1N6472US [MICROSEMI]

VOIDLESS HERMETICALLY SEALED SURFACE MOUNT UNDIRECTIONAL TRANSIENT SUPPRESSORS; 无空隙气密封装表面贴装无方向性瞬态抑制器
1N6472US
型号: 1N6472US
厂家: Microsemi    Microsemi
描述:

VOIDLESS HERMETICALLY SEALED SURFACE MOUNT UNDIRECTIONAL TRANSIENT SUPPRESSORS
无空隙气密封装表面贴装无方向性瞬态抑制器

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1N6469US thru 1N6476US  
Voidless-Hermetically-Sealed Surface  
Mount Unidirectional Transient  
Suppressors  
S C O T T S D A L E D I V I S I O N  
DESCRIPTION  
APPEARANCE  
This surface mount series of industry recognized voidless-hermetically-sealed  
Unidirectional Transient Voltage Suppressor (TVS) designs is military qualified to MIL-  
PRF-19500/552 and are ideal for high-reliability applications where a failure cannot be  
tolerated. They provide a Working Peak “Standoff” Voltage selection from 5.0 to 51.6  
Volts with 1500 W ratings. They are very robust in hard-glass construction and also  
use an internal metallurgical bond identified as Category I for high reliability  
applications. The 1500 W series is military qualified to MIL-PRF-19500/552. These  
devices are also available in axial-leaded packages for thru-hole mounting by deleting  
the “US” suffix (see separate data sheet for 1N6469 thru 1N6476A). Microsemi also  
offers numerous other TVS products to meet higher and lower peak pulse power and  
voltage ratings in both through-hole and surface-mount packages.  
Package “G”  
(or “D-5C”)  
IMPORTANT: For the most current data, consult MICROSEMI’s website: http://www.microsemi.com  
FEATURES  
APPLICATIONS / BENEFITS  
High surge current and peak pulse power provides  
Military and other high reliability transient protection  
Extremely robust construction  
transient voltage protection for sensitive circuits  
Triple-layer passivation  
Internal “Category I” metallurgical bonds  
Voidless hermetically sealed glass package  
JAN/TX/TXV military qualifications available per MIL-  
PRF-19500/552 by adding JAN, JANTX, or JANTXV  
prefix  
Further options for screening in accordance with MIL-  
PRF-19500 for JANS by using a “MSP” prefix, e.g.  
MSP6469, MSP6476, etc.  
Working Peak “Standoff” Voltage (VWM) from 5.0 to  
51.6 V  
Available as 1500 W Peak Pulse Power (PPP)  
ESD and EFT protection per IEC61000-4-2 and  
IEC61000-4-4 respectively  
Secondary lightning protection per select levels in  
IEC61000-4-5  
Square-end-cap terminals for easy mounting  
Nonsensitive to ESD per MIL-STD-750 Method  
Axial-leaded equivalents are also available (see  
1020  
separate data sheet for 1N6469 thru 1N6476)  
Inherently radiation hard as described in Microsemi  
MicroNote 050  
MAXIMUM RATINGS  
MECHANICAL AND PACKAGING  
Operating & Storage Temperature: -55oC to +175oC  
CASE: Hermetically sealed voidless hard glass  
Peak Pulse Power at 25oC: 1500 Watts @ 10/1000 µs  
(also see Figures 1,2 and 4)  
Impulse repetition rate (duty factor): 0.01%  
with Tungsten slugs  
TERMINATIONS: Axial-leads are Tin/Lead (Sn/Pb)  
over copper  
MARKING: Body painted and part number, etc.  
POLARITY: Cathode band  
Tape & Reel option: Standard per EIA-481-B  
Weight: 1100 mg  
See package dimensions on last page  
Forward Surge Current: 130 Amps@ 8.33 ms one-  
half sine wave  
Forward Voltage: 1.5 V @ 4 Amps dc and 4.8 V at  
100 Amps (pulsed)  
Steady-State Power: 3.0 W @ TA = 25oC (see note  
below and Figure 4)  
Thermal Resistance Junction to End Cap: 20.0 oC/W  
Solder Temperatures: 260oC for 10 s (maximum)  
NOTE: Steady-state power ratings with reference to ambient are for PC boards where thermal resistance from  
mounting point to ambient is sufficiently controlled where TJ(MAX) is not exceeded.  
Copyright 2004  
11-01-2004 REV A  
Microsemi  
Scottsdale Division  
Page 1  
8700 E. Thomas Rd. PO Box 1390, Scottsdale, AZ 85252 USA, (480) 941-6300, Fax: (480) 947-1503  
1N6469US thru 1N6476US  
Voidless-Hermetically-Sealed Surface  
Mount Unidirectional Transient  
Suppressors  
S C O T T S D A L E D I V I S I O N  
ELECTRICAL CHARACTERISTICS  
MAXIMUM  
CLAMPING  
VOLTAGE  
VC  
MAXIMUM  
PEAK PULSE  
CURRENT  
IPP  
BREAKDOWN  
MAXIMUM  
TEMP.  
BREAK  
DOWN  
VOLTAGE  
V(BR)  
MIN.  
WORKING  
MAX  
LEAKAGE  
CURRENT  
ID  
CURRENT  
PEAK  
VOLTAGE  
VWM  
I
TYPE  
COEF. OF  
V(BR)  
(BR)  
@ 10/1000 µs  
@8/20 µs  
@10/1000 µs  
Volts  
5.6  
mAdc  
50  
50  
10  
10  
5
Vdc  
5
V(pk)  
9.0  
A(pk)  
945  
775  
374  
322  
207  
181  
135  
107  
A(pk)  
167  
137  
66  
%/oC  
-.03, +0.04  
0.06  
µAdc  
500  
100  
20  
10  
5
1N6469US  
1N6470US  
1N6471US  
1N6472US  
1N6473US  
1N6474US  
1N6475US  
1N6476US  
6.5  
6
11.0  
22.6  
26.5  
41.4  
47.5  
63.5  
78.5  
13.6  
12  
0.085  
0.085  
.096  
16.4  
15  
57  
27.0  
24  
36.5  
32  
33.0  
1
30.5  
40.3  
51.6  
5
.098  
43.7  
1
5
24  
.101  
54.0  
1
5
19  
.103  
SYMBOLS & DEFINITIONS  
Symbol  
Definition  
VBR  
Minimum Breakdown Voltage: The minimum voltage the device will exhibit at a specified current.  
Working Peak Voltage: The maximum peak voltage that can be applied over the operating temperature range.  
This is also referred to as Standoff Voltage.  
VWM  
ID  
Maximum Standoff Current: The maximum current that will flow at the specified voltage and temperature.  
Maximum clamping voltage at specified IPP (Peak Pulse Current) at the specified pulse conditions.  
VC  
Peak Pulse Power: The peak power dissipation resulting from the peak impulse current IPP  
.
PPP  
GRAPHS  
Peak Value  
IPP  
Pulse time duration (tp) is  
defined as that point where  
I
P decays to 50% of peak  
value (IPP).  
time (t) in milliseconds  
FIG. 1 – Non-repetive peak pulse power rating curve  
NOTE: Peak power defined as peak voltage times peak current  
FIG. 2 Pulse wave form for exponential surge  
for 10/1000 µs  
Copyright 2004  
11-01-2004 REV A  
Microsemi  
Page 2  
Scottsdale Division  
8700 E. Thomas Rd. PO Box 1390, Scottsdale, AZ 85252 USA, (480) 941-6300, Fax: (480) 947-1503  
1N6469US thru 1N6476US  
Voidless-Hermetically-Sealed Surface  
Mount Unidirectional Transient  
Suppressors  
S C O T T S D A L E D I V I S I O N  
FIGURE 3  
T – Temperature – oC  
8/20 µs CURRENT IMPULSE WAVEFORM  
FIGURE 4  
DERATING CURVE  
PACKAGE DIMENSIONS Inches [mm]  
G-MELF-PKG (D-5C)  
Note: If mounting requires adhesive separate from the solder,  
an additional 0.090 inch diameter contact may be placed in the  
center between the pads as an optional spot for cement as  
shown in the pad layout.  
Copyright 2004  
Microsemi  
Scottsdale Division  
Page 3  
11-01-2004 REV A  
8700 E. Thomas Rd. PO Box 1390, Scottsdale, AZ 85252 USA, (480) 941-6300, Fax: (480) 947-1503  

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