APTDF100H601G [MICROSEMI]

Fast Diode Full Bridge Power Module; 快速二极管全桥电源模块
APTDF100H601G
型号: APTDF100H601G
厂家: Microsemi    Microsemi
描述:

Fast Diode Full Bridge Power Module
快速二极管全桥电源模块

电源电路 整流二极管 桥式整流二极管 局域网
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中文:  中文翻译
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APTDF100H601G  
Fast Diode Full Bridge  
Power Module  
VRRM = 600V  
IC = 100A* @ Tc = 80°C  
3
4
Application  
Uninterruptible Power Supply (UPS)  
Induction heating  
CR1  
CR3  
CR4  
Welding equipment  
5
6
1
2
High speed rectifiers  
Features  
CR2  
7
Ultra fast recovery times  
Soft recovery characteristics  
High blocking voltage  
High current  
Low leakage current  
Very low stray inductance  
High level of integration  
8
9 10  
Benefits  
Outstanding performance at high frequency  
operation  
Low losses  
Low noise switching  
Solderable terminals for easy PCB mounting  
Direct mounting to heatsink (isolated package)  
Low junction to case thermal resistance  
RoHS Compliant  
All multiple inputs and outputs must be shorted together  
3/4 ; 5/6 ; 7/8 ; 1/2 ; 9/10  
Absolute maximum ratings  
Symbol  
VR  
Parameter  
Maximum DC reverse Voltage  
Max ratings  
Unit  
600  
V
VRRM  
Maximum Peak Repetitive Reverse Voltage  
TC = 25°C  
TC = 80°C  
TC = 45°C  
135 *  
100 *  
500  
Maximum Average Forward  
IF(AV)  
IFSM  
Duty cycle = 50%  
Current  
A
Non-Repetitive Forward Surge Current  
8.3ms  
* Specification of diode device but output current must be limited to 75A to not exceed a delta of temperature greater  
than 30°C for the connectors.  
These Devices are sensitive to Electrostatic Discharge. Proper Handling Procedures Should Be Followed. See application note  
APT0502 on www.microsemi.com  
1 - 4  
www.microsemi.com  
APTDF100H601G  
All ratings @ Tj = 25°C unless otherwise specified  
Electrical Characteristics  
Symbol Characteristic  
Test Conditions  
IF = 100A  
Min Typ Max Unit  
1.6  
2.0  
1.3  
2.0  
VF  
Diode Forward Voltage  
IF = 200A  
V
IF = 100A  
Tj = 125°C  
Tj = 25°C  
Tj = 125°C  
250  
500  
IRM  
CT  
Maximum Reverse Leakage Current  
Junction Capacitance  
VR = 600V  
VR = 200V  
µA  
pF  
190  
Dynamic Characteristics  
Symbol Characteristic  
Test Conditions  
Min  
Typ  
Max Unit  
Tj = 25°C  
Tj = 125°C  
Tj = 25°C  
Tj = 125°C  
Tj = 25°C  
Tj = 125°C  
160  
220  
290  
1530  
5
trr  
Reverse Recovery Time  
Reverse Recovery Charge  
Reverse Recovery Current  
ns  
IF = 100A  
VR = 400V  
Qrr  
nC  
A
di/dt = 200A/µs  
IRRM  
13  
trr  
Qrr  
IRRM  
Reverse Recovery Time  
Reverse Recovery Charge  
Reverse Recovery Current  
100  
2890  
44  
ns  
nC  
A
IF = 100A  
VR = 400V  
Tj = 125°C  
di/dt=1000A/µs  
Thermal and package characteristics  
Symbol Characteristic  
Min Typ Max Unit  
RthJC  
Junction to Case Thermal Resistance  
0.55 °C/W  
RMS Isolation Voltage, any terminal to case t =1 min, I isol<1mA, 50/60Hz  
Operating junction temperature range  
Storage Temperature Range  
VISOL  
2500  
-40  
-40  
-40  
2.5  
V
TJ  
175  
125  
100  
4.7  
80  
°C  
TSTG  
TC  
Operating Case Temperature  
Torque Mounting torque  
To heatsink  
M4  
N.m  
g
Wt  
Package Weight  
2 - 4  
www.microsemi.com  
APTDF100H601G  
Typical Performance Curve  
Maximum Effective Transient Thermal Impedance, Junction to Case vs Pulse Duration  
0.6  
0.5  
0.4  
0.3  
0.2  
0.1  
0.9  
0.7  
0.5  
0.3  
0.1  
0.05  
Single Pulse  
0.01  
0
0.00001  
0.0001  
0.001  
0.1  
1
10  
Rectangular Pulse Duration (Seconds)  
Forward Current vs Forward Voltage  
Trr vs. Current Rate of Charge  
300  
250  
200  
150  
100  
50  
300  
250  
200  
150  
100  
50  
TJ=125°C  
VR=400V  
200 A  
100 A  
TJ=125°C  
TJ=25°C  
50 A  
0
0.0  
0.5  
1.0  
1.5  
2.0  
2.5  
0
200 400 600 800 1000 1200  
-diF/dt (A/µs)  
VF, Anode to Cathode Voltage (V)  
QRR vs. Current Rate Charge  
IRRM vs. Current Rate of Charge  
4
3
2
1
0
60  
50  
40  
30  
20  
10  
0
200 A  
200 A  
TJ=125°C  
VR=400V  
TJ=125°C  
VR=400V  
100 A  
100 A  
50 A  
50 A  
0
200  
400  
600  
800 1000 1200  
0
200 400 600 800 1000 1200  
-diF/dt (A/µs)  
-diF/dt (A/µs)  
Capacitance vs. Reverse Voltage  
Max. Average Forward Current vs. Case Temp.  
150  
1400  
1200  
1000  
800  
600  
400  
200  
0
Duty Cycle = 0.5  
TJ=175°C  
125  
100  
75  
50  
25  
0
1
10  
100  
1000  
25  
50  
75  
100 125 150 175  
VR, Reverse Voltage (V)  
Case Temperature (°C)  
3 - 4  
www.microsemi.com  
APTDF100H601G  
SP1 Package outline (dimensions in mm)  
See application note 1904 - Mounting Instructions for SP1 Power Modules on www.microsemi.com  
Microsemi reserves the right to change, without notice, the specifications and information contained herein  
Microsemi's products are covered by one or more of U.S patents 4,895,810 5,045,903 5,089,434 5,182,234 5,019,522  
5,262,336 6,503,786 5,256,583 4,748,103 5,283,202 5,231,474 5,434,095 5,528,058 and foreign patents. U.S and Foreign patents pending. All Rights Reserved.  
4 - 4  
www.microsemi.com  

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