MPLAD130KP275CVE3 [MICROSEMI]

Trans Voltage Suppressor Diode, 1300001W, 275V V(RWM), Bidirectional, 1 Element, Silicon, PLASTIC PACKAGE-1;
MPLAD130KP275CVE3
型号: MPLAD130KP275CVE3
厂家: Microsemi    Microsemi
描述:

Trans Voltage Suppressor Diode, 1300001W, 275V V(RWM), Bidirectional, 1 Element, Silicon, PLASTIC PACKAGE-1

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TECHNICAL DATA SHEET  
Gort Road Business Park, Ennis, Co. Clare, Ireland.  
Tel: +353 (0) 65 6840044, Fax: +353 (0) 65 6822298  
6 Lake Street, Lawrence, MA 01841  
Tel: 1-800-446-1158 / (978) 794-1666, Fax: (978) 6890803  
Website: http://www.microsemi.com  
- High Reliability controlled devices  
- Bidirectional (CA) construction  
SURFACE MOUNT 130 kW  
Transient Voltage Suppressor  
- 275 V standoff voltages (VWM  
- Fast response  
)
LEVELS  
M, MA, MX, MXL  
DEVICES MPLAD130KP275CA and MPLAD130KP275CV, e3  
FEATURES  
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High reliability controlled devices with wafer fabrication and assembly lot traceability  
100 % surge tested devices  
Low profile surface mount  
Low package inductance  
Available as either low clamp with “CV” suffix or normal clamping features with “CA” suffix  
Optional up screening available by replacing the M prefix with MA, MX or MXL. These  
prefixes specify various screening and conformance inspection options based on MIL-PRF-19500.  
Refer to MicroNote 129 for more details on the screening options.  
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Suppresses transients up to 130 kW1 @ 6.4/69 µs  
Moisture classification is Level 1 with no dry pack required per IPC/JEDEC J-STD-020B  
RoHS compliant devices available by adding an “e3” suffix  
3σ lot norm screening performed on Standby Current ID  
MAXIMUM RATINGS  
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Peak Pulse Power dissipation at 25 °C: 130,0001 watts @ 6.4/69 µs (also see Figure 1) with  
impulse repetition rate (duty factor) of 0.05% or less  
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tclamping (0 volts to VBR min.): < 5 ns (theoretical)  
Operating and Storage temperature: -55 °C to +150 °C  
Thermal resistance: 0.5 °C/W junction to case or 50 °C/W junction to ambient when mounted  
on FR4 PC board with recommended mounting pad (see page 2) and 1oz Cu  
.
Steady-State Power dissipation: 250 watts at TC = 25 °C with good heat sink, or 2.5 watts at  
TA = 25 °C if mounted on FR4 PC board as described for thermal resistance  
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Temperature Coefficient of voltage: 0.1 %/°C  
Solder temperatures: 260 °C for 10 s (maximum)  
MECHANICAL AND PACKAGING  
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Void-free transfer molded thermosetting epoxy body meeting UL94V-0  
Tin-Lead (90 % Sn, 10 % Pb) or RoHS (100 % Sn) compliant annealed matte-tin plating  
readily solderable per MIL-STD-750, method 2026  
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Body marked with part number  
No Cathode band for Bi-directional devices  
Available in custom tape-and-reel or bulk packaging  
TAPE-AND-REEL Standard per EIA-481-B (add “TR” suffix to part number)  
Weight: 2.2 grams (approximately)  
RF01020 Rev A, November 2010  
High Reliability Product Group  
Page 1 of 3  
TECHNICAL DATA SHEET  
Gort Road Business Park, Ennis, Co. Clare, Ireland.  
Tel: +353 (0) 65 6840044, Fax: +353 (0) 65 6822298  
6 Lake Street, Lawrence, MA 01841  
Tel: 1-800-446-1158 / (978) 794-1666, Fax: (978) 6890803  
Website: http://www.microsemi.com  
______________________________________________________________________________________________________________________________  
PACKAGE AND MOUNTING PAD DIMENSIONS Inches [mm]  
SYMBOLS & DEFINITIONS  
Symbol  
VWM  
PPP  
Definition  
Symbol Definition  
Working Peak (Standoff) Voltage  
Peak Pulse Power  
Breakdown Voltage  
Standby Current  
IPP  
Peak Pulse Current  
VC  
Clamping Voltage  
VBR  
ID  
IBR  
Breakdown Current for VBR  
ELECTRICAL CHARACTERISTICS @ 25oC  
Description  
Symbol  
Conditions  
IBR = 5mA  
Min  
300  
Typ  
Max  
Unit  
V
Breakdown Voltage  
Working Standoff Voltage  
Standby Current  
VBR  
VWM  
ID  
275  
5
V
A
A
VR = VWM  
Peak Pulse Current 1  
Clamping Voltage  
IPP  
tr=6.4us, tp=69us  
292  
VC  
Ic = IPP  
PLAD130KP275CV  
PLAD130KP275CA  
400  
445  
V
V
Note:  
1) Also equivalent to 40 kW at a longer pulse of 10/1000 us with clamping voltages shown and Ipp = 90A  
RF01020 Rev A, November 2010  
High Reliability Product Group  
Page 2 of 3  
TECHNICAL DATA SHEET  
Gort Road Business Park, Ennis, Co. Clare, Ireland.  
Tel: +353 (0) 65 6840044, Fax: +353 (0) 65 6822298  
6 Lake Street, Lawrence, MA 01841  
Tel: 1-800-446-1158 / (978) 794-1666, Fax: (978) 6890803  
Website: http://www.microsemi.com  
______________________________________________________________________________________________________________________________  
GRAPHS  
TL Lead Temperature oC  
FIGURE 2  
Derating Curve  
RF01020 Rev A, November 2010  
High Reliability Product Group  
Page 3 of 3  

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