certified.
== ISO/TS 16949 ==
2001-2012 Microchip Technology Inc.
DS21385D-page 17
Worldwide Sales and Service
AMERICAS
ASIA/PACIFIC
ASIA/PACIFIC
EUROPE
Corporate Office
2355 West Chandler Blvd.
Chandler, AZ 85224-6199
Tel: 480-792-7200
Fax: 480-792-7277
Technical Support:
http://www.microchip.com/
support
Asia Pacific Office
Suites 3707-14, 37th Floor
Tower 6, The Gateway
Harbour City, Kowloon
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Tel: 852-2401-1200
Fax: 852-2401-3431
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Tel: 91-80-3090-4444
Fax: 91-80-3090-4123
Austria - Wels
Tel: 43-7242-2244-39
Fax: 43-7242-2244-393
Denmark - Copenhagen
Tel: 45-4450-2828
Fax: 45-4485-2829
India - New Delhi
Tel: 91-11-4160-8631
Fax: 91-11-4160-8632
France - Paris
Tel: 33-1-69-53-63-20
Fax: 33-1-69-30-90-79
India - Pune
Tel: 91-20-2566-1512
Fax: 91-20-2566-1513
Australia - Sydney
Tel: 61-2-9868-6733
Fax: 61-2-9868-6755
Web Address:
www.microchip.com
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Tel: 49-89-627-144-0
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Tel: 81-66-152-7160
Fax: 81-66-152-9310
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Tel: 678-957-9614
Fax: 678-957-1455
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Tel: 86-10-8569-7000
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Fax: 39-0331-466781
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Tel: 81-45-471- 6166
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Tel: 774-760-0087
Fax: 774-760-0088
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Tel: 630-285-0071
Fax: 630-285-0075
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Tel: 34-91-708-08-90
Fax: 34-91-708-08-91
Korea - Seoul
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Tel: 86-571-2819-3187
Fax: 86-571-2819-3189
Tel: 82-2-554-7200
Fax: 82-2-558-5932 or
82-2-558-5934
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Tel: 44-118-921-5869
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Tel: 216-447-0464
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Tel: 86-27-5980-5300
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Santa Clara, CA
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Toronto
Mississauga, Ontario,
Canada
China - Xiamen
Tel: 905-673-0699
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Tel: 86-592-2388138
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Tel: 86-756-3210040
Fax: 86-756-3210049
11/27/12
DS21385D-page 18
2001-2012 Microchip Technology Inc.
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