TCM811TERC [MICROCHIP]

4-Pin Microcontroller Reset Monitors; 4引脚单片机复位监视器
TCM811TERC
型号: TCM811TERC
厂家: MICROCHIP    MICROCHIP
描述:

4-Pin Microcontroller Reset Monitors
4引脚单片机复位监视器

监视器 微控制器
文件: 总14页 (文件大小:251K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
TCM811/TCM812  
M
4-Pin Microcontroller Reset Monitors  
Features  
General Description  
• Precision VDD Monitor for 2.0V, 2.8V, 3.0V, 3.3V,  
The TCM811 and TCM812 are cost effective system  
supervisory circuits designed to monitor VDD in digital  
systems and provide a reset signal to the host control-  
ler when necessary. A manual reset input is provided  
to override the reset monitor and is suitable for use as  
a push-button reset. No external components are  
required.  
The reset output is driven active within 20 µsec (5 µsec  
for F version) of VDD falling through the reset voltage  
threshold. RESET is maintained active for a minimum  
of 140 msec after VDD rises above the reset threshold.  
The TCM812 has an active high RESET output while  
the TCM811 has an active low RESET output. The out-  
put of the TCM811 is valid down to VDD = 1V. Both  
devices are available in a 4-Pin SOT-143 package,  
specified with a temperature range of -40°C to +85°C.  
5.0V Nominal Supplies  
• Manual Reset Input  
• 140 msec Minimum RESET Output Duration  
• RESET Output Valid to VDD = 1.0V (TCM811)  
• Low 6 µA (typ.) Supply Current  
• VDD Transient Immunity  
• Small 4-Pin SOT-143 Package  
• No External Components  
• Replacement for MAX811/812 and Offers a Lower  
Threshold Voltage Option  
• Push-Pull RESET Output  
Temperature Range:  
- Commercial (C) -40°C to +85°C  
The TCM811/TCM812 are optimized to reject fast tran-  
sient glitches on the VDD line. A low supply current of  
6 µA (VDD = 3.3V) makes these devices ideal for battery  
powered applications.  
Applications  
• Computers  
• Embedded Systems  
• Battery Powered Equipment  
• Critical Microcontroller Power Supply Monitoring  
Package Types:  
SOT-143  
Typical Application Circuit  
VDD  
VDD  
MR  
4
3
1
2
GND  
VDD  
4
0.1µF  
VDD  
PIC  
TCM811  
Microcontroller  
3
MR  
TCM811 RESET  
TCM812 (RESET)  
2
RESET  
RESET  
GND  
PUSH  
INPUT  
BUTTON  
(Active Low)  
GND  
2002 Microchip Technology Inc.  
DS21615B-page 1  
TCM811/TCM812  
1.0  
ELECTRICAL  
PIN FUNCTION TABLE  
CHARACTERISTICS  
NAME  
FUNCTION  
GND  
RESET (TCM811)  
Ground  
ABSOLUTE MAXIMUM RATINGS*  
RESET push-pull output remains low  
while VDD is below the reset voltage  
threshold, and for at least 140 msec  
(min.) after VDD rises above reset  
threshold.  
RESET push-pull output remains  
high while VDD is below the reset  
voltage threshold, and for at least  
140 msec (min.) after VDD rises  
above reset threshold.  
Supply Voltage (VDD to GND).........................................+6.0V  
RESET, RESET.................................... - 0.3V to (VDD + 0.3V)  
Input Current, VDD.........................................................20 mA  
Output Current, RESET, RESET...................................20 mA  
Operating Temperature Range......................40°C to +85°C  
Storage Temperature Range.......................65°C to +150°C  
Maximum Junction Temperature, TS..............................150°C  
*Notice: Stresses beyond those listed under “Absolute Maximun Rat-  
ings” may cause permanenet damage to the device. These are stress  
ratings only, and functional operation of the device at these or any other  
conditions beyond those indicated in the operational sections of the  
specifications is not implied. Exposure to absolute maximun rating con-  
ditions for extended periods may affect device reliability.  
RESET (TCM812)  
MR  
Manual Reset input generates a  
reset when MR is below VIL.  
Supply Voltage  
VDD  
ELECTRICAL CHARACTERISTICS  
VDD = 5V for L/M versions, VDD = 3.3V for T/S versions, VDD = 3V for R version, VDD = 2.0V for F version.  
T = –40°C to +85°C, unless otherwise noted. Typical values are at T = +25°C. (Note 1)  
A
A
Parameters  
DD Range  
Sym  
Min  
Typ  
Max  
Units  
Conditions  
V
VDD  
1.0  
1.1  
5.5  
5.5  
V
TCM811  
TCM812  
Supply Current  
I
6
15  
10  
µA  
V
TCM81_L/M, VDD = 5.5V, I  
= 0  
OUT  
CC  
OUT  
4.75  
TCM81_R/S/T/F, VDD = 3.6V, I  
= 0  
Reset Threshold  
V
4.54  
4.50  
4.63  
4.72  
4.75  
TCM81_L: T = +25°C  
TH  
A
T = –40°C to +85°C  
A
4.30  
4.25  
4.38  
4.46  
4.50  
TCM81_M: T = +25°C  
A
T = –40°C to +85°C  
A
3.03  
3.00  
3.08  
3.14  
3.15  
TCM81_T: T = +25°C  
A
T = –40°C to +85°C  
A
2.88  
2.85  
2.93  
2.98  
3.00  
TCM81_S: T = +25°C  
A
T = –40°C to +85°C  
A
2.58  
2.55  
2.63  
2.68  
2.70  
TCM81_R: T = +25°C  
A
T = –40°C to +85°C  
A
1.71  
1.70  
1.75  
1.79  
1.80  
TCM81_F: T = +25°C  
A
T = –40°C to +85°C  
A
Reset Threshold Tempco  
VDD to Reset Delay  
30  
20  
5
ppm/°C  
µsec VDD = V to V –125 mV; L, M,  
TH TH  
R, S, T, F  
Reset Active Timeout Period  
MR Minimum Pulse Width  
MR Glitch Immunity  
MR to Reset Propagation  
Delay  
t
140  
10  
280  
100  
0.5  
560  
msec VDD = V  
µsec  
nsec  
RP  
TH(MAX)  
t
MR  
t
µsec  
MD  
Note 1: Production testing done at TA = +25°C and +85°C, over temperature limits are tested with periodic QA tests  
in production.  
DS21615B-page 2  
2002 Microchip Technology Inc.  
TCM811/TCM812  
VDD = 5V for L/M versions, VDD = 3.3V for T/S versions, VDD = 3V for R version, VDD = 2.0V for F version.  
T = –40°C to +85°C, unless otherwise noted. Typical values are at T = +25°C. (Note 1)  
A
A
Parameters  
Sym  
Min  
Typ  
Max  
Units  
Conditions  
MR Input Threshold  
V
2.3  
0.8  
V
VDD > V  
TH(MAX),  
IH  
IL  
V
TCM81_L/M  
V
0.7 VDD  
10  
20  
V
VDD > V  
,
TH(MAX)  
IH  
IL  
V
0.25 VDD  
40  
TCM81_R/S/T/F  
MR Pull-up Resistance  
RESET Output Voltage Low  
(TCM811)  
kΩ  
V
V
0.3  
TCM811R/S/T only;  
OL  
I
SINK = 1.2 mA, VDD = VTH(MIN)  
0.4  
0.3  
V
V
TCM811F only;  
SINK = 500 µA, VDD = VTH(MIN)  
TCM811L/M only;  
I
I
SINK = 3.2 mA, VDD = VTH(MIN)  
ISINK = 3.2 mA, VDD = VTH(MIN)  
TCM811R/S/T/F only;  
RESET Output Voltage High  
(TCM811)  
V
0.8 VDD  
VDD - 1.5  
V
V
V
OH  
I
SOURCE = 500 µA, VDD > VTH(MAX)  
TCM811L/M only;  
SOURCE = 800 µA, VDD > VTH(MAX)  
I
RESET Output Voltage Low  
(TCM812)  
V
0.2  
0.3  
0.4  
TCM812F only, ISINK = 500 µA,  
DD = V  
OL  
V
TH(MAX)  
TCM812R/S/T only, ISINK = 1.2 mA,  
DD = V  
V
TH(MAX)  
TCM812L/M only, ISINK = 1.2 mA,  
DD = V  
V
TH(MAX)  
RESET Output Voltage High  
(TCM812)  
V
0.8 VDD  
V
ISOURCE = 150 µA, VDD V  
TH(MIN)  
OH  
Note 1: Production testing done at TA = +25°C and +85°C, over temperature limits are tested with periodic QA tests  
in production.  
2002 Microchip Technology Inc.  
DS21615B-page 3  
TCM811/TCM812  
(100 kwill be suitable for most applications). Simi-  
larly, a pull-up resistor to VDD is required for the  
TCM812 to ensure a valid high RESET for VDD below  
1.1V.  
2.0  
APPLICATIONS INFORMATION  
The TCM811/TCM812 provides accurate VDD monitor-  
ing and reset timing during power-up, power-down, and  
brownout/sag conditions. These devices also reject  
negative-going transients (glitches) on the power sup-  
ply line. Figure 2-1 shows the maximum transient dura-  
tion vs. maximum negative excursion (overdrive) for  
glitch rejection. Any combination of duration and over-  
drive that is under the curve will not generate a reset  
signal. Combinations above the curve are detected as  
a brownout or power-down. Transient immunity can be  
improved by adding a 0.1 µF capacitor in close proxim-  
ity to the VDD pin of the TCM811/812.  
VDD  
4
VDD  
0.1µF  
TCM811  
2
RESET  
R
V
DD  
1
100 kΩ  
GND  
1
V
TH  
Overdrive =  
V
D D  
FIGURE 2-2: The addition of R at the RESET  
1
output of the TCM811 ensures that the RESET output  
is valid to VDD = 0V.  
Duration  
400  
T
= +25˚C  
2.2  
Controllers and Processors With  
Bidirectional I/O Pins  
A
320  
240  
160  
Some microcontrollers have bi-directional reset pins.  
Depending on the current drive capability of the control-  
ler pin, an indeterminate logic level may result if there  
is a logic conflict. This can be avoided by adding a  
4.7 kresistor in series with the output of the TCM811/  
TCM812 (Figure 2-3). If there are other components in  
the system which require a reset signal, they should be  
buffered so as not to load the reset line. If the other  
components are required to follow the reset I/O of the  
microcontroller, the buffer should be connected as  
shown with the solid line.  
TCM81xL/M  
80  
0
TCM81xR/S/T  
10  
1
1000  
100  
RESET COMPARATOR OVERDRIVE,  
- V (mV)  
V
TH  
DD  
Buffered RESET  
To Other System  
Components  
FIGURE 2-1: Maximum Transient Duration vs.  
BUFFER  
Overdrive for Glitch Rejection at 25°C.  
2.1  
RESET Signal Integrity During Power-  
Down  
VDD  
4
The TCM811 RESET push-pull output is valid to VDD  
=
Micro  
0.1µF  
TCM811  
1.0V. Below this voltage the output becomes an "open  
circuit" and does not sink current. This means CMOS  
logic inputs to the microcontroller will be floating at an  
undetermined voltage. Most digital systems are com-  
pletely shutdown well above this voltage. However, in  
situations where RESET must be maintained valid to  
controller  
4.7 k  
RESET  
RESET  
GND  
2
GND  
1
V
DD = 0V, a pull-down resistor must be connected from  
RESET to ground to discharge stray capacitances and  
hold the output low (Figure 2-2). This resistor value,  
though not critical, should be chosen such that it does  
not appreciably load RESET under normal operation  
FIGURE 2-3: Interfacing the TCM811 to  
a Bi-  
directional Reset I/O.  
DS21615B-page 4  
2002 Microchip Technology Inc.  
TCM811/TCM812  
3.0  
TYPICAL PERFORMANCE CHARACTERISTICS  
Note: The graphs provided following this note are a statistical summary based on a limited number of samples  
and are provided for informational purposes only. The performance characteristics listed herein are not  
tested or guaranteed. In some graphs, the data presented may be outside the specified operating range  
(e.g., outside specified power supply range) and therefore outside the warranted range.  
14  
12  
8
TCM81xL/M  
No Load  
TCM81xR/S/T/F  
No Load  
6
10  
8
VDD = 5V  
VDD = 5V  
4
2
VDD = 3V  
VDD = 3V  
6
VDD = 1V  
4
VDD = 1V  
2
0
0
–40  
–20  
0
40  
60  
–40  
–20  
0
40  
TEMPERATURE (˚C)  
60  
20  
85  
20  
85  
TEMPERATURE (˚C)  
FIGURE 3-1: Supply Current vs. Temperature.  
FIGURE 3-4: Supply Current vs. Temperature.  
50  
50  
TCM81xF  
VOD = 20 mV  
VOD = 100 mV  
40  
30  
40  
VOD = 200 mV  
30  
20  
10  
VOD = 20 mV  
20  
10  
0
VOD = 100 mV  
TCM81xL/M  
VOD = 200 mV  
–20  
0
–40  
–40  
0
40  
60  
20  
85  
–20  
0
40  
60  
20  
85  
TEMPERATURE (˚C)  
TEMPERATURE (˚C)  
FIGURE 3-2: Power-Down  
Reset  
Delay  
vs.  
FIGURE 3-5: Power-Down  
Reset  
Delay  
vs.  
Temperature.  
Temperature.  
50  
250  
245  
240  
235  
TCM81x/R/S/T  
40  
30  
TCM81xL/M  
TCM81xR/S/T/F  
VOD = 200 mV  
VOD = 100 mV  
20  
10  
VOD = 20 mV  
230  
225  
0
–40  
–20  
0
40  
60  
20  
85  
–40  
–20  
0
40  
60  
20  
85  
TEMPERATURE (˚C)  
TEMPERATURE (˚C)  
FIGURE 3-3: Power-Up  
Reset  
Timeout  
vs.  
FIGURE 3-6: Power-Down  
Reset  
Delay  
vs.  
Temperature.  
Temperature.  
2002 Microchip Technology Inc.  
DS21615B-page 5  
TCM811/TCM812  
1.0030  
1.0020  
1.0010  
1.0000  
0.9990  
0.9980  
0.9970  
0.9960  
0.9950  
0.9940  
60  
65  
–40  
–15  
10  
35  
TEMPERATURE (˚C)  
FIGURE 3-7: Normalized Reset Threshold vs.  
Temperature.  
DS21615B-page 6  
2002 Microchip Technology Inc.  
TCM811/TCM812  
4.0  
PACKAGING INFORMATION  
4.1  
Package Marking Information  
4-Pin SOT-143  
1
2
3
4
Part Number  
(V)  
Code  
TCM811LERC  
TCM811MERC  
TCM811TERC  
TCM811SERC  
TCM811RERC  
TCM811FERC  
4.63  
4.38  
3.08  
2.93  
2.63  
1.75  
U1  
U2  
U3  
U4  
U5  
U7  
TCM812LERC  
TCM812MERC  
TCM812TERC  
TCM812SERC  
TCM812RERC  
TCM812FERC  
4.63  
4.38  
3.08  
2.93  
2.63  
1.75  
V1  
V2  
V3  
V4  
V5  
V7  
Legend:  
1
2
3
4
Part Number + temperature range and voltage (two-digit code)  
Part Number + temperature range and voltage (two-digit code)  
Year and two-month period code  
Lot ID number  
Note: In the event the full Microchip part number cannot be marked on one line, it will  
be carried over to the next line thus limiting the number of available characters  
for customer specific information.  
2002 Microchip Technology Inc.  
DS21615B-page 7  
TCM811/TCM812  
4.2  
Package Dimensions  
Component Taping Orientation for 4-Pin SOT-143 Devices  
User Direction of Feed  
Device  
Marking  
W
PIN 1  
P
Standard Reel Component Orientation  
for TR Suffix Device  
(Mark Right Side Up)  
Carrier Tape, Number of Components Per Reel and Reel Size:  
Package  
Carrier Width (W)  
Pitch (P)  
Part Per Full Reel  
Reel Size  
4-Pin SOT-143  
8 mm  
4 mm  
3000  
7 in.  
.079 (2.00)  
.071 (1.80)  
.098 (2.50)  
.083 (2.10)  
.055 (1.40)  
.047 (1.20)  
.080 (2.03)  
.070 (1.78)  
.120 (3.05)  
.105 (2.67)  
.040 (1.02)  
.031 (0.79)  
.006 (0.15)  
.004 (0.09)  
8 MAX.  
.004 (0.10)  
.001 (0.02)  
.010 (0.25)  
.005 (0.13)  
.021 (0.54)  
.015 (0.38)  
.037 (0.94)  
.030 (0.77)  
DS21615B-page 8  
2002 Microchip Technology Inc.  
TCM811/TCM812  
Systems Information and Upgrade Hot Line  
ON-LINE SUPPORT  
Microchip provides on-line support on the Microchip  
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Plus, this line provides information on how customers  
can receive any currently available upgrade kits.The  
Hot Line Numbers are:  
1-800-755-2345 for U.S. and most of Canada, and  
1-480-792-7302 for the rest of the world.  
013001  
ConnectingtotheMicrochipInternetWebSite  
The Microchip web site is available by using your  
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The file transfer site is available by using an FTP ser-  
vice to connect to:  
ftp://ftp.microchip.com  
The web site and file transfer site provide a variety of  
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available for consideration is:  
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2002 Microchip Technology Inc.  
DS21615B-page 9  
TCM811/TCM812  
READER RESPONSE  
It is our intention to provide you with the best documentation possible to ensure successful use of your Microchip prod-  
uct. If you wish to provide your comments on organization, clarity, subject matter, and ways in which our documentation  
can better serve you, please FAX your comments to the Technical Publications Manager at (480) 792-4150.  
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Literature Number:  
DS21615B  
Device:  
TCM811/TCM812  
Questions:  
1. What are the best features of this document?  
2. How does this document meet your hardware and software development needs?  
3. Do you find the organization of this data sheet easy to follow? If not, why?  
4. What additions to the data sheet do you think would enhance the structure and subject?  
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DS21615B-page 10  
2002 Microchip Technology Inc.  
TCM811/TCM812  
PRODUCT IDENTIFICATION SYSTEM  
To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office.  
PART NO.  
Device  
X
X
XXXX  
Examples:  
Temperature  
Range  
Package  
VDD  
Reset  
a)  
TCM811LERCTR: SOT-143, Microcontroller  
4.63V Reset Monitor, -40°C to +85°C, Tape and  
Reel.  
Threshold  
b)  
TCM811MERCTR: SOT-143, Microcontroller  
4.38V Reset Monitor, -40°C to +85°C, Tape and  
Reel.  
Device:  
TCM811: Supervisor Circuit with active-low RESET output  
TCM812: Supervisor Circuit with active-high RESET output  
VDD Reset Threshold:  
L
=
=
=
=
=
=
4.63V  
4.38V  
3.08V  
2.93V  
2.63V  
1.75V  
a)  
b)  
TCM812FERCTR: SOT-143, Microcontroller  
1.75V Reset Monitor, -40°C to +85°C, Tape  
and Reel.  
TCM812SERCTR: SOT-143, Microcontroller  
2.93V Reset Monitor, -40°C to +125°C, Tape  
and Reel.  
M
T
S
R
F
Temperature Range:  
Package:  
E
=
-40°C to +85°C  
RCTR  
= SOT-143, 4-pin (Tape and Reel)  
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2002 Microchip Technology Inc.  
DS21615B-page11  
TCM811/TCM812  
NOTES:  
DS21615B-page 12  
2002 Microchip Technology Inc.  
Information contained in this publication regarding device  
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and may be superseded by updates. It is your responsibility to  
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dsPIC, ECONOMONITOR, FanSense, FlexROM, fuzzyLAB,  
In-Circuit Serial Programming, ICSP, ICEPIC, microID,  
microPort, Migratable Memory, MPASM, MPLIB, MPLINK,  
MPSIM, MXDEV, PICC, PICDEM, PICDEM.net, rfPIC, Select  
Mode and Total Endurance are trademarks of Microchip  
Technology Incorporated in the U.S.A.  
Serialized Quick Term Programming (SQTP) is a service mark  
of Microchip Technology Incorporated in the U.S.A.  
All other trademarks mentioned herein are property of their  
respective companies.  
© 2002, Microchip Technology Incorporated, Printed in the  
U.S.A., All Rights Reserved.  
Printed on recycled paper.  
Microchip received QS-9000 quality system  
certification for its worldwide headquarters,  
design and wafer fabrication facilities in  
Chandler and Tempe, Arizona in July 1999. The  
Company’s quality system processes and  
procedures are QS-9000 compliant for its  
®
PICmicro 8-bit MCUs, KEELOQ® code hopping  
devices, Serial EEPROMs and microperipheral  
products. In addition, Microchip’s quality  
system for the design and manufacture of  
development systems is ISO 9001 certified.  
2002 Microchip Technology Inc.  
DS21615B - page 13  
M
WORLDWIDE SALES AND SERVICE  
Japan  
AMERICAS  
ASIA/PACIFIC  
Microchip Technology Japan K.K.  
Benex S-1 6F  
Corporate Office  
Australia  
2355 West Chandler Blvd.  
Microchip Technology Australia Pty Ltd  
Suite 22, 41 Rawson Street  
Epping 2121, NSW  
3-18-20, Shinyokohama  
Kohoku-Ku, Yokohama-shi  
Kanagawa, 222-0033, Japan  
Tel: 81-45-471- 6166 Fax: 81-45-471-6122  
Chandler, AZ 85224-6199  
Tel: 480-792-7200 Fax: 480-792-7277  
Technical Support: 480-792-7627  
Web Address: http://www.microchip.com  
Australia  
Tel: 61-2-9868-6733 Fax: 61-2-9868-6755  
Korea  
Rocky Mountain  
China - Beijing  
Microchip Technology Korea  
168-1, Youngbo Bldg. 3 Floor  
Samsung-Dong, Kangnam-Ku  
Seoul, Korea 135-882  
2355 West Chandler Blvd.  
Chandler, AZ 85224-6199  
Tel: 480-792-7966 Fax: 480-792-7456  
Microchip Technology Consulting (Shanghai)  
Co., Ltd., Beijing Liaison Office  
Unit 915  
Bei Hai Wan Tai Bldg.  
Atlanta  
Tel: 82-2-554-7200 Fax: 82-2-558-5934  
No. 6 Chaoyangmen Beidajie  
Beijing, 100027, No. China  
Tel: 86-10-85282100 Fax: 86-10-85282104  
500 Sugar Mill Road, Suite 200B  
Atlanta, GA 30350  
Singapore  
Microchip Technology Singapore Pte Ltd.  
200 Middle Road  
Tel: 770-640-0034 Fax: 770-640-0307  
China - Chengdu  
Boston  
#07-02 Prime Centre  
Microchip Technology Consulting (Shanghai)  
Co., Ltd., Chengdu Liaison Office  
Rm. 2401, 24th Floor,  
2 Lan Drive, Suite 120  
Westford, MA 01886  
Tel: 978-692-3848 Fax: 978-692-3821  
Singapore, 188980  
Tel: 65-334-8870 Fax: 65-334-8850  
Taiwan  
Ming Xing Financial Tower  
Chicago  
Microchip Technology Taiwan  
11F-3, No. 207  
No. 88 TIDU Street  
333 Pierce Road, Suite 180  
Itasca, IL 60143  
Chengdu 610016, China  
Tung Hua North Road  
Taipei, 105, Taiwan  
Tel: 86-28-6766200 Fax: 86-28-6766599  
Tel: 630-285-0071 Fax: 630-285-0075  
China - Fuzhou  
Tel: 886-2-2717-7175 Fax: 886-2-2545-0139  
Dallas  
Microchip Technology Consulting (Shanghai)  
Co., Ltd., Fuzhou Liaison Office  
Unit 28F, World Trade Plaza  
4570 Westgrove Drive, Suite 160  
Addison, TX 75001  
EUROPE  
Tel: 972-818-7423 Fax: 972-818-2924  
No. 71 Wusi Road  
Detroit  
Denmark  
Fuzhou 350001, China  
Tri-Atria Office Building  
Microchip Technology Nordic ApS  
Regus Business Centre  
Lautrup hoj 1-3  
Tel: 86-591-7503506 Fax: 86-591-7503521  
32255 Northwestern Highway, Suite 190  
Farmington Hills, MI 48334  
Tel: 248-538-2250 Fax: 248-538-2260  
China - Shanghai  
Microchip Technology Consulting (Shanghai)  
Co., Ltd.  
Ballerup DK-2750 Denmark  
Tel: 45 4420 9895 Fax: 45 4420 9910  
Kokomo  
Room 701, Bldg. B  
France  
2767 S. Albright Road  
Kokomo, Indiana 46902  
Tel: 765-864-8360 Fax: 765-864-8387  
Los Angeles  
Far East International Plaza  
No. 317 Xian Xia Road  
Microchip Technology SARL  
Parc d’Activite du Moulin de Massy  
43 Rue du Saule Trapu  
Shanghai, 200051  
Tel: 86-21-6275-5700 Fax: 86-21-6275-5060  
Batiment A - ler Etage  
18201 Von Karman, Suite 1090  
Irvine, CA 92612  
China - Shenzhen  
91300 Massy, France  
Microchip Technology Consulting (Shanghai)  
Co., Ltd., Shenzhen Liaison Office  
Rm. 1315, 13/F, Shenzhen Kerry Centre,  
Renminnan Lu  
Tel: 33-1-69-53-63-20 Fax: 33-1-69-30-90-79  
Tel: 949-263-1888 Fax: 949-263-1338  
Germany  
New York  
Microchip Technology GmbH  
Gustav-Heinemann Ring 125  
D-81739 Munich, Germany  
Tel: 49-89-627-144 0 Fax: 49-89-627-144-44  
150 Motor Parkway, Suite 202  
Hauppauge, NY 11788  
Shenzhen 518001, China  
Tel: 631-273-5305 Fax: 631-273-5335  
Tel: 86-755-2350361 Fax: 86-755-2366086  
San Jose  
Hong Kong  
Italy  
Microchip Technology Inc.  
2107 North First Street, Suite 590  
San Jose, CA 95131  
Microchip Technology Hongkong Ltd.  
Unit 901-6, Tower 2, Metroplaza  
223 Hing Fong Road  
Microchip Technology SRL  
Centro Direzionale Colleoni  
Palazzo Taurus 1 V. Le Colleoni 1  
20041 Agrate Brianza  
Tel: 408-436-7950 Fax: 408-436-7955  
Kwai Fong, N.T., Hong Kong  
Tel: 852-2401-1200 Fax: 852-2401-3431  
Toronto  
Milan, Italy  
6285 Northam Drive, Suite 108  
Mississauga, Ontario L4V 1X5, Canada  
Tel: 905-673-0699 Fax: 905-673-6509  
India  
Tel: 39-039-65791-1 Fax: 39-039-6899883  
Microchip Technology Inc.  
India Liaison Office  
United Kingdom  
Arizona Microchip Technology Ltd.  
505 Eskdale Road  
Divyasree Chambers  
1 Floor, Wing A (A3/A4)  
No. 11, O’Shaugnessey Road  
Bangalore, 560 025, India  
Tel: 91-80-2290061 Fax: 91-80-2290062  
Winnersh Triangle  
Wokingham  
Berkshire, England RG41 5TU  
Tel: 44 118 921 5869 Fax: 44-118 921-5820  
01/18/02  
*DS21615B*  
DS21615B-page 14  
2002 Microchip Technology Inc.  

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