TC1313-1D1EMF_技术文档

TC1313

500 mA Synchronous Buck Regulator,

+ 300 mA LDO

Features

Description

• Dual-Output Regulator (500 mA Buck Regulator

and 300 mA Low-Dropout Regulator (LDO))

The TC1313 device combines a 500 mA synchronous

buck regulator and 300 mA Low-Dropout Regulator

(LDO) to provide a highly integrated solution for

devices that require multiple supply voltages. The

unique combination of an integrated buck switching

regulator and low-dropout linear regulator provides the

lowest system cost for dual-output voltage applications

that require one lower processor core voltage and one

higher bias voltage.

• Total Device Quiescent Current = 57 µA (Typical)

• Independent Shutdown for Buck and LDO

Outputs

• Both Outputs Internally Compensated

• Synchronous Buck Regulator:

- Over 90% Typical Efficiency

- 2.0 MHz Fixed-Frequency PWM

(Heavy Load)

The 500 mA synchronous buck regulator switches at a

fixed frequency of 2.0 MHz when the load is heavy,

providing a low-noise, small-size solution. When the

load on the buck output is reduced to light levels, it

changes operation to a Pulse Frequency Modulation

(PFM) mode to minimize quiescent current draw from

the battery. No intervention is necessary for smooth

transition from one mode to another.

- Low Output Noise

- Automatic PWM-to-PFM mode transition

- Adjustable (0.8V to 4.5V) and Standard

Fixed-Output Voltages (0.8V, 1.2V, 1.5V,

1.8V, 2.5V, 3.3V)

• Low-Dropout Regulator:

The LDO provides a 300 mA auxiliary output that

requires a single 1 µF ceramic output capacitor,

minimizing board area and cost. The typical dropout

voltage for the LDO output is 137 mV for a 200 mA

load.

- Low-Dropout Voltage = 137 mV Typical @

200 mA

- Standard Fixed-Output Voltages

(1.5V, 1.8V, 2.5V, 3.3V)

• Small 10-pin 3x3 DFN or MSOP Package Options

• Operating Junction Temperature Range:

- -40°C to +125°C

The TC1313 device is available in either the 10-pin DFN

or MSOP package.

Additional protection features include: UVLO,

overtemperature and overcurrent protection on both

outputs.

• Undervoltage Lockout (UVLO)

• Output Short Circuit Protection

• Overtemperature Protection

For a complete listing of TC1313 standard parts,

consult your Microchip representative.

Applications

Package Type

• Cellular Phones

10-Lead DFN *

• Portable Computers

• USB-Powered Devices

• Handheld Medical Instruments

• Organizers and PDAs

SHDN2

P

L

1

2

10

9

GND

V

IN2

X

EP

11

V

IN1

3

4

5

8

OUT2

NC

SHDN1

7

6

V

/V

A

FB1 OUT1

GND

10-Lead MSOP

P

10

SHDN2

1

2

3

4

5

GND

V

9

L

IN2

X

V

8

IN1

OUT2

7

SHDN1

NC

V

/V

A

6

FB1 OUT1

GND

* Includes Exposed Thermal Pad (EP); see Table 3-1.

DS21974B-page 1

TC1313

Functional Block Diagram

Undervoltage Lockout

(UVLO)

UVLO

V_REF

Synchronous Buck Regulator

V_IN1

PDRV

V_IN2

L_X

Driver

Control

SHDN1

NDRV

P_GND

A_GND

V_OUT1/V_FB1

V_REF

UVLO

V_OUT2

LDO

SHDN2

A_GND

DS21974B-page 2

TC1313

Typical Application Circuits

TC1313

Fixed-Output Application

10-Lead MSOP

4.7 µH

V_IN

V_IN1

V_OUT1

1.5V @ 500 mA

L_X

P_GND

V_OUT1

V_OUT2

A_GND

8

2

7

1

4

9

10

6

2.7V to 4.2V

4.7 µF

V_IN2

SHDN1

SHDN2

NC

V_OUT2

2.5V @ 300 mA

3

1 µF

5

TC1313

Adjustable-Output Application

10-Lead DFN

4.7 µH

V_OUT1

V

L

IN1

X

Input

8

2

7

9

10

6

Voltage

2.1V @

500 mA

P

4.7 µF

V

GND

IN2

4.7 µF

4.5V to 5.5V

200 kΩ

4.99 kΩ

EP

11

V

OUT1

SHDN1

V_OUT2

*Optional

Capacitor

33 pF

V

A

OUT2

SHDN2

NC

1.0 µF

3

5

1

4

3.3V @

300 mA

121 kΩ

V_IN2

1 µF

GND

Note

Note: Connect DFN package exposed pad to A_GND

.

DS21974B-page 3

TC1313

NOTES:

DS21974B-page 4

TC1313

† Notice: Stresses above those listed under “Maximum

Ratings” may cause permanent damage to the device. This is

a stress rating only and functional operation of the device at

those or any other conditions above those indicated in the

operational listings of this specification is not implied.

Exposure to maximum rating conditions for extended periods

may affect device reliability.

1.0

ELECTRICAL

CHARACTERISTICS

Absolute Maximum Ratings †

V

_IN- A_GND......................................................................6.0V

All Other I/O ...............................(A_GND- 0.3V) to (V_IN+ 0.3V)

L_Xto P_GND...............................................-0.3V to (V_IN+ 0.3V)

P

_GNDto A_GND..................................................-0.3V to +0.3V

Output Short Circuit Current ................................Continuous

Power Dissipation (Note 7)..........................Internally Limited

Storage temperature .....................................-65°C to +150°C

Ambient Temp. with Power Applied ................-40°C to +85°C

Operating Junction Temperature...................-40°C to +125°C

ESD protection on all pins (HBM) ....................................... 3 kV

DC CHARACTERISTICS

Electrical Characteristics: V_IN1= V_IN2= SHDN1,2 = 3.6V, C_OUT1= C_IN= 4.7 µF, C_OUT2= 1µF, L = 4.7 µH, V_OUT1(ADJ) = 1.8V,

_OUT1= 100 ma, I_OUT2= 0.1 mA T_A= +25°C. Boldface specifications apply over the T_Arange of -40°C to +85°C.

I

Parameters

Sym

Min

Typ

Max

Units

Conditions

Input/Output Characteristics

Input Voltage

V_IN

2.7

500

300

—

5.5

—

1

V

Note 1, Note 2, Note 8

Note 1

Maximum Output Current

I_{OUT1_MAX}

I_{OUT2_MAX}

I_{IN_SHDN}

mA

µA

—

Note 1

Shutdown Current

0.05

SHDN1 = SHDN2 = GND

Combined V_IN1and V_IN2Current

Operating I_Q

I_Q

—

57

100

µA

SHDN1 = SHDN2 = V_IN2

I_OUT1= 0 mA, I_OUT2= 0 mA

Synchronous Buck I_Q

LDO I_Q

—

38

44

—

µA

SHDN1 = V_IN, SHDN2 = GND

SHDN1 = GND, SHDN2 = V_IN2

Shutdown/UVLO/Thermal Shutdown Characteristics

SHDN1,SHDN2,

Logic Input Voltage Low

V_IL

V_IH

I_IN

—

15

—

%V_IN

µA

V_IN1= V_IN2= 2.7V to 5.5V

SHDN1,SHDN2,

Logic Input Voltage High

45

SHDN1,SHDN2,

Input Leakage Current

-1.0

±0.01

1.0

V_IN1= V_IN2= 2.7V to 5.5V

SHDNX = GND

SHDNY = V_IN

Thermal Shutdown

T_SHD

T_SHD-HYS

UVLO

—

165

10

—

°C

V

Note 6, Note 7

Thermal Shutdown Hysteresis

Undervoltage Lockout

2.4

2.55

2.7

V_IN1Falling

(V_OUT1and V_OUT2

)

Undervoltage Lockout Hysteresis UVLO-_HYS

—

200

—

mV

Note 1: The Minimum V_INhas to meet two conditions: V_IN≥ 2.7V and V_IN≥ V_RX+ V_DROPOUT,V_RX= V_R1or V_R2

2: _RXis the regulator output voltage setting.

3: TCV_OUT2= ((V_OUT2max– V_OUT2min) * 10⁶)/(V_OUT2* D_T).

.

V

4: Regulation is measured at a constant junction temperature using low duty cycle pulse testing. Load regulation is tested

over a load range from 0.1 mA to the maximum specified output current.

5: Dropout voltage is defined as the input-to-output voltage differential at which the output voltage drops 2% below its

nominal value measured at a 1V differential.

6: The maximum allowable power dissipation is a function of ambient temperature, the maximum allowable junction

temperature and the thermal resistance from junction to air. (i.e. T_A, T_J, θ_JA). Exceeding the maximum allowable power

dissipation causes the device to initiate thermal shutdown.

7: The integrated MOSFET switches have an integral diode from the L_Xpin to V_IN, and from L_Xto P_GND. In cases where

these diodes are forward-biased, the package power dissipation limits must be adhered to. Thermal protection is not

able to limit the junction temperature for these cases.

8:

V_IN1and V_IN2are supplied by the same input source.

DS21974B-page 5

TC1313

DC CHARACTERISTICS (CONTINUED)

Electrical Characteristics: V_IN1= V_IN2= SHDN1,2 = 3.6V, C_OUT1= C_IN= 4.7 µF, C_OUT2= 1µF, L = 4.7 µH, V_OUT1(ADJ) = 1.8V,

I

_OUT1= 100 ma, I_OUT2= 0.1 mA T_A= +25°C. Boldface specifications apply over the T_Arange of -40°C to +85°C.

Parameters

Sym

)

Min

Typ

Max

Units

Conditions

Synchronous Buck Regulator (V_OUT1

Adjustable Output Voltage Range

Adjustable Reference Feedback

V_OUT1

V_FB1

0.8

—

4.5

V

0.78

0.8

0.82

Voltage (V_FB1

Feedback Input Bias Current

(I_FB1

Output Voltage Tolerance Fixed

(V_OUT1

Line Regulation (V_OUT1

)

I_VFB1

—

-2.5

—

-1.5

±0.3

0.2

—

+2.5

—

nA

%

)

V_OUT1

Note 2

)

V_LINE-REG

V_LOAD-REG

V_IN– V_OUT1

%/V

%

V_IN= V_R+1V to 5.5V,

_LOAD= 100 mA

I

Load Regulation (V_OUT1

Dropout Voltage V_OUT1

)

—

0.2

—

V_IN= V_R+ 1.5V, I_LOAD= 100 mA to

500 mA (Note 1)

—

280

—

mV

I_OUT1= 500 mA, V_OUT1= 3.3V

(Note 5)

Internal Oscillator Frequency

Start Up Time

F_OSC

T_SS

1.6

—

2.0

0.5

2.4

—

MHz

ms

T_R= 10% to 90%

I_P= 100 mA

R_DSonP-Channel

R_DSon-P

R_DSon-N

I_LX

—

450

±0.01

—

mΩ

μA

R_DSonN-Channel

—

I_N= 100 mA

L_XPin Leakage Current

-1.0

1.0

SHDN = 0V, V_IN= 5.5V, L_X= 0V,

L

_X= 5.5V

Positive Current Limit Threshold

+I_LX(MAX)

—

700

—

mA

%

LDO Output (V_OUT2

)

Output Voltage Tolerance (V_OUT2

Temperature Coefficient

Line Regulation

)

V_OUT2

-2.5

—

±0.3

25

+2.5

—

Note 2

TCV_OUT

ppm/°C Note 3

ΔV_OUT2

ΔV_IN

/

-0.2

±0.02

+0.2

%/V

(V_R+1V) ≤ V_IN≤ 5.5V

Load Regulation, V_OUT2≥ 2.5V

Load Regulation, V_OUT2< 2.5V

Dropout Voltage V_OUT2> 2.5V

ΔV_OUT2

I_OUT2

-0.75

-0.90

0.1

+0.75

+0.90

%

I_OUT2= 0.1 mA to 300 mA (Note 4)

I_OUT2= 200 mA (Note 5)

ΔV_OUT2

%

I_OUT2

V_IN– V_OUT2

—

137

205

62

300

500

—

mV

I

_OUT2= 300 mA

Power Supply Rejection Ratio

Output Noise

PSRR

eN

dB

f = 100 Hz, I_OUT1= I_OUT2= 50 mA,

C_IN= 0 µF

½

—

1.8

—

µV/(Hz)

f = 1 kHz, I_OUT2= 50 mA,

SHDN1 = GND

Note 1: The Minimum V_INhas to meet two conditions: V_IN≥ 2.7V and V_IN≥ V_RX+ V_DROPOUT,V_RX= V_R1or V_R2

2: _RXis the regulator output voltage setting.

3: TCV_OUT2= ((V_OUT2max– V_OUT2min) * 10⁶)/(V_OUT2* D_T).

.

V

4: Regulation is measured at a constant junction temperature using low duty cycle pulse testing. Load regulation is tested

over a load range from 0.1 mA to the maximum specified output current.

5: Dropout voltage is defined as the input-to-output voltage differential at which the output voltage drops 2% below its

nominal value measured at a 1V differential.

6: The maximum allowable power dissipation is a function of ambient temperature, the maximum allowable junction

temperature and the thermal resistance from junction to air. (i.e. T_A, T_J, θ_JA). Exceeding the maximum allowable power

dissipation causes the device to initiate thermal shutdown.

7: The integrated MOSFET switches have an integral diode from the L_Xpin to V_IN, and from L_Xto P_GND. In cases where

these diodes are forward-biased, the package power dissipation limits must be adhered to. Thermal protection is not

able to limit the junction temperature for these cases.

8:

V_IN1and V_IN2are supplied by the same input source.

DS21974B-page 6

TC1313

DC CHARACTERISTICS (CONTINUED)

Electrical Characteristics: V_IN1= V_IN2= SHDN1,2 = 3.6V, C_OUT1= C_IN= 4.7 µF, C_OUT2= 1µF, L = 4.7 µH, V_OUT1(ADJ) = 1.8V,

_OUT1= 100 ma, I_OUT2= 0.1 mA T_A= +25°C. Boldface specifications apply over the T_Arange of -40°C to +85°C.

I

Parameters

Sym

Min

Typ

Max

Units

Conditions

R_LOAD2≤ 1Ω

Output Short Circuit Current

(Average)

I_OUTsc2

—

240

—

mA

Wake-Up Time

(From SHDN2 mode), (V_OUT2

t_WK

t_S

—

31

100

—

µs

I_OUT1= I_OUT2= 50 mA

)

Settling Time

(From SHDN2 mode), (V_OUT2

100

Note 1: The Minimum V_INhas to meet two conditions: V_IN≥ 2.7V and V_IN≥ V_RX+ V_DROPOUT,V_RX= V_R1or V_R2

2: _RXis the regulator output voltage setting.

3: TCV_OUT2= ((V_OUT2max– V_OUT2min) * 10⁶)/(V_OUT2* D_T).

.

V

4: Regulation is measured at a constant junction temperature using low duty cycle pulse testing. Load regulation is tested

over a load range from 0.1 mA to the maximum specified output current.

5: Dropout voltage is defined as the input-to-output voltage differential at which the output voltage drops 2% below its

nominal value measured at a 1V differential.

6: The maximum allowable power dissipation is a function of ambient temperature, the maximum allowable junction

temperature and the thermal resistance from junction to air. (i.e. T_A, T_J, θ_JA). Exceeding the maximum allowable power

dissipation causes the device to initiate thermal shutdown.

7: The integrated MOSFET switches have an integral diode from the L_Xpin to V_IN, and from L_Xto P_GND. In cases where

these diodes are forward-biased, the package power dissipation limits must be adhered to. Thermal protection is not

able to limit the junction temperature for these cases.

8:

V_IN1and V_IN2are supplied by the same input source.

TEMPERATURE SPECIFICATIONS

Electrical Specifications: Unless otherwise indicated, all limits are specified for: V_IN= +2.7V to +5.5V

Parameters

Temperature Ranges

Sym

Min

Typ

Max

Units

Conditions

Operating Junction Temperature Range

Storage Temperature Range

T_J

T_A

T_J

-40

-65

—

+125

+150

°C

Steady state

Transient

Maximum Junction Temperature

Thermal Package Resistances

Thermal Resistance, 10L-DFN

θ_JA

—

41

—

°C/W Typical 4-layer board with Internal

Ground Plane and 2 Vias in Thermal

Pad

Thermal Resistance, 10L-MSOP

θ_JA

113

°C/W Typical 4-layer board with Internal

Ground Plane

DS21974B-page 7

TC1313

2.0

TYPICAL PERFORMANCE CURVES

Note:

The graphs and tables provided following this note are a statistical summary based on a limited number of

samples and are provided for informational purposes only. The performance characteristics listed herein

are not tested or guaranteed. In some graphs or tables, the data presented may be outside the specified

operating range (e.g., outside specified power supply range) and therefore outside the warranted range.

Note: Unless otherwise indicated, V_IN1= V_IN2= SHDN1,2 = 3.6V, C_OUT1= C_IN= 4.7 µF, C_OUT2= 1 µF, L = 4.7 µH,

_OUT1(ADJ) = 1.8V, T_A= +25°C. Boldface specifications apply over the T_Arange of -40°C to +85°C. T_A= +25°C. Adjustable or fixed-

output voltage options can be used to generate the Typical Performance Characteristics.

V

66

64

62

60

58

56

54

52

100

95

90

85

80

75

70

65

60

55

50

SHDN1 = V_IN2

SHDN2 = V_IN2

SHDN1 = V_IN2

SHDN2 = A_GND

I_OUT1= 100 mA

V_IN= 5.5V

I_OUT1= 250 mA

I_OUT1= 500 mA

V_IN= 4.2V

V_IN= 3.6V

-40 -25 -10

5

20 35 50 65 80 95 110 125

2.7 3.05 3.4 3.75 4.1 4.45 4.8 5.15 5.5

Input Voltage (V)

Ambient Temperature (°C)

FIGURE 2-1:

I Switcher and LDO

FIGURE 2-4:

V

Output Efficiency vs.

OUT1

Q

Current vs. Ambient Temperature.

Input Voltage (V

= 1.2V).

OUT1

40

100

95

90

85

80

SHDN1 = V_IN2

SHDN2 = A_GND

SHDN1 = V_IN2

SHDN2 = A_GND

V_IN= 5.5V

38

36

34

32

30

V_IN= 4.2V

V_IN1= 3.6V

V_IN= 3.6V

V_IN1= 4.2V

75

V_IN1= 3.0V

70

0.005

0.104

0.203

0.302

0.401

0.5

-40 -25 -10

5

20 35 50 65 80 95 110 125

I_OUT1(A)

Ambient Temperature (°C)

FIGURE 2-2:

Ambient Temperature.

I Switcher Current vs.

FIGURE 2-5:

(V

V

Output Efficiency vs.

OUT1

Q

I

= 1.2V).

OUT1

100

95

90

85

80

75

70

65

60

50

SHDN1 = V_IN2

SHDN2 = A_GND

SHDN1 = A_GND

SHDN2 = V_IN2

48

I_OUT1= 100 mA

I_OUT1= 250 mA

V_IN= 5.5V

46

44

42

V_IN= 4.2V

I_OUT1= 500 mA

V_IN= 3.6V

40

38

36

-40 -25 -10

5

20 35 50 65 80 95 110 125

2.7 3.05 3.4 3.75 4.1 4.45 4.8 5.15 5.5

Input Voltage (V)

Ambient Temperature (°C)

FIGURE 2-3:

I LDO Current vs. Ambient

FIGURE 2-6:

V

Output Efficiency vs.

OUT1

Q

Temperature.

Input Voltage (V

= 1.8V).

OUT1

DS21974B-page 8

TC1313

Note: Unless otherwise indicated, V_IN1= V_IN2= SHDN1,2 = 3.6V, C_OUT1= C_IN= 4.7 µF, C_OUT2= 1 µF, L = 4.7 µH,

_OUT1(ADJ) = 1.8V, T_A= +25°C. Boldface specifications apply over the T_Arange of -40°C to +85°C. T_A= +25°C. Adjustable or fixed-

output voltage options can be used to generate the Typical Performance Characteristics.

V

1.21

1.206

1.202

1.198

1.194

1.19

100

95

90

85

80

75

SHDN1 = V_IN2

SHDN2 = A_GND

SHDN1 = V_IN2

SHDN2 = A_GND

V_IN= 3.0V

V_IN1= 3.6V

V_IN= 4.2V

V_IN= 3.6V

0.005

0.104

0.203

0.302

0.401

0.5

0.005

0.104

0.203

0.302

0.401

0.5

I

_OUT1(A)

I

_OUT1(A)

FIGURE 2-7:

(V

V

Output Efficiency vs.

FIGURE 2-10:

(V = 1.2V).

V

vs. I

OUT1 OUT1

OUT1

I

= 1.8V).

OUT1

100

96

92

88

84

80

1.82

SHDN1 = V_IN2

SHDN2 = A_GND

SHDN1 = V_IN2

SHDN2 = A_GND

V_IN1= 3.6V

I_OUT1= 100 mA

1.815

1.81

1.805

1.8

I_OUT1= 250 mA

I_OUT1= 500 mA

1.795

1.79

0.005

0.203

0.401

0.5

3.60

3.92

4.23

4.55

4.87

5.18

5.50

I_OUT1(A)

Input Voltage (V)

FIGURE 2-8:

Input Voltage (V

V

Output Efficiency vs.

FIGURE 2-11:

(V = 1.8V).

V

vs. I

OUT1 OUT1

OUT1

= 3.3V).

OUT1

V_IN1= 3.6V

100

95

90

85

80

75

70

65

60

3.4

SHDN1 = V_IN2

SHDN2 = A_GND

3.36

3.32

3.28

3.24

3.2

V_IN1= 4.2V

SHDN1 = V_IN2

SHDN2 = A_GND

V_IN1= 5.5V

0.005

0.104

0.203

0.302

0.401

0.5

0.005

0.203

I_OUT1(A)

0.401

0.5

I_OUT1(A)

FIGURE 2-9:

(V

V

Output Efficiency vs.

FIGURE 2-12:

(V = 3.3V).

V

vs. I

OUT1 OUT1

OUT1

I

= 3.3V).

OUT1

DS21974B-page 9

TC1313

Note: Unless otherwise indicated, V_IN1= V_IN2= SHDN1,2 = 3.6V, C_OUT1= C_IN= 4.7 µF, C_OUT2= 1 µF, L = 4.7 µH,

V

_OUT1(ADJ) = 1.8V, T_A= +25°C. Boldface specifications apply over the T_Arange of -40°C to +85°C. T_A= +25°C. Adjustable or fixed-

output voltage options can be used to generate the Typical Performance Characteristics.

0.65

0.60

0.55

0.50

0.45

0.40

2.20

2.15

2.10

2.05

2.00

1.95

1.90

SHDN1 = V_IN2

SHDN2 = A_GND

SHDN1 = V_IN2

SHDN2 = A_GND

V_IN1= 3.6V

P-Channel

N-Channel

2.7

3.1

3.5

3.9

4.3

4.7

5.1

5.5

3.3 3.5 3.7 3.9 4.1 4.3 4.5 4.7 4.9 5.1 5.3 5.5

Input Voltage (V)

FIGURE 2-13:

V

Switching Frequency

FIGURE 2-16:

V

Switch Resistance

OUT1

vs. Input Voltage.

0.70

2.00

1.98

1.96

1.94

1.92

1.90

SHDN1 = V_IN2

SHDN2 = A_GND

V_IN1= 3.6V

0.65

0.60

0.55

0.50

0.45

P-Channel

N-Channel

SHDN1 = V_IN2

SHDN2 = A_GND

0.40

-40 -25 -10

5

20 35 50 65 80 95 110 125

Ambient Temperature (°C)

FIGURE 2-14:

V

Switching Frequency

FIGURE 2-17:

V

Switch Resistance

OUT1

vs. Ambient Temperature.

0.820

0.4

SHDN1 = V_IN2

SHDN2 = A_GND

SHDN1 = V_IN2

SHDN2 = A_GND

0.35

0.815

V_IN1= 3.6V

0.810

0.805

0.800

0.795

0.790

0.3

0.25

0.2

V_OUT1= 3.3V

I_OUT1= 500 mA

0.15

0.1

Ambient Temperature (°C)

FIGURE 2-15:

V

Adjustable Feedback

FIGURE 2-18:

V

Dropout Voltage vs.

OUT1

Voltage vs. Ambient Temperature.

Ambient Temperature.

DS21974B-page 10

TC1313

Note: Unless otherwise indicated, V_IN1= V_IN2= SHDN1,2 = 3.6V, C_OUT1= C_IN= 4.7 µF, C_OUT2= 1 µF, L = 4.7 µH,

_OUT1(ADJ) = 1.8V, T_A= +25°C. Boldface specifications apply over the T_Arange of -40°C to +85°C. T_A= +25°C. Adjustable or fixed-

V

output voltage options can be used to generate the Typical Performance Characteristics.

1.802

I_OUT2= 150 mA

SHDN1 = A_GND

SHDN2 = V_IN2

1.800

1.798

1.796

1.794

1.792

T_A= + 85°C

T_A= + 25°C

T_A= - 40°C

2.7 3.05 3.4 3.75 4.1 4.45 4.8 5.15 5.5

Input Voltage (V)

FIGURE 2-19:

V

and V

Heavy

FIGURE 2-22:

V

Output Voltage vs.

OUT2

OUT1

OUT2

Load Switching Waveforms vs. Time.

Input Voltage (V

= 1.8V).

OUT2

2.508

SHDN1 = A_GND

SHDN2 = V_IN2

I_OUT2= 150 mA

2.506

2.504

2.502

2.500

2.498

2.496

T_A= + 85°C

T_A= + 25°C

T_A= - 40°C

3.3 3.5 3.7 3.9 4.1 4.3 4.5 4.7 4.9 5.1 5.3 5.5

Input Voltage (V)

FIGURE 2-20:

V

and V

Light

FIGURE 2-23:

V

Output Voltage vs.

OUT2

OUT1

OUT2

Load Switching Waveforms vs. Time.

Input Voltage (V

= 2.5V).

OUT2

I_OUT2= 150 mA

1.492

3.298

SHDN1 = A_GND

SHDN2 = V_IN2

I_OUT2= 150 mA

T_A= + 85°C

1.49

3.297

3.296

3.295

3.294

3.293

3.292

T_A= + 85°C

1.488

T_A= + 25°C

SHDN1 = A_GND

SHDN2 = V_IN2

T_A= + 25°C

T_A= - 40°C

1.486

1.484

1.482

T_A= - 40°C

2.7 3.05 3.4 3.75 4.1 4.45 4.8 5.15 5.5

Input Voltage (V)

3.60

3.92

4.23

4.55

4.87

5.18

5.50

Input Voltage (V)

FIGURE 2-21:

V

Output Voltage vs.

FIGURE 2-24:

V

Output Voltage vs.

OUT2

Input Voltage (V

= 1.5V).

Input Voltage (V

= 3.3V).

OUT2

DS21974B-page 11

TC1313

Note: Unless otherwise indicated, V_IN1= V_IN2= SHDN1,2 = 3.6V, C_OUT1= C_IN= 4.7 µF, C_OUT2= 1 µF, L = 4.7 µH,

V

_OUT1(ADJ) = 1.8V, T_A= +25°C. Boldface specifications apply over the T_Arange of -40°C to +85°C. T_A= +25°C. Adjustable or fixed-

output voltage options can be used to generate the Typical Performance Characteristics.

0.1

0.0

0.30

0.25

0.20

0.15

0.10

0.05

V_IN2= 3.6V

SHDN1 = A_GND

SHDN2 = V_IN2

SHDN1 = A_GND

SHDN2 = V_IN2

V_OUT2= 3.3V

I_OUT2= 300 mA

I_OUT2= 200 mA

-0.1

-0.2

-0.3

-0.4

V_OUT2= 2.6V

V_OUT2= 1.5V

Ambient Temperature (°C)

FIGURE 2-25:

V

Dropout Voltage vs.

FIGURE 2-28:

V

Load Regulation vs.

OUT2

Ambient Temperature (V

= 2.5V).

Ambient Temperature.

OUT2

0.3

0

SHDN1 = A_GND

SHDN2 = V_IN2

SHDN1 = GND

-10

V

_OUT2= 1.5V

C_OUT2= 1.0 µF

I

_OUT2= 30 mA

-20

-30

-40

-50

-60

-70

-80

C_IN= 0 µF

0.2

0.1

0.0

I_OUT2= 300 mA

C_OUT2= 4.7 µF

I_OUT2= 200 mA

0.01

0.1

1

10

100

1000

-40 -25 -10

5

20 35 50 65 80 95 110 125

Frequency (kHz)

Ambient Temperature (°C)

FIGURE 2-26:

Ambient Temperature (V

V

Dropout Voltage vs.

FIGURE 2-29:

Rejection vs. Frequency.

V

Power Supply Ripple

OUT2

= 3.3V).

SHDN1 = A_GND

SHDN2 = V_IN2

10

0.005

0.000

SHDN1 = A_GND

SHDN2 = V_IN2

V_OUT2= 3.3V

-0.005

-0.010

-0.015

-0.020

-0.025

-0.030

-0.035

I_OUT2= 100 µA

1

V_OUT2= 2.5V

0.1

V_IN= 3.6V

V_OUT2= 1.5V

V_OUT2= 2.5V

I

_OUT2= 50 mA

0.01

-40 -25 -10

5

20 35 50 65 80 95 110 125

0.1

1

10

100

1000 10000

Ambient Temperature (°C)

Frequency (kHz)

FIGURE 2-27:

V

Line Regulation vs.

FIGURE 2-30:

V

Noise vs. Frequency.

OUT2

Ambient Temperature.

DS21974B-page 12

TC1313

Note: Unless otherwise indicated, V_IN1= V_IN2= SHDN1,2 = 3.6V, C_OUT1= C_IN= 4.7 µF, C_OUT2= 1 µF, L = 4.7 µH,

_OUT1(ADJ) = 1.8V, T_A= +25°C. Boldface specifications apply over the T_Arange of -40°C to +85°C. T_A= +25°C. Adjustable or fixed-

output voltage options can be used to generate the Typical Performance Characteristics.

V

FIGURE 2-31:

vs. Time.

V

Load Step Response

FIGURE 2-34:

Waveforms.

V

and V Startup

OUT2

OUT1

OUT2

OUT1

FIGURE 2-32:

vs. Time.

Load Step Response

FIGURE 2-35:

Waveforms.

V

and V

Shutdown

OUT2

OUT1

FIGURE 2-33:

and V

Line Step

OUT2

Response vs. Time.

DS21974B-page 13

TC1313

NOTES:

DS21974B-page 14

TC1313

3.0

PIN DESCRIPTIONS

The descriptions of the pins are listed in Table 3-1.

TABLE 3-1:

PIN FUNCTION TABLE

DFN

MSOP

Function

1

2

3

4

5

SHDN2

V_IN2

SHDN2

V_IN2

Active Low Shutdown Input for LDO Output Pin

Analog Input Supply Voltage Pin

LDO Output Voltage Pin

V_OUT2

NC

V_OUT2

NC

No Connect

A_GND

Analog Ground Pin

6

V_FB/ V_OUT1

V_FB/ V_OUT1Buck Feedback Voltage (Adjustable Version)/Buck Output Voltage (Fixed

Version) Pin

7

8

SHDN1

V_IN1

L_X

SHDN1

V_IN1

L_X

Active Low Shutdown Input for Buck Regulator Output Pin

Buck Regulator Input Voltage Pin

9

Buck Inductor Output Pin

10

11

P_GND

EP

P_GND

—

Power Ground Pin

Exposed Pad. It is a thermal path to remove heat from the device. Electri-

cally, this pad is at ground potential and should be connected to A_GND

.

3.1

LDO Shutdown Input Pin (SHDN2)

3.7

Buck Regulator Shutdown Input

Pin (SHDN1)

SHDN2 is a logic-level input used to turn the LDO

regulator on and off. A logic-high (> 45% of V_IN) will

enable the regulator output. A logic-low (< 15% of V_IN)

will ensure that the output is turned off.

SHDN1 is a logic-level input used to turn the buck

regulator on and off. A logic-high (> 45% of V_IN) will

enable the regulator output. A logic-low (< 15% of V_IN)

will ensure that the output is turned off.

3.2

LDO Input Voltage Pin (V_IN2)

3.8

Buck Regulator Input Voltage Pin

(V_IN1

V_IN2is a LDO power-input supply pin. Connect

variable-input voltage source to V_IN2. Connect V_IN1and

V_IN2together with board traces as short as possible.

V_IN2provides the input voltage for the LDO regulator.

An additional capacitor can be added to lower the LDO

regulator input ripple voltage.

)

V_IN1is the buck regulator power-input supply pin.

Connect a variable-input voltage source to V_IN1

Connect V_IN1and V_IN2together with board traces as

short as possible.

.

3.3

LDO Output Voltage Pin (V_OUT2)

3.9

Buck Inductor Output Pin (L_X)

V_OUT2is a regulated LDO output voltage pin. Connect

a 1 µF or larger capacitor to V_OUT2and A_GNDfor proper

operation.

Connect L_Xdirectly to the buck inductor. This pin

carries large signal-level current; all connections

should be made as short as possible.

3.4

No Connect Pin (NC)

3.10 Power Ground Pin (P_GND

)

No connection.

Connect all large-signal level ground returns to P_GND

.

These large-signal level ground traces should have a

small loop area and length to prevent coupling of

switching noise to sensitive traces. Please see the

physical layout information supplied in Section 5.0

3.5

Analog Ground Pin (A_GND)

A_GNDis the analog ground connection. Tie A_GNDto the

analog portion of the ground plane (A_GND). See the

physical layout information in Section 5.0 “Application

Circuits/Issues” for grounding recommendations.

“Application

Circuits/Issues” for

grounding

recommendations.

3.6

Buck Regulator Output Sense Pin

(V_FB/V_OUT1

3.11 Exposed Pad (EP)

)

For the DFN package, connect the EP to A_GNDwith

vias into the A_GNDplane.

For V_OUT1adjustable-output voltage options, connect

the center of the output voltage divider to the V_FBpin.

For fixed-output voltage options, connect the output of

the buck regulator to this pin (V_OUT1).

DS21974B-page 15

TC1313

NOTES:

DS21974B-page 16

TC1313

4.2.1

FIXED-FREQUENCY PWM MODE

4.0

4.1

DETAILED DESCRIPTION

Device Overview

While operating in Pulse Width Modulation (PWM)

mode, the TC1313 buck regulator switches at a fixed

2.0 MHz frequency. The PWM mode is suited for higher

load current operation, maintaining low output noise

and high conversion efficiency. PFM to PWM mode

transition is initiated for any of the following conditions.

The TC1313 combines a 500 mA synchronous buck

regulator with a 300 mA LDO. This unique combination

provides a small, low-cost solution for applications that

require two or more voltage rails. The buck regulator

can deliver high-output current over a wide range of

input-to-output voltage ratios while maintaining high

efficiency. This is typically used for the lower-voltage,

higher-current processor core. The LDO is a minimal

parts-count solution (single-output capacitor), providing

a regulated voltage for an auxiliary rail. The typical LDO

dropout voltage (137 mV @ 200 mA) allows the use of

very low input-to-output LDO differential voltages,

minimizing the power loss internal to the LDO pass

transistor. Integrated features include independent

• Continuous inductor current is sensed

• Inductor peak current exceeds 100 mA

• The buck regulator output voltage has dropped

out of regulation (step load has occurred)

The typical PFM-to-PWM threshold is 80 mA.

4.2.2

PFM MODE

PFM mode is entered when the output load on the buck

regulator is very light. Once detected, the converter

enters the PFM mode automatically and begins to skip

pulses to minimize unnecessary quiescent current

draw by reducing the number of switching cycles per

second. The typical quiescent current for the switching

regulator is less than 38 µA. The transition from PWM

to PFM mode occurs when discontinuous inductor

current is sensed, or the peak inductor current is less

than 60 mA (typ.). The typical PWM to PFM mode

threshold is 30 mA. For low input-to-output differential

voltages, the PWM to PFM mode threshold can be low

due to the lack of ripple current. It is recommended that

V_IN1be one volt greater than V_OUT1for PWM to PFM

transitions.

shutdown

overtemperature shutdown.

inputs,

UVLO,

overcurrent

and

4.2

Synchronous Buck Regulator

The synchronous buck regulator is capable of supply-

ing a 500 mA continuous output current over a wide

range of input and output voltages. The output voltage

range is from 0.8V (min) to 4.5V (max). The regulator

operates in three different modes and automatically

selects the most efficient mode of operation. During

heavy load conditions, the TC1313 buck converter

operates at a high, fixed frequency (2.0 MHz) using

current mode control. This minimizes output ripple and

noise (less than 8 mV peak-to-peak ripple) while main-

taining high efficiency (typically > 90%). For standby or

light-load applications, the buck regulator will automat-

ically switch to a power-saving Pulse Frequency

Modulation (PFM) mode. This minimizes the quiescent

current draw on the battery while keeping the buck

output voltage in regulation. The typical buck PFM

mode current is 38 µA. The buck regulator is capable of

operating at 100% duty cycle, minimizing the voltage

drop from input to output for wide-input, battery-

powered applications. For fixed-output voltage applica-

tions, the feedback divider and control loop compensa-

tion components are integrated, eliminating the need

for external components. The buck regulator output is

protected against overcurrent, short circuit and over-

temperature. While shut down, the synchronous buck

N-channel and P-channel switches are off, so the L_X

pin is in a high-impedance state (this allows for

connecting a source on the output of the buck regulator

as long as its voltage does not exceed the input

voltage).

4.3

Low-Dropout Regulator (LDO)

The LDO output is a 300 mA low-dropout linear

regulator that provides a regulated output voltage with

a single 1 µF external capacitor. The output voltage is

available in fixed options only, ranging from 1.5V to

3.3V. The LDO is stable using ceramic output

capacitors that inherently provide lower output noise

and reduce the size and cost of the regulator solution.

The quiescent current consumed by the LDO output is

typically less than 43.7 µA, with a typical dropout

voltage of 137 mV at 200 mA. The LDO output is

protected against overcurrent and overtemperature.

While operating in Dropout mode, the LDO quiescent

current will increase, minimizing the necessary voltage

differential needed for the LDO output to maintain

regulation. The LDO output is protected against over-

current and overtemperature.

4.4

Soft Start

Both outputs of the TC1313 are controlled during

startup. Less than 1% of V_OUT1or V_OUT2overshoot is

observed during start-up from V_INrising above the

UVLO voltage; or SHDN1 or SHDN2 being enabled.

DS21974B-page 17

TC1313

4.5

Overtemperature Protection

The TC1313 has an integrated overtemperature

protection circuit that monitors the device junction

temperature and shuts the device off if the junction

temperature exceeds the typical 165°C threshold. If the

overtemperature threshold is reached, the soft start is

reset so that, once the junction temperature cools to

approximately 155°C, the device will automatically

restart.

DS21974B-page 18

TC1313

An additional V_IN2capacitor can be added to reduce

high-frequency noise on the LDO input-voltage pin

(V_IN2). This additional capacitor (1 µF) is not necessary

for typical applications.

5.0

5.1

APPLICATION CIRCUITS/

ISSUES

Typical Applications

5.4

Input and Output Capacitor

Selection

The TC1313 500 mA buck regulator + 300 mA LDO

operates over a wide input-voltage range (2.7V to 5.5V)

and is ideal for single-cell Li-Ion battery-powered

applications, USB-powered applications, three-cell

NiMH or NiCd applications and 3V to 5V regulated

input applications. The 10-pin MSOP and 3x3 DFN

packages provide a small footprint with minimal exter-

nal components.

As with all buck-derived dc-dc switching regulators, the

input current is pulled from the source in pulses. This

places a burden on the TC1313 input filter capacitor. In

most applications,

a

minimum of 4.7 µF is

recommended on V_IN1(buck regulator input-voltage

pin). In applications that have high source impedance,

or have long leads (10 inches) connecting to the input

source, additional capacitance should be used. The

capacitor type can be electrolytic (aluminum, tantalum,

POSCAP, OSCON) or ceramic. For most portable

electronic applications, ceramic capacitors are

preferred due to their small size and low cost.

5.2

Fixed-Output Application

A typical V_OUT1fixed-output voltage application is

shown in “Typical Application Circuits”. A 4.7 µF

V_IN1ceramic input capacitor, 4.7 µF V_OUT1ceramic

capacitor, 1.0 µF ceramic V_OUT2capacitor and 4.7 µH

inductor make up the entire external component

solution for this dual-output application. No external

dividers or compensation components are necessary.

For this application, the input-voltage range is 2.7V to

4.2V, V_OUT1= 1.5V at 500 mA, while V_OUT2= 2.5V at

300 mA.

For applications that require very low noise on the LDO

output, an additional capacitor (typically 1 µF) can be

added to the V_IN2pin (LDO input voltage pin).

Low ESR electrolytic or ceramic can be used for the

buck regulator output capacitor. Again, ceramic is

recommended because of its physical attributes and

cost. For most applications, a 4.7 µF is recommended.

Refer to Table 5-1 for recommended values. Larger

capacitors (up to 22 µF) can be used. There are some

advantages in load step performance when using

larger value capacitors. Ceramic materials, X7R and

X5R, have low temperature coefficients and are well

within the acceptable ESR range required.

5.3

Adjustable-Output Application

A typical V_OUT1adjustable-output application is also

shown in “Typical Application Circuits”. For this

application, the buck regulator output voltage is adjust-

able by using two external resistors as a voltage

divider. For adjustable-output voltages, it is recom-

mended that the top resistor divider value be 200 kΩ.

The bottom resistor divider can be calculated using the

following formula:

TABLE 5-1:

TC1313 RECOMMENDED

CAPACITOR VALUES

C (V_IN1

)

C (V_IN2

)

C_OUT1

C_OUT2

EQUATION 5-1:

Min

4.7 µF

none

4.7 µF

22 µF

1 µF

V_FB

⎛

⎝

⎞

⎠

--------------------------------

R_BOT= R_TOP

×

Max

10 µF

V_OUT1– V_FB

Example:

R_TOP= 200 kΩ

V_OUT1= 2.1V

V_FB= 0.8V

R_BOT= 200 kΩ x (0.8V/(2.1V – 0.8V))

R_BOT= 123 kΩ (Standard Value = 121 kΩ)

For adjustable output applications, an additional R-C

compensation is necessary for the buck regulator

control loop stability. Recommended values are:

R_COMP= 4.99 kΩ

C_COMP= 33 pF

DS21974B-page 19

TC1313

TABLE 5-2:

TC1313 RECOMMENDED

INDUCTOR VALUES

5.5

Inductor Selection

For most applications,

a

4.7 µH inductor is

DCR

Ω

(max)

recommended to minimize noise. There are many

different magnetic core materials and package options

to select from. That decision is based on size, cost and

acceptable radiated energy levels. Toroid and shielded

ferrite pot cores will have low radiated energy but tend

to be larger and more expensive. With a typical

2.0 MHz switching frequency, the inductor ripple

current can be calculated based on the following

formulas.

Part

Number (µH)

Value

MAX

I_DC(A)

Size

WxLxH (mm)

Coiltronics^®

SD10

2.2

3.3

4.7

0.091 1.35 5.2, 5.2, 1.0 max.

0.108 1.24 5.2, 5.2, 1.0 max.

0.154 1.04 5.2, 5.2, 1.0 max.

SD10

Coiltronics

SD12

2.2

3.3

4.7

0.075 1.80 5.2, 5.2, 1.2 max.

0.104 1.42 5.2, 5.2, 1.2 max.

0.118 1.29 5.2, 5.2, 1.2 max.

EQUATION 5-2:

SD12

V_OUT

DutyCycle = -------------

V_IN

SD12

Sumida Corporation^®

CMD411 2.2

CMD411 3.3

CMD411 4.7

Coilcraft^®

0.116 0.950 4.4, 5.8, 1.2 max.

Duty cycle represents the percentage of switch-on

time.

0.174 0.770 4.4, 5.8, 1.2 max.

0.216 0.750 4.4, 5.8, 1.2 max.

EQUATION 5-3:

1

F_SW

1008PS 4.7

1812PS 4.7

0.35

0.11

1.0 3.8, 3.8, 2.74 max.

1.15 5.9, 5.0, 3.81 max.

---------

T_ON= DutyCycle ×

Where:

F_SW

5.6

Thermal Calculations

=

Switching Frequency

5.6.1

BUCK REGULATOR OUTPUT

The inductor ac ripple current can be calculated using

the following relationship:

(V

)

OUT1

The TC1313 is available in two different 10-pin

packages (MSOP and 3x3 DFN). By calculating the

power dissipation and applying the package thermal

resistance, (θ_JA), the junction temperature is estimated.

The maximum continuous junction temperature rating

for the TC1313 is +125°C.

EQUATION 5-4:

ΔI_L

--------

V_L= L ×

Δt

Where:

V_L

=

voltage across the inductor

(V_IN– V_OUT

on-time of P-channel MOSFET

To quickly estimate the internal power dissipation for

the switching buck regulator, an empirical calculation

using measured efficiency can be used. Given the

measured efficiency (Section 2.0 “Typical Perfor-

mance Curves”), the internal power dissipation is

estimated below.

)

Δt

Solving for ΔI_L= yields:

EQUATION 5-5:

ΔI_L

EQUATION 5-6:

V_L

-----

L

V_OUT1× I_OUT1

⎛

⎝

⎞

⎠

=

× Δt

-------------------------------------

– (V_OUT1× I_OUT1) = P_Dissipation

Efficiency

When considering inductor ratings, the maximum DC

current rating of the inductor should be at least equal to

the maximum buck regulator load current (I_OUT1), plus

one half of the peak-to-peak inductor ripple current (1/

2 * ΔI_L). The inductor DC resistance can add to the

buck converter I²R losses. A rating of less than 200 mΩ

is recommended. Overall efficiency will be improved by

using lower DC resistance inductors.

The first term is equal to the input power (definition of

efficiency, P_OUT/P_IN= Efficiency). The second term is

equal to the delivered power. The difference is internal

power dissipation. This estimate assumes that most of

the power lost is internal to the TC1313. There is some

percentage of power lost in the buck inductor, with very

little loss in the input and output capacitors.

DS21974B-page 20

TC1313

For example, for a 3.6V input, 1.8V output with a load

of 400 mA, the efficiency taken from Figure 2-7 is

approximately 84%. The internal power dissipation is

approximately 137 mW.

minimize trace length. The C_IN1and C_OUT1capacitor

returns are connected closely together at the P_GND

plane. The LDO optional input capacitor (C_IN2) and

LDO output capacitor C_OUT2are returned to the A_GND

plane. The analog ground plane and power ground

plane are connected at one point (shown near L₁). All

other signals (SHDN1, SHDN2, feedback in the

adjustable output case) should be referenced to A_GND

and have the A_GNDplane underneath them.

5.6.2

LDO OUTPUT (V

)

OUT2

The internal power dissipation within the TC1313 LDO

is a function of input voltage, output voltage and output

current. The following equation can be used to

calculate the internal power dissipation for the LDO.

- Via

A_GNDto P_GND

EQUATION 5-7:

P_LDO= (V_IN(MAX)– V_OUT2(MIN)) × I_OUT2(MAX)

+V_OUT1

* C_IN2Optional

Where:

C_OUT1

L₁

A_GND

P_GND

C_IN2

P_LDO= LDO Pass device internal power

dissipation

V_IN(MAX)= Maximum input voltage

1

2

3

4

5

10

9

C_IN1

+V_IN2

V_OUT(MIN)= LDO minimum output voltage

+V_IN1

8

+V_OUT2

7

The maximum power dissipation capability for a

package can be calculated given the junction-to-

ambient thermal resistance and the maximum ambient

temperature for the application. The following equation

can be used to determine the package’s maximum

internal power dissipation.

C_OUT2

6

TC1313

P_GNDPlane

A_GND

A_GNDPlane

FIGURE 5-1:

Component Placement,

Fixed-Output 10-Pin MSOP.

5.6.3

LDO POWER DISSIPATION

EXAMPLE

There will be some difference in layout for the 10-pin

DFN package due to the thermal pad. A typical fixed-

output DFN layout is shown below. For the DFN layout,

the V_IN1to V_IN2connection is routed on the bottom of

the board around the TC1313 thermal pad.

Input Voltage

V

_IN= 5V ±10%

LDO Output Voltage and Current

- Via

V_OUT= 3.3V

+V_OUT1

A_GNDto P_GND

I

_OUT= 300 mA

* C_IN2Optional

Internal Power Dissipation

C_OUT1

L₁

P_LDO(MAX)= (V_IN(MAX)– V_OUT2(MIN)) x I_OUT2(MAX)

A_GND

PGND

P_LDO= (5.5V) – (0.975 x 3.3V))

x 300 mA

C_IN2

1

2

3

4

5

10

9

P_GND

P_LDO= 684.8 mW

+V_IN2

C_IN1

8

+V_OUT2

5.7

PCB Layout Information

+V_IN1

7

C_OUT2

Some basic design guidelines should be used when

physically placing the TC1313 on a Printed Circuit

Board (PCB). The TC1313 has two ground pins,

identified as A_GND(analog ground) and P_GND(power

ground). By separating grounds, it is possible to

minimize the switching frequency noise on the LDO

output. The first priority, while placing external

components on the board, is the input capacitor (C_IN1).

Wiring should be short and wide; the input current for

the TC1313 can be as high as 800 mA. The next

priority would be the buck regulator output capacitor

6

TC1313

A_GND

P_GNDPlane

A

_GNDPlane

FIGURE 5-2:

Component Placement,

Fixed-Output 10-Pin DFN.

(C_OUT1) and inductor (L₁). All three of these

components are placed near their respective pins to

DS21974B-page 21

TC1313

5.8

Design Example

V_OUT1= 2.0V @ 500 mA

V_OUT2= 3.3V @ 300 mA

V_IN= 5V ±10%

L = 4.7 µH

Calculate PWM mode inductor ripple current

Nominal Duty

Cycle = 2.0V/5.0V = 40%

P-channel

Switch-on time = 0.40 x 1/(2 MHz) = 200 ns

V_L= (V_IN-V_OUT1) = 3V

ΔI_L= (V_L/L) x T_ON= 128 mA

Peak inductor current:

I_L(PK)= I_OUT1+1/2ΔI_L= 564 mA

Switcher power loss:

Use efficiency estimate for 1.8V from Figure 2-7

Efficiency = 84%, P_DISS1= 190 mW

Resistor Divider:

R_TOP= 200 kΩ

R_BOT= 133 kΩ

LDO Output:

P_DISS2= (V_IN(MAX)

–

V_OUT2(MIN)) x I_OUT2(MAX)

P_DISS2= (5.5V – (0.975) x 3.3V) x 300 mA

P_DISS2= 684.8 mW

Total

Dissipation = 190 mW + 685 mW = 875 mW

Junction Temp Rise and Maximum Ambient

Operating Temperature Calculations

10-Pin MSOP (4-Layer Board with internal Planes)

Rθ_JA= 113° C/Watt

Junction Temp.

Rise = 875 mW x 113° C/Watt = 98.9°C

Max. Ambient

Temperature = 125°C - 98.9°C

Max. Ambient

Temperature = 26.1°C

10-Pin DFN

Rθ_JA= 41° C/Watt (4-Layer Board with

internal planes and 2 vias)

Junction Temp.

Rise = 875 mW x 41° C/Watt = 35.9°C

Max. Ambient

Temperature = 125°C - 35.9°C

Max. Ambient

Temperature = 89.1°C

This is above the +85°C max. ambient temperature.

DS21974B-page 22

TC1313

6.0

6.1

PACKAGING INFORMATION

Package Marking Information

10-Lead MSOP

Example:

10-Lead DFN

Example:

— 5 = TC1313

XXXX

YYWW

NNN

51H0

0527

256

XXXXXX

YWWNNN

51H0E

527256

— 1 = 1.375V V_OUT1

— H = 2.6V V_OUT2

— 0 = Default

Second letter represents V_OUT1configuration:

Third letter represents V_OUT2configuration:

Code V_OUT1Code V_OUT1Code V_OUT1

Code V_OUT2Code V_OUT2Code V_OUT2

A

B

C

D

E

F

G

H

I

3.3V

3.2V

3.1V

3.0V

2.9V

2.8V

2.7V

2.6V

2.5V

J

K

L

2.4V

2.3V

2.2V

2.1V

2.0V

1.9V

1.8V

1.7V

1.6V

S

T

1.5V

1.4V

1.3V

1.2V

1.1V

1.0V

0.9V

Adj

A

B

C

D

E

F

G

H

I

3.3V

3.2V

3.1V

3.0V

2.9V

2.8V

2.7V

2.6V

2.5V

J

K

L

2.4V

2.3V

2.2V

2.1V

2.0V

1.9V

1.8V

1.7V

1.6V

S

T

1.5V

—

U

V

W

X

Y

Z

U

V

W

X

Y

Z

—

M

N

O

P

Q

R

M

N

O

P

Q

R

—

1

1.375V

Fourth letter represents +50 mV Increments:

Code

0

1

Default

2

3

+50 mV to V2

+50 mV to V1

and V2

Legend: XX...X Customer-specific information

Y

Year code (last digit of calendar year)

YY

WW

NNN

Year code (last 2 digits of calendar year)

Week code (week of January 1 is week ‘01’)

Alphanumeric traceability code

e

3

Pb-free JEDEC designator for Matte Tin (Sn)

*

This package is Pb-free. The Pb-free JEDEC designator (

can be found on the outer packaging for this package.

)

e3

Note: In the event the full Microchip part number cannot be marked on one line, it will

be carried over to the next line, thus limiting the number of available

characters for customer-specific information.

DS21974B-page 23

TC1313

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DS21974B-page 24

TC1313

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L1

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DS21974B-page 25

TC1313

NOTES:

DS21974B-page 26

TC1313

APPENDIX A: REVISION HISTORY

Revision B (January 2009)

The following is the list of modifications:

1. Added the new DFN package information.

Revision A (November 2005)

• Original Release of this Document.

DS21974B-page 23

TC1313

NOTES:

DS21974B-page 24

TC1313

PRODUCT IDENTIFICATION SYSTEM

To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office.

Examples:

PART NO.

TC1313

X

XX

a)

TC1313-1H0EMF:

1.375V, 2.6V, Default,

10LD DFN pkg.

1.375V, 2.6V, Default,

10LD MSOP pkg.

1.375V, 1.8V, Default,

10LD DFN pkg.

1.375V, 1.8V, Default,

10LD MSOP pkg.

3.0V, 2.7V, Default,

10LD DFN pkg.

V_OUT1V_OUT2

+50 mV

Increments

Temp Package Tube

Range

or

Tape &

Reel

b)

c)

d)

e)

f)

TC1313-1H0EUN:

TC1313-1P0EMF:

TC1313-1P0EUN:

TC1313-DG0EMF:

TC1313-RD1EMF:

TC1313-ZS0EUN:

Device:

Options

TC1313: PWM/LDO combo.

1.65V, 3.0V,

10LD DFN pkg.

Adj., 1.5V, Default,

10LD MSOP pkg.

Code

V

Code

V

Code

+50 mV

OUT1

OUT2

A

B

C

D

E

F

G

H

I

3.3V

3.2V

3.1V

3.0V

2.9V

2.8V

2.7V

2.6V

2.5V

2.4V

2.3V

2.2V

2.1V

2.0V

1.9V

1.8V

1.7V

1.6V

1.5V

1.4V

1.3V

1.2V

1.1V

1.0V

0.9V

Adjustable

1.375V

A

B

C

D

E

F

G

H

I

3.3V

3.2V

3.1V

3.0V

2.9V

2.8V

2.7V

2.6V

2.5V

2.4V

2.3V

2.2V

2.1V

2.0V

1.9V

1.8V

1.7V

1.6V

1.5V

0

1

2

3

Default

V1 + 50 mV

V2 + 50 mV

V1 and V2

+ 50 mV

g)

h)

TC1313-1H0EMFTR: 1.375V, 2.6V, Default,

10LD DFN pkg

Tape and Reel.

i)

TC1313-1H0EUNTR: 1.375V, 2.6V, Default,

10LD MSOP pkg

Tape and Reel.

j)

TC1313-1P0EMFTR: 1.375V, 1.8V, Default,

10LD DFN pkg

J

K

L

J

K

L

Tape and Reel.

k)

l)

TC1313-1P0EUNTR: 1.375V, 1.8V, Default,

10LD MSOP pkg

M

N

O

P

Q

R

S

T

U

V

W

X

Y

Z

M

N

O

P

Q

R

S

T

U

V

W

X

Y

Z

Tape and Reel.

TC1313-DG0EMFTR: 3.0V, 2.7V, Default,

10LD DFN pkg

Tape and Reel.

m) TC1313-RD1EMFTR: 1.65V, 3.0V,

10LD DFN pkg

Tape and Reel.

n)

TC1313-ZS0EUNTR: Adj., 1.5V, Default,

10LD MSOP pkg

Tape and Reel.

1

* Contact Factory for Alternate Output Voltage and Reset

Voltage Configurations.

Temperature

Range:

E

= -40°C to +85°C

Package:

MF

UN

=

Dual Flat, No Lead (3x3 mm body), 10-lead

Plastic Micro Small Outline (MSOP), 10-lead

Tube or

Tape and Reel:

Blank

TR

=

Tube

Tape and Reel

DS21974B-page 25

TC1313

NOTES:

DS21974B-page 26

Note the following details of the code protection feature on Microchip devices:

•

Microchip products meet the specification contained in their particular Microchip Data Sheet.

•

Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the

intended manner and under normal conditions.

•

There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our

knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data

Sheets. Most likely, the person doing so is engaged in theft of intellectual property.

•

Microchip is willing to work with the customer who is concerned about the integrity of their code.

Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not

mean that we are guaranteeing the product as “unbreakable.”

Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our

products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts

allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act.

Information contained in this publication regarding device

applications and the like is provided only for your convenience

and may be superseded by updates. It is your responsibility to

ensure that your application meets with your specifications.

MICROCHIP MAKES NO REPRESENTATIONS OR

WARRANTIES OF ANY KIND WHETHER EXPRESS OR

IMPLIED, WRITTEN OR ORAL, STATUTORY OR

OTHERWISE, RELATED TO THE INFORMATION,

INCLUDING BUT NOT LIMITED TO ITS CONDITION,

QUALITY, PERFORMANCE, MERCHANTABILITY OR

FITNESS FOR PURPOSE. Microchip disclaims all liability

arising from this information and its use. Use of Microchip

devices in life support and/or safety applications is entirely at

the buyer’s risk, and the buyer agrees to defend, indemnify and

hold harmless Microchip from any and all damages, claims,

suits, or expenses resulting from such use. No licenses are

conveyed, implicitly or otherwise, under any Microchip

intellectual property rights.

Trademarks

The Microchip name and logo, the Microchip logo, Accuron,

dsPIC, KEELOQ, KEELOQ logo, MPLAB, PIC, PICmicro,

PICSTART, rfPIC, SmartShunt and UNI/O are registered

trademarks of Microchip Technology Incorporated in the

U.S.A. and other countries.

FilterLab, Linear Active Thermistor, MXDEV, MXLAB,

SEEVAL, SmartSensor and The Embedded Control Solutions

Company are registered trademarks of Microchip Technology

Incorporated in the U.S.A.

Analog-for-the-Digital Age, Application Maestro, CodeGuard,

dsPICDEM, dsPICDEM.net, dsPICworks, dsSPEAK, ECAN,

ECONOMONITOR, FanSense, In-Circuit Serial

Programming, ICSP, ICEPIC, Mindi, MiWi, MPASM, MPLAB

Certified logo, MPLIB, MPLINK, mTouch, PICkit, PICDEM,

PICDEM.net, PICtail, PIC³²logo, PowerCal, PowerInfo,

PowerMate, PowerTool, REAL ICE, rfLAB, Select Mode, Total

Endurance, WiperLock and ZENA are trademarks of

Microchip Technology Incorporated in the U.S.A. and other

countries.

SQTP is a service mark of Microchip Technology Incorporated

in the U.S.A.

All other trademarks mentioned herein are property of their

respective companies.

Printed on recycled paper.

Microchip received ISO/TS-16949:2002 certification for its worldwide

headquarters, design and wafer fabrication facilities in Chandler and

Tempe, Arizona; Gresham, Oregon and design centers in California

and India. The Company’s quality system processes and procedures

are for its PIC^®MCUs and dsPIC^®DSCs, KEELOQ^®code hopping

devices, Serial EEPROMs, microperipherals, nonvolatile memory and

analog products. In addition, Microchip’s quality system for the design

and manufacture of development systems is ISO 9001:2000 certified.

DS21974B-page 27

WORLDWIDE SALES AND SERVICE

AMERICAS

ASIA/PACIFIC

EUROPE

Corporate Office

Asia Pacific Office

Suites 3707-14, 37th Floor

Tower 6, The Gateway

Harbour City, Kowloon

Hong Kong

Tel: 852-2401-1200

Fax: 852-2401-3431

India - Bangalore

Tel: 91-80-4182-8400

Fax: 91-80-4182-8422

Austria - Wels

Tel: 43-7242-2244-39

Fax: 43-7242-2244-393

2355 West Chandler Blvd.

Chandler, AZ 85224-6199

Tel: 480-792-7200

Fax: 480-792-7277

Technical Support:

http://support.microchip.com

Web Address:

www.microchip.com

Denmark - Copenhagen

Tel: 45-4450-2828

Fax: 45-4485-2829

India - New Delhi

Tel: 91-11-4160-8631

Fax: 91-11-4160-8632

France - Paris

Tel: 33-1-69-53-63-20

Fax: 33-1-69-30-90-79

India - Pune

Tel: 91-20-2566-1512

Fax: 91-20-2566-1513

Australia - Sydney

Tel: 61-2-9868-6733

Fax: 61-2-9868-6755

Atlanta

Duluth, GA

Tel: 678-957-9614

Fax: 678-957-1455

Germany - Munich

Tel: 49-89-627-144-0

Fax: 49-89-627-144-44

Japan - Yokohama

Tel: 81-45-471- 6166

Fax: 81-45-471-6122

China - Beijing

Tel: 86-10-8528-2100

Fax: 86-10-8528-2104

Italy - Milan

Tel: 39-0331-742611

Fax: 39-0331-466781

Korea - Daegu

Tel: 82-53-744-4301

Fax: 82-53-744-4302

Boston

China - Chengdu

Tel: 86-28-8665-5511

Fax: 86-28-8665-7889

Westborough, MA

Tel: 774-760-0087

Fax: 774-760-0088

Netherlands - Drunen

Tel: 31-416-690399

Fax: 31-416-690340

Korea - Seoul

China - Hong Kong SAR

Tel: 852-2401-1200

Fax: 852-2401-3431

Tel: 82-2-554-7200

Fax: 82-2-558-5932 or

82-2-558-5934

Chicago

Itasca, IL

Tel: 630-285-0071

Fax: 630-285-0075

Spain - Madrid

Tel: 34-91-708-08-90

Fax: 34-91-708-08-91

China - Nanjing

Tel: 86-25-8473-2460

Fax: 86-25-8473-2470

Malaysia - Kuala Lumpur

Tel: 60-3-6201-9857

Fax: 60-3-6201-9859

Dallas

Addison, TX

Tel: 972-818-7423

Fax: 972-818-2924

UK - Wokingham

Tel: 44-118-921-5869

Fax: 44-118-921-5820

China - Qingdao

Tel: 86-532-8502-7355

Fax: 86-532-8502-7205

Malaysia - Penang

Tel: 60-4-227-8870

Fax: 60-4-227-4068

Detroit

Farmington Hills, MI

Tel: 248-538-2250

Fax: 248-538-2260

China - Shanghai

Tel: 86-21-5407-5533

Fax: 86-21-5407-5066

Philippines - Manila

Tel: 63-2-634-9065

Fax: 63-2-634-9069

Kokomo

Kokomo, IN

Tel: 765-864-8360

Fax: 765-864-8387

China - Shenyang

Tel: 86-24-2334-2829

Fax: 86-24-2334-2393

Singapore

Tel: 65-6334-8870

Fax: 65-6334-8850

China - Shenzhen

Tel: 86-755-8203-2660

Fax: 86-755-8203-1760

Taiwan - Hsin Chu

Tel: 886-3-572-9526

Fax: 886-3-572-6459

Los Angeles

Mission Viejo, CA

Tel: 949-462-9523

Fax: 949-462-9608

China - Wuhan

Tel: 86-27-5980-5300

Fax: 86-27-5980-5118

Taiwan - Kaohsiung

Tel: 886-7-536-4818

Fax: 886-7-536-4803

Santa Clara

Santa Clara, CA

Tel: 408-961-6444

Fax: 408-961-6445

China - Xiamen

Tel: 86-592-2388138

Fax: 86-592-238813S0

Taiwan - Taipei

Tel: 886-2-2500-6610

Fax: 886-2-2508-0102

Toronto

Mississauga, Ontario,

Canada

Tel: 905-673-0699

Fax: 905-673-6509

China - Xian

Tel: 86-29-8833-7252

Fax: 86-29-8833-7256

Thailand - Bangkok

Tel: 66-2-694-1351

Fax: 66-2-694-1350

China - Zhuhai

Tel: 86-756-3210040

Fax: 86-756-3210049

01/02/08

DS21974B-page 28


型号：	TC1313-1D1EMF
厂家：	MICROCHIP
描述：	0.5 A SWITCHING REGULATOR, 2400 kHz SWITCHING FREQ-MAX, PDSO10, 3 X 3 MM, 0.90 MM HEIGHT, PLASTIC, DFN-10 开关光电二极管输出元件
文件：	总32页 (文件大小：590K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

TC1313-1D1EMF [MICROCHIP]

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