TC2186-3.3VCTRT [MICROCHIP]
3.3 V FIXED POSITIVE LDO REGULATOR, 0.21 V DROPOUT, PDSO5, SC-74A, SOT-23A, 5 PIN;
| 型号： | TC2186-3.3VCTRT |
| 厂家： | 
MICROCHIP |
| 描述： | 3.3 V FIXED POSITIVE LDO REGULATOR, 0.21 V DROPOUT, PDSO5, SC-74A, SOT-23A, 5 PIN 光电二极管 |
| 文件： | 总16页 (文件大小：519K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
TC2054/2055/2186
50mA, 100mA, and 150mA CMOS LDOs
with Shutdown and Error Output
Features
General Description
• Very Low Supply Current (55µA Typ.) for Longer
Battery Life
The TC2054, TC2055 and TC2186 are high accuracy
(typically ±0.4%) CMOS upgrades for older (bipolar)
low dropout regulators. Designed specifically for bat-
tery-operated systems, the devices’ total supply current
is typically 55µA at full load (20 to 60 times lower than
in bipolar regulators).
• Very Low Dropout Voltage: 140mV (Typ.) @
150mA
• High Output Voltage Accuracy: ±0.4% (Typ)
• Standard or Custom Output Voltages
• Power-Saving Shutdown Mode
The devices’ key features include ultra low noise oper-
ation, very low dropout voltage - typically 45mV
(TC2054); 90mV (TC2055); and 140mV (TC2186) at
full load - and fast response to step changes in load. An
error output (ERROR) is asserted when the devices are
out-of-regulation (due to a low input voltage or exces-
sive output current). Supply current is reduced to 0.5µA
• ERROR Output Can Be Used as a Low Battery
Detector or Processor Reset Generator
• Fast Shutdown Reponse Time: 60µsec (Typ)
• Over-Current Protection
• Space-Saving 5-Pin SOT-23A Package
• Pin Compatible Upgrades for Bipolar Regulators
(max) and both V
and ERROR are disabled when
OUT
the shutdown input is low. The devices also incorporate
over-current protection.
Applications
The TC2054, TC2055 and TC2186 are stable with a
low esr ceramic output capacitor of 1µF and have a
maximum output current of 50mA, 100mA and 150mA,
respectively. This LDO Family also features a fast
response time (60µsec typically) when released from
shutdown.
• Battery Operated Systems
• Portable Computers
• Medical Instruments
• Instrumentation
• Cellular / GSMS / PHS Phones
• Pagers
Typical Application
Device Selection Table
1
5
V
V
V
V
OUT
IN
IN
OUT
Junction Temp.
Part Number
Package
Range
1µF
1µF
TC2054-xxVCT 5-Pin SOT-23A*
TC2055-xxVCT 5-Pin SOT-23A*
TC2186-xxVCT 5-Pin SOT-23A*
-40°C to +125°C
-40°C to +125°C
-40°C to +125°C
2
GND
TC2054
TC2055
TC2186
1M
Note:
*5-Pin SOT-23A is equivalent to EIAJ (SC-74A).
3
4
SHDN
ERROR
ERROR
Package Type
Shutdown Control
(from Power Control Logic)
VOUT
ERROR
4
5
TC2054
TC2055
TC2186
2
3
1
5-Pin SOT-23A*
TOP VIEW
VIN
GND SHDN
2002 Microchip Technology Inc.
DS21663B-page 1
TC2054/2055/2186
*Stresses above those listed under “Absolute Maxi-
mum Ratings” may cause permanent damage to the
device. These are stress ratings only and functional
operation of the device at these or any other conditions
above those indicated in the operation sections of the
specifications is not implied. Exposure to Absolute
Maximum Rating conditions for extended periods my
affect device reliability.
1.0
ELECTRICAL
CHARACTERISTICS
ABSOLUTE MAXIMUM RATINGS*
Input Voltage .........................................................6.5V
Output Voltage................................(-0.3) to (V + 0.3)
IN
Operating Temperature .................. -40°C < T < 125°C
J
Storage Temperature..........................-65°C to +150°C
Maximum Voltage on Any Pin ........V +0.3V to -0.3V
IN
TC2054/2055/2186 ELECTRICAL SPECIFICATIONS
Electrical Characteristics: VIN = VR + 1V, IL = 100µA, CL = 3.3µF, SHDN > VIH, TA = 25°C, unless otherwise noted. BOLDFACE
type specifications apply for junction temperature of -40°C to +125°C.
Symbol
Parameter
Min
2.7
Typ
Max
6.0
Units
Test Conditions
V
Input Operating Voltage
Maximum Output Current
—
V
Note 1
IN
IOUT
50
100
150
—
—
—
—
—
—
mA
TC2054
TC2055
TC2186
MAX
V
Output Voltage
V
- 2.0%
V
± 0.4%
V + 2.0%
R
V
Note 2
OUT
R
R
TCV
V
Temperature
OUT
—
20
—
ppm/°C Note 3
OUT
Coefficient
—
40
—
∆V
∆V
/
Line Regulation
—
0.05
0.5
%
%
(V + 1V) < V < 6V
OUT
R
IN
IN
∆V
/
Load Regulation
-1.5
-2.5
0.5
0.5
0.5
0.5
TC2054;TC2055 I = 0.1mA to IOUT
L
OUT
MAX
MAX
V
V
TC2186
I = 0.1mA to IOUT
OUT
L
Note 4
– V
Dropout Voltage, Note 5
—
—
—
—
2
45
90
140
—
70
140
210
mV
I
I
I
I
= 100µA
= 50mA
= 100mA
= 150mA
IN
OUT
L
L
L
L
TC2015; TC2185
TC2185
Note 5
I
Supply Current
—
—
55
0.05
50
80
0.5
—
µA
µA
SHDN = V , I =0
IN
IH
L
I
Shutdown Supply Current
Power Supply Rejection Ratio
Output Short Circuit Current
Thermal Regulation
SHDN = 0V
F ≤ 120kHz
RE
INSD
PSRR
—
dB
I
160
—
300
0.04
600
—
mA
V/W
V
OUT
= 0V
OUT
SC
∆V
∆P
—
Note 6
= I
OUT
D
eN
Output Noise
—
—
nV /
√Hz
I
, F = 10kHz
L
OUT
MAX
t
Response Time
—
60
—
µsec
V
= 4V
R
IN
(from Shutdown Mode)
C
= 1µF, C
= 10µF
IN
OUT
I
= 0.1mA, Note 9
L
Note 1: The minimum V has to meet two conditions: V = 2.7V and V = V + V .
DROPOUT
IN
IN
IN
R
2:
V is the regulator output voltage setting. For example: V = 1.8V, 2.7V, 2.8V, 2.85V, 3.0V, 3.3V.
R
R
3: TCV
=
6
OUT
(V
– V
) × 10
OUTMAX
OUTMIN
× ∆T
-----------------------------------------------------------------------------------------
V
OUT
4: Regulation is measured at a constant junction temperature using low duty cycle pulse testing. Load regulation is tested over a
load range from 1.0mA to the maximum specified output current. Changes in output voltage due to heating effects are covered
by the thermal regulation specification.
5: Dropout voltage is defined as the input to output differential at which the output voltage drops 2% below its nominal value at a 1V
differential.
6: Thermal Regulation is defined as the change in output voltage at a time T after a change in power dissipation is applied, exclud-
ing load or line regulation effects. Specifications are for a current pulse equal to I
at V = 6V for T = 10msec.
MAX
IN
7: The maximum allowable power dissipation is a function of ambient temperature, the maximum allowable junction temperature
and the thermal resistance from junction-to-air (i.e. T , T , θ ).
A
J
JA
8: Hysteresis voltage is referenced by V .
R
9: Time required for V
to reach 95% of V (output voltage setting), after V
is switched from 0 to V .
SHDN IN
OUT
R
DS21663B-page 2
2002 Microchip Technology Inc.
TC2054/2055/2186
Electrical Characteristics: VIN = VR + 1V, IL = 100µA, CL = 3.3µF, SHDN > VIH, TA = 25°C, unless otherwise noted. BOLDFACE
type specifications apply for junction temperature of -40°C to +125°C.
Symbol
Parameter
Min
Typ
Max
Units
Test Conditions
SHDN Input
V
V
SHDN Input High Threshold
SHDN Input Low Threshold
60
—
—
—
%V
%V
V
V
= 2.5V to 6.0V
IH
IL
IN
IN
IN
IN
—
15
= 2.5V to 6.0V
ERROR OUTPUT
V
Minimum V Operating Volt-
1.0
—
—
V
V
≥ 2.7V
OUT
INMIN
IN
age
V
V
V
Output Logic Low Voltage
ERROR Threshold Voltage
ERROR Positive Hysteresis
—
—
—
—
—
—
0.95 x V
50
400
—
mV
1 mA Flows to ERROR
See Figure 4-2
Note 8
OL
V
TH
R
—
mV
msec
Ω
HYS
DELAY
t
V
to ERROR Delay
2
—
V
V
from V = 3V to 2.8V
OUT R
OUT
R
Resistance from ERROR to
GND
126
—
= 2.5V, V
= 2.5V
OUT
ERROR
DD
Note 1: The minimum V has to meet two conditions: V = 2.7V and V = V + V .
DROPOUT
IN
IN
IN
R
2:
V is the regulator output voltage setting. For example: V = 1.8V, 2.7V, 2.8V, 2.85V, 3.0V, 3.3V.
R
R
3: TCV
=
6
OUT
(V
– V
) × 10
OUTMAX
OUTMIN
× ∆T
-----------------------------------------------------------------------------------------
V
OUT
4: Regulation is measured at a constant junction temperature using low duty cycle pulse testing. Load regulation is tested over a
load range from 1.0mA to the maximum specified output current. Changes in output voltage due to heating effects are covered
by the thermal regulation specification.
5: Dropout voltage is defined as the input to output differential at which the output voltage drops 2% below its nominal value at a 1V
differential.
6: Thermal Regulation is defined as the change in output voltage at a time T after a change in power dissipation is applied, exclud-
ing load or line regulation effects. Specifications are for a current pulse equal to I
at V = 6V for T = 10msec.
MAX
IN
7: The maximum allowable power dissipation is a function of ambient temperature, the maximum allowable junction temperature
and the thermal resistance from junction-to-air (i.e. T , T , θ ).
A
J
JA
8: Hysteresis voltage is referenced by V .
R
9: Time required for V
to reach 95% of V (output voltage setting), after V
is switched from 0 to V .
SHDN IN
OUT
R
2.0
PIN DESCRIPTIONS
The descriptions of the pins are listed in Table 2-1.
TABLE 2-1:
Pin Number
PIN FUNCTION TABLE
Symbol
Description
1
2
3
V
Unregulated supply input.
Ground terminal.
IN
GND
SHDN
Shutdown control input. The regulator is fully enabled when a logic high is
applied to this input. The regulator enters shutdown when a logic low is
applied to this input. During shutdown, output voltage falls to zero, ERROR
is open circuited and supply current is reduced to 0.5µA (max).
4
5
ERROR
Out-of-Regulation Flag. (Open drain output). This output goes low when
V
is out-of-tolerance by approximately -5%.
OUT
V
Regulated voltage output.
OUT
2002 Microchip Technology Inc.
DS21663B-page 3
TC2054/2055/2186
FIGURE 3-2: ERROR OUTPUT OPERATION
3.0
DETAILED DESCRIPTION
VOUT
The TC2054, TC2055 and TC2186 are precision fixed
output voltage regulators. (If an adjustable version is
desired, please see the TC1070, TC1071 or TC1187
data sheets.) Unlike bipolar regulators, the TC2054,
TC2055 and TC2186 supply current does not increase
with load current. In addition, VOUT remains stable and
within regulation over the entire 0mA to maximum out-
put current operating load range.
HYSTERESIS (VHYS
)
VTH
ERROR
VIH
VOL
Figure 3-1 shows a typical application circuit. The reg-
ulator is enabled any time the shutdown input (SHDN)
3.2
Output Capacitor
is at or above V , and shutdown (disabled) when
IH
SHDN is at or below V . SHDN may be controlled by a
IL
A 1µF (min) capacitor from V
to ground is required.
The output capacitor should have an effective series
OUT
CMOS logic gate, or I/O port of a microcontroller. If the
SHDN input is not required, it should be connected
directly to the input supply. While in shutdown, supply
resistance of 0.01Ω. to 5Ω for V = 2.5V, and 0.05Ω.
OUT
to 5Ω for V
< 2.5V. A 1µF capacitor should be con-
IN
OUT
current decreases to 0.05µA (typical), V
zero volts, and ERROR is open-circuited.
falls to
OUT
nected from V to GND if there is more than 10 inches
of wire between the regulator and the AC filter capaci-
tor, or if a battery is used as the power source. Ceramic,
tantalum and aluminum electrolytic capacitors can be
used. (Since many aluminum electrolytic capacitors
freeze at approximately -30°C, solid tantalums are rec-
ommended for applications operating below -25°C).
When operating from sources other than batteries, sup-
ply-noise rejection and transient response can be
improved by increasing the value of the input and out-
put capacitors and employing passive filtering tech-
niques.
FIGURE 3-1: TYPICAL APPLICATION CIRCUIT
V
V
V
OUT
OUT
IN
1µF
1µF
C1
TC2054
TC2055
TC2186
BATTERY
GND
+
V
SHDN
ERROR
R1
1M
Shutdown Control
(to CMOS Logic or Tie
C2 Required Only
BATTLOW
or RESET
if ERROR is used as a
Processor RESET Signal
(See Text)
to V if unused)
IN
0.2µF
C2
3.1
ERROR Open Drain Output
ERROR is driven low whenever V
falls out of regu-
OUT
lation by more than -5% (typical). This condition may be
caused by low input voltage, output current limiting or
thermal limiting. The ERROR threshold is 5% below
rated V
regardless of the programmed output volt-
OUT
age value (e.g. ERROR = V at 4.75V (typ.) for a 5.0V
OL
regulator and 2.85V (typ.) for a 3.0V regulator).
ERROR output operation is shown in Figure 4-2.
Note that ERROR is active when V
falls to V , and
TH
OUT
inactive when V
rises above V by V
.
OUT
TH
HYS
As shown in Figure 3-1, ERROR can be used as a bat-
tery low flag or as a processor RESET signal (with the
addition of timing capacitor C2). R1 x C2 should be
chosen to maintain ERROR below V of the processor
IH
RESET input for at least 200msec to allow time for the
system to stabilize. Pull-up resistor R1 can be tied to
V
, V or any other voltage less than (V + 0.3V).
OUT IN
IN
The ERROR pin sink current is self-limiting to approxi-
mately 18mA.
DS21663B-page 4
2002 Microchip Technology Inc.
TC2054/2055/2186
Equation 4-1 can be used in conjunction with Equation
4-2 to ensure regulator thermal operation is within lim-
its. For example:
4.0
4.1
THERMAL CONSIDERATIONS
Power Dissipation
The amount of power the regulator dissipates is prima-
rily a function of input and output voltage, and output
current.
Given:
V
V
= 3.0V ±5%
= 2.7V – 2.5%
= 40mA
IN
MAX
OUT
MIN
The following equation is used to calculate worst case
power dissipation:
I
LOAD
MAX
T
= 55°C
A
MAX
EQUATION 4-1:
Find 1. Actual power dissapation
:
P
≈ (V – V
)I
OUT LOAD
MIN
D
IN
MAX
2. Maximum allowable dissapation
Where:
P
V
V
=
=
=
=
Worst case actual power dissipation
Maximum voltage on V
D
Actual power dissipation:
IN
IN
MAX
Minimum regulator output voltage
Maximum output (load) current
OUT
MIN
P
≈ (V
– V
)I
OUT LOAD
MAX
MIN
D
IN
MAX
I
LOAD
–3
MAX
= [(3.0 x 1.05) – (2.7 x .975)]40 x 10
= 20.7mW
Maximum allowable power dissipation:
The maximum allowable power dissipation (Equation
4-2) is a function of the maximum ambient temperature
(TJ
– TA
)
MAX
(T
), the maximum allowable die temperature (125
A
MAX
MAX
PD
= -------------------------------------
MAX
°C) and the thermal resistance from junction-to-air
θJA
(θ ). The 5-Pin SOT-23A package has a θ of
JA
JA
approximately 220°C/Watt when mounted on a typical
two layer FR4 dielectric copper clad PC board.
(125 – 55)
--------------------------
EQUATION 4-2:
220
TJ
– TA
MAX
= 318mW
MAX
PD
= ----------------------------------
MAX
θJA
In this example, the TC2054 dissipates a maximum of
only 20.7mW; far below the allowable limit of 318mW.
In a similar manner, Equation 4-1 and Equation 4-2 can
be used to calculate maximum current and/or input
voltage limits.
Where all terms are previously defined
4.2
Layout Considerations
The primary path of heat conduction out of the package
is via the package leads. Therefore, layouts having a
ground plane, wide traces at the pads, and wide power
supply bus lines combine to lower θ and, therefore,
JA
increase the maximum allowable power dissipation
limit.
2002 Microchip Technology Inc.
DS21663B-page 5
TC2054/2055/2186
5.0
TYPICAL CHARACTERISTICS
Note: The graphs and tables provided following this note are a statistical summary based on a limited number of
samples and are provided for informational purposes only. The performance characteristics listed herein
are not tested or guaranteed. In some graphs or tables, the data presented may be outside the specified
operating range (e.g., outside specified power supply range) and therefore outside the warranted range.
FIGURE 5-1: POWER SUPPLY REJECTION
RATIO
FIGURE 5-4: POWER SUPPLY REJECTION
RATIO
0
0
V
INDC = 4V
I
OUT = 150mA
V
INDC = 4V
I
OUT = 100µA
V
INAC = 100mVp-p
OUTDC = 3V
COUT = 10µF Ceramic
V
INAC = 100mVp-p
COUT = 1mF Ceramic
V
V
OUTDC = 3V
-20
-40
-20
-40
-60
-60
-80
-80
-100
-100
10
100
1k
10k
100k
1M
10
100
1k
10k
100k
1M
f (Hz)
f (Hz)
FIGURE 5-5: POWER SUPPLY REJECTION
FIGURE 5-2: POWER SUPPLY REJECTION
RATIO
RATIO
0
0
V
INDC = 4V
I
OUT = 150mA
INDC = 4V
I
OUT = 150mA
V
INAC = 100mVp-p
OUTDC = 3V
COUT = 10µF Tantalum
V
COUT = 1µF Ceramic
V
-20
-40
-20
-40
-60
-60
-80
-80
-100
-100
10
100
1k
10k
100k
1M
10
100
1k
10k
100k
1M
f (Hz)
f (Hz)
FIGURE 5-6: DROPOUT VOLTAGE VS. I
FIGURE 5-3: OUTPUT NOISE
LOAD
0.160
10
V
OUT = 1.8V
0.140
0.120
0.100
1
T = 25˚C
T = 130˚C
C
OUT = 1µF
0.080
0.060
0.1
0.01
T = -45˚C
0.040
0.020
0.000
0.001
0.01
0.1
1
10
100
1000
100
150
50
0
Frequency (KHz)
I
LOAD (mA)
DS21663B-page 6
2002 Microchip Technology Inc.
TC2054/2055/2186
TYPICAL CHARACTERISTICS (CONT)
FIGURE 5-7:
I
VS. TEMPERATURE
FIGURE 5-10: OUTPUT VOLTAGE VS. OUTPUT
CURRENT
DD
65.00
1.9
1.88
1.86
1.84
V
OUT = 1.8V
63.00
61.00
1.82
59.00
57.00
V
IN = 2.8V
VIN = 2.8V
1.8
1.78
1.76
1.74
55.00
53.00
1.72
1.7
-45
5
55
105
155
0
15
30
45
60
75
90
105
120
135
150
Temp (˚C)
I
LOAD (mA)
FIGURE 5-8: OUTPUT VOLTAGE VS.
TEMPERATURE
FIGURE 5-11: OUTPUT VOLTAGE VS. SUPPLY
VOLTAGE
2.9
V
OUT = 2.8V
2.9
I
OUT = 0.1mA
V
OUT = 2.8V
2.85
2.8
VIN = 6.5V
I
OUT = 0.1mA
2.85
Temp = +130˚C
2.8
2.75
2.7
V
IN = 6.0V
V
IN = 3.8V
2.75
2.7
Temp = +25˚C
Temp = -45˚C
2.65
2.6
2.65
2.6
2.55
2.5
2.55
2.5
-50 -35 -20 -5
10
25
40 55
70
85 100 115 130 145
3.5
4
4.5
5
5.5
6
6.5
7
Temperature (˚C)
VIN (V)
FIGURE 5-9: OUTPUT VOLTAGE VS.
TEMPERATURE
FIGURE 5-12: OUTPUT VOLTAGE VS. SUPPLY
VOLTAGE
1.9
V
OUT = 1.8V
I
OUT = 0.1mA
1.88
1.86
1.9
V
OUT = 1.8V
1.88
1.86
1.84
I
OUT = 0.1mA
1.84
1.82
1.8
VIN = 6.0V
VIN = 6.5V
Temp = +130˚C
1.82
1.8
1.78
V
IN = 2.8V
1.76
1.74
Temp = -45˚C
1.78
Temp = +25˚C
1.76
1.74
1.72
1.72
1.7
-50 -35 -20
-5
10
25 40
55 70
85 100 115 130 145
1.7
Temperature (˚C)
2.7
3.2
3.7
4.2
4.7
5.2
5.7
6.2
6.7
VIN (V)
2002 Microchip Technology Inc.
DS21663B-page 7
TC2054/2055/2186
TYPICAL CHARACTERISTICS (CONT)
FIGURE 5-13: LOAD TRANSIENT RESPONSE
FIGURE 5-16: LOAD TRANSIENT RESPONSE
V
V
= 3.0V
V
V
= 3.8V
IN
IN
= 2.8V
= 2.8V
OUT
OUT
C
= 1µF Ceramic
C
= 1 µF Ceramic
= 1 µF Ceramic
IN
IN
C
= 10µF Ceramic
C
OUT
OUT
Frequency = 1 KHz
Frequency = 10KHz
V
100mV/DIV
100mV / DIV
V
OUT
OUT
Load Current
Load Current
150mA
Load
100µA
150mA
Load
100µA
FIGURE 5-17: SHUTDOWN DELAY
FIGURE 5-14: LOAD TRANSIENT RESPONSE IN
DROPOUT MODE
V
V
C
C
I
= 4.0V
IN
= 3.0V
= 10µF
= 0.01µF
= 100µA
Load Transient Response in Dropout Mode
OUT
OUT
BYP
OUT
VOUT
100mV/DIV
V
SHDN
150mA
VIN = 3.105V
VOUT = 3.006V
CIN = 1µF Ceramic
COUT = 1µF Ceramic
V
OUT
100µA
RLOAD = 20Ω
FIGURE 5-18: SHUTDOWN WAKE-UP TIME
FIGURE 5-15: LINE TRANSIENT RESPONSE
V
SHDN
V
= 2.8V
OUT
C
C
I
= 1µF Ceramic
= 470pF
OUT
BYP
= 100µA
OUT
50mV / DIV
V
OUT
V
OUT
Input Voltage
2V / DIV
6V
4V
V
V
= 4.0V
IN
= 3.0V
OUT
C
= 10µF
OUT
C
= 0.01µF
= 100µA
BYP
OUT
I
DS21663B-page 8
2002 Microchip Technology Inc.
TC2054/2055/2186
TYPICAL CHARACTERISTICS (CONT)
FIGURE 5-19: V
TO ERROR DELAY
OUT
R
PULLUP = 100kΩ
I
OUT = 0.3mA
V
IN
1V/Div
1V/Div
3.42V
3.0V
2.8V
2.8V
V
OUT
2V/Div
VERROR
0V
2002 Microchip Technology Inc.
DS21663B-page 9
TC2054/2055/2186
6.0
6.1
PACKAGING INFORMATION
Package Marking Information
5-Pin SOT-23A
1 & 2 = part number code + temperature range and volt-
age
TC2054
Code
TC2055
Code
TC2186
Code
(V)
1.8
2.5
2.7
2.8
2.85
3.0
3.3
SA
SB
SC
SD
SE
SF
SG
TA
TB
TC
TD
TE
TF
TG
VA
VB
VC
VD
VE
VF
VG
3 represents year and 2-month period code
4 represents lot ID number
6.2
Taping Information
Component Taping Orientation for 5-Pin SOT-23A (EIAJ SC-74A) Devices
User Direction of Feed
Device
Marking
W
PIN 1
Standard Reel Component Orientation
TR Suffix Device
(Mark Right Side Up)
P
Reverse Reel Component Orientation
RT Suffix Device
(Mark Upside Down)
Carrier Tape, Number of Components Per Reel and Reel Size
Package
Carrier Width (W)
Pitch (P)
Part Per Full Reel
Reel Size
5-Pin SOT-23A
8 mm
4 mm
3000
7 in
DS21663B-page 10
2002 Microchip Technology Inc.
TC2054/2055/2186
6.3
Package Dimensions
SOT-23A-5
.075 (1.90)
REF.
.071 (1.80)
.059 (1.50)
.122 (3.10)
.098 (2.50)
.020 (0.50)
.012 (0.30)
PIN 1
.037 (0.95)
REF.
.122 (3.10)
.106 (2.70)
.057 (1.45)
.035 (0.90)
.010 (0.25)
.004 (0.09)
10° MAX.
.006 (0.15)
.000 (0.00)
.024 (0.60)
.004 (0.10)
Dimensions: inches (mm)
2002 Microchip Technology Inc.
DS21663B-page 11
TC2054/2055/2186
NOTES:
DS21663B-page 12
2002 Microchip Technology Inc.
TC2054/2055/2186
SALES AND SUPPORT
Data Sheets
Products supported by a preliminary Data Sheet may have an errata sheet describing minor operational differences and recom-
mended workarounds. To determine if an errata sheet exists for a particular device, please contact one of the following:
1. Your local Microchip sales office
2. The Microchip Corporate Literature Center U.S. FAX: (480) 792-7277
3. The Microchip Worldwide Site (www.microchip.com)
Please specify which device, revision of silicon and Data Sheet (include Literature #) you are using.
New Customer Notification System
Register on our web site (www.microchip.com/cn) to receive the most current information on our products.
2002 Microchip Technology Inc.
DS21663B-page 13
TC2054/2055/2186
NOTES:
DS21663B-page 14
2002 Microchip Technology Inc.
Information contained in this publication regarding device
applications and the like is intended through suggestion only
and may be superseded by updates. It is your responsibility to
ensure that your application meets with your specifications.
No representation or warranty is given and no liability is
assumed by Microchip Technology Incorporated with respect
to the accuracy or use of such information, or infringement of
patents or other intellectual property rights arising from such
use or otherwise. Use of Microchip’s products as critical com-
ponents in life support systems is not authorized except with
express written approval by Microchip. No licenses are con-
veyed, implicitly or otherwise, under any intellectual property
rights.
Trademarks
The Microchip name and logo, the Microchip logo, FilterLab,
KEELOQ, microID, MPLAB, PIC, PICmicro, PICMASTER,
PICSTART, PRO MATE, SEEVAL and The Embedded Control
Solutions Company are registered trademarks of Microchip Tech-
nology Incorporated in the U.S.A. and other countries.
dsPIC, ECONOMONITOR, FanSense, FlexROM, fuzzyLAB,
In-Circuit Serial Programming, ICSP, ICEPIC, microPort,
Migratable Memory, MPASM, MPLIB, MPLINK, MPSIM,
MXDEV, PICC, PICDEM, PICDEM.net, rfPIC, Select Mode
and Total Endurance are trademarks of Microchip Technology
Incorporated in the U.S.A.
Serialized Quick Turn Programming (SQTP) is a service mark
of Microchip Technology Incorporated in the U.S.A.
All other trademarks mentioned herein are property of their
respective companies.
© 2002, Microchip Technology Incorporated, Printed in the
U.S.A., All Rights Reserved.
Printed on recycled paper.
Microchip received QS-9000 quality system
certification for its worldwide headquarters,
design and wafer fabrication facilities in
Chandler and Tempe, Arizona in July 1999
and Mountain View, California in March 2002.
The Company’s quality system processes and
procedures are QS-9000 compliant for its
PICmicro® 8-bit MCUs, KEELOQ® code hopping
devices, Serial EEPROMs, microperipherals,
non-volatile memory and analog products. In
addition, Microchip’s quality system for the
design and manufacture of development
systems is ISO 9001 certified.
2002 Microchip Technology Inc.
DS21347B - page 15
WORLDWIDE SALES AND SERVICE
Japan
AMERICAS
ASIA/PACIFIC
Microchip Technology Japan K.K.
Benex S-1 6F
3-18-20, Shinyokohama
Kohoku-Ku, Yokohama-shi
Kanagawa, 222-0033, Japan
Tel: 81-45-471- 6166 Fax: 81-45-471-6122
Corporate Office
Australia
2355 West Chandler Blvd.
Microchip Technology Australia Pty Ltd
Suite 22, 41 Rawson Street
Epping 2121, NSW
Chandler, AZ 85224-6199
Tel: 480-792-7200 Fax: 480-792-7277
Technical Support: 480-792-7627
Web Address: http://www.microchip.com
Australia
Tel: 61-2-9868-6733 Fax: 61-2-9868-6755
Korea
Rocky Mountain
China - Beijing
Microchip Technology Korea
168-1, Youngbo Bldg. 3 Floor
Samsung-Dong, Kangnam-Ku
Seoul, Korea 135-882
2355 West Chandler Blvd.
Chandler, AZ 85224-6199
Tel: 480-792-7966 Fax: 480-792-7456
Microchip Technology Consulting (Shanghai)
Co., Ltd., Beijing Liaison Office
Unit 915
Bei Hai Wan Tai Bldg.
Atlanta
500 Sugar Mill Road, Suite 200B
Atlanta, GA 30350
Tel: 770-640-0034 Fax: 770-640-0307
Boston
2 Lan Drive, Suite 120
Westford, MA 01886
Tel: 978-692-3848 Fax: 978-692-3821
Tel: 82-2-554-7200 Fax: 82-2-558-5934
Singapore
Microchip Technology Singapore Pte Ltd.
200 Middle Road
#07-02 Prime Centre
No. 6 Chaoyangmen Beidajie
Beijing, 100027, No. China
Tel: 86-10-85282100 Fax: 86-10-85282104
China - Chengdu
Microchip Technology Consulting (Shanghai)
Co., Ltd., Chengdu Liaison Office
Rm. 2401, 24th Floor,
Ming Xing Financial Tower
No. 88 TIDU Street
Singapore, 188980
Tel: 65-6334-8870 Fax: 65-6334-8850
Taiwan
Microchip Technology Taiwan
11F-3, No. 207
Tung Hua North Road
Taipei, 105, Taiwan
Tel: 886-2-2717-7175 Fax: 886-2-2545-0139
Chicago
333 Pierce Road, Suite 180
Itasca, IL 60143
Chengdu 610016, China
Tel: 86-28-6766200 Fax: 86-28-6766599
Tel: 630-285-0071 Fax: 630-285-0075
China - Fuzhou
Dallas
Microchip Technology Consulting (Shanghai)
Co., Ltd., Fuzhou Liaison Office
Unit 28F, World Trade Plaza
No. 71 Wusi Road
Fuzhou 350001, China
4570 Westgrove Drive, Suite 160
Addison, TX 75001
EUROPE
Denmark
Microchip Technology Nordic ApS
Regus Business Centre
Lautrup hoj 1-3
Ballerup DK-2750 Denmark
Tel: 45 4420 9895 Fax: 45 4420 9910
Tel: 972-818-7423 Fax: 972-818-2924
Detroit
Tri-Atria Office Building
32255 Northwestern Highway, Suite 190
Farmington Hills, MI 48334
Tel: 248-538-2250 Fax: 248-538-2260
Tel: 86-591-7503506 Fax: 86-591-7503521
China - Shanghai
Microchip Technology Consulting (Shanghai)
Co., Ltd.
Room 701, Bldg. B
Far East International Plaza
No. 317 Xian Xia Road
Shanghai, 200051
Tel: 86-21-6275-5700 Fax: 86-21-6275-5060
Kokomo
France
2767 S. Albright Road
Kokomo, Indiana 46902
Tel: 765-864-8360 Fax: 765-864-8387
Los Angeles
Microchip Technology SARL
Parc d’Activite du Moulin de Massy
43 Rue du Saule Trapu
Batiment A - ler Etage
91300 Massy, France
Tel: 33-1-69-53-63-20 Fax: 33-1-69-30-90-79
Germany
Microchip Technology GmbH
Gustav-Heinemann Ring 125
D-81739 Munich, Germany
Tel: 49-89-627-144 0 Fax: 49-89-627-144-44
18201 Von Karman, Suite 1090
Irvine, CA 92612
Tel: 949-263-1888 Fax: 949-263-1338
China - Shenzhen
Microchip Technology Consulting (Shanghai)
Co., Ltd., Shenzhen Liaison Office
Rm. 1315, 13/F, Shenzhen Kerry Centre,
Renminnan Lu
Shenzhen 518001, China
Tel: 86-755-2350361 Fax: 86-755-2366086
New York
150 Motor Parkway, Suite 202
Hauppauge, NY 11788
Tel: 631-273-5305 Fax: 631-273-5335
San Jose
Microchip Technology Inc.
2107 North First Street, Suite 590
San Jose, CA 95131
Tel: 408-436-7950 Fax: 408-436-7955
Toronto
Hong Kong
Italy
Microchip Technology Hongkong Ltd.
Unit 901-6, Tower 2, Metroplaza
223 Hing Fong Road
Kwai Fong, N.T., Hong Kong
Tel: 852-2401-1200 Fax: 852-2401-3431
Microchip Technology SRL
Centro Direzionale Colleoni
Palazzo Taurus 1 V. Le Colleoni 1
20041 Agrate Brianza
Milan, Italy
6285 Northam Drive, Suite 108
Mississauga, Ontario L4V 1X5, Canada
Tel: 905-673-0699 Fax: 905-673-6509
India
Tel: 39-039-65791-1 Fax: 39-039-6899883
United Kingdom
Arizona Microchip Technology Ltd.
505 Eskdale Road
Winnersh Triangle
Wokingham
Berkshire, England RG41 5TU
Tel: 44 118 921 5869 Fax: 44-118 921-5820
Microchip Technology Inc.
India Liaison Office
Divyasree Chambers
1 Floor, Wing A (A3/A4)
No. 11, O’Shaugnessey Road
Bangalore, 560 025, India
Tel: 91-80-2290061 Fax: 91-80-2290062
03/01/02
DS21663B-page 16
2002 Microchip Technology Inc.
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