MSC2X31 [MICROSEMI]

Dual Silicon Carbide Schottky Barrier Diodes;
MSC2X31
型号: MSC2X31
厂家: Microsemi    Microsemi
描述:

Dual Silicon Carbide Schottky Barrier Diodes

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MSC2X31/30SDA120J Dual Silicon Carbide Schottky Barrier Diodes  
Product Overview  
The silicon carbide (SiC) power Schottky barrier diode (SBD) product line from Microsemi increases the  
performance over silicon diode solutions while lowering the total cost of ownership for high-voltage  
applications. MSC2X31/30SDA120J are dual 1200 V, 30 A SiC SBD devices in a SOT-227 package.  
Figure 2 • Anti-parallel MSC2X30SDA120J  
Figure 1 • Parallel MSC2X31SDA120J  
Features  
The following are key features of the MSC2X31SDA120J and MSC2X30SDA120J devices:  
No reverse recovery  
Low forward voltage  
Low leakage current  
Avalanche-energy rated  
RoHS compliant  
Isolated voltage to 2500 V  
Benefits  
The following are benefits of the MSC2X31SDA120J and MSC2X30SDA120J devices:  
Outstanding performance at high-frequency operation  
Direct mounting to heatsink (isolated package)  
Low junction-to-case thermal resistance  
RoHS compliant  
053-4104 MSC2X31/30SDA120J Datasheet Revision A  
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Product Overview  
Applications  
The MSC2X31SDA120J and MSC2X30SDA120J devices are designed for the following applications:  
Power factor correction (PFC)  
Anti-parallel diode  
Switch-mode power supply  
Inverters/converters  
Motor controllers  
Freewheeling diode  
Switch-mode power supply  
Inverters/converters  
Snubber/clamp diode  
053-4104 MSC2X31/30SDA120J Datasheet Revision A  
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Device Specifications  
Device Specifications  
This section shows the specifications of the MSC2X31SDA120J and MSC2X30SDA120J devices.  
Absolute Maximum Ratings  
The following table shows the absolute maximum ratings per diode of the MSC2X31SDA120J and  
MSC2X30SDA120J devices. TC = 25 °C unless otherwise specified.  
Table 1 • Absolute Maximum Ratings  
Symbol  
Parameter  
Ratings  
1200  
30  
Unit  
V
VR  
IF  
Maximum DC reverse voltage  
Maximum DC forward current  
TC = 100 °C  
A
The following table shows the thermal and mechanical characteristics of the MSC2X31SDA120J and  
MSC2X30SDA120J devices.  
Table 2 • Thermal and Mechanical Characteristics  
Symbol  
Characteristics  
Min  
Typ  
Max  
Unit  
°C/W  
V
RΘJC  
Junction-to-case thermal resistance  
0.60  
0.87  
VISOLATION  
RMS voltage  
2500  
–55  
(50 Hz–60 Hz sinusoidal waveform from  
terminals to mounting base for 1 minute)  
TJ, TSTG  
Operating junction and storage tempera-  
ture range  
175  
°C  
Wt  
Package weight  
1.03  
29.2  
oz  
g
Mounting torque, M4 screw  
10  
lbf-in  
N-m  
1.1  
053-4104 MSC2X31/30SDA120J Datasheet Revision A  
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Device Specifications  
Electrical Performance  
The following table shows the static characteristics per diode of the MSC2X31SDA120J and MSC2X30SDA120J  
devices. TJ = 25 °C unless otherwise specified.  
Table 3 • Static Characteristics Per Diode  
Symbol  
Characteristics  
Test Conditions  
Min  
Typ  
1.5  
2.1  
9
Max  
Unit  
VF  
Forward voltage  
IF = 30 A  
1.8  
V
TJ = 175 °C  
TJ = 175 °C  
IRM  
Reverse leakage current  
VR = 1200 V  
VR = 600 V  
200  
μA  
150  
130  
141  
105  
QC  
CJ  
Total capacitive charge  
Junction capacitance  
nC  
pF  
VR = 400 V, f = 1 MHz  
VR = 800 V, f = 1 MHz  
053-4104 MSC2X31/30SDA120J Datasheet Revision A  
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Device Specifications  
Typical Performance Curves  
This section shows the typical performance curves per diode of the MSC2X31SDA120J and MSC2X30SDA120J  
devices.  
Figure 3 • Maximum Transient Thermal Impedance  
Figure 4 • Forward Current vs. Forward Voltage  
Figure 5 • Reverse Current vs. Reverse Voltage  
053-4104 MSC2X31/30SDA120J Datasheet Revision A  
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Package Specification  
Package Specification  
This section shows the package specification of the MSC2X31SDA120J and MSC2X30SDA120J devices.  
Package Outline Drawing  
The following figure illustrates the SOT-227 package outline of the MSC2X31SDA120J and MSC2X30SDA120J  
devices. The dimensions in the following figure are in millimeters and (inches).  
Figure 6 • Package Outline Drawing  
053-4104 MSC2X31/30SDA120J Datasheet Revision A  
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Legal  
Microsemi's product warranty is set forth in Microsemi's Sales Order Terms and Conditions. Information  
contained in this publication is provided for the sole purpose of designing with and using Microsemi  
products. Information regarding device applications and the like is provided only for your convenience  
and may be superseded by updates. Buyer shall not rely on any data and performance specifications or  
parameters provided by Microsemi. It is your responsibility to ensure that your application meets with  
your specifications. THIS INFORMATION IS PROVIDED "AS IS." MICROSEMI MAKES NO REPRESENTATIONS  
OR WARRANTIES OF ANY KIND WHETHER EXPRESS OR IMPLIED, WRITTEN OR ORAL, STATUTORY OR  
OTHERWISE, RELATED TO THE INFORMATION, INCLUDING BUT NOT LIMITED TO ITS CONDITION, QUALITY,  
PERFORMANCE, NON-INFRINGEMENT, MERCHANTABILITY OR FITNESS FOR A PARTICULAR PURPOSE.  
IN NO EVENT WILL MICROSEMI BE LIABLE FOR ANY INDIRECT, SPECIAL, PUNITIVE, INCIDENTAL OR  
CONSEQUENTIAL LOSS, DAMAGE, COST OR EXPENSE WHATSOEVER RELATED TO THIS INFORMATION  
OR ITS USE, HOWEVER CAUSED, EVEN IF MICROSEMI HAS BEEN ADVISED OF THE POSSIBILITY OR THE  
DAMAGES ARE FORESEEABLE. TO THE FULLEST EXTENT ALLOWED BY LAW, MICROSEMI’S TOTAL LIABILITY  
ON ALL CLAIMS IN RELATED TO THIS INFORMATION OR ITS USE WILL NOT EXCEED THE AMOUNT OF  
FEES, IF ANY, YOU PAID DIRECTLY TO MICROSEMI FOR THIS INFORMATION. Use of Microsemi devices  
in life support, mission-critical equipment or applications, and/or safety applications is entirely at the  
buyer’s risk, and the buyer agrees to defend and indemnify Microsemi from any and all damages, claims,  
suits, or expenses resulting from such use. No licenses are conveyed, implicitly or otherwise, under any  
Microsemi intellectual property rights unless otherwise stated.  
Microsemi  
2355 W. Chandler Blvd.  
Chandler, AZ 85224 USA  
Within the USA: +1 (480) 792-7200  
Fax: +1 (480) 792-7277  
©
www.microsemi.com 2020 Microsemi and  
its corporate affiliates. All rights reserved.  
Microsemi and the Microsemi logo are  
trademarks of Microsemi Corporation and its  
corporate affiliates. All other trademarks and  
service marks are the property of their  
respective owners.  
Microsemi Corporation, a subsidiary of Microchip Technology Inc. (Nasdaq: MCHP),  
and its corporate affiliates are leading providers of smart, connected and secure  
embedded control solutions. Their easy-to-use development tools and  
comprehensive product portfolio enable customers to create optimal designs which  
reduce risk while lowering total system cost and time to market. These solutions  
serve more than 120,000 customers across the industrial, automotive, consumer,  
aerospace and defense, communications and computing markets. Headquartered  
in Chandler, Arizona, the company offers outstanding technical support along with  
dependable delivery and quality. Learn more at www.microsemi.com.  
053-4104 | October 2020 | Released  
053-4104 MSC2X31/30SDA120J Datasheet Revision A  
7

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