MFT62340A-J [MICROSEMI]
Fiber Optic Device;
| 型号： | MFT62340A-J |
| 厂家： | 
Microsemi |
| 描述： | Fiber Optic Device |
| 文件： | 总13页 (文件大小：269K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
This product is obsolete.
This information is available for your
convenience only.
For more information on
Zarlink’s obsolete products and
replacement product lists, please visit
http://products.zarlink.com/obsolete_products/
MFT62340A-J
Parallel Fiber Transmitter
Data sheet
DS5396
ISSUE 3.3
February 2002
Ordering Information
MFT62340A-J
MPO/MTP Connector
Applications
•
High-speed interconnects within and between
Switches, Routers and Transport equipment
•
•
Proprietary backplanes
Low cost OC-192 VSR (Very Short Reach)
connections
•
•
InfiniBand™ connections
Interconnects rack-to-rack, shelf-to-shelf,
board-to-board, board-to-optical backplane
Features
•
•
•
•
•
Data rate 155Mbps to 2.5Gbps per channel
12 parallel channels, total 30Gbps capacity
Description
Differential CML (Current-Mode Logic) interface
The MFT62340A-J and MFR62340A-J make a very
high speed transmitter and receiver pair for parallel
fiber applications. This pair, coupled through a
multimode parallel fiber ribbon cable, constitutes a
complete parallel fiber link. These links provides
high-speed interconnects for use within and between
large capacity switches, routers and data transport
equipment. The transmitter and receiver have a
differential CML interface and MPO/MTP fiber
connector.
.
Link length up to 100m (with 400MHz km fiber)
-12
Channel BER 10
MFR62340A-J
when used with
•
•
•
•
•
•
Designed for multimode fiber ribbon
MPO/MTP™ connector
Surface-mount package
Pick-and-placeable; reflow solderable
Class 1 M IEC 60825-1 compliant
Matches the MFR62340A-J Receiver
16.0
46.9
16.7
Dimensions in mm
Figure 1 - MFT62340A-JO: MPO/MTP Connector
MTP™ is a trademark of US Conec Ltd
1
MFT62340A-J Data sheet
Absolute Maximum Ratings (note 1)
Parameter
Symbol
Min
Max
Unit
1
2
3
4
5
6
Supply voltage
VCC
-0.3
-0.3
20
3.6
VCC+0.3
85
V
V
Voltage on any pin
V
PIN
Operating and storage moisture
Storage temperature
M
%
°C
kV
V
OS
TSTG
-40
-2
+100
2
ESD resistance all I/O except CML (note 3)
ESD resistance CML I/O (note 3)
V
E
V
-500
500
EC
Recommended Operating Conditions (note 4)
Parameter
Symbol
Min
Max
Unit
1
2
3
4
5
6
7
8
Case temperature (note 5, fig. 7)
Supply voltage (note 2,6)
T
0
80
3.3+5%
800
°C
V
CASE
V
3.3-5%
200
CC
CML differential input voltage (Fig. 4,5)
Data rate per channel
V
mV
Gbps
ps
ICML
f
0.155
2.5
D
CML differential input rise/fall time (20-80%, Fig. 5)
CMOS input voltage low
t
, t
160
RC FC
V
0
30%V
V
LCMOS
HCMOS
CC
CC
CMOS input voltage high
V
70%V
V
V
CC
Power supply noise (1MHz to 2GHz)
V
100
mV
p-p
NPS
LASER RADIATION
DO NOT VIEW DIRECTLY WITH OPTICAL INSTRUMENTS
CLASS 1M LASER PRODUCT
Classified in accordance with IEC 60825-1 / A2:2001, IEC 60825-2 : 2000
Maximum output of laser radiation: 3.9 mW
Pulse duration:
100 sec.
840 nm
Emitted wavelength:
Note 1:
Note 2:
Note 3:
Note 4:
Exceeding these values may cause permanent damage. Functional operation under these conditions is not implied.
Vcc turn-on slew rate minimum 0.6V/ms.
Human body model.
Data patterns are to have maximum run lengths and DC balance shifts no worse than those of a Pseudo
23
Random Bit Sequence of length 2 -1 (PRBS-23).
Note 5:
Note 6:
See figures 7 and 8 for information about ambient temperature and thermal resistance vs airflow.
The heat sink of the module is at Gnd potential.
2
Data sheet MFT62340A-J
Characteristics (note 1)
Parameter
Symbol Min
Typ
Max
Unit
1
2
3
4
5
Power consumption (2.5 Gbps, Fig. 6)
Power supply current
P
2.6
830
120
130
-2
W
mA
Ω
D
I
CC
CML differential input impedance (Fig. 3,4)
Optical rise/fall time (20-80%)
Z
80
-7
100
IN
t
t
ps
RO, FO
Average fiber output power per channel
50/125µm fiber, NA=0.2 (note 2)
P
dBm
F
6
7
8
9
Jitter
Total (note 3)
TJ
DJ
120
48
ps
ps
p-p
Contribution
Optical wavelength
Spectral width
Deterministic (note 4)
p-p
λ
830
840
860
0.85
-118
nm
∆λ
nm
dB/Hz
dB
mW
ps
10 Relative Intensity Noise
11 Extinction ratio (note 5)
RIN
ER
OMA
3
12 Optical Modulation Amplitude (note 6)
13 Channel skew (note 7)
0.24
t
175
0.4
SK
14
15
16
17
Low (I
High
= 3mA)
V
V
sink
LNMOS
HNMOS
NMOS output voltage
V
2.4
V
Assert time
T
10
10
µs
AE
Transmitter Enable
(TX_EN) (fig. 8)
De-assert time
T
µs
DE
18 Transmitter Ready (TX_R) assert time (fig. 9)
T
100
100
ms
µs
AR
19 Laser Safety
Shutdown
Laser de-assert time
Laser assert time
T
1
DL
(note 8, Fig. 10)
20
T
20
µs
AL
Note 1:
Operating conditions are as per Recommended Operating Conditions. Test pattern PRBS-23 at 2.5Gbps with
50/125µm fiber unless otherwise specified.
Note 2:
Note 3:
The optical output power is compliant with IEC 60825-1 Amendment 2, Class 1M Accessible Emission Limits (AEL)
Total Jitter, TJ, equals TP1 to TP2 as defined in IEEE 802.3 (2000 Edition) Gigabit Ethernet Specification Clause 38.5
-12
-12
Total jitter is specified at a BER of 10 (TJ=DJ+RJ
x 2Q, where Q=7 for BER 10 and RJ=Random Jitter).
rms
Note 4:
Deterministic jitter includes duty cycle distortion and is measured with zero skew between the differential data
inputs.
Note 5:
Note 6:
Extinction ratio is measured with a PRBS-23 pattern at 622Mbps.
OMA corresponding to P
= -7dBm and ER = 6dB.
average
Note 7:
Note 8:
Optical channel skew is measured with the input signals having equal amplitude and no input electrical channel skew.
An activity detector monitors the data input on each of the electrical input channels of the transmitter. If there are no
data transitions on a channel within a certain time (T ), the channel’s laser will be automatically turned off.
DL
This prevents potential non eye-safe conditions caused by the laser being stuck in the “on” state. The channel will
resume normal operation automatically once activity is again detected.
3
MFT62340A-J Data sheet
inherent eye safety without the need for loopback
control. An activity detector monitors the data input
on each of the electrical input channels of the
transmitter. If there are no data transitions on a
channel within a certain time, the channel’s laser will
be automatically turned off. This prevents potential
non eye-safe conditions caused by the laser being
stuck in the “on” state. The channel will resume
normal operation automatically once activity is again
detected.
Cleaning the Optical Interface
A protective connector plug is supplied with each
module. This plug should remain in place prior to
use, and be re-attached whenever a fiber cable is not
inserted. This will keep the optical interface free
from dust or other contaminants, which may
potentially degrade the optical signal. Before re-
attaching the connector plug to the module, visually
inspect the plug and remove any contamination. If
the optical interface becomes contaminated, it can
be cleaned with high-pressure nitrogen. Liquids or
physical contact with the optical interface are not
advised due to potential damage.
The maximum optical power is certified to comply to
Class 1M in accordance with IEC 60825-1/A2:2001
and IEC 60825-2:2000.
Assembly on Printed Circuit Board
The module can be soldered by hand or by a reflow
Electrostatic Discharge (ESD)
The module is classified as Class 1 according to
MIL-STD-883, test method 3015. When handling the
modules, precautions for ESD sensitive devices
should be taken. These precautions include use of
ESD protected work areas with wrist straps,
controlled work benches, floors etc. The
recommendations advised by Zarlink in the technical
note "MFTN6005A Manufacturing Guidelines" should
be followed.
process.
•
•
For hand soldering, a soldering iron with its tip
connected to ground should be used. Solder
extractors, including replacement parts, should
be of the non-static generating type.
For reflow soldering, the recommendations
advised by Zarlink in the technical note
“MFTN6005A Manufacturing Guidelines” should
be followed. This document provides guidelines
about choice of solder, reflow temperature and
time profile etc.
Use of solder with no-clean flux, i.e. solder that does
not require washing after assembly, is
recommended. Washing the module with any kind of
liquid is not advised due to potential damage.
Eye Safety
This module includes Vertical Cavity Surface-
Emitting Lasers (VCSELs) and is designed for
4
Data sheet MFT62340A-J
TX_EN9-12
TX_EN5-8
TX_EN1-4
Di1
Di1c
1
:
:
:
:
VCSEL
Driver
VCSEL
Array
2
3
4
Di4
Di5
Di4c
Di5c
5
6
7
8
:
:
:
:
VCSEL
Driver
VCSEL
Array
Optical
Outputs
Di8
Di9
Di8c
Di9c
9
:
:
:
:
VCSEL
Driver
VCSEL
Array
10
11
12
Di12
Di12c
VCSEL Driver Controller
TX_R
VCC Gnd
Figure 2 - Block Diagram
100 nF
Vcc
DiN
50Ω
50Ω
8.4KΩ
8.4KΩ
Gnd
DiNc
100 nF
Figure 3 - Data Input Equivalent Circuit
5
MFT62340A-J Data sheet
Recommended CML Output
MFT62340A-J CML Input
+3.3V
100nF
Z
=100Ω
Z =100Ω
IN
Differential
IN
Z =100Ω Differential
O
Differential
100nF
AC coupling capacitors are included
in the module
Figure 4 - Differential CML Interface
Data
80%
20%
VICML
Data Inv
tRC
tFC
Figure 5 - CML Differential Signals
100%
80%
60%
40%
20%
0.5
1.0
1.5
2.0
2.5
0
Data Rate (Gbps)
Figure 6 - Relative Power Consumption vs. Data Rate
6
Data sheet MFT62340A-J
20,0
18,0
16,0
14,0
12,0
10,0
8,0
6,0
4,0
2,0
0,0
0,0
0,5
1,0
1,5
2,0
2,5
3,0
Air velocity [m/s]
Figure 7 - Typical thermal resistance vs. flowing ambient air velocity
Note 1:
These data correspond to a single module placed on a thermally insulating board and air velocity measured
approximately 1cm above the board and 0.5cm in front of the module. The airflow is parallel to the flanges of the
heatsink (100 LFM (linear feet per minute) =0.51m/s)
Ambient Temperature [C]
80
70
60
50
40
0,0
0,5
1,0
1,5
2,0
2,5
3,0
Air velocity [m/s]
Figure 8 - Typical required air temperature to keep the module temperature below 80˚C. The line
correspond to a heat dissipation of 2.6 Watt (worst case).
7
MFT62340A-J Data sheet
0.8VCC
VCC
TAR
2.4V
0.4V
TX_R
Optical
Output
Transmitter Not Ready
Transmitter Ready
Figure 9 - Power-Up Timing Diagram
Last Data Transition
New Data Transition
TDL
TAL
Laser Enabled
Laser Disabled
Laser Enabled
Figure 10 - Laser Safety Shutdown Timing Diagram
25
1
MFT62340A-J
50
1
FIBER RIBBON
12
26
Figure 11 - Pin Locations (Top View)
8
Data sheet MFT62340A-J
Pin Description
No
1
Name
Logic
Description
No
26
27
28
29
30
31
32
33
34
35
36
37
38
39
40
41
42
43
44
45
46
47
Name
Gnd
Di7c
Di7
Logic
Description
Gnd
Ground
Ground
2
V
V
Positive power supply
Positive power supply
CML
CML
Data input No 7, inv.
Data input No 7.
Ground
CC
CC
3
4
TX_EN
CMOS
Transmitter Enable
channels 1 to 4
Gnd
Di8c
Di8
1-4
High = Transmitter
channels active.
Low = Transmitter
channels turned off.
Internal pull-down resistor
50kΩ.
CML
CML
Data input No 8, inv.
Data input No 8.
Ground
Gnd
Di9c
Di9c
Gnd
Di10c
Di10
Gnd
Di11c
Di11
Gnd
Di12c
Di12
Gnd
CML
CML
Data input No 9, inv.
Data input No 9.
Ground
5
6
TX_EN
CMOS
CMOS
Transmitter Enable
channels 5 to 8.
High = Transmitter
channels active.
Low = Transmitter
channels turned off.
Internal pull-down resistor
50kΩ.
5-8
CML
CML
Data input No 10, inv.
Data input No 10.
Ground
TX_EN
Transmitter Enable
channels 9 to 12.
High = Transmitter
channels active.
Low = Transmitter
channels turned off.
Internal pull-down resistor
50kΩ.
CML
CML
Data input No 11, inv.
Data input No 11.
Ground
9-12
CML
CML
Data input No 12, inv.
Data input No 12.
Ground
7
Gnd
Di1c
Di1
Ground
8
CML
CML
Data input No 1, inv
Data input No 1.
Ground
Not Connected
Not Connected
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
Gnd
Di2c
Di2
TX_R
NMOS
Transmitter Ready after
power-up.
Low = Transmitter not
ready.
High = Transmitter ready.
Open drain with internal
pull-up resistor 10kΩ.
CML
CML
Data input No 2, inv.
Data input No 2.
Ground
Gnd
Di3c
Di3
CML
CML
Data input No 3, inv
Data input No 3.
Ground
48
49
50
V
V
Positive power supply
Positive power supply
Ground
CC
CC
Gnd
Di4c
Di4
CML
CML
Data input No 4, inv.
Data input No 4.
Ground
Gnd
Gnd
Di5c
Di5
CML
CML
Data input No 5, inv.
Data input No 5.
Ground
Gnd
Di6c
Di6
CML
CML
Data input No 6, inv
Data input No 6.
Ground
Gnd
9
MFT62340A-J Data sheet
Mechanical Drawing
16
46.9
14.4
Ø3
8.5
0.76
1.27
0.5
3.5
7.19
16.7
Dimensions in mm
Figure 12 - MFT62340A-JO: MPO/MTP Connector
PCB Footprint
3.5
Guide pin key
Ø3.2
1
50
25
26
12.7
17.78
Dashed lines indicate module outline
Solid lines indicate board layout
Dimensions in mm
Rear of Module
Figure 13 - MFT62340A-JO: MPO/MTP Connector (Top View)
10
Data sheet MFT62340A-J
Electrical Connections
TX_R
Di12
Vcc(3.3V)
Zo=100 Ohm Differential
ZL=100 Ohm
Di12c
C1
R1
100pF
5.1Ohm
.
.
.
.
.
.
.
.
.
.
C2
100nF
C4
100pF
Di01
C3
100nF
R2
5.1Ohm
Zo=100 Ohm Differential
ZL=100 Ohm
Di01c
Notes:
TX_EN9-12
TX_EN5-8
*
C1-C4 and R1-R2 should be placed as close
to the Vcc pins as possible.
TX_EN1-4
*
*
Use a ground plane under the module.
Use vias to connect Gnd pins to ground plane
Figure 14 - Recommended Electrical Connections
11
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visit our Web Site at
www.zarlink.com
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However, Zarlink assumes no liability for errors that may appear in this publication, or for liability otherwise arising from the application or use of any such
information, product or service or for any infringement of patents or other intellectual property rights owned by third parties which may result from such application or
use. Neither the supply of such information or purchase of product or service conveys any license, either express or implied, under patents or other intellectual
property rights owned by Zarlink or licensed from third parties by Zarlink, whatsoever. Purchasers of products are also hereby notified that the use of product in
certain ways or in combination with Zarlink, or non-Zarlink furnished goods or services may infringe patents or other intellectual property rights owned by Zarlink.
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of any order or contract nor to be regarded as a representation relating to the products or services concerned. The products, their specifications, services and other
information appearing in this publication are subject to change by Zarlink without notice. No warranty or guarantee express or implied is made regarding the
capability, performance or suitability of any product or service. Information concerning possible methods of use is provided as a guide only and does not constitute
any guarantee that such methods of use will be satisfactory in a specific piece of equipment. It is the user’s responsibility to fully determine the performance and
suitability of any equipment using such information and to ensure that any publication or data used is up to date and has not been superseded. Manufacturing does
not necessarily include testing of all functions or parameters. These products are not suitable for use in any medical products whose failure to perform may result in
significant injury or death to the user. All products and materials are sold and services provided subject to Zarlink’s conditions of sale which are available on request.
Purchase of Zarlink’s I2C components conveys a licence under the Philips I2C Patent rights to use these components in and I2C System, provided that the system
conforms to the I2C Standard Specification as defined by Philips.
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