5961-00-436-7826 [MICROSEMI]

Zener Diode, 47V V(Z), 5%, 10W;
5961-00-436-7826
型号: 5961-00-436-7826
厂家: Microsemi    Microsemi
描述:

Zener Diode, 47V V(Z), 5%, 10W

测试 二极管
文件: 总13页 (文件大小:48K)
中文:  中文翻译
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The documentation and process conversion  
measures necessary to comply with this  
INCH POUND  
revision shall be completed by 20 September 1997  
MIL-PRF-19500/124H  
20 June 1997  
SUPERSEDING  
MIL-S-19500/124G  
15 October 1992  
PERFORMANCE SPECIFICATION  
SEMICONDUCTOR DEVICE, DIODE, SILICON, VOLTAGE REGULATOR B AND RB  
TYPES 1N2970 THROUGH 1N2977, 1N2979, 1N2980, 1N2982, 1N2984  
THROUGH 1N2986, 1N2988 THROUGH 1N2993, 1N2995, 1N2997, 1N2999  
THROUGH 1N3005, 1N3007, 1N3008, 1N3009, 1N3011, 1N3012, 1N3014, 1N3015,  
PLUS A AND RA TYPES 1N3993 THROUGH 1N3998, JAN, JANTX, JANTXV, AND JANS  
This specification is approved for use by all Depart-  
ments and Agencies of the Department of Defense.  
1. SCOPE  
1.1 Scope. This specification covers the performance requirements for 10 watt, silicon, voltage regulator diodes: B type (standard  
polarity); RB type (reverse polarity). Four levels of product assurance are provided for each encapsulated device type as specified in  
MIL-PRF-19500.  
1.2 Physical dimensions. See figure 1 (D0-4).  
1.3 Maximum ratings. Maximum ratings are as shown in columns 4, 8, and 10 of table III herein and as follows:  
-65°C TJ +175°C; PT = 10 W at TC = +55°C; derate at .083 W/°C above +55°C.  
-65°C TSTG +200°C.  
1.4 Primary electrical characteristics. Primary electrical characteristics are as shown in columns 2, 9, 12, and 14 of table III herein,  
and as follows:  
Thermal resistance (RθJC) = 12°C/W maximum.  
Beneficial comments (recommendations, additions, deletions) and any pertinent data which may be of use in improving this document  
should be addressed to: Commander, Defense Supply Center Columbus, ATTN: DSCC-VAT, 3990 East Broad Street, Columbus, OH  
43216-5000, by using the Standardization Document Improvement Proposal (DD Form 1426) appearing at the end of this document or  
by letter.  
AMSC N/A  
FSC 5961  
DISTRIBUTION STATEMENT A. Approved for public release; distribution is unlimited.  
MIL-PRF-19500/124H  
2. APPLICABLE DOCUMENTS  
2.1 General. The documents listed in this section are specified in sections 3 and 4 of this specification. This section does not include  
documents cited in other sections of this specification or recommended for additional information or as examples. While every effort has  
been made to ensure the completeness of this list, document users are cautioned that they must meet all specified requirements  
documents cited in sections 3 and 4 of this specification, whether or not they are listed.  
2.2 Government documents.  
2.2.1 Specifications, standards, and handbooks. The following specifications, standards, and handbooks form a part of this document  
to the extent specified herein. Unless otherwise specified, the issues of these documents are those listed in the issue of the Department  
of Defense Index of Specifications and Standards (DODISS) and supplement thereto, cited in the solicitation (see 6.2).  
SPECIFICATION  
DEPARTMENT OF DEFENSE  
MIL-PRF-19500  
STANDARD  
MILITARY  
MIL-STD-750  
- Semiconductor Devices, General Specification for.  
-
Test Methods for Semiconductor Devices.  
(Unless otherwise indicated, copies of the above specifications, standards, and handbooks are available from the Standardization  
Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.)  
2.3 Order of precedence. In the event of a conflict between the text of this document and the references cited herein (except for  
related associated specifications or specification sheets), the text of this document takes precedence. Nothing in this document,  
however, supersedes applicable laws and regulations unless a specific exemption has been obtained.  
3. REQUIREMENTS  
3.1 Qualification. Devices furnished under this specification shall be products that are authorized by the qualifying activity for listing  
on the applicable qualified products list before contract award (see 4.2 and 6.3).  
3.2 Associated detail specification. The individual item performance requirements shall be in accordance with MIL-PRF-19500, and  
as specified herein.  
3.3 Abbreviations, symbols, and definitions. The abbreviations, symbols, and definitions used herein shall be as specified in  
MIL-PRF-19500.  
3.4 Design, construction, and physical dimensions. The design, construction, and physical dimensions for the purpose of  
interchangeability shall be as specified on figure 1 herein.  
a. Device types 1N2970B through 1N3015B and 1N3993RA through 1N3998RA shall have the anode connected to the stud.  
b. Device types 1N2970RB through 1N3015RB and 1N3993A through 1N3998A shall have the cathode connected to the stud.  
3.4.1 Lead finish. Unless otherwise specified, lead finish shall be solderable in accordance with MIL-PRF-19500, MIL-STD-750, and  
herein. Lead finish shall be gold, silver, or tin plated. Where a choice of lead finish is desired, it shall be specified in the contract (see  
6.2).  
3.4.2 Diode construction. These devices shall be constructed in a manner and using materials which enable the diodes to meet the  
applicable requirements of MIL-PRF-19500 and this document.  
3.5 Marking. Devices shall be marked as specified in MIL-PRF-19500.  
3.6 Reverse polarity. Reverse polarity units (see 3.3, a and b) shall be marked with an "R" preceding the "A" or "B" in the type  
designation, as applicable.  
2
MIL-PRF-19500/124H  
FIGURE 1. Physical dimensions.  
3
MIL-PRF-19500/124H  
Dimensions  
Symbol  
Inches  
Millimeters  
Notes  
Min  
.300  
.012  
----  
.255  
.423  
.075  
.060  
.600  
.163  
----  
----  
.422  
----  
.060  
----  
Max  
Min  
7.62  
0.30  
----  
6.48  
10.74  
1.90  
1.52  
15.24  
4.14  
----  
----  
10.72  
----  
1.52  
----  
Max  
CH  
C
HF  
HF1  
E
HT  
HT1  
DAH  
UD  
SD  
m
SL  
SU  
t
.405  
10.29  
1.65  
12.83  
10.77  
11.13  
4.44  
4.44  
20.32  
4.80  
----  
6.35  
11.51  
1.98  
2.41  
----  
.065  
.505  
.424  
.438  
.175  
.175  
.800  
.189  
----  
.250  
.453  
.078  
.095  
----  
2
1
5
3
4
W
NOTES:  
1. Complete threads to extend to within 2.5 threads of seating plane.  
2. Chamfer on undercut on one or both ends of hexagonal base is optional.  
3. Angular orientation of this terminal is undefined.  
4. Length of incomplete or undercut threads of UD.  
5. 10-32- UNF-2A maximum pitch diameter of plated threads shall be basic pitch diameter .1697 (4.310 mm)  
reference. (Screw thread standards for Federal Services 1957) Handbook H28 P1.  
6. Metric equivalents are given for general information only.  
7. Dimensions are in inches.  
FIGURE 1. Physical dimensions. - Continued.  
4
MIL-PRF-19500/124H  
4. QUALITY ASSURANCE PROVISIONS  
4.1 Classification of inspections. The inspection requirements specified herein are classified as follows:  
a. Qualification inspection (see 4.2).  
b. Screening (see 4.3)  
c. Conformance inspection (see 4.4).  
4.2 Qualification inspection. Qualification inspection shall be in accordance with MIL-PRF-19500.  
4.3 Screening (JANS, JANTXV, JANTX levels only). Screening shall be in accordance with MIL-PRF-19500, appendix E, (table IV)  
and as specified herein. The following measurements shall be made in accordance with table I herein. Devices that exceed the limits of  
table I herein shall not be acceptable.  
Screen (see  
appendix E,  
table IV of  
Measurement  
MIL-PRF-19500)  
JANS level  
JANTX and JANTXV levels  
7.(b)  
9
MIL-STD-750, test method 1071,  
condition C, step 2  
MIL-STD-750, test method 1071,  
condition C, step 2  
IR and VZ (for devices with  
Not applicable  
IR and VZ  
VZ(nom) 10 V dc; see column 2  
of table III)  
11  
IR and VZ; IR = 100 percent of  
initial value or 1 of column 12 of  
table III, whichever is greater,  
VZ = ± 2.5 of initial value (for  
devices with VZ(nom) 10 V dc,  
see column 2 of table III)  
12  
13  
See 4.2.1  
See 4.2.1  
Subgroups 2, 3, and 4 of table I  
herein; IR = 100 percent of  
initial value or 1 of column 12 of  
table III, whichever is greater;  
VZ = ± 2.5 of initial value.  
Subgroup 2 of table I herein; IR  
= 100 percent of initial value  
or 1 of column 12 of table III,  
whichever is greater;  
VZ = ± 2.5 of initial value  
4.3.1 Power burn-in conditions. Power burn-in conditions are as follows:  
IZ = Column 15 of table III; VZ = Column 2 of table III; TC = 150 ± 5°C.  
4.4 Conformance inspection. Conformance inspection shall be in accordance with MIL-PRF-19500.  
4.4.1 Group A inspection. Group A inspection shall be conducted in accordance with appendix E, table V of MIL-PRF-19500 and  
table I herein. End-point electrical measurements shall be in accordance with the applicable steps of table IV herein.  
5
MIL-PRF-19500/124H  
4.4.2 Group B inspection. Group B inspection shall be conducted in accordance with the conditions specified for subgroup testing in  
appendix E, table VIa (JANS) and table VIb (JAN, JANTX, and JANTXV), of MIL-PRF-19500, and as follows. Electrical measurements  
(end points) and delta requirements shall be in accordance with the applicable steps of table II herein.  
4.4.3.1 Group B inspection, appendix E, table Via of MIL-PRF-19500.  
Subgroup  
B2  
Method  
2026  
Conditions  
Dwell time = 10 ± 1 s; immersion to cover flat portion of terminal  
only.  
B4  
B5  
B6  
1037  
1027  
4081  
IZ = column 8 of table III, ton = toff = 3 minutes minimum for 2,000  
cycles. TC = 30 ± 3°C.  
IZ = column 15 of table III for 96 hours, TA = +125°C or adjusted, as  
required, to give an average lot TJ = +225°C  
RθJC = 12°C/W maximum, TC = 30 ± 3°C. For purposes of this test  
“junction to case" shall be used in lieu of "junction to lead" and  
"Rθ " shall be used in lieu of "RθJL". The case shall be the  
JC  
reference point for calculation of junction to case thermal resistance  
(RθJC). The mounting arrangement shall be with heat sink to case.  
4.4.3.2 Group B inspection, appendix E, table VIb of MIL-PRF-19500.  
Subgroup  
Method  
4066  
Conditions  
B2  
B3  
B5  
IZSM = column 10 of table III.  
IZ = column 15 of table III, TC = 150 ±5°C.  
1027  
4081  
RθJC = 12°C/W maximum; TC = 30 ±3°C. For purposes of this test  
"junction to case" shall be used in lieu of "junction to lead" and "Rθ  
"
JC  
shall be used in lieu of "RθJL ".The case shall be the reference point for  
calculation of junction to case thermal resistance (RθJC). The mounting  
arrangement shall be with heat sink to case.  
B6  
1032  
TA = +200°C  
4.4.3 Group C inspection. Group C inspection shall be conducted in accordance with the conditions specified for subgroup testing in  
appendix E, table VII of MIL-PRF-19500 and as follows. Electrical measurements (end points) and delta requirements shall be in  
accordance with the applicable steps of table II herein.  
4.4.3.1 Group C inspection, appendix E, table VII of MIL-PRF-19500.  
Subgroup  
C2  
Method  
2036  
2036  
2036  
2036  
1026  
Conditions  
Tension: Test condition A; 20 pounds; t = 15 ± 3 s.  
Torque (terminal): Test condition D1; 10 ounce-inch; t = 15 ± 3 s.  
Torque (stud): Test condition D2; 15 pound-inch; t = 30 ± 3 s.  
Bending stress: Test condition F; 3 pounds; t = 15 ± 3 s, method B.  
IZ = column 15 of table III, TC = +150 ± 5°C.  
C2  
C2  
C2  
C6  
6
MIL-PRF-19500/124H  
4.5 Methods of inspection. Methods of inspection shall be as specified in the appropriate tables and as follows:  
4.5.1 Surge current IZSM. The currents specified in column 10 of table III shall be applied in the reverse direction and shall be  
superimposed on the current (IZ = column 5 of table III) a total of five surges at 1-minute intervals. Each individual surge shall be a one-  
half square wave pulse of 1/120-second duration or an equivalent one-half sine wave with the same effective (rms) current.  
4.5.2 Voltage regulation VZ(reg). A current at 10 percent of IZ (column 8) shall be maintained until thermal equilibrium is obtained, and  
the VZ shall then be increased to a level of 50 percent of IZ (column 8) and maintained at this level for a period of time until thermal  
equilibrium is obtained at which time the voltage change shall not exceed column 9 of table III. During this test, the case temperature (TC)  
of the diode shall be equal to 30 ± 3°C.  
4.5.3 Regulator voltage. The IZ test current (column 5 of table III) shall be applied until thermal equilibrium is obtained prior to reading  
the regulator voltage. During this test, the case temperature (TC) of the diode shall be equal to 30 ± 3°C.  
4.5.4 Temperature coefficient of regulator voltage (αVZ). The device shall be temperature stabilized with current applied prior to  
reading regulator voltage at the specified case temperatures.  
4.5.5 Inspection condition. Unless otherwise specified in MIL-PRF-19500 or herein, all inspections shall be made at case temperature  
(TC) of 30 ± 3°C.  
7
MIL-PRF-19500/124H  
TABLE I. Group A inspection.  
MIL-STD-750  
Limits 2/  
Inspection 1/  
Subgroup 1  
Symbol  
Unit  
Method  
2071  
Conditions  
MIn  
Max  
Visual and mechanical  
inspection  
Subgroup 2  
Forward voltage  
Reverse current  
4011  
4016  
IF = 2 A dc  
VF  
IR1  
1.5  
V dc  
VR = column 11 of table III,  
DC method  
column 12 A dc  
Regulator voltage  
(see 4.5.3)  
4022  
IZ = column 5 of table III  
VZ  
column 3  
column 4  
V dc  
Subgroup 3  
High temperature  
operation  
TA = +150°C  
Reverse current  
Subgroup 4  
4016  
DC method VR = column 11 of  
table III  
IR2  
500  
µA dc  
Small-signal break-  
down impedance  
4051  
4051  
IZ = column 5 of table III;  
ZZ  
column 6  
column 7  
ohms  
ohms  
Isig = 10 IZ  
Knee impedance  
Subgroup 5  
IZK = 1 mA dc, Isig = 10 IZK  
ZZK  
Not applicable  
Subgroup 6  
JANS level only  
Surge current  
(see 4.5.1)  
4066  
TC = +25°C; IZSM = column 10 of  
table III  
End-point electrical  
measurements  
See table II, steps 1, 3, and 4  
Subgroup 7  
JANS level only  
VZ(reg)  
Voltage regulation  
(see 4.5.2)  
column 9  
V dc  
Temperature  
coefficient of  
breakdown voltage  
(see 4.5.4)  
4071  
IZ = column 5 of table III;  
T1 = 30°C; T2 = T1 +100°C  
αVZ  
column 14 %/°C  
1/ For sampling plan, see MIL-PRF-19500.  
2/ Column references are to table III herein.  
8
MIL-PRF-19500/124H  
TABLE II. Groups B and C electrical measurements. 1/ 2/ 3/  
MIL-STD-750  
Limits 4/  
Step  
Inspection  
Symbol  
Unit  
Method  
4016  
Conditions  
Min  
Max  
1.  
2.  
Reverse current  
Reverse current  
Breakdown voltage  
DC method; VR  
= column 11 of table III  
IR1  
column 12  
column 13  
column 4  
A dc  
A dc  
4016  
DC method; VR  
= column 11 of table III  
IR1  
3.  
4.  
4022  
4051  
IZ = column 5 of table III  
VZ  
ZZ  
column 3  
V dc  
Small-signal break-  
down impedance  
IZ = column 5 of table III;  
sig = 10 IZ  
column  
6
ohms  
I
5.  
6.  
Knee impedance  
Forward voltage  
4051  
4011  
I
I
ZK = 1 mA dc  
sig = 10 IZK  
ZZK  
column  
7
ohms  
IF = 2 A dc  
VF 5/  
± 50 mV dc change  
from previously  
measured value  
1/ The electrical measurements for appendix E, table VIa (JANS) of MIL-PRF-19500 are as follows:  
a. Subgroup 3, see table II herein, steps 1, 3, 4, 5 and 6.  
b. Subgroup 4, see table II herein, steps 1, 3, 4, 5 and 6.  
c. Subgroup 5, see table II herein, steps 2, 3, 4, 5 and 6.  
2/ The electrical measurements for appendix E, table VIb (JANTX and JANTXV) of MIL-PRF-19500 are as follows:  
a. Subgroup 2, see table II herein, steps 1, 3 and 4.  
b. Subgroup 3, see table II herein, steps 2, 3 and 4.  
c. Subgroup 6, see table II herein, steps 2, 3 and 4.  
3/ The electrical measurements for appendix E, table VII of MIL-PRF-19500 are as follows:  
a. Subgroup 2, see table II herein, steps 1, 3, 4, 5 and 6 (JANS) and steps 1, 3 and 4 (JAN, JANTX and JANTXV).  
b. Subgroup 3, see table II herein, steps 1, 3, 4, 5 and 6 (JANS), 1, 3 and 4 (JAN, JANTX and JANTXV).  
c. Subgroup 6, see table II herein, steps 2, 3, 4, 5 and 6 (JANS) steps 2, 3 and 4 (JAN, JANTX and JANTXV).  
4/ Column references are to table III.  
5/ Devices which exceed the group A limits for this test shall not be accepted.  
9
MIL-PRF-19500/124H  
5. PACKAGING  
5.1 Packaging. Packaging shall prevent mechanical damage of the devices during shipping and handling and shall not be detrimental  
to the device. When actual packaging of material is to be performed by DoD personnel, these personnel need to contact the responsible  
packaging activity to ascertain requisite packaging requirements. Packaging requirements are maintained by the Inventory Control Points'  
packaging activity within the Military Department or Defense Agency, or within the Military Departments' System Command. Packaging  
data retrieval is available from the managing Military Departments' or Defense Agency's automated packaging files, CD-ROM products, or  
by contacting the responsible packaging activity.  
5.2 Marking. Unless otherwise specified (see 6.2), marking shall be in accordance with MIL-STD-129.  
6. NOTES  
(This section contains information of a general or explanatory nature that may be helpful, but is not mandatory.)  
6.1 Notes. The notes specified in MIL-PRF-19500 are applicable to this specification.  
6.2 Acquisition requirements. See MIL- PRF-19500.  
6.3 Qualification. With respect to products requiring qualification, awards will be made only for products which are, at the time of  
award of contract, qualified for inclusion in Qualified Products List QPL No.19500 whether or not such products have actually been so  
listed by that date. The attention of the contractors is called to these requirements, and manufacturers are urged to arrange to have the  
products that they propose to offer to the Federal Government tested for qualification in order that they may be eligible to be awarded  
contracts or purchase orders for the products covered by this specification. Information pertaining to qualification of products may be  
obtained from Commander, Defense Supply Center Columbus, ATTN: DSCC-VQE, 3990 East Broad Street, Columbus, OH  
43216-5000.  
6.3.1 Substitutability. The following parts are acceptable substitutions for types 1N3999 and 1N4000, which are no longer available:  
Part number  
required substitute  
1N3999A  
1N3999RA  
1N4000A  
1N4000RA  
1N2970RB  
1N2970B  
1N2971RB  
1N2971B  
6.4 Changes from previous issue. Marginal notations are not used in this revision to identify changes with respect to the previous  
issue due to the extent of the changes.  
6.4 MIL-S-19500/272 for Part or Identifying Number (PIN) 1N3993A, RA through 1N4000A, RA has been obsoleted. PINs 1N3993A,  
RA through 1N3998A, RA have been incorporated into MIL-PRF-19500/124. PINs 1N3999A, RA and 1N4000A, RA have been deleted,  
as they are redundant to 1N2970RB, B and 1N2971RB, B respectively.  
Custodians:  
Army - CR  
Navy - EC  
Preparing activity:  
DLA - CC  
Air Force - 17  
NASA - NA  
Review activities:  
(Project 5961-1873)  
Army - AR, MI, SM  
Navy - AS, CG, MC  
Air Force - 13, 15, 19, 85, 99  
12  
STANDARDIZATION DOCUMENT IMPROVEMENT PROPOSAL  
INSTRUCTIONS  
1. The preparing activity must complete blocks 1, 2, 3, and 8. In block 1, both the document number and revision  
letter should be given.  
2. The submitter of this form must complete blocks 4, 5, 6, and 7.  
3. The preparing activity must provide a reply within 30 days from receipt of the form.  
NOTE: This form may not be used to request copies of documents, nor to request waivers, or clarification of  
requirements on current contracts. Comments submitted on this form do not constitute or imply authorization to  
waive any portion of the referenced document(s) or to amend contractual requirements.  
I RECOMMEND A CHANGE:  
1. DOCUMENT NUMBER  
MIL-PRF-19500/124H  
2. DOCUMENT DATE (YYMMDD)  
970620  
3. DOCUMENT TITLE  
SEMICONDUCTOR DEVICE, DIODE, SILICON, VOLTAGE REGULATOR B AND RB, TYPES 1N2970 THROUGH 1N2977, 1N2979,  
1N2980, 1N2982, 1N2984 THROUGH 1N2986, 1N2988 THROUGH 1N2993, 1N2995, 1N2997, 1N2999 THROUGH 1N3005, 1N3007,  
1N3008, 1N3009, 1N3011, 1N3012, 1N3014, 1N3015, PLUS A AND RA TYPES 1N3993 THROUGH 1N3998, JAN, JANTXV, AND JANS  
4. NATURE OF CHANGE (Identify paragraph number and include proposed rewrite, if possible. Attach extra sheets as needed.)  
5. REASON FOR RECOMMENDATION  
6. SUBMITTER  
a. NAME (Last, First, Middle initial)  
b. ORGANIZATION  
c. ADDRESS (Include Zip Code)  
d. TELEPHONE (Include Area Code)  
(1) Commercial  
7. DATE SUBMITTED  
(YYMMDD)  
(2) AUTOVON  
(If applicable)  
8. PREPARING ACTIVITY  
a. NAME Alan Barone  
b. TELEPHONE (Include Area Code)  
(1) Commercial  
614-962-0510  
(2) AUTOVON  
850-0510  
c. ADDRESS (Include Zip Code)  
IF YOU DO NOT RECEIVE A REPLY WITHIN 45 DAYS, CONTACT:  
Defense Quality and Standardization Office  
5203 Leesburg Pike, Suite 1403, Falls Church, VA 22041-3466  
Telephone (703) 756-2340 AUTOVON 289-2340  
Commander, Defense Supply Center  
Columbus, ATTN: DSCC-VAT, 3990 East  
Broad Street, Columbus, OH 43216-5000  
DD Form 1426, OCT 89  
Previous editions are obsolete  
198/290  

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