APA075-PQG208A [MICROSEMI]

Field Programmable Gate Array, 3072-Cell, CMOS, PQFP208,;
APA075-PQG208A
型号: APA075-PQG208A
厂家: Microsemi    Microsemi
描述:

Field Programmable Gate Array, 3072-Cell, CMOS, PQFP208,

栅 可编程逻辑
文件: 总10页 (文件大小:331K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
v5.9  
®
ProASICPLUS® Flash Family FPGAs  
High Performance Routing Hierarchy  
Features and Benefits  
High Capacity  
Ultra-Fast Local and Long-Line Network  
High-Speed Very Long-Line Network  
High-Performance, Low Skew, Splittable Global Network  
100% Routability and Utilization  
Commercial and Industrial  
75,000 to 1 Million System Gates  
27 K to 198 Kbits of Two-Port SRAM  
66 to 712 User I/Os  
I/O  
Schmitt-Trigger Option on Every Input  
2.5 V / 3.3 V Support with Individually-Selectable Voltage  
and Slew Rate  
Military  
Bidirectional Global I/Os  
300, 000 to 1 Million System Gates  
72 K to 198 Kbits of Two Port SRAM  
158 to 712 User I/Os  
Compliance with PCI Specification Revision 2.2  
Boundary-Scan Test IEEE Std. 1149.1 (JTAG) Compliant  
PLUS  
Pin-Compatible Packages across the ProASIC  
Family  
Reprogrammable Flash Technology  
Unique Clock Conditioning Circuitry  
0.22 µm 4 LM Flash-Based CMOS Process  
Live At Power-Up (LAPU) Level 0 Support  
Single-Chip Solution  
No Configuration Device Required  
Retains Programmed Design during Power-Down/Up Cycles  
Mil/Aero Devices Operate over Full Military Temperature  
Range  
PLL with Flexible Phase, Multiply/Divide, and Delay  
Capabilities  
Internal and/or External Dynamic PLL Configuration  
Two LVPECL Differential Pairs for Clock or Data Inputs  
Standard FPGA and ASIC Design Flow  
Flexibility with Choice of Industry-Standard Front-End Tools  
Efficient Design through Front-End Timing and Gate  
Optimization  
Performance  
3.3 V, 32-Bit PCI, up to 50 MHz (33 MHz over military  
temperature)  
ISP Support  
Two Integrated PLLs  
In-System Programming (ISP) via JTAG Port  
External System Performance up to 150 MHz  
SRAMs and FIFOs  
Secure Programming  
SmartGen Netlist Generation Ensures Optimal Usage of  
Embedded Memory Blocks  
24 SRAM and FIFO Configurations with Synchronous and  
Asynchronous Operation up to 150 MHz (typical)  
®
The Industry’s Most Effective Security Key (FlashLock )  
Low Power  
Low Impedance Flash Switches  
Segmented Hierarchical Routing Structure  
Small, Efficient, Configurable (Combinatorial or Sequential)  
Logic Cells  
Table 1 ProASICPLUS Product Profile  
1
1
1
Device  
Maximum System Gates  
Tiles (Registers)  
Embedded RAM Bits (k=1,024 bits)  
APA075  
75,000  
3,072  
27 k  
12  
APA150  
150,000  
6,144  
36k  
16  
APA300  
APA450  
450,000  
12,288  
108 k  
48  
APA600  
APA750  
750,000  
32,768  
144 k  
64  
APA1000  
300,000  
8,192  
72 k  
32  
600,000  
21,504  
126 k  
56  
1,000,000  
56,320  
198 k  
88  
Embedded RAM Blocks (256x9)  
LVPECL  
2
2
2
2
2
2
2
PLL  
2
2
2
2
2
2
2
Global Networks  
Maximum Clocks  
Maximum User I/Os  
JTAG ISP  
4
24  
158  
Yes  
Yes  
4
32  
242  
Yes  
Yes  
4
32  
290  
Yes  
Yes  
4
48  
344  
Yes  
Yes  
4
56  
454  
Yes  
Yes  
4
64  
562  
Yes  
Yes  
4
88  
712  
Yes  
Yes  
PCI  
Package (by pin count)  
TQFP  
PQFP  
100, 144  
208  
100  
208  
456  
208  
456  
208  
456  
208  
456  
208  
456  
208  
456  
PBGA  
FBGA  
CQFP  
CCGA/LGA  
144  
144, 256  
144, 256  
208, 352  
144, 256, 484 256, 484, 676  
676, 896  
896, 1152  
208, 352  
624  
2
208, 352  
624  
2
Notes:  
1. Available as Commercial/Industrial and Military/MIL-STD-883B devices.  
2. These packages are available only for Military/MIL-STD-883B devices.  
December 2009  
i
© 2009 Actel Corporation  
See the Actel website for the latest version of the datasheet.  
PLUS  
ProASIC  
Flash Family FPGAs  
Ordering Information  
_
APA1000  
FG  
G
1152  
I
Application (Ambient Temperature Range)  
Blank = Commercial (0°C to +70°C)  
I = Industrial (–40°C to +85°C)  
PP = Pre-production  
ES = Engineering Silicon (room temperature only)  
M = Military (–55°C to 125°C)  
B
= MIL-STD-883 Class B  
Package Lead Count  
Lead-free packaging  
Blank = Standard Packaging  
G = RoHS Compliant Packaging  
Package Type  
=
=
=
=
=
=
=
TQ  
PQ  
FG  
BG  
CQ  
CG  
LG  
Thin Quad Flat Pack (0.5 mm pitch)  
Plastic Quad Flat Pack (0.5 mm pitch)  
Fine Pitch Ball Grid Array (1.0 mm pitch)  
Plastic Ball Grid Array (1.27 mm pitch)  
Ceramic Quad Flat Pack (1.05 mm pitch)  
Ceramic Column Grid Array (1.27 mm pitch)  
Land Grid Array (1.27 mm pitch)  
Speed Grade  
=
Blank  
Standard Speed  
Part Number  
APA075 = 75,000 Equivalent System Gates  
APA150 = 150,000 Equivalent System Gates  
APA300 = 300,000 Equivalent System Gates  
APA450 = 450,000 Equivalent System Gates  
APA600 = 600,000 Equivalent System Gates  
APA750 = 750,000 Equivalent System Gates  
APA1000 = 1,000,000 Equivalent System Gates  
ii  
v5.9  
PLUS  
ProASIC  
Flash Family FPGAs  
Device Resources  
User I/Os2  
Commercial/Industrial  
Military/MIL-STD-883B  
CCGA/  
3
3
3
3
3
3
3
3
3
3
TQFP  
TQFP  
PQFP  
PBGA FBGA FBGA FBGA FBGA FBGA  
FBGA  
CQFP  
CQFP  
LGA  
Device  
APA075  
APA150  
APA300  
APA450  
APA600  
APA750  
APA1000  
Notes:  
100-Pin 144-Pin 208-Pin 456-Pin 144-Pin 256-Pin 484-Pin 676-Pin 896-Pin 1152-Pin 208-Pin 352-Pin 624-Pin  
66  
66  
107  
158  
158  
158 5  
100  
100  
242  
290 5  
344  
186 4  
100 5 186 4, 5  
100  
186 4  
186 4, 5 370 4  
158  
158  
158  
248  
248  
248  
158  
344 4  
158 5  
158  
356 5  
454  
454  
440  
440  
356  
562 6  
642 5, 6 712 6  
158 5  
356 5  
1. Package Definitions: TQFP = Thin Quad Flat Pack, PQFP = Plastic Quad Flat Pack, PBGA = Plastic Ball Grid Array, FBGA = Fine Pitch Ball Grid  
Array, CQFP = Ceramic Quad Flat Pack, CCGA = Ceramic Column Grid Array, LGA = Land Grid Array  
2. Each pair of PECL I/Os is counted as one user I/O.  
3. Available in RoHS compatible packages. Ordering code is "G."  
4. FG256 and FG484 are footprint-compatible packages.  
5. Military Temperature Plastic Package Offering  
6. FG896 and FG1152 are footprint-compatible packages.  
General Guideline  
Maximum performance numbers in this datasheet are based on characterized data. Actel does not guarantee  
performance beyond the limits specified within the datasheet.  
v5.9  
iii  
PLUS  
ProASIC  
Flash Family FPGAs  
Temperature Grade Offerings  
Package  
TQ100  
TQ144  
PQ208  
BG456  
FG144  
FG256  
FG484  
FG676  
FG896  
FG1152  
CQ208  
CQ352  
CG624  
APA075  
APA150  
APA300  
APA450  
APA600  
APA750 APA1000  
C, I  
C, I  
C, I  
C, I  
C, I  
C, I  
C, I  
C, I  
C, I, M  
C, I, M  
C, I, M  
C, I, M  
C, I  
C, I  
C, I  
C, I  
C, I  
C, I, M  
C, I, M  
C, I  
C, I  
C, I, M  
C, I, M  
C, I  
C, I, M  
C, I, M  
C, I, M  
C, I  
C, I  
C, I, M  
C, I  
M, B  
M, B  
M, B  
M, B  
M, B  
M, B  
M, B  
M, B  
Note: C = Commercial  
I = Industrial  
M = Military  
B = MIL-STD-883  
Speed Grade and Temperature Matrix  
Std.  
C
I
M, B  
Note: C = Commercial  
I = Industrial  
M = Military  
B = MIL-STD-883  
iv  
v5.9  
PLUS  
ProASIC  
Flash Family FPGAs  
Device Family Overview  
The ProASICPLUS family of devices, Actel’s second-  
generation family of flash FPGAs, offers enhanced  
performance over Actel’s ProASIC family. It combines the  
advantages of ASICs with the benefits of programmable  
devices through nonvolatile flash technology. This  
enables engineers to create high-density systems using  
existing ASIC or FPGA design flows and tools. In addition,  
the ProASICPLUS family offers a unique clock conditioning  
circuit based on two on-board phase-locked loops (PLLs).  
The family offers up to one million system gates,  
supported with up to 198 kbits of two-port SRAM and up  
to 712 user I/Os, all providing 50 MHz PCI performance.  
combination of fine granularity, flexible routing  
resources, and abundant flash switches allows 100%  
utilization and over 95% routability for highly congested  
designs. Tiles and larger functions are interconnected  
through a four-level routing hierarchy.  
Embedded two-port SRAM blocks with built-in FIFO/RAM  
control logic can have user-defined depths and widths.  
Users can also select programming for synchronous or  
asynchronous operation, as well as parity generations or  
checking.  
The unique clock conditioning circuitry in each device  
includes two clock conditioning blocks. Each block  
provides a PLL core, delay lines, phase shifts (0° and  
180°), and clock multipliers/dividers, as well as the  
circuitry needed to provide bidirectional access to the  
PLL. The PLL block contains four programmable  
frequency dividers which allow the incoming clock signal  
to be divided by a wide range of factors from 1 to 64.  
The clock conditioning circuit also delays or advances the  
incoming reference clock up to 8 ns (in increments of  
0.25 ns). The PLL can be configured internally or  
externally during operation without redesigning or  
reprogramming the part. In addition to the PLL, there  
are two LVPECL differential input pairs to accommodate  
high-speed clock and data inputs.  
Advantages  
to  
the  
designer  
extend  
beyond  
performance. Unlike SRAM-based FPGAs, four levels of  
routing hierarchy simplify routing, while the use of flash  
technology allows all functionality to be live at power-  
up. No external boot PROM is required to support device  
programming. While on-board security mechanisms  
prevent  
access  
to  
the  
program  
information,  
reprogramming can be performed in-system to support  
future design iterations and field upgrades. The device’s  
architecture mitigates the complexity of ASIC migration  
at higher user volume. This makes ProASICPLUS a cost-  
effective solution for applications in the networking,  
communications, computing, and avionics markets.  
The ProASICPLUS family achieves its nonvolatility and  
reprogrammability through an advanced flash-based  
0.22 μm LVCMOS process with four layers of metal.  
Standard CMOS design techniques are used to  
implement logic and control functions, including the  
PLLs and LVPECL inputs. This results in predictable  
performance compatible with gate arrays.  
The ProASICPLUS architecture provides granularity  
comparable to gate arrays. The device core consists of a  
Sea-of-Tiles. Each tile can be configured as a flip-flop,  
latch, or three-input/one-output logic function by  
programming the appropriate Flash switches. The  
To support customer needs for more comprehensive,  
lower-cost, board-level testing, Actel’s ProASICPLUS  
devices are fully compatible with IEEE Standard 1149.1  
for test access port and boundary-scan test architecture.  
For more information concerning the flash FPGA  
implementation, please refer to the "Boundary Scan  
(JTAG)" section on page 2-8.  
ProASICPLUS devices are available in a variety of high-  
performance plastic packages. Those packages and the  
performance features discussed above are described in  
more detail in the following sections.  
v5.9  
1-1  
PLUS  
ProASIC  
Flash Family FPGAs  
PLUS  
the appropriate logic cell inputs and outputs. Dedicated  
high-performance lines are connected as needed for fast,  
low-skew global signal distribution throughout the core.  
Maximum core utilization is possible for virtually any  
design.  
ProASICPLUS devices also contain embedded, two-port  
SRAM blocks with built-in FIFO/RAM control logic.  
ProASIC  
Architecture  
The proprietary ProASICPLUS architecture provides  
granularity comparable to gate arrays.  
The ProASICPLUS device core consists of a Sea-of-Tiles  
(Figure 1-1). Each tile can be configured as a three-input  
logic function (e.g., NAND gate, D-Flip-Flop, etc.) by  
programming  
the  
appropriate  
flash  
switch  
Programming  
options  
include  
synchronous  
or  
interconnections (Figure 1-2 and Figure 1-3 on page 1-3).  
Tiles and larger functions are connected with any of the  
four levels of routing hierarchy. Flash switches are  
distributed throughout the device to provide  
nonvolatile, reconfigurable interconnect programming.  
Flash switches are programmed to connect signal lines to  
asynchronous operation, two-port RAM configurations,  
user-defined depth and width, and parity generation or  
checking.  
Refer  
to  
the  
"Embedded  
Memory  
Specifications" section on page 2-54 for more  
information.  
RAM Block  
256x9 Two-Port SRAM  
or FIFO Block  
I/Os  
Logic Tile  
RAM Block  
256x9 Two Port SRAM  
or FIFO Block  
Figure 1-1 The ProASICPLUS Device Architecture  
Switch In  
Floating Gate  
Sensing  
Switching  
Word  
Switch Out  
Figure 1-2 Flash Switch  
1-2  
v5.9  
 
 
PLUS  
ProASIC  
Flash Family FPGAs  
Local Routing  
In 1  
Efficient Long-Line Routing  
In 2 (CLK)  
In 3 (Reset)  
Figure 1-3 Core Logic Tile  
Live at Power-Up  
Flash Switch  
The Actel flash-based ProASICPLUS devices support  
Level 0 of the live at power-up (LAPU) classification  
standard. This feature helps in system component  
initialization, executing critical tasks before the  
processor wakes up, setting up and configuring memory  
blocks, clock generation, and bus activity management.  
The LAPU feature of flash-based ProASICPLUS devices  
greatly simplifies total system design and reduces total  
system cost, often eliminating the need for complex  
programmable logic device (CPLD) and clock generation  
PLLs that are used for this purpose in a system. In  
addition, glitches and brownouts in system power will  
not corrupt the ProASICPLUS device's flash configuration,  
and unlike SRAM-based FPGAs, the device will not have  
to be reloaded when system power is restored. This  
enables the reduction or complete removal of the  
configuration PROM, expensive voltage monitor,  
brownout detection, and clock generator devices from  
the PCB design. Flash-based ProASICPLUS devices simplify  
total system design, and reduce cost and design risk,  
while increasing system reliability and improving system  
initialization time.  
Unlike SRAM FPGAs, ProASICPLUS uses a live-at-power-up  
ISP flash switch as its programming element.  
In the ProASICPLUS flash switch, two transistors share the  
floating gate, which stores the programming  
information. One is the sensing transistor, which is only  
used for writing and verification of the floating gate  
voltage. The other is the switching transistor. It can be  
used in the architecture to connect/separate routing nets  
or to configure logic. It is also used to erase the floating  
gate (Figure 1-2 on page 1-2).  
Logic Tile  
The logic tile cell (Figure 1-3) has three inputs (any or all  
of which can be inverted) and one output (which can  
connect to both ultra-fast local and efficient long-line  
routing resources). Any three-input, one-output logic  
function (except a three-input XOR) can be configured as  
one tile. The tile can be configured as a latch with clear  
or set or as a flip-flop with clear or set. Thus, the tiles can  
flexibly map logic and sequential gates of a design.  
v5.9  
1-3  
 
PLUS  
ProASIC  
Flash Family FPGAs  
Data Sheet Categories  
In order to provide the latest information to designers, some datasheets are published before data has been fully  
characterized. Datasheets are designated as "Product Brief," "Advanced," "Production," and "Datasheet  
Supplement." The definition of these categories are as follows:  
Product Brief  
The product brief is a summarized version of a datasheet (advanced or production) containing general product  
information. This brief gives an overview of specific device and family information.  
Advance  
This datasheet version contains initial estimated information based on simulation, other products, devices, or speed  
grades. This information can be used as estimates, but not for production.  
Unmarked (production)  
This datasheet version contains information that is considered to be final.  
Datasheet Supplement  
The datasheet supplement gives specific device information for a derivative family that differs from the general family  
datasheet. The supplement is to be used in conjunction with the datasheet to obtain more detailed information and  
for specifications that do not differ between the two families.  
Export Administration Regulations (EAR)  
The products described in this datasheet are subject to the Export Administration Regulations (EAR). They could  
require an approved export license prior to export from the United States. An export includes release of product or  
disclosure of technology to a foreign national inside or outside the United States.  
Actel Safety Critical, Life Support, and High-Reliability Applications  
Policy  
The Actel products described in this advance status datasheet may not have completed Actel’s qualification process.  
Actel may amend or enhance products during the product introduction and qualification process, resulting in changes  
in device functionality or performance. It is the responsibility of each customer to ensure the fitness of any Actel  
product (but especially a new product) for a particular purpose, including appropriateness for safety-critical, life-  
support, and other high-reliability applications. Consult Actel’s Terms and Conditions for specific liability exclusions  
relating to life-support applications. A reliability report covering all of Actel’s products is available on the Actel  
website at http://www.actel.com/documents/ORT_Report.pdf. Actel also offers a variety of enhanced qualification and  
lot acceptance screening procedures. Contact your local Actel sales office for additional reliability information.  
1-4  
v5.9  
Actel and the Actel logo are registered trademarks of Actel Corporation.  
All other trademarks are the property of their owners.  
Actel is the leader in low-power and mixed-signal FPGAs and offers the most comprehensive portfolio of  
system and power management solutions. Power Matters. Learn more at www.actel.com.  
Actel Corporation  
Actel Europe Ltd.  
Actel Japan  
Actel Hong Kong  
2061 Stierlin Court  
Mountain View, CA  
94043-4655  
River Court, Meadows Business Park EXOS Ebisu Building 4F  
Room 2107, China Resources Building  
26 Harbour Road  
Wanchai, Hong Kong  
Station Approach, Blackwater  
Camberley Surrey GU17 9AB  
United Kingdom  
1-24-14 Ebisu Shibuya-ku  
Tokyo 150 Japan  
USA  
Phone +81.03.3445.7671  
Fax +81.03.3445.7668  
Phone +852 2185 6460  
Fax +852 2185 6488  
Phone 650.318.4200  
Fax 650.318.4600  
Phone +44 (0) 1276 609 300  
Fax +44 (0) 1276 607 540  
http://jp.actel.com  
www.actel.com.cn  
5172161-25/12.09  

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