TC4427COA713G [MICROCHIP]
1.5 A 2 CHANNEL, BUF OR INV BASED MOSFET DRIVER, PDSO8, 0.150 INCH, PLASTIC, MS-012, SOIC-8;
| 型号： | TC4427COA713G |
| 厂家： | 
MICROCHIP |
| 描述： | 1.5 A 2 CHANNEL, BUF OR INV BASED MOSFET DRIVER, PDSO8, 0.150 INCH, PLASTIC, MS-012, SOIC-8 驱动 光电二极管 |
| 文件： | 总28页 (文件大小：836K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
TC4426/TC4427/TC4428
1.5A Dual High-Speed Power MOSFET Drivers
Features:
General Description:
• High Peak Output Current: 1.5A
• Wide Input Supply Voltage Operating Range:
- 4.5V to 18V
The TC4426/TC4427/TC4428 are improved versions
of the earlier TC426/TC427/TC428 family of MOSFET
drivers. The TC4426/TC4427/TC4428 devices have
matched rise and fall times when charging and
discharging the gate of a MOSFET.
• High Capacitive Load Drive Capability: 1000 pF in
25 ns (typical)
These devices are highly latch-up resistant under any
conditions within their power and voltage ratings. They
are not subject to damage when up to 5V of noise
spiking (of either polarity) occurs on the ground pin.
They can accept, without damage or logic upset, up to
500 mA of reverse current (of either polarity) being
forced back into their outputs. All terminals are fully
protected against Electrostatic Discharge (ESD) up to
2.0 kV.
• Short Delay Times: 40 ns (typical)
• Matched Rise and Fall Times
• Low Supply Current:
- With Logic ‘1’ Input – 4 mA
- With Logic ‘0’ Input – 400 µA
• Low Output Impedance: 7
• Latch-Up Protected: Withstands 0.5A Reverse
Current
The TC4426/TC4427/TC4428 MOSFET drivers can
easily charge/discharge 1000 pF gate capacitances in
under 30 ns. These devices provide low enough
impedances in both the On and Off states to ensure the
MOSFET’s intended state is not affected, even by large
transients.
• Input Withstands Negative Inputs Up to 5V
• Electrostatic Discharge (ESD) Protected: 2.0 kV
• Space-saving 8-Pin MSOP and 8-Pin 6x5 DFN-S
Packages
Applications:
Other compatible drivers are the TC4426A/TC4427A/
TC4428A family of devices. The TC4426A/TC4427A/
TC4428A devices have matched leading and falling
edge input-to-output delay times, in addition to the
matched rise and fall times of the TC4426/TC4427/
TC4428 devices.
• Switch Mode Power Supplies
• Line Drivers
• Pulse Transformer Drive
Package Types
8-Pin MSOP/
PDIP/SOIC TC4426 TC4427 TC4428
8-Pin DFN-S* TC4426 TC4427 TC4428
NC
NC 1
IN A 2
GND 3
IN B 4
8
7
6
5
NC
NC
NC
NC
1
8
NC
NC
TC4426
TC4427
TC4428
OUT A
OUT A
OUT A
IN A
GND
IN B
OUT A
2
3
4
7
6
5
OUT A
OUT A
EP
9
V
V
V
DD
DD
DD
V
OUT B
V
V
OUT B
OUT B
DD
DD
DD
OUT B
OUT B
OUT B
* Includes Exposed Thermal Pad (EP); see Table 3-1.
2006-2014 Microchip Technology Inc.
DS20001422G-page 1
TC4426/TC4427/TC4428
Functional Block Diagram
VDD
Inverting
1.5 mA
300 mV
Output
Non-Inverting
Input
Effective
Input C = 12 pF
(Each Input)
4.7V
TC4426/TC4427/TC4428
GND
Note 1: TC4426 has two inverting drivers, while the TC4427 has two non-inverting
drivers. The TC4428 has one inverting and one non-inverting driver.
2: Ground any unused driver input.
DS20001422G-page 2
2006-2014 Microchip Technology Inc.
TC4426/TC4427/TC4428
† Stresses above those listed under “Absolute Maximum
Ratings” may cause permanent damage to the device. These
are stress ratings only and functional operation of the device
at these or any other conditions above those indicated in the
operation sections of the specifications is not implied.
Exposure to Absolute Maximum Rating conditions for
extended periods may affect device reliability.
1.0
ELECTRICAL
CHARACTERISTICS
Absolute Maximum Ratings †
Supply Voltage ................................................................+22V
Input Voltage, IN A or IN B..........(V + 0.3V) to (GND – 5V)
DD
Package Power Dissipation (T +70°C)
A
DFN-S ..................................................................... Note 3
MSOP.....................................................................340 mW
PDIP.......................................................................730 mW
SOIC.......................................................................470 mW
Storage Temperature Range.........................-65°C to +150°C
Maximum Junction Temperature.................................+150°C
DC CHARACTERISTICS
Electrical Specifications: Unless otherwise noted, TA = +25ºC with 4.5V VDD 18V.
Parameters
Sym.
Min.
Typ.
Max. Units
Conditions
Input
Logic ‘1’, High Input Voltage
Logic ‘0’, Low Input Voltage
Input Current
VIH
VIL
IIN
2.4
—
—
—
—
—
0.8
V
V
Note 2
-1.0
+1.0
µA 0VVINVDD
Output
High Output Voltage
Low Output Voltage
Output Resistance
Peak Output Current
VOH
VOL
RO
VDD – 0.025
—
—
—
0.025
10
V
V
A
A
DC Test
—
—
—
—
DC Test
7
IOUT = 10 mA, VDD = 18V
VDD = 18V
IPK
1.5
> 0.5
—
Latch-Up Protection
IREV
—
Duty cycle2%, t 300 µs
Withstand Reverse Current
VDD = 18V
Switching Time (Note 1)
Rise Time
tR
tF
—
—
—
—
19
19
20
40
30
30
30
50
ns Figure 4-1
ns Figure 4-1
ns Figure 4-1
ns Figure 4-1
Fall Time
Delay Time
tD1
tD2
Delay Time
Power Supply
Power Supply Current
IS
—
—
—
—
4.5
0.4
mA VIN = 3V (Both inputs)
VIN = 0V (Both inputs)
Note 1: Switching times ensured by design.
2: For V temperature range devices, the VIH (Min) limit is 2.0V.
3: Package power dissipation is dependent on the copper pad area on the PCB.
2006-2014 Microchip Technology Inc.
DS20001422G-page 3
TC4426/TC4427/TC4428
DC CHARACTERISTICS (OVER OPERATING TEMPERATURE RANGE)
Electrical Specifications: Unless otherwise noted, over operating temperature range with 4.5V VDD 18V.
Parameters
Sym.
Min.
Typ.
Max. Units
Conditions
Input
Logic ‘1’, High Input Voltage
Logic ‘0’, Low Input Voltage
Input Current
VIH
VIL
IIN
2.4
—
—
—
—
—
0.8
+10
V
V
Note 2
-10
µA 0VVINVDD
Output
High Output Voltage
Low Output Voltage
Output Resistance
Peak Output Current
VOH
VOL
RO
VDD – 0.025
—
—
—
0.025
12
V
V
A
A
DC Test
—
—
—
—
DC Test
9
IOUT = 10 mA, VDD = 18V
VDD = 18V
IPK
1.5
>0.5
—
Latch-Up Protection
IREV
—
Duty cycle2%, t 300 µs
Withstand Reverse Current
VDD = 18V
Switching Time (Note 1)
Rise Time
tR
tF
—
—
—
—
—
—
—
—
40
40
40
60
ns
ns
ns
ns
Figure 4-1
Figure 4-1
Figure 4-1
Figure 4-1
Fall Time
Delay Time
tD1
tD2
Delay Time
Power Supply
Power Supply Current
IS
—
—
—
—
8.0
0.6
mA VIN = 3V (Both inputs)
IN = 0V (Both inputs)
V
Note 1: Switching times ensured by design.
2: For V temperature range devices, the VIH (Min) limit is 2.0V.
TEMPERATURE CHARACTERISTICS
Electrical Specifications: Unless otherwise noted, all parameters apply with 4.5V VDD 18V.
Parameters
Temperature Ranges
Sym.
Min.
Typ.
Max.
Units
Conditions
Specified Temperature Range (C)
Specified Temperature Range (E)
Specified Temperature Range (V)
Maximum Junction Temperature
Storage Temperature Range
TA
TA
TA
TJ
TA
0
—
—
—
—
—
+70
+85
°C
°C
°C
°C
°C
-40
-40
—
+125
+150
+150
-65
Package Thermal Resistances
Thermal Resistance, 8L-6x5 DFN-S
Thermal Resistance, 8L-MSOP
Thermal Resistance, 8L-PDIP
Thermal Resistance, 8L-SOIC
JA
JA
JA
JA
—
—
—
—
33.2
206
125
155
—
—
—
—
°C/W
°C/W
°C/W
°C/W
DS20001422G-page 4
2006-2014 Microchip Technology Inc.
TC4426/TC4427/TC4428
2.0
TYPICAL PERFORMANCE CURVES
Note: The graphs and tables provided following this note are a statistical summary based on a limited number of
samples and are provided for informational purposes only. The performance characteristics listed herein
are not tested or guaranteed. In some graphs or tables, the data presented may be outside the specified
operating range (e.g., outside specified power supply range) and therefore outside the warranted range.
Note: Unless otherwise indicated, TA = +25ºC with 4.5V VDD 18V.
100
80
100
80
2200 pF
1500 pF
2200 pF
1500 pF
60
40
60
40
1000 pF
1000 pF
470 pF
100 pF
6
470 pF
100 pF
20
0
20
0
14
16
18
14
16
18
4
6
8
10
12
(V)
4
8
10
12
(V)
V
V
DD
DD
FIGURE 2-1:
Rise Time vs. Supply
FIGURE 2-4:
Fall Time vs. Supply
Voltage.
Voltage.
100
80
100
80
5V
5V
10V
15V
60
40
20
60
40
20
10V
15V
0
100
0
100
1000
10,000
1000
(pF)
10,000
C
(pF)
C
LOAD
LOAD
FIGURE 2-2:
Rise Time vs. Capacitive
FIGURE 2-5:
Fall Time vs. Capacitive
Load.
Load.
60
50
40
30
80
75
70
65
60
55
50
45
40
35
30
25
20
C
V
= 1000 pF
CLOAD = 1000 pF
VIN = 5V
LOAD
= 17.5V
DD
tD2
tD1
t
FALL
20
10
t
RISE
4
6
8
10
12
14
16
18
–55 –35 –15
5
25 45 65 85 105 125
VDD (V)
Temperature (˚C)
FIGURE 2-3:
Temperature.
Rise and Fall Times vs.
FIGURE 2-6:
Supply Voltage.
Propagation Delay Time vs.
2006-2014 Microchip Technology Inc.
DS20001422G-page 5
TC4426/TC4427/TC4428
Note: Unless otherwise indicated, TA = +25ºC with 4.5V VDD 18V.
60
45
CLOAD = 1000 pF
VDD = 12V
CLOAD = 1000 pF
55
50
45
40
35
30
25
20
15
10
VIN = 5V
40
35
30
25
20
15
10
VDD = 18V
tD2
tD2
tD1
tD1
-55 -35 -15
5
25 45 65 85 105 125
0
1
2
3
4
5
6
7
8
9
10 11 12
Input Amplitude (V)
Temperature (ºC)
FIGURE 2-7:
Input Amplitude.
Propagation Delay Time vs.
FIGURE 2-10:
Temperature.
Propagation Delay Time vs.
4.0
VDD = 18V
3.5
3.0
2.5
2.0
Both Inputs = 1
1
Both Inputs = 1
Both Inputs = 0
0.1
–55 –35 –15
5
25 45 65 85 105 125
A (˚C)
4
6
8
10
12
14
16
18
V
T
DD
FIGURE 2-8:
Supply Current vs. Supply
FIGURE 2-11:
Supply Current vs.
Voltage.
Temperature.
25
20
15
25
20
15
Worst Case @ TJ = +150˚C
Typical @ TA = +25˚C
Worst Case @ TJ = +150˚C
Typical @ T = +25˚C
A
10
10
5
4
5
4
14
16
18
14
16
18
6
8
10
12
6
8
10
12
VDD
VDD
FIGURE 2-9:
Output Resistance (ROH) vs.
FIGURE 2-12:
Output Resistance (ROL) vs.
Supply Voltage.
Supply Voltage.
DS20001422G-page 6
2006-2014 Microchip Technology Inc.
TC4426/TC4427/TC4428
Note: Unless otherwise indicated, TA = +25ºC with 4.5V VDD 18V.
60
60
2 MHz
1000 pF
2200 pF
V
= 18V
V
= 18V
= 12V
= 6V
DD
DD
50
40
30
20
50
40
30
20
900 kHz
600 kHz
100 pF
200 kHz
20 kHz
10
10
0
0
100
1000
(pF)
10,000
10
100
FREQUENCY (kHz)
1000
C
LOAD
FIGURE 2-13:
Capacitive Load.
Supply Current vs.
FIGURE 2-16:
Frequency.
Supply Current vs.
60
60
2200 pF
V
= 12V
2 MHz
V
DD
DD
50
40
30
20
50
40
30
20
1000 pF
900 kHz
600 kHz
100 pF
10
0
10
200 kHz
20 kHz
0
100
1000
10,000
10
100
1000
C
(pF)
LOAD
FREQUENCY (kHz)
FIGURE 2-14:
Capacitive Load.
Supply Current vs.
FIGURE 2-17:
Frequency.
Supply Current vs.
60
60
V
= 6V
V
DD
DD
50
40
30
20
50
40
30
20
2200 pF
2 MHz
1000 pF
900 kHz
600 kHz
200 kHz
20 kHz
10
0
10
0
100 pF
100
1000
10,000
10
100
FREQUENCY (kHz)
1000
C
(pF)
LOAD
FIGURE 2-15:
Supply Current vs.
FIGURE 2-18:
Supply Current vs.
Capacitive Load.
Frequency.
2006-2014 Microchip Technology Inc.
DS20001422G-page 7
TC4426/TC4427/TC4428
Note: Unless otherwise indicated, TA = +25ºC with 4.5V VDD 18V.
–8
10
9
8
7
6
5
4
3
2
–9
10
4
6
8
10
V
12
14
16
18
DD
Note:
The values on this graph represent the loss
seen by both drivers in a package during one
complete cycle. For a single driver, divide the
stated values by 2. For a single transition of a
single driver, divide the stated value by 4.
FIGURE 2-19:
Crossover Energy vs.
Supply Voltage.
DS20001422G-page 8
2006-2014 Microchip Technology Inc.
TC4426/TC4427/TC4428
3.0
PIN DESCRIPTIONS
The descriptions of the pins are listed in Table 3-1.
TABLE 3-1:
PIN FUNCTION TABLE ( 1)
8-Pin PDIP/
MSOP/SOIC
8-Pin
Symbol
DFN-S
Description
1
2
1
2
NC
IN A
GND
IN B
OUT B
VDD
No connection
Input A
3
3
Ground
4
4
Input B
5
5
Output B
6
6
Supply input
Output A
7
7
OUT A
NC
8
8
No connection
Exposed Metal Pad
—
PAD
NC
Note 1: Duplicate pins must be connected for proper operation.
3.1
Inputs A and B
3.4
Supply Input (V
)
DD
MOSFET driver inputs A and B are high-impedance,
TTL/CMOS compatible inputs. These inputs also have
300 mV of hysteresis between the high and low
thresholds that prevents output glitching even when the
rise and fall time of the input signal is very slow.
The VDD input is the bias supply for the MOSFET driver
and is rated for 4.5V to 18V with respect to the Ground
pin. The VDD input should be bypassed with local
ceramic capacitors. The value of these capacitors
should be chosen based on the capacitive load that is
being driven. A value of 1.0 µF is suggested.
3.2
Ground (GND)
3.5
Exposed Metal Pad
Ground is the device return pin. The Ground pin(s)
should have a low-impedance connection to the bias
supply source return. High peak current flows out the
Ground pin(s) when the capacitive load is being
discharged.
The exposed metal pad of the 6x5 DFN-S package is
not internally connected to any potential. Therefore,
this pad can be connected to a ground plane or other
copper plane on a Printed Circuit Board (PCB), to aid
in heat removal from the package.
3.3
Output A and B
MOSFET driver outputs A and B are low-impedance,
CMOS push-pull style outputs. The pull-down and pull-
up devices are of equal strength, making the rise and
fall times equivalent.
2006-2014 Microchip Technology Inc.
DS20001422G-page 9
TC4426/TC4427/TC4428
4.0
APPLICATIONS INFORMATION
+5V
90%
Input
10%
VDD = 18V
0V
VDD
tD1
tD2
t
tR
F
90%
90%
0.1 µF
4.7 µF
Output
0V
6
10%
10%
2
4
7
5
Input
Output
Inverting Driver
CL = 1000 pF
+5V
90%
Input
10%
0V
3
VDD
90%
90%
tD1
tD2
Input: 100 kHz,
square wave,
tRISE = tFALL 10 ns
tF
tR
Output
0V
10%
10%
Non-Inverting Driver
FIGURE 4-1:
Switching Time Test Circuit.
DS20001422G-page 10
2006-2014 Microchip Technology Inc.
TC4426/TC4427/TC4428
5.0
5.1
PACKAGING INFORMATION
Package Marking Information
8-Lead DFN-S (6x5x0.9 mm)
Example
TC4426
EMF^^
1315
256
NNN
PIN 1
PIN 1
8-Lead MSOP (3x3 mm)
Example
4426C
315256
8-Lead PDIP (300 mil)
Example
TC4427
CPA^^NNN
1315
XXXXXXXX
XXXXXNNN
YYWW
8-Lead SOIC (150 mil)
Example
TC4428C
OA^^YYWW
256
NNN
Legend: XX...X Customer specific information*
Y
YY
WW
NNN
Year code (last digit of calendar year)
Year code (last 2 digits of calendar year)
Week code (week of January 1 is week ‘01’)
Alphanumeric traceability code
Note: In the event the full Microchip part number cannot be marked on one line, it will
be carried over to the next line thus limiting the number of available characters
for customer specific information.
*
Standard device marking consists of Microchip part number, year code, week code and traceability code.
2006-2014 Microchip Technology Inc.
DS20001422G-page 11
TC4426/TC4427/TC4428
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e
D
L
b
N
N
K
E
E2
EXPOSED PAD
NOTE 1
NOTE 1
1
2
1
2
D2
BOTTOM VIEW
TOP VIEW
A
A3
A1
NOTE 2
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ꢟꢙ
ꢣꢙ
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ꢯ
ꢻ
ꢝꢂꢹꢶ
ꢙꢂꢙꢶ
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ꢶꢂꢙꢶ
ꢞꢂꢁꢶ
ꢙꢂꢞꢶ
ꢶꢂꢞꢳ
ꢶꢂꢴꢥ
ꢼ
ꢶꢂꢸꢶ
ꢼ
ꢑꢒꢊꢃꢉꢢ
ꢁꢂ ꢃꢄꢅꢀꢁꢀꢆꢄꢇꢈꢉꢊꢀꢄꢅꢋꢌꢍꢀꢎꢌꢉꢏꢈꢐꢌꢀꢑꢉꢒꢀꢆꢉꢐꢒꢓꢀꢔꢈꢏꢀꢑꢈꢇꢏꢀꢔꢌꢀꢊꢕꢖꢉꢏꢌꢋꢀꢗꢄꢏꢘꢄꢅꢀꢏꢘꢌꢀꢘꢉꢏꢖꢘꢌꢋꢀꢉꢐꢌꢉꢂ
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ꢝꢂ ꢃꢉꢖꢚꢉꢛꢌꢀꢄꢇꢀꢇꢉꢗꢀꢇꢄꢅꢛꢈꢊꢉꢏꢌꢋꢂ
ꢞꢂ ꢟꢄꢑꢌꢅꢇꢄꢕꢅꢄꢅꢛꢀꢉꢅꢋꢀꢏꢕꢊꢌꢐꢉꢅꢖꢄꢅꢛꢀꢜꢌꢐꢀꢠꢡꢢꢣꢀꢤꢁꢞꢂꢥꢢꢂ
ꢦꢡꢧꢨ ꢦꢉꢇꢄꢖꢀꢟꢄꢑꢌꢅꢇꢄꢕꢅꢂꢀꢩꢘꢌꢕꢐꢌꢏꢄꢖꢉꢊꢊꢒꢀꢌꢍꢉꢖꢏꢀꢆꢉꢊꢈꢌꢀꢇꢘꢕꢗꢅꢀꢗꢄꢏꢘꢕꢈꢏꢀꢏꢕꢊꢌꢐꢉꢅꢖꢌꢇꢂ
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ꢢꢄꢖꢐꢕꢖꢘꢄꢜ ꢩꢌꢖꢘꢅꢕꢊꢕꢛꢒ ꢟꢐꢉꢗꢄꢅꢛ ꢧꢶꢞꢺꢁꢙꢙꢦ
DS20001422G-page 12
2006-2014 Microchip Technology Inc.
TC4426/TC4427/TC4428
ꢑꢒꢊꢃꢢ ꢫꢕꢐꢀꢏꢘꢌꢀꢑꢕꢇꢏꢀꢖꢈꢐꢐꢌꢅꢏꢀꢜꢉꢖꢚꢉꢛꢌꢀꢋꢐꢉꢗꢄꢅꢛꢇꢓꢀꢜꢊꢌꢉꢇꢌꢀꢇꢌꢌꢀꢏꢘꢌꢀꢢꢄꢖꢐꢕꢖꢘꢄꢜꢀꢃꢉꢖꢚꢉꢛꢄꢅꢛꢀꢡꢜꢌꢖꢄꢎꢄꢖꢉꢏꢄꢕꢅꢀꢊꢕꢖꢉꢏꢌꢋꢀꢉꢏꢀ
ꢘꢏꢏꢜꢨꢬꢬꢗꢗꢗꢂꢑꢄꢖꢐꢕꢖꢘꢄꢜꢂꢖꢕꢑꢬꢜꢉꢖꢚꢉꢛꢄꢅꢛ
2006-2014 Microchip Technology Inc.
DS20001422G-page 13
TC4426/TC4427/TC4428
8$
1RWHꢀ For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
DS20001422G-page 14
2006-2014 Microchip Technology Inc.
TC4426/TC4427/TC4428
UA
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
2006-2014 Microchip Technology Inc.
DS20001422G-page 15
TC4426/TC4427/TC4428
8-Lead Plastic Micro Small Outline Package (UA) [MSOP]
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
DS20001422G-page 16
2006-2014 Microchip Technology Inc.
TC4426/TC4427/TC4428
ꢁꢂ/HDGꢃ3ODVWLFꢃ'XDOꢃ,Qꢂ/LQHꢃꢄ3$ꢅꢃꢂꢃꢆꢇꢇꢃPLOꢃ%RG\ꢃ>3',3@
1RWHꢀ For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
D
A
N
B
E1
NOTE 1
1
2
TOP VIEW
E
A2
A
C
3/$1(
L
c
A1
e
eB
8X b1
8X b
.010
C
SIDE VIEW
END VIEW
Microchip Technology Drawing No. C04-018D Sheet 1 of 2
2006-2014 Microchip Technology Inc.
DS20001422G-page 17
TC4426/TC4427/TC4428
ꢁꢂ/HDGꢃ3ODVWLFꢃ'XDOꢃ,Qꢂ/LQHꢃꢄ3$ꢅꢃꢂꢃꢆꢇꢇꢃPLOꢃ%RG\ꢃ>3',3@
1RWHꢀ For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
ALTERNATE LEAD DESIGN
(VENDOR DEPENDENT)
DATUM A
DATUM A
b
b
e
2
e
2
e
e
Units
Dimension Limits
INCHES
NOM
8
.100 BSC
-
MIN
MAX
Number of Pins
Pitch
N
e
A
Top to Seating Plane
-
.210
.195
-
Molded Package Thickness
Base to Seating Plane
Shoulder to Shoulder Width
Molded Package Width
Overall Length
Tip to Seating Plane
Lead Thickness
Upper Lead Width
A2
A1
E
E1
D
L
c
b1
b
eB
.115
.015
.290
.240
.348
.115
.008
.040
.014
-
.130
-
.310
.250
.365
.130
.010
.060
.018
-
.325
.280
.400
.150
.015
.070
.022
.430
Lower Lead Width
Overall Row Spacing
§
Notes:
1. Pin 1 visual index feature may vary, but must be located within the hatched area.
2. § Significant Characteristic
3. Dimensions D and E1 do not include mold flash or protrusions. Mold flash or
protrusions shall not exceed .010" per side.
4. Dimensioning and tolerancing per ASME Y14.5M
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
Microchip Technology Drawing No. C04-018D Sheet 2 of 2
DS20001422G-page 18
2006-2014 Microchip Technology Inc.
TC4426/TC4427/TC4428
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
2006-2014 Microchip Technology Inc.
DS20001422G-page 19
TC4426/TC4427/TC4428
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
DS20001422G-page 20
2006-2014 Microchip Technology Inc.
TC4426/TC4427/TC4428
ꢀꢁꢂꢃꢄꢅꢆꢇꢈꢄꢉꢊꢋꢌꢆꢠꢜꢄꢈꢈꢆꢣꢎꢊꢈꢋꢤꢃꢆꢕꢣꢥꢗꢆꢘꢆꢑꢄꢦꢦꢒꢧꢐꢆꢨꢩꢪꢫꢆꢜꢜꢆꢝꢒꢅꢞꢆꢟꢠꢣꢬꢭꢡ
ꢑꢒꢊꢃꢢ ꢫꢕꢐꢀꢏꢘꢌꢀꢑꢕꢇꢏꢀꢖꢈꢐꢐꢌꢅꢏꢀꢜꢉꢖꢚꢉꢛꢌꢀꢋꢐꢉꢗꢄꢅꢛꢇꢓꢀꢜꢊꢌꢉꢇꢌꢀꢇꢌꢌꢀꢏꢘꢌꢀꢢꢄꢖꢐꢕꢖꢘꢄꢜꢀꢃꢉꢖꢚꢉꢛꢄꢅꢛꢀꢡꢜꢌꢖꢄꢎꢄꢖꢉꢏꢄꢕꢅꢀꢊꢕꢖꢉꢏꢌꢋꢀꢉꢏꢀ
ꢘꢏꢏꢜꢨꢬꢬꢗꢗꢗꢂꢑꢄꢖꢐꢕꢖꢘꢄꢜꢂꢖꢕꢑꢬꢜꢉꢖꢚꢉꢛꢄꢅꢛ
2006-2014 Microchip Technology Inc.
DS20001422G-page 21
TC4426/TC4427/TC4428
NOTES:
DS20001422G-page 22
2006-2014 Microchip Technology Inc.
TC4426/TC4427/TC4428
APPENDIX A: REVISION HISTORY
Revision G (July 2014)
The following is the list of modifications:
1. Updated the Functional Block Diagram.
Revision F (September 2013)
The following is the list of modifications:
2. Updated the Electrostatic Discharge (ESD)
rating to 2kV in the Features section.
3. Updated the package drawings in Section 5.0
“Packaging Information”.
4. Minor typographical and editorial corrections.
Revisions E (December 2012)
• Added a note to each package outline drawing.
2006-2014 Microchip Technology Inc.
DS20001422G-page 23
TC4426/TC4427/TC4428
NOTES:
DS20001422G-page 24
2006-2014 Microchip Technology Inc.
TC4426/TC4427/TC4428
PRODUCT IDENTIFICATION SYSTEM
To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office.
Examples:
PART NO.
Device
X
XX
XXX
X
a) TC4426COA:
1.5A Dual Inverting
MOSFET driver,
0°C to +70°C
Temperature Package Tape & Reel
Range
PB Free
SOIC package.
b) TC4426EUA:
c) TC4426EMF:
1.5A Dual Inverting
MOSFET driver,
-40°C to +85°C.
MSOP package.
Device:
TC4426: 1.5A Dual MOSFET Driver, Inverting
TC4427: 1.5A Dual MOSFET Driver, Non-Inverting
TC4428: 1.5A Dual MOSFET Driver, Complementary
1.5A Dual Inverting
MOSFET driver,
-40°C to +85°C,
DFN-S package.
Temperature Range:
Package:
C
E
V
=
=
=
0°C to +70°C (PDIP and SOIC only)
-40°C to +85°C
-40°C to +125°C
MF
=
Dual, Flat, No-Lead (6X5 mm Body), 8-lead
a) TC4427CPA:
b) TC4427EPA:
1.5A Dual Non-Inverting
MOSFET driver,
0°C to +70°C
MF713 = Dual, Flat, No-Lead (6X5 mm Body), 8-lead
(Tape and Reel)
OA
= Plastic SOIC, (150 mil Body), 8-lead
PDIP package.
OA713 = Plastic SOIC, (150 mil Body), 8-lead
(Tape and Reel)
1.5A Dual Non-Inverting
MOSFET driver,
-40°C to +85°C
PA
UA
=
=
Plastic DIP (300 mil Body), 8-lead
Plastic Micro Small Outline (MSOP), 8-lead
UA713 = Plastic Micro Small Outline (MSOP), 8-lead
(Tape and Reel)
PDIP package.
a) TC4428COA713:1.5A Dual Complementary
MOSFET driver,
0°C to +70°C,
SOIC package,
Tape and Reel.
b) TC4428EMF:
1.5A Dual Complementary,
MOSFET driver,
-40°C to +85°C
DFN-S package.
2006-2014 Microchip Technology Inc.
DS20001422G-page 25
TC4426/TC4427/TC4428
NOTES:
DS20001422G-page 26
2006-2014 Microchip Technology Inc.
Note the following details of the code protection feature on Microchip devices:
•
Microchip products meet the specification contained in their particular Microchip Data Sheet.
•
Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the
intended manner and under normal conditions.
•
There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our
knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data
Sheets. Most likely, the person doing so is engaged in theft of intellectual property.
•
•
Microchip is willing to work with the customer who is concerned about the integrity of their code.
Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not
mean that we are guaranteeing the product as “unbreakable.”
Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our
products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts
allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act.
Information contained in this publication regarding device
applications and the like is provided only for your convenience
and may be superseded by updates. It is your responsibility to
ensure that your application meets with your specifications.
MICROCHIP MAKES NO REPRESENTATIONS OR
WARRANTIES OF ANY KIND WHETHER EXPRESS OR
IMPLIED, WRITTEN OR ORAL, STATUTORY OR
OTHERWISE, RELATED TO THE INFORMATION,
INCLUDING BUT NOT LIMITED TO ITS CONDITION,
QUALITY, PERFORMANCE, MERCHANTABILITY OR
FITNESS FOR PURPOSE. Microchip disclaims all liability
arising from this information and its use. Use of Microchip
devices in life support and/or safety applications is entirely at
the buyer’s risk, and the buyer agrees to defend, indemnify and
hold harmless Microchip from any and all damages, claims,
suits, or expenses resulting from such use. No licenses are
conveyed, implicitly or otherwise, under any Microchip
intellectual property rights.
Trademarks
The Microchip name and logo, the Microchip logo, dsPIC,
FlashFlex, flexPWR, JukeBlox, KEELOQ, KEELOQ logo, Kleer,
LANCheck, MediaLB, MOST, MOST logo, MPLAB,
32
OptoLyzer, PIC, PICSTART, PIC logo, RightTouch, SpyNIC,
SST, SST Logo, SuperFlash and UNI/O are registered
trademarks of Microchip Technology Incorporated in the
U.S.A. and other countries.
The Embedded Control Solutions Company and mTouch are
registered trademarks of Microchip Technology Incorporated
in the U.S.A.
Analog-for-the-Digital Age, BodyCom, chipKIT, chipKIT logo,
CodeGuard, dsPICDEM, dsPICDEM.net, ECAN, In-Circuit
Serial Programming, ICSP, Inter-Chip Connectivity, KleerNet,
KleerNet logo, MiWi, MPASM, MPF, MPLAB Certified logo,
MPLIB, MPLINK, MultiTRAK, NetDetach, Omniscient Code
Generation, PICDEM, PICDEM.net, PICkit, PICtail,
RightTouch logo, REAL ICE, SQI, Serial Quad I/O, Total
Endurance, TSHARC, USBCheck, VariSense, ViewSpan,
WiperLock, Wireless DNA, and ZENA are trademarks of
Microchip Technology Incorporated in the U.S.A. and other
countries.
SQTP is a service mark of Microchip Technology Incorporated
in the U.S.A.
Silicon Storage Technology is a registered trademark of
Microchip Technology Inc. in other countries.
GestIC is a registered trademarks of Microchip Technology
Germany II GmbH & Co. KG, a subsidiary of Microchip
Technology Inc., in other countries.
All other trademarks mentioned herein are property of their
respective companies.
© 2006-2014, Microchip Technology Incorporated, Printed in
the U.S.A., All Rights Reserved.
ISBN:978-1-63276-371-6
QUALITY MANAGEMENT SYSTEM
CERTIFIED BY DNV
Microchip received ISO/TS-16949:2009 certification for its worldwide
headquarters, design and wafer fabrication facilities in Chandler and
Tempe, Arizona; Gresham, Oregon and design centers in California
and India. The Company’s quality system processes and procedures
are for its PIC® MCUs and dsPIC® DSCs, KEELOQ® code hopping
devices, Serial EEPROMs, microperipherals, nonvolatile memory and
analog products. In addition, Microchip’s quality system for the design
and manufacture of development systems is ISO 9001:2000 certified.
== ISO/TS 16949 ==
2006-2014 Microchip Technology Inc.
DS20001422G-page 27
Worldwide Sales and Service
AMERICAS
ASIA/PACIFIC
ASIA/PACIFIC
EUROPE
Corporate Office
2355 West Chandler Blvd.
Chandler, AZ 85224-6199
Tel: 480-792-7200
Fax: 480-792-7277
Technical Support:
http://www.microchip.com/
support
Asia Pacific Office
Suites 3707-14, 37th Floor
Tower 6, The Gateway
Harbour City, Kowloon
Hong Kong
Tel: 852-2943-5100
Fax: 852-2401-3431
India - Bangalore
Tel: 91-80-3090-4444
Fax: 91-80-3090-4123
Austria - Wels
Tel: 43-7242-2244-39
Fax: 43-7242-2244-393
Denmark - Copenhagen
Tel: 45-4450-2828
Fax: 45-4485-2829
India - New Delhi
Tel: 91-11-4160-8631
Fax: 91-11-4160-8632
France - Paris
Tel: 33-1-69-53-63-20
Fax: 33-1-69-30-90-79
India - Pune
Tel: 91-20-3019-1500
Australia - Sydney
Tel: 61-2-9868-6733
Fax: 61-2-9868-6755
Web Address:
www.microchip.com
Japan - Osaka
Tel: 81-6-6152-7160
Fax: 81-6-6152-9310
Germany - Dusseldorf
Tel: 49-2129-3766400
Atlanta
Duluth, GA
Tel: 678-957-9614
Fax: 678-957-1455
China - Beijing
Tel: 86-10-8569-7000
Fax: 86-10-8528-2104
Germany - Munich
Tel: 49-89-627-144-0
Fax: 49-89-627-144-44
Japan - Tokyo
Tel: 81-3-6880- 3770
Fax: 81-3-6880-3771
China - Chengdu
Tel: 86-28-8665-5511
Fax: 86-28-8665-7889
Austin, TX
Tel: 512-257-3370
Germany - Pforzheim
Tel: 49-7231-424750
Korea - Daegu
Tel: 82-53-744-4301
Fax: 82-53-744-4302
Boston
China - Chongqing
Tel: 86-23-8980-9588
Fax: 86-23-8980-9500
Italy - Milan
Tel: 39-0331-742611
Fax: 39-0331-466781
Westborough, MA
Tel: 774-760-0087
Fax: 774-760-0088
Korea - Seoul
Tel: 82-2-554-7200
Fax: 82-2-558-5932 or
82-2-558-5934
China - Hangzhou
Tel: 86-571-8792-8115
Fax: 86-571-8792-8116
Italy - Venice
Tel: 39-049-7625286
Chicago
Itasca, IL
Tel: 630-285-0071
Fax: 630-285-0075
Netherlands - Drunen
Tel: 31-416-690399
Fax: 31-416-690340
Malaysia - Kuala Lumpur
Tel: 60-3-6201-9857
Fax: 60-3-6201-9859
China - Hong Kong SAR
Tel: 852-2943-5100
Fax: 852-2401-3431
Cleveland
Independence, OH
Tel: 216-447-0464
Fax: 216-447-0643
Poland - Warsaw
Tel: 48-22-3325737
Malaysia - Penang
Tel: 60-4-227-8870
Fax: 60-4-227-4068
China - Nanjing
Tel: 86-25-8473-2460
Fax: 86-25-8473-2470
Spain - Madrid
Tel: 34-91-708-08-90
Fax: 34-91-708-08-91
Dallas
Addison, TX
Tel: 972-818-7423
Fax: 972-818-2924
Philippines - Manila
Tel: 63-2-634-9065
Fax: 63-2-634-9069
China - Qingdao
Tel: 86-532-8502-7355
Fax: 86-532-8502-7205
Sweden - Stockholm
Tel: 46-8-5090-4654
Singapore
Tel: 65-6334-8870
Fax: 65-6334-8850
Detroit
Novi, MI
Tel: 248-848-4000
China - Shanghai
Tel: 86-21-5407-5533
Fax: 86-21-5407-5066
UK - Wokingham
Tel: 44-118-921-5800
Fax: 44-118-921-5820
Taiwan - Hsin Chu
Tel: 886-3-5778-366
Fax: 886-3-5770-955
Houston, TX
Tel: 281-894-5983
China - Shenyang
Tel: 86-24-2334-2829
Fax: 86-24-2334-2393
Indianapolis
Noblesville, IN
Tel: 317-773-8323
Fax: 317-773-5453
Taiwan - Kaohsiung
Tel: 886-7-213-7830
China - Shenzhen
Tel: 86-755-8864-2200
Fax: 86-755-8203-1760
Taiwan - Taipei
Tel: 886-2-2508-8600
Fax: 886-2-2508-0102
Los Angeles
China - Wuhan
Tel: 86-27-5980-5300
Fax: 86-27-5980-5118
Mission Viejo, CA
Tel: 949-462-9523
Fax: 949-462-9608
Thailand - Bangkok
Tel: 66-2-694-1351
Fax: 66-2-694-1350
China - Xian
Tel: 86-29-8833-7252
Fax: 86-29-8833-7256
New York, NY
Tel: 631-435-6000
San Jose, CA
Tel: 408-735-9110
China - Xiamen
Tel: 86-592-2388138
Fax: 86-592-2388130
Canada - Toronto
Tel: 905-673-0699
Fax: 905-673-6509
China - Zhuhai
Tel: 86-756-3210040
Fax: 86-756-3210049
03/25/14
DS20001422G-page 28
2006-2014 Microchip Technology Inc.
相关型号：
TC4427COA723
1.5 A 2 CHANNEL, BUF OR INV BASED MOSFET DRIVER, PDSO8, SOIC-8Warning: Undefined variable $rtag in /www/wwwroot/website_ic37/www.icpdf.com/pdf/pdf/index.php on line 217
-
MICROCHIP
TC4427COAG
1.5 A 2 CHANNEL, BUF OR INV BASED MOSFET DRIVER, PDSO8, 0.150 INCH, PLASTIC, MS-012, SOIC-8Warning: Undefined variable $rtag in /www/wwwroot/website_ic37/www.icpdf.com/pdf/pdf/index.php on line 217
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MICROCHIP
TC4427COART
Buffer/Inverter Based MOSFET Driver, 1.5A, PDSO8, SOIC-8Warning: Undefined variable $rtag in /www/wwwroot/website_ic37/www.icpdf.com/pdf/pdf/index.php on line 217
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MICROCHIP
TC4427COATR
1.5 A 2 CHANNEL, BUF OR INV BASED MOSFET DRIVER, PDSO8, 0.150 INCH, PLASTIC, MS-012, SOIC-8Warning: Undefined variable $rtag in /www/wwwroot/website_ic37/www.icpdf.com/pdf/pdf/index.php on line 217
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MICROCHIP
TC4427CPA
1.5A DUAL HIGH-SPEED POWER MOSFET DRIVERSWarning: Undefined variable $rtag in /www/wwwroot/website_ic37/www.icpdf.com/pdf/pdf/index.php on line 217
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MICROCHIP
TC4427CPA
1.5A DUAL HIGH-SPEED, POWER MOSFET DRIVERSWarning: Undefined variable $rtag in /www/wwwroot/website_ic37/www.icpdf.com/pdf/pdf/index.php on line 217
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TELCOM
TC4427CPAG
暂无描述Warning: Undefined variable $rtag in /www/wwwroot/website_ic37/www.icpdf.com/pdf/pdf/index.php on line 217
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MICROCHIP
TC4427CUA
1.5A Dual High-Speed Power MOSFET DriversWarning: Undefined variable $rtag in /www/wwwroot/website_ic37/www.icpdf.com/pdf/pdf/index.php on line 217
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MICROCHIP
TC4427CUA713
1.5A Dual High-Speed Power MOSFET DriversWarning: Undefined variable $rtag in /www/wwwroot/website_ic37/www.icpdf.com/pdf/pdf/index.php on line 217
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MICROCHIP
TC4427EMF
1.5A Dual High-Speed Power MOSFET DriversWarning: Undefined variable $rtag in /www/wwwroot/website_ic37/www.icpdf.com/pdf/pdf/index.php on line 217
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MICROCHIP
TC4427EMF713
1.5A Dual High-Speed Power MOSFET DriversWarning: Undefined variable $rtag in /www/wwwroot/website_ic37/www.icpdf.com/pdf/pdf/index.php on line 217
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MICROCHIP
TC4427EOA
1.5A DUAL HIGH-SPEED POWER MOSFET DRIVERSWarning: Undefined variable $rtag in /www/wwwroot/website_ic37/www.icpdf.com/pdf/pdf/index.php on line 217
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MICROCHIP
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