TC648EOA [MICROCHIP]
Fan Speed Controller with Auto-Shutdown and Over-Temperature Alert; 风扇速度控制器，自动关闭和过温报警
| 型号： | TC648EOA |
| 厂家： | 
MICROCHIP |
| 描述： | Fan Speed Controller with Auto-Shutdown and Over-Temperature Alert |
| 文件： | 总28页 (文件大小：587K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
TC648
M
Fan Speed Controller with Auto-Shutdown
and Over-Temperature Alert
Features
Package Types
SOIC/PDIP/MSOP
• Temperature Proportional Fan Speed for Acoustic
Control and Longer Fan Life
• Efficient PWM Fan Drive
• 3.0V to 5.5V Supply Range:
- Fan Voltage Independent of TC648
Supply Voltage
- Supports any Fan Voltage
V
V
V
1
2
3
4
8
7
6
5
IN
DD
C
F
OUT
TC648
V
AS
GND
OTF
NC
• Over-temperature Fault Detection
• Automatic Shutdown Mode for “Green” Systems
• Supports Low Cost NTC/PTC Thermistors
• Space Saving 8-Pin MSOP Package
General Description
The TC648 is a switch mode, fan speed controller for
use with brushless DC fans. Temperature proportional
speed control is accomplished using pulse width mod-
ulation (PWM). A thermistor (or other voltage output
Applications
• Power Supplies
• Computers
• Portable Computers
• Telecom Equipment
• UPSs, Power Amps
• General Purpose Fan Speed Control
temperature sensor) connected to the V
input
IN
furnishes the required control voltage of 1.25V to 2.65V
(typical) for 0% to 100% PWM duty cycle. The TC648
can be configured to operate in either auto-shutdown or
minimum speed mode. In auto-shutdown mode, fan
operation is automatically suspended when measured
temperature (V ) is lower than a user programmed
IN
minimum setting (V ). The fan is automatically
AS
Available Tools
• Fan Controller Demonstration Board (TC642DEMO)
• Fan Controller Evaluation Kit (TC642EV)
restarted, and proportional speed control restored,
when V exceeds V (plus hysteresis). Operation in
IN
AS
minimum speed mode is similar to auto-shutdown
mode, with the exception that the fan is operated at a
user programmed minimum setting when the mea-
sured temperature is low. An integrated Start-up Timer
ensures reliable motor start-up at turn-on, and when
coming out of shutdown or auto-shutdown mode.
The over-temperature fault output (OTF) is asserted
when the PWM reaches 100% duty cycle, indicating a
possible thermal runaway situation.
The TC648 is available in the 8-pin plastic DIP, SOIC
and MSOP packages and is available in the industrial
and extended commercial temperature ranges.
2002 Microchip Technology Inc.
DS21448C-page 1
TC648
Functional Block Diagram
V
IN
+
V
DD
V
OTF
–
OTF
–
+
PWM
V
Control
OUT
Logic
C
F
Clock
Generator
–
OTF
Start-up
Timer
V
AS
+
–
SHDN
+
V
TC648
SHDN
NC
GND
DS21448C-page 2
2002 Microchip Technology Inc.
TC648
*Stresses above those listed under "Absolute Maximum Rat-
ings" may cause permanent damage to the device. These are
stress ratings only and functional operation of the device at
these or any other conditions above those indicated in the
operation sections of the specifications is not implied. Expo-
sure to absolute maximum rating conditions for extended peri-
ods may affect device reliability.
1.0
ELECTRICAL
CHARACTERISTICS
Absolute Maximum Ratings*
Supply Voltage ......................................................... 6V
Input Voltage, Any Pin... (GND – 0.3V) to (V + 0.3V)
DD
Package Thermal Resistance:
PDIP (R ).............................................125°C/W
θJA
SOIC (R ) ............................................155°C/W
θJA
MSOP (R ) ..........................................200°C/W
θJA
Specified Temperature Range ........... -40°C to +125°C
Storage Temperature Range.............. -65°C to +150°C
DC ELECTRICAL SPECIFICATIONS
Electrical Characteristics: Unless otherwise specified, TMIN ≤ TA ≤ TMAX, VDD = 3.0V to 5.5V
Symbol
VDD
IDD
Parameter
Supply Voltage
Supply Current, Operating
Min
Typ
Max
Units
Test Conditions
3.0
—
—
0.5
5.5
1.0
V
mA Pins 6, 7 Open,
CF = 1 µF, VIN = VC(MAX)
IDD(SHDN)
Supply Current, Shutdown/
Auto-shutdown Mode
—
25
—
—
µA Pins 6, 7 Open;
Note 1
CF =1 µF, VIN = 0.35V
µA Note 1
IIN
VIN, VAS Input Leakage
-1.0
+1.0
VOUT Output
tR
tF
IOL
IOH
VOUT Rise Time
VOUT Fall Time
Sink Current at VOUT Output
Source Current at VOUT
Output
—
—
1.0
5.0
—
—
—
—
50
50
—
—
µsec IOH = 5 mA, Note 1
µsec IOL = 1 mA, Note 1
mA VOL = 10% of VDD
mA VOH = 80% of VDD
SENSE Input
VTH(SENSE)
SENSE Input Threshold
50
—
70
90
mV Note 1
Voltage with Respect to GND
OTF Output
VOL
Output Low Voltage
—
0.3
2.8
V
V
IOL = 2.5 mA
VIN, VAS Inputs
VC(MAX),VOTF Voltage at VIN for 100% Duty
Cycle and Overtemp. Fault
VC(SPAN)
VAS
2.5
1.3
VC(MAX) ~
VC(SPAN)
2.65
VC(MAX) - VC(MIN)
Auto-shutdown Threshold
1.4
—
1.5
VC(MAX)
V
V
VSHDN
VREL
Voltage Applied to VIN to
Ensure Reset/Shutdown
Voltage Applied to VIN to
Release Reset Mode
—
—
—
VDD x 0.13
—
V
VDD x 0.19
V
VDD = 5V
VHYST
VHAS
Hysteresis on VSHDN, VREL
Hysteresis on Auto-shutdown
Comparator
—
—
0.01 x VDD
70
—
—
V
mV
Note 1: Ensured by design, not tested.
2002 Microchip Technology Inc.
DS21448C-page 3
TC648
DC ELECTRICAL SPECIFICATIONS (CONTINUED)
Electrical Characteristics: Unless otherwise specified, TMIN ≤ TA ≤ TMAX, VDD = 3.0V to 5.5V
Symbol
Parameter
Min
Typ
Max
Units
Test Conditions
Pulse Width Modulator
FOSC
tSTARTUP
PWM Frequency
Start-up Timer
26
—
30
32/F
34
—
Hz CF = 1.0 µF
Sec CF = 1.0 µF
Note 1: Ensured by design, not tested.
DS21448C-page 4
2002 Microchip Technology Inc.
TC648
2.3
Analog Input (V
)
2.0
PIN DESCRIPTIONS
AS
An external resistor divider connected to the V input
The descriptions of the pins are listed in Table 2-1.
AS
sets the auto-shutdown threshold. Auto-shutdown
occurs when V ≤ V . During shutdown, supply
IN
AS
TABLE 2-1:
Pin No. Symbol
PIN FUNCTION TABLE
Description
V Analog Input
IN
current falls to 25 µA (typical). The fan is automatically
restarted when V ≥ (V +V ) (see Section 5.0,
IN
AS
HAS
“Typical Applications” for more details).
1
2
3
4
5
6
7
8
C
Analog Output
Analog Input
F
2.4
Ground (GND)
V
AS
GND denotes the ground Terminal.
GND Ground Terminal
NC
No Internal Connection
2.5
No Connect
OTF
Digital (Open Collector) Output
Digital Output
No internal connection.
V
OUT
V
Power Supply Input
2.6
Digital Output (OTF)
DD
OTF goes low to indicate an over-temperature
2.1
Analog Input (V )
IN
condition. This occurs when the voltage at V > V
IN
OTF
The thermistor network (or other temperature sensor)
(see Section 1.0, "Electrical Characteristics"). An over-
temperature indication is a non-latching condition.
connects to the V input. A voltage range of 1.25V to
IN
2.65V (typical) on this pin drives an active duty cycle of
2.7
Digital Output (V
)
0% to 100% on the V
pin (see Section 5.0, “Typical
OUT
OUT
is an active high complimentary output that drives
Applications”, for more details).
V
OUT
the base of an external NPN transistor (via an appropri-
ate base resistor) or the gate of an N-channel MOS-
FET. This output has asymmetrical drive (see
Section 1.0, “Electrical Characteristics”).
2.2
Analog Output (C )
F
C is the positive terminal for the PWM ramp generator
F
timing capacitor. The recommended C is 1 µF for
F
30 Hz PWM operation.
2.8
Power Supply Input (V
)
DD
may be independent of the fan’s power supply
V
DD
(see Section 1.0, “Electrical Characteristics”).
2002 Microchip Technology Inc.
DS21448C-page 5
TC648
3.5
Auto-Shutdown Mode
3.0
DETAILED DESCRIPTION
If the voltage on V becomes less than the voltage on
IN
3.1
PWM
V
, the fan is automatically shut off (auto-shutdown
AS
mode). The TC648 exits auto-shutdown mode when
The PWM circuit consists of a ramp generator and
threshold detector. The frequency of the PWM is
determined by the value of the capacitor connected to
the voltage on V becomes higher than the voltage on
IN
V
by V
(the auto-shutdown hysteresis voltage
AS
HAS
(see Figure 3-1)). The Start-up Timer is triggered and
normal operation is resumed upon exiting auto-shut-
the C pin. A frequency of 30 Hz is recommended for
F
most applications (C = 1 µF). The PWM is also the
F
down mode. The V input should be grounded if auto-
time base for the Start-up Timer (see Section 3.3,
“Start-up Timer”). The PWM voltage control range is
1.25V to 2.65V (typical) for 0% to 100% output duty
cycle.
AS
shutdown mode is not used.
3.6
Shutdown Mode (Reset)
If an unconditional shutdown and/or device reset is
3.2
The V
VOUT Output
desired, the TC648 may be placed in shutdown mode
by forcing V to a logic low (i.e., V < V ) (see
SHDN
pin is designed to drive a low cost transistor
IN
IN
OUT
Figure 3-1). In this mode, all functions cease and the
OTF output is unconditionally inactive. The TC648
should not be shut down unless all heat producing
activity in the system is at a negligible level. The TC648
or MOSFET as the low side power switching element in
the system. Various examples of driver circuits will be
shown throughout this data sheet. This output has
asymmetric complementary drive and is optimized for
driving NPN transistors or N-channel MOSFETs. Since
the system relies on PWM rather than linear control,
the power dissipation in the power switch is kept to a
minimum. Generally, very small devices (TO-92 or SOT
packages) will suffice.
exits shutdown mode when V becomes greater than
IN
V
, the release voltage.
REL
Entering shutdown mode also performs a complete
device reset. Shutdown mode resets the TC648 into its
power-up state. OTF is unconditionally inactive in shut-
down mode. Upon exiting shutdown mode (V
>
IN
3.3
Start-Up Timer
V
), the Start-up Timer will be triggered and normal
REL
operation will resume, assuming V > V
+ V
HAS
IN
AS
To ensure reliable fan start-up, the Start-up Timer turns
the V
output on for 32 cycles of the PWM whenever
OUT
Note: If V < V when the device exits shutdown
IN
AS
the fan is started from the off state. This occurs at
power-up and when coming out of shutdown or auto-
shutdown mode. If the PWM frequency is 30 Hz
mode, the fan will not restart as it will be in auto-shut-
down mode.
If V is not greater than (V + V ) upon exiting
(C = 1 µF), the resulting start-up time will be
IN
AS
HAS
F
shutdown mode, the fan will not be restarted. To ensure
that a complete reset takes place, the user’s circuitry
approximately one second.
must ensure that V > (V + V ) when the device
HAS
3.4
Over-Temperature Fault (OTF)
Output
IN
AS
is released from shutdown mode. A recommended
algorithm for management of the TC648 by a host
microcontroller or other external circuitry is given in
Section 5.0, “Typical Applications”. A small amount of
OTF is asserted when the PWM control voltage applied
to V becomes greater than that needed to drive 100%
IN
duty cycle (see Section 1.0, “Electrical Characteris-
tics”). This indicates that the fan is at maximum drive,
and the potential exists for system overheating. Either
heat dissipation in the system has gone beyond the
cooling system’s design limits, or some subtle fault
exists (such as fan bearing failure or an airflow obstruc-
tion). This output may be treated as a “System Over-
heat” warning and used to trigger system shutdown or
some other corrective action. OTF will become inactive
hysteresis, typically one percent of V
(50 mV at
DD
V
= 5.0V), is designed into the V
/V
thresh-
DD
SHDN REL
SHDN
old. The levels specified for V
and V
in
REL
Section 1.0, “Electrical Characteristics”, include this
hysteresis plus adequate margin to account for normal
variations in the absolute value of the threshold and
hysteresis.
CAUTION: Shutdown mode is unconditional. That is,
when V < V
.
OTF
the fan will remain off as long as the V pin is being
IN
IN
held low or V < V + V .
HAS
IN
AS
DS21448C-page 6
2002 Microchip Technology Inc.
TC648
TC646
Status
Normal
Operation
Auto-Shutdown
Mode
Normal
Operation
Shut-
Down
Normal
Operation
HI
2.6V
V
+ V
AS
HAS
V
AS
TEMP.
1.2V
t
RESET
V
IN
V
REL
V
SHDN
LO
GND
Time
FIGURE 3-1:
TC648 Nominal Operation.
4.2
Normal Operation
4.0
SYSTEM BEHAVIOR
Normal Operation is an endless loop which may only
be exited by entering shutdown or auto-shutdown
mode. The loop can be thought of as executing at the
frequency of the oscillator and PWM.
The flowcharts describing the TC648’s behavioral
algorithms are shown in Figure 4-1. They can be
summarized as follows:
4.1
Power-Up
(1) Drive V
to a duty cycle proportional to V on a
IN
OUT
cycle by cycle basis.
(1) Assuming the device is not being held in shut-
down or auto-shutdown mode (V > V )..........
(2) If an over-temperature fault occurs, (V > V
),
OTF
IN
AS
IN
activate OTF; release OTF when V < V
.
OTF
(2) Turn V
output on for 32 cycles of the PWM
IN
OUT
clock. This ensures that the fan will start from a
(3) Is the TC648 in shutdown or auto-shutdown
mode?
dead stop.
(3) Branch to Normal Operation.
(4) End.
If so.....
a. V
duty cycle goes to zero.
OUT
b. OTF is disabled.
c. Exit the loop and wait for V > (V + V
),
IN
AS
HAS
then execute Power-up sequence.
(4) End.
2002 Microchip Technology Inc.
DS21448C-page 7
TC648
Normal
Operation
Power-Up
Power-on
Reset
OTF = 1
V
Duty
OUT
Cycle Prop.
to V
IN
Yes
≈ 0V
Minimum
Speed Mode
V
AS
Yes
V
> V
OTF
?
IN
No
No
OTF = 0
Auto-
Shutdown
= 0
Yes
OTF = 1
V
< V ?
AS
IN
V
OUT
No
No
V
AS
>
HAS
IN
+ V
Yes
(V
)
V
< V
AS
?
IN
YES
No
Auto-
Fire Start-up
Timer
Shutdown
V
= 0
OUT
Normal
Operation
Minimum
Speed Mode
Yes
V
= 0
V
≈ 0V ?
OUT
IN
No
No
V
= 0
No
OUT
V
> 1.25V ?
Yes
IN
V
> 1.25V
Yes
IN
Power-Up
V
Duty Cycle Proportional to V
IN
OUT
Yes
V
> V
?
IN
OTF
No
OTF = 0
OTF = 1
FIGURE 4-1:
TC648 Behavioral Algorithm Flowcharts.
DS21448C-page 8
2002 Microchip Technology Inc.
TC648
analysis. At the very least, anyone contemplating a
design using the TC648 should consult the documen-
tation for both the TC642EV (DS21403) and
TC642DEMO (DS21401). Figure 5-1 shows the base
schematic for the TC642DEMO.
An Excel-based spreadsheet is also available for
designing the thermistor network for the TC64X fan
controllers. This file (TC64X Therm) is available for
downloading from the Microchip website at
www.microchip.com.
5.0
TYPICAL APPLICATIONS
Designing with the TC648 involves the following:
(1) The temperature sensor network must be
configured to deliver 1.25V to 2.65V on V for 0%
IN
to 100% of the temperature range to be regulated.
(2) The auto-shutdown temperature must be set with
a voltage divider on V (if used).
AS
(3) The output drive transistor and base resistor must
be selected.
(4) If reset/shutdown capability is desired, the drive
requirements of the external signal or circuit must
be considered.
The TC642 demonstration and prototyping board
(TC642DEMO) and the TC642 Evaluation Kit
(TC642EV) provide working examples of TC648 cir-
cuits and prototyping aids. The TC642DEMO is a
printed circuit board optimized for small size and ease
of inclusion into system prototypes. The TC642EV is a
larger board intended for benchtop development and
+5V*
C
1 µF
+12V
B
NTC
R
1
Fan
Q
Shutdown**
V
V
DD
IN
Over-
Temperature
Interrupt
C
B
0.01 µF
R
2
1
OTF
OUT
+5V
R
BASE
TC648
V
R
3
V
AS
C
B
0.01 µF
NC
C
F
R
4
C
F
1 µF
GND
NOTES:
*See cautions regarding latch-up considerations in Section 5.0, "Typical Applications".
**Optional. See Section 5.0, "Typical Applications", for details.
FIGURE 5-1:
Typical Application Circuit.
2002 Microchip Technology Inc.
DS21448C-page 9
TC648
EQUATION
5.1
Temperature Sensor Design
V
x R
2
The temperature signal connected to V must output a
DD
IN
= V(T )
1
voltage in the range of 1.25V to 2.65V (typical) for 0%
to 100% of the temperature range of interest. The
circuit in Figure 5-2 illustrates a convenient way to pro-
vide this signal using a temperature dependent voltage
divider circuit.
R
(T ) + R
1 2
TEMP
V
x R
2
DD
= V(T )
2
R
(T ) + R
2 2
TEMP
Where T and T are the chosen temperatures and
1
2
V
DD
R
is the parallel combination of the thermistor
TEMP
and R .
1
I
DIV
These two equations facilitate solving for the two
unknown variables, R and R . More information about
1
2
thermistors may be obtained from AN679, “Tempera-
ture Sensing Technologies”, and AN685, “Thermistors
in Single Supply Temperature Sensing Circuits”, which
can be downloaded from Microchip's web site at
www.microchip.com.
RT
R
= 100 kΩ
= 23.2 kΩ
1
1
2
NTC Thermistor
100 kΩ @25˚C
V
IN
5.2
Minimum Speed Mode
R
The TC648 is configured for minimum speed mode by
grounding V and designing the temperature sensor
AS
network such that V operates the fan at relatively con-
IN
stant, minimum speed when the thermistor is at
minimum temperature. Figure 5-3 shows operation in
minimum speed mode. The 0% and 100% fan speeds
FIGURE 5-2:
Temperature Sensing
Circuit.
correspond to V values of 1.25V and 2.65V, typical.
IN
RT is a conventional NTC thermistor and R and R
1
1
2
Minimum system temperature (T
) is defined as the
MIN
are standard resistors. The supply voltage (V ) is
DD
lowest measured temperature at which proportional fan
speed control is required by the system. The fan
operates at minimum speed for all temperatures below
divided between R and the parallel combination of
2
RT and R . For convenience, the parallel combination
1
1
of RT and R will be referred to as R . The resis-
TEMP
1
1
T
and at speeds proportional to the measured
MIN
tance of the thermistor at various temperatures is
obtained from the manufacturer’s specifications. Ther-
mistors are often referred to in terms of their resistance
at 25°C.
temperature between T
and T
.
MIN
MAX
Fan Speed
100%
Generally, the thermistor shown in Figure 5-2 is a non-
linear device with a negative temperature coefficient
(also called an NTC thermistor). In Figure 5-2, R is
1
used to linearize the thermistor temperature response
and R is used to produce a positive temperature
Minimum
Speed
2
coefficient at the V node. As an added benefit, this
IN
configuration produces an output voltage delta of 1.4V,
0%
which is well within the range of the V
C(SPAN)
specification of the TC648. A 100 kΩ NTC thermistor is
T
T
MAX
MIN
selected for this application in order to keep I
minimum.
to a
DIV
FIGURE 5-3:
Minimum Fan Speed Mode
For the voltage range at V to be equal to 1.25V to
Operation.
IN
2.65V, the temperature range of this configuration is
0°C to 50°C. If a different temperature range is required
Temperature sensor design consists of a two-point
calculation: one at T and one at T . At T , the
MIN
MAX
MIN
from this circuit, R should be chosen to equal the
1
ohmic value of the thermistor must be much higher
resistance value of the thermistor at the center of this
new temperature range. It is suggested that a maxi-
mum temperature range of 50°C be used with this cir-
cuit due to thermistor linearity limitations. With this
than that of R so that minimum speed is determined
1
primarily by the values of R and R . At T , the
1
2
MAX
ohmic value of the thermistor must result in a V of
IN
2.65V nominal. The design procedure consists of ini-
change, R is adjusted according to the following
2
tially choosing R to be 10 times smaller than the ther-
1
equations:
DS21448C-page 10
2002 Microchip Technology Inc.
TC648
mistor resistance at T . R is then calculated to
5.3
Auto-Shutdown Temperature
MIN
2
deliver the desired speed at T
. The values for R , R
1 2
MIN
MAX
Design
and RT are then checked at T
for 2.65V nominal.
1
A voltage divider on V sets the temperature at which
It may be necessary to adjust the values of R and R
AS
1
2
the part is automatically shut down if the sensed
after the initial calculation to obtain the desired results.
The design equations are:
temperature at V drops below the set temperature at
IN
V
(i.e. V < V ).
AS
IN
AS
EQUATION
As with the V input, 1.25V to 2.65V corresponds to
IN
the temperature range of interest from T to T ,
1
2
R = (0.1)(RT
)
1MIN
1
respectively. Assuming that the temperature sensor
network designed previously is linearly related to
Where: RT = Thermistor resistance at T
1
MIN
temperature, the shutdown temperature T is related
AS
to T and T by:
EQUATION
2
1
(RT
)(R )(V
)
MIN
1MIN
1
EQUATION
R
=
2
(RT
+ R )(V - V
)
1MIN
1
DD
MIN
V
- 1.25
2.65 - 1.25V
T - T
AS
=
Where V
= the value of V required for
IN
T
- T
2
1
MIN
AS
1
minimum fan speed. V = Power Supply Voltage
DD
1.4V
2
(T - T ) + 1.25
V
=
AS
1
)
(
AS
T - T
1
EQUATION
(RT
)(R )(V
)
MIN
1MIN
1
For example, if 1.25V and 2.65V at V corresponds to
IN
V
=
MAX
a temperature range of T = 0°C to T = 125°C, and the
R (R + RT
)(V
)
DD
1
2
2
1
1MAX
auto-shutdown temperature desired is 25°C, then the
Where RT
MAX
fan speed.
= thermistor resistance at T
= the value of V required for maximum
,
MAX
V
voltage is:
1MAX
AS
V
IN
EQUATION
1.4V
(125 - 0)
Because the thermistor characteristics are fixed, it may
not be possible, in certain applications, to obtain the
V
=
(25 - 0) + 1.25 = 1.53V
AS
desired values of V
and V
using the above
MAX
MIN
equations. In this case, the circuit in Figure 5-4 can be
The V voltage may be set using a simple resistor
divider, as shown in Figure 5-5.
AS
used. Diode D clamps V to the voltage required to
1
IN
sustain minimum speed. The calculations of R and
1
R
for the temperature sensor are identical to the
2
V
DD
equation on the previous page.
V
DD
R
1
I
IN
R
R
R
1
3
RT
1
I
V
AS
DIV
V
IN
D
1
R
2
R
4
2
GND
FIGURE 5-4:
Minimum Fan Speed Circuit.
FIGURE 5-5:
V
Circuit.
AS
2002 Microchip Technology Inc.
DS21448C-page 11
TC648
Per Section 1.0, “Electrical Characteristics”, the leak-
fans with nominal operating currents of no more than
200 mA, a single transistor usually suffices. Above
200 mA, the Darlington or MOSFET solution is
recommended. For the power dissipation to be kept
low, it is imperative that the pass transistor be fully sat-
urated when "on".
age current at the V pin is no more than 1 µA. It is
AS
conservative to design for a divider current, I , of
DIV
100 µA. If V = 5.0V then…
DD
EQUATION
Table 5-1 gives examples of some commonly available
transistors and MOSFETs. This table should be used
as a guide only since there are many transistors and
MOSFETs which will work just as well as those listed.
The critical issues when choosing a device to use as
5.0V
–4
I
= 1e A =
, therefore
DIV
R + R
1
2
5.0V
R + R =
= 50,000Ω = 50 kΩ
1
2
–4
1e A
Q1 are: (1) the breakdown voltage (V
or V
DS
(BR)CEO
(MOSFET)) must be large enough to withstand the
highest voltage applied to the fan (Note: This will occur
when the fan is off); (2) 5 mA of base drive current must
be enough to saturate the transistor when conducting
the full fan current (transistor must have sufficient
We can further specify R and R by the condition that
1
2
the divider voltage is equal to our desired V . This
AS
yields the following:
gain); (3) the V
voltage must be high enough to suf-
OUT
EQUATION
ficiently drive the gate of the MOSFET to minimize the
V
x R
R
of the device; (4) rated fan current draw must
DD
2
DS(on)
V
=
AS
be within the transistor's/MOSFET's current handling
capability; and (5) power dissipation must be kept
within the limits of the chosen device.
R + R
1
2
Solving for the relationship between R and R results
1
2
A base-current limiting resistor is required with bipolar
transistors. The correct value for this resistor can be
determined as follows:
in the following equation:
EQUATION
V
V
= V
= R
+ V
BE R
(SAT)
OH
R
V
- V
AS
BASE
BASE
FE
R x (5 - 1.53)
DD
2
R = R x
1
2
=
x I
1.53
BASE
V
BASE
AS
I
= I
/ h
FAN
BASE
For this example, R = (2.27) R . Substituting this rela-
1
2
V
is specified as 80% of V
in Section 1.0,
DD
OH
tionship back into the original equation yields the
resistor values:
“Electrical Characteristics”; V
is given in the
BE
(SAT)
chosen transistor data sheet. It is now possible to solve
for R
R = 15.3 kΩ, and R = 34.7 kΩ
.
2
1
BASE
In this case, the standard values of 34.8 kΩ and
15.4 kΩ are very close to the calculated values and
would be more than adequate.
EQUATION
V
- V
OH
I
BE(SAT)
R
=
BASE
BASE
5.4
Output Drive Transistor Selection
The TC648 is designed to drive an external transistor
Some applications benefit from the fan being powered
from a negative supply to keep motor noise out of the
positive supply rails. This can be accomplished by the
or MOSFET for modulating power to the fan. This is
shown as Q in Figures 5-1, 5-6, 5-7,and 5-8. The
1
V
pin has a minimum source current of 5 mA and a
OUT
method shown in Figure 5-7. Zener diode D offsets
1
minimum sink current of 1 mA. Bipolar transistors or
MOSFETs may be used as the power switching ele-
ment, as is shown in Figure 5-6. When high current
gain is needed to drive larger fans, two transistors may
be used in a Darlington configuration. These circuit
topologies are shown in Figure 5-6: (a) shows a single
NPN transistor used as the switching element; (b) illus-
trates the Darlington pair; and (c) shows an N-channel
MOSFET.
the -12V power supply voltage, holding transistor Q off
1
when V
is low. When V
is high, the voltage at
OUT
OUT
the anode of D increases by V , causing Q to turn
1
OH
1
on. Operation is otherwise the same as in the case of
fan operation from +12V.
One major advantage of the TC648’s PWM control
scheme versus linear speed control is that the power
dissipation in the pass element is kept very low.
Generally, low cost devices in very small packages,
such as TO-92 or SOT, can be used effectively. For
DS21448C-page 12
2002 Microchip Technology Inc.
TC648
V
DD
V
V
DD
DD
Fan
Fan
Fan
R
R
BASE
BASE
V
V
OUT
OUT
Q
1
Q
Q
1
1
V
OUT
Q
2
GND
GND
GND
b) Darlington Transistor Pair
a) Single Bipolar Transistor
C) N-Channel MOSFET
FIGURE 5-6:
Output Drive Transistor Circuit Topologies.
TABLE 5-1:
Device
TRANSISTORS AND MOSFETS FOR Q (V = 5V)
1
DD
Max. V
/V
V
/V
Fan Current
(mA)
Suggested
BE(sat) GS
CEO DS
Package
Min. H
FE
(V)
(V)
R
(Ω)
BASE
800
800
301
Note 1
Note 1
Note 1
Note 1
MMBT2222A
MPS2222A
MPS6602
SI2302
MGSF1N02E
SI4410
SOT-23
TO-92
TO-92
SOT-23
SOT-23
SO-8
1.2
1.2
1.2
2.5
2.5
4.5
4.5
50
50
50
NA
NA
NA
NA
40
40
40
20
20
30
60
150
150
500
500
500
1000
500
SI2308
SOT-23
Note 1: A series gate resistor may be used in order to control the MOSFET turn-on and turn-off times.
2002 Microchip Technology Inc.
DS21448C-page 13
TC648
+5V
V
DD
R *
2
2.2 kΩ
V
OUT
D
12.0V
Zener
1
Fan
TC648
Q *
1
R *
4
GND
10 kΩ
-12V
NOTE: *Value depends on the specific application and is shown for example only.
FIGURE 5-7:
Powering the Fan from a -12V Supply.
5.5
Latch-up Considerations
Auto-Shutdown Mode Design Example
Step 1. Calculate R and R based on using an NTC
1
2
As with any CMOS IC, the potential exists for latch-up
if signals are applied to the device which are outside
the power supply range. This is of particular concern
during power-up if the external circuitry (such as the
having a resistance of 10 kΩ at T
(25°C)
MIN
and 4.65 kΩ at T
(45°C) (see Figure 5-8).
MAX
R = 20.5 kΩ
1
sensor network, V
divider or shutdown circuit) are
R = 3.83 kΩ
AS
2
powered by a supply different from that of the TC648.
Care should be taken to ensure that the TC648’s V
Step 2. Set auto-shutdown level.
= 1.8V
DD
V
AS
supply powers up first. If possible, the networks
attached to V and V should connect to the V sup-
Limit the divider current to 100 µA
IN
AS
DD
R = 33 kΩ
R = 18 kΩ
5
6
ply at the same physical location as the IC itself. Even
if the IC and any external networks are powered by the
same supply, physical separation of the connecting
points can result in enough parasitic capacitance and/
or inductance in the power supply connections to delay
one power supply “routing” versus another.
Step 3. Design the output circuit
Maximum fan motor current = 250 mA.
Q beta is chosen at 50 from which
1
R = 800 Ω.
7
5.6
Power Supply Routing and
Bypassing
5.7
Minimum Speed Mode Design
Example
Noise present on the V and V inputs may cause
IN
AS
Given:
erroneous operation of the OTF output. As a result,
these inputs should be bypassed with a 0.01 µF capac-
itor mounted as close to the package as possible. This
Minimum speed = 40%(1.8V)
T
= 30°C, T
= 95°C
MAX
MIN
Thermistor = 100 kΩ at 25°C
RT = 79.4 kΩ, RT = 6.5 kΩ
is especially true of V , which is usually driven from a
IN
MIN
MAX
high impedance source (such as a thermistor). Addi-
tionally, the V input should be bypassed with a 1 µF
Step 1: Calculate R :
DD
1
capacitor and grounds should be kept as short as pos-
sible. To keep fan noise off the TC648 ground pin, indi-
vidual ground returns for the TC648 and the low side of
the fan drive device should be used.
R
= 7.9 kΩ (Use closest standard value:
1
7.87 kΩ)
Calculate R2:
R
= 4.05 kΩ (Use closest standard value:
2
4.02 kΩ)
Step 2: Verify V
:
MAX
V
= 2.64V
MAX
DS21448C-page 14
2002 Microchip Technology Inc.
TC648
+5V
+12V
Fan
+5V
C
1 µF
B
NTC
10 kΩ
@ 25˚C
1
R
1
Open-Drain
Device
20.5 kΩ
4
8
RESET
Shutdown
V
DD
V
GND
IN
C
B
R
2
3.83 kΩ
6
0.01 µF
Thermal
Fault
Q
1
OTF
(Optional)
R
7
+5V
800Ω
TC648
7
5
V
R
5
OUT
NC
33 kΩ
3
V
AS
C
B
0.01 µF
2
R
C
F
6
18 kΩ
C
B
1 µF
FIGURE 5-8:
Design Example.
5.8
TC648 as a Microcontroller
Peripheral
In a system containing a microcontroller or other host
intelligence, the TC648 can be effectively managed as
a CPU peripheral. Routine fan control functions can be
performed by the TC648 without processor interven-
tion. The microcontroller receives temperature data
from one or more points throughout the system. It
calculates a fan operating speed based on an algorithm
specifically designed for the application at hand. The
processor controls fan speed using complementary
port bits I/O1 through I/O3.
Resistors R through R (5% tolerance) form a crude
1
6
3-bit DAC that translates the 3-bit code from the
processor's outputs into a 1.6V DC control signal. A
monolithic DAC or digital pot may be used instead of
the circuit shown in Figure 5-9.
With V set at 1.8V, the TC648 enters auto-shutdown
AS
when the processor's output code is 000[B]. Output
codes 001[B] to 111[B] operate the fan from roughly
40% to 100% of full speed. An open-drain output from
the processor (I/O0) can be used to reset the TC648
following detection of a fault condition. The OTF output
can be connected to the processor's interrupt input, or
to another I/O pin, for polled operation.
2002 Microchip Technology Inc.
DS21448C-page 15
TC648
+12V
Fan
+5V
(RESET)
(Optional)
Open-Drain
Outputs
I/O0
+5V
R
1
110 kΩ
1
2
8
(MSB)
V
C
V
I/O1
I/O2
I/O3
IN
DD
C
+
B
C
R
2
B
Analog or Digital
Temperature
Data from one or
more Sensors
1 µF
240 kΩ
R
.01 µF
CMOS
Outputs
9
800Ω
7
R
3
F
V
OUT
2N2222A
+
360 kΩ
+5V
TC648
1 µF
R
7
33 kΩ
(LSB)
R
10
10 kΩ
R
18 k
CMOS
Microcontroller
4
3
6
5
R
5
V
AS
Ω
+5V
OTF
NC
C
B
1.5 kΩ
R
18 kΩ
8
+5V
.01 µF
4
R
6
GND
1 kΩ
GND
INT
FIGURE 5-9:
TC648 as a Microcontroller Peripheral.
DS21448C-page 16
2002 Microchip Technology Inc.
TC648
6.0
6.1
PACKAGING INFORMATION
Package Marking Information
8-Lead PDIP (300 mil)
Example:
XXXXXXXX
NNN
TC648VPA
025
YYWW
0215
8-Lead SOIC (150 mil)
Example:
XXXXXXXX
YYWW
TC648VOA
0215
NNN
025
Example:
8-Lead MSOP
TC648E
XXXXXX
YWWNNN
215025
Legend: XX...X Customer specific information*
YY
WW
NNN
Year code (last 2 digits of calendar year)
Week code (week of January 1 is week ‘01’)
Alphanumeric traceability code
Note:
In the event the full Microchip part number cannot be marked on one line, it will
be carried over to the next line thus limiting the number of available characters
for customer specific information.
*
Standard marking consists of Microchip part number, year code, week code, traceability code (facility
code, mask rev#, and assembly code). For marking beyond this, certain price adders apply. Please check
with your Microchip Sales Office.
2002 Microchip Technology Inc.
DS21448C-page 17
TC648
8-Lead Plastic Dual In-line (P) – 300 mil (PDIP)
E1
D
2
n
1
α
E
A2
A
L
c
A1
β
B1
B
p
eB
Units
Dimension Limits
INCHES*
NOM
MILLIMETERS
MIN
MAX
MIN
NOM
8
MAX
n
p
A
A2
A1
E
E1
D
L
c
B1
B
Number of Pins
Pitch
Top to Seating Plane
Molded Package Thickness
Base to Seating Plane
Shoulder to Shoulder Width
Molded Package Width
Overall Length
Tip to Seating Plane
Lead Thickness
Upper Lead Width
Lower Lead Width
Overall Row Spacing
Mold Draft Angle Top
Mold Draft Angle Bottom
8
.100
.155
.130
2.54
3.94
3.30
.140
.170
.145
3.56
2.92
4.32
3.68
.115
.015
.300
.240
.360
.125
.008
.045
.014
.310
5
0.38
7.62
6.10
9.14
3.18
0.20
1.14
0.36
7.87
5
.313
.250
.373
.130
.012
.058
.018
.370
10
.325
.260
.385
.135
.015
.070
.022
.430
15
7.94
6.35
9.46
3.30
0.29
1.46
0.46
9.40
10
8.26
6.60
9.78
3.43
0.38
1.78
0.56
10.92
15
§
eB
α
β
5
10
15
5
10
15
* Controlling Parameter
§ Significant Characteristic
Notes:
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed
.010” (0.254mm) per side.
JEDEC Equivalent: MS-001
Drawing No. C04-018
DS21448C-page 18
2002 Microchip Technology Inc.
TC648
8-Lead Plastic Small Outline (SN) – Narrow, 150 mil (SOIC)
E
E1
p
D
2
B
n
1
h
α
45×
c
A2
A
f
β
L
A1
Units
INCHES*
NOM
MILLIMETERS
Dimension Limits
MIN
MAX
MIN
NOM
8
MAX
n
p
A
A2
A1
E
E1
D
h
L
f
Number of Pins
Pitch
Overall Height
8
.050
.061
.056
.007
.237
.154
.193
.015
.025
4
1.27
.053
.069
1.35
1.32
1.55
1.42
0.18
6.02
3.91
4.90
0.38
0.62
4
1.75
1.55
0.25
6.20
3.99
5.00
0.51
0.76
8
Molded Package Thickness
Standoff
.052
.004
.228
.146
.189
.010
.019
0
.061
.010
.244
.157
.197
.020
.030
8
§
0.10
5.79
3.71
4.80
0.25
0.48
0
Overall Width
Molded Package Width
Overall Length
Chamfer Distance
Foot Length
Foot Angle
c
Lead Thickness
Lead Width
.008
.013
0
.009
.017
12
.010
.020
15
0.20
0.33
0
0.23
0.42
12
0.25
0.51
15
B
α
β
Mold Draft Angle Top
Mold Draft Angle Bottom
0
12
15
0
12
15
* Controlling Parameter
§ Significant Characteristic
Notes:
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed
.010” (0.254mm) per side.
JEDEC Equivalent: MS-012
Drawing No. C04-057
2002 Microchip Technology Inc.
DS21448C-page 19
TC648
8-Lead Plastic Micro Small Outline Package (MS) (MSOP)
E
p
E1
D
2
B
n
1
α
A2
A
c
φ
A1
(F)
L
β
Units
Dimension Limits
INCHES
NOM
MILLIMETERS*
NOM
MIN
MAX
MIN
MAX
n
p
Number of Pins
Pitch
8
8
.026
0.65
Overall Height
Molded Package Thickness
A
A2
A1
E
E1
D
.044
1.18
.030
.034
.038
.006
.200
.122
.122
.028
.039
0.76
0.05
0.86
0.97
0.15
.5.08
3.10
3.10
0.70
1.00
Standoff
§
.002
.184
.114
.114
.016
.035
Overall Width
Molded Package Width
Overall Length
Foot Length
Footprint (Reference)
Foot Angle
.193
.118
.118
.022
.037
4.90
3.00
3.00
0.55
0.95
4.67
2.90
2.90
0.40
0.90
L
F
φ
0
6
0
6
c
Lead Thickness
Lead Width
Mold Draft Angle Top
Mold Draft Angle Bottom
.004
.010
.006
.012
.008
.016
0.10
0.25
0.15
0.30
0.20
0.40
B
α
β
7
7
7
7
*Controlling Parameter
§ Significant Characteristic
Notes:
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not
exceed. 010" (0.254mm) per side.
Drawing No. C04-111
DS21448C-page 20
2002 Microchip Technology Inc.
TC648
6.2
Taping Form
Component Taping Orientation for 8-Pin SOIC (Narrow) Devices
User Direction of Feed
PIN 1
W
P
Standard Reel Component Orientation
for 713 Suffix Device
Carrier Tape, Number of Components Per Reel and Reel Size
Package
Carrier Width (W)
Pitch (P)
Part Per Full Reel
Reel Size
8-Pin SOIC (N)
12 mm
8 mm
2500
13 in
Component Taping Orientation for 8-Pin MSOP Devices
User Direction of Feed
PIN 1
W
P
Standard Reel Component Orientation
for 713 Suffix Device
Carrier Tape, Number of Components Per Reel and Reel Size
Package
Carrier Width (W)
Pitch (P)
Part Per Full Reel
Reel Size
8-Pin MSOP
12 mm
8 mm
2500
13 in
2002 Microchip Technology Inc.
DS21448C-page 21
TC648
NOTES:
DS21448C-page 22
2002 Microchip Technology Inc.
TC648
ON-LINE SUPPORT
Microchip provides on-line support on the Microchip
World Wide Web site.
SYSTEMS INFORMATION AND
UPGRADE HOT LINE
The Systems Information and Upgrade Line provides
system users a listing of the latest versions of all of
Microchip's development systems software products.
Plus, this line provides information on how customers
can receive the most current upgrade kits.The Hot Line
Numbers are:
1-800-755-2345 for U.S. and most of Canada, and
1-480-792-7302 for the rest of the world.
The web site is used by Microchip as a means to make
files and information easily available to customers. To
view the site, the user must have access to the Internet
®
®
and a web browser, such as Netscape or Microsoft
Internet Explorer. Files are also available for FTP
download from our FTP site.
ConnectingtotheMicrochipInternetWebSite
The Microchip web site is available at the following
URL:
092002
www.microchip.com
The file transfer site is available by using an FTP ser-
vice to connect to:
ftp://ftp.microchip.com
The web site and file transfer site provide a variety of
services. Users may download files for the latest
Development Tools, Data Sheets, Application Notes,
User's Guides, Articles and Sample Programs. A vari-
ety of Microchip specific business information is also
available, including listings of Microchip sales offices,
distributors and factory representatives. Other data
available for consideration is:
• Latest Microchip Press Releases
• Technical Support Section with Frequently Asked
Questions
• Design Tips
• Device Errata
• Job Postings
• Microchip Consultant Program Member Listing
• Links to other useful web sites related to
Microchip Products
• Conferences for products, Development Systems,
technical information and more
• Listing of seminars and events
2002 Microchip Technology Inc.
DS21448C-page23
TC648
READER RESPONSE
It is our intention to provide you with the best documentation possible to ensure successful use of your Microchip prod-
uct. If you wish to provide your comments on organization, clarity, subject matter, and ways in which our documentation
can better serve you, please FAX your comments to the Technical Publications Manager at (480) 792-4150.
Please list the following information, and use this outline to provide us with your comments about this document.
To:
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RE:
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Telephone: (_______) _________ - _________
FAX: (______) _________ - _________
Application (optional):
Would you like a reply?
Y
N
Literature Number:
DS21448C
Device:
TC648
Questions:
1. What are the best features of this document?
2. How does this document meet your hardware and software development needs?
3. Do you find the organization of this document easy to follow? If not, why?
4. What additions to the document do you think would enhance the structure and subject?
5. What deletions from the document could be made without affecting the overall usefulness?
6. Is there any incorrect or misleading information (what and where)?
7. How would you improve this document?
DS21448C-page24
2002 Microchip Technology Inc.
TC648
PRODUCT IDENTIFICATION SYSTEM
To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office.
PART NO.
Device
X
/XX
Examples:
Temperature Package
Range
a)
b)
c)
d)
TC648VOA:
PWM Fan Speed Controller
w/Auto Shutdown and Over-Temperature Alert,
SOIC package.
TC648VUA:
w/Auto Shutdown and Over-Temperature Alert,
MSOP package.
TC648VPA:
w/Auto Shutdown and Over-Temperature Alert,
PDIP package.
TC648EOA713: PWM Fan Speed Controller
w/Auto Shutdown and Over-Temperature Alert,
SOIC package, Tape and Reel.
PWM Fan Speed Controller
Device:
TC648:
PWM Fan Speed Controller w/Auto Shutdown
and Overtemperature Alert
PWM Fan Speed Controller
Temperature Range:
Package:
V
E
=
0°C to +85°C
= -40°C to +85°C
PA
OA
UA
=
=
=
Plastic DIP (300 mil Body), 8-lead
Plastic SOIC, (150 mil Body), 8-lead
Plastic Micro Small Outline (MSOP), 8-lead
* PDIP package is only offered in the V temp range
Sales and Support
Data Sheets
Products supported by a preliminary Data Sheet may have an errata sheet describing minor operational differences and recom-
mended workarounds. To determine if an errata sheet exists for a particular device, please contact one of the following:
1. Your local Microchip sales office
2. The Microchip Corporate Literature Center U.S. FAX: (480) 792-7277
3. The Microchip Worldwide Site (www.microchip.com)
Please specify which device, revision of silicon and Data Sheet (include Literature #) you are using.
New Customer Notification System
Register on our web site (www.microchip.com/cn) to receive the most current information on our products.
2002 Microchip Technology Inc.
DS21448C-page25
TC648
NOTES:
DS21448C-page 26
2002 Microchip Technology Inc.
Information contained in this publication regarding device
applications and the like is intended through suggestion only
and may be superseded by updates. It is your responsibility to
ensure that your application meets with your specifications.
No representation or warranty is given and no liability is
assumed by Microchip Technology Incorporated with respect
to the accuracy or use of such information, or infringement of
patents or other intellectual property rights arising from such
use or otherwise. Use of Microchip’s products as critical com-
ponents in life support systems is not authorized except with
express written approval by Microchip. No licenses are con-
veyed, implicitly or otherwise, under any intellectual property
rights.
Trademarks
The Microchip name and logo, the Microchip logo, KEELOQ,
MPLAB, PIC, PICmicro, PICSTART and PRO MATE are
registered trademarks of Microchip Technology Incorporated
in the U.S.A. and other countries.
FilterLab, microID, MXDEV, MXLAB, PICMASTER, SEEVAL
and The Embedded Control Solutions Company are
registered trademarks of Microchip Technology Incorporated
in the U.S.A.
dsPIC, dsPICDEM.net, ECONOMONITOR, FanSense,
FlexROM, fuzzyLAB, In-Circuit Serial Programming, ICSP,
ICEPIC, microPort, Migratable Memory, MPASM, MPLIB,
MPLINK, MPSIM, PICC, PICDEM, PICDEM.net, rfPIC, Select
Mode and Total Endurance are trademarks of Microchip
Technology Incorporated in the U.S.A. and other countries.
Serialized Quick Turn Programming (SQTP) is a service mark
of Microchip Technology Incorporated in the U.S.A.
All other trademarks mentioned herein are property of their
respective companies.
© 2002, Microchip Technology Incorporated, Printed in the
U.S.A., All Rights Reserved.
Printed on recycled paper.
Microchip received QS-9000 quality system
certification for its worldwide headquarters,
design and wafer fabrication facilities in
Chandler and Tempe, Arizona in July 1999
and Mountain View, California in March 2002.
The Company’s quality system processes and
procedures are QS-9000 compliant for its
®
PICmicro 8-bit MCUs, KEELOQ® code hopping
devices, Serial EEPROMs, microperipherals,
non-volatile memory and analog products. In
addition, Microchip’s quality system for the
design and manufacture of development
systems is ISO 9001 certified.
2002 Microchip Technology Inc.
DS21448C - page 27
M
WORLDWIDE SALES AND SERVICE
Japan
AMERICAS
ASIA/PACIFIC
Microchip Technology Japan K.K.
Benex S-1 6F
Corporate Office
Australia
2355 West Chandler Blvd.
Microchip Technology Australia Pty Ltd
Suite 22, 41 Rawson Street
Epping 2121, NSW
3-18-20, Shinyokohama
Kohoku-Ku, Yokohama-shi
Kanagawa, 222-0033, Japan
Tel: 81-45-471- 6166 Fax: 81-45-471-6122
Chandler, AZ 85224-6199
Tel: 480-792-7200 Fax: 480-792-7277
Technical Support: 480-792-7627
Web Address: http://www.microchip.com
Australia
Tel: 61-2-9868-6733 Fax: 61-2-9868-6755
Korea
Rocky Mountain
China - Beijing
Microchip Technology Korea
168-1, Youngbo Bldg. 3 Floor
Samsung-Dong, Kangnam-Ku
Seoul, Korea 135-882
2355 West Chandler Blvd.
Chandler, AZ 85224-6199
Tel: 480-792-7966 Fax: 480-792-4338
Microchip Technology Consulting (Shanghai)
Co., Ltd., Beijing Liaison Office
Unit 915
Bei Hai Wan Tai Bldg.
Tel: 82-2-554-7200 Fax: 82-2-558-5934
Atlanta
No. 6 Chaoyangmen Beidajie
Beijing, 100027, No. China
Tel: 86-10-85282100 Fax: 86-10-85282104
500 Sugar Mill Road, Suite 200B
Atlanta, GA 30350
Singapore
Microchip Technology Singapore Pte Ltd.
200 Middle Road
Tel: 770-640-0034 Fax: 770-640-0307
China - Chengdu
#07-02 Prime Centre
Boston
Microchip Technology Consulting (Shanghai)
Co., Ltd., Chengdu Liaison Office
Rm. 2401, 24th Floor,
Singapore, 188980
2 Lan Drive, Suite 120
Westford, MA 01886
Tel: 978-692-3848 Fax: 978-692-3821
Tel: 65-6334-8870 Fax: 65-6334-8850
Taiwan
Ming Xing Financial Tower
Microchip Technology (Barbados) Inc.,
Taiwan Branch
Chicago
No. 88 TIDU Street
333 Pierce Road, Suite 180
Itasca, IL 60143
Chengdu 610016, China
11F-3, No. 207
Tel: 86-28-86766200 Fax: 86-28-86766599
Tung Hua North Road
Taipei, 105, Taiwan
Tel: 630-285-0071 Fax: 630-285-0075
China - Fuzhou
Dallas
Microchip Technology Consulting (Shanghai)
Co., Ltd., Fuzhou Liaison Office
Unit 28F, World Trade Plaza
Tel: 886-2-2717-7175 Fax: 886-2-2545-0139
4570 Westgrove Drive, Suite 160
Addison, TX 75001
Tel: 972-818-7423 Fax: 972-818-2924
No. 71 Wusi Road
EUROPE
Austria
Detroit
Fuzhou 350001, China
Tri-Atria Office Building
Tel: 86-591-7503506 Fax: 86-591-7503521
Microchip Technology Austria GmbH
Durisolstrasse 2
32255 Northwestern Highway, Suite 190
Farmington Hills, MI 48334
Tel: 248-538-2250 Fax: 248-538-2260
China - Shanghai
Microchip Technology Consulting (Shanghai)
Co., Ltd.
A-4600 Wels
Austria
Kokomo
Room 701, Bldg. B
Tel: 43-7242-2244-399
Fax: 43-7242-2244-393
Denmark
2767 S. Albright Road
Kokomo, Indiana 46902
Tel: 765-864-8360 Fax: 765-864-8387
Los Angeles
Far East International Plaza
No. 317 Xian Xia Road
Shanghai, 200051
Microchip Technology Nordic ApS
Regus Business Centre
Lautrup hoj 1-3
Tel: 86-21-6275-5700 Fax: 86-21-6275-5060
18201 Von Karman, Suite 1090
Irvine, CA 92612
China - Shenzhen
Microchip Technology Consulting (Shanghai)
Co., Ltd., Shenzhen Liaison Office
Rm. 1315, 13/F, Shenzhen Kerry Centre,
Renminnan Lu
Ballerup DK-2750 Denmark
Tel: 949-263-1888 Fax: 949-263-1338
Tel: 45 4420 9895 Fax: 45 4420 9910
New York
France
150 Motor Parkway, Suite 202
Hauppauge, NY 11788
Microchip Technology SARL
Parc d’Activite du Moulin de Massy
43 Rue du Saule Trapu
Shenzhen 518001, China
Tel: 631-273-5305 Fax: 631-273-5335
Tel: 86-755-2350361 Fax: 86-755-2366086
San Jose
China - Hong Kong SAR
Batiment A - ler Etage
Microchip Technology Inc.
2107 North First Street, Suite 590
San Jose, CA 95131
Microchip Technology Hongkong Ltd.
Unit 901-6, Tower 2, Metroplaza
223 Hing Fong Road
91300 Massy, France
Tel: 33-1-69-53-63-20 Fax: 33-1-69-30-90-79
Germany
Tel: 408-436-7950 Fax: 408-436-7955
Kwai Fong, N.T., Hong Kong
Microchip Technology GmbH
Steinheilstrasse 10
Tel: 852-2401-1200 Fax: 852-2401-3431
Toronto
6285 Northam Drive, Suite 108
Mississauga, Ontario L4V 1X5, Canada
Tel: 905-673-0699 Fax: 905-673-6509
India
D-85737 Ismaning, Germany
Tel: 49-89-627-144 0 Fax: 49-89-627-144-44
Microchip Technology Inc.
India Liaison Office
Italy
Divyasree Chambers
Microchip Technology SRL
Centro Direzionale Colleoni
Palazzo Taurus 1 V. Le Colleoni 1
20041 Agrate Brianza
1 Floor, Wing A (A3/A4)
No. 11, O’Shaugnessey Road
Bangalore, 560 025, India
Tel: 91-80-2290061 Fax: 91-80-2290062
Milan, Italy
Tel: 39-039-65791-1 Fax: 39-039-6899883
United Kingdom
Microchip Ltd.
505 Eskdale Road
Winnersh Triangle
Wokingham
Berkshire, England RG41 5TU
Tel: 44 118 921 5869 Fax: 44-118 921-5820
08/01/02
DS21448C-page 28
2002 Microchip Technology Inc.
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