APT75DL60S [MICROSEMI]

Ultrasoft Recovery Rectifi er Diode; 超软恢复Rectifi器二极管
APT75DL60S
型号: APT75DL60S
厂家: Microsemi    Microsemi
描述:

Ultrasoft Recovery Rectifi er Diode
超软恢复Rectifi器二极管

整流二极管 超软恢复二极管
文件: 总4页 (文件大小:132K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
APT75DL60B(G)  
APT75DL60S(G)  
600V 75A  
*G Denotes RoHS Compliant, Pb Free Terminal Finish.  
Ultrasoft Recovery Rectier Diode  
(B)  
PRODUCT APPLICATIONS  
PRODUCT BENEFITS  
• Soft Switching - High Q  
rr  
PRODUCT FEATURES  
• Ultrasoft Recovery Times (t  
D3PAK  
)
• Anti-Parallel Diode  
-Switchmode Power Supply  
rr  
• Low Noise Switching  
- Reduced Ringing  
• Popular TO-247 Package or  
-Inverters  
1
Surface Mount D3PAK Package  
• Ultra Low Forward Voltage  
• Low Leakage Current  
(S)  
2
2
1
• Applications  
• Higher Reliability Systems  
- Induction Heating  
• Minimizes or eliminates  
snubber  
• Resonant Mode Circuits  
-ZVS and ZCS Topologies  
- Phase Shifted Bridge  
2
1
1 - Cathode  
2 - Anode  
Back of Case -Cathode  
MAXIMUM RATINGS  
All Ratings: T = 25°C unless otherwise specied.  
C
Symbol Characteristic / Test Conditions  
Ratings  
Unit  
Maximum D.C. Reverse Voltage  
VR  
VRRM  
VRWM  
IF(AV)  
Maximum Peak Repetitive Reverse Voltage  
Maximum Working Peak Reverse Voltage  
600  
Volts  
Maximum Average Forward current (TC = 112°C, Duty Cycle = 0.5)  
RMS Forward Currrent (Square wave, 50% duty)  
Non-Repetitive Forward Surge Current (TJ = 45°C, 8.3 ms)  
Operating and Storage Junction Temperature Range  
Lead Temperature for 10 Seconds  
75  
121  
IF(RMS)  
IFSM  
Amps  
°C  
320  
TJ, TSTG  
TL  
-55 to 175  
300  
STATIC ELECTRICAL CHARACTERISTICS  
Symbol Characteristic / Test Conditions  
Min  
Typ  
Max  
Unit  
IF = 75A  
1.25  
2.0  
1.6  
VF  
Forward Voltage  
IF = 150A  
Volts  
IF = 75A, TJ = 125°C  
VR = 600V  
1.25  
25  
IRM  
CT  
Maximum Reverse Leakage Current  
Junction Capacitance, VR = 200V  
μA  
VR = 600V, TJ = 125°C  
250  
69  
pF  
Microsemi Website - http://www.microsemi.com  
DYNAMIC CHARACTERISTICS  
APT75DL60B_S(G)  
Symbol Characteristic / Test Conditions  
Min  
Typ  
Max  
Unit  
trr  
trr  
Reverse Recovery Time  
IF = 1A, diF/dt = -100A/μs, VR = 30V, TJ = 25°C  
56  
460  
2174  
11  
ns  
Reverse Recovery Time  
IF = 75A, diF/dt = -200A/μs  
VR = 400V, TC = 25°C  
Qrr  
IRRM  
trr  
Reverse Recovery Charge  
Maximum Reverse Recovery Current  
Reverse Recovery Time  
nC  
Amps  
ns  
597  
4326  
15  
IF = 75A, diF/dt = -200A/μs  
VR = 400V, TC = 125°C  
Qrr  
IRRM  
trr  
Reverse Recovery Charge  
Maximum Reverse Recovery Current  
Reverse Recovery Time  
nC  
Amps  
ns  
355  
7215  
42  
IF = 75A, diF/dt = -1000A/μs  
VR = 400V, TC = 125°C  
Qrr  
IRRM  
Reverse Recovery Charge  
Maximum Reverse Recovery Current  
nC  
Amps  
THERMAL AND MECHANICAL CHARACTERISTICS  
Symbol Characteristic / Test Conditions  
Min  
Typ  
Max  
Unit  
Junction-to-Case Thermal Resistance  
0.40  
°C/W  
oz  
RθJC  
WT  
0.22  
5.9  
Package Weight  
g
10  
lb·in  
N·m  
Torque  
Maximum Mounting Torque  
1.1  
Microsemi reserves the right to change, without notice, the specications and information contained herein.  
0.45  
0.40  
0.35  
0.30  
0.25  
0.20  
0.15  
0.10  
0.05  
0
Note:  
t
1
t
2
t
1
t
/
2
Duty Factor D =  
Peak T = P x Z  
+ T  
C
J
DM  
θJC  
10-5  
10-4  
10-3  
RECTANGULAR PULSE DURATION (seconds)  
10-2  
10-1  
1.0  
10  
FIGURE 1. MAXIMUM EFFECTIVE TRANSIENT THERMAL IMPEDANCE, JUNCTION-TO-CASE vs. PULSE DURATION  
TYPICAL PERFORMANCE CURVES  
APT75DL60B_S(G)  
160  
800  
700  
600  
500  
400  
300  
200  
100  
T
= 125°C  
= 400V  
J
150A  
75A  
TJ= 125°C  
140  
V
R
TJ= 150°C  
TJ= 55°C  
120  
100  
80  
60  
40  
20  
0
TJ= 25°C  
37.5A  
0
0
200  
400  
600  
800  
1000  
0
1
2
3
-diF/dt, CURRENT RATE OF CHANGE (A/s)  
V , ANODE-TO-CATHODE VOLTAGE (V)  
F
FIGURE 3, Reverse Recovery Time vs. Current Rate of Change  
FIGURE 2, Forward Current vs. Forward Voltage  
10000  
9000  
8000  
7000  
6000  
5000  
4000  
3000  
2000  
1000  
50  
T
= 125°C  
= 400V  
T
= 125°C  
= 400V  
150A  
J
J
V
V
150A  
45  
40  
35  
30  
25  
20  
15  
10  
5
R
R
75A  
75A  
37.5A  
37.5A  
0
0
0
200  
400  
600  
800  
1000  
0
200  
400  
600  
800  
1000  
-diF/dt, CURRENT RATE OF CHANGE (A/s)  
-diF/dt, CURRENT RATE OF CHANGE (A/s)  
FIGURE 5, Reverse Recovery Current vs. Current Rate of Change  
FIGURE 4, Reverse Recovery Charge vs. Current Rate of Change  
160  
1.2  
140  
120  
100  
80  
1.0  
IRRM  
0.8  
tRR  
QRR  
0.6  
60  
0.4  
0.2  
0
40  
20  
0
25  
50  
75  
Case Temperature (°C)  
FIGURE 7, Maximum Average Forward Current vs. Case Temperature  
100  
125  
150  
175  
0
25  
50  
75  
100  
125  
150  
T , JUNCTION TEMPERATURE (°C)  
J
FIGURE 6, Dynamic Parameters vs Junction Temperature  
700  
600  
500  
400  
300  
200  
100  
0
1
10  
100  
400  
V , REVERSE VOLTAGE (V)  
R
FIGURE 8, Junction Capacitance vs. Reverse Voltage  
APT75DL60B_S(G)  
V
r
diF/dt Adjust  
+18V  
0V  
D.U.T.  
t
Q
/
rr rr  
Waveform  
CURRENT  
TRANSFORMER  
Figure 9. Diode Test Circuit  
1
2
IF - Forward Conduction Current  
1
4
5
6
diF/dt - Rate of Diode Current Change Through Zero Crossing.  
Zero  
3
4
IRRM - Maximum Reverse Recovery Current.  
0.25 I  
RRM  
t
- Reverse Recovery Time, measured from zero crossing where diode  
current goes from positive to negative, to the point at which the straight  
line through IRRM and 0.25 IRRM passes through zero.  
3
rr  
Slope = diM/  
dt  
2
5
6
Q
- Area Under the Curve Defined by IRRM and t .  
rr  
rr  
diM/dt - Maximum Rate of Current Increase During the Trailing Portion of t  
rr.  
Figure 10, Diode Reverse Recovery Waveform and Definitions  
TO-247 Package Outline  
e1 SAC: Tin, Silver, Copper  
4.69 (.185)  
D3PAK Package Outline  
e1 100% Sn  
5.31 (.209)  
15.49 (.610)  
4.90 (.193)  
5.10 (.201)  
1.45 (.057)  
1.60 (.063)  
15.85 (.624)  
13.30 (.524)  
13.60(.535)  
16.26 (.640)  
1.49 (.059)  
2.49 (.098)  
16.05(.632)  
1.00 (.039)  
1.15(.045)  
5.38 (.212)  
6.20 (.244)  
6.15 (.242) BSC  
20.80 (.819)  
21.46 (.845)  
12.40 (.488)  
12.70 (.500)  
18.70 (.736)  
19.10 (.752)  
3.50 (.138)  
3.81 (.150)  
0.40 (.016)  
0.65 (.026)  
4.50 (.177) Max.  
1.20 (.047)  
1.40 (.055)  
0.020 (.001)  
0.250 (.010)  
1.90 (.075)  
2.10 (.083)  
2.40 (.094)  
1.65 (.065)  
2.13 (.084)  
0.40 (.016)  
0.79 (.031)  
2.70 (.106)  
1.15 (.045)  
1.45 (.057)  
19.81 (.780)  
20.32 (.800)  
2.70 (.106)  
2.90 (.114)  
(Base of Lead)  
1.01 (.040)  
1.40 (.055)  
5.45 (.215) BSC  
(2 Plcs.)  
Heat Sink (Cathode)  
and Leads  
are Plated  
Anode  
Cathode  
2.21 (.087)  
2.59 (.102)  
Anode  
Cathode  
Dimensions in Millimeters (Inches)  
10.90 (.430) BSC  
Dimensions in Millimeters and (Inches)  
Microsemi’s products are covered by one or more of U.S. patents 4,895,810 5,045,903 5,089,434 5,182,234 5,019,522 5,262,336 6,503,786 5,256,583  
4,748,103 5,283,202 5,231,474 5,434,095 5,528,058 6,939,743, 7,352,045 5,283,201 5,801,417 5,648,283 7,196,634 6,664,594 7,157,886 6,939,743 7,342,262  
and foreign patents. US and Foreign patents pending. All Rights Reserved.  

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