TC4420VPAG [MICROCHIP]
6 A BUF OR INV BASED MOSFET DRIVER;
| 型号： | TC4420VPAG |
| 厂家： | 
MICROCHIP |
| 描述： | 6 A BUF OR INV BASED MOSFET DRIVER 驱动 光电二极管 接口集成电路 驱动器 |
| 文件： | 总22页 (文件大小：360K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
TC4420/TC4429
6A High-Speed MOSFET Drivers
Features
General Description
• Latch-Up Protected: Will Withstand >1.5A
Reverse Output Current
The TC4420/TC4429 are 6A (peak), single-output
MOSFET drivers. The TC4429 is an inverting driver
(pin-compatible with the TC429), while the TC4420 is a
non-inverting driver. These drivers are fabricated in
CMOS for lower power and more efficient operation
versus bipolar drivers.
• Logic Input Will Withstand Negative Swing Up To
5V
• ESD Protected: 4 kV
• Matched Rise and Fall Times:
- 25 ns (2500 pF load)
Both devices have TTL/CMOS compatible inputs that
can be driven as high as VDD + 0.3V or as low as –5V
without upset or damage to the device. This eliminates
the need for external level-shifting circuitry and its
associated cost and size. The output swing is rail-to-rail,
ensuring better drive voltage margin, especially during
power-up/power-down sequencing. Propagational
delay time is only 55 ns (typ.) and the output rise and fall
times are only 25 ns (typ.) into 2500 pF across the
usable power supply range.
• High Peak Output Current: 6A
• Wide Input Supply Voltage Operating Range:
- 4.5V to 18V
• High Capacitive Load Drive Capability: 10,000 pF
• Short Delay Time: 55 ns (typ.)
• CMOS/TTL Compatible Input
• Low Supply Current With Logic ‘1’ Input:
- 450 µA (typ.)
Unlike other drivers, the TC4420/TC4429 are virtually
latch-up proof. They replace three or more discrete
components, saving PCB area, parts and improving
overall system reliability.
• Low Output Impedance: 2.5
• Output Voltage Swing to Within 25 mV of Ground
or VDD
• Space-Saving 8-Pin SOIC and 8-Pin 6x5 DFN
Packages
Applications
• Switch-Mode Power Supplies
• Motor Controls
• Pulse Transformer Driver
• Class D Switching Amplifiers
(1)
Package Types
8-Pin CERDIP/ TC4420 TC4429
PDIP/SOIC
8-Pin DFN(2) TC4420 TC4429
5-Pin TO-220
Tab is
V
1
2
3
4
8
7
6
5
V
DD
DD
Common
to V
V
DD
V
V
1
8
7
6
5
V
DD
DD
DD
DD
TC4420
TC4429
TC4420
TC4429
INPUT 2
NC 3
OUTPUT
OUTPUT
GND
INPUT
NC
OUTPUT
OUTPUT
GND
OUTPUT OUTPUT
TC4420
TC4429
OUTPUT
GND
OUTPUT
GND
GND 4
GND
Note 1: Duplicate pins must both be connected for proper operation.
2: Exposed pad of the DFN package is electrically isolated.
2002-2012 Microchip Technology Inc.
DS21419D-page 1
TC4420/TC4429
Functional Block Diagram
VDD
TC4429
Inverting
500 µA
300 mV
Output
TC4420
Non-Inverting
Input
4.7V
GND
Effective
Input
C = 38 pF
DS21419D-page 2
2002-2012 Microchip Technology Inc.
TC4420/TC4429
† Stresses above those listed under “Absolute Maximum
Ratings” may cause permanent damage to the device. These
are stress ratings only and functional operation of the device
at these or any other conditions above those indicated in the
operation sections of the specifications is not implied.
Exposure to Absolute Maximum Rating conditions for
extended periods may affect device reliability.
1.0
ELECTRICAL
CHARACTERISTICS
Absolute Maximum Ratings†
Supply Voltage .....................................................+20V
Input Voltage ..................................– 5V to VDD + 0.3V
Input Current (VIN > VDD)...................................50 mA
Power Dissipation (TA 70°C)
5-Pin TO-220....................................................1.6W
CERDIP.......................................................800 mW
DFN............................................ ...................Note 2
PDIP............................................................730 mW
SOIC............................................................470 mW
Package Power Dissipation (TA 25°C)
5-Pin TO-220 (With Heatsink) ........................12.5W
Thermal Impedances (To Case)
5-Pin TO-220 RJ-C ......................................10°C/W
DC CHARACTERISTICS
Electrical Specifications: Unless otherwise noted, TA = +25°C with 4.5V VDD 18V.
Parameters
Sym
Min
Typ
Max
Units
Conditions
Input
Logic ‘1’, High Input
VIH
2.4
1.8
—
V
Voltage
Logic ‘0’, Low Input Voltage
Input Voltage Range
Input Current
VIL
VIN
IIN
—
–5
1.3
—
0.8
VDD+0.3
+10
V
V
–10
—
µA 0VVINVDD
Output
High Output Voltage
Low Output Voltage
Output Resistance, High
Output Resistance, Low
Peak Output Current
VOH
VOL
ROH
ROL
IPK
VDD – 0.025
—
—
—
0.025
2.8
2.5
—
V
V
A
A
DC TEST
—
—
—
—
—
DC TEST
2.1
1.5
6.0
> 1.5
IOUT = 10 mA, VDD = 18V
IOUT = 10 mA, VDD = 18V
VDD = 18V
Latch-Up Protection
IREV
—
Duty cycle2%, t 300 µsec
Withstand Reverse Current
Switching Time (Note 1)
Rise Time
tR
tF
—
—
—
—
25
25
55
55
35
35
75
75
ns Figure 4-1, CL = 2,500 pF
ns Figure 4-1, CL = 2,500 pF
ns Figure 4-1
Fall Time
Delay Time
tD1
tD2
Delay Time
ns Figure 4-1
Power Supply
Power Supply Current
IS
—
—
0.45
55
1.5
150
mA VIN = 3V
µA
VIN = 0V
Operating Input Voltage
VDD
4.5
—
18
V
Note 1: Switching times ensured by design.
2: Package power dissipation is dependent on the copper pad area on the PCB.
2002-2012 Microchip Technology Inc.
DS21419D-page 3
TC4420/TC4429
DC CHARACTERISTICS (OVER OPERATING TEMPERATURE RANGE)
Electrical Specifications: Unless otherwise noted, over operating temperature range with 4.5V VDD 18V.
Parameters
Sym
Min
Typ
Max
Units
Conditions
Input
Logic ‘1’, High Input
VIH
2.4
—
—
V
Voltage
Logic ‘0’, Low Input Voltage
Input Voltage Range
Input Current
VIL
VIN
IIN
—
–5
—
—
—
0.8
VDD + 0.3
+10
V
V
–10
µA 0VVINVDD
Output
High Output Voltage
Low Output Voltage
Output Resistance, High
Output Resistance, Low
Switching Time (Note 1)
Rise Time
VOH
VOL
ROH
ROL
VDD – 0.025
—
—
3
—
0.025
5
V
V
DC TEST
—
—
—
DC TEST
IOUT = 10 mA, VDD = 18V
IOUT = 10 mA, VDD = 18V
2.3
5
tR
tF
—
—
—
—
32
34
50
65
60
60
ns Figure 4-1, CL = 2,500 pF
ns Figure 4-1, CL = 2,500 pF
ns Figure 4-1
Fall Time
Delay Time
tD1
tD2
100
100
Delay Time
ns Figure 4-1
Power Supply
Power Supply Current
IS
—
—
0.45
60
3
400
mA VIN = 3V
µA
VIN = 0V
Operating Input Voltage
VDD
4.5
—
18
V
Note 1: Switching times ensured by design.
TEMPERATURE CHARACTERISTICS
Electrical Specifications: Unless otherwise noted, all parameters apply with 4.5V VDD 18V.
Parameters
Temperature Ranges
Sym
Min
Typ
Max
Units
Conditions
Specified Temperature Range (C)
Specified Temperature Range (I)
Specified Temperature Range (E)
Specified Temperature Range (V)
Maximum Junction Temperature
Storage Temperature Range
TA
TA
TA
TA
TJ
TA
0
—
—
—
—
—
—
+70
+85
°C
°C
°C
°C
°C
°C
–25
–40
–40
—
+85
+125
+150
+150
–65
Package Thermal Resistances
Thermal Resistance, 5L-TO-220
Thermal Resistance, 8L-CERDIP
Thermal Resistance, 8L-6x5 DFN
JA
JA
JA
—
—
—
71
—
—
—
°C/W
°C/W
150
33.2
°C/W Typical four-layer board
with vias to ground plane.
Thermal Resistance, 8L-PDIP
Thermal Resistance, 8L-SOIC
JA
JA
—
—
125
155
—
—
°C/W
°C/W
DS21419D-page 4
2002-2012 Microchip Technology Inc.
TC4420/TC4429
2.0
TYPICAL PERFORMANCE CURVES
Note:
The graphs and tables provided following this note are a statistical summary based on a limited number of
samples and are provided for informational purposes only. The performance characteristics listed herein
are not tested or guaranteed. In some graphs or tables, the data presented may be outside the specified
operating range (e.g., outside specified power supply range) and therefore outside the warranted range.
Note: Unless otherwise indicated, TA = +25°C with 4.5V VDD 18V.
120
100
100
80
60
40
20
0
C
= 10,000 pF
L
80
60
40
20
0
C
= 10,000 pF
L
C
C
= 4700 pF
L
C
C
= 4700 pF
L
= 2200 pF
L
= 2200 pF
L
5
7
9
11
13
15
5
7
9
11
13
15
Supply Voltage (V)
Supply Voltage (V)
FIGURE 2-1:
Rise Time vs. Supply
FIGURE 2-4:
Fall Time vs. Supply
Voltage.
Voltage.
100
80
100
80
60
40
60
40
V
DD
= 5V
V
DD
= 5V
V
DD
= 12V
V
DD
= 12V
V
DD
= 18V
V
DD
= 18V
20
10
20
10
1000
10,000
1000
10,000
Capcitive Load (pF)
Capacitive Load (pF)
FIGURE 2-2:
Load.
Rise Time vs. Capacitive
FIGURE 2-5:
Load.
Fall Time vs. Capacitive
50
40
30
20
10
0
84
70
56
42
28
14
0
C
= 2200 pF
V
DD
= 15V
L
V
DD
= 18V
t
D2
t
D1
500 kHz
200 kHz
20 kHz
1000
10,000
–60
–20
20
60
(°C)
100
140
0
100
Capacitive Load (pF)
T
A
FIGURE 2-3:
Temperature.
Propagation Delay Time vs.
FIGURE 2-6:
Capacitive Load.
Supply Current vs.
2002-2012 Microchip Technology Inc.
DS21419D-page 5
TC4420/TC4429
Note: Unless otherwise indicated, TA = +25°C with 4.5V VDD 18V.
50
5
4
3
2
C
= 2200 pF
L
V
DD
= 18V
40
30
20
10
0
100 mA
50 mA
10 mA
t
FALL
t
RISE
–60
–20
20
60
(°C)
100
140
5
7
9
11
13
15
T
A
Supply Voltage (V)
FIGURE 2-7:
Rise and Fall Times vs.
FIGURE 2-10:
High-State Output
Temperature.
Resistance vs Supply Voltage.
65
60
55
50
45
40
35
200
Load = 2200 pF
160
120
80
40
0
Input 2.4V
t
D2
Input 3V
Input 5V
t
D1
Input 8V and 10V
4
6
8
10
12 14 16 18
5
6
7
8
9
10 11 12 13 14 15
V
(V)
DD
Supply Voltage (V)
FIGURE 2-8:
Propagation Delay Time vs.
FIGURE 2-11:
Effect of Input Amplitude on
Supply Voltage.
Propagation Delay.
1000
2.5
C = 2200 pF
L
18V
10V
5V
100
10
2
1.5
1
100 mA
50 mA
10 mA
0
0
100
1000
10,000
5
7
9
11
13
15
Frequency (kHz)
Supply Voltage (V)
FIGURE 2-9:
Supply Current vs.
FIGURE 2-12:
Low-State Output
Frequency.
Resistance vs. Supply Voltage.
DS21419D-page 6
2002-2012 Microchip Technology Inc.
TC4420/TC4429
Note: Unless otherwise indicated, TA = +25°C with 4.5V VDD 18V.
4
3
2
1
0
5
6
7
8
9
10 11 12 13 14 15
Supply Voltage (V)
The values on this graph represent the loss seen
by the driver during one complete cycle. For a
single transition, divide the value by 2.
FIGURE 2-13:
Crossover Energy.
2002-2012 Microchip Technology Inc.
DS21419D-page 7
TC4420/TC4429
3.0
PIN DESCRIPTIONS
The descriptions of the pins are listed in Table 3-1.
TABLE 3-1:
PIN FUNCTION TABLE
Pin No.
8-Pin CERDIP/
PDIP/SOIC
Pin No.
8-Pin DFN
Pin No.
5-Pin TO-220
Symbol
Description
1
2
1
2
—
1
VDD
INPUT
NC
Supply input, 4.5V to 18V
Control input, TTL/CMOS compatible input
No Connection
3
3
—
2
4
4
GND
Ground
5
5
4
GND
Ground
6
6
5
OUTPUT
OUTPUT
VDD
CMOS push-pull output
CMOS push-pull output
Supply input, 4.5V to 18V
Exposed Metal Pad
7
7
—
3
8
8
—
—
PAD
—
—
TAB
NC
VDD
Metal Tab is at the VDD Potential
3.1
Supply Input (V
)
3.3
CMOS Push-Pull Output
DD
The VDD input is the bias supply for the MOSFET driver
and is rated for 4.5V to 18V with respect to the ground
pins. The VDD input should be bypassed to ground with
a local ceramic capacitor. The value of the capacitor
should be chosen based on the capacitive load that is
being driven. A minimum value of 1.0 µF is suggested.
The MOSFET driver output is a low-impedance,
CMOS, push-pull style output capable of driving a
capacitive load with 6.0A peak currents. The MOSFET
driver output is capable of withstanding 1.5A peak
reverse currents of either polarity.
3.4
Ground
3.2
Control Input
The ground pins are the return path for the bias current
and the high peak currents that discharge the load
capacitor. The ground pins should be tied into a ground
plane or have very short traces to the bias supply
source return.
The MOSFET driver input is a high-impedance,
TTL/CMOS compatible input. The input circuitry of the
TC4420/TC4429 MOSFET driver also has a “speed-
up” capacitor. This helps to decrease the propagation
delay times of the driver. Because of this, input signals
with slow rising or falling edges should not be used, as
this can result in double-pulsing of the MOSFET driver
output.
3.5
Exposed Metal Pad
The exposed metal pad of the 6x5 DFN package is not
internally connected to any potential. Therefore, this
pad can be connected to a ground plane or other
copper plane on a printed circuit board (PCB) to aid in
heat removal from the package.
DS21419D-page 8
2002-2012 Microchip Technology Inc.
TC4420/TC4429
4.0
APPLICATIONS INFORMATION
+5V
90%
Input
V
DD = 18V
10%
0V
+18V
Output
0V
tD1
90%
tD2
tF
tR
4.7 µF
90%
1
8
10%
10%
0.1 µF
Input
0.1 µF
Inverting Driver
TC4429
2
6
7
Output
CL = 2,500 pF
+5V
90%
Input
4
5
10%
0V
+18V
90%
90%
tD1
tD2
tF
tR
Output
0V
Input: 100 kHz,
square wave,
10%
10%
tRISE = tFALL 10 ns
Non-Inverting Driver
TC4420
Note: Pinout shown is for the PDIP, SOIC, DFN and CERDIP packages.
FIGURE 4-1: Switching Time Test Circuits.
2002-2012 Microchip Technology Inc.
DS21419D-page 9
TC4420/TC4429
5.0
5.1
PACKAGING INFORMATION
Package Marking Information
5-Lead TO-220
Example:
XXXXXXXXX
XXXXXXXXX
YYWWNNN
TC4420CAT
0419256
8-Lead CERDIP (300 mil)
Example:
XXXXXXXX
XXXXXNNN
TC4420
MJA256
YYWW
0419
8-Lead DFN
Example:
XXXXXXX
XXXXXXX
XXYYWW
NNN
TC4420
EMF
0419
256
Legend: XX...X Customer-specific information
Y
YY
Year code (last digit of calendar year)
Year code (last 2 digits of calendar year)
WW
NNN
Week code (week of January 1 is week ‘01’)
Alphanumeric traceability code
e
3
Pb-free JEDEC designator for Matte Tin (Sn)
This package is Pb-free. The Pb-free JEDEC designator (
can be found on the outer packaging for this package.
*
)
3
e
Note: In the event the full Microchip part number cannot be marked on one line, it will
be carried over to the next line, thus limiting the number of available
characters for customer-specific information.
DS21419D-page 10
2002-2012 Microchip Technology Inc.
TC4420/TC4429
Package Marking Information (Continued)
8-Lead PDIP (300 mil)
Example:
XXXXXXXX
XXXXXNNN
TC4420
CPA256
YYWW
0419
8-Lead SOIC (150 mil)
Example:
XXXXXXXX
XXXXYYWW
TC4420
EOA0419
NNN
256
2002-2012 Microchip Technology Inc.
DS21419D-page 11
TC4420/TC4429
5-Lead Plastic Transistor Outline (AT) (TO-220)
Note: For the most current package drawings, please see the Microchip Packaging Specification located
at http://www.microchip.com/packaging
L
H1
Q
b
e3
e1
E
e
EJECTOR PIN
ØP
(5X)
a
C1
A
J1
F
D
Units
INCHES*
MIN
.060
MILLIMETERS
MIN MAX
1.52
Dimension Limits
MAX
.072
e
Lead Pitch
1.83
6.93
1.02
4.83
10.54
14.99
6.55
1.40
2.87
3.96
14.22
2.92
0.56
1.02
Overall Lead Centers
Space Between Leads
Overall Height
e1
e3
A
.263
.030
.160
.385
.560
.234
.045
.103
.146
.540
.090
.014
.025
.273
.040
.190
.415
.590
.258
.055
.113
.156
.560
.115
.022
.040
6.68
0.76
4.06
9.78
14.22
5.94
1.14
2.62
3.71
13.72
2.29
0.36
0.64
Overall Width
E
Overall Length
D
Flag Length
H1
F
Flag Thickness
Q
Through Hole Center
Through Hole Diameter
Lead Length
P
L
Base to Bottom of Lead
Lead Thickness
J1
C1
b
Lead Width
a
Mold Draft Angle
3°
7°
3°
7°
*Controlling Parameter
Notes:
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or
protrusions shall not exceed .010" (0.254mm) per side.
JEDEC equivalent: TO-220
Drawing No. C04-036
DS21419D-page 12
2002-2012 Microchip Technology Inc.
TC4420/TC4429
8-Lead Ceramic Dual In-line – 300 mil (JA) (CERDIP)
Note: For the most current package drawings, please see the Microchip Packaging Specification located
at http://www.microchip.com/packaging
E1
2
n
1
D
E
A2
L
A
c
B1
eB
B
A1
p
Units
Dimension Limits
INCHES*
NOM
MILLIMETERS
MIN
MAX
MIN
NOM
8
MAX
n
p
Number of Pins
Pitch
Top to Seating Plane
Standoff §
Shoulder to Shoulder Width
Ceramic Pkg. Width
Overall Length
Tip to Seating Plane
Lead Thickness
Upper Lead Width
Lower Lead Width
Overall Row Spacing
*Controlling Parameter
JEDEC Equivalent: MS-030
Drawing No. C04-010
8
.100
.180
.030
.305
.265
.385
.163
.012
.055
.018
.360
2.54
A
A1
E
E1
D
L
c
B1
B
.160
.200
4.06
0.51
4.57
0.77
7.75
6.73
9.78
4.13
0.29
1.40
0.46
9.15
5.08
.020
.290
.230
.370
.125
.008
.045
.016
.320
.040
.320
.300
.400
.200
.015
.065
.020
.400
1.02
8.13
7.62
10.16
5.08
0.38
1.65
0.51
10.16
7.37
5.84
9.40
3.18
0.20
1.14
0.41
8.13
eB
2002-2012 Microchip Technology Inc.
DS21419D-page 13
TC4420/TC4429
8-Lead Plastic Dual Flat No Lead Package (MF) 6x5 mm Body (DFN-S) – Saw Singulated
Note: For the most current package drawings, please see the Microchip Packaging Specification located
at http://www.microchip.com/packaging
DS21419D-page 14
2002-2012 Microchip Technology Inc.
TC4420/TC4429
8-Lead Plastic Dual In-line (PA) – 300 mil (PDIP)
Note: For the most current package drawings, please see the Microchip Packaging Specification located
at http://www.microchip.com/packaging
E1
D
2
n
1
E
A2
A
L
c
A1
B1
B
p
eB
Units
INCHES*
NOM
MILLIMETERS
Dimension Limits
MIN
MAX
MIN
NOM
8
MAX
n
p
Number of Pins
Pitch
8
.100
.155
.130
2.54
Top to Seating Plane
A
.140
.170
3.56
2.92
3.94
3.30
4.32
Molded Package Thickness
Base to Seating Plane
Shoulder to Shoulder Width
Molded Package Width
Overall Length
A2
A1
E
.115
.015
.300
.240
.360
.125
.008
.045
.014
.310
5
.145
3.68
0.38
7.62
6.10
9.14
3.18
0.20
1.14
0.36
7.87
5
.313
.250
.373
.130
.012
.058
.018
.370
10
.325
.260
.385
.135
.015
.070
.022
.430
15
7.94
6.35
9.46
3.30
0.29
1.46
0.46
9.40
10
8.26
6.60
9.78
3.43
0.38
1.78
0.56
10.92
15
E1
D
Tip to Seating Plane
Lead Thickness
L
c
Upper Lead Width
B1
B
Lower Lead Width
Overall Row Spacing
Mold Draft Angle Top
Mold Draft Angle Bottom
§
eB
5
10
15
5
10
15
* Controlling Parameter
§ Significant Characteristic
Notes:
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed
.010” (0.254mm) per side.
JEDEC Equivalent: MS-001
Drawing No. C04-018
2002-2012 Microchip Technology Inc.
DS21419D-page 15
TC4420/TC4429
8-Lead Plastic Small Outline (OA) – Narrow, 150 mil (SOIC)
Note: For the most current package drawings, please see the Microchip Packaging Specification located
at http://www.microchip.com/packaging
E
E1
p
D
2
B
n
1
h
45
c
A2
A
L
A1
Units
INCHES*
NOM
MILLIMETERS
Dimension Limits
MIN
MAX
MIN
NOM
8
MAX
n
p
Number of Pins
Pitch
8
.050
.061
.056
.007
.237
.154
.193
.015
.025
4
1.27
Overall Height
A
.053
.069
1.35
1.32
1.55
1.42
0.18
6.02
3.91
4.90
0.38
0.62
4
1.75
Molded Package Thickness
Standoff
A2
A1
E
.052
.004
.228
.146
.189
.010
.019
0
.061
.010
.244
.157
.197
.020
.030
8
1.55
0.25
6.20
3.99
5.00
0.51
0.76
8
§
0.10
5.79
3.71
4.80
0.25
0.48
0
Overall Width
Molded Package Width
Overall Length
E1
D
Chamfer Distance
Foot Length
h
L
Foot Angle
c
Lead Thickness
Lead Width
.008
.013
0
.009
.017
12
.010
.020
15
0.20
0.33
0
0.23
0.42
12
0.25
0.51
15
B
Mold Draft Angle Top
Mold Draft Angle Bottom
0
12
15
0
12
15
* Controlling Parameter
§ Significant Characteristic
Notes:
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed
.010” (0.254mm) per side.
JEDEC Equivalent: MS-012
Drawing No. C04-057
DS21419D-page 16
2002-2012 Microchip Technology Inc.
TC4420/TC4429
6.0
REVISION HISTORY
Revision D (December 2012)
Added a note to each package outline drawing.
2002-2012 Microchip Technology Inc.
DS21419D-page 17
TC4420/TC4429
NOTES:
DS21419D-page 18
2002-2012 Microchip Technology Inc.
TC4420/TC4429
PRODUCT IDENTIFICATION SYSTEM
To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office.
Examples:
PART NO.
Device
X
XX
XXX
X
a)
b)
c)
TC4420CAT:
6A High-Speed MOSFET
Driver, Non-inverting,
TO-220 package,
0°C to +70°C.
Temperature Package
Range
Tape and
Reel
PB Free
TC4420EOA: 6A High-Speed MOSFET
Driver, Non-inverting,
Device:
TC4420: 6A High-Speed MOSFET Driver, Non-Inverting
TC4429: 6A High-Speed MOSFET Driver, Inverting
SOIC package,
-40°C to +85°C.
Temperature Range:
C
I
E
V
=
=
=
=
0°C to +70°C (PDIP, SOIC, and TO-220 Only)
-25°C to +85°C (CERDIP Only)
-40°C to +85°C
TC4420VMF: 6A High-Speed MOSFET
Driver, Non-inverting,
DFN package,
-40°C to +125°C
-40°C to +125°C.
Package:
AT
JA
=
=
TO-220, 5-lead (C-Temp Only)
Ceramic Dual In-line (300 mil Body), 8-lead
(I-Temp Only)
a)
b)
c)
TC4429CAT:
TC4429EPA:
6A High-Speed MOSFET
Driver, Inverting,
TO-220 package,
0°C to +70°C
MF
=
Dual, Flat, No-Lead (6X5 mm Body), 8-lead
MF713 = Dual, Flat, No-Lead (6X5 mm Body), 8-lead
(Tape and Reel)
PA
6A High-Speed MOSFET
Driver, Inverting,
PDIP package,
=
=
Plastic DIP (300 mil Body), 8-lead
Plastic SOIC, (150 mil Body), 8-lead
OA
OA713 = Plastic SOIC, (150 mil Body), 8-lead
(Tape and Reel)
-40°C to +85°C
TC4429VMF: 6A High-Speed MOSFET
Driver, Inverting,
PB Free
G
=
=
Lead-Free device*
Blank
DFN package,
* Available on selected packages. Contact your local sales
representative for availability
-40°C to +125°C
Sales and Support
Data Sheets
Products supported by a preliminary Data Sheet may have an errata sheet describing minor operational differences and
recommended workarounds. To determine if an errata sheet exists for a particular device, please contact one of the following:
1. Your local Microchip sales office
2. The Microchip Worldwide Site (www.microchip.com)
Please specify which device, revision of silicon and Data Sheet (include Literature #) you are using.
Customer Notification System
Register on our web site (www.microchip.com/cn) to receive the most current information on our products.
2002-2012 Microchip Technology Inc.
DS21419D-page 19
TC4420/TC4429
NOTES:
DS21419D-page 20
2002-2012 Microchip Technology Inc.
Note the following details of the code protection feature on Microchip devices:
•
Microchip products meet the specification contained in their particular Microchip Data Sheet.
•
Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the
intended manner and under normal conditions.
•
There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our
knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data
Sheets. Most likely, the person doing so is engaged in theft of intellectual property.
•
•
Microchip is willing to work with the customer who is concerned about the integrity of their code.
Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not
mean that we are guaranteeing the product as “unbreakable.”
Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our
products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts
allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act.
Information contained in this publication regarding device
applications and the like is provided only for your convenience
and may be superseded by updates. It is your responsibility to
ensure that your application meets with your specifications.
MICROCHIP MAKES NO REPRESENTATIONS OR
WARRANTIES OF ANY KIND WHETHER EXPRESS OR
IMPLIED, WRITTEN OR ORAL, STATUTORY OR
OTHERWISE, RELATED TO THE INFORMATION,
INCLUDING BUT NOT LIMITED TO ITS CONDITION,
QUALITY, PERFORMANCE, MERCHANTABILITY OR
FITNESS FOR PURPOSE. Microchip disclaims all liability
arising from this information and its use. Use of Microchip
devices in life support and/or safety applications is entirely at
the buyer’s risk, and the buyer agrees to defend, indemnify and
hold harmless Microchip from any and all damages, claims,
suits, or expenses resulting from such use. No licenses are
conveyed, implicitly or otherwise, under any Microchip
intellectual property rights.
Trademarks
The Microchip name and logo, the Microchip logo, dsPIC,
FlashFlex, KEELOQ, KEELOQ logo, MPLAB, PIC, PICmicro,
PICSTART, PIC logo, rfPIC, SST, SST Logo, SuperFlash
and UNI/O are registered trademarks of Microchip Technology
Incorporated in the U.S.A. and other countries.
32
FilterLab, Hampshire, HI-TECH C, Linear Active Thermistor,
MTP, SEEVAL and The Embedded Control Solutions
Company are registered trademarks of Microchip Technology
Incorporated in the U.S.A.
Silicon Storage Technology is a registered trademark of
Microchip Technology Inc. in other countries.
Analog-for-the-Digital Age, Application Maestro, BodyCom,
chipKIT, chipKIT logo, CodeGuard, dsPICDEM,
dsPICDEM.net, dsPICworks, dsSPEAK, ECAN,
ECONOMONITOR, FanSense, HI-TIDE, In-Circuit Serial
Programming, ICSP, Mindi, MiWi, MPASM, MPF, MPLAB
Certified logo, MPLIB, MPLINK, mTouch, Omniscient Code
Generation, PICC, PICC-18, PICDEM, PICDEM.net, PICkit,
PICtail, REAL ICE, rfLAB, Select Mode, SQI, Serial Quad I/O,
Total Endurance, TSHARC, UniWinDriver, WiperLock, ZENA
and Z-Scale are trademarks of Microchip Technology
Incorporated in the U.S.A. and other countries.
SQTP is a service mark of Microchip Technology Incorporated
in the U.S.A.
GestIC and ULPP are registered trademarks of Microchip
Technology Germany II GmbH & Co. & KG, a subsidiary of
Microchip Technology Inc., in other countries.
All other trademarks mentioned herein are property of their
respective companies.
© 2002-2012, Microchip Technology Incorporated, Printed in
the U.S.A., All Rights Reserved.
Printed on recycled paper.
ISBN: 9781620767948
QUALITY MANAGEMENT SYSTEM
CERTIFIED BY DNV
Microchip received ISO/TS-16949:2009 certification for its worldwide
headquarters, design and wafer fabrication facilities in Chandler and
Tempe, Arizona; Gresham, Oregon and design centers in California
and India. The Company’s quality system processes and procedures
are for its PIC® MCUs and dsPIC® DSCs, KEELOQ® code hopping
devices, Serial EEPROMs, microperipherals, nonvolatile memory and
analog products. In addition, Microchip’s quality system for the design
and manufacture of development systems is ISO 9001:2000 certified.
== ISO/TS 16949 ==
2002-2012 Microchip Technology Inc.
DS21419D-page 21
Worldwide Sales and Service
AMERICAS
ASIA/PACIFIC
ASIA/PACIFIC
EUROPE
Corporate Office
2355 West Chandler Blvd.
Chandler, AZ 85224-6199
Tel: 480-792-7200
Fax: 480-792-7277
Technical Support:
http://www.microchip.com/
support
Asia Pacific Office
Suites 3707-14, 37th Floor
Tower 6, The Gateway
Harbour City, Kowloon
Hong Kong
Tel: 852-2401-1200
Fax: 852-2401-3431
India - Bangalore
Tel: 91-80-3090-4444
Fax: 91-80-3090-4123
Austria - Wels
Tel: 43-7242-2244-39
Fax: 43-7242-2244-393
Denmark - Copenhagen
Tel: 45-4450-2828
Fax: 45-4485-2829
India - New Delhi
Tel: 91-11-4160-8631
Fax: 91-11-4160-8632
France - Paris
Tel: 33-1-69-53-63-20
Fax: 33-1-69-30-90-79
India - Pune
Tel: 91-20-2566-1512
Fax: 91-20-2566-1513
Australia - Sydney
Tel: 61-2-9868-6733
Fax: 61-2-9868-6755
Web Address:
www.microchip.com
Germany - Munich
Tel: 49-89-627-144-0
Fax: 49-89-627-144-44
Japan - Osaka
Tel: 81-66-152-7160
Fax: 81-66-152-9310
Atlanta
Duluth, GA
Tel: 678-957-9614
Fax: 678-957-1455
China - Beijing
Tel: 86-10-8569-7000
Fax: 86-10-8528-2104
Italy - Milan
Tel: 39-0331-742611
Fax: 39-0331-466781
Japan - Yokohama
Tel: 81-45-471- 6166
Fax: 81-45-471-6122
China - Chengdu
Tel: 86-28-8665-5511
Fax: 86-28-8665-7889
Boston
Westborough, MA
Tel: 774-760-0087
Fax: 774-760-0088
Netherlands - Drunen
Tel: 31-416-690399
Fax: 31-416-690340
Korea - Daegu
Tel: 82-53-744-4301
Fax: 82-53-744-4302
China - Chongqing
Tel: 86-23-8980-9588
Fax: 86-23-8980-9500
Chicago
Itasca, IL
Tel: 630-285-0071
Fax: 630-285-0075
Spain - Madrid
Tel: 34-91-708-08-90
Fax: 34-91-708-08-91
Korea - Seoul
China - Hangzhou
Tel: 86-571-2819-3187
Fax: 86-571-2819-3189
Tel: 82-2-554-7200
Fax: 82-2-558-5932 or
82-2-558-5934
UK - Wokingham
Tel: 44-118-921-5869
Fax: 44-118-921-5820
Cleveland
Independence, OH
Tel: 216-447-0464
Fax: 216-447-0643
China - Hong Kong SAR
Tel: 852-2943-5100
Fax: 852-2401-3431
Malaysia - Kuala Lumpur
Tel: 60-3-6201-9857
Fax: 60-3-6201-9859
Dallas
Addison, TX
Tel: 972-818-7423
Fax: 972-818-2924
China - Nanjing
Tel: 86-25-8473-2460
Fax: 86-25-8473-2470
Malaysia - Penang
Tel: 60-4-227-8870
Fax: 60-4-227-4068
China - Qingdao
Tel: 86-532-8502-7355
Fax: 86-532-8502-7205
Philippines - Manila
Tel: 63-2-634-9065
Fax: 63-2-634-9069
Detroit
Farmington Hills, MI
Tel: 248-538-2250
Fax: 248-538-2260
China - Shanghai
Tel: 86-21-5407-5533
Fax: 86-21-5407-5066
Singapore
Tel: 65-6334-8870
Fax: 65-6334-8850
Indianapolis
Noblesville, IN
Tel: 317-773-8323
Fax: 317-773-5453
China - Shenyang
Tel: 86-24-2334-2829
Fax: 86-24-2334-2393
Taiwan - Hsin Chu
Tel: 886-3-5778-366
Fax: 886-3-5770-955
Los Angeles
China - Shenzhen
Tel: 86-755-8864-2200
Fax: 86-755-8203-1760
Taiwan - Kaohsiung
Tel: 886-7-213-7828
Fax: 886-7-330-9305
Mission Viejo, CA
Tel: 949-462-9523
Fax: 949-462-9608
China - Wuhan
Tel: 86-27-5980-5300
Fax: 86-27-5980-5118
Taiwan - Taipei
Tel: 886-2-2508-8600
Fax: 886-2-2508-0102
Santa Clara
Santa Clara, CA
Tel: 408-961-6444
Fax: 408-961-6445
China - Xian
Tel: 86-29-8833-7252
Fax: 86-29-8833-7256
Thailand - Bangkok
Tel: 66-2-694-1351
Fax: 66-2-694-1350
Toronto
Mississauga, Ontario,
Canada
China - Xiamen
Tel: 905-673-0699
Fax: 905-673-6509
Tel: 86-592-2388138
Fax: 86-592-2388130
China - Zhuhai
Tel: 86-756-3210040
Fax: 86-756-3210049
11/27/12
DS21419D-page 22
2002-2012 Microchip Technology Inc.
相关型号：
TC4421AVMF13
10 A BUF OR INV BASED MOSFET DRIVER, PDSO8, 6 X 8 MM, LEAD FREE, PLASTIC, MO-220, DFN-8
MICROCHIP
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