APT30SCD120B [MICROSEMI]
Rectifier Diode, Schottky, 1 Element, 99A, 1200V V(RRM),;
| 型号： | APT30SCD120B |
| 厂家： | 
Microsemi |
| 描述： | Rectifier Diode, Schottky, 1 Element, 99A, 1200V V(RRM), 二极管 |
| 文件： | 总4页 (文件大小：127K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
APT30SCD120B
APT30SCD120S
1200V 30A
Zero Recovery Silicon Carbide Schottky Diode
PRODUCT APPLICATIONS
PRODUCT BENEFITS
PRODUCT FEATURES
• Higher Reliability Systems
• Zero Recovery Times (t
)
• Anti-Parallel Diode
-Switchmode Power Supply
-Inverters
rr
• Minimizes or eliminates
snubber
• Popular TO-247 Package or
surface mount D3PAK package
D3PAK
• Power Factor Correction (PFC)
• Low Forward Voltage
• Low Leakage Current
1
2
2
1
1 - Cathode
2 - Anode
Back of Case -Cathode
MAXIMUM RATINGS
T = 25°C unless otherwise specified.
C
Symbol Characteristic / Test Conditions
Ratings
Unit
Maximum D.C. Reverse Voltage
VR
VRRM
VRWM
Maximum Peak Repetitive Reverse Voltage
Maximum Working Peak Reverse Voltage
1200
Volts
TC = 25°C
99
29
IF
Maximum D.C. Forward current
TC = 135°C
Amps
IFRM
IFSM
150
330
Repetitive Peak Forward Suge Current (TJ = 45°C, tp = 10ms, Half Sine Wave)
Non-Repetitive Forward Surge Current (TJ = 25°C, tp = 10ms, Half Sine)
TC = 25°C
291
93
Ptot
Power Dissipation
TC = 125°C
W
TJ, TSTG
TL
Operating and Storage Junction Temperature Range
Lead Temperature for 10 Seconds
-55 to 150
300
°C
STATIC ELECTRICAL CHARACTERISTICS
Symbol Characteristic / Test Conditions
Min
Typ
Max
Unit
IF = 30A TJ = 25°C
1.5
2.1
1.8
VF
Forward Voltage
Volts
IF = 30A, TJ = 150°C
VR = 1200V TJ = 25°C
VR = 1200V, TJ = 150°C
600
IRM
Qc
Maximum Reverse Leakage Current
μA
3000
Total Capactive Charge VR = 800V, IF = 30A, di/dt = -100A/μs, TJ = 25°C
Junction Capacitance VR = 0V, TJ = 25°C, f = 1MHz
200
2100
228
nC
CT
Junction Capacitance VR = 200V, TJ = 25°C, f = 1MHz
Junction Capacitance VR = 400V, TJ = 25°C, f = 1MHz
pF
167
Microsemi Website - http://www.microsemi.com
APT30SCD120B_S
THERMAL AND MECHANICAL CHARACTERISTICS
Symbol Characteristic / Test Conditions
Min
Typ
Max
Unit
Junction-to-Case Thermal Resistance
0.43
°C/W
oz
RθJC
WT
0.22
5.9
Package Weight
g
10
lb·in
N·m
Torque
Maximum Mounting Torque
1.1
Microsemi reserves the right to change, without notice, the specifications and information contained herein.
TYPICAL PERFORMANCE CURVES
0.60
0.45
0.40
0.35
0.30
0.25
Note:
0.20
0.15
0.10
0.05
0
t
1
t
2
t
1
t
/
2
Duty Factor D =
Peak T = P
x Z
+ T
θJC C
J
DM
10-5
10-4
10-3
10-2
0.1
1
10
100
RECTANGULAR PULSE DURATION (seconds)
FIGURE 1. MAXIMUM EFFECTIVE TRANSIENT THERMAL IMPEDANCE, JUNCTION-TO-CASE vs. PULSE DURATION
100
140
120
100
80
T
= -55°C
J
T
= 25°C
J
80
60
40
20
T
= 150°C
J
T
= 125°C
J
60
40
20
0
0
25
50
75
Case Temperature (°C)
FIGURE 3, Maximum Forward Current vs. Case Temperature
100
125
150
0
1
2
3
4
5
6
7
8
V , ANODE-TO-CATHODE VOLTAGE (V)
F
FIGURE 2, Forward Current vs. Forward Voltage
TYPICAL PERFORMANCE CURVES
APT30SCD120B_S
300
250
200
150
100
50
1400
1200
1000
800
150°C
125°C
600
400
75°C
25°C
200
0
0
0
200 400 600 800 1000 1200 1400
25
50
75
100
125
150
V , REVERSE VOLTAGE (V)
CASE TEMPERATURE (°C)
R
Figure 4. Maximum Power Dissipation vs. Case Temperature
Figure 5. Reverse Leakage Currents vs. Reverse Voltage
290
500
dif/dt = -200A/ꢀs
TJ = 125°C
270
400
300
250
230
210
190
170
150
200
100
0
0
200
400
600
800
200 300
400
500
600 700
800
V , REVERSE VOLTAGE (V)
VR, REVERSE VOLTAGE (V)
Figure 6. Reverse Recovery Charge vs. VR
R
Figure 7. Junction Capacitance vs. Reverse Voltage
TO-247 Package Outline
D3PAK Package Outline
4.69 (.185)
5.31 (.209)
15.49 (.610)
16.26 (.640)
4.90 (.193)
5.10 (.201)
1.45 (.057)
1.60 (.063)
15.85 (.624)
16.05(.632)
13.30 (.524)
13.60(.535)
1.49 (.059)
2.49 (.098)
1.00 (.039)
1.15(.045)
5.38 (.212)
6.20 (.244)
6.15 (.242) BSC
20.80 (.819)
21.46 (.845)
12.40 (.488)
12.70 (.500)
18.70 (.736)
19.10 (.752)
3.50 (.138)
3.81 (.150)
0.40 (.016)
0.65 (.026)
4.50 (.177) Max
.
1.20 (.047)
1.40 (.055)
0.020 (.001)
0.250 (.010)
2.70 (.106)
2.90 (.114)
1.90 (.075)
2.10 (.083)
2.40 (.094)
1.65 (.065)
2.13 (.084)
0.40 (.016)
1.016(.040)
2.70 (.106)
1.15 (.045)
1.45 (.057)
19.81 (.780)
20.32 (.800)
(Base of Lead)
1.01 (.040)
1.40 (.055)
5.45 (.215) BSC
(2 Plcs.
Heat Sink (Cathode)
and Leads
)
are Plated
Anode
Cathode
2.21 (.087)
2.59 (.102)
Anode
Cathode
10.90 (.430) BSC
Dimensions in Millimeters and (Inches)
Dimensions in Millimeters and (Inches)
APT30SCD120B_S
Disclaimer:
The information contained in the document (unless it is publicly available on the Web without access restrictions) is PROPRIETARY AND
CONFIDENTIAL information of Microsemi and cannot be copied, published, uploaded, posted, transmitted, distributed or disclosed or used
without the express duly signed written consent of Microsemi. If the recipient of this document has entered into a disclosure agreement with
Microsemi, then the terms of such Agreement will also apply . This document and the information contained herein may not be modified, by
any person other than authorized personnel of Microsemi. No license under any patent, copyright, trade secret or other intellectual property
right is granted to or conferred upon you by disclosure or delivery of the information, either expressly, by implication, inducement, estoppels or
otherwise. Any license under such intellectual property rights must be approved by Microsemi in writing signed by an officer of Microsemi.
Microsemi reserves the right to change the configuration, functionality and performance of its products at anytime without any notice. This
product has been subject to limited testing and should not be used in conjunction with life-support or other mission-critical equipment or
applications. Microsemi assumes no liability whatsoever, and Microsemi disclaims any express or implied warranty, relating to sale and/or
use of Microsemi products including liability or warranties relating to fitness for a particular purpose, merchantability, or infringement of any
patent, copyright or other intellectual property right. Any performance specifications believed to be reliable but are not verified and customer or
user must conduct and complete all performance and other testing of this product as well as any user or customers final application. User or
customer shall not rely on any data and performance specifications or parameters provided by Microsemi. It is the customer’s and user’s re-
sponsibility to independently determine suitability of any Microsemi product and to test and verify the same. The information contained herein
is provided “AS IS, WHERE IS” and with all faults, and the entire risk associated with such information is entirely with the User. Microsemi
specifically disclaims any liability of any kind including for consequential, incidental and punitive damages as well as lost profit. The product is
subject to other terms and conditions which can be located on the web at http://www.microsemi.com/legal/tnc.asp
相关型号：
©2020 ICPDF网 联系我们和版权申明