APTLGF350A608G [MICROSEMI]

Phase leg Intelligent Power Module; 相桥臂智能功率模块
APTLGF350A608G
型号: APTLGF350A608G
厂家: Microsemi    Microsemi
描述:

Phase leg Intelligent Power Module
相桥臂智能功率模块

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APTLGF350A608G  
VCES = 600V  
IC = 350A @ Tc = 80°C  
Phase leg  
Intelligent Power Module  
Application  
Motor control  
Uninterruptible Power Supplies  
Switched Mode Power Supplies  
Amplifier  
Features  
Non Punch Through (NPT) FAST IGBT  
-
-
-
-
-
-
Low voltage drop  
Low tail current  
Soft recovery parallel diodes  
Low diode VF  
Low leakage current  
RBSOA & SCSOA rated  
Integrated Fail Safe IGBT Protection (Driver)  
-
-
Top Bottom input signals Interlock  
Isolated DC/DC Converter  
Low stray inductance  
M5 power connectors  
High level of integration  
Benefits  
VBUS  
0/VBUS  
OUT  
Outstanding performance at high frequency operation  
Stable temperature behavior  
Very rugged  
Direct mounting to heatsink (isolated package)  
Low junction to case thermal resistance  
Very high noise immunity  
(common mode rejection > 25kV/µs)  
Galvanic Isolation: 3750V for the optocoupler  
2500V for the transformer  
5V logic level with Schmitt-trigger Input  
Single VDD=5V supply required  
Secondary auxiliary power supplies internally generated  
(15V, -6V)  
Optocoupler qualified to AEC-Q100 test quidelines  
RoHS compliant  
These Devices are sensitive to Electrostatic Discharge. Proper Handling Procedures Should Be Followed.  
See application note APT0502 on www.microsemi.com  
1 - 7  
www.microsemi.com  
APTLGF350A608G  
All ratings @ Tj = 25°C unless otherwise specified  
1. Inverter Power Module  
Absolute maximum ratings  
Symbol  
Parameter  
Max ratings  
600  
Unit  
V
VCES  
Collector - Emitter Breakdown Voltage  
TC = 25°C  
TC = 80°C  
TC = 25°C  
TC = 25°C  
430  
350  
700  
1562  
IC  
Continuous Collector Current  
A
ICM  
PD  
Pulsed Collector Current  
Maximum Power Dissipation  
W
RBSOA Reverse Bias Safe Operating Area  
Tj = 125°C  
800A@550V  
Electrical Characteristics  
Symbol Characteristic  
Test Conditions  
Min Typ Max Unit  
Tj = 25°C  
Tj = 125°C  
Tj = 25°C  
0.5  
V
GE = 0V  
ICES  
Zero Gate Voltage Collector Current  
mA  
VCE = 600V  
1.5  
2
2.5  
VDD = VIN = 5V  
IC = 400A  
VCE(sat) Collector Emitter Saturation Voltage  
V
Tj = 125°C  
2.2  
Dynamic Characteristics  
Symbol Characteristic  
Test Conditions  
Min Typ Max Unit  
Cies  
Coes  
Cres  
Input Capacitance  
Output Capacitance  
Reverse Transfer Capacitance  
17.2  
1.88  
1.6  
V
GE = 0V  
VCE = 25V  
nF  
ns  
f = 1MHz  
Inductive Switching (25°C)  
Tr  
Tf  
Rise Time  
Fall Time  
25  
30  
VDD = VIN = 5V  
VBus = 400V ; IC = 400A  
Inductive Switching (125°C)  
Tr  
Tf  
Rise Time  
25  
45  
ns  
V
V
DD = VIN = 5V  
Bus = 400V  
Fall Time  
Eon  
Turn-on Switching Energy  
17.2  
IC = 400A  
mJ  
Eoff  
Turn-off Switching Energy  
14  
V
DD = VIN = 5V; VBus =360V  
Isc  
Short Circuit data  
1800  
A
tp 10µs ; Tj = 125°C  
RthJC  
Junction to Case thermal resistance  
0.08 °C/W  
2 - 7  
www.microsemi.com  
APTLGF350A608G  
Reverse diode ratings and characteristics  
Symbol Characteristic  
Test Conditions  
Min Typ Max Unit  
Maximum Peak Repetitive Reverse Voltage  
Maximum Reverse Leakage Current  
DC Forward Current  
VRRM  
IRM  
IF  
600  
V
µA  
A
Tj = 25°C  
Tj = 125°C  
Tc = 80°C  
100  
VR=600V  
2000  
240  
1.7  
2
IF = 240A  
IF = 480A  
IF = 240A  
2.3  
VF  
trr  
Diode Forward Voltage  
Reverse Recovery Time  
V
Tj = 125°C  
Tj = 25°C  
Tj = 125°C  
Tj = 25°C  
1.4  
70  
140  
400  
ns  
IF = 240A  
VR = 400V  
di/dt = 800A/µs  
Qrr  
Reverse Recovery Charge  
nC  
Tj = 125°C  
2760  
RthJC  
Junction to Case Thermal Resistance  
0.22 °C/W  
2. Driver  
Absolute maximum ratings  
Symbol  
Parameter  
Max ratings  
Unit  
VDD  
VINi  
Supply Voltage  
Input signal voltage i=L, H  
5.5  
5.5  
0.35  
2
V
VINi = 0V, i =L & H  
VDD=5V, VINH = /VINL ; Fout = 60kHz  
IVDDmax  
fmax  
Maximum Supply current  
A
kHz  
Maximum Switching Frequency  
60  
Driver Electrical Characteristics  
Symbol Characteristic  
Test Conditions  
Min  
4.5  
Typ  
5
Max  
5.5  
5.5  
Unit  
V
VDD  
Operating Supply Voltage  
Maximum Input Voltage  
Positive Going Threshold Voltage  
VINi(max)  
VINi (th+)  
-0.5  
5
V
3.2  
i = L, H  
VINi(th-) Negative Going Threshold Voltage  
1
1
RINi  
Td(on)  
DT  
Input Resistance *  
Turn On delay time  
Built in dead time  
kΩ  
Driver + IGBT  
Driver + IGBT  
1100n  
600  
750  
ns  
Td(off)  
PWD  
Turn Off delay time  
Pulse Width Distortion  
Propagation Delay Difference  
between any two driver  
300  
350  
ns  
PDD  
VISOL  
Td(on) - Td(off)  
-350  
2500  
Primary to Secondary Isolation  
VRMS  
* Low impedance guarantees good noise immunity.  
n Including built in dead time.  
3 - 7  
www.microsemi.com  
APTLGF350A608G  
3. Package characteristics  
Symbol Characteristic  
Min Typ Max Unit  
RMS Isolation Voltage, any terminal to case t =1 min, I isol<1mA, 50/60Hz  
VISOL  
TJ  
TOP  
TSTG  
TC  
2500  
-40  
-40  
-40  
-40  
2
V
Operating junction temperature range  
Operating Ambient Temperature  
Storage Temperature Range  
150  
85  
100  
100  
4.7  
4
°C  
Operating Case Temperature  
To heatsink  
For terminals  
M5  
M5  
Torque Mounting torque  
Wt Package Weight  
N.m  
g
2
550  
4. LP8 Package outline (dimensions in mm)  
4 - 7  
www.microsemi.com  
APTLGF350A608G  
Typical IGBT Performance Curve  
Breakdown Voltage vs Junction Temp.  
Output characteristics  
800  
1.20  
250µs Pulse Test  
< 0.5% Duty cycle  
600  
1.10  
1.00  
0.90  
0.80  
TJ=25°C  
TJ=125°C  
400  
200  
0
VDD = 5V  
VIN = 5V  
25  
50  
75  
100  
125  
0
1
2
3
4
TJ, Junction Temperature (°C)  
VCE, Collector to Emitter Voltage (V)  
Reverse Bias Safe Operating Area  
DC Collector Current vs Case Temperature  
1000  
800  
600  
400  
200  
0
500  
400  
300  
200  
100  
0
0
100  
200  
300  
400  
500  
600  
25  
50  
75  
100  
125  
150  
VCE, Collector to Emitter Voltage (V)  
TC, Case Temperature (°C)  
Current Rise Time vs Collector Current  
Current Fall Time vs Collector Current  
80  
60  
40  
20  
0
80  
60  
40  
20  
0
VCE = 400V  
VDD = 5V  
VCE = 400V  
VDD = 5V  
V
IN = 5V  
VIN = 5V  
TJ=125°C  
TJ = 125°C  
TJ = 25°C  
100  
200  
300  
400  
500  
600  
100  
200  
300  
400  
500  
600  
I
CE, Collector to Emitter Current (A)  
ICE, Collector to Emitter Current (A)  
Turn-On Energy Loss vs Collector Current  
32  
Turn-Off Energy Loss vs Collector Current  
24  
20  
16  
12  
8
VCE = 400V  
VCE = 400V  
DD = 5V  
VIN = 5V  
TJ = 125°C  
VDD = 5V  
IN = 5V  
TJ=125°C  
V
V
24  
16  
8
TJ = 25°C  
TJ=25°C  
4
0
0
100  
200  
300  
400  
500  
600  
100  
200  
300  
400  
500  
600  
ICE, Collector to Emitter Current (A)  
ICE, Collector to Emitter Current (A)  
5 - 7  
www.microsemi.com  
APTLGF350A608G  
Capacitance vs Collector to Emitter Voltage  
100000  
Operating Frequency vs Collector Current  
70  
60  
50  
40  
30  
20  
10  
0
VCE = 400V  
D = 50%  
VDD = 5V  
VIN = 5V  
Cies  
10000  
1000  
100  
TJ = 125°C  
Limited by  
internal gate  
drive power  
dissipation  
TC =75°C  
Coes  
Cres  
Hard  
switching  
0
100  
200  
300  
400  
500  
0
10  
20  
30  
40  
50  
V
CE, Collector to Emitter Voltage (V)  
IC, Collector Current (A)  
Maximum Effective Transient Thermal Impedance, Junction to Case vs Pulse Duration  
0.1  
0.08  
0.06  
0.04  
0.02  
0
0.9  
0.7  
0.5  
0.3  
Single Pulse  
0.1  
0.05  
0.00001  
0.0001  
0.001  
0.01  
0.1  
1
10  
Rectangular Pulse Duration (Seconds)  
6 - 7  
www.microsemi.com  
APTLGF350A608G  
Typical diode Performance Curve  
Maximum Effective Transient Thermal Impedance, Junction to Case vs Pulse Duration  
0.25  
0.9  
0.7  
0.5  
0.2  
0.15  
0.1  
0.3  
0.05  
0.1  
Single Pulse  
0.01  
0.05  
0
0.00001  
0.0001  
0.001  
0.1  
1
10  
Rectangular Pulse Duration (Seconds)  
Forward Current vs Forward Voltage  
Trr vs. Current Rate of Charge  
175  
150  
125  
100  
75  
500  
TJ=125°C  
VR=400V  
480 A  
400  
300  
200  
100  
0
TJ=125°C  
120 A  
240 A  
TJ=25°C  
50  
0.0  
0.5  
1.0  
1.5  
2.0  
2.5  
0
800 1600 2400 3200 4000 4800  
-diF/dt (A/µs)  
VF, Anode to Cathode Voltage (V)  
QRR vs. Current Rate Charge  
IRRM vs. Current Rate of Charge  
8.0  
6.0  
4.0  
2.0  
0.0  
160  
140  
120  
100  
80  
TJ=125°C  
480 A  
VR=400V  
TJ=125°C  
480 A  
VR=400V  
240 A  
240 A  
120 A  
60  
40  
20  
120 A  
0
0
800 1600 2400 3200 4000 4800  
0
800 1600 2400 3200 4000 4800  
-diF/dt (A/µs)  
-diF/dt (A/µs)  
Capacitance vs. Reverse Voltage  
2000  
1600  
1200  
800  
400  
0
1
10  
100  
1000  
VR, Reverse Voltage (V)  
Microsemi reserves the right to change, without notice, the specifications and information contained herein  
7 - 7  
www.microsemi.com  

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