5962-8871502PA [MICROSEMI]

Buffer/Inverter Based Peripheral Driver, 0.5A, CDIP8, CERAMIC, DIP-8;
5962-8871502PA
型号: 5962-8871502PA
厂家: Microsemi    Microsemi
描述:

Buffer/Inverter Based Peripheral Driver, 0.5A, CDIP8, CERAMIC, DIP-8

驱动 CD 接口集成电路
文件: 总11页 (文件大小:61K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
REVISIONS  
LTR  
A
DESCRIPTION  
DATE (YR-MO-DA)  
90-05-24  
APPROVED  
M. A. Frye  
Add device types 02 and 03. Add case outline P. Make changes to table I and  
editorial changes throughout.  
B
C
Make changes to tPLH, tPHL, tTLH, and tTHL tests as specified in table I herein. - ro  
Update drawing to current requirements. - drw  
00-06-21  
04-06-01  
R. Monnin  
R. Monnin  
REV  
SHEET  
REV  
SHEET  
REV STATUS  
OF SHEETS  
REV  
C
1
C
2
C
3
C
4
C
5
C
6
C
7
C
8
C
9
C
SHEET  
10  
PMIC N/A  
PREPARED BY  
Gary Zahn  
DEFENSE SUPPLY CENTER COLUMBUS  
COLUMBUS, OHIO 43218-3990  
http://www.dscc.dla.mil  
CHECKED BY  
Ray Monnin  
STANDARD  
MICROCIRCUIT  
DRAWING  
APPROVED BY  
Michael A. Frye  
THIS DRAWING IS AVAILABLE  
FOR USE BY ALL  
DEPARTMENTS  
AND AGENCIES OF THE  
DEPARTMENT OF DEFENSE  
MICROCIRCUIT, DIGITAL-LINEAR, DUAL  
PERIPHERAL NOR DRIVER, MONOLITHIC  
SILICON  
DRAWING APPROVAL DATE  
89-04-17  
AMSC N/A  
REVISION LEVEL  
C
SIZE  
A
CAGE CODE  
5962-88715  
67268  
SHEET  
1
OF  
10  
DSCC FORM 2233  
APR 97  
5962-E299-04  
1. SCOPE  
1.1 Scope. This drawing describes device requirements for MIL-STD-883 compliant, non-JAN class level B microcircuits in  
accordance with MIL-PRF-38535, appendix A.  
1.2 Part or Identifying Number (PIN). The complete PIN is as shown in the following example:  
5962-88715  
01  
P
A
Drawing number  
Device type  
(see 1.2.1)  
Case outline  
(see 1.2.2)  
Lead finish  
(see 1.2.3)  
1.2.1 Device types. The device types identify the circuit function as follows:  
Device type  
Generic number  
Circuit function  
01  
02  
03  
55454  
55464  
55474  
Dual peripheral NOR driver  
Dual peripheral NOR driver  
Dual peripheral NOR driver  
1.2.2 Case outlines. The case outlines are as designated in MIL-STD-1835 and as follows:  
Outline letter  
Descriptive designator  
Terminals  
Package style  
P
2
GDIP1-T8 or CDIP2-T8  
CQCC1-N20  
8
20  
Dual-in-line package  
Square leadless chip carrier  
1.2.3 Lead finish. The lead finish is as specified in MIL-PRF-38535, appendix A.  
1.3 Absolute maximum ratings.  
Supply voltage (V ) ............................................................................................ 7.0 V dc 1/  
CC  
Input voltage (V )................................................................................................. 5.5 V dc 2/  
IN  
Interemitter voltage (V ) .................................................................................... 5.5 V dc  
EM  
Offstate output voltage (V ):  
OO  
Device type 01 .................................................................................................. 30 V dc  
Device type 02 .................................................................................................. 35 V dc  
Device type 03 .................................................................................................. 70 V dc  
Continuous output current (I ) .......................................................................... 400 mA 3/  
OC  
Peak output current (I ):  
OP  
(t < 10 ms, duty cycle < 50 %)....................................................................... 500 mA 3/  
W
Continuous power dissipation (P ):  
D
Device types 01, 02, and 03 ............................................................................ 1375 mW 4/  
Junction temperature (T ) .................................................................................... +150°C  
J
Storage temperature range .................................................................................. -65°C to +150°C  
1/ Voltage values are with respect to ground.  
2/ This is the voltage between two emitters of a multiple-emitter transistor.  
3/ Both halves of these dual circuits may conduct rated current simultaneously; however, power dissipation average over  
a short time interval must fall within the continuous power dissipation ratings.  
4/ Device types 01, 02, and 03 derate above T = +25°C at 11.0 mW/°C.  
A
SIZE  
STANDARD  
MICROCIRCUIT DRAWING  
5962-88715  
A
DEFENSE SUPPLY CENTER COLUMBUS  
COLUMBUS, OHIO 43216-5000  
REVISION LEVEL  
C
SHEET  
2
DSCC FORM 2234  
APR 97  
1.3 Absolute maximum ratings – continued.  
Lead temperature (soldering, 10 seconds)........................................................... +300°C  
Thermal resistance, junction-to-case (θ )........................................................... See MIL-STD-1835  
JC  
1.4 Recommended operating conditions.  
Supply voltage range (V ) ................................................................................. +4.5 V dc to +5.5 V dc  
CC  
Minimum high level input voltage (V ) ................................................................ 2.0 V dc  
IH  
Maximum low level input voltage (V ) ................................................................. 0.8 V dc  
IL  
Ambient operating temperature range (T ) ......................................................... -55°C to +125°C  
A
2. APPLICABLE DOCUMENTS  
2.1 Government specification, standards, and handbooks. The following specification, standards, and handbooks form a part of  
this drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are those cited in the  
solicitation or contract.  
DEPARTMENT OF DEFENSE SPECIFICATION  
MIL-PRF-38535 - Integrated Circuits, Manufacturing, General Specification for.  
DEPARTMENT OF DEFENSE STANDARDS  
MIL-STD-883  
-
Test Method Standard Microcircuits.  
MIL-STD-1835 - Interface Standard Electronic Component Case Outlines.  
DEPARTMENT OF DEFENSE HANDBOOKS  
MIL-HDBK-103 - List of Standard Microcircuit Drawings.  
MIL-HDBK-780 - Standard Microcircuit Drawings.  
(Copies of these documents are available online at http://assist.daps.dla.mil;quicksearch/ or www.dodssp.daps.mil or from  
the Standardization Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.)  
2.2 Order of precedence. In the event of a conflict between the text of this drawing and the references cited herein, the text of  
this drawing takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a specific  
exemption has been obtained.  
SIZE  
STANDARD  
MICROCIRCUIT DRAWING  
5962-88715  
A
DEFENSE SUPPLY CENTER COLUMBUS  
COLUMBUS, OHIO 43216-5000  
REVISION LEVEL  
C
SHEET  
3
DSCC FORM 2234  
APR 97  
3. REQUIREMENTS  
3.1 Item requirements. The individual item requirements shall be in accordance with MIL-PRF-38535, appendix A for non-JAN  
class level B devices and as specified herein. Product built to this drawing that is produced by a Qualified Manufacturer Listing  
(QML) certified and qualified manufacturer or a manufacturer who has been granted transitional certification to MIL-PRF-38535  
may be processed as QML product in accordance with the manufacturers approved program plan and qualifying activity approval  
in accordance with MIL-PRF-38535. This QML flow as documented in the Quality Management (QM) plan may make  
modifications to the requirements herein. These modifications shall not affect form, fit, or function of the device. These  
modifications shall not affect the PIN as described herein. A "Q" or "QML" certification mark in accordance with MIL-PRF-38535 is  
required to identify when the QML flow option is used.  
3.2 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be as specified in  
MIL-PRF-38535, appendix A and herein.  
3.2.1 Case outlines. The case outlines shall be in accordance with 1.2.2 herein.  
3.2.2 Terminal connections. The terminal connections shall be as specified on figure .1  
3.2.3 Truth table. The truth table shall be as specified on figure 2.  
3.3 Electrical performance characteristics. Unless otherwise specified herein, the electrical performance characteristics are as  
specified in table I and shall apply over the full ambient operating temperature range.  
3.4 Electrical test requirements. The electrical test requirements shall be the subgroups specified in table II. The electrical tests  
for each subgroup are described in table I.  
3.5 Marking. Marking shall be in accordance with MIL-PRF-38535, appendix A. The part shall be marked with the PIN listed in  
1.2 herein. In addition, the manufacturer's PIN may also be marked. For packages where marking of the entire SMD PIN number  
is not feasible due to space limitations, the manufacturer has the option of not marking the "5962-" on the device.  
3.5.1 Certification/compliance mark. A compliance indicator “C” shall be marked on all non-JAN devices built in compliance to  
MIL-PRF-38535, appendix A. The compliance indicator “C” shall be replaced with a "Q" or "QML" certification mark in accordance  
with MIL-PRF-38535 to identify when the QML flow option is used.  
3.6 Certificate of compliance. A certificate of compliance shall be required from a manufacturer in order to be listed as an  
approved source of supply in MIL-HDBK-103 (see 6.6 herein). The certificate of compliance submitted to DSCC-VA prior to listing  
as an approved source of supply shall affirm that the manufacturer's product meets the requirements of MIL-PRF-38535, appendix  
A and the requirements herein.  
3.7 Certificate of conformance. A certificate of conformance as required in MIL-PRF-38535, appendix A shall be provided with  
each lot of microcircuits delivered to this drawing.  
3.8 Notification of change. Notification of change to DSCC-VA shall be required for any change that affects this drawing.  
3.9 Verification and review. DSCC, DSCC's agent, and the acquiring activity retain the option to review the manufacturer's  
facility and applicable required documentation. Offshore documentation shall be made available onshore at the option of the  
reviewer.  
SIZE  
STANDARD  
MICROCIRCUIT DRAWING  
5962-88715  
A
DEFENSE SUPPLY CENTER COLUMBUS  
COLUMBUS, OHIO 43216-5000  
REVISION LEVEL  
C
SHEET  
4
DSCC FORM 2234  
APR 97  
TABLE I. Electrical performance characteristics.  
Conditions  
-55°C T +125°C  
unless otherwise specified  
Group A  
subgroups  
Device  
type  
Limits  
Unit  
A
Test  
Symbol  
Min  
Max  
-1.5  
1,2,3  
1,2,3  
All  
01  
02  
03  
V
V
V
V
V
= 4.5 V, I = -12 mA  
I
Input clamp voltage  
IC  
CC  
CC  
300  
300  
300  
µA  
I
= 4.5 V,  
V
V
V
= 30 V  
= 35 V  
= 70 V  
High level output current  
OH  
OH  
OH  
OH  
= 0.8 V  
IL  
I
=
OL  
1,2,3  
1,2,3  
All  
0.5  
0.8  
V
V
V
= 4.5 V,  
Low level output voltage  
OL1  
CC  
100 mA  
I
=
OL  
V
I
V
V
= 2.0 V  
OL2  
IH  
300 mA  
All  
1.0  
40  
mA  
= 5.5 V  
V
V
= 5.5 V  
High level input current  
Low level input current  
IH1  
CC  
IN  
IN  
µA  
mA  
mA  
I
= 2.4 V  
IH2  
1,2,3  
1,2,3  
All  
01  
-1.6  
17  
I
V
V
= 5.5 V, V = 0.4 v  
IN  
IL  
CC  
CC  
High level supply current  
(outputs high)  
I
= 5.5 V, V = 0 V  
IN  
CCH  
02,03  
01  
19  
Low level supply current  
(output low)  
1,2,3  
79  
mA  
ns  
I
V
= 5.5 V, V = 5.0 V  
CC IN  
CCL  
02,03  
All  
85  
See 4.3.1c and figure 2  
= 5.0 V, I = 200 mA,  
7,8  
9
Functional tests  
Propagation delay time,  
low to high level output  
01  
35  
110  
135  
150  
90  
t
V
CC  
PLH  
O
02,03  
01  
C = 15 pF, R = 50 ,  
L
L
see figure 3  
10,11  
02,03  
01  
Propagation delay time,  
high to low level output  
9,10,11  
ns  
t
V
= 5.0 V, I = 200 mA  
CC O  
PHL  
C = 15 pF, R = 50 , see  
figure 3  
L
L
02,03  
110  
SIZE  
STANDARD  
MICROCIRCUIT DRAWING  
5962-88715  
A
DEFENSE SUPPLY CENTER COLUMBUS  
COLUMBUS, OHIO 43216-5000  
REVISION LEVEL  
C
SHEET  
5
DSCC FORM 2234  
APR 97  
TABLE I. Electrical performance characteristics - Continued.  
Conditions  
-55°C T +125°C  
unless otherwise specified  
Group A  
subgroups  
Device  
type  
Limits  
Unit  
ns  
A
Test  
Symbol  
Min  
Max  
25  
Transition time, low to high  
level output  
9
01  
02,03  
01  
t
V
= 5.0 V, I = 200 mA,  
CC O  
TLH  
30  
25  
30  
20  
35  
30  
35  
C = 15 pF, R = 50 ,  
L
L
see figure 3  
10,11  
9
02,03  
01  
Transition time, high to low  
level output  
ns  
t
V
= 5.0 V, I = 200 mA  
O
THL  
CC  
02,03  
01  
C = 15 pF, R = 50 ,  
L
L
see figure 3  
10,11  
02,03  
SIZE  
STANDARD  
MICROCIRCUIT DRAWING  
5962-88715  
A
DEFENSE SUPPLY CENTER COLUMBUS  
COLUMBUS, OHIO 43216-5000  
REVISION LEVEL  
C
SHEET  
6
DSCC FORM 2234  
APR 97  
Device types  
Case outlines  
01, 02, and 03  
P
2
Terminal  
number  
Terminal symbol  
1
2
1A  
1B  
NC  
1A  
3
1Y  
NC  
NC  
1B  
4
GND  
2Y  
5
6
2A  
NC  
1Y  
7
2B  
8
NC  
NC  
GND  
NC  
2Y  
V
CC  
9
---  
---  
---  
---  
---  
---  
---  
---  
---  
---  
---  
---  
10  
11  
12  
13  
14  
15  
16  
17  
18  
19  
20  
NC  
NC  
2A  
NC  
2B  
NC  
NC  
V
CC  
NC = No connection  
FIGURE 1. Terminal connections.  
Inputs  
Output  
Y
A
B
L
L
L
H
L
H (off state)  
L (on state)  
L (on state)  
L (on state)  
H
H
H
NOTES:  
Positive logic: Y = A + B or AB  
Truth table is for each driver.  
FIGURE 2. Truth table.  
SIZE  
STANDARD  
MICROCIRCUIT DRAWING  
5962-88715  
A
DEFENSE SUPPLY CENTER COLUMBUS  
COLUMBUS, OHIO 43216-5000  
REVISION LEVEL  
SHEET  
C
7
DSCC FORM 2234  
APR 97  
NOTES:  
1.  
2.  
Pulse generator characteristics: PRR 1.0 MHz, Z  
= 50 .  
OUT  
C = load capacitance and includes scope and jig capacitance.  
L
FIGURE 3. Switching times test circuit and waveforms.  
SIZE  
STANDARD  
MICROCIRCUIT DRAWING  
5962-88715  
A
DEFENSE SUPPLY CENTER COLUMBUS  
COLUMBUS, OHIO 43216-5000  
REVISION LEVEL  
C
SHEET  
8
DSCC FORM 2234  
APR 97  
4. VERIFICATION  
4.1 Sampling and inspection. Sampling and inspection procedures shall be in accordance with MIL-PRF-38535,  
appendix A.  
4.2 Screening. Screening shall be in accordance with method 5004 of MIL-STD-883, and shall be conducted on all devices  
prior to quality conformance inspection. The following additional criteria shall apply:  
a. Burn-in test, method 1015 of MIL-STD-883.  
(1) Test condition A, B, C, or D. The test circuit shall be maintained by the manufacturer under document revision level  
control and shall be made available to the preparing or acquiring activity upon request. The test circuit shall specify the  
inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specified in method 1015 of  
MIL-STD-883.  
(2) TA = +125°C, minimum.  
b. Interim and final electrical test parameters shall be as specified in table II herein, except interim electrical parameter tests  
prior to burn-in are optional at the discretion of the manufacturer.  
TABLE II. Electrical test requirements.  
Subgroups  
(in accordance with  
MIL-STD-883 test requirements  
MIL-STD-883, method 5005,  
table I)  
Interim electrical parameters  
- - -  
(method 5004)  
Final electrical test parameters  
1*, 2, 3, 7, 9  
(method 5004)  
Group A test requirements  
1, 2, 3, 7, 8, 9, 10, 11  
(method 5005)  
Groups C and D end-point  
electrical parameters  
(method 5005)  
1, 2, 3  
* PDA applies to subgroup 1.  
4.3 Quality conformance inspection. Quality conformance inspection shall be in accordance with method 5005 of MIL-STD-  
883 including groups A, B, C, and D inspections. The following additional criteria shall apply.  
4.3.1 Group A inspection.  
a. Tests shall be as specified in table II herein.  
b. Subgroups 4, 5, and 6 in table I, method 5005 of MIL-STD-883 shall be omitted.  
c. Subgroups 7 and 8 shall include verification of the truth table.  
SIZE  
STANDARD  
MICROCIRCUIT DRAWING  
5962-88715  
A
DEFENSE SUPPLY CENTER COLUMBUS  
COLUMBUS, OHIO 43216-5000  
REVISION LEVEL  
C
SHEET  
9
DSCC FORM 2234  
APR 97  
4.3.2 Groups C and D inspections.  
a. End-point electrical parameters shall be as specified in table II herein.  
b. Steady-state life test conditions, method 1005 of MIL-STD-883.  
(1) Test condition A, B, C, or D. The test circuit shall be maintained by the manufacturer under document revision level  
control and shall be made available to the preparing or acquiring activity upon request. The test circuit shall specify  
the inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specified in method  
1005 of MIL-STD-883.  
(2) TA = +125°C, minimum.  
(3) Test duration: 1,000 hours, except as permitted by method 1005 of MIL-STD-883.  
5. PACKAGING  
5.1 Packaging requirements. The requirements for packaging shall be in accordance with MIL-PRF-38535, appendix A.  
6. NOTES  
6.1 Intended use. Microcircuits conforming to this drawing are intended for use for Government microcircuit applications  
(original equipment), design applications, and logistics purposes.  
6.2 Replaceability. Microcircuits covered by this drawing will replace the same generic device covered by a contractor-prepared  
specification or drawing.  
6.3 Configuration control of SMD's. All proposed changes to existing SMD's will be coordinated with the users of record for the  
individual documents. This coordination will be accomplished using DD Form 1692, Engineering Change Proposal.  
6.4 Record of users. Military and industrial users shall inform Defense Supply Center Columbus (DSCC) when a system  
application requires configuration control and the applicable SMD. DSCC will maintain a record of users and this list will be used  
for coordination and distribution of changes to the drawings. Users of drawings covering microelectronics devices (FSC 5962)  
should contact DSCC-VA, telephone (614) 692-0544.  
6.5 Comments. Comments on this drawing should be directed to DSCC-VA, Columbus, Ohio 43218-3990, or telephone (614)  
692-0547.  
6.6 Approved sources of supply. Approved sources of supply are listed in MIL-HDBK-103. The vendors listed in MIL-HDBK-  
103 have agreed to this drawing and a certificate of compliance (see 3.6 herein) has been submitted to and accepted by DSCC-  
VA.  
SIZE  
STANDARD  
MICROCIRCUIT DRAWING  
5962-88715  
A
DEFENSE SUPPLY CENTER COLUMBUS  
COLUMBUS, OHIO 43216-5000  
REVISION LEVEL  
C
SHEET  
10  
DSCC FORM 2234  
APR 97  
STANDARD MICROCIRCUIT DRAWING BULLETIN  
DATE: 04-06-01  
Approved sources of supply for SMD 5962-88715 are listed below for immediate acquisition information only and shall  
be added to MIL-HDBK-103 and QML-38535 during the next revision. MIL-HDBK-103 and QML-38535 will be revised  
to include the addition or deletion of sources. The vendors listed below have agreed to this drawing and a certificate of  
compliance has been submitted to and accepted by DSCC-VA. This information bulletin is superseded by the next  
dated revision of MIL-HDBK-103 and QML-38535.  
Replacement  
military specification  
part number  
Standard  
microcircuit drawing  
PIN 1/  
Vendor  
CAGE  
number  
Vendor  
similar  
PIN 2/  
5962-88715012A  
5962-8871502PA  
5962-88715022A  
5962-8871503PA  
5962-88715032A  
34333  
34333  
34333  
34333  
34333  
SG55454BL/883B  
SG55464Y/883B  
SG55464L/883B  
SG55474Y/883B  
SG55474L/883B  
---  
M38510/12910BPA  
---  
---  
---  
1/ The lead finish shown for each PIN representing  
a hermetic package is the most readily available  
from the manufacturer listed for that part. If the  
desired lead finish is not listed contact the vendor  
to determine its availability.  
2/ Caution. Do not use this number for item  
acquisition. Items acquired to this number may not  
satisfy the performance requirements of this drawing.  
Vendor CAGE  
number  
Vendor name  
and address  
34333  
Microsemi Integrated Products  
11861 Western Avenue  
Garden Grove, CA 92641-1816  
The information contained herein is disseminated for convenience only and the  
Government assumes no liability whatsoever for any inaccuracies in the  
information bulletin.  

相关型号:

5962-8871502PX

Dual Peripheral Driver
ETC

5962-88715032A

Buffer/Inverter Based Peripheral Driver, 2 Driver, 0.5A, TTL, CQCC20, CERAMIC, QCC-20
MICROSEMI

5962-88715032X

Dual Peripheral Driver
ETC

5962-8871503PX

Dual Peripheral Driver
ETC

5962-8871601CX

Dual MOSFET Driver
ETC

5962-8871601GX

Dual MOSFET Driver
ETC

5962-8871601PX

Dual MOSFET Driver
ETC

5962-8871601XX

Dual MOSFET Driver
ETC

5962-88718012A

HEX INVERTERS WITH OPEN-DRAIN OUTPUTS
TI

5962-88718012X

Hex Inverter
ETC

5962-8871801CA

HEX INVERTERS WITH OPEN-DRAIN OUTPUTS
TI

5962-8871801CX

Hex Inverter
ETC