TC1303C-SQ0EMF [MICROCHIP]
0.5 A SWITCHING REGULATOR, 2400 kHz SWITCHING FREQ-MAX, PDSO10, 3 X 3 MM, 0.9 MM HEIGHT, PLASTIC, DFN-10;
| 型号： | TC1303C-SQ0EMF |
| 厂家： | 
MICROCHIP |
| 描述： | 0.5 A SWITCHING REGULATOR, 2400 kHz SWITCHING FREQ-MAX, PDSO10, 3 X 3 MM, 0.9 MM HEIGHT, PLASTIC, DFN-10 开关 控制器 开关式稳压器 开关式控制器 光电二极管 电源电路 开关式稳压器或控制器 |
| 文件： | 总38页 (文件大小：755K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
TC1303A/TC1303B/
TC1303C/TC1304
500 mA Synchronous Buck Regulator,
+ 300 mA LDO with Power-Good Output
Features
Description
• Dual-Output Regulator (500 mA Buck Regulator
and 300 mA Low-Dropout Regulator)
The
TC1303/TC1304
combines
a
500 mA
synchronous buck regulator and 300 mA Low-Dropout
Regulator (LDO) with a power-good monitor to provide
a highly integrated solution for devices that require
multiple supply voltages. The unique combination of an
integrated buck switching regulator and low-dropout
linear regulator provides the lowest system cost for
dual-output voltage applications that require one lower
processor core voltage and one higher bias voltage.
• Power-Good Output with 300 ms Delay
• Total Device Quiescent Current = 65 µA, Typical
• Independent Shutdown for Buck and LDO
Outputs (TC1303)
• Both Outputs Internally Compensated
• Synchronous Buck Regulator:
- Over 90% Typical Efficiency
The 500 mA synchronous buck regulator switches at a
fixed frequency of 2.0 MHz when the load is heavy,
providing a low noise, small-size solution. When the
load on the buck output is reduced to light levels, it
changes operation to a Pulse Frequency Modulation
(PFM) mode to minimize quiescent current draw from
the battery. No intervention is necessary for smooth
transition from one mode to another.
- 2.0 MHz Fixed-Frequency PWM
(Heavy Load)
- Low Output Noise
- Automatic PWM to PFM mode transition
- Adjustable (0.8V to 4.5V) and Standard
Fixed-Output Voltages (0.8V, 1.2V, 1.5V,
1.8V, 2.5V, 3.3V)
The LDO provides a 300 mA auxiliary output that
requires a single 1 µF ceramic output capacitor,
minimizing board area and cost. The typical dropout
voltage for the LDO output is 137 mV for a 200 mA
load.
• Low-Dropout Regulator:
- Low-Dropout Voltage = 137 mV Typical @
200 mA
- Standard Fixed-Output Voltages
(1.5V, 1.8V, 2.5V, 3.3V)
For the TC1303/TC1304, the power-good output is
based on the regulation of the buck regulator output, the
LDO output or the combination of both. The TC1304
features start-up and shutdown output sequencing.
• Power-Good Function:
- Monitors Buck Output Function (TC1303A)
- Monitors LDO Output Function (TC1303B)
- Monitors Both Buck and LDO Output
Functions (TC1303C and TC1304)
The TC1303/TC1304 is available in either the 10-pin
DFN or MSOP package.
- 300 ms Delay Used for Processor Reset
• Sequenced Startup and Shutdown (TC1304)
• Small 10-pin 3x3 DFN or MSOP Package Options
• Operating Junction Temperature Range:
- -40°C to +125°C
Additional protection features include: UVLO,
overtemperature and overcurrent protection on both
outputs.
For a complete listing of TC1303/TC1304 standard
parts, consult your Microchip representative.
• Undervoltage Lockout (UVLO)
• Output Short Circuit Protection
• Overtemperature Protection
Applications
• Cellular Phones
• Portable Computers
• USB-Powered Devices
• Handheld Medical Instruments
• Organizers and PDAs
© 2008 Microchip Technology Inc.
DS21949C-page 1
TC1303A/TC1303B/TC1303C/TC1304
Package Types
TC1303A,B,C
10-Lead DFN
10-Lead MSOP
PGND
10
9
SHDN2
VIN2
1
2
3
4
5
SHDN2
VIN2
P
GND
1
2
10
LX
LX
9
EP
11
VIN1
VOUT2
VOUT2
VIN1
8
3
4
5
8
7
6
PG
AGND
SHDN1
VFB1/VOUT1
7
SHDN1
PG
VFB1/VOUT1
AGND
6
TC1304
10-Lead DFN
10-Lead MSOP
PGND
10
9
SHDN
VIN2
1
SHDN
P
1
2
10
9
GND
LX
2
3
4
5
VIN2
LX
EP
11
VIN1
VOUT2
VOUT2
VIN1
8
3
4
5
8
7
6
PG
AGND
AGND
VFB1/VOUT1
7
AGND
PG
VFB1/VOUT1
AGND
6
DS21949C-page 2
© 2008 Microchip Technology Inc.
TC1303A/TC1303B/TC1303C/TC1304
Functional Block Diagram – TC1303
Undervoltage Lockout
(UVLO)
UVLO
VREF
Synchronous Buck Regulator
VIN1
PDRV
VIN2
LX
Driver
Control
SHDN1
NDRV
PGND
PGND
PGND
AGND
VOUT1/VFB1
Sense Switcher for A,C
PG
TC1303A(1),B(2),C(1) options
PG Generator with Delay
VREF
Sense LDO for B,C
UVLO
VOUT2
LDO
SHDN2
AGND
Note 1: PG open-drain for A,C options
2: PG push-pull output for B option
© 2008 Microchip Technology Inc.
DS21949C-page 3
TC1303A/TC1303B/TC1303C/TC1304
Functional Block Diagram – TC1304
Undervoltage Lockout
(UVLO)
UVLO
VREF
Synchronous Buck Regulator
VIN1
PDRV
VIN2
LX
Driver
Control
SHDN
NDRV
PGND
PGND
PGND
AGND
VOUT1/VFB1
PG
TC1304(Note)
PG Generator with Delay
Output Voltage
Sequencer ckt.
AGND
VREF
UVLO
VOUT2
LDO
AGND
Note:
PG open-drain for TC1304
DS21949C-page 4
© 2008 Microchip Technology Inc.
TC1303A/TC1303B/TC1303C/TC1304
Typical Application Circuits
TC1303A
Fixed-Output Application
10-Lead MSOP
4.7 μH
VIN
VIN1
VOUT1
1.5V @ 500 mA
LX
PGND
VOUT1
VOUT2
AGND
8
2
7
1
4
9
10
6
2.7V to 4.2V
4.7 μF
4.7 μF
VIN2
SHDN1
SHDN2
PG
VOUT2
2.5V @ 300 mA
3
1 μF
RPULLUP
5
Processor
RESET
TC1303B
Adjustable-Output Application
10-Lead DFN
4.7 μH
VOUT1
VIN1
VIN2
LX
Input
8
2
9
Voltage
2.1V @
500 mA
PGND
4.7 ΜF
1 ΜF
4.7 μF
4.5V to 5.5V
200 kΩ
VOUT2
4.99 kΩ
10
SHDN1
VOUT1
EP
11
7
1
4
6
3
*Optional
Capacitor
VIN2
SHDN2
PG
VOUT2
1.0 μF
33 pF
3.3V @
300 mA
121 kΩ
AGND
(Note)
5
Processor
RESET
Note: Connect DFN package exposed pad to AGND
.
TC1304
Fixed-Output Application
10-Lead MSOP
4.7
H
μ
VIN
2.7V to 4.2V
VIN1
VIN2
AGND
VOUT1
1.2V @ 500 mA
LX
PGND
VOUT1
VOUT2
AGND
8
2
7
1
4
9
10
6
4.7 ΜF
4.7 μF
VOUT2
SHDN
PG
3
1 μF
2.5V @ 300 mA
RPULLUP
5
Processor
RESET
© 2008 Microchip Technology Inc.
DS21949C-page 5
TC1303A/TC1303B/TC1303C/TC1304
NOTES:
DS21949C-page 6
© 2008 Microchip Technology Inc.
TC1303A/TC1303B/TC1303C/TC1304
† Notice: Stresses above those listed under “Maximum
1.0
ELECTRICAL
CHARACTERISTICS
Ratings” may cause permanent damage to the device. This is
a stress rating only and functional operation of the device at
those or any other conditions above those indicated in the
operational listings of this specification is not implied.
Exposure to maximum rating conditions for extended periods
may affect device reliability.
Absolute Maximum Ratings †
V
- A .......................................................................6.0V
GND
IN
All Other I/O ...............................(AGND - 0.3V) to (VIN + 0.3V)
LX to PGND...............................................-0.3V to (VIN + 0.3V)
P
GND to AGND ..................................................-0.3V to +0.3V
Output Short Circuit Current ................................Continuous
Power Dissipation (Note 7)..........................Internally Limited
Storage temperature .....................................-65°C to +150°C
Ambient Temp. with Power Applied ................-40°C to +85°C
Operating Junction Temperature...................-40°C to +125°C
ESD protection on all pins (HBM) ....................................... 3 kV
DC CHARACTERISTICS
Electrical Characteristics: VIN1 =VIN2 = SHDN1,2 = 3.6V, COUT1 = CIN = 4.7 µF, COUT2 = 1 µF, L = 4.7 µH, VOUT1 (ADJ) = 1.8V,
OUT1 = 100 mA, IOUT2 = 0.1 mA TA = +25°C. Boldface specifications apply over the TA range of -40°C to +85°C.
I
Parameters
Sym
Min
Typ
Max
Units
Conditions
Input/Output Characteristics
Input Voltage
VIN
2.7
500
300
—
—
—
5.5
—
—
1
V
Note 1, Note 2, Note 8
Note 1
Maximum Output Current
Maximum Output Current
IOUT1_MAX
IOUT2_MAX
IIN_SHDN
mA
mA
µA
—
Note 1
Shutdown Current
0.05
SHDN1 = SHDN2 = GND
Combined VIN1 and VIN2 Current
TC1303A,B Operating IQ
TC1303C, TC1304 Operating IQ
IQ
IQ
—
65.0
70.1
110
110
µA
SHDN1 = SHDN2 = VIN2
IOUT1 = 0 mA, IOUT2 = 0 mA
Synchronous Buck IQ
LDO IQ
—
—
38
46
—
—
µA
µA
SHDN1 = VIN, SHDN2 = GND
SHDN1 = GND, SHDN2 = VIN2
Shutdown/UVLO/Thermal Shutdown Characteristics
SHDN1,SHDN2, SHDN (TC1304)
Logic Input Voltage Low
VIL
VIH
IIN
—
—
—
15
—
%VIN
%VIN
µA
VIN1 =VIN2 = 2.7V to 5.5V
VIN1 =VIN2 = 2.7V to 5.5V
SHDN1,SHDN2, SHDN (TC1304)
Logic Input Voltage High
45
SHDN1,SHDN2, SHDN (TC1304)
Input Leakage Current
-1.0
±0.01
1.0
VIN1 =VIN2 = 2.7V to 5.5V
SHDNX = GND
SHDNY = VIN
Thermal Shutdown
TSHD
TSHD-HYS
UVLO
—
—
165
10
—
—
°C
°C
V
Note 6, Note 7
Thermal Shutdown Hysteresis
Undervoltage Lockout
2.4
2.55
2.7
VIN1 Falling
(VOUT1 and VOUT2
)
Undervoltage Lockout Hysteresis UVLO-HYS
—
200
—
mV
Note 1: The Minimum VIN has to meet two conditions: VIN ≥ 2.7V and VIN ≥ VRX + VDROPOUT, VRX = VR1 or VR2
2: RX is the regulator output voltage setting.
3: TCVOUT2 = ((VOUT2max – VOUT2min) * 106)/(VOUT2 * DT).
.
V
4: Regulation is measured at a constant junction temperature using low duty-cycle pulse testing. Load regulation is tested
over a load range from 0.1 mA to the maximum specified output current.
5: Dropout voltage is defined as the input-to-output voltage differential at which the output voltage drops 2% below its
nominal value measured at a 1V differential.
6: The maximum allowable power dissipation is a function of ambient temperature, the maximum allowable junction
temperature and the thermal resistance from junction to air. (i.e. TA, TJ, θJA). Exceeding the maximum allowable power
dissipation causes the device to initiate thermal shutdown.
7: The integrated MOSFET switches have an integral diode from the LX pin to VIN, and from LX to PGND. In cases where
these diodes are forward-biased, the package power dissipation limits must be adhered to. Thermal protection is not
able to limit the junction temperature for these cases.
8:
VIN1 and VIN2 are supplied by the same input source.
© 2008 Microchip Technology Inc.
DS21949C-page 7
TC1303A/TC1303B/TC1303C/TC1304
DC CHARACTERISTICS (CONTINUED)
Electrical Characteristics: VIN1 =VIN2 = SHDN1,2 = 3.6V, COUT1 = CIN = 4.7 µF, COUT2 = 1 µF, L = 4.7 µH, VOUT1 (ADJ) = 1.8V,
I
OUT1 = 100 mA, IOUT2 = 0.1 mA TA = +25°C. Boldface specifications apply over the TA range of -40°C to +85°C.
Parameters
Sym
)
Min
Typ
Max
Units
Conditions
Synchronous Buck Regulator (VOUT1
Adjustable Output Voltage Range
Adjustable Reference Feedback
VOUT1
VFB1
0.8
—
4.5
V
V
0.78
0.8
0.82
Voltage (VFB1
)
Feedback Input Bias Current
IVFB1
—
-2.5
—
-1.5
±0.3
0.2
—
+2.5
—
nA
%
(
)
IFB1
Output Voltage Tolerance Fixed
(VOUT1
Line Regulation (VOUT1
VOUT1
Note 2
)
)
VLINE-REG
VLOAD-REG
VIN – VOUT1
%/V
%
VIN =VR+1V to 5.5V,
LOAD = 100 mA
I
Load Regulation (VOUT1
Dropout Voltage VOUT1
)
—
0.2
—
VIN = VR + 1.5V, ILOAD = 100 mA to
500 mA (Note 1)
—
280
—
mV
IOUT1 = 500 mA, VOUT1 = 3.3V
(Note 5)
Internal Oscillator Frequency
Start Up Time
FOSC
TSS
1.6
—
2.0
0.5
2.4
—
MHz
ms
TR = 10% to 90%
IP=100 mA
RDSon P-Channel
RDSon-P
RDSon-N
ILX
—
450
450
±0.01
—
mΩ
mΩ
μA
RDSon N-Channel
—
—
IN=100 mA
LX Pin Leakage Current
-1.0
1.0
SHDN = 0V, VIN = 5.5V, LX = 0V,
L
X = 5.5V
Positive Current Limit Threshold
+ILX(MAX)
—
700
—
mA
%
LDO Output (VOUT2
)
Output Voltage Tolerance (VOUT2
Temperature Coefficient
Line Regulation
)
VOUT2
-2.5
—
±0.3
25
+2.5
—
Note 2
TCVOUT
ppm/°C Note 3
∆VOUT2
∆VIN
/
/
/
-0.2
±0.02
+0.2
%/V
(VR+1V) ≤ VIN ≤ 5.5V
Load Regulation, VOUT2 ≥ 2.5V
Load Regulation, VOUT2 < 2.5V
Dropout Voltage VOUT2 > 2.5V
Power Supply Rejection Ratio
Output Noise
∆VOUT2
IOUT2
-0.75
-0.9
—
-0.08
-0.18
+0.75
+0.9
%
IOUT2 = 0.1 mA to 300 mA (Note 4)
IOUT2 = 0.1 mA to 300 mA (Note 4)
IOUT2 = 200 mA (Note 5)
∆VOUT2
%
IOUT2
VIN – VOUT2
PSRR
137
205
300
500
mV
I
OUT2 = 300 mA
f ≤ 100 Hz, IOUT1 = IOUT2 = 50 mA,
IN = 0 µF
—
62
—
dB
C
½
eN
—
1.8
—
µV/(Hz)
f ≤ 1 kHz, IOUT2 = 50 mA,
SHDN1 = GND
Note 1: The Minimum VIN has to meet two conditions: VIN ≥ 2.7V and VIN ≥ VRX + VDROPOUT, VRX = VR1 or VR2
2: RX is the regulator output voltage setting.
3: TCVOUT2 = ((VOUT2max – VOUT2min) * 106)/(VOUT2 * DT).
.
V
4: Regulation is measured at a constant junction temperature using low duty-cycle pulse testing. Load regulation is tested
over a load range from 0.1 mA to the maximum specified output current.
5: Dropout voltage is defined as the input-to-output voltage differential at which the output voltage drops 2% below its
nominal value measured at a 1V differential.
6: The maximum allowable power dissipation is a function of ambient temperature, the maximum allowable junction
temperature and the thermal resistance from junction to air. (i.e. TA, TJ, θJA). Exceeding the maximum allowable power
dissipation causes the device to initiate thermal shutdown.
7: The integrated MOSFET switches have an integral diode from the LX pin to VIN, and from LX to PGND. In cases where
these diodes are forward-biased, the package power dissipation limits must be adhered to. Thermal protection is not
able to limit the junction temperature for these cases.
8:
VIN1 and VIN2 are supplied by the same input source.
DS21949C-page 8
© 2008 Microchip Technology Inc.
TC1303A/TC1303B/TC1303C/TC1304
DC CHARACTERISTICS (CONTINUED)
Electrical Characteristics: VIN1 =VIN2 = SHDN1,2 = 3.6V, COUT1 = CIN = 4.7 µF, COUT2 = 1 µF, L = 4.7 µH, VOUT1 (ADJ) = 1.8V,
OUT1 = 100 mA, IOUT2 = 0.1 mA TA = +25°C. Boldface specifications apply over the TA range of -40°C to +85°C.
I
Parameters
Sym
Min
Typ
Max
Units
Conditions
RLOAD2 ≤ 1Ω
Output Short Circuit Current
(Average)
IOUTsc2
—
240
—
mA
Wake-Up Time (From SHDN2
tWK
tS
—
—
31
100
—
µs
µs
IOUT1 = IOUT2 = 50 mA
IOUT1 = IOUT2 = 50 mA
mode), (VOUT2
Settling Time (From SHDN2
mode), (VOUT2
)
100
)
Power-Good (PG)
Voltage Range PG
VPG
1.0
—
5.5
V
TA = 0°C to +70°C
1.2
5.5
TA = -40°C to +85°C
VIN ≤ 2.7 ISINK = 100 µA
PG Threshold High
VTH_H
VTH_L
—
89
—
94
92
2
96
—
—
% of
VOUTX
On Rising VOUT1 or VOUT2
VOUTX = VOUT1 or VOUT2
(VOUT1 or VOUT2
PG Threshold Low
(VOUT1 or VOUT2
PG Threshold Hysteresis
(VOUT1 and VOUT2
)
% of
VOUTX
On Falling VOUT1 or VOUT2
VOUTX = VOUT1 or VOUT2
)
VTH_HYS
% of
VOUTX
VOUTX = VOUT1 or VOUT2
)
PG Threshold Tempco
PG Delay
ΔVTH/ΔT
—
—
30
—
—
ppm/°C
µs
tRPD
165
VOUT1 or VOUT2 = (VTH + 100 mV)
to (VTH - 100 mV)
PG Active Time-out Period
PG Output Voltage Low
tRPU
140
—
262
—
560
0.2
—
ms
V
VOUT1 or VOUT2 = VTH - 100 mV
to VTH + 100 mV,
I
SINK = 1.2 mA
PG_VOL
PG_VOH
VOUT1orVOUT2 = VTH - 100 mV,
IPG= 1.2 mA VIN2 > 2.7V
I
PG = 100 µA, 1.0V < VIN2 < 2.7V
PG Output Voltage High
(TC1303B only)
0.9* VOUT2
—
V
VOUT1 or VOUT2 = VTH + 100 mV
VOUT2 ≥ 1.8V, IPG = - 500 µA
V
OUT2 < 1.8V,IPG = - 300 µA
Note 1: The Minimum VIN has to meet two conditions: VIN ≥ 2.7V and VIN ≥ VRX + VDROPOUT, VRX = VR1 or VR2
2: RX is the regulator output voltage setting.
3: TCVOUT2 = ((VOUT2max – VOUT2min) * 106)/(VOUT2 * DT).
.
V
4: Regulation is measured at a constant junction temperature using low duty-cycle pulse testing. Load regulation is tested
over a load range from 0.1 mA to the maximum specified output current.
5: Dropout voltage is defined as the input-to-output voltage differential at which the output voltage drops 2% below its
nominal value measured at a 1V differential.
6: The maximum allowable power dissipation is a function of ambient temperature, the maximum allowable junction
temperature and the thermal resistance from junction to air. (i.e. TA, TJ, θJA). Exceeding the maximum allowable power
dissipation causes the device to initiate thermal shutdown.
7: The integrated MOSFET switches have an integral diode from the LX pin to VIN, and from LX to PGND. In cases where
these diodes are forward-biased, the package power dissipation limits must be adhered to. Thermal protection is not
able to limit the junction temperature for these cases.
8:
VIN1 and VIN2 are supplied by the same input source.
© 2008 Microchip Technology Inc.
DS21949C-page 9
TC1303A/TC1303B/TC1303C/TC1304
TEMPERATURE SPECIFICATIONS
Electrical Specifications: Unless otherwise indicated, all limits are specified for: VIN = +2.7V to +5.5V
Parameters
Sym
Min
Typ
Max
Units
Conditions
Temperature Ranges
Operating Junction Temperature
Range
TJ
-40
—
+125
°C
Steady state
Storage Temperature Range
Maximum Junction Temperature
Thermal Package Resistances
Thermal Resistance, 10L-DFN
TA
TJ
-65
—
—
—
+150
+150
°C
°C
Transient
θJA
—
—
41
—
—
°C/W Typical 4-layer Board with
Internal Ground Plane and 2 Vias
in Thermal Pad
Thermal Resistance, 10L-MSOP
θJA
113
°C/W Typical 4-layer Board with
Internal Ground Plane
DS21949C-page 10
© 2008 Microchip Technology Inc.
TC1303A/TC1303B/TC1303C/TC1304
2.0
TYPICAL PERFORMANCE CURVES
Note:
The graphs and tables provided following this note are a statistical summary based on a limited number of
samples and are provided for informational purposes only. The performance characteristics listed herein
are not tested or guaranteed. In some graphs or tables, the data presented may be outside the specified
operating range (e.g., outside specified power supply range) and therefore outside the warranted range.
Note: Unless otherwise indicated, VIN1 = VIN2 = SHDN1,2 = 3.6V, COUT1 = CIN = 4.7 µF, COUT2 = 1 µF, L = 4.7 µH,
OUT1 (ADJ) = 1.8V, TA = +25°C. Boldface specifications apply over the TA range of -40°C to +85°C. TA = +25°C. Adjustable- or fixed-
output voltage options can be used to generate the Typical Performance Characteristics.
V
80
76
72
68
64
60
55
50
45
40
35
30
VIN = 5.5V
IOUT1 = IOUT2 = 0 mA
SHDN1 = VIN2
SHDN2 = VIN2
IOUT2 = 0 mA
VIN = 5.5V
VIN = 4.2V
VIN = 4.2V
VIN = 3.6V
SHDN1 = AGND
SHDN2 = VIN2
VIN = 3.6V
-40 -25 -10
5
20 35 50 65 80 95 110 125
-40 -25 -10
5
20 35 50 65 80 95 110 125
Ambient Temperature (°C)
Ambient Temperature (°C)
FIGURE 2-1:
I Switcher and LDO
FIGURE 2-4:
I LDO Current vs. Ambient
Q
Q
Current vs. Ambient Temperature (TC1303A,B).
Temperature.
VIN = 5.5V
78
76
74
72
70
68
66
100
95
90
85
80
75
70
65
60
55
50
SHDN1 = VIN2
SHDN2 = VIN2
SHDN1 = VIN2
SHDN2 = AGND
IOUT1 = 100 mA
VIN = 4.2V
IOUT1 = 250 mA
IOUT1 = 500 mA
VIN = 3.6V
-40 -25 -10
5
20 35 50 65 80 95 110 125
2.7 3.05 3.4 3.75 4.1 4.45 4.8 5.15 5.5
Input Voltage (V)
Ambient Temperature (°C)
FIGURE 2-2:
I Switcher and LDO
FIGURE 2-5:
V
Output Efficiency vs.
OUT1
Q
Current vs. Ambient Temperature
(TC1303C, TC1304).
Input Voltage (V
= 1.2V).
OUT1
SHDN1 = VIN2
SHDN2 = AGND
55
100
95
IOUT1 = 0 mA
VIN = 5.5V
SHDN1 = VIN2
SHDN2 = AGND
50
45
90
85
VIN1 = 3.6V
40
80
75
70
VIN1 = 4.2V
VIN = 4.2V
VIN = 3.6V
35
30
VIN1 = 3.0V
0.005
0.104
0.203
0.302
0.401
0.5
-40 -25 -10
5
20 35 50 65 80 95 110 125
IOUT1 (A)
Ambient Temperature (°C)
FIGURE 2-3:
Ambient Temperature.
I Switcher Current vs.
FIGURE 2-6:
(V = 1.2V).
OUT1
V
Output Efficiency vs.
Q
OUT1
I
OUT1
© 2008 Microchip Technology Inc.
DS21949C-page 11
TC1303A/TC1303B/TC1303C/TC1304
Note: Unless otherwise indicated, VIN1 = VIN2 = SHDN1,2 = 3.6V, COUT1 = CIN = 4.7 µF, COUT2 = 1 µF, L = 4.7 µH,
V
OUT1 (ADJ) = 1.8V, TA = +25°C. Boldface specifications apply over the TA range of -40°C to +85°C. TA = +25°C. Adjustable- or fixed-
output voltage options can be used to generate the Typical Performance Characteristics.
VIN1 = 3.6V
100
95
90
85
80
75
70
65
60
100
95
90
85
80
75
70
65
60
SHDN1 = VIN2
SHDN2 = AGND
IOUT1 = 100 mA
IOUT1 = 250 mA
VIN1 = 4.2V
SHDN1 = VIN2
SHDN2 = AGND
IOUT1 = 500 mA
VIN1 = 5.5V
0.005
0.104
0.203
0.302
0.401
0.5
2.7 3.05 3.4 3.75 4.1 4.45 4.8 5.15 5.5
Input Voltage (V)
IOUT1 (A)
FIGURE 2-7:
V
Output Efficiency vs.
FIGURE 2-10:
V
Output Efficiency vs.
OUT1
OUT1
Input Voltage (V
= 1.8V).
I
(V = 3.3V).
OUT1
OUT1
OUT1
100
1.21
1.206
1.202
1.198
1.194
1.19
SHDN1 = VIN2
SHDN2 = AGND
SHDN1 = VIN2
SHDN2 = AGND
VIN = 3.0V
95
90
85
80
75
VIN1 = 3.6V
VIN = 4.2V
VIN = 3.6V
0.005
0.104
0.203
0.302
0.401
0.5
0.005
0.104
0.203
0.302
0.401
0.5
I
OUT1 (A)
IOUT1 (A)
FIGURE 2-8:
V
Output Efficiency vs.
FIGURE 2-11:
(V = 1.2V).
V
vs. I
OUT1 OUT1
OUT1
I
(V
= 1.8V).
OUT1
OUT1
OUT1
100
96
92
88
84
80
1.82
SHDN1 = VIN2
SHDN2 = AGND
SHDN1 = VIN2
SHDN2 = AGND
VIN1 = 3.6V
IOUT1 = 100 mA
1.815
1.81
1.805
1.8
IOUT1 = 250 mA
IOUT1 = 500 mA
1.795
1.79
0.005
0.104
0.203
0.302
0.401
0.5
3.60
3.92
4.23
4.55
4.87
5.18
5.50
IOUT1 (A)
Input Voltage (V)
FIGURE 2-9:
Input Voltage (V
V
Output Efficiency vs.
FIGURE 2-12:
(V = 1.8V).
V
vs. I
OUT1 OUT1
OUT1
= 3.3V).
OUT1
OUT1
DS21949C-page 12
© 2008 Microchip Technology Inc.
TC1303A/TC1303B/TC1303C/TC1304
Note: Unless otherwise indicated, VIN1 = VIN2 = SHDN1,2 = 3.6V, COUT1 = CIN = 4.7 µF, COUT2 = 1 µF, L = 4.7 µH,
V
OUT1 (ADJ) = 1.8V, TA = +25°C. Boldface specifications apply over the TA range of -40°C to +85°C. TA = +25°C. Adjustable- or fixed-
output voltage options can be used to generate the Typical Performance Characteristics.
3.4
3.36
3.32
3.28
3.24
3.2
0.820
0.815
0.810
0.805
0.800
0.795
0.790
SHDN1 = VIN2
SHDN2 = AGND
SHDN1 = VIN2
SHDN2 = AGND
VIN1 = 3.6V
VIN1 = 4.2V
0.005
0.104
0.203
0.302
0.401
0.5
IOUT1 (A)
Ambient Temperature (°C)
FIGURE 2-13:
(V = 3.3V).
V
vs. I
FIGURE 2-16:
Voltage vs. Ambient Temperature.
V
Adjustable Feedback
OUT1
OUT1
OUT1
OUT1
2.20
0.6
SHDN1 = VIN2
SHDN2 = AGND
SHDN1 = VIN2
SHDN2 = AGND
2.15
2.10
2.05
2.00
1.95
1.90
0.55
0.5
TA = 25 °C
0.45
0.4
N-Channel
P-Channel
0.35
0.3
3.3 3.5 3.7 3.9 4.1 4.3 4.5 4.7 4.9 5.1 5.3 5.5
Input Voltage (V)
2.7
3.1
3.5
3.9
4.3
4.7
5.1
5.5
Input Voltage (V)
FIGURE 2-14:
V
Switching Frequency
FIGURE 2-17:
V
Switch Resistance
OUT1
OUT1
vs. Input Voltage.
vs. Input Voltage.
0.65
2.00
1.98
1.96
1.94
1.92
1.90
SHDN1 = VIN2
SHDN2 = AGND
SHDN1 = VIN2
SHDN2 = AGND
VIN1 = 3.6V
0.6
0.55
0.5
P-Channel
N-Channel
0.45
0.4
0.35
0.3
-40 -25 -10
5
20 35 50 65 80 95 110 125
Ambient Temperature (°C)
Ambient Temperature (°C)
FIGURE 2-15:
V
Switching Frequency
FIGURE 2-18:
V
Switch Resistance
OUT1
OUT1
vs. Ambient Temperature.
vs. Ambient Temperature.
© 2008 Microchip Technology Inc.
DS21949C-page 13
TC1303A/TC1303B/TC1303C/TC1304
Note: Unless otherwise indicated, VIN1 = VIN2 = SHDN1,2 = 3.6V, COUT1 = CIN = 4.7 µF, COUT2 = 1 µF, L = 4.7 µH,
V
OUT1 (ADJ) = 1.8V, TA = +25°C. Boldface specifications apply over the TA range of -40°C to +85°C. TA = +25°C. Adjustable- or fixed-
output voltage options can be used to generate the Typical Performance Characteristics.
IOUT2 = 150 mA
TA = + 85°C
0.4
0.35
0.3
1.492
1.49
SHDN1 = VIN2
SHDN2 = AGND
1.488
1.486
1.484
1.482
TA = + 25°C
TA = - 40°C
0.25
0.2
SHDN1 = AGND
SHDN2 = VIN2
VOUT1 = 3.3V
IOUT1 = 500 mA
0.15
0.1
2.7 3.05 3.4 3.75 4.1 4.45 4.8 5.15 5.5
Input Voltage (V)
Ambient Temperature (°C)
FIGURE 2-19:
V
Dropout Voltage vs.
FIGURE 2-22:
V
Output Voltage vs.
OUT2
OUT1
Ambient Temperature.
Input Voltage (V
= 1.5V).
OUT2
1.802
IOUT2 = 150 mA
SHDN1 = AGND
SHDN2 = VIN2
1.800
1.798
1.796
1.794
1.792
TA = + 85°C
TA = + 25°C
TA = - 40°C
2.7 3.05 3.4 3.75 4.1 4.45 4.8 5.15 5.5
Input Voltage (V)
FIGURE 2-20:
V
and V
Heavy
FIGURE 2-23:
V
Output Voltage vs.
OUT2
OUT1
OUT2
Load Switching Waveforms vs. Time.
Input Voltage (V
= 1.8V).
OUT2
2.508
SHDN1 = AGND
SHDN2 = VIN2
IOUT2 = 150 mA
2.506
2.504
2.502
2.500
2.498
2.496
TA = + 85°C
TA = + 25°C
TA = - 40°C
3.3 3.5 3.7 3.9 4.1 4.3 4.5 4.7 4.9 5.1 5.3 5.5
Input Voltage (V)
FIGURE 2-21:
V
and V
Light
FIGURE 2-24:
V
Output Voltage vs.
OUT2
OUT1
OUT2
Load Switching Waveforms vs. Time.
Input Voltage (V
= 2.5V).
OUT2
DS21949C-page 14
© 2008 Microchip Technology Inc.
TC1303A/TC1303B/TC1303C/TC1304
Note: Unless otherwise indicated, VIN1 = VIN2 = SHDN1,2 = 3.6V, COUT1 = CIN = 4.7 µF, COUT2 = 1 µF, L = 4.7 µH,
V
OUT1 (ADJ) = 1.8V, TA = +25°C. Boldface specifications apply over the TA range of -40°C to +85°C. TA = +25°C. Adjustable- or fixed-
output voltage options can be used to generate the Typical Performance Characteristics.
SHDN1 = AGND
SHDN2 = VIN2
3.298
3.297
3.296
3.295
3.294
3.293
3.292
0.005
0.000
SHDN1 = AGND
SHDN2 = VIN2
IOUT2 = 150 mA
VOUT2 = 3.3V
TA = + 85°C
-0.005
-0.010
-0.015
-0.020
-0.025
-0.030
-0.035
IOUT2 = 100 µA
VOUT2 = 2.5V
TA = + 25°C
TA = - 40°C
VOUT2 = 1.5V
3.60
3.92
4.23
4.55
4.87
5.18
5.50
-40 -25 -10
5
20 35 50 65 80 95 110 125
Input Voltage (V)
Ambient Temperature (°C)
FIGURE 2-25:
V
Output Voltage vs.
FIGURE 2-28:
V
Line Regulation vs.
OUT2
OUT2
Input Voltage (V
= 3.3V).
Ambient Temperature.
OUT2
0.30
0.25
0.20
0.15
0.10
0.05
0.1
SHDN1 = AGND
SHDN2 = VIN2
VIN2 = 3.6V
SHDN1 = AGND
SHDN2 = VIN2
VOUT2 = 3.3V
0.0
-0.1
-0.2
-0.3
-0.4
IOUT2 = 300 mA
IOUT2 = 200 mA
VOUT2 = 2.6V
VOUT2 = 1.5V
Ambient Temperature (°C)
Ambient Temperature (°C)
FIGURE 2-26:
V
Dropout Voltage vs.
FIGURE 2-29:
V
Load Regulation vs.
OUT2
OUT2
Ambient Temperature (V
= 2.5V).
Ambient Temperature.
OUT2
0.3
350
VIN = 3.6V
SHDN1 = AGND
SHDN2 = VIN2
SHDN1 = VIN2
SHDN2 = VIN2
325
300
275
250
225
200
0.2
0.1
0.0
IOUT2 = 300 mA
IOUT2 = 200 mA
-40 -25 -10
5
20 35 50 65 80 95 110 125
-40 -25 -10
5
20 35 50 65 80 95 110 125
Ambient temperature (°C)
Ambient Temperature (°C)
FIGURE 2-27:
Ambient Temperature (V
V
Dropout Voltage vs.
FIGURE 2-30:
vs. Ambient Temperature.
PG Active Delay Time-out
OUT2
OUT2
= 3.3V).
© 2008 Microchip Technology Inc.
DS21949C-page 15
TC1303A/TC1303B/TC1303C/TC1304
Note: Unless otherwise indicated, VIN1 = VIN2 = SHDN1,2 = 3.6V, COUT1 = CIN = 4.7 µF, COUT2 = 1 µF, L = 4.7 µH,
V
OUT1 (ADJ) = 1.8V, TA = +25°C. Boldface specifications apply over the TA range of -40°C to +85°C. TA = +25°C. Adjustable- or fixed-
output voltage options can be used to generate the Typical Performance Characteristics.
96
95
94
93
92
91
90
0
-10
-20
-30
-40
-50
-60
-70
-80
SHDN1 = VIN2
SHDN2 = VIN2
SHDN1 = GND
VOUT2 = 1.5V
VIN = 3.6V
COUT2 = 1.0 µF
IOUT2 = 30 mA
C
IN = 0 µF
PG Threshold Hi
COUT2 = 4.7 µF
PG Threshold Low
-40 -25 -10
5
20 35 50 65 80 95 110 125
0.01
0.1
1
10
100
1000
Ambient Temperature (°C)
Frequency (kHz)
FIGURE 2-31:
PG Threshold Voltage vs.
FIGURE 2-34:
V
Power Supply Ripple
OUT2
Ambient Temperature.
Rejection vs. Frequency.
0.02
10
SHDN1 = VIN2
SHDN2 = VIN2
SHDN1 = AGND
SHDN2 = VIN2
VIN = 3.6V
0.018
1
0.016
0.014
0.012
0.01
IOL = 1.2 mA
0.1
VIN = 3.6V
VOUT2 = 2.5V
I
OUT2 = 50 mA
0.01
0.01
0.1
1
10
100
1000 10000
Ambient Temperature (°C)
Frequency (kHz)
FIGURE 2-32:
PG Output Voltage Level
FIGURE 2-35:
V
Noise vs. Frequency.
OUT2
Low vs. Ambient Temperature.
VOUT2 = 2.8V
3.0
2.5
VOUT2 = 2.5V
2.0
1.5
VOUT2 = 1.5V
1.0
VIN = 3.6V
0.5
SHDN1 = VIN2
SHDN2 = VIN2
I
OH = 500 µA
0.0
-40 -25 -10
5
20 35 50 65 80 95 110 125
Ambient Temperature (°C)
FIGURE 2-36:
V
Load Step Response
OUT1
FIGURE 2-33:
PG Output Voltage Level
vs. Time.
High vs. Ambient Temperature.
DS21949C-page 16
© 2008 Microchip Technology Inc.
TC1303A/TC1303B/TC1303C/TC1304
Note: Unless otherwise indicated, VIN1 = VIN2 = SHDN1,2 = 3.6V, COUT1 = CIN = 4.7 µF, COUT2 = 1 µF, L = 4.7 µH,
V
OUT1 (ADJ) = 1.8V, TA = +25°C. Boldface specifications apply over the TA range of -40°C to +85°C. TA = +25°C. Adjustable- or fixed-
output voltage options can be used to generate the Typical Performance Characteristics.
FIGURE 2-37:
vs. Time.
V
V
V
Load Step Response
FIGURE 2-40:
Waveforms.
V
and V
Shutdown
OUT2
OUT2
OUT1
OUT1
OUT1
FIGURE 2-38:
Response vs. Time.
and V
Line Step
FIGURE 2-41:
Power-Good Output Timing.
OUT2
FIGURE 2-42:
Start-up Waveforms
FIGURE 2-39:
and V
Start-up
OUT2
(TC1304).
Waveforms.
© 2008 Microchip Technology Inc.
DS21949C-page 17
TC1303A/TC1303B/TC1303C/TC1304
Note: Unless otherwise indicated, VIN1 = VIN2 = SHDN1,2 = 3.6V, COUT1 = CIN = 4.7 µF, COUT2 = 1 µF, L = 4.7 µH,
V
OUT1 (ADJ) = 1.8V, TA = +25°C. Boldface specifications apply over the TA range of -40°C to +85°C. TA = +25°C. Adjustable- or fixed-
output voltage options can be used to generate the Typical Performance Characteristics.
FIGURE 2-43:
Shutdown Waveforms
(TC1304).
DS21949C-page 18
© 2008 Microchip Technology Inc.
TC1303A/TC1303B/TC1303C/TC1304
3.0
PIN DESCRIPTIONS
The descriptions of the pins are listed in Table 3-1.
TABLE 3-1:
Pin No.
PIN FUNCTION TABLE
Symbol
TC1303
TC1304
Description
MSOP, DFN MSOP, DFN
1
1
SHDN2
—
—
Active Low Shutdown Input for LDO Output Pin
SHDN
Active Low Shutdown Input both Buck Regulator Output and LDO Output.
Initiates sequencing up and down
2
3
4
5
6
VIN2
VOUT2
PG
VIN2
VOUT2
PG
Analog Input Supply Voltage Pin
LDO Output Voltage Pin
Power-Good Output Pin
Analog Ground Pin
AGND
AGND
V
FB/VOUT1 VFB/VOUT1 Buck Feedback Voltage (Adjustable Version) / Buck Output Voltage
(Fixed Version) Pin
7
7
SHDN1
—
—
AGND
VIN1
LX
Active Low Shutdown Input for Buck Regulator Output Pin
Analog Ground Pin
8
VIN1
LX
Buck Regulator Input Voltage Pin
Buck Inductor Output Pin
9
10
11
PGND
EP
PGND
EP
Power Ground Pin
Exposed Pad - For the DFN package, the center exposed pad is a thermal
path to remove heat from the device. Electrically this pad is at ground
potential and should be connected to AGND
.
3.1
TC1303 LDO Shutdown Input Pin
(SHDN2)
3.4
LDO Output Voltage Pin (VOUT2)
VOUT2 is a regulated LDO output voltage pin. Connect
a 1 µF or larger capacitor to VOUT2 and AGND for proper
operation.
SHDN2 is a logic-level input used to turn the LDO
Regulator on and off. A logic-high (> 45% of VIN), will
enable the regulator output. A logic-low (< 15% of VIN)
will ensure that the output is turned off.
3.5
Power-Good Output Pin (PG)
PG is an output level indicating that VOUT2 (LDO) is
within 94% of regulation. The PG output is configured
as a push-pull for the TC1303B and open-drain output
for the TC1303A, TC1303C and TC1304.
3.2
TC1304 Shutdown Input Pin
(SHDN)
SHDN is a logic-level input used to initiate the
sequencing of the LDO output, then the buck regulator
output. A logic-high (> 45% of VIN), will enable the
regulator outputs. A logic-low (< 15% of VIN) will ensure
that the outputs are turned off.
3.6
Analog Ground Pin (AGND)
AGND is the analog ground connection. Tie AGND to the
analog portion of the ground plane (AGND). See the
physical layout information in Section 5.0 “Application
Circuits/Issues” for grounding recommendations.
3.3
LDO Input Voltage Pin (VIN2)
VIN2 is a LDO power input supply pin. Connect variable
input voltage source to VIN2. Connect VIN1 and VIN2
together with board traces as short as possible. VIN2
provides the input voltage for the LDO. An additional
capacitor can be added to lower the LDO regulator
input ripple voltage.
3.7
Buck Regulator Output Sense Pin
(VFB/VOUT1
)
For VOUT1 adjustable-output voltage options, connect
the center of the output voltage divider to the VFB pin.
For fixed-output voltage options, connect the output of
the buck regulator to this pin (VOUT1).
© 2008 Microchip Technology Inc.
DS21949C-page 19
TC1303A/TC1303B/TC1303C/TC1304
3.8
Buck Regulator Shutdown Input
Pin (SHDN1)
3.11 Power Ground Pin (PGND)
Connect all large-signal level ground returns to PGND
.
These large-signal, level ground traces should have a
small loop area and length to prevent coupling of
switching noise to sensitive traces. Please see the
physical layout information supplied in Section 5.0
SHDN1 is a logic-level input used to turn the buck
regulator on and off. A logic-high (> 45% of VIN), will
enable the regulator output. A logic-low (< 15% of VIN)
will ensure that the output is turned off.
“Application
Circuits/Issues” for
grounding
recommendations.
3.9
Buck Regulator Input Voltage Pin
(VIN1
)
3.12 Exposed Pad (EP)
VIN1 is the buck regulator power input supply pin.
Connect a variable input voltage source to VIN1
Connect VIN1 and VIN2 together with board traces as
short as possible.
For the DFN package, connect the EP to AGND, with
vias into the AGND plane.
.
3.10 Buck Inductor Output Pin (LX)
Connect LX directly to the buck inductor. This pin
carries large signal-level current; all connections
should be made as short as possible.
DS21949C-page 20
© 2008 Microchip Technology Inc.
TC1303A/TC1303B/TC1303C/TC1304
4.2.1
FIXED-FREQUENCY PWM MODE
4.0
DETAILED DESCRIPTION
Device Overview
While operating in Pulse Width Modulation (PWM)
mode, the TC1303/TC1304 buck regulator switches at
a fixed, 2.0 MHz frequency. The PWM mode is suited
for higher load current operation, maintaining low
output noise and high conversion efficiency. PFM-to-
PWM mode transition is initiated for any of the following
conditions:
4.1
The
TC1303/TC1304
combines
a
500 mA
synchronous buck regulator with a 300 mA LDO and a
power-good output. This unique combination provides
a small, low-cost solution for applications that require
two or more voltage rails. The buck regulator can
deliver high-output current over a wide range of input-
to-output voltage ratios while maintaining high
efficiency. This is typically used for the lower-voltage,
high-current processor core. The LDO is a minimal
parts-count solution (single-output capacitor), providing
a regulated voltage for an auxiliary rail. The typical LDO
dropout voltage (137 mV @ 200 mA) allows the use of
very low input-to-output LDO differential voltages,
minimizing the power loss internal to the LDO pass
transistor. A power-good output is provided, indicating
that the buck regulator output, the LDO output or both
outputs are in regulation. Additional features include
independent shutdown inputs (TC1303), UVLO, output
voltage sequencing (TC1304), overcurrent and
overtemperature shutdown.
• Continuous inductor current is sensed
• Inductor peak current exceeds 100 mA
• The buck regulator output voltage has dropped
out of regulation (step load has occurred)
The typical PFM-to-PWM threshold is 80 mA.
4.2.2
PFM MODE
PFM mode is entered when the output load on the buck
regulator is very light. Once detected, the converter
enters the PFM mode automatically and begins to skip
pulses to minimize unnecessary quiescent current
draw by reducing the number of switching cycles per
second. The typical quiescent current for the switching
regulator is less than 35 µA. The transition from PWM
to PFM mode occurs when discontinuous inductor
current is sensed or the peak inductor current is less
than 60 mA (typical). The typical PWM to PFM mode
threshold is 30 mA. For low input-to-output differential
voltages, the PWM-to-PFM mode threshold can be low
due to the lack of ripple current. It is recommended that
VIN1 be one volt greater than VOUT1 for PWM-to-PFM
transitions.
4.2
Synchronous Buck Regulator
The synchronous buck regulator is capable of
supplying a 500 mA continuous output current over a
wide range of input and output voltages. The output
voltage range is from 0.8V (minimum) to 4.5V
(maximum). The regulator operates in three different
modes, automatically selecting the most efficient mode
of operation. During heavy load conditions, the
TC1303/TC1304 buck converter operates at a high,
fixed frequency (2.0 MHz) using current mode control.
This minimizes output ripple and noise (less than 8 mV
peak-to-peak ripple) while maintaining high efficiency
(typically > 90%). For standby or light load applications,
the buck regulator will automatically switch to a power-
saving Pulse Frequency Modulation (PFM) mode. This
minimizes the quiescent current draw on the battery,
while keeping the buck output voltage in regulation.
The typical buck PFM mode current is 38 µA. The buck
regulator is capable of operating at 100% duty cycle,
minimizing the voltage drop from input-to-output for
wide input, battery-powered applications. For fixed-
output voltage applications, the feedback divider and
control loop compensation components are integrated,
eliminating the need for external components. The
buck regulator output is protected against overcurrent,
short circuit and overtemperature. While shut down, the
synchronous buck N-channel and P-channel switches
are off, so the LX pin is in a high-impedance state (this
allows for connecting a source on the output of the
buck regulator as long as its voltage does not exceed
the input voltage).
4.3
Low Drop Out Regulator (LDO)
The LDO output is a 300 mA low-dropout linear
regulator that provides a regulated output voltage with
a single 1 µF external capacitor. The output voltage is
available in fixed options only, ranging from 1.5V to
3.3V. The LDO is stable using ceramic output
capacitors that inherently provide lower output noise
and reduce the size and cost of the regulator solution.
The quiescent current consumed by the LDO output is
typically less than 40 µA, with a typical dropout voltage
of 137 mV at 200 mA. While operating in Dropout
mode, the LDO quiescent current will increase,
minimizing the necessary voltage differential needed
for the LDO output to maintain regulation. The LDO
output is protected against overcurrent and
overtemperature conditions.
© 2008 Microchip Technology Inc.
DS21949C-page 21
TC1303A/TC1303B/TC1303C/TC1304
4.4
Power-Good
4.5
Power Good Output Options
A Power-Good (PG) output signal is generated based
off of the buck regulator output voltage (VOUT1), the
LDO output voltage (VOUT2) or the combination of both
outputs. A fixed delay time of approximately 262 ms is
generated once the monitored output voltage is above
the power-good threshold (typically 94% of VOUTX). As
the monitored output voltage falls out of regulation, the
falling PG threshold is typically 92% of the output
voltage. The PG output signal is pulled up to the output
voltage, indicating that power is good and pulled low,
indicating that the output is out of regulation. The
typical quiescent current draw for power-good circuitry
is less than 10 µA.
There are three monitoring options for the TC1303
family.
For the TC1303A, only the buck regulator output
voltage (VOUT1) is monitored. The PG output signal
depends only on VOUT1
For the TC1303B, only the LDO output voltage (VOUT2
is monitored. The PG output signal depends only on
VOUT2
.
)
.
For the TC1303C and TC1304, both the buck regulator
output voltage and LDO output voltage are monitored.
If either one of the outputs fall out of regulation, the PG
will be low. Only if both VOUT1 and VOUT2 are within the
PG voltage threshold limits will the PG output be high.
If the monitored output voltage falls below the power-
good threshold, the power-good output will transition to
the Low state. The power-good circuitry has a 165 µs
delay when detecting a falling output voltage. This
helps to increase the noise immunity of the power-good
output, avoiding false triggering of the PG signal during
line and load transients.
For the TC1303A,C and TC1304, the PG output pin is
open drain and can be pulled up to any level within the
given absolute maximum ratings (AGND - 0.3V) to (VIN
+ 0.3V).
TABLE 4-1:
PG AVAILABLE OPTIONS
PG
PG Output
Part
Number
Output
LDO
PG Output
Type
VTH_H
VOUT1
Buck
(VOUT1
)
(VOUT2
)
or VOUT2
TC1303A
TC1303B
Yes
No
No
Open-Drain
Push-Pull
tRPU
Yes
(VOUT2
)
VOH
TC1303C
TC1304
Yes
Yes
Yes
Yes
Open-Drain
Open-Drain
tRPD
PG
VOL
FIGURE 4-1:
Power-Good Timing.
DS21949C-page 22
© 2008 Microchip Technology Inc.
TC1303A/TC1303B/TC1303C/TC1304
the turn on of the Buck Regulator output (VOUT1) until
4.6
TC1304 Sequencing
the LDO output is in regulation. During power-down,
the sequencing circuit will turn off the Buck Regulator
output prior to turning off LDO output.
The TC1304 device features an integrated sequencing
option. A sequencing circuit using only the SHDN input,
(Pin1), will turn on the LDO output (VOUT2) and delay
160 µs Delay*
+
VOUT2
SHDN
Enable
To PG
–
Delay CKT.
92% of VOUT2
+
160 µs Delay*
VOUT1
Enable
–
92% of VOUT1
* 160 µs delay on trailing edge
FIGURE 4-2:
TC1304 Sequencing Circuit.
4.7
Soft Start
Both outputs of the TC1303/TC1304 are controlled
during start-up. Less than 1% of VOUT1 or VOUT2
overshoot is observed during start-up from VIN rising
above the UVLO voltage or either SHDN1 or SHDN2
being enabled.
TC1304
Power Up Timing From SHDN
VIN1/VIN2
SHDN
VOUT1
4.8
Overtemperature Protection
500 µs
The TC1303/TC1304 has an integrated overtempera-
ture protection circuit that monitors the device junction
temperature and shuts the device off if the junction
temperature exceeds the typical 165°C threshold. If the
overtemperature threshold is reached, the soft start is
reset so that, once the junction temperature cools to
approximately 155°C, the device will automatically
restart.
t
WK + tS
VOUT2
300 ms
Power Good
FIGURE 4-3:
TC1304 Power-up Timing
from SHDN.
© 2008 Microchip Technology Inc.
DS21949C-page 23
TC1303A/TC1303B/TC1303C/TC1304
NOTES:
DS21949C-page 24
© 2008 Microchip Technology Inc.
TC1303A/TC1303B/TC1303C/TC1304
An additional VIN2 capacitor can be added to reduce
5.0
5.1
APPLICATION CIRCUITS/
ISSUES
high-frequency noise on the LDO input voltage pin
(VIN2). This additional capacitor (1 µF on page 5) is not
necessary for typical applications.
Typical Applications
5.4
Input and Output Capacitor
Selection
The TC1303/TC1304 500 mA buck regulator + 300 mA
LDO with power-good operates over a wide input volt-
age range (2.7V to 5.5V) and is ideal for single-cell Li-
Ion battery-powered applications, USB-powered
applications, three-cell NiMH or NiCd applications and
3V to 5V regulated input applications. The 10-pin
MSOP and 3x3 DFN packages provide a small footprint
with minimal external components.
As with all buck-derived dc-dc switching regulators, the
input current is pulled from the source in pulses. This
places a burden on the TC1303/TC1304 input filter
capacitor. In most applications, a minimum of 4.7 µF is
recommended on VIN1 (buck regulator input voltage
pin). In applications that have high source impedance,
or have long leads, (10 inches) connecting to the input
source, additional capacitance should be used. The
capacitor type can be electrolytic (aluminum, tantalum,
POSCAP, OSCON) or ceramic. For most portable
electronic applications, ceramic capacitors are
preferred due to their small size and low cost.
5.2
Fixed Output Application
A typical VOUT1 fixed-output voltage application is
shown in “Typical Application Circuits”. A 4.7 µF
VIN1 ceramic input capacitor, 4.7 µF VOUT1 ceramic
capacitor, 1.0 µF ceramic VOUT2 capacitor and 4.7 µH
inductor make up the entire external component
solution for this dual-output application. No external
dividers or compensation components are necessary.
For this application, the input voltage range is 2.7V to
4.2V, VOUT1 = 1.5V at 500 mA, while VOUT2 = 2.5V at
300 mA.
For applications that require very low noise on the LDO
output, an additional capacitor (typically 1 µF) can be
added to the VIN2 pin (LDO input voltage pin).
Low ESR electrolytic or ceramic can be used for the
buck regulator output capacitor. Again, ceramic is
recommended because of its physical attributes and
cost. For most applications, a 4.7 µF is recommended.
Refer to Table 5-1 for recommended values. Larger
capacitors (up to 22 µF) can be used. There are some
advantages in load step performance when using
larger value capacitors. Ceramic materials X7R and
X5R have low temperature coefficients and are well
within the acceptable ESR range required.
5.3
Adjustable Output Application
A typical VOUT1 adjustable output application is also
shown in “Typical Application Circuits”. For this
application, the buck regulator output voltage is
adjustable by using two external resistors as a voltage
divider. For adjustable-output voltages, it is
recommended that the top resistor divider value be
200 kΩ. The bottom resistor divider can be calculated
using the following formula:
TABLE 5-1:
TC1303A, TC1303B, TC1303C,
TC1304 RECOMMENDED
CAPACITOR VALUES
EQUATION 5-1:
C(VIN1
4.7 µF
none
)
C(VIN2
)
COUT1
COUT2
VFB
⎛
⎝
⎞
⎠
min
none
none
4.7 µF
22 µF
1 µF
--------------------------------
RBOT = RTOP
×
VOUT1 – VFB
max
10 µF
Example:
RTOP
VOUT1
VFB
=
=
=
=
=
200 kΩ
2.1V
0.8V
RBOT
RBOT
200 kΩ x (0.8V/(2.1V – 0.8V))
123 kΩ (Standard Value = 121 kΩ)
For adjustable-output applications, an additional R-C
compensation is necessary for the buck regulator
control loop stability. Recommended values are:
RCOMP
CCOMP
=
=
4.99 kΩ
33 pF
© 2008 Microchip Technology Inc.
DS21949C-page 25
TC1303A/TC1303B/TC1303C/TC1304
TABLE 5-2:
TC1303A, TC1303B, TC1303C,
TC1304 RECOMMENDED
INDUCTOR VALUES
5.5
Inductor Selection
For most applications, a 4.7 µH inductor is recom-
mended to minimize noise. There are many different
magnetic core materials and package options to select
from. That decision is based on size, cost and accept-
able radiated energy levels. Toroid and shielded ferrite
pot cores will have low radiated energy, but tend to be
larger and higher is cost. With a typical 2.0 MHz
switching frequency, the inductor ripple current can be
calculated based on the following formulas.
DCR
Ω
(MAX)
Part
Value
MAX
Size
Number (µH)
IDC (A) WxLxH (mm)
Coiltronics®
SD10
SD10
2.2
3.3
4.7
0.091 1.35 5.2, 5.2, 1.0 max.
0.108 1.24 5.2, 5.2, 1.0 max.
0.154 1.04 5.2, 5.2, 1.0 max.
SD10
EQUATION 5-2:
Coiltronics
SD12
VOUT
DutyCycle = -------------
VIN
2.2
3.3
4.7
0.075 1.80 5.2, 5.2, 1.2 max.
0.104 1.42 5.2, 5.2, 1.2 max.
0.118 1.29 5.2, 5.2, 1.2 max.
SD12
SD12
Sumida Corporation®
Duty cycle represents the percentage of switch-on
time.
CMD411
CMD411
CMD411
Coilcraft®
1008PS
2.2
3.3
4.7
0.116 0.950 4.4, 5.8, 1.2 max.
0.174 0.770 4.4, 5.8, 1.2 max.
0.216 0.750 4.4, 5.8, 1.2 max.
EQUATION 5-3:
1
FSW
---------
TON = DutyCycle ×
Where:
4.7
4.7
0.35
0.11
1.0 3.8, 3.8, 2.74 max.
1.15 5.9, 5.0, 3.81 max
1812PS
FSW = Switching Frequency.
The inductor ac ripple current can be calculated using
the following relationship:
5.6
Thermal Calculations
5.6.1
BUCK REGULATOR OUTPUT
(V
)
EQUATION 5-4:
OUT1
ΔIL
The TC1303/TC1304 is available in two different 10-pin
packages (MSOP and 3x3 DFN). By calculating the
power dissipation and applying the package thermal
resistance, (θJA), the junction temperature is estimated.
The maximum continuous junction temperature rating
for the TC1303/TC1304 is +125°C.
--------
VL = L ×
Δt
Where:
VL
=
=
voltage across the inductor (VIN – VOUT
)
∆t
on-time of P-channel MOSFET
To quickly estimate the internal power dissipation for
the switching buck regulator, an empirical calculation
using measured efficiency can be used. Given the
measured efficiency (Section 2.0 “Typical Perfor-
mance Curves”), the internal power dissipation is
estimated below:
Solving for ∆IL = yields:
EQUATION 5-5:
ΔIL
VL
-----
L
=
× Δt
EQUATION 5-6:
When considering inductor ratings, the maximum DC
current rating of the inductor should be at least equal to
the maximum buck regulator load current (IOUT1), plus
one half of the peak-to-peak inductor ripple current (1/
2 * ΔIL). The inductor DC resistance can add to the
buck converter I2R losses. A rating of less than 200 mΩ
is recommended. Overall efficiency will be improved by
using lower DC resistance inductors.
VOUT1 × IOUT1
⎛
⎝
⎞
⎠
-------------------------------------
– (VOUT1 × IOUT1) = PDissipation
Efficiency
The first term is equal to the input power (definition of
efficiency, POUT/PIN = Efficiency). The second term is
equal to the delivered power. The difference is internal
power dissipation. This is an estimate assuming that
most of the power lost is internal to the TC1303B.
There is some percentage of power lost in the buck
inductor, with very little loss in the input and output
capacitors.
DS21949C-page 26
© 2008 Microchip Technology Inc.
TC1303A/TC1303B/TC1303C/TC1304
As an example, for a 3.6V input, 1.8V output with a load
returns are connected closely together at the PGND
plane. The LDO optional input capacitor (CIN2) and
LDO output capacitor COUT2 are returned to the AGND
plane. The analog ground plane and power ground
plane are connected at one point (shown near L1). All
other signals (SHDN1, SHDN2, feedback in the
adjustable-output case) should be referenced to AGND
and have the AGND plane underneath them.
of 400 mA, the efficiency taken from Figure 2-8 is
approximately 84%. The internal power dissipation is
approximately 137 mW.
5.6.2
LDO OUTPUT (V
)
OUT2
The internal power dissipation within the TC1303/
TC1304 LDO is a function of input voltage, output
voltage and output current. Equation 5-7 can be used
to calculate the internal power dissipation for the LDO.
- Via
AGND to PGND
EQUATION 5-7:
+VOUT1
* CIN2 Optional
PLDO = (VIN(MAX)) – VOUT2(MIN)) × IOUT2(MAX))
COUT1
L1
Where:
AGND
PGND
CIN2
PLDO = LDO Pass device internal power
dissipation
1
2
3
4
5
10
9
CIN1
VIN(MAX) = Maximum input voltage
+VIN2
+VIN1
VOUT(MIN) = LDO minimum output voltage
8
+VOUT2
7
COUT2
The maximum power dissipation capability for a
package can be calculated given the junction-to-
ambient thermal resistance and the maximum ambient
temperature for the application. The following equation
can be used to determine the package’s maximum
internal power dissipation.
6
TC1303B
PGND Plane
AGND
A
GND Plane
FIGURE 5-1:
Fixed 10-Pin MSOP.
Component Placement,
There will be some difference in layout for the 10-pin
DFN package due to the thermal pad. A typical fixed-
output DFN layout is shown below. For the DFN layout,
the VIN1 to VIN2 connection is routed on the bottom of
the board around the TC1303/TC1304 thermal pad.
5.6.3
LDO POWER DISSIPATION
EXAMPLE
Input Voltage
VIN = 5V±10%
LDO Output Voltage and Current
OUT = 3.3V
- Via
+VOUT1
AGND to PGND
V
IOUT = 300 mA
* CIN2 Optional
Internal Power Dissipation
COUT1
L1
AGND
PLDO(MAX) = (VIN(MAX) – VOUT2(MIN)) x IOUT2(MAX)
PGND
PLDO = (5.5V – 0.975 x 3.3V) x 300 mA
CIN2
P
LDO = 684.8 mW
1
2
3
4
5
10
9
PGND
+VIN2
CIN1
5.7
PCB Layout Information
8
+VOUT2
+VIN1
7
Some basic design guidelines should be used when
physically placing the TC1303/TC1304 on a Printed
Circuit Board (PCB). The TC1303/TC1304 has two
ground pins, identified as AGND (analog ground) and
PGND (power ground). By separating grounds, it is
possible to minimize the switching frequency noise on
the LDO output. The first priority, while placing external
components on the board, is the input capacitor (CIN1).
Wiring should be short and wide; the input current for
the TC1303/TC1304 can be as high as 800 mA. The
next priority would be the buck regulator output
capacitor (COUT1) and inductor (L1). All three of these
components are placed near their respective pins to
minimize trace length. The CIN1 and COUT1 capacitor
COUT2
6
TC1303B
AGND
PGND Plane
A
GND Plane
FIGURE 5-2:
Fixed 10-Pin DFN.
Component Placement,
© 2008 Microchip Technology Inc.
DS21949C-page 27
TC1303A/TC1303B/TC1303C/TC1304
5.8
Design Example
VOUT1 = 2.0V @ 500 mA
VOUT2 = 3.3V @ 300 mA
VIN = 5V±10%
L = 4.7µH
Calculate PWM mode inductor ripple current
Nominal Duty
Cycle = 2.0V/5.0V = 40%
P-channel
Switch-on time = 0.40 x 1/(2 MHz) = 200 ns
VL = (VIN-VOUT1) = 3V
∆IL = (VL/L) x TON = 128 mA
Peak inductor current:
IL(PK) = IOUT1+1/2∆IL = 564 mA
Switcher power loss:
Use efficiency estimate for 1.8V from Figure 2-8
Efficiency = 84%, PDISS1 = 190 mW
Resistor Divider:
RTOP = 200 kΩ
RBOT = 133 kΩ
LDO Output:
PDISS2 = (VIN(MAX)
–
VOUT2(MIN)) x IOUT2(MAX)
PDISS2 = (5.5V – (0.975) x 3.3V) x 300 mA
PDISS2 = 684.8 mW
Total
Dissipation = 190 mW + 685 mW = 874 mW
Junction Temp Rise and Maximum Ambient
Operating Temperature Calculations
10-Pin MSOP (4-Layer Board with internal Planes)
RθJA = 113° C/Watt
Junction Temp.
Rise = 874 mW x 113° C/Watt = 98.8°C
Max. Ambient
Temperature = 125°C - 98.8°C
Max. Ambient
Temperature = 26.3°C
10-Pin DFN
RθJA = 41° C/Watt (4-Layer Board with
internal planes and 2 vias)
Junction Temp.
Rise = 874 mW x 41° C/Watt = 35.8°C
Max. Ambient
Temperature = 125°C - 35.8°C
Max. Ambient
Temperature = 89.2°C
This is above the +85°C max. ambient temperature.
DS21949C-page 28
© 2008 Microchip Technology Inc.
TC1303A/TC1303B/TC1303C/TC1304
6.0
6.1
PACKAGING INFORMATION
Package Marking Information
10-Lead MSOP
Example:
10-Lead DFN
Example:
— 1 = TC1303B
— 2 = TC1303A
— 3 = TC1303C
— 4 = TC1304
— 1 = 1.375V VOUT1
— H = 2.6V VOUT2
— 0 = Default
XXXX
YYWW
NNN
11H0
0831
256
XXXXXX
YWWNNN
11H0E
831256
Second letter represents VOUT1 configuration:
Third letter represents VOUT2 configuration:
Code VOUT1 Code VOUT1 Code VOUT1
Code VOUT2 Code VOUT1 Code VOUT2
A
B
C
D
E
F
G
H
I
3.3V
3.2V
3.1V
3.0V
2.9V
2.8V
2.7V
2.6V
2.5V
J
K
L
2.4V
2.3V
2.2V
2.1V
2.0V
1.9V
1.8V
1.7V
1.6V
S
T
1.5V
1.4V
1.3V
1.2V
1.1V
1.0V
0.9V
Adj
A
B
C
D
E
F
G
H
I
3.3V
3.2V
3.1V
3.0V
2.9V
2.8V
2.7V
2.6V
2.5V
J
K
L
2.4V
2.3V
2.2V
2.1V
2.0V
1.9V
1.8V
1.7V
1.6V
S
T
1.5V
—
U
V
W
X
Y
Z
U
V
W
X
Y
Z
—
M
N
O
P
Q
R
M
N
O
P
Q
R
—
—
—
—
—
1
1.375V
Fourth letter represents +50 mV Increments:
Code
Code
0
1
Default
2
3
+50 mV to V2
+50 mV to V1
+50 mV to V1
and V2
Legend: XX...X Customer-specific information
Y
Year code (last digit of calendar year)
YY
WW
NNN
Year code (last 2 digits of calendar year)
Week code (week of January 1 is week ‘01’)
Alphanumeric traceability code
e
3
Pb-free JEDEC designator for Matte Tin (Sn)
*
This package is Pb-free. The Pb-free JEDEC designator (
can be found on the outer packaging for this package.
)
e3
Note: In the event the full Microchip part number cannot be marked on one line, it will
be carried over to the next line, thus limiting the number of available
characters for customer-specific information.
© 2008 Microchip Technology Inc.
DS21949C-page 29
TC1303A/TC1303B/TC1303C/TC1304
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ꢀꢁ ꢂꢃꢄꢅꢀꢅꢆꢃ !ꢇꢈꢅꢃꢄ"ꢉ#ꢅ$ꢉꢇ%!ꢊꢉꢅ&ꢇꢋꢅꢆꢇꢊꢋ'ꢅ(!%ꢅ&! %ꢅ(ꢉꢅꢈꢌꢍꢇ%ꢉ"ꢅ)ꢃ%ꢎꢃꢄꢅ%ꢎꢉꢅꢎꢇ%ꢍꢎꢉ"ꢅꢇꢊꢉꢇꢁ
ꢏꢁ ꢂꢇꢍ*ꢇꢐꢉꢅ&ꢇꢋꢅꢎꢇꢆꢉꢅꢌꢄꢉꢅꢌꢊꢅ&ꢌꢊꢉꢅꢉ#ꢑꢌ ꢉ"ꢅ%ꢃꢉꢅ(ꢇꢊ ꢅꢇ%ꢅꢉꢄ" ꢁ
+ꢁ ꢂꢇꢍ*ꢇꢐꢉꢅꢃ ꢅ ꢇ)ꢅ ꢃꢄꢐ!ꢈꢇ%ꢉ"ꢁ
ꢒꢁ ꢓꢃ&ꢉꢄ ꢃꢌꢄꢃꢄꢐꢅꢇꢄ"ꢅ%ꢌꢈꢉꢊꢇꢄꢍꢃꢄꢐꢅꢑꢉꢊꢅꢔꢕꢖ,ꢅ-ꢀꢒꢁ.ꢖꢁ
/ꢕ01 /ꢇ ꢃꢍꢅꢓꢃ&ꢉꢄ ꢃꢌꢄꢁꢅꢗꢎꢉꢌꢊꢉ%ꢃꢍꢇꢈꢈꢋꢅꢉ#ꢇꢍ%ꢅꢆꢇꢈ!ꢉꢅ ꢎꢌ)ꢄꢅ)ꢃ%ꢎꢌ!%ꢅ%ꢌꢈꢉꢊꢇꢄꢍꢉ ꢁ
ꢘ,21 ꢘꢉ$ꢉꢊꢉꢄꢍꢉꢅꢓꢃ&ꢉꢄ ꢃꢌꢄ'ꢅ! !ꢇꢈꢈꢋꢅ)ꢃ%ꢎꢌ!%ꢅ%ꢌꢈꢉꢊꢇꢄꢍꢉ'ꢅ$ꢌꢊꢅꢃꢄ$ꢌꢊ&ꢇ%ꢃꢌꢄꢅꢑ!ꢊꢑꢌ ꢉ ꢅꢌꢄꢈꢋꢁ
ꢖꢃꢍꢊꢌꢍꢎꢃꢑ ꢗꢉꢍꢎꢄꢌꢈꢌꢐꢋ ꢓꢊꢇ)ꢃꢄꢐ 0ꢚꢒꢝꢚ>+/
DS21949C-page 30
© 2008 Microchip Technology Inc.
TC1303A/TC1303B/TC1303C/TC1304
ꢀꢁꢂꢃꢄꢅꢆꢇꢈꢉꢅꢊꢋꢌꢍꢇꢎꢏꢅꢉꢇꢐꢉꢅꢋꢑꢇꢒꢓꢇꢃꢄꢅꢆꢇꢈꢅꢍꢔꢅꢕꢄꢇꢖꢗꢐꢘꢇMꢇꢙꢚꢙꢚꢁꢛꢜꢇ ꢇ!ꢓꢆ"ꢇ#ꢎꢐꢒ$
ꢒꢓꢋꢄ% 2ꢌꢊꢅ%ꢎꢉꢅ&ꢌ %ꢅꢍ!ꢊꢊꢉꢄ%ꢅꢑꢇꢍ*ꢇꢐꢉꢅ"ꢊꢇ)ꢃꢄꢐ 'ꢅꢑꢈꢉꢇ ꢉꢅ ꢉꢉꢅ%ꢎꢉꢅꢖꢃꢍꢊꢌꢍꢎꢃꢑꢅꢂꢇꢍ*ꢇꢐꢃꢄꢐꢅꢕꢑꢉꢍꢃ$ꢃꢍꢇ%ꢃꢌꢄꢅꢈꢌꢍꢇ%ꢉ"ꢅꢇ%ꢅ
ꢎ%%ꢑ133)))ꢁ&ꢃꢍꢊꢌꢍꢎꢃꢑꢁꢍꢌ&3ꢑꢇꢍ*ꢇꢐꢃꢄꢐ
© 2008 Microchip Technology Inc.
DS21949C-page 31
TC1303A/TC1303B/TC1303C/TC1304
ꢀꢁꢂꢃꢄꢅꢆꢇꢈꢉꢅꢊꢋꢌꢍꢇꢗꢌꢍ&ꢓꢇ' ꢅꢉꢉꢇ(ꢏꢋꢉꢌ)ꢄꢇꢈꢅꢍꢔꢅꢕꢄꢇꢖ*ꢒꢘꢇ#ꢗ'(ꢈ$
ꢒꢓꢋꢄ% 2ꢌꢊꢅ%ꢎꢉꢅ&ꢌ %ꢅꢍ!ꢊꢊꢉꢄ%ꢅꢑꢇꢍ*ꢇꢐꢉꢅ"ꢊꢇ)ꢃꢄꢐ 'ꢅꢑꢈꢉꢇ ꢉꢅ ꢉꢉꢅ%ꢎꢉꢅꢖꢃꢍꢊꢌꢍꢎꢃꢑꢅꢂꢇꢍ*ꢇꢐꢃꢄꢐꢅꢕꢑꢉꢍꢃ$ꢃꢍꢇ%ꢃꢌꢄꢅꢈꢌꢍꢇ%ꢉ"ꢅꢇ%ꢅ
ꢎ%%ꢑ133)))ꢁ&ꢃꢍꢊꢌꢍꢎꢃꢑꢁꢍꢌ&3ꢑꢇꢍ*ꢇꢐꢃꢄꢐ
D
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E1
NOTE 1
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A2
φ
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ꢓꢃ&ꢉꢄ ꢃꢌꢄꢅ5ꢃ&ꢃ%
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7ꢆꢉꢊꢇꢈꢈꢅ9ꢉꢃꢐꢎ%
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,
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ꢒꢓꢋꢄꢊ%
ꢀꢁ ꢂꢃꢄꢅꢀꢅꢆꢃ !ꢇꢈꢅꢃꢄ"ꢉ#ꢅ$ꢉꢇ%!ꢊꢉꢅ&ꢇꢋꢅꢆꢇꢊꢋ'ꢅ(!%ꢅ&! %ꢅ(ꢉꢅꢈꢌꢍꢇ%ꢉ"ꢅ)ꢃ%ꢎꢃꢄꢅ%ꢎꢉꢅꢎꢇ%ꢍꢎꢉ"ꢅꢇꢊꢉꢇꢁ
ꢏꢁ ꢓꢃ&ꢉꢄ ꢃꢌꢄ ꢅꢓꢅꢇꢄ"ꢅ,ꢀꢅ"ꢌꢅꢄꢌ%ꢅꢃꢄꢍꢈ!"ꢉꢅ&ꢌꢈ"ꢅ$ꢈꢇ ꢎꢅꢌꢊꢅꢑꢊꢌ%ꢊ! ꢃꢌꢄ ꢁꢅꢖꢌꢈ"ꢅ$ꢈꢇ ꢎꢅꢌꢊꢅꢑꢊꢌ%ꢊ! ꢃꢌꢄ ꢅ ꢎꢇꢈꢈꢅꢄꢌ%ꢅꢉ#ꢍꢉꢉ"ꢅꢚꢁꢀ.ꢅ&&ꢅꢑꢉꢊꢅ ꢃ"ꢉꢁ
+ꢁ ꢓꢃ&ꢉꢄ ꢃꢌꢄꢃꢄꢐꢅꢇꢄ"ꢅ%ꢌꢈꢉꢊꢇꢄꢍꢃꢄꢐꢅꢑꢉꢊꢅꢔꢕꢖ,ꢅ-ꢀꢒꢁ.ꢖꢁ
/ꢕ01 /ꢇ ꢃꢍꢅꢓꢃ&ꢉꢄ ꢃꢌꢄꢁꢅꢗꢎꢉꢌꢊꢉ%ꢃꢍꢇꢈꢈꢋꢅꢉ#ꢇꢍ%ꢅꢆꢇꢈ!ꢉꢅ ꢎꢌ)ꢄꢅ)ꢃ%ꢎꢌ!%ꢅ%ꢌꢈꢉꢊꢇꢄꢍꢉ ꢁ
ꢘ,21 ꢘꢉ$ꢉꢊꢉꢄꢍꢉꢅꢓꢃ&ꢉꢄ ꢃꢌꢄ'ꢅ! !ꢇꢈꢈꢋꢅ)ꢃ%ꢎꢌ!%ꢅ%ꢌꢈꢉꢊꢇꢄꢍꢉ'ꢅ$ꢌꢊꢅꢃꢄ$ꢌꢊ&ꢇ%ꢃꢌꢄꢅꢑ!ꢊꢑꢌ ꢉ ꢅꢌꢄꢈꢋꢁ
ꢖꢃꢍꢊꢌꢍꢎꢃꢑ ꢗꢉꢍꢎꢄꢌꢈꢌꢐꢋ ꢓꢊꢇ)ꢃꢄꢐ 0ꢚꢒꢝꢚꢏꢀ/
DS21949C-page 32
© 2008 Microchip Technology Inc.
TC1303A/1303B/1303C/1304
APPENDIX A: REVISION HISTORY
Revision C (December 2008)
The following is the list of modifications:
1. Updated Package Types diagram and
Section 3.0 “Pin Descriptions” to show the
Exposed Thermal Pad (EP) information.
2. Updated Section 6.0 “Packaging Informa-
tion”.
Revision B (July 2005)
The following is the list of modifications:
1. Added information on TC1303A, TC1303C and
TC1304 throughout data sheet.
Revision A (June 2005)
• Original Release of this Document.
© 2008 Microchip Technology Inc.
DS21949C-page 33
TC1303A/1303B/1303C/1304
NOTES:
DS21949C-page 34
© 2008 Microchip Technology Inc.
TC1303A/TC1303B/TC1303C/TC1304
PRODUCT IDENTIFICATION SYSTEM
To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office.
PART NO.
X-
X
X
X
X
XX
XX
Examples:
TC1303
Type VOUT1 VOUT2 +50 mV Temp Package Tube
a)
b)
c)
TC1303A-SI0EMF:
1.5V, 2.5V, Default,
10LD DFN pkg.
Adj, 3.3V, Default,
10LD MSOP pkg.
or
Increments
B
Range
Tape &
Reel
TC1303A-ZA0EUN:
TC1303A-PP3EMFTR: 1.8V, 1.8V, +50 mV,
10LD DFN pkg.
Device:
Options
TC1303A: PWM/LDO combo with Power-Good
TC1303B: PWM/LDO combo with Power-Good
TC1303C: PWM/LDO combo with Power-Good
TC1304: PWM/LDO combo with Power-Good
Tape and Reel
a)
TC1303B-1H0EMF:
1.375V, 2.6V, Default,
10LD DFN pkg.
3.3V, 2.7V, Default,
10LD MSOP pkg.
3.3V, 3.0V, Default,
10LD DFN pkg.
2.5V, 3.3V, Default,
10LD MSOP pkg.
2.5V, 3.3V, Default,
10LD DFN pkg.
1.8V, 2.8V, Default,
10LD MSOP pkg.
1.8V, 2.8V, Default,
10LD DFN pkg.
b)
c)
d)
e)
f)
TC1303B-AG0EUN:
TC1303B-AD0EMF:
TC1303B-IA0EUN:
TC1303B-IA0EMF:
TC1303B-PF0EUN:
TC1303B-PF0EMF:
TC1303B-PG0EUN:
Code
V
Code
V
Code
+50 mV
OUT1
OUT2
A
B
C
D
E
F
G
H
I
3.3V
3.2V
3.1V
3.0V
2.9V
2.8V
2.7V
2.6V
2.5V
2.4V
2.3V
2.2V
2.1V
2.0V
1.9V
1.8V
1.7V
1.6V
1.5V
1.4V
1.3V
1.2V
1.1V
1.0V
0.9V
Adjustable
1.375V
A
B
C
D
E
F
G
H
I
3.3V
3.2V
3.1V
3.0V
2.9V
2.8V
2.7V
2.6V
2.5V
2.4V
2.3V
2.2V
2.1V
2.0V
1.9V
1.8V
1.7V
1.6V
1.5V
0
1
2
3
Default
+50 mV to V1
+50 mV to V2
+50 mV to V1
and V2
g)
h)
i)
J
K
L
J
K
L
1.8V, 2.7V, Default,
10LD MSOP pkg.
M
N
O
P
Q
R
S
T
U
V
W
X
Y
Z
M
N
O
P
Q
R
S
T
U
V
W
X
Y
Z
TC1303B-DG0EMFTR: 3.0V, 2.7V, Default,
10LD DFN pkg.
Tape and Reel
a)
b)
TC1303C-VP0EMF:
1.2V, 1.8V, Default,
10LD DFN pkg.
TC1303C-VP0EMFTR: 1.2V, 1.8V, Default,
10LD DFN pkg.
Tape and Reel.
a)
b)
c)
d)
TC1304-VI0EMF:
TC1304-VP0EMF:
TC1304-VI0EUN:
TC1304-VI0EMFTR:
1.2V, 2.5V, Default,
10LD DFN pkg.
1.2V, 1.8V, Default,
10LD DFN pkg.
1.2V, 2.5V, Default,
10LD MSOP pkg.
1.2V, 2.5V, Default,
10LD DFN pkg.
1
1
* Contact Factory for Alternate Output Voltage and Reset Voltage
Configurations.
Tape and Reel.
e)
f)
TC1304-VP0EMFTR:
TC1304-VI0EUNTR:
1.2V, 1.8V, Default
10LD DFN pkg.
Tape and Reel.
1.2V, 2.5V, Default,
10LD MSOP pkg.
Tape and Reel.
Temperature
Range:
E
= -40°C to +85°C
Package:
MF
UN
=
Dual Flat, No Lead (3x3 mm body), 10-lead
Plastic Micro Small Outline (MSOP), 10-lead
=
Tube or
Tape and Reel: TR
Blank
=
=
Tube
Tape and Reel
© 2008 Microchip Technology Inc.
DS21949C-page 35
TC1303A/TC1303B/TC1303C/TC1304
NOTES:
DS21949C-page 36
© 2008 Microchip Technology Inc.
Note the following details of the code protection feature on Microchip devices:
•
Microchip products meet the specification contained in their particular Microchip Data Sheet.
•
Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the
intended manner and under normal conditions.
•
There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our
knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data
Sheets. Most likely, the person doing so is engaged in theft of intellectual property.
•
•
Microchip is willing to work with the customer who is concerned about the integrity of their code.
Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not
mean that we are guaranteeing the product as “unbreakable.”
Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our
products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts
allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act.
Information contained in this publication regarding device
applications and the like is provided only for your convenience
and may be superseded by updates. It is your responsibility to
ensure that your application meets with your specifications.
MICROCHIP MAKES NO REPRESENTATIONS OR
WARRANTIES OF ANY KIND WHETHER EXPRESS OR
IMPLIED, WRITTEN OR ORAL, STATUTORY OR
OTHERWISE, RELATED TO THE INFORMATION,
INCLUDING BUT NOT LIMITED TO ITS CONDITION,
QUALITY, PERFORMANCE, MERCHANTABILITY OR
FITNESS FOR PURPOSE. Microchip disclaims all liability
arising from this information and its use. Use of Microchip
devices in life support and/or safety applications is entirely at
the buyer’s risk, and the buyer agrees to defend, indemnify and
hold harmless Microchip from any and all damages, claims,
suits, or expenses resulting from such use. No licenses are
conveyed, implicitly or otherwise, under any Microchip
intellectual property rights.
Trademarks
The Microchip name and logo, the Microchip logo, Accuron,
dsPIC, KEELOQ, KEELOQ logo, MPLAB, PIC, PICmicro,
PICSTART, rfPIC, SmartShunt and UNI/O are registered
trademarks of Microchip Technology Incorporated in the
U.S.A. and other countries.
FilterLab, Linear Active Thermistor, MXDEV, MXLAB,
SEEVAL, SmartSensor and The Embedded Control Solutions
Company are registered trademarks of Microchip Technology
Incorporated in the U.S.A.
Analog-for-the-Digital Age, Application Maestro, CodeGuard,
dsPICDEM, dsPICDEM.net, dsPICworks, dsSPEAK, ECAN,
ECONOMONITOR, FanSense, In-Circuit Serial
Programming, ICSP, ICEPIC, Mindi, MiWi, MPASM, MPLAB
Certified logo, MPLIB, MPLINK, mTouch, PICkit, PICDEM,
PICDEM.net, PICtail, PIC32 logo, PowerCal, PowerInfo,
PowerMate, PowerTool, REAL ICE, rfLAB, Select Mode, Total
Endurance, WiperLock and ZENA are trademarks of
Microchip Technology Incorporated in the U.S.A. and other
countries.
SQTP is a service mark of Microchip Technology Incorporated
in the U.S.A.
All other trademarks mentioned herein are property of their
respective companies.
© 2008, Microchip Technology Incorporated, Printed in the
U.S.A., All Rights Reserved.
Printed on recycled paper.
Microchip received ISO/TS-16949:2002 certification for its worldwide
headquarters, design and wafer fabrication facilities in Chandler and
Tempe, Arizona; Gresham, Oregon and design centers in California
and India. The Company’s quality system processes and procedures
are for its PIC® MCUs and dsPIC® DSCs, KEELOQ® code hopping
devices, Serial EEPROMs, microperipherals, nonvolatile memory and
analog products. In addition, Microchip’s quality system for the design
and manufacture of development systems is ISO 9001:2000 certified.
© 2008 Microchip Technology Inc.
DS21949C-page 37
WORLDWIDE SALES AND SERVICE
AMERICAS
ASIA/PACIFIC
ASIA/PACIFIC
EUROPE
Corporate Office
Asia Pacific Office
Suites 3707-14, 37th Floor
Tower 6, The Gateway
Harbour City, Kowloon
Hong Kong
Tel: 852-2401-1200
Fax: 852-2401-3431
India - Bangalore
Tel: 91-80-4182-8400
Fax: 91-80-4182-8422
Austria - Wels
Tel: 43-7242-2244-39
Fax: 43-7242-2244-393
2355 West Chandler Blvd.
Chandler, AZ 85224-6199
Tel: 480-792-7200
Fax: 480-792-7277
Technical Support:
http://support.microchip.com
Web Address:
www.microchip.com
Denmark - Copenhagen
Tel: 45-4450-2828
Fax: 45-4485-2829
India - New Delhi
Tel: 91-11-4160-8631
Fax: 91-11-4160-8632
France - Paris
Tel: 33-1-69-53-63-20
Fax: 33-1-69-30-90-79
India - Pune
Tel: 91-20-2566-1512
Fax: 91-20-2566-1513
Australia - Sydney
Tel: 61-2-9868-6733
Fax: 61-2-9868-6755
Atlanta
Duluth, GA
Tel: 678-957-9614
Fax: 678-957-1455
Germany - Munich
Tel: 49-89-627-144-0
Fax: 49-89-627-144-44
Japan - Yokohama
Tel: 81-45-471- 6166
Fax: 81-45-471-6122
China - Beijing
Tel: 86-10-8528-2100
Fax: 86-10-8528-2104
Italy - Milan
Tel: 39-0331-742611
Fax: 39-0331-466781
Korea - Daegu
Tel: 82-53-744-4301
Fax: 82-53-744-4302
Boston
China - Chengdu
Tel: 86-28-8665-5511
Fax: 86-28-8665-7889
Westborough, MA
Tel: 774-760-0087
Fax: 774-760-0088
Netherlands - Drunen
Tel: 31-416-690399
Fax: 31-416-690340
Korea - Seoul
China - Hong Kong SAR
Tel: 852-2401-1200
Fax: 852-2401-3431
Tel: 82-2-554-7200
Fax: 82-2-558-5932 or
82-2-558-5934
Chicago
Itasca, IL
Tel: 630-285-0071
Fax: 630-285-0075
Spain - Madrid
Tel: 34-91-708-08-90
Fax: 34-91-708-08-91
China - Nanjing
Tel: 86-25-8473-2460
Fax: 86-25-8473-2470
Malaysia - Kuala Lumpur
Tel: 60-3-6201-9857
Fax: 60-3-6201-9859
Dallas
Addison, TX
Tel: 972-818-7423
Fax: 972-818-2924
UK - Wokingham
Tel: 44-118-921-5869
Fax: 44-118-921-5820
China - Qingdao
Tel: 86-532-8502-7355
Fax: 86-532-8502-7205
Malaysia - Penang
Tel: 60-4-227-8870
Fax: 60-4-227-4068
Detroit
Farmington Hills, MI
Tel: 248-538-2250
Fax: 248-538-2260
China - Shanghai
Tel: 86-21-5407-5533
Fax: 86-21-5407-5066
Philippines - Manila
Tel: 63-2-634-9065
Fax: 63-2-634-9069
Kokomo
Kokomo, IN
Tel: 765-864-8360
Fax: 765-864-8387
China - Shenyang
Tel: 86-24-2334-2829
Fax: 86-24-2334-2393
Singapore
Tel: 65-6334-8870
Fax: 65-6334-8850
China - Shenzhen
Tel: 86-755-8203-2660
Fax: 86-755-8203-1760
Taiwan - Hsin Chu
Tel: 886-3-572-9526
Fax: 886-3-572-6459
Los Angeles
Mission Viejo, CA
Tel: 949-462-9523
Fax: 949-462-9608
China - Wuhan
Tel: 86-27-5980-5300
Fax: 86-27-5980-5118
Taiwan - Kaohsiung
Tel: 886-7-536-4818
Fax: 886-7-536-4803
Santa Clara
Santa Clara, CA
Tel: 408-961-6444
Fax: 408-961-6445
China - Xiamen
Tel: 86-592-2388138
Fax: 86-592-2388130
Taiwan - Taipei
Tel: 886-2-2500-6610
Fax: 886-2-2508-0102
Toronto
Mississauga, Ontario,
Canada
Tel: 905-673-0699
Fax: 905-673-6509
China - Xian
Tel: 86-29-8833-7252
Fax: 86-29-8833-7256
Thailand - Bangkok
Tel: 66-2-694-1351
Fax: 66-2-694-1350
China - Zhuhai
Tel: 86-756-3210040
Fax: 86-756-3210049
01/02/08
DS21949C-page 38
© 2008 Microchip Technology Inc.
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