MASMCG130CATR [MICROSEMI]
1500W, BIDIRECTIONAL, SILICON, TVS DIODE, DO-215AB, PLASTIC, SMCG, 2 PIN;型号: | MASMCG130CATR |
厂家: | Microsemi |
描述: | 1500W, BIDIRECTIONAL, SILICON, TVS DIODE, DO-215AB, PLASTIC, SMCG, 2 PIN 局域网 光电二极管 电视 |
文件: | 总4页 (文件大小:347K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
TECHNICAL DATA SHEET
Gort Road Business Park, Ennis, Co. Clare, Ireland.
Tel: +353 (0) 65 6840044, Fax: +353 (0) 65 6822298
6 Lake Street, Lawrence, MA 01841
Tel: 1-800-446-1158 / (978) 794-1666, Fax: (978) 6890803
Website: http://www.microsemi.com
- High Reliability controlled devices
SURFACE MOUNT 1500 Watt
Transient Voltage Suppressor
- Unidirectional (A) and Bidirectional (CA) construction
- Available in both J-bend and Gull-wing terminations
- Selections for 5.0 to 170 V standoff voltages (VWM
)
LEVELS
M, MA, MX, MXL
DEVICES
MSMCJ5.0A thru MSMCJ170CA, e3
and MSMCG5.0A thru MSMCG170CA, e3
FEATURES
.
.
.
High reliability controlled devices with fabrication and assembly lot traceability
100 % surge tested devices
Optional upscreening available by replacing the M prefix with MA, MX or MXL prefixes.
These prefixes specify various screening and conformance inspection options based on
MIL-PRF-19500. Refer to MicroNote 129 for more details on the screening options.
.
Axial-lead equivalent packages for thru-hole mounting available as 1.5KE6.8A to
1.5KE200CA or 1N6267 thru 1N6303A and 1N5908 (consult factory for other surface mount
options).
.
.
.
Moisture classification is Level 1 with no dry pack required per IPC/JEDEC J-STD-020B
RoHS compliant devices available by adding an “e3” suffix
3σ lot norm screening performed on Standby Current ID
APPLICATIONS / BENEFITS
.
.
.
Protection from switching transients and induced RF
Protection from ESD and EFT per IEC 61000-4-2 and IEC 61000-4-4
Secondary lightening protection per IEC 61000-4-5 with 42 Ohms source impedance:
o
o
o
o
Class 1: MSMC5.0A to MSMC170CA
Class 2: MSMC5.0A to MSMC150CA
Class 3: MSMC5.0A to MSMC75CA
Class 4: MSMC5.0A to MSMC36CA
.
.
Secondary lightening protection per IEC 61000-4-5 with 12 Ohms source impedance:
o
o
o
o
Class 1: MSMC5.0A to MSMC90CA
Class 2: MSMC5.0A to MSMC45CA
Class 3: MSMC5.0A to MSMC24CA
Class 4: MSMC5.0A to MSMC11CA
Secondary lightening protection per IEC 61000-4-5 with 2 Ohms source impedance:
o
o
Class 2: MSMC5.0A to MSMC22CA
Class 3: MSMC5.0A to MSMC10CA
MAXIMUM RATINGS
.
Peak Pulse Power dissipation at 25 ºC: 1500 watts at 10/1000 μs (also see Figures 1,2, and
3) with impulse repetition rate (duty factor) of 0.01 % or less
.
.
.
tclamping (0 volts to VBR min.): < 100 ps theoretical for unidirectional and <5 ns for bidirectional
Operating and Storage temperature: -65 ºC to +150 ºC
Thermal resistance: 20 ºC/W junction to lead, or 80 ºC/W junction to ambient when mounted
on FR4 PC board (1oz Cu) with recommended footprint (see page 2)
Steady-State Power dissipation: 6 watts at TL = 30 ºC, or 1.56 watts at TA = 25 ºC when
mounted on FR4 PC board with recommended footprint (see page 2)
Forward Surge: 200 Amps peak impulse of 8.3 ms half-sine wave at 25 ºC (unidirectional
only)
.
.
.
Solder temperatures: 260 ºC for 10 s (maximum)
RF01001 Rev A, June 2010
High Reliability Product Group
Page 1 of 4
TECHNICAL DATA SHEET
Gort Road Business Park, Ennis, Co. Clare, Ireland.
Tel: +353 (0) 65 6840044, Fax: +353 (0) 65 6822298
6 Lake Street, Lawrence, MA 01841
Tel: 1-800-446-1158 / (978) 794-1666, Fax: (978) 6890803
Website: http://www.microsemi.com
___________________________________________________________________________________________________________________________________
MECHANICAL AND PACKAGING
.
.
Void-free transfer molded thermosetting epoxy body meeting UL94V-0
Gull-wing or J-bend tin-lead (90 % Sn, 10 % Pb) or RoHS (100 % Sn) compliant annealed matte-tin plating
solderable per MIL-STD-750, method 2026
.
.
.
.
Cathode indicated by band. No cathode band on bi-directional devices.
Part number marked on package
Available in bulk or custom tape-and-reel packaging
TAPE-AND-REEL option available with up to 750 devices on 7 inch reel or up to 2500 devices on 13 inch reel per
EIA-481-1-A with 12 mm tape. Add “TR” suffix to part number.
.
Weight: 0.25 grams (approximately)
PACKAGE DIMENSIONS
SMCJ
SMCG
DIMENSIONS IN INCHES
A
B
C
D
E
F
K
L
MIN .115 .260 .220 .305 .077 .380
MAX .121 .280 .245 .320 .104 .400
DIMENSIONS IN MILLIMETERS
.025
.040
.030
.060
MIN 2.92 6.60 5.59 7.75 1.95 9.65
0.635 .760
MAX 3.07 7.11 6.22 8.13 2.65 10.16 1.016 1.520
Typical Standoff Height: 0.004” – 0.008” (0.1mm – 0.2mm)
(DO-214AB)
(DO-215AB)
PAD LAYOUT
SMCJ (DO-214AB)
SMCG (DO-215AB)
INCHES
0.390
0.110
0.150
mm
9.90
2.79
3.81
INCHES
0.510
0.110
0.150
mm
12.95
2.79
3.81
A
B
C
A
B
C
SYMBOLS & DEFINITIONS
Symbol
VWM
PPP
Definition
Working Peak (Standoff) Voltage
Peak Pulse Power
Symbol
Definition
Peak Pulse Current
Clamping Voltage
IPP
VC
VBR
Breakdown Voltage
IBR
Breakdown Current for VBR
Standby Current
ID
RF01001 Rev A, June 2010
High Reliability Product Group
Page 2 of 4
TECHNICAL DATA SHEET
Gort Road Business Park, Ennis, Co. Clare, Ireland.
Tel: +353 (0) 65 6840044, Fax: +353 (0) 65 6822298
6 Lake Street, Lawrence, MA 01841
Tel: 1-800-446-1158 / (978) 794-1666, Fax: (978) 6890803
Website: http://www.microsemi.com
___________________________________________________________________________________________________________________________________
ELECTRICAL CHARACTERISTICS @ 25oC
REVERSE
STAND-OFF
VOLTAGE
VWM
BREAKDOWN
VOLTAGE
VBR @ IBR
MAXIMUM
CLAMPING
VOLTAGE
VC @ IPP
PEAK PULSE
CURRENT
(see Fig. 2)
IPP
MAXIMUM
STANDBY
CURRENT
ID @ VWM
MICROSEMI PART NUMBER
GULL-WING
MSMCG5.0A
MSMCG6.0A
MSMCG6.5A
MSMCG7.0A
MSMCG7.5A
MSMCG8.0A
MSMCG8.5A
MSMCG9.0A
MSMCG10A
MSMCG11A
MSMCG12A
MSMCG13A
MSMCG14A
MSMCG15A
MSMCG16A
MSMCG17A
MSMCG18A
MSMCG20A
MSMCG22A
MSMCG24A
MSMCG26A
MSMCG28A
MSMCG30A
MSMCG33A
MSMCG36A
MSMCG40A
MSMCG43A
MSMCG45A
MSMCG48A
MSMCG51A
MSMCG54A
MSMCG58A
MSMCG60A
MSMCG64A
MSMCG70A
MSMCG75A
MSMCG78A
MSMCG85A
MSMCG90A
MSMCG100A
MSMCG110A
MSMCG120A
MSMCG130A
MSMCG150A
MSMCG160A
MSMCG170A
J- BEND
MSMCJ5.0A
MSMCJ6.0A
MSMCJ6.5A
MSMCJ7.0A
MSMCJ7.5A
MSMCJ8.0A
MSMCJ8.5A
MSMCJ9.0A
MSMCJ10A
MSMCJ11A
MSMCJ12A
MSMCJ13A
MSMCJ14A
MSMCJ15A
MSMCJ16A
MSMCJ17A
MSMCJ18A
MSMCJ20A
MSMCJ22A
MSMCJ24A
MSMCJ26A
MSMCJ28A
MSMCJ30A
MSMCJ33A
MSMCJ36A
MSMCJ40A
MSMCJ43A
MSMCJ45A
MSMCJ48A
MSMCJ51A
MSMCJ54A
MSMCJ58A
MSMCJ60A
MSMCJ64A
MSMCJ70A
MSMCJ75A
MSMCJ78A
MSMCJ85A
MSMCJ90A
MSMCJ100A
MSMCJ110A
MSMCJ120A
MSMCJ130A
MSMCJ150A
MSMCJ160A
MSMCJ170A
V
5.0
6.0
6.5
7.0
7.5
8.0
8.5
9.0
10
11
12
13
14
15
16
17
18
20
22
24
26
28
30
33
36
40
43
45
48
51
54
58
60
V
mA
V
9.2
A
A
1000
1000
500
200
100
50
20
10
5
5
5
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
6.40 – 7.00
6.67 – 7.37
7.22 – 7.98
7.78 – 8.60
8.33 – 9.21
8.89 – 9.83
9.44 – 10.4
10.0 – 11.1
11.1 – 12.3
12.2 – 13.5
13.3 – 14.7
14.4 – 15.9
15.6 – 17.2
16.7 – 18.5
17.8 – 19.7
18.9 – 20.9
20.0 – 22.1
22.2 – 24.5
24.4 – 26.9
26.7 – 29.5
28.9 – 31.9
31.1 – 34.4
33.3 – 36.8
36.7 – 40.6
40.0 – 44.2
44.4 – 49.1
47.8 – 52.8
50.0 – 55.3
53.3 – 58.9
56.7 – 62.7
60.0 – 66.3
64.4 – 71.2
66.7 – 73.7
71.1 – 78.6
77.8 – 86.0
83.3 – 92.1
86.7 – 95.8
94.4 – 104.0
100 – 111
111 – 123
122 – 135
133 – 147
144 – 159
167 – 185
178 – 197
189 – 209
10
10
10
10
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
163.0
145.6
133.9
125.0
116.3
110.3
104.2
97.4
88.2
82.4
75.3
69.7
64.7
61.5
57.7
53.3
51.4
46.3
42.2
38.6
35.6
33.0
31.0
28.1
25.8
23.2
21.6
20.6
19.4
18.2
17.2
16.0
15.5
14.6
13.3
12.4
11.4
10.4
10.3
9.3
10.3
11.2
12.0
12.9
13.6
14.4
15.4
17.0
18.2
19.9
21.5
23.2
24.4
26.0
27.6
29.2
32.4
35.5
38.9
42.1
45.4
48.4
53.3
58.1
64.5
69.4
72.7
77.4
82.4
87.1
93.6
96.8
103.0
113
64
70
75
78
85
90
100
110
120
130
150
160
170
1
1
1
1
1
1
1
1
1
1
1
1
121
126
137
146
162
177
193
209
8.4
7.8
7.2
6.2
5.8
5.5
243
259
275
1
NOTE 1: For Bidirectional device types indicate CA suffix after the part number. (i.e. MSMCJ170CA). Bidirectional
capacitance is half that shown in Figure 4 at zero volts.
NOTE 2: Microsemi Corp’s MSMC series (1500 W) surface mountable packages are designed specifically for transient voltage
suppression. The wide leads assure a large surface contact for good heat dissipation, and a low resistance path for
surge current flow to ground. These high speed transient voltage suppressors can be used to effectively protect
sensitive components such as integrated circuits and MOS device.
RF01001 Rev A, June 2010
High Reliability Product Group
Page 3 of 4
TECHNICAL DATA SHEET
Gort Road Business Park, Ennis, Co. Clare, Ireland.
Tel: +353 (0) 65 6840044, Fax: +353 (0) 65 6822298
6 Lake Street, Lawrence, MA 01841
Tel: 1-800-446-1158 / (978) 794-1666, Fax: (978) 6890803
Website: http://www.microsemi.com
___________________________________________________________________________________________________________________________________
GRAPHS
100
(Waveform – See Figure 2)
Non-repetitive
10
1.0
0
1µs
10µs
100µs
1ms
10 ms
Test waveform parameters
tr = 10µs, tp = 1000µs
tp – Pulse Time – sec
FIGURE 2 – Pulse Waveform
FIGURE 1 – Peak Pulse Power vs. Pulse Time
TL Lead Temperature oC
Breakdown Voltage in Volts
FIGURE 4 – Typical Capacitance vs. Breakdown
FIGURE 3 – Derating Curve
RF01001 Rev A, June 2010
High Reliability Product Group
Page 4 of 4
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