JAN1N5314 [MICROSEMI]

Current Regulator Diode, 4.7mA I(S), 2.9V V(L), Silicon, DO-204AA,;


型号：	JAN1N5314
厂家：	Microsemi
描述：	Current Regulator Diode, 4.7mA I(S), 2.9V V(L), Silicon, DO-204AA,
文件：	总17页 (文件大小：84K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

INCH-POUND

The documentation and process conversion

measures necessary to comply with this revision

shall be completed by 24 September 2003.

MIL-PRF-19500/463F

24 June 2003

SUPERSEDING

MIL-S-19500/463E

12 October 1997

PERFORMANCE SPECIFICATION

SEMICONDUCTOR DEVICE, DIODE, SILICON, CURRENT REGULATOR,

TYPES 1N5283-1 THROUGH 1N5314-1, AND 1N5283UR-1 THROUGH 1N5314UR-1

JAN, JANTX, JANTXV, JANS, JANHC, AND JANKC

This specification is approved for use by all Departments

and Agencies of the Department of Defense.

1. SCOPE

1.1 Scope. This specification covers the performance requirements for 100 volt, silicon, current regulator diodes.

Four levels of product assurance are provided for each encapsulated device type as specified in MIL-PRF-19500.

Two levels of product assurance are provided for each unencapsulated device type.

1.2 Physical dimensions. See figure 1 (DO-7), figure 2 (DO-213AB), and figure 3 (JANHC and JANKC).

1.3 Maximum ratings. Maximum ratings are as shown in maximum test ratings (see 3.10) and as follows:

a. P = 500 mW (DO-7) at T = +50°C, L = .375 inch (9.53 mm); both ends of case or diode body to heat sink

L = .375 inch (9.53 mm). (Derate to 0 at +175°C).

b. P = 500 mW (DO-213AB) at T

= +125°C. (Derate to 0 at +175°C).

c. -65°C ≤ T ≤ +175°C; -65°C ≤ T

≤ +175°C.

STG

1.4 Primary electrical characteristics. Primary electrical ratings are as shown in maximum test ratings (see 3.10)

and as follows, (nominally 0.22 mA dc ≤ I ≤ 4.70 mA dc):

a. R

b. R

= 250°C/W (maximum) at L = .375 inch (9.53 mm) (DO-7).

ΘJL

= 100°C/W (maximum) junction to end-caps (DO-213AB).

ΘJEC

2. APPLICABLE DOCUMENTS

2.1 General. The documents listed in this section are specified in sections 3 and 4 of this specification. This

section does not include documents cited in other sections of this specification or recommended for additional

information or as examples. While every effort has been made to ensure the completeness of this list, document

users are cautioned that they must meet all specified requirements documents cited in sections 3 and 4 of this

specification, whether or not they are listed.

Beneficial comments (recommendations, additions, deletions) and any pertinent data which may be of use in

improving this document should be addressed to: Defense Supply Center, Columbus, ATTN: DSCC-VAC, P.O.

Box 3990, Columbus, OH 43216-5000, by using the Standardization Document Improvement Proposal (DD

Form 1426) appearing at the end of this document or by letter.

AMSC N/A

FSC 5961

DISTRIBUTION STATEMENT A. Approved for public release; distribution is unlimited.

MIL-PRF-19500/463F

DO-7

Symbol

Dimensions

Inches Millimeters

Notes

Min

.085

.230

.018

1.000

Max

.107

.300

.022

1.300

Min

2.16

5.84

0.46

25.4

Max

2.72

7.62

0.56

38.1

3, 4

4,5

NOTES:

1. Dimensions are in inches.

2. Metric equivalents are given for general information only.

3. The minimum body diameter shall be maintained over .15 inch (0.38 mm) inch of body length.

4. The specified lead diameter applies in the zone between .050 inch (1.27 mm) and

the end of the lead. Outside of this zone the lead diameter shall not exceed BD.

5. Both leads shall be within the specified dimension.

6. See 3.3 for L and T definitions.

7. Dimensions are in accordance with ASME Y14.5M.

FIGURE 1. Physical dimensions (1N5283-1 through 1N5314-1).

MIL-PRF-19500/463F

DO-213AB

Dimensions

Inches Millimeters

Symbol

Min

.094

.189

.016

Max

.105

.205

.022

Min

2.39

4.80

0.41

Max

2.67

5.21

0.55

ECT

.001 min

0.03 min

NOTES:

1. Dimensions are in inches.

2. Metric equivalents are given for general information only.

FIGURE 2. Physical dimensions (1N5283UR-1 through 1N5314UR-1).

MIL-PRF-19500/463F

Dimensions

Inches Millimeters

Min Min Max

Symbol

Max

.014

.030

.012

.026

0.305 0.355

0.660 0.762

Design data

Metallization:

Top: (Anode) ......... Al.

Back: (Cathode) .... Au.

Al thickness ............ 25000 Å Min.

Gold thickness ........ 4000 Å Min.

Chip thickness ....... .010 ±.002 inch (0.254 ±0.0508 mm).

NOTES:

1. Dimensions are in inches.

2. Metric equivalents are given for general information only.

FIGURE 3. Physical dimensions, JANHCA and JANKCA die.

MIL-PRF-19500/463F

2.2 Government documents.

2.2.1 Specifications, standards, and handbooks. The following specifications, standards, and handbooks form a

part of this document to the extent specified herein. Unless otherwise specified, the issues of these documents are

those listed in the issue of the Department of Defense Index of Specifications and Standards (DoDISS) and

supplement thereto, cited in the solicitation (see 6.2).

SPECIFICATION

DEPARTMENT OF DEFENSE

MIL-PRF-19500 - Semiconductor Devices, General Specification for.

STANDARD

DEPARTMENT OF DEFENSE

MIL-STD-750 - Test Methods for Semiconductor Devices.

(Unless otherwise indicated, copies of the above specifications, standards, and handbooks are available from the

Document Automation and Production Services (DAPS), Building 4D (DPM-DODSSP), 700 Robbins Avenue,

Philadelphia, PA 19111-5094.)

2.3 Order of precedence. In the event of a conflict between the text of this document and the references cited

herein, the text of this document takes precedence. Nothing in this document, however, supersedes applicable laws

and regulations unless a specific exemption has been obtained.

3. REQUIREMENTS

3.1 General. The individual item requirements shall be as specified in MIL-PRF-19500 and as modified herein.

3.2 Qualification. Devices furnished under this specification shall be products that are manufactured by a

manufacturer authorized by the qualifying activity for listing on the applicable qualified manufacturer's list (QML)

before contract award (see 4.2 and 6.5).

3.3 Abbreviations, symbols, and definitions. Abbreviations, symbols, and definitions shall be as specified in

MIL-PRF-19500 and as follows:

Lead thermal path length. Lead thermal path length is the distance from the end of the diode body to

the point of lead-temperature measurement. For purposes of this measurement, the same heat sinking

at the same distance from the diode body shall be applied to each lead. No heat sinking shall occur

between the diode body and the point of lead-temperature measurement. This measurement may be

made from either end of the diode body. (The diode body includes slugs, if any, but does not include

braze fillet, paint, etc., within the zone of uncontrollable lead diameter.)

Lead temperature. Lead temperature is the temperature of the lead measured at the lead thermal path

length, L. Lead temperature shall be measured by means of a No. 30 copper-constantan

thermocouple, or equivalent. All reference to T will be T

for "UR" devices.

end-cap

Pinch-off current. I Pinch-off current is defined as the regulator current at specified test voltage, V_S.

POV - Peak Operating Voltage. Peak operating voltage is the maximum voltage that shall be applied to the

device.

Steady-state power dissipation. Power dissipated under steady-state conditions.

3.4 Interface and physical dimensions. Interface and physical dimensions shall be as specified in

MIL-PRF-19500, and figure 1 (DO-7), figure 2 (DO-213AB), and figure 3 (JANHC and JANKC die) herein.

MIL-PRF-19500/463F

3.5 Dash one construction. These devices shall be of double plug construction utilizing high temperature

metallurgical bonding between both sides of the silicon die and terminal pins. Metallurgical bond shall be in

accordance with the requirements of category I or II in appendix A of MIL-PRF-19500.

3.5.1 JANS construction. Construction shall be dash one, category I or II metallurgical bond in accordance with

appendix A of MIL-PRF-19500.

3.5.2 Encapsulant material. In addition to those categories of hermetically sealed package requirements

specified in MIL-PRF-19500, fused-metal-oxide to metal shall also be acceptable.

3.6 Lead finish. Unless otherwise specified, lead finish shall be solderable in accordance with

MIL-PRF-19500, MIL-STD-750, and herein. When solder alloy is used for lead finish, the maximum lead

temperature is limited to 175°C maximum. Where a choice of lead finish is desired, it shall be specified in the

acquisition document (see 6.2).

3.7 Marking. Devices shall be marked in accordance with MIL-PRF-19500.

3.7.1 Marking of UR version devices. For UR version devices only, all marking, except polarity (and serial number

for JANS) may be omitted from the body, but shall be retained on the initial container.

3.8 Electrical performance characteristics. Unless otherwise specified herein, the electrical performance

characteristics are as specified in 1.3, 1.4, and tables I and II herein.

3.9 Electrical test requirements. The electrical test requirements shall be the subgroups specified in table I herein.

3.10 Maximum test ratings. Test ratings shall be as shown in table II.

3.11 Workmanship. Semiconductor devices shall be processed in such a manner as to be uniform in quality and

shall be free from other defects that will affect life, serviceability, or appearance.

4. VERIFICATION

4.1 Classification of inspections. The inspection requirements specified herein are classified as follows:

a. Qualification inspection (see 4.2).

b. Screening (see 4.3).

c. Conformance inspection (see 4.7).

4.2 Qualification inspection. Qualification inspection shall be in accordance with MIL-PRF-19500 and as specified

herein.

4.2.1 Group E qualification. Group E qualification shall be performed herein for qualification or requalification

only. In case qualification was awarded to a prior revision of the associated specification that did not request the

performance of group E tests, the tests specified in 4.8.4 herein shall be performed on the first inspection lot to this

revision to maintain qualification.

4.2.2 JANHC and JANKC devices. Qualification for shall be in accordance with appendix G of MIL-PRF-19500.

MIL-PRF-19500/463F

4.3 Screening (JAN, JANTXV, JANTX, and JANS levels only). Screening shall be in accordance with

table IV of MIL-PRF-19500, and as specified herein. The following measurements shall be made in accordance with

table II herein. Devices that exceed the limits of table I herein shall not be acceptable.

Screen

(see table IV of

MIL-PRF-19500)

Measurement

JANS

Temperature cycling

JANTX and JANTXV levels

Temperature cycling

JAN Level

Temperature cycling (in

accordance with MIL-PRF-19500

JANTX level)

(1) 3c

Thermal impedance (see 4.3.3)

Not applicable

Thermal impedance (see 4.3.3)

Not applicable

= 100 V dc at T = +25°C

POV A

POV

t = 48 hours

(2) 11

Subgroup 2 of table II herein;

Subgroup 2 of table II herein

∆I

≤ 5 percent of initial value

(2) 13

See 4.3.2

Subgroup 2 of table II herein;

See 4.3.2

Subgroup 2 of table II herein;

Not applicable

∆I

≤ 5 percent of initial value.

∆I

< 5 percent of initial value.

(1) Thermal impedance may be performed any time after sealing provided temperature cycling is performed in

accordance with MIL-PRF-19500, screen 3 prior to this thermal test.

(2) When thermal impedance is performed prior to screen 13, it is not required to be repeated in screen 13.

4.3.1 Screening (JANHC or JANKC). Screening of die shall be in accordance with appendix G of

MIL-PRF-19500. As a minimum, die shall be 100-percent probed to ensure compliance with subgroup 2 of group A

(with the exception of thermal impedance).

4.3.2 Power burn-in conditions. Power burn-in conditions are as follows: I = 200 mA dc minimum; mounting

and test conditions in accordance with method 1038 of MIL-STD-750, test condition B, T_EC= +75°C to +125°C for

surface mount devices. T = room ambient as defined in the general requirements of 4.5 of MIL-STD-750.

4.3.3 Thermal impedance Z

measurements for screening. The Z

measurements shall be performed in

ΘJX

accordance with method 3101 of MIL-STD-750, (V to be used in lieu of V ). The maximum limit (not to exceed the

table I, subgroup 2 limit) for Z

in screening (table IV of MIL-PRF-19500) shall be derived by each vendor by

ΘJX

means of statistical process control. When the process has exhibited control and capability, the capability data shall

be used to establish the fixed screening limit. In addition to screening, once a fixed limit has been established,

monitor all future sealing lots using a random five piece sample from each lot to be plotted on the applicable X, R

chart. If a lot exhibits an out of control condition, the entire lot shall be removed from the line and held for

engineering evaluation and disposition.

a. I measurement current

1 mA - 10 mA.

.5 A - 1.0 A.

10 ms.

b. I forward heating current

c. t heating time

d. t

measurement delay time

70 µs maximum.

4.4 For initial qualification or requalification. Group E qualification shall be performed herein for qualification or

requalification only. In case qualification was awarded to a prior revision of the associated specification that did not

request the performance of table II tests, the tests specified in 4.8.4 herein shall be performed on the first inspection

lot to this revision to maintain qualification. Read and record data (Z

) shall be supplied to the qualifying activity

ΘJX

on one lot (random sample of 500 devices minimum). Twenty-two serialized devices shall be sent to the qualifying

activity for test correlation.

MIL-PRF-19500/463F

4.5 Thermal resistance. Thermal resistance measurement shall be in accordance with method 3101 of

MIL-STD-750. Forced moving air or draft shall not be permitted across the device during heat. The maximum limit

for R

under these test conditions shall be R

(max) = 250°C/W or R = 100°C/W. The following

ΘJL

ΘJEC

conditions shall apply:

a. I

b. I

1 mA to 10 mA.

200 mA to 400 mA.

30 seconds minimum.

c. t

d. t

70 µs maximum.

LS = lead spacing = .375 inch (9.53 mm) for non-surface mount and 0 inch for surface mount (see figure 4 below):

FIGURE 4. Mounting conditions.

4.5.1 For initial qualifications and re-qualifications. Read and record data in accordance with 4.8.4 herein and

shall be included in the qualification report.

4.6 Temperature coefficient of regulator current. The temperature coefficient of regulator current shall be tested

under the following conditions: (sampling plan: 22 devices, c = 0).

a. Test 1: V = 25 V dc, T = -55°C, T = +25°C, L = .375 inch (9.53 mm) (non-surface mount), L = 0 inch

L1 L2

(surface mount) (see 3.3.2 and 4.8.3) with the maximum limit in accordance with column 8 of table II.

b. Test 2: V = 25 V dc, T = +25°C, T = +150°C, L = .375 inch (9.53 mm) (non-surface mount), L = 0 inch

L1 L2

(surface mount) (see 3.3.2 and 4.8.3) with the maximum limit in accordance with column 9 of table II.

4.7 Conformance inspection. Conformance inspection shall be in accordance with MIL-PRF-19500, and as

specified herein.

4.7.1 Group A inspection. Group A inspection shall be conducted in accordance with MIL-PRF-19500, and table I

herein.

4.7.2 Group B inspection. Group B inspection shall be conducted in accordance with the conditions specified for

subgroup testing in table VIa (JANS) and VIb (JAN, JANTX and JANTXV) of MIL-PRF-19500, and as follows.

Electrical measurements (end-points) and delta requirements shall be in accordance table I, subgroup 2 herein.

MIL-PRF-19500/463F

4.7.2.1 Group B inspection, table VIa (JANS) of MIL-PRF-19500.

Subgroup

Method

1037

Condition

2,000 cycles.

1027

= 200 mA dc, T = +125°C or adjusted as required to give an average lot

J = +175°C. Marking legibility requirements shall not apply.

3101 or

4081

= 250°C/W .375 inch (9.52 mm) lead length (non-surface mount).

ΘJL

= 100°C/W (surface mount).

ΘJEC

4.7.2.2 Group B inspection, table VIb (JAN, JANTX, and JANTXV) of MIL-PRF-19500.

Subgroup

Method

1027

Condition

= 100 V dc; T = +25°C; L = .375 inch (9.53 mm) (non-surface mount),

POV

L = 0 inch for surface mount.

Not applicable.

1032

T = +175°C.

4.7.3 Group C inspection. Group C inspection shall be conducted in accordance with the conditions specified for

subgroup testing in table VII of MIL-PRF-19500, and as follows. Electrical measurements (end-points) and delta

requirements shall be in accordance with table I, subgroup 2 herein.

Subgroup

Method

2036

Condition

(Not applicable to surface mount devices); lead fatigue conditions:

Test condition E; .062 inch (1.57 mm) lead restriction from case.

Test condition A; 4 pounds, 15 seconds.

3101

1026

See 4.5.

= 100 V dc; T = +25°C; L = 0.375 inch (9.53 mm)(non-surface

POV

mount), L = 0 inch for surface mount.

See 4.6 and 4.8.3

4.8 Methods of inspection. Methods of inspection shall be as specified in the appropriate tables and as follows:

4.8.1 Knee ac impedance (Z ) at test voltage V . To test for Z , a 90 Hz signal V (mod) with rms value equal to

10 percent of test voltage, V , is superimposed on the test voltage (see figure 5).

4.8.2 Regulator impedance (Z ) at test voltage V . To test for Z , a 90 Hz signal V (mod) with rms value equal

to 10 percent of test voltage, V , is superimposed on the test voltage (see figure 6).

4.8.3 Temperature coefficient of regulator current ( I ). Temperature coefficient of regulator current shall be

calculated as follows:

(T ) - I (T )

L2 L1

I = _________________

100

(T = +25°C)∆T

L L

MIL-PRF-19500/463F

4.8.4 Group E inspection. Group E inspection shall be conducted in accordance with the conditions specified for

subgroup testing in table IX of MIL-PRF-19500. Electrical measurements (end-points) and delta requirements shall

be in accordance with the applicable steps and footnotes of table I, subgroup 2 herein.

4.8.4.1 Group E inspection, table IX of MIL-PRF-19500.

Subgroup

Method

1051

Condition

Sampling plan

500 cycles

45 devices, c = 0

3 devices, c = 0

22 devices, c = 0

* E2

1037

6,000 cycles (see 4.3.2)

Cross section; scribe and break

2101

3101

4081

= 100°C/W (maximum)

ΘJEC

at zero lead length.

+25°C ≤ T ≤ +35°C, at T ≥ 30 s.

(surface mount only) (see 4.5)

3101

4081

= 250°C/W (maximum) at

22 devices, c = 0

3 devices, c = 0

ΘJL

.375 inch (9.53 mm) lead length

+25°C ≤ T ≤ +35°C at T ≥ 30 s in still

air (non-surface mount only) (see 4.5)

1020

MIL-PRF-19500/463F

TABLE I. Group A inspection.

MIL-STD-750

Inspection 1/

Subgroup 1

Limit 2/

Unit

Symbol

Method

2071

Conditions

Min

Max

Visual and mechanical

examination

Subgroup 2

Regulator current

= 25 V dc, t = 90 s or thermal

Column

mA dc

V dc

equilibrium, T = +30°C ±3°C

(see figure 5)

Limiting voltage

Reverse voltage

= 0.8 I (min), col. 3 of table II

Column

(see figure 6)

= 200 mA

2.5

V dc

Thermal impedance

Subgroup 3

3101

See 4.3.3

°C/W

ΘJX

Not applicable

Subgroup 4

Regulator impedance

= 25 V dc; (see figure 7 and

Column

MΩ

4.8.2)

Knee impedance

= 6.0 V dc, (see figure 8 and

Column

4.8.1)

Subgroups 5 and 6

Not applicable

Subgroup 7

= 100 V dc, T = 90s or thermal

Column

mA dc

Regulator current

equilibrium, T = +30°C ±3°C

(see figure 5)

1/ For sampling plan, see MIL-PRF-19500.

2/ Column references are to table II herein.

TABLE II. Electrical characteristics.

Col 1

Type

Col 2

Col 3

Col 4

Col 5

minimum

Col 6

minimum

Col 7

Col 8

Col 9

Col 10

α I

αI

(Electrical

characteristics

for "UR" and

"-1" suffix

devices are

identical.)

Regulator current at

regulator

impedance

knee

maximum

limiting voltage

regulator

current (mA)

maximum

regulator current

maximum

regulator

current

= 25 V (mA)

impedance

at V = 25 V

at I =

at V = 6 V

C at V = 25V

V = 100 V

0.8 I (min)

C at V

-55°C +25°C

25V +25°C

+150°C

(%/°C)

Nom

0.22

0.24

0.27

0.30

0.33

0.39

0.43

0.47

0.56

0.62

0.68

0.75

0.82

0.91

1.00

1.10

1.20

1.30

1.40

1.50

1.60

1.80

2.00

2.20

2.40

2.70

3.00

3.30

3.60

3.90

4.30

4.70

Min

0.198

0.216

0.243

0.270

0.297

0.351

0.387

0.423

0.504

0.558

0.612

0.675

0.738

0.819

0.900

0.990

1.08

1.17

1.26

1.35

1.44

1.62

1.80

1.98

2.16

Max

0.242

0.264

0.297

0.330

0.363

0.429

0.473

0.517

0.616

0.682

0.748

0.825

0.902

1.001

1.100

1.210

1.32

1.43

1.54

1.65

1.76

1.98

2.20

2.42

2.64

Volts

1.00

1.05

1.10

1.13

1.15

1.20

1.25

1.29

1.35

1.40

1.45

1.50

1.55

1.60

1.65

1.75

1.85

1.95

2.00

2.15

2.25

2.35

2.50

2.60

2.75

2.90

Min

Max

1.15

1.05

0.95

0.85

0.75

0.62

0.55

0.50

0.35

0.25

0.20

0.15

0.07

0.0

0.05

-.10

-.15

-.20

Min

Max

.27

.30

.33

.36

.40

.47

.52

.57

.68

.75

.82

.91

MΩ

25.0

19.0

14.0

9.0

6.6

4.10

3.30

2.70

1.90

1.55

1.35

1.15

1.00

0.880

0.800

0.700

0.640

0.580

0.540

0.510

0.475

0.420

0.395

0.370

0.345

0.320

0.300

0.280

0.265

0.255

0.245

0.235

MΩ

2.75

2.35

1.95

1.60

1.35

1.00

1N5283-1

1N5284-1

1N5285-1

1N5286-1

1N5287-1

1N5288-1

1N5289-1

1N5290-1

1N5291-1

1N5292-1

1N5293-1

1N5294-1

1N5295-1

1N5296-1

1N5297-1

1N5298-1

1N5299-1

1N5300-1

1N5301-1

1N5302-1

1N5303-1

1N5304-1

1N5305-1

1N5306-1

1N5307-1

1N5308-1

1N5309-1

1N5310-1

1N5311-1

1N5312-1

1N5313-1

1N5314-1

- .20

- .30

- .35

- .40

- .50

- .52

- .55

- .60

- .62

- .65

- .70

- .72

- .76

- .78

- .80

- .83

- .85

- .88

- .90

- .92

- .95

- .96

- .98

-1.0

- .16 0.60

- .20 0.56

- .22 0.48

- .25 0.42

- .26 0.37

- .30 0.28

- .32 0.23

- .33 0.18

- .36 0.10

- .37 0.05

- .38 0.02

- .40 - .03

- .41 - .07

- .42 - .10

- .44 - .10

- .46 - .10

- .47 - .10

- .48 - .10

- .49 - .10

- .50 - .10

- .51 - .10

- .52 - .10

- .53 - .10

- .54 - .10

- .55 - .10

0.870

0.750

0.560

0.470

0.400

0.335

0.290

0.240

0.205

0.180

0.155

0.135

0.115

0.105

0.092

0.074

0.061

0.052

0.044

0.035

0.029

0.024

0.020

0.017

0.014

0.012

.99

1.10

1.21

1.33

1.45

1.57

1.69

1.81

1.92

2.18

2.42

2.66

2.90

3.27

3.63

3.99

4.36

4.72

5.20

5.69

2.43

2.70

2.97

3.24

3.51

3.87

4.23

2.97

3.30

3.63

3.96

4.29

4.73

5.17

-1.01

-1.02

-1.03

-1.04

-1.05

-1.06

MIL-PRF-19500/463F

NOTES:

1. Adjust voltage source so that V = 25 V dc.

2. Measure current I .

3. The device is acceptable if the current falls within the limits specified.

4. The ammeter shall represent essentially a short-circuit to the terminals between which the current is

being measured. If not, the voltmeter reading shall be corrected for the drop across the ammeter.

FIGURE 5. Regulator current test circuit.

NOTES:

1. Adjust current source so that I

L = 0.8 I (min).

2. Measure voltage V .

3. The device is acceptable if the voltage is less than the limit specified.

4. The ammeter shall represent essentially a short-circuit to the terminals between which the current is

being measured. If not, the voltmeter reading shall be corrected for the drop across the ammeter.

FIGURE 6. Limiting voltage test circuit.

MIL-PRF-19500/463F

NOTES:

1. Adjust voltage source so that V = 25 Vdc.

2. Apply an ac signal of 2.5 Vrms at 90 Hz through an isolating capacitor C.

3. Measure the ac rms voltage.

4. z = V mod x (R

1÷ V ac) where V mod equals ac signal for note 2 and V ac equals the voltage across R .

S 1

5. Device is acceptable if the regulator impedance meets the specified minimum limit.

FIGURE 7. Regulator impedance test circuit.

NOTES:

1. Adjust voltage source so that V = 6.0 Vdc.

2. Apply an ac signal of 0.6 Vrms at 90 Hz through an isolating capacitor C.

3. Measure the ac rms voltage.

4. z = V mod x (R

1÷ V ac) where V mod equals ac signal for note 2 and V ac equals the voltage across R .

K 1

5. Device is acceptable if the knee impedance meets the specified minimum limit.

FIGURE 8. Knee impedance test circuit.

MIL-PRF-19500/463F

5. PACKAGING

5.1 Packaging. For acquisition purposes, the packaging requirements shall be as specified in the contract or

order (see 6.2). When actual packaging of materiel is to be performed by DoD personnel, these personnel need to

contact the responsible packaging activity to ascertain requisite packaging requirements. Packaging requirements

are maintained by the Inventory Control Point's packaging activity within the Military Department or Defense Agency,

or within the Military Department's System Command. Packaging data retrieval is available from the managing

Military Department's or Defense Agency's automated packaging files, CD-ROM products, or by contacting the

responsible packaging activity.

6. NOTES

(This section contains information of a general or explanatory nature that may be helpful, but is not mandatory.)

6.1 Intended use. The notes specified in MIL-PRF-19500 are applicable to this specification.

6.2 Acquisition requirements. Acquisition documents must specify the following:

a. Title, number, and date of this specification.

b. Issue of DoDISS to be cited in the solicitation and if required, the specific issue of individual documents

referenced (see 2.2.1).

c. The lead finish as specified (see 3.6).

d. Type designation and quality assurance level.

e. Packaging requirements (see 5.1).

6.3 Suppliers of die. The qualified die suppliers with the applicable letter version (example JANHCA1N5283) will

be identified on the QPL.

JANC ordering information

Manufacturer

43611

1N5283-1 through 1N5314-1

JANHCA1N5283 through JANHCA1N5314

JANKCA1N5283 through JANKCA1N5314

6.4 Substitutability. Non dash-one devices have been deleted from this specification. Dash-one devices are a

direct substitute for non dash-one devices and are preferred.

6.5 Qualification. With respect to products requiring qualification, awards will be made only for products which

are, at the time of award of contract, qualified for inclusion in Qualified Manufacturer’s List (QML No.19500) whether

or not such products have actually been so listed by that date. The attention of the contractors is called to these

requirements, and manufacturers are urged to arrange to have the products that they propose to offer to the Federal

Government tested for qualification in order that they may be eligible to be awarded contracts or orders for the

products covered by this specification. Information pertaining to qualification of products may be obtained from

Defense Supply Center, Columbus, ATTN: DSCC-VQE, P.O. Box 3990, Columbus, OH 43216-5000.

6.6 Changes from previous issue. The margins of this specification are marked with asterisks to indicate where

changes from the previous issue were made. This was done as a convenience only and the Government assumes

no liability whatsoever for any inaccuracies in these notations. Bidders and contractors are cautioned to evaluate the

requirements of this document based on the entire content irrespective of the marginal notations and relationship to

the last previous issue.

MIL-PRF-19500/463F

Custodians:

Army - CR

Navy - EC

Air Force - 11

NASA - NA

DLA - CC

Preparing activity:

DLA - CC

Review activities:

Army - AR, MI, SM

Navy - AS, MC

(Project 5961-2640)

Air Force - 19, 99

STANDARDIZATION DOCUMENT IMPROVEMENT PROPOSAL

INSTRUCTIONS

1. The preparing activity must complete blocks 1, 2, 3, and 8. In block 1, both the document number and revision letter should be

given.

2. The submitter of this form must complete blocks 4, 5, 6, and 7.

3. The preparing activity must provide a reply within 30 days from receipt of the form.

NOTE: This form may not be used to request copies of documents, nor to request waivers, or clarification of requirements on

current contracts. Comments submitted on this form do not constitute or imply authorization to waive any portion of the

referenced document(s) or to amend contractual requirements.

1. DOCUMENT NUMBER

MIL-PRF-19500/463F

2. DOCUMENT DATE

24 June 2003

I RECOMMEND A CHANGE:

3. DOCUMENT TITLE

SEMICONDUCTOR DEVICE, DIODE, SILICON, CURRENT REGULATOR, TYPES 1N5283-1 THROUGH 1N5314-1, AND

1N5283UR-1 THROUGH 1N5314UR-1 JAN, JANTX, JANTXV, JANS, JANHC, AND JANKC

4. NATURE OF CHANGE (Identify paragraph number and include proposed rewrite, if possible. Attach extra sheets as needed.)

5. REASON FOR RECOMMENDATION

6. SUBMITTER

a. NAME (Last, First, Middle initial)

b. ORGANIZATION

c. ADDRESS (Include Zip Code)

d. TELEPHONE (Include Area Code)

7. DATE SUBMITTED

COMMERCIAL

DSN

FAX

8. PREPARING ACTIVITY

b. TELEPHONE

Commercial

614-692-0510

a. Point of Contact

Alan Barone

DSN

FAX

850-0510

614-692-6939

alan.barone@dla.mil

c. ADDRESS

Defense Supply Center, Columbus

IF YOU DO NOT RECEIVE A REPLY WITHIN 45 DAYS, CONTACT:

Defense Standardization Program Office (DLSC-LM)

8725 John J. Kingman, Suite 2533, Fort Belvoir, VA 22060-6221

Telephone (703) 767-6888 DSN 427-6888

ATTN: DSCC-VAC, P.O. Box 3990

Columbus, OH 43216-5000

DD Form 1426, Feb 1999 (EG)

Previous editions are obsoleteWHS/DIOR, Feb 99

JAN1N5314 [MICROSEMI]

相关型号：

JAN1N5314-1

JAN1N5314-1E3

JAN1N5314UR

JAN1N5314UR-1

JAN1N5314UR-1

JAN1N5333

JAN1N5333A

JAN1N5333ATR

JAN1N5333B

JAN1N5333BTR

JAN1N5333C

JAN1N5333CTR