5961-00-436-7826 [MICROSEMI]
Zener Diode, 47V V(Z), 5%, 10W;型号: | 5961-00-436-7826 |
厂家: | Microsemi |
描述: | Zener Diode, 47V V(Z), 5%, 10W 测试 二极管 |
文件: | 总13页 (文件大小:48K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
The documentation and process conversion
measures necessary to comply with this
INCH POUND
revision shall be completed by 20 September 1997
MIL-PRF-19500/124H
20 June 1997
SUPERSEDING
MIL-S-19500/124G
15 October 1992
PERFORMANCE SPECIFICATION
SEMICONDUCTOR DEVICE, DIODE, SILICON, VOLTAGE REGULATOR B AND RB
TYPES 1N2970 THROUGH 1N2977, 1N2979, 1N2980, 1N2982, 1N2984
THROUGH 1N2986, 1N2988 THROUGH 1N2993, 1N2995, 1N2997, 1N2999
THROUGH 1N3005, 1N3007, 1N3008, 1N3009, 1N3011, 1N3012, 1N3014, 1N3015,
PLUS A AND RA TYPES 1N3993 THROUGH 1N3998, JAN, JANTX, JANTXV, AND JANS
This specification is approved for use by all Depart-
ments and Agencies of the Department of Defense.
1. SCOPE
1.1 Scope. This specification covers the performance requirements for 10 watt, silicon, voltage regulator diodes: B type (standard
polarity); RB type (reverse polarity). Four levels of product assurance are provided for each encapsulated device type as specified in
MIL-PRF-19500.
1.2 Physical dimensions. See figure 1 (D0-4).
1.3 Maximum ratings. Maximum ratings are as shown in columns 4, 8, and 10 of table III herein and as follows:
-65°C ≤ TJ ≤+175°C; PT = 10 W at TC = +55°C; derate at .083 W/°C above +55°C.
-65°C ≤ TSTG ≤ +200°C.
1.4 Primary electrical characteristics. Primary electrical characteristics are as shown in columns 2, 9, 12, and 14 of table III herein,
and as follows:
Thermal resistance (RθJC) = 12°C/W maximum.
Beneficial comments (recommendations, additions, deletions) and any pertinent data which may be of use in improving this document
should be addressed to: Commander, Defense Supply Center Columbus, ATTN: DSCC-VAT, 3990 East Broad Street, Columbus, OH
43216-5000, by using the Standardization Document Improvement Proposal (DD Form 1426) appearing at the end of this document or
by letter.
AMSC N/A
FSC 5961
DISTRIBUTION STATEMENT A. Approved for public release; distribution is unlimited.
MIL-PRF-19500/124H
2. APPLICABLE DOCUMENTS
2.1 General. The documents listed in this section are specified in sections 3 and 4 of this specification. This section does not include
documents cited in other sections of this specification or recommended for additional information or as examples. While every effort has
been made to ensure the completeness of this list, document users are cautioned that they must meet all specified requirements
documents cited in sections 3 and 4 of this specification, whether or not they are listed.
2.2 Government documents.
2.2.1 Specifications, standards, and handbooks. The following specifications, standards, and handbooks form a part of this document
to the extent specified herein. Unless otherwise specified, the issues of these documents are those listed in the issue of the Department
of Defense Index of Specifications and Standards (DODISS) and supplement thereto, cited in the solicitation (see 6.2).
SPECIFICATION
DEPARTMENT OF DEFENSE
MIL-PRF-19500
STANDARD
MILITARY
MIL-STD-750
- Semiconductor Devices, General Specification for.
-
Test Methods for Semiconductor Devices.
(Unless otherwise indicated, copies of the above specifications, standards, and handbooks are available from the Standardization
Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.)
2.3 Order of precedence. In the event of a conflict between the text of this document and the references cited herein (except for
related associated specifications or specification sheets), the text of this document takes precedence. Nothing in this document,
however, supersedes applicable laws and regulations unless a specific exemption has been obtained.
3. REQUIREMENTS
3.1 Qualification. Devices furnished under this specification shall be products that are authorized by the qualifying activity for listing
on the applicable qualified products list before contract award (see 4.2 and 6.3).
3.2 Associated detail specification. The individual item performance requirements shall be in accordance with MIL-PRF-19500, and
as specified herein.
3.3 Abbreviations, symbols, and definitions. The abbreviations, symbols, and definitions used herein shall be as specified in
MIL-PRF-19500.
3.4 Design, construction, and physical dimensions. The design, construction, and physical dimensions for the purpose of
interchangeability shall be as specified on figure 1 herein.
a. Device types 1N2970B through 1N3015B and 1N3993RA through 1N3998RA shall have the anode connected to the stud.
b. Device types 1N2970RB through 1N3015RB and 1N3993A through 1N3998A shall have the cathode connected to the stud.
3.4.1 Lead finish. Unless otherwise specified, lead finish shall be solderable in accordance with MIL-PRF-19500, MIL-STD-750, and
herein. Lead finish shall be gold, silver, or tin plated. Where a choice of lead finish is desired, it shall be specified in the contract (see
6.2).
3.4.2 Diode construction. These devices shall be constructed in a manner and using materials which enable the diodes to meet the
applicable requirements of MIL-PRF-19500 and this document.
3.5 Marking. Devices shall be marked as specified in MIL-PRF-19500.
3.6 Reverse polarity. Reverse polarity units (see 3.3, a and b) shall be marked with an "R" preceding the "A" or "B" in the type
designation, as applicable.
2
MIL-PRF-19500/124H
FIGURE 1. Physical dimensions.
3
MIL-PRF-19500/124H
Dimensions
Symbol
Inches
Millimeters
Notes
Min
.300
.012
----
.255
.423
.075
.060
.600
.163
----
----
.422
----
.060
----
Max
Min
7.62
0.30
----
6.48
10.74
1.90
1.52
15.24
4.14
----
----
10.72
----
1.52
----
Max
CH
C
HF
HF1
E
HT
HT1
DAH
UD
SD
m
SL
SU
t
.405
10.29
1.65
12.83
10.77
11.13
4.44
4.44
20.32
4.80
----
6.35
11.51
1.98
2.41
----
.065
.505
.424
.438
.175
.175
.800
.189
----
.250
.453
.078
.095
----
2
1
5
3
4
W
NOTES:
1. Complete threads to extend to within 2.5 threads of seating plane.
2. Chamfer on undercut on one or both ends of hexagonal base is optional.
3. Angular orientation of this terminal is undefined.
4. Length of incomplete or undercut threads of UD.
5. 10-32- UNF-2A maximum pitch diameter of plated threads shall be basic pitch diameter .1697 (4.310 mm)
reference. (Screw thread standards for Federal Services 1957) Handbook H28 P1.
6. Metric equivalents are given for general information only.
7. Dimensions are in inches.
FIGURE 1. Physical dimensions. - Continued.
4
MIL-PRF-19500/124H
4. QUALITY ASSURANCE PROVISIONS
4.1 Classification of inspections. The inspection requirements specified herein are classified as follows:
a. Qualification inspection (see 4.2).
b. Screening (see 4.3)
c. Conformance inspection (see 4.4).
4.2 Qualification inspection. Qualification inspection shall be in accordance with MIL-PRF-19500.
4.3 Screening (JANS, JANTXV, JANTX levels only). Screening shall be in accordance with MIL-PRF-19500, appendix E, (table IV)
and as specified herein. The following measurements shall be made in accordance with table I herein. Devices that exceed the limits of
table I herein shall not be acceptable.
Screen (see
appendix E,
table IV of
Measurement
MIL-PRF-19500)
JANS level
JANTX and JANTXV levels
7.(b)
9
MIL-STD-750, test method 1071,
condition C, step 2
MIL-STD-750, test method 1071,
condition C, step 2
IR and VZ (for devices with
Not applicable
IR and VZ
VZ(nom) ≥ 10 V dc; see column 2
of table III)
11
IR and VZ; ∆IR = 100 percent of
initial value or 1 of column 12 of
table III, whichever is greater,
∆VZ = ± 2.5 of initial value (for
devices with VZ(nom) ≥ 10 V dc,
see column 2 of table III)
12
13
See 4.2.1
See 4.2.1
Subgroups 2, 3, and 4 of table I
herein; ∆IR = 100 percent of
initial value or 1 of column 12 of
table III, whichever is greater;
∆VZ = ± 2.5 of initial value.
Subgroup 2 of table I herein; ∆IR
= 100 percent of initial value
or 1 of column 12 of table III,
whichever is greater;
∆VZ = ± 2.5 of initial value
4.3.1 Power burn-in conditions. Power burn-in conditions are as follows:
IZ = Column 15 of table III; VZ = Column 2 of table III; TC = 150 ± 5°C.
4.4 Conformance inspection. Conformance inspection shall be in accordance with MIL-PRF-19500.
4.4.1 Group A inspection. Group A inspection shall be conducted in accordance with appendix E, table V of MIL-PRF-19500 and
table I herein. End-point electrical measurements shall be in accordance with the applicable steps of table IV herein.
5
MIL-PRF-19500/124H
4.4.2 Group B inspection. Group B inspection shall be conducted in accordance with the conditions specified for subgroup testing in
appendix E, table VIa (JANS) and table VIb (JAN, JANTX, and JANTXV), of MIL-PRF-19500, and as follows. Electrical measurements
(end points) and delta requirements shall be in accordance with the applicable steps of table II herein.
4.4.3.1 Group B inspection, appendix E, table Via of MIL-PRF-19500.
Subgroup
B2
Method
2026
Conditions
Dwell time = 10 ± 1 s; immersion to cover flat portion of terminal
only.
B4
B5
B6
1037
1027
4081
IZ = column 8 of table III, ton = toff = 3 minutes minimum for 2,000
cycles. TC = 30 ± 3°C.
IZ = column 15 of table III for 96 hours, TA = +125°C or adjusted, as
required, to give an average lot TJ = +225°C
RθJC = 12°C/W maximum, TC = 30 ± 3°C. For purposes of this test
“junction to case" shall be used in lieu of "junction to lead" and
"Rθ " shall be used in lieu of "RθJL". The case shall be the
JC
reference point for calculation of junction to case thermal resistance
(RθJC). The mounting arrangement shall be with heat sink to case.
4.4.3.2 Group B inspection, appendix E, table VIb of MIL-PRF-19500.
Subgroup
Method
4066
Conditions
B2
B3
B5
IZSM = column 10 of table III.
IZ = column 15 of table III, TC = 150 ±5°C.
1027
4081
RθJC = 12°C/W maximum; TC = 30 ±3°C. For purposes of this test
"junction to case" shall be used in lieu of "junction to lead" and "Rθ
"
JC
shall be used in lieu of "RθJL ".The case shall be the reference point for
calculation of junction to case thermal resistance (RθJC). The mounting
arrangement shall be with heat sink to case.
B6
1032
TA = +200°C
4.4.3 Group C inspection. Group C inspection shall be conducted in accordance with the conditions specified for subgroup testing in
appendix E, table VII of MIL-PRF-19500 and as follows. Electrical measurements (end points) and delta requirements shall be in
accordance with the applicable steps of table II herein.
4.4.3.1 Group C inspection, appendix E, table VII of MIL-PRF-19500.
Subgroup
C2
Method
2036
2036
2036
2036
1026
Conditions
Tension: Test condition A; 20 pounds; t = 15 ± 3 s.
Torque (terminal): Test condition D1; 10 ounce-inch; t = 15 ± 3 s.
Torque (stud): Test condition D2; 15 pound-inch; t = 30 ± 3 s.
Bending stress: Test condition F; 3 pounds; t = 15 ± 3 s, method B.
IZ = column 15 of table III, TC = +150 ± 5°C.
C2
C2
C2
C6
6
MIL-PRF-19500/124H
4.5 Methods of inspection. Methods of inspection shall be as specified in the appropriate tables and as follows:
4.5.1 Surge current IZSM. The currents specified in column 10 of table III shall be applied in the reverse direction and shall be
superimposed on the current (IZ = column 5 of table III) a total of five surges at 1-minute intervals. Each individual surge shall be a one-
half square wave pulse of 1/120-second duration or an equivalent one-half sine wave with the same effective (rms) current.
4.5.2 Voltage regulation VZ(reg). A current at 10 percent of IZ (column 8) shall be maintained until thermal equilibrium is obtained, and
the VZ shall then be increased to a level of 50 percent of IZ (column 8) and maintained at this level for a period of time until thermal
equilibrium is obtained at which time the voltage change shall not exceed column 9 of table III. During this test, the case temperature (TC)
of the diode shall be equal to 30 ± 3°C.
4.5.3 Regulator voltage. The IZ test current (column 5 of table III) shall be applied until thermal equilibrium is obtained prior to reading
the regulator voltage. During this test, the case temperature (TC) of the diode shall be equal to 30 ± 3°C.
4.5.4 Temperature coefficient of regulator voltage (αVZ). The device shall be temperature stabilized with current applied prior to
reading regulator voltage at the specified case temperatures.
4.5.5 Inspection condition. Unless otherwise specified in MIL-PRF-19500 or herein, all inspections shall be made at case temperature
(TC) of 30 ± 3°C.
7
MIL-PRF-19500/124H
TABLE I. Group A inspection.
MIL-STD-750
Limits 2/
Inspection 1/
Subgroup 1
Symbol
Unit
Method
2071
Conditions
MIn
Max
Visual and mechanical
inspection
Subgroup 2
Forward voltage
Reverse current
4011
4016
IF = 2 A dc
VF
IR1
1.5
V dc
VR = column 11 of table III,
DC method
column 12 A dc
Regulator voltage
(see 4.5.3)
4022
IZ = column 5 of table III
VZ
column 3
column 4
V dc
Subgroup 3
High temperature
operation
TA = +150°C
Reverse current
Subgroup 4
4016
DC method VR = column 11 of
table III
IR2
500
µA dc
Small-signal break-
down impedance
4051
4051
IZ = column 5 of table III;
ZZ
column 6
column 7
ohms
ohms
Isig = 10 IZ
Knee impedance
Subgroup 5
IZK = 1 mA dc, Isig = 10 IZK
ZZK
Not applicable
Subgroup 6
JANS level only
Surge current
(see 4.5.1)
4066
TC = +25°C; IZSM = column 10 of
table III
End-point electrical
measurements
See table II, steps 1, 3, and 4
Subgroup 7
JANS level only
VZ(reg)
Voltage regulation
(see 4.5.2)
column 9
V dc
Temperature
coefficient of
breakdown voltage
(see 4.5.4)
4071
IZ = column 5 of table III;
T1 = 30°C; T2 = T1 +100°C
αVZ
column 14 %/°C
1/ For sampling plan, see MIL-PRF-19500.
2/ Column references are to table III herein.
8
MIL-PRF-19500/124H
TABLE II. Groups B and C electrical measurements. 1/ 2/ 3/
MIL-STD-750
Limits 4/
Step
Inspection
Symbol
Unit
Method
4016
Conditions
Min
Max
1.
2.
Reverse current
Reverse current
Breakdown voltage
DC method; VR
= column 11 of table III
IR1
column 12
column 13
column 4
A dc
A dc
4016
DC method; VR
= column 11 of table III
IR1
3.
4.
4022
4051
IZ = column 5 of table III
VZ
ZZ
column 3
V dc
Small-signal break-
down impedance
IZ = column 5 of table III;
sig = 10 IZ
column
6
ohms
I
5.
6.
Knee impedance
Forward voltage
4051
4011
I
I
ZK = 1 mA dc
sig = 10 IZK
ZZK
column
7
ohms
IF = 2 A dc
VF 5/
± 50 mV dc change
from previously
measured value
1/ The electrical measurements for appendix E, table VIa (JANS) of MIL-PRF-19500 are as follows:
a. Subgroup 3, see table II herein, steps 1, 3, 4, 5 and 6.
b. Subgroup 4, see table II herein, steps 1, 3, 4, 5 and 6.
c. Subgroup 5, see table II herein, steps 2, 3, 4, 5 and 6.
2/ The electrical measurements for appendix E, table VIb (JANTX and JANTXV) of MIL-PRF-19500 are as follows:
a. Subgroup 2, see table II herein, steps 1, 3 and 4.
b. Subgroup 3, see table II herein, steps 2, 3 and 4.
c. Subgroup 6, see table II herein, steps 2, 3 and 4.
3/ The electrical measurements for appendix E, table VII of MIL-PRF-19500 are as follows:
a. Subgroup 2, see table II herein, steps 1, 3, 4, 5 and 6 (JANS) and steps 1, 3 and 4 (JAN, JANTX and JANTXV).
b. Subgroup 3, see table II herein, steps 1, 3, 4, 5 and 6 (JANS), 1, 3 and 4 (JAN, JANTX and JANTXV).
c. Subgroup 6, see table II herein, steps 2, 3, 4, 5 and 6 (JANS) steps 2, 3 and 4 (JAN, JANTX and JANTXV).
4/ Column references are to table III.
5/ Devices which exceed the group A limits for this test shall not be accepted.
9
MIL-PRF-19500/124H
5. PACKAGING
5.1 Packaging. Packaging shall prevent mechanical damage of the devices during shipping and handling and shall not be detrimental
to the device. When actual packaging of material is to be performed by DoD personnel, these personnel need to contact the responsible
packaging activity to ascertain requisite packaging requirements. Packaging requirements are maintained by the Inventory Control Points'
packaging activity within the Military Department or Defense Agency, or within the Military Departments' System Command. Packaging
data retrieval is available from the managing Military Departments' or Defense Agency's automated packaging files, CD-ROM products, or
by contacting the responsible packaging activity.
5.2 Marking. Unless otherwise specified (see 6.2), marking shall be in accordance with MIL-STD-129.
6. NOTES
(This section contains information of a general or explanatory nature that may be helpful, but is not mandatory.)
6.1 Notes. The notes specified in MIL-PRF-19500 are applicable to this specification.
6.2 Acquisition requirements. See MIL- PRF-19500.
6.3 Qualification. With respect to products requiring qualification, awards will be made only for products which are, at the time of
award of contract, qualified for inclusion in Qualified Products List QPL No.19500 whether or not such products have actually been so
listed by that date. The attention of the contractors is called to these requirements, and manufacturers are urged to arrange to have the
products that they propose to offer to the Federal Government tested for qualification in order that they may be eligible to be awarded
contracts or purchase orders for the products covered by this specification. Information pertaining to qualification of products may be
obtained from Commander, Defense Supply Center Columbus, ATTN: DSCC-VQE, 3990 East Broad Street, Columbus, OH
43216-5000.
6.3.1 Substitutability. The following parts are acceptable substitutions for types 1N3999 and 1N4000, which are no longer available:
Part number
required substitute
1N3999A
1N3999RA
1N4000A
1N4000RA
1N2970RB
1N2970B
1N2971RB
1N2971B
6.4 Changes from previous issue. Marginal notations are not used in this revision to identify changes with respect to the previous
issue due to the extent of the changes.
6.4 MIL-S-19500/272 for Part or Identifying Number (PIN) 1N3993A, RA through 1N4000A, RA has been obsoleted. PINs 1N3993A,
RA through 1N3998A, RA have been incorporated into MIL-PRF-19500/124. PINs 1N3999A, RA and 1N4000A, RA have been deleted,
as they are redundant to 1N2970RB, B and 1N2971RB, B respectively.
Custodians:
Army - CR
Navy - EC
Preparing activity:
DLA - CC
Air Force - 17
NASA - NA
Review activities:
(Project 5961-1873)
Army - AR, MI, SM
Navy - AS, CG, MC
Air Force - 13, 15, 19, 85, 99
12
STANDARDIZATION DOCUMENT IMPROVEMENT PROPOSAL
INSTRUCTIONS
1. The preparing activity must complete blocks 1, 2, 3, and 8. In block 1, both the document number and revision
letter should be given.
2. The submitter of this form must complete blocks 4, 5, 6, and 7.
3. The preparing activity must provide a reply within 30 days from receipt of the form.
NOTE: This form may not be used to request copies of documents, nor to request waivers, or clarification of
requirements on current contracts. Comments submitted on this form do not constitute or imply authorization to
waive any portion of the referenced document(s) or to amend contractual requirements.
I RECOMMEND A CHANGE:
1. DOCUMENT NUMBER
MIL-PRF-19500/124H
2. DOCUMENT DATE (YYMMDD)
970620
3. DOCUMENT TITLE
SEMICONDUCTOR DEVICE, DIODE, SILICON, VOLTAGE REGULATOR B AND RB, TYPES 1N2970 THROUGH 1N2977, 1N2979,
1N2980, 1N2982, 1N2984 THROUGH 1N2986, 1N2988 THROUGH 1N2993, 1N2995, 1N2997, 1N2999 THROUGH 1N3005, 1N3007,
1N3008, 1N3009, 1N3011, 1N3012, 1N3014, 1N3015, PLUS A AND RA TYPES 1N3993 THROUGH 1N3998, JAN, JANTXV, AND JANS
4. NATURE OF CHANGE (Identify paragraph number and include proposed rewrite, if possible. Attach extra sheets as needed.)
5. REASON FOR RECOMMENDATION
6. SUBMITTER
a. NAME (Last, First, Middle initial)
b. ORGANIZATION
c. ADDRESS (Include Zip Code)
d. TELEPHONE (Include Area Code)
(1) Commercial
7. DATE SUBMITTED
(YYMMDD)
(2) AUTOVON
(If applicable)
8. PREPARING ACTIVITY
a. NAME Alan Barone
b. TELEPHONE (Include Area Code)
(1) Commercial
614-962-0510
(2) AUTOVON
850-0510
c. ADDRESS (Include Zip Code)
IF YOU DO NOT RECEIVE A REPLY WITHIN 45 DAYS, CONTACT:
Defense Quality and Standardization Office
5203 Leesburg Pike, Suite 1403, Falls Church, VA 22041-3466
Telephone (703) 756-2340 AUTOVON 289-2340
Commander, Defense Supply Center
Columbus, ATTN: DSCC-VAT, 3990 East
Broad Street, Columbus, OH 43216-5000
DD Form 1426, OCT 89
Previous editions are obsolete
198/290
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