USB2250 [MICROCHIP]
Ultra Fast USB 2.0 Multi-Slot Flash Media Controller;
| 型号： | USB2250 |
| 厂家： | 
MICROCHIP |
| 描述： | Ultra Fast USB 2.0 Multi-Slot Flash Media Controller |
| 文件： | 总43页 (文件大小：472K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
USB2250/50i/51/51i
Ultra Fast USB 2.0 Multi-Slot Flash Media Controller
• Extended configuration options
General Description
- xD player mode operation
- Socket switch polarities, etc.
• Media Activity LED
• On board 24 MHz crystal driver circuit
• Optional external 24 MHz clock input
- 4 Independent internal card power FETs
- 200 mA each
- "Fold-back" short circuit protection
• 8051 8-bit microprocessor
- 60 MHz - single cycle execution
- 64 KB ROM | 14 KB RAM
The Microchip USB2250/50i/51/51i is a USB 2.0 com-
pliant, Hi-Speed mass storage class peripheral control-
ler intended for reading and writing to more than 24
popular flash media formats from the CompactFlash®
(CF), SmartMediaTM (SM), xD-Picture CardTM (xD)1,
Memory Stick® (MS), Secure Digital (SD), and MultiMe-
diaCardTM (MMC) families.
The USB2250/50i/51/51i is a fully integrated, single
chip solution capable of ultra high performance opera-
tion. Average sustained transfer rates exceeding 35
MB/s are possible if the media and host can support
those rates.
• Internal regulator for 1.8 V core operation
• Optimized pinout improves signal routing which
eases implementation for improved signal integ-
rity
Highlights
• 128-pin VTQFP (14x14 mm) RoHS compliant
package
• Targeted for applications in which single or
"combo" media sockets are used
• Supports multiple simultaneous card insertions
• Flexible assignment of number of LUNs and how
card types are associated with the LUNs
• Hardware-controlled data flow architecture for all
self-mapped media
OEM Selectable
• Vendor, product, and language IDs
• Manufacturer ID and product strings (28 charac-
ter)
• Serial number string (12h digit max)
• Customizable vendor specific data by optional
use of external serial EEPROM
• Bus- or self-powered selection
• LED blink interval or duration
• Internal power FET configuration
• Pipelined hardware support for access to non-
self-mapped media
• Order number with “i” denotes the version that
supports the industrial temperature range of -40ºC
to 85ºC
Software Features
• Optimized for low latency interrupt handling
• Reduced memory footprint
• Device Firmware Upgrade (DFU) support of exter-
nal EEPROM or External Flash
- Assembly line support
- End user field upgrade support
- DFU Package consists of driver, firmware,
sample DFU application and source code,
DFU driver API
Hardware Features
• Single chip flash media controller with non-multi-
plexed interface for independent card sockets
• Flash Media Specification Revision Compliance
- CompactFlash 4.1
- Secure Digital 2.0
- MultiMediaCard 4.2
• Optional custom firmware with up to 128 KB
external ROM
• MMC Streaming Mode support
- Memory Stick 1.43
- Memory Stick Pro Format 1.02
- Memory Stick Duo Format 1.10
- Memory Stick Pro-HG Duo Format 1.01
- xD-Picture Card 1.2
Applications
• Flash Media Card Reader/Writer
• Printers
• Desktop and Mobile PCs
• Consumer A/V
- SmartMedia 1.3
• Media Players/Viewers
• Vista ReadyBoostTM
1.) xD-Picture Card not applicable to USB2251.
2009 - 2015 Microchip Technology Inc.
DS00002005A-page 1
USB2250/50i/51/51i
TO OUR VALUED CUSTOMERS
It is our intention to provide our valued customers with the best documentation possible to ensure successful use of your Microchip
products. To this end, we will continue to improve our publications to better suit your needs. Our publications will be refined and
enhanced as new volumes and updates are introduced.
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E-mail at docerrors@microchip.com. We welcome your feedback.
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http://www.microchip.com
You can determine the version of a data sheet by examining its literature number found on the bottom outside corner of any page.
The last character of the literature number is the version number, (e.g., DS30000000A is version A of document DS30000000).
Errata
An errata sheet, describing minor operational differences from the data sheet and recommended workarounds, may exist for cur-
rent devices. As device/documentation issues become known to us, we will publish an errata sheet. The errata will specify the
revision of silicon and revision of document to which it applies.
To determine if an errata sheet exists for a particular device, please check with one of the following:
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When contacting a sales office, please specify which device, revision of silicon and data sheet (include -literature number) you are
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DS00002005A-page 2
2009 - 2015 Microchip Technology Inc.
USB2250/50i/51/51i
Table of Contents
1.0 Introduction ..................................................................................................................................................................................... 4
2.0 Pin Configuration ............................................................................................................................................................................ 6
3.0 Block Diagram ................................................................................................................................................................................. 7
4.0 Pin Table ......................................................................................................................................................................................... 8
5.0 Pin Descriptions ............................................................................................................................................................................ 10
6.0 Pin Reset State Table ................................................................................................................................................................... 17
7.0 Configuration Options ................................................................................................................................................................... 21
8.0 AC Specifications .......................................................................................................................................................................... 32
9.0 DC Parameters ............................................................................................................................................................................. 34
10.0 Package Outline .......................................................................................................................................................................... 38
Appendix A: Data Sheet Revision History ........................................................................................................................................... 39
Product Identification System ............................................................................................................................................................. 40
The Microchip Web Site ...................................................................................................................................................................... 41
Customer Change Notification Service ............................................................................................................................................... 41
Customer Support ............................................................................................................................................................................... 41
2009 - 2015 Microchip Technology Inc.
DS00002005A-page 3
USB2250/50i/51/51i
1.0
INTRODUCTION
The Microchip USB2250/50i/51/51i is a flash media card reader solution fully compliant with the USB 2.0 specification.
All required resistors on the USB ports are integrated into the device. This includes all series termination resistors on
D+ and D– pins and all required pull-down and pull-up resistors. The over-current sense inputs for the downstream fac-
ing ports have internal pull-up resistors.
Hardware Features
• Single chip flash media controller
• USB2250/USB2251 supports the commercial temperature range of 0°C to +70°C
• USB2250i/USB2251i supports the industrial temperature range of -40°C to +85°C
• 8051 8-bit microprocessor
- 60 MHz - single cycle execution
- 64 KB ROM |14 KB RAM
• Integrated regulator for 1.8 V core operation
• Flash Media Card Specification Revision Compliance
• Compact Flash 4.1
- CF UDMA Modes 0-4
- CF PIO Modes 0-6
• Secure Digital 2.0
- HS-SD and HC-SD
- TransFlash™ and reduced form factor media
• MultiMediaCard 4.2
- 1/4/8 bit MMC
• Memory Stick 1.43
• Memory Stick Pro Format 1.02
• Memory Stick Pro-HG Duo Format 1.01
- Memory Stick, MS Duo, HS-MS, MS Pro-HG, MS Pro
• Memory Stick Duo 1.10
• Smart Media 1.3
• xD-Picture Card 1.2
Software Features
• If the OEM is using an external EEPROM, the following features are available:
- Customizable vendor, product, and device ID’s
- 12-hex digits maximum for the serial number string
- 28-character manufacturer ID and product strings for the flash media reader/writer
2009 - 2015 Microchip Technology Inc.
DS00002005A-page 4
USB2250/50i/51/51i
1.1
Acronyms
ATA:
CFC:
FET:
Advanced Technology Attachment
Compact Flash Controller
Field Effect Transistor
LUN:
MMC:
MSC:
PLL:
RoHS:
RXD:
SDC:
SIE:
Logical Unit Number
MultiMediaCard
Memory Stick Controller
Phase-Locked Loop
Restriction of Hazardous Substances Directive
Received eXchange Data
Secure Digital Controller
Serial Interface Engine
SmartMedia Controller
SMC:
True IDE Mode: True Integrated Drive Electronics Mode
TXD:
Transmit eXchange Data
UART:
UCHAR:
UINT:
Universal Asynchronous Receiver-Transmitter
Unsigned Character
Unsigned Integer
VTQFP:
Very Thin Quad Flat Package
DS00002005A-page 5
2009 - 2015 Microchip Technology Inc.
USB2250/50i/51/51i
2.0
PIN CONFIGURATION
FIGURE 2-1:
128-PIN VTQFP DIAGRAM
97
64
MS_D6
nRESET
98
63
MS_INS
MS_D3
MS_D7
MS_SCLK
VSS
CF_D5
99
62
CF_D12
100
101
102
103
104
105
106
107
108
109
110
111
112
113
114
115
116
117
118
119
120
121
122
123
124
125
126
127
128
61
CF_D4
60
CF_D11
59
CF_D3
58
TEST
CF_nCD
57
VDD33
SD_WP
MA7
SM_nCD
56
SM_nB/R
55
SM_nRE
54
MA13
SM_nCE
53
MA6
SM_CLE
52
MA8
SM_ALE
51
MA5
VSS
50
MA9
VDD33
49
MA4
VDD18
USB225X
128 VTQFP
48
47
46
45
44
43
42
41
40
39
38
37
36
35
34
33
MA11
SM_nWE
SM_nWP
SM_D0
SM_D1
SM_D2
SM_D3
SM_D4
SM_D5
SM_D6
SM_D7
SM_nWPS
MD0
MA3
nMRD
MA2
CF_DMARQ / RXD
SCL / xD_ID
CF_DMACK
LED
(Top View)
VBUS_DET
VSS
XTAL2
XTAL1 (CLKIN)
VDD18PLL
VSS
MD1
MD2
RBIAS
VDD33
MD3
MD7
2009 - 2015 Microchip Technology Inc.
DS00002005A-page 6
USB2250/50i/51/51i
3.0
BLOCK DIAGRAM
FIGURE 3-1:
USB2250/50I/51/51I BLOCK DIAGRAM
SD/
MMC
USB2250 / USB2251
AUTO_CBW
PROC
CF/
GPIO (16)
USB
Host
FMI
SIE
CTL
BUS
INTFC
BUS FMDU
INTFC CTL
PHY
MS
SM
3.3 V
EP0 TX
EP0 RX
1.8 V Reg
BUS
RAM
VDD18
4K
total
INTFC
EP1 RX
EP1 TX
EP2 RX
EP2 TX
24 MHz
Crystal
PLL
XDATA BRIDGE
+ BUS ARBITER
VDD18PLL
3.3 V
PWR_FET0
PWR_FET1
PWR_FET2
PWR_FET3
CRD_PWR0
CRD_PWR1
CRD_PWR2
CRD_PWR3
1.8 V Reg
GPIOs
RAM
10 KB
ADDR
MAP
Program Memory I/O Bus
ROM
64 KB
Clock
Generation and
Control
SFR
RAM
8051
PROCESSOR
2009 - 2015 Microchip Technology Inc.
DS00002005A-page 7
USB2250/50i/51/51i
4.0
4.1
PIN TABLE
128-Pin Package
TABLE 4-1:
128-PIN VTQFP PACKAGE
COMPACT FLASH INTERFACE (28 PINS)
CF_D0
CF_D1
CF_D5
CF_D2
CF_D6
CF_D3
CF_D7
CF_D4
CF_D8
CF_D9
CF_D10
CF_D14
CF_IRQ
CF_D11
CF_D12
CF_nIOR
CF_D13
CF_nIOW
CF_D15
CF_nRESET
CF_IORDY
CF_SA1
CF_nCS0
CF_SA2
CF_DMACK
CF_nCD
CF_SA0
CF_DMARQ
SMARTMEDIA INTERFACE (17 PINS)
SM_D0
SM_D4
SM_D1
SM_D5
SM_D2
SM_D6
SM_D3
SM_D7
SM_ALE
SM_nWP
SM_nWPS
SM_CLE
SM_nB/R
SM_nRE
SM_nCE
SM_nWE
SM_nCD
MEMORY STICK INTERFACE (11 PINS)
MS_BS
MS_D1
MS_D5
MS_D0 / MS_SDIO
MS_D2
MS_SCLK
MS_D3
MS_INS
MS_D4
MS_D6
MS_D7
SECURE DIGITAL / MULTIMEDIACARD INTERFACE (12 PINS)
SD_CMD
SD_D2
SD_CLK
SD_D3
SD_D5
SD_D0
SD_WP
SD_D6
SD_D1
SD_nCD
SD_D7
SD_D4
USB INTERFACE (6 PINS)
USB+
USB-
RBIAS
XTAL2
XTAL1 (CLKIN)
REG_EN
2009 - 2015 Microchip Technology Inc.
DS00002005A-page 8
USB2250/50i/51/51i
TABLE 4-1:
128-PIN VTQFP PACKAGE (CONTINUED)
MEMORY/IO INTERFACE (28 PINS)
MA0 / CLK_SEL0
MA1 / CLK_SEL1
MA2
MA6
MA3
MA7
MA4
MA8
MA5
MA9
MA10
MA14
MD1
MA11
MA15
MD2
MA12
MA16
MD3
MD7
MA13
MD0
MD4
MD5
MD6
nMRD
nMWR
nMCE
MISC (10 PINS)
nRESET
LED
VBUS_DET
CRD_PWR0
TEST
SCL / xD_ID
CRD_PWR1
SDA
CRD_PWR2
CRD_PWR3
DIGITAL, POWER (16 PINS)
(8) VSS VDD18
(6) VDD33
VDD18PLL
TOTAL 128
DS00002005A-page 9
2009 - 2015 Microchip Technology Inc.
USB2250/50i/51/51i
5.0
PIN DESCRIPTIONS
This section provides a detailed description of each signal. The signals are arranged in functional groups according to
their associated interface. The pin descriptions are applied when using the internal default firmware and can be refer-
enced in Section 7.0, "Configuration Options," on page 21. Please reference Section 1.1, "Acronyms," on page 5 for a
list of the acronyms used.
The “n” symbol in the signal name indicates that the active, or asserted, state occurs when the signal is at a low voltage
level. When “n” is not present in the signal name, the signal is asserted at the high voltage level.
The terms assertion and negation are used exclusively. This is done to avoid confusion when working with a mixture of
“active low” and “active high” signals. The term assert, or assertion, indicates that a signal is active, independent of
whether that level is represented by a high or low voltage. The term negate, or negation, indicates that a signal is inac-
tive.
5.1
128-Pin VTQFP Pin Descriptions
TABLE 5-1:
Name
USB2250/50I/51/51I 128-PIN VTQFP PIN DESCRIPTIONS
128-Pin
VTQFP
Buffer
Type
Symbol
Description
COMPACT FLASH (CF) INTERFACE
CF Chip Select 0
CF_nCS0
71
O12PU
This pin is the active low chip select 0 signal for
the task file registers of the CF ATA device in
True IDE mode. This pin has a weak internal
pull-up resistor.
CF Register
Address
CF_SA[2:0]
82
83
84
I/O12
IPD
These pins are the register select address bits
for the CF ATA device.
CF Interrupt
CF_IRQ
74
This is the active high interrupt request signal
from the CF device. This pin has a weak internal
pull-down resistor.
CF Data 15-8
CF_D[15:8] /
70
68
66
62
60
90
89
87
I/O12PD CF_D[15:8]: These pins are the bi-directional
data signals CF_D15 - CF_D8 in True IDE mode
data transfer.
In True IDE mode, all task file register
operations occur on CF_D[7:0], while data
transfer occurs on CF_D[15:0].
These bi-directional data signals have weak
internal pull-down resistors.
CF Data 7-0
CF_D[7:0]
69
67
63
61
59
88
86
85
I/O12PD CF_D[7:0]: These pins are the bi-directional
data signals CF_D7 - CF_D0 in True IDE mode
data transfer. In True IDE mode, all of the task
file register operations occur on CF_D[7:0],
while data transfer occurs on CF_D[15:0].
These bi-directional data signals have weak
internal pull-down resistors.
IO Ready
CF_IORDY
80
IPU
This pin is the active high input signal for
IORDY. This pin has a weak internal pull-up
resistor.
CF Card
CF_nCD
CF_RESET_N
CF_nIOR
58
79
72
73
I/O12
O12
O12
O12
Designates as the Compact Flash card
detection pin.
Detection1
CF Hardware
Reset
This pin is an active low hardware reset signal
to the CF device.
CF IO Read
This pin is an active low read strobe signal for
the CF device.
CF IO Write
Strobe
CF_nIOW
This pin is an active low write strobe signal for
the CF device.
2009 - 2015 Microchip Technology Inc.
DS00002005A-page 10
USB2250/50i/51/51i
TABLE 5-1:
Name
USB2250/50I/51/51I 128-PIN VTQFP PIN DESCRIPTIONS (CONTINUED)
128-Pin
VTQFP
Buffer
Type
Symbol
Description
CF DMA request
CF_DMARQ /
117
I
CF_DMARQ: This pin is the DMA request from
the device to the CF controller.
RXD: The signal can be used as input to the
RXD of UART in the device. Custom firmware is
required to activate this function.
RXD
CF DMA
acknowledge
CF_DMACK
119
O12
CF_nDMACK: This pin is an active low DMA
acknowledge signal for the CF device.
SMARTMEDIA (SM) INTERFACE
SM Write Protect
SM_nWP
SM_ALE
SM_CLE
SM_D[7:0]
47
52
53
O12PD
O12PD
O12PD
This pin is an active low write protect signal for
the SM device and has a weak pull-down
resistor that is permanently enabled.
SM Address
Strobe
This pin is an active high Address Latch Enable
signal for the SM device and has a weak pull-
down resistor that is permanently enabled.
SM Command
Strobe
This pin is an active high Command Latch
Enable signal for the SM device and has a weak
pull-down resistor that is permanently enabled.
SM Data 7-0
39
40
41
42
43
44
45
46
I/O12PD These pins are the bi-directional data signals
SM_D7-SM_D0 and have weak internal pull-
down resistors.
SM Read Enable
SM_nRE
55
O12PU
This pin is an active low read strobe signal for
the SM device.
When using the internal FET, this pin has a
weak internal pull-up resistor that is tied to the
output of the internal power FET.
If an external FET is used (internal FET is
disabled), then the internal pull-up is not
available (external pull-ups must be used).
SM Write Enable
SM_nWE
48
O12PU
This pin is an active low write strobe signal for
the SM device.
When using the internal FET, this pin has a
weak internal pull-up resistor that is tied to the
output of the internal power FET.
If an external FET is used (internal FET is
disabled), then the internal pull-up is not
available (external pull-ups must be used).
SM Write Protect
Switch
SM_nWPS
SM_nB/R
38
56
IPU
IPU
A write-protect seal is detected when this pin is
low. This pin has a weak internal pull-up resistor.
SM Busy or Data
Ready
This pin is connected to the BSY/RDY pin of the
SM device.
When using the internal FET, this pin has a
weak internal pull-up resistor that is tied to the
output of the internal power FET.
If an external FET is used (internal FET is
disabled), then the internal pull-up is not
available (external pull-ups must be used).
DS00002005A-page 11
2009 - 2015 Microchip Technology Inc.
USB2250/50i/51/51i
TABLE 5-1:
Name
USB2250/50I/51/51I 128-PIN VTQFP PIN DESCRIPTIONS (CONTINUED)
128-Pin
VTQFP
Buffer
Type
Symbol
Description
SM Chip Enable
SM_nCE
54
O12PU
This pin is the active low chip enable signal to
the SM device.
When using the internal FET, this pin has a
weak internal pull-up resistor that is tied to the
output of the internal power FET.
If an external FET is used (internal FET is
disabled), then the internal pull-up is not
available (external pull-ups must be used).
SM Card
Detection
SM_nCD
MS_BS
57
I/O12
Designates as the Smart Media card detection
pin.
MEMORY STICK (MS) INTERFACE
MS Bus State
91
O12
This pin is connected to the bus state pin of the
MS device.
It is used to control the bus states 0, 1, 2 and 3
(BS0, BS1, BS2 and BS3) of the MS device.
MS Card Insertion
MS System CLK
MS_INS
98
IPU
Designates as the Memory Stick card detection
pin.
MS_SCLK
101
O12
This pin is an output clock signal to the MS
device. The clock frequency is software
configurable.
MS System Data
In/Out
MS_D[7:1]
100
97
93
95
99
96
92
I/O12PD MS_D[7:1]: These pins are the bi-directional
data signals for the MS device.
MS_D2 and MS_D3 have weak pull-down
resistors. MS_D1 has a pull-down resistor if it is
in parallel mode, otherwise it is disabled.
In 4- or 8-bit parallel mode, each MS_D7:1
signal has a weak pull-down resistor.
MS System Data
In/Out
MS_D0 /
94
I/O12PD MS_D0: This pin is one of the bi-directional data
signals for the MS device.
In serial mode, the most significant bit (MSB) of
each byte is transmitted first by either MSC or
the MS device on MS_D0, MS_D2, and MS_D3
(which have weak pull-down resistors). If
MS_D1 is in parallel mode, it has a pull-down
resistor; Otherwise, it is disabled.
In 4- or 8-bit parallel mode, the MS_D0 signal
has a weak pull-down resistor.
SECURE DIGITAL (SD) / MULTIMEDIACARD (MMC) INTERFACE
SD Data 7-0
SD_D[7:0]
13
11
19
21
22
23
10
12
I/O12PU These pins are bi-directional data signals
SD_D0 - SD_D7 and have weak pull-up
resistors.
SD Clock
SD_CLK
18
O12
This is an output clock signal to the SD/MMC
device.
The clock frequency is software configurable.
2009 - 2015 Microchip Technology Inc.
DS00002005A-page 12
USB2250/50i/51/51i
TABLE 5-1:
Name
USB2250/50I/51/51I 128-PIN VTQFP PIN DESCRIPTIONS (CONTINUED)
128-Pin
VTQFP
Buffer
Type
Symbol
Description
SD Command
SD_CMD
20
I/O12PU This is a bi-directional signal that connects to
the CMD signal of the SD/MMC device and has
a weak internal pull-up resistor.
SD Write
Protected
SD_WP
105
32
I/O12
Designates as the Secure Digital card
mechanical write detect pin.
SD Card Detect
SD_nCD
I/O12
Designates as the Secure Digital card detection
pin.
USB INTERFACE
USB Bus Data
USB+
USB-
7
8
I/O-U
These pins connect to the USB bus data
signals.
USB Transceiver
Bias
RBIAS
127
I-R
A 12.0 k, ±1.0% resistor is attached from VSS
to this pin in order to set the transceiver's
internal bias currents.
24 MHz Crystal
Input (External
Clock Input)
XTAL1
(CLKIN)
124
ICLKx
This pin can be connected to one terminal of the
crystal or it can be connected to an external
24/48 MHz clock when a crystal is not used.
The MA[1:0] pins will be sampled while
RESET_N is asserted, and the value will be
latched upon RESET_N negation. This will
determine the clock source and value.
24 MHz Crystal
Output
XTAL2
123
OCLKx
This is the other terminal of the crystal, or it is
left open when an external clock source is used
to drive XTAL1(CLKIN). It may not be used to
drive any external circuitry other than the crystal
circuit.
MEMORY / IO INTERFACE
Memory
Data Bus
MD[7:0]
33
29
30
31
34
35
36
37
I/O12PU These signals are used to transfer data between
the internal CPU and the external program
memory and have weak internal pull-up
resistors.
DS00002005A-page 13
2009 - 2015 Microchip Technology Inc.
USB2250/50i/51/51i
TABLE 5-1:
Name
USB2250/50I/51/51I 128-PIN VTQFP PIN DESCRIPTIONS (CONTINUED)
128-Pin
VTQFP
Buffer
Type
Symbol
Description
Memory
Address Bus
MA16
28
O12
These signals address memory locations within
the external memory.
MA[15:2]
2
4
O12
These signals address memory locations within
the external memory.
107
1
113
24
111
109
106
108
110
112
114
116
MA[1:0] /
25
O12
MA[1:0]: These signals address memory
locations within the external memory.
I/O12PD CLK_SEL[1:0]: During RESET_N assertion,
these pins will select the operating frequency of
the external clock, and the corresponding weak
pull-down resistors are enabled.
CLK_
SEL[1:0]
27
When RESET_N is negated, the value on these
pins will be latched internally and these pins will
revert to MA[1:0] functionality; the internal pull-
downs will be disabled.
CLK_SEL[1:0] = '00'. 24 MHz
CLK_SEL[1:0] = '01'. RESERVED
CLK_SEL[1:0] = '10'. RESERVED
CLK_SEL[1:0] = '11'. 48 MHz
If the latched value is '1', the corresponding MA
pin is tri-stated when the chip is in power down
state.
If the latched value is '0', the corresponding MA
pin will function identically to MA[15:3] pins at all
times (other than during RESET_N assertion).
Memory Write
Strobe
nMWR
nMRD
nMCE
3
O12
O12
O12
This pin is the active low program Memory Write
strobe signal.
Memory Read
Strobe
115
26
This pin is the active low program Memory Read
strobe signal.
Memory Chip
Enable
This pin is the active low program Memory Chip
Enable strobe signal.
This signal is asserted when any external
access is being done by the processor.
This signal is held to the logic 'high' while
RESET_N is asserted.
2009 - 2015 Microchip Technology Inc.
DS00002005A-page 14
USB2250/50i/51/51i
TABLE 5-1:
Name
USB2250/50I/51/51I 128-PIN VTQFP PIN DESCRIPTIONS (CONTINUED)
128-Pin
VTQFP
Buffer
Type
Symbol
Description
MISC
General Purpose
Input/Output
LED
120
121
I/O12
I/O12
LED: It can be used as an LED output.
VBUS_DET
VBUS is a 3.3 volt input. A resistor divider must
be used if connecting to 5 volts of USB power.
SCL /
118
O12
I/O12
I/O12
SCL: This is the clock output when used with an
external EEPROM.
xD_ID: This is the xD-Picture Card detection pin
only applicable to USB2250/USB2250i.
xD_ID
SDA
5
SDA: This is the data pin when used with an
external serial EEPROM.
CRD_PWR0
CRD_PWR1
CRD_PWR2
14
I/O12
I/O200
I/O12
CRD_PWR: Card power drive of 3.3 V at either
100 mA or 200 mA.
78
76
CRD_PWR: Card power drive of 3.3 V at either
100 mA or 200 mA.
I/O200
I/O200
CRD_PWR: Card power drive of 3.3 V at either
100 mA or 200 mA.
Requirement: This must be the only FET used
to power SM devices. Failure to do this will
violate SM voltage specification on SM device
pins.
CRD_PWR3
RESET_N
16
I/O200
CRD_PWR: Card power drive of 3.3 V at either
100 mA or 200 mA.
Requirement: This must be the only FET used
to power SM devices. Failure to do this will
violate SM voltage specification on SM device
pins.
RESET Input
64
IS
This active low signal is used by the system to
reset the chip. The active low pulse should be
at least 1s wide.
TEST Input
TEST
103
6
I
Tie this pin to ground for normal operation.
Regulator Enable
REG_EN
IPU
This signal is used to enable the internal
1.8 V regulator.
DIGITAL POWER, and GROUND
1.8 V Digital Core
Power
VDD18
49
If the internal regulator is enabled, then this pin
must have a 1.0 F (or greater) ±20% (ESR
<0.1 ) capacitor to VSS.
1.8 V PLL Power
VDD18PLL
125
If the internal regulator is enabled, then this pin
must have a 1.0 F (or greater) ±20% (ESR
<0.1 ) capacitor to VSS.
3.3 V Power and
Voltage Regulator
Input
VDD33
15
50
65
If the internal regulator is enabled, pins 50 and
128 each require an external bypass capacitor
of 4.7 F minimum.
77
104
128
DS00002005A-page 15
2009 - 2015 Microchip Technology Inc.
USB2250/50i/51/51i
TABLE 5-1:
Name
USB2250/50I/51/51I 128-PIN VTQFP PIN DESCRIPTIONS (CONTINUED)
128-Pin
VTQFP
Buffer
Type
Symbol
Description
Ground
VSS
9
17
Ground Reference
51
75
81
102
122
126
Note 5-1
Note 5-2
Hot-insertion capable card connectors are required for all flash media. It is required for the SD
connector to have a Write Protect switch. This allows the chip to detect the MMC card.
nMCE is normally asserted except when the 8051 is in standby mode.
5.2
Buffer Type Descriptions
TABLE 5-2:
BUFFER
BUFFER TYPE DESCRIPTIONS
DESCRIPTION
I
Input.
IPU
IPD
IS
Input with internal weak pull-up resistor.
Input with internal weak pull-down resistor.
Input with Schmitt trigger.
I/O12
I/O200
Input/Output buffer with 12 mA sink and 12 mA source.
Input/Output buffer 12 mA with FET disabled, 100/200 mA source only when the FET
is enabled.
I/O12PD
Input/Output buffer with 12 mA sink and 12 mA source with an internal weak pull-down
resistor.
I/O12PU
O12
Input/Output buffer with 12 mA sink and 12 mA source with a pull-up resistor.
Output buffer with 12 mA source.
O12PU
O12PD
ICLKx
OCLKx
I/O-U
Output buffer with 12 mA sink and 12 mA source, with a pull-up resistor.
Output buffer with 12 mA sink and 12 mA source, with a pull-down resistor.
XTAL clock input.
XTAL clock output.
Analog Input/Output as defined in the USB 2.0 Specification.
RBIAS.
I-R
2009 - 2015 Microchip Technology Inc.
DS00002005A-page 16
USB2250/50i/51/51i
6.0
PIN RESET STATE TABLE
FIGURE 6-1:
PIN RESET STATES
Hardware
Firmware
Initialization
Operational
Voltage
Signal
RESET
(v)
RESET
VDD33
Time
(t)
VSS
TABLE 6-1:
Symbol
LEGEND FOR PIN RESET STATES TABLE
Description
0
Output driven low
1
Output driven high
IP
PU
PD
--
Input enabled
Hardware enables pull-up
Hardware enables pull-down
Hardware disables function
Z
Hardware disables pad. Both output driver and
input buffers are disabled.
2009 - 2015 Microchip Technology Inc.
DS00002005A-page 17
USB2250/50i/51/51i
6.1
128-Pin Reset States
6.2
128-Pin Reset States
TABLE 6-2:
USB2250/50I/51/51I 128-PIN RESET STATES
Reset State
Reset State
Input/
PU/
Input/
Function Out-
put
PU/
PD
Pin
Pin Name
Function Out-
put
Pin
Pin Name
PD
IP
pu
85
86
88
59
61
63
67
69
87
89
90
60
62
66
68
70
72
73
74
79
80
71
84
83
82
CF_D0
CF_D1
None
None
None
None
None
None
None
None
None
None
None
None
None
None
None
None
CF
z
z
z
z
z
z
z
z
z
z
z
z
z
z
z
--
--
--
--
--
--
--
--
--
--
--
--
--
--
--
58
46
45
44
43
42
41
40
39
52
53
47
38
57
91
101
94
92
96
99
95
93
97
100
98
CF_nCD
SM_D0
None
z
pd
pd
pd
pd
pd
pd
pd
pd
pd
pd
pd
--
SM
z
CF_D2
SM_D1
SM
z
CF_D3
SM_D2
SM
z
CF_D4
SM_D3
SM
z
CF_D5
SM_D4
SM
z
CF_D6
SM_D5
SM
z
CF_D7
SM_D6
SM
z
CF_D8
SM_D7
SM
z
CF_D9
SM_ALE
SM_CLE
SM_nWP
SM_nWPS
SM_nCD
MS_BS
SM
z
CF_D10
CF_D11
CF_D12
CF_D13
CF_D14
CF_D15
CF_nIOR
CF_nIOW
CF_nIRQ
CF_nRESET
CF_IORDY
CF_nCS0
CF_SA0
CF_SA1
CF_SA2
SM
z
SM
z
SM
IP
pu
pd
pd
pd
pd
pd
pd
pd
pd
pd
pd
pu
None
z
MS
z
--
z
MS_SCLK
MS_D0 / MS_SDIO
MS_D1
MS
z
z
z
z
z
z
z
z
z
--
--
--
--
--
--
--
--
MS
z
CF
MS
z
CF
MS_D2
MS
z
CF
MS_D3
MS
z
CF
MS_D4
MS
z
CF
MS_D5
MS
z
CF
MS_D6
MS
z
CF
MS_D7
MS
z
--
IP
CF
MS_INS
None
DS00002005A-page 18
2009 - 2015 Microchip Technology Inc.
USB2250/50i/51/51i
TABLE 6-2:
USB2250/50I/51/51I 128-PIN RESET STATES (CONTINUED)
Reset State
Reset State
Input/
Function Out-
put
Input/
Function Out-
put
PU/
PD
PU/
PD
Pin
Pin Name
Pin
Pin Name
0
--
z
--
119
117
12
CF_DMACK
CF_DMARQ
SD_D0
SD_D1
SD_D2
SD_D3
SD_D4
SD_D5
SD_D6
SD_D7
SD_WP
SD_nCD
MA0 / CLK_SEL0
MA1 / CLK_SEL1
MA2
None
20
34
18
31
30
29
33
115
26
120
118
14
78
76
16
103
64
1
SD_CMD
MD3
SD
0
--
z
pu
--
None
MA
z
--
z
SD
SD_CLK
MD4
SD
z
--
z
pu
pu
pu
pu
--
10
SD
MA
z
--
z
23
SD
MD5
MA
z
--
z
22
SD
MD6
MA
z
--
z
21
SD
MD7
MA
z
--
1
19
SD
nMRD
MA
z
--
1
--
11
SD
nMCE
MA
z
--
0
--
13
SD
LED
None
0
--
0
--
105
32
None
SCL / xD_ID
CRD_PWR0
CRD_PWR1
CRD_PWR2
CRD_PWR3
TEST
None
IP
pu
pd
pd
pd
pd
--
z
--
None
None
IP
z
--
27
MA
None
IP
z
--
25
MA
None
IP
z
--
116
114
112
110
108
106
109
111
24
MA
None
IP
IP
--
MA3
MA
TEST
0
IP
--
MA4
MA
nRESET
MA12
nRESET
0
--
0
--
MA5
MA
MA
0
--
0
--
MA6
MA
4
MA14
MA
0
--
0
--
MA7
MA
2
MA15
MA
0
--
1
--
MA8
MA
3
nMWR
MA
0
--
IP
--
MA9
MA
121
5
VBUS_DET
SDA
None
0
--
0
pu
--
MA10
MA
None
0
--
z
113
107
28
MA11
MA
55
48
56
54
SM_nRE
SM_nWE
SM_nB/R
SM_nCE
SM
0
--
z
--
MA13
MA
SM
0
--
z
--
MA16
MA
SM
z
pu
z
--
37
MD0
MA
SM
2009 - 2015 Microchip Technology Inc.
DS00002005A-page 19
USB2250/50i/51/51i
TABLE 6-2:
USB2250/50I/51/51I 128-PIN RESET STATES (CONTINUED)
Reset State
Reset State
Input/
Function Out-
put
Input/
Function Out-
put
PU/
PD
PU/
PD
Pin
Pin Name
Pin
Pin Name
z
pu
pu
z
--
--
36
35
MD1
MD2
MA
7
8
USB+
USB-
USB+
z
z
MA
USB-
DS00002005A-page 20
2009 - 2015 Microchip Technology Inc.
USB2250/50i/51/51i
7.0
7.1
CONFIGURATION OPTIONS
Card Reader
The Microchip USB2250/50i/51/51i is fully compliant with the following flash media card reader specifications:
• Compact Flash 4.1
- CF UDMA Modes 0-4
- CF PIO Modes 0-6
• Secure Digital 2.0
- HS-SD and HC-SD
- TransFlash™ and reduced form factor media
• MultiMediaCard 4.2
- 1/4/8 bit MMC
• Memory Stick 1.43
• Memory Stick Pro Format 1.02
• Memory Stick Pro-HG Duo Format 1.01
- Memory Stick, MS Duo, HS-MS, MS Pro-HG, MS Pro
• Memory Stick Duo 1.10
• Smart Media 1.3
• xD-Picture Card 1.2
7.1.1
VBUS DETECT
According to Section 7.2.1 of the USB 2.0 Specification, a device cannot provide power to its D+ or D- pull-up resistors
unless the upstream port’s VBUS is in the asserted (powered) state. The VBUS_DET pin on the device monitors the
state of the upstream VBUS signal and will not pull-up the D+ resistor if VBUS is not active. If VBUS goes from an active
to an inactive state (not powered), the device will remove power from the D+ pull-up resistor within 10 seconds.
7.2
System Configurations
7.2.1
EEPROM
The USB2250/50i/51/51i can be configured via a 2-wire (I2C) EEPROM (512x8) flash device containing the options for
the USB2250/50i/51/51i. If an external configuration device does not exist the internal default values will be used. If one
of the external devices is used for configuration, the OEM can update the values through the USB interface. The device
will then “attach” to the upstream USB host.
The USBDM tool set is available in the USB225x Card Reader software release package. To download the software
package from Microchip's website, please visit:
http://www.microchip.com/SWLibraryWeb/producttc.aspx?product=OBJ%20files%20for%20USB2250
to go to the OBJ Card Reader Software Download Agreement. Review the license, and if you agree, check the "I agree"
box and then select “Confirm”. You will then be able to download the USB225x Card reader combo release package zip
files containing the USBDM tool set. Please note that the following applies to the system values and descriptions when
used:
• N/A = Not applicable to this part
• Reserved = For internal use
2009 - 2015 Microchip Technology Inc.
DS00002005A-page 21
USB2250/50i/51/51i
7.2.2
EEPROM DATA DESCRIPTOR
INTERNAL FLASH MEDIA CONTROLLER CONFIGURATIONS
TABLE 7-1:
Address
00h
Register Name
Description
Internal Default Value
USB_SER_LEN
USB Serial String
Descriptor Length
1Ah
01h
USB_SER_TYP
USB_SER_NUM
USB Serial String
Descriptor Type
03h
02h-19h
USB Serial Number
"000000225001"
(See Note 7-1)
1Ah-1Bh
1Ch-1Dh
1Eh
USB_VID
USB_PID
USB Vendor Identifier
USB Product Identifier
0424
2250
04h
USB_LANG_LEN
USB Language String Descriptor
Length
1Fh
20h
USB_LANG_TYP
USB_LANG_ID_LSB
USB_LANG_ID_MSB
USB_MFR_STR_LEN
USB_MFR_STR_TYP
USB_MFR_STR
USB Language String Descriptor
Type
03h
USB Language Identifier
Least Significant Byte
09h
(See Note 7-2)
21h
USB Language Identifier
Most Significant Byte
04h
(See Note 7-2)
22h
USB Manufacturer String
Descriptor Length
10h
03h
23h
USB Manufacturer String
Descriptor Type
24h-31h
USB Manufacturer String
“Generic”
(See Note 7-1)
32h-5Dh
5Eh
Reserved
-
00h
24h
USB_PRD_STR_LEN
USB Product String
Descriptor Length
5Fh
USB_PRD_STR_TYP
USB_PRD_STR
USB Product String
Descriptor Type
03h
60h-99h
USB Product String
"Flash Card Reader"
(See Note 7-1)
9Ah
9Bh
9Ch
9Dh
9Eh
9Fh
A0h
USB_BM_ATT
USB_MAX_PWR
ATT_LB
USB BmAttribute
USB Max Power
Attribute Lo byte
Attribute Hi Lo byte
Attribute Lo Hi byte
Attribute Hi byte
80h
30h (96 mA)
40h (Reverse SD_WP only)
ATT_HLB
00h
00h
00h
08h
ATT_LHB
ATT_HB
MS_PWR_LB
Memory Stick Device
Power Lo byte
A1h
A2h
A3h
A4h
A5h
A6h
MS_PWR_HB
CF_PWR_LB
CF_PWR_HB
SM_PWR_LB
SM_PWR_HB
SD_PWR_LB
Memory Stick Device
Power Hi byte
00h
80h
00h
00h
08h
00h
Compact Flash Device
Power Lo byte
Compact Flash Device
Power Hi byte
Smart Media Device
Power Lo byte
Smart Media Device
Power Hi byte
Secure Digital Device
Power Lo byte
DS00002005A-page 22
2009 - 2015 Microchip Technology Inc.
USB2250/50i/51/51i
TABLE 7-1:
Address
A7h
INTERNAL FLASH MEDIA CONTROLLER CONFIGURATIONS (CONTINUED)
Register Name
Description
Internal Default Value
SD_PWR_HB
Secure Digital Device
Power Hi byte
80h
A8h
LED_BLK_INT
LED_BLK_DUR
LED Blink Interval
LED Blink After Access
Device 0 Identifier String
Device 1 Identifier String
Device 2 Identifier String
Device 3 Identifier String
Inquiry Vendor String
Inquiry Product String
Dynamic Number of LUNs
Device to LUN Mapping
-
02h
28h
A9h
AAh - B0h
B1h - B7h
B8h - BEh
BFh - C5h
C6h - CDh
CEh-D2h
D3h
DEV0_ID_STR
“CF”
DEV1_ID_STR
“MS”
DEV2_ID_STR
“SM”
DEV3_ID_STR
“SD/MMC”
“Generic”
2250
INQ_VEN_STR
INQ_PRD_STR
DYN_NUM_LUN
DEV_LUN_MAP
MS_BUS_TIMINGReserved
MS_BUS_TIMINGReserved
Not Applicable
FFh
D4h - D7h
D8h - DAh
DBh - DDh
DEh-FBh
FCh-FFh
Note 7-1
FFh, FFh, FFh, FFh
00h, 03h, 07h
5Ch, 56h, 97h
00h
-
-
NVSTORE_SIG
Non-Volatile Storage Signature
“ATA2”
This value is a UNICODE UTF-16LE encoded string value that meets the USB 2.0 specification
(Revision 2.0, 2000). Values in double quotations without this note are ASCII values.
Note 7-2
For a list of the most current 16-bit language ID’s defined by the USB-IF, please visit
http://www.unicode.org or consult The Unicode Standard, Worldwide Character Encoding, (Version
4.0), The Unicode Consortium, Addison-Wesley Publishing Company, Reading, Massachusetts.
7.2.3
EEPROM DATA DESCRIPTOR REGISTER DESCRIPTIONS
00h: USB Serial String Descriptor Length
7.2.3.1
Byte
Name
Description
0
USB_SER_LEN
USB serial string descriptor length as defined by Section 9.6.7 “String” of the
USB 2.0 Specification (Revision 2.0, 2000). This field is the “bLength” which
describes the size of the string descriptor (in bytes).
7.2.3.2
01h: USB Serial String Descriptor Type
Byte
Name
Description
1
USB_SER_TYP
USB serial string descriptor type as defined by Section 9.6.7 “String” of the
USB 2.0 Specification (Revision 2.0, 2000). This field is the “bDescriptorType”
which is a constant value associated with a string descriptor type.
7.2.3.3
02h-19h: USB Serial Number Option
Byte
25:2
Name
Description
Maximum string length is 12 hex digits. Must be unique to each device.
USB_SER_NUM
7.2.3.4
1Ah-1Bh: USB Vendor ID Option
Byte
Name
Description
1:0
USB_VID
This ID is unique for every vendor. The vendor ID is assigned by the USB
Implementer’s Forum.
2009 - 2015 Microchip Technology Inc.
DS00002005A-page 23
USB2250/50i/51/51i
7.2.3.5
1Ch-1Dh: USB Product ID Option
Byte
Name
Description
This ID is unique for every product. The product ID is assigned by the vendor.
1:0
USB_PID
7.2.3.6
1Eh: USB Language Identifier Descriptor Length
Byte
Name
Description
0
USB_LANG_LEN USB language ID string descriptor length as defined by Section 9.6.7 “String”
of the USB 2.0 Specification (Revision 2.0, 2000). This field is the “bLength”
which describes the size of the string descriptor (in bytes).
7.2.3.7
1Fh: USB Language Identifier Descriptor Type
Byte
Name
Description
1
USB_LANG_TYP USB language ID string descriptor type as defined by Section 9.6.7 “String” of
the USB 2.0 Specification (Revision 2.0, 2000). This field is the
“bDescriptorType” which is a constant value associated with a string descriptor
type.
7.2.3.8
20h: USB Language Identifier Least Significant Byte
Byte
Name
Description
2
USB_LANG_ID
_LSB
English language code = ‘0409’. See Note 7-2 to reference additional language
ID’s defined by the USB-IF.
7.2.3.9
21h: USB Language Identifier Most Significant Byte
Byte
Name
Description
3
USB_LANG_ID
_MSB
English language code = ‘0409’. See Note 7-2 to reference additional language
ID’s defined by the USB-IF.
7.2.3.10
22h: USB Manufacturer String Descriptor Length
Byte
Name
Description
0
USB_MFR_STR
_LEN
USB manufacturer string descriptor length as defined by Section 9.6.7 “String”
of the USB 2.0 Specification (Revision 2.0, 2000). This field is the “bLength”
which describes the size of the string descriptor (in bytes).
7.2.3.11
23h: USB Manufacturer String Descriptor Type
Byte
Name
Description
1
USB_MFR_STR
_TYP
USB manufacturer string descriptor type as defined by Section 9.6.7 “String” of
the USB 2.0 Specification (Revision 2.0, 2000). This field is the
“bDescriptorType” which is a constant value associated with a string descriptor
type.
7.2.3.12
24h-31h: USB Manufacturer String Option
Byte
Name
Description
Maximum string length is 29 characters.
15:2
USB_MFR_STR
DS00002005A-page 24
2009 - 2015 Microchip Technology Inc.
USB2250/50i/51/51i
7.2.3.13
32h-5Dh: Reserved
Byte
Name
Description
59:16
Reserved
Reserved.
7.2.3.14
5Eh: USB Product String Descriptor Length
Byte
Name
Description
0
USB_PRD_STR
_LEN
USB product string descriptor length as defined by Section 9.6.7 “String” of the
USB 2.0 Specification (Revision 2.0, 2000). This field is the “bLength” which
describes the size of the string descriptor (in bytes). Maximum string length is
29 characters
7.2.3.15
5Fh: USB Product String Descriptor Type
Byte
Name
Description
1
USB_PRD_STR
_TYP
USB product string descriptor type as defined by Section 9.6.7 “String” of the
USB 2.0 Specification (Revision 2.0, 2000). This field is the “bDescriptorType”
which is a constant value associated with a string descriptor type.
7.2.3.16
60h-99h: USB Product String Option
Byte
Name
Description
59:2
USB_PRD_STR
This string will be used during the USB enumeration process in the Windows®
operating system. Maximum string length is 29 characters.
7.2.3.17
9Ah: USB BmAttribute (1 byte)
Byte
Name
Description
7:0
USB_BM_ATT
Self- or Bus-Power: Selects between self- and bus-powered operation.
The hub is either self-powered (draws less than 2 mA) or bus-powered (limited
to 100 mA maximum power prior to being configured by the host controller).
When configured as a bus-powered device, the Microchip device consumes
less than 100 mA of current prior to being configured. After configuration, the
bus-powered Microchip device (along with all associated device circuitry, any
embedded devices if part of a compound device, and 100 mA per externally
available downstream port) must consume no more than 500 mA of current.
The current consumption is system dependent, and the OEM must ensure that
the USB 2.0 Specification is not violated.
When configured as a self-powered device, <1 mA of current is consumed and
all ports are available, with each port being capable of sourcing 500 mA of
current.
80 = Bus-powered operation (default)
C0 = Self-powered operation
A0 = Bus-powered operation with remote wake-up
E0 = Self-powered operation with remote wake-up
7.2.3.18
9Bh: USB MaxPower (1 byte)
Byte
Name
Description
7:0
USB_MAX_PWR
USB Max Power per the USB 2.0 Specification. Do NOT set this value greater
than 100 mA.
2009 - 2015 Microchip Technology Inc.
DS00002005A-page 25
USB2250/50i/51/51i
7.2.3.19
9Ch-9Fh: Attribute Byte Descriptions
Byte
Byte Name
Bit
Description
0
ATT_LB
3:0
4
Always reads ‘0’.
Inquire Manufacturer and Product ID Strings
‘1’ - Use the Inquiry Manufacturer and Product ID Strings.
‘0’ (default) - Use the USB Descriptor Manufacturer and Product ID Strings.
Always reads ‘0’.
5
6
Reverse SD Card Write Protect Sense
‘1’ (default) - SD cards will be write protected when SW_nWP is high, and
writable when SW_nWP is low.
‘0’ - SD cards will be write protected when SW_nWP is low, and writable
when SW_nWP is high.
7
3:0
4
Reserved.
1
ATT_HLB
Always reads ‘0’.
Activity LED True Polarity
‘1’ - Activity LED to Low True.
‘0’ (default) - Activity LED polarity to High True.
Common Media Insert / Media Activity LED
5
‘1’ - The activity LED will function as a common media inserted/media access
LED.
‘0’ (default) - The activity LED will remain in its idle state until media is
accessed.
6
7
0
Always reads ‘0’.
Reserved.
2
ATT_LHB
Attach on Card Insert / Detach on Card Removal
‘1’ - Attach on Insert is enabled.
‘0’ (default) - Attach on Insert is disabled.
Always reads ‘0’.
1
2
Enable Device Power Configuration
‘1’ - Custom Device Power Configuration stored in the NVSTORE is used.
‘0’ (default) - Default Device Power Configuration is used.
7:3
6:0
7
Always reads ‘0’.
Always reads ‘0’.
xD Player Mode
3
ATT_HB
7.2.4
A0H-A7H: DEVICE POWER CONFIGURATION
The USB2250/50i/51/51i has four internal FETs which can be utilized for card power. This section describes the default
internal configuration. The settings are stored in NVSTORE and provide the following features:
1. A card can be powered by an external FET or by an internal FET.
2. The power limit can be set to 100 mA or 200 mA (Default) for the internal FET.
Each media uses two bytes to store its device power configuration. Bit 3 selects between internal or external card power
FET options. For internal FET card power control, bits 0 through 2 are used to set the power limit. The “Device Power
Configuration” bits are ignored unless the “Enable Device Power Configuration” bit is set. See Section 7.2.3.19, "9Ch-
9Fh: Attribute Byte Descriptions," on page 26.
DS00002005A-page 26
2009 - 2015 Microchip Technology Inc.
USB2250/50i/51/51i
7.2.4.1
A0h-A1h: Memory Stick Device Power Configuration
FET
Type
Bits
Bit Type
Low Nibble
Description
0
1
2
FET Lo Byte
MS_PWR_LB
3:0
7:4
3:0
0000b Disabled
0000b Disabled
High Nibble
FET Hi Byte
MS_PWR_HB
Low Nibble
0001b External FET enabled
1000b Internal FET with 100 mA power limit
1010b Internal FET with 200 mA power limit
3
7:4
High Nibble
0000b Disabled
7.2.4.2
A2h-A3h: Compact Flash Device Power Configuration
FET
Type
Bits
Bit Type
Low Nibble
Description
0
1
2
FET Lo Byte
CF_PWR_LB
3:0
7:4
3:0
0000b Disabled
0000b Disabled
High Nibble
FET Hi Byte
CF_PWR_HB
Low Nibble
0001b External FET enabled
1000b Internal FET with 100 mA power limit
1010b Internal FET with 200 mA power limit
3
7:4
High Nibble
0000b Disabled
7.2.4.3
A4h-A5h: Smart Media Device Power Configuration
FET
Type
Bits
Bit Type
Low Nibble
Description
0
1
2
FET Lo Byte
SM_PWR_LB
3:0
7:4
3:0
0000b Disabled
0000b Disabled
High Nibble
FET Hi Byte
SM_PWR_HB
Low Nibble
0001b External FET enabled
1000b Internal FET with 100 mA power limit
1010b Internal FET with 200 mA power limit
3
7:4
High Nibble
0000b Disabled
7.2.4.4
A6h-A7h: Secure Digital Device Power Configuration
FET
Type
Bits
Bit Type
Low Nibble
Description
0
1
2
FET Lo Byte
SD_PWR_LB
3:0
7:4
3:0
0000b Disabled
0000b Disabled
High Nibble
FET Hi Byte
SD_PWR_HB
Low Nibble
0001b External FET enabled
1000b Internal FET with 100 mA power limit
1010b Internal FET with 200 mA power limit
3
7:4
High Nibble
0000b Disabled
2009 - 2015 Microchip Technology Inc.
DS00002005A-page 27
USB2250/50i/51/51i
7.2.4.5
A8h: LED Blink Interval
Byte
Name
Description
0
LED_BLK_INT
The blink rate is programmable in 50 ms intervals. The high bit (7) indicates
an idle state:
‘0’ - Off
‘1’ - On
The remaining bits (6:0) are used to determine the blink interval up to a max
of 63 x 50 ms.
7.2.4.6
A9h: LED Blink Duration
Byte
Name
Description
1
LED_BLK_DUR
LED Blink After Access. This byte is used to designate the number of seconds
that the LED will continue to blink after a drive access. Setting this byte to "05"
will cause the LED to blink for 5 seconds after a drive access.
7.2.5
DEVICE ID STRINGS
These bytes are used to specify the LUN descriptor returned by the device. These bytes are used in combination with
the device to LUN mapping bytes in applications where the OEM wishes to reorder and rename the LUNs. If multiple
devices are mapped to the same LUN (a COMBO LUN), then the CLUN#_ID_STR will be used to name the COMBO
LUN instead of the individual device strings. When applicable, the "SM" value will be overridden with xD once an xD-
Picture Card has been identified.
7.2.5.1
AAh-B0h: Device 0 Identifier String
Byte
6:0
Name
Description
Description
DEV0_ID_STR
Not applicable.
7.2.5.2
B1h-B7h: Device 1 Identifier String
Byte
Name
6:0
DEV1_ID_STR
This ID string is associated with the Memory Stick device.
7.2.5.3
B8h-BEh: Device 2 Identifier String
Byte
Name
Description
This ID string is associated with the Smart Media device.
6:0
DEV2_ID_STR
7.2.5.4
BFh-C5h: Device 3 Identifier String
Byte
Name
Description
This ID string is associated with the Secure Digital / MultiMediaCard device.
6:0
DEV3_ID_STR
7.2.5.5
C6h-CDh: Inquiry Vendor String
Byte
Name
Description
7:0
INQ_VEN_STR
If bit 4 of the 1st attribute byte is set, the device will use these strings in
response to a USB inquiry command, instead of the USB descriptor
manufacturer and product ID strings.
DS00002005A-page 28
2009 - 2015 Microchip Technology Inc.
USB2250/50i/51/51i
7.2.5.6
CEh-D2h: Inquiry Product String
Byte
4:0
Name
Description
INQ_PRD_STR
If bit 4 of the 1st attribute byte is set, the device will use these strings in
response to a USB inquiry command, instead of the USB descriptor
manufacturer and product ID strings.
7.2.5.7
D3h: Dynamic Number of LUNs
Byte
Name
Description
7:0
DYN_NUM_LUN
These bytes are used to specify the number of LUNs the device exposes to
the host. These bytes are also used for icon sharing by assigning more than
one LUN to a single icon. This is used in applications where the device utilizes
a combo socket and the OEM wishes to have only a single icon displayed for
one or more interfaces.
If this field is set to "FF", the program assumes that you are using the default
value and icons will be configured per the default configuration.
7.2.5.8
D4h-D7h: Device to LUN Mapping
Byte
Name
Description
3:0
DEV_LUN_MAP
These registers map a device controller (SD/MMC, SM, and MS) to a Logical
Unit Number (LUN). The device reports the mapped LUNs to the USB host in
the USB descriptor during enumeration. The icon installer associates custom
icons with the LUNs specified in these fields.
Setting a register to "FF" indicates that the device is not mapped. Setting all
of the DEV_LUN_MAP registers for all devices to "FF" forces the use of the
default mapping configuration. Not all configurations are valid. Valid
configurations depend on the hardware, packaging, and OEM board layout.
The number of unique LUNs mapped must match the value in the Section
7.2.5.7, "D3h: Dynamic Number of LUNs," on page 29.
7.2.5.9
D8h-FBh: Not Applicable
Byte
Name
Description
35:0
Not Applicable
Not Applicable.
7.2.5.10
FCh-FFh: Non-Volatile Storage Signature
Byte
Name
Description
3:0
NVSTORE_SIG
This signature is used to verify the validity of the data in the first 256 bytes of
the configuration area. The signature must be set to ‘ATA2’ for
USB2250/50i/51/51i.
2009 - 2015 Microchip Technology Inc.
DS00002005A-page 29
USB2250/50i/51/51i
7.3
Default Configuration Option
The Microchip device can be configured via its internal default configuration. Please see Section 7.2.2, "EEPROM Data
Descriptor" for specific details on how to enable default configuration. Please refer to Table 7-1 for the internal default
values that are loaded when this option is selected.
7.3.1
EXTERNAL HARDWARE NRESET
A valid hardware reset is defined as assertion of nRESET for a minimum of 1 s after all power supplies are within oper-
ating range. While reset is asserted, the device (and its associated external circuitry) consumes less than 500 A of
current.
Assertion of nRESET (external pin) causes the following:
1. The PHY is disabled and the differential pair will be in a high-impedance state.
2. All transactions immediately terminate; no states are saved.
3. All internal registers return to the default state.
4. The external crystal oscillator is halted.
5. The PLL is halted.
6. The processor is reset.
7. All media interfaces are reset.
7.3.1.1
nRESET for EEPROM Configuration
FIGURE 7-1:
NRESET TIMING FOR EEPROM MODE
Start
completion
request
Hardware
reset
asserted
Device
Recovery/
Stabilization
8051 Sets
Configuration
Registers
Attach
USB
Upstream
USB Reset
recovery
Idle
response
t4
t6
t7
t1
t5
t2
t3
nRESET
VSS
TABLE 7-2:
Name
NRESET TIMING FOR EEPROM MODE
Description
MIN
TYP
MAX
Units
t1
t2
t3
t4
t5
t6
t7
nRESET asserted
1
sec
sec
msec
msec
msec
msec
msec
Device recovery/stabilization
8051 programs device configuration
USB attach
500
50
20
100
Host acknowledges attach and signals USB reset
USB idle
100
Undefined
Ready to handle requests (with or without data)
5
Note:
All power supplies must have reached the operating levels mandated in Section 9.0, "DC Parameters",
prior to (or coincident with) the assertion of nRESET.
DS00002005A-page 30
2009 - 2015 Microchip Technology Inc.
USB2250/50i/51/51i
7.3.2
USB BUS RESET
In response to the upstream port signaling a reset to the device, the device does the following:
1. Sets default address to ‘0’.
2. Sets configuration to: Unconfigured.
3. All transactions are stopped.
4. Processor reinitializes and restarts.
5. All media interfaces are disabled.
2009 - 2015 Microchip Technology Inc.
DS00002005A-page 31
USB2250/50i/51/51i
8.0
8.1
AC SPECIFICATIONS
Oscillator/Crystal
Parallel Resonant, Fundamental Mode, 24 MHz 350 ppm.
FIGURE 8-1:
TYPICAL CRYSTAL CIRCUIT
XTAL1
(CS1 = CB1 + CXTAL1
)
C1
1 M
Crystal
CL
C0
C2
XTAL2
(CS2 = CB2 + CXTAL2
)
TABLE 8-1:
Symbol
CRYSTAL CIRCUIT LEGEND
Description
In Accordance With
C0
Crystal shunt capacitance
Crystal manufacturer’s specification (See Note 8-1)
CL
Crystal load capacitance
Total board or trace capacitance
Stray capacitance
CB
OEM board design
CS
Microchip IC and OEM board design
Microchip IC
CXTAL
C1
XTAL pin input capacitance
Load capacitors installed on OEM
board
Calculated values based on Figure 8-2, "Capacitance
Formulas" (See Note 8-2)
C2
FIGURE 8-2:
CAPACITANCE FORMULAS
C1 = 2 x (CL – C0) – CS1
C2 = 2 x (CL – C0) – CS2
Note 8-1
Note 8-2
C0 is usually included (subtracted by the crystal manufacturer) in the specification for CL and should
be set to ‘0’ for use in the calculation of the capacitance formulas in Figure 8-2, "Capacitance
Formulas". However, the OEM PCB itself may present a parasitic capacitance between XTAL1 and
XTAL2. For an accurate calculation of C1 and C2, take the parasitic capacitance between traces
XTAL1 and XTAL2 into account.
Each of these capacitance values is typically approximately 18 pF.
2009 - 2015 Microchip Technology Inc.
DS00002005A-page 32
USB2250/50i/51/51i
8.2
Ceramic Resonator
24 MHz 350 ppm
FIGURE 8-3:
CERAMIC RESONATOR USAGE WITH MICROCHIP IC
XTAL1
24 MHz
Ceramic
Resonator
1 M
XTAL2
8.3
External Clock
50% Duty cycle 10%, 24/48 MHz 350 ppm, Jitter < 100 ps rms.
The external clock is recommended to conform to the signaling level designated in the JESD76-2 specification on 1.8
V CMOS Logic. XTAL2 should be treated as a no connect.
DS00002005A-page 33
2009 - 2015 Microchip Technology Inc.
USB2250/50i/51/51i
9.0
9.1
DC PARAMETERS
Maximum Ratings
Parameter
Symbol
TA
MIN
MAX
Units
°C
Comments
Storage
Temperature
-55
150
4.0
Lead
Temperature
°C
V
Please refer to JEDEC
specification J-STD-020D.
3.3 V supply
voltage
VDD33
-0.5
-0.5
Voltage on
USB+ and USB-
pins
(3.3 V supply voltage + 2) 6
V
Voltage on
-0.5
VDD33 + 0.3
V
When internal power FET
operation of these pins are
enabled, these pins may be
simultaneously shorted to
ground or any voltage up to 3.63
V indefinitely, without damage to
the device as long as VDD33 is
less than 3.63 V and TA is less
than 70oC.
CRD_PWR0,
CRD_PWR1,
CRD_PWR2 and
CRD_PWR3
Voltage on any
signal pin
-0.5
-0.5
-0.5
VDD33 + 0.3
3.6
V
V
V
Voltage on
XTAL1
Voltage on
XTAL2
VDD18 + 0.3
Note 9-1
Stresses above the specified parameters may cause permanent damage to the device. This is a
stress rating only and functional operation of the device at any condition above those indicated in the
operation sections of this specification is not implied.
Note 9-2
When powering this device from laboratory or system power supplies, it is important that the absolute
maximum ratings not be exceeded or device failure can result. Some power supplies exhibit voltage
spikes on their outputs when the AC power is switched on or off. In addition, voltage transients on
the AC power line may appear on the DC output. When this possibility exists, it is suggested that a
clamp circuit be used.
FIGURE 9-1:
SUPPLY RISE TIME MODEL
Voltage
tRT
VDD33
3.3 V
100%
90%
10%
VSS
t90%
Time
t10%
2009 - 2015 Microchip Technology Inc.
DS00002005A-page 34
USB2250/50i/51/51i
Note 9-3
When powering the device, the maximum power supply ramp time should be set at a rate faster than
400 s. This speed is important to ensure that the device resets properly. Measure rise time at 10%
and 90%.
9.2
Operating Conditions
Parameter
Symbol
MIN
MAX
Units
Comments
Operating
Temperature
Ambient temperature in still air.
Commercial Part
TA
0
70
°C
Industrial Part
TA
-40
3.0
0
85
°C
V
3.3 V supply voltage
VDD33
3.6
400
5.5
(Note 9-4)
3.3 V supply rise time tRT
s
V
(See Figure 9-1 and Note 9-3)
Voltage on
USB+ and USB- pins
-0.3
If any 3.3 V supply voltage drops
below 3.0 V, then the MAX
becomes:
(3.3 V supply voltage) + 0.5 5.5
Voltage on any signal
pin
-0.3
VDD33
V
Voltage on XTAL1
Voltage on XTAL2
-0.3
-0.3
VDD33
VDD18
V
V
Note 9-4
A 3.3 V regulator with an output tolerance of 1% must be used if the output of the internal power
FET’s must support a 5% tolerance.
9.3
DC Electrical Characteristics
Parameter
Symbol
MIN
TYP
MAX
Units
Comments
I, IPU, IPD Type Input Buffer
Low Input Level
VILI
VIHI
PD
PU
0.8
V
V
TTL Levels
High Input Level
2.0
Pull Down
72
58
A
A
Pull Up
IS Type Input Buffer
Low Input Level
High Input Level
VILI
VIHI
0.8
V
V
TTL Levels
2.0
Hysteresis
VHYSI
420
mV
ICLK Input Buffer
Low Input Level
High Input Level
Input Leakage
VILCK
VIHCK
IIL
0.5
V
V
1.4
-10
+10
A
VIN = 0 to VDD33
DS00002005A-page 35
2009 - 2015 Microchip Technology Inc.
USB2250/50i/51/51i
Parameter
Input Leakage
Symbol
MIN
TYP
MAX
Units
Comments
(All I and IS buffers)
Low Input Leakage
IIL
-10
-10
+10
+10
A
A
VIN = 0
High Input Leakage
IIH
VIN = VDD33
O12 Type Buffer
Low Output Level
High Output Level
Output Leakage
VOL
VOH
IOL
0.4
V
V
IOL = 12 mA @
VDD33= 3.3 V
VDD33
- 0.4
IOH = -12 mA @
VDD33= 3.3 V
-10
+10
0.4
A
VIN = 0 to VDD33
(Note 9-5)
I/O12, I/O12PU & I/O12PD Type
Buffer
Low Output Level
High Output Level
Output Leakage
VOL
VOH
IOL
V
V
IOL = 12 mA @
VDD33= 3.3 V
VDD33
- 0.4
IOH = -12 mA @
VDD33= 3.3 V
-10
+10
A
VIN = 0 to VDD33
(Note 9-5)
Pull Down
Pull Up
PD
PU
72
58
A
A
IO-U
(Note 9-6)
I-R
(Note 9-7)
I/O200
Integrated Power FET for
CRD_PWR0, CRD_PWR1,
CRD_PWR2 and CRD_PWR3
High Output Current Mode
IOUT
IOUT
200
100
mA
mA
VdropFET = 0.46 V
VdropFET = 0.23 V
Low Output Current Mode
(Note 9-8)
On Resistance
(Note 9-8)
RDSON
2.1
IFET = 70 mA
Output Voltage Rise Time
tDSON
800
90
s
CLOAD = 10 F
Supply Current Unconfigured
ICCINIT
80
mA
2009 - 2015 Microchip Technology Inc.
DS00002005A-page 36
USB2250/50i/51/51i
Parameter
Symbol
MIN
TYP
MAX
Units
Comments
Supply Current Active
VDD33 = 3.3 V
ICC
ICC
110
135
140
165
mA
mA
Full Speed
High Speed
Supply Current Suspend
Industrial Temperature Suspend
ICSBY
ICSBYI
350
350
750
950
A
A
VDD33, V = 3.3 V
Note 9-5
Note 9-6
Note 9-7
Note 9-8
Output leakage is measured with the current pins in high impedance.
See The USB 2.0 Specification, Chapter 7, for USB DC electrical characteristics
RBIAS is a 3.3 V tolerant analog pin.
Output current range is controlled by program software, software disables FET during short circuit
condition.
9.4
Capacitance
TA = 25°C; fc = 1 MHz; VDD, VDDP = 1.8 V
Limits
TYP
Parameter
Symbol
Unit
Test Condition
MIN
MAX
Clock Input Capacitance
CXTAL
2
pF
All pins (except USB pins and
pins under test) are tied to AC
ground.
Input Capacitance
Output Capacitance
CIN
10
20
pF
pF
COUT
9.5
Package Thermal Specification
TABLE 9-1:
128-PIN VTQFP PACKAGE THERMAL PARAMETERS
Velocity
Parameter
Symbol
Value
Unit
(meters/sec)
Thermal Resistance
0
1
2
0
1
2
55
48
45
18
18
18
JA
°C/W
Junction-to-Top-of-Package
JT
°C/W
Note 9-9
Thermal parameters are measured or estimated for devices with the exposed pad soldered to thermal
vias in a multilayer 2S2P PCB per JESD51. Thermal resistance is measured from the die to the
ambient air.
DS00002005A-page 37
2009 - 2015 Microchip Technology Inc.
USB2250/50i/51/51i
10.0 PACKAGE OUTLINE
FIGURE 10-1:
128-PIN VTQFP, 14X14X1.0 MM BODY, 2.0 MM PITCH
2009 - 2015 Microchip Technology Inc.
DS00002005A-page 38
USB2250/50i/51/51i
APPENDIX A: DATA SHEET REVISION HISTORY
TABLE A-1:
REVISION HISTORY
REVISION LEVEL & DATE
SECTION/FIGURE/ENTRY
CORRECTION
DS00002005A (10-22-15)
Replaces previous SMSC version Rev. 2.0 (09-29-09)
2009 - 2015 Microchip Technology Inc.
DS00002005A-page 39
USB2250/50i/51/51i
PRODUCT IDENTIFICATION SYSTEM
To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office.
Examples:
PART NO.
Device
[X]
XXX
[X]
-
-
1. USB2250-NU-06
128-pin VTQFN RoHS Compliant pack-
age, Commercial Temp, Tray
2. USB2250-NU-05
Temperature
Range
Package
Internal Microchip
Code
128-pin VTQFN RoHS Compliant pack-
age, Commercial Temp, Tray
3. USB2251-NU-06
Device:
USB2250, USB2250i, USB2251, USB2251i
Temperature Range:
Package:
Blank
i
=
0C to +70C (Commercial)
128-pin VTQFN RoHS Compliant pack-
age, Commercial Temp, Tray
4. USB2251-NU-05
128-pin VTQFN RoHS Compliant pack-
age, Commercial Temp, Tray
5. USB2250i-NU-06
= -40C to+85C (Industrial)
NU
= 128-pin VTQFN
128-pin VTQFN RoHS Compliant pack-
age, Industrial Temp, Tray
2009 - 2015 Microchip Technology Inc.
DS00002005A-page 40
USB2250/50i/51/51i
THE MICROCHIP WEB SITE
Microchip provides online support via our WWW site at www.microchip.com. This web site is used as a means to make
files and information easily available to customers. Accessible by using your favorite Internet browser, the web site con-
tains the following information:
• Product Support – Data sheets and errata, application notes and sample programs, design resources, user’s
guides and hardware support documents, latest software releases and archived software
• General Technical Support – Frequently Asked Questions (FAQ), technical support requests, online discussion
groups, Microchip consultant program member listing
• Business of Microchip – Product selector and ordering guides, latest Microchip press releases, listing of semi-
nars and events, listings of Microchip sales offices, distributors and factory representatives
CUSTOMER CHANGE NOTIFICATION SERVICE
Microchip’s customer notification service helps keep customers current on Microchip products. Subscribers will receive
e-mail notification whenever there are changes, updates, revisions or errata related to a specified product family or
development tool of interest.
To register, access the Microchip web site at www.microchip.com. Under “Support”, click on “Customer Change Notifi-
cation” and follow the registration instructions.
CUSTOMER SUPPORT
Users of Microchip products can receive assistance through several channels:
• Distributor or Representative
• Local Sales Office
• Field Application Engineer (FAE)
• Technical Support
Customers should contact their distributor, representative or field application engineer (FAE) for support. Local sales
offices are also available to help customers. A listing of sales offices and locations is included in the back of this docu-
ment.
Technical support is available through the web site at: http://www.microchip.com/support
2009 - 2015 Microchip Technology Inc.
DS00002005A-page 41
USB2250/50i/51/51i
Note the following details of the code protection feature on Microchip devices:
•
Microchip products meet the specification contained in their particular Microchip Data Sheet.
•
Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the
intended manner and under normal conditions.
•
There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our
knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data
Sheets. Most likely, the person doing so is engaged in theft of intellectual property.
•
•
Microchip is willing to work with the customer who is concerned about the integrity of their code.
Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not
mean that we are guaranteeing the product as “unbreakable.”
Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our
products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts
allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act.
Information contained in this publication regarding device applications and the like is provided only for your convenience and may be super-
seded by updates. It is your responsibility to ensure that your application meets with your specifications. MICROCHIP MAKES NO REP-
RESENTATIONS OR WARRANTIES OF ANY KIND WHETHER EXPRESS OR IMPLIED, WRITTEN OR ORAL, STATUTORY OR
OTHERWISE, RELATED TO THE INFORMATION, INCLUDING BUT NOT LIMITED TO ITS CONDITION, QUALITY, PERFORMANCE,
MERCHANTABILITY OR FITNESS FOR PURPOSE. Microchip disclaims all liability arising from this information and its use. Use of Micro-
chip devices in life support and/or safety applications is entirely at the buyer’s risk, and the buyer agrees to defend, indemnify and hold
harmless Microchip from any and all damages, claims, suits, or expenses resulting from such use. No licenses are conveyed, implicitly or
otherwise, under any Microchip intellectual property rights unless otherwise stated.
Trademarks
The Microchip name and logo, the Microchip logo, dsPIC, FlashFlex, flexPWR, JukeBlox, KEELOQ, KEELOQ logo, Kleer, LANCheck,
MediaLB, MOST, MOST logo, MPLAB, OptoLyzer, PIC, PICSTART, PIC32 logo, RightTouch, SpyNIC, SST, SST Logo, SuperFlash and
UNI/O are registered trademarks of Microchip Technology Incorporated in the U.S.A. and other countries.
The Embedded Control Solutions Company and mTouch are registered trademarks of Microchip Technology Incorporated in the U.S.A.
Analog-for-the-Digital Age, BodyCom, chipKIT, chipKIT logo, CodeGuard, dsPICDEM, dsPICDEM.net, ECAN, In-Circuit Serial
Programming, ICSP, Inter-Chip Connectivity, KleerNet, KleerNet logo, MiWi, motorBench, MPASM, MPF, MPLAB Certified logo, MPLIB,
MPLINK, MultiTRAK, NetDetach, Omniscient Code Generation, PICDEM, PICDEM.net, PICkit, PICtail, RightTouch logo, REAL ICE,
SQI, Serial Quad I/O, Total Endurance, TSHARC, USBCheck, VariSense, ViewSpan, WiperLock, Wireless DNA, and ZENA are
trademarks of Microchip Technology Incorporated in the U.S.A. and other countries.
SQTP is a service mark of Microchip Technology Incorporated in the U.S.A.
Silicon Storage Technology is a registered trademark of Microchip Technology Inc. in other countries.
GestIC is a registered trademark of Microchip Technology Germany II GmbH & Co. KG, a subsidiary of Microchip Technology Inc., in
other countries.
All other trademarks mentioned herein are property of their respective companies.
© 2009 - 2015, Microchip Technology Incorporated, Printed in the U.S.A., All Rights Reserved.
ISBN: 9781632777751
QUALITYꢀMANAGEMENTꢀꢀSYSTEMꢀ
Microchip received ISO/TS-16949:2009 certification for its worldwide
headquarters, design and wafer fabrication facilities in Chandler and
Tempe, Arizona; Gresham, Oregon and design centers in California
CERTIFIEDꢀBYꢀDNVꢀ
and India. The Company’s quality system processes and procedures
are for its PIC® MCUs and dsPIC® DSCs, KEELOQ® code hopping
devices, Serial EEPROMs, microperipherals, nonvolatile memory and
== ISO/TSꢀ16949ꢀ==ꢀ
analog products. In addition, Microchip’s quality system for the design
and manufacture of development systems is ISO 9001:2000 certified.
2009 - 2015 Microchip Technology Inc.
DS00002005A-page 42
Worldwide Sales and Service
AMERICAS
ASIA/PACIFIC
ASIA/PACIFIC
EUROPE
Corporate Office
2355 West Chandler Blvd.
Chandler, AZ 85224-6199
Tel: 480-792-7200
Fax: 480-792-7277
Technical Support:
http://www.microchip.com/
support
Asia Pacific Office
China - Xiamen
Tel: 86-592-2388138
Fax: 86-592-2388130
Austria - Wels
Tel: 43-7242-2244-39
Fax: 43-7242-2244-393
Suites 3707-14, 37th Floor
Tower 6, The Gateway
Harbour City, Kowloon
China - Zhuhai
Tel: 86-756-3210040
Fax: 86-756-3210049
Denmark - Copenhagen
Tel: 45-4450-2828
Fax: 45-4485-2829
Hong Kong
Tel: 852-2943-5100
Fax: 852-2401-3431
India - Bangalore
Tel: 91-80-3090-4444
Fax: 91-80-3090-4123
France - Paris
Tel: 33-1-69-53-63-20
Fax: 33-1-69-30-90-79
Australia - Sydney
Tel: 61-2-9868-6733
Fax: 61-2-9868-6755
Web Address:
www.microchip.com
India - New Delhi
Tel: 91-11-4160-8631
Fax: 91-11-4160-8632
Germany - Dusseldorf
Tel: 49-2129-3766400
Atlanta
Duluth, GA
Tel: 678-957-9614
Fax: 678-957-1455
China - Beijing
Tel: 86-10-8569-7000
Fax: 86-10-8528-2104
Germany - Karlsruhe
Tel: 49-721-625370
India - Pune
Tel: 91-20-3019-1500
China - Chengdu
Tel: 86-28-8665-5511
Fax: 86-28-8665-7889
Germany - Munich
Tel: 49-89-627-144-0
Fax: 49-89-627-144-44
Austin, TX
Tel: 512-257-3370
Japan - Osaka
Tel: 81-6-6152-7160
Fax: 81-6-6152-9310
Boston
China - Chongqing
Tel: 86-23-8980-9588
Fax: 86-23-8980-9500
Italy - Milan
Tel: 39-0331-742611
Fax: 39-0331-466781
Westborough, MA
Tel: 774-760-0087
Fax: 774-760-0088
Japan - Tokyo
Tel: 81-3-6880- 3770
Fax: 81-3-6880-3771
China - Dongguan
Tel: 86-769-8702-9880
Italy - Venice
Tel: 39-049-7625286
Chicago
Itasca, IL
Tel: 630-285-0071
Fax: 630-285-0075
Korea - Daegu
Tel: 82-53-744-4301
Fax: 82-53-744-4302
China - Hangzhou
Tel: 86-571-8792-8115
Fax: 86-571-8792-8116
Netherlands - Drunen
Tel: 31-416-690399
Fax: 31-416-690340
Korea - Seoul
Cleveland
Tel: 82-2-554-7200
Fax: 82-2-558-5932 or
82-2-558-5934
China - Hong Kong SAR
Tel: 852-2943-5100
Fax: 852-2401-3431
Poland - Warsaw
Tel: 48-22-3325737
Independence, OH
Tel: 216-447-0464
Fax: 216-447-0643
Spain - Madrid
Tel: 34-91-708-08-90
Fax: 34-91-708-08-91
China - Nanjing
Tel: 86-25-8473-2460
Fax: 86-25-8473-2470
Malaysia - Kuala Lumpur
Tel: 60-3-6201-9857
Fax: 60-3-6201-9859
Dallas
Addison, TX
Tel: 972-818-7423
Fax: 972-818-2924
Sweden - Stockholm
Tel: 46-8-5090-4654
China - Qingdao
Tel: 86-532-8502-7355
Fax: 86-532-8502-7205
Malaysia - Penang
Tel: 60-4-227-8870
Fax: 60-4-227-4068
Detroit
Novi, MI
UK - Wokingham
Tel: 44-118-921-5800
China - Shanghai
Tel: 86-21-5407-5533
Fax: 86-21-5407-5066
Philippines - Manila
Tel: 63-2-634-9065
Fax: 63-2-634-9069
Tel: 248-848-4000
Fax: 44-118-921-5820
Houston, TX
Tel: 281-894-5983
China - Shenyang
Tel: 86-24-2334-2829
Fax: 86-24-2334-2393
Singapore
Tel: 65-6334-8870
Fax: 65-6334-8850
Indianapolis
Noblesville, IN
Tel: 317-773-8323
Fax: 317-773-5453
China - Shenzhen
Tel: 86-755-8864-2200
Fax: 86-755-8203-1760
Taiwan - Hsin Chu
Tel: 886-3-5778-366
Fax: 886-3-5770-955
Los Angeles
Mission Viejo, CA
Tel: 949-462-9523
Fax: 949-462-9608
China - Wuhan
Tel: 86-27-5980-5300
Fax: 86-27-5980-5118
Taiwan - Kaohsiung
Tel: 886-7-213-7828
Taiwan - Taipei
Tel: 886-2-2508-8600
Fax: 886-2-2508-0102
New York, NY
Tel: 631-435-6000
China - Xian
Tel: 86-29-8833-7252
Fax: 86-29-8833-7256
San Jose, CA
Tel: 408-735-9110
Thailand - Bangkok
Tel: 66-2-694-1351
Fax: 66-2-694-1350
Canada - Toronto
Tel: 905-673-0699
Fax: 905-673-6509
07/14/15
2009 - 2015 Microchip Technology Inc.
DS00002005A-page 43
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