TCM809TVNB713G [MICROCHIP]
1-CHANNEL POWER SUPPLY SUPPORT CKT, PDSO3, LEAD FREE, PLASTIC, TO-236, SOT-23B, 3 PIN;
| 型号： | TCM809TVNB713G |
| 厂家： | 
MICROCHIP |
| 描述： | 1-CHANNEL POWER SUPPLY SUPPORT CKT, PDSO3, LEAD FREE, PLASTIC, TO-236, SOT-23B, 3 PIN 光电二极管 |
| 文件： | 总16页 (文件大小：232K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
TCM809/TCM810
3-Pin Microcontroller Reset Monitors
Features
General Description
• Precision VDD Monitor for 2.5V, 3.0V, 3.3V, 5.0V
Nominal System Voltage Supplies
The TCM809 and TCM810 are cost-effective system
supervisor circuits designed to monitor VDD in digital
systems; providing a reset signal to the host processor,
when necessary. No external components are
required.
• 140 msec Minimum RESET Time-Out Period
• RESET Output to VDD = 1.0V (TCM809)
• Low Supply Current, 9 µA (typ.)
• VDD Transient Immunity
The RESET output is typically driven active within
65 µsec of VDD falling through the reset voltage thresh-
old. RESET is maintained active for a minimum of
140 msec after VDD rises above the reset threshold.
The TCM810 has an active-high RESET output, while
the TCM809 has an active-low RESET output. The
output of the TCM809/TCM810 is valid down to
VDD = 1V. Both devices are available in 3-Pin SC-70
and SOT-23B packages.
• Small 3-Pin SC-70 and SOT-23B Packages
• No External Components
• Push-Pull RESET Output
• Temperature Ranges:
- Industrial: SC-70 (E): -40C to +85C
- Extended: SOT-23, SC-70 (V): -40C to +125C
The TCM809/TCM810 are optimized to reject fast
transient glitches on the VDD line. A low supply current
of 9 µA (typ., VDD = 3.3V) make these devices suitable
for battery-powered applications.
Applications
• Computers
• Embedded Systems
• Battery-powered Equipment
• Critical Microcontroller Power Supply Monitoring
• Automotive
Pin Configurations
SOT-23B/SC-70
Typical Application Circuit
1
2
GND
VDD
VDD
3
VDD
3
VDD
PIC®
Microcontroller
TCM809 RESET
TCM810 (RESET)
TCM809
2
RESET
RESET
INPUT
(Active-Low)
Note: 3-Pin SOT-23B is equivalent to
GND
1
GND
JEDEC TO-236.
2001-2012 Microchip Technology Inc.
DS21661E-page 1
TCM809/TCM810
† Notice: Stresses above those listed under “Maximum
Ratings” may cause permanent damage to the device. This is
a stress rating only and functional operation of the device at
those or any other conditions above those indicated in the
operational listings of this specification is not implied.
Exposure to maximum rating conditions for extended periods
may affect device reliability.
1.0
ELECTRICAL
CHARACTERISTICS
Absolute Maximum Ratings†
Supply Voltage (VDD to GND) ........................................................6.0V
RESET, RESET ................................................... -0.3V to (VDD +0.3V)
Input Current, VDD.......................................................................20 mA
Output Current, RESET, RESET.................................................20 mA
dV/dt (VDD)...........................................................................100V/µsec
Operating Temperature Range ...................................-40°C to +125°C
Power Dissipation (TA = 70°C):
3-Pin SOT-23B (derate 4 mW/°C above +70°C) ....................320 mW
3-Pin SC-70 (derate 2.17 mW/°C above +70°C)....................174 mW
Storage Temperature Range.......................................-65°C to +150°C
Maximum Junction Temperature, TJ............................................ 150°C
ELECTRICAL CHARACTERISTICS
V
V
= Full Range, T = Operating Temperature Range, unless otherwise noted. Typical values are at T = +25°C,
= 5V for L/M/J, 3.3V for T/S, 3.0V for R and 2.5V for Z (Note 1).
DD
DD
A
A
Parameter
Range
Sym
Min
Typ
Max
Units
Test Conditions
V
1.0
1.2
—
—
5.5
5.5
V
T = 0°C to +70°C
A
DD
T = – 40°C to +125°C
A
Supply Current
I
—
12
30
µA
V
TCM8xxL/M/J:
TCM8xxR/S/T/Z:
TCM8xxL:
V
V
< 5.5V
< 3.6V
CC
DD
DD
—
9
25
Reset Threshold (Note 2)
V
4.56
4.50
4.31
4.25
3.93
3.89
3.04
3.00
2.89
2.85
2.59
2.55
2.28
2.25
—
4.63
—
4.70
4.75
4.45
4.50
4.06
4.10
3.11
3.15
2.96
3.00
2.66
2.70
2.35
2.38
—
T = +25°C
A
TH
T = – 40°C to +125°C
A
4.38
—
V
TCM8xxM:
TCM809J:
TCM8xxT:
TCM8xxS:
TCM8xxR:
TCM8xxZ:
T = +25°C
A
V
T = – 40°C to +125°C
A
4.00
—
V
T = +25°C
A
V
T = – 40°C to +125°C
A
3.08
—
V
T = +25°C
A
V
T = – 40°C to +125°C
A
2.93
—
V
T = +25°C
A
V
V
T = – 40°C to +125°C
A
2.63
—
T = +25°C
A
V
T = – 40°C to +125°C
A
2.32
—
V
T = +25°C
A
V
T = – 40°C to +125°C
A
Reset Threshold Tempco
30
ppm/°C
µsec
msec
V
to Reset Delay,
—
65
—
V
= V to (V – 100 mV) (Note 2)
DD
DD TH TH
Reset Active Time Out
Period
140
320
560
RESET Output Voltage
Low (TCM809)
V
—
—
—
—
—
—
—
—
—
—
—
0.3
0.4
0.3
—
V
TCM809R/S/T/Z:
TCM809L/M/J:
V
V
= V min, I
= 1.2 mA
= 3.2 mA
OL
DD
DD
TH
SINK
SINK
= V min, I
TH
V
> 1.0V, I
= 50 µA
SINK
DD
RESET Output Voltage
High (TCM809)
V
0.8 V
V
V
V
TCM809R/S/T/Z: V > V max, I
= 500 µA
OH
DD
DD
TH
SOURCE
V
– 1.5
—
TCM809L/M/J: V > V max, I
= 800 µA
SOURCE
DD
DD
TH
RESET Output Voltage
Low (TCM810)
V
—
0.3
0.4
—
TCM810R/S/T/Z:V = V max, I
= 1.2 mA
SINK
OL
DD
TH
—
TCM810L/M:
V
= V max, I
= 3.2 mA
DD
TH
= 150 µA
SOURCE
SINK
RESET Output Voltage
V
0.8 V
1.8 < V < V min, I
OH
DD
DD
TH
High (TCM810)
Note 1: Production testing done at TA = +25°C, overtemperature limits ensured by QC screen.
2: RESET output for TCM809, RESET output for TCM810.
DS21661E-page 2
2001-2012 Microchip Technology Inc.
TCM809/TCM810
2.0
TYPICAL PERFORMANCE CHARACTERISTICS
Note: The graphs and tables provided following this note are a statistical summary based on a limited number of
samples and are provided for informational purposes only. The performance characteristics listed herein
are not tested or guaranteed. In some graphs or tables, the data presented may be outside the specified
operating range (e.g., outside specified power supply range) and therefore outside the warranted range.
18
TCM8xx/R/S/T/Z, No Load
450
400
350
300
250
200
150
100
50
16
14
12
10
8
VDD = 5V
VDD = 3V
6
4
VDD = 1V
2
0
-40
-20
0
20
40
60
80
100
120
0
-40
-20
0
20
40
60
80
100
120
Temperature (°C)
Temperature (°C)
FIGURE 2-1:
Supply Current vs.
FIGURE 2-3:
Power-up Reset Time Out
Temperature.
vs. Temperature.
16
1.001
1
TCM8xx/L/M/J, No Load
14
12
10
8
VDD = 5V
VDD = 3V
0.999
0.998
0.997
6
VDD = 1V
4
2
0
-40
-20
0
20
40
60
80
100
120
-40
-20
0
20
40
60
80
100
120
Temperature (°C)
Temperature (°C)
FIGURE 2-2:
Supply Current vs.
FIGURE 2-4:
Normalized Reset
Temperature.
Threshold vs. Temperature.
2001-2012 Microchip Technology Inc.
DS21661E-page 3
TCM809/TCM810
3.0
PIN DESCRIPTIONS
The descriptions of the pins are given in Table 3-1.
TABLE 3-1:
NAME
PIN FUNCTION TABLE
FUNCTION
GND
Ground
RESET (TCM809) RESET push-pull output
RESET (TCM810) RESET push-pull output
VDD
Supply voltage (+2.5V, +3.0V,
+3.3V, +5.0V).
3.1
Ground (GND)
Ground terminal.
3.2
RESET Output (TCM809)
The RESET push-pull output remains low while VDD is
below the reset voltage threshold, and for 240 msec
(140 msec min.) after VDD rises above reset threshold.
3.3
RESET Output (TCM810)
The RESET push-pull output remains high while VDD is
below the reset voltage threshold, and for 240 msec
(140 msec min.) after VDD rises above reset threshold.
3.4
Supply Voltage (V
)
DD
VDD: +2.5V, +3.0V, +3.3V and +5.0V
DS21661E-page 4
2001-2012 Microchip Technology Inc.
TCM809/TCM810
Combinations above the curve are detected as a
brown-out or power-down condition. Transient
immunity can be improved by adding a capacitor in
close proximity to the VDD pin of the TCM809/TCM810.
4.0
4.1
APPLICATIONS INFORMATION
V
Transient Rejection
DD
The TCM809/TCM810 provides accurate VDD monitor-
ing and reset timing during power-up, power-down and
brown-out/sag conditions. These devices also reject
negative-going transients (glitches) on the power
supply line. Figure 4-1 shows the maximum transient
duration vs. maximum negative excursion (overdrive)
for glitch rejection. Any combination of duration and
overdrive that lies under the curve will not generate a
reset signal.
4.2
RESET Signal Integrity During
Power-Down
The TCM809 RESET output is valid to VDD = 1.0V.
Below this voltage the output becomes an "open cir-
cuit" and does not sink current. This means CMOS
logic inputs to the microcontroller will be floating at an
undetermined voltage. Most digital systems are
completely shut down well above this voltage.
However, in situations where RESET must be main-
tained valid to VDD = 0V, a pull-down resistor must be
connected from RESET to ground to discharge stray
capacitances and hold the output low (Figure 4-2). This
resistor value, though not critical, should be chosen
such that it does not appreciably load RESET under
normal operation (100 k will be suitable for most
applications). Similarly, a pull-up resistor to VDD is
required for the TCM810 to ensure a valid high RESET
for VDD below 1.0V.
VDD
VTH
Overdrive
Duration
400
TA = +25°C
320
240
160
VDD
VDD
TCM8XXL/M/J (SOT-23)
80
TCM809
TCM8XXZ/R/S/T
(SOT-23)
RESET
0
1
5
1000
100
Reset Comparator Overdrive
[VTH – VDD] (mv)
R1
100 k
GND
130
120
110
100
90
TCM8XXL/M/J (SC-70)
FIGURE 4-2:
RESET output of the TCM809 ensures that the
RESET output is valid to VDD = 0V.
The addition of R1 at the
80
70
60
50
TCM8XXZ/R/S/T (SC-70)
40
30
1
10
100
1000
Reset Comparator Overdrive (mV)
[VTH – VDD] (mv)
FIGURE 4-1:
Maximum Transient
Duration vs. Overdrive for Glitch Rejection at
+25°C.
2001-2012 Microchip Technology Inc.
DS21661E-page 5
TCM809/TCM810
4.3
Controllers and Processors With
Bidirectional I/O Pins
Buffered RESET
To Other System
Components
Buffer
Some microcontrollers have bidirectional reset pins.
Depending on the current drive capability of the control-
ler pin, an indeterminate logic level may result if there
is a logic conflict. This can be avoided by adding a
4.7 k resistor in series with the output of the TCM809/
TCM810 (Figure 4-3). If there are other components in
the system that require a reset signal, they should be
buffered so as not to load the reset line. If the other
components are required to follow the reset I/O of the
microcontroller, the buffer should be connected as
shown with the solid line.
VDD
®
PIC
TCM809
Micro-
controller
4.7 k
RESET
GND
RESET
GND
FIGURE 4-3:
Interfacing the TCM809 to a
Bidirectional RESET I/O.
DS21661E-page 6
2001-2012 Microchip Technology Inc.
TCM809/TCM810
5.0
5.1
PACKAGING INFORMATION
Package Marking Information
3-Pin SOT-23B
Example:
Customer Specific Information Codes for:
TCM8xx =
Part Number
TCM809 TCM810
XXNN
TCM8xxL ENB
VNB
J1
JZ
J2
JY
J3
JX
J4
JV
J5
JU
J6
JT
J7
K1
KZ
K2
KY
K3
KX
K4
KV
K5
KU
—
TCM8xxM ENB
VNB
TCM8xxT ENB
VNB
TCM8xxS ENB
VNB
TCM8xxR ENB
VNB
TCM8xxJ
ENB
VNB
KS
K6
TCM8xxZ ENB
3-Pin SC-70
Example:
Customer Specific Information Codes for:
TCM8xx =
XXN
Part Number
TCM809 TCM810
YWW
TCM8xxL ELB
VLB
J1
JZ
J2
JY
J3
JX
J4
JV
J5
JU
J6
JT
J7
JS
—
KZ
—
TCM8xxM ELB
VLB
Bottom Side
Top Side
KY
—
TCM8xxT ELB
VLB
OR
KX
—
TCM8xxS ELB
VLB
KV
—
TCM8xxR ELB
VLB
KU
—
XXNN
TCM8xxJ
ELB
VLB
KS
—
TCM8xxZ ELB
VLB
KT
Legend: XX...X Customer-specific information*
Y
Year code (last digit of calendar year)
YY
Year code (last 2 digits of calendar year)
WW
NNN
Week code (week of January 1 is week ‘01’)
Alphanumeric traceability code
e
3
Pb-free JEDEC designator for Matte Tin (Sn)
This package is Pb-free. The Pb-free JEDEC designator (
can be found on the outer packaging for this package.
*
)
3
e
Note: In the event the full Microchip part number cannot be marked on one line, it will
be carried over to the next line, thus limiting the number of available
characters for customer-specific information.
2001-2012 Microchip Technology Inc.
DS21661E-page 7
TCM809/TCM810
3-Lead Plastic Small Outline Transistor (NB) (SOT-23)
Note: For the most current package drawings, please see the Microchip Packaging Specification located
at http://www.microchip.com/packaging
E
E1
2
B
p1
D
n
p
1
c
A
A2
A1
L
Units
INCHES*
NOM
MILLIMETERS
Dimension Limits
MIN
MAX
MIN
NOM
3
MAX
n
p
Number of Pins
3
Pitch
.038
.076
.040
.037
.002
.093
.051
.115
.018
5
0.96
1.92
p1
Outside lead pitch (basic)
Overall Height
A
A2
A1
E
.035
.044
0.89
0.88
1.01
0.95
0.06
2.37
1.30
2.92
0.45
5
1.12
1.02
0.10
2.64
1.40
3.04
0.55
10
Molded Package Thickness
.035
.000
.083
.047
.110
.014
0
.040
.004
.104
.055
.120
.022
10
Standoff
§
0.01
2.10
1.20
2.80
0.35
0
Overall Width
Molded Package Width
Overall Length
E1
D
Foot Length
L
Foot Angle
c
Lead Thickness
Lead Width
.004
.015
0
.006
.017
5
.007
.020
10
0.09
0.37
0
0.14
0.44
5
0.18
0.51
10
B
Mold Draft Angle Top
Mold Draft Angle Bottom
0
5
10
0
5
10
* Controlling Parameter
§ Significant Characteristic
Notes:
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed
.010” (0.254mm) per side.
JEDEC Equivalent: TO-236
Drawing No. C04-104
DS21661E-page 8
2001-2012 Microchip Technology Inc.
TCM809/TCM810
3-Lead Plastic Small Outline Transistor (LB) (SC-70)
Note: For the most current package drawings, please see the Microchip Packaging Specification located
at http://www.microchip.com/packaging
E
E1
B
2
1
p1
D
3
p
a
A2
A
c
A1
b
L
Units
Dimension Limits
INCHES
3
MILLIMETERS*
MIN MAX
MIN
MAX
Number of Pins
Pitch
3
p
.026 BSC.
.051 BSC.
.031
.031
.000
.071
.045
.071
.004
.003
.006
8°
0.65 BSC.
1.30 BSC.
0.80
p1
Outside lead pitch (basic)
Overall Height
A
A2
A1
E
.043
1.10
1.00
.010
2.40
1.35
2.25
0.41
0.25
0.40
12°
Molded Package Thickness
Standoff
.039
.0004
.094
.053
.089
.016
.010
.016
12°
0.80
0.00
Overall Width
1.80
Molded Package Width
Overall Length
E1
D
1.15
1.80
Foot Length
L
c
0.10
Lead Thickness
0.08
Lead Width
B
a
0.15
Mold Draft Angle Top
Mold Draft Angle Bottom
8°
b
8°
12°
8°
12°
*Controlling Parameter
Notes:
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions
shall not exceed .005" (0.127mm) per side.
JEITA (EIAJ) Equivalent: SC70
Drawing No. C04-104
2001-2012 Microchip Technology Inc.
DS21661E-page 9
TCM809/TCM810
5.2
Product Tape and Reel Specifications
FIGURE 5-1:
EMBOSSED CARRIER DIMENSIONS (8, 12, 16 AND 24 MM TAPE ONLY)
Top
Cover
Tape
A
0
W
B
K
0
0
P
TABLE 1:
CARRIER TAPE/CAVITY DIMENSIONS
Carrier
Cavity
Dimensions
Output
Quantity
Units
Reel
Diameter in
mm
Dimensions
Case
Package
Outline
Type
W
P
A0
B0
mm
K0
mm
mm
mm
mm
NB
LB
SOT-23
SC-70
3L
3L
8
8
4
4
3.15
2.4
2.77
2.4
1.22
1.19
3000
3000
180
180
FIGURE 5-2:
3-LEAD SOT-23/SC70 DEVICE TAPE AND REEL SPECIFICATIONS
n g k i M a r
e c v i e D
User Direction of Feed
Device
Marking
W, Width
of Carrier
Tape
Pin 1
Pin 1
P, Pitch
Reverse Reel Component Orientation
Standard Reel Component Orientation
DS21661E-page 10
2001-2012 Microchip Technology Inc.
TCM809/TCM810
APPENDIX A: REVISION HISTORY
Revision E (December 2012)
• Added a note to each package outline drawing.
Revision D (March 2005)
• Updated 6.0 “Packaging Information” to include
old and new packaging examples.
• Applied new template and rearranged sections to
be consistent with current documentation.
Revision C (April 2004)
Revision B (January 2002)
Revision A (May 2001)
Initial release of data sheet.
2001-2012 Microchip Technology Inc.
Confidential
DS21661E-page 11
TCM809/TCM810
NOTES:
DS21661E-page 12
Confidential
2001-2012 Microchip Technology Inc.
TCM809/TCM810
PRODUCT IDENTIFICATION SYSTEM
To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office.
Examples:
PART NO.
Device
X
X
XXXXX
a)
b)
c)
TCM809LENB713:
SOT-23B-3-TR,
Microcontroller 4.63V
Reset Monitor,
-40°C to +85°C,
Tape and Reel.
SC-70-3-TR,
Microcontroller 4.63V
Reset Monitor,
-40°C to +125°C,
Tape and Reel.
SOT-23B-3-TR,
Microcontroller 4.63V
Reset Monitor,
Temperature
Range
Package
VDD
Reset
Threshold
TCM809LVLB713:
TCM809LVNB713:
Device:
TCM809: Supervisor circuit with active-low RESET output
TCM810: Supervisor circuit with active-high RESET output
VDD Reset Threshold:
L
M
J
T
S
R
Z
=
=
=
=
=
=
=
4.63V
4.38V
4.00V
3.08V
2.93V
2.63V
2.32V
-40°C to +125°C,
Tape and Reel.
a)
b)
c)
TCM810MENB713:
TCM810RVLB713:
TCM810TVLB713:
SOT-23B-3-TR,
Microcontroller 4.38V
Reset Monitor,
-40°C to +85°C,
Tape and Reel.
SOT-23B-3-TR,
Microcontroller 2.63V
Reset Monitor,
-40°C to +125°C,
Tape and Reel.
Temperature Range:
Package:
E
V
=
=
-40°C to +85°C
-40°C to +125°C
NB713 = SOT-23B, 3-pin (Tape and Reel)
LB713 SC-70, 3-pin (Tape and Reel)
=
SC-70-3-TR,
Microcontroller 4.38V
Reset Monitor,
-40°C to +125°C,
Tape and Reel.
Sales and Support
Data Sheets
Products supported by a preliminary Data Sheet may have an errata sheet describing minor operational differences and
recommended workarounds. To determine if an errata sheet exists for a particular device, please contact one of the following:
1. Your local Microchip sales office
2. The Microchip Worldwide Site (www.microchip.com)
Please specify which device, revision of silicon and Data Sheet (include Literature #) you are using.
Customer Notification System
Register on our web site (www.microchip.com) to receive the most current information on our products.
2001-2012 Microchip Technology Inc.
DS21661E-page 13
TCM809/TCM810
NOTES:
DS21661E-page 14
2001-2012 Microchip Technology Inc.
Note the following details of the code protection feature on Microchip devices:
•
Microchip products meet the specification contained in their particular Microchip Data Sheet.
•
Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the
intended manner and under normal conditions.
•
There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our
knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data
Sheets. Most likely, the person doing so is engaged in theft of intellectual property.
•
•
Microchip is willing to work with the customer who is concerned about the integrity of their code.
Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not
mean that we are guaranteeing the product as “unbreakable.”
Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our
products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts
allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act.
Information contained in this publication regarding device
applications and the like is provided only for your convenience
and may be superseded by updates. It is your responsibility to
ensure that your application meets with your specifications.
MICROCHIP MAKES NO REPRESENTATIONS OR
WARRANTIES OF ANY KIND WHETHER EXPRESS OR
IMPLIED, WRITTEN OR ORAL, STATUTORY OR
OTHERWISE, RELATED TO THE INFORMATION,
INCLUDING BUT NOT LIMITED TO ITS CONDITION,
QUALITY, PERFORMANCE, MERCHANTABILITY OR
FITNESS FOR PURPOSE. Microchip disclaims all liability
arising from this information and its use. Use of Microchip
devices in life support and/or safety applications is entirely at
the buyer’s risk, and the buyer agrees to defend, indemnify and
hold harmless Microchip from any and all damages, claims,
suits, or expenses resulting from such use. No licenses are
conveyed, implicitly or otherwise, under any Microchip
intellectual property rights.
Trademarks
The Microchip name and logo, the Microchip logo, dsPIC,
FlashFlex, KEELOQ, KEELOQ logo, MPLAB, PIC, PICmicro,
PICSTART, PIC logo, rfPIC, SST, SST Logo, SuperFlash
and UNI/O are registered trademarks of Microchip Technology
Incorporated in the U.S.A. and other countries.
32
FilterLab, Hampshire, HI-TECH C, Linear Active Thermistor,
MTP, SEEVAL and The Embedded Control Solutions
Company are registered trademarks of Microchip Technology
Incorporated in the U.S.A.
Silicon Storage Technology is a registered trademark of
Microchip Technology Inc. in other countries.
Analog-for-the-Digital Age, Application Maestro, BodyCom,
chipKIT, chipKIT logo, CodeGuard, dsPICDEM,
dsPICDEM.net, dsPICworks, dsSPEAK, ECAN,
ECONOMONITOR, FanSense, HI-TIDE, In-Circuit Serial
Programming, ICSP, Mindi, MiWi, MPASM, MPF, MPLAB
Certified logo, MPLIB, MPLINK, mTouch, Omniscient Code
Generation, PICC, PICC-18, PICDEM, PICDEM.net, PICkit,
PICtail, REAL ICE, rfLAB, Select Mode, SQI, Serial Quad I/O,
Total Endurance, TSHARC, UniWinDriver, WiperLock, ZENA
and Z-Scale are trademarks of Microchip Technology
Incorporated in the U.S.A. and other countries.
SQTP is a service mark of Microchip Technology Incorporated
in the U.S.A.
GestIC and ULPP are registered trademarks of Microchip
Technology Germany II GmbH & Co. & KG, a subsidiary of
Microchip Technology Inc., in other countries.
All other trademarks mentioned herein are property of their
respective companies.
© 2001-2012, Microchip Technology Incorporated, Printed in
the U.S.A., All Rights Reserved.
Printed on recycled paper.
ISBN: 9781620768877
QUALITY MANAGEMENT SYSTEM
CERTIFIED BY DNV
Microchip received ISO/TS-16949:2009 certification for its worldwide
headquarters, design and wafer fabrication facilities in Chandler and
Tempe, Arizona; Gresham, Oregon and design centers in California
and India. The Company’s quality system processes and procedures
are for its PIC® MCUs and dsPIC® DSCs, KEELOQ® code hopping
devices, Serial EEPROMs, microperipherals, nonvolatile memory and
analog products. In addition, Microchip’s quality system for the design
and manufacture of development systems is ISO 9001:2000 certified.
== ISO/TS 16949 ==
2001-2012 Microchip Technology Inc.
DS21661E-page 15
Worldwide Sales and Service
AMERICAS
ASIA/PACIFIC
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EUROPE
Corporate Office
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Tel: 81-3-6880- 3770
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Fax: 949-462-9608
China - Wuhan
Tel: 86-27-5980-5300
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Taiwan - Taipei
Tel: 886-2-2508-8600
Fax: 886-2-2508-0102
Santa Clara
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Fax: 408-961-6445
China - Xian
Tel: 86-29-8833-7252
Fax: 86-29-8833-7256
Thailand - Bangkok
Tel: 66-2-694-1351
Fax: 66-2-694-1350
Toronto
Mississauga, Ontario,
Canada
China - Xiamen
Tel: 905-673-0699
Fax: 905-673-6509
Tel: 86-592-2388138
Fax: 86-592-2388130
China - Zhuhai
Tel: 86-756-3210040
Fax: 86-756-3210049
11/29/12
DS21661E-page 16
2001-2012 Microchip Technology Inc.
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