JAN1N6100_技术文档

INCH-POUND

The documentation and process conversion

measures necessary to comply with this revision

shall be completed by 23 March 2007.

MIL-PRF-19500/474F

23 January 2007

SUPERSEDING

MIL-PRF-19500/474E

3 November 1997

* PERFORMANCE SPECIFICATION SHEET

SEMICONDUCTOR DEVICE, SILICON, MULTIPLE DIODE ARRAYS,

TYPES 1N5768, 1N5770, 1N5772, 1N5774, 1N6100, 1N6101, 1N6496,

1N6506, 1N6507, 1N6508, 1N6509, 1N6510, AND 1N6511,

JAN, JANTX, JANTXV, AND JANS

This specification is approved for use by all Departments and Agencies

of the Department of Defense.

* The requirements for acquiring the product described herein shall consist

of this specification sheet and MIL-PRF-19500.

1. SCOPE

1.1 Scope. This specification covers the performance requirements for silicon, multiple diode arrays. Four levels

of product assurance are provided for each device type as specified in MIL-PRF-19500.

1.2 Physical dimensions. See figures 1, 2, 3, 4, 5, 6, 7, and 8.

1.3 Maximum ratings. Unless otherwise specified T = +25°C.

*

A

Type

V

1/ 2/

I

1/ 3/

I

1/

P

T

STG

BR(R)

O

FSM

J

T

= +25°C

t = 1/120 s

p

T

= +25°C

A

V dc

mA dc

mW

°C

1N5768

1N5770

1N5772

1N5774

1N6496

1N6506

1N6507

1N6508

1N6509

1N6100

1N6101

1N6510

1N6511

60

75

300

500

500 4/

600 5/

500 4/

600 5/

500 4/

600 5/

-65 to +175

-65 to +200

1/ Each diode.

2/ Pulsed: PW = 100 ms maximum; duty cycle ≤ 20 percent.

3/ Derate at 2.0 mA/°C above +25°C.

4/ Derate at 3.33 mW/°C above +25°C.

5/ Derate at 4.0 mW/°C above +25°C.

Comments, suggestions, or questions on this document should be addressed to Defense Supply Center,

Columbus, ATTN: DSCC-VAC, P.O. Box 3990, Columbus, OH 43218-3990, or emailed to

semiconductor@dscc.dla.mil. Since contact information can change, you may want to verify the currency of

this address information using the ASSIST Online database at http://assist.daps.dla.mil.

AMSC N/A

FSC 5961

MIL-PRF-19500/474F

1.4 Primary electrical characteristics, each diode.

Type

V

(1)

=

V

1/

=

I

C

t

F1

F2

R1

t

rr

= I

fr

=

I

V

R

= 40 V dc

I

=

R

F

I

F

100 mA dc

500 mA dc

200 mA dc

R = 100 Ω

500 mA dc

L

I

= 20 mA dc

rr

V dc

pF

ns

µA dc

Min

Max

Min

Max

Min

Max

Min

Max

Min

Max

Min

Max

1N5768

1N5770

1N5772

1N5774

1N6496

1N6506

1N6507

1N6508

1N6509

1.0

1.5

0.1

4

8

4

8

40

20

Type

V

I

C

t

F1

=

R2

fr

=

rr

= I

I

V

R

= 20 V dc

I

=

R

F

100 mA dc

10 mA dc

R = 100 Ω

L

I

= 1 mA dc

rr

V dc

nA dc

pF

ns

Min

Max

Min

Max

Min

Max

Min

Max

Min

Max

1N6100

1N6101

1N6510

1N6511

1.0

25

4

15

5

(1) Pulsed: PW = 300 µs ± 50 µs, duty cycle ≤ 2 percent, 90 µs after leading edge of pulse.

2

MIL-PRF-19500/474F

Symbol

Inches

Millimeters

Notes

3

Symbol

Inches

Millimeters

Notes

Min

Max

Min

Max

Min

Max

Min

Max

BL

.290

7.37

LO

1

.005

0.13

7, 8

2

BW

.235

.125

.030

.260

5.97

3.18

0.76

6.60

LO

.005

.050

0.13

1.27

2

BW

1

LS

LT

.050 BSC

1.27 BSC

4, 6

5

BW

.003

.006

0.08

0.15

2

CH

LL

LO

.030

.240

.095

.370

.045

0.76

6.10

2.41

9.40

1.14

LU

LW

TL

.280

.019

.015

7.11

0.48

0.38

3

5

1

.010

.008

0.25

0.20

7

NOTES:

1. Index area: A notch or a pin 1 identification mark shall be located adjacent to pin 1 and shall be within the

shaded area shown. The manufacturer's identification shall not be used as a pin 1 identification mark.

Alternatively, a tab (dimension TL) may be used to identify pin 1. This tab may be located on either side as

shown. If a pin 1 identification mark is used in addition to this tab, the minimum limit of dimension TL does

not apply.

2. Dimension LO shall be measured at the point of exit of the lead from the body. Dimension LO shall be

2

.0085 inch (0.216 mm) minimum when lead finish A is solder.

3. These dimensions allow for off-center lid, meniscus, and glass overrun.

4. The basic pin spacing is .050 inch (1.27 mm) between centerlines. Each pin centerline shall be located within

±.005 inch (0.13 mm) of its exact longitudinal position relative to pins 1 and 10.

5. All leads: Dimensions are pre-solder dip.

6. Eight spaces.

7. Applies to all four corners (lead numbers 1, 5, 6, and 10).

8. Dimension LO may be .000 inch (0.00 mm) if lead numbers 1, 5, 6, and 10 bend toward the cavity of the

package within one lead width from the point of entry of the lead into the body. For all bottom-brazed or side-

brazed configurations, dimension LO shall be measured from the edge of the furthest extension of the metal

pad or lead.

9. Optional configuration. If this configuration is used, no organic or polymeric materials shall be molded to the

bottom of the package to cover the leads.

10. Dimensions are in inches. Millimeters are given for general information only.

* FIGURE 1. Physical dimensions for types 1N5768, 1N5770, and 1N5772.

3

MIL-PRF-19500/474F

Symbol

Inches

Millimeters

Notes

4

Min

Max

Min

Max

7.11

6.60

2.41

9.40

1.02

BL

BW

CH

LL

.280

.260

.235

5.97

0.76

6.35

0.25

.030 .095

.250 .370

.010 .040

LO

3

2

LO

.005

.004

0.13

0.10

8

9

3

LS

LT

LU

LW

TL

.050 BSC

.003 .006

.280

.010 .019

.008 .015

1.27 BSC

6

5

4

5

1

0.08

0.15

7.11

0.48

0.38

0.25

0.20

NOTES:

This package is inactive and shall be replaced with the package on figure 3.

1. Index area: A notch or a pin 1 identification mark shall be located adjacent to pin 1 and shall be within the

shaded area shown. The manufacturer's identification shall not be used as a pin 1 identification mark.

Alternatively, a tab (dimensions TL) may be used to identify pin 1. This tab may be located on either side

as shown. If a pin 1 identification mark is used in addition to this tab, the minimum limit of dimension TL

does not apply.

2. Dimension LO shall be measured at the point of exit of the lead from the body. Dimension LO shall be

2

.0085 inch (0.216 mm) minimum when lead finish A is applied.

3. These dimensions allow for off-center lid, meniscus, and glass overrun.

4. The basic pin spacing is .050 inch (1.27 mm) between centerlines. Each pin centerline shall be located

within ±.005 inch (0.13 mm) of its exact longitudinal position relative to pins 1 and 14.

5. All leads: Increase maximum limit by .003 inch (0.08 mm) measured at the center of the flat, when lead

finish A is applied. Dimensions given are pre-solder dip.

6. Twelve places.

7. Applies to all four corners (lead numbers 2, 6, 9, and 13).

8. Dimensions LO may be .000 inch (0.00 mm) if lead numbers 2, 6, 9, and 13 bend toward the cavity of the

package within one lead width from the point of entry of the lead into the body.

9. Applies to lead numbers 1, 7, 8, and 14.

10. Lead configuration is optional within dimension BW except dimensions LT and LW apply.

11. Dimensions are in inches. Millimeters are given for general information only.

* FIGURE 2. Physical dimensions for types 1N5774 and 1N6100.

4

MIL-PRF-19500/474F

Symbol

Inches

Millimeters

Notes

3

Min

Max

Min

Max

BL

BW

.390

.260

9.91

6.60

.235

.125

5.97

3.18

BW

1

BW

2

.030

0.76

CH

LL

LO

.045

.250

.005

.026

.095

.370

1.14

6.35

0.13

0.66

2.41

9.40

7, 8

2

LO

.045

1.14

2

LS

LT

LU

LW

.050 BSC

1.27 BSC

4, 6

5

3

.003

.006

.280

.019

0.08

0.15

7.11

0.48

.010

0.25

5

NOTES

1. Index area: A notch or a pin 1 identification mark shall be located adjacent to pin 1 and shall be within the

shaded area shown. The manufacturer's identification shall not be used as a pin 1 identification mark.

2. Dimension LO shall be measured at the point of exit of the lead from the body. Dimension LO minimum

2

shall be reduced by .0015 inch (0.038 mm) maximum when lead finish is solder.

3. These dimensions allow for off-center lid, meniscus, and glass overrun.

4. The basic pin spacing is .050 inch (1.27 mm) between centerlines. Each pin centerline shall be located

within ±.005 inch (0.13 mm) of its exact longitudinal position relative to pins 1 and 14.

5. All leads: Dimensions are pre-solder dip.

6. Twelve spaces.

7. Applies to all four corners.

8. Dimensions LO may be .000 inch (0.00 mm) if lead numbers 1, 7, 8, and 14 bend toward the cavity of the

package within one lead width from the point of entry of the lead into the body.

9. If this configuration is used, no organic or polymeric materials shall be molded to the bottom of the

package to cover the leads.

10. Lead configuration is optional within dimension BW except dimensions LW and LT apply.

11. Dimensions are in inches. Millimeters are given for general information only.

* FIGURE 3. Alternate physical dimensions for types 1N5774 and 1N6100.

5

MIL-PRF-19500/474F

Symbol

Inches

Max

Millimeters

Notes

Min

Max

BH

BL

BW

.200

.785

.310

.320

5.08

19.94

7.87

4

7

.220

.290

5.59

7.37

BW

8.13

1

LL

.100

.150

.200

2.54

3.81

5.08

LL

1

LO

1

.005

0.13

6

.098

.060

2.49

1.52

.015

0.38

3

LO

2

LS

LT

LW

.100 BSC

2.54 BSC

5, 9

8

.008

.014

.020

.015

.023

.070

0.20

0.36

0.51

0.38

0.58

1.78

LW

2, 8

1

α

0°

15°

0°

15°

NOTES:

1. Index area: A notch or a pin 1 identification mark shall be located adjacent to pin 1 and shall be within the

shaded area shown. The manufacturer's identification shall not be used as a pin 1 identification mark.

2. The minimum limit for dimension LW may be .023 inch (0.58 mm) for lead numbers 1, 7, 8, and 14 only.

1

3. Dimension LO shall be measured from the seating plane to the base plane.

2

4. This dimension allows for off-center lid, meniscus, and glass overrun.

5. The basic pin spacing is .100 inch (2.54 mm) between centerlines. Each pin centerline shall be located

within ±.010 inch (0.25 mm) of its exact longitudinal position relative to pins 1 and 14.

6. Applies to all four corners (lead numbers 1, 7, 8, and 14).

7. Lead center when α is 0 degrees. BW shall be measured at the centerline of the leads.

1

8. All leads: Dimensions are pre-solder dip. Pointed or round lead ends are allowed.

9. Twelve spaces.

10. Dimensions are in inches. Millimeters are given for general information only.

FIGURE 4. Physical dimensions for types 1N6506, 1N6507, 1N6508, 1N6509 and 1N6511.

6

MIL-PRF-19500/474F

Symbol

Inches

Millimeters

Notes

Min

Max

Min

Max

BH

BL

BW

.200

.785

.310

.320

5.08

19.94

7.87

4

7

.220

.290

5.59

7.37

BW

8.13

1

LL

.100

.150

.200

2.54

3.81

5.08

LL

1

LO

.005

0.13

6

.098

.060

2.49

1.52

1

LO₂

LS

LT

.015

.100 BSC

.008

.014

.030

0.38

2.54 BSC

0.20

0.36

0.76

3

5, 9

8

2, 8

.015

.023

.070

0.38

0.58

1.78

LW

1

α

0°

15°

0°

15°

NOTES:

1. Index area: A notch or a pin 1 identification mark shall be located adjacent to pin 1 and shall be within the

shaded area shown. The manufacturer's identification shall not be used as a pin 1 identification mark.

2. The minimum limit for dimension LW may be .020 inch (0.51 mm) for lead numbers 1, 8, 9, and 16 only.

1

3. Dimension LO shall be measured from the seating plane to the base plane.

2

4. This dimension allows for off-center lid, meniscus, and glass overrun.

5. The basic pin spacing is .100 inch (2.54 mm) between centerlines. Each pin centerline shall be located within

±.010 inch (0.25 mm) of its exact longitudinal position relative to pins 1 and 16.

6. Applies to all four corners (lead numbers 1, 8, 9, and 16).

7. Lead center when α is 0 degrees. BW shall be measured at the centerline of the leads.

1

8. All leads: Dimensions are pre-solder dip. Pointed or round lead ends are allowed.

9. Fourteen spaces.

10. Dimensions are in inches. Millimeters are given for general information only.

FIGURE 5. Physical dimensions for type 1N6101.

7

MIL-PRF-19500/474F

Symbol

BL

Inches

Millimeters

Notes

2

Min

Max

.278

.288

Min

Max

.255

6.48

7.06

7.32

BL

1

BW

CH

LL

.194

.045

.265

.724

.200

.095

.290

.780

4.93

1.14

6.73

5.08

2.41

7.37

LL

18.39 19.81

1

LO

.020

.025

0.51

0.64

4

2

LS

LT

LU

LW

.030 TP

0.76 TP

3, 5

6

2

.004

.006

.210

.019

0.10

0.15

5.33

0.48

.010

0.25

6

NOTES:

1. Index area: A notch or a pin 1 identification mark shall be located adjacent to pin 1 and shall be within the

shaded area limited by pin 3 and package centerline. The manufacturer's identification shall not be used as a

pin 1 identification mark.

2. This dimension allows for off-center lid, meniscus, and glass overrun.

3. The true position pin spacing is located within ±.005 inch (0.13 mm) of its true longitudinal position relative to

pins 1 and 20.

4. Dimension LO shall be measured at the point of exit of the lead from the body.

2

5. Eighteen spaces.

6. All leads: Dimensions are pre-solder dip.

7. Dimensions are in inches. Millimeters are given for general information only.

* FIGURE 6. Physical dimensions for type 1N6496.

8

MIL-PRF-19500/474F

Symbol

BL

Inches

Millimeters

Notes

2

Min

Max

.400

.020

Min

Max

.370

9.40

10.16

0.51

BL

1

BW

.245

.260

.015

6.22

6.60

0.38

BW

1

BW

2

0.030

.045

.250

0.76

1.14

6.35

CH

LL

.095

.370

.015

2.41

9.40

0.38

LL

1

LO

.025

.040

0.64

1.02

4

2

LS

LT

LW

.050 BSC

1.27 BSC

3, 5

7

.003

.015

.008

.019

0.08

0.38

0.20

0.48

NOTES:

1. This package is inactive and shall be replaced with the package on figure 8.

2. Index area: A notch or a pin 1 identification mark shall be located adjacent to pin 1 and shall be within

the shaded area limited by pin 3 and package centerline. The manufacturer's identification shall not be

used as a pin 1 identification mark.

3. This dimension allows for off-center lid, meniscus, and glass overrun.

4. The true position pin spacing is located within ±.005 inch (0.13 mm) of its true longitudinal position

relative to pins 1 and 16.

5. Dimension LO shall be measured at the point of exit of the lead from the body.

2

6. Fourteen spaces.

7. All leads: Dimensions are pre-solder dip.

8. Dimensions are in inches. Millimeters are given for general information only.

9. If this configuration is used, no organic or polymeric materials shall be molded to the bottom of the

package to cover the leads.

* FIGURE 7. Physical dimensions for type 1N6510.

9

MIL-PRF-19500/474F

Symbol

Inches

Millimeters

Notes

Min

.370

.235

Max

.400

.260

Min

9.40

5.97

Max

10.16

6.60

BL

BW

1

2

.125

3.18

BW

.030

.045

.250

.005

0.76

1.52

6.35

0.13

CH

LL

LO

.095

.370

2.41

9.40

LO

2

.005

.050 BSC

.003

.015

.050

0.13

1.27 BSC

0.08

0.38

1.27

2

3, 5

6

LS

LT

LW

.006

.019

0.15

0.48

6

NOTES:

1. Index area: A notch or a pin 1 identification mark shall be located adjacent to pin 1 and shall be within the

shaded area limited by pin 3 and package centerline. The manufacturer's identification shall not be used as a

pin 1 identification mark.

2. This dimension allows for off-center lid, meniscus, and glass overrun.

3. The true position pin spacing is located within ±.005 inch (0.13 mm) of its true longitudinal position relative to

pins 1 and 14.

4. Dimension LO shall be measured at the point of exit of the lead from the body.

2

5. Twelve places.

6. All leads: Dimensions are pre-solder dip.

7. Dimensions are in inches.

8. Millimeters are given for general information only.

9. If this configuration is used, no organic or polymeric materials shall be molded to the bottom of the package to

cover the leads.

* FIGURE 8. Physical dimensions for type 1N6510.

10

MIL-PRF-19500/474F

2. APPLICABLE DOCUMENTS

2.1 General. The documents listed in this section are specified in sections 3, 4, or 5 of this specification. This

section does not include documents cited in other sections of this specification or recommended for additional

information or as examples. While every effort has been made to ensure the completeness of this list, document

users are cautioned that they must meet all specified requirements of documents cited in sections 3, 4, or 5 of this

specification, whether or not they are listed.

2.2 Government documents.

2.2.1 Specifications, standards, and handbooks. The following specifications, standards, and handbooks form a

part of this document to the extent specified herein. Unless otherwise specified, the issues of these documents are

those cited in the solicitation or contract.

DEPARTMENT OF DEFENSE SPECIFICATIONS

MIL-PRF-19500

-

Semiconductor Devices, General Specification for.

DEPARTMENT OF DEFENSE STANDARDS

MIL-STD-750

MIL-STD-883

-

Test Methods for Semiconductor Devices.

Microcircuits.

(Copies of these documents are available online at http://assist.daps.dla.mil/quicksearch/ or

http://assist.daps.dla.mil or from the Standardization Document Order Desk, 700 Robbins Avenue, Building 4D,

Philadelphia, PA 19111-5094.)

* 2.2.2 Non-Government publications. The following document(s) form a part of this document to the extent

specified herein. Unless otherwise specified, the issues of these documents are those cited in the solicitation or

contract.

ASTM F30

-

Standard Specification for Iron-Nickel Sealing Alloys

(Application for copies should be addressed to ASTM International, PO Box C700, 100 Barr Harbor West,

Conshohocken, PA 19428-2959 Website is http://www.astm.org.)

2.3 Order of precedence. In the event of a conflict between the text of this document and the references cited

herein, the text of this document takes precedence. Nothing in this document, however, supersedes applicable laws

and regulations unless a specific exemption has been obtained.

3. REQUIREMENTS

* 3.1 General. The individual item requirements shall be as specified in MIL-PRF-19500 and as modified herein.

* 3.2 Qualification. Devices furnished under this specification shall be products that are manufactured by a

manufacturer authorized by the qualifying activity for listing on the applicable qualified manufacturers list (QML)

before contract award (see 4.2 and 6.3).

11

MIL-PRF-19500/474F

3.3 Abbreviations, symbols, and definitions. Abbreviations, symbols, and definitions used herein shall be as

specified in MIL-PRF-19500 and as follows.

V

-

Forward recovery voltage. Specified maximum forward voltage used to determine forward recovery

time.

fr

I

RX

-

Reverse current for each diode of test section.

Forward voltage for each diode of test section.

V

FX

I

-

Isolation current between any two interconnect pins of adjacent parallel sets of diodes with all other

pins open circuited.

Ri

* 3.4 Interface and physical dimension. The interface and physical dimension shall be as specified in

MIL-PRF-19500, and figures 1, 2, 3, 4, 5, 6, 7, and 8. Schematic diagrams are specified in figure 9. No organic or

polymeric materials shall be used.

* 3.4.1 Lead material and finish. Lead material shall be Kovar, F-15 alloy, or alloy 42 as specified in ASTM F-30.

Lead finish shall be gold-plated or solderable in accordance with MIL-PRF-19500. Where a choice of lead material

of finish is desired, it shall be specified in the contract or order (see 6.2).

3.4.2 Die mounting. Pure glass shall not be used for die mounting. Metal glass die mounting is acceptable with

qualifying activity approval for die with area greater than 1,000 square mils.

3.5 Marking. Devices shall be marked as specified in MIL-PRF-19500.

3.6 Electrical performance characteristics. Unless otherwise specified herein, the electrical performance

characteristics are as specified in 1.3, 1.4, and table I.

3.7 Electrical test requirements. The electrical test requirements shall be as specified in table I herein.

3.8 Workmanship. Semiconductor devices shall be processed in such a manner as to be uniform in quality and

shall be free from other defects that will affect life, serviceability, or appearance.

4. VERIFICATION

4.1 Classification of inspections. The inspection requirements specified herein are classified as follows:

a. Qualification inspection (see 4.2).

b. Screening (see 4.3).

c. Conformance inspection (see 4.4).

4.2 Qualification inspection. Qualification inspection shall be in accordance with MIL-PRF-19500 and as

specified herein.

4.2.1 Group E qualification. Group E inspection shall be performed for qualification or re-qualification only. In

case qualification was awarded to a prior revision of the specification sheet that did not require the performance of

table II tests, the tests specified in table II herein that were not performed in the prior revision shall be performed on

the first inspection lot of this revision to maintain qualification.

12

MIL-PRF-19500/474F

4.3 Screening (JANS, JANTXV, and JANTX levels). Screening shall be in accordance with table E-IV of

MIL-PRF-19500 and as specified herein. Specified electrical measurements shall be made in accordance with table I

herein. Devices that exceed the limits of table I herein shall not be acceptable.

Screen

(see table E-IV of

MIL-PRF-19500)

1

Measurements

JANTX and JANTXV levels

JANS level

Method 2010 of MIL-STD-883,

condition B.

Method 2010 of MIL-STD-883,

condition B (JANTXV only).

Optional

7

9

Optional

Not applicable

11

I

and V

I

and V

R1 F1

R1

F1

12

13

See 4.3.1.

Subgroups 2 and 3 of table I herein;

See 4.3.1.

Subgroup 2 of table I herein;

∆I

= 100 percent ofinitial reading

∆I

= 100 percent ofinitial reading or

R1

or 10 nA dc,whichever is greater.

R1

± 25 nA dc,whichever is greater.

∆V = ± 25 mV dc of initial reading. ∆V = ± 30 mV dc of initial reading.

F1

14

Required

4.3.1 Power burn-in conditions. Power burn-in conditions are as follows (see 4.5.7): T = +150°C. Time = 72

A

hours minimum. V = 50 V dc for 1N5768, 1N5770, 1N5772, 1N5774, 1N6496, 1N6506, 1N6507, 1N6508, and

R

1N6509. V = 60 V dc for 1N6100, 1N6101, 1N6510, and 1N6511.

R

4.4 Conformance inspection. Conformance inspection shall be in accordance with MIL-PRF-19500 and as

specified herein.

4.4.1 Group A inspection. Group A inspection shall be conducted in accordance with table E-V of

MIL-PRF-19500, table I herein, and as specified herein. Electrical measurements (end-points) shall be in

accordance with table I, subgroup 2 herein.

4.4.2 Group B inspection. Group B inspection shall be conducted in accordance with the conditions specified for

subgroup testing in table E-VIa (JANS) and table E-VIb (JAN, JANTX, JANTXV) of MIL-PRF-19500 and as specified

herein. Electrical measurements (end-points) and delta requirements shall be in accordance with table I, subgroup

2 herein.

4.4.2.1 Group B inspection, table E-VIa (JANS) of MIL-PRF-19500.

Subgroup

B7

Method

1027

Conditions

= +150°C each diode DC blocking, V = 50 V dc.

T

A

R

4.4.2.2 Group B inspection, table E-VIb (JANTX and JANTXV) of MIL-PRF-19500.

Subgroup

B3

Method

1027

Conditions

DC blocking; T = +150°C; V = 50 V dc.

A

R

B4

2037

Test condition A

13

MIL-PRF-19500/474F

4.4.3 Group C inspection. Group C inspection shall be conducted in accordance with the conditions specified for

subgroup testing in table E-VII of MIL-PRF-19500 and as specified herein. Electrical measurements (end-points)

shall be in accordance with table I, subgroup 2 herein.

4.4.3.1 Group C inspection, table E-VII of MIL-PRF-19500.

Subgroup

C2

Method

1056

Conditions

Test condition A

C6

1026

T = +150°C; V = 50 V dc.

A R

4.4.4 Group E inspection. Group E inspection shall be conducted in accordance with the tests and conditions

specified for subgroup testing in table E-IX of MIL-PRF-19500, and table II herein. Electrical measurements (end-

points) shall be in accordance with table I, subgroup 2 herein.

4.5 Methods of inspection. Methods of inspection shall be as specified in the appropriate tables and as follows.

4.5.1 Measurement of reverse current for 1N5772, 1N5774, 1N6496 1N6508, and 1N6509. For 1N5772,

1N5774, 1N6496, 1N6508, and 1N6509, the reverse current shall be measured using a circuit which bypasses the

shunt resistance through the other diodes not under test, around the current meter. Care should be taken to assure

that the voltage drop across the current meter is less than 10 millivolts.

4.5.2 Forward voltage. This parameter shall be measured 90 microseconds after the leading edge of the pulse.

4.5.3 Peak forward voltage. During this test, the maximum shunt capacitance across the diode shall be 19 pF

and the equipment bandwidth shall be 80 MHz minimum.

4.5.4 Pin-to-pin capacitance. This parameter is the total pin-to-pin capacitance across each individual diode and

may not necessarily represent actual diode capacitance since they are all connected together at either the anode or

cathode and these connections represent additional capacitance.

4.5.5 Reverse current (I ) and forward voltage (V ). Each common anode section and each common cathode

RX FX

section shall be tested separately. Each diode in the test section shall be measured individually after the array

has reached thermal equilibrium.

14

MIL-PRF-19500/474F

4.5.6 Isolation current (I ); bridging current(I

R

). These devices shall be subjected to the isolation

Rbr

current/bridging current tests as specified:

a. For types 1N5772, 1N5774, 1N6496, 1N6508, and 1N6509, the bridging current shall be measured by

supplying the forcing function to every other interconnect pin and measuring the remaining interconnect

pins (excluding common anode and common cathode pins), I

. Repeat the test, reversing the polarity

Rbr

of the forcing function.

b. For types 1N6100, 1N6101, 1N6511, and 1N6510, the bridging current shall be measured by applying the

forcing function to every other diode (anode and cathode simultaneously) and measuring the remaining

diodes (anode and cathode simultaneously), I

. Repeat the test, reversing the polarity of the forcing

Rbr

function.

c. For types 1N5774, 1N6496, and 1N6509, the isolation current shall be measured between the individual

circuits by applying the forcing function to the anode and cathode of one circuit and measuring to the

anode and cathode of other circuit, I . Repeat the test, reversing the polarity of the forcing function.

Ri

d. For types 1N5768 and 1N6506, the forcing function shall be applied to every other anode and measured

on the remaining anodes, I

. Repeat the test, reversing the polarity of the forcing function.

Rbr

e. For types 1N5770 and 1N6509, the forcing function shall be applied to every other cathode and measured

on the remaining cathodes, I . Repeat the test, reversing the polarity of the forcing function.

Rbr

* 4.5.7 Free air power burn-in and life tests. The use of a current limiting or ballast resistor is permitted provided

that each device under test still sees the full P (minimum) and that the minimum applied voltage, where applicable,

t

is maintained throughout the burn-in period. Method 3100 of MIL-STD-750 shall be used to measure T .

J

15

MIL-PRF-19500/474F

TABLE I. Group A inspection.

Inspection 1/

Subgroup 1

MIL-STD-750

Conditions

Limit

Unit

Symbol

Method

2071

Min

Max

Visual and mechanical

Inspection

Subgroup 2

Breakdown voltage

4021

V

(BR)

1N5768, 1N5770, 1N5772

1N5774, 1N6496, 1N6506

1N6507, 1N6508, 1N6509

I

= 10 µA dc;

60

75

V dc

R

PW = 100 ms maximum

duty cycle ≤ 20 percent

1N6100, 1N6101, 1N6510

1N6511

I

= 5 µA dc;

R

PW = 100 ms maximum;

duty cycle ≤ 20 percent

Reverse current

All types

4016 DC method (see 4.5.1)

V

= 40 V dc

= 20 V dc

I

.1

µA dc

nA dc

R

R1

R2

1N6100, 1N6101, 1N6510

1N6511

I

V

25

PW = 300 µs ± 50 µs; duty

cycle ≤ 2 percent (see 4.5.2)

Forward voltage

All types

4011

I

= 100 mA dc

= 500 mA dc

V

1.0

1.5

V dc

F

F1

F2

1N5768, 1N5770, 1N5772

1N5774, 1N6496, 1N6506

1N6507, 1N6508, 1N6509

Subgroup 3

High temperature

operation:

T

= +150°C

A

Reverse current

4016 DC method; V = 40 V dc

R

Low temperature operation:

Forward voltage

I

50

1

µA dc

V dc

T

= -55°C

R3

A

4011

I

= 10 mA dc

V

F3

F

See footnote at end of table.

16

MIL-PRF-19500/474F

TABLE I. Group A inspection - Continued.

MIL-STD-750

Inspection 1/

Subgroup 4

Limit

Min Max

Unit

Symbol

Method

Conditions

Forward recovery voltage

(peak)

4026 PW ≥ 150 ns; R = 50Ω; t = 10 ns;

V

F4

s

r

duty cycle ≤ 2 percent (see 4.5.3)

1N5768, 1N5770, 1N5772,

1N5774, 1N6496, 1N6506,

1N6507, 1N6508, 1N6509

I

= 500 mA

= 100 mA

5

V (pk)

F

1N6100, 1N6101, 1N6510,

1N6511

4001

Capacitance (pin-to-pin)

V

R

= 0 V dc; f = 1 MHz (see 4.5.4)

C

t

1N5770, 1N5772, 1N5774,

1N6496, 1N6507, 1N6508,

1N6509

8

4

pF

1N5768, 1N6100, 1N6101,

1N5605, 1N6510, 1N6511

Forward recovery time

4026

t

PW ≥ 150 ns; R = 50Ω; duty cycle ≤

fr

s

2 percent, t = 10 ns; V = 1.1 V dc

r

fr

1N5768, 1N5770, 1N5772,

1N5774, 1N6496, 1N6506,

1N6507, 1N6508, 1N6509

I

= 500 mA dc

40

15

ns

F

1N6100, 1N6101, 1N6510,

1N6511

= 100 mA dc

Reverse recovery time

20

ns

1N5768, 1N5770,

1N5772 1N5774,

1N6496, 1N6506

1N6507, 1N6508,

1N6509

Condition B; I = I = 200 mA;

4031

t

F

R

rr

R = 100 Ω; I = 20 mA

L

rr

10

5

ns

Condition B; I = I = 10 mA;

1N6100, 1N6101,

1N6510 1N6511

F

R

R = 100 Ω; I = 1 mA

L

rr

4011

Forward voltage (match)

1N6100, 1N6101,

I

= 10 mA

V

F5

mV

F

1N6510 1N6511

See footnote at end of table.

17

MIL-PRF-19500/474F

TABLE I. Group A inspection - Continued.

MIL-STD-750

Inspection 1/

Subgroup 5

Limit

Unit

Symbol

Method

Conditions

Min

Max

Not applicable

Subgroup 6

Surge current

4066

I

= 500 mA(pk); 10 surges at

FSM

one per minute; t = 1/120 s;

p

choose four diodes from each

array in cycles.

Electrical measurements

Subgroup 7

See table. I, subgroup 2

Reverse current

(except omit for the

following devices.)

DC method; V = 40 V dc;

R

4016

I

10

µA dc

RX

I

= 25 mA dc for each of the

F

other diodes in the test section

(see 4.5.5).

1N6100, 1N6101, 1N6510,

1N6511

Forward voltage

(except omit for the

following devices.)

I

= 25 mA dc; I = 25 mA dc for

F

4011

4016

V

FX

1.0

0.8

V dc

F

each of the other diodes in the

test section (see 4.5.5)

1N6100, 1N6101, 1N6510

1N6511

Bridging current

(all devices)

DC method; V = +40 V dc and

R

-40 V dc (see 4.5.6.a through

4.5.6.d)

I

Rbr

µA dc

Isolation current

4016 DC method; V = +40 V dc and

R

I

Ri

-40 V dc (see 4.5.6.c)

1N5774

1N6496

1N6509

0.8

µA dc

1/ For sampling plan, see MIL-PRF-19500.

18

MIL-PRF-19500/474F

TABLE II. Group E inspection (all quality levels) for qualification and requalification only.

Inspection

MIL-STD-750

Qualification

inspection

Method

Conditions

Subgroup 1

Temperature cycling

Hermetic seal

n = 45, c = 0

1051

1071

500 cycles, -65°C to +175°C

Fine leak

Gross leak

Electrical measurement

Subgroup 2

See table I, subgroup 2.

Intermittent operating life

Electrical measurements

Subgroups 4, 5, 6, 7, 8 and 9

Not applicable

1037 10,000 cycles.

See table I, subgroup 2.

19

MIL-PRF-19500/474F

FIGURE 9. Schematics.

20

MIL-PRF-19500/474F

1N6101

DIP

FIGURE 9. Schematics - continued.

21

MIL-PRF-19500/474F

5. PACKAGING

* 5.1 Packaging. For acquisition purposes, the packaging requirements shall be as specified in the contract or

order (see 6.2). When packaging of materiel is to be performed by DoD or in-house contractor personnel, these

personnel need to contact the responsible packaging activity to ascertain packaging requirements. Packaging

requirements are maintained by the Inventory Control Point's packaging activities within the Military Service or

Defense Agency, or within the Military Service’s system commands. Packaging data retrieval is available from the

managing Military Department's or Defense Agency's automated packaging files, CD-ROM products, or by

contacting the responsible packaging activity.

6. NOTES

(This section contains information of a general or explanatory nature that may be helpful, but is not mandatory.)

6.1 Intended use. The notes specified in MIL-PRF-19500 are applicable to this specification.

* 6.2 Acquisition requirements. Acquisition documents should specify the following:

a. Title, number, and date of this specification.

b. Packaging requirements (see 5.1).

c. Lead finish (see 3.4.1).

d. Product assurance level and type designator.

e. Destructive physical analysis when requested.

* 6.3 Qualification. With respect to products requiring qualification, awards will be made only for products which

are, at the time of award of contract, qualified for inclusion in Qualified Manufacturers List (QML-19500) whether or

not such products have actually been so listed by that date. The attention of the contractors is called to these

requirements, and manufacturers are urged to arrange to have the products that they propose to offer to the Federal

Government tested for qualification in order that they may be eligible to be awarded contracts or orders for the

products covered by this specification. Information pertaining to qualification of products may be obtained from

Defense Supply Center, Columbus, ATTN: DSCC/VQE, P.O. Box 3990, Columbus, OH 43218-3990 or e-mail

vqe.chief@dla.mil.

22

MIL-PRF-19500/474F

* 6.6 Changes from previous issue. The margins of this specification are marked with asterisks to indicate where

changes from the previous issue were made. This was done as a convenience only and the Government assumes

no liability whatsoever for any inaccuracies in these notations. Bidders and contractors are cautioned to evaluate

the requirements of this document based on the entire content irrespective of the marginal notations and relationship

to the last previous issue.

Custodians:

Army - CR

Navy - EC

Air Force - 11

NASA - NA

DLA - CC

Preparing activity:

DLA - CC

(Project 5961-2006-066)

Review activities:

Army - AR, AV, MI, SM

Navy - AS, MC

Air Force - 99

* NOTE: The activities listed above were interested in this document as of the date of this document. Since

organizations and responsibilities can change, you should verify the currency of the information above using the

ASSIST Online database at http://assist.daps.dla.mil.

23


型号：	JAN1N6100
厂家：	Microsemi
描述：	Rectifier Diode, 7 Element, 0.3A, Silicon, FP-14 测试光电二极管
文件：	总23页 (文件大小：607K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

JAN1N6100 [MICROSEMI]

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