TC553002IMBTR [MICROCHIP]

Regulator;
TC553002IMBTR
型号: TC553002IMBTR
厂家: MICROCHIP    MICROCHIP
描述:

Regulator

文件: 总18页 (文件大小:382K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
TC55  
M
1 µA Low Dropout Positive Voltage Regulator  
Features  
General Description  
• Very Low Dropout Voltage: 120 mV (typ) at  
The TC55 Series is a collection of CMOS low dropout  
positive voltage regulators that can source up to  
250 mA of current, with an extremely low input-output  
voltage differential of 380 mV (typ) at 200 mA.  
100 mA, 380 mV (typ) at 200 mA  
• High Output Current: 250 mA (V  
= 5.0V)  
OUT  
• High Accuracy Output Voltage: ±2% (max)  
(±1% Semi-Custom Version)  
• Low Power Consumption: 1.1 µA (typ)  
• Low Temperature Drift: ±100 ppm/°C (typ)  
• Excellent Line Regulation: 0.2%/V (typ)  
• Package Options: 3-Pin SOT-23A, 3-Pin SOT-89  
and 3-Pin TO-92  
• Short Circuit Protection  
The TC55’s low dropout voltage, combined with the low  
current consumption of only 1.1 µA (typ), makes it  
ideal for battery operation. The low voltage differential  
(dropout voltage) extends the battery operating life-  
time. It also permits high currents in small packages  
when operated with minimum V – V  
differentials.  
IN  
OUT  
The circuit also incorporates short-circuit protection to  
ensure maximum reliability.  
Applications  
• Battery Powered Devices  
• Cameras and Portable Video Equipment  
• Pagers and Cellular Phones  
• Solar Powered Instruments  
• Consumer Products  
Functional Block Diagram  
V
V
OUT  
IN  
Short-circuit  
Protection  
+
Package Types  
3-Pin SOT-23A  
3-Pin SOT-89  
Voltage  
V
Reference  
IN  
2
TC55  
TC55  
GND  
1
3
OUT  
1
2
3
GND  
V
GND V  
V
IN OUT  
3-Pin TO-92  
1 2 3  
GND V  
V
IN OUT  
Note: 3-Pin SOT-23A is equivalent to the  
EIAJ SC-59.  
2002 Microchip Technology Inc.  
DS21435C-page 1  
TC55  
*Stresses above those listed under "Absolute Maximum  
Ratings" may cause permanent damage to the device. These  
are stress ratings only and functional operation of the device  
at these or any other conditions above those indicated in the  
operation sections of the specifications is not implied.  
Exposure to Absolute Maximum Rating conditions for  
extended periods may affect device reliability.  
1.0  
ELECTRICAL  
CHARACTERISTICS  
Absolute Maximum Ratings*  
Input Voltage ........................................................+12V  
Output Current .............................. P /(V – V )mA  
D
IN  
OUT  
Output Voltage ................. (V – 0.3V) to (V + 0.3V)  
SS  
IN  
Power Dissipation (T 70°C):  
A
3-Pin SOT-23A..........................................240 mW  
3-Pin SOT-89 ............................................400 mW  
3-Pin TO-92...............................................300 mW  
Operating Temperature Range.............-40°C to +85°C  
Storage Temperature Range..............-65°C to +150°C  
ELECTRICAL SPECIFICATIONS  
TC55RP50:  
Electrical Characteristics: Unless otherwise specified, VOUT(S) = 5.0V, TA = 25°C (see Note 1).  
Parameter  
Output Voltage  
Sym  
Min  
Typ  
Max  
Units  
Test Conditions  
IOUT = 40 mA  
VIN = 6.0V  
VOUT(A)  
4.90  
5.0  
5.10  
V
Maximum Output Current  
Load Regulation  
I/O Voltage Difference  
IOUTMAX  
VOUT  
VDIF  
250  
40  
120  
380  
1.1  
0.2  
80  
300  
600  
3.0  
0.3  
mA  
mV  
mV  
VIN = 6.0V, VOUT(A) 4.5V  
VIN = 6.0V, 1 mA IOUT 100 mA  
IOUT = 100 mA  
I
OUT = 200 mA  
VIN = 6.0V  
OUT = 40 mA  
6.0V VIN 10.0V  
Current Consumption  
Voltage Regulation  
ISS  
µA  
%/V  
VOUT(A)•100  
VIN•VOUT(S)  
VIN  
VOUT(A)•106  
VOUT(S)•TA  
I
Input Voltage  
Temperature Coefficient of  
Output Voltage  
±100  
10  
V
ppm/°C IOUT = 40 mA  
-40°C TA 85°C  
Long Term Stability  
0.5  
%
TA = 125°C, 1000 Hours  
TC55RP40  
Electrical Characteristics: Unless otherwise specified, VOUT(S) = 4.0V, TA = 25°C (see Note 1).  
Parameter  
Output Voltage  
Symbol  
Min  
Typ  
Max  
Units  
Test Conditions  
IOUT = 40 mA  
VIN = 5.0V  
VOUT(A)  
3.92  
4.0  
4.08  
V
Maximum Output Current  
Load Regulation  
I/O Voltage Difference  
IOUTMAX  
VOUT  
VDIF  
200  
45  
170  
400  
1.0  
0.2  
90  
330  
630  
2.9  
0.3  
mA  
mV  
mV  
VIN = 5.0V, VOUT(A) 3.6V  
VIN = 5.0V, 1 mA IOUT 100 mA  
IOUT = 100 mA  
I
OUT = 200 mA  
VIN = 5.0V  
OUT = 40 mA  
5.0V VIN 10.0V  
Current Consumption  
Voltage Regulation  
ISS  
µA  
%/V  
VOUT(A)•100  
VIN•VOUT(S)  
VIN  
VOUT(A)  
VOUT(S)•TA  
I
Input Voltage  
Temperature Coefficient of  
Output Voltage  
±100  
10.0  
V
ppm/°C IOUT = 40 mA  
-40°C TA 85°C  
Long Term Stability  
0.5  
%
TA = 125°C, 1000 Hours  
Note 1: VOUT(S): Preset value of output voltage; VOUT(A): Actual value of output voltage; VDIF: Definition of I/O voltage  
difference = {VIN1 – VOUT(A)}; VOUT(A): Output voltage when IOUT is fixed and VIN = VOUT(S) + 1.0 V; VIN1: Input voltage  
when the output voltage is 98% VOUT(A).  
DS21435C-page 2  
2002 Microchip Technology Inc.  
TC55  
ELECTRICAL SPECIFICATIONS (CONTINUED)  
TC55RP30  
Electrical Characteristics: Unless otherwise specified, VOUT(S) = 3.0V, TA = 25°C (see Note 1).  
Parameter  
Output Voltage  
Symbol  
Min  
Typ  
Max  
Units  
Test Conditions  
IOUT = 40 mA  
VIN = 4.0V  
VOUT(A)  
2.94  
3.0  
3.06  
V
Maximum Output Current  
Load Regulation  
I/O Voltage Difference  
IOUTMAX  
VOUT  
VDIF  
150  
45  
180  
400  
0.9  
0.2  
90  
360  
700  
2.8  
0.3  
mA  
mV  
mV  
VIN = 4.0V, VOUT(A) 2.7V  
VIN = 4.0V, 1 mA IOUT 80 mA  
IOUT = 80 mA  
I
OUT = 160 mA  
VIN = 4.0V  
OUT = 40 mA  
4.0V VIN 10.0V  
Current Consumption  
Voltage Regulation  
ISS  
µA  
%/V  
VOUT(A)•100  
VIN•VOUT(S)  
VIN  
VOUT(A)•106  
TA•VOUT(S)  
I
Input Voltage  
Temperature Coefficient of  
Output Voltage  
±100  
10.0  
V
ppm/°C  
IOUT = 40 mA  
-40°C TA 85°C  
Long Term Stability  
0.5  
%
TA = 125°C, 1000 Hours  
Note 1: VOUT(S): Preset value of output voltage; VOUT(A): Actual value of output voltage; VDIF: Definition of I/O voltage  
difference = {VIN1 – VOUT(A)}; VOUT(A): Output voltage when IOUT is fixed and VIN = VOUT(S) + 1.0 V; VIN1: Input voltage  
when the output voltage is 98% VOUT(A).  
2002 Microchip Technology Inc.  
DS21435C-page 3  
TC55  
2.0  
TYPICAL PERFORMANCE CURVES  
Note: The graphs and tables provided following this note are a statistical summary based on a limited number of  
samples and are provided for informational purposes only. The performance characteristics listed herein are  
not tested or guaranteed. In some graphs or tables, the data presented may be outside the specified  
operating range (e.g., outside specified power supply range) and therefore outside the warranted range.  
1. OUTPUT VOLTAGE vs. OUTPUT CURRENT  
TC55RP3002  
TC55RP5002  
V
= 4.0V  
V
= 6.0V  
IN  
IN  
3.1  
3.0  
2.9  
5.1  
5.0  
4.9  
-30
°
C  
25
°
C  
-30
°
C  
25
°
C  
80
°
C  
80
°
C  
4.8  
4.7  
2.8  
2.7  
0
20 40 60 80 100 120 140 160  
OUTPUT CURRENT I (mA)  
0
40  
80  
120  
160  
200  
OUTPUT CURRENT I  
(mA)  
OUT  
OUT  
2. OUTPUT VOLTAGE vs. INPUT VOLTAGE  
TC55RP3002  
TC55RP3002  
T
T
= 25°C  
= 25°C  
OPR  
OPR  
3.2  
3.05  
3.04  
3.0  
3.03  
3.02  
I
= 1 mA  
OUT  
40 mA  
I
= 1 mA  
OUT  
2.8  
2.6  
2.4  
2.2  
3.01  
3.00  
2.99  
2.98  
2.97  
2.96  
2.95  
10 mA  
2.5  
3.0  
3.5  
3
4
10  
5
6
7
8
9
INPUT VOLTAGE V (V)  
IN  
INPUT VOLTAGE V (V)  
IN  
TC55RP5002  
TC55RP5002  
T
= 25°C  
T
= 25°C  
OPR  
OPR  
5.2  
5.0  
5.05  
5.04  
5.03  
5.02  
5.01  
5.00  
4.99  
4.98  
4.97  
4.98  
4.95  
40 mA  
I
= 1 mA  
I
= 1 mA  
OUT  
OUT  
4.8  
4.6  
4.4  
4.2  
10 mA  
4.5  
5.0  
INPUT VOLTAGE V (V)  
5.5  
5
6
7
9
8
10  
INPUT VOLTAGE V (V)  
IN  
IN  
DS21435C-page 4  
2002 Microchip Technology Inc.  
TC55  
TYPICAL CHARACTERISTICS (CONTINUED)  
3. DROPOUT VOLTAGE vs. OUTPUT CURRENT  
TC55RP3002  
TC55RP5002  
2.0  
1.8  
1.6  
2.0  
1.8  
1.4  
1.2  
1.0  
1.2  
1.0  
0.8  
0.6  
0.8  
0.6  
25
°
C  
25
°
C  
0.4  
80°C  
0.4  
0.2  
0.2  
0.0  
80
°
C  
-30
°
C  
-30
°
C  
0.0  
-0.2  
-0.2  
0
20 40 60 80 100 120 140 160  
OUTPUT CURRENT I (mA)  
0
40  
80  
120  
160  
(mA)  
200  
OUTPUT CURRENT I  
OUT  
OUT  
4. OUTPUT VOLTAGE vs. OPERATING TEMPERATURE  
TC55RP3002  
TC55RP5002  
V
= 6.0V  
V
= 4.0V  
IN  
IN  
3.10  
3.08  
3.06  
5.10  
5.08  
5.06  
3.04  
5.04  
3.02  
3.00  
2.98  
2.96  
2.94  
5.02  
5.00  
4.98  
4.96  
4.94  
I
= 10 mA  
OUT  
I
= 10 mA  
OUT  
40 mA  
40 mA  
2.92  
2.90  
4.92  
4.90  
-40 -20  
0
20 40  
60  
80 100  
-40 -20  
0
20 40  
60  
80 100  
OPERATING TEMPERATURE (°C)  
OPERATING TEMPERATURE (°C)  
5. SUPPLY CURRENT vs. INPUT VOLTAGE  
TC55RP3002  
TC55RP5002  
T
= 25
°
C  
T
= 25
°
C  
OPR  
OPR  
1.5  
1.4  
1.3  
1.2  
2.0  
1.9  
1.8  
1.7  
1.1  
1.0  
0.9  
0.8  
0.7  
1.6  
1.4  
1.3  
1.2  
1.1  
1.0  
0.5  
0.6  
0.5  
5
7
8
9
10  
3
4
5
6
7
8
9
10  
6
(V)  
INPUT VOLTAGE V (V)  
IN  
IN  
2002 Microchip Technology Inc.  
DS21435C-page 5  
TC55  
TYPICAL CHARACTERISTICS (CONTINUED)  
6. SUPPLY CURRENT vs. OPERATING TEMPERATURE  
TC55RP3002  
TC55RP5002  
V
= 4.0V  
V
= 6.0V  
IN  
IN  
1.5  
1.4  
2.0  
1.9  
1.8  
1.2  
1.7  
1.1  
1.0  
1.6  
1.5  
0.9  
0.8  
0.7  
0.6  
0.5  
1.4  
1.3  
1.2  
1.1  
1.0  
-40 -20  
0
20 40  
60  
80 100  
-40 -20  
0
20 40  
60  
80 100  
°
C)  
°
C)  
7. INPUT TRANSIENT RESPONSE  
TC55RP5002  
TC55RP5002  
I
= 1 mA  
I
= 10 mA  
OUT  
OUT  
8.0  
7.5  
8.0  
Input  
Input  
Voltage  
Voltage  
7.5  
7.0  
7.0  
6.5  
6.0  
5.5  
5.0  
6.5  
6.0  
5.5  
5.0  
Output  
Voltage  
Output  
Voltage  
5.0  
4.5  
4.0  
4.5  
4.0  
-1  
0
1
2
3
-1  
0
1
2
3
TIME (msec)  
TIME (msec)  
8. LOAD TRANSIENT RESPONSE  
TC55RP3002  
7
TC55RP3002  
5
200  
160  
200  
160  
6
4
3
Output Voltage  
5
Output Voltage  
120  
120  
80  
40  
80  
40  
4
2
Output Current  
Output Current  
3
1
0
40 mA  
40 mA  
1 mA  
1 mA  
2
0
0
TIME (2 msec/div)  
TIME (2 msec/div)  
DS21435C-page 6  
2002 Microchip Technology Inc.  
TC55  
3.0  
PIN DESCRIPTIONS  
4.0  
DETAILED DESCRIPTION  
The descriptions of the pins are listed in Table 3-1.  
The TC55 is a low quiescent current, precision, fixed  
output voltage LDO. Unlike bipolar regulators, the  
TC55 supply current does not increase proportionally  
with load current.  
TABLE 3-1:  
Pin No.  
PIN FUNCTION TABLE  
Description  
Symbol  
4.1  
Output Capacitor  
1
2
3
GND  
Ground Terminal  
Unregulated Supply Input  
Regulated Voltage Output  
V
IN  
A minimum of 1 µF output capacitor is required. The  
output capacitor should have an effective series resis-  
tance greater than 0.1and less than 5, plus a reso-  
nant frequency above 1 MHz. Larger output capacitors  
can be used to improve supply noise rejection and tran-  
sient response. Care should be taken when increasing  
V
OUT  
C
to ensure that the input impedance is not high  
OUT  
enough to cause high input impedance oscillation.  
4.2  
Input Capacitor  
A 1 µF input capacitor is recommended for most  
applications when the input impedance is on the order  
of 10 ohms. Larger input capacitance may be required  
for stability when operating off of a battery input, or if  
there is a large distance from the input source to the  
LDO. When large values of output capacitance are  
used, the input capacitance should be increased to  
prevent high source impedance oscillations.  
2002 Microchip Technology Inc.  
DS21435C-page 7  
TC55  
Given:  
5.0  
THERMAL CONSIDERATIONS  
V
= 3.3V to 4.1V  
= 3.0 V ± 2%  
= 1 mA to 100 mA  
= 55°C  
= (4.1V – (3.0V x 0.98)) x 100 mA  
= 116.0 milliwatts  
IN  
5.1  
Power Dissipation  
V
OUT  
OUT  
The amount of power dissipated internal to the low  
dropout linear regulator is the sum of the power dissi-  
pation within the linear pass device (P-Channel MOS-  
FET) and the quiescent current required to bias the  
internal reference and error amplifier. The internal lin-  
ear pass device power dissipation is calculated by mul-  
tiplying the voltage across the linear device by the  
current through the device.  
I
T
AMAX  
P
P
MAX  
MAX  
To determine the junction temperature of the device, the  
thermal resistance from junction to air must be known.  
The 3-pin SOT-23 thermal resistance from junction to  
air (R ) is estimated to be approximately 359°C/W  
θJA  
EQUATION  
when mounted on a 4-layer board. The SOT-89 R  
θJA  
P (Pass Device) = (V – V  
) x I  
OUT  
is estimated to be approximately 110°C/W when  
mounted on 1 square inch of copper. The TO-92 R is  
D
IN  
OUT  
θJA  
The internal power dissipation, as a result of the bias  
current for the LDO internal reference and error  
amplifier, is calculated by multiplying the ground or  
quiescent current by the input voltage.  
estimated to be 131.9°C/W when mounted on a 4-layer  
board. The R  
will vary with physical layout, airflow  
θJA  
and other application specific conditions.  
The device junction temperature is determined by  
calculating the junction temperature rise above  
ambient, then adding the rise to the ambient  
temperature.  
EQUATION  
P (Bias) = V x I  
GND  
D
IN  
EQUATION  
The total internal power dissipation is the sum of P  
D
(Pass Device) and P (Bias).  
D
Junction Temperature  
SOT-23 Example:  
EQUATION  
T = P  
x R  
+ T  
θJA A  
J
DMAX  
P
= P (Pass Device) + P (Bias)  
D D  
TOTAL  
T = 116.0 milliwatts x 359°C/W + 55°C  
J
T = 96.6°C  
J
For the TC55, the internal quiescent bias current is so  
SOT-89 Example:  
low (1 µA typical) that the P (Bias) term of the power  
D
T = 116.0 milliwatts x 110°C/W + 55°C  
dissipation equation can be ignored. The maximum  
power dissipation can be estimated by using the  
maximum input voltage and the minimum output  
voltage to obtain a maximum voltage differential  
between input and output. The next step would be to  
multiply the maximum voltage differential by the  
maximum output current.  
J
T = 67.8°C  
J
TO-92 Example:  
T = 116.0 milliwatts x 131.9°C/W + 55°C  
J
T = 70.3°C  
J
EQUATION  
P
= (V  
– V  
) x I  
D
INMAX  
OUTMIN OUTMAX  
DS21435C-page 8  
2002 Microchip Technology Inc.  
TC55  
6.0  
6.1  
PACKAGING INFORMATION  
Package Marking Information  
3-Pin TO-92  
3-Pin SOT-23A  
3-Pin SOT-89  
1
5
2
6
3
7
4
8
➀ ➀ ➀ ➀  
9 10 11 12  
1
2
4
3 &  
1 , 2 ,  
5
= 55RP (fixed)  
represents first voltage digit  
2 3 4 5 6  
represents first voltage digit (2-6)  
6 represents first voltage decimal (0-9)  
7 represents extra feature code: fixed: 0  
8 represents regulation accuracy  
3
ex: 3.xV =  
represents first decimal place voltage (x.0 - x.9)  
A = x.0  
B = x.1  
C = x.2  
D = x.3  
ex: 3.4V =  
E = x.4  
F = x.5  
H = x.6  
L = x.8  
M = x.9  
K = x.7  
1 = ±1.0% (custom), 2 = ±2.0% (standard)  
3
E
9 , 10, 11 & 12  
represents assembly lot number  
3
4
represents polarity  
0 = Positive (fixed)  
represents assembly lot number  
6.2  
Taping Form  
Component Taping Orientation for 3-Pin SOT-23A (EIAJ SC-59) Devices  
User Direction of Feed  
Device  
Marking  
W
PIN 1  
P
Standard Reel Component Orientation  
For TR Suffix Device  
(Mark Right Side Up)  
Carrier Tape, Number of Components Per Reel and Reel Size:  
Package  
3-Pin SOT-23A  
Carrier Width (W)  
Pitch (P)  
Part Per Full Reel  
Reel Size  
8 mm  
4 mm  
3000  
7 in.  
2002 Microchip Technology Inc.  
DS21435C-page 9  
TC55  
6.2  
Taping Form (Continued)  
Component Taping Orientation for 3-Pin SOT-89 Devices  
User Direction of Feed  
Device  
Marking  
W
PIN 1  
P
Standard Reel Component Orientation  
For TR Suffix Device  
(Mark Right Side Up)  
Carrier Tape, Number of Components Per Reel and Reel Size:  
Package  
3-Pin SOT-89  
Carrier Width (W)  
Pitch (P)  
Part Per Full Reel  
Reel Size  
12 mm  
8 mm  
1000  
7 in.  
Component Taping Orientation for 3-Pin TO-92  
User Direction of Feed  
P
Mark  
Face  
MARK  
FACE  
MARK  
FACE  
MARK  
FACE  
Seal  
Tape  
Back  
Tape  
W
DS21435C-page 10  
2002 Microchip Technology Inc.  
TC55  
6.3  
Package Dimensions  
SOT-23A-3  
.020 (0.50)  
.012 (0.30)  
.118 (3.00)  
.098 (2.50)  
.071 (1.80)  
.055 (1.40)  
PIN 1  
.075 (1.90)  
REF.  
.122 (3.10)  
.106 (2.70)  
.051 (1.30)  
.035 (0.90)  
.010 (0.25)  
.004 (0.09)  
10° MAX.  
.006 (0.15)  
.000 (0.00)  
.022 (0.55)  
.014 (0.35)  
Dimensions: inches (mm)  
SOT-89-3  
.181 (4.60)  
.173 (4.39)  
.063 (1.60)  
.055 (1.40)  
.071 (1.80)  
.063 (1.60)  
.102 (2.59)  
.090 (2.29)  
.167 (4.24)  
.019 (0.48)  
.014 (0.36)  
PIN 1  
.031 (0.79) MIN.  
.022 (0.56)  
.016 (0.41)  
.017 (0.43)  
.014 (0.36)  
.063 (1.60)  
.055 (1.40)  
.019 (0.48)  
.014 (0.36)  
Dimensions: inches (mm)  
2002 Microchip Technology Inc.  
DS21435C-page 11  
TC55  
6.3  
Package Dimensions (Continued)  
TO-92-3  
.165 (4.19)  
.125 (3.18)  
.500  
(12.70)  
MIN.  
.210 (5.33)  
.170 (4.32)  
.105 (2.67)  
.080 (2.03)  
.135  
(3.43)  
MIN.  
.105 (2.67)  
.095 (2.41)  
.205 (5.21)  
.175 (4.45)  
.055 (1.40)  
.045 (1.14)  
.018 (0.46)  
.015 (0.38)  
.018 (0.46)  
.015 (0.38)  
Dimensions: inches (mm)  
DS21435C-page 12  
2002 Microchip Technology Inc.  
TC55  
ON-LINE SUPPORT  
Microchip provides on-line support on the Microchip  
World Wide Web site.  
SYSTEMS INFORMATION AND  
UPGRADE HOT LINE  
The Systems Information and Upgrade Line provides  
system users a listing of the latest versions of all of  
Microchip's development systems software products.  
Plus, this line provides information on how customers  
can receive the most current upgrade kits.The Hot Line  
Numbers are:  
1-800-755-2345 for U.S. and most of Canada, and  
1-480-792-7302 for the rest of the world.  
The web site is used by Microchip as a means to make  
files and information easily available to customers. To  
view the site, the user must have access to the Internet  
®
®
and a web browser, such as Netscape or Microsoft  
Internet Explorer. Files are also available for FTP  
download from our FTP site.  
ConnectingtotheMicrochipInternetWebSite  
The Microchip web site is available at the following  
URL:  
092002  
www.microchip.com  
The file transfer site is available by using an FTP ser-  
vice to connect to:  
ftp://ftp.microchip.com  
The web site and file transfer site provide a variety of  
services. Users may download files for the latest  
Development Tools, Data Sheets, Application Notes,  
User's Guides, Articles and Sample Programs. A vari-  
ety of Microchip specific business information is also  
available, including listings of Microchip sales offices,  
distributors and factory representatives. Other data  
available for consideration is:  
• Latest Microchip Press Releases  
Technical Support Section with Frequently Asked  
Questions  
• Design Tips  
• Device Errata  
• Job Postings  
• Microchip Consultant Program Member Listing  
• Links to other useful web sites related to  
Microchip Products  
• Conferences for products, Development Systems,  
technical information and more  
• Listing of seminars and events  
2002 Microchip Technology Inc.  
DS21435C-page13  
TC55  
READER RESPONSE  
It is our intention to provide you with the best documentation possible to ensure successful use of your Microchip prod-  
uct. If you wish to provide your comments on organization, clarity, subject matter, and ways in which our documentation  
can better serve you, please FAX your comments to the Technical Publications Manager at (480) 792-4150.  
Please list the following information, and use this outline to provide us with your comments about this document.  
To:  
Technical Publications Manager  
Reader Response  
Total Pages Sent ________  
RE:  
From:  
Name  
Company  
Address  
City / State / ZIP / Country  
Telephone: (_______) _________ - _________  
FAX: (______) _________ - _________  
Application (optional):  
Would you like a reply?  
Y
N
Literature Number:  
DS21435C  
Device:  
TC55  
Questions:  
1. What are the best features of this document?  
2. How does this document meet your hardware and software development needs?  
3. Do you find the organization of this document easy to follow? If not, why?  
4. What additions to the document do you think would enhance the structure and subject?  
5. What deletions from the document could be made without affecting the overall usefulness?  
6. Is there any incorrect or misleading information (what and where)?  
7. How would you improve this document?  
DS21435C-page14  
2002 Microchip Technology Inc.  
TC55  
PRODUCT IDENTIFICATION SYSTEM  
To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office.  
PART NO.  
Device  
XX  
X
X
X
XX  
XX  
Examples:  
Output Feature Tolerance Temp. Package Taping  
a)  
b)  
c)  
d)  
e)  
f)  
TC55RP1802ECB713: 1.8V LDO Positive  
Voltage Direction  
Code  
Voltage Regulator, 2% Tol. SOT23-A-3  
package.  
TC55RP2502EMB713: 1.8V LDO Positive  
Voltage Regulator, 2% Tolerance.  
SOT89-3 package.  
TC55RP2502ECB713: 2.5V LDO Positive  
Voltage Regulator, 2% Tolerance.  
SOT23-A-3 package.  
TC55RP3002ECB713: 3.0V LDO Positive  
Voltage Regulator, 2% Tolerance.  
SOT23-A-3 package.  
TC55RP3002EMB713: 3.0V LDO Positive  
Voltage Regulator, 2% Tolerance.  
SOT89-3 package.  
Device:  
TC55: 1 µA Low Dropout Positive Voltage Regulator  
Output Voltage:  
18  
25  
30  
33  
50  
=
=
=
=
=
1.8V "Standard"  
2.5V "Standard"  
3.0V "Standard"  
3.3V "Standard"  
5.0V "Standard"  
Extra Feature Code:  
Tolerance:  
0
=
Fixed  
1
2
=
=
1.0% (Custom)  
2.0% (Standard)  
TC55RP3302ECB713: 3.3V LDO Positive  
Voltage Regulator, 2% Tolerance.  
SOT23-A-3 package.  
Temperature:  
I
=
-40°C to +85°C  
g)  
h)  
i)  
TC55RP3302EMB713: 3.3V LDO Positive  
Voltage Regulator, 2% Tolerance.  
SOT89-3 package.  
TC55RP5002ECB713: 5.0V LDO Positive  
Voltage Regulator, 2% Tolerance.  
SOT23-A-3 package.  
TC55RP5002EMB713: 5.0V LDO Positive  
Voltage Regulator, 2% Tolerance.  
SOT89-3 package.  
Package Type:  
CB  
MB  
ZB  
=
=
=
3-Pin SOT-23A (equivalent to EIAJ SC-59)  
3-Pin SOT-89  
3-Pin TO-92  
Taping Direction:  
TR  
=
Standard  
713 = Standard  
Sales and Support  
Data Sheets  
Products supported by a preliminary Data Sheet may have an errata sheet describing minor operational differences and recom-  
mended workarounds. To determine if an errata sheet exists for a particular device, please contact one of the following:  
1. Your local Microchip sales office  
2. The Microchip Corporate Literature Center U.S. FAX: (480) 792-7277  
3. The Microchip Worldwide Site (www.microchip.com)  
Please specify which device, revision of silicon and Data Sheet (include Literature #) you are using.  
New Customer Notification System  
Register on our web site (www.microchip.com/cn) to receive the most current information on our products.  
2002 Microchip Technology Inc.  
DS21435C-page15  
TC55  
NOTES:  
DS21435C-page 16  
2002 Microchip Technology Inc.  
Information contained in this publication regarding device  
applications and the like is intended through suggestion only  
and may be superseded by updates. It is your responsibility to  
ensure that your application meets with your specifications.  
No representation or warranty is given and no liability is  
assumed by Microchip Technology Incorporated with respect  
to the accuracy or use of such information, or infringement of  
patents or other intellectual property rights arising from such  
use or otherwise. Use of Microchip’s products as critical com-  
ponents in life support systems is not authorized except with  
express written approval by Microchip. No licenses are con-  
veyed, implicitly or otherwise, under any intellectual property  
rights.  
Trademarks  
The Microchip name and logo, the Microchip logo, KEELOQ,  
MPLAB, PIC, PICmicro, PICSTART and PRO MATE are  
registered trademarks of Microchip Technology Incorporated  
in the U.S.A. and other countries.  
FilterLab, microID, MXDEV, MXLAB, PICMASTER, SEEVAL  
and The Embedded Control Solutions Company are  
registered trademarks of Microchip Technology Incorporated  
in the U.S.A.  
dsPIC, dsPICDEM.net, ECONOMONITOR, FanSense,  
FlexROM, fuzzyLAB, In-Circuit Serial Programming, ICSP,  
ICEPIC, microPort, Migratable Memory, MPASM, MPLIB,  
MPLINK, MPSIM, PICC, PICDEM, PICDEM.net, rfPIC, Select  
Mode and Total Endurance are trademarks of Microchip  
Technology Incorporated in the U.S.A. and other countries.  
Serialized Quick Turn Programming (SQTP) is a service mark  
of Microchip Technology Incorporated in the U.S.A.  
All other trademarks mentioned herein are property of their  
respective companies.  
© 2002, Microchip Technology Incorporated, Printed in the  
U.S.A., All Rights Reserved.  
Printed on recycled paper.  
Microchip received QS-9000 quality system  
certification for its worldwide headquarters,  
design and wafer fabrication facilities in  
Chandler and Tempe, Arizona in July 1999  
and Mountain View, California in March 2002.  
The Company’s quality system processes and  
procedures are QS-9000 compliant for its  
®
PICmicro 8-bit MCUs, KEELOQ® code hopping  
devices, Serial EEPROMs, microperipherals,  
non-volatile memory and analog products. In  
addition, Microchip’s quality system for the  
design and manufacture of development  
systems is ISO 9001 certified.  
2002 Microchip Technology Inc.  
DS21435C - page 17  
M
WORLDWIDE SALES AND SERVICE  
Japan  
AMERICAS  
ASIA/PACIFIC  
Microchip Technology Japan K.K.  
Benex S-1 6F  
Corporate Office  
Australia  
2355 West Chandler Blvd.  
Microchip Technology Australia Pty Ltd  
Suite 22, 41 Rawson Street  
Epping 2121, NSW  
3-18-20, Shinyokohama  
Kohoku-Ku, Yokohama-shi  
Kanagawa, 222-0033, Japan  
Tel: 81-45-471- 6166 Fax: 81-45-471-6122  
Chandler, AZ 85224-6199  
Tel: 480-792-7200 Fax: 480-792-7277  
Technical Support: 480-792-7627  
Web Address: http://www.microchip.com  
Australia  
Tel: 61-2-9868-6733 Fax: 61-2-9868-6755  
Korea  
Rocky Mountain  
China - Beijing  
Microchip Technology Korea  
168-1, Youngbo Bldg. 3 Floor  
Samsung-Dong, Kangnam-Ku  
Seoul, Korea 135-882  
2355 West Chandler Blvd.  
Chandler, AZ 85224-6199  
Tel: 480-792-7966 Fax: 480-792-4338  
Microchip Technology Consulting (Shanghai)  
Co., Ltd., Beijing Liaison Office  
Unit 915  
Bei Hai Wan Tai Bldg.  
Tel: 82-2-554-7200 Fax: 82-2-558-5934  
Atlanta  
No. 6 Chaoyangmen Beidajie  
Beijing, 100027, No. China  
Tel: 86-10-85282100 Fax: 86-10-85282104  
500 Sugar Mill Road, Suite 200B  
Atlanta, GA 30350  
Singapore  
Microchip Technology Singapore Pte Ltd.  
200 Middle Road  
Tel: 770-640-0034 Fax: 770-640-0307  
China - Chengdu  
#07-02 Prime Centre  
Boston  
Microchip Technology Consulting (Shanghai)  
Co., Ltd., Chengdu Liaison Office  
Rm. 2401, 24th Floor,  
Singapore, 188980  
2 Lan Drive, Suite 120  
Westford, MA 01886  
Tel: 978-692-3848 Fax: 978-692-3821  
Tel: 65-6334-8870 Fax: 65-6334-8850  
Taiwan  
Ming Xing Financial Tower  
Microchip Technology (Barbados) Inc.,  
Taiwan Branch  
Chicago  
No. 88 TIDU Street  
333 Pierce Road, Suite 180  
Itasca, IL 60143  
Chengdu 610016, China  
11F-3, No. 207  
Tel: 86-28-86766200 Fax: 86-28-86766599  
Tung Hua North Road  
Taipei, 105, Taiwan  
Tel: 630-285-0071 Fax: 630-285-0075  
China - Fuzhou  
Dallas  
Microchip Technology Consulting (Shanghai)  
Co., Ltd., Fuzhou Liaison Office  
Unit 28F, World Trade Plaza  
Tel: 886-2-2717-7175 Fax: 886-2-2545-0139  
4570 Westgrove Drive, Suite 160  
Addison, TX 75001  
Tel: 972-818-7423 Fax: 972-818-2924  
No. 71 Wusi Road  
EUROPE  
Austria  
Detroit  
Fuzhou 350001, China  
Tri-Atria Office Building  
Tel: 86-591-7503506 Fax: 86-591-7503521  
Microchip Technology Austria GmbH  
Durisolstrasse 2  
32255 Northwestern Highway, Suite 190  
Farmington Hills, MI 48334  
Tel: 248-538-2250 Fax: 248-538-2260  
China - Shanghai  
Microchip Technology Consulting (Shanghai)  
Co., Ltd.  
A-4600 Wels  
Austria  
Kokomo  
Room 701, Bldg. B  
Tel: 43-7242-2244-399  
Fax: 43-7242-2244-393  
Denmark  
2767 S. Albright Road  
Kokomo, Indiana 46902  
Tel: 765-864-8360 Fax: 765-864-8387  
Los Angeles  
Far East International Plaza  
No. 317 Xian Xia Road  
Shanghai, 200051  
Microchip Technology Nordic ApS  
Regus Business Centre  
Lautrup hoj 1-3  
Tel: 86-21-6275-5700 Fax: 86-21-6275-5060  
18201 Von Karman, Suite 1090  
Irvine, CA 92612  
China - Shenzhen  
Microchip Technology Consulting (Shanghai)  
Co., Ltd., Shenzhen Liaison Office  
Rm. 1315, 13/F, Shenzhen Kerry Centre,  
Renminnan Lu  
Ballerup DK-2750 Denmark  
Tel: 949-263-1888 Fax: 949-263-1338  
Tel: 45 4420 9895 Fax: 45 4420 9910  
New York  
France  
150 Motor Parkway, Suite 202  
Hauppauge, NY 11788  
Microchip Technology SARL  
Parc d’Activite du Moulin de Massy  
43 Rue du Saule Trapu  
Shenzhen 518001, China  
Tel: 631-273-5305 Fax: 631-273-5335  
Tel: 86-755-2350361 Fax: 86-755-2366086  
San Jose  
China - Hong Kong SAR  
Batiment A - ler Etage  
Microchip Technology Inc.  
2107 North First Street, Suite 590  
San Jose, CA 95131  
Microchip Technology Hongkong Ltd.  
Unit 901-6, Tower 2, Metroplaza  
223 Hing Fong Road  
91300 Massy, France  
Tel: 33-1-69-53-63-20 Fax: 33-1-69-30-90-79  
Germany  
Tel: 408-436-7950 Fax: 408-436-7955  
Kwai Fong, N.T., Hong Kong  
Microchip Technology GmbH  
Steinheilstrasse 10  
Tel: 852-2401-1200 Fax: 852-2401-3431  
Toronto  
6285 Northam Drive, Suite 108  
Mississauga, Ontario L4V 1X5, Canada  
Tel: 905-673-0699 Fax: 905-673-6509  
India  
D-85737 Ismaning, Germany  
Tel: 49-89-627-144 0 Fax: 49-89-627-144-44  
Microchip Technology Inc.  
India Liaison Office  
Italy  
Divyasree Chambers  
Microchip Technology SRL  
Centro Direzionale Colleoni  
Palazzo Taurus 1 V. Le Colleoni 1  
20041 Agrate Brianza  
1 Floor, Wing A (A3/A4)  
No. 11, O’Shaugnessey Road  
Bangalore, 560 025, India  
Tel: 91-80-2290061 Fax: 91-80-2290062  
Milan, Italy  
Tel: 39-039-65791-1 Fax: 39-039-6899883  
United Kingdom  
Microchip Ltd.  
505 Eskdale Road  
Winnersh Triangle  
Wokingham  
Berkshire, England RG41 5TU  
Tel: 44 118 921 5869 Fax: 44-118 921-5820  
08/01/02  
DS21435C-page 18  
2002 Microchip Technology Inc.  

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