JANSL2N5152L [MICROSEMI]

Small Signal Bipolar Transistor,;
JANSL2N5152L
型号: JANSL2N5152L
厂家: Microsemi    Microsemi
描述:

Small Signal Bipolar Transistor,

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JANS 2N5152L and JANS 2N5154L  
Qualified Levels:  
RADIATION HARDENED  
JANSM, JANSD,  
JANSP, JANSL,  
JANSR, JANSF  
NPN POWER SILICON TRANSISTOR  
Qualified per MIL-PRF-19500/544  
DESCRIPTION  
These RHA level 2N5152L and 2N5154L silicon transistor devices are military Radiation  
Hardness Assurance qualified up to a JANSF level for high-reliability applications. Microsemi  
also offers numerous other products to meet higher and lower power voltage regulation  
applications.  
Important: For the latest information, visit our website http://www.microsemi.com.  
FEATURES  
JEDEC registered 2N5152 and 2N5154.  
JANS RHA qualifications are available per MIL-PRF-19500/544.  
TO-5 Package  
Also available in:  
TO-39 Package  
(leaded)  
APPLICATIONS / BENEFITS  
JANS_2N5152 &  
High frequency operation.  
Lightweight.  
JANS_2N5154  
High-speed power-switching applications.  
High-reliability applications.  
U3 Package  
(surface mount)  
JANS_2N5152U3 &  
JANS_2N5154U3  
MAXIMUM RATINGS  
Parameters/Test Conditions  
Symbol  
Value  
Unit  
ºC  
Junction and Storage Temperature  
Thermal Resistance Junction-to-Ambient  
Thermal Resistance Junction-to-Case  
Reverse Pulse Energy (1)  
TJ and TSTG  
RӨJA  
-65 to +200  
175  
10  
15  
2
ºC/W  
ºC/W  
mJ  
A
RӨJC  
MSC – Lawrence  
6 Lake Street,  
Lawrence, MA 01841  
Tel: 1-800-446-1158 or  
(978) 620-2600  
Collector Current (dc)  
IC  
Collector to base voltage (static), emitter open  
Collector to emitter voltage (static) base open  
Emitter to base voltage (static) collector open  
Steady-State Power Dissipation @ TA = +25 ºC  
Steady-State Power Dissipation @ TC = +25 ºC  
VCBO  
VCEO  
VEBO  
PD  
100  
80  
5.5  
1
V
V
V
Fax: (978) 689-0803  
W
PD  
10  
W
MSC – Ireland  
Gort Road Business Park,  
Ennis, Co. Clare, Ireland  
Tel: +353 (0) 65 6840044  
Fax: +353 (0) 65 6822298  
Notes: 1. This rating is based on the capability of the transistors to operate safely in the unclamped inductive load  
energy test circuit.  
Website:  
www.microsemi.com  
T4-LDS-0100-1, Rev. 1 (120716)  
©2012 Microsemi Corporation  
Page 1 of 8  
JANS 2N5152L and JANS 2N5154L  
MECHANICAL and PACKAGING  
CASE: Hermetically sealed, kovar base, nickel cap.  
TERMINALS: Leads are kovar, nickel plated, and finish is solder dip (Sn63/Pb37).  
MARKING: Part number, date code, manufacturer’s ID.  
POLARITY: NPN (see package outline).  
WEIGHT: Approximately 1.14 grams.  
See Package Dimensions on last page.  
PART NOMENCLATURE  
JANSM 2N5152  
L
Reliability Level  
JANSM – 3K Rads (Si)  
JANSD – 10K Rads (Si)  
JANSP – 30K Rads (Si)  
JANSL – 50K Rads (Si)  
JANSR – 100K Rads (Si)  
JANSF – 300K Rads (Si)  
Long-Leaded Package  
JEDEC type number  
(See Electrical Characteristics  
table)  
SYMBOLS & DEFINITIONS  
Definition  
Symbol  
Common-base open-circuit output capacitance  
Collector cutoff current, base open  
Cobo  
ICEO  
ICEX  
Collector cutoff current, circuit between base and emitter  
Emitter cutoff current, collector open  
IEBO  
hFE  
Common-emitter static forward current transfer ratio  
Collector-emitter voltage, base open  
VCEO  
VCBO  
VEBO  
Collector-emitter voltage, emitter open  
Emitter-base voltage, collector open  
T4-LDS-0100-1, Rev. 1 (120716)  
©2012 Microsemi Corporation  
Page 2 of 8  
JANS 2N5152L and JANS 2N5154L  
ELECTRICAL CHARACTERISTICS @ TA = +25 ºC unless otherwise noted.  
OFF CHARACTERISTICS  
Parameters / Test Conditions  
Collector-Emitter Breakdown Voltage  
IC = 100 mA, IB = 0  
Symbol  
Min.  
Max.  
Unit  
V(BR)CEO  
80  
V
Emitter-Base Cutoff Current  
VEB = 4.0 V, IC = 0  
VEB = 5.5 V, IC = 0  
1.0  
1.0  
µA  
mA  
IEBO  
Collector-Emitter Cutoff Current  
VCE = 60 V, VBE = 0  
VCE = 100 V, VBE = 0  
Collector-Emitter Cutoff Current  
VCE = 40 V, IB = 0  
1.0  
1.0  
µA  
mA  
ICES  
ICEO  
50  
µA  
ON CHARACTERISTICS  
Parameters / Test Conditions  
Symbol  
Min.  
Max.  
Unit  
Forward-Current Transfer Ratio  
IC = 50 mA, VCE = 5 V  
2N5152L  
2N5154L  
2N5152L  
2N5154L  
2N5152L  
2N5154L  
20  
50  
30  
70  
20  
40  
--  
--  
90  
200  
--  
IC = 2.5 A, VCE = 5 V  
IC = 5A, VCE = 5V  
hFE  
--  
Collector-Emitter Saturation Voltage  
IC = 2.5 A, IB = 250 mA  
IC = 5.0 A, IB = 500 mA  
Base-Emitter Voltage Non-Saturation  
IC = 2.5 A, VCE = 5 V  
Base-Emitter Saturation Voltage  
IC = 2.5 A, IB = 250 mA  
0.75  
1.5  
VCE(sat)  
VBE  
V
V
V
1.45  
1.45  
2.2  
VBE(sat)  
IC = 5.0 A, IB = 500 mA  
DYNAMIC CHARACTERISTICS  
Parameters / Test Conditions  
Symbol  
Min.  
Max.  
Unit  
Magnitude of Common Emitter Small-Signal Short-  
Circuit Forward Current Transfer Ratio 2N5152L  
|hfe|  
6
7
2N5154L  
IC = 500 mA, VCE = 5 V, f = 10 MHz  
Small-signal short Circuit Forward-Current  
Transfer Ratio  
IC = 100 mA, VCE = 5 V, f = 1 KHz  
2N5152L  
2N5154L  
hfe  
20  
50  
Output Capacitance  
VCB = 10 V, IE = 0, f = 1.0 MHz  
Cobo  
250  
pF  
T4-LDS-0100-1, Rev. 1 (120716)  
©2012 Microsemi Corporation  
Page 3 of 8  
 
JANS 2N5152L and JANS 2N5154L  
ELECTRICAL CHARACTERISTICS @ TA = +25 °C unless otherwise noted. (continued)  
SWITCHING CHARACTERISTICS  
Parameters / Test Conditions  
Symbol  
Min.  
Max.  
Unit  
Turn-On Time  
IC = 5 A, IB1 = 500 mA  
Turn-Off Time  
RL = 6Ω  
ton  
0.5  
µs  
toff  
1.5  
µs  
Storage Time IB2 = -500 mA  
tS  
tf  
1.4  
0.5  
µs  
µs  
Fall Time  
VBE(OFF) = 3.7 V  
SAFE OPERATING AREA (See SOA graph below and MIL-STD-750, method 3053)  
DC Tests  
TC = +25 °C, tP = 1.0 s, 1 Cycle  
Test 1  
VCE = 5.0 V, IC = 2.0 A  
Test 2  
VCE = 32 V, IC = 310 mA  
Test 3  
VCE = 80 V, IC = 12.5 mA  
dc Operation  
TC < 25 ºC  
VCE – COLLECTOR – EMITTER VOLTAGE – V  
Maximum Safe Operating Area  
T4-LDS-0100-1, Rev. 1 (120716)  
©2012 Microsemi Corporation  
Page 4 of 8  
JANS 2N5152L and JANS 2N5154L  
ELECTRICAL CHARACTERISTICS @ TA = +25 °C, unless otherwise noted (continued)  
POST RADIATION ELECTRICAL CHARACTERISTICS  
Parameters / Test Conditions  
Symbol  
Min.  
Max.  
Unit  
Collector to Emitter Cutoff Current  
VCE = 40 V  
ICEO  
100  
µA  
Emitter to Base Cutoff Current  
VEB = 4 V  
IEBO  
V(BR)CEO  
ICES  
2.0  
µA  
V
Breakdown Voltage, Collector to Emitter  
IC = 100 mA  
80  
Collector to Emitter Cutoff Current  
VCE = 60 V  
2.0  
2.0  
µA  
mA  
Emitter to Base Cutoff Current  
IEBO  
VEB = 5.5 V  
Forward-Current Transfer Ratio (1)  
IC = 50 mA, VCE = 5 V  
2N5152L  
2N5154L  
2N5152L  
2N5154L  
2N5152L  
2N5154L  
[10]  
[25]  
[15]  
[35]  
[10]  
[20]  
IC = 2.5 A, VCE = 5 V  
90  
[hFE]  
200  
IC = 5 A pulsed, VCE = 5 V  
Base to Emitter voltage (non-saturated)  
VCE = 5 V, IC = 2.5 A, pulsed  
1.45  
VBE  
V
V
Collector-Emitter Saturation Voltage  
IC = 2.5 mA, IB = 250 mA, pulsed  
IC = 500 mA, IB = 500 mA, pulsed  
VCE(sat)  
0.86  
1.73  
Base-Emitter Saturation Voltage  
VBE(sat)  
V
1.67  
2.53  
IC = 2.5 A, IB = 250 mA, pulsed  
IC = 5 A, IB = 500 mA, pulsed  
(1) See method 1019 of MIL-STD-750 for how to determine [hFE] by first calculating the delta (1/hFE) from the pre-  
and post-radiation hFE. Notice the [hFE] is not the same as hFE and cannot be measured directly. The [hFE] value  
can never exceed the pre-radiation minimum hFE that it is based upon.  
T4-LDS-0100-1, Rev. 1 (120716)  
©2012 Microsemi Corporation  
Page 5 of 8  
JANS 2N5152L and JANS 2N5154L  
GRAPHS  
TC (°C) (Case)  
FIGURE 1  
Temperature-Power Derating Curve  
TA (°C) (Ambient)  
FIGURE 2  
Temperature-Power Derating Curve  
T4-LDS-0100-1, Rev. 1 (120716)  
©2012 Microsemi Corporation  
Page 6 of 8  
JANS 2N5152L and JANS 2N5154L  
GRAPHS (continued)  
Time (sec)  
FIGURE 3  
Thermal Impedance (RӨJA  
)
Time (sec)  
FIGURE 4  
Thermal Impedance (RӨJC  
)
T4-LDS-0100-1, Rev. 1 (120716)  
©2012 Microsemi Corporation  
Page 7 of 8  
JANS 2N5152L and JANS 2N5154L  
PACKAGE DIMENSIONS  
Dimensions  
Millimeters  
Symbol  
Inch  
Note  
6
Min  
.305  
.240  
.335  
Max  
Min  
Max  
8.51  
6.60  
9.40  
CD  
CH  
HD  
LC  
LD  
LL  
.335  
.260  
.370  
7.75  
6.10  
8.51  
.200 TP  
5.08 TP  
7
.016  
.019  
0.41  
0.48  
8,9  
See note 14  
LU  
L1  
.016  
.019  
.050  
0.41  
0.48  
1.27  
8,9  
8,9  
L2  
P
.250  
.100  
6.35  
2.54  
8,9  
7
Q
.030  
.045  
.034  
.010  
0.76  
1.14  
0.86  
0.25  
5
TL  
TW  
r
.029  
.028  
0.74  
0.71  
3,4  
3
10  
7
α
45° TP  
45° TP  
NOTES:  
1. Dimensions are in inches.  
2. Millimeters are given for general information only.  
3. Beyond r (radius) maximum, TW shall be held for a minimum length of .011 (0.28 mm).  
4. Dimension TL measured from maximum HD.  
5. Body contour optional within zone defined by HD, CD, and Q.  
6. CD shall not vary more than .010 inch (0.25 mm) in zone P. This zone is controlled for automatic handling.  
7. Leads at gauge plane .054 +.001 -.000 inch (1.37 +0.03 -0.00 mm) below seating plane shall be within .007 inch (0.18 mm)  
radius of true position (TP) at maximum material condition (MMC) relative to tab at MMC. The device may be measured by  
direct methods or by gauging procedure.  
8. Dimension LU applies between L1 and L2. Dimension LD applies between L2 and LL minimum. Diameter is uncontrolled in  
and beyond LL minimum.  
9. All three leads.  
10. The collector shall be internally connected to the case.  
11. Dimension r (radius) applies to both inside corners of tab.  
12. In accordance with ASME Y14.5M, diameters are equivalent to Φx symbology.  
13. Lead 1 = emitter, lead 2 = base, lead 3 = collector.  
14. TO-5 dimension LL = 1.5 inches (38.10 mm) min. and 1.75 inches (44.45 mm) max.  
T4-LDS-0100-1, Rev. 1 (120716)  
©2012 Microsemi Corporation  
Page 8 of 8  
 

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